WO2020042631A1 - 高强度 led 支架、 led 及发光装置 - Google Patents

高强度 led 支架、 led 及发光装置 Download PDF

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Publication number
WO2020042631A1
WO2020042631A1 PCT/CN2019/083112 CN2019083112W WO2020042631A1 WO 2020042631 A1 WO2020042631 A1 WO 2020042631A1 CN 2019083112 W CN2019083112 W CN 2019083112W WO 2020042631 A1 WO2020042631 A1 WO 2020042631A1
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WO
WIPO (PCT)
Prior art keywords
substrate
insulating
area
led
led bracket
Prior art date
Application number
PCT/CN2019/083112
Other languages
English (en)
French (fr)
Inventor
姚亚澜
李壮志
刘沛
谭镇良
邢美正
Original Assignee
深圳市聚飞光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市聚飞光电股份有限公司 filed Critical 深圳市聚飞光电股份有限公司
Priority to US17/272,474 priority Critical patent/US20220013695A1/en
Publication of WO2020042631A1 publication Critical patent/WO2020042631A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the invention relates to LED (Light Emitting) Diode (Light Emitting Diode) field, in particular, relates to a high-intensity LED bracket, LED and light emitting device.
  • LED has the advantages of rich colors, small size, environmental protection, energy saving, long life, etc., it has been used and promoted in various fields, such as but not limited to daily lighting, outdoor lighting, lighting decoration, advertising signs, Automotive lighting or instructions, traffic directions, etc., due to the different external environments in which LEDs are used in different fields, greater requirements are placed on the reliability of LEDs, and the overall strength of LEDs is an important factor in LED reliability Metrics.
  • FIGS. 1-1 to 1-2 An existing LED bracket is shown in FIGS. 1-1 to 1-2. It includes a plastic enclosure wall 10 forming a reflection cavity, a positive substrate 11, a negative substrate 12 surrounded by the plastic enclosure 10, and a positive substrate 11 and a negative electrode.
  • Substrate 12 is an insulating and isolating separator 13, in which a part of the front surface of the positive substrate 11 and the negative substrate 12 is in direct contact with the plastic fence 10, which is called a fence contact area; the other area is located at the bottom of the reflection cavity as a functional area.
  • the area can be used to carry LED chips and other possible electronic devices, as well as wiring, die-bonding, and as a light reflection area.
  • the existing LED bracket has the following problems:
  • the contact areas and functional areas of the front wall of the positive substrate 11 and the negative substrate 12 are located on a flat surface, so when moisture spreads to the front of the substrate along the side of the substrate and the plastic enclosure 10, it is easy to pass through the front surface of the substrate.
  • the contact area enters the functional area, which causes a short circuit in the functional area, damage to the device and even directly causes a dead light; and the functional area of most substrates is plated with a metallic silver layer, which is also easily corroded by moisture, causing functions sexual defects. It can be seen that the existing LED brackets and LEDs made using the brackets have poor moisture-proof performance.
  • the high-intensity LED bracket, LED and light-emitting device provided by the present invention mainly solve the technical problem of how to improve the reliability of the LED bracket and the LED and the moisture-proof performance of the LED prepared by using the LED bracket.
  • the present invention provides an LED bracket, which includes a positive substrate, a negative substrate, and an insulating spacer.
  • the insulating spacer is located between the positive substrate and the negative substrate to insulate and isolate the two.
  • An insulating wall body enclosing the positive electrode substrate, the negative electrode substrate, and the insulating separator, and the front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and a wall contact area that is in contact with the wall body;
  • the functional area and the surrounding wall contact area of at least one of the positive substrate and the negative substrate are not on a plane.
  • the functional area and the wall contact area of the positive substrate are not on a plane, and the functional area and the wall contact area of the negative substrate are not on a plane.
  • the surrounding wall contact area is directly connected to the functional area.
  • connection transition region is further provided between the functional region and the wall contact region of at least one of the positive substrate and the negative substrate.
  • connection transition area is an inclined plane, an arc-shaped plane, or a combined plane
  • the combined plane is a combination including at least two of a plane, an inclined plane, and an arc-shaped plane.
  • the plane where the functional area is located is higher than the plane where the wall contact area is located.
  • the plane where the functional area is located is lower than the plane where the fence contact area is located.
  • a height difference between a plane where the functional area is located and a plane where the contact area of the surrounding wall is located is greater than 0 and less than or equal to a quarter of the depth of the reflection cavity formed by the surrounding wall body.
  • At least one end of the front surface of the insulating isolation belt is provided with an insulating protrusion.
  • insulating protrusions are provided on opposite ends of the insulating isolation tape.
  • the insulating protrusions straddle a front surface of the positive substrate and / or the negative substrate.
  • the functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of a reflection cavity formed by the surrounding wall body, the insulation protrusion is in direct contact with the inner side of the reflection cavity, and the insulation protrusion The height is smaller than the height of the inner side of the reflection cavity formed by the surrounding wall body.
  • the insulating protrusion is integrally formed with the insulating spacer, and / or the material of the insulating protrusion and the insulating spacer is the same.
  • the profile of the longitudinal section of the insulating protrusion in the height direction is an arc-shaped profile or a profile composed of an upper horizontal edge, a lower horizontal edge, and an arc between the upper horizontal edge and the lower horizontal edge.
  • the two long sides opposite to each other in the cross-sectional profile of the insulating spacer are arc-shaped sides, or curved sides having at least one bend, or fold line edges having at least one bend, or
  • the included angle between the short sides of the negative substrate is greater than or equal to 10 ° and less than 90 °.
  • two opposite long sides of the cross-sectional profile of the insulating spacer are parallel to each other.
  • the present invention further provides a high-intensity LED, which includes the high-intensity LED bracket and at least one LED chip as described above, the LED chip is disposed on the positive substrate and / or the negative substrate The positive and negative pins of the LED chip are electrically connected to the positive substrate and the negative substrate, respectively.
  • the present invention further provides a light emitting device including the LED as described above, and the light emitting device is a lighting device, a light signal indicating device, a supplemental light device, or a backlight device.
  • the high-strength LED bracket, LED and light-emitting device provided by the present invention include a positive substrate, a negative substrate, and an insulating spacer.
  • the insulating spacer is located between the positive substrate and the negative substrate to insulate and isolate the two.
  • the LED bracket further includes a positive substrate, The negative wall is enclosed by an insulating substrate and an insulating spacer.
  • the front surfaces of the positive and negative substrates have a functional area and a wall contact area that is in contact with the wall. The function of at least one of the positive and negative substrates is provided.
  • the area and the wall contact area are not on the same plane, so the path between the wall contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the LED bracket and using the LED bracket
  • the moisture-proof performance of LEDs improves the reliability and durability of LEDs, making LEDs more suitable for application scenarios in various environments, and more conducive to the promotion and use of LEDs.
  • the insulating spacer between the positive substrate and the negative substrate of the existing LED bracket is perpendicular to the long side of the bracket, it is arranged in parallel with the positive substrate and the negative substrate; and the insulating spacer is a relatively fragile insulating plastic material.
  • the width of the insulating isolation belt is narrow, which results in a small amount of plastic in the insulating isolation belt, and the insulating isolation belt is prone to break, which reduces the overall strength and reliability of the LED bracket and the LED manufactured by the bracket.
  • an insulating protrusion can be further provided on at least one end of the front surface of the insulating isolation tape, thereby increasing the material content of the insulating isolation tape, thereby increasing the overall component occupied by the insulating isolation tape in the bracket, and improving the overall strength of the insulating isolation tape. Improve the overall strength and reliability of the LED bracket with the insulating isolation tape and the LED made by the bracket.
  • Figure 1-1 is a top view of an LED bracket
  • Figure 1-2 is a sectional view of the LED bracket shown in Figure 1-1;
  • FIG. 2-1 is a top view I of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-2 is a top view 2 of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-3 is a top view III of an LED bracket provided in Embodiment 2 of the present invention.
  • FIGS. 2 to 4 are a top view 4 of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-5 is a top view V of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-6 is a top view VI of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-7 is a top view VII of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 2-8 is a top view eight of an LED bracket provided in Embodiment 2 of the present invention.
  • FIG. 3-1 is a first plan view of an LED bracket provided in Embodiment 3 of the present invention.
  • 3-2 is a top view 2 of an LED bracket provided in Embodiment 3 of the present invention.
  • 3-3 is a top view 3 of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 3-4 is a top view IV of an LED bracket provided in Embodiment 3 of the present invention.
  • 3-5 is a top view V of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 3-6 is a top view 6 of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 4-1 is a top view VII of an LED bracket provided in Embodiment 3 of the present invention.
  • 4-2 is a top view eight of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 4-3 is a top view IX of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 4-4 is a top view ten of an LED bracket provided in Embodiment 3 of the present invention.
  • FIG. 5-1 is a top view 1 of an LED bracket provided in Embodiment 4 of the present invention.
  • 5-2 is a top view 2 of an LED bracket provided in Embodiment 4 of the present invention.
  • 5-3 is a top view 3 of an LED bracket provided in Embodiment 4 of the present invention.
  • 5-4 is a fourth plan view of an LED bracket provided in a fourth embodiment of the present invention.
  • 6-1 is a top view 5 of an LED bracket provided in Embodiment 4 of the present invention.
  • 6-2 is a top view 6 of an LED bracket provided in Embodiment 4 of the present invention.
  • 6-3 is a top view VII of an LED bracket provided in Embodiment 4 of the present invention.
  • 6-4 is a top view eight of an LED bracket provided in Embodiment 4 of the present invention.
  • FIG. 7-1 is a first cross-sectional view of an LED bracket according to a fifth embodiment of the present invention.
  • FIG. 7-2 is a cross-sectional view 2 of an LED bracket provided in Embodiment 5 of the present invention.
  • FIG. 7-3 is a sectional view III of an LED bracket provided in Embodiment 5 of the present invention.
  • FIG. 8-1 is a first cross-sectional view of an LED bracket according to a sixth embodiment of the present invention.
  • FIG. 8-2 is a cross-sectional view 2 of an LED bracket provided in Embodiment 6 of the present invention.
  • 8-3 is a sectional view III of an LED bracket provided in Embodiment 6 of the present invention.
  • FIG. 8-4 is a sectional view IV of an LED bracket provided in Embodiment 6 of the present invention.
  • FIG. 8-5 is a sectional view 5 of an LED bracket provided in Embodiment 6 of the present invention.
  • FIG. 8-6 is a cross-sectional view of an LED bracket according to a sixth embodiment of the present invention.
  • FIG. 8-7 is a sectional view VII of an LED bracket provided in Embodiment 6 of the present invention.
  • 9-1 is a first cross-sectional view of an LED bracket according to a seventh embodiment of the present invention.
  • 9-2 is a cross-sectional view 2 of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-3 is a sectional view III of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-4 is a sectional view IV of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-5 is a cross-sectional view 5 of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-6 is a sectional view VI of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-7 is a cross-sectional view VII of an LED bracket provided in Embodiment 7 of the present invention.
  • 9-8 is a cross-sectional view VIII of an LED bracket provided in Embodiment 7 of the present invention.
  • reference numeral 10 in FIGS. 1-1 to 1-2 is a plastic fence, 11 is a positive substrate, 12 is a negative substrate, and 13 is a separator; in FIGS. 2-1 to 2-8, 20 is a fence. 21 is a positive substrate, 22 is a negative substrate, 23 is an insulating spacer, and 231 is an insulating protrusion; in FIGS. 3-1 to 3-6, 30 is a wall body, 31 is a positive substrate, and 32 is a negative substrate. 33 is an insulation isolation area; in FIGS. 4-1 to 4-4, 40 is a wall body, 41 is a substrate, 41 is a positive substrate, 42 is a negative substrate, and 43 is an insulation isolation area; FIGS.
  • FIGS. 6-1 to 6-4 50 is a fence body, 51 is a positive substrate, 52 is a negative substrate, 53 is an insulating spacer, and 531 is an insulating protrusion; in FIGS. 6-1 to 6-4, 60 is a fence body and 61 is a positive substrate. , 62 is a negative substrate, 63 is an insulating spacer, 631 is an insulating protrusion; in FIGS.
  • 70 is a wall body, 71 is a substrate, 711 is a functional area, and 712 is a wall contact area; 731
  • 80 is the wall body, 81 is the base plate, 811 is the functional area, 812 is the wall contact area, 813 is the connection transition area; 831 is the insulation protrusion;
  • Figure 9 -1 to Figure 9-8 90 is the wall body, 91 is Plates, functional area 911, the wall 912 of the contact zone, a transition zone 913 is connected; 931 is an insulating protrusion.
  • the LED bracket provided in this embodiment includes an insulating wall body surrounding a positive substrate, a negative substrate, and an insulating spacer.
  • the function area and the wall contact area that are in contact with the wall body, and the function area and the wall contact area where at least one of the positive substrate and the negative substrate is disposed are not on a plane, so the distance between the wall contact area and the function area of the substrate can be extended.
  • the path that is, the path for moisture to extend into the functional area, thereby improving the moisture-proof performance of the LED bracket and the LED made using the LED bracket, and improving the reliability and durability of the LED, making the LED better applicable to various This kind of environmental application scenario is more conducive to the promotion and use of LED.
  • the high-strength LED bracket in this embodiment includes a positive substrate, a negative substrate, and an insulating spacer.
  • the positive substrate and the negative substrate are provided with functional areas on the front side, and the insulating spacer is located on the positive electrode.
  • the substrate and the negative substrate are insulated and isolated from each other, and an insulation protrusion is provided on at least one end of the front surface of the insulation isolation tape, thereby increasing the material content of the insulation isolation tape, thereby increasing the overall component occupied by the insulation isolation tape in the bracket.
  • the functional areas on the front of the positive substrate and the negative substrate are located at the bottom of the reflection cavity formed by the enclosure.
  • the positive substrate and the negative substrate in this embodiment are both conductive substrates.
