WO2021166340A1 - 配線回路基板 - Google Patents

配線回路基板 Download PDF

Info

Publication number
WO2021166340A1
WO2021166340A1 PCT/JP2020/042346 JP2020042346W WO2021166340A1 WO 2021166340 A1 WO2021166340 A1 WO 2021166340A1 JP 2020042346 W JP2020042346 W JP 2020042346W WO 2021166340 A1 WO2021166340 A1 WO 2021166340A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
terminal
insulating layer
wiring pattern
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/042346
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
仁人 藤村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN202080095672.9A priority Critical patent/CN115066726A/zh
Priority to US17/798,810 priority patent/US12108529B2/en
Publication of WO2021166340A1 publication Critical patent/WO2021166340A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/02—Driving or moving of heads
    • G11B21/10—Track finding or aligning by moving the head ; Provisions for maintaining alignment of the head relative to the track during transducing operation, i.e. track following
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
    • G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
    • G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/596—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following for track following on disks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Definitions

  • the present invention relates to a wiring circuit board.
  • Wiring circuit boards are used in various industrial products such as electronic and electrical equipment.
  • a wiring circuit board for example, a suspension board with a circuit on which a slider provided with a magnetic head and a piezoelectric element for displacing the slider are mounted is known.
  • a support substrate, a base insulating layer, and a conductor pattern are provided in order in the thickness direction of the support substrate, and the conductor pattern is connected to a magnetic head terminal that is electrically connected to the magnetic head and a magnetic head terminal.
  • a suspension board with a circuit having a signal wiring, a first terminal electrically connected to a piezoelectric element, and a power supply wiring connected to the first terminal, and the signal wiring and the power supply wiring are adjacent to each other has been proposed (for example, see Patent Document 1).
  • the power supply wiring electrically connected to the piezoelectric element may be charged, and the power supply wiring and the signal wiring may be short-circuited.
  • the present invention provides a wiring circuit board capable of suppressing a short circuit between the first wiring and the second wiring.
  • the present invention is a wiring circuit board including a first mounting region for mounting a first electronic element and a second mounting region for mounting a second electronic element, and comprises a metal support layer and a metal support layer.
  • a base insulating layer arranged on one side of the metal support layer in the thickness direction and a conductor layer arranged on one side of the base insulating layer in the thickness direction are provided, and the conductor layer is the first mounting.
  • a first wiring pattern having a first terminal arranged in the region or adjacent to the first mounting region and a first wiring connected to the first terminal, and in the second mounting region or the second mounting region.
  • a second wiring pattern having a second terminal arranged adjacent to the mounting area, a second wiring connected to the second terminal and arranged at intervals with respect to the first wiring, and the metal.
  • the shielded wiring pattern comprises a shielded wiring pattern that is electrically connected to the support layer, and the shielded wiring pattern includes a wiring circuit board including a shielded wiring that is arranged between the first wiring and the second wiring.
  • the shield wiring pattern is electrically connected to the metal support layer, and the shield wiring included in the shield wiring pattern is arranged between the first wiring and the second wiring. Therefore, even if the first wiring and / or the second wiring is charged, it is possible to prevent the first wiring and the second wiring from being short-circuited.
  • the wiring circuit according to the above [1], wherein the shield wiring pattern has an inspection terminal for continuity inspection and a ground connection portion electrically connected to the metal support layer. Includes substrate.
  • the shielded wiring pattern has an inspection terminal and a ground connection. Therefore, the probe can be brought into contact with the inspection terminal, and the continuity inspection of the shield wiring pattern can be performed.
  • the present invention [3] includes the wiring circuit board according to the above [2], wherein at least one of the inspection terminal and the ground connection portion is located at an end portion of the shield wiring.
  • At least one of the inspection terminal and the ground connection portion is located at the end of the shield wiring. Therefore, the continuity inspection of the shield wiring pattern is performed to more reliably inspect the poor formation of the shield wiring pattern. can.
  • the present invention [4] further includes a cover insulating layer that is arranged on one side of the base insulating layer in the thickness direction and covers the conductor layer, and the first terminal, the second terminal, and the inspection terminal are The wiring circuit board according to the above [2] or [3], which is exposed from the cover insulating layer.
