WO2021027811A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2021027811A1
WO2021027811A1 PCT/CN2020/108428 CN2020108428W WO2021027811A1 WO 2021027811 A1 WO2021027811 A1 WO 2021027811A1 CN 2020108428 W CN2020108428 W CN 2020108428W WO 2021027811 A1 WO2021027811 A1 WO 2021027811A1
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WIPO (PCT)
Prior art keywords
substrate
retaining wall
display panel
pattern
layer
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PCT/CN2020/108428
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English (en)
French (fr)
Inventor
文平
蒋志亮
王格
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/419,620 priority Critical patent/US20220085329A1/en
Publication of WO2021027811A1 publication Critical patent/WO2021027811A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display device.
  • Self-luminous display devices such as Organic Light-Emitting Diode (OLED) display devices have the characteristics of self-luminescence, lightness and thinness, low power consumption, good color reproduction, responsiveness, and wide viewing angle, and have been more and more widely used.
  • display devices such as mobile phones, laptops, and TVs.
  • people have put forward higher demands for narrow bezels.
  • a display panel has a display area and a peripheral area, and the display panel includes a substrate, a barrier wall, and a filling pattern.
  • the retaining wall is arranged on the substrate and located in the peripheral area.
  • the retaining wall has a first top surface, a first bottom surface, and a first side surface connected to the first top surface and the first bottom surface; the first top surface and the first bottom surface of the retaining wall are perpendicular to the
  • the substrates are arranged oppositely in the direction, and the first bottom surface is closer to the substrate than the first top surface.
  • the filling pattern is arranged on the outside of the connecting position of the first side surface and the first bottom surface. The slope of the side surface of the outer contour formed by the retaining wall and the filling pattern as a whole is smaller than the slope of the first side surface.
  • the filling pattern has a second bottom surface, a second side surface, and a third side surface.
  • the second bottom surface is connected to the second side surface and the third side surface respectively.
  • the second side surface is farther away from the retaining wall than the third side surface.
  • the slope of the second side surface is smaller than the slope of the first side surface.
  • the included angle between the second side surface and the second bottom surface is less than about 30°.
  • the included angle between the first side surface and the first bottom surface is about 30° to 90°.
  • the number of the filling patterns is multiple, and the multiple filling patterns include a first filling pattern and a second filling pattern.
  • the first filling pattern is located on a side of the retaining wall close to the display area, and the second filling pattern is located on a side of the retaining wall away from the display area.
  • the width of the retaining wall is about 30 ⁇ m-50 ⁇ m.
  • the number of the retaining walls is multiple, and the multiple retaining walls include a first retaining wall and a second retaining wall.
  • the first retaining wall and the second retaining wall are spaced apart, and the first retaining wall is closer to the display area than the second retaining wall .
  • the height of the second retaining wall is greater than the height of the first retaining wall.
  • the display panel further includes an encapsulation layer covering the display area.
  • the encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer.
  • the edge of the orthographic projection of the organic packaging layer on the substrate is located within the edge of the orthographic projection of the retaining wall on the substrate close to the display area.
  • the inorganic encapsulation layer also extends to the peripheral area.
  • the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the retaining wall on the substrate and the filling pattern on the substrate. Orthographic projection on the substrate.
  • the organic encapsulation layer and the filling pattern are arranged in the same layer and have the same material.
  • the inorganic encapsulation layer is two layers, namely a first inorganic encapsulation layer and a second inorganic encapsulation layer.
  • the first inorganic encapsulation layer is closer to the substrate than the second inorganic encapsulation layer, and the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.
  • the distance between the top of the filling pattern far from the substrate and the substrate is smaller than the distance between the first top surface and the substrate. spacing.
  • the retaining wall includes a first pattern.
  • the display panel further includes a pixel defining layer.
  • the pixel defining layer is disposed on the substrate and located in the display area.
  • the first pattern and the pixel defining layer are arranged in the same layer and have the same material.
  • the retaining wall further includes a second pattern.
  • the second pattern is located on a side of the first pattern away from the substrate.
  • the display panel also includes a spacer.
  • the isolation pillars are located in the display area; the second pattern and the isolation pillars are arranged in the same layer and have the same material. In the direction perpendicular to the substrate, the distance between the top of the filling pattern far from the substrate and the substrate is smaller than the surface of the second pattern close to the substrate and the substrate Pitch.
  • the retaining wall further includes a third pattern.
  • the third pattern is located on a side of the first pattern close to the substrate.
  • the display panel further includes a flat layer covering at least the display area.
  • the flat layer and the third pattern are arranged in the same layer and have the same material. In the direction perpendicular to the substrate, the distance between the top of the filling pattern far from the substrate and the substrate is smaller than the surface of the third pattern far from the substrate and the substrate Pitch.
  • the substrate includes a flexible substrate.
  • a display device in another aspect, includes: the display panel as described in any of the above embodiments.
  • a method for manufacturing a display panel includes: providing a substrate, the substrate having a display area and a peripheral area; forming a retaining wall on the substrate and the peripheral area; the retaining wall has a first top surface and a first bottom surface And a first side surface connected to the first top surface and the first bottom surface; the first top surface and the first bottom surface of the retaining wall are oppositely arranged in a direction perpendicular to the substrate, and the first The bottom surface is closer to the substrate than the first top surface; a filling pattern is formed on the outside of the connection position of the first side surface and the first bottom surface; the retaining wall and the filling pattern are formed as a whole The slope of the side surface of the outer contour is smaller than the slope of the first side surface.
  • the preparation method further includes: forming an encapsulation layer covering the display area on the substrate; the encapsulation layer includes an organic encapsulation layer, and the organic encapsulation layer is formed on the substrate.
  • the edge of the orthographic projection is located within the edge of the orthographic projection of the retaining wall on the substrate near the display area; the organic encapsulation layer and the filling pattern are simultaneously formed by an inkjet printing process.
  • the total amount of ink droplets printed by inkjet printing is about 10 ⁇ m 3 -30 ⁇ m 3 .
  • FIG. 1 is a top view of a display panel according to some embodiments of the present disclosure
  • Fig. 2 is a cross-sectional view of the display panel in Fig. 1 along the A-A' direction;
  • FIG. 3 is a structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 4 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 5 is a structural diagram of a display panel according to related technologies
  • FIG. 6A is another top view of a display panel according to some embodiments of the present disclosure.
  • FIG. 6B is another top view of a display panel according to some embodiments of the present disclosure.
  • FIG. 7A is another top view of a display panel according to some embodiments of the present disclosure.
  • FIG. 7B is a cross-sectional view of the display panel in FIG. 7A along the direction B-B';
  • FIG. 7C is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 8A is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 8B is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • Fig. 9A is a cross-sectional view of the display panel in Fig. 1 along the direction D-D';
  • FIG. 9B is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 10 is a structural diagram of sub-pixels according to some embodiments of the present disclosure.
  • FIG. 11 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 12 is a structural diagram of a display device according to some embodiments of the present disclosure.
  • FIG. 13 is a flow chart of preparing a display panel according to some embodiments of the present disclosure.
  • FIG. 14A is another top view of a display panel according to some embodiments of the present disclosure.
  • Fig. 14B is a cross-sectional view of the display panel in Fig. 14A along the direction E-E';
  • FIG. 14C is still another top view of a display panel according to some embodiments of the present disclosure.
  • Fig. 14D is a cross-sectional view of the display panel in Fig. 14C along the F-F' direction;
  • FIG. 15A is a manufacturing process diagram of a display panel according to some embodiments of the present disclosure.
  • 15B is another manufacturing process diagram of the display panel according to some embodiments of the present disclosure.
  • 15C is a diagram of still another manufacturing process of the display panel according to some embodiments of the present disclosure.
  • FIG. 15D is another manufacturing process diagram of the display panel according to some embodiments of the present disclosure.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.
  • the expressions “coupled” and “connected” and their extensions may be used.
  • the term “connected” may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used when describing some embodiments to indicate that two or more components have direct physical or electrical contact.
  • the term “coupled” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited to the content herein.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and the combination of A and B.
  • the exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances are conceivable. Therefore, the exemplary embodiments should not be construed as being limited to the shape of the area shown herein, but include shape deviation due to, for example, manufacturing.
  • the etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
  • the level of the packaging process determines the lifetime of the device therein.
  • thin film encapsulation TFE
  • TFE thin film encapsulation
  • the width of the retaining wall will be shortened, and the angle between the side and the bottom of the corresponding retaining wall will also increase, making the slope of the side of the retaining wall larger, so that the subsequent film layer is on the retaining wall.
  • the stress at the bottom of the display panel is relatively concentrated (larger stress), which is prone to breakage, which affects the performance of the display panel. If the angle between the side surface and the bottom surface of the retaining wall is reduced, the top surface of the retaining wall cannot be flattened, and the process is difficult and difficult to implement.
  • the display panel 1 has a display area (Active Area, AA) 10 and a peripheral area 11.
  • the peripheral area 11 may be located on at least one side outside the display area 10, for example, the peripheral area 11 may surround the display area 10.
  • the display panel 1 includes a substrate 12.
  • the substrate 12 may include a rigid substrate such as glass (or referred to as a rigid substrate), or a flexible substrate such as PI (Polyimide, polyimide); it may also include a rigid substrate A film layer (such as a buffer layer, etc.) on a substrate or a flexible substrate.
  • the display panel 1 further includes a retaining wall 13 disposed on the substrate 12 and located in the peripheral area 11.
  • the retaining wall 13 has a first top surface 1301, a first bottom surface 1302 and a first side surface 1303.
  • the first side surface 1303 is connected to the first top surface 1301 and the first bottom surface 1302.
  • the first top surface 1301 and the first bottom surface 1302 are disposed oppositely, and the first bottom surface 1302 is closer to the substrate 12 than the first top surface 1301. .
  • the display panel 1 further includes a filling pattern 14.
  • the filling pattern 14 is arranged on the outer side of the connecting position of the first side surface 1303 and the first bottom surface 1302.
  • the slope of the side surface 1304 (for example, the dotted line in FIG. 2) of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole is smaller than the slope of the first side surface 1303. That is to say, the filling pattern 14 is used to make the slope of the side surface 1304 of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole more gentle with respect to the slope of the first side surface 1303 of the retaining wall 13.
  • the slope of the side refers to the ratio of the vertical height to the horizontal distance of the side, that is, the ratio of the vertical height to the horizontal distance at any position on the side.
  • the vertical height of the position Q1 on the side 1304 of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole is H1 (that is, the distance between the position Q1 and the first bottom surface 1302 in the Z direction)
  • the horizontal distance of the Q1 position is L1 (that is, the distance between the Q1 position in the X direction and the edge of the side 1304, that is, the distance between the Q1 position in the X direction and the farthest point S1 of the filling pattern 14 away from the retaining wall 13 )
  • the slope of the side surface 1304 is H1/L1
  • the vertical height of the position Q2 on the first side surface 1303 of the retaining wall 13 is H2 (that is, the distance between the position Q2 and the first bottom surface 1302 in the Z direction)
  • FIG. 2 illustrates the contact between the filling pattern 14 and the retaining wall 13, but the embodiment of the present disclosure is not limited to this, and other film layers may also be provided between the filling pattern 14 and the retaining wall 13.
  • the embodiment of the present disclosure does not limit the film layer that is in contact with the side of the barrier wall 13 close to the substrate 12, and the film layer may be, for example, an insulating layer (for example, an inorganic insulating layer).
