WO2018149158A1 - Oled显示面板及其制备方法、显示装置 - Google Patents
Oled显示面板及其制备方法、显示装置 Download PDFInfo
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H10K50/00—Organic light-emitting devices
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H10K50/844—Encapsulations
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Definitions
- Embodiments of the present disclosure relate to an organic light emitting diode (OLED) display panel, a method of fabricating the OLED display panel, and a display device.
- OLED organic light emitting diode
- OLED Organic Light-Emitting Diode
- OLED display technology has gradually replaced traditional liquid crystal display technology, and is widely used in mobile phones, computers, full-color TVs, digital video cameras, personal digital assistants and other electronic devices.
- the OLED display technology is different from the conventional liquid crystal display technology in that the OLED device of the OLED display panel includes an anode, a cathode, and a light-emitting layer interposed between the anode and the cathode.
- the cathode in the OLED display panel is an active metal, which is very sensitive to moisture and oxygen in the air, and is very easy to react with water vapor and oxygen which are infiltrated by the outside, affecting the injection of electric charge; in addition, water vapor permeating into the interior of the OLED device And oxygen also chemically reacts with the organic luminescent material in the luminescent layer, damaging the organic luminescent material, greatly reducing the luminous efficiency of the organic luminescent material, resulting in a decrease in performance and shortened life of the OLED display panel. Therefore, the requirements of the OLED display panel for packaging are very high.
- At least one embodiment of the present disclosure provides an organic light emitting diode (OLED) display panel, a method of fabricating the OLED display panel, and a display device.
- OLED organic light emitting diode
- At least one embodiment of the present disclosure provides a method of fabricating an organic light emitting diode (OLED) display panel, comprising: providing a substrate including a display area and a package area located around the display area; Forming a driving transistor, a passivation layer, and an OLED display on the base substrate a unit, wherein the OLED display unit and a driving transistor are formed in the display region, the passivation layer is formed in the display region and the package region, and the passivation layer is formed in the package region a plurality of recesses and a via formed in the display region exposing a source or a drain of the driving transistor, the via and the plurality of recesses being formed by one patterning process; coating in the package region a sealant, the sealant covers the plurality of recesses; and a package substrate is provided, wherein the package substrate and the base substrate are relatively closely packaged by the sealant.
- OLED organic light emitting diode
- the method for fabricating an OLED display panel further includes forming an encapsulation layer on the OLED display unit; forming a filling layer on the encapsulation layer; and sealing the encapsulation and the filling on the encapsulation layer
- the package substrate is disposed on the layer, thereby causing the package substrate and the substrate substrate to be relatively closely packaged.
- the material of the filling layer includes a desiccant.
- the longitudinal cross-sectional shape of the recess is rectangular or trapezoidal.
- the recess is a through hole penetrating the passivation layer.
- the method for fabricating an OLED display panel provided by at least one embodiment of the present disclosure further includes forming a gate insulating layer in the display region and the package region when forming the driving transistor, in forming the passivation layer
- the via hole exposes the gate insulating layer while the via hole is exposed, and the gate insulating layer is at least partially etched.
- an anode or a cathode of the OLED display unit passes through the via and a source of the driving transistor when the OLED display unit is formed. Or the drain is electrically connected.
- At least one embodiment of the present disclosure provides an organic light emitting diode (OLED) display panel, including: a substrate including a display region and a package region located around the display region; and the substrate is disposed on the substrate a driving transistor, a passivation layer, and an OLED display unit, wherein the OLED display unit and the driving transistor are disposed in the display region, and the passivation layer is disposed in the display region and the package region
- the passivation layer includes a plurality of first recesses in the package region and vias exposing a source or a drain of the driving transistor in the display region, the plurality of first recesses and the over
- the hole is formed by a patterning process, the OLED display unit is electrically connected to the driving transistor through the via hole; a frame sealant disposed in the package area, the frame frame
- the glue covers the plurality of first recesses; and the package substrate is oppositely packaged with the base substrate.
- an OLED display panel provided by at least one embodiment of the present disclosure further includes: an encapsulation layer disposed on the OLED display unit; a filling layer disposed on the encapsulation layer; the package substrate being disposed on the encapsulation frame And the filling layer, and the package substrate and the substrate substrate are relatively close to the package.
- the material of the filling layer includes a desiccant.
- the longitudinal shape of the first recess is rectangular or trapezoidal.
- the first recess is a through hole penetrating the passivation layer.
- a gate insulating layer of the driving transistor further extends into the package region and is exposed by the via hole, and the gate insulating layer further includes a second recess of the through hole.
