TWI622135B - 封裝型功率電路模組 - Google Patents
封裝型功率電路模組 Download PDFInfo
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- TWI622135B TWI622135B TW105116025A TW105116025A TWI622135B TW I622135 B TWI622135 B TW I622135B TW 105116025 A TW105116025 A TW 105116025A TW 105116025 A TW105116025 A TW 105116025A TW I622135 B TWI622135 B TW I622135B
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- power circuit
- circuit module
- elastic modulus
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- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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Abstract
本發明提供一種封裝型功率電路模組,封裝型功率電路模組包括:壓力板,壓力板包括至少一壓力柱;框架;基板,基板承載功率電路,功率電路包括至少一個功率開關器件晶片;其中,框架設置於基板與壓力板之間,框架承載壓力板,基板、壓力板與框架構成一大致閉合空間;當壓力板承受外界壓力時,壓力柱抵住基板與基板絕緣接觸,從而將外界壓力均勻傳導至基板。
Description
本發明涉及功率電路,尤其涉及一種封裝型功率電路模組的裝配結構。
功率電路模組是功率轉換電路中較為常見的模組。這些功率電路模組通常可以實現直流/直流或交流/直流之間的轉換。這些功率電路模組通常是個完整的功率電路。這種功率電路中通常至少包括一個功率開關器件晶片,通過一個控制器控制該功率開關器件晶片的開通與關斷來實現電源的轉換。這種功率開關器件晶片也被本領域技術人員稱之為開關管。
通常而言,不同功率等級的功率電路模組其尺寸不大相同,相應的封裝形式也會有所不同。一般而言,功率越大的功率電路模組其尺寸也會越大。與此同時,當此功率較大的功率電路模組應用於一系統板時,通常也需要為此功率較大的功率電路模組配備相應的散熱器。
功率電路模組通常是以一種封裝形式的功率電路模組應用於系統板。此類封裝型的功率電路模組通常會包括:基板、封裝基板的塑封殼和對基板散熱的散熱器。不同類型的基板其對應的封裝結構可能會有少許不同。以下以基板為典型的無銅基板進行舉例說明此類封裝型功率電路模組結構。
基板上承載有功率開關器件晶片以及相應的控制電路,通過焊料和引線鍵合工藝實現基板上元器件及晶片之間的互連。對應於此基板的封裝外殼包括框架、連接板、緩衝墊和壓力板。該連接板與該框架連接構成一密封空間,基板置於該密封空間內。該連接板包括連接板本體、橋單元和門極信號端子;而橋單元和門極信號端子位於連接板本體的周邊,當連接板與基板以及框架組裝在一起時,這些橋單元以及門極信號端子引出基板上功率電路與外部系統板連接的端子。基板通過導熱矽脂與散熱器接觸散熱。為了使基板和散熱器良好接觸,實現傳遞均勻分佈壓力的目的,需要使用壓力板、緩衝墊及橋單元三部分元件。其中,緩衝墊位於壓力板與橋單元之間,壓力板通過模組緊固螺釘施加壓力,通過緩衝墊均勻作用於橋單元,最終通過橋單元的壓力點均勻作用於基板上,從而使基板和散熱器良好接觸,並通過在基板與散熱器的接觸面上塗導熱矽脂,以降低功率模組和散熱器之間的熱阻。另外,由於基板上的元器件和晶片易受外界環境影響,在連接板與框架構成密封空間時在其連接處需要密封材料進行密封處理。
