WO2020107706A1 - 电子雷管产线用一体化自动焊接设备 - Google Patents
电子雷管产线用一体化自动焊接设备 Download PDFInfo
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- WO2020107706A1 WO2020107706A1 PCT/CN2019/073937 CN2019073937W WO2020107706A1 WO 2020107706 A1 WO2020107706 A1 WO 2020107706A1 CN 2019073937 W CN2019073937 W CN 2019073937W WO 2020107706 A1 WO2020107706 A1 WO 2020107706A1
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- chip
- turntable
- welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
Definitions
- the invention relates to civil explosive production equipment, in particular to integrated automatic welding equipment for electronic detonator production lines.
- the technical problem to be solved by the present invention is to provide an integrated automatic welding device for an electronic detonator production line with high production efficiency.
- an integrated automatic welding device for an electronic detonator production line including a frame and a chip processing device, a chip welding device and a chip reclaiming device respectively arranged on the frame
- the chip processing device includes a first turntable and a chip material tape feeding mechanism, a chip material tape punching mechanism and a chip tin mechanism sequentially arranged along the circumference of the first turntable, and a chip bearing jig is provided on the first turntable
- the chip welding device includes a second turntable and a medicine head unloading mechanism, a first welding device and a second welding device that are sequentially arranged along the circumference of the second turntable.
- the second turntable is provided with a welding jig assembly;
- the chip retrieving device is located between the first turntable and the second turntable.
- the beneficial effect of the present invention is that: setting the first and second turntables and optimizing the layout of the chip processing device and the chip welding device composition mechanism, a device capable of chip chip tape feeding, chip chip die cutting, and chip tin plating is manufactured ⁇ Integrated automatic welding equipment for a series of processes such as medicine head material stripping, medicine head chip welding, chip wire welding, etc., which greatly improves the production efficiency of electronic detonators; in addition, the setting of the first and second turntables is reduced The number of turnover equipment not only reduces the manufacturing cost of the integrated automatic welding equipment, but also reduces the time spent on the material flow, which further improves the production efficiency. In addition, the integrated automatic welding equipment is small in size, which is conducive to occupying space.
- FIGS. 1 to 3 are schematic diagrams of the overall structure of an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention.
- FIG. 4 is an enlarged view of detail A in FIG. 3;
- FIG. 5 and 6 are schematic structural diagrams of a chip material tape feeding mechanism in an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention
- FIG. 7 is an enlarged view of detail B in FIG. 5;
- FIG. 8 is a schematic structural view of a die cutting mechanism of an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention.
- FIG. 9 is a schematic structural diagram of a tin-on-chip mechanism in an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention.
- FIG. 10 is a schematic structural view of a solder paste tray in an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention
- 11 and 12 are schematic structural diagrams of a medicine head blanking mechanism in an integrated automatic welding device for an electronic detonator production line according to Embodiment 1 of the present invention
- FIG. 13 is an enlarged view of detail C in FIG. 12.
- First lifting drive 54. Solder paste tray; 55, third drive member; 56, scraper; 57, tin leak hole; 58, avoidance slot; 59, second lift drive member; 6, second turntable; 61, welding jig assembly; 611 , Welding seat; 612, base; 613, guide rod; 614, bottom plate; 615, thimble; 7, medicine head cutting mechanism; 71, fourth driving member; 72, connecting frame; 73, cutter mechanism; 74, grasping Hand mechanism; 75, tape drive; 76, scrap removal mechanism; 77, code scanning device; 81, first welding device; 82, second welding device; 9, chip reclaiming device; 91, second vacuum suction nozzle 92, the second three-axis moving mechanism; 101, the first abutment drive member; 102, the second abutment drive member.
- the most critical concept of the present invention is: setting the first and second turntables and optimizing the layout of the chip processing device and the chip welding device composition mechanism so that the integrated automatic welding equipment can realize chip material tape feeding, chip material tape punching, and chip tin , A series of processes such as unloading of drug head material, chip welding of drug head, chip wire welding and so on.
- an integrated automatic welding equipment for electronic detonator production line includes a frame 1 and a chip processing device, a chip welding device and a chip reclaiming device 9 respectively provided on the frame 1,
- the chip processing device includes a first turntable 2 and a chip material tape feeding mechanism 3, a chip material tape punching mechanism 4 and a chip tin-bonding mechanism 5 which are sequentially arranged along the circumference of the first turntable 2, and the first turntable 2 is provided with chips Carrying fixture 21;
- the chip welding device includes a second turntable 6 and a medicine head unloading mechanism 7, a first welding device 81 and a second welding device 82 which are arranged in sequence along the circumference of the second turntable 6, the second turntable 6
- a welding jig assembly 61 is provided thereon;
- the chip reclaiming device 9 is located between the first turntable 2 and the second turntable 6.
- the working principle of the present invention is briefly described as follows: After the chip tape loading mechanism 3 places the chip tape on the chip carrier jig 21 of the first turntable 2, the first turntable 2 rotates to make the carrier jig loaded with the chip tape Rotate to the working area of the chip material tape punching mechanism 4, and then the chip material tape punching mechanism 4 punches off the excess base tape of the chip material tape, so that only the chips remain on the bearing jig, and then the first turntable 2 rotates to pass the punching
- the cut chip (together with the bearing jig) rotates to the working area of the tin-on-chip mechanism 5, the tin-on-chip mechanism 5 applies tin to the bonding areas at both ends of the chip, and the first turntable 2 continues to rotate to complete the tin-on-chip (and
- the carrier jig) rotates to the working area of the chip reclaiming device 9, the chip retrieving device 9 takes out the tinned chip from the carrier jig and places it in the
- first and second turntables can be driven by the same driving member or different driving members, and the user can choose according to actual needs.
- the order of the die cutting station of the chip material and the tin station on the chip can be reversed, which is the same as the die feeding mechanism 3 of the die tape, die cutting mechanism 4 of the die tape and tin mechanism 5 of the die
- the direction of the arrangement is related to the direction of rotation of the first turntable 2. Therefore, the order of the die cutting station of the chip material and the tin station on the chip should not be regarded as a limitation of the technical solution.
- the beneficial effects of the present invention are: by setting the first and second turntables and by optimizing the layout of the chip machining device and the chip welding device, a device capable of chip chip tape loading and chip chip tape punching is manufactured
- the integrated automatic welding equipment of a series of processes such as cutting, tin on the chip, medicine head material strip cutting, medicine head chip welding, chip wire welding, etc., greatly improves the production efficiency of the electronic detonator; in addition, the first and second The setting of the turntable reduces the number of turnover equipment, not only reduces the manufacturing cost of the integrated automatic welding equipment, but also reduces the material flow time, further improving the production efficiency; in addition, the integrated automatic welding equipment is small in size, which is beneficial to occupy space.
