WO2020062929A1 - 具有电子元件的基座及音圈马达 - Google Patents

具有电子元件的基座及音圈马达 Download PDF

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Publication number
WO2020062929A1
WO2020062929A1 PCT/CN2019/090830 CN2019090830W WO2020062929A1 WO 2020062929 A1 WO2020062929 A1 WO 2020062929A1 CN 2019090830 W CN2019090830 W CN 2019090830W WO 2020062929 A1 WO2020062929 A1 WO 2020062929A1
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WIPO (PCT)
Prior art keywords
metal circuit
base
electronic component
branches
electronic components
Prior art date
Application number
PCT/CN2019/090830
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English (en)
French (fr)
Inventor
莫凑全
Original Assignee
苏州昀冢电子科技有限公司
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Publication date
Application filed by 苏州昀冢电子科技有限公司 filed Critical 苏州昀冢电子科技有限公司
Priority to US17/276,726 priority Critical patent/US12013448B2/en
Priority to JP2021507054A priority patent/JP7111886B2/ja
Publication of WO2020062929A1 publication Critical patent/WO2020062929A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/035—DC motors; Unipolar motors
    • H02K41/0352—Unipolar motors
    • H02K41/0354—Lorentz force motors, e.g. voice coil motors
    • H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G01R33/072—Constructional adaptation of the sensor to specific applications
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0225—Rotatable telephones, i.e. the body parts pivoting to an open position around an axis perpendicular to the plane they define in closed position
    • H04M1/0227—Rotatable in one plane, i.e. using a one degree of freedom hinge
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/035—DC motors; Unipolar motors
    • H02K41/0352—Unipolar motors
    • H02K41/0354—Lorentz force motors, e.g. voice coil motors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Definitions

  • the present application relates to the technical field of electronic components, for example, to a base with electronic components and a voice coil motor.
  • a base with a Hall element in a voice coil closed-loop motor in a mobile phone camera module includes a Hall element, a Flexible Printed Circuit Board (FPC), and a plastic case.
  • the Hall element is welded on the FPC, and the whole of the Hall element and the FPC is inlaid on a plastic case.
  • the production cost of the FPC in the pedestal of the above structure is high, resulting in a high overall cost of the pedestal.
  • the Hall element is welded to the FPC, and the The FPC is assembled on the plastic shell of the base, and the number of assembling steps is increased, which reduces the work efficiency.
  • This application proposes a base with an electronic component and a voice coil motor to solve the problems of complicated technology, low production efficiency, and high production cost in the related technology.
  • the application provides a pedestal with electronic components.
  • the pedestal includes:
  • a metal circuit that is connected to the electronic component and includes a plurality of branches, and the first ends of the plurality of branches are connected to the pins of the electronic component in a one-to-one correspondence;
  • the first plastic part is located at a position where the metal circuit is connected to the electronic component, and is configured to connect all the branches of the metal circuit as a whole, and limit each of the branches of the metal circuit. ;
  • a second plastic part is wrapped on the metal circuit, and each branch of the metal circuit protrudes from the second end of the second circuit far from the electronic component.
  • the first plastic part includes a positioning component, and the positioning component is configured to limit the first end of each branch connected to the electronic component in at least three different directions.
  • the first plastic part includes a plurality of positioning components, and the plurality of positioning components are connected to the branches in a one-to-one correspondence, and each positioning component is configured to connect the electronics to the corresponding branch.
  • the first end of the element is restrained in at least three different directions.
  • each of the positioning components includes at least three limit blocks, and different limit blocks abut on different positions on the corresponding branch road.
  • the metal circuit includes a metal substrate and a protective layer.
  • a plurality of the branches are made of the metal substrate, and the protective layer covers an outer surface of the metal substrate.
  • the protective layer includes an anti-oxidation layer and a soldering layer, and the soldering layer covers the outside of the anti-oxidation layer.
  • the first plastic part is integrally injection-molded with the metal circuit.
  • the second plastic part is integrally injection-molded with the metal circuit.
  • the metal circuit is stamped and formed from sheet metal.
  • the electronic component and the metal circuit are soldered by Surface Mount Technology (SMT).
  • SMT Surface Mount Technology
  • the present application provides a voice coil motor including the above-mentioned base with electronic components, and the electronic components are Hall elements.
