WO2021238645A1 - 显示用基板及其制备方法、显示装置 - Google Patents

显示用基板及其制备方法、显示装置 Download PDF

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Publication number
WO2021238645A1
WO2021238645A1 PCT/CN2021/093145 CN2021093145W WO2021238645A1 WO 2021238645 A1 WO2021238645 A1 WO 2021238645A1 CN 2021093145 W CN2021093145 W CN 2021093145W WO 2021238645 A1 WO2021238645 A1 WO 2021238645A1
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Prior art keywords
substrate
light
annular groove
layer
display substrate
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PCT/CN2021/093145
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English (en)
French (fr)
Inventor
胡春静
代青
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京东方科技集团股份有限公司
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Priority to US17/776,960 priority Critical patent/US20220399408A1/en
Publication of WO2021238645A1 publication Critical patent/WO2021238645A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display substrate, a preparation method thereof, and a display device.
  • OLED display panels have gradually become one of the mainstream displays in the display field due to their low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility. OLED display panels can be widely used in terminal products such as smart phones, tablet computers, and TVs.
  • a display substrate has a plurality of sub-pixel regions.
  • the display substrate includes: a substrate; a flat layer provided on a side of the substrate; and a plurality of light-emitting layers provided on a side of the flat layer away from the substrate.
  • the flat layer includes a plurality of first parts and second parts, a first part is arranged in a sub-pixel area, and the second part is located in a gap area between the plurality of sub-pixel areas; There is a distance between the side surface and the side surface of the second part to form a plurality of annular grooves, and one annular groove surrounds one first part.
  • a light-emitting layer covers a first part of the flat layer.
  • the edge of the light-emitting layer is located in the annular groove.
  • the edge of the light-emitting layer and the edge of the first portion overlap or substantially overlap in a direction perpendicular to the substrate.
  • the material of the flat layer includes a lyophobic material.
  • the display substrate further includes: a lyophobic material layer covering at least an inner surface of the annular groove close to the second part.
  • the display substrate further includes: a first electrode located between the flat layer and the light-emitting layer.
  • the edge of the first electrode is located in the annular groove.
  • the edge of the first electrode and the edge of the first portion overlap or substantially overlap in a direction perpendicular to the substrate.
  • the material of the first electrode includes a lyophilic material.
  • the cross-sectional shape of the annular groove is an inverted trapezoid, and the length of the bottom side of the inverted trapezoid on the side close to the substrate is smaller than the length of the top side on the side away from the substrate.
  • the cross-sectional shape of the annular groove is a regular trapezoid, and the length of the bottom side of the regular trapezoid on the side close to the substrate is greater than the length of the top side on the side far from the substrate.
  • the surface of the first part away from the substrate and the side surface of the annular groove close to the first part have rounded corners.
  • the ratio of the depth of the annular groove to the thickness of the light-emitting layer ranges from about 1.5 to about 5.
  • a display device in another aspect, includes the display substrate as described in any one of the above embodiments.
  • a method for preparing a display substrate includes: providing a substrate, the substrate having a plurality of sub-pixel regions; forming a flat thin film on one side of the substrate, patterning the flat thin film, and forming a plurality of annular grooves in the flat thin film , Obtain a flat layer; the flat layer is divided into a plurality of first parts and second parts by the plurality of annular grooves, an annular groove surrounds a first part, a first part is arranged in a sub-pixel area, and the second A plurality of light-emitting layers are formed on the side of the flat layer away from the substrate, and one light-emitting layer covers a first part of the flat layer.
  • the forming a plurality of light-emitting layers on the side of the flat layer away from the substrate includes: ink-jet printing the light-emitting material ink on the side of the flat layer away from the substrate; Drying the luminescent material ink to form the plurality of luminescent layers.
  • FIG. 1 is a top view of a display substrate provided by some embodiments of the present disclosure
  • Figure 2 is a partial cross-sectional view at P-P in Figure 1;
  • FIG. 3 is a partial cross-sectional view of another display substrate provided by some embodiments of the present disclosure.
  • FIG. 4 is a partial cross-sectional view of another display substrate provided by some embodiments of the present disclosure.
  • FIG. 5 is a partial cross-sectional view of another display substrate provided by some embodiments of the present disclosure.
  • FIG. 6 is a partial cross-sectional view of another display substrate provided by some embodiments of the present disclosure.
  • Figure 7 is a partial enlarged view of Figure 6 at H;
  • FIG. 8 is a partial cross-sectional view of another display substrate provided by some embodiments of the present disclosure.
  • Figure 9 is a partial enlarged view of Figure 8 at I;
  • FIG. 10 is a partial cross-sectional view of a display device provided by some embodiments of the present disclosure.
  • FIG. 11A is a flow chart of a manufacturing process of a display substrate provided by some embodiments of the present disclosure.
  • FIG. 11B is a flowchart of another manufacturing process of a display substrate provided by some embodiments of the disclosure.
  • FIG. 12 is a step diagram of preparing a substrate according to some embodiments of the present disclosure.
  • FIG. 13 is a step diagram of preparing a flat film according to some embodiments of the present disclosure.
  • 16-17 are diagrams of another step of preparing an annular groove provided by some embodiments of the disclosure.
  • FIG. 18 is a step diagram of preparing a first electrode provided by some embodiments of the present disclosure.
  • FIG. 19 is a diagram of another step of preparing a first electrode provided by some embodiments of the present disclosure.
  • FIG. 20 is a step diagram of preparing a light-emitting layer according to some embodiments of the present disclosure.
  • FIG. 21 is a diagram of another step of preparing a light-emitting layer according to some embodiments of the present disclosure.
  • FIG. 22 is a step diagram of preparing a second electrode according to some embodiments of the present disclosure.
  • 23-24 are partial cross-sectional views of a display substrate in the related art.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • plural means two or more.
  • “approximately” includes the stated value as well as the average value within the acceptable deviation range of the specified value, where the acceptable deviation range is considered by a person of ordinary skill in the art in consideration of the measurement being discussed and the The measurement-related error (ie, the limitations of the measurement system) of a specific quantity is determined.
  • the exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances can be envisaged. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing.
  • the etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
  • the film forming process of the OLED display panel mainly includes an evaporation process and a solution process.
  • the vapor deposition process is relatively mature in the application of small-size OLED display panels, and the technology is currently in mass production.
  • the solution process mainly includes inkjet printing, nozzle coating, spin coating, screen printing, etc.
  • the inkjet printing process has a high material utilization rate and can achieve large-size, which is considered to be a large-size OLED display panel to achieve mass production One of the important crafts.
  • the inkjet printing process is used to form the film, but the light-emitting layer formed by this process has the problem of uneven thickness, which in turn leads to uneven or loss of the light-emitting color of the light-emitting layer, which affects the display quality of the OLED display panel.
  • the light-emitting layer is formed by the inkjet printing process, and the thickness of the light-emitting layer is uneven.
