WO2021033529A1 - 硬化性フルオロポリエーテル系接着剤組成物及び光学部品 - Google Patents
硬化性フルオロポリエーテル系接着剤組成物及び光学部品 Download PDFInfo
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- WO2021033529A1 WO2021033529A1 PCT/JP2020/029732 JP2020029732W WO2021033529A1 WO 2021033529 A1 WO2021033529 A1 WO 2021033529A1 JP 2020029732 W JP2020029732 W JP 2020029732W WO 2021033529 A1 WO2021033529 A1 WO 2021033529A1
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- 239000000203 mixture Substances 0.000 title claims abstract description 90
- 239000000853 adhesive Substances 0.000 title claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 44
- 230000003287 optical effect Effects 0.000 title claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 50
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 37
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims abstract description 28
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 22
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 21
- 239000011737 fluorine Substances 0.000 claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 20
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims abstract description 18
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 125000006551 perfluoro alkylene group Chemical group 0.000 claims abstract description 10
- 239000010702 perfluoropolyether Substances 0.000 claims abstract description 10
- 239000011775 sodium fluoride Substances 0.000 claims abstract description 9
- 235000013024 sodium fluoride Nutrition 0.000 claims abstract description 9
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 7
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 41
- 150000002430 hydrocarbons Chemical class 0.000 claims description 36
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 31
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 29
- 238000002834 transmittance Methods 0.000 claims description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000002947 alkylene group Chemical group 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 125000001153 fluoro group Chemical group F* 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 125000004429 atom Chemical group 0.000 claims description 4
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- -1 perfluoro Chemical group 0.000 abstract description 28
- 229920001971 elastomer Polymers 0.000 abstract description 15
- 230000005540 biological transmission Effects 0.000 abstract description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract description 2
- 125000005429 oxyalkyl group Chemical group 0.000 abstract 2
- 125000005702 oxyalkylene group Chemical group 0.000 abstract 1
- 239000000047 product Substances 0.000 description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 38
- 238000001723 curing Methods 0.000 description 17
- 239000000377 silicon dioxide Substances 0.000 description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000006459 hydrosilylation reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 125000005647 linker group Chemical group 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229910003849 O-Si Inorganic materials 0.000 description 3
- 229910003872 O—Si Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 150000003058 platinum compounds Chemical class 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- 0 C*N(*)*(C)C Chemical compound C*N(*)*(C)C 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 241000862969 Stella Species 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000004956 cyclohexylene group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- KSOCRXJMFBYSFA-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4,5,6,6,6-tridecafluoro-5-(1,1,1,2,3,3,4,4,5,5,6,6,6-tridecafluorohexan-2-yloxy)hexane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)OC(F)(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F KSOCRXJMFBYSFA-UHFFFAOYSA-N 0.000 description 1
- PGISRKZDCUNMRX-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-(trifluoromethoxy)butane Chemical compound FC(F)(F)OC(F)(F)C(F)(F)C(F)(F)C(F)(F)F PGISRKZDCUNMRX-UHFFFAOYSA-N 0.000 description 1
- SJBBXFLOLUTGCW-UHFFFAOYSA-N 1,3-bis(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC(C(F)(F)F)=C1 SJBBXFLOLUTGCW-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 description 1
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical compound OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ZWVSQVGDXVZTPM-UHFFFAOYSA-N CCC(C)(NN)OC Chemical compound CCC(C)(NN)OC ZWVSQVGDXVZTPM-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- UNJPQTDTZAKTFK-UHFFFAOYSA-K cerium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Ce+3] UNJPQTDTZAKTFK-UHFFFAOYSA-K 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- CRHLEZORXKQUEI-UHFFFAOYSA-N dialuminum;cobalt(2+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Co+2].[Co+2] CRHLEZORXKQUEI-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 239000002316 fumigant Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229940093474 manganese carbonate Drugs 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/002—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds
- C08G65/005—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens
- C08G65/007—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/04—Polysiloxanes
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
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- C08K3/16—Halogen-containing compounds
Definitions
- the present invention relates to a curable fluoropolyether-based adhesive composition and an optical component having a cured product of the composition.
- a fluorine-containing curable composition a linear fluoropolyether compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in the main chain, and a silicon atom in one molecule.
- a composition containing a fluorine-containing organohydrogensiloxane having two or more hydrogen atoms directly linked to the above and a platinum group metal compound has been proposed, and from the composition, heat resistance, chemical resistance, solvent resistance, mold releasability, and water repellency have been proposed. It is disclosed that a cured product having an excellent balance of oil repellency, low temperature characteristics and the like can be obtained (Patent Document 1: Japanese Patent No. 2990646).
- Patent Document 1 Japanese Patent No. 5246190
- Patent Document 3 Japanese Patent No. 3239717 and Patent Document 4: Japanese Patent No. 5459033
- Patent Document 4 Japanese Patent No. 5459033
- Patent Document 5 Japanese Patent No. 3562578.
- Patent Document 6 Japanese Patent No. 5653877 introduces that it is used as a material for encapsulating an optical semiconductor element.
- Patent Document 7 Japanese Patent No. 5965391 introduces that it is used as a surface layer material of a fixing member in an image forming apparatus equipped with a light reflection sensor.
- Patent Document 8 Japanese Patent No. 5735457 proposes to add spherical silica particles having an average particle size of 0.050 to 10 ⁇ m.
- spherical silica particles having an average particle size of 0.050 to 10 ⁇ m.
- the impact resistance is improved, there is a problem that the light transmittance of the cured product is significantly lowered.
- the present invention has been made in view of the above circumstances, and is a curable fluoropolyether-based adhesive composition having good light transmittance and good adhesiveness, and giving a cured product having excellent rubber strength, and the composition thereof. It is an object of the present invention to provide an optical component having a cured product of an object.
- the present inventor fluorinated as a component for improving rubber strength with respect to a composition containing a predetermined component described later without significantly impairing light transmission.
- the present invention has been made by finding that a curable fluoropolyether-based adhesive composition having good light transmittance and good adhesiveness and giving a cured product having excellent rubber strength can be obtained by using sodium. It came to.
- the present invention provides the following curable fluoropolyether-based adhesive composition and an optical component having a cured product of the composition.
- B One molecule has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, or has a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group, and further.
- a fluorine-containing organohydrogensiloxane that has two or more hydrogen atoms (SiH groups) directly linked to a silicon atom and does not have an epoxy group or an alkoxy group directly linked to a silicon atom in the molecule.
- C Sodium fluoride: 0.1 to 120 parts by mass
- D Platinum group metal catalyst: 0.1 to 2,000 ppm in terms of mass of platinum group metal atom with respect to the component (A)
- the blending amount of the component (B) is such that the hydrogen atom directly linked to the silicon atom in the component (B) is 0.5 to 3 mol with respect to 1 mol of the alkenyl group contained in the composition.
- the perfluoropolyether structure contained in the component (A) has the following general formula (1). -(C a F 2a O) b- (1) (In equation (1), a is an integer of 1 to 6 and b is an integer of 4 to 302.)
- the component (A) is the following general formula (2).
- R 1 and R 2 are alkenyl groups or monovalent hydrocarbon groups having no unsubstituted or substituted aliphatic unsaturated bond, R 1 is independent of each other, and R 2 Are independent of each other, and two or more of the total of six R 1 and R 2 are alkenyl groups.
- R 3 is a hydrogen atom or an unsaturated or substituted monovalent hydrocarbon group independently of each other.
- C and d are respective integers of 1 to 150, and the average value of c + d is 2 to 300, and e is an integer of 1 to 6).
- R 1 and R 2 are alkenyl groups or monovalent hydrocarbon groups having no unsubstituted or substituted aliphatic unsaturated bond
- R 1 is independent of each other
- R 2 Are independent of each other, and two or more of the total of six R 1 and R 2 are alkenyl groups.
- R 4 is independent of each other and is an alkylene group having 1 to 6 carbon atoms
- R 5 is independent of each other. It is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted with fluorine.
- C and d are integers of 1 to 150, respectively, and the average value of c + d is 2 to 300, and e.
- the curable fluoropolyether-based adhesive composition according to any one of [1] to [3], which is a linear polyfluoro compound represented by. [5]
- the component (E) is the following general formula (16).
- t is an integer of 1 to 6
- u is an integer of 1 to 4
- v is an integer of 1 to 4
- t + u + v is an integer of 4 to 10.
- 7 is an unsubstituted or substituted alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms independently of each other
- E is independent of each other and contains a silicon atom, an oxygen atom and a nitrogen atom.