由此可見,傳統的功率較大的封裝型功率電路模組的結構比較複雜,導致裝配過程也比較繁雜,不利於降低封裝型功率電路模組的製作成本。
有鑑於此,本發明提供了一種裝配結構及裝配工藝簡單的封裝型功率電路模組。
本發明的額外方面和優點將部分地在下面的描述中闡述,並且部分地將從描述中變得顯然,或者可以通過本發明的實踐而習得。
本發明提供了一種封裝型功率電路模組,包括:一壓力板,該壓力板包括至少一壓力柱;一框架;一基板,該基板承載功率電路,該功率電路包括至少一功率開關器件晶片;其中,框架設置於基板與壓力板之間,框架承載壓力板,基板、壓力板與框架構成一大致閉合空間;當壓力板承受一外界壓力時,壓力柱抵住基板,並與基板絕緣接觸,而將外界壓力均勻傳導至基板。
在一些實施例中,壓力板包括一第一彈性模量材料和一第二彈性模量材料,第一彈性模量材料的彈性模量小於第二彈性模量材料的彈性模量。
在一些實施例中,第二彈性模量材料的彈性模量大於第一彈性模量材料的彈性模量的兩倍。
在一些實施例中,壓力板還包括一主體,至少一壓力柱垂直於該主體且設置於該主體朝向基板的一側。
在一些實施例中,主體包含第一彈性模量材料,壓力柱由第二彈性模量材料製成。
在一些實施例中,壓力柱包含有第一彈性模量材料。
在一些實施例中,壓力柱與基板接觸的端部為第一彈性模量材料製成。
在一些實施例中,封裝型功率電路模組還包括一金屬加強筋,金屬加強筋設置於主體以增強主體的結構強度。
在一些實施例中,基板上設置有複數個引腳,主體對應設置有複數個引腳孔便於複數個引腳通過;封裝功率電路模組通過穿過主體的複數個引腳與一外部系統電路板電性連接。
在一些實施例中,第一彈性模量材料的彈性模量小於500Mpa。
在一些實施例中,壓力板為一體成型的壓力板。
在一些實施例中,第一彈性模量材料和第二彈性模量材料 均為熱塑型性絕緣材料。
在一些實施例中,基板相對承載功率開關器件晶片的另一面連接有一散熱器。
在一些實施例中,框架的一端與壓力板連接,框架的另一端與散熱器連接。
在一些實施例中,框架包括支撐部和限位部,支撐部支撐壓力板且包圍基板,限位部限制基板的移動。
在一些實施例中,限位部垂直於支撐部,且限位部卡位於基板承載有功率開關器件晶片的一面。
在一些實施例中,壓力板與框架為一體成型。
在一些實施例中,封裝型功率電路模組還包括緊固件,緊固件連接壓力板與散熱器。
在一些實施例中,功率電路的功率大於和等於50千瓦。
在一些實施例中,大致閉合空間內填充有密封膠覆蓋基板上的功率開關器件晶片。
本發明提供的封裝型功率電路模組,利用對壓力板作用壓力,通過壓力板內部不同彈性模量材料的緩衝變形,使通過壓力板的壓力柱傳遞到基板上的壓力更均勻分佈,減小基板集中受力受損的風險,簡化了封裝型功率電路模組的裝配過程,提高了裝配效率,降低了封裝型功率電路模組的結構成本。
現在將參考附圖更全面地描述示例實施方式。然而,示例實施方式能夠以多種形式實施,且不應被理解為限於在此闡述的實施方式;相反,提供這些實施方式使得本發明將全面和完整,並將示例實施方式的構思全面地傳達給本領域的技術人員。在圖中相同的附圖標記表示相同或類似的結構,因而將省略對它們的重複描述。
所描述的特徵、結構或特性可以以任何合適的方式結合在一個或更多實施方式中。在下面的描述中,提供許多具體細節從而給出對本發明的實施方式的充分理解。然而,本領域技術人員應意識到,沒有所述特定細節中的一個或更多,或者採用其它的方法、組元、材料等,也可以實踐本發明的技術方案。在其它情況下,不詳細示出或描述公知結構、材料或者操作以避免模糊本發明。