- an anode or a cathode of the OLED display unit is electrically connected to a source or a drain of the driving transistor through the via.
- At least one embodiment of the present disclosure provides a display device including the OLED display panel of any of the above.
- OLED organic light emitting diode
- OLED organic light emitting diode
- OLED organic light emitting diode
- FIG. 2c is a schematic diagram of a driving circuit of an organic light emitting diode (OLED) display unit according to an embodiment of the present disclosure
- OLED organic light emitting diode
- OLED organic light emitting diode
- OLED organic light emitting diode
- FIG. 6 is a partial cross-sectional structural diagram of an organic light emitting diode (OLED) display panel according to still another embodiment of the present disclosure.
- each pattern in the OLED display panel to which the embodiments of the present disclosure are generally in the actual product is on the order of micrometers or less, and for the sake of clarity, the dimensions of the structures in the drawings of the embodiments of the present disclosure are enlarged unless It is also clearly stated that it does not represent the actual size and proportion.
- OLED organic light-emitting diode
- UV curing sealant At present, commonly used packaging technologies include ultraviolet (UV) curing sealant, glass powder laser sealing, face seal, desiccant packaging, die filling (Dam & Fill) and film packaging.
- Ultra-UV (UV) curing sealant, sealant and desiccant fill package (Dam&Fill) will use the organic sealant (Sealant), and some new packaging technology will also be combined with the use of organic sealant, so the organic sealant package
- the effect is very important.
- the adhesion of the organic sealant to the surface of the passivation layer is an important factor in determining the packaging effect.
- the contact surface between the organic sealant and the passivation layer is small, which results in poor packaging effect of the OLED display panel.
- the moisture and oxygen in the external environment are relatively easy to penetrate into the interior of the OLED display panel through the gap.
- the sealing area reacts with the internal components of the OLED display panel, resulting in faster degradation of the performance of the OLED display panel and shortened service life.
- FIG. 1 shows a partial cross-sectional structure of an organic light emitting diode (OLED) display panel.
- the OLED display panel includes a substrate substrate 60 including a display region 60A and a package region 60B.
- a driving transistor 64, a passivation layer 61, and an OLED display unit 65 are disposed on the display region 60A.
- the passivation layer 61 extends to the package region 60B.
- the encapsulation of the OLED display panel is achieved by directly coating the sealant 62 on the passivation layer 61 extending to the package region 60B and then irradiating with the ultraviolet light to cure the sealant 62.
- the contact area between the sealant 62 and the passivation layer 61 is small, and the adhesion between the sealant 62 and the passivation layer 61 is poor, resulting in an interface between the sealant 62 and the passivation layer 61. It is easy to generate a gap, and external water vapor and oxygen can enter the inside of the OLED display panel through the gap, thereby reacting with the light-emitting layer and the metal cathode inside the OLED display panel, resulting in rapid degradation of the performance of the OLED display panel, and the display panel Short life.
- At least one embodiment of the present disclosure provides a method of fabricating an organic light emitting diode (OLED) display panel, an OLED display panel, and a display device to improve package performance of the OLED display panel.
- OLED organic light emitting diode
- a method for fabricating an OLED display panel includes: providing a substrate; forming a driving transistor, a passivation layer, and an OLED display unit on the substrate;
- the base substrate includes a display area and a package area located around the display area, the OLED display unit and a driving transistor are formed in the display area, and the passivation layer is formed in the display area and the package area
- the passivation layer includes a plurality of recesses formed in the package region and via holes formed in the display region exposing a source or a drain of the driving transistor, the via holes and a plurality of recesses Forming a patterning process; applying a sealant in the package area, the sealant covers the plurality of recesses; providing a package substrate, the package substrate and the base substrate passing through the sealant Relatively close to the package.
- the method for preparing an OLED display panel can form a via hole and a plurality of recesses on the passivation layer by the same patterning process, thereby reducing the number of masks, shortening the production time of the OLED display panel, and reducing the OLED display panel.
- Production cost; on the other hand, the plurality of depressions can increase the contact area between the sealant and the passivation layer, thereby increasing the adhesion between the sealant and the passivation layer, improving the packaging effect of the OLED display panel, and reducing the penetration.
- the oxygen and water vapor inside the OLED display panel improve the display performance and device stability of the OLED display panel, prolong the service life of the OLED display panel, and improve the product yield.