- the curable fluoropolyether-based adhesive composition according to any one of [1] to [4], which is a cyclic organopolysiloxane represented by.
- a curable fluoropolyether-based adhesive composition having good light transmittance and good adhesiveness and giving a cured product having excellent rubber strength, and an optical having the cured product of the composition. Parts can be provided.
- the curable fluoropolyether-based adhesive composition of the present invention contains the following components (A) to (E).
- the component (A) is a linear polyfluoro compound having two or more alkenyl groups in one molecule and further having a perfluoropolyether structure in the main chain.
- a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group and the like can be mentioned, and a vinyl group and an allyl group are particularly preferable.
- the alkenyl group content of the linear polyfluoro compound of the component (A) is preferably 0.005 to 0.3 mol / 100 g, more preferably 0.007 to 0.2 mol / 100 g.
- the alkenyl group content is 0.005 mol / 100 g or more, the degree of cross-linking of the composition of the present invention is sufficient, and there is no possibility that curing defects will occur.
- the alkenyl group content is 0.3 mol / 100 g or less, the mechanical properties of the cured product (fluoropolyether-based rubber elastic body) obtained by curing the composition of the present invention may be impaired. Absent.
- the perfluoropolyether structure of the component (A) is -C a F 2a O- (In the formula, a is an integer from 1 to 6.) It contains a large number of repeating units represented by, and examples thereof include those represented by the following general formula (1). -(C a F 2a O) b- (1) (In equation (1), a is an integer of 1 to 6, b is an integer of 4 to 302, preferably an integer of 8 to 202.)
- repeating unit represented by the above-C a F 2a O- for example, the following formula-CF 2 O-, -CF 2 CF 2 O-, -CF (CF 3 ) O-, -CF 2 CF 2 CF 2 O-, -CF (CF 3 ) CF 2 O-, -CF 2 CF 2 CF 2 CF 2 O-, -CF 2 CF 2 CF 2 CF 2 O-, -C (CF 3 ) 2 O-
- the unit represented by is mentioned.
- the perfluoropolyether structure contained in the component (A) may be composed of one type of the above repeating unit, or may be composed of a combination of two or more types.
- Preferred examples of the component (A) include linear polyfluoro compounds represented by the following general formula (2) and the following general formula (3).
- R 1 and R 2 are alkenyl groups or monovalent hydrocarbon groups having no unsubstituted or substituted aliphatic unsaturated bond, R 1 is independent of each other, and R 2 Are independent of each other, and two or more of the total of six R 1 and R 2 are alkenyl groups.
- R 3 is a hydrogen atom or an unsaturated or substituted monovalent hydrocarbon group independently of each other.
- C and d are respective integers of 1 to 150, and the average value of c + d is 2 to 300, and e is an integer of 1 to 6).
- R 1 and R 2 are alkenyl groups or monovalent hydrocarbon groups having no unsubstituted or substituted aliphatic unsaturated bond, R 1 is independent of each other, and R 2 Are independent of each other, and two or more of the total of six R 1 and R 2 are alkenyl groups.
- R 4 is independent of each other and is an alkylene group having 1 to 6 carbon atoms, and R 5 is independent of each other. It is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted with fluorine.
- C and d are integers of 1 to 150, respectively, and the average value of c + d is 2 to 300, and e. Is an integer from 1 to 6.
- the alkenyl group contained in R 1 and R 2 the same alkenyl group as exemplified as the alkenyl group contained in the above component (A) can be mentioned, and an unsubstituted or substituted aliphatic non-substituted other than the alkenyl group can be mentioned.
- the monovalent hydrocarbon group having no saturated bond is preferably one having 1 to 12 carbon atoms, particularly preferably one having 1 to 10 carbon atoms, and specifically, a methyl group, an ethyl group, a propyl group, and the like.
- Alkyl groups such as butyl group, hexyl group, cyclohexyl group and octyl group; aryl groups such as phenyl group and trill group; aralkyl groups such as benzyl group and phenylethyl group, and some or all of the hydrogen atoms of these groups.
- vinyl group, allyl group, methyl group and ethyl group are particularly preferable as R 1 and R 2.
- R 1 is independent of each other
- R 2 is also independent of each other
- 2 or more (2 to 6) of the total of 6 R 1 and R 2 are alkenyl groups, but R 1 and R 2 are respectively. It is preferable that one or more (that is, 1 to 3 each of R 1 and R 2 ) are alkenyl groups, particularly vinyl groups or allyl groups.
- Examples of the unsubstituted or substituted monovalent hydrocarbon group contained in R 3 include the above-mentioned examples of the monovalent hydrocarbon group having no unsubstituted or substituted aliphatic unsaturated bond of R 1 and R 2. Similar groups can be mentioned.
- R 3 a hydrogen atom, a methyl group, and an ethyl group are preferable.
- R 4 is an alkylene group having 1 to 6 carbon atoms, preferably 2 to 6 carbon atoms, and specifically, a methylene group, an ethylene group, a propylene group (trimethylene group, a methylethylene group), a butylene group (tetramethylene group). , Methylpropylene group), hexamethylene group and the like, and ethylene group and propylene group are particularly preferable.
- R 5 is an alkyl group having 1 to 4 carbon atoms which may be hydrogen atom or fluorine substituted independently of each other, and specifically as an alkyl group having 1 to 4 carbon atoms which may be fluorine substituted. , Methyl group, ethyl group, propyl group, butyl group and other alkyl groups, groups in which some or all of the hydrogen atoms of these groups are substituted with fluorine atoms, for example, trifluoromethyl group and the like. Among these, a hydrogen atom is preferable.
- c and d are preferably integers of 1 to 150, more preferably integers of 1 to 100, and the average value of c + d is preferably 2 to 300, more preferably 6 to 200.
- e is preferably an integer of 1 to 6, and more preferably an integer of 1 to 4.
- linear polyfluoro compound represented by the general formula (2) examples include those represented by the following formula.
- Me represents a methyl group and Et represents an ethyl group.
- c1 and d1 are integers from 1 to 150, respectively.
- c1 and d1 are integers from 1 to 150, respectively.
- c1 and d1 are integers from 1 to 150, respectively.
- linear polyfluoro compound represented by the above general formula (3) examples include those represented by the following formula. (In the formula, c2 and d2 are integers from 1 to 150, respectively.)
- c2 and d2 are integers from 1 to 150, respectively.
- the viscosity can be measured by a rotational viscometer (for example, BL type, BH type, BS type, cone plate type, rheometer, etc.), and in particular, the above general formula (2) or (3).
- the viscosity (23 ° C.) of the linear polyfluoro compound represented by (2) is 500 to 100,000 mPa ⁇ s, particularly 1,000 to 50,000 mPa ⁇ s, as measured by the viscosity specified in JIS K7117-1. Is preferable.
- the viscosity is 500 mPa ⁇ s or more, the storage stability of the composition of the present invention does not deteriorate, and if it is 100,000 mPa ⁇ s or less, the extensibility of the obtained composition does not deteriorate. ..
- the degree of polymerization (or molecular weight) of the linear polyfluoro compound which reflects the number of repetitions of the perfluorooxyalkylene unit constituting the perfluoropolyether structure of the main chain, is determined by using, for example, a fluorosolvent as a developing solvent. It can be determined as a polystyrene-equivalent number average degree of polymerization (or number average molecular weight) or the like in gel permeation chromatography (GPC) analysis.
- the number average degree of polymerization (or number average molecular weight) of the linear polyfluoro compound can also be calculated from 19 F-NMR.
- linear polyfluoro compounds can be used alone or in combination of two or more. That is, among the linear polyfluoro compounds represented by the above general formula (2) or (3), one type can be used alone or in combination of two or more types, and further, the above general formula The linear polyfluoro compound represented by (2) and (3) can also be used in combination.
- the component (B) has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group in one molecule, or has a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group. Further, it is a fluorine-containing organohydrogensiloxane having two or more hydrogen atoms (SiH groups) directly linked to a silicon atom and having no epoxy group or an alkoxy group directly linked to a silicon atom in the molecule, preferably 1.
- SiH groups such as epoxy groups and alkoxy groups directly linked to silicon atoms, which have one or more monovalent or divalent fluorine-containing organic groups and two or more hydrogen atoms directly linked to silicon atoms in the molecule. It is a fluorine-containing organohydrogensiloxane that does not have any other functional group, and functions as a cross-linking agent for the component (A).
- the "other functional group” is a divalent group that links a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group with a silicon atom constituting a polysiloxane.
- Divalent polar groups such as ether-bonded oxygen atoms, amide bonds, carbonyl bonds, and ester bonds that may be contained in the linking groups are excluded.