  • the retaining wall 13 and the filling pattern 14 are not in contact. As shown in FIG.
  • the retaining wall 13 and the filling pattern 14 are formed as a whole
  • the side surface 1304 of the outer contour can be considered as the surface formed by the side of the filling pattern 14 far from the retaining wall 13 (ie, the second side surface 1402 hereinafter) extending to the edge of the first top surface 1301.
  • the side surface of the other film layer located between the filling pattern 14 and the barrier wall 13 and the side surface of the filling pattern 14 may be approximately regarded as the side surface 1304 of the outer contour formed by the barrier wall 13 and the filling pattern 14 as a whole.
  • the embodiment of the present disclosure does not limit the material of the filling pattern 14.
  • the material of the filling pattern 14 may be a flexible material.
  • the filling pattern 14 has a second bottom surface 1401, a second side surface 1402 and a third side surface 1403.
  • the second bottom surface 1401 is connected to the second and third color sub-pixels respectively.
  • the first color sub-pixel For example, the first color sub-pixel,
  • the side surface 1304 of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole can be approximately regarded as the second side surface 1402, that is, The slope of the second side surface 1402 can be regarded as the slope of the side surface 1304 of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole.
  • the slope of the side surface of the overall outer contour is relatively gentler. That is, the slope of the second side surface 1402 of the filling pattern 14 can be made smaller than the slope of the first side surface 1303 of the retaining wall 13, so that when the filling pattern 14 and the retaining wall 13 are regarded as a whole, the slope of the side surface of the overall outer contour is gentle.
  • the slope of the first side of the retaining wall 13 is larger, and the subsequent film layer (for example, the second inorganic encapsulation layer 1722 hereinafter) is connected to the first side of the retaining wall 13
  • the slope at the connection position of the first bottom surface is also relatively large, which makes the subsequent film layer prone to stress concentration at this position, that is, the subsequent film layer receives more stress at this position. Large, so that the subsequent film will have the risk of cracking (Crack), reducing the subsequent film's barrier effect on water vapor, oxygen and impurities.
  • the filling pattern 14 is arranged on the outer side of the connecting position of the first side 1303 and the first bottom surface 1302 of the barrier wall 13, so that the barrier wall 13 and the filling pattern 14 are formed as a whole.
  • the slope of the side surface of the contour is smaller than the slope of the first side 1303, that is, the side of the outer wheel formed by the retaining wall 13 and the filling pattern 14 as a whole is gentler than the first side 1303, which can reduce the subsequent film layer on the retaining wall 13
  • the slope at the connection position of the first side surface 1303 and the first bottom surface 1302 makes the subsequent film layer more gentle, which can avoid the subsequent film layer from being subjected to greater stress at this position and reduce the risk of subsequent film layer cracking.
  • the embodiment of the present disclosure provides a display panel 1, by disposing the filling pattern 14 on the outside of the connecting position of the first side 1303 and the first bottom surface 1302 of the barrier wall 13, so that the barrier wall 13 and the filling pattern 14 are formed as a whole
  • the slope of the side surface of the outer contour of the outer contour is smaller than the slope of the first side surface 1303, that is, the side surface of the outer wheel formed by the retaining wall 13 and the filling pattern 14 as a whole is gentler than the first side surface 1303. Therefore, in the subsequent process of making other film layers, the gradient of the subsequent film layer at the position of the filling pattern 14 is relatively gentle.
  • the subsequent film layer can be formed on the first side of the retaining wall 13
  • the connection position of 1303 and the first bottom surface 1302 is relatively gentle, thereby avoiding the problem of the subsequent film layer having relatively concentrated stress (that is, greater stress) at the connection position of the first side 1303 and the first bottom surface 1302 of the retaining wall 13, and reducing the follow-up
  • the risk of cracking of the film layer improves the performance of the display panel 1 and helps the display panel 1 to achieve a narrow frame.
  • the embodiment of the present disclosure does not limit the planar shape of the retaining wall (such as the shape of the orthographic projection of the retaining wall on the plane where the substrate is located, such as the plane determined by X-Y in FIG. 1).
  • the plan shape of the retaining wall can be a closed ring surrounding the display area as shown in FIG. 1, for example, it can be set to a rectangular ring, a circular ring, a near circular ring, an ellipse, etc., according to the shape of the display area, so that the barrier The wall can have the function of preventing overflow in any plane direction.
  • the plane shape of the retaining wall may be a ring with a gap, which is set in an area where overflow is not easy to occur, so as to prevent the retaining wall material from bulging when heated and expand, and maintain a good overflow prevention effect.
  • the planar shape of the retaining wall (that is, the shape of the orthographic projection on the plane where the substrate is located) may be segmented, for example, a straight line section or a curved section, for example, the retaining wall may include at least one section Sub-retaining walls, for example, multiple sub-retaining walls, multiple sub-retaining walls can be collectively enclosed in a ring, or at least one segment of sub-retaining walls can be set only in areas prone to overflow.
  • Retaining walls are set in the area to simplify the structure of the display substrate.
  • the plane shape of the retaining wall may not be a straight shape, but may be curved.
  • the sides of the rectangular ring may be slightly curved, and each segment of the segmented type may be curved, etc., as long as a good anti-overflow effect can be achieved The embodiment of the present disclosure does not limit this.
  • the included angle ⁇ between the first side surface 1303 and the first bottom surface 1302 is about 30° to 90°.
  • the angle ⁇ is 40°, 60°, or 80°. It should be noted that the "about” in the text refers to a value within the allowable process error range, and does not strictly limit the limit.
  • the barrier effect of the retaining wall 13 against droplets can be improved; and, when the height of the retaining wall 13 is constant, the first top surface of the retaining wall 13 can be guaranteed
  • the width of 1301 will not be too small, so as to avoid that the width of the first top surface 1301 of the retaining wall 13 is too small, causing the subsequently formed film layer covering the retaining wall 13 (such as an inorganic encapsulation layer) to be disconnected at the retaining wall 13 .
  • the included angle ⁇ between the second side surface 1402 and the second bottom surface 1401 is smaller than the included angle ⁇ between the first side surface 1303 and the first bottom surface 1302.
  • the slope of the second side surface 1402 can be represented by tan ⁇
  • the slope of the first side surface 1303 can be represented by tan ⁇ .
  • the angle ⁇ between the second side surface 1402 and the second bottom surface 1401 is approximately less than 30°.
  • the included angle ⁇ is 15°, 20°, or 25°.
  • the second side surface 1402 may be an inclined plane or a curved surface (for example, the second side surface 1402 is recessed toward the substrate 12 side). Wherein, when the second side surface 1402 is a curved surface, the included angle between the second side surface 1402 and the second bottom surface 1401 may be the included angle between the tangent plane of the second side surface 1402 and the second bottom surface 1401.
  • the filling pattern 14 may be located on at least one outer side of the retaining wall 13.
  • the filling pattern 14 may be located on an outer side of the retaining wall 13, for example, as shown in FIG. 6A, the filling pattern 14 is located on the side of the retaining wall 13 close to the display area 10.
  • the multiple filling patterns 14 include a first filling pattern 141 and a second filling pattern 142.
  • the first filling pattern 141 is located on the side of the barrier wall 13 close to the display area 10
  • the second filling pattern 142 is located on the side of the barrier wall 13 away from the display area 10.
  • the subsequent film layers located on the opposite sides of the retaining wall 13 can be relatively gentle at the positions of the first filling pattern 141 and the second filling pattern 142, so as to prevent the subsequent film layer from being stressed.
  • the concentrated position allows the stress on the subsequent film to be evenly distributed.
  • the width of the barrier wall 13 is about 30 ⁇ m-50 ⁇ m.
  • the width of the first top surface 1301 and the first bottom surface 1302 of the retaining wall 13 are both within this range.
  • the slope of the retaining wall will increase accordingly, that is, the angle between the first side surface and the first bottom surface of the retaining wall will increase.
  • the subsequent film layer is likely to be broken at the position of the angle between the first side surface and the first bottom surface. Therefore, the range in which the width of the retaining wall can be reduced is limited.
  • the embodiment of the present disclosure can reduce the gradient of the subsequent film layer at the position of the angle between the first side surface and the first bottom surface through the filling pattern.
  • the width of the retaining wall in the embodiment of the present disclosure can be reduced to a greater extent, so that the angle between the first side surface of the retaining wall and the first bottom surface is larger, that is, the first side surface of the retaining wall has a larger
  • the slope can ensure the flatness of the first top surface of the retaining wall in the process of realizing the narrow frame, and can also ensure the blocking effect of the retaining wall on liquid droplets.
  • the multiple retaining walls 13 include a first retaining wall 131 and a second retaining wall 132.
  • the first retaining wall 131 and the second retaining wall 132 are spaced apart, and the first retaining wall 131 is closer to the display area 10 than the second retaining wall 132, that is, the first retaining wall 131 is located between the second retaining wall 132 and the display area 10.
  • the height of the second retaining wall 132 is greater than the height of the first retaining wall 131.
  • the height refers to the distance between the first top surface and the first bottom surface of the retaining wall in a direction perpendicular to the substrate 12.
  • the first retaining wall 131 and the second retaining wall 132 may be arranged in a concentric ring shape.
  • each retaining wall can be a closed ring, and the other can be segmented; or both It is a segmented type, in which at least one opening of one retaining wall corresponds to a section of a sub-retaining wall of another retaining wall; or, at least one opening of two retaining walls at least partially overlaps, etc.; or, one of the retaining walls is segmented,
  • the other is a closed loop.
  • the first barrier 131 may limit the organic packaging material in a specific area during the formation of, for example, the organic packaging layer.
  • the edge of the organic packaging layer may be located within the first barrier 131 close to the display area 10, so that Avoid overflow of organic encapsulation layer.
  • the second retaining wall 132 can block water vapor, oxygen, impurities, etc. from the peripheral area 11 into the display panel 1.
  • the second retaining wall 132 can also prevent the first retaining wall 131 from being unable to complete the organic encapsulation layer.
  • the organic encapsulation material is blocked, that is, the first retaining wall 131 has insufficient interception ability to the organic encapsulation material, which causes the organic encapsulation material to extend to areas other than the specific area of the display panel 1 and affect the performance of the display panel 1.
  • the aforementioned specific area is generally the display area 10, and may also include the boundary of the peripheral area 11 next to the display area 10, and does not exceed the area of the retaining wall 13 closest to the display area 10 (for example, the aforementioned first retaining wall 131) .
  • the boundary of the organic encapsulation layer is within the area defined by the barrier 13 (for example, the first barrier 131) closest to the display area 10.
  • the number of retaining walls 13 is two, namely, one first retaining wall 131 and one second retaining wall 132. In this way, it can satisfy the barrier to the organic packaging material when the organic packaging layer is formed, and can play the role of blocking water vapor, oxygen and impurities; and the area occupied by the two barrier walls 13 in the peripheral area 11 is relatively small, which is convenient for display Panel 1 realizes a narrow frame.
  • the plurality of retaining walls 13 includes a first retaining wall 131 and a second retaining wall 132
  • the angle between the first side surface of the first retaining wall 131 and the first bottom surface is recorded as ⁇ 1
  • the angle between the first side surface and the first bottom surface of the second retaining wall 132 is recorded as ⁇ 2
  • ⁇ 1 and ⁇ 2 may be equal or unequal.
  • the display panel 1 further includes an encapsulation layer 17 covering the display area 10.
  • the encapsulation layer 17 may be a thin film encapsulation layer.