  • the probe is provided from one side in the thickness direction with respect to each of the first terminal, the second terminal and the inspection terminal. Can be contacted. Therefore, the continuity inspection of the first wiring pattern, the second wiring pattern, and the shield wiring pattern can be collectively performed.
  • a short circuit between the first wiring and the second wiring can be suppressed.
  • FIG. 1 shows a plan view of a suspension board with a circuit as a first embodiment of the wiring circuit board of the present invention.
  • FIG. 2 shows a cross-sectional view taken along the line AA of the suspension board with a circuit shown in FIG.
  • FIG. 3A shows a cross-sectional view taken along the line BB of the suspension board with a circuit shown in FIG.
  • FIG. 3B shows a CC sectional view of the suspension substrate with a circuit shown in FIG.
  • FIG. 3C shows a DD cross-sectional view of the suspension substrate with a circuit shown in FIG.
  • FIG. 4 shows a DD cross-sectional view of a suspension substrate with a circuit as a second embodiment.
  • FIG. 1 shows a plan view of a suspension board with a circuit as a first embodiment of the wiring circuit board of the present invention.
  • FIG. 2 shows a cross-sectional view taken along the line AA of the suspension board with a circuit shown in FIG.
  • FIG. 3A shows a cross
  • FIG. 5 shows a DD cross-sectional view of a suspension substrate with a circuit as a third embodiment.
  • FIG. 6 shows a DD cross-sectional view of a suspension substrate with a circuit as a fourth embodiment.
  • FIG. 7 shows a DD cross-sectional view of a suspension substrate with a circuit as a fifth embodiment.
  • the suspension board 1 with a circuit as the first embodiment of the wiring circuit board of the present invention will be described with reference to FIGS. 1 to 3C.
  • the suspension board 1 with a circuit has a substantially flat band shape extending in a predetermined direction.
  • the paper surface thickness direction is the thickness direction (first direction) of the suspension substrate 1 with a circuit
  • the front side of the paper surface is one side in the thickness direction (one side in the first direction)
  • the back side of the paper surface is the other side in the thickness direction. (The other side of the first direction).
  • the vertical direction of the paper surface is the longitudinal direction of the suspension substrate 1 with a circuit (the second direction orthogonal to the first direction), and the upper side of the paper surface is one side of the longitudinal direction (one side of the second direction) and the lower side of the paper surface.
  • the side is the other side in the longitudinal direction (the other side in the second direction).
  • the left-right direction of the paper surface is the width direction of the suspension substrate 1 with a circuit (the third direction orthogonal to the first direction and the second direction), and the right side of the paper surface is one side of the width direction (one side of the third direction). ), The left side of the paper is the other side in the width direction (the other side in the third direction). Specifically, the direction follows the direction arrow shown in each figure.
  • the thickness direction of the suspension board 1 with a circuit is simply the thickness direction
  • the longitudinal direction of the suspension substrate 1 with a circuit is simply the longitudinal direction
  • the width direction of the suspension substrate 1 with a circuit is simply the width direction.
  • the suspension substrate 1 with a circuit can mount a slider 6 as an example of a first electronic element and a plurality (two) piezoelectric elements 7 as an example of a second electronic element.
  • the suspension board 1 with a circuit includes a first mounting area 1A and a plurality (two) second mounting areas 1B.
  • the first mounting area 1A is an area for mounting the slider 6.
  • the first mounting region 1A is located at one end of the suspension substrate 1 with a circuit in the longitudinal direction.
  • the first mounting area 1A is located between a plurality of (two) second mounting areas 1B in the width direction.
  • the plurality of (two) second mounting regions 1B are regions for mounting the piezoelectric element 7.
  • the plurality (two) second mounting regions 1B are located on the opposite side of the first mounting region 1A in the longitudinal direction.
  • the plurality (two) second mounting regions 1B are located at intervals from each other in the width direction.
  • the metal support layer 2, the base insulating layer 3, the conductor layer 4, and the cover insulating layer 5 are sequentially arranged from the other side in the thickness direction toward one side. Be prepared.
  • the metal support layer 2 is a metal support that supports the conductor layer 4, and extends in the longitudinal direction.
  • the metal support layer 2 and the conductor layer 4 are shown by solid lines, and the base insulating layer 3 and the cover insulating layer 5 are omitted.
  • the metal support layer 2 includes a stage 20 and a main body 21.
  • the stage 20 is located at one end of the metal support layer 2 in the longitudinal direction.
  • the stage 20 overlaps the first mounting area 1A and the plurality (two) second mounting areas 1B when viewed from the thickness direction.
