WO2020262579A1 - 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 - Google Patents
樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 Download PDFInfo
- Publication number
- WO2020262579A1 WO2020262579A1 PCT/JP2020/025141 JP2020025141W WO2020262579A1 WO 2020262579 A1 WO2020262579 A1 WO 2020262579A1 JP 2020025141 W JP2020025141 W JP 2020025141W WO 2020262579 A1 WO2020262579 A1 WO 2020262579A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- resin
- compound
- formula
- resin composition
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 241
- 239000011347 resin Substances 0.000 title claims abstract description 241
- 239000011342 resin composition Substances 0.000 title claims abstract description 103
- 239000004065 semiconductor Substances 0.000 title claims description 24
- -1 bismaleimide compound Chemical class 0.000 claims abstract description 322
- 150000001875 compounds Chemical class 0.000 claims abstract description 133
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 95
- 238000000016 photochemical curing Methods 0.000 claims abstract description 63
- 239000003999 initiator Substances 0.000 claims abstract description 61
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 53
- 239000003822 epoxy resin Substances 0.000 claims abstract description 52
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 32
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 28
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims abstract description 18
- 125000004450 alkenylene group Chemical group 0.000 claims abstract description 15
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims abstract description 12
- 150000005130 benzoxazines Chemical class 0.000 claims abstract description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 76
- 125000000217 alkyl group Chemical group 0.000 claims description 46
- 239000004643 cyanate ester Substances 0.000 claims description 33
- 125000003342 alkenyl group Chemical group 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 11
- 125000001424 substituent group Chemical group 0.000 claims description 7
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims description 2
- 150000001718 carbodiimides Chemical class 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 85
- 238000000034 method Methods 0.000 description 79
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 65
- 239000000047 product Substances 0.000 description 55
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 38
- 239000010408 film Substances 0.000 description 37
- 239000000243 solution Substances 0.000 description 36
- 238000002834 transmittance Methods 0.000 description 36
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 35
- 238000011156 evaluation Methods 0.000 description 35
- 125000003118 aryl group Chemical group 0.000 description 26
- 239000002966 varnish Substances 0.000 description 26
- 238000001723 curing Methods 0.000 description 24
- 238000002835 absorbance Methods 0.000 description 22
- 239000002253 acid Substances 0.000 description 22
- 239000004593 Epoxy Substances 0.000 description 21
- KJCVRFUGPWSIIH-UHFFFAOYSA-N alpha-naphthol Natural products C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 21
- 239000000945 filler Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 239000003960 organic solvent Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 16
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 229920003986 novolac Polymers 0.000 description 14
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 238000010030 laminating Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 8
- 125000003710 aryl alkyl group Chemical group 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000539 dimer Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 150000003254 radicals Chemical class 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical class OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 7
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 229930003836 cresol Natural products 0.000 description 7
- 125000000753 cycloalkyl group Chemical group 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 7
- 125000001624 naphthyl group Chemical group 0.000 description 7
- 125000000962 organic group Chemical group 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 125000004430 oxygen atom Chemical group O* 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- 239000002841 Lewis acid Substances 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- 150000007517 lewis acids Chemical class 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 150000002989 phenols Chemical group 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 4
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- WTAVYBAEMMFITK-UHFFFAOYSA-N 3,4-dihydro-2h-1,3-benzoxazine Chemical compound C1=CC=C2OCNCC2=C1 WTAVYBAEMMFITK-UHFFFAOYSA-N 0.000 description 3
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 0 CC1(C)CC(*N2C(O)=C(CC(C(C3)C(N(C)*)=O)C=O)C3C2O)CCI(C)CC1 Chemical compound CC1(C)CC(*N2C(O)=C(CC(C(C3)C(N(C)*)=O)C=O)C3C2O)CCI(C)CC1 0.000 description 3
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Chemical group 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- HGKHNNVPPFRHFD-UHFFFAOYSA-N (4-cyanatophenyl) 4-cyanatobenzoate Chemical compound C=1C=C(OC#N)C=CC=1C(=O)OC1=CC=C(OC#N)C=C1 HGKHNNVPPFRHFD-UHFFFAOYSA-N 0.000 description 2
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 2
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AYDAHOIUHVUJHQ-UHFFFAOYSA-N 1-(3',6'-dihydroxy-3-oxospiro[2-benzofuran-1,9'-xanthene]-5-yl)pyrrole-2,5-dione Chemical compound C=1C(O)=CC=C2C=1OC1=CC(O)=CC=C1C2(C1=CC=2)OC(=O)C1=CC=2N1C(=O)C=CC1=O AYDAHOIUHVUJHQ-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- SQAINHDHICKHLX-UHFFFAOYSA-N 1-naphthaldehyde Chemical class C1=CC=C2C(C=O)=CC=CC2=C1 SQAINHDHICKHLX-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical group N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- FFFPYJTVNSSLBQ-UHFFFAOYSA-N Phenolphthalin Chemical compound OC(=O)C1=CC=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 FFFPYJTVNSSLBQ-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Chemical group 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- INHGSGHLQLYYND-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(OC#N)C=C1 INHGSGHLQLYYND-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- HXGDTGSAIMULJN-UHFFFAOYSA-N acenaphthylene Chemical compound C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 229910001593 boehmite Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 229940052303 ethers for general anesthesia Drugs 0.000 description 2
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- OIAUFEASXQPCFE-UHFFFAOYSA-N formaldehyde;1,3-xylene Chemical class O=C.CC1=CC=CC(C)=C1 OIAUFEASXQPCFE-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 150000002730 mercury Chemical class 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 2
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- NQFOGDIWKQWFMN-UHFFFAOYSA-N phenalene Chemical compound C1=CC([CH]C=C2)=C3C2=CC=CC3=C1 NQFOGDIWKQWFMN-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 238000007348 radical reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 150000005846 sugar alcohols Chemical class 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000007736 thin film deposition technique Methods 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- GWHCXVQVJPWHRF-KTKRTIGZSA-N (15Z)-tetracosenoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-KTKRTIGZSA-N 0.000 description 1
- JRBJLOCMQWBLDF-UHFFFAOYSA-N (2,6-dichlorophenyl) cyanate Chemical compound ClC1=CC=CC(Cl)=C1OC#N JRBJLOCMQWBLDF-UHFFFAOYSA-N 0.000 description 1
- VSHAQOZVUZJKCO-UHFFFAOYSA-N (2,6-ditert-butylphenyl) cyanate Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1OC#N VSHAQOZVUZJKCO-UHFFFAOYSA-N 0.000 description 1
- ULYBHRQVCDELMO-UHFFFAOYSA-N (2-ethyl-4-nitrophenyl) cyanate Chemical compound CCC1=CC([N+]([O-])=O)=CC=C1OC#N ULYBHRQVCDELMO-UHFFFAOYSA-N 0.000 description 1
- SHBUQGBESNZMCH-UHFFFAOYSA-N (2-nitrophenyl) cyanate Chemical compound [O-][N+](=O)C1=CC=CC=C1OC#N SHBUQGBESNZMCH-UHFFFAOYSA-N 0.000 description 1
- BBWMTEYXFFWPIF-CJBMEHDJSA-N (2e,4e,6e)-icosa-2,4,6-trienoic acid Chemical compound CCCCCCCCCCCCC\C=C\C=C\C=C\C(O)=O BBWMTEYXFFWPIF-CJBMEHDJSA-N 0.000 description 1
- KXVFBCSUGDNXQF-DZDBOGACSA-N (2z,4z,6z,8z,10z)-tetracosa-2,4,6,8,10-pentaenoic acid Chemical compound CCCCCCCCCCCCC\C=C/C=C\C=C/C=C\C=C/C(O)=O KXVFBCSUGDNXQF-DZDBOGACSA-N 0.000 description 1
- QSMZSCNZPOTAQR-UHFFFAOYSA-N (3,5-dimethylphenyl) cyanate Chemical compound CC1=CC(C)=CC(OC#N)=C1 QSMZSCNZPOTAQR-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UBWVCMYZYWVZFK-UHFFFAOYSA-N (3-chloro-2-methylphenyl) cyanate Chemical compound CC1=C(Cl)C=CC=C1OC#N UBWVCMYZYWVZFK-UHFFFAOYSA-N 0.000 description 1
- YVOQQUGUJXFKOC-UHFFFAOYSA-N (3-chlorophenyl) cyanate Chemical compound ClC1=CC=CC(OC#N)=C1 YVOQQUGUJXFKOC-UHFFFAOYSA-N 0.000 description 1
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 1
- MJTRGJDBPFGULK-UHFFFAOYSA-N (4-acetamidophenyl) cyanate Chemical compound CC(=O)NC1=CC=C(OC#N)C=C1 MJTRGJDBPFGULK-UHFFFAOYSA-N 0.000 description 1
- MUAFEFAYKJZTHJ-UHFFFAOYSA-N (4-acetylphenyl) cyanate Chemical compound CC(=O)C1=CC=C(OC#N)C=C1 MUAFEFAYKJZTHJ-UHFFFAOYSA-N 0.000 description 1
- VESOYJBKIYTTEL-UHFFFAOYSA-N (4-benzoylphenyl) cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(=O)C1=CC=CC=C1 VESOYJBKIYTTEL-UHFFFAOYSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- FFUGFEZHSFMOTP-UHFFFAOYSA-N (4-cyclohexylphenyl) cyanate Chemical compound C1=CC(OC#N)=CC=C1C1CCCCC1 FFUGFEZHSFMOTP-UHFFFAOYSA-N 0.000 description 1
- LKOYFNVMCUKOJD-UHFFFAOYSA-N (4-ethenylphenyl) cyanate Chemical compound C=CC1=CC=C(OC#N)C=C1 LKOYFNVMCUKOJD-UHFFFAOYSA-N 0.000 description 1
- BYMZMVNQWJIIDN-UHFFFAOYSA-N (4-formylphenyl) cyanate Chemical compound O=CC1=CC=C(OC#N)C=C1 BYMZMVNQWJIIDN-UHFFFAOYSA-N 0.000 description 1
- HZSITCSNYNWEMM-UHFFFAOYSA-N (4-methoxynaphthalen-1-yl) cyanate Chemical compound O(C#N)C1=CC=C(C2=CC=CC=C12)OC HZSITCSNYNWEMM-UHFFFAOYSA-N 0.000 description 1
- RFXSQXFVJCZAMW-UHFFFAOYSA-N (4-methoxyphenyl) cyanate Chemical compound COC1=CC=C(OC#N)C=C1 RFXSQXFVJCZAMW-UHFFFAOYSA-N 0.000 description 1
- UGMKNMPRUHJNQK-UHFFFAOYSA-N (4-methylphenyl) cyanate Chemical compound CC1=CC=C(OC#N)C=C1 UGMKNMPRUHJNQK-UHFFFAOYSA-N 0.000 description 1
- OQOBDFYUAMYTRM-UHFFFAOYSA-N (4-methylsulfanylphenyl) cyanate Chemical compound CSC1=CC=C(OC#N)C=C1 OQOBDFYUAMYTRM-UHFFFAOYSA-N 0.000 description 1
- SGACLTVKXIFYLM-UHFFFAOYSA-N (4-phenylphenyl) cyanate Chemical group C1=CC(OC#N)=CC=C1C1=CC=CC=C1 SGACLTVKXIFYLM-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- HXQHFNIKBKZGRP-URPRIDOGSA-N (5Z,9Z,12Z)-octadecatrienoic acid Chemical compound CCCCC\C=C/C\C=C/CC\C=C/CCCC(O)=O HXQHFNIKBKZGRP-URPRIDOGSA-N 0.000 description 1
- CCXJDBFHWLSUFE-UHFFFAOYSA-N (6-methoxynaphthalen-2-yl) cyanate Chemical compound O(C#N)C1=CC2=CC=C(C=C2C=C1)OC CCXJDBFHWLSUFE-UHFFFAOYSA-N 0.000 description 1
- PWGMXFQYTQPRLC-UHFFFAOYSA-N (7-methoxynaphthalen-2-yl) cyanate Chemical compound O(C#N)C1=CC2=CC(=CC=C2C=C1)OC PWGMXFQYTQPRLC-UHFFFAOYSA-N 0.000 description 1
- HOBAELRKJCKHQD-UHFFFAOYSA-N (8Z,11Z,14Z)-8,11,14-eicosatrienoic acid Natural products CCCCCC=CCC=CCC=CCCCCCCC(O)=O HOBAELRKJCKHQD-UHFFFAOYSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- OBDUMNZXAIUUTH-HWKANZROSA-N (e)-tetradec-2-ene Chemical group CCCCCCCCCCC\C=C\C OBDUMNZXAIUUTH-HWKANZROSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- LERDAFCBKALCKT-UHFFFAOYSA-N 1,2,3,4,5-pentafluoro-6-(2,3,4-trifluorophenyl)benzene Chemical group FC1=C(F)C(F)=CC=C1C1=C(F)C(F)=C(F)C(F)=C1F LERDAFCBKALCKT-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- VRCACYBCECBXLM-UHFFFAOYSA-N 1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)N1CCOCC1 VRCACYBCECBXLM-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 1
- SLDRBJYQYWWNTB-UHFFFAOYSA-N 1-anilino-3-phenylpyrrole-2,5-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)N1NC1=CC=CC=C1 SLDRBJYQYWWNTB-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical group CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- ZWZGXLKXKAPXMZ-UHFFFAOYSA-N 2,2'-dihydroxy-3,3'-dimethoxy-5,5'-dipropyldiphenylmethane Chemical compound COC1=CC(CCC)=CC(CC=2C(=C(OC)C=C(CCC)C=2)O)=C1O ZWZGXLKXKAPXMZ-UHFFFAOYSA-N 0.000 description 1
- BRXKVEIJEXJBFF-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-3-methylbutane-1,4-diol Chemical compound OCC(C)C(CO)(CO)CO BRXKVEIJEXJBFF-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- 125000004825 2,2-dimethylpropylene group Chemical group [H]C([H])([H])C(C([H])([H])[H])(C([H])([H])[*:1])C([H])([H])[*:2] 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- WAXBZQUSTLNLPU-UHFFFAOYSA-N 2,5-dioxo-3-phenylpyrrole-1-carboxylic acid Chemical compound O=C1N(C(=O)O)C(=O)C=C1C1=CC=CC=C1 WAXBZQUSTLNLPU-UHFFFAOYSA-N 0.000 description 1
- UAFNNYNGQVOTOM-UHFFFAOYSA-N 2-(2-phenyl-1h-imidazol-5-yl)propanenitrile Chemical class N1C(C(C#N)C)=CN=C1C1=CC=CC=C1 UAFNNYNGQVOTOM-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- WNZQDUSMALZDQF-UHFFFAOYSA-N 2-benzofuran-1(3H)-one Chemical compound C1=CC=C2C(=O)OCC2=C1 WNZQDUSMALZDQF-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- 125000004198 2-fluorophenyl group Chemical group [H]C1=C([H])C(F)=C(*)C([H])=C1[H] 0.000 description 1
- 125000006040 2-hexenyl group Chemical group 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- HOZMLTCHTRHKRK-UHFFFAOYSA-N 2-methyl-1-silylprop-2-en-1-one Chemical class CC(=C)C([SiH3])=O HOZMLTCHTRHKRK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 125000006022 2-methyl-2-propenyl group Chemical group 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- CPFRUJWRXRBCLM-UHFFFAOYSA-N 2-phenylethyl cyanate Chemical compound N#COCCC1=CC=CC=C1 CPFRUJWRXRBCLM-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- CGACGSHTSCXSSO-UHFFFAOYSA-N 2h-1,3-benzoxazine Chemical compound C1=CC=C2C=NCOC2=C1 CGACGSHTSCXSSO-UHFFFAOYSA-N 0.000 description 1
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- YPACMOORZSDQDQ-UHFFFAOYSA-N 3-(4-aminobenzoyl)oxypropyl 4-aminobenzoate Chemical compound C1=CC(N)=CC=C1C(=O)OCCCOC(=O)C1=CC=C(N)C=C1 YPACMOORZSDQDQ-UHFFFAOYSA-N 0.000 description 1
- BQQGVSONEPNPAB-UHFFFAOYSA-N 3-(diethoxymethylsilyl)propyl 2-methylprop-2-enoate Chemical compound CCOC(OCC)[SiH2]CCCOC(=O)C(C)=C BQQGVSONEPNPAB-UHFFFAOYSA-N 0.000 description 1
- LOOUJXUUGIUEBC-UHFFFAOYSA-N 3-(dimethoxymethylsilyl)propane-1-thiol Chemical compound COC(OC)[SiH2]CCCS LOOUJXUUGIUEBC-UHFFFAOYSA-N 0.000 description 1
- VLZDYNDUVLBNLD-UHFFFAOYSA-N 3-(dimethoxymethylsilyl)propyl 2-methylprop-2-enoate Chemical compound COC(OC)[SiH2]CCCOC(=O)C(C)=C VLZDYNDUVLBNLD-UHFFFAOYSA-N 0.000 description 1
- VXPSQDAMFATNNG-UHFFFAOYSA-N 3-[2-(2,5-dioxopyrrol-3-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=CC=CC=2)C=2C(NC(=O)C=2)=O)=C1 VXPSQDAMFATNNG-UHFFFAOYSA-N 0.000 description 1
- MOSSLXZUUKTULI-UHFFFAOYSA-N 3-[3-(2,5-dioxopyrrol-3-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(C=2C(NC(=O)C=2)=O)C=C1C1=CC(=O)NC1=O MOSSLXZUUKTULI-UHFFFAOYSA-N 0.000 description 1
- VCFJLCCBKJNFKQ-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC(=CC=2)C=2C(NC(=O)C=2)=O)=C1 VCFJLCCBKJNFKQ-UHFFFAOYSA-N 0.000 description 1
- GSHIDYWGMUZEOL-UHFFFAOYSA-N 3-[[2-[(2,5-dioxopyrrol-3-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CC=2C(=CC=CC=2)CC=2C(NC(=O)C=2)=O)=C1 GSHIDYWGMUZEOL-UHFFFAOYSA-N 0.000 description 1
- RVFQOYLBPXHFKR-UHFFFAOYSA-N 3-[[3-[(2,5-dioxopyrrol-3-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CC=2C=C(CC=3C(NC(=O)C=3)=O)C=CC=2)=C1 RVFQOYLBPXHFKR-UHFFFAOYSA-N 0.000 description 1
- KAWODUAUIIOGGH-UHFFFAOYSA-N 3-[[4-[(2,5-dioxopyrrol-3-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CC=2C=CC(CC=3C(NC(=O)C=3)=O)=CC=2)=C1 KAWODUAUIIOGGH-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- JTDLVCGPAXMHMX-UHFFFAOYSA-N 3-aminosilyl-N,N-dimethylpropan-1-amine Chemical class CN(C)CCC[SiH2]N JTDLVCGPAXMHMX-UHFFFAOYSA-N 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- LRCNCMAONGAHNN-UHFFFAOYSA-N 3-cyclohexa-2,4-dien-1-yl-2,4-dihydro-1,3-benzoxazine Chemical compound C1(CC=CC=C1)N1COC2=C(C1)C=CC=C2 LRCNCMAONGAHNN-UHFFFAOYSA-N 0.000 description 1
- 125000004180 3-fluorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(F)=C1[H] 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- 125000005917 3-methylpentyl group Chemical group 0.000 description 1
- ZLPORNPZJNRGCO-UHFFFAOYSA-N 3-methylpyrrole-2,5-dione Chemical compound CC1=CC(=O)NC1=O ZLPORNPZJNRGCO-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- SMSVFCGGVBWUJL-UHFFFAOYSA-N 4-(2,5-dioxopyrrol-1-yl)-2-hydroxybenzoic acid Chemical compound C1=C(O)C(C(=O)O)=CC=C1N1C(=O)C=CC1=O SMSVFCGGVBWUJL-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 125000000242 4-chlorobenzoyl group Chemical group ClC1=CC=C(C(=O)*)C=C1 0.000 description 1
- 125000001255 4-fluorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1F 0.000 description 1
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 1
- VPBBZXIPVBVLFZ-UHFFFAOYSA-N 4-phenylbutyl cyanate Chemical compound O(C#N)CCCCC1=CC=CC=C1 VPBBZXIPVBVLFZ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- KIFWEUZANBOIJW-UHFFFAOYSA-N 8-phenyloctyl cyanate Chemical compound N#COCCCCCCCCC1=CC=CC=C1 KIFWEUZANBOIJW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- JWBBBJFKVIQIFQ-UHFFFAOYSA-N 9-phenylnonyl cyanate Chemical compound O(C#N)CCCCCCCCCC1=CC=CC=C1 JWBBBJFKVIQIFQ-UHFFFAOYSA-N 0.000 description 1
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- QQXWWCIEPUFZQL-YAJBEHDUSA-N Bosseopentaenoic acid Natural products CCCCCC=C/C=C/C=C/C=CCC=C/CCCC(=O)O QQXWWCIEPUFZQL-YAJBEHDUSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FBUVPLYHFKRRLH-UHFFFAOYSA-N C(Cl)(Cl)Cl.N#CCl Chemical compound C(Cl)(Cl)Cl.N#CCl FBUVPLYHFKRRLH-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- XVZXOLOFWKSDSR-UHFFFAOYSA-N Cc1cc(C)c([C]=O)c(C)c1 Chemical group Cc1cc(C)c([C]=O)c(C)c1 XVZXOLOFWKSDSR-UHFFFAOYSA-N 0.000 description 1
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 description 1
- 241000252203 Clupea harengus Species 0.000 description 1
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 1
- 235000021298 Dihomo-γ-linolenic acid Nutrition 0.000 description 1
- QGLBZNZGBLRJGS-UHFFFAOYSA-N Dihydro-3-methyl-2(3H)-furanone Chemical compound CC1CCOC1=O QGLBZNZGBLRJGS-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 239000005770 Eugenol Substances 0.000 description 1
- OPGOLNDOMSBSCW-CLNHMMGSSA-N Fursultiamine hydrochloride Chemical compound Cl.C1CCOC1CSSC(\CCO)=C(/C)N(C=O)CC1=CN=C(C)N=C1N OPGOLNDOMSBSCW-CLNHMMGSSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 1
- XJXROGWVRIJYMO-SJDLZYGOSA-N Nervonic acid Natural products O=C(O)[C@@H](/C=C/CCCCCCCC)CCCCCCCCCCCC XJXROGWVRIJYMO-SJDLZYGOSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- IPCYSKTUZUBHPN-UHFFFAOYSA-N O(C#N)C1=CC=C(C=C1)C1=C(C=CC(=C1)C(C)C)CC Chemical compound O(C#N)C1=CC=C(C=C1)C1=C(C=CC(=C1)C(C)C)CC IPCYSKTUZUBHPN-UHFFFAOYSA-N 0.000 description 1
- WDQPIBOHJHWKPK-UHFFFAOYSA-N O(C#N)C1=CC=C(C=C1)N1C(C=2C(C1=O)=CC(=CC2)OC=2C=C1C(C(=O)NC1=O)=CC2)=O Chemical compound O(C#N)C1=CC=C(C=C1)N1C(C=2C(C1=O)=CC(=CC2)OC=2C=C1C(C(=O)NC1=O)=CC2)=O WDQPIBOHJHWKPK-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000021319 Palmitoleic acid Nutrition 0.000 description 1
- 229930040373 Paraformaldehyde Chemical class 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 description 1
- HXQHFNIKBKZGRP-UHFFFAOYSA-N Ranuncelin-saeure-methylester Natural products CCCCCC=CCC=CCCC=CCCCC(O)=O HXQHFNIKBKZGRP-UHFFFAOYSA-N 0.000 description 1
- 241001125046 Sardina pilchardus Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- CMHBPGYKMXHYBG-UHFFFAOYSA-N [3-(trifluoromethyl)phenyl] cyanate Chemical compound FC(F)(F)C1=CC=CC(OC#N)=C1 CMHBPGYKMXHYBG-UHFFFAOYSA-N 0.000 description 1
- YMRHMTONDYBPMU-UHFFFAOYSA-N [4-(2-oxo-3H-indol-1-yl)phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)N1C(CC2=CC=CC=C12)=O YMRHMTONDYBPMU-UHFFFAOYSA-N 0.000 description 1
- SNYVZKMCGVGTKN-UHFFFAOYSA-N [4-(4-cyanatophenoxy)phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OC1=CC=C(OC#N)C=C1 SNYVZKMCGVGTKN-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- SYGJXLZLADSQOO-UHFFFAOYSA-N [4-(9H-fluoren-1-yl)phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)C1=CC=CC=2C3=CC=CC=C3CC1=2 SYGJXLZLADSQOO-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- JNCRKOQSRHDNIO-UHFFFAOYSA-N [4-[(4-cyanato-3,5-dimethylphenyl)methyl]-2,6-dimethylphenyl] cyanate Chemical compound CC1=C(OC#N)C(C)=CC(CC=2C=C(C)C(OC#N)=C(C)C=2)=C1 JNCRKOQSRHDNIO-UHFFFAOYSA-N 0.000 description 1
- CGWCRUVZAOUGMY-UHFFFAOYSA-N [4-[(4-cyanatophenyl)-(4-phenylphenyl)methyl]phenyl] cyanate Chemical group O(C#N)C1=CC=C(C=C1)C(C1=CC=C(C=C1)C1=CC=CC=C1)C1=CC=C(C=C1)OC#N CGWCRUVZAOUGMY-UHFFFAOYSA-N 0.000 description 1
