WO2020042632A1 - 一种发光器件及其制作方法、引线框架、支架、发光装置 - Google Patents

一种发光器件及其制作方法、引线框架、支架、发光装置 Download PDF

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Publication number
WO2020042632A1
WO2020042632A1 PCT/CN2019/083114 CN2019083114W WO2020042632A1 WO 2020042632 A1 WO2020042632 A1 WO 2020042632A1 CN 2019083114 W CN2019083114 W CN 2019083114W WO 2020042632 A1 WO2020042632 A1 WO 2020042632A1
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WO
WIPO (PCT)
Prior art keywords
base body
lead frame
bayonet
support
emitting device
Prior art date
Application number
PCT/CN2019/083114
Other languages
English (en)
French (fr)
Inventor
孙平如
沈彬彬
李壮志
姚亚澜
邢美正
Original Assignee
深圳市聚飞光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市聚飞光电股份有限公司 filed Critical 深圳市聚飞光电股份有限公司
Priority to KR1020217009281A priority Critical patent/KR20210047939A/ko
Priority to JP2021536128A priority patent/JP2021535628A/ja
Priority to US17/272,477 priority patent/US20220262998A1/en
Priority to EP19854119.5A priority patent/EP3846229A4/en
Publication of WO2020042632A1 publication Critical patent/WO2020042632A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the embodiment of the present invention relates to LED (Light Emitting Diode (Light Emitting Diode) technology field, in particular, relates to a light emitting device and a manufacturing method thereof, a lead frame, a bracket, and a light emitting device.
  • LED Light Emitting Diode
  • LEDs have played an important role in the display field of mobile terminals due to their unique advantages such as low price, low power consumption, high brightness, and long life, and they will have considerable development in a long period of time in the future. space.
  • the molding of the LED bracket and the packaging of the LED light-emitting device are performed on the lead frame.
  • the lead frame provides the lead for the LED product and provides support during the molding and packaging process.
  • the two support portions provided on the upper side are formed in the bayonet on both sides of the LED product to support it, and the bayonet is opened to the side and the other side adjacent to the two sides, so that the support is supported in the blanking process.
  • the part exits from the opening at the other side of the LED light emitting device adjacent to both sides to realize the blanking of the LED light emitting device.
  • the support part of the lead frame can only fix the five degrees of freedom of the LED product.
  • the fixed performance of LED products on the lead frame is limited, which may cause the LED products to fall off from the lead frame during production and processing operations.
  • the light-emitting device provided by the embodiments of the present invention, a manufacturing method thereof, a lead frame, a bracket, and a light-emitting device mainly solve the technical problems: the support portion on the existing lead frame can only fix five degrees of freedom of the LED product. The resulting LED products have limited fixing performance on the lead frame, and the LED products are prone to fall off the lead frame during production and processing operations.
  • an embodiment of the present invention provides a lead frame, which includes at least one hollow-shaped bracket molding region, and the bracket molding region has a support portion and a lead portion extending from the lead frame main body.
  • the support portion includes a first support portion and a second support portion opposite to each other.
  • the bracket forming area is used for forming the base body through the unsaturated polyester resin, and the support portions are respectively used for embedding the formed base body.
  • the support portion is disengaged from the inside of the base body to make the A bayonet is formed on the base body, and the bayonet includes a first bayonet and a second bayonet that are opened from the inside of the base body to the first outer side surface and the second outer side surface, respectively.
  • a surface of the lead portion is covered with a reflective layer.
  • the lead portion and the support portion are located on the same plane.
  • the thickness of the lead portion and the support portion are equal.
  • the lead portion is provided separately from the support portion, and one end of the support portion is an open end.
  • the end surface of the open end is provided with a protrusion; or, the surface of the support portion close to the open end is provided in a wedge shape.
  • an embodiment of the present invention further provides an LED bracket, including the lead portion of the lead frame described above, and a base body formed on a bracket molding area of the lead frame by using an unsaturated polyester resin.
  • the base body has a groove for packaging an LED chip, and the base body has a bayonet opening which is respectively opened from the inside of the base body to the first outer side and the second outer side opposite to the base body,
  • the bayonet includes a first bayonet and a second bayonet, and the bayonet is received by the support body extending from the lead frame main body in the molding area of the bracket, and the base body receives an action on the lead frame.
  • the external force on the main body is formed after being detached from the inside of the base main body.
  • a filler and / or titanium oxide are added to the unsaturated polyester resin, and the filler includes glass fiber and silica.
  • a preset additive is further added to the unsaturated polyester resin; the unsaturated polyester resin, glass fiber,
  • an embodiment of the present invention further provides an LED light emitting device, including the LED bracket and at least one LED chip packaged in a base body of the LED bracket.
  • an embodiment of the present invention further provides a light emitting device, including: the above light emitting device, the light emitting device is a lighting device, a light signal indicating device, a light supplement device or a backlight device.
  • an embodiment of the present invention further provides a method for manufacturing an LED light emitting device.
  • the method for manufacturing the LED light emitting device includes:
  • the prepared lead frame has at least one hollow-shaped support molding region, and the support molding region has a support portion and a lead portion extending from the lead frame main body, and the support portion includes a first support disposed oppositely ⁇ and the second support portion;
  • a base body is formed in the molding area of the bracket by an unsaturated polyester resin; the base body has a groove for encapsulating the LED chip, and the support portions are respectively embedded in the formed first base body opposite to the first base body. Inside one outer side and second outer side;
  • a force acting on the lead frame body is applied to the base body after the LED chip package, so that the support portion is detached from the inside of the base body after the LED chip package, and is detached.
  • a bayonet is formed on the rear base body, and the bayonet includes first openings that open from the interior of the base body to the first outer side surface and the second outer side surface of the base body, respectively. Bayonet and second bayonet.
  • the method further includes:
  • the lead part is separated from the lead frame body.
  • the method further includes:
  • a portion of the lead portion that protrudes outward in a vertical direction of the third outer side surface of the base body is bent to be attached to a surface of the base body.
  • the lead portion and the bayonet are all located on the same plane.
  • the thickness of the lead portion is equal to the width of the bayonet.
  • the molding of the base body in the bracket molding area by using an unsaturated polyester resin includes:
  • the base body is formed in the stent molding area by an unsaturated polyester resin added with a filler and / or titanium oxide, and the filler includes glass fiber and silica.
  • a preset additive is further added to the unsaturated polyester resin
  • a light-emitting device and a manufacturing method thereof a lead frame, a bracket, and a light-emitting device
  • the lead frame includes at least one hollow-shaped bracket molding region
  • the bracket molding region has a support portion extending from the lead frame body and
  • the lead portion and the support portion include a first support portion and a second support portion opposite to each other.
  • the bracket molding area is used to form the base body through the unsaturated polyester resin, and the support portions are respectively used to be embedded in the formed base body.
  • the support portion is detached from the inside of the base body to form a bayonet on the base body, and the bayonet includes A first bayonet and a second bayonet that are opened from the inside of the base body to the first outer side and the second outer side, respectively.
  • the support portions on the lead frame according to the embodiment of the present invention respectively extend into the bayonet openings on two opposite sides of the LED bracket to fix the six degrees of freedom of the LED bracket, and have high stability when the LED bracket is fixed. , Can effectively prevent the LED bracket from falling off from the lead frame during production and processing operations, and improve the yield of the LED bracket.
  • the blanking of the LED light emitting device in the embodiment of the present invention is to apply force in a direction perpendicular to the lead frame, so that the LED light emitting device is loaded and unloaded in a vertical direction, so that multiple LED light emitting devices can be simultaneously loaded.
  • the LED light emitting device performs synchronous blanking operation, which improves the production efficiency of the LED light emitting device and can effectively reduce the production cost.
  • FIG. 1 is a schematic diagram of forming an LED bracket according to the first embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a lead frame according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic side view of an LED bracket provided in Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural diagram of a support portion provided in Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural diagram of an LED light emitting device according to Embodiment 1 of the present invention.
  • FIG. 6 is a flowchart of a method for manufacturing an LED light emitting device according to a second embodiment of the present invention.
  • FIG. 7a is a schematic diagram before punching and separating the lead part according to the second embodiment of the present invention.
  • FIG. 7b is a schematic diagram after the lead part is cut and separated according to the second embodiment of the present invention.
  • FIG. 8a is a schematic diagram of a lead part vertically protruding outward from a side of a base body provided in Embodiment 2 of the present invention.
  • FIG. 8b is a schematic diagram of a lead part bent and attached to a surface of a base body provided in Embodiment 2 of the present invention.
  • FIG. 9a is a schematic diagram of an LED light-emitting device provided on a support portion provided in Embodiment 2 of the present invention.
  • FIG. 9b is a schematic diagram when the LED light emitting device is removed by force according to the second embodiment of the present invention.
  • an embodiment of the present invention provides a lead frame 10, as shown in FIG. 1.
  • the lead frame 10 includes at least one hollow-shaped support molding area 11, and the support molding area 11 has a self-lead frame. 10
