WO2021023189A1 - 显示基板及其制备方法、显示装置 - Google Patents
显示基板及其制备方法、显示装置 Download PDFInfo
- Publication number
- WO2021023189A1 WO2021023189A1 PCT/CN2020/106870 CN2020106870W WO2021023189A1 WO 2021023189 A1 WO2021023189 A1 WO 2021023189A1 CN 2020106870 W CN2020106870 W CN 2020106870W WO 2021023189 A1 WO2021023189 A1 WO 2021023189A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- substrate
- display
- pattern layer
- dam
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 296
- 238000000034 method Methods 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 157
- 238000005538 encapsulation Methods 0.000 claims abstract description 86
- 239000000463 material Substances 0.000 claims description 148
- 230000000903 blocking effect Effects 0.000 claims description 112
- 238000004806 packaging method and process Methods 0.000 claims description 48
- 230000008569 process Effects 0.000 claims description 38
- 239000010408 film Substances 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 36
- 229920002120 photoresistant polymer Polymers 0.000 claims description 34
- 238000002955 isolation Methods 0.000 claims description 32
- 238000000059 patterning Methods 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims description 16
- 238000002360 preparation method Methods 0.000 claims description 15
- 239000011368 organic material Substances 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 6
- 238000004380 ashing Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 499
- 239000002585 base Substances 0.000 description 38
- 238000013461 design Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 239000004020 conductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000012858 packaging process Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- -1 polymer resin Etc. Chemical compound 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical class NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- NNNSKJSUQWKSAM-UHFFFAOYSA-L magnesium;dichlorate Chemical compound [Mg+2].[O-]Cl(=O)=O.[O-]Cl(=O)=O NNNSKJSUQWKSAM-UHFFFAOYSA-L 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 125000005259 triarylamine group Chemical group 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical class C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Definitions
- the present disclosure relates to the field of display technology, and in particular to a display substrate, a preparation method thereof, and a display device.
- a display substrate has a display area and a frame area around the display area.
- the display substrate includes a base, a pixel unit, at least one barrier dam, and a first encapsulation layer.
- the pixel unit is disposed on the substrate and located in the display area.
- the at least one blocking dam is disposed on the base and located in the frame area, and the at least one blocking dam is provided with at least one groove on the surface of the side facing away from the base; the depth of the at least one groove
- the direction is perpendicular to the base, and the extension direction of the at least one groove is substantially the same as the extension direction of the barrier dam provided with the at least one recess.
- the first encapsulation layer covers at least one barrier dam.
- a portion of the first encapsulation layer covering the at least one groove is conformal to the at least one groove.
- At least one of the barrier dams provided with grooves includes: a second pattern layer and a first pattern layer sequentially stacked on the substrate, and the groove is located in the first pattern layer .
- the display substrate further includes isolation pillars located in the display area.
- the isolation pillar and the first pattern layer are formed by patterning the same film layer.
- the display substrate further includes a pixel defining layer in the display area.
- the pixel defining layer and the second pattern layer are formed by patterning the same film layer.
- the display substrate further includes a flat layer covering at least the display area.
- the barrier dam also includes a third pattern layer located between the second pattern layer and the substrate, and the flat layer and the third pattern layer are formed by patterning the same film layer.
- the at least one blocking dam is provided as at least two, and the at least two blocking dams include a first blocking dam and a second blocking dam.
- the first blocking dam is located between the display area and the second blocking dam.
- the first barrier dam includes the first pattern layer and the second pattern layer, and the second barrier dam includes the first pattern layer, the second pattern layer, and the third pattern layer.
- the at least one blocking dam is provided as at least two, and the at least two blocking dams surround the display area and are sequentially arranged from the inside to the outside.
- the groove is arranged to surround the display area, and the orthographic projection of the groove on the substrate is a closed shape.
- the height of the at least two blocking dams gradually increases along the direction from the center to the edge of the display substrate.
- At least one barrier dam provided with grooves at least two grooves surrounding the display area are provided, and the at least two grooves are sequentially arranged from the inside to the outside.
- the groove is provided with a plurality of protrusions; along the extending direction of the groove, the plurality of protrusions are sequentially arranged at intervals.
- the plurality of protrusions and the part of the blocking dam facing away from the substrate are formed by the same film patterning.
- the shape of the orthographic projection of the plurality of protrusions on the substrate is at least one of a triangle, a rectangle, a polygon, and a circle.
- the display substrate further includes a second packaging layer and a third packaging layer.
- the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate, and the second encapsulation layer covers the display area and the barrier dam.
- the third packaging layer is located between the first packaging layer and the second packaging layer, and the third packaging layer covers at least the display area. The edge of the orthographic projection of the blocking dam on the substrate away from the display area is located outside the orthographic projection of the third packaging layer on the substrate.
- a display device in another aspect, includes the display substrate described in any of the above embodiments.
- a method for preparing a display substrate includes: providing a substrate having a display area and a frame area located around the display area; forming at least one barrier dam on the substrate and in the frame area, and forming at least one barrier dam on the substrate. At least one groove is formed on the side facing away from the substrate; and a first encapsulation layer is formed on the substrate to cover the display area and the at least one barrier dam.
- the depth direction of the at least one groove is perpendicular to the base, and the extending direction of the at least one groove is substantially the same as the extending direction of the barrier dam provided with the at least one groove.
- the at least one barrier dam includes a second pattern layer and a first pattern layer sequentially stacked on the substrate, and the groove is formed in the first pattern layer.
- the forming at least one barrier dam includes: forming a first material layer on the substrate; providing a half-tone mask to pattern the first material layer, including: on a side of the first material layer away from the substrate Coating photoresist on the side; exposing the photoresist using a halftone mask, developing the photoresist, forming a photoresist removal area, a photoresist semi-reserved area, and a photoresist all reserved area;
- the first material layer is to remove a part of the first material layer that is located in the photoresist all-removed area; an ashing process is used to remove the part of the photoresist located in the photoresist semi-reserved area; etching
- the part of the first material layer located in the photoresist semi-reserved area forms a first pattern layer
- the part of the first material layer facing away from the substrate is formed as an isolation pillar, the part of the first material layer facing the substrate is formed as a pixel defining layer, and
- a part of the first material layer away from the substrate is formed as the first pattern layer, and a part of the first material layer close to the substrate is formed as the second pattern layer.
- the at least one barrier dam includes a second pattern layer and a first pattern layer sequentially stacked on the substrate, and the groove is formed in the first pattern layer.
- the forming at least one barrier dam includes: sequentially depositing a second material layer and a first material layer on the substrate to form a stack; and providing a halftone mask while patterning the first material layer and the second material layer. Two material layers.
- the part of the first material layer located in the display area is formed as the isolation pillar
- the part of the first material layer located in the frame area is formed as the first pattern layer
- a portion of the second material layer located in the display area is formed as the pixel defining layer
- a portion of the second material layer located in the frame area is formed as the second pattern layer.
- the at least one barrier dam further includes a third pattern layer located between the second pattern layer and the substrate.
- the forming at least one barrier dam includes: depositing an insulating material film on the substrate to planarize the surface of the substrate; patterning the insulating material film, and the insulating material film is located in the display A part of the area is formed as a flat layer, and a part of the insulating material film outside the display area is formed as the third pattern layer.
- the preparation method further includes, after forming the first encapsulation layer, coating a liquid including an organic material on a region of the at least one barrier dam facing the display area; and applying a liquid to the liquid Drying and curing to form a third encapsulation layer.
- FIG. 1A is a top view of a display substrate according to some embodiments.
- FIG. 1B is a structural diagram of a display substrate according to some embodiments.
- FIG. 1C is another structural diagram of a display substrate according to some embodiments.
- FIG. 1D is a cross-sectional view of the display substrate in FIG. 1A along the A1-B1 direction and the C1-C2 direction;
- 2A is another top view of a display substrate according to some embodiments.
- FIG. 2B is a cross-sectional view of the display substrate in FIG. 2A along the direction A2-B2;
- FIG. 3A is another top view of a display substrate according to some embodiments.
- 3B is a cross-sectional view of the display substrate in FIG. 3A along the direction A3-B3;
- 4A is another top view of a display substrate according to some embodiments.
- FIG. 4B is a cross-sectional view of the display substrate in FIG. 4A along the direction A4-B4;
- FIG. 4C is a cross-sectional view of the display substrate in FIG. 4A along the direction of A5-B5;
- 4D is still another top view of the display substrate according to some embodiments.
- FIG. 5 is another structural diagram of a display substrate according to some embodiments.