- the component (B) does not have an epoxy group and an alkoxy group (alkoxysilyl group) directly bonded to a silicon atom in the molecule, and is clearly different from the component (E) as an adhesive imparting agent described later. It is a distinction.
- the monovalent perfluoroalkyl group, monovalent perfluorooxyalkyl group, divalent perfluoroalkylene group and divalent perfluorooxyalkylene group have compatibility, dispersibility and curing with the component (A). It is a group introduced from the viewpoint of uniformity and the like later.
- Examples of the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group include a group represented by the following general formula (4) or (5).
- C f F 2f + 1 - (4) (In equation (4), f is an integer of 1 to 10, preferably an integer of 3 to 7.)
- g is an integer of 1 to 50, preferably an integer of 2 to 30.)
- Examples of the divalent perfluoroalkylene group or the divalent perfluorooxyalkylene group include groups represented by the following general formulas (6) to (8).
- -C h F 2h- (6) (In equation (6), h is an integer of 1 to 20, preferably an integer of 2 to 10.)
- i and j are integers of 1 or more, preferably integers of 1 to 100, and the average value of i + j is 2 to 200, preferably 2 to 100.
- -CF 2 O- (CF 2 CF 2 O) k (CF 2 O) l -CF 2- (8) In the formula (8), k and l are integers of 1 to 50, preferably 1 to 30, respectively, and the average value of k + l is 2 to 100, preferably 2 to 60.
- the repeating units are each. May be randomly combined.)
- the divalent linking group may be an unsubstituted or substituted divalent hydrocarbon group having 2 to 13 carbon atoms, particularly 2 to 8 carbon atoms, which may have an oxygen atom, a nitrogen atom or a silicon atom. It is preferable to have.
- an alkylene group is selected from the group consisting of an alkylene group, an arylene group and a combination thereof, or a diorganosylylene group such as an ether-bonded oxygen atom, an amide bond, a carbonyl bond, an ester bond, and a dimethylsilylene group on these groups.
- a diorganosylylene group such as an ether-bonded oxygen atom, an amide bond, a carbonyl bond, an ester bond, and a dimethylsilylene group on these groups.
- Examples thereof include those having one or more types of structures interposed therebetween, for example.
- the bond on the left side is bonded to the silicon atom constituting the polysiloxane
- the bond on the right side is bonded to the perfluoroalkyl group, perfluorooxyalkyl group, perfluoroalkylene group or perfluorooxyalkylene group. Is preferable.
- the monovalent or divalent fluorine-containing organic group and the monovalent substituent bonded to the silicon atom other than the hydrogen atom directly connected to the silicon atom in the fluorine-containing organohydrogensiloxane of the component (B) are unsubstituted.
- it is an alkyl group having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms or an aryl group having 6 to 20 carbon atoms, preferably 6 to 12 carbon atoms, for example, a methyl group, an ethyl group, a propyl group, a butyl group, or a hexyl.
- Alkyl groups such as groups, cyclohexyl groups, octyl groups and decyl groups; aryl groups such as phenyl groups, trill groups and naphthyl groups, and some or all of the hydrogen atoms of these groups are halogen atoms such as chlorine atoms and cyano groups. Examples thereof include a chloromethyl group, a chloropropyl group, a cyanoethyl group and the like substituted with the above. Of these, a methyl group is preferred. It does not have an epoxy group or an alkoxy group.
- the structure of the fluorine-containing organohydrogensiloxane (B) component may be cyclic, chain-like, three-dimensional network-like, or a combination thereof.
- the number of silicon atoms of this fluorine-containing organohydrogensiloxane is not particularly limited, but is usually 2 to 60, preferably 3 to 30, and more preferably about 4 to 30.
- the component (B) has two or more SiH groups, preferably three or more SiH groups in one molecule, and the content of the SiH groups is preferably 0.0001 to 0.02 mol / g. More preferably, it is 0.0002 to 0.01 mol / g.
- Examples of the component (B) include those represented by the following general formulas (9) to (15).
- A is independently bonded to the silicon atom constituting the siloxane via the above-mentioned divalent hydrocarbon group which may have an oxygen atom, a nitrogen atom or a silicon atom. It is a valent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, and the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group is represented by the above general formula (4) or (5).
- R 6 is an unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms or an aryl having 6 to 20 carbon atoms, preferably 6 to 12 carbon atoms, independently of each other.
- M is an integer of 2 to 6, preferably an integer of 3 to 6
- n is an integer of 1 to 4, preferably an integer of 1 to 3
- m + n is an integer of 4 to 10. It is preferably an integer of 4 to 9.
- the order of bonding-(Si (H) (R 6 ) O)-and-(Si (A) (R 6 ) O)- is not limited.)
- A is independent of each other and is the same as A
- R 6 is independent of each other and is the same as R 6, and o is an integer of 2 to 50, preferably 3 to. It is an integer of 30.
- A is independent of each other and is the same as A
- R 6 is independent of each other and is the same as R 6.
- o is an integer of 2 to 50, preferably 3 to 30.
- P is an integer of 1 to 40, preferably an integer of 1 to 20, and o + p is an integer of 4 to 60, preferably an integer of 4 to 50.
- -(Si (H) ( R 6) O) - and - (Si (a) (R 6) O) - bond order of is not limited).
- A is independent of each other and is the same as A
- R 6 is independent of each other and is the same as R 6.
- o is an integer of 2 to 50, preferably 3 to 30.
- Q is an integer of 1 to 40, preferably an integer of 1 to 20, and
- o + q is an integer of 4 to 60, preferably an integer of 4 to 50.
- -(Si (H) The order of bonding R 6 ) O)-and-(Si (R 6 ) 2 O)-is not limited.
- A is independent of each other and is the same as A, and R 6 is independent of each other and is the same as R 6.
- o is an integer of 2 to 50, preferably 3 to 30.
- P is an integer of 1 to 40, preferably an integer of 1 to 20
- q is an integer of 1 to 40, preferably an integer of 1 to 20
- o + p + q is an integer of 5 to 60, preferably.
- the order of joining is not limited.
- D is a divalent perfluoro bonded to an adjacent silicon atom via a divalent hydrocarbon group which may have an oxygen atom, an alkylene group, or an oxygen atom or a nitrogen atom. It is an alkylene group or a divalent perfluorooxyalkylene group, and the divalent perfluoroalkylene group or the divalent perfluorooxyalkylene group is any one represented by the above general formulas (6) to (8). Group is mentioned. Also, A is independent of each other and is the same as A above, R 6 is independent of each other and is the same as R 6, and r is an integer of 0 to 3 and s. Is an integer of 0 to 3, r + s is an integer of 2 to 6, preferably an integer of 3 to 5.)
- component (B) examples include the following compounds. These compounds may be used alone or in combination of two or more. In the following formula, Me represents a methyl group and Ph represents a phenyl group. In addition, each siloxane unit may be randomly bonded.
- f' is an integer from 1 to 10.
- g' is an integer from 1 to 50.
- g' is an integer from 1 to 50.
- f' is an integer from 1 to 10.
- f' is an integer of 1 to 10
- g' is an integer of 1 to 50
- f' is an integer of 1 to 10
- g' is an integer of 1 to 50
- Each repeating unit shown in parentheses with k'and l' may be randomly combined.
- This component (B) may be used alone or in combination of two or more. Further, the blending amount of the component (B) is such that the hydrogen atom (SiH group) directly linked to the silicon atom in the component (B) is 0.5 with respect to 1 mol of the alkenyl group contained in the composition of the present invention. The amount is up to 3 mol, preferably 0.6 to 2 mol (molar ratio). If the number of SiH groups is less than 0.5 mol, the degree of cross-linking becomes insufficient, while if it is more than 3 mol, the storage stability is impaired and the heat resistance of the cured product obtained after curing is lowered.
- Component (C) is sodium fluoride, and the cured product obtained by curing the adhesive composition of the present invention has a function of improving the rubber strength without significantly impairing the light transmission (transparency).
- a commercially available product can be used as sodium fluoride.
- Examples of commercially available sodium fluoride products include “sodium fluoride” sold by Stella Chemifa.
- the blending amount of the component (C) is 0.1 to 120 parts by mass, preferably 1 to 100 parts by mass, and more preferably 20 to 80 parts by mass with respect to 100 parts by mass of the component (A). is there. If it is less than 0.1 parts by mass, the rubber strength cannot be sufficiently improved, while if it is more than 120 parts by mass, the fluidity of the composition of the present invention and the transparency of the cured product may be impaired.
- the platinum group metal-based catalyst as the component (D) is a hydrosilylation reaction catalyst.