  • the support portion 12 and the lead portion 13 extending from the main body.
  • the support portion 12 includes a first support portion and a second support portion disposed opposite to each other.
  • the bracket molding area 11 is used to form the base body 20 from the unsaturated polyester resin.
  • the support portions 12 are respectively embedded in the first outer side surface 21 and the second outer side surface 22 of the formed base body 20; when the base body 20 receives an external force acting on the main body of the lead frame 10, Detached from the base body 20 to form a bayonet 23 on the base body 20, the bayonet 23 includes a first bayonet and a first bayonet opening from the base body 20 to the first outer side surface 21 and the second outer side surface 22, respectively; second Bayonet.
  • the lead frame 10 may be formed by performing a stamping process or an etching process on a flat conductive substrate, so as to form at least one hollow-shaped bracket molding region 11 on the lead frame 10 so that the leads are formed.
  • a lead portion 13 and a support portion 12 are formed on the frame 10 after the material of the hollow area is removed, and the support portion 12 and the lead portion 13 extend from the lead frame 10 body to the hollow area.
  • the support in this embodiment The portion 12 and the lead portion 13 respectively extend from the lead frame 10 body to the hollowed-out area; in other embodiments, the support portion and the lead portion may also extend from the lead frame body to the hollowed-out area as a whole, that is, the lead portion passes through the support.
  • the part is connected to the lead frame body.
  • the lead portion 13 is provided with a die-fixing area for mounting LED chips, and is used for conducting the LED chips mounted on it later, while the support portion 12 is used for forming the LED bracket on the lead frame 10 and emitting LED light.
  • the support portions 12 in this embodiment are oppositely disposed. It should be noted that the first support portion and the second support portion may be a single support portion, or may be a whole formed by combining a plurality of single support portions.
  • the lead frame in this embodiment may be composed of substrates of various conductive materials, such as various metal or metal alloy substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, and silver substrates. Of course It can also be a mixed material substrate containing a conductive material, such as conductive rubber. In this embodiment, a copper alloy is preferably used to make the lead frame, which can ensure good electrical conductivity and heat dissipation. In addition, the lead frame in this embodiment may have a thin plate shape, so that it can be easily bent at a later stage, and can be easily formed into a predetermined shape. Moreover, the lead frame is not limited to a single-layer structure, and in some embodiments may also be a composite layer structure composed of a plurality of conductive materials.
  • a reflective layer may be coated on the surface of the lead portion.
  • the reflective layer here may be silver, aluminum, copper, gold, etc.
  • the coating method of the layer may preferably be electroplating. It should be noted that the coating treatment of the reflective layer here may be to process the entire lead frame before the LED bracket molding, or after the LED bracket molding is completed, only A reflective layer coating process is performed on the lead portion where the die-bonding area of the LED chip is placed. In order to further improve the reflectance of the surface of the lead portion, it is preferable that the lead portion can be formed into a smooth surface.
  • the lead portion 13 in this embodiment extends from the lead frame 10 body to the hollowed-out area and is formed in the space between the support portions 12, and the leads The positive lead portion and the negative lead portion of the portion 13 are disconnected to form an insulating isolation region.
  • the oppositely provided support portions 12 each have an open end, and the open end is provided separately from the lead portion 13.
  • the open end here refers to where One end does not form a connection with other components.
  • the support portion may not be provided with an open end, that is, the support portion extends from the lead frame body to the lead portion and is connected to the lead portion. In this case, in actual production, It is necessary to ensure that the final lead portion is separated from the support portion.
  • the lead portion 13 and the support portion 12 in this embodiment are located on the same plane, and further, the thickness of the lead portion 13 and the support portion 12 is equal, so that the process in actual production is easier to implement and can improve Controllability of the process.
  • the base body on the LED bracket is formed with a bayonet corresponding to the supporting portion, and a single bayonet is only on the base. An opening is formed on one side of the seat body for the support portion to exit from the inside of the bayonet.
  • the LED bracket in this embodiment includes the lead portion 13 of the lead frame 10 and a base body 20 formed on the bracket forming area 11 of the lead frame 10 by using an unsaturated polyester resin.
  • the base body 20 has a groove for packaging an LED chip, and the base body 20 has bayonet openings on the first outer side 21 and the second outer side 22 which are opposite to the base body 20 from the inside of the base body 20, respectively.
  • the bayonet 23 includes a first bayonet and a second bayonet.
  • the bayonet 23 is supported by the support portion 12 extending from the main body of the lead frame 10 in the bracket forming area 11 and received by the base body 20 to act on the main body of the lead frame 10. When the external force is applied, it is formed after being detached from the inside of the base body 20.
  • the LED bracket is clamped in a mold by a lead frame and injection-molded on a bracket molding area of the lead frame, and a groove of the LED chip packaging area is formed on the base body of the molded LED bracket.
  • the lead portion of the lead frame is at least partially exposed on the bottom surface of the groove, so as to serve as a mounting area for the LED chip.
  • the LED chip can be placed on the positive lead portion, and then the LED chip is electrically connected to the positive lead portion through a metal wire, and then the LED chip is connected to the negative lead portion through a metal wire.
  • the LED chip is flip-chip mounted, the aforementioned metal wire connecting the LED chip and the lead portion can be eliminated.
  • the groove is opened to the top of the base body, so that the inside of the groove can be sealed with a sealing material from the opening.
  • a bayonet 23 opened to the side is formed in the base body 20, and a single bayonet 23 is opened on only one side, for example, two bayonet 23 are on the first outer side, respectively. 21 and the second outer side 22 are opened.
  • the base body can be adjusted in six degrees of freedom in front, back, left, right, up, and down when the support portion is not deformed.
  • the support part is fixed and has high stability.
  • the two bayonets are only opened on a single side, and if the support portion is to be withdrawn from the opening and detached from the bayonet, the support portion needs to be deformed.
  • a protrusion 123 is provided on the end surface of the open end of the support portion 12.
  • the open end of the opening is close to the opening, the open end is in point contact with the opening through the protrusion 123.
  • the surface of the support portion close to the open end may also be set to be a wedge shape, and the contact with the opening can also be more easily released.
  • the base body is formed in the bracket molding area by using an unsaturated polyester resin.
  • the unsaturated polyester resin as a thermosetting resin has excellent reflectivity and resistance to deterioration such as ultraviolet rays, so that the LED light-emitting device has a long period of time. In the case of light emission, it can effectively suppress the deterioration of the reflective plate or resin, and maintain high reflectance and light efficiency.
  • unsaturated polyester resins do not have reactive functional groups such as hydroxyl groups (-OH groups), and do not form chemical bonds with metals. Therefore, it is difficult to produce resin burrs during the molding process, and it is easy to peel off the resin burrs even if it occurs.
  • the melting point of unsaturated polyester resin is about 50 ° C to 90 ° C. It can suppress the carbonization of organic substances added in the resin, which can effectively suppress molding defects.
  • the unsaturated polyester resin has a higher fluidity with respect to the thermoplastic resin, so that it can be injected at a lower injection pressure when the resin is injected. Resin is injected so that the possibility of deformation of the lead frame is reduced. During the injection molding process, it is not necessary to Holding, the mold can be simplified.
  • fillers composed of long fiber glass fibers and spherical silica can be further added to the unsaturated polyester resin to improve the strength of the resin.
  • titanium oxide can also be added to the unsaturated polyester to improve the light reflectivity of the resin.
  • the filler, titanium oxide, or both may be appropriately combined with other additives such as maleic anhydride, fumaric acid, styrene, a filler, a reinforcing agent, a curing agent, a release agent, and a pigment.
  • additives such as maleic anhydride, fumaric acid, styrene, a filler, a reinforcing agent, a curing agent, a release agent, and a pigment.
  • this embodiment further provides an LED light emitting device 100 made of the LED bracket, which includes the LED bracket and at least one LED chip 30 packaged in the base body 20 of the LED bracket. .
  • the colors of the LED light-emitting device provided by this embodiment that are irradiated and presented to the user can be flexibly set according to actual needs and application scenarios.
  • the color of the light emitted by the LED light-emitting device can be flexibly controlled by but not limited to the following factors: the color of the light emitted by the LED chip itself, whether the LED light-emitting device is provided with a light-emitting conversion layer, and when the LED light-emitting device is set to emit light
  • the type of the light-emitting conversion layer set when the layer is converted.
  • the LED light emitting device may further include a lens adhesive layer disposed on the LED chip (when a light emitting conversion adhesive layer is provided on the LED chip, it is disposed on the light emitting conversion adhesive layer) Or a diffusion glue layer; of course, in some examples, a transparent glue layer may be provided on the LED chip.
  • the light-emitting conversion glue layer may be a fluorescent glue layer containing a phosphor, or a colloid containing a quantum dot photoactive material, or other light-emitting conversion glue or film capable of realizing light conversion, It may also include diffusion powder or silicon powder as required; in this embodiment, the method for forming the light-emitting conversion adhesive layer, lens adhesive layer, or diffusion adhesive layer on the LED chip includes, but is not limited to, dispensing, molding, spraying, and pasting.