- the chip material tape feeding mechanism 3, the chip material tape punching mechanism 4, the chip on-tin mechanism 5 and the chip reclaiming device 9 are evenly distributed around the central axis of the first turntable 2, and the first turntable 2 is
- the number of the chip loading jigs 21 is four, and the four chip loading jigs 21 are evenly distributed around the central axis of the first turntable 2;
- the second welding device 82 and the chip reclaiming device 9 are evenly distributed around the central axis of the second turntable 6, the number of the welding jig components 61 on the second turntable 6 is four, four
- the welding jig assembly 61 is evenly distributed around the central axis of the second turntable 6.
- each rotation of the first and second turntables is 90°, and the above mechanism can work at the same time, shorten the working hours, and further improve the production efficiency.
- the chip tape loading mechanism 3 includes a first lifting mechanism 31, a material frame 32, a push-pull mechanism 33, and a material shifting mechanism 34; the first lifting mechanism 31, the push-pull mechanism 33, and the material shifting mechanism 34 are respectively provided at the On the rack 1, the material frame 32 is placed on the first lifting mechanism 31, and the first lifting mechanism 31 drives the material frame 32 to move up and down, and the material frame 32 has a plurality of parallel upper A material plate 35, a reclaiming table is provided on the rack 1, a side of the material frame 32 near the reclaiming table is provided with an opening, and the push-pull mechanism 33 is used to load the material frame 32 with a chip tape
- the loading plate 35 is transferred to the reclaiming table and the empty loading plate 35 on the reclaiming table is pushed back into the material frame 32, and the material moving mechanism 34 is used to load the material in the reclaiming table
- the chip tape on the board 35 is transferred to the chip carrier jig 21 of the first turntable 2.
- the integrated automatic welding equipment can perform automatic production for a longer period of time, and the worker does not need to keep watching, which is conducive to liberating the labor ,reduce costs.
- the push-pull mechanism 33 includes a first driving member 331, a second driving member 332 and a clamping jaw 333, the first driving member 331 is disposed on the frame 1, and the first driving member 331 drives The second driving member 332 performs linear reciprocating motion, and the second driving member 332 is connected to the clamping jaw 333 and drives the clamping jaw 333 to open and close.
- the push-pull mechanism has a simple structure, stable operation, and low manufacturing cost.
- the tin-on-chip mechanism 5 includes a bracket 51, a lifting plate 52, a first lifting driving member 53, a solder paste tray 54, a third driving member 55, and a scraper 56, and the first lifting driving member 53 is respectively connected
- the bracket 51 and the lifting plate 52 drive the lifting plate 52 up and down
- the third driving member 55 and the solder paste tray 54 are respectively provided on the lifting plate 52, and the bottom plate 614 of the solder paste tray 54
- the third driving member 55 is connected to the scraper 56 and drives the scraper 56 to reciprocate along the length direction of the solder paste tray 54, the scraper 56 is located on the solder paste tray Within 54.
- the scraper scrapes the solder paste in the solder paste tray, so that the solder paste falls to the soldering area of the chip through the tin leakage hole, thereby completing the soldering work of the chip; automating the soldering is beneficial to further improve the production efficiency; the chip
- the thickness of the tin on the welding area is uniform, and the quality of the tin is high.
- the bottom surface of the solder paste tray 54 has a recessed groove 58 provided along the longitudinal direction of the solder paste tray 54, and the both sides of the recessed recess 58 are provided with the tin leakage holes 57.
- the avoidance groove is used to avoid the raised area of the middle section of the chip, so that the solder paste tray can press the periphery of the bonding area of the chip, thereby improving the stability of the tin-on-chip mechanism.
- the medicine head unloading mechanism 7 includes a fourth driving member 71, a connecting frame 72, a cutter mechanism 73 and a gripping mechanism 74, the fourth driving member 71 is fixed on the frame 1 and along the medicine
- the conveying direction of the head material belt drives the connecting frame 72 to reciprocate, and the cutter mechanism 73 and the gripping mechanism 74 are respectively provided on the connecting frame 72.
- the cutter mechanism is used to cut off the connection between the drug head and the tape base material, so that the drug head is separated from the tape; Place into the welding jig assembly.
- connecting frame 72 is provided with a tape driving member 75.
- the tape driving member is used to drive the head tape forward.
- the chip welding device further includes a first abutment driving member 101
- the welding jig assembly 61 includes a welding seat 611, a base 612, and a guide rod 613, and the welding seat 611 and the base 612 pass along the vertical
- the guide rod 613 provided in the straight direction is connected, the welding seat 611 is located above the second turntable 6, the base 612 is located below the second turntable 6, the second turntable 6 is provided with the guide rod 613 matching guide holes, a welding groove is provided on the top surface of the welding seat 611;
- the first abutment driving member 101 is fixed on the frame 1 and is located below the second welding device 82, so The first abutment driving member 101 is used to abut against the base 612 to drive the welding base 611 to rise.
- the electronic detonator chip in the welding jig assembly should be located below the welding end of the wire.
- the first An abutment driving member will lift up the base, so that the electronic detonator chip on the welding base is in contact with/close to the wire, thereby allowing the second welding device to weld the electronic detonator chip and the wire.
- the chip soldering device further includes a second abutment driving member 102
- the soldering jig assembly 61 further includes a thimble assembly.
- the thimble assembly includes a bottom plate 614 and a thimble 615 provided on the bottom plate 614.
- the bottom plate 614 is sleeved on the guide rod 613, the bottom of the welding groove is provided with a pin hole matched with the thimble 615, and the second abutment driving member 102 is fixed on the frame 1 and Located under the second welding device 82, the second abutment driving member 102 is used to abut against the bottom plate 614 to drive the thimble 615 to rise.
- the thimble assembly is used to push the electronic detonator chip that has been soldered with the wire out of the soldering slot.
- the first embodiment of the present invention is: an integrated automatic welding equipment for electronic detonator production line, including a frame 1 and a chip processing device and a chip welding device respectively arranged on the frame 1
- a chip reclaiming device 9 the chip processing device includes a first turntable 2 and a chip material tape feeding mechanism 3, a chip material tape punching mechanism 4 and a chip tin soldering mechanism 5, which are sequentially arranged along the circumference of the first turntable 2.
- the first turntable 2 is provided with a chip bearing jig 21; the chip welding device includes a second turntable 6 and a medicine head unloading mechanism 7, a first welding device 81, and a second welding device that are sequentially arranged along the circumference of the second turntable 6 82.
- the second turntable 6 is provided with a welding jig assembly 61; the chip reclaiming device 9 is located between the first turntable 2 and the second turntable 6.
- the first turntable 2 and the second turntable 6 are driven by different driving members, respectively.
- the first welding device 81 and the second welding device 82 may use welding machines in the prior art.
- the chip material tape is a 10-plate material tape, that is, there are 10 chips on each material tape.
- the chip material tape feeding mechanism 3, the chip material tape punching mechanism 4, the chip on-tin mechanism 5 and the chip reclaiming device 9 are evenly distributed around the central axis of the first turntable 2, and the first turntable 2
- the number of the chip loading jigs 21 is four, and the four chip loading jigs 21 are evenly distributed around the central axis of the first turntable 2; the medicine head blanking mechanism 7 and the first welding device 81 ,
- the second welding device 82 and the chip reclaiming device 9 are evenly distributed around the central axis of the second turntable 6, the number of the welding jig components 61 on the second turntable 6 is four, four
- the welding jig assembly 61 is evenly distributed around the central axis of the second turntable 6.