- PYICCSHCIIAPJE-UHFFFAOYSA-N [4-[(4-cyanatophenyl)-diphenylmethyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C(C=1C=CC(OC#N)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 PYICCSHCIIAPJE-UHFFFAOYSA-N 0.000 description 1
- NNVFMMULSKOXSJ-UHFFFAOYSA-N [4-[(4-cyanatophenyl)-phenylmethyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C(C=1C=CC(OC#N)=CC=1)C1=CC=CC=C1 NNVFMMULSKOXSJ-UHFFFAOYSA-N 0.000 description 1
- AWWJTNMLTCVUBS-UHFFFAOYSA-N [4-[1,1-bis(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C=1C=CC(OC#N)=CC=1)(C)C1=CC=C(OC#N)C=C1 AWWJTNMLTCVUBS-UHFFFAOYSA-N 0.000 description 1
- MWQTYOOOVAXQHW-UHFFFAOYSA-N [4-[1,3-bis(4-cyanatophenyl)propyl]phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)C(CCC1=CC=C(C=C1)OC#N)C1=CC=C(C=C1)OC#N MWQTYOOOVAXQHW-UHFFFAOYSA-N 0.000 description 1
- CVALTECDYLAZLK-UHFFFAOYSA-N [4-[1-(4-cyanato-3-cyclohexylphenyl)cyclohexyl]-2-cyclohexylphenyl] cyanate Chemical compound C1(CCCCC1)C=1C=C(C=CC1OC#N)C1(CCCCC1)C1=CC(=C(C=C1)OC#N)C1CCCCC1 CVALTECDYLAZLK-UHFFFAOYSA-N 0.000 description 1
- WHXGQAGLFTWDAD-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-2,2-dimethylpropyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)(C)C)C1=CC=C(OC#N)C=C1 WHXGQAGLFTWDAD-UHFFFAOYSA-N 0.000 description 1
- VRJVYJZCNABROM-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-2-methylbutyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)CC)C1=CC=C(OC#N)C=C1 VRJVYJZCNABROM-UHFFFAOYSA-N 0.000 description 1
- DUEAQFNVHPRQKJ-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-2-methylpropyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)C)C1=CC=C(OC#N)C=C1 DUEAQFNVHPRQKJ-UHFFFAOYSA-N 0.000 description 1
- ALTSFBKKGZFYFL-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-3-methylbutyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC(C)C)C1=CC=C(OC#N)C=C1 ALTSFBKKGZFYFL-UHFFFAOYSA-N 0.000 description 1
- CUVGYGLIVYYKLM-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-3-oxo-2-benzofuran-1-yl]phenyl] cyanate Chemical compound C12=CC=CC=C2C(=O)OC1(C=1C=CC(OC#N)=CC=1)C1=CC=C(OC#N)C=C1 CUVGYGLIVYYKLM-UHFFFAOYSA-N 0.000 description 1
- ZFWZYLYLPMWAQM-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)butyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CCC)C1=CC=C(OC#N)C=C1 ZFWZYLYLPMWAQM-UHFFFAOYSA-N 0.000 description 1
- RZBUVWIMPWGGRK-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)cyclohexyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C1(C=2C=CC(OC#N)=CC=2)CCCCC1 RZBUVWIMPWGGRK-UHFFFAOYSA-N 0.000 description 1
- BWVPAGYFWDPBIW-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)cyclopentyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C1(C=2C=CC(OC#N)=CC=2)CCCC1 BWVPAGYFWDPBIW-UHFFFAOYSA-N 0.000 description 1
- SIZDMAYTWUINIG-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)C1=CC=C(OC#N)C=C1 SIZDMAYTWUINIG-UHFFFAOYSA-N 0.000 description 1
- YTLAVSHTYSTXGG-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)pentyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CCCC)C1=CC=C(OC#N)C=C1 YTLAVSHTYSTXGG-UHFFFAOYSA-N 0.000 description 1
- LNZIRNRHIJPNRY-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)propyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC)C1=CC=C(OC#N)C=C1 LNZIRNRHIJPNRY-UHFFFAOYSA-N 0.000 description 1
- OXRLCQGMPCWRFK-UHFFFAOYSA-N [4-[2,2-dichloro-1-(4-cyanatophenyl)ethenyl]phenyl] cyanate Chemical group C=1C=C(OC#N)C=CC=1C(=C(Cl)Cl)C1=CC=C(OC#N)C=C1 OXRLCQGMPCWRFK-UHFFFAOYSA-N 0.000 description 1
- LCCSXIORAPRMIY-UHFFFAOYSA-N [4-[2-(4-cyanato-3-phenylphenyl)propan-2-yl]-2-phenylphenyl] cyanate Chemical compound C=1C=C(OC#N)C(C=2C=CC=CC=2)=CC=1C(C)(C)C(C=1)=CC=C(OC#N)C=1C1=CC=CC=C1 LCCSXIORAPRMIY-UHFFFAOYSA-N 0.000 description 1
- VJLQKGRQOAVLKN-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)-3,3-dimethylbutan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C(C)(C)C)C1=CC=C(OC#N)C=C1 VJLQKGRQOAVLKN-UHFFFAOYSA-N 0.000 description 1
- OKOGUHSERRTCOI-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)-4-methylpentan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(CC(C)C)C1=CC=C(OC#N)C=C1 OKOGUHSERRTCOI-UHFFFAOYSA-N 0.000 description 1
- UPCZANMLPOWPAD-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)butan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(CC)C1=CC=C(OC#N)C=C1 UPCZANMLPOWPAD-UHFFFAOYSA-N 0.000 description 1
- NHZITVMFMHBTBL-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)hexan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(CCCC)C1=CC=C(OC#N)C=C1 NHZITVMFMHBTBL-UHFFFAOYSA-N 0.000 description 1
- KGRJSARQPLMHSD-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)pentan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(CCC)C1=CC=C(OC#N)C=C1 KGRJSARQPLMHSD-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- QODYBLNVIHQJIW-UHFFFAOYSA-N [4-[2-[3-[2-(4-cyanatophenyl)propan-2-yl]phenyl]propan-2-yl]phenyl] cyanate Chemical compound C=1C=CC(C(C)(C)C=2C=CC(OC#N)=CC=2)=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 QODYBLNVIHQJIW-UHFFFAOYSA-N 0.000 description 1
- ZPMIQPVBNFKPAM-UHFFFAOYSA-N [4-[2-[4-[2-(4-cyanatophenyl)propan-2-yl]phenyl]propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(C(C)(C)C=2C=CC(OC#N)=CC=2)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 ZPMIQPVBNFKPAM-UHFFFAOYSA-N 0.000 description 1
- JGZANMKVIUZPKB-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-1-adamantyl]phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)C12CC3(CC(CC(C1)C3)C2)C2=CC=C(C=C2)OC#N JGZANMKVIUZPKB-UHFFFAOYSA-N 0.000 description 1
- YWKOUAQTECYGSJ-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-1-methyl-2H-indol-3-yl]phenyl] cyanate Chemical compound CN1CC(C2=CC=CC=C12)(C1=CC=C(C=C1)OC#N)C1=CC=C(C=C1)OC#N YWKOUAQTECYGSJ-UHFFFAOYSA-N 0.000 description 1
- KHNZTNGNKBPUEM-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2,2,4-trimethylpentan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)(C)C)(C(C)C)C1=CC=C(OC#N)C=C1 KHNZTNGNKBPUEM-UHFFFAOYSA-N 0.000 description 1
- MVKJIDGYEARQJO-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2,2-dimethylhexan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)(C)C)(CCC)C1=CC=C(OC#N)C=C1 MVKJIDGYEARQJO-UHFFFAOYSA-N 0.000 description 1
- SABGMTGLIYMFLH-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2,2-dimethylpentan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)(C)C)(CC)C1=CC=C(OC#N)C=C1 SABGMTGLIYMFLH-UHFFFAOYSA-N 0.000 description 1
- PPQOSMROARHRSD-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2,4-dimethylhexan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)C)(C(C)CC)C1=CC=C(OC#N)C=C1 PPQOSMROARHRSD-UHFFFAOYSA-N 0.000 description 1
- GSDUKIJGTSHOOD-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2-methylheptan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)C)(CCCC)C1=CC=C(OC#N)C=C1 GSDUKIJGTSHOOD-UHFFFAOYSA-N 0.000 description 1
- BCFLPWOICZLPEV-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2-methylhexan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)C)(CCC)C1=CC=C(OC#N)C=C1 BCFLPWOICZLPEV-UHFFFAOYSA-N 0.000 description 1
- DIXZEGPVGUCLJG-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-5,7-dimethyl-1-adamantyl]phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)C12CC3(CC(CC(C1)(C3)C)(C2)C)C2=CC=C(C=C2)OC#N DIXZEGPVGUCLJG-UHFFFAOYSA-N 0.000 description 1
- GTJHXCHRCZRACK-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)heptan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC)(CCCC)C1=CC=C(OC#N)C=C1 GTJHXCHRCZRACK-UHFFFAOYSA-N 0.000 description 1
- SIVPMTCZSPKNJC-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)hexan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC)(CCC)C1=CC=C(OC#N)C=C1 SIVPMTCZSPKNJC-UHFFFAOYSA-N 0.000 description 1
- ZSFDETFCXJDSDY-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)octan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC)(CCCCC)C1=CC=C(OC#N)C=C1 ZSFDETFCXJDSDY-UHFFFAOYSA-N 0.000 description 1
- VCTHWSNFKPDIFC-UHFFFAOYSA-N [4-[4-(4-cyanatophenyl)-3-methylheptan-4-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)CC)(CCC)C1=CC=C(OC#N)C=C1 VCTHWSNFKPDIFC-UHFFFAOYSA-N 0.000 description 1
- XFCYBOMYXFWJKW-UHFFFAOYSA-N [4-[9-(4-cyanato-3-methylphenyl)fluoren-9-yl]-2-methylphenyl] cyanate Chemical compound C1=C(OC#N)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(OC#N)=CC=2)=C1 XFCYBOMYXFWJKW-UHFFFAOYSA-N 0.000 description 1
- NRAWVVBFCLDHDQ-UHFFFAOYSA-N [4-[9-(4-cyanato-3-phenylphenyl)fluoren-9-yl]-2-phenylphenyl] cyanate Chemical compound N#COC1=CC=C(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C(OC#N)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 NRAWVVBFCLDHDQ-UHFFFAOYSA-N 0.000 description 1
- RMPWNGZEITYIQC-UHFFFAOYSA-N [4-[[4,6-bis(4-cyanato-N-methylanilino)-1,3,5-triazin-2-yl]-methylamino]phenyl] cyanate Chemical compound CN(C1=CC=C(C=C1)OC#N)C1=NC(=NC(=N1)N(C1=CC=C(C=C1)OC#N)C)N(C1=CC=C(C=C1)OC#N)C RMPWNGZEITYIQC-UHFFFAOYSA-N 0.000 description 1
- KHHRTIJOAOQNBD-UHFFFAOYSA-N [4-[bis(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C(C=1C=CC(OC#N)=CC=1)C1=CC=C(OC#N)C=C1 KHHRTIJOAOQNBD-UHFFFAOYSA-N 0.000 description 1
- BAQMVMPLBZLJLP-UHFFFAOYSA-N [4-[tris(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound O(C#N)C1=CC=C(C=C1)C(C1=CC=C(C=C1)OC#N)(C1=CC=C(C=C1)OC#N)C1=CC=C(C=C1)OC#N BAQMVMPLBZLJLP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthalene Natural products C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 125000005192 alkyl ethylene group Chemical group 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- AFEOSKCFRCAPJL-UHFFFAOYSA-N argon naphthalen-1-ol Chemical compound [Ar].C1=CC=C2C(O)=CC=CC2=C1 AFEOSKCFRCAPJL-UHFFFAOYSA-N 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001553 barium compounds Chemical class 0.000 description 1
- 229910052916 barium silicate Inorganic materials 0.000 description 1
- HMOQPOVBDRFNIU-UHFFFAOYSA-N barium(2+);dioxido(oxo)silane Chemical compound [Ba+2].[O-][Si]([O-])=O HMOQPOVBDRFNIU-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical compound C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- OZGHELYGAUYWFC-UHFFFAOYSA-N bis(4-cyanatophenyl) carbonate Chemical compound C=1C=C(OC#N)C=CC=1OC(=O)OC1=CC=C(OC#N)C=C1 OZGHELYGAUYWFC-UHFFFAOYSA-N 0.000 description 1
- HXTBYXIZCDULQI-UHFFFAOYSA-N bis[4-(methylamino)phenyl]methanone Chemical compound C1=CC(NC)=CC=C1C(=O)C1=CC=C(NC)C=C1 HXTBYXIZCDULQI-UHFFFAOYSA-N 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- QQXWWCIEPUFZQL-JMFSJNRSSA-N bosseopentaenoic acid Chemical compound CCCCC\C=C/C=C/C=C/C=C\C\C=C/CCCC(O)=O QQXWWCIEPUFZQL-JMFSJNRSSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- HXTLWOZJMYIANK-UHFFFAOYSA-N butyl acetate;methanol Chemical compound OC.CCCCOC(C)=O HXTLWOZJMYIANK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229940043430 calcium compound Drugs 0.000 description 1
- 150000001674 calcium compounds Chemical class 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- SECPZKHBENQXJG-UHFFFAOYSA-N cis-palmitoleic acid Natural products CCCCCCC=CCCCCCCCC(O)=O SECPZKHBENQXJG-UHFFFAOYSA-N 0.000 description 1
- GWHCXVQVJPWHRF-UHFFFAOYSA-N cis-tetracosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- CAMXOLUXKJMDSB-UHFFFAOYSA-L copper;naphthalene-1-carboxylate Chemical compound [Cu+2].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 CAMXOLUXKJMDSB-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000005676 cyclic carbonates Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000005725 cyclohexenylene group Chemical group 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 125000004979 cyclopentylene group Chemical group 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 125000004188 dichlorophenyl group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- JAPXJEHHGIVARY-UHFFFAOYSA-N diethoxymethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCOC(OCC)[SiH2]CCCOCC1CO1 JAPXJEHHGIVARY-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- HOBAELRKJCKHQD-QNEBEIHSSA-N dihomo-γ-linolenic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/CCCCCCC(O)=O HOBAELRKJCKHQD-QNEBEIHSSA-N 0.000 description 1
- QGGZBXOADPVUPN-UHFFFAOYSA-N dihydrochalcone Chemical class C=1C=CC=CC=1C(=O)CCC1=CC=CC=C1 QGGZBXOADPVUPN-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 230000000447 dimerizing effect Effects 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- VURFVHCLMJOLKN-UHFFFAOYSA-N diphosphane Chemical class PP VURFVHCLMJOLKN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- IQLUYYHUNSSHIY-HZUMYPAESA-N eicosatetraenoic acid Chemical compound CCCCCCCCCCC\C=C\C=C\C=C\C=C\C(O)=O IQLUYYHUNSSHIY-HZUMYPAESA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 229960002217 eugenol Drugs 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- PQDRJEDWHXYDCQ-UHFFFAOYSA-L fluoro-dioxido-oxo-lambda5-phosphane 4-methoxybenzenediazonium Chemical compound [O-]P([O-])(F)=O.COc1ccc(cc1)[N+]#N.COc1ccc(cc1)[N+]#N PQDRJEDWHXYDCQ-UHFFFAOYSA-L 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 235000019514 herring Nutrition 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000005027 hydroxyaryl group Chemical group 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N icos-2-enoic acid Chemical compound CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002467 indacenes Chemical class 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 150000002681 magnesium compounds Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- SGLXWMAOOWXVAM-UHFFFAOYSA-L manganese(2+);octanoate Chemical compound [Mn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O SGLXWMAOOWXVAM-UHFFFAOYSA-L 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- SODPLIPUBHWQPC-UHFFFAOYSA-N methyl 4-cyanatobenzoate Chemical compound COC(=O)C1=CC=C(OC#N)C=C1 SODPLIPUBHWQPC-UHFFFAOYSA-N 0.000 description 1
- 108091063785 miR-3000 stem-loop Proteins 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- AMVXVPUHCLLJRE-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)hexane-1,6-diamine Chemical compound CO[Si](OC)(OC)CCCNCCCCCCN AMVXVPUHCLLJRE-UHFFFAOYSA-N 0.000 description 1
- MNJJTHFKDZQVKH-UHFFFAOYSA-N n'-[3-(diethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound CCOC(OCC)[SiH2]CCCNCCN MNJJTHFKDZQVKH-UHFFFAOYSA-N 0.000 description 1
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- SQEHYBILZVXINP-UHFFFAOYSA-N n'-tert-butyl-n-propan-2-ylmethanediimine Chemical compound CC(C)N=C=NC(C)(C)C SQEHYBILZVXINP-UHFFFAOYSA-N 0.000 description 1
- JEQPWXGHMRFTRF-UHFFFAOYSA-N n,n'-bis(2-methylpropyl)methanediimine Chemical compound CC(C)CN=C=NCC(C)C JEQPWXGHMRFTRF-UHFFFAOYSA-N 0.000 description 1
- NASVTBDJHWPMOO-UHFFFAOYSA-N n,n'-dimethylmethanediimine Chemical compound CN=C=NC NASVTBDJHWPMOO-UHFFFAOYSA-N 0.000 description 1
- ATYQZACNIHLXIS-UHFFFAOYSA-N n,n'-dinaphthalen-2-ylmethanediimine Chemical compound C1=CC=CC2=CC(N=C=NC3=CC4=CC=CC=C4C=C3)=CC=C21 ATYQZACNIHLXIS-UHFFFAOYSA-N 0.000 description 1
- NWBVGPKHJHHPTA-UHFFFAOYSA-N n,n'-dioctylmethanediimine Chemical compound CCCCCCCCN=C=NCCCCCCCC NWBVGPKHJHHPTA-UHFFFAOYSA-N 0.000 description 1
- CMESPBFFDMPSIY-UHFFFAOYSA-N n,n'-diphenylmethanediimine Chemical compound C1=CC=CC=C1N=C=NC1=CC=CC=C1 CMESPBFFDMPSIY-UHFFFAOYSA-N 0.000 description 1
- IDVWLLCLTVBSCS-UHFFFAOYSA-N n,n'-ditert-butylmethanediimine Chemical compound CC(C)(C)N=C=NC(C)(C)C IDVWLLCLTVBSCS-UHFFFAOYSA-N 0.000 description 1
- JAOPKYRWYXCGOQ-UHFFFAOYSA-N n,n-dimethyl-1-(4-methylphenyl)methanamine Chemical compound CN(C)CC1=CC=C(C)C=C1 JAOPKYRWYXCGOQ-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- KJPLRQFMMRYYFL-UHFFFAOYSA-N naphthalen-2-yl cyanate Chemical compound C1=CC=CC2=CC(OC#N)=CC=C21 KJPLRQFMMRYYFL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002866 paraformaldehyde Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 1
- NOHFYJWXIIYRIP-UHFFFAOYSA-N phenyl 4-cyanatobenzoate Chemical compound C=1C=C(OC#N)C=CC=1C(=O)OC1=CC=CC=C1 NOHFYJWXIIYRIP-UHFFFAOYSA-N 0.000 description 1
- CWHFDTWZHFRTAB-UHFFFAOYSA-N phenyl cyanate Chemical compound N#COC1=CC=CC=C1 CWHFDTWZHFRTAB-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical class [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical group CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 125000006410 propenylene group Chemical group 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000006268 reductive amination reaction Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- JIWBIWFOSCKQMA-UHFFFAOYSA-N stearidonic acid Natural products CCC=CCC=CCC=CCC=CCCCCC(O)=O JIWBIWFOSCKQMA-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical compound O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004360 trifluorophenyl group Chemical group 0.000 description 1
- ZSOVVFMGSCDMIF-UHFFFAOYSA-N trimethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC=CC2=C1 ZSOVVFMGSCDMIF-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- XQEGZYAXBCFSBS-UHFFFAOYSA-N trimethoxy-(4-methylphenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=C(C)C=C1 XQEGZYAXBCFSBS-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
- MTYHLWRUYCUTPA-UHFFFAOYSA-L zinc;naphthalene-1-carboxylate Chemical compound [Zn+2].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 MTYHLWRUYCUTPA-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Definitions
- the present invention relates to a resin composition, a resin sheet, a multilayer printed wiring board, and a semiconductor device.
- the insulating layer is also required to be thinned, and a resin sheet containing no glass cloth is required.
- Thermosetting resin is the mainstream of the resin composition used as the material of the insulating layer, and drilling for obtaining continuity between the insulating layers is generally performed by laser processing.
- an exposure method a method of exposing through a photomask using a mercury lamp as a light source is used, and a material that can be suitably exposed by the light source of this mercury lamp is required.
- a ghi mixed line g-line wavelength 436 nm, h-line wavelength 405 nm, i-line wavelength 365 nm
- a general-purpose photocuring initiator can be selected. ..
- a direct drawing exposure method for directly drawing on a photosensitive resin composition layer based on digital data of a pattern without using a photomask has been introduced.
- This direct drawing exposure method has better alignment accuracy than the exposure method using a photomask and can obtain a high-definition pattern. Therefore, it is particularly introduced in a substrate that requires high-density wiring formation. I'm out.
- the light source uses monochromatic light such as a laser, and among them, a light source having a wavelength of 405 nm (h line) is used in a DMD (Digital Micromirror Device) type device capable of forming a high-definition resist pattern.
- DMD Digital Micromirror Device
- Patent Document 1 describes a carboxyl-modified epoxy (meth) acrylate resin obtained by reacting a bisphenol type epoxy resin with (meth) acrylic acid and then reacting with an acid anhydride, a biphenyl type epoxy resin, and the like.
- a photosensitive thermosetting resin composition containing a photocuring initiator and a diluent is described.
- Patent Document 2 describes a photocurable binder polymer, a photopolymerization compound having an ethylenically unsaturated bond, a photopolymerization (curing) initiator, a sensitizer, and a thermosetting agent, bisallyl nagic.
- a resin composition containing an imide compound and a bismaleimide compound is described.
- Patent Document 3 describes a resin composition containing a bismaleimide compound (curable resin) and a photoradical polymerization initiator (curing agent) as a photosensitive resin composition used for a laminated board or a resin sheet. ing.
- the cured product obtained from the resin composition described in Patent Document 1 has excellent flexibility and folding resistance as a solder resist, and although it is described that it is also excellent in heat resistance, it has heat resistance. No specific value is shown for, and there is a problem that the heat resistance and thermal stability are inferior when used as an interlayer insulating layer.
- Patent Document 2 describes that a bismaleimide compound is used, but it is described as a thermosetting compound, and (meth) acrylate is used as a photopolymerizable compound. Therefore, there is a problem that it is inferior in heat resistance and thermal stability when used as an interlayer insulating layer.
- Patent Document 3 a bismaleimide compound is used as a curable resin.
- the maleimide compound usually has poor light transmittance, if the maleimide compound is contained, the light does not sufficiently reach the photocuring initiator and the photocuring is performed. The initiator is less likely to generate radicals and its reactivity is very low. Therefore, in Patent Document 3, the maleimide compound is cured by performing additional heating before development, but since heating is involved, a high-definition resist pattern cannot be obtained. Further, Patent Document 3 does not describe the use of an active energy ray having a wavelength of 405 nm (h line) as an irradiable light source.