  • the inventor of the present application has discovered through research that one of the reasons for the above-mentioned problems is:
  • the light-emitting layer D2' is formed by an inkjet printing process.
  • the side wall of the retaining wall 15 of the pixel defining layer (Pixel Defining Layer, PDL for short) is lyophilic, The ink will climb along the side wall of the retaining wall 15 to form a light-emitting layer D2' with a thin middle and a thick edge; The opening regions between 15 are gathered in the middle to form a light-emitting layer D2' with thin edges and thick middle. Therefore, regardless of whether the side wall of the barrier 15 of the pixel defining layer is close to or lyophobic, the thickness of the light-emitting layer D2' will be uneven.
  • the substrate 100 for display has a plurality of sub-pixel regions A.
  • 1 shows a plan view of a display substrate 100
  • FIGS. 2 to 5 show a partial cross-sectional view of the display substrate 100 along PP.
  • the display substrate 100 includes a substrate 10 and is disposed on the substrate 10.
  • Each pixel driving circuit includes a plurality of thin film transistors 11.
  • each thin film transistor 11 includes a gate 111, an active layer 112, a source 113, and a drain 114.
  • a gate insulating layer 12 is provided between the active layer 112 and the gate 111 on the surface of the substrate 10 on the side close to the gate 111.
  • the display substrate 100 further includes a flat layer 13 covering the side of the plurality of pixel driving circuits away from the substrate 10.
  • the flat layer 13 includes a plurality of first portions B and second portions C.
  • One first portion B is provided in one sub-pixel area A, and the second portion C is located in the gap area E between the plurality of sub-pixel areas A. .
  • each first portion B in the flat layer 13 has a via 131 so that the light emitting device D is electrically connected to the thin film transistor 11 through the via 131.
  • the display substrate 100 further includes a passivation layer 14 disposed between the flat layer 13 and the pixel driving circuit.
  • the via 131 in the planarization layer 13 also penetrates the passivation layer 14 so that the light-emitting device D is electrically connected to the thin film transistor 11 through the via 131 that penetrates the planarization layer 13 and the passivation layer 14.
  • the display substrate 100 further includes a plurality of light-emitting devices D arranged on the side of the flat layer 13 away from the substrate 10, and one light-emitting device D is arranged in one sub-pixel area A.
  • Each light emitting device D includes a first electrode D1, a light emitting layer D2, and a second electrode D3.
  • the first electrode D1 of the light-emitting device D is located between the flat layer 13 and the light-emitting layer D2, and the first electrode D1 passes through the via 131 in the first part B of the flat layer 13 and passes through the plurality of thin film transistors 11 included in the pixel driving circuit.
  • the source electrode 113 or the drain electrode 114 of the thin film transistor 11 as the driving transistor is electrically connected (the first electrode D1 and the drain electrode 114 are electrically connected in the figure), and the light emitting layer D2 and the second electrode D3 are sequentially arranged on the first electrode D1 and the drain electrode 114.
  • the electrode D1 is away from the side of the substrate 10.
  • the light-emitting layer D2 can be formed by an inkjet printing process.
  • the first electrode D1 may be, for example, an anode
  • the second electrode D3 may be, for example, a cathode.
  • the light-emitting device D in addition to the light-emitting layer D2, the light-emitting device D also includes an electron transport layer (election transporting layer, ETL), an electron injection layer (election injection layer, EIL), and a hole transporting layer (hole transporting layer). , HTL for short) and one or more of the hole injection layer (HIL for short) to improve the luminous efficiency of the light emitting device D.
  • ETL electron transporting layer
  • EIL electron injection layer
  • hole transporting layer hole transporting layer
  • the pixel driving circuit is used to apply a voltage to the first electrode D1 of the light-emitting device D, and to apply a voltage to the second electrode D3 of the light-emitting device D, so that a voltage difference is formed between the first electrode D1 and the second electrode D3, so that the light-emitting device can be driven
  • the light-emitting layer D2 in D emits light, so that the display device realizes the display of the picture.
  • the pixel defining layer of the display substrate 100 does not use a pixel defining layer, but a plurality of annular grooves 132 are formed on the flat layer 13 to form a plurality of first portions B located in the annular grooves 132, And the second part C located between the plurality of sub-pixel regions A.
  • the luminescent material ink is sprayed on the side of the first part B away from the substrate 10. Since the luminescent material ink is in contact with the plane, it is avoided that the luminescent material ink shrinks or is defined along the pixel. The phenomenon that the side walls of the retaining wall 15 of the layer climb up, thereby forming the light-emitting layer D2 with a relatively uniform thickness, thereby improving the uniformity of the light-emitting color of the light-emitting layer D2.
  • the edge of the first electrode D1 and the edge of the first portion B overlap or substantially overlap in the direction perpendicular to the substrate 10, and the edge of the light-emitting layer D2 overlaps with the edge of the first portion B. They overlap or substantially overlap in a direction perpendicular to the substrate 10, and the light-emitting layer D2 covers the first electrode D1.
  • the light-emitting area of the light-emitting device D is located in the first portion B to ensure that the light-emitting area of the light-emitting device D is approximately equal to the orthographic projection area of the first part B on the substrate 10, so that the entire light-emitting layer D2 can be formed on the plane formed by the first part B, so that the film of the light-emitting layer D2 is relatively flat .
  • the “substantially overlap” refers to the limitation of the preparation process of the first electrode D1 and the light-emitting layer D2.
  • the shape and area of the prepared first electrode D1 and the light-emitting layer D2 have process errors, which may not be possible. It is ensured that the edges of the first electrode D1 and the light-emitting layer D2 and the edge of the first portion B are accurately overlapped in the direction perpendicular to the substrate 10.
  • the edge of the first electrode D1 is located in the annular groove 132
  • the edge of the light-emitting layer D2 is also located in the annular groove 132
  • the light-emitting layer D2 covers the first electrode D1.
  • the material of the flat layer 13 includes a lyophobic material.
  • the display substrate 100 further includes a lyophobic material layer 133, which covers at least the inner surface of the annular groove 132 near the second portion C, for example, the lyophobic material layer 133 covers the annular shape.
  • the entire inner surface of the groove 132, the embodiment of the present disclosure is not limited thereto.
  • the liquid repellent material used for the flat layer 13 or the material of the liquid repellent material layer 133 may include at least one of fluorine-doped polyimide, polymethyl methacrylate, and the like.
  • the luminescent material ink when the luminescent layer D2 is prepared by the inkjet printing process, the luminescent material ink is sprayed on the surface of the first electrode D1 away from the substrate 10. Since the luminescent material ink is fluid and is affected by gravity, A certain amount of luminescent material ink will flow into the annular groove 132, and the annular groove 132 is used to receive the flowing luminescent material ink. The luminescent material ink flowing into the annular groove 132 is affected by the lyophobic material layer 133, which can reduce the phenomenon that the luminescent material ink climbs along the side wall of the annular groove 132 close to the second portion C, and prevents the luminescent material ink from overflowing the annular groove 132. Go to the second part C.