- FIG. 6A is another structural diagram of a display substrate according to some embodiments.
- FIG. 6B is another structural diagram of a display substrate according to some embodiments.
- FIG. 7 is a structural diagram of a display device according to some embodiments.
- 8A to 8I are process diagrams of a method of manufacturing a display substrate according to some embodiments.
- first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.
- the expressions “coupled” and “connected” and their extensions may be used.
- the term “connected” may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
- the term “coupled” may be used when describing some embodiments to indicate that two or more components have direct physical or electrical contact.
- the term “coupled” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other.
- the embodiments disclosed herein are not necessarily limited to the content herein.
- At least one of A, B, and C has the same meaning as “at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
- a and/or B includes the following three combinations: A only, B only, and the combination of A and B.
- “approximately”, “approximately” or “approximately” includes the stated value and the average value within the acceptable deviation range of the specified value, wherein the acceptable deviation range is as determined by those of ordinary skill in the art It is determined taking into account the measurement in question and the error associated with the measurement of a specific quantity (ie, the limitations of the measurement system).
- the exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
- the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances are conceivable. Therefore, the exemplary embodiments should not be construed as being limited to the shape of the area shown herein, but include shape deviation due to, for example, manufacturing.
- the etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
- the level of the packaging process determines the lifetime of the device.
- a barrier dam is provided on the display substrate to form an encapsulation structure (for example, the third encapsulation layer in the following embodiments, for example, an organic encapsulation layer), but the arrangement of the barrier dam needs to occupy the design area of the frame area of the display substrate.
- the narrow frame design of the display substrate can be realized by reducing the number of blocking dams, for example, only one blocking dam. However, reducing the number of blocking dams will reduce the packaging effect of the display substrate and shorten the life of the display substrate. , Poor display and other issues.
- the present disclosure provides a display substrate having a display area and a frame area located around the display area.
- the display substrate includes a base, a pixel unit, at least one barrier dam, and a first encapsulation layer.
- the pixel unit is arranged on the substrate and located in the display area.
- At least one blocking dam is arranged on the substrate and located in the frame area, at least one blocking dam is provided with at least one groove on the surface of the side facing away from the substrate, the depth direction of the at least one groove is perpendicular to the substrate, and the at least one groove
- the extension direction is substantially the same as the extension direction of the barrier dam provided with at least one groove.
- the first encapsulation layer covers the barrier dam.
- the first encapsulation layer is an inorganic encapsulation layer.
- the groove can increase the contact area between the barrier dam and the first encapsulation layer, thereby improving the bonding strength of the barrier dam and the first encapsulation layer, and at the same time extend the path of crack propagation and water and oxygen intrusion, and improve the first encapsulation layer.
- the packaging effect of a packaging layer on the display substrate is usually coated on the first packaging layer to form a third packaging layer.
- the groove can increase the difficulty for the liquid to cross the barrier dam, thereby improving
- the function of the anti-overflow effect of the blocking dam that is, compared with the original blocking dam without the above-mentioned grooves, the blocking dam provided with at least one groove can be equivalent to at least two original blocking dams in terms of the function of preventing overflow. Block the dam.
- the display substrate can allow the design number of barrier dams to be reduced, thereby reducing the width of the frame area of the display substrate, which is beneficial to the display substrate to achieve a narrow bezel design, or, without changing the design number of barrier dams, the entire Show the packaging effect of the substrate.
- a spatial rectangular coordinate system is established based on the base of the display substrate to describe the position of each structure in the display substrate.
- the X and Y axes are parallel to the surface where the base is located, and the Z axis is perpendicular to the surface where the base is located.
- the display substrate 1 provided by at least one embodiment of the present disclosure has a display area (Active Area, AA) 101 (area defined by a dashed frame) and a frame area 102 located around the display area 101.
- the bezel area 102 may be located on at least one side outside the display area 101, for example, the bezel area 102 may surround the display area 101.
- the display substrate 1 includes a base 100, a pixel unit P, at least one barrier dam 200, and a first encapsulation layer 310.
- the pixel unit P is disposed on the substrate 100 and located in the display area 101.
- At least one blocking dam 200 is disposed on the base 100 and located in the frame area 102.
- the base 100 may include a rigid base substrate such as glass (or called a rigid base substrate), or a flexible base substrate such as PI (Polyimide, polyimide); it may also include a rigid base substrate. Or a film layer on a flexible substrate (such as a buffer layer, etc.).
- a rigid base substrate such as glass
- a flexible base substrate such as PI (Polyimide, polyimide)
- PI Polyimide, polyimide
- film layer on a flexible substrate such as a buffer layer, etc.
- a plurality of pixel units P may be arranged in an array.
- Each pixel unit P may include a plurality of sub-pixels, and each sub-pixel may include a pixel driving circuit and a light emitting device.
- the pixel driving circuit is coupled to the light-emitting device and used for driving the light-emitting device to emit light.
- At least one blocking dam 200 is provided with at least one groove 20 on a side surface away from the base 100.
- one barrier dam 200 is provided with at least one groove 20 on the surface facing away from the substrate 100; or, at least one of the barrier dams 200 is provided with at least one groove 20 on the surface facing away from the substrate 100.
- the depth direction of the at least one groove 20 (for example, the Z-axis direction) is perpendicular to the substrate 100, and the extending direction of the at least one groove 20 is the same as the extending direction of the barrier dam 200 provided with the at least one groove 20.
- the first encapsulation layer 310 covers the barrier dam 200.
- At least one blocking dam 200 is recessed toward the substrate 100 along a direction perpendicular to the substrate 100 in a portion of the surface of the side facing away from the substrate 100 (for example, the area D shown in FIG. 1B ).
- the depth of the groove 20 is less than or equal to the thickness of the first encapsulation layer 310.
- the first encapsulation layer 310 covers the barrier dam 200, that is, covers the groove 20, and the first encapsulation layer 310 is in contact with the groove 20, and the part of the first encapsulation layer 310 covering the groove 20 faces away from the surface of the substrate 100.
- 100 is recessed, so that the portion of the first encapsulation layer 310 covering the barrier dam 200 and the surface away from the substrate 100 has a step at the position of the groove 20.
- the groove 20 makes the surface of the barrier dam 200 facing away from the substrate 100 have two protrusions.
- the liquid needs to cross the barrier dam 200, it needs to sequentially cross the two protrusions, that is, the boundary of the liquid is close to the barrier dam 200 by climbing the first encapsulation layer 310.
- the barrier dam 200 can be crossed, that is, after the groove 20 is set, the liquid needs to go through an additional climbing process to completely cross the barrier dam 200. Therefore, the groove 20 increases the difficulty of liquid overflow and improves the prevention of the barrier dam 200. The effect of overflow.
- the portion of the first encapsulation layer 310 covering the at least one groove 20 is conformal to the at least one groove 20.
- the "conformal" can mean that two shapes are the same or approximately similar.
- the surface of the first encapsulation layer 310 in contact with the groove 20 conforms to the groove 20
- the surface of the first encapsulation layer 310 away from the substrate 100 conforms to the groove 20
- the portion of the first encapsulation layer 310 covering the barrier dam 200 has a depression similar in shape to the groove 20 (area D shown in FIG. 1B).
- the width of the groove 20 may not be less than 5 micrometers ( ⁇ m), for example, it may be further not less than 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, or the like.
- the formation of the groove 20 in the blocking dam 200 is not limited, and the design can be based on the structure of the blocking dam 200.
- At least one of the barrier dams provided with grooves includes a second pattern layer and a first pattern layer sequentially stacked on a substrate, and the grooves are located in the first pattern layer.
- the aforementioned pattern layer may also be referred to as a film layer.
- the barrier dam 200 of the display substrate 1 includes a first pattern layer 210 and a second pattern layer 220, and the second pattern layer 220 is located between the first pattern layer 210 and the base 100.
- the groove 20 is formed in the first pattern layer 210.
- the first pattern layer 210 and the second pattern layer 220 can be formed by two different film layers in different processes. Compared with the current process, only the groove 20 is formed in the first pattern layer 210. There is no need to consider additional processing of the second pattern layer 220, and the grooves 20 can be simultaneously formed in the process of patterning the first pattern layer 210 without increasing the steps of the manufacturing process of the display substrate 1.
- the material of the first pattern layer and the material of the second pattern layer may be the same or different.
- both the bottom surface and the sidewall of the groove may be formed by the surface of the first pattern layer, that is, the first pattern layer
- the pattern layer is not broken at the groove, that is, the depth of the groove is less than the thickness of the first pattern layer, and the groove does not penetrate the first pattern layer.