  • the base with electronic components proposed in the present application replaces the FPC by a metal circuit, eliminating the need to manufacture the FPC, simplifying the production process of the base, and reducing material costs.
  • FIG. 1 is a schematic structural diagram of a base with electronic components according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a metal circuit according to an embodiment of the present application.
  • FIG. 3 is a structural diagram of a first plastic part and a metal circuit provided in an embodiment of the present application
  • FIG. 4 is a partially enlarged view at A in FIG. 3; FIG.
  • FIG. 5 is a schematic structural diagram of a Hall circuit welded to a metal circuit according to an embodiment of the present application
  • FIG. 6 is a flowchart of a production process of a base with an electronic component according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a plurality of interconnected metal substrates according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a metal circuit after being cut according to an embodiment of the present application.
  • the base includes electronic components 1, metal circuits 2, a first plastic part 3, and a second plastic part 4.
  • the metal circuit 2 is connected to the electronic component 1.
  • the metal circuit 2 includes a plurality of branches 21, and the first ends of the branches 21 are connected to the pins of the electronic component 1 in a one-to-one correspondence.
  • the metal circuit 2 includes a metal substrate and a protective layer.
  • the plurality of branches 21 are made of a metal substrate, and the protective layer covers the outer surface of the metal substrate.
  • the metal substrate is made of copper or stainless steel, and the thickness of the metal substrate is in the range of 0.05-0.2mm. For example, it can be selected as 0.06mm, 0.08mm, 0.10mm, 0.11mm, 0.13mm, 0.15mm, 0.16mm. , 0.18mm or 0.19mm.
  • the metal substrate is stamped from sheet metal, and the stamping method is simple and the production efficiency is high. In addition to forming the metal substrate by stamping, other wire cutting methods can also be adaptively used, which are all within the implementation scope of this embodiment.
  • the protective layer includes an anti-oxidation layer and a flux layer, and the flux layer covers the outside of the anti-oxidation layer.
  • the anti-oxidation layer is a nickel layer to prevent the metal circuit 2 from being oxidized to ensure the service life of the metal circuit 2.
  • the nickel layer is formed by electroplating.
  • the protection of the metal substrate may also be achieved by plating other anti-oxidation metals, which is specifically selected according to actual conditions; at the same time, other surface treatment methods for forming an anti-oxidation layer may be selected.
  • the soldering layer is a gold layer, a tin layer, or a combination of a gold layer and a tin layer, which is beneficial to improving the soldering quality when the electronic component 1 and the metal circuit 2 are soldered.
  • the flux layer is formed by electroplating. Of course, other surface treatment methods for forming an anti-oxidation layer can also be selected.
  • the first plastic part 3 is located at a position where the metal circuit 2 and the electronic component 1 are connected, and is configured to connect all the branches 21 of the metal circuit 2 as a whole.
  • the first plastic part 3 includes a plurality of positioning components.
  • the plurality of positioning components are connected to the branches 21 one by one.
  • Each positioning component performs at least three different directions on the first end of the corresponding branch 21 connected to the electronic component 1. Limiting the position can ensure the stable positioning of the first end of the branch circuit 21 connected to the electronic component 1.
  • each positioning component includes at least three limiting blocks 31, and different limiting blocks 31 abut against different positions on the corresponding branch 21, so that at least three of the corresponding branch 21 can be performed. Limits in different directions.
  • the number of the limiting blocks 31 in each positioning component can be selected to be three or more, and can be determined according to the shape of the branch 21.
  • each branch 21 of the metal circuit 2 is connected to the electronic component 1, when the size of the electronic component 1 is small, the distance between adjacent branches 21 is small, and the limiting blocks 31 corresponding to different branches 21 can be shared, or The connection as a whole can enhance the effect of stably supporting the branch 21 and ensure the stability of the metal circuit 2.
  • the second plastic part 4 is covered on the metal circuit 2, and the branch 21 of the metal circuit 2 extends away from the second end of the electronic component 1 to protrude from the second plastic part 4.
  • the circuit 2 plays a protective role.
  • the second end of the branch 21 of the metal circuit 2 far from the electronic component 1 is located outside the second plastic part 4 to realize connection with the external circuit so that the electronic component 1 realizes its own function.
