WO2020049989A1 - Module and method for producing module - Google Patents

Module and method for producing module Download PDF

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Publication number
WO2020049989A1
WO2020049989A1 PCT/JP2019/032284 JP2019032284W WO2020049989A1 WO 2020049989 A1 WO2020049989 A1 WO 2020049989A1 JP 2019032284 W JP2019032284 W JP 2019032284W WO 2020049989 A1 WO2020049989 A1 WO 2020049989A1
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WO
WIPO (PCT)
Prior art keywords
substrate
flexible
rigid
mold resin
electronic component
Prior art date
Application number
PCT/JP2019/032284
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French (fr)
Japanese (ja)
Inventor
▲高▼木昌由
佐藤和茂
岡本和也
Original Assignee
株式会社村田製作所
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Publication of WO2020049989A1 publication Critical patent/WO2020049989A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to a module and a method for manufacturing the module.
  • a multilayer mounting board in which a rigid board on which electronic components are mounted and a flexible board on which the electronic components are mounted are connected.
  • Patent Document 1 discloses that two rigid boards are connected by a flexible board, and the flexible board is bent so as to form three or more odd-numbered layers.
  • a multilayer mounting board in which electronic components are mounted on at least one of the front and back surfaces of a flexible board is described.
  • Patent Document 1 describes that the multilayer mounting board having the above-described configuration can prevent a short circuit of an electronic component on a flexible board.
  • the flexible board since the flexible board has flexibility, the flexible board may be deformed after mounting the electronic component, and the connection reliability between the electronic component and the flexible board may be reduced. There is.
  • the flexible board may be deformed by the weight of the mold resin when the mold resin is supplied.
  • the present invention has been made to solve the above problems, and has a configuration in which a mold resin is provided between a rigid substrate and a flexible substrate, and is capable of suppressing deformation of the flexible substrate during supply of the mold resin. And a method for manufacturing such a module.
  • the module of the present invention A rigid substrate, An opposing portion opposing the rigid substrate at a position away from the rigid substrate, and a flexible substrate having at least two connecting portions connecting the opposing portion and the rigid substrate, Electronic components, Mold resin provided at least in the filling portion between the rigid substrate and the facing portion of the flexible substrate, With The electronic component is mounted on the flexible substrate, At least one of the at least two connecting portions has an opening.
  • the electronic component is mounted on a first main surface, which is a surface of the facing portion opposite to the rigid substrate,
  • the mold resin may be provided so as to cover not only the filling portion but also the electronic component mounted on the first main surface.
  • the electronic component may be mounted on the connection section.
  • the electronic component may be mounted on a second main surface of the facing portion facing the filling portion.
  • a portion of the flexible substrate that constitutes the filling portion may be provided with an electromagnetic wave shielding portion for blocking electromagnetic waves.
  • a plurality of the filling portions may be formed.
  • a signal line sandwiched between electrodes connected to the ground potential may be arranged in the connection portion.
  • the method for manufacturing a module according to the present invention comprises: Providing a plurality of openings at predetermined positions of the flexible collective board on which the electronic component is mounted, Bending the flexible collective substrate to form a plurality of cavities, The rigid assembly board and the flexible assembly board are aligned with each other so that the electronic component mounted on the rigid assembly board is located in the cavity, and then the rigid assembly board and the flexible assembly board are joined.
  • the molding portion is provided with the molding resin, the deformation of the flexible substrate can be suppressed.
  • the mold resin supplied onto the flexible substrate at the time of manufacturing the module flows into the cavity from the opening provided in at least one of the connection portions, so that the flexible substrate is deformed when the mold resin is supplied. Can also be suppressed.
  • the mold resin flows into the cavity from an opening provided at a predetermined position of the flexible collective board, Since the cavity is filled with the mold resin, the deformation of the flexible collective substrate due to the weight of the mold resin during supply of the mold resin can be suppressed. Also, a plurality of modules can be manufactured at once.
  • FIG. 2 is a cross-sectional view schematically illustrating a configuration of a module according to the first embodiment. It is a perspective view which shows typically the whole rigid board and flexible board which comprise a module.
  • FIG. 3 is a cross-sectional view illustrating a signal line provided at a connection portion of a flexible substrate. It is a top view showing a flexible collective substrate. It is a figure showing the state where an opening was provided in a flexible collective substrate.
  • FIG. 6 is a cross-sectional view taken along a line VI-VI in FIG. 5 after bending the flexible collective substrate.
  • FIG. 9 is a diagram illustrating a state in which the rigid assembly board and the flexible assembly board are aligned so that the electronic components mounted on the rigid assembly board are positioned in the cavities.
  • FIG. 1 is a cross-sectional view schematically illustrating a configuration of a module 100 according to the first embodiment.
  • FIG. 2 is a perspective view schematically showing the entire shape of the rigid board 1 and the flexible board 2 constituting the module 100.
  • FIG. 1 is a cross-sectional view of the module 100 of FIG. 2 taken along the line II. However, in FIG. 2, the mold resin 4 is omitted.
  • the module 100 includes a rigid board 1, a flexible board 2, a plurality of electronic components 3, and a mold resin 4.
  • the rigid substrate 1 has a flat plate shape, and has a first main surface 1a and a second main surface 1b.
  • the rigid substrate 1 is a substrate having a certain degree of rigidity, and cannot be bent freely like a flexible substrate 2 described later.
  • the rigid substrate 1 may be a single-layer substrate or a multilayer substrate.
  • the rigid board 1 is a single-layer board, it is made of, for example, ceramic or glass epoxy resin.
  • the rigid substrate 1 is a multilayer substrate, for example, a configuration can be adopted in which an insulating layer made of ceramic or glass epoxy resin and a wiring layer are alternately laminated.
  • the wiring formed in the wiring layer can be formed of, for example, at least one metal of Ag and Cu.
  • the electronic component 3 is mounted on the first main surface 1a of the rigid substrate 1 which is the surface on the flexible substrate 2 side. More specifically, the electronic component 3 is mounted on the first main surface 1a of the rigid board 1 and between the opposing portion 21 of the flexible board 2 described later and the rigid board 1.
  • the filling portion 10 between the opposing portion 21 of the flexible substrate 2 and the rigid substrate 1 is filled with the mold resin 4, but is filled with the mold resin 4 in the manufacturing process of the module 100.
  • the previous space is referred to herein as a "cavity.”
  • a mounting electrode may be provided on the second main surface 1b of the rigid substrate 1 opposite to the first main surface 1a.
  • the mounting electrode may have a configuration in which, for example, an electrode made of Cu is plated with Au.
  • the flexible substrate 2 has flexibility and can be freely bent or cut out.
  • the flexible substrate 2 is made of, for example, a polyimide resin, a polyester resin, or a liquid crystal polymer.
  • a copper-clad laminate in which a copper foil is attached to an insulator, an insulator sheet with a copper foil, or the like may be used.
  • the flexible substrate 2 has an opposing portion 21 facing the rigid substrate 1 at a position distant from the rigid substrate 1, and at least two connecting portions 22 connecting the opposing portion 21 and the rigid substrate 1.
  • the flexible substrate 2 has four connecting portions 22 as shown in FIG.
  • the distance between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2 is, for example, 0.5 mm.
  • the shape of the facing portion 21 is rectangular, and the facing portion 21 and the rigid substrate 1 are parallel.
  • the shape of the facing portion 21 is not limited to a rectangle.
  • the facing portion 21 of the flexible substrate 2 does not need to be provided in parallel with the rigid substrate 1 and may be inclined in the Z-axis direction. Even when the opposing portion 21 of the flexible substrate 2 is not parallel to the rigid substrate 1 but is inclined in the Z-axis direction, it can be said that the opposing portion 21 faces the rigid substrate 1.
  • connection portions 22 of the flexible board 2 are provided at positions corresponding to the four sides of the rectangular opposing portion 21.
  • Each of the four connection portions 22 has an L-shape including a parallel portion 22a parallel to the first main surface 1a of the rigid substrate 1 and an orthogonal portion 22b orthogonal to the first main surface 1a of the rigid substrate 1. It has the shape of
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are connected.
  • the flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected.
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected by a bump electrode, soldering, or the like.
  • connection portion 22 of the flexible substrate 2 is provided with a signal line 211 sandwiched between electrodes 212 and 213 connected to the ground potential, as shown in FIG. Since the signal line 211 is sandwiched between the electrodes 212 and 213 connected to the ground potential, it is possible to prevent the electromagnetic wave from being radiated to the outside and to prevent the signal line 211 from being affected by the external electromagnetic wave. Can be suppressed.
  • the signal line 211 is, for example, electrically connected to the rigid substrate 1 at the parallel portion 22 a and electrically connected to the electronic component 3 mounted on the opposing portion 21 at the opposing portion 21. Thereby, in the electrical connection between the rigid substrate 1 and the flexible substrate 2, it is possible to eliminate the need for further connecting components such as columnar electrodes.
  • the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 may be connected using an adhesive such as epoxy resin, and electrical connection may be made at another position.
  • the electrode provided on the rigid substrate 1 is formed on the first main surface of the opposing portion 21 via a bump or a columnar electrode and a through hole provided on the opposing portion 21 of the flexible substrate 2. It may be connected to the electrode on 21a.
  • connection portion 22 of the flexible substrate 2 may not have the parallel portion 22a. In that case, the rigid portion 1 is connected to the orthogonal portion 22b of the connection portion 22.
  • At least one of the plurality of connecting portions 22 has the opening 20.
  • the opening 20 is for allowing the mold resin to flow into the cavity that becomes the filling unit 10 after the module 100 is manufactured.
  • each of the orthogonal portions 22 b of the four connection portions 22 has the opening 20.
  • the opening 20 is provided at a position corresponding to the center of each of four sides of the rectangular facing portion 21. Since the opening 20 is provided at a position corresponding to the center of each of the four sides of the facing portion 21, the mold resin 4 can be efficiently filled in the cavity when the module 100 is manufactured.
  • the opening 20 is provided so as to open all positions in the Z-axis direction of the orthogonal portion 22 b, but a part of the position in the Z-axis direction is
  • the opening 20 may be provided so as to open.