- An object of the present invention is to provide a resin composition capable of obtaining an excellent cured product, a resin sheet using the resin composition, a multilayer printed wiring board, and a semiconductor device.
- the present inventors can solve the above-mentioned problems by using a resin composition containing a specific bismaleimide compound (A), a specific resin or compound (B), and a photocuring initiator (C).
- the present invention has been completed.
- R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms
- R 2 represents a linear or branched alkenylene group having 2 to 16 carbon atoms. It represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms.
- R 3 is an independent hydrogen atom and 1 to 16 carbon atoms, respectively. It represents a linear or branched alkyl group of 16 or a linear or branched alkenyl group having 2 to 16 carbon atoms.
- N represents an integer of 1 to 10 independently.
- R 4 independently represents a substituent or a phenyl group represented by the following formula (3)).
- ⁇ * indicates a bond
- R 5 independently represents a hydrogen atom or a methyl group
- a resin sheet having a support and resin layers arranged on one or both sides of the support, wherein the resin layer contains the resin composition according to [1] or [2].
- Multi-layer printed wiring having an insulating layer and a conductor layer formed on one side or both sides of the insulating layer, wherein the insulating layer contains the resin composition according to [1] or [2].
- Board [6] A semiconductor device containing the resin composition according to [1] or [2].
- a resin composition that has excellent photocurability when used in a multilayer printed wiring board and can obtain a cured product having an excellent balance of heat resistance, thermal stability and insulation reliability.
- a resin sheet, a multilayer printed wiring board, and a semiconductor device using the resin sheet can be provided.
- the present embodiment a mode for carrying out the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail.
- the following embodiments are examples for explaining the present invention, and are not intended to limit the present invention to the following contents.
- the present invention can be appropriately modified and carried out within the scope of the gist thereof.
- (meth) acrylic means both “acryloxy” and its corresponding "methacrylicoxy
- (meth) acrylate means both “acrylate” and its corresponding “methacrylate”.
- (meth) acrylic means both “acrylic” and the corresponding "methacryl”.
- the resin composition of the present embodiment includes a specific bismaleimide compound (A) (also referred to as “component (A)”), a maleimide compound other than the bismaleimide compound (A), a cyanate ester compound, a benzoxazine compound, and an epoxy.
- At least one resin or compound (B) also referred to as “component (B)” or “resin or compound (B)” selected from the group consisting of resins, carbodiimide compounds, and compounds having an ethylenically unsaturated group.
- a photocuring initiator (C) also referred to as “component (C)”.
- the resin composition contains a bismaleimide compound (A) (also referred to as a component (A)).
- the bismaleimide compound (A) contains a structural unit represented by the formula (1) and maleimide groups at both ends of the molecular chain.
- R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms or a linear or branched alkenylene group having 2 to 16 carbon atoms.
- R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms or a linear or branched alkenylene group having 2 to 16 carbon atoms.
- R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms.
- n represents an integer of 1 to 10 independently of each other.
- the maleimide compound has poor light transmittance, so if the resin composition contains the maleimide compound, the light does not sufficiently reach the photocuring initiator dispersed in the resin composition, and the photocuring initiator radicalizes. Hard to occur. Therefore, in general, the photoradical reaction of the maleimide compound is difficult to proceed, and even if the radical polymerization or dimerization reaction of the maleimide alone proceeds, the reactivity is very low. However, since the bismaleimide compound (A) contains a structural unit represented by the formula (1), it is extremely excellent in light transmission.
- a chloroform solution containing 1% by mass of the bismaleimide compound (A) is prepared, and 1% by mass of the bismaleimide compound (A) is added using an active energy ray containing a wavelength of 365 nm (i line).
- the transmittance of the chloroform solution contained in is measured, the transmittance is 5% or more, which is extremely excellent light transmittance.
- the transmittance of a chloroform solution containing 1% by mass of the bismaleimide compound (A) is measured using an active energy ray (light ray) containing a wavelength of 405 nm (h ray), the transmittance is 5 It shows very excellent light transmittance of% or more.
- the transmittance at a wavelength of 365 nm (i-line) is preferably 8% or more, and more preferably 10% or more, from the viewpoint of exhibiting more excellent light transmittance.
- the transmittance at a wavelength of 405 nm (h line) is preferably 8% or more, preferably 10% or more, from the viewpoint of producing a printed wiring board having a higher density and high-definition wiring formation (pattern). More preferred.
- the upper limits of the transmittance at a wavelength of 365 nm (i-line) and the transmittance at a wavelength of 405 nm (h-line) are, for example, 99.9% or less.
- the photocuring initiator tends to have a low absorbance when a long wavelength light beam is used.
- an active energy ray containing a wavelength of 405 nm (h line) since the light having a wavelength of this wavelength is a relatively long wavelength, it is not absorbed by a normal photocuring initiator, and this light is suitably absorbed. If a photocuring initiator capable of generating radicals is not used, the polymerization will not proceed. Therefore, as the photocuring initiator (C) described later, when the absorbance of the chloroform solution containing the photocuring initiator (C) in an amount of 0.01% by mass is measured, the light has a wavelength of 405 nm (h line). On the other hand, it is preferable to use a photocuring initiator having an absorbance of 0.1 or more, which is extremely excellent in absorbency.
- the bismaleimide compound (A) is excellent in light transmission as described above, for example, even when an active energy ray containing a wavelength of 365 nm or an active energy ray containing 405 nm is used, the light is sufficient to the photoinitiator.
- the radical reaction using the radicals generated from the photo-curing initiator proceeds, and photo-curing is possible even in a composition containing a large amount of the bismaleimide compound (A). Therefore, the resin composition of the present embodiment is excellent in photocurability.
- the bismaleimide compound (A) has high heat resistance and thermal stability because it has a rigid imide ring even when photocured.
- the cured product obtained by photocuring the bismaleimide compound is obtained. Or, wrinkles occur when further curing is performed by heating in a post-baking process or the like performed after the development process is completed. Therefore, the cured product obtained by homopolymerizing the bismaleimide compound (A) is not suitable for use in a multilayer printed wiring board.
- the bismaleimide compound (A) together with the resin or compound (B) described later and the photocuring initiator (C) higher heat resistance is obtained while having excellent photocurability and insulation reliability. And has thermal stability. Therefore, the cured product obtained from the resin composition of the present embodiment is excellent in heat resistance, thermal stability, and insulation reliability, and according to the present embodiment, the protective film in the multilayer printed wiring board and the semiconductor device, And the insulating layer can be preferably formed.
- the bismaleimide compound (A) preferably has a mass average molecular weight of 100 to 5000, more preferably 300 to 4500, from the viewpoint that a suitable viscosity can be obtained and an increase in the viscosity of the varnish can be suppressed.
- the "mass average molecular weight” means a polystyrene standard equivalent mass average molecular weight by gel permeation chromatography (GPC) method.
- R 1 has a linear or branched alkylene group having 1 to 16 carbon atoms or a linear or branched alkenylene group having 2 to 16 carbon atoms. Shown. R 1 is preferably a linear or branched alkylene group, and more preferably a linear alkylene group, from the viewpoint that a suitable viscosity can be obtained and an increase in the viscosity of the varnish can be controlled.
- the number of carbon atoms of the alkylene group is preferably 2 to 14, more preferably 4 to 12, from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be further controlled.
- Examples of the linear or branched alkylene group include methylene group, ethylene group, propylene group, 2,2-dimethylpropylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group and decylene.
- the number of carbon atoms of the alkenylene group is preferably 2 to 14 and more preferably 4 to 12 from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be further controlled.
- the linear or branched alkenylene group include a vinylene group, a 1-methylvinylene group, an arylene group, a propenylene group, an isopropenylene group, a 1-butenylene group, a 2-butenylene group, a 1-pentenylene group, and 2 -Pentenylene group, isopentylene group, cyclopentenylene group, cyclohexenylene group, dicyclopentadienylene group and the like can be mentioned.
- R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms or a linear or branched alkenylene group having 2 to 16 carbon atoms.
- R 2 is preferably a linear or branched alkylene group, and more preferably a linear alkylene group, from the viewpoint that a suitable viscosity can be obtained and an increase in the viscosity of the varnish can be controlled.
- the number of carbon atoms of the alkylene group is preferably 2 to 14, more preferably 4 to 12, from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be further controlled.
- R 1 can be referred to as a linear or branched alkylene group.
- the number of carbon atoms of the alkenylene group is preferably 2 to 14 and more preferably 4 to 12 from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be further controlled.
- R 1 can be referred to as a linear or branched alkenylene group.
- R 1 and R 2 may be the same or different, but are preferably the same because the bismaleimide compound (A) can be more easily synthesized.
- R 3 independently comprises a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms.
- R 3 is preferably a hydrogen atom or a linear or branched alkyl group having 1 to 16 carbon atoms independently from the viewpoint that a suitable viscosity can be obtained and an increase in the viscosity of the varnish can be controlled.
- the group (R 3 ) of 1 to 5 is a linear or branched alkyl group having 1 to 16 carbon atoms, and the remaining group (R 3 ) is a hydrogen atom.
- R 3 is a straight-chain or branched alkyl group having 1 to 16 carbon atoms, more preferably remaining groups (R 3) is a hydrogen atom.
- the number of carbon atoms of the alkyl group is preferably 2 to 14, more preferably 4 to 12, from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be more controlled.
- Examples of linear or branched alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, 1-ethylpropyl group, n-butyl group, 2-butyl group, isobutyl group and tert-butyl.
- n-pentyl group 2-pentyl group, tert-pentyl group, 2-methylbutyl group, 3-methylbutyl group, 2,2-dimethylpropyl group, n-hexyl group, 2-hexyl group, 3-hexyl group, Examples thereof include n-heptyl group, n-octyl group, 2-methylpentyl group, 3-methylpentyl group, 4-methylpentyl group, 2-methylpentane-3-yl group, and n-nonyl group.
- the number of carbon atoms of the alkenyl group is preferably 2 to 14, more preferably 4 to 12, from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be more controlled.
- Examples of the linear or branched alkenyl group include a vinyl group, an allyl group, a 4-pentenyl group, an isopropenyl group, an isopentenyl group, a 2-heptenyl group, a 2-octenyl group, and a 2-nonenyl group. Be done.
- n independently represents an integer of 1 to 10.
- the bismaleimide compound (A) has maleimide groups at both ends of the molecular chain.
- both ends mean both ends in the molecular chain of the bismaleimide compound (A), and for example, the structural unit represented by the formula (1) is the molecular chain of the bismaleimide compound (A).
- the maleimide group is at the end of the molecular chain of R 1 , at the end of the molecular chain at the N atom of the maleimide ring, or at both ends.
- the bismaleimide compound (A) may have a maleimide group in addition to both ends of the molecular chain.
- the maleimide group is represented by the formula (4), and the N atom is bonded to the molecular chain of the bismaleimide compound (A).
- the maleimide groups bonded to the bismaleimide compound (A) may be all the same or different, but it is preferable that the maleimide groups at both ends of the molecular chain are the same.
- R 6 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. Both of R 6 are preferably hydrogen atoms from the viewpoint of being preferably photocured.
- the number of carbon atoms of the alkyl group is preferably 1 to 3 and more preferably 1 to 2 from the viewpoint of preferably photocuring.
- R 3 can be referred to as a linear or branched alkyl group.
- Examples of such a bismaleimide compound (A) include a bismaleimide compound represented by the formula (5). These can be used alone or in admixture of two or more.
- a represents an integer from 1 to 10.
- a is preferably an integer of 1 to 6 from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be more controlled.
- the bismaleimide compound (A) As the bismaleimide compound (A), a commercially available product can also be used. Examples of commercially available products include MIZ-001 (trade name, including maleimide compound of formula (5)) manufactured by Nippon Kayaku Co., Ltd.
- the content of the bismaleimide compound (A) makes it possible to obtain a cured product containing the bismaleimide compound as a main component, and has a good balance of photocurability, heat resistance and thermal stability. From the viewpoint that it can be improved, 5 to 99.4 parts by mass with respect to a total of 100 parts by mass of the bismaleimide compound (A), the resin or compound (B) described later, and the photocuring initiator (C) described later. It is preferably 8 to 98 parts by mass, and even more preferably 17 to 93 parts by mass.
- the bismaleimide compound (A) can be used alone or in admixture of two or more.
- the bismaleimide compound (A) can be produced by a known method.
- 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride, a monomer containing diamine containing dimerdiamine and the like, and a maleimide compound such as maleimide anhydride are usually contained at about 80 to 250 ° C., preferably 100.
- a heavy addition reaction is usually carried out for about 0.5 to 50 hours, preferably about 1 to 20 hours to obtain a heavy adduct, and then usually about 60 to 120 ° C., preferably about 80 to 100.
- the bismaleimide compound (A) is formed by subjecting the heavy adduct to an imidization reaction, that is, a dehydration ring closure reaction at a temperature of about ° C. for about 0.1 to 2 hours, preferably about 0.1 to 0.5 hours. Can be obtained.
- an imidization reaction that is, a dehydration ring closure reaction at a temperature of about ° C. for about 0.1 to 2 hours, preferably about 0.1 to 0.5 hours.
- Dimer diamine is obtained, for example, by a reductive amination reaction of dimer acid, and the amineization reaction is described in a known method such as a reduction method using ammonia and a catalyst (for example, JP-A-9-12712). It can be done by the method of).
- Dimer acid is a dibasic acid obtained by dimerizing unsaturated fatty acids by an intermolecular polymerization reaction or the like. Although it depends on the synthesis conditions and purification conditions, it usually contains a small amount of monomeric acid, trimer acid and the like in addition to dimer acid.
- the double bond remains in the obtained molecule, but in the present embodiment, the double bond existing in the molecule is reduced to become a saturated dibasic acid by the hydrogenation reaction, which is also a dimer acid.
- Dimer acid is obtained, for example, by polymerizing unsaturated fatty acids using Lewis acid and Bronsted acid as catalysts.
- the dimer acid can be produced by a known method (for example, the method described in JP-A-9-12712).
- unsaturated fatty acids include crotonic acid, myristoleic acid, palmitoleic acid, oleic acid, elaidic acid, baxenoic acid, gadrain acid, eicosaenoic acid, erucic acid, nervonic acid, linoleic acid, pinolenic acid, and eleostearic acid.
- the unsaturated fatty acid usually has 4 to 24 carbon atoms, preferably 14 to 20 carbon atoms.
- the diamine-containing monomer is previously dissolved in an organic solvent or dispersed in a slurry in an inert atmosphere such as argon or nitrogen to form a diamine-containing monomer solution. It is preferable to do so. Then, 1,2,4,5-cyclohexanetetracarboxylic dianhydride can be added to the monomer solution containing the diamine after being dissolved in an organic solvent or dispersed in a slurry, or in a solid state. preferable.
- An arbitrary bismaleimide compound (A) can be obtained by preparing the number of moles of 1,2,4,5-cyclohexanetetracarboxylic dianhydride and the total number of moles of the diamine-containing monomer and the maleimide compound. be able to.
- Solvents include, for example, amides such as N, N-dimethylformamide, N, N-dimethylacetamide, and N-methyl-2-pyrrolidone; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and isophorone; Esters such as ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone, ⁇ -caprolactone, ⁇ -caprolactone, ⁇ -methyl- ⁇ -butyrolactone, ethyl lactate, methyl acetate, ethyl acetate, and butyl acetate; methanol, ethanol , And aliphatic alcohols having 1 to 10 carbon atoms such as propanol; phenols and aromatic group-containing phenols such as cresol; aromatic group-containing alcohols such as
- glycols with methanol, ethanol, butanol, hexanol, octanol, benzyl alcohol, phenol, cresol, etc., or glycol ethers such as esters of these monoethers; dioxane, and Examples include ethers such as tetrahydrofuran; cyclic carbonates such as ethylene carbonate and propylene carbonate; aromatic hydrocarbons such as aliphatic and toluene, and xylene; aprotonic polar solvents such as dimethyl sulfoxide. These solvents may be used alone or in combination of two or more, if necessary.
- a catalyst for example, a tertiary amine and a dehydration catalyst can be used.
- a tertiary amine a heterocyclic tertiary amine is preferable, and examples thereof include pyridine, picoline, quinoline, and isoquinoline.
- the dehydration catalyst include acetic anhydride, propionic anhydride, n-butyric anhydride, benzoic acid anhydride, trifluoroacetic anhydride and the like.
- the amount of the catalyst added is, for example, about 0.5 to 5.0 times the molar equivalent of the imidizing agent with respect to the amide group, and 0.5 to 10.0 times the molar equivalent of the dehydration catalyst with respect to the amide group.
- the equivalent amount is preferable.
- this solution may be used as a bismaleimide compound (A) solution, or a poor solvent may be added to the reaction solvent to make the bismaleimide compound (A) a solid substance.
- the poor solvent include water, methyl alcohol, ethyl alcohol, 2-propyl alcohol, ethylene glycol, triethylene glycol, 2-butyl alcohol, 2-pentyl alcohol, 2-hexyl alcohol, cyclopentyl alcohol, cyclohexyl alcohol, and phenol. Examples thereof include t-butyl alcohol.
- the resin composition of the present embodiment is selected from the group consisting of maleimide compounds other than the bismaleimide compound (A), cyanate ester compounds, benzoxazine compounds, epoxy resins, carbodiimide compounds, and compounds having an ethylenically unsaturated group. Contains at least one resin or compound (B) (also referred to as component (B)). These resins or compounds (B) can be used alone or in admixture of two or more, depending on the physical characteristics and use of the obtained cured product. In the present embodiment, when the resin or the compound (B) is used together with the bismaleimide compound (A) and the photocuring initiator described later, the photocurability, heat resistance and thermal stability are excellent.
- the present inventors have to achieve both the photocurability and insulation reliability of the bismaleimide compound (A) and the heat resistance and thermal stability of the resin or the compound (B). Is presumed to be possible. Further, it is also possible to impart various physical characteristics of the bismaleimide compound (A) and the resin or the compound (B) to the obtained cured product. Since the bismaleimide compound (A) is extremely excellent in light transmission, even if a resin or the compound (B) is used, sufficient light reaches the photocuring initiator, and the photoradical reaction of maleimide occurs efficiently. It can be photocured using various active energy rays.
- the resin or compound (B) can be photocured together with the bismaleimide compound (A) and the photocuring initiator (C) using various active energy rays to obtain a cured product.
- each of the resin or compound (B) prepares an N-methylpyrrolidone solution contained in an amount of 1% by mass, and uses an active energy ray containing a wavelength of 365 nm (i-line) to provide one carboxy group.
- the transmittance of the N-methylpyrrolidone solution containing 1% by mass of the compound (B) containing the above is measured, the transmittance is preferably 5% or more.
- Such a resin or compound (B) exhibits very good light transmission.
- the transmittance of the N-methylpyrrolidone solution containing 1% by mass of the resin or the compound (B) is measured using active energy rays having a wavelength of 405 nm (h line), the transmittance is measured. Is preferably 5% or more, and even in this case, very excellent light transmittance is exhibited.
- a resin or compound (B) for example, when a printed wiring board having a high-density and high-definition wiring formation (pattern) is manufactured by using a direct drawing exposure method, a wavelength of 405 nm (h line) is obtained. Even when the active energy rays containing it are used, the photoradical reaction of maleimide occurs efficiently.
- the transmittance at a wavelength of 365 nm (i-line) is more preferably 8% or more, further preferably 10% or more, because a resin composition having better photocurability can be obtained.
- the transmittance at a wavelength of 405 nm (h line) is more preferably 8% or more, further preferably 10% or more, because a resin composition having better photocurability can be obtained.
- the upper limits of the transmittance at the wavelength of 365 nm (i-line) and the transmittance at the wavelength of 405 nm (h-line) are, for example, 99.9% or less.
- the resin or compound (B) preferably has a molecular weight of 100 to 5,000, respectively, from the viewpoint of suppressing an increase in the viscosity of the varnish.
- the resin or compound (B) is not particularly limited as long as the effects of the present invention are exhibited, but it is preferable that the mass average molecular weight of each is 100 to 50,000 from the viewpoint of suppressing an increase in the viscosity of the varnish.
- the "mass average molecular weight” means the polystyrene standard equivalent mass average molecular weight by the gel permeation chromatography (GPC) method.
- the total content of the resin or the compound (B) makes it possible to obtain a cured product containing the bismaleimide compound as a main component, and from the viewpoint of improving the photocurability, the bismaleimide compound (A). ),
- the resin or compound (B) and the photocuring initiator (C) described later are preferably 0.5 to 85 parts by mass, and more preferably 1 to 84 parts by mass. It is preferably 5 to 76 parts by mass, and more preferably 5 to 76 parts by mass.
- a maleimide compound (B1) (also referred to as a component (B1)) other than the bismaleimide compound (A) can be used.
- the maleimide compound (B1) will be described below.
- the maleimide compound (B1) is other than the maleimide compound (A), and is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule. Specific examples thereof include N-phenylmaleimide, N-cyclohexylmaleimide, N-hydroxyphenylmaleimide, N-anilinophenylmaleimide, N-carboxyphenylmaleimide, N- (4-carboxy-3-hydroxyphenyl) maleimide, 6 -Maleimidehexanoic acid, 4-maleimidebutyric acid, bis (4-maleimidephenyl) methane, 2,2-bis ⁇ 4- (4-maleimidephenoxy) -phenyl ⁇ propane, 4,4-diphenylmethanebismaleimide, bis (3, 5-Dimethyl-4-maleimidephenyl) methane, bis (3-ethyl-5-methyl-4-maleimidephenyl) methane, bis (3,5-diethyl-4-male
- maleimide compound represented by the formula (6) a commercially available product can also be used, and examples thereof include BMI-2300 (trade name) manufactured by Daiwa Kasei Kogyo Co., Ltd.
- maleimide compound represented by the formula (7) a commercially available product can also be used, and examples thereof include MIR-3000 (trade name) manufactured by Nippon Kayaku Co., Ltd.
- R 7 independently represents a hydrogen atom or a methyl group.
- n 1 represents an integer of 1 or more, preferably an integer of 1 to 10, and more preferably an integer of 1 to 5.
- R 8 independently represents a hydrogen atom or a methyl group.
- n 2 represents an integer of 1 or more, preferably an integer of 1 to 5.
- a chloroform solution containing the maleimide compound (B1) in an amount of 1% by mass is prepared and contains a wavelength of 365 nm (i-line).
- the transmittance of this chloroform solution is measured using active energy rays, it is preferable that the transmittance shows a light transmittance of 5% or more. In this case, the transmittance is more preferably 8% or more, and further preferably 10% or more.
- a chloroform solution containing the maleimide compound (B1) in an amount of 1% by mass was prepared, and an active energy ray containing a wavelength of 405 nm (h line) was prepared.
- the transmittance of this chloroform solution is measured using the above, it is preferable that the transmittance shows a light transmittance of 5% or more.
- a maleimide compound (B1) for example, when a printed wiring board having a high-density and high-definition wiring formation (pattern) is manufactured by using a direct drawing exposure method, a wavelength of 405 nm (h line) can be obtained. Even when the active energy rays containing it are used, the photoradical reaction of maleimide occurs efficiently.
- the light transmittance is more preferably 8% or more, further preferably 10% or more, because a resin composition having better photocurability can be obtained.
- Examples of such a maleimide compound (B1) include a maleimide compound represented by the formula (8), a maleimide compound represented by the formula (9), a maleimide compound represented by the formula (16), and the like (10). ), The maleimide compound represented by the formula (11), the maleimide compound represented by the formula (12), the maleimide compound represented by the formula (13), 1,6-bismaleimide- (2). , 2,4-trimethyl) hexane (maleimide compound represented by the formula (14)), maleimide compound represented by the formula (15), and fluorescein-5-maleimide.
- n 3 (average) is 1 or more, preferably 1 to 21, and more preferably 1 to 16 from the viewpoint of exhibiting excellent photocurability.
- the number of x is 10 to 35.
- the number of y is 10 to 35.
- Ra represents a linear or branched alkyl group having 1 to 16 carbon atoms or a linear or branched alkenyl group having 2 to 16 carbon atoms.
- R a is preferably a linear or branched alkyl group, and more preferably a linear alkyl group because it exhibits excellent photocurability.