- the groove 20 shown in FIG. 1B refers to the groove 20 shown in FIG. 1B.
- the groove is open on the first pattern layer, that is, the groove penetrates the first pattern layer and exposes the top surface of the second pattern layer (that is, the surface of the second pattern layer facing away from the substrate), that is, The first pattern layer is broken at the groove.
- the sidewall of the groove is composed of the first pattern layer
- the bottom surface of the groove is composed of the top surface of the second pattern layer
- the bottom surface of the groove is the first pattern layer and the second pattern layer.
- the display substrate further includes an isolation pillar located in the display area, wherein the isolation pillar and the first pattern layer are configured to be formed by patterning the same film layer.
- the display area 101 of the display substrate 1 is provided with isolation pillars 211, and the first pattern layer 210 and the isolation pillars 211 are provided in the same layer and have the same material.
- a material layer may be deposited first, and the material layer may be patterned (that is, patterned), which may include, for example, exposure, development, and etching processes).
- the portion of the material layer located in the display area 101 is formed as an isolation pillar 211, and the portion of the material layer located in the frame area 102 is formed as the first pattern layer 210, and there is a space between the isolation pillar 211 and the first pattern layer 210.
- the grooves 20 may be simultaneously formed. In this way, the formation of the first pattern layer 210 and the groove 20 therein does not increase the process steps for preparing the display substrate 1, thereby simplifying the production process.
- FIG. 1D only illustrates part of the structure in the pixel unit in the display area (for example, including a flat layer, a pixel defining layer, and a light-emitting device, etc.).
- a pixel drive circuit for example, Etc.
- the spacers can be used to support the mask (such as a fine metal mask, etc.) so that the mask (such as a mask strip with a mask pattern provided in the mask) and the surface of the display substrate (in the In this case, there is a certain interval for the surface of the other part of the display substrate except for the isolation pillars, so as to prevent the mask plate from being completely attached to the surface of the display substrate and causing poor evaporation.
- the mask such as a fine metal mask, etc.
- the display substrate further includes a pixel defining layer located in the display area, wherein the pixel defining layer and the second pattern layer are configured to be formed by patterning the same film layer.
- a pixel defining layer 221 is provided in the display area 101 of the display substrate 1, and the second pattern layer 220 and the pixel defining layer 221 are arranged in the same layer and have the same material.
- a material layer may be deposited first, and the material layer may be patterned.
- the portion of the material layer located in the display area 101 is formed as the pixel defining layer 221.
- the part of the material layer located in the frame area 102 is formed as the second pattern layer 220.
- the pixel defining layer 221 may be used to define the sub-pixel area of the display substrate 1, for example, may be used to define the formation position of the light-emitting function layer 420 of the light-emitting device 400 as shown in FIG. 1D.
- the material of the pixel defining layer and the isolation pillar may be the same, so that the two may be formed by patterning one film layer.
- the first pattern layer and the second pattern layer in the barrier dam may be an integrated structure, that is, the pixel defining layer, the isolation pillar, the first pattern layer, and the second pattern layer may all be patterned and formed by one film layer. In this way, the preparation process of the display substrate can be simplified.
- the barrier dam further includes a third pattern layer located between the second pattern layer and the substrate.
- the barrier dam 200 of the display substrate 1 further includes a third pattern layer 230, and the third pattern layer 230 is located between the substrate 100 and the second pattern layer 220.
- the third pattern layer 220 can increase the thickness of the barrier dam 200, improve the overflow prevention effect of the barrier dam 200, and increase the contact area between the barrier dam 200 and the first packaging layer 310, thereby improving the packaging effect of the display substrate 1 .
- the display substrate further includes a flat layer covering at least the display area.
- the flat layer and the third pattern layer can be formed by patterning the same film layer.
- a flat layer 231 is provided in the display area 101 of the display substrate 1, and the third pattern layer 230 and the flat layer 231 are provided in the same layer and have the same material.
- a material layer may be deposited first, and the material layer may be patterned.
- the portion of the material layer located in the display area 101 is formed as the flat layer 231, and the material layer The part of the frame area 102 is formed as the third pattern layer 230.
- the planarization layer 231 may be used to provide a planarized surface to improve the structure formed on the planarization layer 231 (for example, the light emitting device 400, the pixel defining layer 221, and the first encapsulation layer in FIG. 1D). 310, etc.) to improve the uniformity of the film.
- the material of the flat layer 231 may include an organic material. Since the stress of the organic material is relatively small and the flexibility is relatively large, it can buffer the stress received by the display substrate 1 and facilitate the realization of the flexible design of the display substrate 1.
- the "thickness" described in the embodiments of the present disclosure can be the surface of the structural layer (for example, the barrier dam 200 shown in FIGS. 1B to 1D) facing away from the substrate to the surface (near) of the structural layer. The distance from the surface of the substrate.
- the number of pattern layers in the barrier dam can be designed as required.
- the barrier dam can include at least one of the above-mentioned first pattern layer, second pattern layer, and third pattern layer, It may also include a pattern layer formed in other ways, which is not limited herein.
- the groove may not penetrate the first pattern layer (for example, the groove 20 and the first pattern layer 210 shown in FIG. 1B), or the groove may penetrate the first pattern layer.
- the layer is formed as an opening (for example, the groove 20 and the first pattern layer 210 shown in FIG. 1C).
- the groove may not penetrate the first pattern layer (for example, the groove 20 and the first pattern layer 210 shown in FIG. 1B); or the groove may penetrate the first pattern layer.
- the surface of the second pattern layer facing the first pattern layer serves as the bottom surface of the groove (for example, the groove 20 and the first pattern layer 210 shown in FIG.
- the groove may penetrate the first pattern layer and partially Through the second pattern layer, at this time, the surface of the second pattern layer facing away from the substrate has a depression; or the groove may penetrate the first pattern layer and the second pattern layer.
- the analogy is in order.
- the embodiment of the present disclosure does not limit the planar shape of the barrier dam (for example, the shape of the orthographic projection of the barrier dam on the substrate).
- the planar shape of the blocking dam may be a closed ring surrounding the display area as shown in FIG. 1A.
- it may be set to a rectangular ring, a circular ring, a near circular ring, an ellipse, etc. according to the shape of the display area, so as to block The dam can prevent overflow in any plane direction.
- the planar shape of the blocking dam may be a ring with a gap, which is arranged in an area where overflow is not easy to occur, so as to prevent the blocking dam material from swelling when heated and expand, and maintain a good overflow prevention effect.
- the planar shape of the blocking dam may be segmented, for example, a straight line or a curved section.
- the blocking dam may include at least one section of sub-blocking dams, for example, multiple sub-blocking dams.
- the segment blocking dams can be collectively enclosed in a ring shape, or at least one segment of the blocking dams can be arranged only in areas prone to overflow. In this way, blocking dams can be provided in the areas prone to overflow of the display substrate to simplify the structure of the display substrate.
- planar shape of the blocking dam may not be straight, but may be curved.
- the sides of the rectangular ring may be slightly curved, and each segment of the segmented type may be curved, etc., as long as a good anti-overflow effect can be achieved
- the embodiment of the present disclosure does not limit this.
- planar shape described in the embodiments of the present disclosure can be the shape of the orthographic projection of the structure on the plane where the substrate is located (the plane determined by XY in FIG. 1A), and the "plane direction" is also parallel to X axis and Y axis.
- planar structure of the blocking dam as a closed loop surrounding the display area as an example, the display substrate, the preparation method thereof, and the display device in at least one embodiment of the present disclosure will be described.
- the groove is arranged to surround the display area, and the orthographic projection of the groove on the base is a closed ring.
- the planar shape of the groove 20 is closed around the display area 101, so that the groove 20 can improve the anti-overflow effect of the blocking dam 200 in any plane direction.
- the number of barrier dams of the display substrate is not limited.
- the blocking dam is set as a blocking dam 200 as shown in FIGS. 1A to 1D.
- the at least one barrier dam is provided as at least two, for example, the at least two barrier dams surround the display area and are arranged in sequence from the inside to the outside.
- At least one blocking dam is provided as at least two.
- the at least two blocking dams include a first blocking dam and a second blocking dam.
- the first blocking dam is located between the display area and the second blocking dam.
- the at least two blocking dams 200 include a first blocking dam 201 and a second blocking dam 202.
- the first blocking dam 201 and the second blocking dam 202 surround the display area 101 and are directed inwardly.