- the chip tape loading mechanism 3 includes a first lifting mechanism 31, a material frame 32, a push-pull mechanism 33, and a material shifting mechanism 34; the first lifting mechanism 31, the push-pull mechanism 33, and the material shifting mechanism 34 are respectively provided in the rack 1, the material frame 32 is placed on the first lifting mechanism 31, the first lifting mechanism 31 drives the material frame 32 up and down, the material frame 32 has a plurality of parallel loading plate 35 ,
- the rack 1 is provided with a reclaiming table, the material frame 32 is provided with an opening on the side close to the reclaiming table, and the push-pull mechanism 33 is used for loading the material frame 32 with the loading of chip tape
- the plate 35 is transferred to the reclaiming table and the empty loading plate 35 on the reclaiming table is pushed back into the material frame 32, and the material moving mechanism 34 is used to move the loading plate 35 in the reclaiming table
- the chip material tape is transferred to the chip bearing jig 21 of the first turntable 2.
- the push-pull mechanism 33 includes a first driving member 331, a second driving member 332 and a clamping jaw 333, the first driving member 331 is disposed on the frame 1, and the first driving member 331 drives The second driving member 332 performs linear reciprocating motion, and the second driving member 332 is connected to the clamping jaw 333 and drives the clamping jaw 333 to open and close.
- the first elevating mechanism 31 includes an elevating platform 312 and an elevating platform elevating drive 311.
- the elevating platform elevating drive 311 is provided on the frame 1, and the elevating platform elevating drive 311 is connected to the elevating platform 312 And drive the lifting platform 312 to lift.
- the material transfer mechanism 34 includes a connected first vacuum suction nozzle 341 and a first three-axis movement mechanism 342.
- the first vacuum suction nozzle 341 can be driven by the first three-axis movement mechanism 342. It can move along the X-axis direction, it can move along the Y-axis direction, and it can also move along the Z-axis direction.
- the chip reclaiming device 9 includes a connected second vacuum suction nozzle 91 and a second three-axis moving mechanism 92.
- the second vacuum suction nozzle 91 can be driven along the X-axis direction by the second three-axis moving mechanism 92 It can move in the Y-axis direction and also in the Z-axis direction.
- a first roller 36 and a second roller 37 are provided in the reclaiming table, the first roller 36 is provided at the bottom of the reclaiming table, and second rollers 37 are provided on both sides of the reclaiming table ,
- the first roller 36 is used to support the loading plate 35 in the reclaiming table, and the second roller 37 is against the side wall of the loading plate 35 entering the reclaiming table to guide the loading plate 35, the first roller 36 and
- the setting of the second roller 37 can change the sliding friction between the loading plate 35 and the reclaiming table into rolling friction, which is beneficial to prolong the service life of the loading plate 35.
- the chip tape loading mechanism 3 further includes a first clamping driving member 381 and a first clamping block 382, and the first clamping driving member 381 is installed on the lifting platform 312 and connected to the first The clamping block 382, the first clamping block 382 is used to clamp the material frame 32 on the lifting platform 312, so as to prevent the material frame 32 from accidentally falling.
- the chip tape loading mechanism 3 further includes a second clamping driving member 391 and a second clamping block 392, and the second clamping driving member 391 is installed on the chassis 1 and connected to the second The clamping block 392 and the second clamping block 392 are used to clamp the loading plate 35 located in the reclaiming table, so that the loading plate 35 tightly abuts the second roller 37 on one side, so that the The loading plate 35 is positioned more accurately, so that the material moving mechanism 34 can accurately absorb the chip tape.
- the die cutting device 4 for a chip material includes a connected first punching drive 41 and a first cutter 42, the first punching drive 41 is installed on the frame 1, and the first punching
- the driving member 41 drives the first cutter 42 to move up and down.
- the first punching drive 41 may be a cylinder, a linear push rod, or the like.
- the tin-on-chip mechanism 5 includes a bracket 51, a lifting plate 52, a first lifting driving member 53, a solder paste tray 54, a third driving member 55 and a scraper 56, the first lifting driving member 53 is respectively connected to the bracket 51 and the lifting plate 52 also drive the lifting plate 52 to move up and down, the third driving member 55 and the solder paste tray 54 are respectively provided on the lifting plate 52, and the solder paste tray 54 is provided on the bottom plate 614 Tin leakage hole 57, the third driving member 55 directly or indirectly connects the scraper 56 and drives the scraper 56 to reciprocate along the length direction of the solder paste tray 54, the scraper 56 is located in the solder paste tray In 54, the scraper 56 is used to scrape the solder paste in the solder paste tray 54 (via the tin leakage hole 57) to the soldering area of the electronic detonator chip.
- the bottom surface of the solder paste tray 54 is provided with an avoiding groove 58 provided along the longitudinal direction of the solder paste tray 54, and the both sides of the avoiding groove 58 are provided with the tin leakage holes 57.
- the tin-on-chip mechanism 5 further includes a second lifting driving member 59, an output end of the second lifting driving member 59 is connected to the scraper 56, and the third driving member 55 passes through the second
- the lifting drive 59 is indirectly connected to the scraper 56.
- the height of the scraper 56 relative to the solder paste tray 54 is adjustable, which facilitates later maintenance of the scraper 56.
- the medicine head unloading mechanism 7 includes a fourth driving member 71, a connecting frame 72, a cutter mechanism 73 and a gripping mechanism 74, the fourth driving member 71 is fixed on the frame 1 and along the medicine head material belt
- the conveying direction drives the connecting frame 72 to reciprocate
- the cutter mechanism 73 and the gripping mechanism 74 are respectively provided on the connecting frame 72
- the connecting frame 72 is provided with a tape driving member 75.
- the material belt driving member 75 includes a rotation driving member and a rotation wheel. The rotation driving member is fixed on the connecting frame 72 and connected to the rotation wheel, and the rotation wheel abuts the top surface of the medicine head material belt And drive the medicine head material belt forward.
- a waste material cutting mechanism 76 is provided on the connecting frame 72, the waste material cutting mechanism 76 includes a connected second cutter and a second punching drive member, and the waste material cutting mechanism 76 is used for cutting out and removing the medicine head After the remaining drug head material with a substrate.
- a code scanning device 77 is provided on the connecting frame 72, and the code scanning device 77 is used to scan and record the code on the medicine head for later product traceability.
- the cutter mechanism 73 includes a connected third punching drive member and a third cutter, the third punching drive member is fixedly installed on the connecting frame 72;
- the grip mechanism 74 includes two The axis movement mechanism and the gripping assembly, assuming that the movement direction of the drug head material belt is the Y-axis direction, the gripping assembly can move along the X-axis direction and the Z-axis direction under the driving of the two-axis movement mechanism .