  • the light-emitting conversion adhesive layer may include a phosphor adhesive layer, a fluorescent film, or a quantum dot QD film; the phosphor adhesive layer and the fluorescent film may be made of an inorganic phosphor, and may be an inorganic phosphor doped with a rare earth element, wherein Inorganic phosphors include, but are not limited to, at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.
  • the quantum dot QD film can be made of quantum dot phosphors; quantum dot phosphors include but are not limited to BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe , GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI3.
  • quantum dot phosphors include but are not limited to BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe , Ga
  • the type of light emitted by the LED chip itself may be visible light visible to the naked eye, or may be ultraviolet or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light invisible to the naked eye
  • a light emitting conversion layer may be provided on the LED chip to convert invisible light to visible light, so that the light emitted by the LED light emitting device is light visible to the user.
  • the light emitting conversion layer may be made by mixing red, green, and blue phosphors.
  • the two supporting portions provided on the lead frame provided in the embodiment of the present invention respectively extend into the bayonet openings on the two side openings opposite to the LED bracket to fix the six degrees of freedom of the LED bracket and the LED bracket.
  • the stability during fixing is high, which can effectively prevent the LED bracket from falling off from the lead frame during the production and processing operation, which improves the yield of the LED bracket.
  • the blanking of the LED light emitting device in the embodiment of the present invention is to apply force in a direction perpendicular to the lead frame, so that the LED light emitting device is loaded and unloaded in a vertical direction, so that multiple LED light emitting devices can be simultaneously loaded on the lead frame.
  • the LED light emitting device performs synchronous blanking operation, which improves the production efficiency of the LED light emitting device and can effectively reduce the production cost.
  • this embodiment exemplifies the manufacturing process of the LED light emitting device provided by the embodiments of the present invention.
  • FIG. 6 is a flowchart of a method for manufacturing an LED light emitting device according to this embodiment.
  • specific implementation steps include:
  • the prepared lead frame has at least one hollow-shaped support molding area, and the support molding area includes a support portion and a lead portion extending from the lead frame body, and the support portion includes a first support portion and Second support.
  • the lead frame is formed by selectively removing the material of a predetermined area by punching or etching the conductive substrate, and the formed lead frame is formed with a bracket molding area for injection molding in a mold. Area that forms the base body of the LED holder.
  • the support portions on the lead frame are oppositely arranged, so that the LED bracket formed on the lead frame can be stably supported.
  • the support portion and the lead portion respectively extend from the lead frame body to the hollow area, and after the lead portion and the support portion extend from the lead frame body, the lead portion and the support portion are far from the lead frame body.
  • One end is open and does not form a connection with other components.
  • the support portion and the lead portion may also extend from the lead frame body to the hollow area as a whole, that is, the lead portion is connected to the lead frame body through the support portion.
  • the base body is formed in the molding area of the bracket by using unsaturated polyester resin; the base body has a groove for encapsulating the LED chip, and the supporting portions are respectively embedded in the first outer side and the second opposite side of the base body that are formed. Inside the outside.
  • the base body is injection-molded in the stent molding area using an unsaturated polyester resin.
  • fillers and / or titanium oxide may be further added to the unsaturated polyester.
  • the filler includes glass fiber and silica.
  • the filler may increase the strength of the resin, and the addition of titanium oxide may improve the resin's resistance to light. Reflectivity.
  • the filler, titanium oxide, or both may be appropriately combined with the following materials: maleic anhydride, fumaric acid, styrene, fillers, reinforcing agents, curing agents, mold release agents, pigments, and other additives .
  • the mold is heated for a predetermined time to harden the resin.
  • the support portion and the lead portion on the lead frame are embedded in the base body, and the support portions are respectively embedded into the base from the two opposite sides of the base body. Inside the seat body.
  • the method further includes: separating the lead portion from the lead frame body.
  • FIG. 7a is a schematic diagram before the lead part is punched and separated
  • FIG. 7b is a schematic diagram after the lead part is punched and separated.
  • the method further includes: bending the portion of the lead portion that protrudes outward in the vertical direction of the third outer side surface to be attached to the base.
  • the surface of the seat body is not limited to: bending the portion of the lead portion that protrudes outward in the vertical direction of the third outer side surface to be attached to the base.
  • a part of the lead portion 13 is formed inside the base body 20 as the inner lead portion 13 of the functional area of the LED chip.
  • another part is an external lead portion 131 protruding vertically outward from the side of the base body 20, and the external lead portion 131 is used for electrical connection with the outside, for example, soldered on a PCB board Therefore, in order to make it easy to be electrically connected to the outside, as shown in b in FIG. 8, in this embodiment, an external lead portion 131 separated from the lead frame 10 body is applied with a force to attach it to the base body 20. surface.
  • S603 Applying a force on the lead frame main body to the base body after the LED chip package, detach the support portion from the inside of the base body after the LED chip package, and form a card on the detached base body.
  • the mouth and the bayonet include a first bayonet and a second bayonet that open from the inside of the base body to the first outer side and the second outer side of the base body, respectively.
  • the lead portion and the bayonet in this embodiment are located on the same plane, and further, the thickness of the lead portion is equal to the width of the bayonet, so that the process in actual production is easier to implement and can improve the process. Controllability.
  • Fig. 9a it is a schematic diagram of the LED light emitting device being fixed on the support portion
  • Fig. 9b is a schematic diagram of the LED light emitting device when it is removed by force.
  • the step of removing the LED light emitting device is Since each bayonet is opened to only one side of the base body 20, if the base body 20 is to be separated from the support of the support portion 12, the support portion 12 can only be withdrawn from the side opening and only passed through.
  • the support portion 12 is subjected to a force perpendicular to the plane where the lead frame main body is located, thereby causing the support portion 12 to undergo a bending deformation, so that the support portion 12 gradually withdraws from its initial position in the bayonet 23.
  • FIG. 9a it is a schematic diagram of the LED light emitting device being fixed on the support portion
  • Fig. 9b is a schematic diagram of the LED light emitting device when it is removed by force.
  • the step of removing the LED light emitting device is Since each bayonet is
  • the first support portion 121 and the second support portion 122 are respectively engaged in the first bayonet 231 and the second bayonet 232 which are respectively opened on the first outer side 21 and the second outer side 22, as shown in FIG.
  • a force in the direction of the top surface that is, a longitudinal force
  • the bottom surface of the base body 20 that is, the support portion 12 is bent upward and exited from the opening.
  • this embodiment is optional You can also apply a force toward the bottom surface on the top surface of the base body to bend the support.
  • the setting position of the bayonet on the base body in this embodiment can be flexibly selected according to the actual application scenario, and it is only necessary to ensure that each bayonet is opened on only one side.
  • the base body is formed by using resin in the bracket molding area of the lead frame, and the two supporting portions provided on the lead frame are respectively extended into the opposite sides of the LED light-emitting device.
  • a force is applied to the LED light emitting device in a direction perpendicular to the plane where the lead frame is located in the blanking process to bend and deform the supporting portion and detach the supporting portion from the LED light emitting device.
  • a bayonet is formed at the corresponding position of the LED light-emitting device; the embodiment of the present invention can fix six degrees of freedom of the LED product, and has high stability when fixing the LED product, which can effectively prevent the LED product from being damaged during production and processing operations.
  • the lead frame is peeled off, which improves the yield of the LED light emitting device.
  • the blanking of the LED light emitting device in the embodiment of the present invention is to apply force in a direction perpendicular to the lead frame, so that the LED light emitting device is loaded and unloaded in a vertical direction, so that multiple LED light emitting devices can be simultaneously loaded.
  • the LED light emitting device performs synchronous blanking operation, which improves the production efficiency of the LED light emitting device and can effectively reduce the production cost.
  • This embodiment provides a light-emitting device, which includes the LED light-emitting device illustrated in the first embodiment or the second embodiment.
  • the light-emitting device in this embodiment may be a lighting device, a light signal indicating device, a fill light device, a backlight device, or the like.
  • a lighting device it may be a lighting device used in various fields, such as table lamps, fluorescent lamps, ceiling lamps, down lamps, street lamps, projection lamps, etc. in daily life, and high beam lamps and low beams in automobiles.
  • Lamps, atmosphere lamps, etc. such as medical surgical lamps, low electromagnetic lighting lamps, various medical instrument lighting, and for example various colored lights, landscape lighting, advertising lamps, etc.
  • the light signal indicating device can be specifically applied to various fields, for example, the signal light in the traffic field, and various signal status indicators on communication equipment in the communication field.
  • Complementary light in the field of photography such as flashlights, supplementary lights, or plants in the agricultural field, can be used as supplementary light for plants.
  • it is a backlight device, it can be a backlight module used in various backlight fields. It is used in monitors, televisions, mobile phones and other mobile terminals, advertising machines and other equipment.

