WO2021248434A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2021248434A1
WO2021248434A1 PCT/CN2020/095761 CN2020095761W WO2021248434A1 WO 2021248434 A1 WO2021248434 A1 WO 2021248434A1 CN 2020095761 W CN2020095761 W CN 2020095761W WO 2021248434 A1 WO2021248434 A1 WO 2021248434A1
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WIPO (PCT)
Prior art keywords
substrate
display panel
sub
layer
light
Prior art date
Application number
PCT/CN2020/095761
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English (en)
French (fr)
Inventor
高昕伟
张大成
刘烺
许晨
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202080000983.2A priority Critical patent/CN114270554B/zh
Priority to EP20940352.6A priority patent/EP4071841A4/en
Priority to US17/274,324 priority patent/US20220199939A1/en
Priority to PCT/CN2020/095761 priority patent/WO2021248434A1/zh
Publication of WO2021248434A1 publication Critical patent/WO2021248434A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • At least one embodiment of the present disclosure relates to a display panel, a manufacturing method thereof, and a display device.
  • Organic light-emitting diode (OLED) display technology has attracted more and more attention.
  • the organic materials included in many organic light-emitting diode devices are sensitive to moisture and oxygen, and are not resistant to high temperatures; in addition, the oxidation of the metal electrode of the organic light-emitting diode can also degrade the performance of the organic light-emitting diode. Therefore, it is important to isolate the organic light-emitting diode from the water and oxygen in the environment and to be able to dissipate the heat in order to prolong the life of the device.
  • the organic light-emitting diode device is usually sealed with a sealant and a packaging cover, and a desiccant can also be used to prevent water vapor from invading the organic light-emitting diode device.
  • An embodiment of the present disclosure provides a display panel, which includes: an array substrate, a packaging cover plate, and a frame sealant.
  • the array substrate includes a display area and a non-display area at least partially surrounding the display area, the display area includes a plurality of pixels distributed in an array, each of the pixels includes a plurality of sub-pixels, and each of the sub-pixels includes a light emitting device .
  • the packaging cover plate is arranged opposite to the array substrate, and includes a first substrate and a plurality of organic layers. A plurality of organic layers are located on a side of the first substrate close to the array substrate.
  • the frame sealant is located in the non-display area and between the array substrate and the packaging cover plate, and adheres the array substrate and the packaging cover plate; There is a spacing area between the organic layer closest to the frame sealant and the frame sealant in the direction to the frame sealant, and the spacing area connects the organic layer closest to the frame sealant with the The frame sealant is spaced apart, and the spaced area is located in the non-display area.
  • the plurality of organic layers include: a black matrix and a protective layer.
  • the black matrix is located on the side of the first substrate close to the array substrate, and defines a plurality of sub-color filter units, and the plurality of sub-color filter units correspond to the plurality of sub-pixels in a one-to-one manner and are configured to make
  • the light emitted by the light-emitting device of each sub-pixel transmits the corresponding sub-color filter unit;
  • the protective layer covers the first surface of the black matrix away from the first substrate and the plurality of sub-pixels
  • the color filter unit, wherein the organic layer closest to the sealant is the black matrix.
  • the plurality of organic layers include: a black matrix and a protective layer.
  • the black matrix is located on the side of the first substrate close to the array substrate, and defines a plurality of sub-color filter units, and the plurality of sub-color filter units correspond to the plurality of sub-pixels in a one-to-one manner and are configured to make
  • the light emitted by the light-emitting device of each sub-pixel transmits the corresponding sub-color filter unit;
  • the protective layer covers the first surface of the black matrix away from the first substrate and the black matrix On the side surface intersecting the first surface, the organic layer closest to the frame sealant is the protective layer.
  • the plurality of organic layers include: a black matrix, a protective layer, and a first spacer.
  • the black matrix is located on the side of the first substrate close to the array substrate, and defines a plurality of sub-color filter units, and the plurality of sub-color filter units correspond to the plurality of sub-pixels in a one-to-one manner and are configured to make
  • the light emitted by the light-emitting device of each sub-pixel transmits the corresponding sub-color filter unit;
  • the protective layer covers at least part of the black matrix and the plurality of sub-color filter units;
  • first spacer Located on the side of the first substrate close to the array substrate, and on the side of the black matrix and the protective layer close to the frame sealant, the organic compound closest to the frame sealant The layer is the first spacer.
  • the width of the spacer area in the direction from the protective layer to the sealant is greater than or equal to 10 ⁇ m.
  • the width of the frame sealant in the lateral direction is less than or equal to 2 mm, and the width of the spacer area is greater than or equal to 100 ⁇ m.
  • the protective layer is a flat layer
  • the surface of the flat layer away from the first substrate is a flat surface
  • the packaging cover plate further includes a light shielding layer that does not transmit light.
  • the light-shielding layer is located on the first substrate and covers at least a part of the spacer area.
  • the light shielding layer covers the entire space area.
  • the light-shielding layer is located on a side of the first substrate close to the array substrate, and the orthographic projection of the light-shielding layer on the first substrate is It does not overlap with the orthographic projection of the frame sealant on the first substrate.
  • the light-shielding layer is located on a side of the first substrate close to the array substrate, and the orthographic projection of the light-shielding layer on the first substrate is At least partially overlapping with the orthographic projection of the frame sealant on the first substrate.
  • the light shielding layer is located on a side of the first substrate away from the array substrate, and the orthographic projection of the light shielding layer on the first substrate At least partially overlapping with the orthographic projection of the frame sealant on the first substrate.
  • the material of the light shielding layer is a metal material.
  • the array substrate further includes a pixel defining layer.
  • the pixel defining layer defines the plurality of sub-pixels, wherein the orthographic projection of the black matrix on the first substrate is located within the orthographic projection of the pixel defining layer on the first substrate.
  • the array substrate further includes a second spacer.
  • the second spacer is located on the side of the pixel defining layer close to the black matrix, and there is a space between the second spacer and the protective layer, wherein the second spacer is on the first substrate.
  • the orthographic projection is in the orthographic projection of the pixel defining layer on the first substrate, and in the orthographic projection of the black matrix on the first substrate; the second spacer is perpendicular to the first substrate
  • the height in the direction of a substrate is smaller than the height of the first spacer in the direction perpendicular to the first substrate.
  • the display panel provided by at least one embodiment of the present disclosure further includes a filling material layer.
  • the filling material layer is filled between the array substrate and the encapsulation cover plate, and includes a first part located in the display area and a second part located in the frame area; the first part covers the light emitting device, so The second part fills the space area.
  • the filling material layer is an elastic layer
  • the elastic layer when the display panel is applied with pressure in a direction perpendicular to the first substrate, the elastic layer The thickness in the direction perpendicular to the first substrate decreases.
  • At least one embodiment of the present disclosure provides a display device, and the display device includes any display panel provided in the embodiments of the present disclosure.
  • At least one embodiment of the present disclosure further provides a method for manufacturing a display panel.
  • the manufacturing method includes: providing an array substrate, wherein the array substrate includes a display area and a non-display area surrounding at least part of the display area, wherein The display area includes a plurality of pixels distributed in an array, each of the pixels includes a plurality of sub-pixels, each of the sub-pixels includes a light-emitting device; a package cover is formed; a frame sealant is formed, wherein the frame sealant is located The non-display area; and aligning the array substrate and the packaging cover plate; forming the packaging cover plate includes: providing a first substrate; and on a side of the first substrate close to the array substrate Multiple organic layers are formed.
  • the frame sealing glue is located between the array substrate and the package cover plate and adheres the array substrate and the package cover plate. In the direction of the glue, there is a space area between the organic layer closest to the frame sealing glue and the frame sealing glue, and the space area separates the organic layer closest to the frame sealing glue from the frame sealing glue Open, the interval area is located in the non-display area.
  • FIG. 1 is a schematic plan view of a display panel provided by an embodiment of the present disclosure
  • Fig. 2 is a schematic cross-sectional view taken along the line A-A' in Fig. 1;
  • 3A is a schematic plan view of another display panel provided by an embodiment of the present disclosure.
  • Fig. 3B is a schematic cross-sectional view taken along the line B-B' in Fig. 3A;
  • FIG. 4A is a schematic plan view of still another display panel provided by an embodiment of the present disclosure.
  • Fig. 4B is a schematic cross-sectional view taken along the line C-C' in Fig. 4A;
  • 5A is a schematic plan view of still another display panel provided by an embodiment of the present disclosure.
  • Fig. 5B is a schematic cross-sectional view taken along the line D-D' in Fig. 5A;
  • FIG. 6 is a schematic cross-sectional view of still another display panel provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic cross-sectional view of still another display panel provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a display device provided by an embodiment of the present disclosure.
  • An embodiment of the present disclosure provides a display panel, which includes: an array substrate, a packaging cover plate, and a frame sealant.
  • the array substrate includes a display area and a non-display area at least partially surrounding the display area, the display area includes a plurality of pixels distributed in an array, each of the pixels includes a plurality of sub-pixels, and each of the sub-pixels includes a light emitting device .
  • the packaging cover plate is arranged opposite to the array substrate, and includes a first substrate and a plurality of organic layers. A plurality of organic layers are located on a side of the first substrate close to the array substrate.
  • the frame sealant is located in the non-display area and between the array substrate and the packaging cover plate, and adheres the array substrate and the packaging cover plate; There is a spacing area between the organic layer closest to the frame sealant and the frame sealant in the direction to the frame sealant, and the spacing area connects the organic layer closest to the frame sealant with the The frame sealant is spaced apart, and the spaced area is located in the non-display area.
  • the multiple organic layers such as color film and black matrix, etc., need to be provided on the packaging cover to obtain a higher color gamut and better color effects.
  • the organic layer has a weaker ability to block water and oxygen (for example, relative to the inorganic layer).