- the hydrosilylation reaction catalyst contains an alkenyl group contained in the composition, particularly an alkenyl group in the component (A), and a SiH group contained in the composition, particularly the components (B) and (E). It is a catalyst that promotes the addition reaction with the SiH group.
- This hydrosilylation reaction catalyst is generally a noble metal or a compound thereof, and since it is expensive, platinum or a platinum compound which is relatively easily available is often used.
- platinum compound examples include a complex of chloroplatic acid, a complex of chloroplatinic acid and an olefin such as ethylene, a complex of platinum and an alcohol or vinylsiloxane, and a metallic platinum supported on silica, alumina, carbon or the like.
- Rhodium, ruthenium, iridium, and palladium-based compounds are also known as platinum group metal-based catalysts other than platinum or platinum compounds.
- RhCl (PPh 3 ) 3 , RhCl (CO) (PPh 3 ) 2 , Ru 3 Examples thereof include CO) 12 , IrCl (CO) (PPh 3 ) 2 , Pd (PPh 3 ) 4, and the like.
- Ph is a phenyl group.
- chloroplatinic acid or a complex is used, for example, toluene or ethanol. It is preferable to use the compound dissolved in an appropriate solvent of (A) by dissolving it in the linear polyfluoro compound of the component (A).
- the blending amount of the component (D) is an effective amount as a hydrosilylation reaction catalyst, and is usually 0.1 to 2,000 ppm, preferably 0.1 to 500 ppm, particularly preferably 0.1 to 2,000 ppm based on the mass of the component (A). It is 0.5 to 200 ppm (mass equivalent of platinum group metal atom), but can be appropriately increased or decreased depending on the desired curing rate.
- the component (E) may contain a hydrogen atom (SiH group) directly linked to a silicon atom, a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, and an oxygen atom in one molecule.
- a hydrogen atom SiH group
- It is an organopolysiloxane having an epoxy group, a trialkoxysilyl group, or both bonded to a silicon atom via a hydrocarbon group of the present invention, and imparts self-adhesiveness to a cured product obtained by curing the composition of the present invention. It has a function as an adhesion imparting agent.
- the structure of the organopolysiloxane of the component (E) may be cyclic, chain-like, three-dimensional network-like, or a combination thereof, but is preferably a cyclic structure.
- the number of silicon atoms in this organopolysiloxane is not particularly limited, but is usually 2 to 60, preferably 3 to 30, and more preferably about 4 to 30.
- the component (E) has one or more SiH groups in one molecule, and the content of the SiH groups is preferably 0.00001 to 0.02 mol / g, and 0.0001 to 0. 01 mol / g is more preferable.
- the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group is a group introduced from the viewpoint of compatibility with the component (A), dispersibility, uniformity after curing, and the like.
- Examples of the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group include the groups represented by the above-mentioned general formula (4) or (5).
- the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group constitutes a polysiloxane via a divalent hydrocarbon group (linking group) which may contain a silicon atom, an oxygen atom and a nitrogen atom. It is preferable that the divalent hydrocarbon group is connected to a silicon atom, and the divalent hydrocarbon group includes an alkylene group, an arylene group and a combination thereof, or an ether bond oxygen atom, an amide bond, a carbonyl bond and an ester bond to these groups. , And one or more structures selected from the group consisting of diorganosylylene groups such as dimethylsilylene group may be interposed, for example.
- the bond on the left side is bonded to the silicon atom constituting the polysiloxane, and the bond on the right side is bonded to a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group.
- Examples of the epoxy group bonded to the silicon atom via the divalent hydrocarbon group which may contain an oxygen atom include the epoxy group represented by the following general formula (17) and the following general formula (18). Examples thereof include an alicyclic epoxy group such as an epoxycyclohexyl group. (In the formula, R 8 is a divalent hydrocarbon group that may contain an oxygen atom.)
- R 8 is a divalent hydrocarbon group having 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, which may contain an oxygen atom.
- alkylene groups such as methylene group, ethylene group, propylene group, butylene group, hexylene group and octylene group, cycloalkylene group such as cyclohexylene group, oxy such as oxyethylene group, oxypropylene group and oxybutylene group.
- alkylene groups such as methylene group, ethylene group, propylene group, butylene group, hexylene group and octylene group, cycloalkylene group such as cyclohexylene group, oxy such as oxyethylene group, oxypropylene group and oxybutylene group.
- epoxy group via a divalent hydrocarbon group that may contain such an oxygen atom examples include those shown below.
- examples of the trialkoxysilyl group bonded to the silicon atom via the divalent hydrocarbon group which may contain the oxygen atom include those represented by the following general formula (19). -R 9- Si (OR 10 ) 3 (19) (In the formula, R 9 is a divalent hydrocarbon group that may contain an oxygen atom, and R 10 is an alkyl group.)
- R 9 is preferably a divalent hydrocarbon group having 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and specifically, a methylene group, an ethylene group, or a propylene group. , Butylene group, hexylene group, cyclohexylene group, alkylene group such as octylene group and the like.
- R 10 is preferably an alkyl group having 1 to 8 carbon atoms, more preferably 1 to 4 carbon atoms, and specific examples thereof include a methyl group, an ethyl group and an n-propyl group.
- trialkoxysilyl group via a divalent hydrocarbon group that may contain such an oxygen atom include those shown below. -(CH 2 ) 2- Si (OCH 3 ) 3 , -(CH 2 ) 3- Si (OCH 3 ) 3 , -(CH 2 ) 2- Si (OCH 2 CH 3 ) 3 , -(CH 2 ) 3- Si (OCH 2 CH 3 ) 3
- the organopolysiloxane of the component (E) contains a hydrogen atom (SiH group) directly linked to the silicon atom, a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, and an oxygen atom.
- the monovalent substituent bonded to a silicon atom other than the epoxy group bonded to the silicon atom or the trialkoxysilyl group via a divalent hydrocarbon group may have 1 to 20 unsubstituted or substituted carbon atoms, preferably.
- Alkyl group of 1 to 12 or an aryl group having 6 to 20 carbon atoms, preferably 6 to 12, such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, a cyclohexyl group, an octyl group, a decyl group and the like.
- Alkyl group Aryl group such as phenyl group, tolyl group, naphthyl group, and part or all of hydrogen atom of these group is substituted with halogen atom such as chlorine atom, cyano group, etc., for example, chloromethyl group. , Chloropropyl group, cyanoethyl group and the like. Among these, a methyl group and an ethyl group are preferable.
- a cyclic organopolysiloxane represented by the following general formula (16) is preferable.
- t is an integer of 1 to 6, preferably an integer of 1 to 5, more preferably 1 or 2
- u is an integer of 1 to 4, preferably an integer of 1 to 3.
- v is an integer of 1 to 4, preferably an integer of 1 to 3, t + u + v is an integer of 4 to 10, preferably an integer of 4 to 8, and R 7 is independent of each other and is unsubstituted or substituted.
- E contains a silicon atom, an oxygen atom and a nitrogen atom independently of each other. It may be a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group bonded to a silicon atom via a divalent hydrocarbon group, and G may contain an oxygen atom independently of each other. of an epoxy group or trialkoxysilyl group bonded to a silicon atom via a hydrocarbon group, however, -. (SiO) (H ) R 7 -, - (SiO) (E) R 7 -, and - (SiO ) (G)
- the order of R 7- bonding is not limited.
- R 7 is an unsubstituted or substituted alkyl group having 1 to 20, preferably 1 to 12 or an aryl group having 6 to 20, preferably 6 to 12, independently of each other.
- a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, and a divalent hydrocarbon group which may contain an oxygen atom examples thereof include the same groups as those exemplified as the monovalent substituent bonded to the silicon atom other than the epoxy group bonded to the silicon atom or the trialkoxysilyl group, and the methyl group and the ethyl group are preferable.
- E is a monovalent perfluoroalkyl group or a monovalent per, which is independently bonded to a silicon atom via the above-mentioned divalent hydrocarbon group which may contain a silicon atom, an oxygen atom and a nitrogen atom. It is a fluorooxyalkyl group, and examples of the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group include the groups represented by the above-mentioned general formula (4) or (5), which are silicon atoms.
- the divalent hydrocarbon group which may contain an oxygen atom and a nitrogen atom includes the above-mentioned alkylene group, arylene group and a combination thereof, or an ether bond oxygen atom, an amide bond, a carbonyl bond, an ester bond and a combination thereof to these groups.
- Examples thereof include one or more structures selected from the group consisting of diorganosylylene groups such as dimethylsilylene groups.