Abstract

一种发光器件及其制作方法、引线框架（10）、支架、发光装置，该引线框架（10）的支架成型区域（11）内具有自引线框架（10）主体延伸出的支撑部（12）和引线部（13），支撑部（12）包括相对设置的第一/第二支撑部（121/122），支架成型区域（11）用于成型基座主体（20），支撑部（12）分别用于嵌入所成型的基座主体（20）相对的第一外侧面（21）和第二外侧面（22）之内。引线框架（10）上的支撑部（12）分别伸入仅在LED产品的相对侧面开口的卡口（23）中，来对LED产品的六个自由度进行固定，提高了对LED产品进行固定时的稳定性。

Description

一种发光器件及其制作方法、引线框架、支架、发光装置 技术领域
本发明实施例涉及LED（Light Emitting Diode，发光二极管）技术领域，尤其涉及一种发光器件及其制作方法、引线框架、支架、发光装置。
 背景技术
近年来，LED依靠其独特的低价、低耗、高亮度、长寿命等优越性一直在移动终端的显示领域扮演着重要的角色，并且在今后相当长的一段时期内还有相当大的发展空间。现有的LED生产工艺中，在引线框架上进行LED支架的成型和LED发光器件的封装，引线框架为LED产品提供引线并提供其成型、封装过程中的支撑，而现有的引线框架通过相对设置于上的两个支撑部成型于LED产品两侧的卡口内而对其进行支撑，并且卡口向侧面以及临接于两侧面的另一侧面进行开口，从而在下料工序中则是将支撑部从LED发光器件临接于两侧面的另一侧面处的开口退出，以实现LED发光器件的下料，在这种情况下引线框架的支撑部只能对LED产品的五个自由度进行固定，LED产品在引线框架上的固定性能有限，在生产加工作业中可能会使LED产品从引线框架上脱落。
 技术问题
本发明实施例提供的发光器件及其制作方法、引线框架、支架、发光装置，主要解决的技术问题是：现有的引线框架上的支撑部只能对LED产品的五个自由度进行固定，所导致的LED产品在引线框架上的固定性能有限，在生产加工作业中LED产品易从引线框架上脱落问题。
 