  • the encapsulation layer 17 includes an organic encapsulation layer 171 and an inorganic encapsulation layer 172.
  • the edge of the orthographic projection of the organic encapsulation layer 171 on the substrate 12 is located within the edge of the orthographic projection of the barrier 13 on the substrate 12 close to the display area 10.
  • the inorganic encapsulation layer 172 extends to the peripheral area 11, and the orthographic projection of the inorganic encapsulation layer 172 on the substrate 12 covers the orthographic projection of the barrier 13 on the substrate 12 and the orthographic projection of the filling pattern 14 on the substrate 12.
  • the material of the organic encapsulation layer 171 can be, for example, an organic material including acrylic, etc.; the material of the inorganic encapsulation layer 172 can be an inorganic insulating material including silicon nitride and/or silicon oxide.
  • the embodiment of the present disclosure does not limit the number of layers of the organic encapsulation layer 171 and the inorganic encapsulation layer 172.
  • the organic encapsulation layer 171 is one layer
  • the inorganic encapsulation layer 172 is two layers
  • the organic encapsulation layer 171 is located between the two inorganic encapsulation layers 172.
  • the organic encapsulation layer 171 has two layers
  • the inorganic encapsulation layer 172 has three layers.
  • the inorganic encapsulation layer 172 and the organic encapsulation layer 171 are alternately arranged in a direction away from (away from) the substrate 12 (ie, the Z direction).
  • the inorganic encapsulation layer has a better barrier to water and oxygen than the organic encapsulation layer. Therefore, in order to ensure the encapsulation effect of the display panel 1, the outermost layer of the encapsulation layer 17 far from the substrate 12 is an inorganic encapsulation layer. .
  • the organic encapsulation layer 171 has the characteristics of good ductility and flexibility. Providing the organic encapsulation layer 171 in the encapsulation layer 17 can make the encapsulation layer 17 have good ductility and flexibility.
  • the organic encapsulation layer 171 can also prevent impurity particles (such as inorganic particles in one inorganic encapsulation layer 172) from affecting the preparation of the film layer above the organic encapsulation layer 171 (such as another inorganic encapsulation layer 172).
  • impurity particles such as inorganic particles in one inorganic encapsulation layer 172
  • the organic encapsulation layer 171 also plays a role of planarization and improves the uniformity of subsequent film layers.
  • the organic encapsulation layer 171 and the filling pattern 14 may be arranged in the same layer and have the same material.
  • the organic encapsulation layer 171 and the filling pattern 14 can be formed simultaneously, for example, formed by the same process (such as inkjet printing), which can simplify the manufacturing process and save costs.
  • the filling pattern 14 on one side may be in contact with the organic encapsulation layer 171.
  • the inorganic encapsulation layer 172 has two layers, namely a first inorganic encapsulation layer 1721 and a second inorganic encapsulation layer 1722.
  • the first inorganic encapsulation layer 1721 is compared with the second inorganic encapsulation layer 1721.
  • the inorganic encapsulation layer 1722 is close to the substrate 12, and the organic encapsulation layer 171 is located between the first inorganic encapsulation layer 1721 and the second inorganic encapsulation layer 1712. In this case, as shown in FIG. 8A and FIG.
  • an inorganic, organic, and inorganic alternate structure is also formed at the connecting position (ie, at the angle) between the first side 1303 and the first bottom surface 1302 of the retaining wall 13. Therefore, the stress at the connecting position (ie, the included corner) of the first side surface 1303 and the first bottom surface 1302 of the retaining wall 13 is reduced, thereby reducing the risk of cracking of the packaging layer 17.
  • a plurality of sub-pixels 101 are provided in the display area 10.
  • the plurality of sub-pixels 101 includes at least a first-color sub-pixel, a second-color sub-pixel, and a third-color sub-pixel.
  • the first color, the second color, and the third color are three primary colors.
  • the first color subpixel, the second color subpixel, and the third color subpixel are red subpixel, green subpixel, and blue subpixel, respectively.
  • the embodiment of the present disclosure does not limit the distribution mode of the multiple sub-pixels 101, and can be set according to actual conditions.
  • a plurality of sub-pixels 101 are arranged in an array, a row of sub-pixels arranged along the X direction in FIG. 1 serves as the same row of sub-pixels, and a row of sub-pixels arranged along the Y direction in FIG. 1 may serve as the same row of sub-pixels.
  • each sub-pixel 101 includes a light emitting device 15 which includes a light emitting functional layer 151, an anode 152 and a cathode 153 located on both sides of the light emitting functional layer 151.
  • the anode 152 is arranged on the side of the light-emitting function layer 151 close to the substrate 12
  • the cathode 153 is arranged on the side of the light-emitting function layer 151 away from the substrate 12.
  • the anode may be formed of a transparent conductive material with a high work function, and its electrode material may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO), zinc oxide (ZnO) , Indium oxide (In 2 O 3 ), aluminum oxide zinc (AZO), carbon nanotubes, etc.;
  • the cathode can be formed of materials with high conductivity and low work function, and its electrode materials can include magnesium aluminum alloy (MgAl) and lithium aluminum Alloys (LiAl) or other simple metals such as magnesium, aluminum, lithium, and silver (Ag).
  • the light-emitting functional layer 151 includes at least a light-emitting layer 1511. As shown in FIG. 10, for example, in addition to the light-emitting layer 1511, the light-emitting function layer 151 may also include an electron transport layer (election transporting layer, ETL) 1512, an electron injection layer (election injection layer, EIL) 1513, and holes. A hole transporting layer (HTL) 1514 and a hole injection layer (HIL) 1515.
  • ETL electron transport layer
  • EIL electron injection layer
  • HTL hole transporting layer
  • HIL hole injection layer
  • ETL1512 is located between the cathode 153 and the light-emitting layer 1511
  • EIL1513 is located between the ETL1512 and the cathode 153
  • HTL1514 is located between the anode 152 and the light-emitting layer 1511
  • HIL1515 is located between the anode 152 and HTL1514.
  • the light-emitting functional layer 151 in addition to the light-emitting layer 1511, parts of ETL1512, EIL1513, HTL1514, and HIL1515 may be included.
  • the light-emitting functional layer may also include a hole blocking layer and an electron blocking layer.
  • the hole blocking layer may be disposed between the electron transport layer and the light emitting layer
  • the electron blocking layer may be disposed, for example, between the hole transport layer and the light emitting layer. .
  • the material of the light-emitting layer can be selected according to the color of the emitted light.
  • the material of the light emitting layer includes a fluorescent light emitting material or a phosphorescent light emitting material.
  • the light-emitting layer may adopt a doping system, that is, a dopant material is mixed into the host light-emitting material to obtain a usable light-emitting material.
  • the host luminescent material may use metal compound materials, anthracene derivatives, aromatic diamine compounds, triphenylamine compounds, aromatic triamine compounds, benzenediamine derivatives, triarylamine polymers, and the like.
  • the sub-pixel 101 further includes a pixel driving circuit 1011, and the pixel driving circuit 1011 is closer to the substrate 12 relative to the light-emitting device 15.
  • the pixel driving circuit 1011 is coupled to the light emitting device 15.
  • the pixel driving circuit 1011 is configured to drive the light emitting device 15 to operate.
  • FIG. 10 is only a schematic diagram, and does not show the specific circuit structure of the pixel driving circuit 1011, nor the specific structure and connection relationship between the pixel driving circuit 1011 and the light-emitting device 15 (in practice, you can choose appropriate The pixel driving circuit 1011).
  • the pixel driving circuit 1011 may be composed of electronic devices such as a thin film transistor (TFT) and a capacitor (Capacitance, C).
  • the pixel drive circuit can be a 2T1C structured pixel drive circuit composed of two TFTs (one switching TFT and one drive TFT) and a capacitor; of course, the pixel drive circuit can also be composed of more than two TFTs (multiple switch TFT and a driving TFT) and at least one capacitor constitute a pixel driving circuit.
  • one of the TFTs is a driving TFT.
  • the driving TFT 16 is coupled to the light emitting device 15.
  • the anode 152 of the light emitting device 15 may be coupled to the drain 163 of the driving TFT 16 through a via hole on the insulating layer 18 (for example, the insulating layer 18 may be a passivation layer).
  • the driving TFT 16 may be a top-gate TFT.
  • the top-gate TFT includes an active layer 164 and a gate insulating layer 165, a gate electrode 161, The source electrode 162 and the drain electrode 163, and the source electrode 162 and the drain electrode 163 respectively contact the active layer 164 through the via holes on the interlayer insulating layer 20.
  • the driving TFT 16 may also be any one of bottom gate type TFT, double gate type TFT, etc.
  • Each TFT in the pixel driving circuit can be of the same type.
  • the driving TFT is a top-gate TFT
  • other TFTs in the pixel driving circuit can also be top-gate TFTs.
  • the distance between the top part of the filling pattern 14 far from the substrate 12 and the substrate 12 is smaller than the distance between the first top surface 1301 and the substrate 12. It can be understood that the filling pattern 14 is far from the top of the substrate 12 and is closer to the substrate 12 than the first top surface 1301. The filling pattern 14 will not overlap the first top surface 1301, and the orthographic projection of the filling pattern 14 on the substrate 12 does not overlap with the orthographic projection of the first top surface 1301 on the substrate 12, so that the filling pattern 14 can be avoided. Overflow from the retaining wall 13.
  • the display panel 1 further includes a pixel defining layer 19 disposed on the substrate 12 and located in the display area 10.
  • the pixel defining layer 19 can be used to define the area where the sub-pixels 101 of the display panel 1 are located.
  • it can be used to define the formation position of the light emitting function layer 151 of the light emitting device 15.
  • the light emitting function layer 151 is located In the opening of the pixel defining layer 19.
  • the retaining wall 13 includes a first pattern 1310, and the first pattern 1310 and the pixel defining layer 19 are arranged in the same layer and have the same material.
  • the first pattern 1310 and the pixel defining layer 19 can be formed simultaneously.
  • a material layer can be deposited first, and the material layer can be patterned (for example, exposure , Developing and etching processes)
  • the portion of the material layer located in the display area 10 is formed as the pixel defining layer 19
  • the portion of the material layer located in the peripheral area 11 is formed as the first pattern 1310.
  • barrier wall 13 only includes the first pattern 1310
  • at least one barrier wall 13 in the display panel 1 and the pixel defining layer 19 are arranged in the same layer and have the same material.
  • the pixel driving circuit in each sub-pixel 101 is formed in the display area 10 on the substrate 12.
  • the circuit and the circuit can be formed in the peripheral area 11 simultaneously.
  • an insulating layer 18 covering the display area 10 and the peripheral area 11 may be formed, and an anode 152 located in each sub-pixel 101 may be formed on the insulating layer 18; then, a pixel defining layer 19 may be formed in the display area 10.
  • the first inorganic encapsulation layer 1721, the organic encapsulation layer 171, and the second inorganic encapsulation layer can be formed in sequence
  • the display panel 1 further includes an isolation column 21 located in the display area 10.
  • an evaporation process is required to form some functional layers (such as the light-emitting functional layer 151) on the display panel 1.
  • the spacer can be used to support the mask (such as a fine metal mask, etc.) so that the mask (such as a mask strip provided with a mask pattern in the mask) and the surface of the display panel (in the In this case, there is a certain interval for the surface of the other parts of the display panel except for the isolation pillars, so as to prevent the mask plate from being completely attached to the surface of the display panel and causing poor vapor deposition.