- the patterning process is, for example, a photolithography patterning process, which includes, for example, coating a photoresist film on a structure layer to be patterned, and coating the photoresist film by spin coating or blade coating. Or a roll coating method; then exposing the photoresist layer using a mask, developing the exposed photoresist layer to obtain a photoresist pattern; and then etching the structural layer using a photoresist pattern, optionally The photoresist pattern is removed; the remaining photoresist is finally stripped to form the desired pattern structure.
- a photolithography patterning process which includes, for example, coating a photoresist film on a structure layer to be patterned, and coating the photoresist film by spin coating or blade coating. Or a roll coating method; then exposing the photoresist layer using a mask, developing the exposed photoresist layer to obtain a photoresist pattern; and then etching the structural layer using a photoresist pattern, optionally The photoresist pattern is
- one patterning process means forming a layer structure using the same mask.
- a patterning process may include multiple exposure, development, or etching processes, and the particular pattern in the resulting layer structure may be continuous or discontinuous, and these particular patterns may also be at different heights. Or have different thicknesses.
- FIG. 2a is a partial cross-sectional structural view of an organic light emitting diode (OLED) display panel according to an embodiment of the present disclosure
- FIG. 2b is a schematic plan view of an OLED display panel according to an embodiment of the present disclosure.
- FIGS. 3a-3i are process flow diagrams of a method for fabricating an OLED display panel according to an embodiment of the present disclosure
- FIG. 4 shows A partial cross-sectional structural view of another OLED display panel according to an embodiment of the present disclosure
- FIG. 5 is a partial cross-sectional structural diagram of another OLED display panel according to an embodiment of the present disclosure. It should be noted that Figures 2a, 2b, 2c, 3a-3i, 4 and 5 only show A portion of the OLED display panel related structure for a clearer explanation.
- the OLED display panel of the embodiment of the present disclosure includes: a substrate substrate 10, a driving transistor 2 disposed on the substrate substrate 10, a passivation layer 17 and an OLED display unit 1, a package substrate 33, and a setting A sealant 32 between the base substrate 10 and the package substrate 33.
- the passivation layer 17 includes a plurality of first recesses 35 and via holes 16 exposing the driving transistor 2, and the plurality of first recesses 35 and vias 16 are formed on the passivation layer 17 by the same patterning process, thereby reducing the number of masks Shorten the production time of OLED display panels, reduce the production cost of OLED display panels, and effectively increase production capacity and product yield.
- the sealant 32 is formed on the passivation layer 17 and covers the plurality of first recesses 35.
- the plurality of first recesses 35 can increase the contact area between the sealant 32 and the passivation layer 17, thereby increasing the sealant 32 and
- the adhesion of the interface of the passivation layer 17 improves the packaging effect of the OLED display panel, reduces oxygen and moisture permeating into the interior of the OLED display panel, improves display performance and device stability of the OLED display panel, and prolongs the service life of the OLED display panel.
- the longitudinal cross-sectional shape of the first recess 35 may be a rectangle or a trapezoid or the like.
- the plurality of first recesses 35 may be spaced apart from each other, as shown in FIG. 2a, and the plurality of first recesses 35 may be, for example, four, and embodiments of the present disclosure are not limited to these specific arrangements.
- the first recess 35 and the via 16 may have the same depth, and the first recess 35 and the via 16 may have different depths, for example, as shown in FIG.
- the first recess 35 may be a through hole 325 penetrating the passivation layer 17.
- the through hole 325 can further increase the contact area of the sealant 32 and the passivation layer 17, increase the adhesion of the sealant 32 to the interface of the passivation layer 17, and improve the packaging effect of the OLED display panel.
- the base substrate 10 includes a display area 10A and a package area 10B located around the display area 10A.
- the display area 10A may also be referred to as an AA (Active Area) area, and the display area 10A may include an array arrangement.
- the pixel unit is used for realizing display, and the package region 10B may be provided with a sealant or the like for implementing packaging of the display panel or the like.
- the passivation layer 17 may be disposed in the display region 10A and the package region 10B, the plurality of first recesses 35 are disposed in the package region 10B, and the via holes 16 are disposed in the display region 10A.
- the OLED display unit 1 may be disposed within the display area 10A, as shown in FIG. 2a, the OLED display unit 1 includes a first electrode 20, a pixel defining layer 21, an organic layer 22, and a second electrode 23.
- the organic layer 22 is sandwiched between the first electrode 20 and the second electrode 23, and the organic layer 22 may have a multilayer structure.
- the organic layer 22 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and The multilayer structure formed by the electron injecting layer, the organic layer 22 may further include a hole blocking layer and an electron blocking layer, The hole blocking layer may be disposed, for example, between the electron transport layer and the light emitting layer, and the electron blocking layer may be disposed, for example, between the hole transport layer and the light emitting layer.