 技术解决方案
为解决上述技术问题，本发明实施例提供一种引线框架，包括至少一个镂空状的支架成型区域，所述支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，所述支撑部包括相对设置的第一支撑部和第二支撑部，所述支架成型区域用于通过不饱和聚酯树脂于上成型基座主体，所述支撑部分别用于嵌入所成型的所述基座主体相对的第一外侧面和第二外侧面之内；所述支撑部在所述基座主体接收到作用于所述引线框架主体上的外力时，从所述基座主体内部脱离而使所述基座主体上形成卡口，所述卡口包括分别自所述基座主体内部向所述第一外侧面和所述第二外侧面开口的第一卡口和第二卡口。
优选的，所述引线部的表面覆盖有反射层。
优选的，所述引线部与所述支撑部位于同一平面上。
优选的，所述引线部与所述支撑部的厚度相等。
优选的，所述引线部与所述支撑部分离设置，所述支撑部的一端为开放端。
优选的，所述开放端的端面设置有凸起；或，所述支撑部接近于所述开放端的表面设置为楔形。
为解决上述技术问题，本发明实施例还提供一种LED支架，包括上述的引线框架的引线部以及通过不饱和聚酯树脂成型于所述引线框架的支架成型区域上的基座主体，所述基座主体具有用于封装LED芯片的凹槽，所述基座主体上具有分别自所述基座主体内部向所述基座主体相对的第一外侧面和第二外侧面开口的卡口，所述卡口包括第一卡口和第二卡口，所述卡口由所述支架成型区域内自引线框架主体延伸出的支撑部、在所述基座主体接收到作用于所述引线框架主体上的外力时，从所述基座主体内部脱离后形成。
优选的，所述不饱和聚酯树脂中添加有填料和/或氧化钛，所述填料包括玻璃纤维和二氧化硅。
优选的，在所述不饱和聚酯树脂中添加有所述填料和所述氧化钛时，所述不饱和聚酯树脂中还添加有预设添加剂；所述不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和预设添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%。
为解决上述技术问题，本发明实施例还提供一种LED发光器件，包括：上述的LED支架和封装于所述LED支架的基座主体内的至少一颗LED芯片。
为解决上述技术问题，本发明实施例还提供一种发光装置，包括：上述的发光器件，所述发光装置为照明装置、光信号指示装置、补光装置或背光装置。
为解决上述技术问题，本发明实施例还提供一种LED发光器件制作方法，该LED发光器件制作方法包括：
制备引线框架；所制备的引线框架具有至少一个镂空状的支架成型区域，所述支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，所述支撑部包括相对设置的第一支撑部和第二支撑部；
通过不饱和聚酯树脂在所述支架成型区域内成型基座主体；所述基座主体具有用于封装LED芯片的凹槽，所述支撑部分别嵌入所成型的所述基座主体相对的第一外侧面和第二外侧面之内；
对经过LED芯片封装后的所述基座主体，施加作用于所述引线框架主体上的力，使所述支撑部从所述经过LED芯片封装后的所述基座主体内部脱离，并在脱离后的所述基座主体上形成卡口，所述卡口包括分别自所述基座主体内部向所述基座主体的所述第一外侧面和所述第二外侧面上开口的第一卡口和第二卡口。
优选的，在通过不饱和聚酯树脂在所述支架成型区域内成型基座主体之后，还包括：
将所述引线部从所述引线框架主体上进行分离。
优选的，在将所述引线部从所述引线框架主体上进行分离之后，还包括：
将所述引线部上沿所述基座主体的第三外侧面的垂直方向上向外突出的部分，弯折至贴附于所述基座主体的表面。
优选的，所述引线部与所述卡口均位于同一平面上。
优选的，所述引线部的厚度与所述卡口的宽度相等。
优选的，所述通过不饱和聚酯树脂在所述支架成型区域内成型基座主体包括：
通过添加有填料和/或氧化钛的不饱和聚酯树脂在所述支架成型区域内成型基座主体，所述填料包括玻璃纤维和二氧化硅。
优选的，在通过添加有填料和/或氧化钛的不饱和聚酯树脂在所述支架成型区域内成型基座主体时，所述不饱和聚酯树脂中还添加有预设添加剂；
所述不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和预设添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%。
 
 有益效果
根据本发明实施例提供的发光器件及其制作方法、引线框架、支架、发光装置，该引线框架包括至少一个镂空状的支架成型区域，支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，支撑部包括相对设置的第一支撑部和第二支撑部，支架成型区域用于通过不饱和聚酯树脂于上成型基座主体，支撑部分别用于嵌入所成型的基座主体相对的第一外侧面和第二外侧面之内；支撑部在基座主体接收到作用于引线框架主体上的力时，从基座主体内部脱离而使基座主体上形成卡口，卡口包括分别自基座主体内部向第一外侧面和第二外侧面开口的第一卡口和第二卡口。本发明实施例的引线框架上的支撑部分别伸入在LED支架两个相对的侧面开口的卡口中，来对LED支架的六个自由度进行固定，对LED支架进行固定时的稳定性高，可以有效避免LED支架在生产加工作业中从引线框架上脱落，提高了LED支架的良品率。
进一步的，本发明实施例中的LED发光器件的下料是通过在垂直于引线框架的方向上施力，而使LED发光器件在竖直方向上下料，从而可以同时对引线框架上的多个LED发光器件进行同步下料作业，提升了LED发光器件的生产效率，可以有效降低生产成本。
 附图说明
图1为本发明实施例一提供的LED支架的成型示意图；
图2为本发明实施例一提供的引线框架的结构示意图；
图 3为本发明实施例一提供的LED支架的侧面示意图；
图 4为本发明实施例一提供的支撑部的结构示意图；
图 5为本发明实施例一提供的LED发光器件的结构示意图；
图 6为本发明实施例二提供的LED发光器件制作方法的流程图；
图 7a为本发明实施例二提供的对引线部进行冲切分离前的示意图；
图 7b为本发明实施例二提供的对引线部进行冲切分离后的示意图；
图8a为本发明实施例二提供的引线部自基座主体侧面向外垂直突出的示意图；
图8b为本发明实施例二提供的引线部弯折贴附于基座主体表面的示意图；
图9a为本发明实施例二提供的LED发光器件被固定在支撑部上的示意图；
图9b为本发明实施例二提供的LED发光器件受力移除时的示意图。
 
