FR3083955B1 - Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef - Google Patents

Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef Download PDF

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Publication number
FR3083955B1
FR3083955B1 FR1856488A FR1856488A FR3083955B1 FR 3083955 B1 FR3083955 B1 FR 3083955B1 FR 1856488 A FR1856488 A FR 1856488A FR 1856488 A FR1856488 A FR 1856488A FR 3083955 B1 FR3083955 B1 FR 3083955B1
Authority
FR
France
Prior art keywords
metallized substrate
manufacturing
power module
aircraft
board electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1856488A
Other languages
English (en)
Other versions
FR3083955A1 (fr
Inventor
Stephane Sorel
Gael Blondel
Erick Henry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electrical and Power SAS
Original Assignee
Safran Electrical and Power SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electrical and Power SAS filed Critical Safran Electrical and Power SAS
Priority to FR1856488A priority Critical patent/FR3083955B1/fr
Priority to PCT/FR2019/051689 priority patent/WO2020012101A1/fr
Publication of FR3083955A1 publication Critical patent/FR3083955A1/fr
Application granted granted Critical
Publication of FR3083955B1 publication Critical patent/FR3083955B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Procédé de fabrication d'un module électronique de puissance pour une électronique embarquée sur aéronef, ce module de puissance comportant au moins un substrat métallisé (12) sur lequel sont fixées des puces de puissance (10) ainsi que des conducteurs (14) de liaison électrique, comprenant les étapes de : (a) fixation des puces sur le substrat métallisé, (c) fixation des conducteurs sur le substrat métallisé, chaque conducteur comportant une première extrémité positionnée et fixée sur une plage de connexion du substrat métallisé, caractérisé en ce qu'il comprend, simultanément ou juste après l'étape (a), une étape de : (b) fixation d'au moins un pion de centrage (26) sur le substrat métallisé, et en ce que, à l'étape (c), le positionnement de l'extrémité de chaque conducteur sur la plage de connexion est réalisé par rapport à la position dudit au moins un pion de centrage sur le substrat métallisé.
FR1856488A 2018-07-13 2018-07-13 Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef Active FR3083955B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1856488A FR3083955B1 (fr) 2018-07-13 2018-07-13 Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef
PCT/FR2019/051689 WO2020012101A1 (fr) 2018-07-13 2019-07-08 Procede de fabrication d'un module electronique de puissance pour une électronique embarquée sur aeronef

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1856488 2018-07-13
FR1856488A FR3083955B1 (fr) 2018-07-13 2018-07-13 Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef

Publications (2)

Publication Number Publication Date
FR3083955A1 FR3083955A1 (fr) 2020-01-17
FR3083955B1 true FR3083955B1 (fr) 2020-11-06

Family

ID=64049353

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1856488A Active FR3083955B1 (fr) 2018-07-13 2018-07-13 Procede de fabrication d'un module electronique de puissance pour une electronique embarquee sur aeronef

Country Status (2)

Country Link
FR (1) FR3083955B1 (fr)
WO (1) WO2020012101A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386626A (en) * 1993-09-10 1995-02-07 Cen Tronic Co., Ltd. Method for manufacturing a circuit board with a plurality of conductive terminal pins
US6116492A (en) * 1999-04-28 2000-09-12 Behavior Tech Computer Corporation Jig for facilitating surface-soldering pin to laminated metal sheet
FR2864419B1 (fr) 2003-12-19 2006-04-28 Hispano Suiza Sa Procede pour braser un composant electronique sur une carte electronique, procede de reparation de la carte et installation pour la mise en oeuvre du procede
US8520389B2 (en) * 2009-12-02 2013-08-27 Hamilton Sundstrand Corporation Power semiconductor module for wide temperature applications
CN106298688B (zh) * 2015-05-28 2018-11-06 台达电子工业股份有限公司 封装型功率电路模块
CN106257652B (zh) * 2015-06-16 2020-03-27 台达电子企业管理（上海）有限公司 封装模块及封装方法

Also Published As

Publication number Publication date
FR3083955A1 (fr) 2020-01-17
WO2020012101A1 (fr) 2020-01-16

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