WO2020049989A1 - Module et procédé de production de module - Google Patents

Module et procédé de production de module Download PDF

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Publication number
WO2020049989A1
WO2020049989A1 PCT/JP2019/032284 JP2019032284W WO2020049989A1 WO 2020049989 A1 WO2020049989 A1 WO 2020049989A1 JP 2019032284 W JP2019032284 W JP 2019032284W WO 2020049989 A1 WO2020049989 A1 WO 2020049989A1
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WO
WIPO (PCT)
Prior art keywords
substrate
flexible
rigid
mold resin
electronic component
Prior art date
Application number
PCT/JP2019/032284
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English (en)
Japanese (ja)
Inventor
▲高▼木昌由
佐藤和茂
岡本和也
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2020049989A1 publication Critical patent/WO2020049989A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to a module and a method for manufacturing the module.
  • a multilayer mounting board in which a rigid board on which electronic components are mounted and a flexible board on which the electronic components are mounted are connected.
  • Patent Document 1 discloses that two rigid boards are connected by a flexible board, and the flexible board is bent so as to form three or more odd-numbered layers.
  • a multilayer mounting board in which electronic components are mounted on at least one of the front and back surfaces of a flexible board is described.
  • Patent Document 1 describes that the multilayer mounting board having the above-described configuration can prevent a short circuit of an electronic component on a flexible board.
  • the flexible board since the flexible board has flexibility, the flexible board may be deformed after mounting the electronic component, and the connection reliability between the electronic component and the flexible board may be reduced. There is.
  • the flexible board may be deformed by the weight of the mold resin when the mold resin is supplied.
  • the present invention has been made to solve the above problems, and has a configuration in which a mold resin is provided between a rigid substrate and a flexible substrate, and is capable of suppressing deformation of the flexible substrate during supply of the mold resin. And a method for manufacturing such a module.
  • the module of the present invention A rigid substrate, An opposing portion opposing the rigid substrate at a position away from the rigid substrate, and a flexible substrate having at least two connecting portions connecting the opposing portion and the rigid substrate, Electronic components, Mold resin provided at least in the filling portion between the rigid substrate and the facing portion of the flexible substrate, With The electronic component is mounted on the flexible substrate, At least one of the at least two connecting portions has an opening.
  • the electronic component is mounted on a first main surface, which is a surface of the facing portion opposite to the rigid substrate,
  • the mold resin may be provided so as to cover not only the filling portion but also the electronic component mounted on the first main surface.
  • the electronic component may be mounted on the connection section.
  • the electronic component may be mounted on a second main surface of the facing portion facing the filling portion.
  • a portion of the flexible substrate that constitutes the filling portion may be provided with an electromagnetic wave shielding portion for blocking electromagnetic waves.
  • a plurality of the filling portions may be formed.
  • a signal line sandwiched between electrodes connected to the ground potential may be arranged in the connection portion.
  • the method for manufacturing a module according to the present invention comprises: Providing a plurality of openings at predetermined positions of the flexible collective board on which the electronic component is mounted, Bending the flexible collective substrate to form a plurality of cavities, The rigid assembly board and the flexible assembly board are aligned with each other so that the electronic component mounted on the rigid assembly board is located in the cavity, and then the rigid assembly board and the flexible assembly board are joined.
  • the molding portion is provided with the molding resin, the deformation of the flexible substrate can be suppressed.
  • the mold resin supplied onto the flexible substrate at the time of manufacturing the module flows into the cavity from the opening provided in at least one of the connection portions, so that the flexible substrate is deformed when the mold resin is supplied. Can also be suppressed.
  • the mold resin flows into the cavity from an opening provided at a predetermined position of the flexible collective board, Since the cavity is filled with the mold resin, the deformation of the flexible collective substrate due to the weight of the mold resin during supply of the mold resin can be suppressed. Also, a plurality of modules can be manufactured at once.
  • FIG. 2 is a cross-sectional view schematically illustrating a configuration of a module according to the first embodiment. It is a perspective view which shows typically the whole rigid board and flexible board which comprise a module.
  • FIG. 3 is a cross-sectional view illustrating a signal line provided at a connection portion of a flexible substrate. It is a top view showing a flexible collective substrate. It is a figure showing the state where an opening was provided in a flexible collective substrate.