  • the frame sealant does not directly contact the organic layer closest to the frame sealant, the water and oxygen entering the display panel will not directly enter the organic layer after passing through the frame sealant and diffuse to the light-emitting device through the organic layer.
  • FIG. 1 is a schematic plan view of a display panel provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view taken along the line AA' in FIG. 1.
  • FIG. 2 may be the display shown in FIG. A schematic cross-sectional view of the panel.
  • FIG. 2 only shows one pixel in the display area.
  • the display panel 10 includes: an array substrate, an encapsulation cover plate, and a sealant 3; the array substrate includes a display area 101 and a non-display area 102 at least partially surrounding the display area 101, and the display area 101 It includes a plurality of pixels 23 distributed in an array, and each pixel 23 includes a plurality of sub-pixels 230.
  • Each sub-pixel 230 includes a light emitting device.
  • one pixel 23 includes a first sub-pixel, a second sub-pixel, and a third sub-pixel.
  • the first sub-pixel, the second sub-pixel, and the third sub-pixel include a first light-emitting device 231, a second light-emitting device 232, and a third light-emitting device 233, respectively.
  • the first light emitting device 231, the second light emitting device 232, and the third light emitting device 233 respectively emit light of different colors, for example, red light, green light, and blue light, respectively.
  • one pixel 23 includes three sub-pixels 230 as an example. In other embodiments, the number of sub-pixels of one pixel is not limited to three, which is not limited in the embodiment of the present disclosure.
  • the plane shape of the frame sealant 3 is a closed ring, so as to play a better bonding effect and block water and oxygen.
  • the light emitting device is a light emitting diode (LED) device, such as an organic light emitting diode (OLED) device.
  • the light emitting device includes a first electrode, a light emitting layer, and a second electrode stacked in a direction perpendicular to the second substrate 21.
  • the first electrode is an anode and the second electrode is a cathode.
  • an OLED device also includes a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer.
  • the packaging cover plate is arranged opposite to the array substrate.
  • the packaging cover plate includes a first substrate 11 and a plurality of organic layers 1.
  • the array substrate includes a second substrate 21 disposed opposite to the first substrate 11.
  • the multiple organic layers 1 are located on the side of the first substrate 11 close to the array substrate.
  • the frame sealant 3 is located in the non-display area 102 and between the array substrate and the packaging cover, and bonds the array substrate and the packaging cover.
  • the sealant 3 is located in the non-display area 102 and between the first substrate 11 and the second substrate 21 and adheres the first substrate 11 and the second substrate 21.
  • the plurality of organic layers include the black matrix 12 and the protective layer 13.
  • the black matrix 12 is located on the side of the first substrate 11 close to the array substrate, and defines a plurality of sub-color filter units 14, and the plurality of sub-color filter units 14 correspond to the plurality of sub-pixels 230 one-to-one and are configured to make each sub-pixel
  • the light emitted by the light emitting device 230 transmits the corresponding sub-color filter unit.
  • the protective layer 13 covers the first surface of the black matrix 12 away from the first substrate 11 and the plurality of sub-color filter units 14.
  • the organic layer closest to the frame sealant 3 is the black matrix 12.
  • the interval area 4 separates the black matrix 12 from the frame sealant 3, and the interval area 4 is located in the non-display area 102. Since the frame sealant 3 does not directly contact the black matrix 12, the water and oxygen entering the display panel 10 will not directly enter the black matrix 12 after passing through the frame sealant 3 and diffuse to the light-emitting device through the black matrix 12. It is buffered in the spacer area 4, for example, diffused or absorbed in the spacer area 4 to other positions except the position of the organic layer 1. At the same time, it also increases the propagation path of water and oxygen to the light-emitting device, so as to better prevent the increase Outside water and oxygen enter the display area. Especially for large-size display panels, the effect is more prominent. The size of the large-sized panel is, for example, larger than 48 inches.
  • one filter unit includes a plurality of sub-color filter units 14, such as a red filter unit, a green filter unit, and a red filter unit corresponding to the first light emitting device 231, the second light emitting device 232, and the third light emitting device 233, respectively.
  • the red filter unit, the green filter unit and the blue filter unit respectively include a red filter layer, a green filter layer and a blue filter layer.
  • the thickness of the red filter layer, the green filter layer and the blue filter layer in the direction perpendicular to the first substrate 11 are all 0.1 ⁇ m to 5 ⁇ m, and the red filter layer, the green filter layer and the blue filter layer
  • the material of the optical layer is a resin material, for example, a photoresist material. The embodiment of the present disclosure does not limit the material of the color filter layer.
  • the black matrix 12 surrounds each color filter layer, that is, the black matrix 12 surrounds each red filter layer, each green filter layer, and each blue filter layer to prevent crosstalk between different color lights.
  • the black matrix 12 and the plurality of sub-color filter units 14 need to be arranged on the packaging cover plate to obtain a higher color gamut and better color effects.
  • the direction from the black matrix 12 to the frame sealant 3 is horizontal.
  • the width L of the space area 4 in the horizontal direction is proportional to the size of the non-display area 102 in the horizontal direction.
  • the width L of the interval area 4 can be designed according to the size of the non-display area 102 in the horizontal direction, that is, the width of the frame area, so that the width L of the interval area 4 adapts to the width of the frame area without being too large due to the interval area 4 Widen the border.
  • the width L of the spacer area 4 in the lateral direction is inversely proportional to the size of the frame sealant 3 in the lateral direction.
  • the larger the size of the frame sealant 3 in the lateral direction the smaller the width L of the interval area 4 is.
  • the larger the size of the frame sealant 3 in the lateral direction the stronger its ability to block water and oxygen, so that the width L of the spacer area 4 can be reduced, so that the frame sealant 3 and the spacer area 4 can reasonably allocate the width of the frame area.
  • the border will not be too large and widened due to the spacing area 4.
  • the width of the spacer area 4 in the direction from the protective layer 13 to the sealant 3 is greater than or equal to 10 ⁇ m, so as to achieve a better effect of blocking water and oxygen.
  • the width L of the space area 4 is greater than or equal to 100 ⁇ m.
  • width L of the spacer area 4 is not specifically limited.
  • the thickness of the black matrix 12 in the direction perpendicular to the first substrate 11 is 0.1 ⁇ m to 5 ⁇ m.
  • the material of the black matrix 12 is a photoresist material, so as to form a pattern of the black matrix 12 through a photolithography process.
  • the material of the black matrix 12 is a negative photoresist, of course, it can also be a positive photoresist.
  • the protective layer 13 is a flat layer, and the surface of the flat layer away from the first substrate 11 is a flat surface.
  • the filling material filled above the flat layer can be pressed more flatly, so that the packaging cover plate and the array substrate are pressed more tightly, and the sealing of the light emitting device is enhanced.
  • the thickness of the flat layer 13 in the direction perpendicular to the first substrate 11 is 0.1 ⁇ m to 5 ⁇ m.
  • the material of the flat layer is resin, or positive or negative photoresist.
  • the array substrate further includes a pixel defining layer 22.
  • the pixel defining layer 22 defines a plurality of sub-pixels 23.
  • the orthographic projection of the black matrix 12 on the first substrate 11 is located within the orthographic projection of the pixel defining layer 22 on the first substrate 11.
  • the size (opening) of a sub-color filter unit is greater than or equal to that corresponding to it.
  • the size of the sub-pixels (openings) to ensure the light output rate.
  • the display panel 10 further includes a filling material layer 5.
  • the filling material layer 5 is filled between the array substrate and the packaging cover, and includes a first part located in the display area 101 and a second part located in the frame area. The first part covers the light emitting device, and the second part fills the spacer area 4. In this way, the water and oxygen that enters the interior of the display panel 10 can diffuse into the filling material layer 5 in the interval area 4 and be absorbed by the filling material layer 5, thereby better preventing increased external water and oxygen from entering the display area.
  • the material of the filling material layer 5 includes resin, such as acrylic, epoxy and the like.
  • the filling material layer 5 further includes at least one of a desiccant, an oxygen absorber, and a heat dissipation material, so as to achieve a more effective effect of blocking water and oxygen and an effect of effective heat dissipation.
  • the desiccant can be quicklime (CaO) or a water-absorbing resin
  • the oxygen absorbent can be an inorganic oxygen absorbent, such as metal powder (including iron powder, copper powder, etc.), a mixture of sodium sulfide and iron powder, or two Sodium sulfite, etc., can also be organic oxygen absorbents, such as butylated hydroxymethyl anisole (BHA) or bishydroxymethyl ether (BHT), etc.
  • the heat dissipation material can be thermally conductive grease, such as zinc oxide, aluminum oxide or nitrogen Heat dissipation particles made of boron fluoride, etc.
  • the materials included in the filling material layer 5 are not limited to the above-mentioned three kinds of desiccant, oxygen absorber and heat dissipation material, and may also include other materials that are beneficial to protecting organic light-emitting devices, and the above three materials It is not only limited to the listed types, and the present disclosure does not limit this.
  • the filling material layer 5 may not include desiccant, oxygen absorbent and heat dissipation material. The embodiment of the present disclosure does not limit the filling material layer 5.
  • the filling material layer 5 is an elastic layer, and when the display panel 10 is applied with pressure in a direction perpendicular to the first substrate 11, the thickness of the elastic layer in the direction perpendicular to the first substrate 11 is reduced.
  • the Young's modulus of the filling material layer 5 may be about 0.1 MPa to 10 MPa. Young's modulus is a physical quantity that characterizes the ability of a material to resist tension or compression within the elastic limit.
  • the Young's modulus of the filler material layer 5 is less than about 0.1 MPa, a greater pressure may be required to deform the filler material layer 5, which greatly reduces the cushioning effect of the filler material layer 5; if the Young's modulus is greater than About 10 MPa, it means that the elastic layer 15 is too soft, which may reduce the durability of the display panel 10.