- the alkyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- the alkenyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- R 3 in the bismaleimide compound (A) can be referred to.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- 2-heptenyl group, 2-octenyl group and 2-nonenyl group are preferable, and 2-octenyl group is more preferable, because they show excellent photocurability.
- R b represents a linear or branched alkyl group having 1 to 16 carbon atoms or a linear or branched alkenyl group having 2 to 16 carbon atoms.
- R b is preferably a linear or branched alkyl group, and more preferably a linear alkyl group because it exhibits excellent photocurability.
- the alkyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- the alkenyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- the alkyl group in Ra can be referred to.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- the alkenyl group in Ra can be referred to.
- a 2-heptenyl group, a 2-octenyl group, and a 2-nonenyl group are preferable, and a 2-octenyl group is more preferable, because they exhibit excellent photocurability.
- the number of n a is 1 or more, preferably 2 to 16, and more preferably 3 to 14 from the viewpoint of exhibiting excellent photocurability.
- the number of n b is 1 or more, preferably 2 to 16, and more preferably 3 to 14 from the viewpoint of exhibiting excellent photocurability.
- n a and n b may be the same or different.
- n 4 (average) is 0.5 or more, preferably 0.8 to 10, and more preferably 1 to 8 from the viewpoint of exhibiting excellent photocurability.
- n 5 represents an integer of 1 or more, preferably an integer of 1 to 10.
- n 6 represents an integer of 1 or more, preferably an integer of 1 to 10.
- R 9 independently represents a hydrogen atom, a methyl group or an ethyl group
- R 10 independently represents a hydrogen atom or a methyl group.
- maleimide compound (B1) a commercially available product can also be used.
- maleimide compound represented by the formula (10) examples include Designer Molecules Inc. BMI-689 (trade name, formula (16), functional group equivalent: 346 g / eq.) And the like.
- BMI-5000 (trade name) manufactured by (DMI), Designer Moleculars Inc. BMI-9000 (trade name) manufactured by (DMI) can be mentioned.
- the maleimide compound represented by the formula (14) a commercially available product can also be used, and examples thereof include BMI-TMH (trade name) manufactured by Daiwa Kasei Kogyo Co., Ltd.
- the maleimide compound represented by the formula (15) a commercially available product can also be used, and examples thereof include BMI-70 (trade name) manufactured by KAI Kasei Co., Ltd.
- These maleimide compounds (B1) can be used alone or in admixture of two or more.
- the content of the maleimide compound (B1) is preferably 0.5 to 0.5 to 100 parts by mass with respect to a total of 100 parts by mass of the bismaleimide compound (A), the maleimide compound (B1) and the photoinitiator (C). It is preferably 85 parts by mass.
- Cyanide ester compound A cyanide ester compound (B2) (also referred to as a component (B2)) can be used in the resin composition.
- the cyanate ester compound (B2) will be described below.
- the cyanate ester compound is not particularly limited as long as it is a resin having an aromatic moiety in the molecule in which at least one cyanato group (cyanic acid ester group) is substituted.
- Ar 1 represents a benzene ring, a naphthalene ring, or a single bond of two benzene rings. When there are a plurality of them, they may be the same or different from each other.
- Ar 1 is preferably a naphthalene ring.
- Ra independently has a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, and 1 to 4 carbon atoms. It shows a group in which an alkyl group of 6 and an aryl group having 6 to 12 carbon atoms are bonded.
- Ra is preferably a hydrogen atom.
- the aromatic ring in Ra may have a substituent, and the substituent in Ar 1 and Ra can be selected at any position.
- p indicates the number of cyanato groups bonded to Ar 1 , each of which is an integer of 1 to 3 and is preferably 1.
- q represents the number of Ra to bind to Ar 1, the 4-p when Ar 1 is a benzene ring, when the naphthalene ring when those 6-p, 2 one benzene ring is a single bond is 8-p .
- t indicates the average number of repetitions, and is an integer of 0 to 50, preferably an integer of 1 to 30, and more preferably an integer of 1 to 10.
- the cyanide ester compound may be a mixture of compounds having different t.
- each of them has a single bond, a divalent organic group having 1 to 50 carbon atoms (the hydrogen atom may be replaced with a hetero atom), and a divalent group having 1 to 10 nitrogen atoms.
- Organic group for example, -N-RN- (where R indicates an organic group)
- the alkyl group in Ra of the formula (17) may have either a linear or branched chain structure or a cyclic structure (for example, a cycloalkyl group). Further, even if the hydrogen atom in the alkyl group in the formula (17) and the aryl group in Ra is substituted with a halogen atom such as a fluorine atom or a chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, or a cyano group. Good.
- alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, 1-ethylpropyl group and 2,2-dimethylpropyl group.
- alkyl group examples include a group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a trifluoromethyl group and the like.
- alkenyl group examples include vinyl group, (meth) allyl group, isopropenyl group, 1-propenyl group, 2-butenyl group, 3-butenyl group, 1,3-butandienyl group, 2-methyl-2-propenyl. , 2-Pentenyl group, 2-hexenyl group and the like.
- aryl group include phenyl group, xylyl group, mesityl group, naphthyl group, phenoxyphenyl group, ethylphenyl group, o-, m- or p-fluorophenyl group, dichlorophenyl group, dicyanophenyl group and trifluorophenyl.
- alkoxyl group examples include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group and the like.
- divalent organic group having 1 to 50 carbon atoms in X of the formula (17) include methylene group, ethylene group, trimethylene group, cyclopentylene group, cyclohexylene group, trimethylcyclohexylene group and biphenylylmethylene.
- examples thereof include a group, a dimethylmethylene-phenylene-dimethylmethylene group, a methylene-phenylene-methylene group, a fluorinatedyl group, and a phthalidodiyl group.
- a methylene-phenylene-methylene group is preferable.
- the hydrogen atom in the divalent organic group may be substituted with a halogen atom such as a fluorine atom or a chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, a cyano group or the like.
- a halogen atom such as a fluorine atom or a chlorine atom
- an alkoxyl group such as a methoxy group or a phenoxy group
- a cyano group or the like examples of the divalent organic group having a nitrogen number of 1 to 10 in X of the formula (17) include an imino group and a polyimide group.
- examples of the organic group of X in the formula (17) include those having a structure represented by the formula (18) or the formula (19).
- Ar 2 represents a benzenediyl group, a naphthalenediyl group or a biphenyldiyl group, and when u is an integer of 2 or more, they may be the same or different from each other.
- Rb, Rc, Rf, and Rg each independently have a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a trifluoromethyl group, or an aryl having at least one phenolic hydroxy group. Indicates a group.
- Rd and Re are independently selected from one of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, or a hydroxy group. .. u represents an integer from 0 to 5.
- Ar 3 represents a benzenediyl group, a naphthalenediyl group or a biphenyldiyl group, and when v is an integer of 2 or more, they may be the same or different from each other.
- Ri and Rj are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, aryl groups having 6 to 12 carbon atoms, benzyl groups, alkoxyl groups having 1 to 4 carbon atoms, hydroxy groups, trifluoromethyl groups, respectively. Alternatively, it indicates an aryl group in which at least one cyanato group is substituted.
- v represents an integer of 0 to 5, it may be a mixture of compounds in which v is different.
- z represents an integer of 4 to 7.
- Rk independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- Ar 2 of the formula (18) and Ar 3 of the formula (19) two carbon atoms represented by the formula (18) or two oxygen atoms represented by the formula (19) are 1,4.
- Benzene diyl group bonded to the position or 1,3 position, two carbon atoms or two oxygen atoms at the 4,4'position, 2,4'position, 2,2'position, 2,3'position, 3 , 3'-position, or 3,4'-position bonded biphenyldiyl group, and two carbon atoms or two oxygen atoms at the 2,6, 1,5, 1,6, 1, Examples thereof include a naphthalenediyl group bonded to the 8-position, 1,3-position, 1,4-position, or 2,7-position.
- the alkyl and aryl groups in Rb, Rc, Rd, Re, Rf and Rg of formula (18) and Ri and Rj of formula (19) are synonymous with those in formula (17).
- cyanato-substituted aromatic compound represented by the formula (17) include cyanatobenzene, 1-cyanato-2-, 1-cyanato-3-, or 1-cyanato-4-methylbenzene, 1-cyanato. -2-, 1-Cyanato-3-, or 1-Cyanato-4-methoxybenzene, 1-Cyanato-2,3-,1-Cyanato-2,4-,1-Cyanato-2,5-,1- Cianato-2,6-,1-Cyanato-3,4- or 1-Cyanato-3,5-dimethylbenzene, Cyanatoethylbenzene, Cyanatobutylbenzene, Cyanatooctylbenzene, Cyanatononylbenzene, 2- (4) -Cyanafel) -2-phenylpropane (cyanate of 4- ⁇ -cumylphenol), 1-cyanato-4-cyclohexylbenzene, 1-cyanato-4-vinylbenzene, 1-
- ⁇ -naphthol aralkyl type cyanide ester resin represented by the formula (31) (in the formula (31), n 13 is 1 to 4) is used because the heat resistance of the cured product is improved. Included) is preferred.
- cyanate ester compounds can be used alone or in admixture of two or more.
- phenol novolac resin and cresol novolac resin by a known method, phenol, alkyl-substituted phenol or halogen-substituted phenol, formalin, paraformaldehyde and the like, etc.
- Formaldehyde compound reacted in an acidic solution trisphenol novolac resin (hydroxybenzaldehyde and phenol reacted in the presence of an acidic catalyst), fluorennovolac resin (fluorenone compound and 9,9-bis) (hydroxyaryl) that the fluorenes were reacted in the presence of an acid catalyst), phenol aralkyl resins, cresol aralkyl resin, (by known methods, Ar 4 - (CH 2 Y) naphthol aralkyl resins and biphenyl aralkyl resin 2 (Ar 4 indicates a phenyl group and Y indicates a halogen atom.
- phenol-modified xyleneformaldehyde resin a reaction of xyleneformaldehyde resin and phenol compound in the presence of an acidic catalyst by a known method
- modified naphthaleneformaldehyde resin by a known method, naphthaleneformaldehyde resin
- a hydroxy-substituted aromatic compound reacted in the presence of an acidic catalyst a phenol-modified dicyclopentadiene resin
- a phenol resin having a polynaphthylene ether structure by a known method, 2 phenolic hydroxy groups are contained in one molecule.
- Examples thereof include a phenolic resin obtained by dehydrating and condensing a polyvalent hydroxynaphthalene compound having one or more of them in the presence of a basic catalyst), which is cyanated by the same method as described above, and prepolymers thereof. .. These cyanate ester compounds may be used alone or in admixture of two or more.
- the method for producing these cyanate ester compounds is not particularly limited, and known methods can be used.
- An example of such a production method is a method in which a hydroxy group-containing compound having a desired skeleton is obtained or synthesized, and the hydroxy group is modified by a known method to cyanate.
- Examples of the method for cyanating a hydroxy group include the methods described in Ian Hamerton, Chemistry and Technology of Cyanate Ester Resins, Blackie Academic & Professional.
- the cured product using these cyanate ester compounds has excellent properties such as glass transition temperature, low thermal expansion, and plating adhesion.
- the content of the cyanate ester compound is 0.5 to 85 with respect to 100 parts by mass of the total of the bismaleimide compound (A), the cyanate ester compound (B2) and the photoinitiator (C). It is preferably parts by mass.
- a benzoxazine compound (B3) (also referred to as a component (B3)) can be used in the resin composition.
- the benzoxazine compound (B3) will be described below.
- As the benzoxazine compound (B3) a generally known compound can be used as long as it has an oxazine ring as the basic skeleton.
- the benzoxazine compound also includes a compound having a polycyclic oxazine skeleton such as a naphthooxazine compound.
- the compound represented by the formula (20) and the compound represented by the formula (21) are preferable from the viewpoint of obtaining good photocurability.
- R 11 independently represents a hydrogen atom, an aryl group, an aralkyl group, an alkenyl group, an alkyl group, or a cycloalkyl group.
- n 7 each independently represents an integer of 1 to 4.
- Each R 12 independently represents a hydrogen atom, an aryl group, an aralkyl group, an alkenyl group, an alkyl group, or a cycloalkyl group.
- n 8 independently represents an integer of 1 to 4.
- T 1 represents an alkylene group, a group represented by the formula (22), a group represented by the formula "-SO 2- ", a group represented by "-CO-", an oxygen atom, or a single bond.
- Both R 11 and R 12 are preferably aryl groups having 6 to 18 carbon atoms.
- Examples of such an aryl group include a phenyl group, a naphthyl group, an indenyl group, a biphenyl group, and an anthryl group. Of these, a phenyl group is more preferable.
- These aryl groups may have one or more lower alkyl groups having 1 to 4 carbon atoms, preferably 1 to 3 carbon atoms. Examples of the aryl group having such a lower alkyl group include a tolyl group, a xsilyl group, and a methylnaphthyl group.
- the aralkyl group is preferably a benzyl group and a phenethyl group. These may have one or more lower alkyl groups having 1 to 4 carbon atoms on the phenyl group, preferably 1 to 3 carbon atoms.
- Examples of the alkenyl group for both R 11 and R 12 include a vinyl group, a (meth) allyl group, a propenyl group, a butenyl group, and a hexenyl group. Among these, a vinyl group, an allyl group, and a propenyl group are preferable, and an allyl group is more preferable.
- an alkyl group having 1 to 20 carbon atoms is preferable, and an alkyl group having 1 to 10 carbon atoms is more preferable.
- the alkyl group having 3 or more carbon atoms may be linear or branched.
- methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, n-pentyl group, neopentyl group, n-hexyl group, texyl group examples thereof include an n-heptyl group, an n-octyl group, an n-ethylhexyl group, an n-nonyl group, and an n-decyl group.
- Examples of the cycloalkyl group for both R 11 and R 12 include a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group. It is preferably a cyclohexyl group.
- a linear or branched alkylene group is preferable.
- the linear alkylene group include methylene group, ethylene group, propylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decanylene group, trimethylene group, tetramethylene group and pentamethylene group.
- Examples include a group and a hexamethylene group.
- Examples of the branched alkylene group include -C (CH 3 ) 2- , -CH (CH 3 )-, -CH (CH 2 CH 3 )-, and -C (CH 3 ) (CH 2 CH 3 ).
- R 13 independently represents a hydrogen atom, an aryl group, an aralkyl group, an alkenyl group, an alkyl group, or a cycloalkyl group.
- n 9 each independently represents an integer of 1 to 3.
- R 14 independently represents a hydrogen atom, an aryl group, an aralkyl group, an alkenyl group, an alkyl group, or a cycloalkyl group.
- n 10 each independently represents an integer of 1 to 5.
- T 2 represents an alkylene group, a group represented by the formula (22), a group represented by the formula "-SO 2- ", a group represented by "-CO-", an oxygen atom, or a single bond.
- the aryl group, aralkyl group, alkenyl group, alkyl group, and cycloalkyl group are as described above.
- the alkylene group at T 2 is as described above.
- Z is a hydrocarbon group having an alkylene group or an aromatic ring and having 6 to 30 carbon atoms.
- n 11 represents an integer of 0 or more and 5 or less.
- n 11 is preferably an integer of 1 or more and 3 or less, and more preferably 1 or 2.
- the alkylene group in Z is as described above.
- hydrocarbon group having an aromatic ring and having 6 to 30 carbon atoms examples include benzene, biphenyl, naphthalene, anthracene, fluorene, phenalene train, indacene, terphenyl, acenaphthalene, and a compound having aromaticity of phenalene.
- a divalent group obtained by removing two hydrogen atoms from the nucleus of naphthalene can be mentioned.
- benzoxazine compound (B3) a commercially available product may be used.
- Pd-type benzoxazine manufactured by Shikoku Kasei Kogyo Co., Ltd., 3,3'-(methylene-1,4-diphenylene) bis (3,3) 4-Dihydro-2H-1,3-benzoxazine), compound represented by the formula (20)
- Fa type benzoxazine manufactured by Shikoku Kasei Kogyo Co., Ltd., 2,2-bis (3,4-dihydro-) 2H-3-phenyl-1,3-benzoxazine) methane, compound represented by formula (21)
- bisphenol A type benzoxazine BA-BXZ manufactured by Konishi Chemical Industry Co., Ltd., trade name
- bisphenol F Type benzoxazine BF-BXZ manufactured by Konishi Chemical Industry Co., Ltd., trade name
- benzoxazine compounds (B3) can be used alone or in admixture of two or more.
- the benzoxazine compound is preferably a compound represented by the formula (20) and a compound represented by the formula (21) because it has good heat resistance, and is 3,3'-(methylene-1,4).
- -Diphenylene) bis (3,4-dihydro-2H-1,3-benzoxazine is more preferred.
- the content of the benzoxazine compound is 0.5 to 85 parts by mass with respect to 100 parts by mass in total of the bismaleimide compound (A), the benzoxazine compound (B3) and the photoinitiator (C). Is preferable.
- Epoxy resin An epoxy resin (B4) (also referred to as a component (B4)) can be used as the resin composition.
- the epoxy resin (B4) will be described below.
- the epoxy resin (B4) generally known ones can be used.
- epoxy resin a commercially available product can also be used.
- examples of commercially available products include an epoxy resin represented by the formula (23) (NC-3000FH (trade name) manufactured by Nippon Kayaku Co., Ltd., n 12 in the formula (23) is about 4), and a formula.
- examples thereof include a naphthalene type epoxy resin represented by (24) (HP-4710 (trade name) manufactured by DIC Corporation).
- epoxy resins can be used alone or in admixture of two or more.
- the epoxy resin represented by the formula (23) and the epoxy resin represented by the formula (24) are preferable because the cured product has excellent heat resistance, and the epoxy represented by the formula (23) is preferable. Resin is more preferable.
- the content of the epoxy resin is 0.5 to 85 parts by mass with respect to 100 parts by mass in total of the bismaleimide compound (A), the epoxy resin (B4) and the photocuring initiator (C). Is preferable.
- Carbodiimide compound A carbodiimide compound (B5) (also referred to as a component (B5)) can be used in the resin composition.
- the carbodiimide compound (B5) will be described below.
- As the carbodiimide compound (B5) generally known compounds can be used as long as they have at least one or more carbodiimide groups in the molecule.
- carbodiimide compounds (B5) can be used alone or in admixture of two or more.
- the carbodiimide compound has good heat resistance and has good adhesion to the conductor layer when used as an insulating layer of a printed wiring board. Therefore, carbodilite (registered trademark) B-01, V-03, V05 (trade name, manufactured by Nisshinbo Chemical Co., Ltd.) is preferable, and carbodilite (registered trademark) B-01 (trademark, manufactured by Nisshinbo Chemical Co., Ltd.) is more preferable.
- the content of the carbodiimide compound is preferably 0.5 to 85 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- a compound (B6) having an ethylenically unsaturated group (also referred to as a component (B6)) can be used.
- the compound (B6) having an ethylenically unsaturated group will be described below.
- a generally known compound can be used as long as it is a compound having one or more ethylenically unsaturated groups in one molecule.
- a compound having a (meth) acryloyl group, a vinyl group and the like can be mentioned.
- Examples of the compound having a (meth) acryloyl group include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, lauryl (meth) acrylate, polyethylene glycol (meth) acrylate, and polyethylene glycol (meth) acrylate monomethyl ether.
- Phenylethyl (meth) acrylate isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, butanediol di (meth) acrylate, hexanediol di (meth) acrylate, Neopentyl glycol di (meth) acrylate, nonanediol di (meth) acrylate, glycol di (meth) acrylate, diethylene di (meth) acrylate, polyethylene glycol di (meth) acrylate, tris (meth) acryloyloxyethyl isocyanurate, polypropylene glycol Di (meth) acrylate, epoxy di (meth) acrylate of adipate, bisphenolethylene oxide di (meth) acrylate, hydride bisphenolethylene oxide (meth) acrylate
- urethane (meth) acrylates having a (meth) acryloyl group and a urethane bond in the same molecule
- polyester (meth) acrylates having a (meth) acryloyl group and an ester bond in the same molecule
- epoxy Epoxy (meth) acrylates derived from a resin and also having a (meth) acryloyl group; reactive oligomers in which these bonds are used in combination can also be mentioned.
- urethane (meth) acrylates include reaction products of hydroxyl group-containing (meth) acrylates and polyisocyanates, and other alcohols used as needed.
- hydroxyalkyl (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate and hydroxybutyl (meth) acrylate
- glycerin (meth) such as glycerin mono (meth) acrylate and glycerin di (meth) acrylate.
- Alacrylates such as pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and toluene diisocyanate.
- sugar alcohol (meth) acrylates such as pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and toluene diisocyanate.
- polyester (meth) acrylates examples include caprolactone-modified 2-hydroxyethyl (meth) acrylate, ethylene oxide and / or propylene oxide-modified phthalic acid (meth) acrylate, ethylene oxide-modified succinic acid (meth) acrylate, and caprolactone-modified tetrahydro.
- Monofunctional (poly) ester (meth) acrylates such as furfuryl (meth) acrylate; hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, caprolactone-modified hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, epichlorohydrin-modified Di (poly) ester (meth) acrylates such as phthalic acid di (meth) acrylate; 1 mol or more of cyclic lactone compounds such as ⁇ -caprolactone, ⁇ -butyrolactone and ⁇ -valerolactone per 1 mol of trimethylolpropane or glycerin. Examples thereof include mono, di or tri (meth) acrylates of triol obtained by addition.
- Triol mono or poly obtained by adding 1 mol or more of cyclic lactone compounds such as ⁇ -caprolactone, ⁇ -butyrolactone, and ⁇ -valerolactone to 1 mol of dipentaerythritol. Examples thereof include mono (meth) acrylate and poly (meth) acrylate of polyhydric alcohols such as triol, tetraol, pentaol or hexaol of meta) acrylate.
- diol components such as (poly) ethylene glycol, (poly) propylene glycol, (poly) tetramethylene glycol, (poly) butylene glycol, 3-methyl-1,5-pentanediol, and hexanediol, and maleic acid and fumal.
- polybasic acids such as acids, succinic acid, adipic acid, phthalic acid, isophthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, dimer acid, sebatic acid, azelaic acid, 5-sodium sulfoisophthalic acid, and anhydrides thereof.
- (Meta) acrylate of polyester polyol which is the reaction product of the above; Polyfunctional (poly) ester (meth) acrylates and the like can be mentioned.
- Epoxy (meth) acrylates are carboxylate compounds of a compound having an epoxy group and (meth) acrylic acid.
- phenol novolac type epoxy (meth) acrylate cresol novolac type epoxy (meth) acrylate, trishydroxyphenylmethane type epoxy (meth) acrylate, dicyclopentadienephenol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate.
- Bisphenol F type epoxy (meth) acrylate Bisphenol F type epoxy (meth) acrylate, biphenol type epoxy (meth) acrylate, bisphenol A novolak type epoxy (meth) acrylate, naphthalene skeleton-containing epoxy (meth) acrylate, glyoxal type epoxy (meth) acrylate, heterocyclic epoxy ( Examples thereof include meta) acrylates and the like, and these acid anhydride-modified epoxy acrylates and the like.
- Examples of the compound having a vinyl group include vinyl ethers such as ethyl vinyl ether, propyl vinyl ether, hydroxyethyl vinyl ether and ethylene glycol divinyl ether; and styrenes such as styrene, methylstyrene, ethylstyrene and divinylbenzene.
- Examples of other vinyl compounds include triallyl isocyanurate, trimetaallyl isocyanurate, and bisallyl nadiimide.
- KAYARADZCA registered trademark
- -601H trade name, manufactured by Nippon Kayaku Co., Ltd.
- TrisP-PA epoxy acrylate compound propylene glycol monomethyl ether acetate KAYARAD (registered trademark) ZCR-6007H (trademark) manufactured by Nippon Kayaku Co., Ltd.
- KAYARAD registered trademark
- ZCR-6007H trademark
- KAYARAD registered trademark
- ZCR-6001H trademark
- KAYARAD registered trademark
- ZCR-6002H trademark
- KAYARAD registered trademark
- KAYARAD registered trademark
- ZCR-6006H trade name
- These compounds having an ethylenically unsaturated group (B6) can be used alone or in admixture of two or more.
- the compound having an ethylenically unsaturated group propylene glycol monomethyl ether acetate, which is a TrisP-PA epoxy acrylate compound, is preferable because it has good thermal stability.