  • FIG. 6 is a cross-sectional view taken along a line VI-VI in FIG. 5 after bending the flexible collective substrate.
  • FIG. 9 is a diagram illustrating a state in which the rigid assembly board and the flexible assembly board are aligned so that the electronic components mounted on the rigid assembly board are positioned in the cavities.
  • FIG. 1 is a cross-sectional view schematically illustrating a configuration of a module 100 according to the first embodiment.
  • FIG. 2 is a perspective view schematically showing the entire shape of the rigid board 1 and the flexible board 2 constituting the module 100.
  • FIG. 1 is a cross-sectional view of the module 100 of FIG. 2 taken along the line II. However, in FIG. 2, the mold resin 4 is omitted.
  • the module 100 includes a rigid board 1, a flexible board 2, a plurality of electronic components 3, and a mold resin 4.
  • the rigid substrate 1 has a flat plate shape, and has a first main surface 1a and a second main surface 1b.
  • the rigid substrate 1 is a substrate having a certain degree of rigidity, and cannot be bent freely like a flexible substrate 2 described later.
  • the rigid substrate 1 may be a single-layer substrate or a multilayer substrate.
  • the rigid board 1 is a single-layer board, it is made of, for example, ceramic or glass epoxy resin.
  • the rigid substrate 1 is a multilayer substrate, for example, a configuration can be adopted in which an insulating layer made of ceramic or glass epoxy resin and a wiring layer are alternately laminated.
  • the wiring formed in the wiring layer can be formed of, for example, at least one metal of Ag and Cu.
  • the electronic component 3 is mounted on the first main surface 1a of the rigid substrate 1 which is the surface on the flexible substrate 2 side. More specifically, the electronic component 3 is mounted on the first main surface 1a of the rigid board 1 and between the opposing portion 21 of the flexible board 2 described later and the rigid board 1.
  • the filling portion 10 between the opposing portion 21 of the flexible substrate 2 and the rigid substrate 1 is filled with the mold resin 4, but is filled with the mold resin 4 in the manufacturing process of the module 100.
  • the previous space is referred to herein as a "cavity.”
  • a mounting electrode may be provided on the second main surface 1b of the rigid substrate 1 opposite to the first main surface 1a.
  • the mounting electrode may have a configuration in which, for example, an electrode made of Cu is plated with Au.
  • the flexible substrate 2 has flexibility and can be freely bent or cut out.
  • the flexible substrate 2 is made of, for example, a polyimide resin, a polyester resin, or a liquid crystal polymer.
  • a copper-clad laminate in which a copper foil is attached to an insulator, an insulator sheet with a copper foil, or the like may be used.
  • the flexible substrate 2 has an opposing portion 21 facing the rigid substrate 1 at a position distant from the rigid substrate 1, and at least two connecting portions 22 connecting the opposing portion 21 and the rigid substrate 1.
  • the flexible substrate 2 has four connecting portions 22 as shown in FIG.
  • the distance between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2 is, for example, 0.5 mm.
  • the shape of the facing portion 21 is rectangular, and the facing portion 21 and the rigid substrate 1 are parallel.
  • the shape of the facing portion 21 is not limited to a rectangle.
  • the facing portion 21 of the flexible substrate 2 does not need to be provided in parallel with the rigid substrate 1 and may be inclined in the Z-axis direction. Even when the opposing portion 21 of the flexible substrate 2 is not parallel to the rigid substrate 1 but is inclined in the Z-axis direction, it can be said that the opposing portion 21 faces the rigid substrate 1.
  • connection portions 22 of the flexible board 2 are provided at positions corresponding to the four sides of the rectangular opposing portion 21.
  • Each of the four connection portions 22 has an L-shape including a parallel portion 22a parallel to the first main surface 1a of the rigid substrate 1 and an orthogonal portion 22b orthogonal to the first main surface 1a of the rigid substrate 1. It has the shape of
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are connected.
  • the flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected.
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected by a bump electrode, soldering, or the like.
  • connection portion 22 of the flexible substrate 2 is provided with a signal line 211 sandwiched between electrodes 212 and 213 connected to the ground potential, as shown in FIG. Since the signal line 211 is sandwiched between the electrodes 212 and 213 connected to the ground potential, it is possible to prevent the electromagnetic wave from being radiated to the outside and to prevent the signal line 211 from being affected by the external electromagnetic wave. Can be suppressed.