- the grip mechanism 74 can also be a driving mechanism with more degrees of freedom.
- the gripping mechanism 74 may grasp the medicine head before the cutter mechanism 73 cuts the medicine head, or may grasp the medicine head after the cutter 73 cuts the medicine head. In this embodiment, The hand mechanism 74 always grasps the medicine head during the process of cutting off the medicine head by the cutter mechanism 73 to avoid contamination of the medicine head from falling.
- the chip welding device further includes a first abutment driving member 101
- the welding jig assembly 61 includes a welding seat 611, a base 612, and a guide rod 613, and the welding seat 611 and the base 612 are arranged along a vertical direction
- the guide rod 613 is connected, the welding seat 611 is located above the second turntable 6, the base 612 is located below the second turntable 6, the second turntable 6 is provided with the guide rod 613 to cooperate Guide hole, a welding groove is provided on the top surface of the welding seat 611;
- the first abutment driving member 101 is fixed on the frame 1 and is located below the second welding device 82, the first The abutment driving member 101 is used to abut the base 612 to drive the welding base 611 to rise.
- the chip soldering device further includes a second abutment driving member 102
- the solder jig assembly 61 further includes a thimble assembly
- the thimble assembly includes a bottom plate 614 and a thimble 615 provided on the bottom plate 614
- the bottom plate 614 Sleeved on the guide rod 613, the bottom of the welding groove is provided with a pin hole matched with the thimble 615
- the second abutment driving member 102 is fixed on the frame 1 and is located on the Below the second welding device 82
- the second abutment driving member 102 is used to abut against the bottom plate 614 to drive the thimble 615 to rise.
- the thimble 615 has a hollow structure and is externally connected with an air suction device (such as a suction pump), so that the thimble 615 is used not only as an ejector but also as a suction nozzle, thereby achieving multiple uses.
- an air suction device such as a suction pump
- the integrated automatic welding equipment for the electronic detonator production line can realize chip material tape feeding, chip material die cutting, chip tin, chip material tape material discharging, drug chip welding,
- a series of processes such as chip wire welding have greatly improved the production efficiency of electronic detonators; the setting of the first and second turntables reduces the number of turnover equipment, not only reduces the manufacturing cost of integrated automatic welding equipment, but also reduces materials Time-consuming circulation further improves production efficiency; in addition, the integrated automatic welding equipment is small in size, which is conducive to occupying space.
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Abstract
电子雷管产线用一体化自动焊接设备，包括机架（1）和分别设于机架（1）上的芯片加工装置、芯片焊接装置和芯片取料装置（9），芯片加工装置包括第一转盘（2）及沿第一转盘（2）圆周依次设置的芯片料带上料机构（3）、芯片料带冲切机构（4）和芯片上锡机构（5），第一转盘（2）上设有芯片承载治具（21）；芯片焊接装置包括第二转盘（6）及沿第二转盘（6）圆周依次设置的药头下料机构（7）、第一焊接装置（81）和第二焊接装置（82），第二转盘（6）上设有焊接治具组件（61）；芯片取料装置（9）位于第一转盘（2）和第二转盘（6）之间。设备制造成本低，生产效率高，体积小。
Description
本发明涉及民用爆炸物品生产设备，尤其涉及电子雷管产线用一体化自动焊接设备。
电子雷管在生产的过程中需要经过芯片取料、芯片焊接、药头取料、药头焊接等工序，现有的电子雷管产线中实现上述工序往往需要使用的多台设备且多台设备沿流水线的运输方向排列，这就需要流水线断断续续的前行，严重影响了生产效率。