- the outer parts (that is, along the direction from the center to the edge of the display substrate 1) are sequentially arranged.
- the first blocking dam 201 and the second blocking dam 202 may be arranged in a concentric ring shape, and the first blocking dam 201 is located between the second blocking dam 202 and the display area 101.
- at least two blocking dams can reduce the risk of liquid overflow during the process of packaging the display substrate, thereby improving the packaging yield of the display substrate.
- each blocking dam may be a closed ring and the other may be a segmented type; or both It is segmented, in which at least one opening of one barrier dam corresponds to a segment of the other barrier dam; or, at least one opening of two barrier dams at least partially overlap, etc.; or, one of the barrier dams is segmented, The other is a closed loop.
- the distance from the top of the multiple (at least two) blocking dams (for example, the surface away from the base) to the base increases sequentially That is, the height of multiple blocking dams gradually increases.
- the height difference between two adjacent barrier dams may be the same or different. In this way, the height of the barrier dam relatively close to the display area is relatively small, so that in the preparation process of the display substrate (such as evaporation process, packaging process, etc.), the formation of the barrier dam in the display area due to the large height can be reduced. The structure appears bad.
- the "height" may be the distance from the surface of the structure (for example, the barrier dam) away from the substrate to the substrate.
- a first barrier dam and a second barrier dam are provided on the display substrate, and the first barrier dam is located between the display area and the second barrier dam,
- the first barrier dam 201 may be configured to include a first pattern layer 210a and a second pattern layer 220a
- the second barrier dam 202 may be configured to include a first pattern layer 210a and a second pattern layer 220a.
- the barrier dam of the third pattern layer 230a In this way, the height of the second blocking dam 202 far from the display area 101 may be greater than the height of the first blocking dam 201 close to the display area 101.
- the blocking dam 200 includes a first blocking dam 201 and a second blocking dam 202.
- the first blocking dam 201 and the second blocking dam 202 may be arranged in a concentric ring shape, and the first blocking dam 201 Located between the second blocking dam 202 and the display area 101.
- the first barrier dam 201 is provided with a first groove 21 surrounding the display area 101
- the second barrier dam 202 is provided with a second groove 22 surrounding the display area 101.
- one groove may be provided in one blocking dam, or multiple grooves may be provided.
- a blocking dam a plurality of grooves are arranged around the display area, for example, they may be arranged in a concentric ring.
- a blocking dam 200c is provided on the display substrate 1, and the side of the blocking dam 200c facing away from the substrate 100 is provided with three grooves 20c.
- the three grooves 20c are arranged in a concentric ring shape. cloth.
- the boundary of the liquid needs to enter the third groove 20c (the recess in the first encapsulation layer 310 that is conformal to the groove 20c to form), that is The boundary of the liquid needs to climb four times at the part of the first encapsulation layer 310 that overlaps the barrier dam 200c to completely pass the barrier dam 200c.
- the barrier dam 200c with the three grooves 20c can be equivalent to the four original barrier dams (that is, the barrier dam without grooves).
- the display substrate can allow the design number of blocking dams to be reduced, thereby reducing the width of the frame area of the display substrate, which is beneficial to realize a narrow frame design.
- only one blocking dam such as the aforementioned blocking dam 200c may be provided in the display substrate.
- the width of the blocking dam can be designed according to the number of grooves provided therein.
- the width of the barrier dam 200 may be set to 20 ⁇ m to 80 ⁇ m, for example, it may be 30 ⁇ m to 40 ⁇ m.
- the width of the barrier dam 200c may be set to 60 ⁇ m to 80 ⁇ m.
- the groove may be set as a closed shape surrounding the display area as shown in FIG. 1A.
- it may be set in a rectangular ring, a circular ring, a near circular ring, an ellipse, etc., according to the shape of the display area.
- the planar shape of the can be a ring with a gap, the gap is set in an area that is not prone to overflow.
- the groove may be formed in segments, such as straight or curved sections.
- the groove may include at least one segment of sub-blocking dams, for example, multiple segments of sub-blocking dams, and multiple segments of sub-blocking dams.
- the barrier dams may be collectively enclosed in a ring shape, or at least one section of the sub-barrier dams may be arranged only in areas prone to overflow, that is, no grooves are formed in the partial barrier dam areas.
- the width of the barrier dam 200c as shown in FIG. 3B is much smaller than the total width of the four barrier dams provided on the display substrate and the gaps between them, so as to ensure that the display substrate 1 prevents overflow while achieving a narrow Border design.
- the “width” is the size of the structure (for example, the barrier dam) in the direction from the display area to the frame area.
- the width of the barrier dam 200c is the size of the barrier dam 200c in the X-axis direction.
- the barrier dam 200c may include a third pattern layer 230c, a second pattern layer 220c, and a first pattern layer 210c that are sequentially stacked on the substrate 100, the third pattern layer 230c, the second pattern layer 220c, and the first pattern layer 230c.
- the structure of the pattern layer 210c can refer to the related descriptions of the third pattern layer, the second pattern layer, and the first pattern layer in the foregoing embodiment, and will not be repeated here.
- a plurality of protrusions are provided in the groove, and the plurality of protrusions are arranged at intervals in sequence along the extending direction of the groove.
- a plurality of protrusions 30 spaced apart from each other are provided in the groove 20d of the blocking dam 200d.
- the protrusion 30 can be equivalent to a wave-eliminating block, that is, if liquid overflows into the groove 20d during the process of forming the third encapsulation layer, the kinetic energy of the overflow of the liquid is weakened due to the action of the protrusion 30, making it difficult to escape from the recess.
- the plurality of protrusions 30 are sequentially arranged along the extending direction of the groove 20d, that is, when the planar shape of the groove 20d is annular, the plurality The protruding portion 30 may surround the display area 101, that is, the connecting lines connected by the plurality of protruding portions 30 in sequence surround the display area 101. In this way, the risk of overflow of the display substrate during the packaging process can be reduced, thereby improving the packaging yield of the display substrate.
- the protrusion 30 may be in contact with the side wall of the groove 20 on one side (for example, a side surface of the protrusion 30 along the width direction of the groove 20) without a gap.
- the protrusion 30 30 and groove 20 may be an integral structure.
- the protrusion 30 and the groove 20 can be formed by patterning the same film layer.
- the protrusion 30 and the groove 20 are an integrated structure.
- the plurality of protrusions and the part of the blocking dam away from the base are configured to be formed by the same film patterning.
- the barrier dam 200d may include, for example, a third pattern layer 230d, a second pattern layer 220d, and a first pattern layer 210d that are sequentially stacked on the substrate 100.
- the groove 20d is formed in the first pattern layer 210d.
- the protrusion 30 can be formed at the same time. In this way, the preparation process of the barrier dam 200d can be simplified and reduced cost.
- the structures of the third pattern layer 230d, the second pattern layer 220d, and the first pattern layer 210d please refer to the relevant descriptions of the third pattern layer, the second pattern layer and the first pattern layer in the foregoing embodiment, which will not be described here. Repeat.
- the protrusion 30 as shown in FIG. 4C may also be separately formed by an additional process.
- a material layer is deposited in the groove 20d, and the material layer is patterned to form the protrusion 30.
- the orthographic projection of the protrusion on the base is at least one of a triangle, a rectangle, a polygon, and a circle, and may also have other shapes.
- the shape (ie, the planar shape) of the orthographic projection of the protrusion 30 on the substrate 100 is a rectangle.
- the display substrate provided by at least one embodiment of the present disclosure further includes a second packaging layer and a third packaging layer.
- the second packaging layer is located on the side of the first packaging layer away from the substrate, and the third packaging layer is located between the first packaging layer and the second packaging layer.
- the second encapsulation layer covers the display area and the barrier dam, and the third encapsulation layer covers at least the display area.
- the edge of the orthographic projection of the blocking dam on the substrate away from the display area is outside the orthographic projection of the third packaging layer on the substrate.
- FIG. 5 may be a cross-sectional view of a partial area of the display panel shown in FIG. 1A after the packaging is completed. As shown in FIG.
- the first packaging layer 310 is formed on the base 100 of the display substrate 1. Due to the blocking of the blocking dam 200, the area of the third encapsulating layer 330 is limited by the blocking dam 200. The edge of the orthographic projection of the third encapsulation layer 330 on the substrate 100 is located within the edge of the side facing away from the display area 101 in the orthographic projection of the blocking dam 200 on the substrate 100.