  • the signal line 211 is, for example, electrically connected to the rigid substrate 1 at the parallel portion 22 a and electrically connected to the electronic component 3 mounted on the opposing portion 21 at the opposing portion 21. Thereby, in the electrical connection between the rigid substrate 1 and the flexible substrate 2, it is possible to eliminate the need for further connecting components such as columnar electrodes.
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 may be connected using an adhesive such as epoxy resin, and electrical connection may be made at another position.
  • the electrode provided on the rigid substrate 1 is formed on the first main surface of the opposing portion 21 via a bump or a columnar electrode and a through hole provided on the opposing portion 21 of the flexible substrate 2. It may be connected to the electrode on 21a.
  • connection portion 22 of the flexible substrate 2 may not have the parallel portion 22a. In that case, the rigid portion 1 is connected to the orthogonal portion 22b of the connection portion 22.
  • At least one of the plurality of connecting portions 22 has the opening 20.
  • the opening 20 is for allowing the mold resin to flow into the cavity that becomes the filling unit 10 after the module 100 is manufactured.
  • each of the orthogonal portions 22 b of the four connection portions 22 has the opening 20.
  • the opening 20 is provided at a position corresponding to the center of each of four sides of the rectangular facing portion 21. Since the opening 20 is provided at a position corresponding to the center of each of the four sides of the facing portion 21, the mold resin 4 can be efficiently filled in the cavity when the module 100 is manufactured.
  • the opening 20 is provided so as to open all positions in the Z-axis direction of the orthogonal portion 22 b, but a part of the position in the Z-axis direction is
  • the opening 20 may be provided so as to open.
  • At least one electronic component 3 is mounted on the first main surface 21 a of the opposing portion 21 of the flexible substrate 2 which is located on the side opposite to the rigid substrate 1.
  • the type of the electronic component 3 mounted on the module 100 includes an SMD (surface mounting) type inductor, capacitor, resistor, crystal oscillator, SAW filter, BAW filter, duplexer, and semiconductor chip.
  • the semiconductor chip is, for example, a PA (power amplifier), an LNA (low noise amplifier), a switch IC, an RF-IC, a baseband IC, or the like.
  • These electronic components 3 are mounted using, for example, solder.
  • solder solder
  • the electronic component 3 is a semiconductor chip, it can be connected to a land electrode on the substrate by wire bonding, solder bump, Au bump, or the like.
  • the mold resin 4 is provided at least in the filling portion 10.
  • the mold resin 4 is, for example, a polyimide resin or an epoxy resin.
  • all of the modules 100 located on the first main surface 1 a side of the rigid substrate 1 are covered with the mold resin 4. That is, the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4.
  • the molding resin 4 is provided at least in the filling portion 10 between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2, deformation of the flexible substrate 2 is suppressed. it can.
  • the molding resin is supplied so as to cover the flexible substrate 2 as described later. However, since the supplied molding resin flows into the cavity from the opening 20, the molding resin is supplied. Sometimes, the deformation of the flexible substrate 2 can also be suppressed.
  • Module manufacturing method A method for manufacturing the module 100 having the above-described configuration will be described.
  • a flexible assembly board 30 capable of manufacturing a plurality of modules at once is prepared, and a plurality of electronic components 3 are mounted on the flexible assembly board 30 (see FIG. 4).
  • the flexible collective board 30 shown in FIG. 4 can manufacture 12 modules collectively.
  • a land electrode corresponding to the terminal of the electronic component 3 to be mounted or a wiring for connecting the electronic components is formed by etching the copper foil in advance. Is formed. Then, the electronic component 3 is mounted on the land electrode.
  • an opening is provided at a predetermined position of the flexible collective substrate 30.
  • the description will be made on the assumption that the openings 20 are provided at four places which are orthogonal to the connection parts of each module after completion.
  • the opening 20 may be provided at at least one of the positions that are orthogonal to the connection part.
  • the electronic component 3 may be mounted on the flexible collective substrate 30.
  • FIG. 6 is a cross-sectional view when the flexible assembly substrate 30 is bent and then cut along the line VI-VI in FIG.