  • At least one electronic component 3 is mounted on the first main surface 21 a of the opposing portion 21 of the flexible substrate 2 which is located on the side opposite to the rigid substrate 1.
  • the type of the electronic component 3 mounted on the module 100 includes an SMD (surface mounting) type inductor, capacitor, resistor, crystal oscillator, SAW filter, BAW filter, duplexer, and semiconductor chip.
  • the semiconductor chip is, for example, a PA (power amplifier), an LNA (low noise amplifier), a switch IC, an RF-IC, a baseband IC, or the like.
  • These electronic components 3 are mounted using, for example, solder.
  • solder solder
  • the electronic component 3 is a semiconductor chip, it can be connected to a land electrode on the substrate by wire bonding, solder bump, Au bump, or the like.
  • the mold resin 4 is provided at least in the filling portion 10.
  • the mold resin 4 is, for example, a polyimide resin or an epoxy resin.
  • all of the modules 100 located on the first main surface 1 a side of the rigid substrate 1 are covered with the mold resin 4. That is, the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4.
  • the molding resin 4 is provided at least in the filling portion 10 between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2, deformation of the flexible substrate 2 is suppressed. it can.
  • the molding resin is supplied so as to cover the flexible substrate 2 as described later. However, since the supplied molding resin flows into the cavity from the opening 20, the molding resin is supplied. Sometimes, the deformation of the flexible substrate 2 can also be suppressed.
  • Module manufacturing method A method for manufacturing the module 100 having the above-described configuration will be described.
  • a flexible assembly board 30 capable of manufacturing a plurality of modules at once is prepared, and a plurality of electronic components 3 are mounted on the flexible assembly board 30 (see FIG. 4).
  • the flexible collective board 30 shown in FIG. 4 can manufacture 12 modules collectively.
  • a land electrode corresponding to the terminal of the electronic component 3 to be mounted or a wiring for connecting the electronic components is formed by etching the copper foil in advance. Is formed. Then, the electronic component 3 is mounted on the land electrode.
  • an opening is provided at a predetermined position of the flexible collective substrate 30.
  • the description will be made on the assumption that the openings 20 are provided at four places which are orthogonal to the connection parts of each module after completion.
  • the opening 20 may be provided at at least one of the positions that are orthogonal to the connection part.
  • the electronic component 3 may be mounted on the flexible collective substrate 30.
  • FIG. 6 is a cross-sectional view when the flexible assembly substrate 30 is bent and then cut along the line VI-VI in FIG.
  • FIG. 6 is a cross-sectional view when cut at a position where there is no opening 20.
  • a rigid assembly board having the electronic component 3 mounted on one main surface is prepared.
  • a mounting electrode may be provided on the other main surface of the rigid assembly substrate.
  • the rigid assembly board 40 and the flexible assembly board 30 are aligned so that the electronic components 3 mounted on the rigid assembly board 40 are located in the cavities.
  • the flexible assembly substrate 30 is joined.
  • a bonding electrode is formed in a portion of the flexible collective substrate 30 that is in contact with the rigid collective substrate 40, and the electrode on the rigid collective substrate 40 and the joint electrode of the flexible collective substrate 30 are bonded by soldering or the like. .
  • mold resin is supplied so as to cover the flexible collective substrate 30.
  • a mold resin for example, a polyimide resin or an epoxy resin can be used.
  • the mold resin may be a liquid type or a solid type as long as it has fluidity.
  • the supply of the mold resin is performed using, for example, a dispenser.
  • the mold resin so as to cover the plurality of electronic components 3 mounted on the flexible collective board 30.
  • the composition or type of the mold resin may be changed between the mold resin covering the flexible collective substrate 30 and the mold resin covering the plurality of electronic components 3 mounted on the flexible collective substrate 30, and a single mold resin may be used. It is not limited to things.
  • the mold resin supplied to the entire flexible collective board 30 flows into the cavity from the opening 20, and the cavity is filled with the mold resin.
  • the mold resin is heated and cured.
  • the mold resin supplied to cover the flexible collective substrate 30 flows into the cavity from the opening 20. If the opening 20 is not provided, the mold resin does not flow into the cavity, and the weight of the supplied mold resin may deform the portion of the flexible collective substrate 30 that will become the facing portion after completion. There is. However, in the present embodiment, since the opening 20 is provided in the flexible collective substrate 30, the molding resin flows into the cavity from the opening 20, so that the deformation of the flexible collective substrate 30 can be suppressed.
  • a plurality of modules can be manufactured at one time.
  • FIG. 8 is a diagram schematically illustrating a cross section of the module 100A according to the second embodiment. However, FIG. 8 shows a cross-sectional view when the module 100A is cut at a position where the opening 20 is not provided.
  • the electronic component 3 is also mounted on the orthogonal portion 22b of the connection portion 22 of the flexible substrate 2.
  • FIG. 8 shows two electronic components 3 mounted on the orthogonal portion 22b of the connection portion 22, but it is sufficient that at least one electronic component 3 is also mounted on the orthogonal portion 22b.
  • the electronic component 3 mounted on the orthogonal portion 22b may be mounted so as to protrude from the first main surface 21a of the facing portion 21 of the flexible substrate 2 in the Z-axis direction.
  • the electronic component 3 located on the right side of the two electronic components 3 mounted on the orthogonal portion 22 b is protruded above the first main surface 21 a of the facing portion 21 of the flexible substrate 2.
  • the electronic component 3 Since the electronic component 3 is mounted so as to protrude from the first main surface 21a of the opposing portion 21 of the flexible substrate 2, for example, other electronic components mounted on the first main surface 21a of the opposing portion 21 are provided. Electromagnetic field coupling with the electronic component 3 can be easily generated.
  • the module 100A of the second embodiment since the electronic components 3 are also mounted on the orthogonal portions 22b of the connection portions 22 of the flexible substrate 2, the number of the electronic components 3 mounted on the facing portion 21 is reduced accordingly.
  • the facing portion 21 can be made smaller.
  • the module 100A can be reduced in size.
  • the radiation characteristics and directivity of the signal can be adjusted to desired characteristics.
  • FIG. 9 is a diagram schematically illustrating a cross section of the module 100B according to the third embodiment.
  • the electronic components 3 are mounted on both main surfaces of the opposing portion 21 of the flexible substrate 2. That is, the electronic component 3 is mounted not only on the first main surface 21a of the facing portion 21 but also on the second main surface 21b facing the filling portion 10. It is sufficient that at least one electronic component 3 is mounted on the second main surface 21b of the facing portion 21.
  • the electronic component 3 mounted on the second main surface 21b of the facing portion 21 may be mounted so as to protrude outside the filling portion 10 through the opening 20.
  • the electronic component 3 mounted on the rightmost side passes through the opening 20 and is outside the filling portion 10. It is implemented to protrude to. For example, since the electronic component 3 protrudes out of the filling unit 10, it is possible to easily generate electromagnetic field coupling with another electronic component 3 mounted outside the filling unit 10.
  • the electronic component 3 is mounted not only on the first main surface 21a of the opposing portion 21 of the flexible substrate 2 but also on the second main surface 21b.
  • the number of the electronic components 3 mounted on the first main surface 21a can be reduced, and the size of the facing portion 21 can be reduced. Thereby, the module 100B can be downsized.
  • FIG. 10 is a diagram schematically illustrating a cross section of a module 100C according to the fourth embodiment. However, FIG. 10 shows a cross section at a position where the opening 20 is not provided.
  • the electromagnetic wave shielding unit 50 for blocking electromagnetic waves is provided in a portion of the flexible substrate 2 that constitutes the filling unit 10.
  • the electromagnetic wave shield unit 50 is made of a conductive material such as Cu, Ag, or Al, for example, and is electrically connected to a ground electrode provided on the rigid substrate 1.
  • the ground electrode of the rigid substrate 1 may be provided inside the substrate, or may be provided on the second main surface 1b of the rigid substrate 1.
  • the flexible substrate 2 may be configured as a multilayer substrate, a ground electrode may be provided inside the flexible substrate 2, and the ground electrode and the electromagnetic wave shield unit 50 may be electrically connected.
  • the electromagnetic wave shield part 50 is provided on the entire surface of the flexible substrate 2 on the rigid substrate 1 side, but it is not necessary to provide the electromagnetic wave shield part 50 on the entire surface. It is sufficient that the electromagnetic wave shield part 50 is provided at least in a part constituting the filling part 10.
  • the flexible substrate 2 may be configured as a multilayer substrate, and the electromagnetic wave shield 50 may be provided inside the substrate.
  • the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 that forms the filling unit 10, so that an electronic component such as a power amplifier that emits electromagnetic waves is provided.
  • an electronic component such as a power amplifier that emits electromagnetic waves.
  • 3 is mounted in the filling section 10
  • the electronic component 3 mounted in the filling unit 10 can be suppressed from being affected by electromagnetic waves from outside the filling unit 10.
  • FIG. 11 is a diagram schematically illustrating a cross section of a module 100D according to the fifth embodiment.
  • FIG. 11 shows a cross section at a position where the opening 20 is not provided, similarly to FIG.
  • a plurality of filling units 10 are provided for the module 100C of the fourth embodiment.
  • the filling unit 10 may be provided for each electronic component 3 provided on the rigid board 1.
  • the volume of the filling unit 10 can be reduced, and the filling of the mold resin into the cavity during manufacturing becomes easy.
  • the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 which forms the filling unit 10, the electronic components mounted in each filling unit 10 are provided. Electromagnetic waves can be blocked for each component 3.
  • each electronic component 3 it is not necessary to provide the filling unit 10 for each electronic component 3.
  • the electromagnetic component coupling is reduced by mounting the electronic components 3 in different filling portions 10. be able to.
  • the plurality of electronic components 3 whose electromagnetic field coupling is to be reduced are, for example, a power amplifier and a low noise amplifier.
  • FIG. 12 is a diagram schematically illustrating a cross section of a module 100E according to the sixth embodiment.
  • the flexible substrate 2 includes a plurality of opposing portions 21 having different distances from the rigid substrate 1.