- the content of the compound having an ethylenically unsaturated group is 0. with respect to 100 parts by mass of the total of the bismaleimide compound (A), the benzoxazine compound (B3) and the photocuring initiator (C). It is preferably 5 to 85 parts by mass.
- the resin composition according to the present embodiment contains a photocuring initiator (C) (also referred to as component (C)).
- a photocuring initiator (C) also referred to as component (C)
- the photocurable initiator (C) those known in the field generally used in the photocurable resin composition can be used.
- the photo-curing initiator (C) is used together with the bismaleimide compound (A) and the resin or compound (B) for photo-curing using various active energy rays.
- Examples of the photocuring initiator (C) include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether, benzoyl peroxide, lauroyl peroxide, acetyl peroxide, and parachlorobenzoyl.
- Peroxides and organic peroxides exemplified by di-tert-butyl-di-perphthalate and the like; 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and bis (2,4,6-trimethylbenzoyl).
- )-Phosphinoxides such as phenylphosphine oxide; acetophenone, 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2- Methyl-phenylpropane-1-one, diethoxyacetophenone, 1-hydroxyncrohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1-one, and 2-benzyl Acetophenones such as -2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; anthraquinones such as 2-ethylanthraquinone, 2-t-butyl anthraquinone, 2-chloroanthraquinone, and 2-amyl anthraquinone.
- phenylphosphine oxide such as phenyl
- Thioxanthones such as 2,4-diethylthioxanthone, 2-isopropylthioxanthone, and 2-chlorothioxanthone; acetophenone dimethyl ketal, and ketals such as benzyl dimethyl ketal; benzophenone, 4-benzoyl-4'-methyldiphenyl sulfate, and Benzophenones such as 4,4'-bismethylaminobenzophenone; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], and 1- [9-ethyl-6 Radical photocuring initiators such as oxime esters such as-(2-methylbenzoyl) -9H-carbazole-3-yl] -acetophenone-1- (O-acetyloxime), and Diazonium salts of Lewis acids such as p-methoxyphenyldiazonium fluorophosphonate and
- a commercially available product can also be used as the photocuring initiator (C).
- Examples of commercially available products include Omnirad (registered trademark) 369 (trademark) manufactured by IGM Resins, Omnirad (registered trademark) 819 (trademark) manufactured by IGM Resins, and Omnirad (registered trademark) 819DW (trademark) manufactured by IGM Resins.
- IGM Resins Omnirad® 907 (trademark), IGM Resins Omnirad® TPO (trademark), IGM Resins Omnirad® TPO-L (trademark), IGM Omnirad (registered trademark) 784 (trademark) manufactured by Resins, Irgacure (registered trademark) OXE01 (trademark) manufactured by BASF Japan Co., Ltd., Irgacure (registered trademark) OXE02 (trademark name) manufactured by BASF Japan Co., Ltd., BASF Japan Co., Ltd.
- photo-curing initiators (C) can be used alone or in admixture of two or more.
- the photocuring initiator (C) is prepared by preparing a chloroform solution contained in an amount of 0.01% by mass, and using an active energy ray containing a wavelength of 365 nm (i-ray), the photocuring initiator (C) is used.
- the absorbance of the chloroform solution containing 0.01% by mass is measured, the absorbance is preferably 0.1 or more, and this photoinitiator (C) exhibits extremely excellent absorbance. ..
- the absorbance of the chloroform solution containing 0.01% by mass of the photoinitiator (C) is measured using an active energy ray containing a wavelength of 405 nm (h line), the absorbance is 0.1.
- the above is preferable, and even in this case, very excellent absorbance is exhibited.
- a photocuring initiator (C) for example, when a printed wiring board having a high-density and high-definition wiring formation (pattern) is manufactured by using a direct drawing exposure method, a wavelength of 405 nm (h line) is used. Even when an active energy ray containing the above is used, the photoradical reaction of maleimide occurs efficiently.
- the absorbance at a wavelength of 365 nm (i-line) is more preferably 0.15 or more because a resin composition having better photocurability can be obtained.
- the absorbance at a wavelength of 405 nm (h line) is more preferably 0.15 or more because a resin composition having better photocurability can be obtained.
- the upper limits of the absorbance at the wavelength of 365 (i-line) and the absorbance at the wavelength of 405 nm (h-line) are, for example, 99.9 or less.
- a compound represented by the formula (2) is preferable.
- R 4 independently represents a substituent or a phenyl group represented by the formula (3).
- R 5 independently represents a hydrogen atom or a methyl group.
- ⁇ * indicates a bond with the phosphorus atom (P) in formula (2).
- a chloroform solution containing 0.01% by mass of this compound was prepared, and the absorbance of this chloroform solution was measured using an active energy ray containing a wavelength of 365 nm (i-ray).
- the absorbance is 0.1 or more, and it exhibits extremely excellent absorbency for light having a wavelength of 365 nm (i-line). Therefore, this compound preferably generates radicals for light having a wavelength of 365 nm (i-line).
- the absorbance is preferably 0.15 or more.
- the upper limit is, for example, 5.0 or less, and may be 10.0 or less.
- a chloroform solution containing 0.01% by mass of this compound is prepared, and the absorbance of this chloroform solution is measured using an active energy ray containing a wavelength of 405 nm (h line). When measured, it exhibits an absorbance of 0.1 or more and very excellent absorbency for light having a wavelength of 405 nm (h line). Therefore, this compound preferably generates radicals for light having a wavelength of 405 nm (h line). Therefore, this compound preferably generates radicals for light having a wavelength of 405 nm (h line). Therefore, this compound preferably generates radicals for light having a wavelength of 405 nm (h line).
- the absorbance is preferably 0.15 or more.
- the upper limit is, for example, 5.0 or less, and may be 10.0 or less.
- R 4 independently represents a substituent or a phenyl group represented by the formula (3). It is preferable that one or more of R 4 are substituents represented by the formula (3).
- R 5 independently represents a hydrogen atom or a methyl group. Of R 5 , it is preferable that one or more are methyl groups, and it is more preferable that all of them are methyl groups.
- Examples of the compound represented by the formula (2) include phosphine such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
- phosphine such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
- Examples include oxides.
- bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide is preferable because it has excellent light transmittance.
- These compounds may be used alone or in admixture of two or more.
- Acylphosphine oxides show extremely excellent absorption to active energy rays containing a wavelength of 405 nm (h line), for example, a bismaleimide compound having a transmittance of 5% or more at a wavelength of 405 nm (h line).
- (A) can be suitably radically polymerized. Therefore, especially when used for a multilayer printed wiring board, a resin composition, a resin sheet, which has excellent photocurability and can obtain a cured product having an excellent balance of heat resistance, thermal stability and insulation reliability. It becomes possible to suitably manufacture a multilayer printed wiring board and a semiconductor device using them.
- the content of the photocuring initiator (C) sufficiently promotes the photocuring of the bismaleimide compound (A) and the resin or the compound (B), and provides better heat resistance and thermal stability. From the viewpoint of obtaining, it is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the total of the bismaleimide compound (A), the resin or the compound (B) and the photocuring initiator (C). It is more preferably 8 parts by mass, further preferably 2 to 7 parts by mass.
- the resin composition of the present embodiment may also contain a filler (D) (also referred to as a component (D)) in order to improve various properties such as coating film property and heat resistance.
- the filler (D) preferably has insulating properties and does not hinder the permeability to various active energy rays used for photocuring, and has a wavelength of 365 nm (i-line) and / or a wavelength of 405 nm (h). It is more preferable that it does not inhibit the permeability to active energy rays including rays).
- Examples of the filler (D) include silica (for example, natural silica, molten silica, amorphous silica, hollow silica, etc.), aluminum compounds (for example, boehmite, aluminum hydroxide, alumina, aluminum nitride, etc.), and boron compounds. (Eg, boron nitride, etc.), magnesium compounds (eg, magnesium oxide, magnesium hydroxide, etc.), calcium compounds (eg, calcium carbonate, etc.), molybdenum compounds (eg, molybdenum oxide, zinc molybdate, etc.), barium compounds.
- silica for example, natural silica, molten silica, amorphous silica, hollow silica, etc.
- aluminum compounds for example, boehmite, aluminum hydroxide, alumina, aluminum nitride, etc.
- boron compounds eg, boron nitride, etc.
- magnesium compounds eg, magnesium oxide
- fillers (D) can be used alone or in admixture of two or more.
- silica, boehmite, barium sulfate, silicone powder, fluororesin-based filler, urethane resin-based filler, (meth) acrylic resin-based filler, polyethylene-based filler, styrene-butadiene rubber, and silicone rubber can be used.
- These fillers (D) may be surface-treated with a silane coupling agent or the like described later.
- Silica is preferable, and fused silica is more preferable, from the viewpoint of improving the heat resistance of the cured product and obtaining good coating film properties.
- Specific examples of silica include SFP-130MC (trade name) manufactured by Denka Co., Ltd., SC2050-MB (trade name) manufactured by Admatex Co., Ltd., SC1050-MLE (trade name), and YA010C-MFN (trade name). ), YA050C-MJA (trade name) and the like.
- the particle size of the filler (D) is usually 0.005 to 10 ⁇ m, preferably 0.01 to 1.0 ⁇ m, from the viewpoint of ultraviolet light transmission of the resin composition.
- the content of the filler (D) is the bismaleimide compound (A), the resin, or the resin, from the viewpoint of improving the light transmittance of the resin composition and the heat resistance of the cured product.
- the total amount of the compound (B) and the photocuring initiator (C) is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and more preferably 100 parts by mass or less. More preferred.
- the upper limit value may be 30 parts by mass or less, 20 parts by mass or less, or 10 parts by mass or less.
- the lower limit is set to the bismaleimide compound (A), the resin or the compound (B) and from the viewpoint of obtaining the effect of improving various properties such as coating property and heat resistance. It is usually 1 part by mass with respect to a total of 100 parts by mass of the photocuring initiator (C).
- silane coupling agent and wet dispersant In the resin composition of the present embodiment, a silane coupling agent and / or a wet dispersant may be used in combination in order to improve the dispersibility of the filler and the adhesive strength between the polymer and / or the resin and the filler. it can.
- the silane coupling agent is not limited as long as it is a silane coupling agent generally used for surface treatment of inorganic substances.
- Specific examples include 3-aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, 3-aminopropyldiethoxymethylsilane, and N- ⁇ - (aminoethyl) - ⁇ -amino.
- methacrylsilanes such as 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyldimethoxymethylsilane, 3-methacryloxypropyldiethoxymethylsilane, ⁇ -acryloxypropyltri (Meta) acrylic silanes such as methoxysilane and 3-acryloxypropyltriethoxysilane; isocyanatesilanes such as 3-isocyanatepropyltrimethoxysilane and 3-isocyanatepropyltriethoxysilane; tris- (trimethoxysilylpropyl) ) Isocyanurate silanes such as isocyanurate; mercaptosilanes such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyldimethoxymethylsilane; 3-ureidopropyltriethoxysilane Which ureidosilane system;
- the content of the silane coupling agent is usually 100 parts by mass in total of the bismaleimide compound (A), the resin or the compound (B) and the photocuring initiator (C). It is 0.1 to 10 parts by mass.
- the wet dispersant is not particularly limited as long as it is a dispersion stabilizer used for paints. Specific examples include DISPERBYK (registered trademark) -110 (trademark), 111 (product name), 118 (product name), 180 (product name), 161 (product name), BYK manufactured by Big Chemie Japan Co., Ltd.
- wetting dispersants such as (registered trademark) -W996 (trade name), W9010 (trade name), W903 (trade name) and the like can be mentioned. These wet dispersants can be used alone or in admixture of two or more.
- the content of the wet dispersant is usually 0 with respect to a total of 100 parts by mass of the bismaleimide compound (A), the resin or the compound (B) and the photocuring initiator (C). . 1 to 10 parts by mass.
- the resin composition of the present embodiment preferably contains a curing accelerator in order to appropriately adjust the curing rate, if necessary.
- a curing accelerator those generally used as a curing accelerator such as a cyanide ester compound can be used.
- the curing accelerator include organic metal salts such as zinc octylate, zinc naphthate, cobalt naphthenate, copper naphthate, iron acetylacetone, nickel octylate, and manganese octylate; phenol, xylenol, cresol, resorcin, and catechol.
- Octylphenol and phenolic compounds such as nonylphenol; alcohols such as 1-butanol and 2-ethylhexanol; 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-phenyl Imidazoles such as imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole and their imidazoles.
- alcohols such as 1-butanol and 2-ethylhexanol
- 2-methylimidazole 2-ethyl-4-methylimidazole
- 2-phenylimidazole 2-phenylimidazole
- 1-cyanoethyl-2-phenyl Imidazoles such as imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole
- carboxylic acids or adducts thereof dicyandiamide, benzyldimethylamine, and amines such as 4-methyl-N, N-dimethylbenzylamine; phosphine compounds, phosphine oxide compounds, phosphonium salts Compounds and phosphorus compounds such as diphosphine compounds; epoxy-imidazole adduct compounds; benzoyl peroxide, p-chlorobenzoyl peroxide, di-t-butyl peroxide, diisopropyl peroxycarbonate, and di-2-ethylhexylper.
- Peroxides such as oxycarbonate; azo compounds such as 2,2'-azobisisobutyronitrile (hereinafter, also referred to as "AIBN") can be mentioned.
- these curing accelerators can be used alone or in admixture of two or more.
- the content of the curing accelerator is usually 0 with respect to a total of 100 parts by mass of the bismaleimide compound (A), the resin or the compound (B) and the photocuring initiator (C). . 1 to 20 parts by mass.
- the resin composition of the present embodiment may contain an organic solvent, if necessary.
- an organic solvent When an organic solvent is used, the viscosity of the resin composition at the time of preparation can be adjusted.
- the type of the organic solvent is not particularly limited as long as it can dissolve a part or all of the resin in the resin composition.
- the organic solvent include ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; alicyclic ketones such as cyclopentanone and cyclohexanone; cellosolve solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.
- Ester solvents such as ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, isoamyl acetate, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, and ⁇ -butyrolactone; amides such as dimethylacetamide and dimethylformamide.
- Polar solvents Non-polar solvents such as toluene and aromatic hydrocarbons such as xylene. These organic solvents may be used alone or in admixture of two or more.
- the resin composition of the present embodiment contains various high molecular weight resins such as thermosetting resins, thermoplastic resins, and oligomers thereof, which have not been mentioned so far, as long as the characteristics of the present embodiment are not impaired.
- Molecular compounds; flame-retardant compounds not listed so far; additives and the like can be used in combination. These are not particularly limited as long as they are generally used.
- flame-retardant compounds include nitrogen-containing compounds such as melamine and benzoguanamine, oxazine ring-containing compounds, phosphate compounds of phosphorus compounds, aromatic condensed phosphoric acid esters, halogen-containing condensed phosphoric acid esters, and the like.
- Additives include UV absorbers, antioxidants, optical brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, defoamers, surface conditioners, brighteners, polymerization inhibitors, heat cures.
- accelerators include accelerators. These components may be used alone or in admixture of two or more. In the resin composition of the present embodiment, the content of the other components is usually 100 parts by mass in total of the bismaleimide compound (A), the resin or the compound (B) and the photocuring initiator (C), respectively. It is 0.1 to 10 parts by mass.
- the resin composition of the present embodiment contains a bismaleimide compound (A), a resin or a compound (B), a photocuring initiator (C), and if necessary, a filler (D), another resin, and other compounds. , And additives and the like are appropriately mixed to prepare the mixture.
- the resin composition can be suitably used as a varnish for producing the resin sheet of the present embodiment described later.
- the organic solvent used for preparing the varnish is not particularly limited, and specific examples thereof are as described above.
- Examples of the method for producing the resin composition include a method in which each of the above-mentioned components is sequentially mixed with a solvent and sufficiently stirred.
- the resin composition is excellent in photocurability, and the cured product obtained from the resin composition is excellent in heat resistance, thermal stability, and insulation reliability.
- a known treatment for uniformly dissolving or dispersing each component can be performed.
- the dispersibility of each component in the resin composition can be improved by performing the stirring and dispersing treatment using a stirring tank equipped with a stirring machine having an appropriate stirring ability.
- a stirring device for dispersing an ultrasonic homogenizer for example, a stirring device for dispersing an ultrasonic homogenizer, a device for mixing three rolls, a ball mill, a bead mill, a sand mill, etc., and a revolving or rotating type mixing device. It can be carried out as appropriate using a known device such as.
- an organic solvent can be used if necessary.
- the type of the organic solvent is not particularly limited as long as it can dissolve the resin in the resin composition, and specific examples thereof are as described above.
- the resin composition can be suitably used as a varnish when producing the resin sheet of the present embodiment described later.
- the varnish can be obtained by a known method. For example, in the varnish, 10 to 900 parts by mass of an organic solvent is added to 100 parts by mass of the component excluding the organic solvent in the resin composition of the present embodiment, and the above-mentioned known mixing treatment (stirring, kneading treatment, etc.) is performed. Can be obtained by doing.
- the resin composition can be preferably used in applications where an insulating and reliable resin composition is required.
- Applications include, for example, photosensitive films, photosensitive films with supports, prepregs, resin sheets, circuit boards (laminated board applications, multilayer printed wiring board applications, etc.), solder resists, underfill materials, die bonding materials, semiconductor seals. It can be used as a stop material, a hole filling resin, a component filling resin, and the like.
- the resin composition is excellent in photocurability, heat resistance and thermal stability, and therefore can be suitably used for an insulating layer of a multilayer printed wiring board or for a solder resist.
- the cured product is obtained by curing the resin composition of the present embodiment.
- the cured product can be obtained, for example, by melting or dissolving the resin composition in a solvent, pouring it into a mold, and curing it under normal conditions using light.
- the wavelength region of light is preferably cured in the range of 100 to 500 nm, which is efficiently cured by a photopolymerization initiator or the like.
- the resin sheet of the present embodiment is a resin sheet with a support having a support and resin layers arranged on one side or both sides of the support, and the resin layer contains a resin composition.
- the resin sheet can be produced by applying the resin composition on the support and drying it.
- the resin layer in the resin sheet has excellent heat resistance, thermal stability and insulation reliability.
- a known support can be used, but a resin film is preferable.
- the resin film include polyimide film, polyamide film, polyester film, polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polypropylene (PP) film, polyethylene (PE) film, polyethylene naphthalate film, and polyvinyl alcohol.
- PET film is preferable.
- the resin film is preferably coated with a release agent on the surface in order to facilitate peeling from the resin layer.
- the thickness of the resin film is preferably in the range of 5 to 100 ⁇ m, and more preferably in the range of 10 to 50 ⁇ m. If the thickness is less than 5 ⁇ m, the support tends to be torn easily when the support is peeled off before development, and if the thickness exceeds 100 ⁇ m, the resolution when exposed from above the support tends to decrease. is there.
- the resin film has excellent transparency.
- the resin layer may be protected by a protective film.
- a protective film By protecting the resin layer side with a protective film, it is possible to prevent dust and the like from adhering to the surface of the resin layer and scratches.
- the protective film a film made of the same material as the resin film can be used.
- the thickness of the protective film is preferably in the range of 1 to 50 ⁇ m, more preferably in the range of 5 to 40 ⁇ m. If the thickness is less than 1 ⁇ m, the handleability of the protective film tends to decrease, and if it exceeds 50 ⁇ m, the cost tends to be inferior.
- the protective film preferably has a smaller adhesive force between the resin layer and the protective film than the adhesive force between the resin layer and the support.
- the method for producing a resin sheet of the present embodiment is, for example, a method of producing a resin sheet by applying the resin composition of the present embodiment to a support such as a PET film and drying it to remove an organic solvent. And so on.
- the coating method can be performed by a known method using, for example, a roll coater, a comma coater, a gravure coater, a die coater, a bar coater, a lip coater, a knife coater, a squeeze coater, or the like. Drying can be performed, for example, by heating in a dryer at 60 to 200 ° C. for 1 to 60 minutes.
- the amount of the organic solvent remaining in the resin layer is preferably 5% by mass or less with respect to the total mass of the resin layer from the viewpoint of preventing the diffusion of the organic solvent in a later step.
- the thickness of the resin layer is preferably 1 to 50 ⁇ m from the viewpoint of improving handleability.
- the resin sheet can be preferably used for manufacturing an insulating layer of a multilayer printed wiring board.
- the multilayer printed wiring board of the present embodiment has an insulating layer and a conductor layer formed on one side or both sides of the insulating layer, and the insulating layer contains a resin composition.
- the insulating layer can also be obtained, for example, by stacking one or more resin sheets and curing them.
- the number of layers of the insulating layer and the conductor layer is not particularly limited, and the number of layers can be appropriately set according to the intended use. Further, the order of the insulating layer and the conductor layer is not particularly limited.
- the conductor layer may be a metal foil used for various printed wiring board materials, and examples thereof include metal foils such as copper and aluminum. Examples of the copper metal foil include rolled copper foil and copper foil such as electrolytic copper foil.
- the thickness of the conductor layer is usually 1 to 100 ⁇ m. Specifically, it can be produced by the following method.
- the resin layer side of the resin sheet is laminated on one side or both sides of the circuit board using a vacuum laminator.
- the circuit board include a glass epoxy board, a metal substrate, a ceramic substrate, a silicon substrate, a semiconductor encapsulating resin substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate.
- the circuit board refers to a board on which a patterned conductor layer (circuit) is formed on one side or both sides of the board.
- a circuit board is also a circuit board in which one or both sides of the outermost layer of the multi-layer printed wiring board is a patterned conductor layer (circuit).
- the insulating layer laminated on the multilayer printed wiring board may be an insulating layer obtained by stacking one or more resin sheets of the present embodiment and curing the resin sheet of the present embodiment.
- the insulating layer may be obtained by stacking one or more of the resin sheet of the present embodiment and a known resin sheet different from the resin sheet of the present embodiment.
- the method of stacking the resin sheet of the present embodiment and a known resin sheet different from the resin sheet of the present embodiment is not particularly limited.
- the surface of the conductor layer may be roughened in advance by blackening treatment and / or copper etching or the like.
- the protective film is peeled off and removed, and then the resin sheet and the circuit board are preheated as necessary, and the resin layer of the resin sheet is pressurized and heated. While crimping to the circuit board.
- a method of laminating a resin layer of a resin sheet on a circuit board under reduced pressure by a vacuum laminating method is preferably used.
- the conditions of the laminating process are, for example, a crimping temperature (lamination temperature) of 50 to 140 ° C., a crimping pressure of 1 to 15 kgf / cm 2 , a crimping time of 5 to 300 seconds, and an air pressure of 20 mmHg or less under reduced pressure. It is preferable to laminate. Further, the laminating step may be a batch type or a continuous type using a roll.
- the vacuum laminating method can be performed using a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a 2-stage build-up laminator (trade name) manufactured by Nikko Materials Co., Ltd.
- a predetermined portion of the resin layer is irradiated with active energy rays as a light source to cure the resin layer of the irradiated portion.
- Irradiation may be performed through a mask pattern, or a direct drawing method of direct irradiation may be used.
- the active energy ray include ultraviolet rays, visible rays, electron beams, X-rays and the like.
- the wavelength of the active energy ray is, for example, in the range of 200 to 600 nm. When ultraviolet rays are used, the irradiation amount is about 10 to 1000 mJ / cm 2 .
- an active energy ray having a wavelength of 365 nm (i-line) is used as the active energy ray.
- the irradiation amount thereof is approximately 10 to 10,000 mJ / cm 2 .
- an active energy ray containing a wavelength of 405 nm (h line) is used as the active energy ray.
- the exposure method through which the mask pattern is passed includes a contact exposure method in which the mask pattern is brought into close contact with a multilayer printed wiring board and a non-contact exposure method in which the mask pattern is exposed using parallel light rays without being brought into close contact with each other. It doesn't matter.
- the support is present on the resin layer, it may be exposed from above the support, or the support may be exposed after peeling.
- a developing step may be included, if necessary. That is, when the support is not present on the resin layer, the pattern of the insulating layer is formed by removing the non-photocured portion (unexposed portion) by wet development after the exposure step and developing the resin layer. Can be formed. When a support is present on the resin layer, the support is removed after the exposure step, and then the non-photocured portion (unexposed portion) is removed by wet development and developed. Thereby, the pattern of the insulating layer can be formed.