- the arrangement and material of each layer in the organic layer 22 can be referred to a general design, and the embodiment of the present disclosure does not limit this.
- the pixel defining layer 21 is configured to define a sub-pixel region, and the light emitting layer in the organic layer 22 is correspondingly disposed in an open region of the pixel defining layer 21.
- the pixel defining layer 21 may be a one-layer or two-layer structure, or may be a multi-layer composite layer structure.
- the pixel defining layer 21 may include a first defining layer and a second defining layer, the first defining layer and the second defining layer may be made of different hydrophilic organic materials, and the first defining layer may be, for example, a hydrophilic organic
- the material is formed, and the second defining layer may be formed of, for example, a hydrophobic organic material, but embodiments of the present disclosure are not limited thereto.
- the first defining layer is adjacent to the organic layer 22
- the second defining layer is adjacent to the first electrode 20
- the first defining layer formed of the hydrophilic material can flatten the luminescent material.
- the droplets make the luminescent material droplets flatten the opening area of the pixel defining layer 21, so that the illuminating quality of the OLED display panel can be improved.
- the OLED display unit 1 can be driven by an active or passive drive.
- the passively driven OLED display panel is composed of a cathode and an anode. The intersection of the anode and the cathode can emit light, and the driving circuit can be packaged by a Tape Carrier Package (TCP). Or externally mounted by a connection method such as a chip on chip (Chip On Glass, COG).
- TCP Tape Carrier Package
- COG Chip On Glass
- the active-drive OLED display panel can be provided with a thin film transistor and a charge storage capacitor having a switching function for each pixel, and the entire system of the peripheral driving circuit and the OLED display unit 1 can be integrated on the same glass substrate. As shown in FIG.
- the OLED display unit 1 is in an actively driven manner such that the drive circuit includes the drive transistor 2.
- the drive transistor 2 is disposed in the display region 10A, and the drive transistor 2 can function as a driving component of the OLED display unit 1 to connect the OLED display unit 1 to a power source.
- the driving transistor 2 may include a gate electrode 11, a gate insulating layer 15, an active layer 12, a third electrode 13, and a fourth electrode 14, and the via hole 16 exposes the fourth electrode 14, through which the first electrode 20 passes
- the fourth electrode 14 is electrically connected.
- the third electrode 13 may be a source or a drain, and accordingly the fourth electrode 14 is a drain or a source.
- the gate insulating layer 15 of the driving transistor 2 may also extend into the package region 10B, and the via insulating layer 15 penetrating the passivation layer 17 exposes the gate insulating layer 15, for example, the gate insulating layer 15
- a second recess 36 corresponding to the through hole 325 may be included.
- the second recess 36 can contact the sealant 32 with the gate insulating layer 15 to further increase the depth of the sealant 32 on the substrate substrate 10, and extend the penetration of outside air, moisture, etc. into the OLED display panel.
- the internal channel length effectively blocks the penetration of air, water vapor, etc. into the interior of the OLED display panel, improving the display of the OLED display panel. Performance and device stability extend the life of OLED display panels.
- the driving circuit may further include a switching transistor 3 and a storage capacitor Cst, that is, the driving circuit may employ, for example, a 2T1C structure.
- the gate of the switching transistor 3 is connected to the gate line Vg, the input terminal (for example, the source or the drain) of the switching transistor 3 is electrically connected to the data line Vdata, and the output terminal (correspondingly, for example, the drain or the source) is electrically connected to the driving The gate 11 of the transistor 2.
- One end of the storage capacitor Cst is connected to the third electrode 13 of the driving transistor 2, and the other end is connected to, for example, an output terminal (for example, a drain or a source) of the switching transistor 3.
- the third electrode 13 of the driving transistor 2 can be connected, for example, to the power supply line Vdd
- the fourth electrode 14 can be electrically connected to the first electrode 20 of the OLED display unit 1
- the second electrode 23 of the OLED display unit 1 can be grounded, for example.
- the driving circuit may also be an optional structure such as 3T1C, 4T2C, etc., for example, the driving circuit may further include a detecting transistor, a compensating transistor, a reset transistor, etc., and embodiments of the present disclosure are not limited. The specific structure of the drive circuit.
- the OLED display panel of the present embodiment may further include: an encapsulation layer 30 disposed on the OLED display unit 1 and a filling layer 31 disposed on the encapsulation layer 30.