  • the luminescent material ink flowing into the annular groove 132 is dried, so that the edge of the luminous layer D2 is located in the annular groove 132, so that the luminous layers D2 of two adjacent sub-pixel regions A are disconnected, and the effect of pixel definition is achieved.
  • the cross-sectional shape of the annular groove 132 is an inverted trapezoid, and the length of the bottom side of the inverted trapezoid on the side close to the substrate 10 is smaller than the length of the top side on the side away from the substrate 10. That is, the width of the notch of the annular groove 132 is greater than the width of the groove bottom, which makes the corner of the first part B away from the substrate 10 an obtuse angle, which facilitates the flow of the luminescent material ink into the annular groove 132 and improves the receiving effect of the annular groove 132 .
  • the cross-sectional shape of the annular groove 132 is a regular trapezoid, and the length of the bottom side of the regular trapezoid on the side close to the substrate 10 is greater than the length of the top side on the side away from the substrate 10, That is, the width of the notch of the annular groove 132 is smaller than the width of the groove bottom, which makes the corner of the first part B away from the substrate 10 an acute angle, thereby further reducing the phenomenon of the luminescent material ink climbing along the side wall of the annular groove 132 .
  • the luminescent material ink is dried so that the edge of the luminescent layer D2 is located in the annular groove 132. Since the corner of the side of the first part B away from the substrate 10 is at an acute angle, it is more conducive to the luminescent layer of the two adjacent sub-pixel regions A. Disconnect between D2, thereby further improving the effect of pixel definition.
  • the ratio of the depth of the annular groove 132 to the thickness of the light-emitting layer D2 ranges from about 1.5 to about 5 to ensure that the luminescent material ink required to form the light-emitting layer D2 does not overflow the annular groove 132.
  • the thickness of the light-emitting layer D2 is 0.2 ⁇ m
  • the depth of the annular groove 132 ranges from 0.3 ⁇ m to 1 ⁇ m.
  • the depth of the annular groove 132 is 0.3 ⁇ m, 0.6 ⁇ m, and 1 ⁇ m.
  • the ratio of the thickness of D2 is 1.5, 3, and 5.
  • the depth of the annular groove 132 can be reduced and the distance of the first part B away from the substrate 10 can be increased.
  • the corner angle on one side, the corner on the side of the first part B away from the substrate 10 is set to a rounded corner R (as shown in FIGS. 6-9), and the thickness of the second electrode D3 is increased.
  • the angle range of the corner on the side of the first part B away from the substrate 10 is 60° to 60° to 90° (not including 90°), so as to prevent the second electrode D3 from breaking in the annular groove 132, and to ensure that the second electrode D3 has good continuity.
  • the material of the first electrode D1 includes a lyophilic material, such as acrylic.
  • the luminescent material ink is sprayed on the surface of the first electrode D1. Under the action of the lyophilic material, the luminescent material ink has affinity with the surface of the first electrode D1, which facilitates the attachment of the luminescent material ink to the surface of the first electrode D1, thereby improving
  • the uniformity of the thickness of the light-emitting layer D2 is formed by baking.
  • the display device 200 may be an electroluminescence display device, and the electroluminescence display device may be an organic light-emitting display device. OLED for short) or Quantum Dot Light Emitting Diodes (QLED for short).
  • OLED for short
  • QLED Quantum Dot Light Emitting Diodes
  • the display device 200 includes the above-mentioned display substrate 100.
  • the pixel definition of the display substrate 100 does not use a pixel defining layer. Instead, a plurality of annular grooves 132 are formed on the flat layer 13 to form a plurality of first portions located in the annular grooves 132. B, and the second part C located between the plurality of sub-pixel regions A.
  • the luminescent material ink is sprayed on the side of the first part B away from the substrate 10. Since the luminescent material ink is in contact with the plane, it is avoided that the luminescent material ink shrinks or is along the side of the barrier 15 of the pixel defining layer.
  • the phenomenon of wall climbing forms the light-emitting layer D2 with a relatively uniform thickness, thereby improving the uniformity of the light-emitting color of the light-emitting layer D2, thereby improving the display effect of the display device 200.
  • the above-mentioned display device 200 may be a top-emission display device.
  • the first electrode D1 close to the substrate 10 is opaque, and the second electrode D3 far away from the substrate 10 is transparent or semi-transparent. Light is emitted from the light-emitting layer D2.
  • the second electrode D3 is emitted in a direction away from the substrate 10.
  • the above-mentioned display device 200 may also be a bottom-emission display device.
  • the first electrode D1 close to the substrate 10 is transparent or semi-transparent, and the second electrode D3 far away from the substrate 10 is opaque, and light is emitted from the light-emitting layer D2. It is emitted in a direction close to the substrate 10 through the first electrode D1.
  • the above-mentioned electroluminescent display device further includes a packaging structure, and the packaging structure may be a packaging film or a packaging substrate.
  • the packaging structure is a packaging film
  • the electroluminescent display device described above further includes an packaging layer 2.
  • the encapsulation layer 2 is used to encapsulate the display substrate 100 and includes at least a first inorganic barrier layer 21, an organic barrier layer 22, and a second inorganic barrier layer 23.
  • the first inorganic barrier layer 21 is in contact with the surface of the display substrate 100, and the organic barrier layer 22
  • the second inorganic barrier layer 23 is formed on the side of the first inorganic barrier layer 21 away from the display substrate 100, and the second inorganic barrier layer 23 is formed on the side of the organic barrier layer 22 away from the first inorganic barrier layer 21.
  • the first inorganic barrier layer 21 and the second inorganic barrier layer 23 have the function of blocking water vapor and oxygen, while the organic barrier layer 22 has a certain flexibility and the function of absorbing water vapor, so that the formed encapsulation layer 2 can be used for the display substrate 100 A good packaging effect is achieved, and packaging failure is not easy to occur.
  • the foregoing electroluminescent display device may further include components such as a polarizer 3, an optically clear adhesive 4 (Optically Clear Adhesive, OCA for short), a cover glass 5 and the like.
  • a polarizer 3 Optically Clear Adhesive, OCA for short
  • a cover glass 5 Optically Clear Adhesive, OCA for short
  • the above-mentioned display device 200 may be any device that displays images, whether in motion (for example, video) or fixed (for example, still images), and regardless of text or images. More specifically, it is expected that the described embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, and personal data assistants (PDAs).
  • PDAs personal data assistants
  • Handheld or portable computers GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, TV monitors, flat panel displays, computer monitors, car monitors (e.g., Odometer display, etc.), navigator, cockpit controller and/or display, camera view display (for example, the display of a rear-view camera in a vehicle), electronic photos, electronic billboards or signs, projectors, building structures, packaging And aesthetic structure (for example, a display of the image of a piece of jewelry), etc.