- the developing solution is not particularly limited as long as it selectively elutes the unexposed portion.
- organic solvents such as cyclohexanone, cyclopentanone, and ⁇ -butyrolactone
- alkaline developing solutions such as tetramethylammonium hydroxide aqueous solution, sodium carbonate aqueous solution, potassium carbonate aqueous solution, sodium hydroxide aqueous solution, and potassium hydroxide aqueous solution are used. ..
- These developers can be used alone or in admixture of two or more.
- a developing method for example, a known method such as dipping, paddle, spraying, rocking dipping, brushing, scraping, etc. can be performed. In pattern formation, these developing methods may be used in combination, if necessary. Further, as a developing method, it is preferable to use a high-pressure spray because the resolution is further improved. When the spray method is adopted, the spray pressure is preferably 0.02 to 0.5 MPa.
- a post-baking process is performed to form an insulating layer (cured product).
- the post-baking step include an ultraviolet irradiation step using a high-pressure mercury lamp and a heating step using a clean oven, and these can be used in combination.
- the irradiation amount can be adjusted as needed, and for example, irradiation can be performed at an irradiation amount of about 50 to 10,000 mJ / cm 2 .
- the heating conditions can be appropriately selected as needed, but are preferably selected in the range of 150 to 220 ° C. for 20 to 180 minutes, and more preferably in the range of 160 to 200 ° C. for 30 to 150 minutes.
- a conductor layer is formed on the surface of the insulating layer by dry plating.
- dry plating known methods such as a thin film deposition method, a sputtering method, and an ion plating method can be used.
- a metal film can be formed on an insulating layer by placing a multilayer printed wiring board in a vacuum vessel and heating and evaporating the metal.
- a multilayer printed wiring board is placed in a vacuum vessel, an inert gas such as argon is introduced, a DC voltage is applied, and the ionized inert gas collides with the target metal and is beaten out.
- a metal film can be formed on the insulating layer by the metal.
- a conductor layer is formed by electroless plating or electrolytic plating.
- a subsequent pattern forming method for example, a subtractive method, a semi-additive method, or the like can be used.
- the semiconductor device of this embodiment includes a resin composition. Specifically, it can be produced by the following method.
- a semiconductor device can be manufactured by mounting a semiconductor chip on a conductive portion of a multilayer printed wiring board.
- the conductive portion is a portion of the multilayer printed wiring board that transmits an electric signal, and the location may be a surface or an embedded portion.
- the semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.
- the mounting method of the semiconductor chip when manufacturing the semiconductor device is not particularly limited as long as the semiconductor chip functions effectively. Specifically, a wire bonding mounting method, a flip chip mounting method, a bumpless build-up layer (BBUL) mounting method, an anisotropic conductive film (ACF) mounting method, and a non-conductive film (NCF) mounting method. And so on.
- a semiconductor device can also be manufactured by forming an insulating layer containing a resin composition on a semiconductor chip or a substrate on which the semiconductor chip is mounted.
- the shape of the substrate on which the semiconductor chip is mounted may be a wafer shape or a panel shape. After the formation, it can be manufactured by the same method as that of the multilayer printed wiring board.
- MIZ-001 (trade name, mass average molecular weight (Mw): 3000) manufactured by Nippon Kayaku Co., Ltd. is used as the bismaleimide compound (A), and this MIZ-001 (trade name) is contained in 1% by mass.
- a chloroform solution was prepared, and the transmittances at wavelengths of 365 nm and 405 nm were measured using a UV-vis measuring device (Hitachi spectrophotometer U-4100 (trade name) manufactured by Hitachi High-Technologies Corporation). ..
- Pd-type benzoxazine manufactured by Shikoku Kasei Kogyo Co., Ltd., 3,3'-(methylene-1,4-diphenylene) bis (3,4-dihydro-2H-) 1,3-benzoxazine), benzoxazine compound
- propylene glycol monomethyl ether acetate of TrisP-PA epoxy acrylate compound (KAYARAD® ZCR-6007H (trade name) manufactured by Nippon Kayaku Co., Ltd., ethylenically unsaturated Using a machine-equipped compound
- epoxy resin NC-3000FH (trade name) manufactured by Nippon Kayaku Co., Ltd.
- carbodiimide compound carbodilite B-01 (trade name) manufactured by Nisshinbo Chemical Co., Ltd.
- Example 1 (Preparation of resin composition and resin sheet) ⁇ -naphthol obtained in Synthesis Example 1 in which MIZ-001 (trade name) is 47.5 parts by mass as the bismaleimide compound (A) and the cyanate ester compound (B2) is the resin or compound (B).
- aralkyl type cyanate ester resin SNCN
- Example 2 As the resin or compound (B), Pd-type benzoxazine (Shikoku Kasei Kogyo Co., Ltd.), which is a benzoxazine compound (B3), is used instead of 47.5 parts by mass of ⁇ -naphthol aralkyl type cyanate resin (SNCN). , 3,3'-(methylene-1,4-diphenylene) bis (3,4-dihydro-2H-1,3-benzoxazine)) using 47.5 parts by mass and 2-ethyl as a curing accelerator.
- a resin sheet was obtained in the same manner as in Example 1 except that -4-methylimidazole (2E4MZ) was not blended. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 3 As the resin or compound (B), propylene of TrisP-PA epoxy acrylate compound which is a compound (B6) having an ethylenically unsaturated group instead of 47.5 parts by mass of ⁇ -naphthol aralkyl type cyanate resin (SNCN).
- SNCN ⁇ -naphthol aralkyl type cyanate resin
- AIBN 2,2'-azobis (isobutyronitrile)
- Example 4 As the bismaleimide compound (A), MIZ-001 (trade name) is 94 parts by mass, and the resin or compound (B) is an epoxy resin (B4), which is an epoxy resin represented by the formula (23).
- NC-3000FH (trade name) manufactured by NC Co., Ltd. and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (Omnirad (registered trademark) 819 (trade name)) as a photoinitiator (C). ) was obtained in the same manner as in Example 1. Using 5 parts by mass, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 5 As the resin or compound (B), instead of 47.5 parts by mass of ⁇ -naphthol aralkyl type cyanate ester resin (SNCN), carbodiimide compound (B5), carbodilite B-01 (trade name, manufactured by Nisshinbo Chemical Co., Ltd.) ) 47.5 parts by mass was used, and a resin sheet was obtained in the same manner as in Example 1 except that 2-ethyl-4-methylimidazole (2E4MZ), which is a curing accelerator, was not blended. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- 2-ethyl-4-methylimidazole (2E4MZ 2-ethyl-4-methylimidazole
- Example 6 As the photoinitiator (C), 2-benzyl-2-instead of 5 parts by mass of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (Omnirad (registered trademark) 819 (trade name)) A resin sheet was obtained in the same manner as in Example 1 except that 5 parts by mass of dimethylamino-1- (4-morpholinophenyl) -butanone-1 (Omnirad (registered trademark) 369 (trade name)) was used. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 7 As the photoinitiator (C), 2-methyl-1- instead of 5 parts by mass of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (Omnirad (registered trademark) 819 (trade name)) A resin sheet was obtained in the same manner as in Example 1 except that 5 parts by mass of [4- (methylthio) phenyl] -2-morpholinopropane-1-one (Omnirad (registered trademark) 907 (trade name)) was used. It was. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 8 As the bismaleimide compound (A), MIZ-001 (trade name) 45.5 parts by mass was changed to 94.9 parts by mass, and as a resin or compound, ⁇ -naphthol aralkyl type cyanate ester resin (SNCN) 47.5. A resin sheet was obtained in the same manner as in Example 1 except that the parts by mass was changed to 0.1 parts by mass. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- SNCN ⁇ -naphthol aralkyl type cyanate ester resin
- Example 9 As the bismaleimide compound (A), MIZ-001 (trade name) 45.5 parts by mass was changed to 94 parts by mass, and as the resin or compound (B), ⁇ -naphthol aralkyl type cyanate ester resin (SNCN) 47. A resin sheet was obtained in the same manner as in Example 1 except that 5 parts by mass was changed to 1 part by mass. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 10 MIZ-001 (trade name) 45.5 parts by mass was changed to 85.5 parts by mass as the bismaleimide compound (A), and ⁇ -naphthol aralkyl type cyanate ester resin (SNCN) was used as the resin or compound (B).
- a resin sheet was obtained in the same manner as in Example 1 except that 47.5 parts by mass was changed to 9.5 parts by mass. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Example 11 As the bismaleimide compound (A), MIZ-001 (trade name) 45.5 parts by mass was changed to 19 parts by mass, and as the resin or compound (B), ⁇ -naphthol aralkyl type cyanate ester resin (SNCN) 47. A resin sheet was obtained in the same manner as in Example 1 except that 5 parts by mass was changed to 76 parts by mass. Using this, a resin for evaluation was obtained in the same manner as in Example 1.
- Photo DSC (TA Instruments Japan Co., Ltd.) equipped with a light source (Omnicure (registered trademark) S2000 (trade name) manufactured by Uvics Co., Ltd.) capable of irradiating active energy rays with a wavelength of 200 to 600 nm.
- a light source Omnicure (registered trademark) S2000 (trade name) manufactured by Uvics Co., Ltd.
- DSC-2500 (trade name) manufactured by DSC-2500, the obtained evaluation resin is irradiated with an active energy ray containing a wavelength of 200 to 600 nm at an illuminance of 30 mW and an exposure time of 3.5 minutes, and the horizontal axis is time (sec). ), The vertical axis is the heat flow (mW) graph.
- a wavelength 365 nm (i-line) filter or a wavelength 405 nm (h-line) filter is used to generate an active energy ray containing a wavelength of 365 nm (i-line) or an active energy ray containing a wavelength of 405 nm (h-line).
- graphs of time (sec) on the horizontal axis and heat flow (mW) on the vertical axis were obtained except that they were used.
- the peak area when a horizontal line was drawn from the end point of the graph was defined as enthalpy (J / g). Curability was evaluated according to the following criteria.
- AA The enthalpy was 20 (J / g) or more.
- BB The enthalpy was 1 (J / g) or more and less than 20 (J / g).
- CC Enthalpy was less than 1 (J / g).
- the enthalpy of 1 (J / g) or more means that the resin is sufficiently cured by exposure at a predetermined wavelength.
- the evaluation resin cured in the photocurability test was further subjected to a post-baking step of heat-treating at 180 ° C. and 120 minutes, and then the supports on both sides were peeled off to obtain a cured product for evaluation. ..
- the mass was measured at the target temperature (500 ° C.) under a nitrogen atmosphere.
- the temperature at which the mass reduction rate was 5% was evaluated as thermal stability (° C.).
- the resin composition of the present embodiment contains an active energy ray containing a wavelength of 365 nm (i line), an active energy ray containing a 405 nm (h line), and an activity containing a wavelength of 200 to 600 nm. When exposed to any of the energy rays, it is well exposed and photocurable. Further, according to the resin composition of the present embodiment, as shown in Tables 2 and 3, it can be seen that a cured product having an excellent balance of heat resistance, thermal stability and insulation reliability can be obtained.
- the resin composition of the present embodiment is industrially useful because it has excellent photocurability and can obtain a cured product having a good balance of heat resistance, thermal stability and insulation reliability.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
例えば、特許文献1には、ビスフェノール型エポキシ樹脂と(メタ)アクリル酸とを反応させた後、酸無水物を反応させて得られるカルボキシル変性エポキシ(メタ)アクリレート樹脂と、ビフェニル型エポキシ樹脂と、光硬化開始剤と、希釈剤とを含む感光性熱硬化型樹脂組成物が記載されている。
[1]下記式(1)で表される構成単位と、分子鎖の両末端にマレイミド基と、を含む、ビスマレイミド化合物(A)と、
前記ビスマレイミド化合物(A)以外のマレイミド化合物、シアン酸エステル化合物、ベンゾオキサジン化合物、エポキシ樹脂、カルボジイミド化合物、及びエチレン性不飽和基を有する化合物からなる群より選択される少なくとも1種以上の樹脂又は化合物(B)と、
光硬化開始剤(C)と、を含む、樹脂組成物。
[4]前記樹脂層の厚さが1~50μmである、[3]に記載の樹脂シート。
[5]絶縁層と、前記絶縁層の片面又は両面に形成された導体層と、を有し、前記絶縁層が、[1]又は[2]に記載の樹脂組成物を含む、多層プリント配線板。
[6][1]又は[2]に記載の樹脂組成物を含む、半導体装置。
本実施形態の樹脂組成物は、特定のビスマレイミド化合物(A)(「成分(A)」とも称す)と、ビスマレイミド化合物(A)以外のマレイミド化合物、シアン酸エステル化合物、ベンゾオキサジン化合物、エポキシ樹脂、カルボジイミド化合物、及びエチレン性不飽和基を有する化合物からなる群より選択される少なくとも1種以上の樹脂又は化合物(B)(「成分(B)」、又は「樹脂又は化合物(B)」とも称す)と、光硬化開始剤(C)(「成分(C)」とも称す)と、を含む。以下、各成分について説明する。
樹脂組成物は、ビスマレイミド化合物(A)(成分(A)とも称す)を含む。ビスマレイミド化合物(A)は、式(1)で表される構成単位と、分子鎖の両末端にマレイミド基と、を含む。
一方、ビスマレイミド化合物(A)は、光硬化しても剛直なイミド環を有することから、高い耐熱性及び熱安定性を有するが、ビスマレイミド化合物を光硬化した硬化物を、露光工程終了後、又は現像工程終了後に行うポストベーク工程などにおいて加熱により更に硬化する際にシワが生じる。そのため、ビスマレイミド化合物(A)を単独重合して得られる硬化物は、多層プリント配線板の用途には不適である。しかし、ビスマレイミド化合物(A)を、後述の樹脂又は化合物(B)と光硬化開始剤(C)と共に配合することで、優れた光硬化性及び絶縁信頼性を有しながら、より高い耐熱性及び熱安定性を有する。それゆえ、本実施形態の樹脂組成物から得られる硬化物は、耐熱性、熱安定性、及び絶縁信頼性に優れ、本実施形態によれば、多層プリント配線板及び半導体装置における、保護膜、及び絶縁層を好適に形成することができる。
ビスマレイミド化合物(A)の式(1)中、R1は、炭素数1~16の直鎖状若しくは分岐状のアルキレン基、又は炭素数2~16の直鎖状若しくは分岐状のアルケニレン基を示す。R1としては、好適な粘度が得られ、ワニスの粘度上昇が制御できる点から、直鎖状若しくは分岐状のアルキレン基であることが好ましく、直鎖状のアルキレン基であることがより好ましい。
アルキレン基の炭素数としては、より好適な粘度が得られ、ワニスの粘度上昇をより制御できる点から、2~14であることが好ましく、4~12であることがより好ましい。
直鎖状若しくは分岐状のアルキレン基としては、例えば、メチレン基、エチレン基、プロピレン基、2,2-ジメチルプロピレン基、ブチレン基、ペンチレン基、ヘキシレン基、ヘプチレン基、オクチレン基、ノニレン基、デシレン基、ドデシレン基、ウンデシレン基、トリデシレン基、テトラデシレン基、ペンタデシレン基、ヘキサデシレン基、ネオペンチレン基、ジメチルブチレン基、メチルヘキシレン基、エチルヘキシレン基、ジメチルヘキシレン基、トリメチルヘキシレン基、メチルヘプチレン基、ジメチルヘプチレン基、トリメチルヘプチレン基、テトラメチルヘプチレン基、エチルヘプチレン基、メチルオクチレン基、メチルノニレン基、メチルデシレン基、メチルドデシレン基、メチルウンデシレン基、メチルトリデシレン基、メチルテトラデシレン基、及びメチルペンタデシレン基、が挙げられる。
アルケニレン基の炭素数としては、より好適な粘度が得られ、ワニスの粘度上昇をより制御できる点から、2~14であることが好ましく、4~12であることがより好ましい。
直鎖状若しくは分岐状のアルケニレン基としては、例えば、ビニレン基、1-メチルビニレン基、アリレン基、プロペニレン基、イソプロペニレン基、1-ブテニレン基、2-ブテニレン基、1-ペンテニレン基、2-ペンテニレン基、イソペンチレン基、シクロペンテニレン基、シクロヘキセニレン基、及びジシクロペンタジエニレン基等が挙げられる。
直鎖状若しくは分岐状のアルキレン基としては、R1が参照できる。
直鎖状若しくは分岐状のアルケニレン基としては、R1が参照できる。
アルキル基の炭素数としては、より好適な粘度が得られ、ワニスの粘度上昇がより制御できる点から、2~14であることが好ましく、4~12であることがより好ましい。
直鎖状若しくは分岐状のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、1-エチルプロピル基、n-ブチル基、2-ブチル基、イソブチル基、tert-ブチル基、n-ペンチル基、2-ペンチル基、tert-ペンチル基、2-メチルブチル基、3-メチルブチル基、2,2-ジメチルプロピル基、n-ヘキシル基、2-ヘキシル基、3-ヘキシル基、n-へプチル基、n-オクチル基、2-メチルペンチル基、3-メチルペンチル基、4-メチルペンチル基、2-メチルペンタン-3-イル基、及びn-ノニル基が挙げられる。
アルケニル基の炭素数としては、より好適な粘度が得られ、ワニスの粘度上昇がより制御できる点から、2~14であることが好ましく、4~12であることがより好ましい。
直鎖状若しくは分岐状のアルケニル基としては、例えば、ビニル基、アリル基、4-ペンテニル基、イソプロペニル基、イソペンテニル基、2-ヘプテニル基、2-オクテニル基、及び2-ノネニル基が挙げられる。
本実施形態において、マレイミド基は、式(4)で表され、N原子がビスマレイミド化合物(A)の分子鎖に結合している。また、ビスマレイミド化合物(A)に結合されるマレイミド基は、全て同一であっても異なっていてもよいが、分子鎖の両末端のマレイミド基は同一であることが好ましい。
アルキル基の炭素数としては、好適に光硬化する点から、1~3であることが好ましく、1~2であることがより好ましい。
直鎖状若しくは分岐状のアルキル基としては、R3が参照できる。
ビスマレイミド化合物(A)は、公知の方法により製造することができる。例えば、1,2,4,5-シクロヘキサンテトラカルボン酸二無水物と、ダイマージアミン等を含むジアミンを含むモノマーと、無水マレイミド酸等のマレイミド化合物とを、通常80~250℃程度、好ましくは100~200℃程度の温度において、通常0.5~50時間程度、好ましくは1~20時間程度、重付加反応させて重付加物を得る、その後、通常60~120℃程度、好ましくは80~100℃程度の温度において、通常0.1~2時間程度、好ましくは0.1~0.5時間程度、重付加物をイミド化反応、すなわち、脱水閉環反応させることで、ビスマレイミド化合物(A)を得ることができる。
1,2,4,5-シクロヘキサンテトラカルボン酸二無水物のモル数と、ジアミンを含むモノマー及びマレイミド化合物との全量のモル数とを調製することで、任意のビスマレイミド化合物(A)を得ることができる。
触媒の添加量は、例えば、イミド化剤を、アミド基に対して、0.5~5.0倍モル当量程度、脱水触媒を、アミド基に対して、0.5~10.0倍モル当量とすることが好ましい。