 本发明的实施方式
为了使本发明实施例的目的、技术方案及优点更加清楚明白，下面通过具体实施方式结合附图对本发明实施例作进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明实施例，并不用于限定本发明实施例。
实施例一：
针对于现有技术中，通过将引线框架的支撑部从LED发光器件在相对的两个侧面开口的卡口中脱离来进行LED发光器件的下料，所导致的下料过程中LED发光器件容易因受力而损坏的问题，本发明实施例提供了一种引线框架10，具体请参见图1，该引线框架10包括至少一个镂空状的支架成型区域11，支架成型区域11内具有自引线框架10主体延伸出的支撑部12和引线部13，支撑部12包括相对设置的第一支撑部和第二支撑部，支架成型区域11用于通过不饱和聚酯树脂于上成型基座主体20，支撑部12分别用于嵌入所成型的基座主体20相对的第一外侧面21和第二外侧面22之内；支撑部12在基座主体20接收到作用于引线框架10主体上的外力时，从基座主体20内部脱离而使基座主体20上形成卡口23，卡口23包括分别自基座主体20内部向第一外侧面21和第二外侧面22开口的第一卡口和第二卡口。
在本实施例中，请参见图2，引线框架10可以采用对平板状的导电基板进行冲压加工或蚀刻加工而形成，从而在引线框架10上形成至少一个镂空状的支架成型区域11，从而引线框架10上在对镂空区域的材料进行去除后所剩余的部分形成有引线部13和支撑部12，并且支撑部12和引线部13自引线框架10本体向镂空区域延伸，本实施例中的支撑部12和引线部13分别自引线框架10本体向镂空区域延伸；而在另一些实施例中，支撑部和引线部还可以作为一个整体自引线框架本体向镂空区域延伸，也即引线部通过支撑部连接于引线框架本体之上。其中引线部13上具有用于载置LED芯片的固晶区，用于对后期安装于上的LED芯片进行导通，而支撑部12则用于在引线框架10上进行LED支架成型和LED发光器件的封装时，形成于LED产品内部而对LED产品进行支撑。本实施例中的支撑部12相对设置，应当说明的是，第一支撑部和第二支撑部可以是单体支撑部，也可以分别是由多个单体支撑部所组合而成的整体。
应当理解的是，本实施例中的引线框架可以为各种导电材质的基板构成，例如可以为各种金属或金属合金基板，包括但不限于铜基板、铝基板、铁基板、银基板，当然也可以为包含导电材料的混合材料基板，例如导电橡胶等，本实施例中优选的采用铜合金来制成引线框架，可以保证良好的导电性和散热性。另外，本实施例中的引线框架可以为薄板状，从而易于后期弯曲加工，能够使其易于成型为规定的形状。并且，引线框架不仅限于单层结构，在一些实施例中还可以是由多层导电材料所组成的复合层结构。
另外，在本实施例中，为了提高对LED芯片所发出的光的反射率，还可以对引线部表面进行反射层的涂覆，这里的反射层可以为银、铝、铜、金等，反射层的涂覆方式优选的可以采用电镀，应当说明的是，这里的反射层涂覆处理可以是在进行LED支架成型之前对引线框架整体进行处理，也可以是在完成LED支架成型之后，仅在用于载置LED芯片的固晶区所处的引线部进行反射层涂覆处理。为了进一步提高引线部表面的反射率，优选的可以使引线部形成平滑表面。
应当说明的是，请再次参见图2，作为一种优选的实现方式，本实施例中的引线部13自引线框架10本体向镂空区域延伸而形成于支撑部12之间的空间内，且引线部13的正极引线部与负极引线部之间断开而形成绝缘隔离区，而相对设置的支撑部12均具有一开放端，并且其开放端与引线部13分离设置，这里的开放端是指所在一端不与其它部件形成连接。当然，在另一些实施例中，支撑部也可以不设置开放端，也即支撑部自引线框架本体延伸出来后一直延伸至引线部而与引线部相连，在这种情况下则在实际生产中需要保证最终引线部会与支撑部分离。
优选的，本实施例中的引线部13与支撑部12位于同一平面上，并且，进一步的，引线部13与支撑部12的厚度相等，从而使得实际生产中的工艺更易于实现，并能提高工艺的可控性。
为了保证本实施例中的支撑部在进行LED发光器件下料时可以从LED发光器件中脱离出来，LED支架上的基座主体上成型有对应于支撑部的卡口，单个卡口仅在基座主体的一个侧面上开口，以供支撑部从卡口内部退出。请再次参阅图1以及图3，本实施例中的LED支架包括上述引线框架10的引线部13以及通过不饱和聚酯树脂成型于上述引线框架10的支架成型区域11上的基座主体20，基座主体20具有用于封装LED芯片的凹槽，基座主体20上具有分别自基座主体20内部向基座主体20相对的第一外侧面21和第二外侧面22上开口的卡口23，卡口23包括第一卡口和第二卡口，卡口23由支架成型区域11内自引线框架10主体延伸出的支撑部12、在基座主体20接收到作用于引线框架10主体上的外力时，从基座主体20内部脱离后形成。
在本实施例中，该LED支架由引线框架夹持在模具中在引线框架的支架成型区域上注塑成型，成型后的LED支架的基座主体上形成有作为LED芯片的封装区域的凹槽，其中引线框架的引线部至少部分露出于凹槽的底面，从而作为LED芯片的载置区域。在实际应用中，LED芯片可以载置在正极引线部上，然后将LED芯片通过金属线与正极引线部电连接，然后再将LED芯片通过金属线与负极引线部连接，当然，在实际应用中，若将LED芯片倒装，则可无需前述连接LED芯片与引线部的金属线。凹槽向基座主体的顶部开口，从而可以从开口处对凹槽内部进行密封材料的封装。
具体的，请再次参阅图3，在基座主体20中形成有向侧面开口的卡口23，单个卡口23仅在一个侧面上进行开口，例如两个卡口23的分别在第一外侧面21和第二外侧面22上进行开口，当支撑部位于卡口中时，在支撑部不发生形变时，基座主体的前、后、左、右、上、下六个自由度均可被支撑部固定，稳定性高。
基于本实施例中的基座主体上的相对的两个卡口均仅在单个侧面上进行开口，而若支撑部要分别从开口处退出而从卡口中脱离，则需要使支撑部发生形变而脱离，为了使得支撑部在受力发生形变后在开口处的退出更为顺利，如图4所示，本实施例中在支撑部12的开放端的端面设置有凸起123，当支撑部12的开放端接近开口处时，开放端通过凸起123而与开口处为点接触，相对于常规的开放端与开口处的线接触，受力时更容易脱离接触。当然，在另一些实施例中，还可以将支撑部接近于开放端的表面设置为楔形，同样可以更为轻松的脱离与开口处的接触。
本实施例中采用不饱和聚酯树脂在支架成型区域进行基座主体的成型，不饱和聚酯树脂作为热固化树脂具有优良的反射率和对紫外线等的劣化耐性，从而在LED发光器件长时间发光的情况下，可有效抑制反射板或树脂的劣化，并维持高反射率和光效率；另外，不饱和聚酯树脂不具有羟基 (-OH基团) 等反应性官能团，与金属不形成化学键，所以在成型过程中较难产生树脂毛刺，即使产生了树脂毛刺也容易将其剥离；再者，不饱和聚酯树脂的熔点为50℃-90℃左右，从而对不饱和聚酯进行注塑成型时能够抑制树脂中所添加的有机物被碳化，可有效抑制成型缺陷；还有，不饱和聚酯树脂相对于热塑性树脂的流动性要高，从而在进行树脂注入时，能够以较低的注入压力来将树脂注入，这样引线框架变形的可能性被降低，在注塑成型过程中，则不需要对引线框架进行保持，能够将模具简单化。
在实际应用中，不饱和聚酯树脂中可以进一步添加由纤维较长的玻璃纤维和球状的二氧化硅构成的填料以提高树脂的强度。当然，还可以在不饱和聚酯中添加氧化钛，以提高树脂对光的反射率。
在填料或者氧化钛或者该两者中，还可适当组合添加以下物质：马来酸酐、富马酸、苯乙烯、填充材料、增强剂、固化剂、脱模剂、颜料等其他的添加剂。
在一种优选的实施方式中，在不饱和聚酯树脂中添加有填料、氧化钛和添加剂时，不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%，采用本实施例中的材料配比，可以有效抑制不饱和聚酯树脂开裂、变色等情况。
如图5所示，本实施例还提供了一种利用上述LED支架制成的LED发光器件100，其包括上述的LED支架和封装于LED支架的基座主体20内的至少一颗LED芯片30。
本实施例提供的LED发光器件的光照射出来、呈现给用户的颜色，可以根据实际需求和应用场景进行灵活设置。LED发光器件的光照射出来、呈现出的是何种颜色，可以通过但不限于以下因素灵活控制：LED芯片自身发出的光的颜色、LED发光器件是否设置发光转换层、当LED发光器件设置发光转换层时所设置的发光转换层的类型。
在本实施例的一种示例中，LED发光器件还可包括设置于LED芯片（在LED芯片之上设置有发光转换胶层时，则设置于发光转换胶层之上）之上的透镜胶层或扩散胶层；当然，在一些示例中，LED芯片之上也可设置透明胶层。
应当理解的是， 在一种示例中，发光转换胶层可以是包含荧光粉的荧光胶层，也可以是包含量子点光致材料的胶体，或者其他可实现发光转换的发光转换胶或膜，且根据需要也可以包括扩散粉或硅粉等；本实施例中在LED芯片上形成发光转换胶层、透镜胶层或扩散胶层的方式包括但不限于点胶、模压、喷涂、粘贴等。
例如，发光转换胶层可包括荧光粉胶层、荧光膜、或量子点QD膜；荧光粉胶层、荧光膜可采用无机荧光粉制作的，可以是掺杂了稀土元素的无机荧光粉，其中，无机荧光粉包括但不限于硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。
又例如，量子点QD膜可采用量子点荧光粉制作；量子点荧光粉包括但不限于BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x) 、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。
在本实施例中，LED芯片自身发出的光的类型可以是肉眼可见的可见光，也可以是肉眼不可见的紫外光、红外光；当LED芯片自身发出的光的类型是肉眼不可见的紫外光、红外光时，可在LED芯片之上设置发光转换层，以将肉眼不可见光转换成肉眼可见光，使得LED发光器件照射出来的光是用户可见的光。例如，当LED芯片自身发出的光是紫外光时，若想LED发光器件呈现用户可见的白光，则发光转换层可以是将红、绿、蓝荧光粉进行混合后制作成的。
本发明实施例提供的引线框架上相对设置的两个支撑部分别伸入各自在LED支架相对设置的两个侧面开口的卡口中，来对LED支架的六个自由度进行固定，对LED支架进行固定时的稳定性高，可以有效避免LED支架在生产加工作业中从引线框架上脱落，提高了LED支架的良品率。进一步的，本发明实施例中的LED发光器件的下料是通过在垂直于引线框架的方向上施力，而使LED发光器件在竖直方向上下料，从而可以同时对引线框架上的多个LED发光器件进行同步下料作业，提升了LED发光器件的生产效率，可以有效降低生产成本。
 