  • the shape and structure of the second plastic part 4 can be adaptively selected according to the specific use occasion, which is not specifically limited in this embodiment.
  • the first plastic part 3 and the second plastic part 4 are integrally injection-molded with the metal circuit 2, and it is not necessary to separately produce the metal circuit 2, the first plastic part 3, and the second plastic part 4, and then no assembly process is required. , Simplifying the assembly process and improving the production efficiency of the base.
  • the base with electronic components in this embodiment replaces the FPC by the metal circuit 2 without manufacturing the FPC, which simplifies the production process of the base and reduces the material cost.
  • all the branches 21 of the metal circuit 2 are connected through the first plastic part 3 to realize the connection and connection between the multiple branches 21 of the metal circuit 2. Reinforced to obtain a high quality base.
  • the electronic component 1 and the metal circuit 2 are soldered by SMT, which can improve soldering efficiency.
  • This embodiment also relates to a voice coil motor including the above-mentioned base with electronic components, and the electronic component 1 is a Hall component. Because the production process of the base with electronic components is simplified and the cost is reduced, it is beneficial to simplify the assembly process of the voice coil motor and improve the production efficiency of the voice coil motor.
  • This embodiment also relates to a production process of a base with electronic components. As shown in FIGS. 6 and 7, the production process includes the following steps.
  • the electronic component 1 is soldered to the FPC by spot welding. Therefore, repeated positioning of each FPC is required, but the accuracy of repeated positioning of the FPC has high requirements. In the actual production process, the accuracy of each positioning cannot be completely guaranteed. At the same time, FPC itself has geometric tolerances. Based on the above, the overall defect rate of the pedestal produced by the assembly process is high, and welding is performed after positioning one by one, resulting in low production efficiency and poor mass productivity.
  • step S10 by punching a plurality of interconnected metal substrates on the long sheet 5, continuous production or mass production can be achieved in subsequent multiple steps, which is beneficial to improving production efficiency.
  • a plurality of positioning holes 51 are also punched and formed on the long sheet 5.
  • the sheet can be aligned with the positioning pins inserted into the positioning holes 51. 5 positioning, so that multiple metal substrates can be positioned at the same time, avoiding the problem of low positioning efficiency by repeating positioning one by one.
  • the positioning pins are provided on the forming device in the corresponding process.
  • other methods such as wire cutting can be adaptively used, which are all within the implementation scope of this embodiment.
  • the long sheet 5 is made of a material such as copper or stainless steel. In other embodiments, the long sheet 5 may also be a long sheet selected from other metals or alloys according to specific conditions, which can be used to conduct electricity and be soldered to the electronic component 1.
  • the thickness of the long sheet 5 is in the range of 0.05-0.2 mm, and for example, 0.06 mm, 0.08 mm, 0.10 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.16 mm, 0.18 mm, or 0.19 mm can be selected.
  • the reel can be driven to rotate by an automatic traction device or a feeding device when processing in the next step, which is beneficial to realize automatic feeding.
  • the anti-oxidation layer is formed by nickel plating to prevent the metal circuit 2 from being oxidized to ensure the service life of the metal circuit 2.
  • the protection of the metal substrate may also be achieved by plating other anti-oxidation metals, which is specifically selected according to actual conditions; at the same time, other surface treatment methods for forming an anti-oxidation layer may be selected.
  • the anti-oxidation layer is plated with gold or tin to form a soldering layer, and both gold and tin can be plated to achieve a better soldering effect.
  • the soldering flux layer facilitates the welding process, and can improve the welding quality when the metal circuit 2 and the electronic component 1 are soldered to each other.
  • the formed metal circuit 2 is packaged on a reel.
  • the reel can be driven to rotate by an automatic traction device or a feeding device, which is beneficial to realize automatic feeding.
  • the injection temperature is 250-390 degrees Celsius (° C), for example, 260 ° C, 270 ° C, 280 ° C, 290 ° C, 300 ° C, 310 ° C, 320 ° C, 330 ° C can be selected. , 340 ° C, 350, 360 ° C, 370 ° C or 380 ° C.
  • the injection time is 5-15 seconds (s), for example, it can be selected as 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s, or 14s.