- liquid may overflow into the recess of the first encapsulation layer 310 corresponding to the groove 20 in a part of the area, but the liquid does not overflow from the recess, that is, In this area, the sidewall of the groove 20 (or the recess of the first encapsulation layer 310) away from the display area 101 can define the position of the third encapsulation layer 330.
- the edge of the third encapsulation layer 330 is located in the groove 20.
- the second packaging layer 320 covers the third packaging layer 330, for example, the second packaging layer 320 also covers the first packaging layer 310.
- the specific materials of the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer are not limited.
- the material of the first encapsulation layer and the material of the second encapsulation layer may include inorganic materials, that is, both are inorganic encapsulation layers.
- the inorganic material may be, for example, silicon nitride, silicon oxide, silicon oxynitride, etc.
- the first inorganic encapsulating layer and the second inorganic encapsulating layer formed of the inorganic material have high density and can prevent the intrusion of water, oxygen, and the like.
- the material of the third encapsulation layer may include an organic material, that is, the third encapsulation layer is an organic encapsulation layer, and the organic material may be a polymer material containing a desiccant or a polymer material that can block water vapor, such as polymer resin Etc., in order to planarize the surface of the display substrate, and can relieve the stress of the first packaging layer and the second packaging layer.
- the organic material may be a polymer material containing a desiccant or a polymer material that can block water vapor, such as polymer resin Etc., in order to planarize the surface of the display substrate, and can relieve the stress of the first packaging layer and the second packaging layer.
- the material of the third encapsulation layer may also include water-absorbing materials, such as alkali metals (such as lithium (Li) and sodium (Na)), alkaline earth metals (such as barium (Ba) and calcium (Ca)) or other moisture-reactive materials Metal (such as aluminum (Al) and iron (Fe)); it can also be alkali metal oxides (such as lithium oxide (Li 2 O) and sodium oxide (Na 2 O)), alkaline earth metal oxides (such as magnesium oxide ( MgO), calcium oxide (CaO) and barium oxide (BaO)), sulfates (such as anhydrous magnesium sulfate (MgSO 4 )), metal halides (such as calcium chloride (CaCl 2 )) or perchlorates (such as high Magnesium chlorate (Mg(ClO 4 ) 2 ), etc., to absorb substances such as water and oxygen that intrude into the interior.
- alkali metals such as lithium (Li
- the display substrate provided by at least one embodiment of the present disclosure further includes a plurality of light-emitting devices arrayed in the display area, wherein the light-emitting devices are located between the first packaging layer and the substrate.
- the pixel defining layer 221 defines the area where the light emitting device 400 is located.
- the light emitting device 400 includes a first electrode 410, a light emitting function layer 420, and a second electrode 420 sequentially stacked on the substrate 100 (or the flat layer 231), and the light emitting function layer 420 is located in the opening of the pixel defining layer 221.
- the material of the first electrode and the material of the second electrode in the light emitting device are not limited.
- one of the first electrode and the second electrode may be an anode, and the other may be a cathode.
- the anode for example, may be formed of a transparent conductive material with a high work function, and its electrode material may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO), zinc oxide (ZnO) , Indium oxide (In 2 O 3 ), aluminum oxide zinc (AZO), carbon nanotubes, etc.
- the cathode can be formed of materials with high conductivity and low work function, and its electrode materials can include magnesium aluminum alloy (MgAl) and lithium aluminum Alloys (LiAl) or other simple metals such as magnesium, aluminum, lithium, and silver (Ag).
- the light-emitting function layer includes a light-emitting layer, and may also include a hole injection layer between the anode and the light-emitting layer, a hole transport layer, and an electron transport layer between the cathode and the light-emitting layer, Structures such as an electron injection layer may further include a hole blocking layer and an electron blocking layer.
- the hole blocking layer may be disposed between the electron transport layer and the light emitting layer, and the electron blocking layer may be disposed, for example, between the hole transport layer and the light emitting layer. between.
- the material of the light-emitting layer can be selected according to the color of the emitted light.
- the material of the light emitting layer includes a fluorescent light emitting material or a phosphorescent light emitting material.
- the light-emitting layer may adopt a doping system, that is, a dopant material is mixed into the host light-emitting material to obtain a usable light-emitting material.
- the host luminescent material may use metal compound materials, anthracene derivatives, aromatic diamine compounds, triphenylamine compounds, aromatic triamine compounds, benzenediamine derivatives, triarylamine polymers, and the like.
- the substrate may include multiple functional layers.
- the base may include a base substrate and a driving circuit layer provided on the base substrate.
- the driving circuit layer may include a pixel driving circuit.
- the pixel driving circuit includes a plurality of transistors, capacitors, and light-emitting devices, for example, formed as 2T1C (that is, 2 transistors (T) and 1 capacitor (C)), 3T1C or 7T1C, etc. Many forms.
- the embodiment of the present disclosure does not limit the structure, composition, etc. of the driving circuit layer.
- the pixel driving circuit may be located in the display area and between the flat layer and the base substrate.
- a via hole may be provided in the planarization layer so that the first electrode of the light emitting device may be coupled with one of the drain or the anode of the transistor.
- the display substrate 1 further includes a conductive pattern 104 located in the frame area 102.
- the conductive pattern 104 and the first electrode 410 in the light emitting device 400 are arranged in the same layer and have the same material, that is, the conductive pattern 104 and the first electrode 410 can be formed simultaneously.
- the conductive pattern can be used as a signal line or contact pad.
- the edge of the conductive pattern 104 close to the display area 101 is located within the edge of the barrier dam 200 close to the display area 101.
- the orthographic projection of the conductive pattern 104 on the substrate 100 overlaps with the orthographic projection of the third pattern layer 230 on the substrate 100, which overlaps with the second pattern layer 220 and the first pattern layer 210 on the substrate 100. There is no overlap on the orthographic projection on the substrate 100; or, the orthographic projection of the conductive pattern 104 on the substrate 100 overlaps the orthographic projection of the third pattern layer 230, the second pattern layer 220, and the first pattern layer 210 on the substrate 100.
- a part of the conductive pattern 104 is located between the third pattern layer 230 and the second pattern layer 220.
- the conductive pattern 104 is located on the side of the first barrier dam 201 close to the substrate 100, and the conductive pattern 104 extends between the second pattern layer 220b and the third pattern layer 230b in the second barrier dam 202 .
- At least one embodiment of the present disclosure provides a display device including the display substrate in any one of the above embodiments.
- the display device 3 further includes an outer frame 2 provided around the display substrate 1.
- a touch structure may be provided on the display side of the display substrate to obtain a touch function.
- the above-mentioned display device may be any device that displays images whether in motion (e.g., video) or fixed (e.g., still images) and regardless of text or images. More specifically, it is expected that the described embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, TV monitors, flat panel displays, computer monitors, car monitors (e.g., Odometer display, etc.), navigator, cockpit controller and/or display, camera view display (for example, the display of a rear-view camera in a vehicle), electronic photos, electronic billboards or signs, projectors, building structures, packaging And aesthetic structure (for example, a display of the image of a piece of jewelry), etc.
- PDAs personal data assistants
- Handheld or portable computers GPS receivers/navi
- the display device has the same beneficial effects as the above-mentioned display substrate, which will not be repeated here.
- At least one embodiment of the present disclosure provides a method for preparing a display substrate.
- the preparation method includes: providing a base, the base including a display area and a frame area located around the display area; and forming at least one barrier dam on the base of the frame area, such as blocking The dam surrounds the display area, and at least one groove is formed on the surface of the at least one blocking dam facing away from the substrate.
- the depth direction of the at least one groove is perpendicular to the base, and the extending direction of the at least one groove is substantially the same as the extending direction of the barrier dam provided with the at least one groove.
- a first encapsulation layer is formed on the substrate to cover the display area and at least one barrier dam.
- the portion of the first encapsulation layer that overlaps the barrier dam is conformal to one side of the barrier dam.
- the groove can increase the contact area between the barrier dam and the first encapsulation layer, thereby improving the bonding strength of the barrier dam and the first encapsulation layer, and at the same time increase crack propagation and water and oxygen intrusion.
- the path improves the packaging effect of the first packaging layer on the display substrate.
- the groove can increase the difficulty for the liquid to cross the barrier dam, thereby improving the anti-overflow effect of the barrier dam, that is, compared with those without the above grooves.
- the blocking dam formed with at least one groove can be equivalent to at least two original blocking dams (that is, the blocking dam without grooves) in terms of overflow prevention.
- the display substrate can allow the design number of barrier dams to be reduced, thereby reducing the width of the frame area of the display substrate, which is beneficial to the narrow bezel design, or, without changing the design number of the barrier dams, the overall display substrate is improved.