  • the retaining wall 13 further includes a second pattern 1320, and the second pattern 1320 is located on the side of the first pattern 1310 away from the substrate 12.
  • the isolation pillar 21 and the second pattern 1320 are arranged in the same layer and have the same material. In this way, the second pattern 1320 and the isolation pillar 21 can be simultaneously formed.
  • a material layer may be deposited first, and the material layer may be patterned.
  • the portion of the material layer located in the display area 10 is formed as the isolation pillars 21.
  • the portion located in the peripheral region 11 is formed as a second pattern 1320, and there is a space between the isolation pillar 21 and the second pattern 1320. In this way, the formation of the second pattern 1320 and the isolation pillars 21 does not increase the process steps for preparing the display panel 1, thereby simplifying the production process.
  • the distance between the top of the filling pattern 14 away from the substrate 12 and the substrate 12 is smaller than the distance between the surface close to the substrate 12 in the second pattern 1320 and the substrate 12.
  • the filling pattern 14 is far from the top of the substrate 12 and is closer to the substrate 12 than the surface of the second pattern 1320 is close to the substrate 12.
  • the slope of the second side surface of the filling pattern 14 can be made relatively gentle, and the filling pattern 14 can also be prevented from overflowing the retaining wall 13.
  • the material of the pixel defining layer and the isolation pillar may be the same, so that the two may be formed by patterning one film layer.
  • the first pattern and the second pattern in the retaining wall may be an integrated structure, and the pixel defining layer, the isolation pillar, the first pattern and the second pattern may all be formed by patterning one film layer. In this way, the preparation process of the display substrate can be simplified.
  • the display panel 1 further includes a flat layer 22 covering at least the display area 10.
  • the planarization layer 22 may be used to provide a planarized surface to improve the structure (such as the light-emitting device 15, the pixel defining layer 19, and the encapsulation layer 17, etc.) formed on the planarization layer 22.
  • the film quality improves the uniformity of the film.
  • the material of the flat layer 22 may include organic materials. Since the stress of the organic materials is relatively small and the flexibility is relatively large, the stress on the display panel 1 can be buffered, which is beneficial to the flexible design of the display panel 1.
  • the retaining wall 13 further includes a third pattern 1330, and the third pattern 1330 is located on the side of the first pattern 1310 close to the substrate 12.
  • the flat layer 22 and the third pattern 1330 are arranged in the same layer and have the same material.
  • the third pattern 1330 and the flat layer 22 can be formed simultaneously.
  • a material layer may be deposited first, and the material layer may be patterned.
  • the portion of the material layer located in the display area 10 is formed as the flat layer 22.
  • the portion located in the peripheral area 11 is formed as a third pattern 1330.
  • there is an interval between the flat layer 22 and the third pattern 1330 there is an interval between the flat layer 22 and the third pattern 1330. In this way, the formation of the third pattern 1330 does not increase the process steps for manufacturing the display panel 1, thereby simplifying the production process.
  • the distance between the top of the filling pattern 14 away from the substrate 12 and the substrate 12 is smaller than the distance between the surface of the third pattern 1330 away from the substrate 12 and the substrate 12.
  • the filling pattern 14 is far from the top of the substrate 12 and is closer to the substrate 12 compared to the surface of the third pattern 1330 far from the substrate 12.
  • the slope of the second side surface of the filling pattern 14 can be made relatively gentle, and the filling pattern 14 can also be prevented from overflowing the retaining wall 13.
  • FIG. 11 only illustrates part of the structure in the display area (for example, including a flat layer, a pixel defining layer, and a light-emitting device, etc.), but not for other structures (for example, a pixel drive circuit, etc.). Out.
  • the substrate 12 is a flexible substrate, and the substrate 12 can be bent and folded.
  • the display panel 1 is a flexible display panel, and the display panel 1 has the unique characteristics of a flexible display panel such as bendability and folding.
  • bendability and folding In this way, in the process of bending or folding the display panel 1, since the filling pattern 14 can make the film layer located at the position of the filling pattern 14 relatively smooth, it is possible to avoid excessive stress on the film layer located at the position of the filling pattern 14 Larger causes the film layer to break, which can increase the service life of the display panel 1 and make the display panel 1 more durable, lighter and thinner.
  • an embodiment of the present disclosure provides a display device including the display panel in any one of the above embodiments.
  • the display device 3 further includes an outer frame 2 arranged around the display panel 1.
  • a touch structure may be provided on the display side of the display panel to obtain a touch function.
  • the display device further includes a driving circuit coupled to the display panel, and the driving circuit is configured to provide a driving signal to the display panel to drive the display panel to work, for example, to the display panel.
  • the pixel drive circuit in provides data signals so that the pixel drive circuit drives the light-emitting device to work.
  • the above-mentioned display device may be any device that displays images whether in motion (e.g., video) or fixed (e.g., still images) and regardless of text or images. More specifically, it is expected that the described embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, TV monitors, flat panel displays, computer monitors, car monitors (e.g., Odometer display, etc.), navigator, cockpit controller and/or display, camera view display (for example, the display of a rear-view camera in a vehicle), electronic photos, electronic billboards or signs, projectors, building structures, packaging And aesthetic structure (for example, a display of the image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • Handheld or portable computers GPS receivers/navi
  • the entire structure of the display panel is not described.
  • those skilled in the art can set other structures according to specific application scenarios, which are not limited in the present disclosure.
  • the display device has the same beneficial effects as the above-mentioned display panel, which will not be repeated here.
  • the embodiments of the present disclosure provide a method for manufacturing a display panel, and the display panel may be the display panel in any of the above-mentioned embodiments.
  • the preparation method includes the following steps:
  • a substrate 12 is provided.
  • the substrate 12 has a display area 10 and a peripheral area 11. It should be noted that the display area of the substrate 12 is the display area of the display panel 1, and the peripheral area of the substrate 12 is the peripheral area of the display panel 1.
  • a retaining wall 13 is formed on the substrate 12 and in the peripheral area 11.
  • the retaining wall 13 has a first top surface 1301, a first bottom surface 1302, and a first side surface 1303 connected to the first top surface 1301 and the first bottom surface 1302.
  • the first top surface 1301 and the first bottom surface 1302 of the retaining wall 13 are opposed to each other in a direction perpendicular to the substrate 12, and the first bottom surface 1302 is closer to the substrate 12 than the first top surface 1301.
  • a filling pattern 14 is formed on the outside of the position where the first side surface 1303 and the first bottom surface 1302 of the retaining wall 13 are connected. Wherein, the slope of the side surface of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole is smaller than the slope of the first side surface.
  • the filling pattern 14 may be formed by an inkjet printing process.
  • the display panel 1 in the embodiment of the present disclosure through the filling pattern 14, can make the side slope of the outer contour formed by the retaining wall 13 and the filling pattern 14 as a whole smaller than the slope of the first side 1303, that is, the retaining wall
  • the side surface of the outer ring formed by 13 and the filling pattern 14 as a whole is gentler than the first side surface 1303. Therefore, in the subsequent process of making other film layers, the gradient of the subsequent film layer at the position of the filling pattern 14 is relatively gentle.
  • connection position of 1303 and the first bottom surface 1302 is relatively gentle, thereby avoiding the problem of the subsequent film layer having relatively concentrated stress (that is, greater stress) at the connection position of the first side 1303 and the first bottom surface 1302 of the retaining wall 13, and reducing the follow-up
  • the risk of film cracking improves the performance of the display panel 1.
  • a retaining wall 13 is provided on each outer side (that is, around) of the display area 10 as an example, that is, the retaining wall 13 surrounds the display area 10, but the embodiment of the present disclosure is not limited to this .
  • FIGS. 15A and 15B illustrate that the filling pattern 14 and the retaining wall 13 are in contact, but the embodiment of the present disclosure is not limited to this, and other film layers may also be provided between the filling pattern 14 and the retaining wall 13.
  • an inorganic insulating layer (such as the first inorganic encapsulation layer described in the text) may be provided between the filling pattern 14 and the barrier wall 13.
  • the manufacturing method of the display panel 1 further includes: referring to FIGS. 8A and 8B, forming an encapsulation layer 17 covering the display area 10 on the substrate 12.
  • the encapsulation layer 17 may be a thin-film encapsulation layer, and
  • the layer 17 includes an organic encapsulation layer 171.
  • the edge of the orthographic projection of the organic encapsulation layer 171 on the substrate 12 is located within the edge of the orthographic projection of the retaining wall 13 on the substrate 12 close to the display area 10, and on the retaining wall 13
  • the organic encapsulation layer 171 is located within the range defined by the barrier 13 closest to the display area 10.
  • the organic encapsulation layer 171 and the filling pattern 14 are simultaneously formed by an inkjet printing process.
  • the thin-film encapsulation layer 17 has a three-layer structure as an example, that is, the first inorganic encapsulation layer 1721 is formed first (as shown in FIGS. 15C and 15D), and then inkjet In the printing process, the organic encapsulation layer 171 and the filling pattern 14 are simultaneously formed, and then the second inorganic encapsulation layer 1722 is formed.
  • the retaining wall 13 and the filling pattern 14 are regarded as a whole, the part of the first inorganic encapsulation layer 1721 and the filling pattern 14 in contact with the retaining wall 13 can be included in the whole.
  • the retaining wall 13 and the filling pattern 14 The side surface of the outer contour formed as a whole includes the side surface of the filling pattern 14 (ie, the second side surface) and a part of the side surface of the first inorganic encapsulation layer 1721.
  • the organic encapsulation layer 171 and the filling pattern 14 are simultaneously formed by an inkjet printing process.
  • the filling pattern 14 can be produced without increasing the production process.
  • the inkjet printing time of the organic encapsulation layer 171 and the filling pattern 14 is the same.
  • the width and height of the organic encapsulation layer 171 and the filling pattern 14 formed can be controlled.
  • the total amount of ink droplets for inkjet printing is about 10 ⁇ m 3 -30 ⁇ m 3 , for example, 15 ⁇ m 3 , 20 ⁇ m 3 or 25 ⁇ m 3 . That is, the total amount of ink droplets for inkjet printing required to form a filling pattern 14 is about 10 ⁇ m 3 -30 ⁇ m 3 .