本发明所要解决的技术问题是：提供一种生产效率高的电子雷管产线用一体化自动焊接设备。
为了解决上述技术问题，本发明采用的技术方案为：电子雷管产线用一体化自动焊接设备，包括机架和分别设于所述机架上的芯片加工装置、芯片焊接装置和芯片取料装置，所述芯片加工装置包括第一转盘及沿第一转盘圆周依次设置的芯片料带上料机构、芯片料带冲切机构和芯片上锡机构，所述第一转盘上设有芯片承载治具；所述芯片焊接装置包括第二转盘及沿第二转盘圆周依次设置的药头下料机构、第一焊接装置和第二焊接装置，所述第二转盘上设有焊接治具组件；所述芯片取料装置位于所述第一转盘和第二转盘之间。
本发明的有益效果在于：设置第一、二转盘并通过优化芯片加工装置和芯片焊接装置组成机构的布局，制造出了一台能够实现芯片料带上料、芯片料带冲切、芯片上锡、药头料带下料、药头芯片焊接、芯片导线焊接等一系列工序的一体化自动焊接设备，极大程度上提高了电子雷管的生产效率；另外，第一、二转盘的设置减少了周转设备的数量，不仅降低了一体化自动焊接设备的制造成本，还减少了物料流转耗时，进一步提高了生产效率；另外，一体化自动焊接设备体积小，利于占用空间。
图1至图3分别为本发明实施例一的电子雷管产线用一体化自动焊接设备的整体结构的示意图；
图4为图3中细节A的放大图；
图5和图6分别为本发明实施例一的电子雷管产线用一体化自动焊接设备中的芯片料带上料机构的结构示意图；
图7为图5中细节B的放大图；
图8为本发明实施例一的电子雷管产线用一体化自动焊接设备中的芯片料带冲切机构的结构示意图；
图9为本发明实施例一的电子雷管产线用一体化自动焊接设备中的芯片上锡机构的结构示意图；
图10为本发明实施例一的电子雷管产线用一体化自动焊接设备中的锡膏盘的结构示意图；
图11和图12分别为本发明实施例一的电子雷管产线用一体化自动焊接设备中的药头下料机构的结构示意图；
图13为图12中细节C的放大图。
标号说明：
1、机架；2、第一转盘；21、芯片承载治具；3、芯片料带上料机构；31、第一升降机构；311、升降台升降驱动件；312、升降台；32、物料框；33、推拉机构；331、第一驱动件；332、第二驱动件；333、夹爪；34、移料机构；341、第一真空吸嘴；342、第一三轴移动机构；35、上料板；36、第一滚轮；37、第二滚轮；381、第一夹紧驱动件；382、第一夹块；391、第二夹紧驱动件；392、第二夹块；4、芯片料带冲切机构；41、第一冲切驱动件；42、第一切刀；5、芯片上锡机构；51、支架；52、升降板；53、第一升降驱动件；54、锡膏盘；55、第三驱动件；56、刮具；57、漏锡孔；58、避位槽；59、第二升降驱动件；6、第二转盘；61、焊接治具组件；611、焊接座；612、底座；613、导向杆；614、底板；615、顶针；7、药头下料机构；71、第四驱动件；72、连接架；73、切刀机构；74、抓手机构；75、料带驱动件；76、废料切除机构；77、编码扫描装置；81、第一焊接装置；82、第二焊接装置；9、芯片取料装置；91、第二真空吸嘴；92、第二三轴移动机构；101、第一顶抵驱动件；102、第二顶抵驱动件。
为详细说明本发明的技术内容、所实现目的及效果，以下结合实施方式并配合附图予以说明。
本发明最关键的构思在于：设置第一、二转盘并优化芯片加工装置和芯片焊接装置组成机构的布局使得一体化自动焊接设备能够实现芯片料带上料、芯片料带冲切、芯片上锡、药头料带下料、药头芯片焊接、芯片导线焊接等一系列工序。
请参照图1至图13，电子雷管产线用一体化自动焊接设备，包括机架1和分别设于所述机架1上的芯片加工装置、芯片焊接装置和芯片取料装置9，所述芯片加工装置包括第一转盘2及沿第一转盘2圆周依次设置的芯片料带上料机构3、芯片料带冲切机构4和芯片上锡机构5，所述第一转盘2上设有芯片承载治具21；所述芯片焊接装置包括第二转盘6及沿第二转盘6圆周依次设置的药头下料机构7、第一焊接装置81和第二焊接装置82，所述第二转盘6上设有焊接治具组件61；所述芯片取料装置9位于所述第一转盘2和第二转盘6之间。
本发明的工作原理简述如下：芯片料带上料机构3将芯片料带放置到第一转盘2的芯片承载治具21上后，第一转盘2转动使装载有芯片料带的承载治具转动到芯片料带冲切机构4的工作区域，然后芯片料带冲切机构4冲切掉芯片料带多余基带，使得仅有芯片留在承载治具上，接着第一转盘2转动使经过冲切的芯片（与承载治具一起）转动到芯片上锡机构5的工作区域，芯片上锡机构5对芯片两端的焊接区进行上锡，第一转盘2继续转动使上锡完成的芯片（与承载治具一起）转动到芯片取料装置9的工作区域，芯片取料装置9从承载治具上取出上锡后的芯片并将其放置到第二转盘6的焊接治具组件61中，第二转盘6转动使上锡完成的芯片（与焊接治具组件61一起）转动到药头下料机构7的工作区域，药头下料机构7将药头放置到焊接治具组件61上并让药头与芯片接触或靠近，第二转盘6继续转动使药头（与焊接治具组件61一起）转动到第一焊接装置81的工作区域，第一焊接装置81焊接药头与芯片，再然后，第二转盘6转动使焊接后的药头芯片（与焊接治具组件61一起）转动到第二焊接装置82的工作区域，第二焊接装置82焊接芯片与导线（导线可由流水线运输）。需要说明的是，第一、二转盘可由同一驱动件进行驱动，也可由不同的驱动件进行驱动，用户可根据实际需要选择。应当理解的，芯片料带冲切工位与芯片上锡工位的先后顺序是可以对调的，此与芯片料带上料机构3、芯片料带冲切机构4和芯片上锡机构5三者的排布方向及第一转盘2的转动方向有关，因此，芯片料带冲切工位与芯片上锡工位的先后顺序不应视为对本技术方案的限制。
从上述描述可知，本发明的有益效果在于：设置第一、二转盘并通过优化芯片加工装置和芯片焊接装置组成机构的布局，制造出了一台能够实现芯片料带上料、芯片料带冲切、芯片上锡、药头料带下料、药头芯片焊接、芯片导线焊接等一系列工序的一体化自动焊接设备，极大程度上提高了电子雷管的生产效率；另外，第一、二转盘的设置减少了周转设备的数量，不仅降低了一体化自动焊接设备的制造成本，还减少了物料流转耗时，进一步提高了生产效率；另外，一体化自动焊接设备体积小，利于占用空间。
进一步的，芯片料带上料机构3、芯片料带冲切机构4、芯片上锡机构5和芯片取料装置9绕所述第一转盘2的中心轴均布，所述第一转盘2上的所述芯片承载治具21的数量为四个，四个所述芯片承载治具21绕所述第一转盘2的中心轴均布；所述药头下料机构7、第一焊接装置81、第二焊接装置82和芯片取料装置9绕所述第二转盘6的中心轴均布，所述第二转盘6上的所述焊接治具组件61的数量为四个，四个所述焊接治具组件61绕所述第二转盘6的中心轴均布。
由上述描述可知，第一、二转盘每次转动均为90°，上述机构可同时工作，缩短工时，进一步提高生产效率。
进一步的，所述芯片料带上料机构3包括第一升降机构31、物料框32、推拉机构33和移料机构34；第一升降机构31、推拉机构33和移料机构34分别设于所述机架1上，所述物料框32放置在所述第一升降机构31上，所述第一升降机构31驱动所述物料框32升降，所述物料框32内具有多个平行设置的上料板35，所述机架1上设有取料台，所述物料框32靠近所述取料台的一侧设有开口，所述推拉机构33用于将物料框32中装载芯片料带的上料板35转移到所述取料台上以及将所述取料台上空载的上料板35推回物料框32中，所述移料机构34用于将取料台中的上料板35上的芯片料带转移到所述第一转盘2的所述芯片承载治具21中。
由上述描述可知，工作人员将装满上料板35的物料框放置在第一升降机构上后，一体化自动焊接设备就能够进行较长时间的自动生产，工作人员无需一直照看，利于解放劳动力，降低成本。
进一步的，所述推拉机构33包括第一驱动件331、第二驱动件332和夹爪333，所述第一驱动件331设于所述机架1上，所述第一驱动件331驱动所述第二驱动件332做直线往复运动，所述第二驱动件332与所述夹爪333相连并驱动所述夹爪333开合。