  • the flexible substrate 2 includes two opposing portions 21 of a first opposing portion 21X and a second opposing portion 21Y.
  • the number of the plurality of opposing portions 21 may be three or more.
  • the flexible substrate 2 includes the plurality of opposing portions 21 having different distances from the rigid substrate 1, the electronic components 3 having different heights can be mounted on the rigid substrate 1.
  • the second opposing portion 21Y is farther from the rigid substrate 1 than the first opposing portion 21X, so that the second opposing portion 21Y is on the rigid substrate 1 and the first opposing portion 21X
  • the electronic component 3 having a low height can be mounted in the space between the electronic component 3 and the electronic component 3 having a high height can be mounted in the space between the second opposing portion 21Y.
  • the electronic component 3 having a small heat dissipation is mounted on the rigid board 1 side of the two main surfaces of the second opposing portion 21Y of the flexible board 2, and the electronic component 3 having a large heat dissipation is mounted on the rigid board 1. You may make it. In that case, the heat generated from the electronic component 3 mounted on the rigid board 1 is easily released to the outside of the module 100E via the rigid board 1.
  • the flexible substrate 2 has been described as having four connection portions 22, but it is sufficient that the flexible substrate 2 has at least two connection portions 22.
  • the two connecting portions 22 may be respectively arranged on opposing sides of the opposing portion 21.
  • each of the orthogonal portions 22b of the connecting portion 22 has been described as having the opening 20, but the opening 20 is provided in at least one of the plurality of connecting portions 22. It should just be done. Even in that case, the mold resin can flow into the cavity from the opening 20 when the mold resin is supplied.
  • the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4. Although it has been described that the mold resin 4 is filled, only the filling portion 10 may be filled. However, since the electronic component 3 mounted on the flexible substrate 2 can be protected by covering the electronic component 3 with the mold resin 4, it is preferable that the electronic component 3 is covered with the mold resin 4.
  • the flexible collective substrate 30 is used, but the flexible collective substrate 30 may be singulated and joined to the rigid collective substrate 40.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

A module 100 according to the present invention is provided with: a rigid substrate 1; a flexible substrate 2 which comprises a facing part 21 that is positioned at a distance from the rigid substrate 1 so as to face the rigid substrate 1, and at least two connection parts 22 that connect the facing part 21 and the rigid substrate 1 to each other; an electronic component 3; and a mold resin 4 which is provided at least in a filling part 10 between the rigid substrate 1 and the facing part 21 of the flexible substrate 2. The electronic component 3 is mounted on the flexible substrate 2; and at least one of the at least two connection parts 22 has an opening 20.

Description

モジュールおよびモジュールの製造方法Module and module manufacturing method
　本発明は、モジュール、および、モジュールの製造方法に関する。 The present invention relates to a module and a method for manufacturing the module.
　従来、電子部品が実装されたリジッド基板と、電子部品が実装されたフレキシブル基板とを接続した多層実装基板が知られている。 多層 Conventionally, a multilayer mounting board is known in which a rigid board on which electronic components are mounted and a flexible board on which the electronic components are mounted are connected.
　そのような多層実装基板の１つとして、特許文献１には、２枚のリジッド基板をフレキシブル基板で接続し、フレキシブル基板を３層以上の奇数層を形成するように折り曲げて、偶数層目のフレキシブル基板の表裏の面の少なくとも一方に電子部品が実装された多層実装基板が記載されている。上述した構成の多層実装基板は、フレキシブル基板上の電子部品の短絡を防止することができると特許文献１には記載されている。 As one of such multilayer mounting boards, Patent Document 1 discloses that two rigid boards are connected by a flexible board, and the flexible board is bent so as to form three or more odd-numbered layers. A multilayer mounting board in which electronic components are mounted on at least one of the front and back surfaces of a flexible board is described. Patent Document 1 describes that the multilayer mounting board having the above-described configuration can prevent a short circuit of an electronic component on a flexible board.
特許第３０７０２６２号公報Japanese Patent No. 3070262
　しかしながら、特許文献１に記載の多層実装基板では、フレキシブル基板が柔軟性を有しているので、電子部品の実装後にフレキシブル基板が変形し、電子部品とフレキシブル基板との接続信頼性が低下する可能性がある。 However, in the multilayer mounting board described in Patent Document 1, since the flexible board has flexibility, the flexible board may be deformed after mounting the electronic component, and the connection reliability between the electronic component and the flexible board may be reduced. There is.
　このため、多層実装基板をモールド樹脂で封止することが考えられるが、モールド樹脂の供給時に、モールド樹脂の重みでフレキシブル基板が変形する可能性がある。 Thus, it is conceivable to seal the multilayer mounting board with a mold resin, but the flexible board may be deformed by the weight of the mold resin when the mold resin is supplied.
　本発明は、上記課題を解決するものであり、リジッド基板とフレキシブル基板との間にモールド樹脂が設けられた構成を有し、モールド樹脂の供給時にフレキシブル基板の変形を抑制することができるモジュール、およびそのようなモジュールの製造方法を提供することを目的とする。 The present invention has been made to solve the above problems, and has a configuration in which a mold resin is provided between a rigid substrate and a flexible substrate, and is capable of suppressing deformation of the flexible substrate during supply of the mold resin. And a method for manufacturing such a module.
　本発明のモジュールは、
　リジッド基板と、
　前記リジッド基板から離れた位置で前記リジッド基板と対向する対向部、および、前記対向部と前記リジッド基板とを接続する少なくとも２つの接続部を有するフレキシブル基板と、
　電子部品と、
　少なくとも前記リジッド基板と前記フレキシブル基板の前記対向部との間の充填部に設けられたモールド樹脂と、
を備え、
　前記電子部品は、前記フレキシブル基板上に実装されており、
　少なくとも２つの前記接続部のうちの少なくとも１つは、開口部を有することを特徴とする。 The module of the present invention
A rigid substrate,
An opposing portion opposing the rigid substrate at a position away from the rigid substrate, and a flexible substrate having at least two connecting portions connecting the opposing portion and the rigid substrate,
Electronic components,
Mold resin provided at least in the filling portion between the rigid substrate and the facing portion of the flexible substrate,
With
The electronic component is mounted on the flexible substrate,
At least one of the at least two connecting portions has an opening.
　前記電子部品は、前記対向部のうちの前記リジッド基板とは反対側の面である第１の主面に実装されており、
　前記モールド樹脂は、前記充填部だけでなく、前記第１の主面に実装された前記電子部品を覆うように設けられていてもよい。 The electronic component is mounted on a first main surface, which is a surface of the facing portion opposite to the rigid substrate,
The mold resin may be provided so as to cover not only the filling portion but also the electronic component mounted on the first main surface.
　前記電子部品は、前記接続部に実装されていてもよい。 電子 The electronic component may be mounted on the connection section.
　前記電子部品は、前記対向部のうちの前記充填部に面している第２の主面に実装されていてもよい。 The electronic component may be mounted on a second main surface of the facing portion facing the filling portion.
　前記フレキシブル基板のうちの前記充填部を構成する部分には、電磁波を遮断するための電磁波シールド部が設けられていてもよい。 部分 A portion of the flexible substrate that constitutes the filling portion may be provided with an electromagnetic wave shielding portion for blocking electromagnetic waves.
　前記充填部は、複数形成されていてもよい。 複数 A plurality of the filling portions may be formed.
　前記接続部には、接地電位に接続される電極に挟まれた信号線が配置されていてもよい。 信号 A signal line sandwiched between electrodes connected to the ground potential may be arranged in the connection portion.
　本発明のモジュールの製造方法は、
　電子部品が実装されたフレキシブル集合基板の所定の位置に複数の開口部を設ける工程と、
　複数のキャビティを形成するために前記フレキシブル集合基板を折り曲げる工程と、
　リジッド集合基板に実装された電子部品が、前記キャビティ内に位置するように、前記リジッド集合基板と前記フレキシブル集合基板とを位置合わせしてから、前記リジッド集合基板と前記フレキシブル集合基板とを接合する工程と、
　前記フレキシブル集合基板を覆うようにモールド樹脂を供給することによって、前記開口部から前記キャビティ内に前記モールド樹脂を流入させて、前記キャビティ内に前記モールド樹脂を充填する工程と、
　供給された前記モールド樹脂を硬化させる工程と、
　前記モールド樹脂が硬化した後、前記フレキシブル集合基板と前記リジッド集合基板とを分割することによって、複数のモジュールを製造する工程と、
を備えることを特徴とする。 The method for manufacturing a module according to the present invention comprises:
Providing a plurality of openings at predetermined positions of the flexible collective board on which the electronic component is mounted,
Bending the flexible collective substrate to form a plurality of cavities,
The rigid assembly board and the flexible assembly board are aligned with each other so that the electronic component mounted on the rigid assembly board is located in the cavity, and then the rigid assembly board and the flexible assembly board are joined. Process and
By supplying the mold resin so as to cover the flexible collective substrate, flowing the mold resin from the opening into the cavity, filling the cavity with the mold resin,
Curing the supplied mold resin,
After the mold resin is cured, by dividing the flexible collective board and the rigid collective board, a step of manufacturing a plurality of modules,
It is characterized by having.
　本発明のモジュールによれば、充填部にモールド樹脂が設けられているので、フレキシブル基板の変形を抑制することができる。また、モジュールの製造時にフレキシブル基板上に供給されたモールド樹脂は、接続部のうちの少なくとも１つに設けられている開口部からキャビティ内に流入するので、モールド樹脂の供給時にフレキシブル基板が変形することも抑制することができる。 According to the module of the present invention, since the molding portion is provided with the molding resin, the deformation of the flexible substrate can be suppressed. In addition, the mold resin supplied onto the flexible substrate at the time of manufacturing the module flows into the cavity from the opening provided in at least one of the connection portions, so that the flexible substrate is deformed when the mold resin is supplied. Can also be suppressed.