  • FIG. 3A is a schematic plan view of another display panel provided by an embodiment of the present disclosure
  • FIG. 3B is a schematic cross-sectional view taken along the line B-B' in FIG. 3A.
  • the embodiment shown in FIG. 3A and FIG. 3B has the following differences from the embodiment shown in FIG. 2.
  • the protective layer 13 covers the first surface of the black matrix 12 away from the first substrate 11 and the side surface of the black matrix 12 that intersects the first surface.
  • the organic layer closest to the frame sealant 3 is the protective layer 13.
  • the water and oxygen entering the inside of the display panel 10 will not directly enter the protective layer 13 after passing through the sealant 3 and then diffuse to the light-emitting device through the protective layer 13, but can be buffered in the spacer area 4, for example, in the spacer area 4 Except for the location of the organic layer 1, other locations are diffused or absorbed, and at the same time, the propagation path of water and oxygen to the light-emitting device is increased, so as to better prevent increased external water and oxygen from entering the display area.
  • the other features and corresponding technical effects of the embodiment shown in FIG. 3B and the embodiment shown in FIG. 2 are the same as those in FIG. 2, please refer to the previous description.
  • FIG. 4A is a schematic plan view of another display panel provided by an embodiment of the present disclosure
  • FIG. 4B is a schematic cross-sectional view taken along the line C-C' in FIG. 4A.
  • the embodiment shown in FIG. 4A and FIG. 4B and the embodiment shown in FIG. 2 have the following differences.
  • the plurality of organic layers in addition to the black matrix 12 and the protective layer 13, also include first spacers 71.
  • the first spacer 71 is located on the side of the first substrate 11 that is close to the array substrate, and is located on the side of the black matrix 12 and the protective layer 13 that is close to the frame sealant 3.
  • the closest to the frame seal The organic layer of the glue 3 is the first spacer 71. Therefore, the water and oxygen entering the inside of the display panel 10 will not directly enter the first spacer 71 after passing through the frame sealant 3 and then diffuse to the light-emitting device through the first spacer 71, but can be buffered in the spacer area 4.
  • the spacer area 4 diffuses or is absorbed to other positions except the position where the organic layer 1 is located, and at the same time, the propagation path of water and oxygen to the light-emitting device is increased, so as to better prevent the increase of external water and oxygen from entering the display area.
  • an end of the first spacer 71 away from the second substrate 21 is in contact with the first substrate 11, and an end of the first spacer 71 away from the first substrate 11 is spaced from the second substrate 21.
  • the first spacer 71 is supported between the first substrate 11 and the second substrate 21 to maintain a stable distance between the first substrate 11 and the second substrate 21. At the same time, it can be lowered
  • the barrier water and oxygen in the direction perpendicular to the first substrate 11 further enter the display area inside the first spacer 71.
  • the display panel 10 has better performance. The effect of preventing water and oxygen from entering the display area.
  • the end of the first spacer 71 away from the first substrate 11 may be in contact with the second substrate 21.
  • the planar shape of the first spacer 71 is a closed ring, so as to achieve a better support effect and a water and oxygen barrier effect at the edge of the entire display area.
  • the first spacer 71 may also include a plurality of pillars spaced apart from each other.
  • the display panel 10 further includes a second spacer 72.
  • the second spacer 72 is located on the side of the pixel defining layer 22 that is close to the black matrix 12, and is spaced from the protective layer 13; the orthographic projection of the second spacer 72 on the first substrate 11 is located on the pixel defining layer 22 is in the orthographic projection on the first substrate 11 and in the orthographic projection of the black matrix 12 on the first substrate 11.
  • the second spacer 72 can maintain a relatively stable distance between the first substrate 11 and the second substrate 21; at the same time, the second spacer 72 will not affect the display panel 10 Opening rate.
  • the height of the second spacer 72 in the direction perpendicular to the first substrate 11 is smaller than the height of the first spacer 71 in the direction perpendicular to the first substrate 11.
  • the material of the second spacer and the material of the first spacer are resin; or positive or negative photoresist, so that the second spacer and the first spacer can be formed by patterning by photolithography. Simplify the photolithography process during the patterning process.
  • FIG. 5A is a schematic plan view of still another display panel provided by an embodiment of the present disclosure
  • FIG. 5B is a schematic cross-sectional view taken along the line D-D' in FIG. 5A.
  • the package cover plate further includes a light-shielding layer 6 that does not transmit light.
  • the opaque light-shielding layer 6 is located on the first substrate 11 and covers at least a part of the spacer area 4 to block the light leakage of the display panel in the spacer area 4.
  • the light-shielding layer 6 can further block water and oxygen.
  • the light-shielding layer covers the entire interval area 4 to better play the role of light-shielding and blocking water and oxygen.
  • the plane shape of the light-shielding layer 6 is a closed ring, so as to achieve a better light-shielding effect and water and oxygen blocking effect at the edge of the entire display area.
  • the material of the light shielding layer 6 is a metal material.
  • the metal material is, for example, metal or alloy, such as molybdenum, copper, aluminum, chromium, nickel, or their alloys.
  • the above metal materials are only exemplary, and are not limited to the above-listed types.
  • Metal materials have a stronger ability to block water and oxygen, for example, than organic opaque materials, which have a stronger ability to block water and oxygen, which is conducive to obtaining a better effect of blocking water and oxygen.
  • the material of the light-shielding layer 6 may also be an organic material, such as light-shielding tape.
  • the light-shielding layer 6 is located on the side of the first substrate 11 close to the array substrate, and the orthographic projection of the light-shielding layer 6 on the first substrate 11 and the sealant 3 on the first substrate 11 The orthographic projections do not overlap.
  • the frame sealant 3 directly contacts the first substrate 11 and has stronger adhesion to the first substrate 11 and the second substrate 21, and prevents the light shielding layer 6 from overlapping the frame sealant 3 and reduces the frame sealant. 3. Adhesion to the first substrate 11 and the second substrate 21.
  • the first side surface of the light-shielding layer 6, that is, the surface of the light-shielding layer 6 close to the frame sealant 3, and the first side surface of the frame sealant 3, that is, the surface close to the light-shielding layer 6, contact or exist
  • a certain gap is used to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • the second side surface of the light-shielding layer 6 opposite to the first side surface that is, the surface of the light-shielding layer 6 away from the frame sealant 3, and the first side surface of the protective layer 13, that is, close to the frame seal.
  • the surface of the glue 3 contacts or has a certain gap to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • FIG. 6 is a schematic cross-sectional view of still another display panel provided by an embodiment of the present disclosure.
  • the embodiment shown in FIG. 6 has the following differences from the embodiment shown in FIG. 5B.
  • the orthographic projection of the light-shielding layer 6 on the first substrate 11 and the orthographic projection of the frame sealant 3 on the first substrate 11 at least partially overlap, for example, the light-shielding layer 6 extends outward from the spacer area 4.
  • the frame sealant 3 is transparent, and the light-shielding layer 6 shown in FIG. 6 can achieve a better light-shielding effect.
  • the second side surface of the light-shielding layer 6 opposite to the first side surface that is, the surface of the light-shielding layer 6 away from the frame sealant 3, and the first side surface of the protective layer 13, that is, close to the frame seal.
  • the surface of the glue 3 contacts or has a certain gap to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • FIG. 7 is a schematic cross-sectional view of still another display panel provided by an embodiment of the present disclosure.
  • the embodiment shown in FIG. 7 has the following differences from the embodiment shown in FIG. 6.
  • the light shielding layer 6 is located on the side of the first substrate 11 away from the array substrate.
  • the projections overlap at least partially.
  • the orthographic projection of the light-shielding layer 6 on the first substrate 11 partially overlaps the orthographic projection of the frame sealant 3 on the first substrate 11, or, in other embodiments, the light-shielding layer 6 is The orthographic projection on the first substrate 11 overlaps the entire orthographic projection of the sealant 3 on the first substrate 11.
  • the embodiment shown in FIG. 7 and the embodiment shown in FIG. 6 have the same or similar technical effects, and the previous description can be referred to, which will not be repeated here.
  • At least one embodiment of the present disclosure provides a display device, and the display device includes any display panel provided in the embodiments of the present disclosure.
  • FIG. 8 is a schematic diagram of a display device provided by an embodiment of the present disclosure. As shown in FIG. 8, at least one embodiment of the present disclosure provides a display device 100 that includes any display panel 10 provided by the embodiments of the present disclosure.
  • the display device is a light emitting diode display (LED) device, such as an organic light emitting diode (OLED) display device.
  • LED light emitting diode display
  • OLED organic light emitting diode
  • the display device can be implemented as a product such as a mobile phone, a tablet computer, a monitor, a notebook computer, and an ATM machine.
  • At least one embodiment of the present disclosure further provides a method for manufacturing a display panel.
  • the manufacturing method includes: providing an array substrate, wherein the array substrate includes a display area and a non-display area surrounding at least part of the display area, wherein The display area includes a plurality of pixels distributed in an array, each of the pixels includes a plurality of sub-pixels, each of the sub-pixels includes a light-emitting device; a package cover is formed; a frame sealant is formed, wherein the frame sealant is located The non-display area; and aligning the array substrate and the packaging cover plate; forming the packaging cover plate includes: providing a first substrate; and on a side of the first substrate close to the array substrate Multiple organic layers are formed.
  • the frame sealing glue is located between the array substrate and the package cover plate and adheres the array substrate and the package cover plate. In the direction of the glue, there is a space area between the organic layer closest to the frame sealing glue and the frame sealing glue, and the space area separates the organic layer closest to the frame sealing glue from the frame sealing glue Open, the interval area is located in the non-display area.
  • the preparation method includes the following steps.
  • Step 1 Provide an array substrate; as shown in FIG. 1, the array substrate includes a display area 101 and a non-display area 102 surrounding at least part of the display area.
  • the display area 101 includes a plurality of pixels 23 distributed in an array, and each pixel 23 includes a plurality of pixels.