圖1A和圖1B為本發明一個實施例的封裝型功率電路模組的結構圖。如圖1A所示,本發明一個實施例的封裝型功率電路模組1包括:基板10、壓力板11、框架12及功率開關器件晶片13。
其中,在基板10包括相對且平行的第一表面和第二表面,第一表面上形成有電路圖形,承載封裝型功率電路模組1中的功率電路。封裝型功率電路模組1一般適用於功率高於和等於50千瓦的功率電路,但本發明不以此為限。該功率電路包括至少一個功率開關器件晶片13。功率開關器件晶片13可通過焊料等材料固定於基板10的第一表面上,其上表面的表面電極和基板10第一表面上的電路圖形可通過導電材料(如焊線、銅片)等實現封裝型功率電路模組1內部的電連接,再通過焊接或導電膠粘接等工藝將引腳(terminal)14固定並電連接到基板10的第一表面,實現封裝型功率電路模組1與外部的電連接。此外,功率開關器件晶片13還可通過倒裝晶片(flip chip)等方式與基板10電連接,本發明不以此為限。
基板10例如可以為直接敷銅(Direct Bonding Copper,DBC)基板、直接敷鋁(Direct Bonding Aluminum,DBA)基板、低溫共燒陶瓷(Low-Temperature Co-fired Ceramic,LTCC)基板、直接電鍍銅(Direct Plated Copper,DPC)基板、金屬絕緣(Insulate Metal Substrate,IMS)基板及印刷電路板(Printed Circuit Board,PCB)等,但本發明不限於此。
壓力板11至少包括兩種不同彈性模量的材料:彈性模量較低的第一彈性模量材料和彈性模量較高的第二彈性模量材料。壓力板11包括:主體(main body)110和至少一個凸起的壓力柱(protrusion body)111,主體110為大致與基板10平行的平板,壓力柱111垂直於主體110且設置於主體110朝向基板10的一側,均呈豎直結構,主體110與壓力柱111可以為一體成型結構。其中,壓力柱111直接絕緣接觸基板10的第一表面,以將作用於主體110的壓力通過壓力柱111更均勻地傳遞到基板10上。此外,主體110上設置有對應於引腳14的引腳孔141,以便於引腳14穿過壓力板11。壓力板11的生產可採用雙色或多色注塑成型工藝,採用雙色注塑機或多色注塑機來實現批量生產。
框架12位於基板10與壓力板11之間,承載壓力板11,起到對壓力板11限位及結構支撐的作用,合理分配壓力板11的部分壓力的傳遞,此外還可以起到控制封裝型功率電路模組1高度一致性的作用。在一些實施例中,如圖1A所示,以基板10一側的框架12為例說明,框架12具有支撐部121和限位部122。支撐部121支撐壓力板11且包圍基板10。限位部122垂直於支撐部121,且卡位於基板10的第一表面上,以限制基板10的移動。此外,框架12和主體110、及基板10形成閉合空間。由於功率開關器件晶片13容易受濕氣、離子、粉塵等的影響,可在框架12和主體110形成的大致閉合空間中,全部或部分地填充密封材料(Encapsulation)15對其進行保護,同時密封材料15還將壓力柱111包覆於其中。壓力板11的主體部分110上可以開有灌膠孔(圖中未示意出,以便密封材料15灌入圖1A所示的大致閉合空間。
然而在圖1B所示實施例中,框架12中的支撐部121並不與壓力板11接觸,而是間隔有若干距離。壓力板11可以通過其壓力柱111進行支撐,框架12也可通過框架12的限位部122予以支撐。那麼,在此壓力板11與框架12不直接接觸的情況下,壓力板11與框架12的組合可以通過組合件,例如螺釘和螺孔的方式組合,最終壓力板11、框架12和基板10構成一個並非完全閉合的空間。