　本発明のモジュールの製造方法によれば、フレキシブル集合基板を覆うようにモールド樹脂を供給することによって、フレキシブル集合基板の所定の位置に設けられた開口部からキャビティ内にモールド樹脂を流入させて、キャビティ内にモールド樹脂を充填するので、モールド樹脂の供給時に、モールド樹脂の重みによってフレキシブル集合基板が変形することを抑制することができる。また、複数のモジュールを一度に製造することができる。 According to the module manufacturing method of the present invention, by supplying the mold resin so as to cover the flexible collective board, the mold resin flows into the cavity from an opening provided at a predetermined position of the flexible collective board, Since the cavity is filled with the mold resin, the deformation of the flexible collective substrate due to the weight of the mold resin during supply of the mold resin can be suppressed. Also, a plurality of modules can be manufactured at once.
第１の実施形態におけるモジュールの構成を模式的に示す断面図である。FIG. 2 is a cross-sectional view schematically illustrating a configuration of a module according to the first embodiment. モジュールを構成するリジッド基板およびフレキシブル基板の全体の形状を模式的に示す斜視図である。It is a perspective view which shows typically the whole rigid board and flexible board which comprise a module. フレキシブル基板の接続部に設けられている信号線を示す断面図である。FIG. 3 is a cross-sectional view illustrating a signal line provided at a connection portion of a flexible substrate. フレキシブル集合基板を示す平面図である。It is a top view showing a flexible collective substrate. フレキシブル集合基板に開口部を設けた状態を示す図である。It is a figure showing the state where an opening was provided in a flexible collective substrate. フレキシブル集合基板を折り曲げた後に、図５のＶＩ－ＶＩ線に沿って切断した場合の断面図である。FIG. 6 is a cross-sectional view taken along a line VI-VI in FIG. 5 after bending the flexible collective substrate. リジッド集合基板に実装された電子部品がキャビティ内に位置するように、リジッド集合基板とフレキシブル集合基板とを位置合わせする様子を示す図である。FIG. 9 is a diagram illustrating a state in which the rigid assembly board and the flexible assembly board are aligned so that the electronic components mounted on the rigid assembly board are positioned in the cavities. 第２の実施形態におけるモジュールの断面を模式的に示す図である。It is a figure showing typically a section of a module in a 2nd embodiment. 第３の実施形態におけるモジュールの断面を模式的に示す図である。It is a figure showing typically the section of the module in a 3rd embodiment. 第４の実施形態におけるモジュールの断面を模式的に示す図である。It is a figure showing typically a section of a module in a 4th embodiment. 第５の実施形態におけるモジュールの断面を模式的に示す図である。It is a figure showing typically a section of a module in a 5th embodiment. 第６の実施形態におけるモジュールの断面を模式的に示す図である。It is a figure showing typically the section of the module in a 6th embodiment.
　以下に本発明の実施形態を示して、本発明の特徴とするところを具体的に説明する。 (4) Embodiments of the present invention will be described below to specifically describe features of the present invention.
　＜第１の実施形態＞
　図１は、第１の実施形態におけるモジュール１００の構成を模式的に示す断面図である。図２は、モジュール１００を構成するリジッド基板１およびフレキシブル基板２の全体の形状を模式的に示す斜視図である。図１は、図２のモジュール１００のＩ－Ｉ線に沿った断面図である。ただし、図２では、モールド樹脂４を省略している。 <First embodiment>
FIG. 1 is a cross-sectional view schematically illustrating a configuration of a module 100 according to the first embodiment. FIG. 2 is a perspective view schematically showing the entire shape of the rigid board 1 and the flexible board 2 constituting the module 100. FIG. 1 is a cross-sectional view of the module 100 of FIG. 2 taken along the line II. However, in FIG. 2, the mold resin 4 is omitted.
　第１の実施形態におけるモジュール１００は、リジッド基板１と、フレキシブル基板２と、複数の電子部品３と、モールド樹脂４とを備える。 The module 100 according to the first embodiment includes a rigid board 1, a flexible board 2, a plurality of electronic components 3, and a mold resin 4.
　リジッド基板１は、平板状の形状であって、第１の主面１ａおよび第２の主面１ｂを有する。リジッド基板１は、ある程度の剛性を有する基板であって、後述するフレキシブル基板２のように、自由に折り曲げることはできない。 The rigid substrate 1 has a flat plate shape, and has a first main surface 1a and a second main surface 1b. The rigid substrate 1 is a substrate having a certain degree of rigidity, and cannot be bent freely like a flexible substrate 2 described later.
　リジッド基板１は、単層基板であってもよいし、多層基板であってもよい。リジッド基板１が単層基板である場合、例えばセラミックまたはガラスエポキシ樹脂からなる。また、リジッド基板１が多層基板である場合、例えば、セラミックまたはガラスエポキシ樹脂からなる絶縁体層と、配線層とが交互に積層された構成とすることができる。その場合、配線層に形成される配線は、例えばＡｇおよびＣｕのうちの少なくとも一方の金属により形成することができる。 The rigid substrate 1 may be a single-layer substrate or a multilayer substrate. When the rigid board 1 is a single-layer board, it is made of, for example, ceramic or glass epoxy resin. Further, when the rigid substrate 1 is a multilayer substrate, for example, a configuration can be adopted in which an insulating layer made of ceramic or glass epoxy resin and a wiring layer are alternately laminated. In that case, the wiring formed in the wiring layer can be formed of, for example, at least one metal of Ag and Cu.
　本実施形態では、リジッド基板１のうちのフレキシブル基板２側の面である第１の主面１ａに電子部品３が実装されている。より詳しくは、リジッド基板１の第１の主面１ａ上であって、後述するフレキシブル基板２の対向部２１とリジッド基板１との間に、電子部品３が実装されている。 In the present embodiment, the electronic component 3 is mounted on the first main surface 1a of the rigid substrate 1 which is the surface on the flexible substrate 2 side. More specifically, the electronic component 3 is mounted on the first main surface 1a of the rigid board 1 and between the opposing portion 21 of the flexible board 2 described later and the rigid board 1.
　なお、後述するように、フレキシブル基板２の対向部２１とリジッド基板１との間の充填部１０にはモールド樹脂４が充填されているが、モジュール１００の製造工程においてモールド樹脂４が充填される前の空間を、本明細書では「キャビティ」と呼ぶ。 As described later, the filling portion 10 between the opposing portion 21 of the flexible substrate 2 and the rigid substrate 1 is filled with the mold resin 4, but is filled with the mold resin 4 in the manufacturing process of the module 100. The previous space is referred to herein as a "cavity."
　リジッド基板１の第１の主面１ａとは反対側の面である第２の主面１ｂには、実装用電極が設けられていてもよい。その場合、実装用電極は、例えば、Ｃｕからなる電極にＡｕめっきが施された構成とすることができる。 A mounting electrode may be provided on the second main surface 1b of the rigid substrate 1 opposite to the first main surface 1a. In this case, the mounting electrode may have a configuration in which, for example, an electrode made of Cu is plated with Au.
　フレキシブル基板２は、屈曲性を有しており、自由に折り曲げたり、切り抜いたりすることが可能である。フレキシブル基板２は、例えば、ポリイミド樹脂、ポリエステル樹脂、または、液晶ポリマなどからなる。フレキシブル基板２として、絶縁体に銅箔が貼り付けられた銅張積層体や、銅箔付き絶縁体シートなどを用いてもよい。 The flexible substrate 2 has flexibility and can be freely bent or cut out. The flexible substrate 2 is made of, for example, a polyimide resin, a polyester resin, or a liquid crystal polymer. As the flexible substrate 2, a copper-clad laminate in which a copper foil is attached to an insulator, an insulator sheet with a copper foil, or the like may be used.
　フレキシブル基板２は、リジッド基板１から離れた位置でリジッド基板１と対向する対向部２１、および、対向部２１とリジッド基板１とを接続する少なくとも２つの接続部２２を有する。本実施形態では、フレキシブル基板２は、図２に示すように、４つの接続部２２を有する。 The flexible substrate 2 has an opposing portion 21 facing the rigid substrate 1 at a position distant from the rigid substrate 1, and at least two connecting portions 22 connecting the opposing portion 21 and the rigid substrate 1. In the present embodiment, the flexible substrate 2 has four connecting portions 22 as shown in FIG.
　モジュール１００のＺ軸方向の寸法が例えば１．０ｍｍ以上１．５ｍｍ以下である場合に、リジッド基板１とフレキシブル基板２の対向部２１との間の距離は、例えば０．５ｍｍである。 When the dimension of the module 100 in the Z-axis direction is, for example, 1.0 mm or more and 1.5 mm or less, the distance between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2 is, for example, 0.5 mm.
　本実施形態では、対向部２１の形状は矩形であり、対向部２１とリジッド基板１とは平行である。ただし、対向部２１の形状が矩形に限定されることはない。また、フレキシブル基板２の対向部２１は、リジッド基板１に対して平行に設けられている必要はなく、Ｚ軸方向に傾いていてもよい。フレキシブル基板２の対向部２１がリジッド基板１と平行ではなく、Ｚ軸方向に傾いている場合でも、対向部２１は、リジッド基板１と対向していると言える。 In the present embodiment, the shape of the facing portion 21 is rectangular, and the facing portion 21 and the rigid substrate 1 are parallel. However, the shape of the facing portion 21 is not limited to a rectangle. Further, the facing portion 21 of the flexible substrate 2 does not need to be provided in parallel with the rigid substrate 1 and may be inclined in the Z-axis direction. Even when the opposing portion 21 of the flexible substrate 2 is not parallel to the rigid substrate 1 but is inclined in the Z-axis direction, it can be said that the opposing portion 21 faces the rigid substrate 1.