  • the conductive substrates can be substrates made of various conductive materials.
  • they can be various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, Silver substrate; the conductive substrate may also be a mixed material conductive substrate containing a conductive material, such as conductive rubber.
  • At least one of the positive electrode substrate and the negative electrode substrate may further be provided with a reflective layer in the functional area to improve the light emitting efficiency of the bracket.
  • the reflective layer may be various light reflecting layers capable of improving the light emitting efficiency, for example, Including but not limited to silver plating.
  • the back surface of at least one of the positive electrode substrate and the negative electrode substrate is exposed at the bottom of the wall body as an electrode welding area.
  • the back surface of at least one of the positive electrode substrate and the negative electrode substrate may not be used as a welding area, but the side surface may be used as a welding area, and the specific settings may be flexibly determined according to specific application requirements.
  • the surrounding wall body may be a surrounding wall body of various insulation materials, for example, including but not limited to various plastics, insulating ceramics, and the like.
  • materials that can be used for the enclosure include, but are not limited to, epoxy (EP) resin, high temperature resistant nylon (PPA plastic), polyphthalamide (PPA, polyphthalamide), and polyterephthalate.
  • PCT Poly 1,4-cyclohexylene dimethylene terephthalate
  • liquid crystal polymer LCP, Liquid Crystal Polymer
  • SMC sheet molding compound
  • EMC epoxy molding compound
  • UP unsaturated polyester
  • PET Polyethylene terephthalate
  • PC Polycarbonate
  • Nylon 66 polyhexamethylene adipamide
  • the material of the insulating spacer in this embodiment may be the same as or different from the surrounding wall, and may be formed together with the surrounding wall or separately.
  • a manner of forming the surrounding wall body may also be flexibly selected, for example, it may be formed by, but not limited to, injection molding.
  • both ends of the front surface of the insulation isolation tape may be provided with insulation protrusions to further enhance the strength of the insulation isolation tape.
  • insulation protrusions when insulating protrusions are provided at both ends of the insulating isolation belt, the shapes, sizes, and materials of the insulating protrusions at both ends may be the same, or may be set differently according to requirements.
  • the insulating protrusions may span the front surface of the positive substrate and / or the negative substrate to improve the contact area between the insulating separator and the positive substrate and / or the negative substrate, and the insulating separator and the The contact area of the inner wall of the enclosing wall allows the mechanical force received by the insulating spacer to be transmitted to the positive substrate and / or the negative substrate and the enclosing wall, thereby further improving the strength of the insulating spacer, and thereby improving the overall strength and reliability of the LED bracket as a whole. .
  • the air-tightness of the LED bracket can be improved, thereby improving the moisture-proof performance of the LED bracket.
  • the functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the surrounding wall body.
  • the insulation protrusion provided on the insulation spacer is in direct contact with the inner side of the reflection cavity, and The height of the insulating protrusion is smaller than the height of the inner side of the reflective cavity; the mechanical force received by the insulating isolation belt is transmitted to the surrounding wall body, thereby further improving the strength of the insulating isolation belt, and thereby improving the overall strength and reliability of the LED bracket as a whole. Sex.
  • the air-tightness of the LED bracket can be improved, thereby improving the moisture-proof performance of the LED bracket.
  • an insulating protrusion provided on the insulating spacer to be in contact with at least one substrate and the surrounding wall at the same time, so that the mechanical force received by the insulating spacer is transmitted to the surrounding wall and at least one substrate.
  • the front of the insulating separator may be set higher than the front of the positive substrate and the negative substrate, and the specific height may be flexibly set according to requirements.
  • the insulating protrusions provided on the insulating isolation tape and the insulating isolation tape may be integrally formed or separately formed, and may be flexibly set according to specific processes and requirements.
  • the materials of the insulating protrusions provided on the insulating isolation tape and the insulating isolation tape may be the same, but of course, they may be set to be different in some examples.
  • the specific shape and structure of the insulating protrusions in this embodiment can be flexibly set.
  • the shape and structure of the insulating protrusions can be set to be semi-spherical or semi-circular pie, etc., of course, it can also be less than half or larger than half-spherical or pie-shaped;
  • the profile of the longitudinal section of the protrusion along the height direction may be an arc-shaped profile, or the profile of the longitudinal section of the insulation protrusion along the height direction may be an upper transverse edge, a lower transverse edge, and between the upper transverse edge and the lower transverse edge. Curved composition of contours.
  • the insulating protrusions in this embodiment may also be set to a square shape or other regular shapes, and of course, they may also be set to irregular shapes, and they may be flexibly set according to specific application scenarios.
  • an insulating protrusion is provided on at least one end of the front surface of the insulating isolation tape, and the insulating protrusion can be in contact with at least one substrate or a wall at the same time.
  • the overall component occupied in the bracket improves the overall strength of the insulation spacer, and at the same time, the mechanical force received by the insulation spacer can be transmitted to the surrounding wall and at least one substrate, thereby maximizing the overall strength and reliability of the LED bracket.
  • moisture-proof performance at the same time, the contact area between the insulating spacer and the substrate and the surrounding wall is improved, and the airtightness of the bracket is improved.
  • the functional area and the wall contact area of at least one of the positive substrate and the negative substrate of the LED bracket are not on a plane, for example, the functional area and the wall contact area of the front surface of the positive substrate are not on a plane, and / or, The functional area on the front side of the negative substrate and the contact area of the wall are not on the same plane; specifically, if one or two of the positive substrate and the negative substrate are set on the same surface, the functional area and the wall contact area are not on the same plane, and can be flexibly set according to specific requirements.
  • the functional area of the positive substrate and the negative substrate and the contact area of the enclosure wall may not be on the same plane.
  • This arrangement can extend the path between the functional areas of the wall's contact area of the substrate, that is, extend the path of moisture into the functional area, thereby improving the sealing performance of the LED bracket and LEDs made using the LED bracket. Promote the reliability and durability of LED, so that LED can better meet the requirements of various environmental uses, and more conducive to the promotion and use of LED.
  • the wall contact area on the front surface of the substrate may be directly connected to the functional area, and the wall contact area may be an inclined surface, an arc surface, or another type of surface.
  • connection transition area may also be provided between the wall contact area and the functional area of the substrate. After entering the functional area through the contact area of the fence and the connection transition area, the moisture-proof performance of the bracket can be further improved.
  • the connection transition area may also be an inclined surface, an arc-shaped surface, or a combination surface.
  • the combination surface may also include but is not limited to a combination of at least two of a planar surface, an inclined surface, and an curved surface.
  • the functional area and the wall contact area are not on a plane, and optionally, the plane where the functional area is located is higher than the plane where the wall contact area is located. , Or set the plane where the functional area is located lower than the plane where the wall contact area is located, so the path between the wall contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area is extended, thereby improving the LED bracket. And the moisture-proof performance of the LED made by the LED bracket.
  • 20 is the wall body
  • 21 is the positive substrate
  • 22 is the negative substrate
  • 23 is the insulation spacer
  • 231 is the insulation protrusion.
  • the insulation An insulation protrusion 231 is provided at the left end of the separator 23, and the insulation protrusion 231 may be a hemispherical shape or a semi-circular cake shape.
  • the insulating protrusions 231, the insulating spacer 23 and the wall body 20 may be formed by the same process, or may be formed by different processes, and in one example, the three may be integrated. Molding, for example, can be integrally molded by injection molding.
  • the insulating protrusions 231 are in contact with the positive substrate 21, the negative substrate 22, and the enclosure 20 at the same time, so that the mechanical force received by the insulating spacer is transmitted to the enclosure and at least one substrate, thereby maximizing the overall strength of the LED support Reliability and moisture-proof performance, and increase the contact area with the substrate and the wall body 20, thereby improving the air tightness of the LED bracket.
  • the insulating protrusions 231 may be located on only one of the substrates, for example, as shown in FIG. 2-2, the insulating protrusions 231 are provided on both ends of the insulating spacer 23,
  • the shape and size of the insulating protrusions 231 can be the same. Of course, they can be set differently according to requirements.
  • the insulating protrusions 231 are only located on the positive substrate 21. Of course, one end of the insulating protrusions 231 can also be provided on the positive substrate 21. One end of the insulating protrusion 231 is located on the negative electrode substrate 22.
  • the insulation protrusion 231 can contact the wall body 20 at the same time, so that the mechanical force received by the insulation spacer is transmitted to the wall body and the positive substrate, which improves the overall strength, reliability and moisture resistance of the LED bracket, and also improves the substrate and the wall.
  • the contact area of the body 20 further improves the airtightness of the LED bracket.
  • both ends of the insulating spacer 23 are provided with insulating protrusions 231, and the shape of the insulating protrusions 231, The size is the same, and the insulating protrusions 231 span the positive substrate 21 and the negative substrate 22.
  • the insulating protrusions 231 can be in contact with the surrounding wall body 20 at the same time, so that the mechanical force received by the insulating spacer is transmitted to the surrounding wall body, the positive substrate and the negative substrate, thereby improving the overall strength, reliability and moisture resistance of the LED bracket, and improving the The contact areas of the positive electrode substrate 21, the negative electrode substrate 22 and the surrounding wall body 20 further improve the airtightness of the LED bracket.
  • both ends of the insulating spacer 23 are provided with insulating protrusions 231, and the insulating protrusions 231 are horizontal
  • the cross-section has a rectangular convex structure, and the insulating protrusion 231 straddles the positive substrate 21 and the negative substrate 22.
  • the insulating protrusions 231 can be in contact with the surrounding wall body 20 at the same time, so that the mechanical force received by the insulating spacer is transmitted to the surrounding wall body, the positive substrate and the negative substrate, thereby improving the overall strength, reliability and moisture resistance of the LED bracket.
  • both ends of the insulating spacer 23 are provided with insulating protrusions 231, and the insulating protrusions 231 are horizontal
  • the cross-section is a non-semicircular arc-shaped surface, and the insulating protrusions 231 also straddle the positive substrate 21 and the negative substrate 22.
  • the insulating protrusions 231 can be in contact with the surrounding wall body 20 at the same time, so that the mechanical force received by the insulating spacer is transmitted to the surrounding wall body, the positive substrate and the negative substrate, thereby improving the overall strength, reliability and moisture resistance of the LED bracket.
  • the height, width, and length of the insulating protrusion can be extended as much as possible to improve the strength and moisture resistance performance as much as possible.
  • the insulation protrusion 231 extends as long as possible in the direction of the positive substrate 21, so that the contact area of the insulation protrusion on the enclosure 20 and the substrate increases.
  • the insulating protrusions 231 may be irregularly shaped.
  • one of the exemplary insulating protrusions 231 is an irregularly shaped protrusion, which also straddles the positive electrode substrate 21 and the negative electrode.
  • the insulating protrusions 231 can be in contact with the surrounding wall body 20 at the same time, so that the mechanical force received by the insulating spacer is transmitted to the surrounding wall body, the positive substrate and the negative substrate, thereby improving the overall strength, reliability and moisture resistance of the LED bracket.
  • the shapes and sizes of the insulating protrusions 231 at both ends may also be set to be different.
  • the insulating protrusion 231 provided at the left end of the insulating spacer is a semi-spherical or semi-circular pie shape
  • the insulating protrusion provided at the right end is a hexahedron.
  • the insulation protrusions provided on at least one end of the front surface of the insulation isolation belt provided in this embodiment can be in contact with at least one substrate or wall at the same time, which can increase the overall component occupied by the insulation isolation belt in the bracket and improve the insulation isolation belt.
  • the mechanical strength of the insulating spacer can be transmitted to the surrounding wall and at least one substrate, which can improve the overall strength, reliability and moisture resistance of the LED bracket to the greatest extent.
  • the insulating spacer between the positive substrate and the negative substrate is vertical to the long side of the holder, is disposed parallel to the positive substrate and the negative substrate, and is parallel to the positive substrate. It is parallel to the negative substrate; and the insulating spacer is a relatively fragile insulating material.
  • the width of the insulating spacer is narrow, which leads to easy breakage of the insulating spacer, which reduces the overall strength and reliability of the LED bracket.
  • an LED bracket with a new structure is also provided in this embodiment.
  • the two long sides of the cross-section profile of the insulation spacer of the LED bracket that are opposite to each other are arc-shaped edges or curves with at least one bend.
  • the edges are either edges with at least one bent line, or hypotenuses with an angle of 10 ° or more and 90 ° or less with the short side of the negative electrode substrate.
  • Part of the received mechanical force is transmitted to the positive electrode substrate, the negative electrode substrate, and the wall body, so the strength of the insulating separator can be increased.
  • the two long sides of the cross-section profile of the insulating spacer may be parallel or non-parallel, and can be flexibly set according to requirements.
  • the following embodiments use parallel Two examples of setting and non-parallel setting are explained.
  • 30 is a wall body
  • 31 is a positive substrate
  • 32 is a negative substrate
  • 33 is an insulating and isolation region.
  • the dashed line is the short side of the negative electrode substrate 32.
  • the two long sides opposite to the cross-sectional profile of the insulating spacer 33 are hypotenuses with an angle of 10 ° or more and less than 90 ° with the short side of the negative electrode substrate.
  • the included angle A in the angle is greater than or equal to 10 ° and less than 90 °.
  • the value of the included angle can be flexibly set according to at least one of the strength requirements of the specific application scenario, the material used in the insulating spacer, and the forming process.
  • the value of the included angle A may be 75 ° to 85 °, for example, the specific values are 75 °, 78 °, 80 °, 83 °, 85 °, etc., so that when the insulating spacer 33 is subjected to mechanical force At this time, a part of the received mechanical force can be transmitted to the positive electrode substrate 31, the negative electrode substrate 32, and the surrounding wall body 30, so as to improve the strength of the insulating spacer 33, and further improve the overall strength and reliability of the LED bracket.
  • the long sides may be curved sides.
  • the two long sides of the insulating cross-section 33 with opposite cross-sections are two curved sides that are parallel to each other.