- the package substrate 33 is disposed on the sealant 32 and the filling layer 31, and the package substrate 33 and the base substrate 10 are relatively closely packaged.
- the sealant 32 and the filling layer 31 are formed of different materials, and the sealant 32 and the filling layer 31 can be separately disposed, so that no contact is made between the two, so that the sealant 32 and the filling layer can be avoided. Chemical and/or physical reactions occur between 31 to further ensure the sealing performance of the OLED display panel.
- a plurality of OLED display units 1 and driving transistors 2 are disposed in a display region 10A of a base substrate 10, which may be arranged in an array of m rows and n columns (m, n Is an integer).
- a plurality of first recesses 35 are disposed in the package region 10B, and the first recesses 35 are not limited to the arrangement of the single row and the single row in FIG. 2b.
- the first recess 35 may be disposed in a plurality of rows and columns, and the number of the first recesses 35 may be determined according to the area of the package region 10B.
- the OLED display panel provided by the embodiment of the present disclosure can independently emit light by using red, green and blue pixels.
- the OLED display panel provided by the embodiment of the present disclosure can also use the OLED display unit to emit white light, and then implement color display in combination with the color filter.
- the OLED display panel provided by the embodiment of the present disclosure can also adopt an OLED display.
- the unit emits blue light, and then the blue light is used to excite the light color conversion material to obtain red light and green light, thereby realizing color display. It will be understood by those of ordinary skill in the art that the manner of illumination of the OLED display panel of the embodiments of the present disclosure is not limited to the above three, and is not limited to the specific color of the light that it emits.
- a base substrate 10 is provided on which a gate electrode 11, a gate insulating layer 15, an active layer 12, a third electrode 13, and a fourth electrode 14 are formed by a deposition process and a patterning process.
- the drive transistor 2 and the like are configured.
- the base substrate 10 may be a transparent insulating substrate, and an example of a material for the base substrate 10 may be a glass substrate, a quartz substrate, or other suitable material.
- materials for the third electrode 13, the fourth electrode 14, and the gate electrode 11 may include a copper-based metal, an aluminum-based metal, or a nickel-based metal or the like.
- the copper-based metal has a characteristic of low resistivity and good electrical conductivity, so that the signal transmission rate of the third electrode 13 and the fourth electrode 14 can be improved.
- the material used for the active layer 12 may be amorphous silicon, polycrystalline silicon, an oxide semiconductor, or other suitable material.
- the polycrystalline silicon may be high temperature polycrystalline silicon or low temperature polycrystalline silicon
- the oxide semiconductor may be, for example, indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), zinc oxide (ZnO), or gallium zinc oxide (GZO).
- examples of the material forming the gate insulating layer 15 include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiN x O y ), or other suitable materials.
- a passivation layer 17 is formed on a substrate substrate 100 on which the driving transistor 2 is formed by a deposition process.
- examples of the material for the passivation layer 17 include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiN x O y ), or other suitable materials.
- a photoresist 18 is formed on the passivation layer 17, the photoresist 18 is exposed through a mask 19, and then the exposed photoresist 18 is developed. A photoresist pattern 180 is obtained.
- the passivation layer 17 is etched using the photoresist pattern 180 as a mask; finally, the remaining photoresist pattern 180 is stripped, thereby forming a plurality of first recesses 35 and exposed A portion of the via 16 of the fourth electrode 14.
- the mask 19 includes a first pattern 19a corresponding to the first recess 35 and a second pattern 19b corresponding to the via 16. Therefore, the first recess 35 and the via 16 can be formed by a patterning process, the number of masks is reduced, the production time of the OLED display panel is shortened, the production cost of the OLED display panel is reduced, and the productivity and the yield of the product are effectively improved.
- the etching time can be adjusted so that the first recess 35 can penetrate the passivation layer 17 to form a via hole 325.
- the gate insulating layer 15 is formed in the display region 10A and the package region 10B, and when the via hole 325 in the passivation layer 17 is formed, the metal and gate insulating can be used.
- the layer 15 material has a selective etchant, where the etch is stopped after the via 16 is formed to expose the fourth electrode 14, and the first recess 35 is formed through the passivation layer 17 to expose the gate insulating layer.
- the etching action after 15 continues here to at least partially etch the gate insulating layer 15 to form a second recess 36 on the gate insulating layer 15.
- the first electrode 20, the pixel defining layer 21, the organic layer 22, and the second electrode 23 are formed on the passivation layer 17 by a deposition process and a patterning process to constitute the OLED display unit 1.