- G is an epoxy group or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group which may contain an oxygen atom independently of each other, and is represented by the above formulas (17) to (19). The groups represented are mentioned.
- each siloxane unit may be randomly bonded.
- g is an integer from 1 to 50.
- g is an integer from 1 to 50.
- g is an integer from 1 to 50.
- This component (E) may be used alone or in combination of two or more.
- the amount of the component (E) used is in the range of 0.1 to 20 parts by mass, preferably in the range of 0.1 to 10 parts by mass, more preferably in the range of 0.1 to 20 parts by mass with respect to 100 parts by mass of the component (A). It is in the range of 0.5 to 8 parts by mass. If it is less than 0.1 parts by mass, sufficient adhesiveness cannot be obtained, and if it exceeds 20 parts by mass, the physical strength of the cured product obtained by curing the composition of the present invention decreases.
- the present invention relates to 1 mol of the total number of alkenyl groups contained in the composition of the present invention (for example, the total number of alkenyl groups contained in the component (A) and any component described later).
- the total number of hydrogen atoms (SiH groups) directly linked to the silicon atoms contained in the composition is 0.51 to 3.5 mol.
- the amount (molar ratio) is preferably 0.6 to 2.5 mol.
- a hydrosilylation addition reaction control agent (( F) component) inorganic filler, plasticizer, viscosity modifier, flexibility-imparting agent, and a cured product obtained by curing the composition of the present invention by improving the adhesive-imparting ability of the component (E).
- various compounding agents such as an adhesion promoter such as a carboxylic acid anhydride can be added as needed. The blending amount of these additives is arbitrary as long as the object of the present invention is not impaired.
- hydrosilylation addition reaction regulator examples include 1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyne-3-ol, and 3,5-dimethyl-1-hexin-3-.
- Acetylene alcohols such as oar, 3-methyl-1-penten-3-ol, and phenylbutynol; monovalent perfluoroalkyl groups represented by the above general formula (4), or represented by the above general formula (5).
- inorganic fillers examples include fumigant silica (humped silica or dry silica), precipitated silica (wet silica), spherical silica (molten silica), solgel method silica, silica powder such as silica aerogel, or the silica powder.
- a silica-based reinforcing filler such as silica powder retreated with organosilane having a monovalent perfluorooxyalkyl group represented by the above general formula (5) or organosiloxane, quartz powder, molten quartz powder, etc.
- Reinforcing or semi-reinforcing fillers such as diatomaceous soil and calcium carbonate, inorganic pigments such as titanium oxide, iron oxide, carbon black and cobalt aluminate, titanium oxide, iron oxide, carbon black, cerium oxide, cerium hydroxide and zinc carbonate.
- Heat resistance improver such as magnesium carbonate and manganese carbonate, heat conductivity imparting agent such as alumina, boron nitride, silicon dioxide and metal powder, and conductivity imparting agent such as carbon black, silver powder and conductive zinc flower. ..
- plasticizer examples include linear polyfluoro compounds represented by the following general formulas (20) and (21), and / or poly represented by the following general formula (22). Fluoromonoalkenyl compounds can be used.
- J is a group represented by C x F 2x + 1- (x is an integer of 1 to 3), w is an integer of 1 to 500, and preferably an integer of 2 to 300. Is.)
- J is the same as above, y and z are integers of 0 to 300, respectively, preferably integers of 0 to 150, except when both y and z are 0. Further, ⁇ is an integer of 1 to 300, preferably an integer of 1 to 150. Each repeating unit may be randomly connected to each other.
- Rf- (L) ⁇ -CH CH 2 (22) [In the formula (22), Rf is the following general formula (23). F- [CF (CF 3 ) CF 2 O] ⁇ - C ⁇ F 2 ⁇ - (23) (In equation (23), ⁇ is an integer of 1 to 200, preferably an integer of 1 to 150, and ⁇ is an integer of 1 to 3.) L is -CH 2- , -OCH 2- , -CH 2 OCH 2- or -CO-NR 11 -M- [In each of these groups, the left end is Rf and the right end is carbon. Bonded to an atom.
- R 11 is a hydrogen atom, methyl, phenyl or an allyl group
- M is -CH 2 -, a group represented by the group or the following structural formula represented by the following structural formula (24) (25).
- It is a dimethylphenylsilylene group represented by the o-position, m-position or p-position, and the left end is bonded to a nitrogen atom and the right end is bonded to a carbon atom.
- ⁇ is 0 or 1.
- linear polyfluoro compound represented by the general formula (20) or (21) include the following.
- Each repeating unit may be randomly combined.
- Each repeating unit may be randomly combined.)
- the linear polyfluoro compound represented by the general formula (20) or (21) may be used alone or in combination of two or more.
- polyfluoromonoalkenyl compound represented by the general formula (22) include the following. (Here, ⁇ 'is an integer from 1 to 200.)
- the polyfluoromonoalkenyl compound represented by the above general formula (22) may be used alone or in combination of two or more.
- the method for producing the adhesive composition of the present invention is not particularly limited, and it can be produced by kneading the above components (A) to (E), the optional component (F), and other optional components. ..
- a mixing device such as a planetary mixer, a loss mixer, a hobert mixer, or a kneading device such as a kneader or a three-roll mill can be used.
- composition of the adhesive composition of the present invention as a so-called one-component type in which the above components (A) to (E), the optional component (F), and all other optional components are treated as one composition. It may be configured, or it may be a two-component type and both may be mixed at the time of use.
- the composition may be used in an appropriate fluorine-based solvent, for example, 1,3-bis (trifluoromethyl) benzene, or Fluorinert (manufactured by 3M) according to its use and purpose.
- fluorine-based solvent for example, 1,3-bis (trifluoromethyl) benzene, or Fluorinert (manufactured by 3M) according to its use and purpose.
- Fluorinert manufactured by 3M
- Perfluorobutyl methyl ether, perfluorobutyl ethyl ether and the like may be dissolved in a desired concentration before use.
- the total light transmittance of the cured product having a thickness of 2 mm obtained by curing the adhesive composition of the present invention is preferably 80% or more (80 to 100%), and more preferably 85 to 100%. .. If the total light transmittance is less than 80%, there is a possibility that a defect in optical function may occur when used in an optical component.
- the total light transmittance is measured according to JIS K7361-1.
- the above-mentioned component (A) The blending amount of sodium fluoride of the component (C) with respect to 100 parts by mass of the alkenyl group-containing linear polyfluoro compound is within the specific range specified in the present invention (that is, 0.1 to 120 parts by mass, preferably 1 to 1 to 1 to 120 parts by mass. It can be achieved by 100 parts by mass, more preferably 20 to 80 parts by mass).
- the adhesive composition of the present invention can be easily cured by leaving it at room temperature or heating it. In this case, it is usually preferable to thermally cure at room temperature (for example, 5 to 35 ° C.) to 200 ° C. for 1 minute to 24 hours.
- the cured product (fluoropolyether-based rubber elastic body) obtained by curing the adhesive composition of the present invention is excellent in heat resistance, oil resistance, chemical resistance, solvent resistance, low temperature characteristics, low moisture permeability, etc. Further, it has good light transmittance, good adhesiveness to various substrates, and excellent rubber strength, so that it is particularly suitable as an adhesive material used for optical parts. Specifically, light guide plates, backlights, liquid crystal display elements, display substrates such as color filters and EL display element substrates, surface protection films, light diffusion films, retardation films, transparent conductive films, antireflection films, OHP films.
- Optical materials used for optical fibers, optical fibers, lenses, etc. encapsulants that protect electrical and electronic components such as optical semiconductor elements such as rectifying diodes, light emitting diodes, LSIs, and organic EL, and images equipped with light reflection sensors. Examples thereof include a surface layer material of a fixing member in a forming device.
- the adhesive composition of the present invention has good adhesiveness to various substrates such as metals such as aluminum, plastics (organic resins) such as epoxy glass resin, and inorganic substances such as glass. ..
- the degree of polymerization of component (A) is a number average degree of polymerization calculated from 19 F-NMR, and the viscosity of component (A) shows a measured value at 23 ° C. (based on JIS K6249).
- Example 1 to 4 Comparative Examples 1 to 4
- the components (A) to (F) used in the following Examples and Comparative Examples are shown below.
- the vinyl group content of component (A) was calculated from 1 H-NMR using an internal standard substance.