  • the two sides may also be curved sides.
  • the two long sides with opposite cross-sectional profiles of the insulating spacer 33 are two curved sides parallel to each other.
  • the arrangement of the curved sides can also make the insulating spacer 33 receive mechanical force. A part of the received mechanical force is transmitted to the positive electrode substrate 31, the negative electrode substrate 32, and the wall body 30, and the strength of the insulating spacer 33 is increased.
  • the number of curved edges can be flexibly set.
  • the curved edges shown in Figure 3-5 can also be used. Of course, other forms of curves can also be used. side.
  • the arc, and the curved side in addition to the hypotenuse, the arc, and the curved side, it can also be a fold line edge with at least one bend.
  • the two long sides of the insulating cross-section 33 with opposite cross-sections are two fold-line sides parallel to each other.
  • the setting of the fold-line sides can also cause the insulation-isolate belt 33 to receive mechanical force. A part of the received mechanical force is transmitted to the positive electrode substrate 31, the negative electrode substrate 32, and the wall body 30, and the strength of the insulating spacer 33 is increased.
  • the fold line edges in this embodiment can be flexibly set.
  • the fold line edges shown in Figure 3-6 can also be used, of course, other forms can also be used. Polyline edge.
  • 40 is a wall body
  • 41 is a positive substrate
  • 42 is a negative substrate
  • 43 is an insulation and isolation region.
  • the two long sides opposite to the cross-sectional profile of the insulating spacer 43 are hypotenuses with an angle of 10 ° or more and less than 90 ° with the short side of the negative electrode substrate. The distance between them is not parallel. In this way, when the insulating spacer 43 receives a mechanical force, a part of the received mechanical force can be transmitted to the positive substrate 41, the negative substrate 42 and the wall body 40, thereby increasing the strength of the insulating spacer 43 and thus the LED. The overall strength and reliability of the stand.
  • the two long sides with opposite cross-sectional contours of the insulating spacer 43 may be curved sides, in addition to the oblique sides.
  • the two long sides of the insulating cross-section 43 with opposite cross-sections are two non-parallel curved edges.
  • the arrangement of the non-parallel curved edges can also make the insulating isolation belt. 43.
  • the two long sides of the cross-section profile of the insulating spacer 43 opposite to each other in addition to the oblique side and the curved side, they may also be curved sides.
  • the two long sides with opposite cross-sectional profiles of the insulating spacer 43 are two non-parallel curved sides.
  • the arrangement of the two non-parallel curved sides can also cause the insulating spacer 43 to be subjected to In the case of mechanical force, a part of the received mechanical force is transmitted to the positive electrode substrate 41, the negative electrode substrate 42 and the surrounding wall body 40, and the strength of the insulating spacer 43 is increased.
  • the long side in addition to the two long sides with opposite cross-sectional contours of the insulating isolation tape 43, in addition to the hypotenuse, the arc, and the curved side, the long side may also have at least one bent line edge.
  • the two long sides of the insulating cross-section 43 with opposite cross-sectional profiles are two non-parallel folded line edges.
  • the arrangement of the two non-parallel folded line edges can also cause the insulating isolation belt 43 to be subjected to In the case of mechanical force, a part of the received mechanical force is transmitted to the positive electrode substrate 41, the negative electrode substrate 42 and the surrounding wall body 40, and the strength of the insulating spacer 43 is increased.
  • the two long sides opposite to each other in the cross-section profile of the insulating isolation belt are set as curved sides, or curved sides, or folded line sides, or an included angle between the short side of the negative electrode substrate is greater than or equal to 10 °, and less than
  • the 90 ° hypotenuse can transmit a part of the mechanical force to the positive substrate and / or the negative substrate when the separator is stressed. Therefore, the strength of the insulating separator can be increased, and the LED bracket and the bracket made by the bracket can be improved. The overall strength and reliability of the LED.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • the insulation spacer in the third embodiment and the insulation protrusion structure in the first or the second embodiment may also be combined to double increase the strength of the insulation spacer, thereby improving the overall LED bracket. Strength, and can increase the contact area of the insulating spacer with the substrate and / or the wall at the same time, and improve the moisture-proof performance of the LED bracket.
  • insulating spacers are arranged in parallel and non-parallel in combination with insulating protrusions are described below.
  • 50 is a surrounding wall body
  • 51 is a positive substrate
  • 52 is a negative substrate
  • 53 is an insulating isolation region
  • 532 is an insulating protrusion.
  • the two long sides opposite to the cross-sectional profile of the insulating spacer 53 are two parallel angles greater than 0 ° and less than or equal to 45 ° with the horizontal line on the front surface of the positive substrate. The beveled edge, so that when the insulating spacer 53 receives a mechanical force, a part of the received mechanical force can be transmitted to the positive substrate 51, the negative substrate 52, and the enclosure 50, thereby increasing the strength of the insulating spacer 53 and thus the LED bracket.
  • insulating protrusions 531 are provided at both ends of the insulating spacer 53, and the insulating protrusions 531 span the positive substrate 51 and the negative substrate 52; and optionally, the insulating protrusions 531 may be simultaneously It is in contact with the wall body 50, so that the mechanical force received by the insulating spacer 53 is transmitted to the wall body 50, the positive substrate 51, and the negative substrate 52, which further improves the overall strength, reliability and moisture resistance of the LED bracket, and improves the substrate
  • the contact area with the surrounding wall body 50 further improves the airtightness of the LED bracket.
  • the two long sides with opposite cross-sectional profiles of the insulating spacer 53 may be curved sides, in addition to the oblique sides.
  • the two long sides of the cross-section profile of the insulating spacer 53 are two curved sides that are parallel to each other.
  • the arrangement of the curved sides can also make the insulating spacer 53 subject to mechanical When the force is applied, part of the received mechanical force is transmitted to the positive electrode substrate 51, the negative electrode substrate 52, and the surrounding wall body 50, and the strength of the insulating spacer 53 is increased.
  • insulating protrusions 531 are also provided at both ends of the insulating spacer 53, and the insulating protrusions 531 span the positive and negative substrates 51 and 52; and optionally, the insulating protrusions 531 are in contact with the enclosure 50, so that The mechanical force part of the insulating spacer 53 is transmitted to the wall 50, the positive substrate 51 and the negative substrate 52, which further improves the overall strength, reliability and moisture resistance of the LED bracket, and also increases the contact area with the substrate and the wall 50. , To further improve the air tightness of the LED bracket.
  • the two long sides with opposite cross-sectional contours of the insulating isolation tape 53 in addition to the oblique side and the curved side, they can also be curved sides.
  • the two long sides with opposite cross-sectional profiles of the insulating spacer 53 are two curved sides parallel to each other.
  • the arrangement of the curved sides can also cause the insulating spacer 53 to receive mechanical force. A part of the received mechanical force is transmitted to the positive electrode substrate 51, the negative electrode substrate 52, and the enclosure 50, and the strength of the insulating spacer 53 is increased.
  • insulating protrusions 531 are also provided at both ends of the insulating isolation tape 53, and the insulating protrusions 531 span the positive substrate 51 and the negative substrate 52; and the insulating protrusions 531 are in contact with the wall body 50 so as to isolate the insulation Part of the mechanical force received by the belt 53 is transmitted to the wall body 50, the positive substrate 51 and the negative substrate 52, which further improves the overall strength, reliability and moisture resistance of the LED bracket.
  • the long side in addition to the two long sides with opposite cross-sectional contours of the insulating isolation tape 53, in addition to the hypotenuse, the arc, and the curved side, the long side may also have at least one bent line edge.
  • the two long sides of the cross-section profile of the insulating isolating belt 53 are parallel to each other with two fold line edges.
  • the setting of the fold line edges can also make the insulating belt 53 receive a mechanical force. A part of the received mechanical force is transmitted to the positive electrode substrate 51, the negative electrode substrate 52, and the enclosure 50, and the strength of the insulating spacer 53 is increased.
  • insulating protrusions 531 are also provided at both ends of the insulating isolation tape 53, and the insulating protrusions 531 span the positive substrate 51 and the negative substrate 52; and the insulating protrusions 531 are in contact with the wall body 50 so as to isolate the insulation
  • the mechanical force received by the belt 53 is transmitted to the wall body 50, the positive substrate 51 and the negative substrate 52, which further improves the overall strength, reliability and moisture resistance of the LED bracket, and also increases the contact area with the substrate and the wall body 50, further improving Airtightness of LED bracket.
  • 60 is a surrounding wall body
  • 61 is a positive substrate
  • 62 is a negative substrate
  • 63 is an insulating isolation region
  • 631 is an insulating protrusion.
  • the two long sides opposite to the cross-section profile of the insulating spacer 63 are two oblique edges with an angle of greater than 0 ° and less than or equal to 45 ° with the horizontal line on the front surface of the positive electrode substrate. They are not parallel.
  • the insulating spacer 63 when the insulating spacer 63 receives a mechanical force, a part of the received mechanical force can be transmitted to the positive substrate 61 and the negative substrate 62, thereby increasing the strength of the insulating spacer 63 and the overall strength of the LED bracket.
  • insulating protrusions 631 are also provided at both ends of the insulating spacer 63, and the insulating protrusions 631 span the positive substrate 61 and the negative substrate 62; and the insulating protrusions 631 are in contact with the enclosure 60, As a result, the mechanical force received by the insulating spacer 63 is transmitted to the surrounding wall 60, the positive substrate 61 and the negative substrate 62, further improving the overall strength, reliability and moisture resistance of the LED bracket, and improving the contact with the substrate and the surrounding wall 60. Area, further improving the airtightness of the LED bracket.
  • the two long sides with opposite cross-sectional contours of the insulating spacer 63 can also be curved sides, in addition to the hypotenuse.
  • the two long sides with opposite cross-sections of the insulating spacer 63 are two non-parallel curved edges.
  • the arrangement of the non-parallel curved edges can also make the insulating spacer
  • insulating protrusions 631 are provided at both ends of the insulating spacer 63 to insulate.
  • the protrusion 631 straddles the positive substrate 61 and the negative substrate 62; and the insulating protrusion 631 is in contact with the wall body 60, so that the mechanical force received by the insulating spacer 63 is transmitted to the wall body 60, the positive substrate 61, and the negative substrate 62
  • the overall strength, reliability and moisture resistance of the LED bracket are further improved, and the contact area with the substrate and the surrounding wall body 60 is further improved to further improve the airtightness of the LED bracket.
  • the insulation spacer 63 in addition to the two long sides of the cross-sectional profile of the insulation spacer 63, which are opposite to each other, they may be beveled edges and curved edges, or curved edges.
  • the two long sides of the cross-section profile of the insulating spacer 63 are two non-parallel curved sides.
  • the arrangement of the two non-parallel curved sides can also cause the insulating spacer 63 to be subjected to During mechanical force, a part of the received mechanical force is transmitted to the positive substrate 61 and the negative substrate 62 to increase the strength of the insulating spacer 63.
  • insulating protrusions 631 and insulating protrusions are also provided at both ends of the insulating spacer 63.
  • 631 straddles the positive electrode substrate 61 and the negative electrode substrate 62; and the insulating protrusions 631 are in contact with the wall body 60, so that the mechanical force received by the insulating spacer 63 is transmitted to the wall body 60, the positive electrode substrate 61, and the negative electrode substrate 62.
  • the overall strength, reliability, and moisture resistance of the LED bracket are further improved, and the contact area with the substrate and the surrounding wall body 60 is further improved, thereby further improving the airtightness of the LED bracket.
  • the long side with at least one bent line can also be used.
  • the two long sides with opposite cross-sectional contours of the insulation spacer 63 are two non-parallel fold lines.
  • the arrangement of the two non-parallel fold lines can also cause the insulation spacer 63 to be exposed.
  • insulating protrusions 631 and insulating protrusions are also provided at both ends of the insulating spacer 63.
  • 631 straddles the positive electrode substrate 61 and the negative electrode substrate 62; and the insulating protrusions 631 are in contact with the wall body 60, so that the mechanical force received by the insulating spacer 63 is transmitted to the wall body 60, the positive electrode substrate 61, and the negative electrode substrate 62.
  • the overall strength, reliability, and moisture resistance of the LED bracket are further improved, and the contact area with the substrate and the surrounding wall body 60 is further improved, thereby further improving the airtightness of the LED bracket.
  • the two long sides opposite to the cross-section profile of the insulating isolation belt are set as curved edges, or curved edges, or folded line edges, or an included angle with a horizontal line on the front surface of the positive electrode substrate is greater than 0 ° and less than or equal to 64.
  • insulation protrusions are also provided at both ends of the insulation spacer, the insulation protrusions spanning the positive substrate and the negative substrate; and the insulation protrusions are in contact with the wall body; Part of the mechanical force is transmitted to the wall body, the positive substrate and the negative substrate, further improving the overall strength, reliability and moisture resistance of the LED bracket, and also increasing the contact area with the substrate and the wall body, further improving the airtightness of the LED bracket.
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • the present embodiment uses an example in which the contact area of the fence on the substrate is directly connected to the functional area, and the functional area is located above the contact area of the fence.
  • 70 is the wall body
  • 71 is the substrate (possibly the positive substrate and / or the negative substrate)
  • 711 is the functional area
  • 712 is the contact area of the wall
  • 731 is the insulation barrier.
  • FIG. 7-1 shows a schematic diagram of a direct connection between a wall contact area and a functional area on a substrate.
  • the wall contact area 712 is an inclined surface, and the function area 711 is located in the wall
  • the plane of the contact area 712 may be a non-planar area.
  • the path between the wall contact zone 712 and the function zone 711 is significantly longer than the path where the existing wall contact zone and the function zone are located on the same plane, so the path of moisture entering the function zone can be lengthened, thereby improving the moisture-proof performance of the bracket. Improve the reliability of the LED lamp beads or other products made using the bracket.
  • the fence contact area 712 may not be an inclined surface, but may be another type of surface.