  • FIG. 6 is a cross-sectional view when cut at a position where there is no opening 20.
  • a rigid assembly board having the electronic component 3 mounted on one main surface is prepared.
  • a mounting electrode may be provided on the other main surface of the rigid assembly substrate.
  • the rigid assembly board 40 and the flexible assembly board 30 are aligned so that the electronic components 3 mounted on the rigid assembly board 40 are located in the cavities.
  • the flexible assembly substrate 30 is joined.
  • a bonding electrode is formed in a portion of the flexible collective substrate 30 that is in contact with the rigid collective substrate 40, and the electrode on the rigid collective substrate 40 and the joint electrode of the flexible collective substrate 30 are bonded by soldering or the like. .
  • mold resin is supplied so as to cover the flexible collective substrate 30.
  • a mold resin for example, a polyimide resin or an epoxy resin can be used.
  • the mold resin may be a liquid type or a solid type as long as it has fluidity.
  • the supply of the mold resin is performed using, for example, a dispenser.
  • the mold resin so as to cover the plurality of electronic components 3 mounted on the flexible collective board 30.
  • the composition or type of the mold resin may be changed between the mold resin covering the flexible collective substrate 30 and the mold resin covering the plurality of electronic components 3 mounted on the flexible collective substrate 30, and a single mold resin may be used. It is not limited to things.
  • the mold resin supplied to the entire flexible collective board 30 flows into the cavity from the opening 20, and the cavity is filled with the mold resin.
  • the mold resin is heated and cured.
  • the mold resin supplied to cover the flexible collective substrate 30 flows into the cavity from the opening 20. If the opening 20 is not provided, the mold resin does not flow into the cavity, and the weight of the supplied mold resin may deform the portion of the flexible collective substrate 30 that will become the facing portion after completion. There is. However, in the present embodiment, since the opening 20 is provided in the flexible collective substrate 30, the molding resin flows into the cavity from the opening 20, so that the deformation of the flexible collective substrate 30 can be suppressed.
  • a plurality of modules can be manufactured at one time.
  • FIG. 8 is a diagram schematically illustrating a cross section of the module 100A according to the second embodiment. However, FIG. 8 shows a cross-sectional view when the module 100A is cut at a position where the opening 20 is not provided.
  • the electronic component 3 is also mounted on the orthogonal portion 22b of the connection portion 22 of the flexible substrate 2.
  • FIG. 8 shows two electronic components 3 mounted on the orthogonal portion 22b of the connection portion 22, but it is sufficient that at least one electronic component 3 is also mounted on the orthogonal portion 22b.
  • the electronic component 3 mounted on the orthogonal portion 22b may be mounted so as to protrude from the first main surface 21a of the facing portion 21 of the flexible substrate 2 in the Z-axis direction.
  • the electronic component 3 located on the right side of the two electronic components 3 mounted on the orthogonal portion 22 b is protruded above the first main surface 21 a of the facing portion 21 of the flexible substrate 2.
  • the electronic component 3 Since the electronic component 3 is mounted so as to protrude from the first main surface 21a of the opposing portion 21 of the flexible substrate 2, for example, other electronic components mounted on the first main surface 21a of the opposing portion 21 are provided. Electromagnetic field coupling with the electronic component 3 can be easily generated.
  • the module 100A of the second embodiment since the electronic components 3 are also mounted on the orthogonal portions 22b of the connection portions 22 of the flexible substrate 2, the number of the electronic components 3 mounted on the facing portion 21 is reduced accordingly.
  • the facing portion 21 can be made smaller.
  • the module 100A can be reduced in size.
  • the radiation characteristics and directivity of the signal can be adjusted to desired characteristics.
  • FIG. 9 is a diagram schematically illustrating a cross section of the module 100B according to the third embodiment.
  • the electronic components 3 are mounted on both main surfaces of the opposing portion 21 of the flexible substrate 2. That is, the electronic component 3 is mounted not only on the first main surface 21a of the facing portion 21 but also on the second main surface 21b facing the filling portion 10. It is sufficient that at least one electronic component 3 is mounted on the second main surface 21b of the facing portion 21.
  • the electronic component 3 mounted on the second main surface 21b of the facing portion 21 may be mounted so as to protrude outside the filling portion 10 through the opening 20.