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Abstract

一种显示面板，具有显示区和周边区。显示面板包括衬底、挡墙和填充图案。挡墙设置于衬底上且位于周边区。挡墙具有第一顶面、第一底面以及与第一顶面和第一底面连接的第一侧面；挡墙的第一顶面和第一底面在垂直于衬底的方向上相对设置，第一底面相比于第一顶面更靠近衬底。填充图案设置于第一侧面与第一底面连接位置处的外侧；挡墙和填充图案作为整体构成的外轮廓的侧面的坡度，小于第一侧面的坡度。

Description

显示面板及其制备方法、显示装置
本申请要求于2019年08月12日提交的、申请号为201910740116.1的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板及其制备方法、显示装置。
背景技术
自发光显示装置例如有机发光二极管(Organic Light-Emitting Diode，OLED)显示装置具有自发光、轻薄、功耗低、色彩还原度好、反应灵敏以及广视角等特点，已经被越来越广泛的应用在手机、笔记本电脑以及电视等显示设备中。并且，对于上述显示设备，为了实现更好的视觉效果，人们对窄边框提出了更高的需求。
发明内容
一方面，提供一种显示面板。所述显示面板具有显示区和周边区，所述显示面板包括衬底、挡墙和填充图案。所述挡墙设置于所述衬底上且位于所述周边区。所述挡墙具有第一顶面、第一底面以及与所述第一顶面和所述第一底面连接的第一侧面；所述挡墙的第一顶面和第一底面在垂直于所述衬底的方向上相对设置，所述第一底面相比于所述第一顶面更靠近所述衬底。所述填充图案设置于所述第一侧面与所述第一底面连接位置处的外侧。所述挡墙和所述填充图案作为整体构成的外轮廓的侧面的坡度，小于所述第一侧面的坡度。
在一些实施例中，所述填充图案具有第二底面、第二侧面和第三侧面。所述第二底面分别与所述第二侧面和所述第三侧面连接。沿所述显示区至所述周边区的方向，所述第二侧面相比于所述第三侧面远离所述挡墙。所述第二侧面的坡度小于所述第一侧面的坡度。
在一些实施例中，所述第二侧面与所述第二底面的夹角约小于30°。
在一些实施例中，所述第一侧面与所述第一底面的夹角约为30°～90°。
在一些实施例中，所述填充图案的个数为多个，多个填充图案包括第一填充图案和第二填充图案。所述第一填充图案位于所述挡墙靠近所述显示区的一侧，所述第二填充图案位于所述挡墙远离所述显示区的一侧。
在一些实施例中，沿所述显示区至所述周边区的方向，所述挡墙的宽度 约为30μm～50μm。
在一些实施例中，所述挡墙的个数为多个，多个挡墙包括第一挡墙和第二挡墙。沿所述显示区至所述周边区的方向，所述第一挡墙和所述第二挡墙间隔设置，且所述第一挡墙相比于所述第二挡墙靠近所述显示区。所述第二挡墙的高度大于所述第一挡墙的高度。
在一些实施例中，所述显示面板还包括覆盖所述显示区的封装层。所述封装层包括有机封装层和无机封装层。所述有机封装层在所述衬底上的正投影的边沿，位于所述挡墙在所述衬底上的正投影靠近所述显示区的边沿之内。所述无机封装层还延伸至所述周边区，所述无机封装层在所述衬底上的正投影，覆盖所述挡墙在所述衬底上的正投影和所述填充图案在所述衬底上的正投影。
在一些实施例中，所述有机封装层和所述填充图案同层设置且材料相同。
在一些实施例中，所述无机封装层为两层，分别为第一无机封装层和第二无机封装层。所述第一无机封装层相比于所述第二无机封装层靠近所述衬底，所述有机封装层位于所述第一无机封装层和所述第二无机封装层之间。
在一些实施例中，在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第一顶面与所述衬底的间距。
在一些实施例中，所述挡墙包括第一图案。所述显示面板还包括像素界定层。所述像素界定层设置于所述衬底上且位于所述显示区。所述第一图案与所述像素界定层同层设置且材料相同。
在一些实施例中，所述挡墙还包括第二图案。所述第二图案位于所述第一图案远离所述衬底的一侧。所述显示面板还包括隔离柱。所述隔离柱位于所述显示区；所述第二图案与所述隔离柱同层设置且材料相同。在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第二图案中靠近所述衬底的表面与所述衬底的间距。
在一些实施例中，所述挡墙还包括第三图案。所述第三图案位于所述第一图案靠近所述衬底的一侧。所述显示面板还包括至少覆盖所述显示区的平坦层。所述平坦层与所述第三图案同层设置且材料相同。在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第三图案中远离所述衬底的表面与所述衬底的间距。
在一些实施例中，所述衬底包括柔性衬底。
另一方面，提供一种显示装置。所述显示装置包括：如上述任一实施例所述的显示面板。
又一方面，提供一种显示面板的制备方法。所述制备方法包括：提供衬底，所述衬底具有显示区和周边区；在所述衬底上且所述周边区内形成挡墙；所述挡墙具有第一顶面、第一底面以及与所述第一顶面和所述第一底面连接的第一侧面；所述挡墙的第一顶面和第一底面在垂直于所述衬底的方向上相对设置，所述第一底面相比于所述第一顶面更靠近所述衬底；在所述第一侧面与所述第一底面连接位置处的外侧形成填充图案；所述挡墙和所述填充图案作为整体构成的外轮廓的侧面的坡度，小于所述第一侧面的坡度。
在一些实施例中，所述制备方法还包括：在所述衬底上形成覆盖所述显示区的封装层；所述封装层包括有机封装层，所述有机封装层在所述衬底上的正投影的边沿，位于所述挡墙在所述衬底上的正投影靠近所述显示区的边沿之内；所述有机封装层与所述填充图案同步通过喷墨打印工艺形成。
在一些实施例中，在所述第一侧面与所述第一底面连接位置处，喷墨打印的墨滴总量约为10μm 3～30μm 3。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据本公开一些实施例的显示面板的一种俯视图；
图2为图1中的显示面板沿A-A’方向的剖视图；
图3为根据本公开一些实施例的显示面板的一种结构图；
图4为根据本公开一些实施例的显示面板的另一种结构图；
图5为根据相关技术的显示面板的一种结构图；
图6A为根据本公开一些实施例的显示面板的另一种俯视图；
图6B为根据本公开一些实施例的显示面板的又一种俯视图；
图7A为根据本公开一些实施例的显示面板的又一种俯视图；
图7B为图7A中的显示面板沿B-B’方向的剖视图；
图7C为根据本公开一些实施例的显示面板的又一种结构图；
图8A为根据本公开一些实施例的显示面板的又一种结构图；
图8B为根据本公开一些实施例的显示面板的又一种结构图；
图9A为图1中的显示面板沿D-D’方向的剖视图；
图9B为根据本公开一些实施例的显示面板的又一种结构图；
图10为根据本公开一些实施例的亚像素的一种结构图；
图11为根据本公开一些实施例的显示面板的又一种结构图；
图12为根据本公开一些实施例的显示装置的一种结构图；
图13为根据本公开一些实施例的显示面板的一种制备流程图；
图14A为根据本公开一些实施例的显示面板的又一种俯视图；
图14B为图14A中的显示面板沿E-E’方向的剖视图；
图14C为根据本公开一些实施例的显示面板的又一种俯视图；
图14D为图14C中的显示面板沿F-F’方向的剖视图；
图15A为根据本公开一些实施例的显示面板的一种制备过程图；
图15B为根据本公开一些实施例的显示面板的另一种制备过程图；
图15C为根据本公开一些实施例的显示面板的又一种制备过程图；
图15D为根据本公开一些实施例的显示面板的又一种制备过程图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或 暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在电子显示产品的生产和使用过程中，外界环境中的水汽和氧气等会侵入电子显示产品内部，例如水汽和氧气等可以与电子显示产品内部的结构发生反应而影响其电学性能，从而降低电子显示产品的性能和寿命。例如，对于显示面板例如柔性有机发光二极管显示面板，封装工艺的水平决定着其中的器件的寿命。例如，可以采用薄膜封装技术(Thin Film Encapsulation，TFE)对自发光器件进行封装。在封装过程中，通常需要通过喷墨打印工艺制作一 层有机封装层，而为了将该有机封装层限定在特定区域内，需要在显示面板的周边区设置挡墙。其中，挡墙的侧面与底面的夹角越大，挡墙对喷墨打印过程中的液滴的阻挡效果越好。
在实现窄边框的过程中，会缩短挡墙的宽度，相应的挡墙的侧面与底面的夹角也会变大，使得挡墙的侧面的坡度也较大，这样，后续膜层在挡墙的底部位置处的应力较为集中(应力较大)，容易发生断裂，影响显示面板的性能。如果减小挡墙的侧面与底面的夹角，则无法保证挡墙的顶面平坦化，且工艺难度较大，不易实现。
本公开的实施例提供一种显示面板，如图1所示，显示面板1具有显示区(Active Area，AA)10和周边区11。示例性地，周边区11可以位于显示区10外的至少一侧，例如，周边区11可以围绕显示区10。
如图1和图2所示，显示面板1包括衬底12。示例性地，衬底12可以包括玻璃等刚性衬底基板(或称为硬质衬底基板)，或者PI(Polyimide，聚酰亚胺)等柔性衬底基板；还可以包括设置在刚性衬底基板或柔性衬底基板上的膜层(例如缓冲层等)。
显示面板1还包括设置于衬底12上且位于周边区11的挡墙13。挡墙13具有第一顶面1301、第一底面1302以及第一侧面1303。第一侧面1303与第一顶面1301和第一底面1302连接。在垂直于衬底12的方向(如图2中的Z方向)上，第一顶面1301和第一底面1302相对设置，且第一底面1302相比于第一顶面1301更靠近衬底12。
如图1和图2所示，显示面板1还包括填充图案14。填充图案14设置于第一侧面1303和第一底面1302连接位置处的外侧。挡墙13和填充图案14作为整体构成的外轮廓的侧面1304(例如图2中虚线部分)的坡度，小于第一侧面1303的坡度。也就是说，填充图案14用于使挡墙13和填充图案14作为整体构成的外轮廓的侧面1304的坡度，相对于挡墙13的第一侧面1303的坡度更平缓。
需要说明的是，侧面的坡度指的是，侧面的垂直高度和水平距离的比值，也即，侧面中任一位置处的垂直高度和水平距离的比值。例如，如图2所示，挡墙13和填充图案14作为整体构成的外轮廓的侧面1304上Q1位置的垂直高度为H1(即在Z方向上Q1位置与第一底面1302之间的距离)，Q1位置的水平距离为L1(即在X方向上Q1位置与侧面1304的边沿的间距，也即，在X方向上Q1位置与填充图案14远离挡墙13最远端点S1之间的距离)，侧面1304的坡度为H1/L1；挡墙13的第一侧面1303上Q2位置的垂直高度 为H2(即在Z方向上Q2位置与第一底面1302之间的距离)，Q2位置的水平距离为L2(即在X方向上Q2位置与其所在的第一侧面1303的边沿的间距，也即，在X方向上Q2位置与挡墙13的第一底面1302的端点S2之间的距离)，第一侧面1303的坡度为H2/L2，此时，H1/L1＜H2/L2。