圖2A-圖2C為本發明實施例的封裝型功率電路模組1與散熱器3的裝配示意圖。基板10相對承載功率開關器件晶片13另一面連接有散熱器3。框架12的一端與壓力板11連接,其另一端與散熱器3連接。作用到壓力板11上的壓力可由緊固封裝型功率電路模組1的緊固件4(例如螺釘)的預緊力提供,如圖2A所示,緊固件4穿過框架12的本體,以將封裝型功率電路模組1與散熱器3固定。當緊固件4為螺釘時,框架12的本體內部具有與緊固件4匹配的螺紋結構。如圖2B所示,緊固件4位於框架12的外側,穿過壓力板11後與散熱器3固定。
圖2C示意了框架12與壓力板11不直接接觸的情況下,壓力板11與框架12的一種組裝方式。同圖1B所示實施例,框架12中的支撐部121並不與壓力板11接觸,而是間隔有若干距離。壓力板11可以通過壓力柱111進行支撐,框架12可以通過框架12的限位部122予以支撐。緊固件4穿過框架12的本體,以將封裝型功率電路模組1與散熱器3固定。
本發明提供的封裝型功率電路模組,利用對壓力板作用壓力,主要通過壓力板內部彈性模量較低的第一彈性材料的緩衝變形,使通過壓力板的壓力柱傳遞到基板上的壓力更均勻分佈,減小基板集中受力受損的風險,提高設計可靠性,降低了封裝型功率電路模組的結構成本,簡化了封裝型功率電路模組的裝配過程。
如以上實施例所提及,為了使壓力板11在承受壓力時能夠起到緩衝壓力的作用,壓力板11包括了第一彈性模量材料,第一彈性模量材料為低彈性模量材料(material with low elastic modulus)。採用低彈性模量材料的目的主要是因為低彈性模量材料具有較大的緩衝作用,在壓力板11承受壓力時,壓力板11沿壓力方向的變形較大,利用第一彈性模量材料的變形而一定程度較好地緩解壓力板所承受的壓力,並將所承受之壓力均勻施加在基板10上,減小基板10集中受力受損的風險。通過壓力板將外界受力均勻轉化至基板,也利於提高基板10與散熱器3之間的貼合度,從而利於降低封裝型功率電路模組1的熱阻。低彈性模量材料,根據壓力、基板10受力面積和壓力板11變形大小的需求,可選擇彈性模量值小於500Mpa的材料。低彈性模量材料例如包括:熱塑性橡膠(Thermoplastic Rubber,TPR)、熱塑性彈性體(Thermoplastic Elastomer,TPE)等,其中優選彈性模量為200Mpa左右的TPE材料。
此外,壓力板11至少還包括一種第二彈性模量材料,第二彈性模量材料為常規結構材料(normal structural material),例如聚碳酸酯、尼龍、聚丙烯等非金屬材料,或者鋁、銅、鋼、不銹鋼等金屬和金屬合金材料。此外,為了利於壓力板11的製作和成型,第二彈性模量材料也可以為熱塑性絕緣材料。第二彈性模量材料利於提高壓力板11的強度,以緩解壓力板11中第一彈性模量的變形導致壓力板11變形過於嚴重,使得整個壓力板11受力時產生的彈性形變控制在預期設計的範圍內。在此實施例的應用中,較好的會讓第二彈性模量材料的彈性模量大於等於兩倍的第一彈性模量材料的彈性模量。
圖3A-圖3F為本發明封裝型功率電路模組中的壓力板的多種實施例的結構圖。如圖3A所示的壓力板的實施例中,主體110包括上、下兩部分1101和1102,其中下部1102的材料採用第一彈性模量材料,從而使主體110起到壓力緩衝的作用。當然在其他壓力板的實施例中,壓力板的主體的其他部分也可為第一彈性模量製作,例如中間或上部。也可如圖3B所示的壓力板的實施例,壓力柱111整體均為第一彈性模量材料,以使直接與基板10接觸的壓力柱111起到壓力緩衝的作用。還可如圖3C所示的壓力板的實施例,僅壓力柱111的頂端1111,即與基板10接觸的部分為第一彈性模量材料,以使壓力柱111的頂端1111起到壓力緩衝的作用。當然在其他的實施例中,壓力板中的壓力柱與壓力板的主體連接的一端為第一彈性模量製作。也可以將以上所例舉的壓力板的實施例進行組合,例如如圖3D所示,主體110的中間部分1103的材料為第一彈性模量材料製作,同時壓力柱111的頂端1111的材料也為第一彈性模量材料製作,使得主體110和壓力柱111的頂端1111各起到緩衝變形的作用。