实施例二：
为了便于全方位理解本发明实施例，本实施例对本发明实施例提供的LED发光器件的制作过程进行示例说明。
请参见图6，图6为本实施例提供的LED发光器件制作方法的流程图，在制作LED发光器件时，其具体实现步骤包括：
S601，制备引线框架；所制备的引线框架具有至少一个镂空状的支架成型区域，支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，支撑部包括相对设置的第一支撑部和第二支撑部。
在本实施例中，引线框架通过对导电基板进行冲压或蚀刻加工而选择性的去除预设区域的材料后形成，所形成的引线框架上形成有支架成型区域，用于在模具中进行注塑成型形成LED支架的基座主体的区域。引线框架上的支撑部相对设置，从而可以对成型于上的LED支架进行稳定支撑。应当说明的是，在优选的实施方式中，支撑部和引线部分别自引线框架本体向镂空区域延伸，引线部和支撑部自引线框架本体延伸出来后，引线部和支撑部远离引线框架本体的一端均为开放端，而不与其它部件形成连接。当然，在另一些实施方式中，支撑部和引线部还可以作为一个整体自引线框架本体向镂空区域延伸，也即引线部通过支撑部连接于引线框架本体之上。
S602，通过不饱和聚酯树脂在支架成型区域内成型基座主体；基座主体具有用于封装LED芯片的凹槽，支撑部分别嵌入所成型的基座主体相对的第一外侧面和第二外侧面之内。
在该步骤中，采用不饱和聚酯树脂在支架成型区域内进行基座主体的注塑成型。在实际应用中，进一步的可以在不饱和聚酯中添加填料和/或氧化钛，填料包括玻璃纤维和二氧化硅，其中添加填料可以提高树脂的强度，而添加氧化钛则可以提高树脂对光的反射率。并且，在填料或者氧化钛或者该两者中，还可适当组合添加以下物质：马来酸酐、富马酸、苯乙烯、填充材料、增强剂、固化剂、脱模剂、颜料等其他的添加剂。
在一种优选的实施方式中，在不饱和聚酯树脂中添加有填料、氧化钛和添加剂时，不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%，采用本实施例中的材料配比，可以有效抑制不饱和聚酯树脂开裂、变色等情况。
当注塑完成后，对模具加热规定时间来使树脂硬化，此时引线框架上的支撑部和引线部均嵌入至基座主体内，其中支撑部分别从基座主体相对的两个侧面嵌入至基座主体内。
在本实施例中，在通过不饱和聚酯树脂在支架成型区域内成型基座主体之后，还包括：将引线部从引线框架主体上进行分离。
具体的，在引线部13与支撑部12均分别自引线框架10本体向支架成型区域11的镂空区域延伸的实施方式中，引线部13成型于基座主体20之后，则需要将引线部13与引线框架10本体进行分离，从而保证在后期LED产品能够从引线框架10上分离，并且在分离后引线部13能够被保持在LED产品内。如图7a所示为对引线部进行冲切分离前的示意图，如图7b所示为对引线部进行冲切分离后的示意图。
进一步的，本实施例中，在将引线部从引线框架主体上进行分离之后，还包括：将引线部上沿第三外侧面的垂直方向上向外突出的部分，弯折至贴附于基座主体的表面。
具体的，在一些实施方式中，如图8a所示，当引线框架上注塑完成基座主体20后，引线部13其中一部分成型于基座主体20内部作为LED芯片的功能区的内部引线部13（图8a中未示出），还有一部分则是自基座主体20侧面垂直向外突出的外部引线部131， 外部引线部131用于与外部进行电连接，例如将其焊接在PCB板上，因此，为了使其易于与外部进行电连接，如图8中b所示，本实施例中将与引线框架10本体分离的外部引线部131施加力而使之贴附在基座主体20的表面。
S603，对经过LED芯片封装后的基座主体，施加作用于引线框架主体上的力，使支撑部从经过LED芯片封装后的基座主体内部脱离，并在脱离后的基座主体上形成卡口，卡口包括分别自基座主体内部向基座主体的第一外侧面和第二外侧面开口的第一卡口和第二卡口。
优选的，本实施例中的引线部与卡口均位于同一平面上，并且，进一步的，引线部的厚度与卡口的宽度相等，从而使得实际生产中的工艺更易于实现，并能提高工艺的可控性。
如图9 a所示，为LED发光器件被固定在支撑部上的示意图，如图9b所示则为LED发光器件受力移除时的示意图，本实施例在对LED发光器件的移除步骤中，由于每个卡口仅向基座主体20的一个侧面上进行开口，从而基座主体20若要脱离支撑部12的支撑，仅有使得支撑部12从该侧面开口退出，并且仅有通过使支撑部12受到垂直于引线框架主体所在平面的力而使支撑部12发生弯曲形变，从而支撑部12从其在卡口23中的初始位置逐渐向外退出。如图9a中所示，第一支撑部121和第二支撑部122分别卡入在第一外侧面21和第二外侧面22分别开口的第一卡口231和第二卡口232，如图9b中所示，可以在基座主体20的底面上施加朝向顶面的方向的力，也即施加纵向的力，使得支撑部12向上弯曲而从开口处退出，当然，本实施例中可选的还可以在基座主体的顶面上施加朝向底面的力来使支撑部受力弯曲。
应当说明的是，本实施例中卡口在基座主体上的设置位置可以根据实际应用场景进行灵活选择，仅需保证每个卡口仅在一个侧面上进行开口即可。
本发明实施例提供的LED发光器件制作方法，通过树脂在引线框架的支架成型区域进行基座主体的成型，并由引线框架上相对设置的两个支撑部分别伸入各自在LED发光器件的相对设置的两个侧面开口的卡口中，在下料工序中对LED发光器件施加垂直于引线框架所在平面的方向上的力来使支撑部发生弯曲形变而将支撑部从LED发光器件中脱离出来，并在LED发光器件的相应位置形成卡口；本发明实施例可对LED产品的六个自由度进行固定，对LED产品进行固定时的稳定性高，可以有效避免LED产品在生产加工作业中从引线框架上脱落，提高了LED发光器件的良品率。进一步的，本发明实施例中的LED发光器件的下料是通过在垂直于引线框架的方向上施力，而使LED发光器件在竖直方向上下料，从而可以同时对引线框架上的多个LED发光器件进行同步下料作业，提升了LED发光器件的生产效率，可以有效降低生产成本。
 