  • the electronic component 1 is soldered to the first semi-finished product through the SMT process to form a second semi-finished product, as shown in FIG. 5.
  • the welding temperature of the SMT process is 150-350 ° C.
  • it can be selected as 160 ° C, 170 ° C, 180 ° C, 190 ° C, 200 ° C, 210 ° C, 220 ° C, 230 ° C, 240 ° C, 250 ° C. , 260 ° C, 270 ° C, 280 ° C, 290 ° C, 300 ° C, 310 ° C, 320 ° C, 330 ° C, 340 ° C or 350 ° C.
  • the position marked with a dotted line in FIG. 8 is bent along the dotted line.
  • the injection temperature is 250-390 ° C.
  • the injection time is 5-15s. For example, it can be 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s, or 14s.
  • the multiple connected bases are cut to form a single base, as shown in FIG. 1, so as to facilitate the assembly of the bases into the corresponding voice coil closed-loop motors one by one.
  • this step includes cutting the strips of the long sheet 5 connected to the plurality of bases, and also cutting off the connection portions of each metal circuit connected to different branches 21.
  • the cutting machine used in this step is provided with a cutting material belt and a multi-hole number dividing function, which can realize the simultaneous cutting of multiple interconnected bases into multiple single bases at the same time, which can improve the operating efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Windings For Motors And Generators (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

本申请公开了一种具有电子元件的基座及音圈马达。具有电子元件的基座包括电子元件、金属电路、第一塑胶件和第二塑胶件。金属电路与所述电子元件连接，且包括多个支路，多个所述支路的第一端与所述电子元件的引脚一一对应连接；第一塑胶件位于所述金属电路与所述电子元件连接的位置，设置为将所述金属电路的所有支路连接为一体，并对所述金属电路的每个支路进行限位；第二塑胶件包覆在所述金属电路上，所述金属电路的支路远离电子元件的第二端伸出所述第二塑胶件。

Description

具有电子元件的基座及音圈马达
本申请要求在2018年09月25日提交中国专利局、申请号为201811114105.4的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子元件技术领域，例如涉及一种具有电子元件的基座及音圈马达。
背景技术