  • Step 2 forming a package cover; referring to FIG. 2, forming the package cover includes: providing a first substrate 11; and forming a plurality of organic layers 1 on the first side of the first substrate 11.
  • Forming a plurality of organic layers 1 includes sequentially forming a plurality of sub-color filter units 1, a black matrix 12, and a protective layer 13.
  • forming a plurality of sub-color filter units 14 includes forming a red filter layer, a green filter layer, and a blue filter layer through a patterning process.
  • the patterning process is, for example, a photolithography process.
  • the materials of the red filter layer, the green filter layer and the blue filter layer are resin materials, such as photoresist materials.
  • the black matrix 12 is located on the side of the first substrate 11 close to the array substrate, and defines a plurality of sub-color filter units 14, and the plurality of sub-color filter units 14 correspond to the plurality of sub-pixels 230 in a one-to-one manner and are configured such that each The light emitted by the light-emitting devices of each sub-pixel 230 transmits the corresponding sub-color filter unit.
  • the protective layer 13 covers the first surface of the black matrix 12 away from the first substrate 11 and the plurality of sub-color filter units 14.
  • Step 3 Form sealant 3 on the first side of the first substrate 11.
  • the frame sealant 3 is located in the non-display area 102, and the planar shape of the frame sealant 3 is a closed ring surrounding the display area.
  • Step 4 A filling material is formed on the first side of the first substrate 11, and the filling material is located inside the frame sealant 3 (the side close to the display area 101).
  • the filling material can be formed on the inner side of the frame sealant 3 by a dot coating method.
  • Step 5 Before joining the array substrate and the package cover plate, semi-curing the filling material and the frame sealant to reduce their fluidity.
  • Step 6 align the array substrate and the package cover plate, wherein the frame sealant 3 is located between the array substrate and the package cover plate and adheres the array substrate and the package cover plate.
  • the first side of the first substrate 11 is located on the first side The side of the substrate 11 close to the array substrate; the organic layer of the plurality of organic layers 1 that is closest to the sealant in the direction from the display area to the sealant is the black matrix 12, the black matrix 12 and the sealant There is an interval area 4 between the sealant 3, the interval area 4 separates the black matrix 12 from the sealant 3, and the interval area 4 is located in the non-display area 102.
  • Step 7 After the array substrate and the packaging cover are assembled, the filling material and the sealant 3 are thoroughly cured to obtain the filling material layer 5, so as to realize the stable combination of the array substrate and the packaging cover.
  • the filling material layer 5 is filled between the array substrate and the packaging cover, and includes a first part located in the display area 101 and a second part located in the frame area. The first part covers the light emitting device, and the second part fills the spacer area 4.
  • the material of the filling material and the frame sealing glue 3 includes ultraviolet curing resin, and the curing of the filling material and the frame sealing glue 3 can be realized by an ultraviolet curing method.
  • the display panel 10 shown in FIG. 2 is obtained.
  • the manufacturing method of the display panel shown in FIG. 3B is different from the manufacturing method of the display panel shown in FIG. 2 in that the protective layer 13 is formed to cover the first surface of the black matrix 12 away from the first substrate 11 and the black matrix 12 On the side surface that intersects with the first surface, the organic layer closest to the sealant 3 in the lateral direction among the plurality of organic layers 1 is the protective layer 13.
  • the other steps and features of the manufacturing method of the display panel shown in FIG. 3B are the same as those of the manufacturing method of the display panel shown in FIG. 2, and reference may be made to the previous description.
  • the manufacturing method of the display panel shown in FIG. 4B is different from the manufacturing method of the display panel shown in FIG.
  • a first spacer 71 is formed on the side.
  • the first spacer 71 is located on the side of the first substrate 11 that is close to the array substrate, and is located on the side of the black matrix 12 and the protective layer 13 that is close to the frame sealant 3.
  • the closest to the frame seal The organic layer of the glue 3 is the first spacer 71.
  • the array substrate further includes a second spacer 72.
  • the second spacer 72 is located on the side of the pixel defining layer 22 that is close to the black matrix 12, and is spaced from the protective layer 13; the orthographic projection of the second spacer 72 on the first substrate 11 is located on the pixel defining layer 22 is in the orthographic projection on the first substrate 11 and in the orthographic projection of the black matrix 12 on the first substrate 11.
  • the other steps and features of the manufacturing method of the display panel shown in FIG. 4B are the same as those of the manufacturing method of the display panel shown in FIG. 2, and reference may be made to the previous description.
  • the material of the second spacer and the material of the first spacer are resin; or positive or negative photoresist, so that the second spacer and the first spacer can be formed by patterning by photolithography. Simplify the photolithography process during the patterning process.
  • the manufacturing method of the display panel shown in FIG. 5B is different from the manufacturing method of the display panel shown in FIG.
  • An opaque light-shielding layer 6 is formed on the side.
  • the opaque light-shielding layer 6 is located on the first substrate 11 and covers at least a part of the spacer area 4 to block the light leakage of the display panel in the spacer area 4.
  • the light-shielding layer 6 can further block water and oxygen.
  • the light-shielding layer covers the entire interval area 4 to better play the role of light-shielding and blocking water and oxygen.
  • the light-shielding layer 6 is located on the side of the first substrate 11 close to the array substrate, and the orthographic projection of the light-shielding layer 6 on the first substrate 11 and the orthographic projection of the sealant 3 on the first substrate 11 do not overlap.
  • the material of the light shielding layer 6 is a metal material.
  • the metal material is, for example, metal or alloy, such as molybdenum, copper, aluminum, chromium, nickel, or their alloys.
  • the above metal materials are only exemplary, and are not limited to the above-listed types.
  • the pattern of the light shielding layer 6 can be formed by a method of screen printing or photolithography.
  • the material of the light-shielding layer 6 can also be an organic material, such as light-shielding tape.
  • the pattern of the light-shielding layer 6 can also be formed by embossing, such as a roll-to-roll method.
  • the first side surface of the light-shielding layer 6, that is, the surface of the light-shielding layer 6 close to the frame sealant 3, and the first side surface of the frame sealant 3, that is, the surface close to the light-shielding layer 6, contact or exist
  • a certain gap is used to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • the second side surface of the light-shielding layer 6 opposite to the first side surface that is, the surface of the light-shielding layer 6 away from the frame sealant 3, and the first side surface of the protective layer 13, that is, close to the frame seal.
  • the surface of the glue 3 contacts or has a certain gap to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • the difference between the manufacturing method of the display panel shown in FIG. 6 and the manufacturing method of the display panel shown in FIG. The orthographic projection of at least partially overlaps, for example, the light shielding layer 6 extends outward from the spacer area 4 to be stacked with the sealant 3.
  • the second side surface of the light-shielding layer 6 opposite to the first side surface that is, the surface of the light-shielding layer 6 away from the frame sealant 3, and the first side surface of the protective layer 13, that is, close to the frame seal.
  • the surface of the glue 3 contacts or has a certain gap to further effectively use the gap to prevent water and oxygen from entering the display area.
  • there is a filling material layer 5 in the gap to further effectively use the filling material layer 5 in the gap to prevent water and oxygen from entering the display area.
  • the manufacturing method of the display panel shown in FIG. 7 differs from the manufacturing method of the display panel shown in FIG.
  • the light shielding layer 6 is formed on the opposite second side. After the packaging cover and the array substrate are joined, the second side of the first substrate 11 is located on the side of the first substrate 11 away from the array substrate.
  • the orthographic projection of the light shielding layer 6 on the first substrate 11 and the orthographic projection of the sealant 3 on the first substrate 11 at least partially overlap. For example, in FIG.
  • the orthographic projection of the light-shielding layer 6 on the first substrate 11 partially overlaps the orthographic projection of the frame sealant 3 on the first substrate 11, or, in other embodiments, the light-shielding layer 6 is The orthographic projection on the first substrate 11 overlaps the entire orthographic projection of the sealant 3 on the first substrate 11.