由上述描述可知，推拉机构结构简单、工作稳定、制造成本低。
进一步的，所述芯片上锡机构5包括支架51、升降板52、第一升降驱动件53、锡膏盘54、第三驱动件55和刮具56，所述第一升降驱动件53分别连接所述支架51和所述升降板52并驱动所述升降板52升降，所述第三驱动件55和锡膏盘54分别设于所述升降板52上，所述锡膏盘54的底板614上设有漏锡孔57，所述第三驱动件55连接所述刮具56并驱动所述刮具56沿锡膏盘54的长度方向往复运动，所述刮具56位于所述锡膏盘54内。
由上述描述可知，刮具刮动锡膏盘中的锡膏，使锡膏经由漏锡孔落到芯片的焊接区，从而完成芯片的上锡工作；自动化上锡，利于进一步提高生产效率；芯片焊接区的上锡厚度均匀，上锡质量高。
进一步的，所述锡膏盘54的底面具有沿锡膏盘54的长度方向设置的避位槽58，所述避位槽58的两侧分别设有所述漏锡孔57。
由上述描述可知，避位槽用于对芯片的中段的凸起区域进行避位，从而使得锡膏盘能够压住芯片的焊接区的周边，从而提高芯片上锡机构工作的稳定性。
进一步的，所述药头下料机构7包括第四驱动件71、连接架72、切刀机构73和抓手机构74，所述第四驱动件71固定在所述机架1上并沿药头料带的输送方向驱动所述连接架72往复移动，所述切刀机构73和所述抓手机构74分别设于所述连接架72上。
由上述描述可知，切刀机构用于切断药头与料带基材之间的连接，使得药头脱离料带；抓手机构用于抓取脱离料带基材的药头，并将药头放置到焊接治具组件中。
进一步的，所述连接架72上设有料带驱动件75。
由上述描述可知，料带驱动件用于驱动药头料带前进。
进一步的，所述芯片焊接装置还包括第一顶抵驱动件101，所述焊接治具组件61包括焊接座611、底座612和导向杆613，所述焊接座611与所述底座612通过沿竖直方向设置的所述导向杆613相连，焊接座611位于所述第二转盘6的上方，底座612位于所述第二转盘6的下方，所述第二转盘6上设有与所述导向杆613相配合的导向孔，所述焊接座611的顶面设有焊接槽；所述第一顶抵驱动件101固定在所述机架1上且位于所述第二焊接装置82的下方，所述第一顶抵驱动件101用于顶抵底座612以驱使所述焊接座611上升。
由上述描述可知，为避免流水线将导线流动到焊接位置时，导线与焊接治具组件发生干涉，焊接治具组件中的电子雷管芯片要位于导线焊接端的下方，在第二焊接装置工作之前，第一顶抵驱动件将会顶起底座，从而使得焊接座上的电子雷管芯片与导线接触/靠近，进而让第二焊接装置能够焊接电子雷管芯片与导线。
进一步的，所述芯片焊接装置还包括第二顶抵驱动件102，所述焊接治具组件61还包括顶针组件，所述顶针组件包括底板614和设于所述底板614上的顶针615，所述底板614套设在所述导向杆613上，所述焊接槽的底部设有与所述顶针615相配合的针孔，所述第二顶抵驱动件102固定在所述机架1上且位于所述第二焊接装置82的下方，所述第二顶抵驱动件102用于顶抵底板614以驱使所述顶针615上升。
由上述描述可知，顶针组件用于将与导线完成焊接的电子雷管芯片顶出焊接槽。
实施例一
请参照图1至图13，本发明的实施例一为：电子雷管产线用一体化自动焊接设备，包括机架1和分别设于所述机架1上的芯片加工装置、芯片焊接装置和芯片取料装置9，所述芯片加工装置包括第一转盘2及沿第一转盘2圆周依次设置的芯片料带上料机构3、芯片料带冲切机构4和芯片上锡机构5，所述第一转盘2上设有芯片承载治具21；所述芯片焊接装置包括第二转盘6及沿第二转盘6圆周依次设置的药头下料机构7、第一焊接装置81和第二焊接装置82，所述第二转盘6上设有焊接治具组件61；所述芯片取料装置9位于所述第一转盘2和第二转盘6之间。本实施例中，所述第一转盘2和第二转盘6分别通过不同的驱动件进行驱动。第一焊接装置81和第二焊接装置82可选用现有技术中的焊接机器。可选的，所述芯片料带为10联板料带，即每个料带上均均有10个芯片。
优选的，芯片料带上料机构3、芯片料带冲切机构4、芯片上锡机构5和芯片取料装置9绕所述第一转盘2的中心轴均布，所述第一转盘2上的所述芯片承载治具21的数量为四个，四个所述芯片承载治具21绕所述第一转盘2的中心轴均布；所述药头下料机构7、第一焊接装置81、第二焊接装置82和芯片取料装置9绕所述第二转盘6的中心轴均布，所述第二转盘6上的所述焊接治具组件61的数量为四个，四个所述焊接治具组件61绕所述第二转盘6的中心轴均布。
所述芯片料带上料机构3包括第一升降机构31、物料框32、推拉机构33和移料机构34；第一升降机构31、推拉机构33和移料机构34分别设于所述机架1上，所述物料框32放置在所述第一升降机构31上，所述第一升降机构31驱动所述物料框32升降，所述物料框32内具有多个平行设置的上料板35，所述机架1上设有取料台，所述物料框32靠近所述取料台的一侧设有开口，所述推拉机构33用于将物料框32中装载芯片料带的上料板35转移到所述取料台上以及将所述取料台上空载的上料板35推回物料框32中，所述移料机构34用于将取料台中的上料板35上的芯片料带转移到所述第一转盘2的所述芯片承载治具21中。详细的，所述推拉机构33包括第一驱动件331、第二驱动件332和夹爪333，所述第一驱动件331设于所述机架1上，所述第一驱动件331驱动所述第二驱动件332做直线往复运动，所述第二驱动件332与所述夹爪333相连并驱动所述夹爪333开合。所述第一升降机构31包括升降台312和升降台升降驱动件311，所述升降台升降驱动件311设于所述机架1上，所述升降台升降驱动件311连接所述升降台312并驱动所述升降台312升降。
本实施例中，所述移料机构34包括相连的第一真空吸嘴341和第一三轴移动机构342，第一真空吸嘴341在所述第一三轴移动机构342的驱动下既可以沿X轴方向移动，又可以沿Y轴方向移动，还可以沿Z轴方向移动。所述芯片取料装置9包括相连的第二真空吸嘴91和第二三轴移动机构92，第二真空吸嘴91在所述第二三轴移动机构92的驱动下既可以沿X轴方向移动，又可以沿Y轴方向移动，还可以沿Z轴方向移动。
优选的，所述取料台内设有第一滚轮36和第二滚轮37，所述第一滚轮36设于所述取料台的底部，取料台的两侧分别设有第二滚轮37，第一滚轮36用于支撑取料台内的上料板35，第二滚轮37抵触进入取料台内的上料板35的侧壁以对上料板35进行导向，第一滚轮36和第二滚轮37的设置可以将上料板35与取料台之间的滑动摩擦变为滚动摩擦，利于延长上料板35的使用寿命。
可选的，所述芯片料带上料机构3还包括第一夹紧驱动件381和第一夹块382，第一夹紧驱动件381安装在所述升降台312上并连接所述第一夹块382，第一夹块382用于夹持位于升降台312上的物料框32，从而防止物料框32意外掉落。可选的，所述芯片料带上料机构3还包括第二夹紧驱动件391和第二夹块392，第二夹紧驱动件391安装在所述机架1上并连接所述第二夹块392，第二夹块392用于夹持位于取料台内的上料板35，使上料板35紧紧抵靠一侧的所述第二滚轮37，从而让取料台内的上料板35定位更精准，进而让移料机构34能够准确地吸取芯片料带。
所述芯片料带冲切机构4包括相连的第一冲切驱动件41和第一切刀42，所述第一冲切驱动件41安装在所述机架1上，所述第一冲切驱动件41驱动所述第一切刀42升降。第一冲切驱动件41可以是气缸、直线推杆等。
所述芯片上锡机构5包括支架51、升降板52、第一升降驱动件53、锡膏盘54、第三驱动件55和刮具56，所述第一升降驱动件53分别连接所述支架51和所述升降板52并驱动所述升降板52升降，所述第三驱动件55和锡膏盘54分别设于所述升降板52上，所述锡膏盘54的底板614上设有漏锡孔57，所述第三驱动件55直接或间接连接所述刮具56并驱动所述刮具56沿锡膏盘54的长度方向往复运动，所述刮具56位于所述锡膏盘54内，所述刮具56用于将锡膏盘54中的锡膏（经由漏锡孔57）刮到电子雷管芯片的焊接区。