  • the stage 20 has an H shape when viewed from the thickness direction.
  • the stage 20 has two recesses 20A.
  • the two recesses 20A are arranged at intervals in the width direction.
  • the recess 20A overlaps with the second mounting region 1B when viewed from the thickness direction.
  • the recess 20A is recessed inward in the width direction from the edge of the stage 20 in the width direction.
  • the main body 21 is a portion supported by a road beam (not shown).
  • the main body 21 is located on the opposite side of the stage 20 in the longitudinal direction.
  • the main body 21 has a flat band shape extending in the longitudinal direction.
  • the main body 21 is continuous with the other end of the stage 20 in the longitudinal direction.
  • Examples of the material of the metal support layer 2 include a metal material such as stainless steel.
  • the thickness of the metal support layer 2 is not particularly limited, but is, for example, 10 ⁇ m or more and 35 ⁇ m or less.
  • the base insulation layer 3 is arranged on one side of the metal support layer 2 in the thickness direction, specifically, on one surface of the metal support layer 2 in the thickness direction.
  • the base insulating layer 3 has a predetermined pattern corresponding to the conductor layer 4.
  • the base insulating layer 3 is located between the metal support layer 2 and the conductor layer 4 in the thickness direction.
  • the base insulating layer 3 includes a ground opening 30.
  • the ground opening 30 is located in a portion of the base insulating layer 3 located on the main body portion 21.
  • the ground opening 30 penetrates the base insulating layer 3 in the thickness direction.
  • the ground opening 30 exposes one surface of the main body 21 in the thickness direction from the base insulating layer 3.
  • Examples of the material of the base insulating layer 3 include a synthetic resin such as a polyimide resin.
  • the thickness of the base insulating layer 3 is not particularly limited, but is, for example, 1 ⁇ m or more and 1000 ⁇ m or less.
  • the conductor layer 4 is arranged on one side of the base insulating layer 3 in the thickness direction, specifically, on one surface of the base insulating layer 3 in the thickness direction.
  • the conductor layer 4 includes a first wiring pattern 40, a second wiring pattern 41, and a shield wiring pattern 42.
  • the first wiring pattern 40 includes a plurality of (four) slider connection terminals 40A as an example of the first terminal, a plurality of (four) external connection terminals 40B, and a plurality of (four) signal wirings 40C. ..
  • the plurality (4) slider connection terminals 40A are electrically connected to the slider 6 via a bonding material (for example, solder) when the slider 6 is mounted on the suspension board 1 with a circuit.
  • a bonding material for example, solder
  • the plurality of slider connection terminals 40A are located at one end of the suspension board 1 with a circuit in the longitudinal direction. In this embodiment, the plurality of slider connection terminals 40A are arranged adjacent to the first mounting area 1A. More specifically, the plurality of slider connection terminals 40A are arranged adjacent to one side of the first mounting area 1A in the longitudinal direction. The plurality of slider connection terminals 40A may be arranged in the first mounting area 1A.
  • the plurality of slider connection terminals 40A are located at intervals from each other in the width direction.
  • the slider connection terminal 40A has a rectangular shape extending in the longitudinal direction.
  • the plurality (4) external connection terminals 40B are electrically connected to the external board 8 with the main body 21 supported by the load beam (not shown).
  • the plurality (4) external connection terminals 40B are located at the other end of the suspension board 1 with a circuit in the longitudinal direction.
  • the plurality of external connection terminals 40B are located at intervals from each other in the width direction.
  • the external connection terminal 40B has a rectangular shape extending in the longitudinal direction.
  • the plurality (4) signal wirings 40C electrically connect the plurality (4) slider connection terminals 40A and the plurality (4) external connection terminals 40B.
  • the plurality (four) signal wirings 40C extend along the longitudinal direction and are located spaced apart from each other in the width direction.
  • the plurality (four) signal wirings 40C pass between the two second mounting regions 1B in the width direction.
  • the plurality of (four) signal wirings 40C include a plurality of (two) lead wirings 40D as an example of the first wiring and a plurality of (two) write wirings 40E.
  • the plurality of (two) lead wirings 40D are connected to the plurality (two) slider connection terminals 40A located on one side in the width direction among the plurality (four) slider connection terminals 40A. Further, the plurality of (two) lead wirings 40D are connected to the plurality (two) external connection terminals 40B located on one side in the width direction among the plurality (four) external connection terminals 40B.
  • the plurality of (two) lead wirings 40D are located on one side in the width direction with respect to the plurality of (two) write wirings 40E.
  • the two lead wires 40D form a first differential signal wire pair that transmits the lead signal.
  • the slider connection terminal 40A electrically connected to the slider 6 and the external connection terminal 40B electrically connected to the external board 8