  • the preparation method includes the following S1 to S3:
  • a substrate 10 is provided, and the substrate 10 has a plurality of sub-pixel regions A.
  • a plurality of pixel driving circuits are formed on one side of the substrate 10, each pixel driving circuit includes a plurality of thin film transistors 11, and each thin film transistor 11 includes a gate 111, an active layer 112, a source 113 and a drain 114.
  • a gate insulating layer 12 is provided between the active layer 112 and the gate 111 on the surface of the substrate 10 on the side close to the gate 111.
  • a passivation layer 14 is formed on the side of the plurality of pixel driving circuits away from the substrate 10, and the passivation layer 14 covers the plurality of pixel driving circuits.
  • a flat layer 13 is formed on one side of the substrate 10.
  • the above S2 includes the following S21 to S22:
  • a flat film 130 is formed on one side of the substrate 10.
  • a flat film 130 is formed on the side of the passivation layer 14 away from the substrate 10 by a coating and film forming process, and the flat film 130 covers a plurality of pixel driving circuits on the substrate 10.
  • the flat film 130 is patterned, a plurality of annular grooves 132 are formed in the flat film 130, and the flat layer 13 is divided by the plurality of annular grooves 132 into a plurality of first parts B and In the second part C, an annular groove 132 surrounds a first part B, a first part B is arranged in a sub-pixel area A, and the second part C is located between a plurality of sub-pixel areas A.
  • the patterning process is used to expose the flat film 130 to ultraviolet light using a mask.
  • the exposure area may be the area where the annular groove 132 to be formed is located, or the flat film 130 except for the annular groove 132 to be formed. This depends on the type of photoresist used for the flat film 130.
  • the exposure area is the area where the annular groove 132 to be formed is located, and the part of the flat film 130 in the exposure area is removed to obtain the annular groove 132;
  • the photoresist used in 130 is a negative photoresist, and the exposed area is the part of the flat film 130 excluding the annular groove 132 to be formed, and the part of the flat film 130 outside the exposed area is removed to obtain the annular groove 132 .
  • the exposure area is the area where the annular groove 132 is located.
  • the amount of light obtained on the side of the flat film 130 near the ultraviolet light is larger than the amount of light obtained on the side away from the ultraviolet light. Therefore, the flat film 130 is removed from the side near the ultraviolet light after development.
  • the width of the part is larger than the width of the part removed from the side away from the ultraviolet light, so that the width of the slot of the annular groove 132 is greater than the width of the groove bottom, that is, the annular groove 132 with a regular trapezoidal cross-sectional shape.
  • the exposed area is the portion of the flat film 130 excluding the annular groove 132.
  • the amount of light obtained on the side of the flat film 130 near the ultraviolet light is larger than the amount of light obtained on the side away from the ultraviolet light. Therefore, the flat film 130 is removed from the side near the ultraviolet light after development.
  • the width of the removed portion is smaller than the width of the removed portion away from the ultraviolet light, so that the width of the groove of the annular groove 132 is smaller than the width of the groove bottom, that is, the annular groove 132 with an inverted trapezoidal cross-sectional shape.
  • the depth of the removed portion of the flat film 130 is controlled, so as to control the depth of the annular groove 132 to prevent the annular groove 132 from penetrating the flat layer 13, thereby causing the luminescent material ink to flow into the flat layer through the annular groove 132.
  • Pixel drive circuit under layer 13 By controlling the exposure and development time of the flat film 130, the depth of the removed portion of the flat film 130 is controlled, so as to control the depth of the annular groove 132 to prevent the annular groove 132 from penetrating the flat layer 13, thereby causing the luminescent material ink to flow into the flat layer through the annular groove 132.
  • a via 131 needs to be opened in each first portion B of the planarization layer 13.
  • the via 131 exposes the source 113 or the drain 114 of the thin film transistor 11 so that the first electrode D1 formed later is electrically connected to the source 113 or the drain 114 of the thin film transistor 11.
  • the patterning process is used to remove the part of the electrode film D10 that does not cover the first part B to obtain the first electrode D1, so that the edge of the first electrode D1 and the edge of the first part B are perpendicular to the liner.
  • the direction of the bottom 10 coincides or substantially coincides.
  • a patterning process is used to remove at least a part of the electrode film D10, leaving the electrode film D10 in the continuous part of the first part B and the annular groove 132 to obtain the first electrode D1, so that the first electrode D1 The edge is located in the annular groove 132.
  • a plurality of light-emitting layers D2 are formed on the side of the flat layer 13 away from the substrate 10.
  • the inkjet printing process is used to spray the luminescent material ink on the surface of the first electrode D1 away from the substrate 10. Since the luminescent material ink is in contact with the plane, it is avoided that the luminescent material ink shrinks or is defined along the pixel. The phenomenon that the side wall of the retaining wall 15 of the layer climbs. The luminescent material ink is dried to form a luminescent layer D2 with a relatively uniform thickness, and the luminescent layer D2 covers the first electrode D1.
  • the display substrate 100 since the pixel definition layer of the display substrate 100 does not use a pixel definition layer, the display substrate 100 does not need to enter a vacuum dryer (VCD) to dry the luminescent material ink.
  • VCD vacuum dryer
  • the real-time drying method can be used to directly heat and dry the luminescent material ink on the printer table, thereby obtaining a luminescent layer D2 with a relatively uniform thickness, which simplifies the process flow.
  • the luminescent material ink is sprayed only on the first electrode D1. s surface.
  • the edge of the light-emitting layer D2 formed by baking and the edge of the first portion B overlap or substantially overlap in the direction perpendicular to the substrate 10.
  • the edge of the first electrode D1 when the edge of the first electrode D1 is located in the annular groove 132, the luminescent material ink is sprayed on the surface of the first electrode D1 and flows into the annular groove 132.
  • the edge of the light-emitting layer D2 formed by baking is located in the annular groove 132, and the edge of the light-emitting layer D2 partially covers a part of the inner surface of the annular groove 132.
  • the spray amount of the luminescent material ink is controlled so that the luminescent material ink does not overflow the annular groove 132 and flow to the surface of the second part C.
  • the method further includes: forming a second electrode D3 on the side of the light-emitting layer D2 away from the substrate 10.
  • the second electrode D3 covers the surface of the display substrate 100 in a planar shape.

