WO2021129093A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2021129093A1
WO2021129093A1 PCT/CN2020/122800 CN2020122800W WO2021129093A1 WO 2021129093 A1 WO2021129093 A1 WO 2021129093A1 CN 2020122800 W CN2020122800 W CN 2020122800W WO 2021129093 A1 WO2021129093 A1 WO 2021129093A1
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Prior art keywords
layer
display device
display
encapsulation
touch
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PCT/CN2020/122800
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English (en)
French (fr)
Inventor
张秀玉
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云谷（固安）科技有限公司
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Publication date
Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Priority to KR1020227005155A priority Critical patent/KR20220027261A/ko
Priority to JP2022511397A priority patent/JP7292499B2/ja
Priority to EP20905236.4A priority patent/EP4009310A4/en
Publication of WO2021129093A1 publication Critical patent/WO2021129093A1/zh
Priority to US17/545,462 priority patent/US11825681B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • This application relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device.
  • the touch screen mainly uses an external touch module, but the external touch module not only increases the thickness and process difficulty of the display, but also integrates the touch chip and the display driver chip on one chip, although it can reduce the entire display
  • the thickness of the screen and the difficulty of the process but it will bring about the problem of the display screen's relatively wide frame, which cannot adapt to the development of narrow frame or even full-screen technology. Therefore, the touch display screen in the prior art cannot achieve small thickness, simple process, narrow frame or even full screen at the same time.
  • the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, which solve the technical problems in the prior art that the touch display screen cannot achieve small thickness, simple process, narrow frame or even full screen at the same time.
  • an embodiment of the present application provides a display panel, including: a substrate; a display device layer provided on one side of the substrate; and a package provided on the side of the display device layer away from the substrate And a touch layer disposed on the side of the encapsulation layer away from the display device layer, the display device layer and the touch layer are bonded by a bonding structure; a through hole is provided in the encapsulation layer , The bonding structure is located in the through hole.
  • the touch layer includes: a first insulating layer disposed on a side of the packaging layer away from the display device layer; and a first insulating layer disposed on the first insulating layer away from the display device layer.
  • the bonding structure includes: a first pin provided on the side of the first metal layer close to the display device layer; and a second pin provided on the side of the display device layer away from the substrate Pin.
  • the display panel further includes: a cover layer disposed on a side of the touch layer away from the encapsulation layer.
  • the encapsulation layer includes: a first encapsulation layer and a second encapsulation layer arranged on a side of the display device layer away from the substrate and arranged in a direction along the middle of the substrate toward the edge of the substrate. Two encapsulation layers; wherein the second encapsulation layer is arranged around the touch layer.
  • the second encapsulation layer is in contact with the surface of the cover layer close to the display screen body.
  • the through hole is located in the first packaging layer.
  • the first surface of the through hole is in contact with the first encapsulation layer
  • the second surface of the through hole is in contact with the second encapsulation layer
  • the first surface is in contact with the The second side is the opposite side.
  • an embodiment of the present application provides a display device, including: a display panel; a chip integrated with a display driver chip and a touch control chip; and a circuit board, one end of the circuit board is connected to the display Panel bonding, the chip is bonded to the circuit board; the structure of the display panel adopts the structure of the display panel described above.
  • an embodiment of the present application provides a method for manufacturing a display panel, including: preparing or preparing a substrate; forming a display device layer on one side of the substrate; Depositing encapsulation glue on one side of the substrate, and there is a gap between two adjacent encapsulation glues; preparing or preparing a touch layer; aligning and bonding the touch layer and the display device layer to form a bonding structure, so The bonding structure is located in the gap; and the packaging glue is cured to form an packaging layer.
  • the aligning and bonding the touch layer and the display device layer includes: aligning and bonding the touch layer and the display device layer by ultrasonic waves.
  • the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer and the display screen body is overlapped with the packaging area of the display screen body, which can reduce the number of display panels.
  • the thickness of the display also greatly reduces the width of the frame of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a display panel provided by another embodiment of this application.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the application.
  • FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the application.
  • the touch screen cannot simultaneously achieve the technical problems of small thickness, simple process, narrow bezel or even full screen.
  • the touch screen mainly uses an external touch module, but the external touch module not only increases the thickness and process difficulty of the display, so the touch chip and the display driver chip are integrated on one chip, although it can reduce the entire display The thickness of the screen and the difficulty of the process, but will bring about the problem of relatively wide frame of the display screen.