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Abstract

一种显示面板及其制备方法、以及显示装置。该显示面板包括阵列基板、封装盖板和封框胶。阵列基板包括显示区域和至少部分围绕显示区域的非显示区域，显示区域包括呈阵列分布的多个像素，每个像素包括多个子像素，每个子像素包括发光器件。封装盖板与阵列基板相对设置，且包括第一衬底以及多个有机层。多个有机层位于第一衬底的靠近阵列基板的一侧。封框胶位于非显示区域且位于阵列基板和封装盖板之间并粘合阵列基板和封装盖板；多个有机层中在从显示区域到封框胶的方向上最靠近封框胶的有机层与封框胶之间具有间隔区域，间隔区域将最靠近封框胶的有机层与封框胶间隔开，间隔区域位于非显示区域。

Description

显示面板及其制备方法、显示装置 技术领域
本公开至少一实施例涉及一种显示面板及其制备方法、以及显示装置。
背景技术
有机发光二极管(OLED)显示技术越来越受到人们的关注。但许多有机发光二极管器件所包括的有机材料对湿气和氧气比较敏感，不耐高温；另外，有机发光二极管的金属电极的氧化也会使有机发光二极管的性能退化。因此，使有机发光二极管与环境中的水氧隔绝并且能够对其进行散热对于延长器件寿命很重要。通常会采用密封胶和封装盖板对有机发光二极管器件进行密封，也可以采用干燥剂来阻止水汽侵入有机发光二极管器件。
发明内容
本公开实施例提供一种显示面板，该显示面板包括：阵列基板、封装盖板和封框胶。阵列基板包括显示区域和至少部分围绕所述显示区域的非显示区域，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件。封装盖板与所述阵列基板相对设置，且包括第一衬底以及多个有机层。多个有机层位于所述第一衬底的靠近所述阵列基板的一侧。封框胶位于所述非显示区域且位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板；所述多个有机层中在从所述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。
例如，本公开至少一实施例提供的显示面板中，所述多个有机层包括：黑矩阵和保护层。黑矩阵位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所 述子彩色滤光单元；保护层覆盖所述黑矩阵的远离所述第一衬底的第一表面和所述多个子彩色滤光单元，其中，所述最靠近所述封框胶的有机层为所述黑矩阵。
例如，本公开至少一实施例提供的显示面板中，所述多个有机层包括：黑矩阵和保护层。黑矩阵位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所述子彩色滤光单元；保护层覆盖所述黑矩阵的远离所述第一衬底的第一表面和所述黑矩阵的与所述第一表面相交的侧表面，所述最靠近所述封框胶的有机层为所述保护层。
例如，本公开至少一实施例提供的显示面板中，所述多个有机层包括：黑矩阵、保护层和第一隔垫物。黑矩阵位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所述子彩色滤光单元；保护层覆盖至少部分所述黑矩阵和所述多个子彩色滤光单元；第一隔垫物位于所述第一衬底的靠近所述阵列基板的一侧，且位于所述黑矩阵和所述保护层的靠近所述封框胶的一侧，所述最靠近所述封框胶的有机层为所述第一隔垫物。
例如，本公开至少一实施例提供的显示面板中，所述非显示区的在从所述黑矩阵到所述封框胶的横向上的尺寸越大，所述间隔区域的在所述横向上的宽度越大。
例如，本公开至少一实施例提供的显示面板中，所述封框胶的在从所述黑矩阵到所述封框胶的横向上的尺寸越大，所述间隔区域的在所述横向上的宽度越小。
例如，本公开至少一实施例提供的显示面板中，所述间隔区域的在从所述保护层到所述封框胶的方向上的宽度大于等于10μm。
例如，本公开至少一实施例提供的显示面板中，所述封框胶的在所述横向上的宽度小于等于2mm，所述间隔区域的所述宽度大于等于100μm。
例如，本公开至少一实施例提供的显示面板中，所述保护层为平坦层， 所述平坦层的远离所述第一衬底的表面为平坦表面。
例如，本公开至少一实施例提供的显示面板中，所述封装盖板还包括不透光的遮光层。遮光层位于所述第一衬底上，且覆盖至少部分所述间隔区域。
例如，本公开至少一实施例提供的显示面板中，所述遮光层覆盖整个所述间隔区域。
例如，本公开至少一实施例提供的显示面板中，所述遮光层位于所述第一衬底的靠近所述阵列基板的一侧，所述遮光层在所述第一衬底上的正投影与所述封框胶在所述第一衬底上的正投影不重叠。
例如，本公开至少一实施例提供的显示面板中，所述遮光层位于所述第一衬底的靠近所述阵列基板的一侧，所述遮光层在所述第一衬底上的正投影与所述封框胶在所述第一衬底上的正投影至少部分重叠。
例如，本公开至少一实施例提供的显示面板中，所述遮光层位于所述第一衬底的远离所述阵列基板的一侧，所述遮光层在所述第一衬底上的正投影与所述封框胶在所述第一衬底上的正投影至少部分重叠。
例如，本公开至少一实施例提供的显示面板中，所述遮光层的材料为金属材料。
例如，本公开至少一实施例提供的显示面板中，所述阵列基板还包括像素界定层。像素界定层限定出所述多个子像素，其中，所述黑矩阵在所述第一衬底上的正投影位于所述像素界定层在所述第一衬底上的正投影内。
例如，本公开至少一实施例提供的显示面板中，所述阵列基板还包括第二隔垫物。第二隔垫物位于所述像素界定层的靠近所述黑矩阵的一侧，且与所述保护层之间具有间隔，其中，所述第二隔垫物在所述第一衬底上的正投影位于所述像素界定层在所述第一衬底上的正投影内，且位于所述黑矩阵在所述第一衬底上的正投影内；第二隔垫物的在垂直于第一衬底的方向上的高度小于第一隔垫物的在垂直于第一衬底的方向上的高度。
例如，本公开至少一实施例提供的显示面板，还包括填充材料层。填充材料层填充于所述阵列基板与所述封装盖板之间，且包括位于所述显示区域的第一部分和位于所述边框区域的第二部分；所述第一部分覆盖所述发光器件，所述第二部分填充所述间隔区域。
例如，本公开至少一实施例提供的显示面板中，所述填充材料层为弹性层，在所述显示面板被施加沿垂直于所述第一衬底方向的压力的情况下，所述弹性层的在垂直于所述第一衬底方向上的厚度减小。
本公开至少一实施例提供一种显示装置，该显示装置包括本公开实施例提供的任意一种显示面板。
本公开至少一实施例还提供一种显示面板的制备方法，该制备方法包括：提供阵列基板，其中，所述阵列基板包括显示区域和围绕至少部分所述显示区域的非显示区域，其中，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件；形成封装盖板；形成封框胶，其中，所述封框胶位于所述非显示区域；以及将所述阵列基板与所述封装盖板对合；形成封装盖板包括：提供第一衬底；以及在所述第一衬底的靠近所述阵列基板的一侧形成多个有机层。所述封框胶位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板，所述多个有机层中在从所述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为本公开一实施例提供的一种显示面板的平面示意图；
图2为沿图1中的A-A’线的截面示意图；
图3A为本公开一实施例提供的另一种显示面板的平面示意图；
图3B为沿图3A中的B-B’线的截面示意图；
图4A为本公开一实施例提供的又一种显示面板的平面示意图；
图4B为沿图4A中的C-C’线的截面示意图；
图5A为本公开一实施例提供的再一种显示面板的平面示意图；
图5B为沿图5A中的D-D’线的截面示意图；
图6为本公开一实施例提供的再一种显示面板的截面示意图；
图7为本公开一实施例提供的再一种显示面板的截面示意图；
图8为本公开一实施例提供的一种显示装置的示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。以下所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“包括”或者“包含”等类似的词语意指出现在该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开所使用的附图的尺寸并不是严格按实际比例绘制，显示区域中发像素的个数也不是限定为图中所示的数量，各个结构的具体地尺寸和数量可根据实际需要进行确定。本公开中所描述的附图仅是结构示意图。
本公开实施例提供一种显示面板，该显示面板包括：阵列基板、封装盖板和封框胶。阵列基板包括显示区域和至少部分围绕所述显示区域的非显示区域，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件。封装盖板与所述阵列基板相对设置，且包括第一衬底以及多个有机层。多个有机层位于所述第一衬底的靠近所述阵列基板的一侧。封框胶位于所述非显示区域且位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板；所述多个有机层中在从所 述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。尤其是在大尺寸的显示面板中，需要在封装盖板上设置该多个有机层例如彩膜和黑矩阵等等，以获得较高的色域、较好的色彩效果。但是，有机层阻隔水氧的能力较弱(例如相对无机层)，在本公开实施例中，当外界环境的水氧进入显示面板内部，即进入封框胶的靠近显示区的一侧后，由于封框胶与所述最靠近所述封框胶的有机层不直接接触，从而进入显示面板内部的水氧不会在通过封框胶后而直接进入有机层而通过有机层向发光器件扩散，而是能够在间隔区域得到缓冲，例如在间隔区域向除了有机层所在位置之外的其他位置扩散或者被吸收，从而更好地阻止增大外界水氧进入显示区域。
示例性地，图1为本公开一实施例提供的一种显示面板的平面示意图,图2为沿图1中的A-A’线的截面示意图，例如图2可以为图1所示的显示面板的截面示意图，为了清楚和简洁，图2只示出了显示区域中的一个像素。
如图1和图2所示，显示面板10包括：阵列基板、封装盖板和封框胶3；阵列基板包括显示区域101和至少部分围绕所述显示区域101的非显示区域102，显示区域101包括呈阵列分布的多个像素23，每个像素23包括多个子像素230。每个子像素230包括发光器件。例如，一个像素23包括第一子像素、第二子像素和第三子像素。第一子像素、第二子像素和第三子像素分别包括第一发光器件231、第二发光器件232和第三发光器件233。第一发光器件231、第二发光器件232和第三发光器件233分别发出不同颜色的光，例如分别发出红光、绿光和蓝光。例如，本公开实施例以一个像素23包括三个子像素230为例，在其他实施例中，一个像素的子像素的个数不限于三个，本公开实施例对此不作限定。