- Component (D) (D-1): Toluene solution of platinum-divinyltetramethyldisiloxane complex (platinum concentration 0.5% by mass)
- E-1 Organopolysiloxane represented by the following formula (30) (SiH group content 0.00101 mol / g)
- E-2) Organopolysiloxane represented by the following formula (31) (SiH group content 0.00226 mol / g)
- E-3) Organopolysiloxane represented by the following formula (32) (SiH group content 0.00116 mol / g)
- Component (F) (F-1) 50% by mass toluene solution of 1-ethynyl-1-hydroxycyclohexane
- Example 1 to 4 and Comparative Examples 1 to 4 the compositions were prepared as follows using the predetermined amounts of each component shown in Table 1. Further, according to the following method, the composition was molded and cured to prepare a cured product, and the rubber physical characteristics and total light transmittance of the cured product were measured. The results are shown in Table 1.
- compositions of Examples 1-4 First, the components (A) and (C) are kneaded in the predetermined amounts shown in Table 1 at room temperature for 1 hour using a planetary mixer, and further kneaded at 150 ° C. for 1 hour under a reduced pressure of ⁇ 98.0 kPaG. did. Next, the kneaded product was cooled to room temperature and then subjected to a three-roll mill treatment. The component (D) was added to the kneaded product in a predetermined amount shown in Table 1 and kneaded at room temperature for 10 minutes, and then the component (F) was added in a predetermined amount shown in Table 1 and kneaded at room temperature for 10 minutes. Finally, the components (B) and (E) were added in the predetermined amounts shown in Table 1 and kneaded at room temperature for 10 minutes to obtain a composition.
- compositions of Comparative Examples 1 to 3 First, the components (A) and (D) were kneaded in the predetermined amounts shown in Table 1 at room temperature for 10 minutes using a planetary mixer. Next, the predetermined amount of the component (F) shown in Table 1 is added to the kneaded product, and the mixture is kneaded at room temperature for 10 minutes. Finally, the predetermined amounts of the component (B) and the component (E) are shown in Table 1. In addition, it was kneaded at room temperature for 10 minutes to obtain a composition.
- the component (D) was added to the kneaded product in a predetermined amount shown in Table 1 and kneaded at room temperature for 10 minutes, and then the component (F) was added in a predetermined amount shown in Table 1 and kneaded at room temperature for 10 minutes. Finally, the components (B) and (E) were added in the predetermined amounts shown in Table 1 and kneaded at room temperature for 10 minutes to obtain a composition.
- Rubber properties of cured products of Examples 1 to 4 and Comparative Examples 1 to 4 Using the above-mentioned cured sheet, the hardness was measured according to JIS K6253-3, and the tensile strength and elongation at cutting were measured according to JIS K6251. The results are shown in Table 1.
- Total light transmittance of cured products of Examples 1 to 4 and Comparative Examples 1 to 4 Using the above-mentioned cured sheet, the total light transmittance was measured with a haze meter HGM-2 (manufactured by Suga Test Instruments Co., Ltd.) according to JIS K7361-1. The results are shown in Table 1.
- Tensile-shear adhesive strength of Examples 1 to 4 and Comparative Examples 1 to 4 Two 100 mm x 25 mm test panels of various adherends (aluminum, epoxy glass resin and glass) are layered with a 1 mm thick composition of Examples and Comparative Examples so that their ends overlap by 10 mm. (Length 10 mm ⁇ width 25 mm ⁇ thickness 1 mm) were sandwiched and superposed, and the composition was cured by heating at 150 ° C. for 1 hour to prepare an adhesion test piece. Next, a tensile shear adhesion test (tensile speed 50 mm / min) was performed on this test piece to evaluate the adhesive strength (shear adhesive force) and the cohesive fracture rate. The results are shown in Table 2.
- the cured product obtained by curing the compositions of Examples 1 to 4 satisfying the requirements of the present invention is more than the cured product obtained by curing the compositions of Comparative Examples 1 to 3 containing no component (C).
- C no component
- the hardness, tensile strength and elongation at the time of cutting were high, while the total light transmittance did not decrease so much, it was 80% or more, and it showed good adhesiveness to various adherends.
- the cured product obtained by curing the composition of Comparative Example 4 showed good adhesiveness to various adherends, and the hardness, tensile strength and elongation at the time of cutting were high due to the blended spherical silica particles.