Abstract

一种显示用基板，包括：衬底；设置于衬底一侧的平坦层；以及，设置于平坦层远离衬底一侧的多个发光层。平坦层包括多个第一部分和第二部分，一个子像素区域内设置有一个第一部分，第二部分位于多个子像素区域之间的间隙区域；多个第一部分的侧面与第二部分的侧面之间具有间距，形成多个环形槽，一个环形槽围绕一个第一部分。一个发光层覆盖平坦层的一个第一部分。

Description

显示用基板及其制备方法、显示装置
本申请要求于2020年05月27日提交的、申请号为202010463812.5的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示用基板及其制备方法、显示装置。
背景技术
有机电致发光(Organic Light-Emitting Diode，简称OLED)显示面板凭借其低功耗、高色饱和度、广视角、薄厚度、能实现柔性化等优异性能，逐渐成为显示领域的主流之一，OLED显示面板可广泛应用于智能手机、平板电脑、电视等终端产品中。
发明内容
一方面，提供一种显示用基板。所述显示用基板具有多个子像素区域。所述显示用基板包括：衬底；设置于所述衬底一侧的平坦层；以及，设置于所述平坦层远离所述衬底一侧的多个发光层。所述平坦层包括多个第一部分和第二部分，一个子像素区域内设置有一个第一部分，所述第二部分位于所述多个子像素区域之间的间隙区域；所述多个第一部分的侧面与所述第二部分的侧面之间具有间距，形成多个环形槽，一个环形槽围绕一个第一部分。一个发光层覆盖所述平坦层的一个第一部分。
在一些实施例中，所述发光层的边缘位于所述环形槽内。
在一些实施例中，所述发光层的边缘与所述第一部分的边缘在垂直于所述衬底的方向上重合或大致重合。
在一些实施例中，所述平坦层的材料包括疏液材料。
在一些实施例中，所述显示用基板还包括：疏液材料层，所述疏液材料层至少覆盖所述环形槽靠近所述第二部分的内表面。
在一些实施例中，所述显示用基板还包括：第一电极，位于所述平坦层和所述发光层之间。
在一些实施例中，所述第一电极的边缘位于所述环形槽内。
在一些实施例中，所述第一电极的边缘与所述第一部分的边缘在垂直于所述衬底的方向上重合或大致重合。
在一些实施例中，所述第一电极的材料包括亲液材料。
在一些实施例中，所述环形槽的截面形状为倒梯形，所述倒梯形靠近所 述衬底一侧的底边的长度小于远离所述衬底一侧的顶边的长度。
在一些实施例中，所述环形槽的截面形状为正梯形，所述正梯形靠近所述衬底一侧的底边的长度大于远离所述衬底一侧的顶边的长度。
在一些实施例中，所述第一部分远离所述衬底的表面与所述环形槽靠近所述第一部分的侧面之间具有圆角。
在一些实施例中，所述环形槽的底面与所述平坦层靠近所述衬底的表面之间具有间距。
在一些实施例中，所述环形槽的深度与所述发光层的厚度的比值为范围为大约1.5～大约5。
另一方面，提供一种显示装置。所述显示装置包括：如上述任一项实施例所述的显示用基板。
又一方面，提供一种显示用基板的制备方法。所述制备方法包括：提供衬底，所述衬底具有多个子像素区域；在所述衬底的一侧形成平坦薄膜，图案化所述平坦薄膜，在所述平坦薄膜中形成多个环形槽，得到平坦层；所述平坦层被所述多个环形槽划分出多个第一部分和第二部分，一个环形槽围绕一个第一部分，一个子像素区域内设置有一个第一部分，所述第二部分位于所述多个子像素区域之间的间隙区域；在所述平坦层远离所述衬底的一侧形成多个发光层，一个发光层覆盖所述平坦层的一个第一部分。
在一些实施例中，所述在所述平坦层远离所述衬底的一侧形成多个发光层，包括：在所述平坦层远离所述衬底的一侧喷墨打印发光材料墨水；烘干所述发光材料墨水，形成所述多个发光层。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为本公开一些实施例提供的一种显示用基板的俯视图；
图2为图1中P-P处的局部剖视图；
图3为本公开一些实施例提供的另一种显示用基板的局部剖视图；
图4为本公开一些实施例提供的另一种显示用基板的局部剖视图；
图5为本公开一些实施例提供的另一种显示用基板的局部剖视图；
图6为本公开一些实施例提供的另一种显示用基板的局部剖视图；
图7为图6在H处的局部放大图；
图8为本公开一些实施例提供的另一种显示用基板的局部剖视图；
图9为图8在I处的局部放大图；
图10为本公开一些实施例提供的一种显示装置的局部剖视图；
图11A为本公开一些实施例提供的显示用基板的一种制备工艺流程图；
图11B为本公开一些实施例提供的显示用基板的另一种制备工艺流程图；
图12为本公开一些实施例提供的一种制备衬底的步骤图；
图13为本公开一些实施例提供的一种制备平坦薄膜的步骤图；
图14～图15为本公开一些实施例提供的一种制备环形槽的步骤图；
图16～图17为本公开一些实施例提供的另一种制备环形槽的步骤图；
图18为本公开一些实施例提供的一种制备第一电极的步骤图；
图19为本公开一些实施例提供的另一种制备第一电极的步骤图；
图20为本公开一些实施例提供的一种制备发光层的步骤图；
图21为本公开一些实施例提供的另一种制备发光层的步骤图；
图22为本公开一些实施例提供的一种制备第二电极的步骤图；
图23～图24为相关技术中显示用基板的局部剖视图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结 构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“大约”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
OLED显示面板的成膜工艺主要有蒸镀制程和溶液制程。蒸镀制程在小尺寸OLED显示面板应用较为成熟，目前该技术已经应用于量产中。而溶液制程主要有喷墨打印、喷嘴涂覆、旋涂、丝网印刷等，其中喷墨打印工艺的材料利用率较高、可以实现大尺寸化，被认为是大尺寸OLED显示面板实现量产的重要工艺之一。
在一些示例中，采用喷墨打印工艺成膜，然而这种工艺所形成的发光层存在厚度不均匀的问题，进而导致发光层的发光颜色不均匀或损失，影响OLED显示面板的显示质量。
如上所述，采用喷墨打印工艺形成发光层，发光层存在厚度不均匀的问题。本申请的发明人经过研究发现，产生上述问题的原因之一在于：
采用喷墨打印工艺形成发光层D2’，发光材料的墨水在干燥的过程中，如图23所示，若像素界定层(Pixel Defining Layer，简称PDL)的挡墙15侧 壁是亲液的，墨水会沿着挡墙15侧壁攀爬，形成中间薄、边缘厚的发光层D2’；如图24所示，若像素界定层的挡墙15侧壁是疏液的，墨水会在挡墙15之间的开口区域中间聚集，形成边缘薄、中间厚的发光层D2’。由此，无论像素界定层的挡墙15侧壁亲、疏液，都会导致发光层D2’的厚度不均匀。