  • the contact area 712 of the wall in the figure is an arc surface, and the arc faces a convex arc surface protruding outside of the substrate 71.
  • the arrangement of the convex arc surface shown in FIG. 7-2 is relatively The slope shown in Figure 7-1 can further extend the path for moisture to enter the functional area, and thus can further improve the moisture-proof effect.
  • the wall contact area 712 is a curved surface
  • other types of curved surfaces may also be used.
  • FIG. 7-3 which is an inner arc surface concave toward the inside of the substrate 71.
  • the path of moisture entering the functional area can be further extended, so the moisture resistance can be further improved. effect.
  • the surrounding wall contact area 712 may be set to other types of surfaces according to requirements, and it may be a regular surface or an irregular surface.
  • the contact area 712 of the surrounding wall is a curved surface. Compared with the inclined surface shown in FIG. 7-1, the path of moisture entering the functional area can be further extended, so the moisture-proof effect can be further improved.
  • fence contact areas 712 on opposite sides in FIGS. 7-1 to 7-4 can be set to the same surface or different surfaces, and can be flexibly set according to the application scenario.
  • the formation process of the above-mentioned wall contact area 712 can be flexibly selected, such as, but not limited to, etching and cutting.
  • the formation method is simple, low cost, and high efficiency. While ensuring the cost and efficiency of bracket production, the LED bracket can be improved. Moisture resistance.
  • Embodiment 6 is a diagrammatic representation of Embodiment 6
  • this embodiment is described by taking a connection transition area between the wall contact area and the function area on the substrate as an example, and the function area located above the wall contact area as an example.
  • the plane where the functional area is located may be higher than the plane where the contact area of the fence is located, and the specific height difference between the two may be flexibly set according to the application scenario, such as the plane where the functional area is located and the fence.
  • the height difference of the plane where the contact area is located can be set to greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity; of course, it can also be set to other values according to specific needs, such as the height difference can be set to greater than 0 and less than or equal to reflection One-fifth, one-sixth, or one-third of the cavity depth.
  • connection transition area between the contact area and the functional area of the fence may also be in contact with the fence body at least in part, so that the contact area between the substrate and the fence body can be improved, and the strength of the bracket can be improved. Further extend the path of moisture into the functional area.
  • the contact area of the surrounding wall and the connection transition area may be located on the same plane, or may be located on different planes, and the types of the two may be the same or different. It should also be understood that the contact area of the surrounding wall in this embodiment may also be several types of faces as shown in the second embodiment.
  • 80 is the wall body
  • 81 is the substrate (possibly the positive substrate and / or the negative substrate)
  • 811 is the functional area
  • 812 is the contact area of the wall
  • 831 is the insulation barrier.
  • the area of the wall contact area 812 is an inclined area where the front surface of the substrate directly contacts the wall body 80
  • the connection transition area 813 is an area of the inclined surface where the front surface of the substrate does not contact the wall body 80.
  • the connecting transition area 813 and the wall contact area 812 form an inclined plane, that is, they are located on the same plane.
  • the area of the wall contact area 812 is a planar area where the front surface of the substrate directly contacts the wall body 80, and the connection transition area 813 is the front surface of the substrate connecting the wall contact area 812 and the functional area.
  • the sloped area of 811 in the example shown in FIG. 8-2, a part of the connecting transition area 813 also directly contacts the wall body 80, so while further increasing the path between the wall contact area 812 and the function area 811, Increasing the strength of the bracket can also improve the moisture resistance and strength of the bracket at the same time.
  • the area of the wall contact area 812 is a planar area where the front surface of the substrate directly contacts the wall body 80, and the connection transition area 813 is the front surface of the substrate connecting the wall contact area 812 and the functional area.
  • the curved surface area of 811 is a convex curved surface area protruding to the outside of the substrate 81.
  • the connection transition area 813 also has a part directly contacting the wall 80, so While further increasing the path between the wall contact area 812 and the function area 811 to improve the moisture-proof performance, the strength of the bracket can be improved.
  • connection transition region 813 in this embodiment may also be a concave arc surface concave toward the inside of the substrate 81.
  • FIG. 8-4 which is an example.
  • the connecting transition area 813 is a concave arc surface, it can also increase the path between the wall contact area 812 and the functional area 811 to improve the moisture resistance performance, and also increase the strength of the support.
  • connection transition regions 813 on opposite sides of the front surface of the substrate may also be set as the same type of surface, or may be set as different types of surfaces.
  • connection transition area 813 on one side of the substrate is set as a convex arc surface
  • connection transition area 813 on the other side is set as a concave arc surface.
  • the specific setting method can be based on the specific application scenario and The process used is flexible.
  • connection transition area may also be a combination surface
  • the combination surface may include, but is not limited to, a combination of at least two of a flat surface, an inclined surface, and an arc surface.
  • the area of the wall contact area 812 is a planar area where the front surface of the substrate directly contacts the wall body 80, and the connection transition area 813 is the slope and arc of the front surface of the substrate connecting the wall contact area 812 and the functional area 811.
  • Combined surface combined by planes for another example, see FIG. 8-7, which is different from the bracket shown in FIG. 8-6 in that the connection transition region 813 is formed by combining two inclined planes and a plane connecting the two inclined planes;
  • the difference from the brackets shown in FIGS. 8-6 and 8-7 is that the connection transition region 813 is formed by combining inclined surfaces, planes, and curved surfaces connected in sequence.
  • connection transition area 813 in this embodiment is a combination surface
  • the specific combination manner can be flexibly set.
  • the enclosure contact area 812 in this embodiment may also be a combination surface, and may be a combination surface of the same type as the connection transition area 813, or a combination surface of a different type from the connection transition area 813.
  • a connection transition area is further provided between the wall contact area and the function area on the substrate, which can further increase the path between the wall contact area 812 and the function area 811 to improve the moisture resistance performance; and optionally, a connection can also be provided. At least a part of the transition area is in contact with the surrounding wall body, so as to simultaneously increase the contact area between the substrate and the surrounding wall body, thereby increasing the strength of the support.
  • Embodiment 7 is a diagrammatic representation of Embodiment 7:
  • connection transition region between the wall contact region and the functional region on the substrate is described by taking a connection transition region between the wall contact region and the functional region on the substrate as an example, and the functional region located below the wall contact region as an example.
  • the planes where the functional areas of the positive substrate and the negative substrate can be set are lower than the plane where the contact area of the fence is located.
  • the functional areas of the positive substrate and the negative substrate are located at the bottom of the reflective cavity formed by the wall body; the value of the height difference between the plane where the functional area is located and the plane where the wall contact area is located can be flexibly set.
  • the height difference can be set to greater than 0, less than or equal to one quarter of the depth of the reflection cavity formed by the contact area of the wall; of course, it can also be set to other values according to specific needs, such as the height difference can be set to greater than 0. Less than or equal to one-fifth, one-sixth or one-third of the depth of the reflection cavity.
  • connection transition region may be an inclined plane, an arc-shaped plane, or a combination plane
  • combination plane is a combination including at least two of a plane, an inclined plane, and an arc-shaped plane.
  • connection transition region may also be in contact with the surrounding wall body, so as to simultaneously increase the contact area between the substrate and the surrounding wall body, thereby increasing the strength of the support.
  • the type of the contact area of the surrounding wall and the connection transition area and / or the process used to form them may be the same or different. It should also be understood that the contact area of the surrounding wall in this embodiment may also be several types of faces as shown in the second embodiment.
  • 90 is the wall body
  • 91 is the substrate (possibly the positive substrate and / or the negative substrate)
  • 911 is the functional area
  • 912 is the contact area of the wall
  • 931 is two
  • the specific setting manner of the insulating protrusions can refer to the manners shown in the foregoing embodiments, and is not limited to the manners shown in the figures of this embodiment.
  • the area of the wall contact area 912 is a flat area where the front surface of the substrate directly contacts the wall body 90
  • the connection transition area 913 is an inclined surface connecting the wall contact area 912 and the function area 11. region.
  • the area of the wall contact area 912 is a flat area where the front surface of the substrate directly contacts the wall body 90, and the connection transition area 913 is a connection area between the wall contact area 912 and the function area 11. Curved surface area.
  • the curved surface area is a concave curved surface area recessed toward the back of the substrate 91.
  • the concave curved surface area transition connection area is more inclined than the inclined surface transition connection area to further increase the wall contact.
  • the path between zone 912 and functional zone 911 can further improve the moisture resistance and strength of the bracket.
  • connection transition area 913 when the connection transition area 913 is an arc surface area connecting the wall contact area 912 and the functional area 11, it may also be a convex arc area protruding upward from the front surface of the substrate 91, as shown in FIG. 9-4.
  • the opposite slope transition connection zone can further increase the path between the wall contact zone 912 and the function zone 911, and can further improve the moisture-proof performance and strength of the bracket.
  • connection transition area may also be a combination surface
  • the combination surface may include, but is not limited to, a combination of at least two of a flat surface, an inclined surface, and an arc surface.
  • the area of the wall contact area 912 is a planar area where the front surface of the substrate directly contacts the wall body 90, and the connection transition area 913 is the front surface of the substrate connecting the wall contact area 912 and the functional area.
  • the combination area of the plane area and the bevel area of 911 is a combination surface, and the combination surface can further increase the path between the wall contact area 912 and the function area 911 to improve the moisture resistance performance.
  • the area of the wall contact area 912 is a plane area where the front surface of the substrate directly contacts the wall body 90
  • the connection transition area 913 is the plane and arc shape of the front surface of the substrate connecting the wall contact area 912 and the functional area 911.
  • the combined surface is a combination surface
  • the curved surface is a convex curved surface area protruding upward from the front surface of the substrate 91.
  • the connection transition area 913 is composed of a plane and a concave arc surface area, and the combined surface can further increase the wall contact area 912. Path to functional area 911 to improve moisture resistance.
  • connection transition regions 913 on opposite sides of the front surface of the substrate may also be provided as the same type of surface, or as different types of surfaces.
  • the connection transition area 913 on one side of the substrate is set as a combination surface of a plane and an inclined surface
  • the connection transition area 913 on the other side is a combination surface of a plane and a concave arc surface.
  • the specific setting method can be flexibly determined according to the specific application scenario and the adopted process.
  • a connection transition area is further provided between the wall contact area and the functional area on the substrate, and at least part of the contact area can be in direct contact with the wall contact area 912 to simultaneously increase the contact area between the substrate and the wall.
  • the combined surface 913 combined by the inclined plane and the plane is completely in direct contact with the surrounding wall contact area 912, which can further increase the contact area between the substrate and the surrounding wall body, and thus increase the strength of the support; meanwhile, the support Air tightness to further improve moisture resistance.
  • Embodiment 8 is a diagrammatic representation of Embodiment 8
  • This embodiment provides an LED, which includes the LED bracket as shown in the above embodiments, and further has at least one LED chip, the LED chip is disposed on the positive substrate and / or the negative substrate, and the positive pin and the negative electrode of the LED chip The pins are electrically connected to the positive substrate and the negative substrate respectively.
  • the LED chip in this embodiment may be a flip-chip LED chip or a positive-mounted LED chip, and the positive and negative pins of the LED chip Ways of achieving electrical connection with the positive substrate and the negative substrate, respectively, include, but are not limited to, a conductive wire, a conductive adhesive, or other forms of conductive materials.
  • the colors of the LEDs provided by this embodiment that are irradiated and presented to users can be flexibly set according to actual needs and application scenarios.
  • the color of the light emitted by the LED can be flexibly controlled by but not limited to the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a light-emitting conversion layer, and the LED emits light when the LED includes a light-emitting conversion layer The type of the transformation layer.
  • the LED may further include a lens adhesive layer or a diffuser disposed on the LED chip (when a light-emitting conversion adhesive layer is provided on the LED chip, it is disposed on the light-emitting conversion adhesive layer). Glue layer.
  • the light-emitting conversion glue layer may be a fluorescent glue layer containing a phosphor, or a colloid containing a quantum dot photoactive material, or other light-emitting conversion glue or film capable of realizing light conversion, It may also include diffusion powder or silicon powder as required; in this embodiment, the method for forming the light-emitting conversion adhesive layer, lens adhesive layer, or diffusion adhesive layer on the LED chip includes, but is not limited to, dispensing, molding, spraying, and pasting.
  • the light emitting conversion layer may include a phosphor powder layer, a fluorescent film, or a quantum dot QD film; the phosphor powder layer and the fluorescent film may be made of an inorganic phosphor, and may be an inorganic phosphor doped with a rare earth element, wherein,
  • the inorganic phosphor includes, but is not limited to, at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphor.
  • the quantum dot QD film can be made of quantum dot phosphors; quantum dot phosphors include but are not limited to BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe , GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI3.
  • quantum dot phosphors include but are not limited to BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe , Ga
  • the type of light emitted by the LED chip itself may be visible light visible to the naked eye, or may be ultraviolet or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light invisible to the naked eye
  • a light-emitting conversion layer may be provided on the LED chip to convert invisible light to visible light, so that the light emitted by the LED is visible to the user.
  • the light-emitting conversion layer may be made by mixing red, green, and blue phosphors.
  • This embodiment also provides a light-emitting device, which includes the LEDs illustrated in the above embodiments.
  • the light-emitting device in this embodiment may be a lighting device, a light signal indicating device, a fill light device, a backlight device, or the like.
  • a lighting device it may be a lighting device used in various fields, such as table lamps, fluorescent lamps, ceiling lamps, down lamps, street lamps, projection lamps, etc. in daily life, and high beam lamps and low beams in automobiles.
  • Lamps, atmosphere lamps, etc. such as medical surgical lamps, low electromagnetic lighting lamps, various medical instrument lighting, and for example various colored lights, landscape lighting, advertising lamps, etc.
  • the light signal indicating device can be specifically applied to various fields, such as signal lights in the traffic field, various signal status indicators on communication equipment in the communication field, various indicators on vehicles, etc. ;
  • it can be a supplementary light in the field of photography, such as a flash, a supplementary light, or a plant supplementary light that supplements light in plants in the agricultural field.