- Package effect the design number of barrier dams to be reduced, thereby reducing the width of the frame area of the display substrate, which is beneficial to the narrow bezel design, or, without changing the design number of the barrier dams, the overall display substrate is improved.
- At least one barrier dam includes a second pattern layer and a first pattern layer sequentially stacked on a base, and a groove is formed in the first pattern layer
- Forming at least one barrier dam includes: forming a first material layer on a substrate; and providing a half-tone mask to pattern (ie, pattern) the first material layer.
- a part of the patterned first material layer in the display area is formed as isolation pillars, the remaining part in the display area is formed as a pixel defining layer, and the part formed as the isolation pillar is different from the part formed as the pixel defining layer.
- the pixel defining layer, the isolation column, and the first pattern layer and the second pattern layer to the barrier dam can all be formed from a first material layer through a patterning process, which simplifies the manufacturing process of the display substrate.
- the width of the pixel defining layer is greater than the width of the isolation pillars.
- the side facing away from the substrate is coated with photoresist, a halftone mask is used to expose the photoresist, and the photoresist is developed to form a photoresist removal area, a photoresist semi-reserved area and a photoresist all-reserved area.
- the first material layer is etched to remove the part of the first material layer located in the photolithography all-removed area, and the entire thickness of the part of the first material layer located in the photolithographic all-removed area is etched in the display area to form a pixel defining layer.
- use an ashing process to remove the part of the photoresist located in the photoresist semi-reserved area, and then The part of the first material layer located in the semi-reserved area of the photoresist is etched to form a first pattern layer and isolation pillars.
- the part of the first material layer located in the semi-reserved region of the photoresist is etched to a predetermined thickness (for example, the predetermined thickness is smaller than the thickness of the first material layer) to obtain the first pattern layer and the spacers.
- the predetermined thickness is The thickness of a pattern layer and spacers. Then strip the remaining photoresist.
- the widest part of the barrier dam that is not continuously etched after the ashing process is formed as the second pattern layer, and the first material layer in the display area that is not continuously etched after the ashing process is formed as the pixel defining layer.
- At least one barrier dam includes a second pattern layer and a first pattern layer sequentially stacked on a base, and a groove is formed in the first pattern layer
- Forming at least one barrier dam includes: sequentially depositing a second material layer and a first material layer on a substrate to form a stack; and providing a halftone mask to simultaneously pattern the first material layer and the second material layer.
- the part of the first material layer located in the display area is formed as a spacer
- the part of the first material layer located in the frame area is formed as the first pattern layer
- the part of the second material layer located in the display area is formed as pixels A defining layer
- a part of the second material layer located in the frame area is formed as a second pattern layer.
- the at least one barrier dam further includes a third pattern layer located between the second pattern layer and the substrate, and forming the at least one barrier dam includes: depositing on the substrate The insulating material film planarizes the surface of the substrate, and the insulating material film is patterned. The part of the insulating material film in the display area is formed as a flat layer, and the part of the insulating material film in the frame area is formed as a third pattern layer. In this way, the formation of the third pattern layer does not increase the process steps for manufacturing the display substrate.
- the method for preparing a display substrate further includes: after forming the first encapsulation layer, coating a liquid including an organic material on a region of the at least one barrier dam facing the display area; and drying and curing the liquid To form a third encapsulation layer.
- At least one barrier dam and its groove are used to define the area where the liquid is located and prevent the liquid from overflowing. In this way, after the liquid is dried, the surface of the third encapsulation layer facing away from the substrate is relatively smooth, so that the third encapsulation layer can be lifted. To the effect of flattening.
- the method of applying liquid includes inkjet printing (IJP) or other methods.
- the preparation method of the display substrate 1 may include the processes shown in FIGS. 8A to 8I, which are specifically as follows.
- a substrate 100 is provided, an insulating material film 103 with a planarization function is deposited on the substrate 100, and the insulating material film 103 is patterned.
- the portion of the insulating material film 103 located in the display area 101 is formed as a flat layer 231, a portion of the insulating material film 103 located in the frame area 102 is formed as a third pattern layer 230.
- the material of the flat layer may be an organic material, such as epoxy, polyimide, polyamide, acrylic, or other suitable materials.
- the material of the third pattern layer 230 is the same as the material of the flat layer.
- the base may include a base substrate and a driving circuit layer provided on the base substrate.
- the base substrate may be a glass plate, a quartz plate, a metal plate, or a resin-based plate.
- the material of the base substrate may include an organic material.
- the organic material may include polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, and polyethylene terephthalate. And resin materials such as polyethylene naphthalate.
- the base substrate may be formed of multiple material layers.
- the base substrate may include a base, and the material of the base may be composed of the above-mentioned materials.
- a buffer layer may be formed on the surface of the base as a transition layer, which can prevent lining The harmful substances in the base substrate invade the inside of the display substrate, which can increase the adhesion of the film layer in the display substrate on the base substrate.
- the material of the buffer layer may include silicon oxide, silicon nitride, or silicon oxynitride.
- the base may include a base substrate and a driving circuit layer provided on the base substrate.
- the preparation method for forming the driving circuit layer on the base substrate is related to the type of the transistor.
- the transistor may be a top-gate, bottom-gate, double-gate or other types of thin film transistors.
- the process of forming the driving circuit layer on the base substrate can refer to the conventional process, which will not be repeated here.
- a conductive material layer is deposited on the flat layer 231, and the conductive material layer is patterned to form a first electrode 410.
- the first electrodes 410 are multiple and spaced apart (only in FIG. 8C). Show one).
- the material of the first electrode 410 can be referred to the related description in the foregoing embodiment, which is not repeated here.
- the conductive material layer when the conductive material layer is deposited, the conductive material layer can be further deposited in the frame area.
- the conductive material layer located in the frame area can form a conductive material. Pattern, the conductive pattern is used to form signal lines, contact pads and other components.
- a conductive pattern 104 as shown in FIG. 6A can be obtained.
- the second material layer 106 and the first material layer 105 are sequentially deposited on the substrate 100.
- the second material layer 106 and the first material layer 105 may both be photosensitive resin materials, such as photoresist 107.
- the photosensitive resin material is a positive photoresist. Then a halftone mask 40 is provided to expose the second material layer 106 and the first material layer 105.
- the halftone mask 40 includes a first area 41, a second area 42 and a third area 43.
- the light transmittance of the first area 41, the second area 42, and the third area 43 decreases sequentially.
- the first area 41 may be set as an opening, and for example, the third area 43 may be set to be opaque.
- the first material layer 105 and the second material layer 106 are The part corresponding to 41 is completely exposed, the part of the first material layer 105 corresponding to the second region 42 is completely exposed, and the parts of the first material layer 105 and the second material layer 106 corresponding to the third region 43 are not exposed.
- a halftone mask is used for patterning, so that the edge angle of the obtained pattern is small, so that the film stress caused by the height difference can be relieved.
- it is beneficial to reduce the distance (the distance between the edge of the packaging layer and the edge of the display substrate) for packaging at the edge (frame area) of the display substrate, and is beneficial to the narrow frame design of the display substrate.
- the portion of the second material layer 106 located in the display area 101 is formed as a pixel defining layer 221, and the pixel defining layer 221
- An opening is formed to expose the first electrode 410
- a portion of the second material layer 106 located in the frame area 102 is formed as a second pattern layer 220
- a portion of the first material layer 105 located in the display area 101 is formed as a spacer 211
- the portion of the first material layer 105 located in the frame area 102 is formed as the first pattern layer 210.
- the materials of the first material layer and the second material layer can be set to be the same.
- a film layer can be deposited on the substrate to be equivalent to the first material in FIG. 8D
- the thickness of the first material layer (or the second material layer) can be increased, so that the thickness of the first material layer (or the second material layer) is equivalent to FIG. 8D
- the first material layer 105 and the second material layer 106 are shown, so that the second material layer 106 (or the first material layer 105) does not need to be deposited again.
- the thickened first material layer (or second material layer) is patterned using the above-mentioned halftone mask.
- the first pattern layer 210 and the second pattern layer 220 are an integrated structure, that is, there is no physical interface between the first pattern layer 210 and the second pattern layer 220; the isolation pillars 211 and the pixel defining layer 221 It is an integrated structure, that is, there is no physical interface between the isolation pillar 211 and the pixel defining layer 221.
- the light-emitting function layer 420 and the second electrode 430 are sequentially formed by processes such as inkjet printing and evaporation.