所述锡膏盘54的底面具有沿锡膏盘54的长度方向设置的避位槽58，所述避位槽58的两侧分别设有所述漏锡孔57。
可选的，所述芯片上锡机构5还包括第二升降驱动件59，所述第二升降驱动件59的输出端连接所述刮具56，所述第三驱动件55通过所述第二升降驱动件59间接连接所述刮具56。刮具56相对于锡膏盘54的高度是可调的，方便后期维护刮具56。
所述药头下料机构7包括第四驱动件71、连接架72、切刀机构73和抓手机构74，所述第四驱动件71固定在所述机架1上并沿药头料带的输送方向驱动所述连接架72往复移动，所述切刀机构73和所述抓手机构74分别设于所述连接架72上，所述连接架72上设有料带驱动件75。本实施例中，所述料带驱动件75包括转动驱动件和转动轮，转动驱动件固定在所述连接架72上并连接所述转动轮，所述转动轮抵触药头料带的顶面并驱动药头料带前进。可选的，所述连接架72上设有废料切除机构76，所述废料切除机构76包括相连的第二切刀和第二冲切驱动件，所述废料切除机构76用于切除取出药头后的残存药头料带基材。所述连接架72上设有编码扫描装置77，所述编码扫描装置77用于扫描并记录药头上的编码，以便后期进行产品追溯。
本实施例中，所述切刀机构73包括相连的第三冲切驱动件和第三切刀，第三冲切驱动件固定安装在所述连接架72上；所述抓手机构74包括二轴移动机构和夹取组件，假设药头料带的移动方向是Y轴方向，则夹取组件在所述二轴移动机构的带动下既可以沿X轴方向移动，又可以沿Z轴方向移动。在其他实施例中，所述抓手机构74还可以是更多自由度的驱动机构。另外，需要说明的是，抓手机构74既可以在切刀机构73切下药头之前就抓着药头，也可以在切刀73切下药头之后再抓着药头，本实施例中，抓手机构74在切刀机构73切下药头的过程中一直抓着药头，以避免药头坠落受到污染。
所述芯片焊接装置还包括第一顶抵驱动件101，所述焊接治具组件61包括焊接座611、底座612和导向杆613，所述焊接座611与所述底座612通过沿竖直方向设置的所述导向杆613相连，焊接座611位于所述第二转盘6的上方，底座612位于所述第二转盘6的下方，所述第二转盘6上设有与所述导向杆613相配合的导向孔，所述焊接座611的顶面设有焊接槽；所述第一顶抵驱动件101固定在所述机架1上且位于所述第二焊接装置82的下方，所述第一顶抵驱动件101用于顶抵底座612以驱使所述焊接座611上升。
所述芯片焊接装置还包括第二顶抵驱动件102，所述焊接治具组件61还包括顶针组件，所述顶针组件包括底板614和设于所述底板614上的顶针615，所述底板614套设在所述导向杆613上，所述焊接槽的底部设有与所述顶针615相配合的针孔，所述第二顶抵驱动件102固定在所述机架1上且位于所述第二焊接装置82的下方，所述第二顶抵驱动件102用于顶抵底板614以驱使所述顶针615上升。另外，优选的，所述顶针615为中空结构，外接吸气设备（如吸气泵），从而使得顶针615不仅作为顶出件使用还作为吸嘴使用，实现了一物多用。
综上所述，本发明提供的电子雷管产线用一体化自动焊接设备，能够实现芯片料带上料、芯片料带冲切、芯片上锡、药头料带下料、药头芯片焊接、芯片导线焊接等一系列工序，极大程度上提高了电子雷管的生产效率；第一、二转盘的设置减少了周转设备的数量，不仅降低了一体化自动焊接设备的制造成本，还减少了物料流转耗时，进一步提高了生产效率；另外，一体化自动焊接设备体积小，利于占用空间。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等同变换，或直接或间接运用在相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (10)
- 电子雷管产线用一体化自动焊接设备，其特征在于：包括机架和分别设于所述机架上的芯片加工装置、芯片焊接装置和芯片取料装置，所述芯片加工装置包括第一转盘及沿第一转盘圆周依次设置的芯片料带上料机构、芯片料带冲切机构和芯片上锡机构，所述第一转盘上设有芯片承载治具；所述芯片焊接装置包括第二转盘及沿第二转盘圆周依次设置的药头下料机构、第一焊接装置和第二焊接装置，所述第二转盘上设有焊接治具组件；所述芯片取料装置位于所述第一转盘和第二转盘之间。
- 根据权利要求1所述的电子雷管产线用一体化自动焊接设备，其特征在于：芯片料带上料机构、芯片料带冲切机构、芯片上锡机构和芯片取料装置绕所述第一转盘的中心轴均布，所述第一转盘上的所述芯片承载治具的数量为四个，四个所述芯片承载治具绕所述第一转盘的中心轴均布；所述药头下料机构、第一焊接装置、第二焊接装置和芯片取料装置绕所述第二转盘的中心轴均布，所述第二转盘上的所述焊接治具组件的数量为四个，四个所述焊接治具组件绕所述第二转盘的中心轴均布。
- 根据权利要求1所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述芯片料带上料机构包括第一升降机构、物料框、推拉机构和移料机构；第一升降机构、推拉机构和移料机构分别设于所述机架上，所述物料框放置在所述第一升降机构上，所述第一升降机构驱动所述物料框升降，所述物料框内具有多个平行设置的上料板，所述机架上设有取料台，所述物料框靠近所述取料台的一侧设有开口，所述推拉机构用于将物料框中装载芯片料带的上料板转移到所述取料台上以及将所述取料台上空载的上料板推回物料框中，所述移料机构用于将取料台中的上料板上的芯片料带转移到所述第一转盘的所述芯片承载治具中。
- 根据权利要求3所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述推拉机构包括第一驱动件、第二驱动件和夹爪，所述第一驱动件设于所述机架上，所述第一驱动件驱动所述第二驱动件做直线往复运动，所述第二驱动件与所述夹爪相连并驱动所述夹爪开合。
- 根据权利要求1所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述芯片上锡机构包括支架、升降板、第一升降驱动件、锡膏盘、第三驱动件和刮具，所述第一升降驱动件分别连接所述支架和所述升降板并驱动所述升降板升降，所述第三驱动件和锡膏盘分别设于所述升降板上，所述锡膏盘的底板上设有漏锡孔，所述第三驱动件连接所述刮具并驱动所述刮具沿锡膏盘的长度方向往复运动，所述刮具位于所述锡膏盘内。
- 根据权利要求5所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述锡膏盘的底面具有沿锡膏盘的长度方向设置的避位槽，所述避位槽的两侧分别设有所述漏锡孔。
- 根据权利要求1所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述药头下料机构包括第四驱动件、连接架、切刀机构和抓手机构，所述第四驱动件固定在所述机架上并沿药头料带的输送方向驱动所述连接架往复移动，所述切刀机构和所述抓手机构分别设于所述连接架上。
- 根据权利要求7所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述连接架上设有料带驱动件。
- 根据权利要求1所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述芯片焊接装置还包括第一顶抵驱动件，所述焊接治具组件包括焊接座、底座和导向杆，所述焊接座与所述底座通过沿竖直方向设置的所述导向杆相连，焊接座位于所述第二转盘的上方，底座位于所述第二转盘的下方，所述第二转盘上设有与所述导向杆相配合的导向孔，所述焊接座的顶面设有焊接槽；所述第一顶抵驱动件固定在所述机架上且位于所述第二焊接装置的下方，所述第一顶抵驱动件用于顶抵底座以驱使所述焊接座上升。