  • one of the two lead wirings 40D has a first lead wiring 40D.
  • the lead signal of the above is transmitted, and the second lead signal having the opposite phase to that of the first lead signal is transmitted to the other lead wiring 40D.
  • the plurality of (two) light wirings 40E are connected to the plurality (two) slider connection terminals 40A located on the other side in the width direction among the plurality (four) slider connection terminals 40A. Further, the plurality of (two) light wirings 40E are connected to the plurality (two) external connection terminals 40B located on the other side in the width direction among the plurality (four) external connection terminals 40B.
  • the two write wirings 40E form a second differential signal wiring pair that transmits a write signal.
  • the slider connection terminal 40A electrically connected to the slider 6 and the external connection terminal 40B electrically connected to the external board 8
  • one of the two light wirings 40E has a first light wiring 40E.
  • the write signal of the above is transmitted, and the second write signal having the opposite phase to the first write signal is transmitted to the other write wiring 40E.
  • the second wiring pattern 41 includes a plurality of (four) element connection terminals 41A, a plurality of (two) power supply terminals 41B, a plurality of (two) power supply wirings 41C as an example of the second wiring, and a plurality of (two) power supply wirings 41C. It is provided with two) ground wirings 41D.
  • the plurality of (four) element connection terminals 41A are connected to the piezoelectric element 7 via a bonding material (for example, solder) when the plurality (two) piezoelectric elements 7 are mounted on the suspension substrate 1 with a circuit. It is electrically connected.
  • the element connection terminal 41A has a rectangular shape extending in the width direction. Two element connection terminals 41A are arranged in each second mounting area 1B.
  • the two element connection terminals 41A arranged in each second mounting area 1B include a first element connection terminal 41E as an example of the second terminal and a second element connection terminal 41F.
  • the first element connection terminal 41E and the second element connection terminal 41F are arranged in the second mounting area 1B.
  • the first element connection terminal 41E and the second element connection terminal 41F may be arranged adjacent to the second mounting area 1B.
  • the first element connection terminal 41E is located on the opposite side of the recess 20A in the longitudinal direction.
  • the second element connection terminal 41F is located at a distance from the first element connection terminal 41E in the longitudinal direction.
  • the second element connection terminal 41F is located on the opposite side of the first element connection terminal 41E with respect to the recess 20A.
  • the plurality (two) power supply terminals 41B are electrically connected to the external power supply 9 with the main body 21 supported by the load beam (not shown).
  • the plurality (two) power supply terminals 41B are located at the other end of the suspension board 1 with a circuit in the longitudinal direction.
  • the plurality (two) power supply terminals 41B are located at intervals from each other in the width direction.
  • the plurality (four) external connection terminals 40B are located between the plurality (two) power supply terminals 41B in the width direction.
  • the power supply terminal 41B has a rectangular shape extending in the longitudinal direction.
  • the power supply wiring 41C is connected to the first element connection terminal 41E and the power supply terminal 41B, and electrically connects them.
  • the plurality (two) power supply wirings 41C extend along the longitudinal direction and are located at intervals from each other in the width direction.
  • the plurality (four) signal wirings 40C pass between the two power supply wirings 41C in the width direction.
  • the power supply wiring 41C on one side in the width direction is arranged on one side with a space from the lead wiring 40D in the width direction.
  • the power supply wiring 41C on the other side in the width direction is arranged at intervals on the other side with respect to the light wiring 40E in the width direction.
  • the ground wiring 41D is connected to the second element connection terminal 41F, and electrically connects (grounds) the second element connection terminal 41F and the stage 20.
  • the plurality (two) ground wirings 41D are located at intervals from each other in the width direction.
  • the ground wiring 41D extends from the second element connection terminal 41F to one side in the longitudinal direction.
  • the ground wiring 41D contacts (grounds) the stage 20 through a hole (not shown) included in the base insulating layer 3.
  • the shield wiring pattern 42 overlaps with the main body 21 when viewed from the thickness direction.
  • the shield wiring pattern 42 is located between the power supply wiring 41C and the lead wiring 40D.
  • the shield wiring pattern 42 includes an inspection terminal 42A and a shield wiring 42B.
  • the inspection terminal 42A is provided for the continuity inspection of the shield wiring pattern 42.
  • the inspection terminal 42A comes into contact with the third probe 12 when the continuity inspection of the shield wiring pattern 42 is performed (see FIG. 3C).