例如，封框胶3的平面形状为封闭的环形，以发挥较好的粘结作用和阻隔水氧的作用。
例如，发光器件为发光二极管(LED)器件，例如有机发光二极管(OLED)器件。例如发光器件包括在垂直于第二衬底21的方向上堆叠设置的第一电极、发光层和第二电极。例如，第一电极为阳极，第二电极为阴极。例如OLED 器件还包括空穴注入层、空穴传输层、电子注入层和电子传输层等，对于这些结构，本领域技术人员可参考常规技术进行设计，在此不再赘述。
封装盖板与阵列基板相对设置。封装盖板包括第一衬底11以及多个有机层1。阵列基板包括与第一衬底11相对设置的第二衬底21。多个有机层1位于第一衬底11的靠近阵列基板的一侧。封框胶3位于非显示区域102且位于阵列基板和封装盖板之间并粘合阵列基板和封装盖板。例如封框胶3位于非显示区域102且位于第一衬底11和第二衬底21之间并粘合第一衬底11和第二衬底21。
例如，多个有机层包括黑矩阵12和保护层13。黑矩阵12位于第一衬底11的靠近阵列基板的一侧，且限定出多个子彩色滤光单元14，多个子彩色滤光单元14与多个子像素230一一对应且配置为使每个子像素230的发光器件发出的光透射出与之对应的子彩色滤光单元。保护层13覆盖黑矩阵12的远离第一衬底11的第一表面和多个子彩色滤光单元14。在本实施例中，最靠近封框胶3的有机层为黑矩阵12。即黑矩阵12与封框胶3之间具有间隔区域4，间隔区域4将黑矩阵12与封框胶3间隔开，间隔区域4位于非显示区域102。由于封框胶3与黑矩阵12不直接接触，从而进入显示面板10内部的水氧不会在通过封框胶3后而直接进入黑矩阵12而通过黑矩阵12向发光器件扩散，而是能够在间隔区域4得到缓冲，例如在间隔区域4向除了有机层1所在位置之外的其他位置扩散或者被吸收，同时，也增长了水氧向发光器件传播的路径，从而更好地阻止增大外界水氧进入显示区域。尤其对于大尺寸显示面板，效果更为突出。该大尺寸面板的尺寸例如大于48英寸。
例如，一个滤光单元包括多个子彩色滤光单元14，例如包括分别与第一发光器件231、第二发光器件232和第三发光器件233一一对应的红色滤光单元、绿色滤光单元和蓝色滤光单元。红色滤光单元、绿色滤光单元和蓝色滤光单元分别包括红色滤光层、绿色滤光层和蓝色滤光层。例如，红色滤光层、绿色滤光层和蓝色滤光层的在垂直于第一衬底11方向上的厚度均为0.1μm～5μm，红色滤光层、绿色滤光层和蓝色滤光层的材料为树脂材料，例如为光刻胶材料。本公开实施例对彩色滤光层的材料此不作限定。
例如，黑矩阵12环绕每个彩色滤光层，即黑矩阵12环绕每个红色滤光 层、每个绿色滤光层和每个蓝色滤光层，以防止不同色光之间的串扰。尤其是在大尺寸的显示面板中，需要在封装盖板上设置该黑矩阵12和该多个子彩色滤光单元14，以获得较高的色域、较好的色彩效果。
从黑矩阵12到封框胶3的方向为横向。例如，间隔区域4的在横向上的宽度L与非显示区102在横向上的尺寸成正比。非显示区102在横向上的尺寸越大，间隔区域4的宽度L越大。如此，能够根据非显示区102在横向上的尺寸即边框区的宽度来设计间隔区域4的宽度L，使间隔区域4的宽度L适应边框区的宽度，而不会因间隔区域4而过大加宽边框。
例如，间隔区域4的在横向上的宽度L与封框胶3在横向上的尺寸成反比。封框胶3在横向上的尺寸越大，间隔区域4的宽度L越小。封框胶3在横向上的尺寸越大，其阻隔水氧的能力越强，从而可减小间隔区域4的宽度L，以使封框胶3与间隔区域4合理分配边框区的宽度，而不会因间隔区域4而过大加宽边框。
例如，间隔区域4的在从保护层13到封框胶3的方向上的宽度大于等于10μm，以达到较好的阻隔水氧的效果。
例如，当封框胶3的在横向上的宽度小于等于2mm时，间隔区域4的宽度L大于等于100μm。
需要说明的是，以上的尺寸只是示例性的，本领域技术人员可根据边框尺寸以及封框胶的宽度、以及对阻隔水氧的要求来设计间隔区域4的宽度L，本公开实施例对间隔区域4的宽度L不作具体限定。
例如，黑矩阵12的在垂直于第一衬底11方向上的厚度为0.1μm～5μm。例如，黑矩阵12的材料为光刻胶材料，以便于通过光刻工艺形成黑矩阵12的图案。例如黑矩阵12的材料为负性光刻胶，当然，也可以为正性光刻胶。
如图2所示，例如，保护层13为平坦层，平坦层的远离第一衬底11的表面为平坦表面。从而可以使填充于平坦层上方的填充材料能够被压合得更加平坦，从而使封装盖板与阵列基板压合得更加密合，增强对发光器件的密封性。
例如，平坦层13的在垂直于第一衬底11方向上的厚度为0.1μm～5μm。例如，平坦层的材料是树脂，或者是正性或负性光刻胶。
如图2所示，例如，阵列基板还包括像素界定层22。像素界定层22限定出多个子像素23。例如，黑矩阵12在第一衬底11上的正投影位于像素界定层22在第一衬底11上的正投影内，如此，一个子彩色滤光单元的尺寸(开口)大于等于与之对应子像素(开口)的尺寸，以保证出光率。
如图2所示，例如，显示面板10还包括填充材料层5。填充材料层5填充于阵列基板与封装盖板之间，且包括位于显示区域101的第一部分和位于所述边框区域的第二部分。第一部分覆盖发光器件，第二部分填充间隔区域4。如此，进入显示面板10内部的水氧能够在间隔区域4向填充材料层5扩散，被填充材料层5吸收，从而更好地阻止增大外界水氧进入显示区域。
例如，填充材料层5的材料包括树脂，例如亚克力系、环氧树脂等。例如，在一些实施例中，填充材料层5还包括干燥剂、吸氧剂和散热材料中的至少之一，以达到更有效地阻隔水氧的效果以及有效散热的效果。例如，干燥剂可以是生石灰(CaO)，也可以是吸水树脂；吸氧剂可以是无机吸氧剂，例如金属粉(包括铁粉、铜粉等)、硫化硫酸钠和铁粉的混合物或二亚硫酸钠等，也可以是有机吸氧剂，例如双丁羟基甲基茴香醚(BHA)或双羟基甲基醚(BHT)等；散热材料可以是导热脂类，例如由氧化锌、氧化铝或氮化硼等制成的散热颗粒。当然，在本实施例中，填充材料层5包括的材料不仅仅限于上述的干燥剂、吸氧剂和散热材料三种，也可以包含其他对保护有机发光器件有利的材料，并且上述三种材料也不仅仅限于是所列举的种类，本公开对此不作限定。例如，在一些实施例中，填充材料层5也可以不包括干燥剂、吸氧剂和散热材料。本公开实施例对填充材料层5不作限定。
例如，填充材料层5为弹性层，在显示面板10被施加沿垂直于第一衬底11方向的压力的情况下，弹性层的在垂直于第一衬底11的方向上的厚度减小。例如填充材料层5的杨氏模量可以为约为0.1MPa～10MPa。杨氏模量是表征在弹性限度内材料抗拉或抗压能力的物理量。如果填充材料层5的杨氏模量低于约0.1MPa，则可能需要较大的压力才能使填充材料层5产生形变，则大大降低了填充材料层5的缓冲作用；若杨氏模量大于约10MPa，则说明弹性层15太软，这可能降低显示面板10的耐用性。
例如，图3A为本公开一实施例提供的另一种显示面板的平面示意图， 图3B为沿图3A中的B-B’线的截面示意图。图3A和图3B所示的实施例与图2所示的实施例具有以下区别。如图3A和图3B所示，保护层13覆盖黑矩阵12的远离第一衬底11的第一表面和黑矩阵12的与第一表面相交的侧表面，多个有机层1中在横向上最靠近封框胶3的有机层为保护层13。从而进入显示面板10内部的水氧不会在通过封框胶3后而直接进入保护层13继而通过保护层13向发光器件扩散，而是能够在间隔区域4得到缓冲，例如在间隔区域4向除了有机层1所在位置之外的其他位置扩散或者被吸收，同时，增长了水氧向发光器件传播的路径，从而更好地阻止增大外界水氧进入显示区域。图3B所示的实施例与图2所示的实施例的其他特征及相应技术效果均与图2中的相同，请参考之前的描述。
例如，图4A为本公开一实施例提供的又一种显示面板的平面示意图，图4B为沿图4A中的C-C’线的截面示意图。图4A和图4B所示的实施例与图2所示的实施例具有以下区别。如图4A和图4B所示，除了黑矩阵12和保护层13，多个有机层还包括第一隔垫物71。第一隔垫物71位于第一衬底11的靠近阵列基板的一侧，且位于黑矩阵12和保护层13的靠近封框胶3的一侧，所述多个有机层中最靠近封框胶3的有机层为第一隔垫物71。从而进入显示面板10内部的水氧不会在通过封框胶3后而直接进入第一隔垫物71继而通过第一隔垫物71向发光器件扩散，而是能够在间隔区域4得到缓冲，例如在间隔区域4向除了有机层1所在位置之外的其他位置扩散或者被吸收，同时，增长了水氧向发光器件传播的路径，从而更好地阻止增大外界水氧进入显示区域。
例如，第一隔垫物71的远离第二衬底21的一端与第一衬底11接触，第一隔垫物71的远离第一衬底11的一端与第二衬底21之间具有间隔，第一隔垫物71支撑于第一衬底11与第二衬底21之间，以起到维持第一衬底11与第二衬底21之间稳定的距离的作用，同时，可以下垂直于第一衬底11的方向上的阻隔水氧进一步进入第一隔垫物71内侧的显示区域，比不设置第一隔垫物71的显示面板相比，该显示面板10具有更好的阻止水氧进入显示区域的效果。例如，在其他实施例中，第一隔垫物71的远离第一衬底11的一端可以与第二衬底21接触。
例如，在图4A和图4B所示的实施例中，第一隔垫物71的平面形状为封闭的环形，以在整个显示区域的边缘达到更好的支撑效果和阻隔水氧的效果。当然，在其他实施例中，第一隔垫物71也可以包括彼此间隔开的多个柱状物。
如图4B所示，例如，显示面板10还包括第二隔垫物72。第二隔垫物72位于像素界定层22的靠近黑矩阵12的一侧，且与保护层13之间具有间隔；第二隔垫物72在第一衬底11上的正投影位于像素界定层22在第一衬底11上的正投影内，且位于黑矩阵12在第一衬底11上的正投影内。在显示面板10受外界压力时，第二隔垫物72能够维持第一衬底11与第二衬底21之间相对稳定的距离；同时，第二隔垫物72不会影响显示面板10的开口率。
例如，第二隔垫物72的在垂直于第一衬底11的方向上的高度小于第一隔垫物71的在垂直于第一衬底11的方向上的高度。
例如，第二隔垫物的材料和第一隔垫物的材料是树脂；或者是正性或负性光刻胶，以便于在通过光刻构图来形成第二隔垫物和第一隔垫物的图案的过程中，简化光刻工艺。
图4B所示的实施例与图3B所示的实施例的其他特征及相应技术效果均与图3B中的相同，请参考之前的描述。
例如，图5A为本公开一实施例提供的再一种显示面板的平面示意图，图5B为沿图5A中的D-D’线的截面示意图。图5A和图5B所示的实施例与图3B所示的实施例具有以下区别。如图5A和图5B所示，封装盖板还包括不透光的遮光层6。不透光的遮光层6位于第一衬底11上，且覆盖至少部分间隔区域4，以遮挡显示面板在间隔区域4的漏光，同时，遮光层6可进一步阻隔水氧。例如遮光层覆盖整个间隔区域4，以更好地发挥遮光和阻隔水氧的作用。