  • the electronic component 3 mounted on the rightmost side passes through the opening 20 and is outside the filling portion 10. It is implemented to protrude to. For example, since the electronic component 3 protrudes out of the filling unit 10, it is possible to easily generate electromagnetic field coupling with another electronic component 3 mounted outside the filling unit 10.
  • the electronic component 3 is mounted not only on the first main surface 21a of the opposing portion 21 of the flexible substrate 2 but also on the second main surface 21b.
  • the number of the electronic components 3 mounted on the first main surface 21a can be reduced, and the size of the facing portion 21 can be reduced. Thereby, the module 100B can be downsized.
  • FIG. 10 is a diagram schematically illustrating a cross section of a module 100C according to the fourth embodiment. However, FIG. 10 shows a cross section at a position where the opening 20 is not provided.
  • the electromagnetic wave shielding unit 50 for blocking electromagnetic waves is provided in a portion of the flexible substrate 2 that constitutes the filling unit 10.
  • the electromagnetic wave shield unit 50 is made of a conductive material such as Cu, Ag, or Al, for example, and is electrically connected to a ground electrode provided on the rigid substrate 1.
  • the ground electrode of the rigid substrate 1 may be provided inside the substrate, or may be provided on the second main surface 1b of the rigid substrate 1.
  • the flexible substrate 2 may be configured as a multilayer substrate, a ground electrode may be provided inside the flexible substrate 2, and the ground electrode and the electromagnetic wave shield unit 50 may be electrically connected.
  • the electromagnetic wave shield part 50 is provided on the entire surface of the flexible substrate 2 on the rigid substrate 1 side, but it is not necessary to provide the electromagnetic wave shield part 50 on the entire surface. It is sufficient that the electromagnetic wave shield part 50 is provided at least in a part constituting the filling part 10.
  • the flexible substrate 2 may be configured as a multilayer substrate, and the electromagnetic wave shield 50 may be provided inside the substrate.
  • the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 that forms the filling unit 10, so that an electronic component such as a power amplifier that emits electromagnetic waves is provided.
  • an electronic component such as a power amplifier that emits electromagnetic waves.
  • 3 is mounted in the filling section 10
  • the electronic component 3 mounted in the filling unit 10 can be suppressed from being affected by electromagnetic waves from outside the filling unit 10.
  • FIG. 11 is a diagram schematically illustrating a cross section of a module 100D according to the fifth embodiment.
  • FIG. 11 shows a cross section at a position where the opening 20 is not provided, similarly to FIG.
  • a plurality of filling units 10 are provided for the module 100C of the fourth embodiment.
  • the filling unit 10 may be provided for each electronic component 3 provided on the rigid board 1.
  • the volume of the filling unit 10 can be reduced, and the filling of the mold resin into the cavity during manufacturing becomes easy.
  • the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 which forms the filling unit 10, the electronic components mounted in each filling unit 10 are provided. Electromagnetic waves can be blocked for each component 3.
  • each electronic component 3 it is not necessary to provide the filling unit 10 for each electronic component 3.
  • the electromagnetic component coupling is reduced by mounting the electronic components 3 in different filling portions 10. be able to.
  • the plurality of electronic components 3 whose electromagnetic field coupling is to be reduced are, for example, a power amplifier and a low noise amplifier.
  • FIG. 12 is a diagram schematically illustrating a cross section of a module 100E according to the sixth embodiment.
  • the flexible substrate 2 includes a plurality of opposing portions 21 having different distances from the rigid substrate 1.
  • the flexible substrate 2 includes two opposing portions 21 of a first opposing portion 21X and a second opposing portion 21Y.
  • the number of the plurality of opposing portions 21 may be three or more.
  • the flexible substrate 2 includes the plurality of opposing portions 21 having different distances from the rigid substrate 1, the electronic components 3 having different heights can be mounted on the rigid substrate 1.
  • the second opposing portion 21Y is farther from the rigid substrate 1 than the first opposing portion 21X, so that the second opposing portion 21Y is on the rigid substrate 1 and the first opposing portion 21X
  • the electronic component 3 having a low height can be mounted in the space between the electronic component 3 and the electronic component 3 having a high height can be mounted in the space between the second opposing portion 21Y.