  • the inspection terminal 42A is located at one end of the shield wiring pattern 42 in the longitudinal direction.
  • the inspection terminal 42A is located at one end of the main body 21 in the longitudinal direction.
  • the inspection terminal 42A is located on one side of the base insulating layer 3 in the thickness direction.
  • the inspection terminal 42A has a rectangular shape extending in the longitudinal direction.
  • the shield wiring 42B is connected to the inspection terminal 42A, and electrically connects (grounds) the inspection terminal 42A and the main body 21. As a result, the shield wiring pattern 42 is electrically connected to the metal support layer 2.
  • the shield wiring 42B suppresses a short circuit between the power supply wiring 41C and the lead wiring 40D.
  • the shield wiring 42B extends along the longitudinal direction.
  • the shield wiring 42B is arranged between the power supply wiring 41C and the lead wiring 40D.
  • the shield wiring 42B is adjacent to the power supply wiring 41C and the lead wiring 40D.
  • the shield wiring 42B is located on the opposite side of the write wiring 40E with respect to the lead wiring 40D.
  • the shield wiring 42B has a wiring main body 42C and a ground connection portion 42D.
  • the wiring body 42C is located on one side of the base insulating layer 3 in the thickness direction. One end of the wiring body 42C in the longitudinal direction is connected to the inspection terminal 42A. In other words, the inspection terminal 42A is located at one end of the shielded wiring 42B in the longitudinal direction. The wiring body 42C extends from the inspection terminal 42A to the other side in the longitudinal direction.
  • the ground connection portion 42D is located at the other end of the shield wiring 42B in the longitudinal direction.
  • the ground connection portion 42D is electrically connected to the metal support layer 2. More specifically, the ground connection portion 42D is continuous with the other end of the wiring body 42C in the longitudinal direction.
  • the ground connection portion 42D is filled in the ground opening 30 and comes into contact with the main body portion 21.
  • Examples of the material of the conductor layer 4 include a conductor material such as copper.
  • the thickness of the conductor layer 4 is, for example, 1 ⁇ m or more, preferably 3 ⁇ m or more, for example, 20 ⁇ m or less, preferably 12 ⁇ m or less.
  • the cover insulating layer 5 covers one side of the base insulating layer 3 in the thickness direction so as to cover the conductor layer 4, specifically, the thickness of the base insulating layer 3. It is placed on one side of the direction.
  • the cover insulating layer 5 covers the first wiring pattern 40 so that the plurality (4) slider connection terminals 40A and the plurality (4) external connection terminals 40B are exposed. do. Further, the cover insulating layer 5 covers the second wiring pattern 41 so that the plurality (four) element connection terminals 41A and the plurality (two) power supply terminals 41B are exposed.
  • the cover insulating layer 5 covers the shield wiring pattern 42 so that the inspection terminal 42A is exposed.
  • the cover insulating layer 5 has an opening 50.
  • the opening 50 penetrates the cover insulating layer 5 in the thickness direction.
  • the opening 50 exposes one side of the inspection terminal 42A in the thickness direction.
  • one side in the thickness direction of the slider connection terminal 40A, one side in the thickness direction of the power supply terminal 41B, one side in the thickness direction of the element connection terminal 41A, and one side in the thickness direction of the inspection terminal 42A are exposed from the cover insulating layer 5. do.
  • Examples of the material of the cover insulating layer 5 include a synthetic resin such as a polyimide resin.
  • the thickness of the cover insulating layer 5 is, for example, 1 ⁇ m or more, preferably 2 ⁇ m or more, for example, 10 ⁇ m or less, preferably 8 ⁇ m or less.
  • the continuity inspection on the suspension board 1 with a circuit inspects at least the disconnection and / or short circuit of the shield wiring 42B.
  • the disconnection and / or short circuit of the signal wiring 40C, the power supply wiring 41C, and the shield wiring 42B are collectively inspected by using an inspection jig (not shown).
  • the inspection jig (not shown) includes a first probe 10, a second probe 11, a third probe 12, a plurality of fourth probes (not shown), a plurality of fifth probes (not shown), and a sixth probe (not shown). ..
  • the first probe 10 contacts the slider connection terminal 40A from one side in the thickness direction in the continuity inspection.
  • the second probe 11 contacts the first element connection terminal 41E from one side in the thickness direction in the continuity inspection.
  • the third probe 12 contacts the inspection terminal 42A from one side in the thickness direction in the continuity inspection.
  • each of the first probe 10, the second probe 11, and the third probe 12 is electrically connected to a voltage detection circuit capable of detecting a voltage.
  • the plurality of fourth probes come into contact with the plurality of external connection terminals 40B from one side in the thickness direction in the continuity inspection.
  • the plurality of fifth probes come into contact with the plurality of power supply terminals 41B from one side in the thickness direction in the continuity inspection.