為進一步增加主體的強度,還可在壓力板中增設加強筋。加強筋較佳地可以採用金屬材質進行製作,當然也可以採用其他材料製作並不限制於金屬材料。增設加強筋的一實施例如圖3E所示壓力板中主體110中增加金屬加強筋(reinforcing rib)1105,由於壓力板11的厚度有限且金屬加強筋1105的厚度如果太薄不能起到加強左右,因此金屬加強筋1105的厚度選擇1mm~2mm左右,在該實施例中,主體110起到緩衝壓力的作用。此外,對於金屬材質的金屬加強筋除了起到增加結構強度的作用外,還可起到封裝型功率電路模組遮罩層的作用。增設加強筋的另一具體實施例還可如圖3F所示,在主體110的上部1101的中間加入金屬加強筋1105,主體110的下部1102為第一彈性模量材料製作,以使主體110具有一定強度的同時起到緩衝壓力的作用。上述給出的各種結構僅為示例說明,但本發明不限於此,任何可使得壓力板能夠起到緩衝壓力作用的結構及材料使用,都應涵蓋在本發明的保護範圍之內。
圖4為本發明另一實施例的封裝型功率電路模組的示意圖。如圖4所示的實施例中,壓力板11的壓力柱111有的會直接對基板10的表面接觸,然而也有的壓力柱會和基板10上的功率開關器件晶片13絕緣接觸或者其他類型的晶片接觸。為了避免在功率開關器件晶片13邊緣或者其他類型晶片的邊緣產生應力集中的問題,壓力柱111與功率開關器件晶片13邊緣或者其他類型晶片的邊緣之間的距離D1或D2需大於0.5mm。實則,在實際的壓力柱的位置的排放的設計中,在保證壓力柱能儘量均勻分佈的前提下,儘量不要直接接觸基板上的晶片。但是在沒有辦法改變基板上晶片位置排放的前提下,也可以讓少數壓力柱直接與基板上的晶片表面直接接觸。
繼續參考圖4,以壓力板11的主體110採用第二彈性模量材料及壓力柱111採用第一彈性模量材料為例,說明第一彈性模組材料厚度的計算。在圖4所示的實施例中,即計算壓力柱111的高度。
當對壓力板11施加壓力時,第一彈性模量材料的厚度由使變形基板表面平整所需的壓力、第一彈性模量材料的彈性模量和框架12限位等因素所確定。根據上文的分析,第一彈性模量材料的彈性模量遠低於第二彈性模量材料的彈性模量,因此,可以近似認為所有的彈性變形均發生在第一彈性模量材料上,此時壓力柱111的高度可以通過如下公式進行設計:
H=A*E*△H/F
其中,F為壓力板11作用到變形基板10使其表面平整的壓力,單位為N;A為壓力柱111壓力方向橫截面面積,單位為m2;E為第一彈性模量材料的彈性模量,單位為Pa;△H為第一彈性模量材料的彈性變形高度,單位為m;H為壓力柱111的高度,即如圖4所示的H1或H2,單位為m。
在如圖4所示的實施例中,第一彈性模量材料因為完全使用在壓力柱111中,因此可以通過上述公式計算第一彈性模量材料的厚度,即壓力柱111的高度。而在例如圖3A、3C-3F所示的其他實施例中,第一彈性模量材料的厚度,在保證第一彈性模量材料的彈性變形高度△H至少大於基板10在裝配狀態下的初始翹曲值(通常在50um-1mm之間)的前提下,可以通過模擬或者實驗得出。