需要说明的是，图2以填充图案14和挡墙13接触进行示意，但本公开的实施例并不限于此，在填充图案14和挡墙13之间也可以设置其他膜层。本公开的实施例对挡墙13靠近衬底12一侧接触的膜层不做限定，该膜层例如可以是绝缘层(例如无机绝缘层)。示例性地，在填充图案14和挡墙13之间设置有其他膜层的情况下，挡墙13和填充图案14未接触，如图3所示，挡墙13和填充图案14作为整体构成的外轮廓的侧面1304，可以认为是填充图案14中远离挡墙13的侧面(即下文中的第二侧面1402)延伸至第一顶面1301的边沿处所构成的表面。或者，也可以将位于填充图案14和挡墙13之间的其他膜层的侧面，与填充图案14的侧面，近似看作是挡墙13和填充图案14作为整体构成的外轮廓的侧面1304。
此外，本公开的实施例对填充图案14的材料进行不作限定，例如填充图案14的材料可以采用具有柔性的材料。
示例性地，如图4所示，填充图案14具有第二底面1401、第二侧面1402和第三侧面1403。第二底面1401分别与第二和第三颜色亚像素。示例的，第一颜色亚像素、
需要说明的是，对于填充图案14和挡墙13之间设置有其他膜层的情况，挡墙13和填充图案14作为整体构成的外轮廓的侧面1304可以近似认为是第二侧面1402，即，第二侧面1402的坡度可以认为是挡墙13和填充图案14作为整体构成的外轮廓的侧面1304的坡度。
这样，可以通过控制填充图案14的第二侧面1402的坡度，使填充图案14和挡墙13看作整体时，该整体的外轮廓的侧面的坡度相对更平缓。即，可使填充图案14的第二侧面1402的坡度小于挡墙13的第一侧面1303的坡度，实现填充图案14和挡墙13看作整体时，该整体的外轮廓的侧面的坡度平缓。
相比于如图5所示的显示面板1'，挡墙13的第一侧面的坡度较大，后续膜层(例如下文中的第二无机封装层1722)在挡墙13的第一侧面与第一底面连接位置处(图5中虚线框所示)的坡度也相对较大，使得后续膜层在该位置处容易出现应力集中的问题，即，后续膜层在该位置处受到的应力较大，从而使得后续膜层会有开裂(Crack)风险，降低了后续膜层对水汽、氧气和杂质等的阻隔作用。而本公开的实施例中的显示面板1，通过在挡墙13的第 一侧面1303与第一底面1302连接位置处的外侧设置填充图案14，使得挡墙13和填充图案14作为整体构成的外轮廓的侧面的坡度，小于第一侧面1303的坡度，即，挡墙13和填充图案14作为整体构成的外轮的侧面相比于第一侧面1303更平缓，可以降低后续膜层在挡墙13的第一侧面1303与第一底面1302连接位置处的坡度，使得后续膜层更为平缓，从而可以避免后续膜层在该位置处受到的应力较大，降低了后续膜层出现开裂的风险。
因此，本公开的实施例提供一种显示面板1，通过在挡墙13的第一侧面1303与第一底面1302连接位置处的外侧设置填充图案14，使得挡墙13和填充图案14作为整体构成的外轮廓的侧面的坡度，小于第一侧面1303的坡度，即，挡墙13和填充图案14作为整体构成的外轮的侧面相比于第一侧面1303更平缓。因此，在后续制作其他膜层的过程中，使得后续膜层在填充图案14位置处的坡度也相应的较为平缓。这样，即使挡墙13的第一侧面1303与第一底面1302的夹角较大，即，挡墙13第一侧面1303的坡度较大，也可以使得后续膜层在挡墙13的第一侧面1303和第一底面1302连接位置处较为平缓，从而避免了后续膜层在挡墙13的第一侧面1303和第一底面1302连接位置处应力较为集中(即应力较大)的问题，降低了后续膜层发生开裂的风险，提高了显示面板1的性能，有利于显示面板1实现窄边框。
需要说明的是，本公开的实施例对挡墙的平面形状(如挡墙在衬底所在平面上的正投影的形状，例如图1中的X-Y确定的平面)不做限制。例如，挡墙的平面形状可以为如图1所示的环绕显示区的闭合环形，例如，可以根据显示区的形状而设置为矩形环、圆环、接近圆环、椭圆等形状，从而使得挡墙可以在任一平面方向上具有防溢流的作用。或者，挡墙的平面形状可以是带有缺口的环形，该缺口设置在不容易出现溢流的区域，从而防止挡墙材料受热膨胀时造成隆起等，保持良好的防止溢流的效果。例如，在本公开一些实施例中，挡墙的平面形状(即衬底所在平面上的正投影的形状)可以为分段式，例如，直线段或曲线段，例如，挡墙可以包括至少一段子挡墙，例如，多段子挡墙，多段子挡墙可以共同围成环形，或者至少一段子挡墙可以仅设置在容易出现溢流的区域，如此，可以在显示面板的容易出现溢流的区域设置挡墙，以简化显示基板的结构。另外，挡墙的平面形状可以不是直线形状，可以带有弯曲，例如，矩形环的边可以稍微带有弯曲，分段式的每段可以带有弯曲等，只要能够实现良好的防溢流效果，本公开的实施例并不对此进行限制。
示例性地，参考图4，第一侧面1303与第一底面1302的夹角α约为 30°～90°。例如，夹角α为40°、60°或80°。需要说明的是，文中的“约”是指允许工艺误差范围内的的数值，不严格限定界限。
这样，在后续采用喷墨打印形成膜层的过程中，可以提高挡墙13对液滴的阻挡效果；并且，在挡墙13的高度一定的情况下，可以保证挡墙13的第一顶面1301的宽度不会过小，从而避免因挡墙13的第一顶面1301的宽度过小，而导致后续形成的覆盖挡墙13的膜层(例如无机封装层)在挡墙13处断开。
示例性地，参考图4，第二侧面1402与第二底面1401的夹角β小于第一侧面1303与第一底面1302的夹角α。例如，第二侧面1402的坡度可以用tanβ表示，第一侧面1303的坡度可以用tanα表示。例如，第二侧面1402与第二底面1401的夹角β约小于30°。例如，夹角β为15°、20°或25°。
需要说明的是，第二侧面1402可以是倾斜的平面，也可以是曲面(例如第二侧面1402朝向衬底12一侧凹陷)。其中，在第二侧面1402是曲面的情况下，第二侧面1402与第二底面1401的夹角可以是第二侧面1402的切平面与第二底面1401的夹角。
在一些实施例中，填充图案14可以位于挡墙13的至少一外侧。示例性地，填充图案14可以位于挡墙13的一个外侧，例如，如图6A所示，填充图案14位于挡墙13靠近显示区10的一侧。
示例性地，填充图案14的个数为多个，例如图6B所示，多个填充图案14包括第一填充图案141和第二填充图案142。第一填充图案141位于挡墙13靠近显示区10的一侧，第二填充图案142位于挡墙13远离显示区10的一侧。这样，沿显示区10至周边区11的方向，位于挡墙13相对两外侧的后续膜层可以在第一填充图案141和第二填充图案142的位置处较为平缓，避免后续膜层存在应力较为集中的位置，使得后续膜层受到的应力可以均匀分布。
在一些实施例中，沿显示区10至周边区11的方向，挡墙13的宽度约为30μm～50μm。其中，挡墙13的第一顶面1301与第一底面1302的宽度(即在显示区10至周边区11的方向上的尺寸)均在此范围内。
可以理解的是，为了实现窄边框，在减小挡墙的宽度的过程中，挡墙的坡度会相应的增大，即，挡墙的第一侧面与第一底面的夹角会变大，后续膜层容易在第一侧面与第一底面的夹角的位置处发生断裂，因此，挡墙的宽度可以减小的范围受到限制。本公开的实施例可以通过填充图案降低后续膜层在第一侧面与第一底面的夹角的位置处的坡度，即使挡墙的第一侧面与第一底面的夹角较大，也可以使得后续膜层的侧面的坡度较为平缓，避免后续膜 层发生断裂，使得挡墙的第一侧面与第一底面的夹角对后续膜层的坡度影响较小。因此，本公开的实施例中的挡墙的宽度可以较大程度的减小，使得挡墙的第一侧面与第一底面的夹角较大，即，挡墙的第一侧面具有较大的坡度，在实现窄边框的过程中，可以保证挡墙的第一顶面平坦化，也可以保证挡墙对液滴的阻挡效果。
在一些实施例中，如图7A和图7B所示，挡墙13的个数为多个，多个挡墙13包括第一挡墙131和第二挡墙132。沿显示区10至周边区11的方向，第一挡墙131和第二挡墙132间隔设置，且第一挡墙131相比于第二挡墙132靠近显示区10，即，第一挡墙131位于第二挡墙132与显示区10之间。第二挡墙132的高度大于第一挡墙131的高度。其中，高度指的是挡墙的第一顶面与第一底面在垂直于衬底12的方向上的间距。示例性地，如图7A所示，第一挡墙131和第二挡墙132可以呈同心环形排布。
需要说明的是，每个挡墙的平面形状和设置方式都可以参考前面的描述，这里将不进行赘述，例如可以是一个挡墙为闭合环形，另一个是分段式；或者，两个都是分段式，其中一个挡墙的至少一个开口对应于另一个挡墙的一段子挡墙；或者，两个挡墙的至少一个开口至少有部分交叠等；或者，一个是分段式，另一个是闭合环形。
其中，第一挡墙131可以在形成例如有机封装层的过程中，将有机封装材料限定在特定区域内，例如，有机封装层的边沿可以位于第一挡墙131靠近显示区10以内，这样可以避免有机封装层溢出。第二挡墙132可以阻挡从周边区11入侵至显示面板1的水汽、氧气和杂质等，此外，第二挡墙132也可以避免在形成有机封装层的过程中，第一挡墙131无法完全阻挡有机封装材料，即，第一挡墙131对有机封装材料的拦截能力不足，而导致有机封装材料延伸至显示面板1除特定区域以外的区域中，影响显示面板1的性能的问题。
其中，上述特定区域一般为显示区10，还可以包括周边区11中紧挨着显示区10的边界，且不超过最靠近显示区10的挡墙13(例如上述第一挡墙131)的区域。通常情况下，有机封装层的边界在最靠近显示区10的挡墙13(例如第一挡墙131)限定的区域以内。
示例性地，挡墙13的个数为两个，即，一个第一挡墙131和一个第二挡墙132。这样，可以满足形成有机封装层时对有机封装材料的阻挡，且可起到阻挡水汽、氧气和杂质的作用；并且，两个挡墙13在周边区11所占用的面积相对较少，便于显示面板1实现窄边框化。
示例性地，如图7B所示，在多个挡墙13包括第一挡墙131和第二挡墙132的情况下，第一挡墙131的第一侧面与第一底面的夹角记为α1，第二挡墙132的第一侧面与第一底面的夹角记为α2，α1和α2可以相等也可以不相等。
在一些实施例中，如图8A与图8B所示，显示面板1还包括覆盖显示区10的封装层17，例如，该封装层17可以为薄膜封装层。封装层17包括有机封装层171和无机封装层172。有机封装层171在衬底12上的正投影的边沿，位于挡墙13在衬底12上的正投影靠近显示区10的边沿之内。无机封装层172延伸至周边区11，无机封装层172在衬底12上的正投影，覆盖挡墙13在衬底12上的正投影和填充图案14在衬底12上的正投影。
示例性地，有机封装层171的材料例如可以采用包括亚克力等的有机材料；无机封装层172的材料可以采用包括氮化硅和/或氧化硅等的无机绝缘材料。
需要说明的是，本公开的实施例不对有机封装层171和无机封装层172的层数进行限定。例如，如图7C、图8A与图8B所示，有机封装层171为一层，无机封装层172为两层，有机封装层171位于两层无机封装层172之间。又例如，有机封装层171为两层，无机封装层172为三层，沿背离(远离)衬底12的方向(即Z方向)，无机封装层172和有机封装层171依次交替排布。
可以理解的是，由于相对有机封装层，无机封装层对水氧的阻隔能力更好，因此，为了保证显示面板1的封装效果，封装层17的远离衬底12的最外层是无机封装层。并且，有机封装层171具有延展性和柔韧性较好的特性，在封装层17中设置有机封装层171，可以使得封装层17具有较好的延展性和柔韧性。此外，有机封装层171还可以起到避免其下方的杂质颗粒(例如一个无机封装层172中的无机物颗粒)影响该有机封装层171上方的膜层(例如另一个无机封装层172)的制备，以避免该有机封装层171上方的膜层(例如无机封装层172)发生破裂。而且，有机封装层171也起到平坦化的作用，提高后续膜层的均匀性。