- the first electrode 20 is electrically connected to the fourth electrode 14 via the via 16 .
- first electrode 20 and the second electrode 23 are an anode and the other is a cathode.
- the first electrode 20 may be formed, for example, of a transparent conductive material having a high work function, and the electrode material may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO) zinc oxide.
- ITO indium tin oxide
- IZO indium zinc oxide
- IGO indium gallium oxide
- GZO gallium zinc oxide
- the second electrode 23 may be formed of, for example, a material having high conductivity and a low work function, and the electrode material may include magnesium alloy An alloy such as (MgAl) or lithium aluminum alloy (LiAl) or a single metal such as magnesium, aluminum or lithium.
- magnesium alloy An alloy such as (MgAl) or lithium aluminum alloy (LiAl) or a single metal such as magnesium, aluminum or lithium.
- the organic layer 22 may include a light-emitting layer whose material of the light-emitting layer may be selected according to the color of the light emitted therefrom.
- the material of the luminescent layer includes a fluorescent luminescent material or a phosphorescent luminescent material.
- a doping system is generally employed, that is, a doping material is mixed in a host luminescent material to obtain a usable luminescent material.
- the host light-emitting material may be a metal compound material, a ruthenium derivative, an aromatic diamine compound, a triphenylamine compound, an aromatic triamine compound, a biphenyldiamine derivative, or a triarylamine polymer.
- a sealant 32 is formed on the passivation layer 17 at a position corresponding to the first recess 35 by a coating process or the like, and the sealant 32 covers the first recess 35, so that the sealant 32 At least partially entering the first recess 35, the first recess 35 can increase the contact area of the sealant 32 and the passivation layer 17, thereby increasing the adhesion of the sealant 32 to the interface of the passivation layer 17, and improving OLED
- the packaging effect of the display panel reduces the oxygen and moisture that penetrate into the OLED, improves the display performance and device stability of the OLED display panel, and prolongs the service life of the OLED display panel.
- the through hole 325 can further increase the contact area of the interface between the sealant 32 and the passivation layer 17, and improve the packaging effect of the OLED display panel; on the other hand, the through hole 325 and The second recess 36 can further increase the depth of the sealant 32 on the substrate substrate 10, and extend the passage length of the outside air, water vapor, etc. into the interior of the OLED display panel, effectively blocking the penetration of air, water vapor, etc. into the OLED.
- the inside of the display panel improves the display performance and device stability of the OLED display panel and prolongs the service life of the OLED display panel.
- the material of the sealant 32 may be an organic material, an inorganic material, or a combination of an organic material and an inorganic material.
- the organic material may include an epoxy resin, a polyurethane, an organic silicone, an acrylate, a polysiloxane, a polyamide, a polyester, or a combination of the above materials, and the inorganic material may include water glass or the like.
- the encapsulation layer 30 and the filling layer 31 are formed on the OLED display unit 1 by a deposition process; then the package substrate 33 is disposed on the encapsulation 32 and the filling layer 31 such that the package substrate 33 and the substrate are 10 is relatively bonded, and finally irradiated with ultraviolet light or cured by a process such as thermal curing to complete the encapsulation of the package substrate 33 and the substrate 10 .
- the material of the filling layer 31 may include a desiccant to block moisture or the like from entering the inside of the OLED display panel.
- the material of the filling layer 31 may be a polymer material containing a desiccant; a polymer material that can block moisture, etc., such as a polymer resin, etc.; or a water-absorbent material, for example, an alkali metal (for example, Li) , Na), alkaline earth metals (such as Ba, Ca) or other moisture-reactive metals (such as Al, Fe); may also be alkali metal oxides (such as Li 2 O, Na 2 O), alkaline earth metal oxides (for example) MgO, CaO, BaO), a sulfate (for example, anhydrous MgSO 4 ), a metal halide (for example, CaCl 2 ), or a perchlorate (for example, Mg(ClO 4 ) 2 ).
- an alkali metal for example, Li
- the material of the encapsulation layer 30 may be silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiN x O y ), or other suitable materials.
- the sealant 32 can also be cured by pressing, melting, cooling, reaction curing, or a combination thereof.
- Typical materials that cure by pressing include pressure sensitive adhesives.
- Typical materials that cure by melting and cooling include hot melt adhesives such as polyolefins, polyesters or polyamides.
- Typical materials that are cured by the reaction include acrylates, epoxies, polyurethanes, polysiloxanes, or combinations thereof, and the reaction curing includes, for example, curing by heat curing or ultraviolet radiation.