例如，遮光层6的平面形状为封闭的环形，以在整个显示区域的边缘达到更好的遮光效果和阻隔水氧的效果。
例如，遮光层6的材料为金属材料。该金属材料例如金属或合金，例如钼、铜、铝、铬、镍或他们的合金等。当然，以上金属材料只是示例性的，不限于上述列举种类。金属材料的阻隔水氧的能力较强，例如比有机不透明 材料的阻隔水氧的能力强，有利于获得更好的阻隔水氧的效果。当然，在一些实施例中，遮光层6的材料也可以为有机材料，例如遮光胶带。
例如，如图5B所示，遮光层6位于第一衬底11的靠近阵列基板的一侧，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影不重叠。从而使封框胶3直接与第一衬底11接触而对第一衬底11和第二衬底21具有更强的粘结力，避免遮光层6与封框胶3重叠而降低封框胶3对第一衬底11和第二衬底21粘结力。
在一些实施例中，遮光层6的第一侧表面，即遮光层6的靠近封框胶3的表面，与封框胶3的第一侧表面，即靠近遮光层6的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。
在一些实施例中，遮光层6的与第一侧表面相对设置的第二侧表面，即遮光层6的远离封框胶3的表面，与保护层13的第一侧表面，即靠近封框胶3的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。
图5B所示的实施例与图3B所示的实施例的其他特征及相应技术效果均与图3B中的相同，请参考之前的描述。
例如，图6为本公开一实施例提供的再一种显示面板的截面示意图。图6所示的实施例与图5B所示的实施例具有以下区别。如图6所示，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影至少部分重叠，例如，遮光层6从间隔区域4向外延伸以与封框胶3堆叠。例如在一些实施例中封框胶3是透明的，图6所示的遮光层6可以获得更好的遮光效果。
在一些实施例中，遮光层6的与第一侧表面相对设置的第二侧表面，即遮光层6的远离封框胶3的表面，与保护层13的第一侧表面，即靠近封框胶3的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。
图6所示的实施例与图5B所示的实施例的其他特征及相应技术效果均与图5B中的相同，请参考之前的描述。
例如，图7为本公开一实施例提供的再一种显示面板的截面示意图。图7所示的实施例与图6所示的实施例具有以下区别。如图7所示，遮光层6位于第一衬底11的远离阵列基板的一侧，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影至少部分重叠。例如，在图7中，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影部分重叠，或者，在其他实施例中，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的整个正投影重叠。图7所示实施例与图6所示实施例具有相同或相似的技术效果，可参考之前的描述，在此不再重复。
本公开至少一实施例提供一种显示装置，该显示装置包括本公开实施例提供的任意一种显示面板。
示例性地，图8为本公开一实施例提供的一种显示装置的示意图。如图8所示，本公开至少一实施例提供显示装置100包括本公开实施例提供的任意一种显示面板10。
例如，显示装置100的其他结构例如像素驱动电路等，本领域可参考常规技术进行设计，本公开的实施例对此没有限制。
例如，该显示装置是发光二极管显示(LED)装置，例如有机发光二极管(OLED)显示装置。例如，该显示装置可实现为手机、平板电脑、显示器、笔记本电脑、ATM机等产品。
本公开至少一实施例还提供一种显示面板的制备方法，该制备方法包括：提供阵列基板，其中，所述阵列基板包括显示区域和围绕至少部分所述显示区域的非显示区域，其中，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件；形成封装盖板；形成封框胶，其中，所述封框胶位于所述非显示区域；以及将所述阵列基板与所述封装盖板对合；形成封装盖板包括：提供第一衬底；以及在所述第一衬底的靠近所述阵列基板的一侧形成多个有机层。所述封框胶位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板，所述多个有机层中在从所述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层 与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。
示例性地，制备方法包括以下步骤。
步骤1：提供阵列基板；如图1所示，阵列基板包括显示区域101和围绕至少部分显示区域的非显示区域102，显示区域101包括呈阵列分布的多个像素23，每个像素23包括多个子像素230，每个子像素包括发光器件。
步骤2：形成封装盖板；参考图2，形成封装盖板包括：提供第一衬底11；以及在第一衬底11的第一侧形成多个有机层1。形成多个有机层1包括依次形成多个子彩色滤光单元1、黑矩阵12和保护层13。例如，形成多个子彩色滤光单元14包括通过构图工艺形成红色滤光层、绿色滤光层和蓝色滤光层。该构图工艺例如为光刻工艺。例如，红色滤光层、绿色滤光层和蓝色滤光层的材料为树脂材料，例如为光刻胶材料。例如，黑矩阵12位于第一衬底11的靠近阵列基板的一侧，且限定出多个子彩色滤光单元14，多个子彩色滤光单元14与多个子像素230一一对应且配置为使每个子像素230的发光器件发出的光透射出与之对应的子彩色滤光单元。保护层13覆盖黑矩阵12的远离第一衬底11的第一表面和多个子彩色滤光单元14。
步骤3：在第一衬底11的第一侧形成封框胶3。封框胶3位于所述非显示区域102，封框胶3的平面形状为围绕显示区域的封闭的环形。
步骤4：在第一衬底11的第一侧形成填充材料，填充材料位于封框胶3的内侧(靠近显示区域101的一侧)。例如可以通过点涂的方法在封框胶3的内侧形成填充材料。
步骤5：在将阵列基板与封装盖板对合前，对填充材料和封框胶进行半固化以降低其流动性。
步骤6：将阵列基板与封装盖板对合，其中，封框胶3位于阵列基板和封装盖板之间并粘合阵列基板和封装盖板，第一衬底11的第一侧位于第一衬11底的靠近阵列基板的一侧；多个有机层1中在从显示区域到所述封框胶的方向上最靠近所述封框胶的有机层为黑矩阵12，黑矩阵12与封框胶3之间具有间隔区域4，间隔区域4将黑矩阵12与封框胶3间隔开，间隔区域4位于非显示区域102。
步骤7：在对阵列基板与封装盖板对合后，将填充材料和封框胶3彻底固化得到填充材料层5，实现阵列基板与封装盖板的稳固结合。填充材料层5填充于阵列基板与封装盖板之间，且包括位于显示区域101的第一部分和位于所述边框区域的第二部分。第一部分覆盖发光器件，第二部分填充间隔区域4。
例如，填充材料和封框胶3的材料包括紫外固化树脂，可采用紫外固化方法实现填充材料和封框胶3的固化。从而得到图2所示的显示面板10。
图3B所示的显示面板的制备方法与图2所示的显示面板的制备方法的区别在于，将保护层13形成为覆盖黑矩阵12的远离第一衬底11的第一表面和黑矩阵12的与第一表面相交的侧表面，多个有机层1中在横向上最靠近封框胶3的有机层为保护层13。图3B所示的显示面板的制备方法的其他的步骤及特征与图2所示的显示面板的制备方法相同，可参考之前的描述。
图4B所示的显示面板的制备方法与图2所示的显示面板的制备方法的区别在于，还包括：在将阵列基板与封装盖板对合前，在在第一衬底11的第一侧形成第一隔垫物71。第一隔垫物71位于第一衬底11的靠近阵列基板的一侧，且位于黑矩阵12和保护层13的靠近封框胶3的一侧，所述多个有机层中最靠近封框胶3的有机层为第一隔垫物71。在将阵列基板与封装盖板对合后，例如，第一隔垫物71的远离第二衬底21的一端与第一衬底11接触，第一隔垫物71的远离第一衬底11的一端与第二衬底21之间具有间隔。并且，阵列基板还包括第二隔垫物72。第二隔垫物72位于像素界定层22的靠近黑矩阵12的一侧，且与保护层13之间具有间隔；第二隔垫物72在第一衬底11上的正投影位于像素界定层22在第一衬底11上的正投影内，且位于黑矩阵12在第一衬底11上的正投影内。图4B所示的显示面板的制备方法的其他的步骤及特征与图2所示的显示面板的制备方法相同，可参考之前的描述。
例如，第二隔垫物的材料和第一隔垫物的材料是树脂；或者是正性或负性光刻胶，以便于在通过光刻构图来形成第二隔垫物和第一隔垫物的图案的过程中，简化光刻工艺。
图5B所示的显示面板的制备方法与图2所示的显示面板的制备方法的区别在于，还包括：在将阵列基板与封装盖板对合前，在在第一衬底11的第 一侧形成不透光的遮光层6。不透光的遮光层6位于第一衬底11上，且覆盖至少部分间隔区域4，以遮挡显示面板在间隔区域4的漏光，同时，遮光层6可进一步阻隔水氧。例如遮光层覆盖整个间隔区域4，以更好地发挥遮光和阻隔水氧的作用。遮光层6位于第一衬底11的靠近阵列基板的一侧，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影不重叠。
例如，遮光层6的材料为金属材料。该金属材料例如金属或合金，例如钼、铜、铝、铬、镍或他们的合金等。当然，以上金属材料只是示例性的，不限于上述列举种类。可以通过丝网印刷或光刻的方法形成遮光层6的图案。例如，遮光层6的材料也可以为有机材料，例如遮光胶带，此时除了丝网印刷和光刻工艺，例如还可以通过压印的方式例如roll-to-roll方法形成遮光层6的图案。
在一些实施例中，遮光层6的第一侧表面，即遮光层6的靠近封框胶3的表面，与封框胶3的第一侧表面，即靠近遮光层6的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。
在一些实施例中，遮光层6的与第一侧表面相对设置的第二侧表面，即遮光层6的远离封框胶3的表面，与保护层13的第一侧表面，即靠近封框胶3的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。
图5B所示的显示面板的制备方法的其他的步骤及特征与图2所示的显示面板的制备方法相同，可参考之前的描述。
图6所示的显示面板的制备方法与图5B所示的显示面板的制备方法的区别在于，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影至少部分重叠，例如，遮光层6从间隔区域4向外延伸以与封框胶3堆叠。