基于此，本公开的一些实施例提供了一种显示用基板100，显示用基板100具有多个子像素区域A。图1示出了显示用基板100的俯视图，图2～图5示出了显示用基板100沿P-P的局部剖视图，在一些实施例中，显示用基板100包括衬底10和设置于衬底10一侧的多个像素驱动电路，一个子像素区域A内设置有一个像素驱动电路。每个像素驱动电路包括多个薄膜晶体管11。在一些实施例中，每个薄膜晶体管11包括栅极111、有源层112、源极113和漏极114。示例性的，位于衬底10靠近栅极111一侧的表面，有源层112与栅极111之间设置有栅极绝缘层12。
在一些实施例中，显示用基板100还包括覆盖在多个像素驱动电路远离衬底10一侧的平坦层13。
在一些实施例中，平坦层13包括多个第一部分B和第二部分C，一个子像素区域A内设置有一个第一部分B，第二部分C位于多个子像素区域A之间的间隙区域E。多个第一部分B的侧面与第二部分C的侧面之间具有间距F，形成多个环形槽132，一个环形槽132围绕一个第一部分B。
在一些实施例中，平坦层13中的每个第一部分B均具有过孔131，以便于发光器件D通过该过孔131与薄膜晶体管11电连接。
在一些其他的实施例中，显示用基板100还包括设置于平坦层13与像素驱动电路之间的钝化层14。这种情况下，平坦层13中的过孔131还贯通钝化层14，以使得发光器件D通过该贯通平坦层13和钝化层14的过孔131与薄膜晶体管11电连接。
在一些实施例中，显示用基板100还包括设置于平坦层13远离衬底10一侧的多个发光器件D，一个子像素区域A内设置有一个发光器件D。每个发光器件D包括第一电极D1、发光层D2和第二电极D3。
其中，发光器件D的第一电极D1位于平坦层13和发光层D2之间，第一电极D1通过平坦层13第一部分B中的过孔131与像素驱动电路所包括的多个薄膜晶体管11中作为驱动晶体管的薄膜晶体管11的源极113或漏极114电连接(图中示出了第一电极D1与漏极114电连接的情形)，发光层D2和第二电极D3依次设置于第一电极D1远离衬底10的一侧。发光层D2可采用喷墨打印工艺形成。第一电极D1例如可以为阳极，第二电极D3例如可以为 阴极。
在一些实施例中，发光器件D除包括发光层D2外，还包括电子传输层(election transporting layer，简称ETL)、电子注入层(election injection layer，简称EIL)、空穴传输层(hole transporting layer，简称HTL)以及空穴注入层(hole injection layer，简称HIL)中的一层或多层，以提高发光器件D的发光效率。
利用像素驱动电路向发光器件D的第一电极D1施加电压，并且向发光器件D的第二电极D3施加电压，使第一电极D1与第二电极D3之间形成电压差，从而可驱动发光器件D中发光层D2发出光线，进而使显示装置实现画面的显示。
在本公开的一些实施例中，显示用基板100的像素界定没有采用像素界定层，而是通过在平坦层13上开设多个环形槽132，形成多个位于环形槽132内的第一部分B，以及位于多个子像素区域A之间的第二部分C。采用喷墨打印工艺形成发光器件D的发光层D2时，发光材料墨水喷涂在第一部分B远离衬底10的一侧，由于发光材料墨水与平面接触，避免出现发光材料墨水内缩或沿像素界定层的挡墙15侧壁攀爬的现象，从而形成厚度较为均匀的发光层D2，从而提高发光层D2的发光颜色的均匀性。
示例性的，如图2和图3所示，第一电极D1的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合，发光层D2的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合，且发光层D2覆盖第一电极D1。
通过上述设置方式，在第一电极D1和发光层D2的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合的情况下，发光器件D的发光区域位于第一部分B内，保证发光器件D的发光面积与第一部分B在衬底10上的正投影面积大致相等，这样整个发光层D2均可以形成第一部分B所形成的平面上，使得发光层D2的膜层较平整。
需要说明是的，所述“大致重合”指的是受限于第一电极D1和发光层D2的制备工艺，制备得到的第一电极D1和发光层D2的形状和面积存在工艺误差，可能不能保证第一电极D1和发光层D2的边缘与第一部分B的边缘在垂直于衬底10的方向上精准重合。
示例性的，如图4和图5所示，第一电极D1的边缘位于环形槽132内，发光层D2的边缘也位于环形槽132内，发光层D2覆盖第一电极D1。
通过上述设置方式，在第一电极D1和发光层D2的边缘延伸到环形槽132 内的情况下，发光器件D的发光区域延伸到环形槽132内，从而提高了发光器件D的发光面积。
在一些实施例中，平坦层13的材料包括疏液材料。或者，如图4和图5所示，显示用基板100还包括疏液材料层133，疏液材料层133至少覆盖环形槽132靠近第二部分C的内表面，例如疏液材料层133覆盖环形槽132的整个内表面，本公开的实施例不限于此。
上述平坦层13的所采用的疏液材料或疏液材料层133的材料可包括掺氟聚酰亚胺、聚甲基丙烯酸甲酯等中的至少一种。
本公开的一些实施例中，采用喷墨打印工艺制备发光层D2时，发光材料墨水喷涂在第一电极D1远离衬底10一侧的表面上，由于发光材料墨水具有流动性且受重力作用，会有一定量的发光材料墨水流入到环形槽132内，环形槽132用于承接流动的发光材料墨水。流入环形槽132内的发光材料墨水受疏液材料层133的作用，可减弱发光材料墨水沿着环形槽132靠近第二部分C的侧壁攀爬的现象，避免发光材料墨水溢出环形槽132流到第二部分C上。
另外，烘干流入环形槽132内的发光材料墨水，使发光层D2的边缘位于环形槽132内，从而使相邻两个子像素区域A的发光层D2之间断开，实现像素界定的效果。
示例性的，如图2和图4所示，环形槽132的截面形状为倒梯形，且倒梯形靠近衬底10一侧的底边的长度小于远离衬底10一侧的顶边的长度，即环形槽132槽口的宽度大于槽底的宽度，这使得第一部分B远离衬底10的一侧的拐角呈钝角，有利于发光材料墨水流入到环形槽132内，提高环形槽132的承接效果。
示例性的，如图3和图5所示，环形槽132的截面形状为正梯形，且正梯形靠近衬底10一侧的底边的长度大于远离衬底10一侧的顶边的长度，即环形槽132槽口的宽度小于槽底的宽度，这使得第一部分B远离衬底10的一侧的拐角呈锐角，从而可以进一步减弱发光材料墨水沿着环形槽132的侧壁攀爬的现象。
另外，烘干发光材料墨水，使发光层D2的边缘位于环形槽132内，由于第一部分B远离衬底10的一侧的拐角呈锐角，因此更有利于相邻两个子像素区域A的发光层D2之间断开，从而进一步提高像素界定的效果。