- the driving transistor 2 may be a thin film transistor adopting a bottom gate type structure, or may be a thin film transistor adopting a top gate type structure.
- the driving transistor 2 adopts a bottom.
- the OLED display unit 1 may adopt a bottom emission or a top emission mode, and may also adopt a two-sided emission mode.
- the anode thereof may be a transparent electrode such as an indium tin oxide electrode, and the cathode may be an opaque metal.
- the embodiments of the present disclosure do not limit this.
- FIG. 6 is a partial cross-sectional structural diagram of an OLED display panel according to an embodiment of the present disclosure. As shown in FIG. 6 , the OLED display panel provided by the embodiment of the present disclosure adopts a bottom emission mode.
- the OLED display panel provided by the embodiment of the present disclosure can use a OLED display unit to emit white light, and then implement color display in combination with a color filter.
- the OLED display panel of the embodiment of the present disclosure includes: a substrate substrate 10 , a driving transistor 2 , a passivation layer 17 , a color filter film 41 , a flat layer 40 , an OLED display unit 1 , an encapsulation layer 30 , and a filling Layer 31, package substrate 33 and sealant 32.
- the passivation layer 17 is disposed in the display region 10A and the package region 10B, and the via hole 16 and the first recess 35 are formed by one patterning process, thereby reducing the number of masks, shortening the production time of the OLED display panel, and reducing the production of the OLED display panel.
- the first recess 39 is formed in the package area 10B and covers the first recess 35. The contact area between the passivation layers 17 increases the adhesion between the sealant 32 and the passivation layer 17, improving the packaging effect of the OLED display panel.
- the color filter film 41 is overlapped with an opening region defined by the pixel defining layer 21 in the OLED display unit 1, so that light emitted from the organic layer 22 can pass through the color filter film 41.
- Filter to achieve color display may include three primary color filter films, and the display unit corresponding to the schematic view as shown in FIG. 6 may be a red filter film, a blue filter film, or a green filter film.
- the organic layer 22 can emit white light, and then filter through the color filter film 41 to obtain three primary colors, and then combine the three primary colors to realize color display.
- each pixel defining area of the pixel defining layer 21 corresponds to one pixel electrode, and each sub-pixel defining area of the pixel defining area corresponds to a single color sub-pixel defining area.
- the color filter film 41 is illustrated. It can be a monochromatic filter film.
- the plurality of sub-pixel defining regions form one pixel defining region, and the color filter films 41 of the plurality of sub-pixel defining regions may respectively correspond to the red filter film, the blue filter film, the green filter film, and the like, thereby realizing color. display.
- the material used for the planarization layer 40 can be an organic material including, for example, epoxy, polyimide, polyamide, acrylic, or other suitable materials.
- the structure and preparation materials of the other layers of the OLED display panel of the embodiments of the present disclosure may be the same as the embodiment of the method for fabricating the OLED display panel described above, and details are not described herein again.
- the step before the formation of the passivation layer 17 may be the same as the corresponding steps in the embodiment of the method for fabricating the OLED display panel described above.
- a color filter film 41 is formed on the passivation layer 17, and then a flat layer 40 is formed on the color filter film 41.
- a first recess is formed by a patterning process. 35 and a portion of the via 16 exposing a portion of the fourth electrode 14.
- the color filter film 41 and the flat layer 40 may be formed first, and then the first recess 35 and the via hole 16 are formed on the passivation layer 17, so that the color filter film 41 and the flat layer can be prevented from being formed.
- the second electrode 14 exposed by the via hole 16 reacts with oxygen or the like in the air to form a metal oxide layer, resulting in poor electrical contact with the first electrode 20, affecting the display performance of the OLED display panel.
- the steps after the first recess 35 and the via 16 are formed may also be the same as the embodiment of the method for fabricating the OLED display panel described above, and are not described herein again.
- the color filter film 41 can be formed by a method such as a dyeing method, a pigment dispersion method, a reverse printing method, a thermal multilayer technique, or an inkjet printing method.
- the embodiment of the present disclosure further provides a display device including the organic light emitting diode (OLED) display panel of any of the above embodiments, and further includes a gate driving circuit, a data driving circuit, a power source, and the like.
- the display device can be any product or component having a display function such as a television, a digital camera, a mobile phone, a watch, a tablet, a notebook computer, a navigator, and the like.
- the display area 10A and the package area 10B in the OLED display panel are all divided according to corresponding areas on the OLED display panel, and the physical boundary of the areas may not exist on the base substrate 10 of the OLED display panel. .