  • the present application provides a display panel.
  • the touch control chip and the display driving chip are integrated on one chip, and the contact position of the touch layer and the display screen body is overlapped with the packaging area of the display screen body, greatly Reduce the frame width of the display body.
  • a display panel provided by the present application includes a substrate; a display device layer provided on one side of the substrate; an encapsulation layer provided on a side of the display device layer away from the substrate; and
  • the touch layer disposed on the side of the encapsulation layer away from the display device layer, the display device layer and the touch layer are bonded by a bonding structure; wherein a through hole is provided in the encapsulation layer, The bonding structure is located in the through hole.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • the display panel includes a substrate 1, a display device layer disposed on the side of the substrate 1, an encapsulation layer 3 disposed on the side of the display device layer 2 away from the substrate 1, and an encapsulation layer 3 disposed away from the display device layer.
  • the display device layer 2 and the touch control layer 4 are bonded through the bonding structure 5.
  • a through hole 31 is provided in the packaging layer, and the bonding structure 5 is located in the through hole 31.
  • the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer 4 with the display body is overlapped with the packaging area of the display body, which can reduce the display
  • the thickness of the panel also greatly reduces the frame width of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
  • the bonding structure 5 is arranged in the through hole of the packaging layer, and there is no need to reserve bonding space at the edge of the display screen body, thereby reducing the width of the display screen body frame.
  • the display device layer 2 includes a multilayer structure of an anode layer, a light-emitting layer, and a cathode layer that are sequentially stacked along the display light-emitting direction.
  • the light-emitting layer includes a plurality of sub-pixels for displaying light emission, and two adjacent sub-pixels are separated from each other by a pixel interval area (a pixel interval area, that is, a defining layer of a pixel).
  • the display device layer 2 is divided into a display area and a non-display area surrounding the display area, and all sub-pixels are located in the display area. Since the encapsulation area is an area that needs to encapsulate all the display area of the display body.
  • the contact position of the touch layer 4 and the display screen body coincides with the packaging area of the display screen body, indicating that the projection of the touch layer 4 on the substrate 1 covers the display area.
  • the substrate 1, the touch layer 4, and the encapsulation layer 3 cooperate with each other, so that the display area of the display device layer 2 is completely sealed to prevent water and oxygen from invading the sub-pixels. Since the touch layer 4 not only plays a touch function, but also cooperates with the encapsulation layer 3 to act as a part of the encapsulation structure, blocking water and oxygen from entering the display area from the cover plate, which is similar to the encapsulation structure and touch control in the display panel in the prior art. Compared with the structure, the thickness is reduced. Thus, a small thickness and a narrow bezel can be achieved at the same time.
  • each sub-pixel may be, for example, a hole injection layer (HIL), a hole transport layer (HTL), an organic material light emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) that are sequentially stacked. Active electrons in the cathode layer and holes generated in the anode layer are recombined in the light-emitting layer to excite the organic light-emitting material in the organic material light-emitting layer to emit light.
  • HIL hole injection layer
  • HTL hole transport layer
  • EML organic material light emitting layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the encapsulation layer 3 includes a first encapsulation layer 32 and a second encapsulation layer 33 that are sequentially arranged along the direction in which the middle of the substrate points to the edge of the substrate.
  • the first packaging layer 32 is arranged on the surface of the display device layer 2 away from the substrate 1.
  • the second encapsulation layer 33 is also disposed on the surface of the display device layer 2 away from the substrate 1, and the second encapsulation layer 33 is disposed around the touch layer 4, wherein the through holes 31 are disposed in the first encapsulation layer 32, and the structure is bonded. 5 is provided in the through hole 31.
  • the encapsulation layer 3 in the embodiment of the present application includes a second encapsulation layer 33, and the second encapsulation layer 33 is disposed around the touch layer 4.
  • the second encapsulation layer 33 arranged around the touch layer 4 can prevent water and oxygen in the external environment from invading into the touch layer 4, reduce the probability of the electrodes in the touch layer 4 being corroded by water and oxygen, and reduce the touch layer 4 The probability of damage to the electrodes in the battery improves the life of the display panel. For the display panel in FIG.
  • the first encapsulation layer 32 is in contact with the display device layer 2 and the touch layer 4 at the same time, the first encapsulation layer 31 is provided with a through hole, and the through hole 31 is provided with a bonding structure 5, and a bonding structure 5
  • the display device layer 2 and the touch control layer 4 are electrically connected.