手机摄像头模组中音圈闭环马达中的具有霍尔元件的基座，包括霍尔元件、柔性印刷电路板(Flexible Printed Circuit，FPC)和塑料壳体。其中，霍尔元件焊接在FPC上，霍尔元件和FPC的整体镶嵌在塑料壳体上。上述结构的基座中的FPC的生产成本高，从而导致基座整体成本较高，另外，在生产该基座的过程中，霍尔元件焊接在FPC上，还需要将带有霍尔元件的FPC装配到基座的塑料壳体上，装配步骤增加，降低了工作效率。
基于以上问题，亟需一种能够解决相关技术中工艺复杂、生产效率低以及生产成本高的问题的具有电子元件的基座及音圈马达。
发明内容
本申请提出一种具有电子元件的基座及音圈马达，以解决相关技术中工艺复杂、生产效率低以及生产成本高的问题。
本申请提供一种具有电子元件的基座，该基座包括：
电子元件；
金属电路，与所述电子元件连接，且包括多个支路，多个所述支路的第一端与所述电子元件的多个引脚一一对应连接；
第一塑胶件，位于所述金属电路与所述电子元件连接的位置，设置为将所述金属电路的所有支路连接为一体，并对所述金属电路的每个所述支路进行限位；
第二塑胶件，包覆在所述金属电路上，所述金属电路的每个支路远离电子元件的第二端伸出所述第二塑胶件。
在一实施例中，所述第一塑胶件包括定位组件，所述定位组件设置为对每 个支路连接所述电子元件的第一端进行至少三个不同方向的限位。
在一实施例中，所述第一塑胶件包括多个定位组件，多个定位组件与多个所述支路一一对应连接，每个定位组件设置为对相应所述支路连接所述电子元件的第一端进行至少三个不同方向的限位。
在一实施例中，每个所述定位组件包括至少三个限位块，不同的所述限位块抵靠于相应所述支路上的不同位置。
在一实施例中，所述金属电路包括金属基材和防护层，多个所述支路由所述金属基材制成，所述防护层覆盖于所述金属基材的外表面上。
在一实施例中，所述防护层包括抗氧化层和助焊层，所述助焊层覆盖在所述抗氧化层外部。
在一实施例中，所述第一塑胶件与所述金属电路一体注塑成型。
在一实施例中，所述第二塑胶件与所述金属电路一体注塑成型。
在一实施例中，所述金属电路由板材冲压成型。
在一实施例中，所述电子元件与所述金属电路通过表面组装技术(Surface Mount Technology，SMT)焊接。
本申请提供一种音圈马达，该音圈马达包括上述的具有电子元件的基座，所述电子元件为霍尔元件。
本申请提出的具有电子元件的基座，通过金属电路代替FPC，无需制造FPC，简化了基座的生产工艺，降低了材料成本。
附图说明
图1是本申请实施例提供的具有电子元件的基座的结构示意图；
图2是本申请实施例提供的金属电路的结构示意图；
图3是本申请实施例提供的第一塑胶件与金属电路的结构示
意图；
图4是图3中A处的局部放大图；
图5是本申请实施例提供的金属电路上焊接有霍尔元件后的结构示意图；
图6是本申请实施例提供的具有电子元件的基座的生产工艺的流程图；
图7是本申请实施例提供的多个相互连接的金属基材的结构示意图；
图8是本申请实施例提供的对金属电路进行裁切后的结构示意图。
其中，1、电子元件；2、金属电路；3、第一塑胶件；4、第二塑胶件；5、片材；
21、支路；31、限位块；51、定位孔。
具体实施方式
下面结合附图并通过具体实施方式来说明本申请的技术方案。
本实施方式涉及一种具有电子元件的基座，如图1-图5所示，该基座包括电子元件1、金属电路2、第一塑胶件3和第二塑胶件4。
本实施例中，金属电路2与电子元件1连接，如图2所示，金属电路2包括多个支路21，支路21的第一端与电子元件1的引脚一一对应连接。
本实施方式中，金属电路2包括金属基材和防护层，多个支路21由金属基材制成，防护层覆盖于金属基材的外表面上。
其中，金属基材由铜或不锈钢等材料制成，金属基材的厚度范围为0.05-0.2mm，例如可以选择为0.06mm、0.08mm、0.10mm、0.11mm、0.13mm、0.15mm、0.16mm、0.18mm或0.19mm。金属基材由板材冲压而成，冲压成型的方式简单、生产效率高。除了采用冲压成型的方式成型出金属基材外，还能够适应性地采用其他的线切割等方式，均在本实施例的实现范围之内。
防护层包括抗氧化层和助焊层，助焊层覆盖在抗氧化层外部。抗氧化层为镍层，避免金属电路2氧化，以保证金属电路2的使用寿命。镍层的形成通过电镀实现。其他实施例中还可以通过镀覆其他抗氧化金属实现对金属基材的保护，具体通过实际情况进行选择；同时还可以选择其他的形成抗氧化层的表面处理方法。
助焊层为金层、锡层或者为金层和锡层的结合，有利于提高电子元件1和金属电路2焊接时的焊接质量。助焊层通过电镀形成，当然还可以选择其他的形成抗氧化层的表面处理方法。