示例性地，有机封装层171和填充图案14可以同层设置，且材料相同。在此情况下，有机封装层171和填充图案14可以同步形成，例如通过同一次工艺(例如喷墨打印)制作形成，可以简化制备工艺，节省成本。例如，有机封装层171与填充图案14之间可以有间隔，或者，例如在显示区10至周边区11的方向上，距显示区10最近的挡墙13，位于该挡墙13靠近显示区 10一侧的填充图案14可以与有机封装层171接触。
在一些实施例中，如图8A和图8B所示，无机封装层172为两层，分别为第一无机封装层1721和第二无机封装层1722，第一无机封装层1721相比于第二无机封装层1722靠近衬底12，有机封装层171位于第一无机封装层1721和第二无机封装层1712之间。在此情况下，如图8A和图8B所示，在挡墙13的第一侧面1303与第一底面1302连接位置处(即夹角处)也形成了无机、有机、无机的交替结构。因而，降低了在挡墙13的第一侧面1303与第一底面1302连接位置处(即夹角处)的应力，从而降低了封装层17的开裂风险。
在一些实施例中，如图1所示，显示区10内设置有多个亚像素101。示例性地，多个亚像素101至少包括第一颜色亚像素、第二颜色亚像素和第三颜色亚像素。例如，第一颜色、第二颜色和第三颜色为三基色。例如，第一颜色亚像素、第二颜色亚像素和第三颜色亚像素分别为红色亚像素、绿色亚像素和蓝色亚像素。
需要说明的是，本公开的实施例对多个亚像素101的分布方式不作限定，可以根据实际情况进行设置。例如，多个亚像素101呈阵列分布，沿图1中的X方向排列的一排亚像素作为同一行亚像素，沿图1中的Y方向排列的一排亚像素可以作为同一列亚像素。
如图9A和图9B所示，每个亚像素101包括发光器件15，发光器件15包括发光功能层151、位于发光功能层151两侧的阳极152和阴极153。需要说明的是，图9A和图9B以阳极152设置于发光功能层151靠近衬底12一侧，阴极153设置于发光功能层151远离衬底12一侧进行示意。
需要说明的是，本公开的实施例对发光器件中的阴极和阳极的材料不做限制。阳极例如可由具有高功函数的透明导电材料形成，其电极材料可以包括氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟镓(IGO)、氧化镓锌(GZO)氧化锌(ZnO)、氧化铟(In 2O 3)、氧化铝锌(AZO)和碳纳米管等；阴极例如可由高导电性和低功函数的材料形成，其电极材料可以包括镁铝合金(MgAl)和锂铝合金(LiAl)等合金或者镁、铝、锂和银(Ag)等金属单质。
其中，发光功能层151至少包括发光层1511。如图10所示，示例性地，发光功能层151除包括发光层1511外，还可以包括电子传输层(election transporting layer，ETL)1512、电子注入层(election injection layer，EIL)1513、空穴传输层(hole transporting layer，HTL)1514以及空穴注入层(hole injection layer，HIL)1515。ETL1512位于阴极153与发光层1511之间，EIL1513位于 ETL1512与阴极153之间，HTL1514位于阳极152与发光层1511之间，HIL1515位于阳极152与HTL1514之间。当然，对于发光功能层151而言，除包括发光层1511外，可以包括ETL1512、EIL1513、HTL1514、HIL1515中的部分。此外，发光功能层还可以包括空穴阻挡层和电子阻挡层，空穴阻挡层例如可设置在电子传输层和发光层之间，电子阻挡层例如可设置在空穴传输层和发光层之间。
例如，在本公开至少一个实施例中，发光层的材料可以根据其发射光颜色的不同进行选择。例如，发光层的材料包括荧光发光材料或磷光发光材料。例如，在本公开至少一个实施例中，发光层可以采用掺杂体系，即在主体发光材料中混入掺杂材料来得到可用的发光材料。例如，主体发光材料可以采用金属化合物材料、蒽的衍生物、芳香族二胺类化合物、三苯胺化合物、芳香族三胺类化合物、联苯二胺衍生物和三芳胺聚合物等。
在此基础上，如图10所示，亚像素101还包括像素驱动电路1011，像素驱动电路1011相对于发光器件15更靠近衬底12。像素驱动电路1011与发光器件15耦接。像素驱动电路1011被配置为驱动发光器件15工作。
需要说明的是，图10仅为示意图，并未示出像素驱动电路1011的具体电路结构，也未示出像素驱动电路1011与发光器件15的具体结构及连接关系(实际中可以根据需要选择合适的像素驱动电路1011)。
示例性地，像素驱动电路1011可以由薄膜晶体管(Thin Film Transistor，TFT)和电容(Capacitance，C)等电子器件组成。例如，像素驱动电路可以是由两个TFT(一个开关TFT和一个驱动TFT)和一个电容构成的2T1C结构的像素驱动电路；当然，像素驱动电路还可以是由两个以上的TFT(多个开关TFT和一个驱动TFT)和至少一个电容构成的像素驱动电路。不管像素驱动电路包括几个TFT，其中一个TFT为驱动TFT，如图9A和图9B所示，该驱动TFT16与发光器件15耦接。例如，发光器件15的阳极152可通过绝缘层18(例如绝缘层18可以为钝化层)上的过孔与驱动TFT16的漏极163耦接。
示例性地，如图9A和图9B所示，驱动TFT16可以为顶栅型TFT，顶栅型TFT包括依次层叠设置于衬底12上的有源层164和栅绝缘层165、栅极161、源极162和漏极163，源极162和漏极163通过层间绝缘层20上的过孔分别与有源层164接触。当然，驱动TFT16也可以是底栅型TFT、双栅型TFT等任意一种。像素驱动电路中的各个TFT可以采用同种类型的TFT，例如，在驱动TFT为顶栅型TFT的情况下，像素驱动电路中的其他TFT也可以均为顶 栅型TFT。其中，对于像素驱动电路中的其他TFT的结构，可参考上述驱动TFT16的结构，在此不再赘述。
在一些实施例中，在垂直于衬底12的方向上，填充图案14中远离衬底12的顶部与衬底12的间距，小于第一顶面1301与衬底12的间距。可以理解的是，填充图案14中远离衬底12的顶部，相比于第一顶面1301更靠近衬底12。填充图案14不会搭接到第一顶面1301，填充图案14在衬底12上的正投影与第一顶面1301在衬底12上的正投影无交叠，这样，可以避免填充图案14从挡墙13处溢出。
在一些实施例中，如图8A和图8B以及图9A和图9B所示，显示面板1还包括设置于衬底12上且位于显示区10的像素界定层19。其中，像素界定层19可以用于限定显示面板1的亚像素101所在的区域，例如，如图11所示，可以用于限定发光器件15的发光功能层151的形成位置，发光功能层151位于像素界定层19的开口中。
示例性地，如图11所示，挡墙13包括第一图案1310，第一图案1310与像素界定层19同层设置且材料相同。这样，第一图案1310与像素界定层19可以同步形成，例如，在形成第一图案1310和像素界定层19的过程中，可以先沉积一材料层，对该材料层进行构图(例如进行包括曝光、显影和蚀刻等工艺)，该材料层的位于显示区10的部分形成为像素界定层19，该材料层的位于周边区11的部分形成为第一图案1310。并且，像素界定层19与第一图案1310之间有间隔。如此，第一图案1310的形成不会增加制备显示面板1的工艺步骤，从而简化了生产工艺。
例如，在挡墙13仅包括第一图案1310的情况下，显示面板1中的至少一个挡墙13与像素界定层19同层设置且材料相同。
以如图8A和图8B所示结构为例，在工艺上，在衬底12上先在显示区10形成每个亚像素101中的像素驱动电路，当然，在周边区11可同步形成电路以及走线；之后，可形成覆盖显示区10和周边区11的绝缘层18，并在绝缘层18上形成位于每个亚像素101中的阳极152；然后，在显示区10形成像素界定层19，并同步在周边区11形成挡墙13；然后形成位于每个亚像素101中的发光功能层151和阴极152；之后，可依次形成第一无机封装层1721、有机封装层171、第二无机封装层1722，其中，在形成有机封装层171时，同步形成填充图案14。
在一些实施例中，如图11所示，显示面板1还包括位于显示区10的隔离柱21。例如，在显示面板1的制备过程中，需要蒸镀工艺以形成显示面板 1上的一些功能层(例如发光功能层151)。在蒸镀工艺中，隔离柱可以用于支撑掩模板(例如精细金属掩模板等)，以使得掩模板(例如掩模板中设置有掩模图案的掩模条)与显示面板的表面(在该情况下，为显示面板的除隔离柱之外的其它部分的表面)存在一定的间隔，以免掩模板完全贴附在显示面板表面上而造成蒸镀不良。
示例性地，如图11所示，挡墙13还包括第二图案1320，第二图案1320位于第一图案1310远离衬底12的一侧。隔离柱21与第二图案1320同层设置且材料相同。这样，第二图案1320与隔离柱21可以同步形成。例如，在形成第二图案1320和隔离柱21的过程中，可以先沉积一材料层，对该材料层进行构图，该材料层的位于显示区10的部分形成为隔离柱21，该材料层的位于周边区11的部分形成为第二图案1320，并且，隔离柱21与第二图案1320之间有间隔。如此，第二图案1320和隔离柱21的形成不会增加制备显示面板1的工艺步骤，从而简化了生产工艺。
示例性地，在垂直于衬底12的方向上，填充图案14中远离衬底12的顶部与衬底12的间距，小于第二图案1320中靠近衬底12的表面与衬底12的间距。也就是说，填充图案14中远离衬底12的顶部，相比于第二图案1320中靠近衬底12的表面，靠近衬底12。这样，可以使得填充图案14的第二侧面的坡度较为平缓，还可以避免填充图案14溢出挡墙13。
在一些实施例中，像素界定层和隔离柱的材料可以相同，这样二者可以由一个膜层构图形成。如此，挡墙中的第一图案和第二图案可以为一体化结构，像素界定层、隔离柱、第一图案和第二图案都可以由一个膜层构图形成。如此，可以简化显示基板的制备工艺。
在一些实施例中，如图11所示，显示面板1还包括至少覆盖显示区10的平坦层22。例如，在显示面板1的制造过程中，平坦层22可以用于提供平坦化的表面，以提高在平坦层22上形成的结构(例如发光器件15、像素界定层19和封装层17等)的成膜质量，提高膜层的均匀性。例如，平坦层22的材料可以包括有机材料，由于有机材料的应力较小，柔性较大，可以缓冲显示面板1受到的应力，有利于显示面板1实现柔性设计。
示例性地，如图11所示，挡墙13还包括第三图案1330，第三图案1330位于第一图案1310靠近衬底12的一侧。平坦层22与第三图案1330同层设置且材料相同。这样，第三图案1330与平坦层22可以同步形成。例如，在形成第三图案1330和平坦层22的过程中，可以先沉积一材料层，对该材料层进行构图，该材料层的位于显示区10的部分形成为平坦层22，该材料层的 位于周边区11的部分形成为第三图案1330。并且，平坦层22与第三图案1330之间有间隔。如此，第三图案1330的形成不会增加制造显示面板1的工艺步骤，从而简化生产工序。
示例性地，在垂直于衬底12的方向上，填充图案14中远离衬底12的顶部与衬底12的间距，小于第三图案1330中远离衬底12的表面与衬底12的间距。也就是说，填充图案14中远离衬底12的顶部，相比于第三图案1330中远离衬底12的表面，靠近衬底12。这样，可以使得填充图案14的第二侧面的坡度较为平缓，还可以避免填充图案14溢出挡墙13。