在一些实施例中，如图2～图5所示，环形槽132的底面与平坦层13靠近衬底10的表面之间具有间距G，避免环形槽132贯通平坦层13，从而避免发 光材料墨水经环形槽132流入到位于平坦层13下方的像素驱动电路。
在一些实施例中，环形槽132的深度与发光层D2的厚度的比值范围为大约1.5～大约5，以确保形成发光层D2所需的发光材料墨水不会溢出环形槽132。示例性的，发光层D2的厚度为0.2μm，环形槽132的深度范围为0.3μm～1μm，例如环形槽132的深度为0.3μm、0.6μm和1μm，这样，环形槽132的深度与发光层D2的厚度的比值为1.5、3和5。
在一些实施例中，为了保证第二电极D3的膜层的连续性，使得其在环形槽132内不至于断裂，可以通过减小环形槽132的深度、增大第一部分B远离衬底10的一侧的拐角角度、将第一部分B远离衬底10的一侧的拐角设置为圆角R(如图6～图9所示)、增大第二电极D3的膜层厚度等措施中的至少一种，来达到上述目的。
示例性的，在环形槽132的截面形状为正梯形，且环形槽132的深度范围为0.3μm～1μm的情况下，第一部分B远离衬底10的一侧的拐角的角度范围为60°～90°(不包含90°)，以使第二电极D3在环形槽132内不至于断裂，保证第二电极D3具有良好的连续性。
在一些实施例中，第一电极D1的材料包括亲液材料，例如丙烯酸。发光材料墨水喷涂在第一电极D1的表面上，受亲液材料的作用，发光材料墨水与第一电极D1的表面亲和，有利于发光材料墨水附着在第一电极D1的表面，从而提高了烘干形成发光层D2的厚度的均匀性。
本公开一些实施例提供一种显示装置200，如图10所示，该显示装置200可以为电致发光显示装置，该电致发光显示装置可以为有机电致发光显示装置(Organic Light-Emitting Diode，简称OLED)或量子点电致发光显示装置(Quantum Dot Light Emitting Diodes，简称QLED)。
显示装置200包括上述的显示用基板100，显示用基板100的像素界定没有采用像素界定层，而是通过在平坦层13上开设多个环形槽132，形成多个位于环形槽132内的第一部分B，以及位于多个子像素区域A之间的第二部分C。采用喷墨打印工艺成膜时，发光材料墨水喷涂在第一部分B远离衬底10的一侧，由于发光材料墨水与平面接触，避免出现发光材料墨水内缩或沿像素界定层的挡墙15侧壁攀爬的现象，从而形成厚度较为均匀的发光层D2，从而提高发光层D2的发光颜色的均匀性，进而提高显示装置200的显示效果。
上述显示装置200可以是顶发射型显示装置，在此情况下，靠近衬底10的第一电极D1不透明，远离衬底10的第二电极D3透明或半透明，光线从发光层D2射出，经第二电极D3向远离衬底10的方向射出。上述显示装置 200也可以是底发射型显示装置，在此情况下，靠近衬底10的第一电极D1透明或半透明，远离衬底10的第二电极D3不透明，光线从发光层D2射出，经第一电极D1向靠近衬底10的方向射出。
在一些实施例中，上述电致发光显示装置还包括封装结构，封装结构可以为封装薄膜，也可以为封装基板。在封装结构为封装薄膜的情况下，上述电致发光显示装置还包括封装层2。
封装层2用于封装显示用基板100，至少包括第一无机阻隔层21、有机阻隔层22和第二无机阻隔层23，第一无机阻隔层21与显示用基板100表面接触，有机阻隔层22形成于第一无机阻隔层21远离显示用基板100的一侧，第二无机阻隔层23形成于有机阻隔层22远离第一无机阻隔层21的一侧。
第一无机阻隔层21和第二无机阻隔层23具有阻隔水汽和氧气的作用，而有机阻隔层22具有一定的柔性和吸收水汽的作用，从而使所形成的封装层2可以使显示用基板100达到良好的封装效果，不易出现封装失效现象。
在一些实施例中，上述电致发光显示装置还可包括偏光片3、光学胶4(Optically Clear Adhesive，简称OCA)和盖板玻璃5等部件。
上述显示装置200可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
本公开一些实施例提供了一种显示用基板的制备方法，如图11A所示，该制备方法包括下列S1～S3：
S1：提供衬底。
示例性的，如图12所示，提供一衬底10，衬底10具有多个子像素区域A。在衬底10的一侧形成多个像素驱动电路，每个像素驱动电路包括多个薄膜晶体管11，每个薄膜晶体管11包括栅极111、有源层112、源极113和漏极114。其中，位于衬底10靠近栅极111一侧的表面，有源层112与栅极111之间设置有栅极绝缘层12。在多个像素驱动电路远离衬底10的一侧形成钝化 层14，钝化层14覆盖多个像素驱动电路。
S2：在衬底10的一侧形成平坦层13。
如图11B所示，上述S2包括下列S21～S22：
S21：在衬底10的一侧形成平坦薄膜130。
示例性的，如图13所示，采用涂覆成膜的工艺在钝化层14远离衬底10的一侧形成平坦薄膜130，平坦薄膜130覆盖衬底10上的多个像素驱动电路。
S22：图案化平坦薄膜130，在平坦薄膜130中形成多个环形槽132，得到平坦层13。
在一些实施例中，如图14～图17所示，图案化平坦薄膜130，在平坦薄膜130中形成多个环形槽132，平坦层13被多个环形槽132划分出多个第一部分B和第二部分C，一个环形槽132围绕一个第一部分B，一个子像素区域A内设置有一个第一部分B，第二部分C位于多个子像素区域A之间。
需要说明的是，采用构图工艺，使用掩膜板对平坦薄膜130进行紫外光曝光，曝光区域可以是待形成的环形槽132所在的区域，或是平坦薄膜130上除待形成的环形槽132以外的部分，这取决于平坦薄膜130所使用的光刻胶的类型。若平坦薄膜130所使用的光刻胶为正性光刻胶，则曝光区域是待形成的环形槽132所在的区域，去除掉平坦薄膜130位于曝光区域的部分，得到环形槽132；若平坦薄膜130所使用的光刻胶的为负性光刻胶，则曝光区域是平坦薄膜130上除待形成的环形槽132以外的部分，去除掉平坦薄膜130位于曝光区域外的部分，得到环形槽132。
示例性的，如图14和图15所示，在平坦薄膜130所使用的光刻胶为正性光刻胶的情况下，曝光区域是环形槽132所在的区域。对环形槽132所在区域的平坦薄膜130进行曝光，平坦薄膜130靠近紫外光一侧得到的光照量相对于远离紫外光一侧得到的光照量较大，因此，显影后平坦薄膜130靠近紫外光一侧去除掉的部分的宽度，相对于远离紫外光一侧去除掉的部分的宽度较大，从而得到环形槽132槽口的宽度大于槽底的宽度，即截面形状为正梯形的环形槽132。