如图3和图4所示，第一塑胶件3位于金属电路2与电子元件1连接的位置，设置为将金属电路2的所有支路21连接为一体。第一塑胶件3包括多个定位组件，多个定位组件与多个支路21一一对应连接，每个定位组件对相应支路21连接电子元件1的第一端进行至少三个不同方向的限位，从而能够保证对支路21连接电子元件1的第一端进行稳固的定位。在一实施例中，每个定位组件包括至少三个限位块31，不同的所述限位块31抵靠于相应支路21上的不同位置，进而能够对相应的支路21进行至少三个不同方向的限位。每个定位组件中 的限位块31的个数可以选择为三个或更多个，可以根据支路21的形状进行确定。
由于金属电路2的每个支路21均与电子元件1连接，电子元件1尺寸较小时，相邻支路21之间的间距较小，不同支路21对应的限位块31可以共用，或者连接为一体，从而能够增强对支路21稳定支撑的效果，保证金属电路2的稳定性。
如图1所示，第二塑胶件4包覆在金属电路2上，金属电路2的支路21远离电子元件1的第二端伸出第二塑胶件4，第二塑胶件4能够对金属电路2起到保护作用，同时金属电路2的支路21远离电子元件1的第二端位于第二塑胶件4的外部，实现与外部电路的连接，以使电子元件1实现自身功能。其中，第二塑胶件4的形状和结构可根据具体使用场合进行适应性选用，本实施方式中不做具体限定。
本实施方式中，第一塑胶件3和第二塑胶件4均与金属电路2一体注塑成型，无需单独生产金属电路2、第一塑胶件3和第二塑胶件4，之后无需再进行装配工序，简化了装配工艺，提高了基座的生产效率。
本实施方式中的具有电子元件的基座通过金属电路2代替FPC，无需制造FPC，简化了基座的生产工艺，降低了材料成本。同时，为了保证金属电路2在基座生产过程中的稳定性，通过第一塑胶件3将金属电路2的所有支路21连接起来，实现对金属电路2多个支路21之间进行连接和加固，从而能够获得高质量的基座。
电子元件1与金属电路2通过SMT焊接，能够提高焊接效率。
本实施方式还涉及了一种音圈马达，包括上述的具有电子元件的基座，电子元件1为霍尔元件。由于具有电子元件的基座的生产工艺得到简化、成本得到降低，因此有利于简化音圈马达的组装工艺、提高音圈马达的生产效率。
本实施方式还涉及一种具有电子元件的基座的生产工艺，如图6和图7所示，该生产工艺包括以下步骤。
S10、将长条片材5冲压成多个相互连接的预设形状的金属基材，并进行卷盘包装。
传统点锡焊接工艺在焊接时，电子元件1通过点焊焊接到FPC上。因此，需要对每个FPC进行重复定位，但是对FPC重复定位的精度具有较高的要求，在实际生产过程中，无法完全保证每次定位的精度。同时FPC本身存在形位公差。基于以上情况，组装工艺生产的基座的整体不良率高，并且逐个定位后焊接，造成生产效率低，量产性不好。
该步骤S10中，通过在长条片材5上冲压多个相互连接的金属基材，能够在后续的多个步骤中实现连续生产或批量生产，有利于提高生产效率。如图7所示，在该步骤中还在长条片材5上冲压成型有多个定位孔51，在后续的多个工艺步骤中，能够通过穿入定位孔51中的定位销对片材5定位，从而实现对多个金属基材同时定位，避免逐个重复定位效率低的问题。本实施例中，定位销设置在相应工序中的成型装置上。本实施例中，除了采用冲压成型的方式成型出金属基材外，还能够适应性地采用其他的线切割等方式，均在本实施例的实现范围之内。
本实施例中，长条片材5由铜或不锈钢等材料制成。在其他实施例中，长条片材5还可以为根据具体情况选择其他金属或合金的长条片材，能够实现导电以及与电子元件1焊接即可。长条片材5的厚度范围为0.05-0.2mm，例如可以选择为0.06mm、0.08mm、0.10mm、0.11mm、0.13mm、0.15mm、0.16mm、0.18mm或0.19mm。
对金属基材进行卷盘包装，在接下来的步骤中进行加工时，能够通过自动牵引装置或送料装置驱动卷盘转动，有利于实现自动送料。
S20、在金属基材表面镀覆抗氧化层。
在一实施例中，通过镀镍形成抗氧化层，避免金属电路2氧化，以保证金属电路2的使用寿命。其他实施例中还可以通过镀覆其他抗氧化金属实现对金属基材的保护，具体通过实际情况进行选择；同时还可以选择其他的形成抗氧化层的表面处理方法。
S30、在抗氧化层外镀覆助焊层，从而形成多个连续的金属电路2，并进行卷盘包装。
在一实施例中，在抗氧化层外镀金或镀锡形成助焊层，还可以既镀金也镀锡，实现较好的助焊效果。助焊层有助于焊接工艺的进行，在金属电路2和电子元件1相互焊接时，能够提高焊接质量。