  • the sixth probe comes into contact with the portion of the metal support layer 2 where the base insulating layer 3 is not arranged from one side in the thickness direction.
  • each of the fourth probe, the fifth probe, and the sixth probe is electrically connected to a voltage application device to which a voltage can be applied.
  • the voltage application device applies a voltage to the signal wiring 40C via the fourth probe (not shown) that contacts the external connection terminal 40B.
  • the voltage detection circuit (not shown) connected to the first probe 10 inspects the signal wiring 40C for disconnection and / or short circuit depending on whether or not the voltage is detected.
  • the voltage applying device applies a voltage to the power supply wiring 41C via the fifth probe (not shown) in contact with the power supply terminal 41B. Then, the voltage detection circuit (not shown) connected to the second probe 11 inspects the power supply wiring 41C for disconnection and / or short circuit depending on whether or not the voltage is detected.
  • the voltage applying device applies a voltage to the metal support layer 2 via the sixth probe (not shown) in contact with the metal support layer 2.
  • the voltage detection circuit (not shown) connected to the third probe 12 inspects the shield wiring 42B for disconnection and / or short circuit depending on whether or not the voltage is detected.
  • the shield wiring pattern 42 is electrically connected to the metal support layer 2, and the shield wiring 42B included in the shield wiring pattern 42 is the lead wiring 40D and the power supply wiring 41C. It is placed between and. Therefore, even if the lead wiring 40D and / or the power supply wiring 41C is charged, it is possible to prevent the lead wiring 40D and the power supply wiring 41C from being short-circuited.
  • the power supply wiring 41C electrically connected to the piezoelectric element 7 is more likely to be charged than the signal wiring 40C. Then, when the power supply wiring 41C is charged and the lead wiring 40D and the power supply wiring 41C are short-circuited, the slider 6 is electrostatically destroyed. On the other hand, according to the above configuration, since the short circuit between the lead wiring 40D and the power supply wiring 41C is suppressed, the electrostatic breakdown of the slider 6 can be suppressed.
  • the shield wiring pattern 42 has an inspection terminal 42A located at one end of the shield wiring 42B and a ground connection portion 42D located at the other end of the shield wiring 42B. Therefore, the third probe 12 can be brought into contact with the inspection terminal 42A, and the continuity inspection of the shield wiring pattern 42 can be performed.
  • the slider connection terminal 40A, the first element connection terminal 41E, and the inspection terminal 42A are exposed from the cover insulating layer 5. Therefore, the probes (first probe 10, second probe 11, and third probe 12) can be brought into contact with each of the slider connection terminal 40A, the first element terminal 41E, and the inspection terminal 42A from one side in the thickness direction. .. As a result, the continuity inspection of the first wiring pattern 40, the second wiring pattern 41, and the shield wiring pattern 42 can be collectively performed.
  • the inspection terminal 42A is exposed on one side in the thickness direction, but the wiring circuit board of the present invention is not limited to this.
  • the inspection terminal 42A is exposed from the other side in the thickness direction.
  • the base insulating layer 3 has a first terminal opening 31.
  • the first terminal opening 31 penetrates the base insulating layer 3 in the thickness direction.
  • the metal support layer 2 has a second terminal opening 20B.
  • the second terminal opening 20B penetrates the metal support layer 2 in the thickness direction.
  • the second terminal opening 20B communicates with the first terminal opening 31 in the thickness direction.
  • the inspection terminal 42A is filled in the first terminal opening 31 and is exposed from the other side in the thickness direction via the second terminal opening 20B.
  • the second embodiment also has the same effect as the first embodiment.
  • the inspection terminal 42A is located at one end of the shielded wiring pattern 42 in the longitudinal direction, and the ground connection portion 42D is located at the other end of the shielded wiring pattern 42 in the longitudinal direction.
  • the arrangement and number of the ground connection portions 42D and the arrangement and number of the ground connection portions 42D are not limited thereto.
  • the shielded wiring 42B has a wiring main body 42C, a first ground connecting portion 42E, and a second ground connecting portion 42F.
  • the first ground connection portion 42E is located at one end of the shield wiring 42B in the longitudinal direction.
  • the second ground connection portion 42F is located at the other end of the shield wiring 42B in the longitudinal direction. More specifically, the first ground connection portion 42E is continuous with one end portion of the wiring main body 42C in the longitudinal direction.
  • the second ground connection portion 42F is continuous with the other end of the wiring main body 42C in the longitudinal direction.
  • the base insulating layer 3 has a first ground opening 32 and a second ground opening 33.