在一些实施例中，遮光层6的与第一侧表面相对设置的第二侧表面，即遮光层6的远离封框胶3的表面，与保护层13的第一侧表面，即靠近封框胶 3的表面，接触或存在一定间隙，以进一步有效地利用该间隙阻止水氧进入到显示区域中。在一些实施例中，间隙中存在填充材料层5，以进一步有效地利用该间隙中的填充材料层5阻止水氧进入到显示区域中。图6所示的显示面板的制备方法其他的步骤及特征与图5B所示的显示面板的制备方法相同，可参考之前的描述。
图7所示的显示面板的制备方法与图6所示的显示面板的制备方法的区别在于，包括：在将阵列基板与封装盖板对合前，在第一衬底11的与其第一侧相对的第二侧形成遮光层6，在将封装盖板和阵列基板对合之后，第一衬底11的第二侧位于第一衬11底的远离所述阵列基板的一侧。遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影至少部分重叠。例如，在图7中，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的正投影部分重叠，或者，在其他实施例中，遮光层6在第一衬底11上的正投影与封框胶3在第一衬底11上的整个正投影重叠。图7所示的显示面板的制备方法的其他的步骤及特征与图6所示的显示面板的制备方法相同，可参考之前的描述。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围根据权利要求书所界定的范围确定。

Claims (21)

  1. 一种显示面板，包括：
    阵列基板，包括显示区域和至少部分围绕所述显示区域的非显示区域，其中，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件；
    封装盖板，与所述阵列基板相对设置，且包括：
    第一衬底；以及
    多个有机层，位于所述第一衬底的靠近所述阵列基板的一侧；
    以及
    封框胶，位于所述非显示区域且位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板，其中，所述多个有机层中在从所述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。
  2. 根据权利要求1所述的显示面板，其中，所述多个有机层包括：
    黑矩阵，位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所述子彩色滤光单元；以及
    保护层，覆盖所述黑矩阵的远离所述第一衬底的第一表面和所述多个子彩色滤光单元，其中，所述最靠近所述封框胶的有机层为所述黑矩阵。
  3. 根据权利要求1所述的显示面板，其中，所述多个有机层包括：
    黑矩阵，位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所述子彩色滤光单元；以及
    保护层，覆盖所述黑矩阵的远离所述第一衬底的第一表面和所述黑矩阵的与所述第一表面相交的侧表面，所述最靠近所述封框胶的有机层为所述保 护层。
  4. 根据权利要求1-3任一所述的显示面板，其中，所述多个有机层包括：
    黑矩阵，位于所述第一衬底的靠近所述阵列基板的一侧，且限定出多个子彩色滤光单元，所述多个子彩色滤光单元与所述多个子像素一一对应且配置为使每个所述子像素的发光器件发出的光透射出与之对应的所述子彩色滤光单元；
    保护层，覆盖至少部分所述黑矩阵和所述多个子彩色滤光单元；以及
    第一隔垫物，位于所述第一衬底的靠近所述阵列基板的一侧，且位于所述黑矩阵和所述保护层的靠近所述封框胶的一侧，所述最靠近所述封框胶的有机层为所述第一隔垫物。
  5. 根据权利要求1-4任一所述的显示面板，其中，
    所述非显示区的在从所述黑矩阵到所述封框胶的横向上的尺寸越大，所述间隔区域的在所述横向上的宽度越大。
  6. 根据权利要求1-4任一所述的显示面板，其中，
    所述封框胶的在从所述黑矩阵到所述封框胶的横向上的尺寸越大，所述间隔区域的在所述横向上的宽度越小。
  7. 根据权利要求6所述的显示面板，其中，所述间隔区域的在从所述保护层到所述封框胶的方向上的宽度大于等于10μm。
  8. 根据权利要求7所述的显示面板，其中，所述封框胶的在所述横向上的宽度小于等于2mm，所述间隔区域的所述宽度大于等于100μm。
  9. 根据权利要求1-8任一所述的显示面板，其中，所述保护层为平坦层，所述平坦层的远离所述第一衬底的表面为平坦表面。
  10. 根据权利要求1-9任一所述的显示面板，其中，所述封装盖板还包括：
    不透光的遮光层，位于所述第一衬底上，且覆盖至少部分所述间隔区域。
  11. 根据权利要求10所述的显示面板，其中，所述遮光层覆盖整个所述间隔区域。
  12. 根据权利要求10或11所述的显示面板，其中，所述遮光层位于所述第一衬底的靠近所述阵列基板的一侧，所述遮光层在所述第一衬底上的正 投影与所述封框胶在所述第一衬底上的正投影不重叠。
  13. 根据权利要求10或11所述的显示面板，其中，所述遮光层位于所述第一衬底的靠近所述阵列基板的一侧，所述遮光层在所述第一衬底上的正投影与所述封框胶在所述第一衬底上的正投影至少部分重叠。
  14. 根据权利要求10或11所述的显示面板，其中，所述遮光层位于所述第一衬底的远离所述阵列基板的一侧，所述遮光层在所述第一衬底上的正投影与所述封框胶在所述第一衬底上的正投影至少部分重叠。
  15. 根据权利要求10-14任一所述的显示面板，其中，所述遮光层的材料为金属材料。
  16. 根据权利要求4-15任一所述的显示面板，其中，所述阵列基板还包括：
    像素界定层，限定出所述多个子像素，其中，所述黑矩阵在所述第一衬底上的正投影位于所述像素界定层在所述第一衬底上的正投影内。
  17. 根据权利要求16所述的显示面板，还包括：
    第二隔垫物，位于所述像素界定层的靠近所述黑矩阵的一侧，且与所述保护层之间具有间隔，其中，所述第二隔垫物在所述第一衬底上的正投影位于所述像素界定层在所述第一衬底上的正投影内，且位于所述黑矩阵在所述第一衬底上的正投影内；
    第二隔垫物的在垂直于第一衬底的方向上的高度小于第一隔垫物的在垂直于第一衬底的方向上的高度。
  18. 根据权利要求1-17任一所述的显示面板，还包括：
    填充材料层，填充于所述阵列基板与所述封装盖板之间，且包括位于所述显示区域的第一部分和位于所述边框区域的第二部分，其中，
    所述第一部分覆盖所述发光器件，所述第二部分填充所述间隔区域。
  19. 根据权利要求18所述的显示面板，其中，所述填充材料层为弹性层，在所述显示面板被施加沿垂直于所述第一衬底方向的压力的情况下，所述弹性层的在垂直于所述第一衬底方向上的厚度减小。
  20. 一种显示面板的制备方法，包括：
    提供阵列基板，其中，所述阵列基板包括显示区域和围绕至少部分所述 显示区域的非显示区域，其中，所述显示区域包括呈阵列分布的多个像素，每个所述像素包括多个子像素，每个所述子像素包括发光器件；
    形成封装盖板，包括：
    提供第一衬底；以及
    在所述第一衬底的靠近所述阵列基板的一侧形成多个有机层；
    形成封框胶，其中，所述封框胶位于所述非显示区域；以及
    将所述阵列基板与所述封装盖板对合，其中，所述封框胶位于所述阵列基板和所述封装盖板之间并粘合所述阵列基板和所述封装盖板，所述多个有机层中在从所述显示区域到所述封框胶的方向上最靠近所述封框胶的有机层与所述封框胶之间具有间隔区域，所述间隔区域将所述最靠近所述封框胶的有机层与所述封框胶间隔开，所述间隔区域位于所述非显示区域。
  21. 一种显示装置，包括权利要求1-19任一所述的显示面板。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103426896A (zh) * 2012-05-15 2013-12-04 群康科技(深圳)有限公司 有机发光二极管显示装置
CN107316951A (zh) * 2017-08-16 2017-11-03 京东方科技集团股份有限公司 封装基板及其制备方法、oled显示面板及其制备方法
US20190189951A1 (en) * 2017-12-15 2019-06-20 Beijing Boe Display Technology Co., Ltd. Package structure, method for manufacturing the same, method for detecting package defect, oled device and display apparatus
CN110444689A (zh) * 2019-08-19 2019-11-12 京东方科技集团股份有限公司 一种显示面板及显示装置
CN110752317A (zh) * 2019-11-08 2020-02-04 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107845662B (zh) * 2017-10-27 2020-06-26 京东方科技集团股份有限公司 一种彩膜基板及其制作方法和显示装置
CN108258143A (zh) * 2018-01-12 2018-07-06 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103426896A (zh) * 2012-05-15 2013-12-04 群康科技(深圳)有限公司 有机发光二极管显示装置
CN107316951A (zh) * 2017-08-16 2017-11-03 京东方科技集团股份有限公司 封装基板及其制备方法、oled显示面板及其制备方法
US20190189951A1 (en) * 2017-12-15 2019-06-20 Beijing Boe Display Technology Co., Ltd. Package structure, method for manufacturing the same, method for detecting package defect, oled device and display apparatus
CN110444689A (zh) * 2019-08-19 2019-11-12 京东方科技集团股份有限公司 一种显示面板及显示装置
CN110752317A (zh) * 2019-11-08 2020-02-04 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法

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