例如,為了保證第一彈性模量材料能夠充分吸收由於工藝制程中的各類公差,第一彈性模量材料的厚度H通常被設置成第一彈性模量材料的彈性變形高度△H的2倍或以上。如在此實施例中,第一彈性模量材料的彈性變形高度至少要大於等於基板的初始翹曲值在0.3mm時,對應的第一彈性模量的厚度H以0.6mm以上為宜,優選範圍為1mm-2mm。 此外,H的高度還受壓力板作用到變形基板使其表面平整的壓力F值影響,F值由基板所需要承受的壓應力決定。典型條件下,在封裝型功率電路模組1的基板10和散熱器3之間需要設置一層熱介面材料(Thermal Interface Material,TIM)以降低其介面熱阻,而TIM材料的導熱能力和所承受的壓應力相關,壓應力較大時導熱能力亦越好,一般壓應力的水準取5PSI-40PSI之間,該壓應力水準和基板面積的乘積定義了F值。因此,在充分吸收基板初始變形的基礎上,H值還需要疊加該提供F力的高度,以封裝型功率電路模組高度為30mm為例,該疊加高度在1mm-4mm左右。綜合上面描述,高度H值的優選範圍在2mm-6mm之間。出於控制封裝型功率電路模組高度一致性的考慮,通常還可以在壓力板和散熱器之間通過剛性外殼形成一距離控制單元(圖中未示出),以調節模組高度的一致性。
圖5為本發明另一個實施例的封裝型功率電路模組的結構圖。在圖1所示的封裝型功率電路模組1中,壓力板11和框架12分別為獨立的元件,通過裝配後共同形成一殼體。與圖1所示的封裝型功率電路模組1不同的是,在圖5所示的實施例中,封裝型功率電路模組2中的壓力板21和框架22為一體成型結構,可採用雙色或多色注塑成型工藝生產。採用一體成型結構而構成一殼體時,由於其在緊固件預緊力作用下,壓力板21高度壓縮變形,框架22也需要承受壓縮變形。為避免框架22壓縮變形影響其和基板20形成的封閉腔體,除了在壓力板21中增加第一彈性模量材料外(圖5中以壓力柱211採用第一彈性模量材料為例),也可以在框架22中增加第一彈性模量材料,如圖5所示在限位部222及部分地支撐部221中增加第一彈性模量材料,以緩衝壓縮變形。此外,本實施例之圖5所示的標號23、24、25及210係對應與圖1A之標號13、14、15、110的元件類似,於此不再贅述。
本發明提供的封裝型功率電路模組,利用對壓力板作用壓力,通過壓力板內部不同彈性模量材料的緩衝變形,使通過壓力板的壓力柱傳遞到基板上的壓力更均勻分佈,減小基板集中受力受損的風險,簡化了封裝型功率電路模組的裝配過程,提高了裝配效率,降低了封裝型功率電路模組的結構成本。
以上具體地示出和描述了本發明的示例性實施方式。應該理解,本發明不限於所公開的實施方式,相反,本發明意圖涵蓋包含在所附權利要求範圍內的各種修改和等效置換。
1、2‧‧‧封裝型功率電路模組
10、20‧‧‧基板
11、21‧‧‧壓力板
110、210‧‧‧主體
111、211‧‧‧壓力柱
12、22‧‧‧框架
121、221‧‧‧支撐部
122、222‧‧‧限位部
13、23‧‧‧功率開關器件晶片
14、24‧‧‧引腳
141‧‧‧引腳孔
15、25‧‧‧密封材料
3‧‧‧散熱器
4‧‧‧緊固件
1101‧‧‧上部
1102‧‧‧下部
1111‧‧‧頂端
1103‧‧‧中間部分
1105‧‧‧金屬加強筋
D1、D2‧‧‧距離
H1、H2‧‧‧高度
通過參照附圖詳細描述其示例實施方式,本發明的上述和其它特徵及優點將變得更加明顯。 圖1A和圖1B為本發明一個實施例的封裝型功率電路模組的結構圖。 圖2A-圖2C為本發明實施例的封裝型功率電路模組與散熱器的裝配示意圖。 圖3A-圖3F為發明實施例的封裝型功率電路模組中的壓力板的多種結構圖。 圖4為本發明實施例的封裝型功率電路模組中的壓力板對基板的施壓方式示意圖。 圖5為本發明另一個實施例的封裝型功率電路模組的結構圖。
Claims (20)