　フレキシブル基板２の４つの接続部２２は、矩形形状である対向部２１の四辺に対応した位置に設けられている。４つの接続部２２はそれぞれ、リジッド基板１の第１の主面１ａと平行である平行部２２ａと、リジッド基板１の第１の主面１ａと直交する直交部２２ｂとを備えたＬ字状の形状を有する。 (4) The four connection portions 22 of the flexible board 2 are provided at positions corresponding to the four sides of the rectangular opposing portion 21. Each of the four connection portions 22 has an L-shape including a parallel portion 22a parallel to the first main surface 1a of the rigid substrate 1 and an orthogonal portion 22b orthogonal to the first main surface 1a of the rigid substrate 1. It has the shape of
　本実施形態では、フレキシブル基板２の接続部２２のうち、平行部２２ａとリジッド基板１とが接続されている。フレキシブル基板２とリジッド基板１とは、機械的および電気的に接続されている。例えば、バンプ電極やはんだ付けなどによって、フレキシブル基板２の接続部２２の平行部２２ａとリジッド基板１とが機械的および電気的に接続されている。 In the present embodiment, the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are connected. The flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected. For example, the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 are mechanically and electrically connected by a bump electrode, soldering, or the like.
　フレキシブル基板２の接続部２２には、図３に示すように、接地電位に接続される電極２１２、２１３に挟まれた信号線２１１が設けられている。接地電位に接続される電極２１２、２１３に信号線２１１が挟まれていることにより、電磁波が外部に放射されることを抑制し、かつ、信号線２１１が外部からの電磁波の影響を受けることを抑制することができる。信号線２１１は、例えば、平行部２２ａにおいてリジッド基板１と電気的に接続され、対向部２１において、対向部２１に実装されている電子部品３と電気的に接続されている。これにより、リジッド基板１とフレキシブル基板２との電気的な接続において、さらなる柱状電極等の接続部品を不要とすることができる。 (3) The connection portion 22 of the flexible substrate 2 is provided with a signal line 211 sandwiched between electrodes 212 and 213 connected to the ground potential, as shown in FIG. Since the signal line 211 is sandwiched between the electrodes 212 and 213 connected to the ground potential, it is possible to prevent the electromagnetic wave from being radiated to the outside and to prevent the signal line 211 from being affected by the external electromagnetic wave. Can be suppressed. The signal line 211 is, for example, electrically connected to the rigid substrate 1 at the parallel portion 22 a and electrically connected to the electronic component 3 mounted on the opposing portion 21 at the opposing portion 21. Thereby, in the electrical connection between the rigid substrate 1 and the flexible substrate 2, it is possible to eliminate the need for further connecting components such as columnar electrodes.
　ただし、フレキシブル基板２の接続部２２の平行部２２ａとリジッド基板１との間をエポキシ樹脂などの接着剤を用いて接続し、電気的な接続は別の位置で行うようにしてもよい。例えば、充填部１０において、リジッド基板１に設けられている電極が、バンプまたは柱状電極と、フレキシブル基板２の対向部２１に設けたスルーホールとを介して、対向部２１の第１の主面２１ａ上の電極と接続されていてもよい。 However, the parallel portion 22a of the connection portion 22 of the flexible substrate 2 and the rigid substrate 1 may be connected using an adhesive such as epoxy resin, and electrical connection may be made at another position. For example, in the filling portion 10, the electrode provided on the rigid substrate 1 is formed on the first main surface of the opposing portion 21 via a bump or a columnar electrode and a through hole provided on the opposing portion 21 of the flexible substrate 2. It may be connected to the electrode on 21a.
　なお、フレキシブル基板２の接続部２２が平行部２２ａを有していない構成としてもよい。その場合、接続部２２の直交部２２ｂと、リジッド基板１とが接続される。 The connection portion 22 of the flexible substrate 2 may not have the parallel portion 22a. In that case, the rigid portion 1 is connected to the orthogonal portion 22b of the connection portion 22.
　複数の接続部２２のうちの少なくとも１つは、開口部２０を有する。開口部２０は、モジュール１００の製造時に、製造後に充填部１０となるキャビティにモールド樹脂を流入させるためのものである。 少 な く と も At least one of the plurality of connecting portions 22 has the opening 20. The opening 20 is for allowing the mold resin to flow into the cavity that becomes the filling unit 10 after the module 100 is manufactured.
　本実施形態では、４つの接続部２２の直交部２２ｂのそれぞれが開口部２０を有する。開口部２０が設けられる位置に特に制約はないが、矩形形状である対向部２１の四辺それぞれの中央に対応する位置に設けられていることが好ましい。対向部２１の四辺それぞれの中央に対応する位置に開口部２０が設けられていることにより、モジュール１００の製造時に、モールド樹脂４をキャビティに効率よく充填させることができる。 In the present embodiment, each of the orthogonal portions 22 b of the four connection portions 22 has the opening 20. There is no particular restriction on the position where the opening 20 is provided, but it is preferable that the opening 20 is provided at a position corresponding to the center of each of four sides of the rectangular facing portion 21. Since the opening 20 is provided at a position corresponding to the center of each of the four sides of the facing portion 21, the mold resin 4 can be efficiently filled in the cavity when the module 100 is manufactured.
　本実施形態では、図１および図２に示すように、直交部２２ｂのＺ軸方向の全ての位置が開口するように開口部２０が設けられているが、Ｚ軸方向の一部の位置が開口するように開口部２０が設けられていてもよい。 In the present embodiment, as shown in FIGS. 1 and 2, the opening 20 is provided so as to open all positions in the Z-axis direction of the orthogonal portion 22 b, but a part of the position in the Z-axis direction is The opening 20 may be provided so as to open.
　フレキシブル基板２の対向部２１のうち、リジッド基板１とは反対側に位置する第１の主面２１ａには、少なくとも１つの電子部品３が実装されている。 少 な く と も At least one electronic component 3 is mounted on the first main surface 21 a of the opposing portion 21 of the flexible substrate 2 which is located on the side opposite to the rigid substrate 1.
　モジュール１００に実装されている電子部品３の種類に特に制約はなく、例えば、ＳＭＤ（表面実装）タイプのインダクタ、キャパシタ、抵抗、水晶発振器、ＳＡＷフィルタ、ＢＡＷフィルタ、デュプレクサ、および半導体チップなどである。半導体チップは、例えば、ＰＡ（パワーアンプ）、ＬＮＡ（ローノイズアンプ）、スイッチＩＣ、ＲＦ－ＩＣ、ベースバンドＩＣなどである。これらの電子部品３は、例えばはんだを用いて実装されている。また、電子部品３が半導体チップの場合には、基板上のランド電極と、ワイヤボンディング、はんだバンプ、Ａｕバンプなどで接続することができる。 There is no particular limitation on the type of the electronic component 3 mounted on the module 100, and examples thereof include an SMD (surface mounting) type inductor, capacitor, resistor, crystal oscillator, SAW filter, BAW filter, duplexer, and semiconductor chip. . The semiconductor chip is, for example, a PA (power amplifier), an LNA (low noise amplifier), a switch IC, an RF-IC, a baseband IC, or the like. These electronic components 3 are mounted using, for example, solder. When the electronic component 3 is a semiconductor chip, it can be connected to a land electrode on the substrate by wire bonding, solder bump, Au bump, or the like.
　モールド樹脂４は、少なくとも充填部１０に設けられている。モールド樹脂４は、例えばポリイミド樹脂またはエポキシ樹脂である。 The mold resin 4 is provided at least in the filling portion 10. The mold resin 4 is, for example, a polyimide resin or an epoxy resin.
　本実施形態では、モジュール１００のうち、リジッド基板１の第１の主面１ａ側に位置する全てのものがモールド樹脂４によって覆われている。すなわち、充填部１０にはモールド樹脂４が充填されており、かつ、フレキシブル基板２の全体と、フレキシブル基板２に実装されている全ての電子部品３がモールド樹脂４によって覆われている。 In the present embodiment, all of the modules 100 located on the first main surface 1 a side of the rigid substrate 1 are covered with the mold resin 4. That is, the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4.
　本実施形態におけるモジュール１００によれば、少なくともリジッド基板１とフレキシブル基板２の対向部２１との間の充填部１０にモールド樹脂４が設けられているので、フレキシブル基板２の変形を抑制することができる。また、モジュール１００の製造時には、後述するように、フレキシブル基板２を覆うようにモールド樹脂が供給されるが、供給されたモールド樹脂は、開口部２０からキャビティ内に流入するので、モールド樹脂の供給時にフレキシブル基板２が変形することも抑制することができる。 According to the module 100 in the present embodiment, since the molding resin 4 is provided at least in the filling portion 10 between the rigid substrate 1 and the facing portion 21 of the flexible substrate 2, deformation of the flexible substrate 2 is suppressed. it can. When the module 100 is manufactured, the molding resin is supplied so as to cover the flexible substrate 2 as described later. However, since the supplied molding resin flows into the cavity from the opening 20, the molding resin is supplied. Sometimes, the deformation of the flexible substrate 2 can also be suppressed.
　（モジュールの製造方法）
　上述した構成を有するモジュール１００の製造方法について説明する。 (Module manufacturing method)
A method for manufacturing the module 100 having the above-described configuration will be described.
　初めに、複数のモジュールを一括して製造することが可能なフレキシブル集合基板３０を用意して、フレキシブル集合基板３０に複数の電子部品３を実装する（図４参照）。なお、図４に示すフレキシブル集合基板３０は、１２個のモジュールを一括して製造することができる。 First, a flexible assembly board 30 capable of manufacturing a plurality of modules at once is prepared, and a plurality of electronic components 3 are mounted on the flexible assembly board 30 (see FIG. 4). In addition, the flexible collective board 30 shown in FIG. 4 can manufacture 12 modules collectively.
　例えば、フレキシブル集合基板３０として銅箔付きの絶縁シートを用いる場合、予め銅箔をエッチング等することによって、実装する電子部品３の端子に対応したランド電極や、電子部品同士を接続するための配線を形成しておく。そして、ランド電極に電子部品３を実装する。 For example, when an insulating sheet with a copper foil is used as the flexible collective substrate 30, a land electrode corresponding to the terminal of the electronic component 3 to be mounted or a wiring for connecting the electronic components is formed by etching the copper foil in advance. Is formed. Then, the electronic component 3 is mounted on the land electrode.