  • the second encapsulation layer is in contact with the sides of the display device layer 2, the cover 6 and the touch layer 4.
  • the touch layer 4 blocks the water and oxygen entering the display area from the direction of the cover 6, and the encapsulation layer 3 and the non-display area block the access from the side
  • the water and oxygen in the display area make the water and oxygen around the display area unable to invade.
  • the encapsulation layer 3 is arranged around the touch layer 4, which reduces the probability of the electrodes in the touch layer 4 being corroded by water and oxygen.
  • the touch control layer 4 includes: a first insulating layer 41 disposed on the side of the first encapsulation layer 32 away from the display device layer 2; and a first insulating layer 41 disposed on the side of the first insulating layer 41 away from the display device layer 2.
  • the bonding structure 5 includes: a first pin 51 arranged on the side of the first metal layer 42 close to the display device layer 2; and a second pin 52 arranged on the side of the display device layer 2 away from the substrate 1.
  • the electrical connection between the first pin 51 and the second pin 52 realizes the electrical connection between the touch layer 4 and the display device layer 2, and realizes display control and touch control through the electrical connection between the display device layer 2 and the chip. .
  • first pin 51 and the first metal layer 42 may be integrally prepared.
  • One-piece molding preparation saves process steps and improves electrical connection reliability.
  • the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, which can reduce the display panel
  • the thickness of the display also greatly reduces the width of the frame of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
  • the through hole 31 is provided in the first encapsulation layer 32. And the first side of the through hole 31 is in contact with the first encapsulation layer 32, the second side of the through hole 31 is in contact with the second encapsulation layer 33, the first side and the second side are opposite sides, and the bonding structure 5 is arranged in the through hole 31 Inside. That is, there is a gap between the first package 32 and the second package layer 33, and the gap serves as the through hole 31.
  • the bonding structure 5 is disposed between the first encapsulation layer 32 and the second encapsulation layer 33.
  • the first encapsulation layer 32 and the second encapsulation layer 33 are directly deposited separately, and there is a gap between the first encapsulation layer 32 and the second encapsulation layer 33, which reduces the process complexity .
  • the display panel further includes: a cover layer 6 disposed on the side of the touch layer 4 away from the encapsulation layer 3.
  • the packaging layer 3 includes a first packaging layer 32 and a second packaging layer 33.
  • the first packaging layer 32 is arranged on the surface of the display device layer 2 away from the substrate 1.
  • the second encapsulation layer 33 is also disposed on the surface of the display device layer 2 away from the substrate 1, and the second encapsulation layer 33 is disposed around the touch layer 4, and the second encapsulation layer 33 and the cover layer 6 are close to the touch layer 4
  • the second encapsulation layer 33 of the encapsulation layer in the embodiment of the present application is in contact with a surface of the cover layer 6 close to the touch layer 4, which can further protect the water and oxygen in the external environment from intruding into the touch layer 4. The probability of damage to the electrodes in the touch layer 4 is reduced.
  • the difference between the thickness of the second encapsulation layer 33 and the thickness of the first encapsulation layer 32 is greater than or equal to the thickness of the touch layer 4.
  • FIG. 3 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • the display device includes a display panel; a chip 8 integrated with a display driver chip and a touch chip; and a circuit board 7 , One end of the circuit board 7 is bonded to the display panel, and the chip 8 is bonded to the circuit board 7.
  • the structure of the display panel adopts the structure of the display panel described above.
  • the driving display chip and the touch control chip are integrated on the same chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, thereby reducing the entire display
  • the thickness of the device also greatly reduces the frame width of the display screen.
  • FIG. 4 shows a manufacturing method of the display panel provided by an embodiment of the application. As shown in FIG. 4, the manufacturing method of the display panel includes:
  • Step S101 preparing or preparing a substrate
  • Step S102 forming a display device layer on one side of the substrate
  • Step S103 deposit packaging glue on the side of the display device layer away from the substrate, and there is a gap between two adjacent packaging glues;
  • Step S104 preparing or preparing a touch layer
  • Step S105 aligning and bonding the touch layer and the display device layer to form a bonding structure, and the bonding structure is located in the gap;
  • Step S106 curing the encapsulation glue to form an encapsulation layer.
  • the touch chip and the actual driving chip are integrated on one chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, which reduces the entire display panel.
  • the thickness of the display also greatly reduces the frame width of the display body.