- 一種封裝型功率電路模組,其特徵在於,包括: 一壓力板,該壓力板包括至少一壓力柱; 一框架; 一基板,該基板承載該功率電路,該功率電路包括至少一功率開關器件晶片; 其中,該框架設置於該基板與該壓力板之間,該框架承載該壓力板,該基板、該壓力板與該框架構成一大致閉合空間; 當該壓力板承受一外界壓力時,該至少一壓力柱抵住該基板,並與該基板絕緣接觸,而將該外界壓力均勻傳導至該基板。
- 如申請專利範圍第1項所述的封裝型功率電路模組,該壓力板包括一第一彈性模量材料和一第二彈性模量材料,該第一彈性模量材料的彈性模量小於該第二彈性模量材料的彈性模量。
- 如申請專利範圍第2項所述的封裝型功率電路模組,該第二彈性模量材料的彈性模量大於該第一彈性模量材料的彈性模量的兩倍。
- 如申請專利範圍第2項所述的封裝型功率電路模組,該壓力板還包括一主體,該至少一壓力柱垂直於該主體且設置於該主體朝向該基板的一側。
- 如申請專利範圍第4項所述的封裝型功率電路模組,該主體包含該第一彈性模量材料,該至少一壓力柱由該第二彈性模量材料製成。
- 如申請專利範圍第4項所述的封裝型功率電路模組,該至少一壓力柱包含有該第一彈性模量材料。
- 如申請專利範圍第6項所述的封裝型功率電路模組,該至少一壓力柱與該基板接觸的端部為該第一彈性模量材料製成。
- 如申請專利範圍第4項所述的封裝型功率電路模組,還包括一金屬加強筋,該金屬加強筋設置於該主體以增強該主體的結構強度。
- 如申請專利範圍第4項所述的封裝型功率電路模組,該基板上設置有複數個引腳,該主體對應設置有複數個引腳孔便於該複數個引腳通過;封裝功率電路模組通過穿過該主體的該複數個引腳與一外部系統電路板電性連接。
- 如申請專利範圍第2項所述的封裝型功率電路模組,該第一彈性模量材料的彈性模量小於500Mpa。
- 如申請專利範圍第2項所述的封裝型功率電路模組,該壓力板為一體成型的壓力板。
- 如申請專利範圍第2項所述的封裝型功率電路模組,該第一彈性模量材料和該第二彈性模量材料均為熱塑性絕緣材料。
- 如申請專利範圍第1項所述的封裝型功率電路模組,該基板相對承載該功率開關器件晶片的另一面連接有一散熱器。
- 如申請專利範圍第13項述的封裝型功率電路模組,該框架的一端與該壓力板連接,該框架的另一端與該散熱器連接。
- 如申請專利範圍第14項所述的封裝型功率電路模組,該框架包括一支撐部和一限位部,該支撐部支撐該壓力板且包圍該基板,該限位部限制該基板的移動。
- 如申請專利範圍第15項所述的封裝型功率電路模組,其中該限位部垂直於該支撐部,且該限位部卡位於該基板承載有該功率開關器件晶片的一面。
- 如申請專利範圍第14項所述的封裝型功率電路模組,其中該壓力板與該框架為一體成型。
- 如申請專利範圍第14項所述的封裝型功率電路模組,還包括一緊固件,該緊固件連接該壓力板與該散熱器。
- 如申請專利範圍第1項所述的封裝型功率電路模組,其中該功率電路的功率大於和等於50千瓦。
- 如申請專利範圍第1所述的封裝型功率電路模組,其中該大致閉合空間內填充有密封膠覆蓋該基板上的功率開關器件晶片。
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CN106298688B (zh) | 2018-11-06 |
US10104813B2 (en) | 2018-10-16 |
US20160352244A1 (en) | 2016-12-01 |
CN106298688A (zh) | 2017-01-04 |
TW201644012A (zh) | 2016-12-16 |
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