本実施形態の樹脂組成物には、ビスマレイミド化合物(A)以外のマレイミド化合物、シアン酸エステル化合物、ベンゾオキサジン化合物、エポキシ樹脂、カルボジイミド化合物、及びエチレン性不飽和基を有する化合物からなる群より選択される少なくとも1種以上の樹脂又は化合物(B)(成分(B)とも称す)を含む。これらの樹脂又は化合物(B)は、得られる硬化物の物性及び用途に応じて、1種単独又は2種以上を適宜混合して使用することも可能である。
本実施形態において、ビスマレイミド化合物(A)及び後述の光硬化開始剤と共に、樹脂又は化合物(B)を用いると、光硬化性、耐熱性及び熱安定性に優れる。この理由は定かではないが、本発明者らは、ビスマレイミド化合物(A)が有する光硬化性及び絶縁信頼性と、樹脂又は化合物(B)が有する耐熱性及び熱安定性とを両立することが可能であるためと推定している。また、得られる硬化物には、ビスマレイミド化合物(A)と、樹脂又は化合物(B)とが有する種々の物性を付与することも可能となる。ビスマレイミド化合物(A)は、光透過性に非常に優れるため、樹脂又は化合物(B)を用いても、光硬化開始剤まで十分に光が届き、マレイミドの光ラジカル反応が効率的に起き、種々の活性エネルギー線を用いて光硬化させることができる。そのため、例えば、波長365nmを含む活性エネルギー線、又は405nmを含む活性エネルギー線を用いても、光が光硬化開始剤まで十分に届き、光硬化開始剤から発生したラジカルを用いたラジカル反応が進行し、樹脂又は化合物(B)が配合されている組成物においても光硬化が可能となる。
本実施形態において、樹脂又は化合物(B)は、それぞれ、1質量%で含まれるN-メチルピロリドン溶液を調製し、波長365nm(i線)を含む活性エネルギー線を用いて、カルボキシ基を1つ以上含む化合物(B)が1質量%で含まれるN-メチルピロリドン溶液の透過率を測定した場合においては、その透過率は5%以上であることが好ましい。このような樹脂又は化合物(B)は、非常に優れた光透過性を示す。また、波長405nm(h線)を含む活性エネルギー線を用いて、それぞれ、樹脂又は化合物(B)が1質量%で含まれるN-メチルピロリドン溶液の透過率を測定した場合においては、その透過率が5%以上であることが好ましく、この場合においても非常に優れた光透過性を示す。このような樹脂又は化合物(B)を用いると、例えば、直接描画露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際し、波長405nm(h線)を含む活性エネルギー線を用いた場合でも、マレイミドの光ラジカル反応が効率的に起こる。なお、波長365nm(i線)における透過率は、光硬化性により優れる樹脂組成物を得ることができることから、8%以上であることがより好ましく、10%以上であることが更に好ましい。波長405nm(h線)における透過率は、光硬化性により優れる樹脂組成物を得ることができることから、8%以上であることがより好ましく、10%以上であることが更に好ましい。なお、波長365nm(i線)における透過率、及び波長405nm(h線)における透過率において、それぞれの上限は、例えば、99.9%以下である。
樹脂組成物には、ビスマレイミド化合物(A)以外のマレイミド化合物(B1)(成分(B1)とも称す)を用いることができる。以下にマレイミド化合物(B1)について述べる。
また、ビスマレイミド化合物(A)の光ラジカル反応を効率的に起こさせるために、マレイミド化合物(B1)が1質量%で含まれるクロロホルム溶液を調製し、波長405nm(h線)を含む活性エネルギー線を用いてこのクロロホルム溶液の透過率を測定した場合に、透過率が5%以上の光透過性を示すことが好ましい。このようなマレイミド化合物(B1)を用いることで、例えば、直接描画露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際し、波長405nm(h線)を含む活性エネルギー線を用いた場合でも、マレイミドの光ラジカル反応が効率的に起こる。光透過率は、光硬化性により優れる樹脂組成物を得ることができることから、8%以上であることがより好ましく、10%以上であることが更に好ましい。
式(9)中、yの数は、10~35である。
アルキル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
アルケニル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
直鎖状若しくは分岐状のアルケニル基としては、ビスマレイミド化合物(A)におけるR3が参照できる。これらの中でも、優れた光硬化性を示すことから、2-ヘプテニル基、2-オクテニル基、2-ノネニル基が好ましく、2-オクテニル基がより好ましい。
アルキル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
アルケニル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
アルケニル基の具体例としては、Raにおけるアルケニル基を参照できる。この中でも、優れた光硬化性を示すことから、2-ヘプテニル基、2-オクテニル基、2-ノネニル基が好ましく、2-オクテニル基がより好ましい。
式(8)で表されるマレイミド化合物としては、例えば、ケイ・アイ化成(株)製BMI-1000P(商品名、式(8)中のn3=13.6(平均))、ケイ・アイ化成(株)社製BMI-650P(商品名、式(8)中のn3=8.8(平均))、ケイ・アイ化成(株)社製BMI-250P(商品名、式(8)中のn3=3~8(平均))、ケイ・アイ化成(株)社製CUA-4(商品名、式(8)中のn3=1)等が挙げられる。
式(9)で表されるマレイミド化合物としては、例えば、Designer Molecules Inc.製BMI-6100(商品名、式(9)中のx=18、y=18)等が挙げられる。
式(10)で表されるマレイミド化合物としては、例えば、Designer Molecules Inc.製BMI-689(商品名、式(16)、官能基当量:346g/eq.)等が挙げられる。
式(12)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、Designer Molecules Inc.(DMI)製BMI-1700(商品名)が挙げられる。
式(13)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、Designer Molecules Inc.(DMI)製BMI-3000(商品名)、Designer Molecules Inc.(DMI)製BMI-5000(商品名)、Designer Molecules Inc.(DMI)製BMI-9000(商品名)が挙げられる。
式(14)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、大和化成工業株式会社製BMI-TMH(商品名)が挙げられる。
式(15)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、ケイ・アイ化成(株)製BMI-70(商品名)が挙げられる。
これらのマレイミド化合物(B1)は、1種単独又は2種以上を適宜混合して使用することも可能である。
樹脂組成物には、シアン酸エステル化合物(B2)(成分(B2)とも称す)を用いることができる。以下にシアン酸エステル化合物(B2)について述べる。
シアン酸エステル化合物としては、シアナト基(シアン酸エステル基)が少なくとも1個置換された芳香族部分を分子内に有する樹脂であれば特に限定されない。
また、式(17)におけるアルキル基及びRaにおけるアリール基中の水素原子は、フッ素原子、塩素原子等のハロゲン原子、メトキシ基、フェノキシ基等のアルコキシル基、又はシアノ基等で置換されていてもよい。
アルケニル基の具体例としては、ビニル基、(メタ)アリル基、イソプロペニル基、1-プロペニル基、2-ブテニル基、3-ブテニル基、1,3-ブタンジエニル基、2-メチル-2-プロペニル、2-ペンテニル基、及び2-ヘキセニル基等が挙げられる。
アリール基の具体例としては、フェニル基、キシリル基、メシチル基、ナフチル基、フェノキシフェニル基、エチルフェニル基、o-,m-又はp-フルオロフェニル基、ジクロロフェニル基、ジシアノフェニル基、トリフルオロフェニル基、メトキシフェニル基、及びo-,m-又はp-トリル基等が挙げられる。更にアルコキシル基としては、例えば、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、及びtert-ブトキシ基等が挙げられる。
式(17)のXにおける窒素数1~10の2価の有機基としては、イミノ基、ポリイミド基等が挙げられる。
式(18)のAr2及び式(19)のAr3の具体例としては、式(18)に示す2個の炭素原子、又は式(19)に示す2個の酸素原子が、1,4位又は1,3位に結合するベンゼンジイル基、2個の炭素原子又は2個の酸素原子が4,4’位、2,4’位、2,2’位、2,3’位、3,3’位、又は3,4’位に結合するビフェニルジイル基、及び、2個の炭素原子又は2個の酸素原子が、2,6位、1,5位、1,6位、1,8位、1,3位、1,4位、又は2,7位に結合するナフタレンジイル基が挙げられる。
式(18)のRb、Rc、Rd、Re、Rf及びRg、並びに式(19)のRi、Rjにおけるアルキル基及びアリール基は、式(17)におけるものと同義である。
樹脂組成物には、ベンゾオキサジン化合物(B3)(成分(B3)とも称す)を用いることができる。以下にベンゾオキサジン化合物(B3)について述べる。
ベンゾオキサジン化合物(B3)としては、基本骨格としてオキサジン環を有していれば、一般に公知のものを用いることができる。ベンゾオキサジン化合物には、ナフトオキサジン化合物などの多環オキサジン骨格を有する化合物も含まれる。
ベンゾオキサジン化合物は、良好な耐熱性を有するとの理由から、式(20)で表される化合物、及び式(21)で表される化合物が好ましく、3,3’-(メチレン-1,4-ジフェニレン)ビス(3,4-ジヒドロ-2H-1,3-ベンゾオキサジンがより好ましい。
樹脂組成物には、エポキシ樹脂(B4)(成分(B4)とも称す)を用いることができる。以下にエポキシ樹脂(B4)について述べる。
エポキシ樹脂(B4)としては、一般に公知のものを使用できる。例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、キシレンノボラック型エポキシ樹脂、多官能フェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフタレン骨格変性ノボラック型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、アントラセン型エポキシ樹脂、3官能フェノール型エポキシ樹脂、4官能フェノール型エポキシ樹脂、トリグリシジルイソシアヌレート、グリシジルエステル型エポキシ樹脂、脂環式エポキシ樹脂、ジシクロペンタジエンノボラック型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂、フェノールアラルキルノボラック型エポキシ樹脂、ナフトールアラルキルノボラック型エポキシ樹脂、アラルキルノボラック型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ポリオール型エポキシ樹脂、リン含有エポキシ樹脂、グリシジルアミン、ブタジエン等の二重結合をエポキシ化した化合物、水酸基含有シリコーン樹脂類とエピクロルヒドリンとの反応により得られる化合物、及びこれらのハロゲン化物が挙げられる。これらのエポキシ樹脂は、1種単独又は2種以上を適宜混合して使用することも可能である。
エポキシ樹脂は、硬化物の耐熱性に優れるとの理由から、式(23)で表されるエポキシ樹脂、及び式(24)で表されるエポキシ樹脂が好ましく、式(23)で表されるエポキシ樹脂がより好ましい。
樹脂組成物には、カルボジイミド化合物(B5)(成分(B5)とも称す)を用いることができる。以下にカルボジイミド化合物(B5)について述べる。
カルボジイミド化合物(B5)としては、少なくとも分子中に1個以上のカルボジイミド基を有していれば、一般に公知のものを使用できる。例えば、N,N’-ジシクロヘキシルカルボジイミド、ジシクロヘキシルカルボジイミド、ジイソプロピルカルボジイミド、ジメチルカルボジイミド、ジイソブチルカルボジイミド、ジオクチルカルボジイミド、t-ブチルイソプロピルカルボジイミド、ジフェニルカルボジイミド、ジ-t-ブチルカルボジイミド、ジ-β-ナフチルカルボジイミド、N,N’-ジ-2,6-ジイソプロピルフェニルカルボジイミド、2,6,2’,6’-テトライソプロピルジフェニルカルボジイミド、環状カルボジイミド、カルボジライト(登録商標)B-01(日清紡ケミカル(株)製)、及びスタバクゾール(登録商標:Rhein Chemie社製)等のポリカルボジイミド等が挙げられる。
カルボジイミド化合物は、良好な耐熱性を有し、プリント配線板の絶縁層に用いた場合に導体層と良好な密着性を有するとの理由から、カルボジライト(登録商標)B-01、V-03、V05(以上、商品名、日清紡ケミカル(株)製)が好ましく、カルボジライト(登録商標)B-01(商品名、日清紡ケミカル(株)製)がより好ましい。
樹脂組成物には、エチレン性不飽和基を有する化合物(B6)(成分(B6)とも称す)を用いることができる。以下にエチレン性不飽和基を有する化合物(B6)について述べる。
エチレン性不飽和基を有する化合物(B6)としては、1分子中に1個以上のエチレン性不飽和基を有する化合物であれば、一般に公知のものを使用できる。例えば、(メタ)アクリロイル基、及びビニル基等を有する化合物が挙げられる。
エチレン性不飽和基を有する化合物としては、良好な熱安定性を有するとの理由から、TrisP-PAエポキシアクリレート化合物のプロピレングリコールモノメチルエーテルアセテートが好ましい。
本実施形態に係る樹脂組成物には、光硬化開始剤(C)(成分(C)とも称す)を含む。光硬化開始剤(C)は、一般に光硬化性樹脂組成物で用いられる分野で公知のものを使用することができる。光硬化開始剤(C)は、ビスマレイミド化合物(A)、及び樹脂又は化合物(B)と共に、種々の活性エネルギー線を用いて光硬化させるために用いられる。
p-メトキシフェニルジアゾニウムフロロホスホネート、及びN,N-ジエチルアミノフェニルジアゾニウムヘキサフロロホスホネート等のルイス酸のジアゾニウム塩;ジフェニルヨードニウムヘキサフロロホスホネート、及びジフェニルヨードニウムヘキサフロロアンチモネート等のルイス酸のヨードニウム塩;トリフェニルスルホニウムヘキサフロロホスホネート、及びトリフェニルスルホニウムヘキサフロロアンチモネート等のルイス酸のスルホニウム塩;トリフェニルホスホニウムヘキサフロロアンチモネート等のルイス酸のホスホニウム塩;その他のハロゲン化物;トリアジン系開始剤;ボーレート系開始剤;その他の光酸発生剤等のカチオン系光硬化開始剤が挙げられる。
これらの光硬化開始剤(C)は、1種単独又は2種以上を適宜混合して使用することも可能である。
式(3)中、R5は、各々独立に水素原子又はメチル基を表す。R5のうち、1つ以上がメチル基であることが好ましく、全てメチル基であることがより好ましい。
本実施形態の樹脂組成物には、塗膜性や耐熱性等の諸特性を向上させるために、充填材(D)(成分(D)とも称す)を含むこともできる。充填材(D)としては、絶縁性を有し、光硬化に用いる種々の活性エネルギー線に対する透過性を阻害しないものであることが好ましく、波長365nm(i線)、及び/又は波長405nm(h線)を含む活性エネルギー線に対する透過性を阻害しないものであることがより好ましい。
これらの充填材(D)は、後述のシランカップリング剤等で表面処理されていてもよい。
本実施形態の樹脂組成物には、充填材の分散性、ポリマー及び/又は樹脂と、充填材との接着強度を向上させるために、シランカップリング剤及び/又は湿潤分散剤を併用することができる。
これらのシランカップリング剤としては、一般に無機物の表面処理に使用されているシランカップリング剤であれば、限定されない。具体例としては、3-アミノプロピルトリメトキシシラン、γ-アミノプロピルトリエトキシシラン、3-アミノプロピルジメトキシメチルシラン、3-アミノプロピルジエトキシメチルシラン、N-β-(アミノエチル)-γ-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリエトキシシラン、N-(2-アミノエチル)-3-アミノプロピルジメトキシメチルシラン、N-(2-アミノエチル)-3-アミノプロピルジエトキシメチルシラン、 N-フェニル-3-アミノプロピルトリメトキシシラン、N-フェニル-3-アミノプロピルトリエトキシシラン、[3-(6-アミノヘキシルアミノ)プロピル]トリメトキシシラン、及び[3-(N,N-ジメチルアミノ)-プロピル]トリメトキシシラン等のアミノシラン系;γ-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、3-グリシドキシプロピルジメトキシメチルシラン、3-グリシドキシプロピルジエトキシメチルシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、及び[8-(グリシジルオキシ)-n-オクチル]トリメトキシシラン等のエポキシシラン系;ビニルトリス(2-メトキシエトキシ)シラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ジメトキシメチルビニルシラン、ジエトキシメチルビニルシラン、トリメトキシ(7-オクテン-1-イル)シラン、及びトリメトキシ(4-ビニルフェニル)シランなどのビニルシラン系;3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-メタクリロキシプロピルジメトキシメチルシラン、3-メタクリロキシプロピルジエトキシメチルシランなどのメタクリルシラン系、γ-アクリロキシプロピルトリメトキシシラン、及び3-アクリロキシプロピルトリエトキシシラン等の(メタ)アクリルシラン系;3-イソシアネートプロピルトリメトキシシラン、及び3-イソシアネートプロピルトリエトキシシランなどのイソシアネートシラン系;トリス-(トリメトキシシリルプロピル)イソシアヌレートなどのイソシアヌレートシラン系;3-メルカプトプロピルトリメトキシシラン、及び3-メルカプトプロピルジメトキシメチルシランなどのメルカプトシラン系;3-ウレイドプロピルトリエトキシシランなどのウレイドシラン系;p-スチリルトリメトキシシランなどのスチリルシラン系;N-β-(N-ビニルベンジルアミノエチル)-γ-アミノプロピルトリメトキシシラン塩酸塩等のカチオニックシラン系;[3-(トリメトキシシリル)プロピル]コハク酸無水物などの酸無水物系;フェニルトリメトキシシラン、フェニルトリエトキシシラン、ジメトキシメチルフェニルシラン、ジエトキシメチルフェニルシラン、及びp-トリルトリメトキシシラン等のフェニルシラン系トリメトキシ(1-ナフチル)シランなどのアリールシラン系が挙げられる。これらのシランカップリング剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
湿潤分散剤としては、塗料用に使用されている分散安定剤であれば、特に限定されない。具体例としては、ビッグケミー・ジャパン(株)製のDISPERBYK(登録商標)-110(商品名)、111(商品名)、118(商品名)、180(商品名)、161(商品名)、BYK(登録商標)-W996(商品名)、W9010(商品名)、W903(商品名)等の湿潤分散剤が挙げられる。これらの湿潤分散剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
本実施形態の樹脂組成物において、湿潤分散剤の含有量は、通常、ビスマレイミド化合物(A)、樹脂又は化合物(B)及び光硬化開始剤(C)の合計100質量部に対して、0.1~10質量部である。
本実施形態の樹脂組成物には、必要に応じて、硬化速度を適宜調節するために、硬化促進剤を含むことが好ましい。硬化促進剤としては、シアン酸エステル化合物等の硬化促進剤として一般に使用されているものを用いることができる。硬化促進剤としては、例えば、オクチル酸亜鉛、ナフテン酸亜鉛、ナフテン酸コバルト、ナフテン酸銅、アセチルアセトン鉄、オクチル酸ニッケル、及びオクチル酸マンガン等の有機金属塩類;フェノール、キシレノール、クレゾール、レゾルシン、カテコール、オクチルフェノール、及びノニルフェノール等のフェノール化合物;1-ブタノール、及び2-エチルヘキサノール等のアルコール類;2-メチルイミダゾール、2-エチル-4-メチルイミダゾール、2-フェニルイミダゾール、1-シアノエチル-2-フェニルイミダゾール、1-シアノエチル-2-エチル-4-メチルイミダゾール、2-フェニル-4,5-ジヒドロキシメチルイミダゾール、及び2-フェニル-4-メチル-5-ヒドロキシメチルイミダゾール等のイミダゾール類及びこれらのイミダゾール類のカルボン酸もしくはその酸無水類の付加体等の誘導体;ジシアンジアミド、ベンジルジメチルアミン、及び4-メチル-N,N-ジメチルベンジルアミン等のアミン類;ホスフィン系化合物、ホスフィンオキサイド系化合物、ホスホニウム塩系化合物、及びダイホスフィン系化合物等のリン化合物;エポキシ-イミダゾールアダクト系化合物;ベンゾイルパーオキサイド、p-クロロベンゾイルパーオキサイド、ジ-t-ブチルパーオキサイド、ジイソプロピルパーオキシカーボネート、及びジ-2-エチルヘキシルパーオキシカーボネート等の過酸化物;2,2’-アゾビスイソブチロニトリル(以下、「AIBN」とも称す)等のアゾ化合物が挙げられる。これらの硬化促進剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
本実施形態の樹脂組成物において、硬化促進剤の含有量は、通常、ビスマレイミド化合物(A)、樹脂又は化合物(B)及び光硬化開始剤(C)の合計100質量部に対して、0.1~20質量部である。
本実施形態の樹脂組成物には、必要に応じて、有機溶剤を含んでもよい。有機溶剤を用いると、樹脂組成物の調製時における粘度を調整することができる。有機溶剤の種類は、樹脂組成物中の樹脂の一部又は全部を溶解可能なものであれば、特に限定されない。有機溶剤としては、例えば、アセトン、メチルエチルケトン、及びメチルイソブチルケトン等のケトン類;シクロペンタノン、及びシクロヘキサノン等の脂環式ケトン類;プロピレングリコールモノメチルエーテル、及びプロピレングリコールモノメチルエーテルアセテート等のセロソルブ系溶媒;乳酸エチル、酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソアミル、乳酸エチル、メトキシプロピオン酸メチル、ヒドロキシイソ酪酸メチル、及びγ―ブチロラクトン等のエステル系溶媒;ジメチルアセトアミド、及びジメチルホルムアミド等のアミド類などの極性溶剤類;トルエン、及びキシレン等の芳香族炭化水素等の無極性溶剤が挙げられる。
これらの有機溶剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
本実施形態の樹脂組成物には、本実施形態の特性が損なわれない範囲において、これまでに挙げられていない熱硬化性樹脂、熱可塑性樹脂、及びそのオリゴマー、並びにエラストマー類等の種々の高分子化合物;これまでに挙げられていない難燃性の化合物;添加剤等の併用も可能である。これらは一般に使用されているものであれば、特に限定されない。例えば、難燃性の化合物では、メラミンやベンゾグアナミン等の窒素含有化合物、オキサジン環含有化合物、及びリン系化合物のホスフェート化合物、芳香族縮合リン酸エステル、含ハロゲン縮合リン酸エステル等が挙げられる。添加剤としては、紫外線吸収剤、酸化防止剤、蛍光増白剤、光増感剤、染料、顔料、増粘剤、滑剤、消泡剤、表面調整剤、光沢剤、重合禁止剤、熱硬化促進剤等が挙げられる。これらの成分は、1種単独又は2種以上を適宜混合して使用することも可能である。
本実施形態の樹脂組成物において、その他の成分の含有量は、通常、ビスマレイミド化合物(A)、樹脂又は化合物(B)及び光硬化開始剤(C)の合計100質量部に対して、それぞれ0.1~10質量部である。
本実施形態の樹脂組成物は、ビスマレイミド化合物(A)、樹脂又は化合物(B)、光硬化開始剤(C)と、必要に応じて、充填材(D)、その他の樹脂、その他の化合物、及び添加剤等を適宜混合することにより調製される。樹脂組成物は、後述する本実施形態の樹脂シートを作製する際のワニスとして、好適に使用することができる。なお、ワニスの調製に使用する有機溶媒は、特に限定されず、その具体例は、前記したとおりである。
樹脂組成物は、絶縁信頼性の樹脂組成物が必要とされる用途に好ましく使用することができる。用途としては、例えば、感光性フィルム、支持体付き感光性フィルム、プリプレグ、樹脂シート、回路基板(積層板用途、多層プリント配線板用途等)、ソルダーレジスト、アンダーフィル材、ダイボンディング材、半導体封止材、穴埋め樹脂、及び部品埋め込み樹脂等に使用することができる。それらの中でも、樹脂組成物は、光硬化性、耐熱性及び熱安定性に優れるため、多層プリント配線板の絶縁層用として、又はソルダーレジスト用として好適に使用することができる。
硬化物は、本実施形態の樹脂組成物を硬化させてなる。硬化物は、例えば、樹脂組成物を溶融又は溶媒に溶解させた後、型内に流し込み、光を用いて通常の条件で硬化させることにより得ることができる。光の波長領域は、光重合開始剤等により効率的に硬化が進む100~500nmの範囲で硬化させることが好ましい。
本実施形態の樹脂シートは、支持体と、支持体の片面又は両面に配された樹脂層と、を有し、樹脂層が、樹脂組成物を含む、支持体付き樹脂シートである。樹脂シートは、樹脂組成物を支持体上に塗布、及び乾燥して製造することができる。樹脂シートにおける樹脂層は、優れた耐熱性、熱安定性及び絶縁信頼性を有する。
樹脂層側を保護フィルムで保護することにより、樹脂層表面へのゴミ等の付着やキズを防止することができる。保護フィルムとしては、樹脂フィルムと同様の材料により構成されたフィルムを用いることができる。保護フィルムの厚さは、1~50μmの範囲であることが好ましく、5~40μmの範囲であることがより好ましい。厚さが1μm未満では、保護フィルムの取り扱い性が低下する傾向にあり、50μmを超えると廉価性に劣る傾向にある。なお、保護フィルムは、樹脂層と支持体との接着力に対して、樹脂層と保護フィルムとの接着力の方が小さいものが好ましい。
塗布方法は、例えば、ロールコーター、コンマコーター、グラビアコーター、ダイコーター、バーコーター、リップコーター、ナイフコーター、及びスクイズコーター等を用いた公知の方法で行うことができる。乾燥は、例えば、60~200℃の乾燥機中で、1~60分加熱させる方法等により行うことができる。
本実施形態の多層プリント配線板は、絶縁層と、絶縁層の片面又は両面に形成された導体層とを有し、絶縁層が、樹脂組成物を含む。絶縁層は、例えば、樹脂シートを1枚以上重ねて硬化して得ることもできる。絶縁層と導体層のそれぞれの積層数は、特に限定されず、目的とする用途に応じて適宜積層数を設定することができる。また、絶縁層と導体層の順番も特に限定されない。導体層としては、各種プリント配線板材料に用いられる金属箔であってもよく、例えば、銅、及びアルミニウム等の金属箔が挙げられる。銅の金属箔としては、圧延銅箔、及び電解銅箔等の銅箔が挙げられる。導体層の厚みは、通常、1~100μmである。具体的には、以下の方法により製造することができる。
ラミネート工程では、樹脂シートの樹脂層側を、真空ラミネーターを用いて回路基板の片面又は両面にラミネートする。回路基板としては、例えば、ガラスエポキシ基板、金属基板、セラミック基板、シリコン基板、半導体封止樹脂基板、ポリエステル基板、ポリイミド基板、BTレジン基板、及び熱硬化型ポリフェニレンエーテル基板等が挙げられる。なお、回路基板とは、基板の片面又は両面にパターン加工された導体層(回路)が形成された基板をいう。また、導体層と絶縁層とを交互に積層してなる多層プリント配線板において、多層プリント配線板の最外層の片面又は両面がパターン加工された導体層(回路)となっている基板も回路基板に含まれる。なお、この多層プリント配線板に積層されている絶縁層は、本実施形態の樹脂シートを1枚以上重ねて硬化して得られた絶縁層であってもよく、本実施形態の樹脂シートと、本実施形態の樹脂シートと異なる公知の樹脂シートとをそれぞれ1枚以上重ねて得られた絶縁層であってもよい。なお、本実施形態の樹脂シートと、本実施形態の樹脂シートと異なる公知の樹脂シートとの重ね方は、特に限定されない。導体層表面には、黒化処理、及び/又は銅エッチング等により予め粗化処理が施されていてもよい。ラミネート工程において、樹脂シートが保護フィルムを有している場合には、保護フィルムを剥離除去した後、必要に応じて樹脂シート及び回路基板をプレヒートし、樹脂シートの樹脂層を加圧及び加熱しながら回路基板に圧着する。本実施形態においては、真空ラミネート法により減圧下で回路基板に樹脂シートの樹脂層をラミネートする方法が好適に用いられる。
露光工程では、ラミネート工程により、回路基板上に樹脂層が設けられた後、樹脂層の所定部分に光源として、活性エネルギー線を照射し、照射部の樹脂層を硬化させる。
照射は、マスクパターンを通してもよいし、直接照射する直接描画法を用いてもよい。活性エネルギー線としては、例えば、紫外線、可視光線、電子線、及びX線等が挙げられる。活性エネルギー線の波長としては、例えば、200~600nmの範囲である。紫外線を用いる場合、その照射量はおおむね10~1000mJ/cm2である。また、ステッパー露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際しては、活性エネルギー線として、例えば、波長365nm(i線)を含む活性エネルギー線を用いることが好ましい。波長365nm(i線)を含む活性エネルギー線を用いた場合、その照射量は、おおむね10~10,000mJ/cm2である。直接描画露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際しては、活性エネルギー線として、例えば、波長405nm(h線)を含む活性エネルギー線を用いることが好ましい。波長405nm(h線)を含む活性エネルギー線を用いた場合、その照射量は、おおむね10~10,000mJ/cm2である。
マスクパターンを通す露光方法には、マスクパターンを多層プリント配線板に密着させて行う接触露光法と、密着させずに平行光線を使用して露光する非接触露光法とがあるが、どちらを用いてもかまわない。また、樹脂層上に支持体が存在している場合は、支持体上から露光してもよいし、支持体を剥離後に露光してもよい。
本実施形態では、必要に応じて、現像工程を含んでもよい。
すなわち、樹脂層上に支持体が存在していない場合には、露光工程後、ウエット現像にて光硬化されていない部分(未露光部)を除去し、現像することにより、絶縁層のパターンを形成することができる。また、樹脂層上に支持体が存在している場合には、露光工程後、その支持体を除去した後に、ウエット現像にて光硬化されていない部分(未露光部)を除去し、現像することにより、絶縁層のパターンを形成することができる。
露光工程終了後、又は現像工程終了後、ポストベーク工程を行い、絶縁層(硬化物)を形成する。ポストベーク工程としては、高圧水銀ランプによる紫外線照射工程やクリーンオーブンを用いた加熱工程等が挙げられ、これらを併用することも可能である。紫外線を照射する場合は、必要に応じてその照射量を調整することができ、例えば、50~10,000mJ/cm2程度の照射量で照射を行うことができる。また加熱の条件は、必要に応じて適宜選択できるが、好ましくは150~220℃で20~180分間の範囲、より好ましくは160~200℃で30~150分間の範囲で選択される。
絶縁層(硬化物)を形成後、乾式めっきにより絶縁層表面に導体層を形成する。乾式めっきとしては、蒸着法、スパッタリング法、及びイオンプレーティング法等の公知の方法を使用することができる。蒸着法(真空蒸着法)は、例えば、多層プリント配線板を真空容器内に入れ、金属を加熱蒸発させることにより、絶縁層上に金属膜を形成することができる。スパッタリング法も、例えば、多層プリント配線板を真空容器内に入れ、アルゴン等の不活性ガスを導入し、直流電圧を印加して、イオン化した不活性ガスをターゲット金属に衝突させ、叩き出された金属により絶縁層上に金属膜を形成することができる。
本実施形態の半導体装置は、樹脂組成物を含む。具体的には、以下の方法により製造することができる。多層プリント配線板の導通箇所に、半導体チップを実装することにより半導体装置を製造することができる。ここで、導通箇所とは、多層プリント配線板における電気信号を伝える箇所のことであって、その場所は表面であっても、埋め込まれた箇所であってもよい。また、半導体チップは、半導体を材料とする電気回路素子であれば特に限定されない。
α-ナフトールアラルキル型フェノール樹脂(新日鐵化学(株)製SN495V(商品名)、OH基当量:236g/eq.、ナフトールアラルキルの繰り返し単位数nは1~5のものが含まれる)0.47mol(OH基換算)を、クロロホルム500mLに溶解させ、この溶液にトリエチルアミン0.7molを添加した(溶液1)。
温度を-10℃に保ちながら、0.93molの塩化シアンのクロロホルム溶液300gに対して、溶液1を1.5時間かけて滴下し、滴下終了後、30分撹拌した。
その後さらに、0.1molのトリエチルアミンとクロロホルム30gの混合溶液を反応器内に滴下し、30分撹拌して反応を完結させた。副生したトリエチルアミンの塩酸塩を反応液から濾別した後、得られた濾液を0.1N塩酸500mLで洗浄した後、水500mLでの洗浄を4回繰り返した。これを硫酸ナトリウムにより乾燥した後、75℃でエバポレートし、さらに90℃で減圧脱気することにより、褐色固形のα-ナフトールアラルキル型シアン酸エステル樹脂(SNCN、式(31)、n13は1~4のものが含まれる)を得た。得られたα-ナフトールアラルキル型シアン酸エステル樹脂を赤外吸収スペクトルにより分析したところ、2264cm-1付近のシアン酸エステル基の吸収が確認された。
〔透過率、及び吸光度〕
ビスマレイミド化合物(A)として、日本化薬(株)製MIZ-001(商品名、質量平均分子量(Mw):3000)を用いて、このMIZ-001(商品名)が1質量%で含まれるクロロホルム溶液を調製し、UV-vis測定装置((株)日立ハイテクノロジーズ製日立分光光度計 U-4100(商品名))を用いて、波長365nm、及び405nmにおけるそれぞれの透過率の測定を行った。
同様に、樹脂又は化合物(B)として、P-d型ベンゾオキサジン(四国化成工業(株)製、3,3’-(メチレン-1,4-ジフェニレン)ビス(3,4-ジヒドロ-2H-1,3-ベンゾオキサジン)、ベンゾオキサジン化合物)、TrisP-PAエポキシアクリレート化合物のプロピレングリコールモノメチルエーテルアセテート(日本化薬(株)製KAYARAD(登録商標)ZCR-6007H(商品名)、エチレン性不飽和機を有する化合物)、エポキシ樹脂(日本化薬(株)製NC-3000FH(商品名))、及びカルボジイミド化合物(日清紡ケミカル(株)製カルボジライトB-01(商品名))を用いて、波長365nm、及び405nmにおけるそれぞれの透過率の測定を行った。