- the first electrode 410, the light-emitting function layer 420, and the second electrode 430 sequentially stacked on the substrate 100 constitute the light-emitting device 400.
- an inorganic material is deposited on the substrate 100 to form a first encapsulation layer 310 that covers the display area 101 and covers the barrier dam 200 of the frame area 102.
- the liquid 130 is coated on the substrate 100 on which the first encapsulation layer 310 is formed.
- the liquid 130 may be applied by inkjet printing.
- the liquid can be selected so that the first encapsulation layer has liquid repellency with respect to the liquid.
- FIG. 8H when the liquid 130 is applied, The height of the liquid level of the liquid 130 is greater than the height of the barrier dam 200 and the first encapsulation layer 310 covering the barrier dam 200, so that more liquid can be coated on the display substrate, that is, when the design height of the barrier dam is fixed.
- the above design can increase the thickness of the third packaging layer to be formed.
- the liquid 130 is dried and then cured to form the third encapsulation layer 330.
- an inorganic material is deposited on the substrate 100 formed with the third encapsulation layer 330 to form a second encapsulation layer 320, the second encapsulation layer 320 covers the third encapsulation layer 330 and covers the barrier dam 200 of the bezel area 102.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (20)
- 一种显示基板,具有显示区和位于所述显示区周围的边框区,所述显示基板包括:基底;像素单元,设置于所述基底上且位于所述显示区;至少一个阻挡坝,设置于所述基底上且位于所述边框区,所述至少一个阻挡坝在背离所述基底的一侧的表面设置有至少一个凹槽;所述至少一个凹槽的深度方向垂直于所述基底,所述至少一个凹槽的延伸方向与设置有所述至少一个凹糟的阻挡坝的延伸方向大致相同;以及第一封装层,覆盖所述至少一个阻挡坝。
- 根据权利要求1所述的显示基板,其中,所述第一封装层中的覆盖所述至少一个凹槽的部分与所述至少一个凹槽共形。
- 根据权利要求1或2所述的显示基板,其中,设置有凹槽的阻挡坝中的至少一个包括:在所述基底上依次叠置的第二图案层和第一图案层,所述凹槽位于所述第一图案层中。
- 根据权利要求3所述的显示基板,还包括:位于所述显示区的隔离柱;所述隔离柱与所述第一图案层由同一膜层构图形成。
- 根据权利要求3或4所述的显示基板,还包括:位于所述显示区的像素界定层;所述像素界定层与所述第二图案层由同一膜层构图形成。
- 根据权利要求3~5中任一项所述的显示基板,还包括:至少覆盖所述显示区的平坦层;所述阻挡坝还包括位于所述第二图案层和所述基底之间的第三图案层,所述平坦层与所述第三图案层由同一膜层构图形成。
- 根据权利要求6所述的显示基板,其中,所述至少一个阻挡坝设置为至少两个,至少两个阻挡坝包括第一阻挡坝和第二阻挡坝;所述第一阻挡坝位于所述显示区和所述第二阻挡坝之间;所述第一阻挡坝包括所述第一图案层和所述第二图案层,所述第二阻挡坝包括所述第一图案层、所述第二图案层和所述第三图案层。
- 根据权利要求1~7中任一项所述的显示基板,其中,所述至少一个阻挡坝设置为至少两个,至少两个阻挡坝环绕所述显示区且由内向外依次排布;所述凹槽设置为环绕所述显示区,且所述凹槽在所述基底上的正投影为闭合形状。
- 根据权利要求8所述的显示基板,其中,沿从所述显示基板的中心至边沿的方向,所述至少两个阻挡坝的高度逐渐增加。
- 根据权利要求1~9中任一项所述的显示基板,其中,在至少一个设置有凹槽的阻挡坝中,设置有至少两个环绕所述显示区的凹槽,且至少两个凹槽由内向外依次排布。
- 根据权利要求1~10中任一项所述的显示基板,其中,所述凹槽中设置有多个突出部;沿所述凹槽的延伸方向,所述多个突出部依次间隔排布。
- 根据权利要求11所述的显示基板,其中,所述多个突出部与所述阻挡坝中的背离所述基底的部分由同一膜层构图形成。
- 根据权利要求11或12所述的显示基板,其中,所述多个突出部在所述基底上的正投影的形状为三角形、矩形、多边形和圆形中的至少一者。
- 根据权利要求1~13中任一项所述的显示基板,还包括:第二封装层,位于所述第一封装层背离所述基底的一侧;所述第二封装层覆盖所述显示区和所述阻挡坝;第三封装层,位于所述第一封装层和所述第二封装层之间;所述第三封装层至少覆盖所述显示区;所述阻挡坝在所述基底上的正投影的背离所述显示区的边缘,位于所述第三封装层在所述基底上的正投影之外。
- 一种显示装置,包括如权利要求1~14中任一项所述的显示基板。
- 一种显示基板的制备方法,包括提供基底,所述基底具有显示区以及位于所述显示区周围的边框区;在所述基底上且在所述边框区形成至少一个阻挡坝,在所述至少一个阻挡坝的背离所述基底的一侧形成有至少一个凹槽;所述至少一个凹槽的深度方向垂直于所述基底,所述至少一个凹槽的延伸方向与设置有所述至少一个凹糟的阻挡坝的延伸方向大致相同;以及在所述基底上形成第一封装层,以覆盖所述显示区和所述至少一个阻挡坝。
- 根据权利要求16所述的制备方法,其中,所述至少一个阻挡坝包括依次叠置在所述基底上的第二图案层和第一图案层,所述凹槽形成在所述第一图案层中,所述形成至少一个阻挡坝,包括:在所述基底上形成第一材料层;提供半色调掩模板构图所述第一材料层,包括:在所述第一材料层的背离所述基底的一侧涂覆光刻胶;采用半色调掩模板曝光所述光刻胶,显影所述光刻胶,形成光刻胶全部去除区、光刻胶半保留区以及光刻胶全部保留区;蚀刻所述第一材料层,去除所述第一材料层中位于所述光刻全部去除区的部分;采用灰化工艺,去除所述光刻胶中位于所述光刻胶半保留区的部分;蚀刻所述第一材料层中位于所述光刻胶半保留区的部分,形成第一图案层和隔离柱;剥离剩余的光刻胶;其中,在所述显示区,所述第一材料层中的背离所述基底的部分形成为隔离柱,所述第一材料层中的面向所述基底的部分形成为像素界定层,以及在所述边框区,所述第一材料层中的背离所述基底的部分形成为所述第一图案层,所述第一材料层中的靠近所述基底的部分形成为所述第二图案层。
- 根据权利要求16所述的制备方法,其中,所述至少一个阻挡坝包括依次叠置在所述基底上的第二图案层和第一图案层,所述凹槽形成在所述第一图案层中,所述形成至少一个阻挡坝,包括:在所述基底上依次沉积得到第二材料层和第一材料层以形成叠层;以及提供半色调掩模板同时构图所述第一材料层和所述第二材料层;其中,所述第一材料层中的位于所述显示区的部分形成为所述隔离柱,所述第一材料层中的位于所述边框区的部分形成为所述第一图案层,所述第二材料层中的位于所述显示区的部分形成为所述像素界定层,所述第二材料层中的位于所述边框区的部分形成为所述第二图案层。
- 根据权利要求17或18所述的制备方法,其中,所述至少一个阻挡坝还包括位于所述第二图案层和所述基底之间的第三图案层,所述形成至少一个阻挡坝,包括:在所述基底上沉积得到绝缘材料薄膜,以平坦化所述基底的表面;对所述绝缘材料薄膜进行构图,所述绝缘材料薄膜中的位于所述显示区的部分形成为平坦层,所述绝缘材料薄膜中的位于所述显示区外的部分形成 为所述第三图案层。
- 根据权利要求17或18所述的制备方法,还包括:形成所述第一封装层之后,在所述至少一个阻挡坝的面向所述显示区的区域涂覆包括有机材料的液体;以及对所述液体进行干燥固化以形成第三封装层。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/420,104 US20220085330A1 (en) | 2019-08-06 | 2020-08-04 | Display substrate and manufacturing method therefor, and display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910722165.2 | 2019-08-06 | ||
CN201910722165.2A CN110416434B (zh) | 2019-08-06 | 2019-08-06 | 显示基板及其制备方法、显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021023189A1 true WO2021023189A1 (zh) | 2021-02-11 |
Family
ID=68366178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/106870 WO2021023189A1 (zh) | 2019-08-06 | 2020-08-04 | 显示基板及其制备方法、显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220085330A1 (zh) |
CN (1) | CN110416434B (zh) |
WO (1) | WO2021023189A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113410418A (zh) * | 2021-06-16 | 2021-09-17 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
CN113611729A (zh) * | 2021-08-05 | 2021-11-05 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
CN114430014A (zh) * | 2022-01-28 | 2022-05-03 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110416434B (zh) * | 2019-08-06 | 2022-01-28 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
CN113287198B (zh) * | 2019-12-20 | 2023-04-18 | 京东方科技集团股份有限公司 | 显示面板及其制作方法和对位方法 |
CN111312779B (zh) | 2020-02-27 | 2022-09-09 | 武汉华星光电半导体显示技术有限公司 | 一种用于优化喷墨打印封装制程的结构及方法、显示屏 |
CN111495703B (zh) * | 2020-04-29 | 2021-05-04 | 京东方科技集团股份有限公司 | 显示面板的检测方法和检测装置 |
CN112002828B (zh) * | 2020-09-04 | 2023-11-07 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