  • Each of the first gland opening 32 and the second gland opening 33 penetrates the base insulating layer 3 in the thickness direction.
  • the first gland opening 32 and the second gland opening 33 are located spaced apart from each other in the longitudinal direction.
  • the first gland connection portion 42E is filled in the first gland opening 32 and comes into contact with the main body portion 21.
  • the second ground connection portion 42F is filled in the second ground opening 33 and comes into contact with the main body portion 21.
  • the inspection terminal 42A is provided between the first ground connection portion 42E and the second ground connection portion 42F in the shield wiring pattern 42.
  • the inspection terminal 42A is interposed in the middle of the wiring body 42C in the longitudinal direction (between one end and the other end).
  • the shield wiring pattern 42 includes a first inspection terminal 42G, a second inspection terminal 42H, and a shield wiring 42B.
  • the first inspection terminal 42G and the second inspection terminal 42H are located at intervals from each other in the longitudinal direction.
  • the first inspection terminal 42G is located at one end of the shield wiring pattern 42 in the longitudinal direction.
  • the second inspection terminal 42H is located at the other end of the shield wiring pattern 42 in the longitudinal direction.
  • the shield wiring 42B is located between the first inspection terminal 42G and the second inspection terminal 42H.
  • the shield wiring 42B is connected to the first inspection terminal 42G and the second inspection terminal 42H.
  • the shield wiring 42B has a wiring main body 42C, a first ground connection portion 42E, and a second ground connection portion 42F, as in the third embodiment. Further, the base insulating layer 3 has a first ground opening 32 and a second ground opening 33, as in the third embodiment.
  • the first ground connection portion 42E is continuous with the first inspection terminal 42G.
  • the first ground connection portion 42E is located on the opposite side of the first inspection terminal 42G in the longitudinal direction.
  • the second ground connection portion 42F is continuous with the second inspection terminal 42H.
  • the second ground connection portion 42F is located on one side with respect to the second inspection terminal 42H in the longitudinal direction.
  • the cover insulating layer 5 has a first opening 51 and a second opening 52.
  • the first opening 51 exposes one surface of the first inspection terminal 42G in the thickness direction.
  • the second opening 52 exposes one surface of the second inspection terminal 42H in the thickness direction.
  • the continuity inspection is performed in a state where the third probe 12 (see FIG. 3C) is in contact with the first inspection terminal 42G and the sixth probe (not shown) is in contact with the second inspection terminal 42H. Is carried out.
  • the shield wiring pattern 42 separately includes the inspection terminal 42A and the ground connection portion 42D, but the present invention is not limited thereto.
  • the inspection terminal may also serve as a ground connection portion.
  • the shield wiring pattern 42 includes the first inspection terminal 42G and the second inspection terminal 42H as in the fourth embodiment, and the first inspection terminal 42G includes the first inspection terminal 42G.
  • the second inspection terminal 42H also serves as a first ground connection portion, and also serves as a second ground connection portion.
  • the base insulating layer 3 has the first ground opening 32 and the second ground opening 33
  • the cover insulating layer 5 has the first opening 51 and the second opening 52. And have.
  • the first inspection terminal 42G is continuous with one end of the wiring body 42C in the longitudinal direction.
  • the first inspection terminal 42G is filled in the first ground opening 32 and comes into contact with the main body portion 21.
  • the second inspection terminal 42H is continuous with the other end of the wiring body 42C in the longitudinal direction.
  • the second inspection terminal 42H is filled in the second ground opening 33 and comes into contact with the main body portion 21.
  • the shielded wiring 42B is adjacent to the power supply wiring 41C and the lead wiring 40D, but the wiring circuit board of the present invention is not limited thereto.
  • other wiring may be arranged between the shield wiring 42B and the lead wiring 40D.
  • the suspension board 1 with a circuit is mentioned as an example of the wiring circuit board, but the wiring circuit board is not limited to the suspension board 1 with a circuit.
  • the wiring circuit board may be a flexible printed wiring board with a reinforcing layer including the metal support layer 2 as a reinforcing layer.
  • the wiring circuit board of the present invention is used in various applications such as a wiring circuit board for electronic devices (wiring circuit board for electronic components) and a wiring circuit board for electrical devices (wiring circuit board for electrical components).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
PCT/JP2020/042346 2020-02-17 2020-11-12 配線回路基板 Ceased WO2021166340A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080095672.9A CN115066726A (zh) 2020-02-17 2020-11-12 布线电路基板
US17/798,810 US12108529B2 (en) 2020-02-17 2020-11-12 Wiring circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-024024 2020-02-17
JP2020024024A JP7493952B2 (ja) 2020-02-17 2020-02-17 配線回路基板