需要说明的是，为了方便描述，图11仅示意出了显示区中的部分结构(例如包括平坦层、像素界定层和一个发光器件等)，对于其他结构(例如像素驱动电路等)并未示意出。
示例性地，衬底12为柔性衬底，衬底12可以弯曲和折叠。这样，显示面板1为柔性显示面板，该显示面板1具备可弯曲和折叠等柔性显示面板所特有的特点。这样，在显示面板1进行弯曲或折叠的过程中，由于填充图案14可以使得位于填充图案14位置处的膜层较为平缓，因此，可以避免因位于填充图案14位置处的膜层受到的应力过大而导致膜层出现断裂的问题，从而可以提高显示面板1的使用寿命，使得显示面板1更耐用，更轻薄。
本公开的实施例提供一种显示装置，该显示装置包括上述任一项实施例中的显示面板。例如，如图12所示，显示装置3还包括设置于显示面板1周围的外框2。例如，在本公开至少一个实施例提供的显示装置中，显示面板的显示侧可以设置触控结构，以获得触控功能。例如，在本公开至少一个实施例提供的显示装置中，显示装置还包括与显示面板耦接的驱动电路，驱动电路被配置为向显示面板提供驱动信号，以驱动显示面板工作，例如向显示面板中的像素驱动电路提供数据信号，以使像素驱动电路驱动发光器件工作。
例如，上述显示装置可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
需要说明的是，为表示清楚，并没有叙述该显示面板的全部结构。为实现显示面板的必要功能，本领域技术人员可以根据具体应用场景进行设置其他结构，本公开对此不做限制。显示装置具有与上述显示面板具有相同的有益效果，此处不再赘述。
本公开的实施例提供一种显示面板的制备方法，该显示面板可以为上述任一实施例中的显示面板。如图13所示，制备方法包括以下步骤：
S10、参考图1，提供衬底12。其中，衬底12具有显示区10和周边区11。需要说明的是，衬底12的显示区即为显示面板1的显示区，衬底12的周边区即为显示面板1的周边区。
S11、如图14A至图14D所示，在衬底12上且周边区11内形成挡墙13。其中，挡墙13具有第一顶面1301、第一底面1302以及与第一顶面1301和第一底面1302连接的第一侧面1303。挡墙13的第一顶面1301和第一底面1302在垂直于衬底12的方向上相对设置，第一底面1302相比于第一顶面1301更靠近衬底12。
S12、参考图1和图2，在挡墙13的第一侧面1303与第一底面1302连接位置处的外侧，形成填充图案14。其中，挡墙13和填充图案14作为整体构成的外轮廓的侧面的坡度小于第一侧面的坡度。
示例性地，可以采用通过喷墨打印工艺形成填充图案14。
因此，本公开的实施例中的显示面板1，通过填充图案14，可以使得挡墙13和填充图案14作为整体构成的外轮廓的侧面的坡度，小于第一侧面1303的坡度，即，挡墙13和填充图案14作为整体构成的外轮的侧面相比于第一侧面1303更平缓。因此，在后续制作其他膜层的过程中，使得后续膜层在填充图案14位置处的坡度也相应的较为平缓。这样，即使挡墙13的第一侧面1303与第一底面1302的夹角较大，即，挡墙13第一侧面1303的坡度较大，也可以使得后续膜层在挡墙13的第一侧面1303和第一底面1302连接位置处较为平缓，从而避免了后续膜层在挡墙13的第一侧面1303和第一底面1302连接位置处应力较为集中(即应力较大)的问题，降低了后续膜层发生开裂的风险，提高了显示面板1的性能。
需要说明的是，图14A至图14D以显示区10的每个外侧(即四周)均设置有挡墙13进行示例，即，挡墙13围绕显示区10，但本公开实施例并不限于此。
需要说明的是，图15A和图15B以填充图案14和挡墙13接触进行示意，但本公开实施例并不限于此，在填充图案14和挡墙13之间也可以设置其他 膜层。例如，填充图案14和挡墙13之间可以设置无机绝缘层(例如文中描述的第一无机封装层)。
在一些实施例中，显示面板1的制备方法还包括：参考图8A和图8B，在衬底12上形成覆盖所述显示区10的封装层17，该封装层17可以为薄膜封装层，封装层17包括有机封装层171，有机封装层171在衬底12上的正投影的边沿，位于挡墙13在衬底12上的正投影靠近显示区10的边沿之内，并且，在挡墙13的个数为多个的情况下，有机封装层171位于最靠近显示区10的挡墙13限定的范围内。如图15A和图15B所示，有机封装层171与填充图案14通过喷墨打印工艺同步形成。
示例性地，参考图8A和图8B所示，以薄膜封装层17为三层结构为例，即，先形成第一无机封装层1721(如图15C和图15D所示)，然后采用喷墨打印工艺，同步形成有机封装层171和填充图案14，之后形成第二无机封装层1722。
例如，填充图案14与挡墙13之间存在第一无机封装层1721的部分。此时，将挡墙13和填充图案14看作整体时，可以将第一无机封装层1721与填充图案14与挡墙13接触的部分包含在该整体中，这样，挡墙13和填充图案14作为整体构成的外轮廓的侧面，包括填充图案14的侧面(即第二侧面)和第一无机封装层1721的部分侧面。有机封装层171与填充图案14同步通过喷墨打印工艺形成，在制作机封装层171时，同时在挡墙13的第一侧面与挡墙13靠近衬底12一侧接触的膜层接触位置处，制作有填充图案14。这样一来，可以在不增加制作工序的基础上，制作填充图案14。
在此情况下，有机封装层171与填充图案14进行喷墨打印的时间相同，可以通过控制喷墨打印的墨滴的总量，可控制形成的有机封装层171和填充图案14的宽度和高度，并控制填充图案14的坡度。示例性地，在第一侧面1303与第一底面1302连接位置处，喷墨打印的墨滴总量约为10μm 3～30μm 3，例如可以为15μm 3、20μm 3或25μm 3。也即，形成一个填充图案14所需要的喷墨打印的墨滴总量约为10μm 3～30μm 3。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种显示面板，具有显示区和周边区；所述显示面板包括：
    衬底；
    挡墙，设置于所述衬底上且位于所述周边区；其中，所述挡墙具有第一顶面、第一底面以及与所述第一顶面和所述第一底面连接的第一侧面；所述挡墙的第一顶面和第一底面在垂直于所述衬底的方向上相对设置，所述第一底面相比于所述第一顶面更靠近所述衬底；和
    填充图案，设置于所述第一侧面与所述第一底面连接位置处的外侧；所述挡墙和所述填充图案作为整体构成的外轮廓的侧面的坡度，小于所述第一侧面的坡度。
  2. 根据权利要求1所述的显示面板，其中，所述填充图案具有第二底面、第二侧面和第三侧面；所述第二底面分别与所述第二侧面和所述第三侧面连接；沿所述显示区至所述周边区的方向，所述第二侧面相比于所述第三侧面远离所述挡墙；
    所述第二侧面的坡度小于所述第一侧面的坡度。
  3. 根据权利要求2所述的显示面板，其中，所述第二侧面与所述第二底面的夹角约小于30°。
  4. 根据权利要求1～3中任一项所述的显示面板，其中，所述第一侧面与所述第一底面的夹角约为30°～90°。
  5. 根据权利要求1～4中任一项所述的显示面板，其中，所述填充图案的个数为多个，多个填充图案包括第一填充图案和第二填充图案；
    所述第一填充图案位于所述挡墙靠近所述显示区的一侧，所述第二填充图案位于所述挡墙远离所述显示区的一侧。
  6. 根据权利要求1～5中任一项所述的显示面板，其中，沿所述显示区至所述周边区的方向，所述挡墙的宽度约为30μm～50μm。
  7. 根据权利要求1～6中任一项所述的显示面板，其中，所述挡墙的个数为多个，多个挡墙包括第一挡墙和第二挡墙；
    沿所述显示区至所述周边区的方向，所述第一挡墙和所述第二挡墙间隔设置，且所述第一挡墙相比于所述第二挡墙靠近所述显示区；
    所述第二挡墙的高度大于所述第一挡墙的高度。
  8. 根据权利要求1～7中任一项所述的显示面板，还包括：
    覆盖所述显示区的封装层；所述封装层包括有机封装层和无机封装层，所述有机封装层在所述衬底上的正投影的边沿，位于所述挡墙在所述衬底上的正投影靠近所述显示区的边沿之内；
    所述无机封装层还延伸至所述周边区，所述无机封装层在所述衬底上的正投影，覆盖所述挡墙在所述衬底上的正投影和所述填充图案在所述衬底上的正投影。
  9. 根据权利要求8所述的显示面板，其中，所述有机封装层和所述填充图案同层设置且材料相同。
  10. 根据权利要求8或9所述的显示面板，其中，所述无机封装层为两层，分别为第一无机封装层和第二无机封装层；所述第一无机封装层相比于所述第二无机封装层靠近所述衬底，所述有机封装层位于所述第一无机封装层和所述第二无机封装层之间。
  11. 根据权利要求1～10中任一项所述的显示面板，其中，在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第一顶面与所述衬底的间距。
  12. 根据权利要求1～11中任一项所述的显示面板，其中，所述挡墙包括第一图案；
    所述显示面板还包括：
    像素界定层，设置于所述衬底上且位于所述显示区；
    所述第一图案与所述像素界定层同层设置且材料相同。
  13. 根据权利要求12所述的显示面板，其中，所述挡墙还包括第二图案；所述第二图案位于所述第一图案远离所述衬底的一侧；
    所述显示面板还包括：
    隔离柱，位于所述显示区；所述第二图案与所述隔离柱同层设置且材料相同；
    在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第二图案中靠近所述衬底的表面与所述衬底的间距。
  14. 根据权利要求12或13所述的显示面板，其中，所述挡墙还包括第三图案；所述第三图案位于所述第一图案靠近所述衬底的一侧；
    所述显示面板还包括：
    至少覆盖所述显示区的平坦层；
    所述平坦层与所述第三图案同层设置且材料相同；
    在垂直于所述衬底的方向上，所述填充图案中远离所述衬底的顶部与所述衬底的间距，小于所述第三图案中远离所述衬底的表面与所述衬底的间距。
  15. 根据权利要求1～14中任一项所述的显示面板，其中，所述衬底包括柔性衬底。
  16. 一种显示装置，包括：如权利要求1～15中任一项所述的显示面板。
  17. 一种显示面板的制备方法，包括：
    提供衬底，所述衬底具有显示区和周边区；
    在所述衬底上且所述周边区内形成挡墙；所述挡墙具有第一顶面、第一底面以及与所述第一顶面和所述第一底面连接的第一侧面；所述挡墙的第一顶面和第一底面在垂直于所述衬底的方向上相对设置，所述第一底面相比于所述第一顶面更靠近所述衬底；
    在所述第一侧面与所述第一底面连接位置处的外侧形成填充图案；所述挡墙和所述填充图案作为整体构成的外轮廓的侧面的坡度，小于所述第一侧面的坡度。
  18. 根据权利要求17所述的制备方法，还包括：
    在所述衬底上形成覆盖所述显示区的封装层；所述封装层包括有机封装层，所述有机封装层在所述衬底上的正投影的边沿，位于所述挡墙在所述衬底上的正投影靠近所述显示区的边沿之内；
    所述有机封装层与所述填充图案同步通过喷墨打印工艺形成。
  19. 根据权利要求18所述的制备方法，其中，在所述第一侧面与所述第一底面连接位置处，喷墨打印的墨滴总量约为10μm 3～30μm 3。
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