对形成的金属电路2进行卷盘包装，在接下来的步骤中进行加工时，能够通过自动牵引装置或送料装置驱动卷盘转动，有利于实现自动送料。
S40、对金属电路2上连接电子元件1的位置注塑成型第一塑胶件3，形成第一半成品，如图3和图4所示。
在一实施例中，进行注塑成型时，注塑温度均为250-390摄氏度(℃)，例如可以选择为260℃、270℃、280℃、290℃、300℃、310℃、320℃、330℃、340℃、350、360℃、370℃或380℃。注塑时间为5-15秒(s)，例如可以选择为6s、7s、8s、9s、10s、11s、12s、13s或14s。
S50、将电子元件1通过SMT工艺焊接到第一半成品上，形成第二半成品，如图5所示。
在一实施例中，SMT工艺的焊接温度为150-350℃，例如可以选择为160℃、170℃、180℃、190℃、200℃、210℃、220℃、230℃、240℃、250℃、260℃270℃、280℃、290℃、300℃、310℃、320℃、330℃、340℃或350℃。
S60、对第二半成品件中的金属电路2进行裁切，如图8所示。
S70、对裁切后的第二半成品件中的金属电路2进行弯折。
在一实施例中，对图8中标有虚线的位置沿虚线进行弯折。
S80、在弯折后的第二半成品上注塑成型第二塑胶件4，形成多个相互连接的基座。
注塑温度均为250-390℃，例如可以选择为260℃、270℃、280℃、290℃、300℃、310℃、320℃、330℃、340℃、350、360℃、370℃或380℃。注塑时间为5-15s，例如可以选择为6s、7s、8s、9s、10s、11s、12s、13s或14s。
S90、对多个相互连接的基座进行裁切，形成单个的基座，如图1所示，以方便将基座逐个装配到相应的音圈闭环马达中。
在一实施例中，该步骤中包括对长条片材5连接多个基座的料带进行裁切，还包括将每个金属电路中的连接不同支路21的连接部裁掉。本步骤中采用的裁切机带有裁断料带和多穴数分穴功能，能够实现一次将多个相互连接的基座同时裁切成多个单个的基座，能够提高作业效率。

Claims (10)

  1. 一种具有电子元件的基座，包括：
    电子元件(1)；
    金属电路(2)，与所述电子元件(1)连接，且包括多个支路(21)，多个所述支路(21)的第一端与所述电子元件(1)的多个引脚一一对应连接；
    第一塑胶件(3)，位于所述金属电路(2)与所述电子元件(1)连接的位置，设置为将所述金属电路(2)的所有支路(21)连接为一体，并对所述金属电路(2)的每个所述支路(21)进行限位；
    第二塑胶件(4)，包覆在所述金属电路(2)上，所述金属电路(2)的每个支路(21)远离电子元件(1)的第二端伸出所述第二塑胶件(4)。
  2. 根据权利要求1所述的具有电子元件的基座，其中，所述第一塑胶件(3)包括多个定位组件，多个所述定位组件与多个所述支路(21)一一对应连接，每个所述定位组件设置为对相应所述支路(21)连接所述电子元件(1)的第一端进行至少三个不同方向的限位。
  3. 根据权利要求2所述的具有电子元件的基座，其中，每个所述定位组件包括至少三个限位块(31)，不同的所述限位块(31)抵靠于相应所述支路(21)上的不同位置。
  4. 根据权利要求1、2或3所述的具有电子元件的基座，其中，所述金属电路(2)包括金属基材和防护层，多个所述支路(21)由所述金属基材制成，所述防护层覆盖于所述金属基材的外表面上。
  5. 根据权利要求4所述的具有电子元件的基座，其中，所述防护层包括抗氧化层和助焊层，所述助焊层覆盖在所述抗氧化层外部。
  6. 根据权利要求1-5任一项所述的具有电子元件的基座，其中，所述第一塑胶件(3)与所述金属电路(2)一体注塑成型。
  7. 根据权利要求1-6任一项所述的具有电子元件的基座，其中，所述第二塑胶件(4)与所述金属电路(2)一体注塑成型。
  8. 根据权利要求1-7任一项所述的具有电子元件的基座，其中，所述金属电路(2)由板材冲压成型。
  9. 根据权利要求1-8任一项所述的具有电子元件的基座，其中，所述电子元件(1)与所述金属电路(2)通过表面组装技术SMT焊接。
  10. 一种音圈马达，包括权利要求1-9任一项所述的具有电子元件的基座，所述电子元件(1)为霍尔元件。
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