- Embodiments of the present disclosure provide an organic light emitting diode (OLED) display panel, a method of fabricating an OLED display panel, and a display device, which can form a via hole and a plurality of recesses on a passivation layer by a patterning process, thereby reducing the number of masks. Shortening the production time of the OLED display panel and reducing the production cost of the OLED display panel; on the other hand, the plurality of recesses can increase the contact area between the sealant and the passivation layer.
- OLED organic light emitting diode
Abstract
Description
Claims (15)
- 一种有机发光二极管(OLED)显示面板的制备方法,包括:提供衬底基板,所述衬底基板包括显示区域和位于所述显示区域周边的封装区域;在所述衬底基板上形成驱动晶体管、钝化层和OLED显示单元,其中,所述OLED显示单元和驱动晶体管形成在所述显示区域内,所述钝化层形成在所述显示区域以及所述封装区域内,所述钝化层包括形成在所述封装区域内的多个凹陷和形成在所述显示区域内暴露所述驱动晶体管的源极或漏极的过孔,所述过孔和多个凹陷通过一次构图工艺形成;在所述封装区域内涂覆封框胶,所述封框胶覆盖所述多个凹陷;提供封装基板,所述封装基板和所述衬底基板通过所述封框胶相对贴合封装。
- 根据权利要求1所述的OLED显示面板的制备方法,还包括:在所述OLED显示单元上形成封装层;在所述封装层上形成填充层;在所述封框胶和所述填充层上设置所述封装基板,由此使得所述封装基板和所述衬底基板相对贴合封装。
- 根据权利要求2所述的OLED显示面板的制备方法,其中,所述填充层的材料包括干燥剂。
- 根据权利要求1-3任一项所述的OLED显示面板的制备方法,其中,所述凹陷的纵截面形状为矩形或梯形。
- 根据权利要求1-4任一项所述的OLED显示面板的制备方法,其中,所述凹陷为贯穿所述钝化层的通孔。
- 根据权利要求5所述的OLED显示面板的制备方法,还包括:在形成所述驱动晶体管时,在所述显示区域和封装区域内形成栅绝缘层,在形成所述钝化层中的通孔时,所述通孔暴露所述栅绝缘层,且所述栅绝缘层被至少部分刻蚀。
- 根据权利要求1-6任一项所述的OLED显示面板的制备方法,其中,在形成所述OLED显示单元时,所述OLED显示单元的阳极或阴极通过所述过孔与所述驱动晶体管的源极或漏极电连接。
- 一种有机发光二极管(OLED)显示面板,包括:衬底基板,包括显示区域和位于所述显示区域周边的封装区域;设置在所述衬底基板上的驱动晶体管、钝化层和OLED显示单元,其中,所述OLED显示单元和驱动晶体管设置在所述显示区域内,所述钝化层设置在所述显示区域以及所述封装区域内,所述钝化层包括在所述封装区域内的多个第一凹陷和在所述显示区域内暴露所述驱动晶体管的源极或漏极的过孔,所述多个第一凹陷和所述过孔通过一次构图工艺形成,所述OLED显示单元通过所述过孔与所述驱动晶体管电连接;设置在所述封装区域内的封框胶,所述封框胶覆盖所述多个第一凹陷;封装基板,与所述衬底基板相对贴合封装。
- 根据权利要求8所述OLED显示面板,还包括:设置在所述OLED显示单元上的封装层;设置在所述封装层上的填充层,其中,所述封装基板设置在所述封框胶和所述填充层上,且所述封装基板和所述衬底基板相对贴合封装。
- 根据权利要求9所述OLED显示面板,其中,所述填充层的材料包括干燥剂。
- 根据权利要求8-10任一项所述OLED显示面板,其中,所述第一凹陷的纵截面形状为矩形或梯形。
- 根据权利要求8-11任一项所述OLED显示面板,其中,所述第一凹陷为贯穿所述钝化层的通孔。
- 根据权利要求12所述OLED显示面板,其中,所述驱动晶体管的栅绝缘层还延伸到所述封装区域之中并由所述通孔暴露,所述栅绝缘层还包括对应于所述通孔的第二凹陷。
- 根据权利要求8-13任一项所述OLED显示面板,其中,所述OLED显示单元的阳极或阴极通过所述过孔与所述驱动晶体管的源极或漏极电连接。
- 一种显示装置,包括权利要求8-14任一项所述的OLED显示面板。
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CN106876328A (zh) | 2017-06-20 |
US20180331320A1 (en) | 2018-11-15 |
US10439163B2 (en) | 2019-10-08 |
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