Publications (1)

Publication Number Publication Date
WO2021166340A1 true WO2021166340A1 (ja) 2021-08-26

Family

ID=77390583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/042346 Ceased WO2021166340A1 (ja) 2020-02-17 2020-11-12 配線回路基板

Country Status (4)

Country Link
US (1) US12108529B2 (https=)
JP (1) JP7493952B2 (https=)
CN (1) CN115066726A (https=)
WO (1) WO2021166340A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004756A (ja) * 2006-06-22 2008-01-10 Nitto Denko Corp 配線回路基板
JP2008010646A (ja) * 2006-06-29 2008-01-17 Nitto Denko Corp 配線回路基板
JP2008276922A (ja) * 2007-04-04 2008-11-13 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスク

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339834B2 (ja) * 2005-08-23 2009-10-07 日東電工株式会社 回路付サスペンション基板の製造方法
US8097811B2 (en) 2007-04-04 2012-01-17 Dai Nippon Printing Co., Ltd. Substrate for suspension
US8758910B2 (en) * 2010-06-29 2014-06-24 Dai Nippon Printing Co., Ltd. Substrate for suspension, and production process thereof
JP5810492B2 (ja) * 2010-09-01 2015-11-11 大日本印刷株式会社 サスペンション用基板、サスペンション、およびサスペンション用基板の製造方法
JP6043613B2 (ja) * 2012-12-11 2016-12-14 日東電工株式会社 回路付サスペンション基板
JP6360707B2 (ja) * 2014-04-21 2018-07-18 日東電工株式会社 配線回路基板
JP2016051881A (ja) * 2014-09-02 2016-04-11 日東電工株式会社 配線回路基板
JP6466680B2 (ja) * 2014-10-14 2019-02-06 日東電工株式会社 回路付サスペンション基板
JP6420643B2 (ja) 2014-11-28 2018-11-07 日東電工株式会社 回路付サスペンション基板
JP6533153B2 (ja) * 2015-12-07 2019-06-19 日東電工株式会社 回路付サスペンション基板、および、回路付サスペンション基板の製造方法
JP6687490B2 (ja) 2016-09-07 2020-04-22 日東電工株式会社 回路付サスペンション基板および回路付サスペンション基板の製造方法
KR20180062098A (ko) * 2016-11-30 2018-06-08 엘지디스플레이 주식회사 백라이트유닛 및 이를 포함하는 액정표시장치
JP7173752B2 (ja) * 2017-04-28 2022-11-16 日東電工株式会社 フレキシブル配線回路基板、その製造方法、および、撮像装置
JP6865643B2 (ja) * 2017-06-09 2021-04-28 日東電工株式会社 回路付サスペンション基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004756A (ja) * 2006-06-22 2008-01-10 Nitto Denko Corp 配線回路基板
JP2008010646A (ja) * 2006-06-29 2008-01-17 Nitto Denko Corp 配線回路基板
JP2008276922A (ja) * 2007-04-04 2008-11-13 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスク

Also Published As

Publication number Publication date
JP7493952B2 (ja) 2024-06-03
CN115066726A (zh) 2022-09-16
JP2021128813A (ja) 2021-09-02
US20230156914A1 (en) 2023-05-18
US12108529B2 (en) 2024-10-01

Similar Documents

Publication Publication Date Title
US6201398B1 (en) Non-contact board inspection probe
US4748293A (en) Flexible cable and method of manufacturing thereof
TWI596995B (zh) 印刷電路板
US10201077B2 (en) Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same
TWI430411B (zh) 堆式防護結構
JPWO2018151134A1 (ja) 電子機器
US9648726B2 (en) Suspension board assembly sheet with circuits and manufacturing method of the same
JP5079806B2 (ja) 検査用構造体
WO2011145269A1 (ja) Ｉｃ電流測定用装置、及びｉｃ電流測定用アダプタ
JP4757630B2 (ja) プローブカード
KR100768291B1 (ko) 반도체 장치의 시험 장치 및 반도체 장치의 시험 방법
JP6420643B2 (ja) 回路付サスペンション基板
JP7101457B2 (ja) 電気的接続装置
WO2021166340A1 (ja) 配線回路基板
US6040704A (en) Probe unit and inspection head
JP6546683B2 (ja) 回路付サスペンション基板およびその製造方法
KR101693001B1 (ko) 반도체 패키지 테스트 보드 및 그를 구비하는 반도체 패키지 테스트용 보드 어셈블리
JP2014202739A (ja) プローブカード
US8389978B2 (en) Two-shelf interconnect
TW202343000A (zh) 電連接裝置
JP2003307527A (ja) プローブカード
JP7205435B2 (ja) ケーブル整列治具及び多芯ケーブルの検査方法
JP2008226880A (ja) 回路基板およびこれを用いた電気的接続装置
JP5258497B2 (ja) プリント配線板のはんだ接合検査用配線構造
JP2025014061A (ja) 配線回路基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20920114

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20920114

Country of ref document: EP

Kind code of ref document: A1