　続いて、フレキシブル集合基板３０の所定の位置に開口部を設ける。ここでは、図５に示すように、完成後に各モジュールの接続部の直交部となる４箇所に開口部２０を設けるものとして説明する。ただし、開口部２０は、接続部の直交部となる位置の少なくとも１箇所に設ければよい。なお、開口部２０を設けた後に、フレキシブル集合基板３０に電子部品３を実装するようにしてもよい。 Next, an opening is provided at a predetermined position of the flexible collective substrate 30. Here, as shown in FIG. 5, the description will be made on the assumption that the openings 20 are provided at four places which are orthogonal to the connection parts of each module after completion. However, the opening 20 may be provided at at least one of the positions that are orthogonal to the connection part. After providing the opening 20, the electronic component 3 may be mounted on the flexible collective substrate 30.
　続いて、複数のキャビティを形成するために、フレキシブル集合基板３０を折り曲げる。すなわち、図５の点線に沿って、フレキシブル集合基板３０を折り曲げる。フレキシブル集合基板３０を折り曲げた後に、図５のＶＩ－ＶＩ線に沿って切断した場合の断面図を図６に示す。図６は、開口部２０の無い位置で切断したときの断面図である。 Next, the flexible collective substrate 30 is bent to form a plurality of cavities. That is, the flexible collective substrate 30 is bent along the dotted line in FIG. FIG. 6 is a cross-sectional view when the flexible assembly substrate 30 is bent and then cut along the line VI-VI in FIG. FIG. 6 is a cross-sectional view when cut at a position where there is no opening 20.
　続いて、一方主面上に電子部品３が実装されたリジッド集合基板を用意する。リジッド集合基板の他方主面には、実装用電極が設けられていてもよい。 (4) Next, a rigid assembly board having the electronic component 3 mounted on one main surface is prepared. A mounting electrode may be provided on the other main surface of the rigid assembly substrate.
　そして、図７に示すように、リジッド集合基板４０に実装された電子部品３がキャビティ内に位置するように、リジッド集合基板４０とフレキシブル集合基板３０とを位置合わせした後、リジッド集合基板４０とフレキシブル集合基板３０とを接合する。例えば、フレキシブル集合基板３０のリジッド集合基板４０と接触する部分に接合用電極を形成しておき、リジッド集合基板４０上の電極と、フレキシブル集合基板３０の接合用電極とを、はんだなどにより接合する。 Then, as shown in FIG. 7, the rigid assembly board 40 and the flexible assembly board 30 are aligned so that the electronic components 3 mounted on the rigid assembly board 40 are located in the cavities. The flexible assembly substrate 30 is joined. For example, a bonding electrode is formed in a portion of the flexible collective substrate 30 that is in contact with the rigid collective substrate 40, and the electrode on the rigid collective substrate 40 and the joint electrode of the flexible collective substrate 30 are bonded by soldering or the like. .
　続いて、フレキシブル集合基板３０を覆うようにモールド樹脂を供給する。モールド樹脂として、例えばポリイミド樹脂またはエポキシ樹脂を用いることができる。モールド樹脂は、流動性を有していれば、液状タイプでもよいし、固形タイプでもよい。モールド樹脂の供給は、例えばディスペンサを用いて行う。 (5) Subsequently, mold resin is supplied so as to cover the flexible collective substrate 30. As the mold resin, for example, a polyimide resin or an epoxy resin can be used. The mold resin may be a liquid type or a solid type as long as it has fluidity. The supply of the mold resin is performed using, for example, a dispenser.
　このとき、フレキシブル集合基板３０に実装された複数の電子部品３を覆うようにモールド樹脂を供給することが好ましい。また、例えばフレキシブル集合基板３０を覆うモールド樹脂と、フレキシブル集合基板３０に実装された複数の電子部品３を覆うモールド樹脂とでモールド樹脂の組成または種類を変えてもよく、モールド樹脂は単一のものに限られない。 At this time, it is preferable to supply the mold resin so as to cover the plurality of electronic components 3 mounted on the flexible collective board 30. Further, for example, the composition or type of the mold resin may be changed between the mold resin covering the flexible collective substrate 30 and the mold resin covering the plurality of electronic components 3 mounted on the flexible collective substrate 30, and a single mold resin may be used. It is not limited to things.
　フレキシブル集合基板３０の全体に供給されたモールド樹脂は、開口部２０からキャビティ内に流入し、キャビティ内にモールド樹脂が充填される。フレキシブル集合基板３０を覆うようにモールド樹脂が供給され、かつ、キャビティ内部にモールド樹脂が充填されると、モールド樹脂を加熱して硬化させる。 (4) The mold resin supplied to the entire flexible collective board 30 flows into the cavity from the opening 20, and the cavity is filled with the mold resin. When the mold resin is supplied to cover the flexible collective substrate 30 and the inside of the cavity is filled with the mold resin, the mold resin is heated and cured.
　最後に、リジッド集合基板４０とフレキシブル集合基板３０とを分割することによって、複数のモジュール１００を得る。分割は、リジッド集合基板４０とフレキシブル集合基板３０とが電気的に接続されている部分を避けて行う。 Finally, by dividing the rigid assembly board 40 and the flexible assembly board 30, a plurality of modules 100 are obtained. The division is performed while avoiding a portion where the rigid collective board 40 and the flexible collective board 30 are electrically connected.
　本実施形態におけるモジュールの製造方法によれば、フレキシブル集合基板３０を覆うように供給されたモールド樹脂は、開口部２０からキャビティ内に流入する。開口部２０が設けられていない場合には、キャビティ内にモールド樹脂が流入しないため、供給されたモールド樹脂の重みによって、フレキシブル集合基板３０のうち、完成後に対向部となる部分が変形する可能性がある。しかしながら、本実施形態では、フレキシブル集合基板３０に開口部２０が設けられていることにより、モールド樹脂が開口部２０からキャビティ内に流入するので、フレキシブル集合基板３０の変形を抑制することができる。 According to the module manufacturing method of the present embodiment, the mold resin supplied to cover the flexible collective substrate 30 flows into the cavity from the opening 20. If the opening 20 is not provided, the mold resin does not flow into the cavity, and the weight of the supplied mold resin may deform the portion of the flexible collective substrate 30 that will become the facing portion after completion. There is. However, in the present embodiment, since the opening 20 is provided in the flexible collective substrate 30, the molding resin flows into the cavity from the opening 20, so that the deformation of the flexible collective substrate 30 can be suppressed.
　また、本実施形態におけるモジュールの製造方法によれば、複数のモジュールを一度に製造することができる。 According to the module manufacturing method of the present embodiment, a plurality of modules can be manufactured at one time.
　＜第２実施形態＞
　図８は、第２の実施形態におけるモジュール１００Ａの断面を模式的に示す図である。ただし、図８は、開口部２０が設けられていない位置でモジュール１００Ａを切断した場合の断面図を示している。 <Second embodiment>
FIG. 8 is a diagram schematically illustrating a cross section of the module 100A according to the second embodiment. However, FIG. 8 shows a cross-sectional view when the module 100A is cut at a position where the opening 20 is not provided.
　第２の実施形態におけるモジュール１００Ａでは、フレキシブル基板２の接続部２２の直交部２２ｂにも電子部品３が実装されている。図８では、接続部２２の直交部２２ｂに実装されている電子部品３を２つ示しているが、少なくとも１つの電子部品３が直交部２２ｂにも実装されていればよい。 モ ジ ュ ー ル In the module 100A according to the second embodiment, the electronic component 3 is also mounted on the orthogonal portion 22b of the connection portion 22 of the flexible substrate 2. FIG. 8 shows two electronic components 3 mounted on the orthogonal portion 22b of the connection portion 22, but it is sufficient that at least one electronic component 3 is also mounted on the orthogonal portion 22b.
　直交部２２ｂに実装されている電子部品３は、Ｚ軸方向において、フレキシブル基板２の対向部２１の第１の主面２１ａよりも突出するように実装されていてもよい。図８では、直交部２２ｂに実装されている２つの電子部品３のうち、右側に位置する電子部品３がフレキシブル基板２の対向部２１の第１の主面２１ａよりも上方に突出するように実装されていている。電子部品３がフレキシブル基板２の対向部２１の第１の主面２１ａよりも突出するように実装されていることにより、例えば、対向部２１の第１の主面２１ａに実装されている他の電子部品３との間で電磁界結合を発生させやすくすることができる。 The electronic component 3 mounted on the orthogonal portion 22b may be mounted so as to protrude from the first main surface 21a of the facing portion 21 of the flexible substrate 2 in the Z-axis direction. In FIG. 8, the electronic component 3 located on the right side of the two electronic components 3 mounted on the orthogonal portion 22 b is protruded above the first main surface 21 a of the facing portion 21 of the flexible substrate 2. Has been implemented. Since the electronic component 3 is mounted so as to protrude from the first main surface 21a of the opposing portion 21 of the flexible substrate 2, for example, other electronic components mounted on the first main surface 21a of the opposing portion 21 are provided. Electromagnetic field coupling with the electronic component 3 can be easily generated.
　第２の実施形態におけるモジュール１００Ａによれば、フレキシブル基板２の接続部２２の直交部２２ｂにも電子部品３が実装されているので、その分、対向部２１に実装する電子部品３の数を減らして、対向部２１を小さくすることができる。これにより、モジュール１００Ａを小型化することができる。 According to the module 100A of the second embodiment, since the electronic components 3 are also mounted on the orthogonal portions 22b of the connection portions 22 of the flexible substrate 2, the number of the electronic components 3 mounted on the facing portion 21 is reduced accordingly. Thus, the facing portion 21 can be made smaller. Thereby, the module 100A can be reduced in size.
　また、フレキシブル基板２の接続部２２の直交部２２ｂに、例えばアンテナを配置することにより、信号の放射特性や指向性を所望の特性に調整することができる。 Also, by arranging, for example, an antenna in the orthogonal portion 22b of the connection portion 22 of the flexible substrate 2, the radiation characteristics and directivity of the signal can be adjusted to desired characteristics.
　＜第３の実施形態＞
　図９は、第３の実施形態におけるモジュール１００Ｂの断面を模式的に示す図である。第３の実施形態におけるモジュール１００Ｂでは、フレキシブル基板２の対向部２１の両主面に電子部品３が実装されている。すなわち、対向部２１の第１の主面２１ａだけでなく、充填部１０に面している第２の主面２１ｂにも電子部品３が実装されている。対向部２１の第２の主面２１ｂには、少なくとも１つの電子部品３が実装されていればよい。 <Third embodiment>
FIG. 9 is a diagram schematically illustrating a cross section of the module 100B according to the third embodiment. In the module 100B according to the third embodiment, the electronic components 3 are mounted on both main surfaces of the opposing portion 21 of the flexible substrate 2. That is, the electronic component 3 is mounted not only on the first main surface 21a of the facing portion 21 but also on the second main surface 21b facing the filling portion 10. It is sufficient that at least one electronic component 3 is mounted on the second main surface 21b of the facing portion 21.
　対向部２１の第２の主面２１ｂに実装されている電子部品３は、開口部２０を通って充填部１０の外へと突出するように実装されていてもよい。図９では、対向部２１の第２の主面２１ｂに実装されている複数の電子部品３のうち、一番右側に実装されている電子部品３が開口部２０を通って充填部１０の外へと突出するように実装されている。例えば、電子部品３が充填部１０の外へと突出していることにより、充填部１０の外に実装されている他の電子部品３との間で電磁界結合を発生させやすくすることができる。 (4) The electronic component 3 mounted on the second main surface 21b of the facing portion 21 may be mounted so as to protrude outside the filling portion 10 through the opening 20. In FIG. 9, among the plurality of electronic components 3 mounted on the second main surface 21 b of the facing portion 21, the electronic component 3 mounted on the rightmost side passes through the opening 20 and is outside the filling portion 10. It is implemented to protrude to. For example, since the electronic component 3 protrudes out of the filling unit 10, it is possible to easily generate electromagnetic field coupling with another electronic component 3 mounted outside the filling unit 10.
　第３の実施形態におけるモジュール１００Ｂによれば、フレキシブル基板２の対向部２１の第１の主面２１ａだけでなく第２の主面２１ｂにも電子部品３が実装されているので、その分、第１の主面２１ａに実装する電子部品３の数を減らして、対向部２１を小さくすることができる。これにより、モジュール１００Ｂを小型化することができる。 According to the module 100B of the third embodiment, the electronic component 3 is mounted not only on the first main surface 21a of the opposing portion 21 of the flexible substrate 2 but also on the second main surface 21b. The number of the electronic components 3 mounted on the first main surface 21a can be reduced, and the size of the facing portion 21 can be reduced. Thereby, the module 100B can be downsized.
　＜第４の実施形態＞
　図１０は、第４の実施形態におけるモジュール１００Ｃの断面を模式的に示す図である。ただし、図１０は、開口部２０が設けられていない位置の断面を示している。 <Fourth embodiment>
FIG. 10 is a diagram schematically illustrating a cross section of a module 100C according to the fourth embodiment. However, FIG. 10 shows a cross section at a position where the opening 20 is not provided.
　第４の実施形態におけるモジュール１００Ｃでは、フレキシブル基板２のうちの充填部１０を構成する部分に、電磁波を遮断するための電磁波シールド部５０が設けられている。 モ ジ ュ ー ル In the module 100C of the fourth embodiment, the electromagnetic wave shielding unit 50 for blocking electromagnetic waves is provided in a portion of the flexible substrate 2 that constitutes the filling unit 10.
　電磁波シールド部５０は、例えばＣｕ、Ａｇ、Ａｌなどの導電性の材料からなり、リジッド基板１に設けられているグランド電極と電気的に接続されている。リジッド基板１のグランド電極は、例えば、リジッド基板１を多層基板として構成した場合には基板内部に設けられていてもよいし、リジッド基板１の第２の主面１ｂに設けられていてもよい。また、フレキシブル基板２を多層基板として構成し、フレキシブル基板２の内部にグランド電極を設けて、このグランド電極と電磁波シールド部５０とが電気的に接続された構成としてもよい。 The electromagnetic wave shield unit 50 is made of a conductive material such as Cu, Ag, or Al, for example, and is electrically connected to a ground electrode provided on the rigid substrate 1. For example, when the rigid substrate 1 is configured as a multilayer substrate, the ground electrode of the rigid substrate 1 may be provided inside the substrate, or may be provided on the second main surface 1b of the rigid substrate 1. . Alternatively, the flexible substrate 2 may be configured as a multilayer substrate, a ground electrode may be provided inside the flexible substrate 2, and the ground electrode and the electromagnetic wave shield unit 50 may be electrically connected.
　本実施形態では、図１０に示すように、フレキシブル基板２の両面のうち、リジッド基板１側の面の全体に電磁波シールド部５０が設けられているが、面全体に設けられている必要はなく、少なくとも充填部１０を構成する部分に電磁波シールド部５０が設けられていればよい。また、フレキシブル基板２を多層基板として構成し、基板内部に電磁波シールド部５０を設けるようにしてもよい。 In the present embodiment, as shown in FIG. 10, the electromagnetic wave shield part 50 is provided on the entire surface of the flexible substrate 2 on the rigid substrate 1 side, but it is not necessary to provide the electromagnetic wave shield part 50 on the entire surface. It is sufficient that the electromagnetic wave shield part 50 is provided at least in a part constituting the filling part 10. Alternatively, the flexible substrate 2 may be configured as a multilayer substrate, and the electromagnetic wave shield 50 may be provided inside the substrate.
　第４の実施形態におけるモジュール１００Ｃによれば、フレキシブル基板２のうちの充填部１０を構成する部分に電磁波シールド部５０が設けられていることにより、パワーアンプなどのように電磁波を放射する電子部品３が充填部１０内に実装されている場合に、充填部１０の外へ電磁波が放射されることを抑制することができる。また、充填部１０内に実装されている電子部品３が、充填部１０の外部からの電磁波の影響を受けることを抑制することができる。 According to the module 100 </ b> C in the fourth embodiment, the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 that forms the filling unit 10, so that an electronic component such as a power amplifier that emits electromagnetic waves is provided. In the case where 3 is mounted in the filling section 10, it is possible to suppress the electromagnetic wave from being emitted outside the filling section 10. Further, the electronic component 3 mounted in the filling unit 10 can be suppressed from being affected by electromagnetic waves from outside the filling unit 10.
　＜第５の実施形態＞
　図１１は、第５の実施形態におけるモジュール１００Ｄの断面を模式的に示す図である。図１１は、図１０と同様に、開口部２０が設けられていない位置の断面を示している。 <Fifth embodiment>
FIG. 11 is a diagram schematically illustrating a cross section of a module 100D according to the fifth embodiment. FIG. 11 shows a cross section at a position where the opening 20 is not provided, similarly to FIG.
　第５の実施形態におけるモジュール１００Ｄでは、第４の実施形態におけるモジュール１００Ｃに対して、充填部１０が複数設けられている。 モ ジ ュ ー ル In the module 100D of the fifth embodiment, a plurality of filling units 10 are provided for the module 100C of the fourth embodiment.
　例えば、リジッド基板１に設けられている電子部品３ごとに充填部１０を設けるようにしてもよい。その場合、１つの充填部１０に複数の電子部品３が実装されている構成と比べて、充填部１０の容積を小さくすることができ、製造時にキャビティ内へのモールド樹脂の充填が容易となる。 For example, the filling unit 10 may be provided for each electronic component 3 provided on the rigid board 1. In this case, compared to a configuration in which a plurality of electronic components 3 are mounted on one filling unit 10, the volume of the filling unit 10 can be reduced, and the filling of the mold resin into the cavity during manufacturing becomes easy. .
　また、第４の実施形態におけるモジュール１００Ｃと同様に、フレキシブル基板２のうちの充填部１０を構成する部分に電磁波シールド部５０が設けられているので、各充填部１０内に実装されている電子部品３ごとに、電磁波を遮断することができる。 Further, similarly to the module 100C in the fourth embodiment, since the electromagnetic wave shielding unit 50 is provided in a portion of the flexible substrate 2 which forms the filling unit 10, the electronic components mounted in each filling unit 10 are provided. Electromagnetic waves can be blocked for each component 3.
　なお、電子部品３ごとに充填部１０を設ける必要はない。例えば、電磁界結合を低減したい複数の電子部品３がリジッド基板１に実装されている場合に、それらの電子部品３をそれぞれ別の充填部１０内に実装することにより、電磁界結合を低減することができる。電磁界結合を低減したい複数の電子部品３とは、例えばパワーアンプとローノイズアンプである。 It is not necessary to provide the filling unit 10 for each electronic component 3. For example, when a plurality of electronic components 3 whose electromagnetic field coupling is to be reduced are mounted on the rigid board 1, the electromagnetic component coupling is reduced by mounting the electronic components 3 in different filling portions 10. be able to. The plurality of electronic components 3 whose electromagnetic field coupling is to be reduced are, for example, a power amplifier and a low noise amplifier.
　＜第６の実施形態＞
　図１２は、第６の実施形態におけるモジュール１００Ｅの断面を模式的に示す図である。第６の実施形態におけるモジュール１００Ｅでは、フレキシブル基板２が、リジッド基板１からの距離が異なる複数の対向部２１を備える。ここでは、フレキシブル基板２が第１の対向部２１Ｘと第２の対向部２１Ｙの２つの対向部２１を備えるものとして説明する。ただし、複数の対向部２１の数は３つ以上であってもよい。 <Sixth embodiment>
FIG. 12 is a diagram schematically illustrating a cross section of a module 100E according to the sixth embodiment. In the module 100E according to the sixth embodiment, the flexible substrate 2 includes a plurality of opposing portions 21 having different distances from the rigid substrate 1. Here, a description will be given assuming that the flexible substrate 2 includes two opposing portions 21 of a first opposing portion 21X and a second opposing portion 21Y. However, the number of the plurality of opposing portions 21 may be three or more.
　フレキシブル基板２が、リジッド基板１からの距離の異なる複数の対向部２１を備えていることにより、リジッド基板１に、高さの異なる電子部品３を実装することができる。図１２に示すように、第１の対向部２１Ｘと比べて、第２の対向部２１Ｙの方がリジッド基板１からの距離が遠いので、リジッド基板１上であって、第１の対向部２１Ｘとの間の空間には、高さの低い電子部品３を実装し、第２の対向部２１Ｙとの間の空間には、高さの高い電子部品３を実装することができる。 (4) Since the flexible substrate 2 includes the plurality of opposing portions 21 having different distances from the rigid substrate 1, the electronic components 3 having different heights can be mounted on the rigid substrate 1. As shown in FIG. 12, the second opposing portion 21Y is farther from the rigid substrate 1 than the first opposing portion 21X, so that the second opposing portion 21Y is on the rigid substrate 1 and the first opposing portion 21X The electronic component 3 having a low height can be mounted in the space between the electronic component 3 and the electronic component 3 having a high height can be mounted in the space between the second opposing portion 21Y.
　また、放熱量の少ない電子部品３をフレキシブル基板２の第２の対向部２１Ｙの両主面のうちのリジッド基板１側の面に実装し、放熱量の多い電子部品３をリジッド基板１に実装するようにしてもよい。その場合、リジッド基板１に実装された電子部品３から発せられた熱は、リジッド基板１を介してモジュール１００Ｅの外部へと放出されやすくなる。 Further, the electronic component 3 having a small heat dissipation is mounted on the rigid board 1 side of the two main surfaces of the second opposing portion 21Y of the flexible board 2, and the electronic component 3 having a large heat dissipation is mounted on the rigid board 1. You may make it. In that case, the heat generated from the electronic component 3 mounted on the rigid board 1 is easily released to the outside of the module 100E via the rigid board 1.
　本発明は、上記実施形態に限定されるものではなく、本発明の範囲内において、種々の応用、変形を加えることが可能である。例えば、上述した各実施形態の特徴的な構成は、適宜組み合わせることができる。 The present invention is not limited to the above embodiment, and various applications and modifications can be made within the scope of the present invention. For example, the characteristic configurations of the embodiments described above can be appropriately combined.
　上述した各実施形態において、フレキシブル基板２は、４つの接続部２２を有するものとして説明したが、少なくとも２つの接続部２２を有していればよい。この場合、２つの接続部２２は、対向部２１の対向する辺にそれぞれ配置してもよい。また、上述した各実施形態では、接続部２２の直交部２２ｂのそれぞれが開口部２０を有するものとして説明したが、複数の接続部２２のうちの少なくとも１つの直交部２２ｂに開口部２０が設けられていればよい。その場合でも、モールド樹脂の供給時に、開口部２０からキャビティ内にモールド樹脂を流入させることができる。 In each of the embodiments described above, the flexible substrate 2 has been described as having four connection portions 22, but it is sufficient that the flexible substrate 2 has at least two connection portions 22. In this case, the two connecting portions 22 may be respectively arranged on opposing sides of the opposing portion 21. In each of the above-described embodiments, each of the orthogonal portions 22b of the connecting portion 22 has been described as having the opening 20, but the opening 20 is provided in at least one of the plurality of connecting portions 22. It should just be done. Even in that case, the mold resin can flow into the cavity from the opening 20 when the mold resin is supplied.
　上述した各実施形態では、充填部１０はモールド樹脂４が充填されており、かつ、フレキシブル基板２の全体と、フレキシブル基板２に実装されている全ての電子部品３がモールド樹脂４によって覆われているものとして説明したが、モールド樹脂４は、充填部１０にだけ充填されている構成としてもよい。ただし、フレキシブル基板２に実装されている電子部品３をモールド樹脂４で覆うことにより、その電子部品３を保護することができるため、電子部品３をモールド樹脂４で覆う構成とする方が好ましい。 In each of the above-described embodiments, the filling portion 10 is filled with the mold resin 4, and the entire flexible substrate 2 and all the electronic components 3 mounted on the flexible substrate 2 are covered with the mold resin 4. Although it has been described that the mold resin 4 is filled, only the filling portion 10 may be filled. However, since the electronic component 3 mounted on the flexible substrate 2 can be protected by covering the electronic component 3 with the mold resin 4, it is preferable that the electronic component 3 is covered with the mold resin 4.
　上述した製造方法では、フレキシブル集合基板３０を用いたが、フレキシブル集合基板３０を個片化したものを用いて、リジッド集合基板４０と接合してもよい。 In the above-described manufacturing method, the flexible collective substrate 30 is used, but the flexible collective substrate 30 may be singulated and joined to the rigid collective substrate 40.
１　　　リジッド基板
２　　　フレキシブル基板
３　　　電子部品
４　　　モールド樹脂
１０　　充填部
２０　　開口部
２１、２１Ｘ、２１Ｙ　対向部
２２　　接続部
２２ａ　平行部
２２ｂ　直交部
３０　　フレキシブル集合基板
４０　　リジッド集合基板
５０　　電磁波シールド部
１００、１００Ａ、１００Ｂ、１００Ｃ、１００Ｄ、１００Ｅ　モジュール
２１１　信号線
２１２　グランド
２１３　グランド DESCRIPTION OF SYMBOLS 1 Rigid board 2 Flexible board 3 Electronic component 4 Mold resin 10 Filling part 20 Opening 21, 21X, 21Y Facing part 22 Connecting part 22a Parallel part 22b Orthogonal part 30 Flexible assembly board 40 Rigid assembly board 50 Electromagnetic wave shield parts 100, 100A 100B, 100C, 100D, 100E Module 211 Signal line 212 Ground 213 Ground

Claims (8)

  1. 　リジッド基板と、
    　前記リジッド基板から離れた位置で前記リジッド基板と対向する対向部、および、前記対向部と前記リジッド基板とを接続する少なくとも２つの接続部を有するフレキシブル基板と、
    　電子部品と、
    　少なくとも前記リジッド基板と前記フレキシブル基板の前記対向部との間の充填部に設けられたモールド樹脂と、
    を備え、
    　前記電子部品は、前記フレキシブル基板上に実装されており、
    　少なくとも２つの前記接続部のうちの少なくとも１つは、開口部を有することを特徴とするモジュール。     A rigid substrate,
    An opposing portion opposing the rigid substrate at a position away from the rigid substrate, and a flexible substrate having at least two connecting portions connecting the opposing portion and the rigid substrate,
    Electronic components,
    Mold resin provided at least in the filling portion between the rigid substrate and the facing portion of the flexible substrate,
    With
    The electronic component is mounted on the flexible substrate,
    A module, wherein at least one of the at least two connections has an opening.
  2. 　前記電子部品は、前記対向部のうちの前記リジッド基板とは反対側の面である第１の主面に実装されており、
    　前記モールド樹脂は、前記充填部だけでなく、前記第１の主面に実装された前記電子部品を覆うように設けられていることを特徴とする請求項１に記載のモジュール。     The electronic component is mounted on a first main surface, which is a surface of the facing portion opposite to the rigid substrate,
    The module according to claim 1, wherein the mold resin is provided so as to cover not only the filling portion but also the electronic component mounted on the first main surface.
  3. 　前記電子部品は、前記接続部に実装されていることを特徴とする請求項１または２に記載のモジュール。 The module according to claim 1 or 2, wherein the electronic component is mounted on the connection unit.
  4. 　前記電子部品は、前記対向部のうちの前記充填部に面している第２の主面に実装されていることを特徴とする請求項１～３のいずれかに記載のモジュール。 (4) The module according to any one of (1) to (3), wherein the electronic component is mounted on a second main surface of the facing portion facing the filling portion.
  5. 　前記フレキシブル基板のうちの前記充填部を構成する部分には、電磁波を遮断するための電磁波シールド部が設けられていることを特徴とする請求項１～４のいずれかに記載のモジュール。 (5) The module according to any one of (1) to (4), wherein an electromagnetic wave shield part for blocking electromagnetic waves is provided in a part of the flexible substrate that constitutes the filling part.
  6. 　前記充填部は、複数形成されていることを特徴とする請求項１～５のいずれかに記載のモジュール。 The module according to any one of claims 1 to 5, wherein a plurality of the filling portions are formed.
  7. 　前記接続部には、接地電位に接続される電極に挟まれた信号線が配置されていることを特徴とする請求項１～６のいずれかに記載のモジュール。 (7) The module according to any one of (1) to (6), wherein a signal line sandwiched between electrodes connected to a ground potential is arranged in the connection portion.
  8. 　電子部品が実装されたフレキシブル集合基板の所定の位置に複数の開口部を設ける工程と、
    　複数のキャビティを形成するために前記フレキシブル集合基板を折り曲げる工程と、
    　リジッド集合基板に実装された電子部品が、前記キャビティ内に位置するように、前記リジッド集合基板と前記フレキシブル集合基板とを位置合わせしてから、前記リジッド集合基板と前記フレキシブル集合基板とを接合する工程と、
    　前記フレキシブル集合基板を覆うようにモールド樹脂を供給することによって、前記開口部から前記キャビティ内に前記モールド樹脂を流入させて、前記キャビティ内に前記モールド樹脂を充填する工程と、
    　供給された前記モールド樹脂を硬化させる工程と、
    　前記モールド樹脂が硬化した後、前記フレキシブル集合基板と前記リジッド集合基板とを分割することによって、複数のモジュールを製造する工程と、
    を備えることを特徴とするモジュールの製造方法。     Providing a plurality of openings at predetermined positions of the flexible collective board on which the electronic component is mounted,
    Bending the flexible collective substrate to form a plurality of cavities,
    The rigid assembly board and the flexible assembly board are aligned with each other so that the electronic component mounted on the rigid assembly board is located in the cavity, and then the rigid assembly board and the flexible assembly board are joined. Process and
    By supplying the mold resin so as to cover the flexible collective substrate, flowing the mold resin from the opening into the cavity, filling the cavity with the mold resin,
    Curing the supplied mold resin,
    After the mold resin is cured, by dividing the flexible collective board and the rigid collective board, a step of manufacturing a plurality of modules,
    A method for manufacturing a module, comprising:
PCT/JP2019/032284 2018-09-07 2019-08-19 Module and method for producing module WO2020049989A1 (en)

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