  • the electronic component 3 having a small heat dissipation is mounted on the rigid board 1 side of the two main surfaces of the second opposing portion 21Y of the flexible board 2, and the electronic component 3 having a large heat dissipation is mounted on the rigid board 1. You may make it. In that case, the heat generated from the electronic component 3 mounted on the rigid board 1 is easily released to the outside of the module 100E via the rigid board 1.
  • the flexible substrate 2 has been described as having four connection portions 22, but it is sufficient that the flexible substrate 2 has at least two connection portions 22.
  • the two connecting portions 22 may be respectively arranged on opposing sides of the opposing portion 21.
  • each of the orthogonal portions 22b of the connecting portion 22 has been described as having the opening 20, but the opening 20 is provided in at least one of the plurality of connecting portions 22. It should just be done. Even in that case, the mold resin can flow into the cavity from the opening 20 when the mold resin is supplied.
  • the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4. Although it has been described that the mold resin 4 is filled, only the filling portion 10 may be filled. However, since the electronic component 3 mounted on the flexible substrate 2 can be protected by covering the electronic component 3 with the mold resin 4, it is preferable that the electronic component 3 is covered with the mold resin 4.
  • the flexible collective substrate 30 is used, but the flexible collective substrate 30 may be singulated and joined to the rigid collective substrate 40.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Un module (100) selon la présente invention comporte : un substrat rigide (1) ; un substrat souple (2) qui comprend une partie en regard (21) qui est positionnée à une certaine distance du substrat rigide (1) de façon à faire face au substrat rigide (1), et au moins deux parties de liaison (22) qui relient la partie en regard (21) et le substrat rigide (1) l'un à l'autre ; un composant électronique (3) ; et une résine de moulage (4) qui est disposée au moins dans une partie de remplissage (10) entre le substrat rigide (1) et la partie en regard (21) du substrat souple (2). Le composant électronique (3) est monté sur le substrat souple (2) ; et au moins l'une desdites deux parties de liaison (22) a une ouverture (20).
PCT/JP2019/032284 2018-09-07 2019-08-19 Module et procédé de production de module WO2020049989A1 (fr)

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JP2018167796 2018-09-07
JP2018-167796 2018-09-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022124022A1 (fr) * 2020-12-08 2022-06-16 株式会社村田製作所 Module de circuit
WO2023190683A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Module semi-conducteur

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WO2016088693A1 (fr) * 2014-12-01 2016-06-09 株式会社村田製作所 Appareil électronique
WO2017043480A1 (fr) * 2015-09-09 2017-03-16 株式会社ソシオネクスト Boîtier de semi-conducteur
JP2018110153A (ja) * 2016-12-28 2018-07-12 株式会社フジクラ 配線体アセンブリ、配線基板、及びタッチセンサ

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JPH03152967A (ja) * 1989-11-09 1991-06-28 Nec Corp 混成集積回路装置
JP3070262B2 (ja) * 1992-06-03 2000-07-31 ソニー株式会社 多層フレキシブル実装基板
JP2008091405A (ja) * 2006-09-29 2008-04-17 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置
JP2010251706A (ja) * 2009-03-25 2010-11-04 Panasonic Corp 装着用発電モジュール
JP2011049372A (ja) * 2009-08-27 2011-03-10 Murata Mfg Co Ltd 基板モジュールおよびその製造方法
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WO2014178153A1 (fr) * 2013-04-30 2014-11-06 株式会社村田製作所 Substrat composite
JP2015153816A (ja) * 2014-02-12 2015-08-24 新光電気工業株式会社 配線基板、半導体パッケージ及び半導体パッケージの製造方法
WO2016088693A1 (fr) * 2014-12-01 2016-06-09 株式会社村田製作所 Appareil électronique
WO2017043480A1 (fr) * 2015-09-09 2017-03-16 株式会社ソシオネクスト Boîtier de semi-conducteur
JP2018110153A (ja) * 2016-12-28 2018-07-12 株式会社フジクラ 配線体アセンブリ、配線基板、及びタッチセンサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022124022A1 (fr) * 2020-12-08 2022-06-16 株式会社村田製作所 Module de circuit
WO2023190683A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Module semi-conducteur

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