实施例三：
本实施例提供了一种发光装置，该发光装置包括上述实施例一或实施例二所示例的LED发光器件。本实施例中的发光装置可为照明装置、光信号指示装置、补光装置或背光装置等。为照明装置时，具体可以为应用于各种领域的照明装置，例如日常生活中的台灯、日光灯、吸顶灯、筒灯、路灯、投射灯等等，又例如汽车中的远光灯、近光灯、氛围灯等，又例如医用中的手术灯、低电磁照明灯、各种医用仪器的照明灯，又例如应装饰领域照明中的各种彩灯、景观照明灯、广告灯等等；为光信号指示装置时，具体可以为应用于各种领域的光信号指示装置，例如交通领域的信号指示灯，通信领域中通信设备上的各种信号状态指示灯；为补光装置时，可以为摄影领域的补光灯，例如闪光灯、补光灯，也可以为农业领域为植物补光的植物补光灯等；为背光装置时，可以为应用于各种背光领域的背光模组，例如可应用于显示器、电视机、手机等移动终端、广告机等设备上。
应当理解的是，上述应用仅仅是本实施例所示例的几种应用，应当理解的是LED发光器件的应用并不限于上述示例的几种领域。
 
以上内容是结合具体的实施方式对本发明实施例所作的进一步详细说明，不能认定本发明实施例的具体实施只局限于这些说明。对于本发明实施例所属技术领域的普通技术人员来说，在不脱离本发明实施例构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明实施例的保护范围。
 

Claims (18)

  1. 一种引线框架，其特征在于，包括至少一个镂空状的支架成型区域，所述支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，所述支撑部包括相对设置的第一支撑部和第二支撑部，所述支架成型区域用于通过不饱和聚酯树脂于上成型基座主体，所述支撑部分别用于嵌入所成型的所述基座主体相对的第一外侧面和第二外侧面之内；所述支撑部在所述基座主体接收到作用于所述引线框架主体上的外力时，从所述基座主体内部脱离而使所述基座主体上形成卡口，所述卡口包括分别自所述基座主体内部向所述第一外侧面和所述第二外侧面开口的第一卡口和第二卡口。
     
  2. 如权利要求1所述的引线框架，其特征在于，所述引线部的表面覆盖有反射层。
     
  3. 如权利要求1所述的引线框架，其特征在于，所述引线部与所述支撑部位于同一平面上。
  4. 如权利要求1所述的引线框架，其特征在于，所述引线部与所述支撑部的厚度相等。
  5. 如权利要求1至4中任一项所述的引线框架，其特征在于，所述引线部与所述支撑部分离设置，所述支撑部的一端为开放端。
     
  6. 如权利要求5所述的引线框架，其特征在于，所述开放端的端面设置有凸起；或，所述支撑部接近于所述开放端的表面设置为楔形。
     
  7. 一种LED支架，其特征在于，包括如权利要求1至6中任一项所述的引线框架的引线部以及通过不饱和聚酯树脂成型于所述引线框架的支架成型区域上的基座主体，所述基座主体具有用于封装LED芯片的凹槽，所述基座主体上具有分别自所述基座主体内部向所述基座主体相对的第一外侧面和第二外侧面开口的卡口，所述卡口包括第一卡口和第二卡口，所述卡口由所述支架成型区域内自引线框架主体延伸出的支撑部、在所述基座主体接收到作用于所述引线框架主体上的外力时，从所述基座主体内部脱离后形成。
     
  8. 如权利要求7所述的LED支架，其特征在于，所述不饱和聚酯树脂中添加有填料和/或氧化钛，所述填料包括玻璃纤维和二氧化硅。
     
  9. 如权利要求8所述的LED支架，其特征在于，在所述不饱和聚酯树脂中添加有所述填料和所述氧化钛时，所述不饱和聚酯树脂中还添加有预设添加剂；所述不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和预设添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%。
  10. 一种LED发光器件，其特征在于，包括如权利要求7至9中任一项所述的LED支架和封装于所述LED支架的基座主体内的至少一颗LED芯片。
     
  11. 一种发光装置，其特征在于，包括如权利要求10所述的LED发光器件，所述发光装置为照明装置、光信号指示装置、补光装置或背光装置。
  12. 一种LED发光器件制作方法，其特征在于，包括以下步骤：
    制备引线框架；所制备的引线框架具有至少一个镂空状的支架成型区域，所述支架成型区域内具有自引线框架主体延伸出的支撑部和引线部，所述支撑部包括相对设置的第一支撑部和第二支撑部；
    通过不饱和聚酯树脂在所述支架成型区域内成型基座主体；所述基座主体具有用于封装LED芯片的凹槽，所述支撑部分别嵌入所成型的所述基座主体相对的第一外侧面和第二外侧面之内；
    对经过LED芯片封装后的所述基座主体，施加作用于所述引线框架主体上的力，使所述支撑部从所述经过LED芯片封装后的所述基座主体内部脱离，并在脱离后的所述基座主体上形成卡口，所述卡口包括分别自所述基座主体内部向所述基座主体的所述第一外侧面和所述第二外侧面开口的第一卡口和第二卡口。
     
  13. 如权利要求12所述的LED发光器件制作方法，其特征在于，在通过不饱和聚酯树脂在所述支架成型区域内成型基座主体之后，还包括：
    将所述引线部从所述引线框架主体上进行分离。
     
  14. 如权利要求13所述的LED发光器件制作方法，其特征在于，在将所述引线部从所述引线框架主体上进行分离之后，还包括：
    将所述引线部上沿所述基座主体的第三外侧面的垂直方向上向外突出的部分，弯折至贴附于所述基座主体的表面。
     
  15. 如权利要求12所述的LED发光器件制作方法，其特征在于，所述引线部与所述卡口均位于同一平面上。
     
  16. 如权利要求12所述的LED发光器件制作方法，其特征在于，所述引线部的厚度与所述卡口的宽度相等。
     
  17. 如权利要求12至16中任一项所述的LED发光器件制作方法，其特征在于，所述通过不饱和聚酯树脂在所述支架成型区域内成型基座主体包括：
    通过添加有填料和/或氧化钛的不饱和聚酯树脂在所述支架成型区域内成型基座主体，所述填料包括玻璃纤维和二氧化硅。
  18. 如权利要求17所述的LED发光器件制作方法，其特征在于，在通过添加有填料和/或氧化钛的不饱和聚酯树脂在所述支架成型区域内成型基座主体时，所述不饱和聚酯树脂中还添加有预设添加剂；
    所述不饱和聚酯树脂、玻璃纤维、二氧化硅、氧化钛和预设添加剂的成分比分别为A、B、C、D和E，其中，15%＜A＜25%，5%＜B＜20%，20%＜C＜30%，30%＜D＜40%，1%＜E＜3%，A+B+C+D+E=100%。
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