示例性的，如图16和图17所示，在平坦薄膜130所使用的光刻胶为负性光刻胶的情况下，曝光区域是平坦薄膜130上除环形槽132的部分。对平坦薄膜130上除环形槽132的部分进行曝光，平坦薄膜130靠近紫外光一侧得到的光照量相对于远离紫外光一侧得到的光照量较大，因此，显影后平坦薄膜130靠近紫外光一侧去除掉的部分的宽度，相对于远离紫外光一侧去除掉的部分的宽度较小，从而得到环形槽132槽口的宽度小于槽底的宽度，即 截面形状为倒梯形的环形槽132。
示例性的，如图15和图17所示，环形槽132的底面与平坦层13靠近衬底10的表面之间具有间距G。
通过控制平坦薄膜130曝光和显影的时长，控制平坦薄膜130去除部分的深度，从而控制环形槽132的深度，避免环形槽132贯通平坦层13，进而导致发光材料墨水经环形槽132流入到位于平坦层13下方的像素驱动电路。
在一些实施例中，在采用构图工艺图案化平坦层13的过程中，需要在平坦层13中的每个第一部分B均开设有过孔131。过孔131将薄膜晶体管11的源极113或漏极114暴露，以便于后续形成的第一电极D1与薄膜晶体管11的源极113或漏极114电连接。
在一些实施例中，如图18～图19所示，在S2之后，S3之前，还可以包括：在平坦层13远离衬底10的一侧形成电极薄膜，图案化电极薄膜，得到第一电极D1。
示例性的，如图18所示，采用构图工艺，去除掉电极薄膜D10未覆盖第一部分B的部分，得到第一电极D1，使第一电极D1的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合。
示例性的，如图19所示，采用构图工艺，去除掉电极薄膜D10的至少一部分，保留电极薄膜D10在第一部分B和环形槽132连续的部分，得到第一电极D1，使第一电极D1的边缘位于环形槽132内。
S3：在平坦层13远离衬底10的一侧形成多个发光层D2。
在一些实施例中，采用喷墨打印工艺，在第一电极D1远离衬底10一侧的表面上喷涂发光材料墨水，由于发光材料墨水与平面接触，避免出现发光材料墨水内缩或沿像素界定层的挡墙15侧壁攀爬的现象。烘干发光材料墨水，形成厚度较为均匀的发光层D2，且发光层D2覆盖第一电极D1。
在一些实施例中，由于显示用基板100的像素界定没有采用像素界定层，因此显示用基板100不用进入真空干燥机(Vacuum dryer，简称VCD)烘干发光材料墨水。可采用实时干燥法，直接在打印机台上加热干燥发光材料墨水，从而得到厚度较为均匀的发光层D2，简化了工艺流程。
示例性的，如图20所示，在第一电极D1的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合的情况下，发光材料墨水仅喷涂在第一电极D1的表面。烘干形成的发光层D2的边缘与第一部分B的边缘在垂直于衬底10的方向上重合或大致重合。
示例性的，如图21所示，在第一电极D1的边缘位于环形槽132内的情 况下，发光材料墨水喷涂在第一电极D1的表面，且流入到环形槽132内。烘干形成的发光层D2的边缘位于环形槽132内，且发光层D2的边缘部分覆盖在环形槽132的一部分内表面上。
示例性的，控制发光材料墨水的喷涂量，使发光材料墨水不会溢出环形槽132流到第二部分C的表面。
在一些实施例中，如图22所示，在S3之后，还包括：在发光层D2远离衬底10的一侧形成第二电极D3。例如，第二电极D3呈面状覆盖在显示用基板100的表面上。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种显示用基板，具有多个子像素区域；所述显示用基板包括：
    衬底；
    设置于所述衬底一侧的平坦层；所述平坦层包括多个第一部分和第二部分，一个子像素区域内设置有一个第一部分，所述第二部分位于所述多个子像素区域之间的间隙区域；所述多个第一部分的侧面与所述第二部分的侧面之间具有间距，形成多个环形槽，一个环形槽围绕一个第一部分；
    设置于所述平坦层远离所述衬底一侧的多个发光层，一个发光层覆盖所述平坦层的一个第一部分。
  2. 根据权利要求1所述的显示用基板，其中，所述发光层的边缘位于所述环形槽内。
  3. 根据权利要求1所述的显示用基板，其中，
    所述发光层的边缘与所述第一部分的边缘在垂直于所述衬底的方向上重合或大致重合。
  4. 根据权利要求1～3中任一项所述的显示用基板，其中，所述平坦层的材料包括疏液材料。
  5. 根据权利要求1～3中任一项所述的显示用基板，还包括：
    疏液材料层，所述疏液材料层至少覆盖所述环形槽靠近所述第二部分的内表面。
  6. 根据权利要求1～5中任一项所述的显示用基板，还包括：
    第一电极，位于所述平坦层和所述发光层之间。
  7. 根据权利要求6所述的显示用基板，其中，
    所述第一电极的边缘位于所述环形槽内。
  8. 根据权利要求6所述的显示用基板，其中，
    所述第一电极的边缘与所述第一部分的边缘在垂直于所述衬底的方向上重合或大致重合。
  9. 根据权利要求6～8中任一项所述的显示用基板，其中，
    所述第一电极的材料包括亲液材料。
  10. 根据权利要求1～9中任一项所述的显示用基板，其中，所述环形槽的截面形状为倒梯形，所述倒梯形靠近所述衬底一侧的底边的长度小于远离所述衬底一侧的顶边的长度。
  11. 根据权利要求1～10中任一项所述的显示用基板，其中，
    所述环形槽的截面形状为正梯形，所述正梯形靠近所述衬底一侧的底边的长度大于远离所述衬底一侧的顶边的长度。
  12. 根据权利要求1～11中任一项所述的显示用基板，其中，
    所述第一部分远离所述衬底的表面与所述环形槽靠近所述第一部分的侧面之间具有圆角。
  13. 根据权利要求1～12中任一项所述的显示用基板，其中，
    所述环形槽的底面与所述平坦层靠近所述衬底的表面之间具有间距。
  14. 根据权利要求1～13中任一项所述的显示用基板，其中，所述环形槽的深度与所述发光层的厚度的比值为范围为大约1.5～大约5。
  15. 一种显示装置，包括：
    如权利要求1～14中任一项所述的显示用基板。
  16. 一种显示用基板的制备方法，包括：
    提供衬底；所述衬底具有多个子像素区域；
    在所述衬底的一侧形成平坦薄膜，图案化所述平坦薄膜，在所述平坦薄膜中形成多个环形槽，得到平坦层；所述平坦层被所述多个环形槽划分出多个第一部分和第二部分，一个环形槽围绕一个第一部分，一个子像素区域内设置有一个第一部分，所述第二部分位于所述多个子像素区域之间的间隙区域；
    在所述平坦层远离所述衬底的一侧形成多个发光层，一个发光层覆盖所述平坦层的一个第一部分。
  17. 根据权利要求16所述的制备方法，其中，所述在所述平坦层远离所述衬底的一侧形成多个发光层，包括：
    在所述平坦层远离所述衬底的一侧喷墨打印发光材料墨水；
    烘干所述发光材料墨水，形成所述多个发光层。
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