- the total light transmittance was extremely low.
- the adhesive composition of the present invention is particularly useful as a material for optical parts because it gives a cured product having good light transmittance and good adhesiveness and excellent rubber strength.
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Abstract
Description
[1]
(A)1分子中に2個以上のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有する直鎖状ポリフルオロ化合物:100質量部、
(B)1分子中に、1価のパーフルオロアルキル基若しくは1価のパーフルオロオキシアルキル基を有するか、又は2価のパーフルオロアルキレン基若しくは2価のパーフルオロオキシアルキレン基を有し、さらにケイ素原子に直結した水素原子(SiH基)を2個以上有し、かつ分子中にエポキシ基及びケイ素原子に直結したアルコキシ基を有さない含フッ素オルガノ水素シロキサン、
(C)フッ化ナトリウム:0.1~120質量部、
(D)白金族金属系触媒:(A)成分に対して白金族金属原子の質量換算で0.1~2,000ppm
(E)1分子中に、ケイ素原子に直結した水素原子(SiH基)と、1価のパーフルオロアルキル基又は1価のパーフルオロオキシアルキル基と、酸素原子を含んでもよい2価の炭化水素基を介してケイ素原子に結合したエポキシ基若しくはトリアルコキシシリル基又はその両方とを有するオルガノポリシロキサン:0.1~20質量部
を含有する硬化性フルオロポリエーテル系接着剤組成物であって、前記(B)成分の配合量が、該組成物中に含まれるアルケニル基1モルに対して、前記(B)成分中のケイ素原子に直結した水素原子が0.5~3モルとなる量であることを特徴とする硬化性フルオロポリエーテル系接着剤組成物。
[2]
前記(A)成分の直鎖状ポリフルオロ化合物のアルケニル基含有量が、0.005~0.3モル/100gである[1]に記載の硬化性フルオロポリエーテル系接着剤組成物。
[3]
前記(A)成分が有するパーフルオロポリエーテル構造が、下記一般式(1)
-(CaF2aO)b- (1)
(式(1)中、aは1~6の整数であり、bは4~302の整数である。)
で表される構造を含む[1]又は[2]に記載の硬化性フルオロポリエーテル系接着剤組成物。
[4]
前記(A)成分が、下記一般式(2)
及び/又は下記一般式(3)
で表される直鎖状ポリフルオロ化合物である[1]~[3]のいずれかに記載の硬化性フルオロポリエーテル系接着剤組成物。
[5]
前記(E)成分が、下記一般式(16)
で表される環状オルガノポリシロキサンである[1]~[4]のいずれかに記載の硬化性フルオロポリエーテル系接着剤組成物。
[6]
JIS K7361-1に準じて測定される2mm厚の全光線透過率が80%以上である硬化物を与えるものである[1]~[5]のいずれかに記載の硬化性フルオロポリエーテル系接着剤組成物。
[7]
[1]~[6]のいずれかに記載の硬化性フルオロポリエーテル系接着剤組成物の硬化物を有する光学部品。
<硬化性フルオロポリエーテル系接着剤組成物>
本発明の硬化性フルオロポリエーテル系接着剤組成物は、以下の(A)~(E)成分を含有してなるものである。
(A)成分は、1分子中に2個以上のアルケニル基を有し、さらに主鎖中にパーフルオロポリエーテル構造を有する直鎖状ポリフルオロ化合物である。
-CaF2aO-
(式中、aは1~6の整数である。)
で表される繰り返し単位を多数含むものであり、例えば下記一般式(1)で表されるもの等が挙げられる。
-(CaF2aO)b- (1)
(式(1)中、aは1~6の整数であり、bは4~302の整数、好ましくは8~202の整数である。)
-CF2O-、
-CF2CF2O-、
-CF(CF3)O-、
-CF2CF2CF2O-、
-CF(CF3)CF2O-、
-CF2CF2CF2CF2O-、
-CF2CF2CF2CF2CF2CF2O-、
-C(CF3)2O-
で表される単位等が挙げられる。
-CF2O-、
-CF2CF2O-、
-CF2CF2CF2O-、
-CF(CF3)CF2O-
で表される繰り返し単位が好適である。
なお、R1は互いに独立し、R2も互いに独立し、R1及びR2の合計6個のうち2個以上(2~6個)はアルケニル基であるが、R1、R2のそれぞれ1個以上(即ち、R1、R2のそれぞれ1~3個)がアルケニル基、特にはビニル基又はアリル基であることが好ましい。
(B)成分は、1分子中に、1価のパーフルオロアルキル基若しくは1価のパーフルオロオキシアルキル基を有するか、又は2価のパーフルオロアルキレン基若しくは2価のパーフルオロオキシアルキレン基を有し、さらにケイ素原子に直結した水素原子(SiH基)を2個以上有し、かつ分子中にエポキシ基及びケイ素原子に直結したアルコキシ基を有さない含フッ素オルガノ水素シロキサンであり、好ましくは1分子中に上記1価又は2価の含フッ素有機基を1個以上及びケイ素原子に直結した水素原子を2個以上有し、かつエポキシ基や、ケイ素原子に直結したアルコキシ基等のSiH基以外のその他の官能性基を有さない含フッ素オルガノ水素シロキサンであり、上記(A)成分の架橋剤として機能するものである。
但し、ここで「その他の官能性基」とは、パーフルオロアルキル基、パーフルオロオキシアルキル基、パーフルオロアルキレン基又はパーフルオロオキシアルキレン基とポリシロキサンを構成するケイ素原子とを連結する2価の連結基中に含有してもよいエーテル結合酸素原子、アミド結合、カルボニル結合、エステル結合などの2価の極性基(極性構造)等は除くものとする。
なお、(B)成分は分子中にエポキシ基及びケイ素原子に直結したアルコキシ基(アルコキシシリル基)を有さないものである点において、後述する接着付与剤としての(E)成分とは明確に区別されるものである。
CfF2f+1- (4)
(式(4)中、fは1~10の整数、好ましくは3~7の整数である。)
-ChF2h- (6)
(式(6)中、hは1~20の整数、好ましくは2~10の整数である。)
-CF2O-(CF2CF2O)k(CF2O)l-CF2- (8)
(式(8)中、k及びlはそれぞれ1~50の整数、好ましくは1~30の整数であり、k+lの平均値は2~100、好ましくは2~60である。各繰り返し単位同士はランダムに結合されていてよい。)
-CH2CH2-、
-CH2CH2CH2-、
-CH2CH2CH2OCH2-、
-CH2CH2CH2-NH-CO-、
-CH2CH2CH2-N(Ph)-CO-、
-CH2CH2CH2-N(CH3)-CO-、
-CH2CH2CH2-N(CH2CH3)-CO-、
-CH2CH2CH2-N(CH(CH3)2)-CO-、
-CH2CH2CH2-O-CO-、
-CH2CH2-Si(CH3)2-Ph’-N(CH3)-CO-、
-CH2CH2CH2-Si(CH3)2-Ph’-N(CH3)-CO-
(但し、Phはフェニル基、Ph’はフェニレン基である。)
等の炭素数2~13のものが挙げられる。なお、上記の構造において、左側の結合手はポリシロキサンを構成するケイ素原子と、右側の結合手はパーフルオロアルキル基、パーフルオロオキシアルキル基、パーフルオロアルキレン基又はパーフルオロオキシアルキレン基と結合することが好ましい。
また、(B)成分は、1分子中にSiH基を2個以上、好ましくは3個以上有するものであり、該SiH基の含有量は、0.0001~0.02モル/gが好ましく、さらに好ましくは0.0002~0.01モル/gである。
(C)成分は、フッ化ナトリウムであり、本発明の接着剤組成物を硬化して得られる硬化物に、光透過性(透明性)をさほど損なわずにゴム強度を向上させる機能を有する。
(D)成分である白金族金属系触媒は、ヒドロシリル化反応触媒である。ヒドロシリル化反応触媒は、組成物中に含有されるアルケニル基、特には(A)成分中のアルケニル基と、組成物中に含有されるSiH基、特には(B)成分及び(E)成分中のSiH基との付加反応を促進する触媒である。このヒドロシリル化反応触媒は、一般に貴金属又はその化合物であり、高価格であることから、比較的入手し易い白金又は白金化合物がよく用いられる。
(E)成分は、1分子中に、ケイ素原子に直結した水素原子(SiH基)と、1価のパーフルオロアルキル基又は1価のパーフルオロオキシアルキル基と、酸素原子を含んでもよい2価の炭化水素基を介してケイ素原子に結合したエポキシ基若しくはトリアルコキシシリル基又はその両方とを有するオルガノポリシロキサンであり、本発明の組成物を硬化して得られる硬化物に自己接着性を与える接着付与剤としての機能を有する。
また、(E)成分は、1分子中にSiH基を1個以上有するものであり、該SiH基の含有量は、0.00001~0.02モル/gが好ましく、0.0001~0.01モル/gがより好ましい。
-CH2CH2-、
-CH2CH2CH2-、
-CH2CH2CH2OCH2-、
-CH2CH2CH2-NH-CO-、
-CH2CH2CH2-N(Ph)-CO-、
-CH2CH2CH2-N(CH3)-CO-、
-CH2CH2CH2-N(CH2CH3)-CO-、
-CH2CH2CH2-N(CH(CH3)2)-CO-、
-CH2CH2CH2-O-CO-、
-CH2CH2CH2-Si(CH3)2-O-Si(CH3)2-CH2CH2CH2-、
-CH2OCH2CH2CH2-Si(CH3)2-O-Si(CH3)2-CH2CH2-、
-CO-N(CH3)-Ph’-Si(CH3)2-CH2CH2-、
-CO-N(CH3)-Ph’-Si(CH3)2-CH2CH2-Si(CH3)2-O-Si(CH3)2-CH2CH2-、
-CO-NH-Ph’-[Si(CH3)2-CH2CH2]3-CH2-、
-CO-N(CH3)-Ph’-[Si(CH3)2-CH2CH2]3-
(但し、Phはフェニル基、Ph’はフェニレン基である。)
等の炭素数2~20のものが挙げられる。なお、上記の構造において、左側の結合手はポリシロキサンを構成するケイ素原子と、右側の結合手は1価のパーフルオロアルキル基又は1価のパーフルオロオキシアルキル基と結合することが好ましい。
-CH2CH2CH2OCH2-、
-CH2CH2CH2-O-CO-
-R9-Si(OR10)3 (19)
(式中、R9は酸素原子を含んでもよい2価の炭化水素基であり、R10はアルキル基である。)
-(CH2)2-Si(OCH3)3、
-(CH2)3-Si(OCH3)3、
-(CH2)2-Si(OCH2CH3)3、
-(CH2)3-Si(OCH2CH3)3