同様に、光硬化開始剤として、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1(IGM Resins社製Omnirad(登録商標)369(商品名))、及び2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(IGM Resins社製Omnirad(登録商標)907(商品名))を用いて、波長365nm、及び405nmにおけるそれぞれの吸光度の測定を行った。
結果を表1に示す。
(樹脂組成物及び樹脂シートの作製)
ビスマレイミド化合物(A)として、MIZ-001(商品名)を47.5質量部と、樹脂又は化合物(B)として、シアン酸エステル化合物(B2)である合成例1で得られたα-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)を47.5質量部と、光硬化開始剤(C)として、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(Omnirad(登録商標)819(商品名))を5質量部と、硬化促進剤として、2-エチル-4-メチルイミダゾール(2E4MZ、四国化成工業(株)製)5質量部とを混合し、メチルエチルケトン(出光興産(株)製)150質量部で希釈した後、超音波ホモジナイザーで攪拌してワニス(樹脂組成物の溶液)を得た。
このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製ユニピール(登録商標)TR1-38、(商品名))上に自動塗工装置(テスター産業(株)製PI-1210(商品名))を用いて塗布し、90℃で5分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。
得られた樹脂シートの樹脂面を張り合わせ、真空ラミネーター(ニッコー・マテリアルズ(株)製)を用いて、30秒間真空引き(5.0hPa以下)を行った後、圧力10kgf/cm2、温度70℃で30秒間の積層成形を行った。さらに圧力7kgf/cm2、温度70℃で60秒間の積層成形を行うことで、両面に支持体を有する評価用樹脂を得た。
樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部の代わりに、ベンゾオキサジン化合物(B3)であるP-d型ベンゾオキサジン(四国化成工業(株)製、3,3’-(メチレン-1,4-ジフェニレン)ビス(3,4-ジヒドロ-2H-1,3-ベンゾオキサジン))47.5質量部を用い、硬化促進剤である2-エチル-4-メチルイミダゾール(2E4MZ)を配合しなかった以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部の代わりに、エチレン性不飽和基を有する化合物(B6)であるTrisP-PAエポキシアクリレート化合物のプロピレングリコールモノメチルエーテルアセテート(日本化薬(株)製KAYARAD(登録商標)ZCR-6007H(商品名))47.5質量部を用い、硬化促進剤として、2-エチル-4-メチルイミダゾール(2E4MZ)5質量部の代わりに、2,2’-アゾビス(イソブチロニトリル)(AIBN、富士フィルム和光純薬(株)製)5質量部を用いた以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物(A)として、MIZ-001(商品名)を94質量部と、樹脂又は化合物(B)として、エポキシ樹脂(B4)である式(23)で表されるエポキシ樹脂(日本化薬(株)製NC-3000FH(商品名)1質量部と、光硬化開始剤(C)として、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(Omnirad(登録商標)819(商品名))を5質量部とを用いて、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部の代わりに、カルボジイミド化合物(B5)であるカルボジライトB-01(商品名、日清紡ケミカル(株)製)47.5質量部を用い、硬化促進剤である2-エチル-4-メチルイミダゾール(2E4MZ)を配合しなかった以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
光硬化開始剤(C)として、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(Omnirad(登録商標)819(商品名))5質量部の代わりに、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1(Omnirad(登録商標)369(商品名))5質量部用いた以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
光硬化開始剤(C)として、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(Omnirad(登録商標)819(商品名))5質量部の代わりに、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(Omnirad(登録商標)907(商品名))5質量部用いた以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物(A)として、MIZ-001(商品名)45.5質量部を94.9質量部に変更し、樹脂又は化合物として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部を0.1質量部に変更した以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物(A)として、MIZ-001(商品名)45.5質量部を94質量部に変更し、樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部を1質量部に変更した以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物(A)として、MIZ-001(商品名)45.5質量部を85.5質量部に変更し、樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部を9.5質量部に変更した以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物(A)として、MIZ-001(商品名)45.5質量部を19質量部に変更し、樹脂又は化合物(B)として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)47.5質量部を76質量部に変更した以外は、実施例1と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物としてMIZ-001(商品名)を95質量部と、光硬化開始剤としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(Omnirad(登録商標)819(商品名))を5質量部とを混合し、メチルエチルケトン(出光興産(株)製)150質量部で希釈した後、超音波ホモジナイザーで攪拌してワニス(樹脂組成物の溶液)を得た。
このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)製PI-1210(商品名))を用いて塗布し、90℃で5分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。
これを用いて、実施例1と同様にして、評価用樹脂を得た。
ビスマレイミド化合物としてMIZ-001(商品名)を50質量部と、樹脂又は化合物として、シアン酸エステル化合物である合成例1で得られたα-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)を50質量部とを混合し、メチルエチルケトン(出光興産(株)製)150質量部で希釈した後、超音波ホモジナイザーで攪拌してワニス(樹脂組成物の溶液)を得た。
このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)製PI-1210(商品名))を用いて塗布し、90℃で5分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。
これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物として、シアン酸エステル化合物である合成例1で得られたα-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)を95質量部と、光硬化開始剤としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(Omnirad(登録商標)819(商品名))を5質量部と、硬化促進剤として、2-エチル-4-メチルイミダゾール(四国化成工業(株)製2E4MZ)5質量部とを混合し、メチルエチルケトン(出光興産(株)製)150質量部で希釈した後、超音波ホモジナイザーで攪拌してワニス(樹脂組成物の溶液)を得た。
このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)製PI-1210(商品名))を用いて塗布し、90℃で5分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。
これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)95質量部の代わりに、ベンゾオキサジン化合物であるP-d型ベンゾオキサジン(四国化成工業(株)製、3,3’-(メチレン-1,4-ジフェニレン)ビス(3,4-ジヒドロ-2H-1,3-ベンゾオキサジン))95質量部を用い、硬化促進剤である2-エチル-4-メチルイミダゾール(2E4MZ)を配合しなかった以外は、比較例3と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)95質量部の代わりに、エチレン性不飽和基を有する化合物であるTrisP-PAエポキシアクリレート化合物のプロピレングリコールモノメチルエーテルアセテート(日本化薬(株)製KAYARAD(登録商標)ZCR-6007H(商品名))95質量部を用い、硬化促進剤として、2-エチル-4-メチルイミダゾール(2E4MZ)5質量部の代わりに、2,2‘-アゾビス(イソブチロニトリル)(AIBN、富士フィルム和光純薬(株)製)5質量部を用いた以外は、比較例3と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
樹脂又は化合物として、α-ナフトールアラルキル型シアン酸エステル樹脂(SNCN)95質量部の代わりに、エポキシ樹脂である式(23)で表されるエポキシ樹脂(日本化薬(株)製NC-3000FH(商品名)95質量部を用い、硬化促進剤である2-エチル-4-メチルイミダゾール(2E4MZ)を配合しなかった以外は、比較例3と同様にして、樹脂シートを得た。これを用いて、実施例1と同様にして、評価用樹脂を得た。
実施例及び比較例で得られた評価用樹脂を以下の方法により測定し、評価した。それらの結果を表2、及び3に示す。
波長200~600nmを含む活性エネルギー線を照射可能な光源(ユーヴィックス(株)製Omnicure(登録商標)S2000(商品名))を付属したフォトDSC(ティー・エイ・インスツルメント・ジャパン(株)製DSC-2500(商品名))を用い、得られた評価用樹脂に、波長200~600nmを含む活性エネルギー線を、照度30mW、露光時間3.5分間照射して、横軸が時間(sec)、縦軸がヒートフロー(mW)のグラフを得た。
また、光源として、波長365nm(i線)フィルター、又は波長405nm(h線)フィルターを用いて、波長365nm(i線)を含む活性エネルギー線、又は波長405nm(h線)を含む活性エネルギー線を用いたこと以外は、前記と同様の条件により、横軸が時間(sec)、縦軸がヒートフロー(mW)のグラフをそれぞれ得た。
それぞれのグラフにおいて、グラフの終点から、水平に線を引いた際のピーク面積をエンタルピー(J/g)とした。硬化性は、以下の基準で評価した。
AA:エンタルピーが20(J/g)以上であった。
BB:エンタルピーが1(J/g)以上、20(J/g)未満であった。
CC:エンタルピーが1(J/g)未満であった。
なお、エンタルピーが1(J/g)以上とは、所定の波長における露光により、樹脂の硬化が十分に進行することを意味する。
前記の光硬化性試験にて硬化した評価用樹脂に対して、更に、180℃、及び120分間加熱処理するポストベーク工程を施した後、両面の支持体をはがし取って評価用硬化物とした。
この評価用硬化物をDMA装置(TAインスツルメント社製動的粘弾性測定装置DMAQ800(商品名))を用いて10℃/分で昇温し、LossModulusのピーク位置をガラス転移温度(Tg、℃)とした。
なお、比較例1、及び3~6にて得られた評価用樹脂においては、ポストベーク工程において「シワ」が発生した。耐熱性の測定においては、平滑な試料が必要となるため、これらの試料については、測定できなかった。比較例2にて得られた評価用樹脂は、光硬化しなかったが、その後のポストベーク工程において熱硬化し、この熱硬化により得られた硬化物について耐熱性試験を行った。
前記の光硬化性試験にて硬化した評価用樹脂に対して、更に、180℃、及び120分間加熱処理するポストベーク工程を施した後、両面の支持体をはがし取って評価用硬化物とした。
この評価用硬化物をDMA装置(TAインスツルメント社製動的粘弾性測定装置DMAQ800(商品名))を用いて10℃/分で昇温し、弾性率(MPa)を測定した。
なお、比較例1、及び3~6にて得られた評価用樹脂においては、ポストベーク工程において「シワ」が発生した。弾性率の測定においては、平滑な試料が必要となるため、これらの試料については、測定できなかった。比較例2にて得られた評価用樹脂は、光硬化しなかったが、その後のポストベーク工程において熱硬化し、この熱硬化により得られた硬化物について弾性率の測定を行った。
前記の光硬化性試験にて硬化した評価用樹脂に対して、更に、180℃、及び120分間加熱処理するポストベーク工程を施した後、両面の支持体をはがし取って評価用硬化物とした。
この評価用硬化物について、示差熱質量同時測定装置((株)日立ハイテクサイエンス製TG-DTA6200(商品名))にて、測定開始温度(20℃)、昇温速度(10℃/min)、目標温度(500℃)にて、窒素雰囲気下にて質量を測定した。質量減少率が5%となった温度を熱安定性(℃)として評価した。
Claims (6)
- 下記式(1)で表される構成単位と、分子鎖の両末端にマレイミド基と、を含む、ビスマレイミド化合物(A)と、
前記ビスマレイミド化合物(A)以外のマレイミド化合物、シアン酸エステル化合物、ベンゾオキサジン化合物、エポキシ樹脂、カルボジイミド化合物、及びエチレン性不飽和基を有する化合物からなる群より選択される少なくとも1種以上の樹脂又は化合物(B)と、
光硬化開始剤(C)と、を含む、樹脂組成物。
- 支持体と、
前記支持体の片面又は両面に配された樹脂層と、を有し、
前記樹脂層が、請求項1又は2に記載の樹脂組成物を含む、
樹脂シート。 - 前記樹脂層の厚さが1~50μmである、請求項3に記載の樹脂シート。
- 絶縁層と、
前記絶縁層の片面又は両面に形成された導体層と、
を有し、
前記絶縁層が、請求項1又は2に記載の樹脂組成物を含む、多層プリント配線板。 - 請求項1又は2に記載の樹脂組成物を含む、半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20832982.1A EP3919531B1 (en) | 2019-06-28 | 2020-06-26 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
JP2020555264A JP6871539B1 (ja) | 2019-06-28 | 2020-06-26 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
KR1020217017897A KR102459496B1 (ko) | 2019-06-28 | 2020-06-26 | 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치 |
CN202080025767.3A CN113646393B (zh) | 2019-06-28 | 2020-06-26 | 树脂组合物、树脂片、多层印刷电路板和半导体装置 |
US17/621,906 US11680139B2 (en) | 2019-06-28 | 2020-06-26 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-122268 | 2019-06-28 | ||
JP2019122268 | 2019-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020262579A1 true WO2020262579A1 (ja) | 2020-12-30 |
Family
ID=74061742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2020/025141 WO2020262579A1 (ja) | 2019-06-28 | 2020-06-26 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11680139B2 (ja) |
EP (1) | EP3919531B1 (ja) |
JP (1) | JP6871539B1 (ja) |
KR (1) | KR102459496B1 (ja) |
CN (1) | CN113646393B (ja) |
TW (1) | TW202108697A (ja) |
WO (1) | WO2020262579A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021117762A1 (ja) * | 2019-12-11 | 2021-06-17 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2022201621A1 (ja) * | 2021-03-25 | 2022-09-29 | 日本化薬株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2022264985A1 (ja) * | 2021-06-15 | 2022-12-22 | ||
WO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2022264994A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2022264984A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2023008186A1 (ja) * | 2021-07-26 | 2023-02-02 | 東洋インキScホールディングス株式会社 | 接着性樹脂シート、プリント配線板および、電子機器 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI748898B (zh) | 2021-03-15 | 2021-12-01 | 晉一化工股份有限公司 | 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0912712A (ja) | 1995-06-27 | 1997-01-14 | Lion Corp | ダイマージアミン由来のポリアミド樹脂及び該ポリアミドを含有する合成樹脂製光学用材料 |
JP2005062450A (ja) | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | 感光性熱硬化型樹脂組成物 |
JP2006022173A (ja) * | 2004-07-07 | 2006-01-26 | Mitsubishi Gas Chem Co Inc | 皮膜形成用組成物および皮膜形成法および皮膜加工法 |
JP2010204298A (ja) | 2009-03-02 | 2010-09-16 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線用基板 |
JP2016169337A (ja) * | 2015-03-13 | 2016-09-23 | ナミックス株式会社 | 樹脂組成物及びそれを用いた接着剤 |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
WO2019013194A1 (ja) * | 2017-07-14 | 2019-01-17 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
JP2019511587A (ja) * | 2016-02-04 | 2019-04-25 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 剥離可能接着剤及びその高温使用 |
JP2019122268A (ja) | 2018-01-12 | 2019-07-25 | ハウス食品株式会社 | ペースト状調味料及びその製造方法 |
JP2020033472A (ja) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235833A (ja) * | 2007-03-23 | 2008-10-02 | Mitsubishi Plastics Ind Ltd | 多層配線基板用層間接続ボンディングシート |
WO2016125657A1 (ja) * | 2015-02-03 | 2016-08-11 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板 |
WO2017126536A1 (ja) * | 2016-01-20 | 2017-07-27 | 三菱瓦斯化学株式会社 | 樹脂組成物、支持体付き樹脂シート、多層プリント配線板及び半導体装置 |
WO2017136669A1 (en) * | 2016-02-04 | 2017-08-10 | Henkel IP & Holding GmbH | Debondable adhesives and the high temperature use thereof |
JP7054459B2 (ja) | 2017-05-15 | 2022-04-14 | 三菱瓦斯化学株式会社 | リソグラフィー用膜形成材料、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜及びパターン形成方法 |
WO2020203834A1 (ja) | 2019-04-02 | 2020-10-08 | 日本化薬株式会社 | ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子 |
-
2020
- 2020-06-26 EP EP20832982.1A patent/EP3919531B1/en active Active
- 2020-06-26 CN CN202080025767.3A patent/CN113646393B/zh active Active
- 2020-06-26 JP JP2020555264A patent/JP6871539B1/ja active Active
- 2020-06-26 WO PCT/JP2020/025141 patent/WO2020262579A1/ja unknown
- 2020-06-26 KR KR1020217017897A patent/KR102459496B1/ko active IP Right Grant
- 2020-06-26 US US17/621,906 patent/US11680139B2/en active Active
- 2020-06-29 TW TW109121900A patent/TW202108697A/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0912712A (ja) | 1995-06-27 | 1997-01-14 | Lion Corp | ダイマージアミン由来のポリアミド樹脂及び該ポリアミドを含有する合成樹脂製光学用材料 |
JP2005062450A (ja) | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | 感光性熱硬化型樹脂組成物 |
JP2006022173A (ja) * | 2004-07-07 | 2006-01-26 | Mitsubishi Gas Chem Co Inc | 皮膜形成用組成物および皮膜形成法および皮膜加工法 |
JP2010204298A (ja) | 2009-03-02 | 2010-09-16 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線用基板 |
JP2016169337A (ja) * | 2015-03-13 | 2016-09-23 | ナミックス株式会社 | 樹脂組成物及びそれを用いた接着剤 |
JP2019511587A (ja) * | 2016-02-04 | 2019-04-25 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 剥離可能接着剤及びその高温使用 |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
WO2019013194A1 (ja) * | 2017-07-14 | 2019-01-17 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
JP2019122268A (ja) | 2018-01-12 | 2019-07-25 | ハウス食品株式会社 | ペースト状調味料及びその製造方法 |
JP2020033472A (ja) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021117762A1 (ja) * | 2019-12-11 | 2021-06-17 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2021117762A1 (ja) * | 2019-12-11 | 2021-12-09 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JP7014339B2 (ja) | 2019-12-11 | 2022-02-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
US11643493B2 (en) | 2019-12-11 | 2023-05-09 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
WO2022201621A1 (ja) * | 2021-03-25 | 2022-09-29 | 日本化薬株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | ||
JP7298798B2 (ja) | 2021-06-15 | 2023-06-27 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2022264984A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
WO2022264985A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2022264994A1 (ja) * | 2021-06-15 | 2022-12-22 | ||
WO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
KR102656757B1 (ko) * | 2021-06-15 | 2024-04-11 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치 |
KR102646474B1 (ko) * | 2021-06-15 | 2024-03-11 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치 |
JPWO2022264985A1 (ja) * | 2021-06-15 | 2022-12-22 | ||
WO2022264994A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JP7302760B2 (ja) | 2021-06-15 | 2023-07-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JP7305110B2 (ja) | 2021-06-15 | 2023-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
KR20230128387A (ko) * | 2021-06-15 | 2023-09-04 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체장치 |
CN117355545A (zh) * | 2021-06-15 | 2024-01-05 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、多层印刷电路板及半导体装置 |
KR20230134624A (ko) * | 2021-06-15 | 2023-09-21 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치 |
JP7342917B2 (ja) | 2021-07-26 | 2023-09-12 | 東洋インキScホールディングス株式会社 | 接着性樹脂シート、プリント配線板および、電子機器。 |
JP2023017308A (ja) * | 2021-07-26 | 2023-02-07 | 東洋インキScホールディングス株式会社 | 接着性樹脂シート、プリント配線板および、電子機器。 |
WO2023008186A1 (ja) * | 2021-07-26 | 2023-02-02 | 東洋インキScホールディングス株式会社 | 接着性樹脂シート、プリント配線板および、電子機器 |
Also Published As
Publication number | Publication date |
---|---|
EP3919531B1 (en) | 2023-08-02 |
KR102459496B1 (ko) | 2022-10-26 |
TW202108697A (zh) | 2021-03-01 |
CN113646393A (zh) | 2021-11-12 |
EP3919531A1 (en) | 2021-12-08 |
EP3919531A4 (en) | 2022-07-27 |
US11680139B2 (en) | 2023-06-20 |
CN113646393B (zh) | 2023-09-19 |
JP6871539B1 (ja) | 2021-05-12 |
JPWO2020262579A1 (ja) | 2021-09-13 |
US20220204694A1 (en) | 2022-06-30 |
KR20210082256A (ko) | 2021-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6871539B1 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
WO2020262577A1 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
JP7489031B2 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
JP6746106B2 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
EP4043419B1 (en) | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | |
JP6886133B1 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
JP7014339B2 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
WO2022201621A1 (ja) | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 | |
JP7191276B1 (ja) | 樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、多層プリント配線板、封止用材料、繊維強化複合材料、接着剤及び半導体装置 | |
EP4074681A1 (en) | Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | |
EP4357375A1 (en) | Resin composition, resin sheet, multilayer printed wiring board and semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2020555264 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20832982 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20217017897 Country of ref document: KR Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2020832982 Country of ref document: EP Effective date: 20210831 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |