WO2020178944A1 - コイル装置及び製造方法 - Google Patents

コイル装置及び製造方法 Download PDF

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Publication number
WO2020178944A1
WO2020178944A1 PCT/JP2019/008387 JP2019008387W WO2020178944A1 WO 2020178944 A1 WO2020178944 A1 WO 2020178944A1 JP 2019008387 W JP2019008387 W JP 2019008387W WO 2020178944 A1 WO2020178944 A1 WO 2020178944A1
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WO
WIPO (PCT)
Prior art keywords
coil
adhesive layer
coil device
support
manufacturing
Prior art date
Application number
PCT/JP2019/008387
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English (en)
French (fr)
Japanese (ja)
Inventor
典明 種子
和男 高波
秀吉 瀧井
田中　信也
Original Assignee
株式会社プリケン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社プリケン filed Critical 株式会社プリケン
Priority to JP2020536702A priority Critical patent/JP6774699B1/ja
Priority to PCT/JP2019/008387 priority patent/WO2020178944A1/ja
Priority to KR1020207029119A priority patent/KR102389151B1/ko
Priority to CN202210651017.8A priority patent/CN114999764A/zh
Priority to CN201980024372.9A priority patent/CN113474852B/zh
Priority to TW109106701A priority patent/TWI767195B/zh
Publication of WO2020178944A1 publication Critical patent/WO2020178944A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Definitions

  • the present invention relates to a coil device.
  • Coil devices are used in various electrical and electronic products.
  • Patent No. 6102578 proposes a coil device (see FIG. 10).
  • 13S is a substantially spiral pattern
  • 13e is an outer peripheral end of the substantially spiral pattern 13S
  • 19 is a wiring pattern.
  • the coil device is manufactured as follows (see FIG. 11).
  • a base metal film 11 was formed on the surface of the substrate 10 (see FIG. 11A).
  • the resist film 12 was applied on the base metal film 11.
  • the resist film 12 was formed into a predetermined pattern by photolithography and dry etching (see FIG. 11B).
  • a plating film was provided by electrolytic plating on the underlying metal film 11 at the opening of the resist film 12 (see FIG. 11C).
  • the resist film 12 was removed (see FIG. 11D).
  • the underlying metal film 11 where the resist film 12 was present was removed (see FIG. 11E). Further, electrolytic plating was performed to obtain a substantially spiral coil (plating film 13) having a high aspect ratio (see FIGS. 10 and 11(f)).
  • the coil device of FIG. 10 can also be obtained by the method of FIG.
  • the plating film 13 was formed on the surface of the substrate 10 (see FIG. 12A).
  • W L1 is the line width
  • W S1 is the space width.
  • a low current was applied in the plating solution 21.
  • the plating film 13 grew isotropically.
  • the plating film 13 also grew in the vertical direction and the horizontal direction, and had a curved cross-sectional shape at the top. This plating step was carried out until the space width was W S2 ( WS1 > W S2 > 0) and the line width was W L2 (W L2 > W L1 ) (see FIGS. 12 (b) and 12 (c)).
  • the plating film at this stage is indicated by reference numeral 14.
  • the thickness T 2 of the plating film 14 is at least twice the space width W S2 .
  • a higher potential than that during the plating was applied.
  • a metal ion dilute layer (thickness W 0 ) 17 having a certain thickness or more was formed on the surface of the plating film 14 in contact with the plating solution 21 (see FIG. 12 (d)).
  • the plating solution 21 was stirred (see FIG. 12(e)).
  • the metal ion diluted layer (substantially insulating layer) 17 covers the entire surface of the plated film 14.
  • the metal ion diluted layer 17 is partially removed by stirring. Since metal ions are supplied to this removed portion, plating grows in one direction.
  • the plated film 14 has grown to a tall plated film (height T 3 ) 15 (see FIG. 12(f)).
  • the height of the coil differs depending on the location.
  • the height of the line at the outermost peripheral position of the coil was higher than the height of the line at the inner peripheral side position of the coil. Therefore, the coil characteristics were poor.
  • the problem to be solved by the present invention is to provide a new coil device.
  • the present invention is A support, An insulating adhesive layer provided on the support, We propose a coil device including a conductive coil in which a part of the adhesive layer is inserted.
  • the present invention proposes the coil device, further comprising an insulating material provided between the wires of the conductive coil.
  • the present invention proposes the above coil device, in which the wire of the conductive coil has a width at an end portion on the side of the adhesive layer that is narrower than a width of an end portion on the side opposite to the adhesive layer.
  • the present invention proposes the coil device, wherein the wire of the conductive coil has a substantially curved cross-section at the end on the adhesive layer side.
  • the present invention proposes the above coil device, wherein the adhesive layer has a thickness of 7 to 50 ⁇ m.
  • the present invention proposes the above coil device, wherein one or two or more selected from the group of thermosetting resins and photocuring resins are used as the material of the adhesive layer.
  • the present invention proposes the above coil device, in which one or more selected from the group of thermosetting resins and photocuring resins are used as the material of the insulating material.
  • the present invention proposes the coil device, wherein the coil has a substantially spiral shape or a substantially spiral shape.
  • the present invention proposes the above coil device, wherein the coil wire has a thickness of 30 to 600 ⁇ m, and a closest distance between the wires is 5 to 20 ⁇ m.
  • the present invention proposes the above coil device, wherein the support, the adhesive layer, and the conductive coil are laminated in one layer or two or more layers.
  • the present invention is We propose a method for manufacturing a coil device that transfers a conductive coil provided on a first support to the insulating adhesive layer of a second support having an insulating adhesive layer.
  • the present invention is A step of providing a conductive coil on the first support, A step B of providing an insulating adhesive layer on the second support, We propose a method for manufacturing a coil device including a C step of transferring the coil onto the insulating adhesive layer.
  • the present invention proposes a method of manufacturing the coil device, wherein the coil device is peeled off after or after the transfer.
  • the present invention proposes a method for manufacturing the coil device, wherein the coil device is filled with an insulating material between the wires of the coil.
  • the present invention is the method for manufacturing the coil device, further comprising a groove forming step of forming a concave groove on the surface of the first support, and a plating step of plating the concave groove with metal.
  • a method for manufacturing a coil device in which the coil is provided on the metal plating was proposed.
  • the present invention is the method for manufacturing the coil device, wherein at least the surface layer of the first support is a metal, a resist film is provided on the metal surface, and a groove connected to the metal surface is formed in the resist film.
  • a method for manufacturing a coil device is proposed, in which the groove is formed, the groove is metal-plated, and the coil is provided on the metal plating.
  • the present invention proposes a method for manufacturing the coil device, wherein the coil is formed by anisotropic plating.
  • the present invention proposes a method for manufacturing the coil device, wherein in the transfer, the tip end of the coil wire enters the adhesive layer.
  • the present invention proposes a method for manufacturing the coil device, wherein the width of the groove is narrower than the line width of the coil.
  • the present invention proposes a method of manufacturing the coil device, wherein the metal type of the metal plating provided in the groove is different from the metal type of the coil.
  • the first invention is a coil device.
  • the device comprises a support.
  • the support is generally made of an insulating material.
  • a conductive material may be partially used. Conductive materials are not excluded. That is, it is sufficient if it is electrically insulated from the conductive coil described later.
  • An insulating adhesive layer which will be described later, is provided on the support. Therefore, since there is an adhesive layer (insulating) between the conductive coil and the support, the requirement that the support must be an insulating material is relaxed.
  • the support is preferably made of an insulating material.
  • the support is generally insulative, since there is little particular reason to use a conductive material.
  • the device comprises an adhesive layer.
  • the adhesive layer is an insulating material.
  • the adhesive layer is made of a conductive material, the wire of the coil is short-circuited with the adhesive layer. Therefore, the adhesive layer is insulative.
  • the adhesive layer is provided on the surface of the support.
  • the adhesive layer is formed by applying an adhesive. Alternatively, it can be configured by sticking an adhesive film.
  • the adhesive is used as a concept including an adhesive. Therefore, the adhesive layer also includes an adhesive layer.
  • the device includes a conductive coil (hereinafter, also simply referred to as a coil). A part of the wire of the coil is inserted into the adhesive layer.
  • the coil and the support are integrated by the adhesive layer.
  • integrated means that the coil is supported (adhered) by the adhesive layer.
  • the device preferably comprises an insulating material.
  • the insulating material exists in the space (gap) between the wires of the coil. Air is insulative. Therefore, even if there is no special insulating material between the coil wires, no short circuit will occur in the coil. However, if an insulating material (for example, an insulating resin) is present between the wires of the coil, a short circuit due to the metal falling between the wires can be avoided. Since a lateral force is applied to the coil, a short circuit due to contact between the wires can be avoided. Furthermore, when the insulating material is present in the space (gap) between the wires, it is difficult for the coil (wire) to deform.
  • the filled resin adheres to the side wall surface of the coil (wire).
  • the coil (wire) is hard to buckle.
  • the side wall surface of the coil (wire) is difficult to oxidize.
  • the filling is easily performed by pouring the solution of the resin into the gap.
  • the width of the end of the coil (wire) on the side of the adhesive layer is narrower than the width of the end on the side opposite to the adhesive layer.
  • the end portion on the adhesive layer side has, for example, a substantially curved cross section.
  • it has a substantially hemispherical shape or a substantially dome shape. It may be in the shape of a semi-racky ball. Of course, it is not limited to these curved surfaces.
  • the shape is not limited to a curved surface, and may be a pyramid shape or a pyramid trapezoidal shape.
  • the coil (wire) generally has a substantially curved cross section (see FIG. 5).
  • the tip side easily enters the adhesive layer (see FIG. 6 ). Therefore, the coil is easily supported by the adhesive layer. Furthermore, the contact area between the tip side surface of the coil (wire) and the adhesive layer is increased. Therefore, the coil is reliably supported.
  • the insulating material (insulating material in a fluidized state) is poured between the wires of the coil from above (on the side opposite to the support). At this time, the insulating material efficiently enters the lower part of the gap between the wires of the coil. As the insulating material is filled between the wires of the coil, air existing between the wires is easily released.
  • the thickness of the adhesive layer was preferably 7 ⁇ m or more. It was more preferably 7.5 ⁇ m or more. It was more preferably 12.5 ⁇ m or more. It was more preferably 25 ⁇ m or more. Preferably, the thickness was 50 ⁇ m or less. It was more preferably 38 ⁇ m or less. It was more preferably 25 ⁇ m or less. If the thickness of the adhesive layer is too thin, it is difficult to support the coil. That is, the meaning of providing the adhesive layer is weakened. On the other hand, if the coil is too thick, the height of the upper end of the coil tends to vary (uneven) due to the variation of the pressing force when the coil is provided.
  • the thickness (height) of the adhesive layer is preferably thinner than the thickness (height) of the coil.
  • the thickness of the adhesive layer was preferably 1/3 or less of the thickness of the coil. More preferably, it was 1/4 or less. It was more preferably 1/5 or less. If the thickness of the adhesive layer is larger than the thickness of the coil, it is difficult to push the coil into the adhesive layer.
  • the height of the coil was easy to vary depending on the place.
  • the adhesive layer is made of one or more materials selected from the group of thermosetting resins and photocurable resins.
  • thermosetting adhesives include acrylic resin thermosetting adhesives, rubber resin thermosetting adhesives, vinyl alkyl ether resin thermosetting adhesives, silicone resin thermosetting adhesives, and polyester resins.
  • thermosetting adhesives include thermosetting adhesives, polyamide resin thermosetting adhesives, urethane resin thermosetting adhesives, fluorine resin thermosetting adhesives, and epoxy resin thermosetting adhesives.
  • the adhesive contains an appropriate component such as a curing agent.
  • epoxy resin photo-curing adhesive epoxy resin photo-curing adhesive, fluorine-containing epoxy resin photo-curing adhesive, silicone resin photo-curing adhesive, acrylic resin photo-curing adhesive, fluorine-containing acrylic
  • examples thereof include a resin photocurable adhesive, a urethane acrylate resin photocurable adhesive, and an epoxy acrylate resin photocurable adhesive.
  • a type in which the adhesive layer does not return to the original state once cured is preferable. This is because, depending on the environment in which the coil device is used, it may be under high temperature or may be exposed to light (ultraviolet rays). When the coil device is placed under a specific use condition (for example, high temperature), when the adhesive layer after curing becomes soft, the coil fluctuates.
  • the insulating material is one or more selected from the group of thermosetting resins and photocurable resins.
  • the resins mentioned for the adhesive are used. Of course, it is not limited to this.
  • the coil has a substantially spiral shape or a substantially spiral shape.
  • the spiral shape is not limited to the substantially circular shape. It does not matter if it is rectangular.
  • the wire of the coil had a thickness (height) of 30 ⁇ m or more. More preferably, it was 100 ⁇ m or more. More preferably, it was 200 ⁇ m or more. Preferably, the thickness (height) was 600 ⁇ m or less. It was more preferably 500 ⁇ m or less. More preferably, it was 250 ⁇ m or less.
  • the width of the line was 100 ⁇ m or more. More preferably, it was 130 ⁇ m or more. More preferably, it was 150 ⁇ m or more. Preferably, the width was 1000 ⁇ m or less. It was more preferably 800 ⁇ m or less. More preferably, it was 600 ⁇ m or less. The closest distance between the lines of the coil (in FIGS.
  • the distance between the lines of the coil on the upper end side of the coil was 5 ⁇ m or more. It was more preferably 7 ⁇ m or more. More preferably, it was 8 ⁇ m or more. It was preferably 20 ⁇ m or less. It was more preferably 15 ⁇ m or less. More preferably, it was 12 ⁇ m or less.
  • the reason was as follows. When the thickness was small, the coil performance (Q value) was low. If the thickness is large, it is difficult to stabilize the width of the wire. If the width is small, it is difficult to develop anisotropic plating. When the width was large, the coil performance (number of turns) was low. If the closest distance is small, a short circuit is likely to occur. When the closest distance was large, the coil performance (number of turns) was low.
  • the support, the adhesive layer, and the conductive coil may have a single layer configuration. It may have a laminated structure of two or more layers.
  • the second invention is a method for manufacturing a coil device.
  • the method is a method of transferring the conductive coil provided on the first support to the insulating adhesive layer of the second support having an insulating adhesive layer.
  • the method includes a step A, a step B, and a step C.
  • the step A is a step of providing a conductive coil on the first support.
  • the step B is a step of providing an insulating adhesive layer on the second support.
  • the C step is a step of transferring the coil to the insulating adhesive layer. Either step A or step B may be performed first. It may be done at the same time. It goes without saying that the C step is after the A step and the B step.
  • the first support is preferably peeled off.
  • the insulating material is preferably filled between the wires of the coil.
  • the filling is preferably performed after the peeling.
  • the step A (or the formation of the coil) is performed, for example, as follows.
  • a groove is formed on the surface of the first support.
  • Metal plating is performed.
  • the groove is filled with metal.
  • the coil is provided by plating (particularly anisotropic plating) using the metal as a seed.
  • the step A (or the formation of the coil) is performed, for example, as follows.
  • At least the surface layer of the first support is metal. It may be composed of only a metal material.
  • a resist film is provided on the metal surface.
  • the resist film is formed in a predetermined pattern. That is, a concave groove connected to the metal surface is formed on the resist film. This formation can be easily performed by, for example, photolithography technology and etching technology.
  • Metal plating is performed. As a result, the groove is filled with metal.
  • the coil is provided by plating (particularly anisotropic plating) using the metal as a seed.
  • the tip of the coil (wire) preferably enters the adhesive layer.
  • the width of the groove is preferably narrower than the width of the coil (wire).
  • the metal type of the metal plating provided in the groove and the metal type of the coil are preferably different. The reason is that if the same metal is used, it is difficult to peel it off.
  • the method is, for example, the method for manufacturing the first invention (coil device).
  • 1 to 8 are manufacturing process diagrams of a coil device according to an embodiment of the present invention.
  • a support (first support) 51 was prepared (see FIG. 1).
  • the support 51 is a conductive plate.
  • a conductive sheet may be used. It may be a conductive foil.
  • a conductive film may be used. The plates, the sheets, the foils, and the films only differ in thickness.
  • a metal material is generally used as the conductive material. Of course, it is not limited to this.
  • a conductive resin may be used.
  • the support 51 may have a conductive film (for example, a metal foil) provided on the surface of an insulating material. In short, it suffices if the surface layer is conductive.
  • This embodiment is an example in which a conductive layer (for example, a metal layer (metal plating film)) 51a is provided on one surface of an insulator 51b as the support 51.
  • a resist solution for example, an alkali developing resist solution
  • the conductive layer (metal layer) 51a is exposed in the opening 53 of the resist film 52 (see FIG. 2).
  • the width of the opening 53 is smaller than the line width of the coil 56 described later. That is, a value smaller than the value of the width of the coil (wire) to be obtained is predicted. The width of the opening 53 was set based on this predicted value.
  • the conductive layer 51a plays the role of a cathode in the electrolytic plating process described later (see FIG. 4). From this point of view, the support 51 requires a conductive layer (for example, a metal layer) 51a on its surface.
  • the current flowing through the cathode (conductive layer 51a) is determined by the value of the electric resistance from the power feeding portion 54 to the cathode.
  • a conductive layer 51a is provided on the entire surface of the cathode. Therefore, the difference in electric resistance in the opening 53 can be reduced. As a result, variations in the thickness of the plated film due to electrolytic plating are reduced. By providing the dummy coil outside the target coil, variations in the film thickness of the target coil are reduced.
  • the opening 53 was filled with a conductive material (particularly metal).
  • Reference numeral 55 is a filler.
  • a known method can be adopted for the filling. For example, wet plating can be adopted. Dry plating can also be used. Wet plating was used in this example. For example, electroplating was used.
  • the filling material (conductive material (particularly metal)) is preferably a material different from the material forming the coil 56.
  • the coil material is generally Cu. Therefore, the filling material is, for example, Ni.
  • the thickness of the filling material 55 filled in the opening 53 is preferably the same as (substantially the same as) the thickness of the resist film 52.
  • the coil (wire) enters the opening 53.
  • the coil is hard to peel off.
  • unevenness is formed on the end face of the coil.
  • Coil performance (space factor) decreases.
  • the thickness of the filling material 55 is thicker than the thickness of the resist film 52, when the coil 56 described later is configured, the filling material 55 enters the coil 56.
  • the contact area between the filler 55 and the coil (wire) increases. As a result, the coil 56 is unlikely to be peeled off.
  • the coil 56 is transferred, irregularities are formed on the end surface of the coil (wire).
  • Coil performance space factor
  • the coil 56 was provided. Electrolytic plating was used to form the coil 56. For example, degreasing, water washing, and sulfuric acid washing were performed. The material shown in FIG. 3 was immersed in the plating bath 57 (see FIG. 4). The power feeding portion 54 was connected to the cathode (conductive layer 51a) and electricity was supplied. As a result, electrolytic plating (electroplating) was performed.
  • the plating solution was, for example, copper sulfate, chloride, an inhibitor, and an accelerator.
  • the current density was, for example, 0.5 A/cm 2 . Of course, it is not limited to this.
  • anisotropic plating (the plating growth rate in the vertical (height) direction is higher than the plating growth rate in the lateral direction) was performed. Since anisotropic plating is well known, its details are omitted.
  • a spiral coil 56 was formed (see FIG. 5. For the spiral shape, see FIG. 10 (plan view)).
  • the upper end side (upper end side in FIG. 5) of the line of the coil 56 is substantially dome-shaped. It is not a flat surface (flat surface) (see FIG. 5).
  • the coil 56 with the wire having a predetermined thickness was formed, and the plating operation was completed.
  • the thickness (height) of the coil 56 was, for example, 220 ⁇ m at the position on the innermost peripheral side.
  • the distance between the lines of the coil 56 was, for example, 10 ⁇ m.
  • the line at the outermost peripheral position in the spiral pattern of the coil 56 has a large plating film thickness (see FIG. 5).
  • the portion 56a where the plating film is thick is called a dummy pattern.
  • the presence of the dummy pattern 56a is one of the major causes of the deterioration of the coil performance.
  • the support 51 was pulled up from the plating solution. It was washed and dried. If necessary, a rust preventive agent is applied to suppress the discoloration of Cu.
  • the coil 56 was transferred (see FIG. 6).
  • the coil 56 formed by the plating was transferred onto a support (second support) 58.
  • the support (second support) 58 is, for example, an insulating plate.
  • An insulating sheet may be used.
  • An insulating film may be used. Any insulating material may be used.
  • an inorganic material for example, glass or ceramics
  • an organic material for example, plastic such as polyimide
  • Reference numeral 59 is an adhesive layer.
  • the material (adhesive) of the adhesive layer 59 is an epoxy resin.
  • the thickness of the adhesive layer 59 was 25 ⁇ m.
  • the adhesive layer 59 was formed by applying the adhesive to the surface of the support 58. The transfer is performed as follows.
  • the tip side (curved side) of the wire of the coil 56 was pressed into the adhesive layer 59.
  • the shape of the support body 58 matches the shape of the coil 56 (the shape inside the dummy pattern 56a).
  • the shape of the support 58 is preferably a shape in which the dummy pattern 56a cannot be transferred. This is because the dummy pattern 56a is prevented from being transferred during the transfer (see FIGS. 6 and 7). If the dummy pattern 56a is also transferred at the same time, the height of the coil becomes uneven, and the coil performance deteriorates.
  • the dummy pattern 56a is not transferred if the adhesive layer 59 is not present at a portion corresponding to the dummy pattern 56a. However, it is easier if the shape of the support 58 meets the above requirements.
  • the support (first support) 51 was peeled off.
  • the peeling may be performed along with the transfer. Along with the transfer, it means that the transfer and the peeling proceed simultaneously (almost simultaneously).
  • the insulating material was filled in the space (gap) 60 between the wires 56b and 56b of the coil 56.
  • the insulating material is preferably an insulating resin.
  • the resin is one kind or two or more kinds selected from the group of thermosetting resins and photosetting resins.
  • a material capable of forming a flexible cured film (Melkid V985-E (Ryoden Kasei Co., Ltd.) whose main component is polyurethane resin) was used.
  • the resin-containing solution was the wire of the coil 56. It was poured into the gap 60 between the 56b and the wire 56b.
  • a resin-containing solution having a viscosity of about 100 mPa ⁇ s or less (more preferably 10 to 20 mPa ⁇ s) is preferably used. Since the resin solution was poured, the upper surface (flat surface) 56c of the coil (wire) was covered with the coating film 61a. 61b is a filling material filled in the gap 60. After the pouring, the heat treatment was performed. This caused the insulation to cure.
  • a coil device having no dummy pattern 56a was easily obtained.
  • the coil device has the dummy pattern 56a, the coil device has variations in height. As a result, the coil device has poor characteristics. The coil device solves such a problem.
  • FIG. 9 is an example in which the coils of FIG. 8 are laminated in two layers. Since the coils of FIG. 8 are merely two-layer laminated, detailed description thereof will be omitted.
PCT/JP2019/008387 2019-03-04 2019-03-04 コイル装置及び製造方法 WO2020178944A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020536702A JP6774699B1 (ja) 2019-03-04 2019-03-04 コイル装置及び製造方法
PCT/JP2019/008387 WO2020178944A1 (ja) 2019-03-04 2019-03-04 コイル装置及び製造方法
KR1020207029119A KR102389151B1 (ko) 2019-03-04 2019-03-04 코일 장치 및 제조 방법
CN202210651017.8A CN114999764A (zh) 2019-03-04 2019-03-04 线圈装置及制造方法
CN201980024372.9A CN113474852B (zh) 2019-03-04 2019-03-04 线圈装置及制造方法
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CN113474852B (zh) 2022-06-28
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