- 根据权利要求9所述的电子雷管产线用一体化自动焊接设备，其特征在于：所述芯片焊接装置还包括第二顶抵驱动件，所述焊接治具组件还包括顶针组件，所述顶针组件包括底板和设于所述底板上的顶针，所述底板套设在所述导向杆上，所述焊接槽的底部设有与所述顶针相配合的针孔，所述第二顶抵驱动件固定在所述机架上且位于所述第二焊接装置的下方，所述第二顶抵驱动件用于顶抵底板以驱使所述顶针上升。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670025A (zh) * | 2022-04-02 | 2022-06-28 | 无锡盛景微电子股份有限公司 | 一种用于模组工艺边分板及卡条装夹的一体化设备 |
| CN114888577A (zh) * | 2022-05-20 | 2022-08-12 | 苏州瀚川智能科技股份有限公司 | 连接头自动上料焊接装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113458804B (zh) * | 2020-11-27 | 2022-04-19 | 深圳市锐巽自动化设备有限公司 | 电子雷管连接机构 |
| CN112504037A (zh) * | 2020-11-27 | 2021-03-16 | 贵州盘江民爆有限公司 | 一种焊接设备以及装配生产线 |
| CN113146261B (zh) * | 2021-03-02 | 2022-10-25 | 杭州职业技术学院 | 一种usb金属外壳体成型焊接设备及其方法 |
| CN112916975A (zh) * | 2021-03-08 | 2021-06-08 | 东莞市东鸿自动化科技有限公司 | 一种用于电感的自动焊锡机以及自动焊锡方法 |
| CN114012918B (zh) * | 2022-01-05 | 2022-03-15 | 江苏明芯微电子股份有限公司 | 一种带有夹持结构的电子芯片的冲切工具 |
| CN117863571B (zh) * | 2023-12-06 | 2024-08-09 | 广东宏大韶化民爆有限公司 | 一种电子管芯片自动热缩套管装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110124381A (ko) * | 2010-05-11 | 2011-11-17 | (주)케이블루 | 탄약 뇌관의 접지 용접장치 |
| CN106181085A (zh) * | 2016-07-15 | 2016-12-07 | 浙江深科自动化科技有限公司 | 电磁系统全自动焊接机及其焊接工艺 |
| CN206241549U (zh) * | 2016-12-08 | 2017-06-13 | 贵州盘江民爆有限公司 | 一种数码雷管芯片焊接工装 |
| CN107091598A (zh) * | 2017-05-25 | 2017-08-25 | 贵州盘江民爆有限公司 | 一种电子雷管焊接和测试一体设备 |
| CN207087085U (zh) * | 2017-08-09 | 2018-03-13 | 东莞市诚信兴智能卡有限公司 | 一种芯片上锡机 |
| CN207139110U (zh) * | 2017-09-11 | 2018-03-27 | 珠海科斯特电源有限公司 | 内置电池全自动激光焊接生产线 |
| CN108827092A (zh) * | 2018-09-05 | 2018-11-16 | 贵州盘江民爆有限公司 | 一种电子雷管自动连续化生产线 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2626662Y (zh) * | 2003-08-08 | 2004-07-21 | 北京京煤集团有限责任公司化工厂 | 一种引火元件点焊机 |
| KR101298466B1 (ko) * | 2012-12-21 | 2013-08-26 | 대한민국(국방부 육군참모총장) | 기계적 절삭을 이용한 충전화약 회수 방법 및 시스템 |
| CN206869274U (zh) * | 2016-09-26 | 2018-01-12 | 立讯精密工业（滁州）有限公司 | 自动刮锡膏装置 |
| CN107363549B (zh) * | 2017-09-01 | 2023-08-29 | 泉州安肯自动化机械有限公司 | 一种轴承座转盘全自动加工装置 |
| CN107414299B (zh) * | 2017-09-11 | 2023-07-14 | 珠海冠宇电源有限公司 | 内置电池全自动激光焊接生产线 |
| CN107571025B (zh) * | 2017-09-28 | 2024-08-13 | 海目星（江门）激光智能装备有限公司 | 一种电芯极耳焊接加工设备 |
| CN108247257B (zh) * | 2018-03-29 | 2023-11-10 | 贵州盘江民爆有限公司 | 一种全自动电子雷管引火元件焊接测试生产线 |
| CN209716985U (zh) * | 2018-11-27 | 2019-12-03 | 前进民爆股份有限公司 | 电子雷管产线用一体化自动焊接设备 |
-
2018
- 2018-11-27 CN CN201811427993.5A patent/CN109531151B/zh active Active
-
2019
- 2019-01-30 WO PCT/CN2019/073937 patent/WO2020107706A1/zh active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110124381A (ko) * | 2010-05-11 | 2011-11-17 | (주)케이블루 | 탄약 뇌관의 접지 용접장치 |
| CN106181085A (zh) * | 2016-07-15 | 2016-12-07 | 浙江深科自动化科技有限公司 | 电磁系统全自动焊接机及其焊接工艺 |
| CN206241549U (zh) * | 2016-12-08 | 2017-06-13 | 贵州盘江民爆有限公司 | 一种数码雷管芯片焊接工装 |
| CN107091598A (zh) * | 2017-05-25 | 2017-08-25 | 贵州盘江民爆有限公司 | 一种电子雷管焊接和测试一体设备 |
| CN207087085U (zh) * | 2017-08-09 | 2018-03-13 | 东莞市诚信兴智能卡有限公司 | 一种芯片上锡机 |
| CN207139110U (zh) * | 2017-09-11 | 2018-03-27 | 珠海科斯特电源有限公司 | 内置电池全自动激光焊接生产线 |
| CN108827092A (zh) * | 2018-09-05 | 2018-11-16 | 贵州盘江民爆有限公司 | 一种电子雷管自动连续化生产线 |
Cited By (2)
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| CN114670025A (zh) * | 2022-04-02 | 2022-06-28 | 无锡盛景微电子股份有限公司 | 一种用于模组工艺边分板及卡条装夹的一体化设备 |
| CN114888577A (zh) * | 2022-05-20 | 2022-08-12 | 苏州瀚川智能科技股份有限公司 | 连接头自动上料焊接装置 |
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| CN109531151A (zh) | 2019-03-29 |
| CN109531151B (zh) | 2024-09-27 |
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