  • the alignment and bonding of the touch layer and the display device layer includes: using ultrasonic waves to align and bond the touch layer and the display device layer.
  • the embodiment of the application adopts the ultrasonic technology to award the touch layer and the display device layer to bond, which avoids the impact on the packaging layer when other bonding technologies are used.

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Abstract

一种显示面板及其制备方法、显示装置，解决了现有技术中触控显示屏无法同时实现厚度小、工艺简单、窄边框甚至全屏的技术问题。一种显示面板，包括基板(1)，设置在基板(1)一侧的显示器件层(2)，设置在显示器件层(2)远离基板(1)一侧的封装层(3)以及设置在封装层(3)远离显示器件层(2)一侧的触控层(4)，显示器件层(2)与触控层(4)通过邦定结构(5)邦定，在封装层(3)设置有通孔(31)，邦定结构(5)位于通孔(31)内。显示面板通过将触控芯片与显示驱动芯片集成在一个芯片上，且将触控层(4)与显示屏体接触的位置与显示屏体的封装区域重合，既可以减少显示面板的厚度，也大大减少了显示屏体的边框宽度，即可以同时实现厚度小且边框窄。

Description

显示面板及其制备方法、显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板及其制备方法、显示装置。
发明背景
随着手机向超薄、大屏发展，以及平板和超极本对触摸屏的需求，触摸屏技术正在发生快速演变。触控屏主要采用外挂式触控模组，但是外挂式触控模组不仅增加了显示屏的厚度和工艺难度，而将触控芯片以及显示驱动芯片集成在一个芯片上，虽然能够降低整个显示屏的厚度以及工艺难度，但是会带来显示屏的边框比较宽的问题，无法适应窄边框甚至全屏技术的发展。因此现有技术中的触控显示屏无法同时实现厚度小、工艺简单、窄边框甚至全屏。
发明内容
有鉴于此，本申请实施例提供了一种显示面板及其制备方法、显示装置，解决了现有技术中触控显示屏无法同时实现厚度小、工艺简单、窄边框甚至全屏的技术问题。
为使本申请的目的、技术手段和优点更加清楚明白，以下结合附图对本申请作进一步详细说明。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
根据本申请的一个方面，本申请一实施例提供了一种显示面板，包括：基板；设置在所述基板一侧的显示器件层；设置在所述显示器件层远离所述基板一侧的封装层；以及设置在所述封装层远离所述显示器件层一侧的触控层，所述显示器件层与所述触控层通过邦定结构实现邦定；在所述封装层设 置有通孔，所述邦定结构位于所述通孔内。
在本申请一实施例中，所述触控层包括：设置在所述封装层远离所述显示器件层一侧的第一绝缘层；设置在所述第一绝缘层远离所述显示器件层一侧的第一金属层；设置在所述第一金属层远离所述第一绝缘层一侧的第二绝缘层；以及设置在所述第二绝缘层远离所述第一金属层一侧的第二金属层；其中，所述邦定结构包括：设置在所述第一金属层靠近所述显示器件层一侧的第一引脚；以及设置在显示器件层远离所述基板一侧的第二引脚。
在本申请一实施例中，所述显示面板进一步包括：设置在所述触控层远离所述封装层一侧的盖板层。
在本申请一实施例中，所述封装层包括：设置在所述显示器件层远离所述基板的一侧且沿所述基板中部指向所述基板边缘的方向依次排列的第一封装层以及第二封装层；其中所述第二封装层设置在所述触控层的周围。
在本申请一实施例中，所述第二封装层与所述盖板层靠近所述显示屏体的表面接触。
在本申请一实施例中，所述通孔位于所述第一封装层中。
在本申请一实施例中，所述通孔的第一面与所述第一封装层接触，所述通孔的第二面与所述第二封装层接触，所述第一面与所述第二面为对立面。
作为本申请的第二方面，本申请实施例提供了一种显示装置，包括：显示面板；芯片，集成有显示驱动芯片以及触控芯片；以及线路板，所述线路板的一端与所述显示面板邦定，所述芯片邦定于所述线路板；所述显示面板的结构采用如前述所述的显示面板的结构。
作为本申请的第三方面，本申请实施例提供了一种显示面板的制备方法，包括：准备或者制备一基板；在所述基板的一侧形成显示器件层；在所述显示器件层远离所述基板一侧沉积封装胶，相邻两处封装胶之间存在间隙；准备或者制备一触控层；将所述触控层与所述显示器件层对位邦定，形成邦定结构，所述邦定结构位于所述间隙内；以及对所述封装胶进行固化形成封装层。
在本申请一实施例中，所述将所述触控层与所述显示器件层对位邦定包括：采用超声波将所述触控层与所述显示器件层对位邦定。
本申请实施例提供的显示面板，通过将触控芯片与显示驱动芯片集成在一个芯片上，且将触控层与显示屏体接触的位置与显示屏体的封装区域重合，既可以减少显示面板的厚度，也大大减少了显示屏体的边框宽度，即可以同时实现厚度小且边框窄。
附图简要说明
图1所示为本申请一实施例提供的一种显示面板的结构示意图；
图2所示为本申请另一实施例提供的一种显示面板的结构示意图；
图3所示为本申请另一实施例提供的一种显示面板的结构示意图；
图4所示为本申请一实施例提供的显示面板的制备方法的流程示意图。
实施本申请的方式
触控显示屏无法同时实现厚度小、工艺简单、窄边框甚至全屏的技术问题。触控屏主要采用外挂式触控模组，但是外挂式触控模组不仅增加了显示屏的厚度和工艺难度，因此将触控芯片以及显示驱动芯片集成在一个芯片上，虽然能够降低整个显示屏的厚度以及工艺难度，但是会带来显示屏的边框比较宽的问题。
基于上述理由，本申请提供了一种显示面板，通过将触控芯片与显示驱动芯片集成在一个芯片上，且将触控层与显示屏体接触的位置与显示屏体的封装区域重合，大大减少了显示屏体的边框宽度。
具体的，本申请提供的一种显示面板，包括基板；设置在所述基板一侧的显示器件层；设置在所述显示器件层远离所述基板一侧的封装层；以及
设置在所述封装层远离所述显示器件层一侧的触控层，所述显示器件层与所述触控层通过邦定结构实现邦定；其中，在所述封装层中设置通孔，所述邦定结构位于所述通孔内。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
图1所示为本申请一实施例提供的一种显示面板的结构示意图。如图1所示，该显示面板包括基板1、设置在基板1一侧的显示器件层2、设置在显示器件层2远离基板1一侧的封装层3、设置在封装层3远离显示器件层2一侧的触控层4。显示器件层2与触控层4通过邦定结构5实现邦定。在封装层中设置通孔31，邦定结构5位于通孔内31。本申请实施例提供的显示面板，通过将触控芯片与显示驱动芯片集成在一个芯片上，且将触控层4与显示屏体接触的位置与显示屏体的封装区域重合，既可以减少显示面板的厚度，也大大减少了显示屏体的边框宽度，即可以同时实现厚度小且边框窄。
通过通孔31中的邦定结构5，实现触控层4与显示器件层2的电连接，显示器件层2通过线路板与集成芯片连接，实现显示控制与触控控制。将邦定结构5设置在封装层的通孔中，无需在显示屏体的边缘处预留邦定空间，从而减少显示屏体边框宽度。
显示器件层2包括沿显示发光方向上依次层叠设置的阳极层、发光层以及阴极层的多层结构。发光层包括多个用于显示发光的子像素，相邻两个子像素被像素间隔区域(像素间隔区域即像素的定义层)彼此隔开。显示器件层2被划分为显示区域以及围绕在显示区域周围的非显示区域，且全部子像素都位于显示区域内。由于封装区域是一个需要将显示屏体的显示区域全部封装起来的区域。触控层4与显示屏体接触的位置与显示屏体的封装区域重合，表明触控层4在基板1上的投影覆盖显示区域。基板1、触控层4与封装层3互相配合，使得显示器件层2的显示区域被完全密封，阻挡水氧入侵子像素。由于触控层4既起到了触控作用，还与封装层3配合，充当封装结构的一部分，阻挡水氧从盖板进入显示区域，与现有技术中的显示面板中的封装结构和触控结构相比，厚度减小。从而，同时实现厚度小且边框窄。
每一个子像素具体结构可以是例如依次叠加的空穴注入层(HIL)、空穴传输层(HTL)、有机材料发光层(EML)、电子传输层(ETL)以及电子注入层(EIL)。阴极层的活动电子与阳极层产生的空穴在发光层内复合，激发有机材料发光层中的有机发光材料发光。
在本申请一实施例中，如图2所示，封装层3包括沿基板的中部指向基板的边缘的方向依次排列的第一封装层32以及第二封装层33。其中第一封装层32设置在显示器件层2远离基板1的表面上。第二封装层33也是设置在显示器件层2远离基板1的表面上，且第二封装层33设置在触控层4的周围，其中通孔31设置在第一封装层32中，邦定结构5设置在通孔31中。本申请实施例中的封装层3包括第二封装层33，且第二封装层33设置在触控层4的周围。设置在触控层4周围的第二封装层33能够防止外面环境中的水氧侵入触控层4中，降低了触控层4中的电极被水氧侵蚀的概率，降低了触控层4中的电极被损害的概率，提高了显示面板的寿命。对于图2中的显示面板，第一封装层32与显示器件层2和触控层4同时接触，第一封装层31中设置通孔，通孔31中设置邦定结构5，邦定结构5电连接显示器件层2和触控层4。第二封装层与显示器件层2、盖板6以及触控层4的侧面接触，触控层4阻挡从盖板6方向进入显示区域的水氧，封装层3与非显示区域阻挡从侧面进入显示区域的水氧，使得显示区域周围的水氧无法入侵。同时，封装层3设置在触控层4的周围，降低了触控层4中的电极被水氧侵蚀的概率。
如图2所示，触控层4包括：设置在第一封装层32远离显示器件层2一侧的第一绝缘层41；设置在第一绝缘层41远离显示器件层2一侧的第一金属层42；设置在第一金属层42远离第一绝缘层41一侧的第二绝缘层43；以及设置在第二绝缘层43远离第一金属层42一侧的第二金属层44。邦定结构5包括：设置在第一金属层42靠近显示器件层2一侧的第一引脚51；以及设置在显示器件层2远离基板1一侧的第二引脚52。第一引脚51与第二引脚52之间的电连接，实现触控层4与显示器件层2的电连接，在通过显示器件层2与芯片的电连接，实现显示控制与触控控制。
在一个进一步实施例中，第一引脚51与第一金属层42可以一体制备。一体成型制备，节省工序，且提高电连接可靠性。
本申请实施例提供的显示面板，通过将触控芯片与显示驱动芯片集成在一个芯片上，且将触控层与显示屏体接触的位置与显示屏体的封装区域重合，既可以减少显示面板的厚度，也大大减少了显示屏体的边框宽度，即可以同时实现厚度小且边框窄。
在本申请一进一步的实施例中，通孔31设置在第一封装层32中。且通孔31的第一面与第一封装层32接触，通孔31的第二面与第二封装层33接触，第一面与第二面为对立面，邦定结构5设置在通孔31内。即，第一封装32与第二封装层33之间存在间隙，而该间隙即作为通孔31。邦定结构5设置在第一封装层32与第二封装层33之间。因此，在制备显示面板的过程中，直接分别沉积第一封装层32以及第二封装层33，并使得第一封装层32与第二封装层33之间有间隙即可，降低了工艺复杂度。
在本申请一实施例中，如图2所示，显示面板进一步包括：设置在触控层4远离封装层3一侧的盖板层6。
在本申请一进一步的实施例中，封装层3包括第一封装层32以及第二封装层33。其中第一封装层32设置在显示器件层2远离基板1的表面上。第二封装层33也是设置在显示器件层2远离基板1的表面上，且第二封装层33设置在触控层4的周围，且第二封装层33与盖板层6靠近触控层4的一表面接触，本申请实施例中的封装层第二封装层33与盖板层6靠近触控层4的一表面接触，更加能够保护外面环境中的水氧侵入触控层4中，因此降低了触控层4中的电极被损害的概率。
在一个实施例中，如图2所示，第二封装层33的厚度与第一封装层32的厚度之差大于或等于触控层4的厚度。通过厚度差的设置，使第一封装层32、第二封装层33以及触控层4之间紧密结合，减少缝隙，降低水氧入侵显示区域的概率。
图3所示为本申请一实施例提供的一种显示装置的结构示意图，如图3 所示，该显示装置包括显示面板；芯片8，集成有显示驱动芯片以及触控芯片；以及线路板7，线路板7的一端与显示面板邦定，芯片8邦定于线路板7。其中，显示面板的结构采用如前述所述的显示面板的结构。本申请实施例提供的显示装置，通过将驱动显示芯片与触控芯片集成在同一个芯片上，并将触控层与显示屏体接触的位置与显示屏体的封装区域重合，降低了整个显示装置的厚度的同时，也大大减少了显示屏体的边框宽度。
图4所示为本申请一实施例提供的显示面板的制备方法，如图4所示，该显示面板的制备方法包括：
步骤S101：准备或者制备一基板；
步骤S102：在基板的一侧形成显示器件层；
步骤S103：在显示器件层远离基板一侧沉积封装胶，相邻两处封装胶之间存在间隙；
步骤S104：准备或者制备一触控层；
步骤S105：将触控层与显示器件层对位邦定，形成邦定结构，邦定结构位于间隙内；以及
步骤S106：对封装胶进行固化形成封装层。
通过本申请实施例制备得到的显示面板，触控芯片与现实驱动芯片集成在一个芯片上，且将触控层与显示屏体接触的位置与显示屏体的封装区域重合，降低了整个显示面板的厚度的同时，还大大减少了显示屏体的边框宽度。
在本申请一实施例中，步骤S105中，触控层与显示器件层对位邦定包括：采用超声波将触控层与所述显示器件层对位邦定。本申请实施例采用超声波技术奖触控层与显示器件层邦定，避免了采用其他邦定技术时对封装层的影响。
以上所述仅为本申请创造的较佳实施例而已，并不用以限制本申请创造，凡在本申请创造的精神和原则之内，所作的任何修改、等同替换等，均应包含在本申请创造的保护范围之内。

Claims (11)

  1. 一种显示面板，其中，包括：
    基板；
    设置在所述基板一侧的显示器件层；
    设置在所述显示器件层远离所述基板一侧的封装层；以及
    设置在所述封装层远离所述显示器件层一侧的触控层，所述显示器件层与所述触控层通过邦定结构实现邦定；
    所述封装层设置有通孔，所述邦定结构位于所述通孔内。
  2. 根据权利要求1所述的显示面板，其中，所述触控层包括：
    设置在所述封装层远离所述显示器件层一侧的第一绝缘层；
    设置在所述第一绝缘层远离所述显示器件层一侧的第一金属层；
    设置在所述第一金属层远离所述第一绝缘层一侧的第二绝缘层；以及
    设置在所述第二绝缘层远离所述第一金属层一侧的第二金属层；
    其中，所述邦定结构包括：
    设置在所述第一金属层靠近所述显示器件层一侧的第一引脚；以及
    设置在显示器件层远离所述基板一侧的第二引脚。
  3. 根据权利要求1所述的显示面板，其中，进一步包括：
    设置在所述触控层远离所述封装层一侧的盖板层。
  4. 根据权利要求3所述的显示面板，其中，所述封装层包括：
    设置在所述显示器件层远离所述基板的一侧且沿所述基板中部指向所述基板边缘的方向依次排列的第一封装层以及第二封装层；
    其中所述第二封装层设置在所述触控层的周围。
  5. 根据权利要求4所述的显示装置，其中，所述第二封装层与所述盖板层靠近所述显示屏体的表面接触。
  6. 根据权利要求4所述的显示装置，其中，所述通孔位于所述第一封装层中。
  7. 根据权利要求4所述的显示装置，其中，所述通孔的第一面与所述第一封装层接触，所述通孔的第二面与所述第二封装层接触，所述第一面与所述第二面为对立面。
  8. 根据权利要求7所述的显示装置，所述第二封装层的厚度与所述第一封装层的厚度之差大于或等于所述触控层的厚度。
  9. 一种显示装置，其中，包括：
    显示面板；
    芯片，集成有显示驱动芯片以及触控芯片；以及
    线路板，所述线路板的一端与所述显示面板邦定，所述芯片邦定于所述线路板；
    所述显示面板的结构采用如权利要求1-7中任一权利要求所述的显示面板的结构。
  10. 一种显示面板的制备方法，其中，包括：
    准备或者制备一基板；
    在所述基板的一侧形成显示器件层；
    在所述显示器件层远离所述基板一侧沉积封装胶，相邻两处封装胶之间存在间隙；
    准备或者制备一触控层；
    将所述触控层与所述显示器件层对位邦定，形成邦定结构，所述邦定结构位于所述间隙内；以及
    对所述封装胶进行固化形成封装层。
  11. 根据权利要求9所述的制备方法，其中，所述将所述触控层与所述显示器件层对位邦定包括：
    采用超声波将所述触控层与所述显示器件层对位邦定。
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