本発明の硬化性フルオロポリエーテル系接着剤組成物には、その実用性を高めるために、上記の(A)~(E)成分以外にも、任意成分として、ヒドロシリル化付加反応制御剤((F)成分)、無機質充填剤、可塑剤、粘度調節剤、可撓性付与剤、さらに、上記(E)成分の接着付与能力を向上させ、本発明の組成物を硬化して得られる硬化物の自己接着性発現を促進させる目的で、カルボン酸無水物などの接着促進剤等の各種配合剤を必要に応じて添加することができる。これら添加剤の配合量は、本発明の目的を損なわない範囲で任意である。
(式(20)中、JはCxF2x+1-(xは1~3の整数)で表される基であり、wは1~500の整数であり、好ましくは2~300の整数である。)
(式(21)中、Jは上記と同じであり、y及びzはそれぞれ0~300の整数であり、好ましくは0~150の整数である。但し、yとzが共に0の場合を除く。また、αは1~300の整数であり、好ましくは1~150の整数である。各繰り返し単位同士はランダムに結合されていてよい。)
[式(22)中、Rfは下記一般式(23)
F-[CF(CF3)CF2O]γ-CδF2δ- (23)
(式(23)中、γは1~200の整数、好ましくは1~150の整数であり、δは1~3の整数である。)
で示される基であり、Lは-CH2-、-OCH2-、-CH2OCH2-又は-CO-NR11-M-〔なお、これら各基は、左端がRfに、右端が炭素原子に結合される。また、R11は水素原子、メチル基、フェニル基又はアリル基であり、Mは-CH2-、下記構造式(24)で示される基又は下記構造式(25)で示される基である。
F-(CF2CF2CF2O)w’-CF2CF3
(w’は1~200の整数である。)
CF3-{(OCF(CF3)CF2)y’-(OCF2)α’}-O-CF3
(y’は1~200の整数、α’は1~200の整数である。各繰り返し単位同士はランダムに結合されていてよい。)
CF3-{(OCF2CF2)z’-(OCF2)α’}-O-CF3
(z’は1~200の整数、α’は1~200の整数である。各繰り返し単位同士はランダムに結合されていてよい。)
本発明の接着剤組成物の製造方法は特に制限されず、上記(A)~(E)成分、任意成分である(F)成分、及びその他の任意成分を練り合わせることにより製造することができる。本発明においては、上記(A)成分と(C)成分とを予め混合することが好ましい。その際、必要に応じて、プラネタリーミキサー、ロスミキサー、ホバートミキサー等の混合装置、ニーダー、3本ロールミル等の混練装置を使用することができる。
本発明の接着剤組成物を硬化して得られる2mm厚の硬化物の全光線透過率は、80%以上(80~100%)であることが好ましく、85~100%であることがより好ましい。該全光線透過率が80%未満の場合、光学部品に用いると光学的機能の不具合が発生するおそれがある。なお、該全光線透過率はJIS K7361-1に準じて測定される。また、上述した全光線透過率を80%以上とするためには、本発明の(A)~(E)成分を含有してなる特定組成の接着剤組成物において、特に、上記(A)成分のアルケニル基含有直鎖状ポリフルオロ化合物100質量部に対する(C)成分のフッ化ナトリウムの配合量を本発明で規定する特定の範囲内(即ち、0.1~120質量部、好ましくは1~100質量部、より好ましくは20~80質量部)とすることによって達成することができる。
本発明の接着剤組成物を硬化して得られる硬化物(フルオロポリエーテル系ゴム弾性体)は、耐熱性、耐油性、耐薬品性、耐溶剤性、低温特性、低透湿性等に優れ、さらに、良好な光透過性と各種基材に対する良好な接着性を有し、かつゴム強度に優れることから、特に光学部品に用いる接着材料として好適である。具体的には、導光板、バックライト、液晶表示素子、カラーフィルターやEL表示素子基板等のディスプレイ基板、表面保護フィルム、光拡散フィルム、位相差フィルム、透明導電性フィルム、反射防止フィルム、OHPフィルム、光ディスク、光ファイバー、レンズ等に使用する光学材料や整流用ダイオード、発光ダイオード、LSI、有機EL等の光半導体素子などの電気電子部品を保護する封止材、さらに、光反射センサーを搭載した画像形成装置における定着部材の表層材などが挙げられる。
なお、本発明の接着剤組成物は、特にアルミニウム等の金属やエポキシガラス樹脂等のプラスチック(有機樹脂)、さらにガラス等の無機物などの各種基材に対して良好な接着性を有するものである。
下記実施例及び比較例に用いられる(A)~(F)成分を下記に示す。なお、(A)成分のビニル基含有量は内部標準物質を用いて1H-NMRから算出したものである。
(A-1):下記式(26)で示される直鎖状ポリフルオロ化合物(粘度4,010mPa・s、ビニル基含有量0.0301モル/100g)
(A-2):下記式(27)で示される直鎖状ポリフルオロ化合物(粘度11,000mPa・s、ビニル基含有量0.0119モル/100g)
(B-1):下記式(28)で示される含フッ素オルガノ水素シロキサン(SiH基含有量0.00394モル/g)
(C-1):ステラケミファ社製フッ化ナトリウム
(D-1):白金-ジビニルテトラメチルジシロキサン錯体のトルエン溶液(白金濃度0.5質量%)
(E-1):下記式(30)で示されるオルガノポリシロキサン(SiH基含有量0.00101モル/g)
(F-1):1-エチニル-1-ヒドロキシシクロヘキサンの50質量%トルエン溶液
まず(A)成分及び(C)成分を、表1に示す所定の量にて、プラネタリーミキサーを用いて室温で1時間混練し、さらに-98.0kPaGの減圧下、150℃で1時間混練した。次に、混練物を室温まで冷却後、3本ロールミル処理を施した。該混練物に(D)成分を表1に示す所定の量加えて、室温で10分間混練した後、(F)成分を表1に示す所定の量加えて、室温で10分間混練した。最後に、(B)成分及び(E)成分を表1に示す所定の量加えて、室温で10分間混練し、組成物を得た。
まず(A)成分及び(D)成分を、表1に示す所定の量にて、プラネタリーミキサーを用いて室温で10分間混練した。次に、該混練物に(F)成分を表1に示す所定の量加えて、室温で10分間混練した後、最後に、(B)成分及び(E)成分を表1に示す所定の量加えて、室温で10分間混練し、組成物を得た。
まず(A)成分及び球状シリカ粒子(株式会社アドマテックス製「アドマファインSO-32R/75C」、平均粒子径1.6μm)を、表1に示す所定の量にて、プラネタリーミキサーを用いて室温で1時間混練し、さらに-98.0kPaGの減圧下、150℃で1時間混練した。次に、混練物を室温まで冷却後、3本ロールミル処理を施した。該混練物に(D)成分を表1に示す所定の量加えて、室温で10分間混練した後、(F)成分を表1に示す所定の量加えて、室温で10分間混練した。最後に、(B)成分及び(E)成分を表1に示す所定の量加えて、室温で10分間混練し、組成物を得た。
上記組成物を150℃、10分のプレス架橋(一次架橋)及び150℃、50分のオーブン架橋(二次架橋)を行って硬化シート(85mm×105mm×2mm)を作製した。
上記硬化シートを用いて、硬さはJIS K6253-3、引張強さ及び切断時伸びはJIS K6251に準拠して測定した。結果を表1に示す。
上記硬化シートを用いて、ヘーズメーターHGM-2(スガ試験機株式会社製)にて、JIS K7361-1に準じて全光線透過率を測定した。結果を表1に示す。
各種被着体(アルミニウム、エポキシガラス樹脂及びガラス)の100mm×25mmのテストパネル2枚を、それぞれの端部が10mmずつ重複するように、厚さ1mmの実施例及び比較例の組成物の層(長さ10mm×幅25mm×厚さ1mm)を挟んで重ね合わせ、150℃で1時間加熱することにより該組成物を硬化させ、接着試験片を作製した。次いで、この試験片について引張せん断接着試験(引張速度50mm/分)を行い、接着強度(せん断接着力)及び凝集破壊率を評価した。結果を表2に示す。
Claims (7)
- (A)1分子中に2個以上のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有する直鎖状ポリフルオロ化合物:100質量部、
(B)1分子中に、1価のパーフルオロアルキル基若しくは1価のパーフルオロオキシアルキル基を有するか、又は2価のパーフルオロアルキレン基若しくは2価のパーフルオロオキシアルキレン基を有し、さらにケイ素原子に直結した水素原子(SiH基)を2個以上有し、かつ分子中にエポキシ基及びケイ素原子に直結したアルコキシ基を有さない含フッ素オルガノ水素シロキサン、
(C)フッ化ナトリウム:0.1~120質量部、
(D)白金族金属系触媒:(A)成分に対して白金族金属原子の質量換算で0.1~2,000ppm
(E)1分子中に、ケイ素原子に直結した水素原子(SiH基)と、1価のパーフルオロアルキル基又は1価のパーフルオロオキシアルキル基と、酸素原子を含んでもよい2価の炭化水素基を介してケイ素原子に結合したエポキシ基若しくはトリアルコキシシリル基又はその両方とを有するオルガノポリシロキサン:0.1~20質量部
を含有する硬化性フルオロポリエーテル系接着剤組成物であって、前記(B)成分の配合量が、該組成物中に含まれるアルケニル基1モルに対して、前記(B)成分中のケイ素原子に直結した水素原子が0.5~3モルとなる量であることを特徴とする硬化性フルオロポリエーテル系接着剤組成物。 - 前記(A)成分の直鎖状ポリフルオロ化合物のアルケニル基含有量が、0.005~0.3モル/100gである請求項1に記載の硬化性フルオロポリエーテル系接着剤組成物。
- 前記(A)成分が有するパーフルオロポリエーテル構造が、下記一般式(1)
-(CaF2aO)b- (1)
(式(1)中、aは1~6の整数であり、bは4~302の整数である。)
で表される構造を含む請求項1又は2に記載の硬化性フルオロポリエーテル系接着剤組成物。 - 前記(A)成分が、下記一般式(2)
及び/又は下記一般式(3)
で表される直鎖状ポリフルオロ化合物である請求項1~3のいずれか1項に記載の硬化性フルオロポリエーテル系接着剤組成物。 - 前記(E)成分が、下記一般式(16)
で表される環状オルガノポリシロキサンである請求項1~4のいずれか1項に記載の硬化性フルオロポリエーテル系接着剤組成物。 - JIS K7361-1に準じて測定される2mm厚の全光線透過率が80%以上である硬化物を与えるものである請求項1~5のいずれか1項に記載の硬化性フルオロポリエーテル系接着剤組成物。
- 請求項1~6のいずれか1項に記載の硬化性フルオロポリエーテル系接着剤組成物の硬化物を有する光学部品。
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EP4019603A4 (en) | 2023-08-30 |
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EP4019603A1 (en) | 2022-06-29 |
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