CN112331707B (zh) * | 2020-10-29 | 2024-07-09 | 合肥维信诺科技有限公司 | 显示面板及其制备方法 |
CN112820841B (zh) * | 2021-01-18 | 2022-06-21 | 合肥维信诺科技有限公司 | 显示基板及显示基板制备方法 |
KR20220106261A (ko) * | 2021-01-21 | 2022-07-29 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
CN115380386A (zh) * | 2021-03-19 | 2022-11-22 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
CN113097262A (zh) * | 2021-03-25 | 2021-07-09 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
CN113314683B (zh) * | 2021-05-27 | 2023-08-08 | 京东方科技集团股份有限公司 | 挡墙结构、显示面板及显示装置 |
CN113764496B (zh) * | 2021-09-09 | 2024-05-10 | 京东方科技集团股份有限公司 | 显示模组及显示装置 |
US20240215318A1 (en) * | 2021-11-29 | 2024-06-27 | Boe Technology Group Co., Ltd. | Display substrate |
CN114420869B (zh) * | 2022-01-17 | 2024-03-12 | 京东方科技集团股份有限公司 | 一种显示基板及显示装置 |
CN114582938A (zh) * | 2022-02-18 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | 一种oled显示面板及oled显示面板的制备方法 |
CN114583080A (zh) * | 2022-02-24 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | 柔性显示面板及其制备方法 |
WO2023225957A1 (zh) * | 2022-05-26 | 2023-11-30 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
WO2023230877A1 (zh) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
CN115224223A (zh) * | 2022-08-02 | 2022-10-21 | 维信诺科技股份有限公司 | 显示面板、显示装置及显示面板的制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106601781A (zh) * | 2017-01-25 | 2017-04-26 | 上海天马微电子有限公司 | 有机发光显示面板和显示装置 |
CN106711171A (zh) * | 2015-11-17 | 2017-05-24 | 三星显示有限公司 | 显示装置和制造显示装置的方法 |
CN109301084A (zh) * | 2018-09-28 | 2019-02-01 | 京东方科技集团股份有限公司 | 封装结构、电子装置及封装方法 |
KR20190030951A (ko) * | 2017-09-15 | 2019-03-25 | 엘지디스플레이 주식회사 | 표시 장치 |
CN110416434A (zh) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018179308A1 (ja) * | 2017-03-31 | 2018-10-04 | シャープ株式会社 | 表示装置およびその製造方法 |
KR102456123B1 (ko) * | 2017-12-04 | 2022-10-17 | 엘지디스플레이 주식회사 | 표시장치 |
KR102431808B1 (ko) * | 2017-12-11 | 2022-08-10 | 엘지디스플레이 주식회사 | 터치 스크린 일체형 표시장치 |
KR102489225B1 (ko) * | 2017-12-13 | 2023-01-17 | 엘지디스플레이 주식회사 | 표시장치와 그의 제조방법 |
KR102457583B1 (ko) * | 2017-12-21 | 2022-10-24 | 삼성디스플레이 주식회사 | 표시 장치 및 그것의 제조 방법 |
CN109256481B (zh) * | 2018-08-30 | 2020-09-11 | 云谷(固安)科技有限公司 | 显示面板和显示装置 |
CN109273510B (zh) * | 2018-10-17 | 2020-04-28 | 武汉华星光电半导体显示技术有限公司 | 有机自发光二极管显示面板及其制作方法 |
CN109585676B (zh) * | 2018-11-28 | 2020-10-27 | 云谷(固安)科技有限公司 | 显示面板 |
CN109585690B (zh) * | 2018-12-29 | 2021-03-16 | 厦门天马微电子有限公司 | 显示面板及显示装置 |
CN109786578A (zh) * | 2019-01-30 | 2019-05-21 | 京东方科技集团股份有限公司 | Oled基板及oled显示装置 |
CN109888126B (zh) * | 2019-02-28 | 2021-06-08 | 云谷(固安)科技有限公司 | 显示面板及其制备方法和具有其的显示装置 |
-
2019
- 2019-08-06 CN CN201910722165.2A patent/CN110416434B/zh active Active
-
2020
- 2020-08-04 WO PCT/CN2020/106870 patent/WO2021023189A1/zh active Application Filing
- 2020-08-04 US US17/420,104 patent/US20220085330A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711171A (zh) * | 2015-11-17 | 2017-05-24 | 三星显示有限公司 | 显示装置和制造显示装置的方法 |
CN106601781A (zh) * | 2017-01-25 | 2017-04-26 | 上海天马微电子有限公司 | 有机发光显示面板和显示装置 |
KR20190030951A (ko) * | 2017-09-15 | 2019-03-25 | 엘지디스플레이 주식회사 | 표시 장치 |
CN109301084A (zh) * | 2018-09-28 | 2019-02-01 | 京东方科技集团股份有限公司 | 封装结构、电子装置及封装方法 |
CN110416434A (zh) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113410418A (zh) * | 2021-06-16 | 2021-09-17 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
CN113410418B (zh) * | 2021-06-16 | 2024-02-20 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
CN113611729A (zh) * | 2021-08-05 | 2021-11-05 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
CN113611729B (zh) * | 2021-08-05 | 2024-05-28 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
CN114430014A (zh) * | 2022-01-28 | 2022-05-03 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110416434B (zh) | 2022-01-28 |
US20220085330A1 (en) | 2022-03-17 |
CN110416434A (zh) | 2019-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021023189A1 (zh) | 显示基板及其制备方法、显示装置 | |
JP7512040B2 (ja) | 表示基板及びその製造方法、並びに表示パネル | |
JP7203763B2 (ja) | 表示基板及びその製造方法、表示装置 | |
CN107452894B (zh) | 一种有机电致发光显示面板、其制作方法及显示装置 | |
US11245094B2 (en) | Display substrate and manufacture method thereof, display panel | |
WO2018149158A1 (zh) | Oled显示面板及其制备方法、显示装置 | |
US11871606B2 (en) | Display substrate and display device | |
WO2022068409A1 (zh) | 显示基板及其制备方法、显示装置 | |
WO2021027811A1 (zh) | 显示面板及其制备方法、显示装置 | |
WO2020143552A1 (zh) | 显示基板及其制备方法、显示装置 | |
CN109801954B (zh) | 阵列基板及其制造方法、显示面板及显示装置 | |
US20170205771A1 (en) | Watch and method for manufacturing the same | |
US11569476B2 (en) | Display substrate and display apparatus | |
CN112038389A (zh) | 显示基板及其制备方法、显示装置 | |
US11398523B2 (en) | Array substrate and manufacturing method thereof, display panel and display device | |
WO2019109692A1 (zh) | 电子装置基板及制造方法、显示装置 | |
WO2022057500A1 (zh) | 触控基板、显示面板及显示装置 | |
WO2021238645A1 (zh) | 显示用基板及其制备方法、显示装置 | |
WO2021155630A1 (zh) | 一种阵列基板及其制备方法、显示面板 | |
CN113241416A (zh) | 发光基板及其制备方法和发光装置 | |
US11626458B2 (en) | Transparent display panel and method for manufacturing the same, display device | |
CN111509140A (zh) | 显示用基板及其制备方法、显示装置 | |
CN110943116A (zh) | 一种显示面板、其制作方法及显示装置 | |
WO2020224009A1 (zh) | 一种显示面板、显示模组及电子装置 | |
WO2023168580A1 (zh) | 显示面板、显示母板及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20850602 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20850602 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20850602 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 03.02.2023) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20850602 Country of ref document: EP Kind code of ref document: A1 |