  • it can be used in various applications. Backlight modules in the field of backlighting can be applied to, for example, mobile terminals such as displays, televisions, and mobile phones, and advertising devices. It should be understood that the applications described above are just a few of the applications illustrated in this embodiment, and it should be understood that the applications of LEDs are not limited to the fields of the examples described above.

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Abstract

本发明提供一种高强度LED支架、LED及发光装置，包括正极基板、负极基板，将正极基板、负极基板围合在内的绝缘的围墙体，正极基板和负极基板的正面具有功能区和与围墙体接触的围墙接触区，正极基板和负极基板中的至少一个基板的功能区和围墙接触区不在一个平面上，可以延长基板的围墙接触区与功能区之间的路径，也即延长湿气进入到功能区内的路径，从而提升LED支架以及利用该LED支架制得的LED的防潮性能和可靠性和耐用性。

Description

高强度LED支架、LED及发光装置 技术领域
本发明涉及LED（Light Emitting Diode，发光二极管）领域，尤其涉及一种高强度LED支架、LED及发光装置。
 
 背景技术
由于LED具有色彩丰富、体积小、环保节能、寿命长等优点，因此，其在各个领域都得到的大量的使用和推广，例如包括但不限于日用照明，户外照明，灯光装饰，广告标识，汽车照明或指示，交通指示等等，由于LED在不同领域使用的外界环境各不相同，因此对LED的可靠性提出了较大的要求，其中LED的整体强度能则是LED可靠性的一个重要衡量指标。
现有LED支架参见图1-1至图1-2所示，其包括形成反射腔的塑料围墙10，被塑料围墙10围合在内的正极基板11、负极基板12以及将正极基板11和负极基板12绝缘隔离的隔离带13，其中正极基板11和负极基板12的正面一部分区域与位于塑料围墙10直接接触，称之为围墙接触区；另一部分区域则位于反射腔底部作为功能区，该功能区可用于承载LED芯片以及其他可能的电子器件，以及布线、固晶和作为光反射区等。现有LED支架存在以下问题：
正极基板11和负极基板12正面的围墙接触区和功能区都位于一个平面上，因此当湿气沿着基板侧面与塑料围墙10的结合处蔓延至基板正面时，就很容易通过基板正面的围墙接触区进入功能区，导致功能区中的电路短路、器件损坏甚至直接造成死灯；且大部分基板的功能区镀有金属银层，金属银层在湿气作用下也很容易腐蚀，造成功能性缺陷。可见，现有LED支架以及利用该支架制得的LED的防潮性能差。
 技术问题
本发明提供的高强度LED支架、LED及发光装置，主要解决的技术问题是：如何提升LED支架，以及利用该LED支架制得的LED的可靠性以及防潮性能。
 
 技术解决方案
为解决上述技术问题，本发明提供一种LED支架，包括正极基板、负极基板以及绝缘隔离带，所述绝缘隔离带位于所述正极基板和所述负极基板之间将二者绝缘隔离，还包括将所述正极基板、负极基板和所述绝缘隔离带围合在内的绝缘的围墙体，所述正极基板和所述负极基板的正面具有功能区和与所述围墙体接触的围墙接触区；
所述正极基板和所述负极基板中的至少一个基板的所述功能区和所述围墙接触区不在一个平面上。
可选地，所述正极基板的所述功能区和所述围墙接触区不在一个平面上，所述负极基板的所述功能区和所述围墙接触区也不在一个平面上。
可选地，所述围墙接触区与所述功能区直接连接。
可选地，所述正极基板和所述负极基板中至少一个基板的所述功能区和所述围墙接触区之间还具有连接过渡区。
可选地，所述连接过渡区为斜面，弧形面，或为组合面，所述组合面为包括平面、斜面、弧形面中的至少两个的结合。
可选地，所述功能区所在的平面高于所述围墙接触区所在的平面。
可选地，所述功能区所在的平面低于所述围墙接触区所在的平面。
可选地，所述功能区所在的平面与所述围墙接触区所在的平面的高度差大于0，小于等于所述围墙体形成的反射腔之深度的四分之一。
可选地，所述绝缘隔离带正面至少一端设有绝缘凸起。
可选地，所述绝缘隔离带正面相对的两端都设有绝缘凸起。
可选地，所述绝缘凸起横跨于所述正极基板和/或所述负极基板的正面上。
可选地，所述正极基板和所述负极基板的功能区位于所述围墙体形成的反射腔底部，所述绝缘凸起与所述反射腔的内侧面直接接触，且所述绝缘凸起的高度小于所述围墙体形成的反射腔之内侧面的高度。
可选地，所述绝缘凸起与所述绝缘隔离带一体成型，和/或，所述绝缘凸起与所述绝缘隔离带的材质相同。
可选地，所述绝缘凸起沿高度方向的纵截面之轮廓为弧形轮廓或为由上横边、下横边以及位于上横边和下横边之间的弧形组成的轮廓。
可选地，所述绝缘隔离带的横截面轮廓相对的两条长边为弧形边，或为具有至少一处弯曲的曲线边，或为具有至少一处弯折的折线边，或为与所述负基板的短边之间的夹角大于等于10°，小于90°的斜边。
可选地，所述绝缘隔离带的横截面轮廓相对的两条长边相互平行。
为了解决上述问题，本发明还提供了一种高强度LED，包括如上所述的高强度LED支架和至少一颗LED芯片，所述LED芯片设置于所述正极基板和/或所述负极基板上，所述LED芯片的正极引脚和负极引脚分别与所述正极基板和所述负极基板电连接。
为了解决上述问题，本发明还提供了一种发光装置，包括如上所述的LED，所述发光装置为照明装置、光信号指示装置、补光装置或背光装置。
 
 有益效果
本发明提供的高强度LED支架、LED及发光装置，包括正极基板、负极基板以及绝缘隔离带，绝缘隔离带位于正极基板和负极基板之间将二者绝缘隔离，LED支架还包括将正极基板、负极基板和绝缘隔离带围合在内的绝缘的围墙体，正极基板和负极基板的正面具有功能区和与围墙体接触的围墙接触区，且设置正极基板和负极基板中的至少一个基板的功能区和围墙接触区不在一个平面上，因此可以延长基板的围墙接触区与功能区之间的路径，也即延长湿气进入到功能区内的路径，从而提升LED支架以及利用该LED支架制得的LED的防潮性能，提升LED的可靠性和耐用性，使得LED可更好的适用于各种环境的应用场景，更利于LED的推广使用。
进一步的，由于现有LED支架的正极基板与负极基板之间的绝缘隔离带是垂直于支架长边，与正极基板和负极基板平行设置的；且绝缘隔离带是比较脆弱的绝缘塑料材质，再加上绝缘隔离带的宽度较窄，导致绝缘隔离带塑料量较少，绝缘隔离带易发生断裂，降低了LED支架以及利用该支架制得的LED的整体强度和可靠性；对此，本发明还可进一步在绝缘隔离带正面至少一端上设有绝缘凸起，从而增加绝缘隔离带的用料分量，进而增加绝缘隔离带在支架中所占用的整体分量，提升绝缘隔离带的整体强度，进而提升具有该绝缘隔离带的LED支架以及利用该支架制得的LED的整体强度和可靠性。
 
 附图说明
图1-1为一种LED支架的俯视图；
图1-2为图1-1所示LED支架的截面图；
图2-1为本发明实施例二提供LED支架的俯视图一；
图2-2为本发明实施例二提供LED支架的俯视图二；
图2-3为本发明实施例二提供LED支架的俯视图三；
图2-4为本发明实施例二提供LED支架的俯视图四；
图2-5为本发明实施例二提供LED支架的俯视图五；
图2-6为本发明实施例二提供LED支架的俯视图六；
图2-7为本发明实施例二提供LED支架的俯视图七；
图2-8为本发明实施例二提供LED支架的俯视图八；
图3-1为本发明实施例三提供LED支架的俯视图一；
图3-2为本发明实施例三提供LED支架的俯视图二；
图3-3为本发明实施例三提供LED支架的俯视图三；
图3-4为本发明实施例三提供LED支架的俯视图四；
图3-5为本发明实施例三提供LED支架的俯视图五；
图3-6为本发明实施例三提供LED支架的俯视图六；
图4-1为本发明实施例三提供LED支架的俯视图七；
图4-2为本发明实施例三提供LED支架的俯视图八；
图4-3为本发明实施例三提供LED支架的俯视图九；
图4-4为本发明实施例三提供LED支架的俯视图十；
图5-1为本发明实施例四提供LED支架的俯视图一；
图5-2为本发明实施例四提供LED支架的俯视图二；
图5-3为本发明实施例四提供LED支架的俯视图三；
图5-4为本发明实施例四提供LED支架的俯视图四；
图6-1为本发明实施例四提供LED支架的俯视图五；
图6-2为本发明实施例四提供LED支架的俯视图六；
图6-3为本发明实施例四提供LED支架的俯视图七；
图6-4为本发明实施例四提供LED支架的俯视图八；
图7-1为本发明实施例五提供LED支架的截面图一；
图7-2为本发明实施例五提供LED支架的截面图二；
图7-3为本发明实施例五提供LED支架的截面图三；
图7-4为本发明实施例五提供LED支架的截面图四；
图8-1为本发明实施例六提供LED支架的截面图一；
图8-2为本发明实施例六提供LED支架的截面图二；
图8-3为本发明实施例六提供LED支架的截面图三；
图8-4为本发明实施例六提供LED支架的截面图四；
图8-5为本发明实施例六提供LED支架的截面图五；
图8-6为本发明实施例六提供LED支架的截面图六；
图8-7为本发明实施例六提供LED支架的截面图七；
图8-8为本发明实施例六提供LED支架的截面图八；
图9-1为本发明实施例七提供LED支架的截面图一；
图9-2为本发明实施例七提供LED支架的截面图二；
图9-3为本发明实施例七提供LED支架的截面图三；
图9-4为本发明实施例七提供LED支架的截面图四；
图9-5为本发明实施例七提供LED支架的截面图五；
图9-6为本发明实施例七提供LED支架的截面图六；
图9-7为本发明实施例七提供LED支架的截面图七；
图9-8为本发明实施例七提供LED支架的截面图八；
其中，图1-1至图1-2中的附图标记10为塑料围墙，11为正极基板，12为负极基板，13为隔离带；图2-1至图2-8中，20为围墙体，21为正极基板，22为负极基板，23为绝缘隔离带，231为绝缘凸起；图3-1至图3-6中，30为围墙体， 31为正极基板，32为负极基板，33为绝缘隔离区；图4-1至图4-4中，40为围墙体，41为基板，41为正极基板，42为负极基板，43为绝缘隔离区；图5-1至图5-4中，50为围墙体，51为正极基板，52为负极基板，53为绝缘隔离带，531为绝缘凸起；图6-1至图6-4中，60为围墙体，61为正极基板，62为负极基板，63为绝缘隔离带，631为绝缘凸起；图7-1至图7-4中，70为围墙体，71为基板，711为功能区，712为围墙接触区；731为绝缘凸起；图8-1至图8-8中，80为围墙体，81为基板，811为功能区，812为围墙接触区，813为连接过渡区；831为绝缘凸起；图9-1至图9-8中，90为围墙体，91为基板，911为功能区，912为围墙接触区，913为连接过渡区；931为绝缘凸起。
 
 
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，下面通过具体实施方式结合附图对本发明实施例作进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例一：
为了解决现有LED支架防潮性差以及可靠性差的问题，本实施例提供的LED支架包括将正极基板、负极基板和绝缘隔离带围合在内的绝缘的围墙体，正极基板和负极基板的正面具有功能区和与围墙体接触的围墙接触区，且设置正极基板和负极基板中的至少一个基板的功能区和围墙接触区不在一个平面上，因此可以延长基板的围墙接触区与功能区之间的路径，也即延长湿气进入到功能区内的路径，从而提升LED支架以及利用该LED支架制得的LED的防潮性能，提升LED的可靠性和耐用性，使得LED可更好的适用于各种环境的应用场景，更利于LED的推广使用。
另外，为了解决现有LED支架整体强度差的问题，本实施例提供的高强度LED支架包括正极基板、负极基板以及绝缘隔离带，正极基板和负极基板正面设有功能区，绝缘隔离带位于正极基板和负极基板之间将二者绝缘隔离，且在绝缘隔离带正面至少一端上设有绝缘凸起，从而增加绝缘隔离带的用料分量，进而增加绝缘隔离带在支架中所占用的整体分量，提升绝缘隔离带的整体强度，进而提升具有该绝缘隔离带的LED支架以及利用该支架制得的LED的整体强度和可靠性。
在一种示例中，正极基板和负极基板正面的功能区位于围墙体所形成的反射腔底部。
本实施例中的正极基板和负极基板都是导电基板，该导电基板可以为各种导电材质构成的基板，例如可为各种金属导电基板，包括但不限于铜基板、铝基板、铁基板、银基板；导电基板也可以为包含导电材料的混合材料导电基板，例如导电橡胶等。
可选地，本实施例中正极基板和负极基板中至少一个正面的功能区内还可设置反射层以提升支架的出光效率，该反射层可以为各种能提升出光效率的光反射层，例如包括但不限于镀银层。
可选地，本实施例中正极基板和负极基板中至少一个基板的背面露出围墙体的底部，作为电极焊接区。当然，在一些示例中，正极基板和负极基板中的至少一个基板的背面也可不作为焊接区，而将其侧面作为焊接区，具体设置可根据具体应用需求灵活确定。
可选地，本实施例中围墙体可以采用各种绝缘材质的围墙体，例如包括但不限于各种塑料、绝缘陶瓷等。一种示例中，围墙体可以采用的材料包括但不限环氧树脂类（EP，Epoxide resin）、耐高温尼龙（PPA塑料）、聚邻苯二甲酰胺（PPA，Polyphthalamide）、聚对苯二甲酸1，4-环己烷二甲醇酯（PCT，Poly1，4-cyclohexylene dimethylene terephthalate）、液晶聚合物（LCP，Liquid Crystal Polymer）、片状模塑料（SMC，Sheet molding compound）、环氧模塑料(EMC，Epoxy molding compound)、不饱和聚酯 (UP)树脂、涤纶树脂（PET，Polyethylene terephthalate）、聚碳酸酯（PC，Polycarbonate）、聚己二酰己二胺（nylon 66）、玻璃纤维。
可选地，本实施例中绝缘隔离带的材质可与围墙体相同，也可不同，且其可以与围墙体一起形成，也可单独形成。
另外，应当理解的是，本实施例中围墙体的形成方式也可灵活选择，例如可通过但不限于注塑形成。
在本实施例的一种示例中，可设置绝缘隔离带正面的两端都设有绝缘凸起，以进一步提升绝缘隔离带的强度。且在绝缘隔离带两端设置绝缘凸起时，两端的绝缘凸起的形状、大小、材质可以相同，也可根据需求设置为不同。
在本实施例的一种示例中，绝缘凸起可横跨于正极基板和/或负极基板的正面上，以提升绝缘隔离带与正极基板和/或负极基板的接触面积，以及绝缘隔离带与围墙内壁的接触面积，使得绝缘隔离带受到的机械力部分传递至正极基板和/或负极基板以及围墙上，从而可进一步提升绝缘隔离带的强度，进而整体上提升LED支架的整体强度和可靠性。且同时也能提升LED支架的气密性，进而提升LED支架的防潮性能。
在本实施例的一种示例中，正极基板和负极基板的功能区位于围墙体形成的反射腔底部，可选地，绝缘隔离带上设置的绝缘凸起与反射腔的内侧面直接接触，且绝缘凸起的高度小于反射腔的内侧面的高度；使得绝缘隔离带受到的机械力部分传递至围墙体上，从而可进一步提升绝缘隔离带的强度，进而整体上提升LED支架的整体强度和可靠性。且同时也能提升LED支架的气密性，进而提升LED支架的防潮性能。
应当理解的是，可选地，也可设置绝缘隔离带上设置的绝缘凸起同时与至少一个基板和围墙体接触，从而使得绝缘隔离带受到的机械力部分传递至围墙体和至少一个基板上，最大程度上提升LED支架的整体强度、可靠性以及防潮性能。
在本实施的一种示例中，为了进一步提升绝缘隔离带的强度，可设置绝缘隔离带正面高于正极基板和负极基板的正面，且具体高度可以根据需求灵活设定。
在本实施例的一种示例中，绝缘隔离带上设置的绝缘凸起与绝缘隔离带可一体成型，也可分别形成，具体可根据具体的工艺和需求灵活设定。
在本实施例的一种示例中，绝缘隔离带上设置的绝缘凸起与绝缘隔离带的材质可以相同，当然在一些示例中也可设置为不同。
本实施例中的绝缘凸起具体的形状和结构可以灵活设定，例如可以设置为半球形，或半圆饼形等，当然也可为小于一半或大于一半的球形或圆饼形；此时绝缘凸起沿着高度方向的纵截面的轮廓可为弧形轮廓，或绝缘凸起沿着高度方向的纵截面的轮廓为由上横边、下横边以及位于上横边和下横边之间的弧形组成的轮廓。当然，本实施例中的绝缘凸起也可以设置为方形或其他规则形状，当然也可以设置为非规则形状，具体都可根据具体应用场景灵活设定。
本实施例在绝缘隔离带正面至少一端上设有绝缘凸起，且该绝缘凸起可同时与至少一个基板或围墙体接触，既增加了绝缘隔离带的用料分量，进而增加绝缘隔离带在支架中所占用的整体分量，提升绝缘隔离带的整体强度，同时又可使得绝缘隔离带受到的机械力部分传递至围墙体和至少一个基板上，最大程度上提升LED支架的整体强度、可靠性以及防潮性能；同时提升了绝缘隔离带与基板和围墙体的接触面积，提升支架的气密性。
本实施例中，LED支架的正极基板和负极基板中的至少一个基板的功能区和围墙接触区不在一个平面上，例如正极基板正面的功能区和围墙接触区不在一个平面上，和/或，负极基板正面的功能区和围墙接触区不在一个平面上；具体设置正极基板和负极基板中的一个还是两个的功能区和围墙接触区不在一个平面上可根据具体需求灵活设定。例如，在一种示例中，为了全面提升LED支架的密封性，可设置正极基板和负极基板的功能区和围墙接触区都不在一个平面上。这种设置可以延长基板的围墙接触区域功能区之间的路径，也即是延长了湿气进入到功能区内的路径，从而可提升LED支架以及利用该LED支架制得的LED的密封性能，提升LED的可靠性和耐用性，使得LED可更好的满足各种环境使用要求，更利于LED的推广使用。
在本实施例的一种示例中，基板正面的围墙接触区可与功能区直接连接，且围墙接触区可以为斜面、弧面或其他类型的面。
在本实施例的另一种示例中，为了进一步延长基板的围墙接触区与功能区之间的路径，还可在基板的围墙接触区与功能区之间设置连接过渡区，这样湿气则需要通过围墙接触区和连接过渡区之后，才能进入功能区，可进一步提升支架的防潮性能。本实施例中，连接过渡区也可为斜面，弧形面，或为组合面，该组合面也可包括但不限于平面、斜面、弧形面中的至少两个的结合。
本实施例通过设置LED支架的正极基板和负极基板中的至少一个基板的功能区和围墙接触区不在一个平面上，且可选地，可设置功能区所在的平面高于围墙接触区所在的平面，或设置功能区所在的平面低于围墙接触区所在的平面，因此可以延长基板的围墙接触区与功能区之间的路径，也即延长湿气进入到功能区内的路径，从而提升LED支架以及利用该LED支架制得的LED的防潮性能。
实施例二：
为了便于理解，本实施例下面以几种绝缘隔离带上的绝缘凸起设置示例进行说明。
请参见图2-1所示，20为围墙体，21为正极基板，22为负极基板，23为绝缘隔离带，231为绝缘凸起，在图2-1所示的LED支架中，在绝缘隔离带23的左端设置了绝缘凸起231，该绝缘凸起231可为半球形，也可以为半圆饼形，且该绝缘凸起231横跨在正极基板和负极基板上，且可选地可同时与围墙体20接触；在一种示例中，绝缘凸起231、绝缘隔离带23以及围墙体20可以通过相同工艺形成，也可通过不同工艺形成，且在一种示例中可以三者可一体成型，例如可通过注塑一体成型。绝缘凸起231同时与至正极基板21和负极基板22以及围墙体20接触，从而使得绝缘隔离带受到的机械力部分传递至围墙体和至少一个基板上，最大程度上提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体20的接触面积，进而提升LED支架的气密性。
应当理解的是，在一些实施例中，绝缘凸起231可仅与位于其中一个基板之上，例如参见图2-2所示，在绝缘隔离带23的两端都设置有绝缘凸起231，且绝缘凸起231的形状、尺寸大小可相同，当然根据需求也可设置为不同，绝缘凸起231仅位于正极基板21上，当然也可设置一端的绝缘凸起231位于正极基板21上，另一端的绝缘凸起231位于负极基板22上。绝缘凸起231可同时与围墙体20接触，从而使得绝缘隔离带受到的机械力部分传递至围墙体和正极基板上，提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体20的接触面积，进而提升LED支架的气密性。
又例如，参见图2-3所示，其与图2-2所示的LED支架相比，区别在于绝缘隔离带23的两端都设置有绝缘凸起231，且绝缘凸起231的形状、尺寸大小相同，绝缘凸起231横跨于正极基板21和负极基板22上。绝缘凸起231可同时与围墙体20接触，从而使得绝缘隔离带受到的机械力部分传递至围墙体、正极基板和负极基板上，提升LED支架的整体强度、可靠性以及防潮性能，又提升与正极基板21、负极基板22和围墙体20的接触面积，进而提升LED支架的气密性。
又例如，参见图2-4所示，其与图2-3所示的LED支架相比，区别在于绝缘隔离带23的两端都设置有绝缘凸起231，且绝缘凸起231都为横截面为矩形的凸起结构，绝缘凸起231横跨于正极基板21和负极基板22上。绝缘凸起231可同时与围墙体20接触，使得绝缘隔离带受到的机械力部分传递至围墙体、正极基板和负极基板上，提升LED支架的整体强度、可靠性以及防潮性能。
又例如，参见图2-5所示，其与图2-3所示的LED支架相比，区别在于绝缘隔离带23的两端都设置有绝缘凸起231，且绝缘凸起231都为横截面为非半圆形的弧形面，绝缘凸起231也横跨于正极基板21和负极基板22上。绝缘凸起231可同时与围墙体20接触，使得绝缘隔离带受到的机械力部分传递至围墙体、正极基板和负极基板上，提升LED支架的整体强度、可靠性以及防潮性能；另外，应当理解的是，在本实施例中，在满足LED支架出光效率的前提下，可以在绝缘凸起高度、宽度、长度方向上尽可能大的延伸，以尽可能提升强度和防潮性能。例如参见图2-6所示，绝缘凸起231则是在长度方向上尽可能长的向正极基板21方向延伸，使得绝缘凸起于围墙体20和基板的接触面积增加。
在本实施例的其他实施例中，绝缘凸起231也可为非规则形状，例如，其中一种示例的绝缘凸起231为非规则形状的凸起，其也横跨于正极基板21和负极基板22上。绝缘凸起231可同时与围墙体20接触，使得绝缘隔离带受到的机械力部分传递至围墙体、正极基板和负极基板上，提升LED支架的整体强度、可靠性以及防潮性能。
在本实施例的其他示例中，绝缘隔离带23的两端都设置绝缘凸起231时，两端的绝缘凸起231形状和尺寸也可设置为不同。例如参见图2-8所示，在绝缘隔离带的左端设置的绝缘凸起231为半圆球形或半圆饼形，在右端设置的绝缘凸起则为六面体。
可见，本实施例提供的在绝缘隔离带正面至少一端上设置的绝缘凸起可同时与至少一个基板或围墙体接触，既能增加绝缘隔离带在支架中所占用的整体分量，提升绝缘隔离带的整体强度，同时又可使得绝缘隔离带受到的机械力部分传递至围墙体和至少一个基板上，最大程度上提升LED支架的整体强度、可靠性以及防潮性能。
实施例三：
参见图1-1至图1-2所示，现有LED支架中，正极基板与负极基板之间的绝缘隔离带是垂直支架长边，与正极基板和负极基板平行设置的，且与正极基板与负极基板平行；且绝缘隔离带是比较脆弱的绝缘材质，再加上绝缘隔离带的宽度较窄，导致绝缘隔离带处容易发生断裂，降低了LED支架的整体强度和可靠性。
针对该问题，本实施例中还提供了一种具有新型结构的LED支架，该LED支架的绝缘隔离带横截面轮廓相对的两条长边为弧形边，或为具有至少一处弯曲的曲线边，或为具有至少一处弯折的折线边，或为与负极基板的短边之间的夹角大于等于10°，小于90°的斜边，这样当隔离带受力时，可以将所受的机械力传递一部分给正极基板、负极基板和围墙体上，因此可以增加绝缘隔离带的强度。
可选地，本实施例中绝缘隔离带的横截面轮廓相对的两条长边可以平行，也可以设置为不平行，具体可以根据需求灵活设定；为了便于理解，本实施例下面分别以平行设置和非平行设置两种示例进行说明。
平行设置示例：
参见图3-1所示，其中30为围墙体， 31为正极基板，32为负极基板，33为绝缘隔离区。在图3-1中，虚线为负极基板32的短边。在图3-1中，绝缘隔离带33横截面轮廓相对的两条长边为与负极基板的短边之间的夹角大于等于10°，小于90°的斜边，也即图3-1中的夹角A大于等于10°，小于90°，该夹角的取值可根据具体应用场景的强度需求、绝缘隔离带所采用的材质、形成工艺等中的至少一种灵活设置。例如一种示例中，夹角A的取值可为75°至85°，例如具体取值为75°，78°，80°，83°,85°等，这样当绝缘隔离带33受到机械力时，可将受到的一部分机械力传递至正极基板31、负极基板32和围墙体30上，从而提升绝缘隔离带33的强度，进而提升LED支架的整体强度和可靠性。
本实施例中绝缘隔离带33横截面轮廓相对的两条长边除了可为斜边外，还可为弧形边。例如，一种设置参见图3-2所示，绝缘隔离带33横截面轮廓相对的两条长边为相互平行的两条弧形边，弧形边的设置也可使得绝缘隔离带33受到机械力时，将受到的一部分机械力传递至正极基板31、负极基板32和围墙体30上，提升绝缘隔离带33的强度。
本实施例中绝缘隔离带33横截面轮廓相对的两条长边除了可为斜边和弧形边外，还可为曲线边。例如，一种设置参见图3-3所示，绝缘隔离带33横截面轮廓相对的两条长边为相互平行的两曲线边，曲线边的设置也可使得绝缘隔离带33受到机械力时，将受到的一部分机械力传递至正极基板31、负极基板32和围墙体30上，提升绝缘隔离带33的强度。本实施例中的曲线边除了弯曲处的数量可以灵活设置，例如除了图3-3所示的曲线边外，还可为图3-5所示的曲线边，当然也可为其他形式的曲线边。
本实施例中绝缘隔离带33横截面轮廓相对的两条长边除了可为斜边外、弧形边外和曲线边外，还可为具有至少一处弯折的折线边。例如，一种设置参见图3-4所示，绝缘隔离带33横截面轮廓相对的两条长边为相互平行的两折线边，折线边的设置也可使得绝缘隔离带33受到机械力时，将受到的一部分机械力传递至正极基板31、负极基板32和围墙体30上，提升绝缘隔离带33的强度。本实施例中的折线边除了弯折处的数量可以灵活设置，例如除了图3-4所示的折线边外，还可为图3-6所示的折线边，当然也可为其他形式的折线边。
非平行设置示例：
参见图4-1所示，其中40为围墙体， 41为正极基板，42为负极基板，43为绝缘隔离区。在图4-1中，绝缘隔离带43横截面轮廓相对的两条长边为与负极基板的短边之间的夹角大于等于10°，小于90°的斜边，这两条斜边之间并不平行，这样当绝缘隔离带43受到机械力时，可将受到的一部分机械力传递至正极基板41、负极基板42和围墙体40上，从而提升绝缘隔离带43的强度，进而提升LED支架的整体强度和可靠性。
本实施例中绝缘隔离带43横截面轮廓相对的两条长边除了可为斜边外，还可为弧形边。例如，一种设置参见图4-2所示，绝缘隔离带43横截面轮廓相对的两条长边为两条非平行的弧形边，非平行的弧形边的设置也可使得绝缘隔离带43受到机械力时，将受到的一部分机械力传递至正极基板41、负极基板42和围墙体40上，提升绝缘隔离带43的强度。
本实施例中绝缘隔离带43横截面轮廓相对的两条长边除了可为斜边和弧形边外，还可为曲线边。例如，一种设置参见图4-3所示，绝缘隔离带43横截面轮廓相对的两条长边为两条非平行曲线边，两条非平行曲线边的设置也可使得绝缘隔离带43受到机械力时，将受到的一部分机械力传递至正极基板41、负极基板42和围墙体40上，提升绝缘隔离带43的强度。
本实施例中绝缘隔离带43横截面轮廓相对的两条长边除了可为斜边外、弧形边外和曲线边外，还可为具有至少一处弯折的折线边。例如，一种设置参见图4-4所示，绝缘隔离带43横截面轮廓相对的两条长边为两条非平行折线边，两条非平行折线边的设置也可使得绝缘隔离带43受到机械力时，将受到的一部分机械力传递至正极基板41、负极基板42和围墙体40上，提升绝缘隔离带43的强度。
本实施例中将绝缘隔离带横截面轮廓相对的两条长边设置为弧形边，或曲线边，或折线边，或为与负极基板的短边之间的夹角大于等于10°，小于90°的斜边，当隔离带受力时，可以将所受的机械力传递一部分给正极基板和/或负极基板，因此可以增加绝缘隔离带的强度，提升LED支架以及利用该支架制得的LED的整体强度和可靠性。
实施例四：
应当理解的是，本实施例中也可结合上述实施例三中的绝缘隔离带与上述实施例一或二中的绝缘凸起结构，以双重增加绝缘隔离带的强度，进而提升LED支架整体的强度，并可同时增加绝缘隔离带与基板和/或围墙体的接触面积，提升LED支架的防潮性能。为了便于理解，本实施例下面仍分别以绝缘隔离带平行设置和非平行设置结合绝缘凸起的两种示例进行说明。
平行设置+绝缘凸起示例：
参见图5-1所示，其中50为围墙体， 51为正极基板，52为负极基板，53为绝缘隔离区，532为绝缘凸起。在图5-1中，在图5-1中，绝缘隔离带53横截面轮廓相对的两条长边为与正极基板正面上的水平线的夹角大于0°，小于等于45°的两条平行斜边，这样当绝缘隔离带53受到机械力时，可将受到的一部分机械力传递至正极基板51、负极基板52和围墙体50上，从而提升绝缘隔离带53的强度，进而提升LED支架的整体强度和可靠性；同时，在绝缘隔离带53的两端都设置有绝缘凸起531，绝缘凸起531横跨于正极基板51和负极基板52上；且可选地绝缘凸起531可同时与围墙体50接触，从而使得绝缘隔离带53受到的机械力部分传递至围墙体50、正极基板51和负极基板52上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体50的接触面积，进一步提升LED支架的气密性。
本实施例中绝缘隔离带53横截面轮廓相对的两条长边除了可为斜边外，还可为弧形边。例如，一种设置参见图5-2所示，绝缘隔离带53横截面轮廓相对的两条长边为相互平行的两条弧形边，弧形边的设置也可使得绝缘隔离带53受到机械力时，将受到的一部分机械力传递至正极基板51、负极基板52和围墙体50上，提升绝缘隔离带53的强度。同时，在绝缘隔离带53的两端也都设置有绝缘凸起531，绝缘凸起531横跨于正极基板51和负极基板52上；且可选地绝缘凸起531与围墙体50接触，从而使得绝缘隔离带53受到的机械力部分传递至围墙体50、正极基板51和负极基板52上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体50的接触面积，进一步提升LED支架的气密性。
本实施例中绝缘隔离带53横截面轮廓相对的两条长边除了可为斜边和弧形边外，还可为曲线边。例如，一种设置参见图5-3所示，绝缘隔离带53横截面轮廓相对的两条长边为相互平行的两曲线边，曲线边的设置也可使得绝缘隔离带53受到机械力时，将受到的一部分机械力传递至正极基板51、负极基板52和围墙体50上，提升绝缘隔离带53的强度。同时，在绝缘隔离带53的两端也都设置有绝缘凸起531，绝缘凸起531横跨于正极基板51和负极基板52上；且绝缘凸起531与围墙体50接触，从而使得绝缘隔离带53受到的机械力部分传递至围墙体50、正极基板51和负极基板52上，进一步提升LED支架的整体强度、可靠性以及防潮性能。
本实施例中绝缘隔离带53横截面轮廓相对的两条长边除了可为斜边外、弧形边外和曲线边外，还可为具有至少一处弯折的折线边。例如，一种设置参见图5-4所示，绝缘隔离带53横截面轮廓相对的两条长边为相互平行的两折线边，折线边的设置也可使得绝缘隔离带53受到机械力时，将受到的一部分机械力传递至正极基板51、负极基板52和围墙体50上，提升绝缘隔离带53的强度。同时，在绝缘隔离带53的两端也都设置有绝缘凸起531，绝缘凸起531横跨于正极基板51和负极基板52上；且绝缘凸起531与围墙体50接触，从而使得绝缘隔离带53受到的机械力部分传递至围墙体50、正极基板51和负极基板52上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体50的接触面积，进一步提升LED支架的气密性。
非平行设置示例：
参见图6-1所示，其中60为围墙体， 61为正极基板，62为负极基板，63为绝缘隔离区，631为绝缘凸起。在图6-1中，绝缘隔离带63横截面轮廓相对的两条长边为与正极基板正面上的水平线的夹角大于0°，小于等于45°的两条斜边，这两条斜边之间并不平行，这样当绝缘隔离带63受到机械力时，可将受到的一部分机械力传递至正极基板61和负极基板62，从而提升绝缘隔离带63的强度，进而提升LED支架的整体强度和可靠性；同时，在绝缘隔离带63的两端也都设置有绝缘凸起631，绝缘凸起631横跨于正极基板61和负极基板62上；且绝缘凸起631与围墙体60接触，从而使得绝缘隔离带63受到的机械力部分传递至围墙体60、正极基板61和负极基板62上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体60的接触面积，进一步提升LED支架的气密性。
本实施例中绝缘隔离带63横截面轮廓相对的两条长边除了可为斜边外，还可为弧形边。例如，一种设置参见图6-2所示，绝缘隔离带63横截面轮廓相对的两条长边为两条非平行的弧形边，非平行的弧形边的设置也可使得绝缘隔离带63受到机械力时，将受到的一部分机械力传递至正极基板61和负极基板62，提升绝缘隔离带63的强度，同时，在绝缘隔离带63的两端也都设置有绝缘凸起631，绝缘凸起631横跨于正极基板61和负极基板62上；且绝缘凸起631与围墙体60接触，从而使得绝缘隔离带63受到的机械力部分传递至围墙体60、正极基板61和负极基板62上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体60的接触面积，进一步提升LED支架的气密性。
本实施例中绝缘隔离带63横截面轮廓相对的两条长边除了可为斜边和弧形边外，还可为曲线边。例如，一种设置参见图6-3所示，绝缘隔离带63横截面轮廓相对的两条长边为两条非平行曲线边，两条非平行曲线边的设置也可使得绝缘隔离带63受到机械力时，将受到的一部分机械力传递至正极基板61和负极基板62，提升绝缘隔离带63的强度；同时，在绝缘隔离带63的两端也都设置有绝缘凸起631，绝缘凸起631横跨于正极基板61和负极基板62上；且绝缘凸起631与围墙体60接触，从而使得绝缘隔离带63受到的机械力部分传递至围墙体60、正极基板61和负极基板62上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体60的接触面积，进一步提升LED支架的气密性。
本实施例中绝缘隔离带63横截面轮廓相对的两条长边除了可为斜边外、弧形边外和曲线边外，还可为具有至少一处弯折的折线边。例如，一种设置参见图6-4所示，绝缘隔离带63横截面轮廓相对的两条长边为两条非平行折线边，两条非平行折线边的设置也可使得绝缘隔离带63受到机械力时，将受到的一部分机械力传递至正极基板61和负极基板62，提升绝缘隔离带63的强度；同时，在绝缘隔离带63的两端也都设置有绝缘凸起631，绝缘凸起631横跨于正极基板61和负极基板62上；且绝缘凸起631与围墙体60接触，从而使得绝缘隔离带63受到的机械力部分传递至围墙体60、正极基板61和负极基板62上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体60的接触面积，进一步提升LED支架的气密性。
本实施例中将绝缘隔离带横截面轮廓相对的两条长边设置为弧形边，或曲线边，或折线边，或为与正极基板正面上的水平线的夹角大于0°，小于等于64°的斜边，同时，在绝缘隔离带的两端也都设置有绝缘凸起，绝缘凸起横跨于正极基板和负极基板上；且绝缘凸起与围墙体接触；从而使得绝缘隔离带受到的机械力部分传递至围墙体、正极基板和负极基板上，进一步提升LED支架的整体强度、可靠性以及防潮性能，又提升与基板和围墙体的接触面积，进一步提升LED支架的气密性。
实施例五：
为了便于理解，本实施例以基板上的围墙接触区与功能区直接连接，且功能区位于围墙接触区之上为示例进行说明。
在图7-1至图7-4中，其中70为围墙体，71为基板（可能为正极基板和/或负极基板），711为功能区，712为围墙接触区；731为绝缘隔离带两端设置的绝缘凸起，应当理解的是绝缘凸起的具体设置方式可参考上述各实施例所示的方式，并不限于本实施例图中所示的方式。
请参见图7-1所示，该图所示为一种基板上的围墙接触区与功能区直接连接的示意图，在图7-1中，围墙接触区712为斜面，功能区711为位于围墙接触区712的平面，当然根据需求功能区711也可设置为非平面。围墙接触区712与功能区711之间的路径相对于现有围墙接触区与功能区设置于同一平面的路径明显加长了，因此可以加长湿气进入功能区的路径，进而提升支架的防潮性能，提升利用该支架制得的LED灯珠或其他产品的可靠性。
在一些示例中，围墙接触区712也可不为斜面，而为其他类型的面。例如，参见图7-2所示，该图中围墙接触区712则为弧面，且该弧面向基板71的外侧凸出的凸弧面，图7-2所示的凸弧面的设置相对于图7-1所示的斜面，可以进一步延长湿气进入功能区的路径，因此可进一步提升防潮效果。
在一些示例中，围墙接触区712为弧面时，除了可为图7-2所示的凸弧面外，也可为其他类型的弧面。例如参见图7-3所示，其为向基板71内侧凹的内弧面，其相对于图7-1所示的斜面，也可以进一步延长湿气进入功能区的路径，因此可进一步提升防潮效果。
当然，应当理解的是，本实施例中围墙接触区712除了可为斜面或弧面外，根据需求也可设置为其他类型的面，且其具体可为规则面，也可为非规则面。例如，参见图7-4所示，围墙接触区712为曲形面，其相对于图7-1所示的斜面，也可以进一步延长湿气进入功能区的路径，因此可进一步提升防潮效果。
另外，应当理解的是，图7-1至图7-4中相对两侧的围墙接触区712可设置为相同的面，也可设置为不同的面，具体可根据应用场景灵活设定。
在一些示例中，上述围墙接触区712的形成工艺可以灵活选择，例如包括但不限于蚀刻、切割，形成方式简单且成本低，效率高，可在保证支架制作成本和效率的同时，提升LED支架的防潮性能。
实施例六：
为了便于理解，本实施例以基板上的围墙接触区与功能区之间具有连接过渡区，且功能区位于围墙接触区之上为示例进行说明。
可选地，在本实施例中，功能区所在的平面可高于围墙接触区所在的平面，且二者之间的具体高度差可以根据应用场景灵活设定，例如功能区所在的平面与围墙接触区所在的平面的高度差可设置为大于0，小于等于反射腔深度的四分之一；当然根据具体需求也可设置为其他值，例如设置为高度差可设置为大于0，小于等于反射腔深度的五分之一，六分之一或三分之一等。
可选地，在本实施例中，围墙接触区与功能区之间的连接过渡区也可至少部分区域与围墙体接触，从而可以提升基板与围墙体的接触面积，提升支架的强度，同时又进一步延长湿气进入功能区的路径。
本实施例中的围墙接触区与连接过渡区可以位于同一平面上，也可位于不同的平面上，且二者的类型可以相同，也可不同。且应当理解的是，本实施例中围墙接触区也可为实施例二所示的几种类型的面。
在图8-1至图8-8中，其中80为围墙体，81为基板（可能为正极基板和/或负极基板），811为功能区，812为围墙接触区；831为绝缘隔离带两端设置的绝缘凸起，应当理解的是绝缘凸起的具体设置方式可参考上述各实施例所示的方式，并不限于本实施例图中所示的方式。
例如，一种示例中，参见图8-1所示，围墙接触区812的区域为基板正面与围墙体80直接接触的斜面区域，连接过渡区813为基板正面与围墙体80未接触的斜面区域，连接过渡区813与围墙接触区812组成一个斜面，也即二者位于同一面上。通过连接过渡区813的设置可进一步增加围墙接触区812与功能区811之间的路径，提升支架的防潮性能。
又例如，一种示例中，参见图8-2所示，围墙接触区812的区域为基板正面与围墙体80直接接触的平面区域，连接过渡区813为基板正面连接围墙接触区812与功能区811的斜面区域，在图8-2所示的示例中，连接过渡区813也有一部分与围墙体80直接接触，因此在进一步增加围墙接触区812与功能区811之间的路径的同时，还可提升支架的强度，也即可同时提升支架的防潮性能和强度。
又例如，一种示例中，参见图8-3所示，围墙接触区812的区域为基板正面与围墙体80直接接触的平面区域，连接过渡区813为基板正面连接围墙接触区812与功能区811的弧面区域，该弧面区域为向基板81外侧凸起的凸弧面区域；在图8-3所示的示例中，连接过渡区813也有一部分与围墙体80直接接触，因此也可在进一步增加围墙接触区812与功能区811之间的路径以提升防潮性能的同时，可提升支架的强度。当然，本实施例中的连接过渡区813除了可为凸弧面外，还可为向基板81内侧凹的凹弧面，例如参见图8-4所示，该图所示则为一种示例的连接过渡区813为凹弧面的情况，其也可在进一步增加围墙接触区812与功能区811之间的路径以提升防潮性能的同时，可提升支架的强度。
另外，应当理解的是，本实施例中基板正面相对两侧的连接过渡区813也可设置为相同类型的面，或设置为不同类型的面。例如参见图8-5所示，在基板一侧的连接过渡区813设置为凸弧面，相对的另一侧的连接过渡区813则设置为凹弧面，具体设置方式可以根据具体应用场景和采用的工艺灵活确定。
本实施例中连接过渡区也可为组合面，该组合面可包括但不限于平面、斜面、弧形面中的至少两个的结合。
例如，参见图8-6所示，围墙接触区812的区域为基板正面与围墙体80直接接触的平面区域，连接过渡区813为基板正面连接围墙接触区812与功能区811的斜面与弧形面结合的组合面；又例如，参见图8-7所示，其与图8-6所示支架的区别在于，连接过渡区813为通过两个斜面以及连接两个斜面的平面结合组成；又例如，参见图8-8所示，其与图8-6和图8-7所示支架的区别在于，连接过渡区813为通过依次连接的斜面、平面和弧形面结合组成。可见，当本实施例中的连接过渡区813为组合面时，具体的组合方式可以灵活设定。且应当理解的是，本实施例中的围墙接触区812也可为组合面，且可为与连接过渡区813相同类型的组合面，也可为与连接过渡区813不同类型的组合面。
本实施例在基板上的围墙接触区与功能区之间进一步设置连接过渡区，可进一步增加围墙接触区812与功能区811之间的路径以提升防潮性能；且可选地，还可设置连接过渡区的至少部分与围墙体接触，以同时提升基板与围墙体的接触面积，进而提升支架的强度。
实施例七：
为了便于理解，本实施例以基板上的围墙接触区与功能区之间具有连接过渡区，且功能区位于围墙接触区之下为示例进行说明。
在本实施例的一种示例中，可设置正极基板和负极基板的功能区所在的平面都低于围墙接触区所在的平面。
在本实施例的一种示例中，正极基板和负极基板的功能区位于围墙体所形成的反射腔的底部；功能区所在的平面与围墙接触区所在的平面的高度差的值可以灵活设定，例如该高度差可设置为大于0，小于等于围墙接触区所形成的反射腔深度的四分之一；当然根据具体需求也可设置为其他值，例如设置为高度差可设置为大于0，小于等于反射腔深度的五分之一，六分之一或三分之一等。
在本实施例中，连接过渡区可为斜面，弧形面，或为组合面，该组合面为包括平面、斜面、弧形面中的至少两个的结合。
且可选地，连接过渡区至少部分区域也可与围墙体接触，以同时提升基板与围墙体的接触面积，进而提升支架的强度。
本实施例中的围墙接触区与连接过渡区类型和/或形成时采用的工艺可以相同，也可不同。且应当理解的是，本实施例中围墙接触区也可为实施例二所示的几种类型的面。
在图9-1至图9-9中，其中90为围墙体，91为基板（可能为正极基板和/或负极基板），911为功能区，912为围墙接触区；931为绝缘隔离带两端设置的绝缘凸起，应当理解的是绝缘凸起的具体设置方式可参考上述各实施例所示的方式，并不限于本实施例图中所示的方式。
例如，一种示例中，参见图9-1所示，围墙接触区912的区域为基板正面与围墙体90直接接触的平面区域，连接过渡区913为连接围墙接触区912和功能区11的斜面区域。通过连接过渡区913的设置可进一步增加围墙接触区912与功能区911之间的路径，提升支架的防潮性能。
又例如，一种示例中，参见图9-2所示，围墙接触区912的区域为基板正面与围墙体90直接接触的平面区域，连接过渡区913为连接围墙接触区912和功能区11的弧形面区域，在图9-2所示的示例中，弧形面区域为向基板91背面下凹的凹弧面区域，凹弧面区域过渡连接区相对斜面过渡连接区可进一步增加围墙接触区912与功能区911之间的路径，因此可进一步提升支架的防潮性能和强度。本实施例中连接过渡区913为连接围墙接触区912和功能区11的弧形面区域时，还可为向基板91正面上方凸起的凸弧面区域，参见图9-4所示，其相对斜面过渡连接区也可进一步增加围墙接触区912与功能区911之间的路径，也可进一步提升支架的防潮性能和强度。
本实施例中连接过渡区也可为组合面，该组合面可包括但不限于平面、斜面、弧形面中的至少两个的结合。
又例如，一种示例中，参见图9-3所示，围墙接触区912的区域为基板正面与围墙体90直接接触的平面区域，连接过渡区913为基板正面连接围墙接触区912与功能区911的平面区域和斜面区域结合组成的组合面，该组合面也可在进一步增加围墙接触区912与功能区911之间的路径以提升防潮性能。
例如，参见图9-5所示，围墙接触区912的区域为基板正面与围墙体90直接接触的平面区域，连接过渡区913为基板正面连接围墙接触区912与功能区911的平面与弧形面结合的组合面，且该弧形面为向基板91正面上方凸起的凸弧面区域。又例如，参见图9-6所示，其与图9-5所示支架的区别在于，连接过渡区913为通过平面以及凹弧面区域组成，该组合面也可在进一步增加围墙接触区912与功能区911之间的路径以提升防潮性能。
另外，应当理解的是，本实施例中基板正面相对两侧的连接过渡区913也可设置为相同类型的面，或设置为不同类型的面。例如参见图9-8所示，在基板一侧的连接过渡区913设置为平面与斜面结合的组合面，相对的另一侧的连接过渡区913则为平面与凹弧面结合的组合面，具体设置方式可以根据具体应用场景和采用的工艺灵活确定。
另外，本实施例在基板上的围墙接触区与功能区之间进一步设置连接过渡区可至少部分与加围墙接触区912直接接触，以同时提升基板与围墙体的接触面积。例如参见图9-7所示，由斜面和平面结合的组合面913完全与围墙接触区912直接接触，可进一步提升基板与围墙体的接触面积，进而提升支架的强度；同时可进一步提升支架的气密性，以进一步提升防潮性能。
实施例八：
本实施例提供了一种LED，包括如上各实施例所示的LED支架，还具有至少一颗LED芯片，该LED芯片设置于正极基板和/或负极基板上， LED芯片的正极引脚和负极引脚分别与正极基板和所述负极基板电连接，应当理解的是，本实施例中的LED芯片可以是倒装LED芯片，也可以正装LED芯片，且LED芯片的正极引脚和负极引脚分别与正极基板和负极基板实现电连接的方式包括但不限于：通过导电线材、导电胶或其他形式的导电材料实现。
应当理解的是，本实施例提供的LED的光照射出来、呈现给用户的颜色，可以根据实际需求和应用场景进行灵活设置。LED的光照射出来、呈现出的是何种颜色，可以通过但不限于以下因素灵活控制：LED芯片自身发出的光的颜色、LED是否包括有发光转换层、当LED包括有发光转换层时发光转换层的类型。
在本实施例的一种示例中，LED还可包括设置于LED芯片（在LED芯片之上设置有发光转换胶层时，则设置于发光转换胶层之上）之上的透镜胶层或扩散胶层。
应当理解的是， 在一种示例中，发光转换胶层可以是包含荧光粉的荧光胶层，也可以是包含量子点光致材料的胶体，或者其他可实现发光转换的发光转换胶或膜，且根据需要也可以包括扩散粉或硅粉等；本实施例中在LED芯片上形成发光转换胶层、透镜胶层或扩散胶层的方式包括但不限于点胶、模压、喷涂、粘贴等。
例如，发光转换层可包括荧光粉胶层、荧光膜、或量子点QD膜；荧光粉胶层、荧光膜可采用无机荧光粉制作的，可以是掺杂了稀土元素的无机荧光粉，其中，无机荧光粉包括但不限于硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。
又例如，量子点QD膜可采用量子点荧光粉制作；量子点荧光粉包括但不限于BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x) 、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。
在本实施例中，LED芯片自身发出的光的类型可以是肉眼可见的可见光，也可以是肉眼不可见的紫外光、红外光；当LED芯片自身发出的光的类型是肉眼不可见的紫外光、红外光时，可在LED芯片之上设置发光转换层，以将肉眼不可见光转换成肉眼可见光，使得LED照射出来的光是用户可见的光。例如，当LED芯片自身发出的光是紫外光时，若想LED呈现用户可见的白光，则发光转换层可以是将红、绿、蓝荧光粉进行混合后制作成的。
本实施例还提供一种发光装置，该发光装置包括上述实施例所示例的LED。本实施例中的发光装置可为照明装置、光信号指示装置、补光装置或背光装置等。为照明装置时，具体可以为应用于各种领域的照明装置，例如日常生活中的台灯、日光灯、吸顶灯、筒灯、路灯、投射灯等等，又例如汽车中的远光灯、近光灯、氛围灯等，又例如医用中的手术灯、低电磁照明灯、各种医用仪器的照明灯，又例如应装饰领域照明中的各种彩灯、景观照明灯、广告灯等等；为光信号指示装置时，具体可以为应用于各种领域的光信号指示装置，例如交通领域的信号指示灯，通信领域中通信设备上的各种信号状态指示灯，车辆上的各种指示灯等；为补光装置时，可以为摄影领域的补光灯，例如闪光灯、补光灯，也可以为农业领域为植物补光的植物补光灯等；为背光装置时，可以为应用于各种背光领域的背光模组，例如可应用于显示器、电视机、手机等移动终端、广告机等设备上。     应当理解的是，上述应用仅仅是本实施例所示例的几种应用，应当理解的是LED的应用并不限于上述示例的几种领域。
 
以上内容是结合具体的实施方式对本发明实施例所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (18)

  1. 一种高强度LED支架，其特征在于， 包括正极基板、负极基板以及绝缘隔离带，所述绝缘隔离带位于所述正极基板和所述负极基板之间将二者绝缘隔离，所述LED支架还包括将所述正极基板、所述负极基板和所述绝缘隔离带围合在内围墙体，所述围墙体为绝缘的围墙体，所述正极基板和所述负极基板的正面具有功能区和与所述围墙体接触的围墙接触区；
    所述正极基板和所述负极基板中至少一个基板的所述功能区和所述围墙接触区不在一个平面上。
  2. 如权利要求1所述的高强度LED支架，其特征在于，所述正极基板的所述功能区和所述围墙接触区不在一个平面上，所述负极基板的所述功能区和所述围墙接触区也不在一个平面上。
  3. 如权利要求1所述的高强度LED支架，其特征在于，所述围墙接触区与所述功能区直接连接。
  4. 如权利要求1所述的高强度LED支架，其特征在于，所述正极基板和所述负极基板中至少一个基板的所述功能区和所述围墙接触区之间还具有连接过渡区。
  5. 如权利要求4所述的高强度LED支架，其特征在于，所述连接过渡区为斜面，弧形面，或为组合面，所述组合面为包括平面、斜面、弧形面中的至少两个的结合。
  6. 如权利要求1-5任一项所述的高强度LED支架，其特征在于，所述功能区所在的平面高于所述围墙接触区所在的平面。
  7. 如权利要求1-5任一项所述的高强度LED支架，其特征在于，所述功能区所在的平面低于所述围墙接触区所在的平面。
  8. 如权利要求1-5任一项所述的高强度LED支架，其特征在于，所述功能区所在的平面与所述围墙接触区所在的平面的高度差大于0，小于等于所述围墙体形成的反射腔之深度的四分之一。
  9. 如权利要求1-5任一项所述的高强度LED支架，其特征在于，所述绝缘隔离带正面至少一端设有绝缘凸起。
  10. 如权利要求9所述的高强度LED支架，其特征在于，所述绝缘隔离带正面相对的两端都设有绝缘凸起。
  11. 如权利要求9所述的高强度LED支架，其特征在于，所述绝缘凸起横跨于所述正极基板和/或所述负极基板的正面上。
  12. 如权利要求9所述的高强度LED支架，其特征在于，所述正极基板和所述负极基板的功能区位于所述围墙体形成的反射腔底部，所述绝缘凸起与所述反射腔的内侧面直接接触，且所述绝缘凸起的高度小于所述围墙体形成的反射腔之内侧面的高度。
  13. 如权利要求9所述的高强度LED支架，其特征在于，所述绝缘凸起与所述绝缘隔离带一体成型，和/或，所述绝缘凸起与所述绝缘隔离带的材质相同。
  14. 如权利要求9所述的高强度LED支架，其特征在于，所述绝缘凸起沿高度方向的纵截面之轮廓为弧形轮廓或为由上横边、下横边以及位于上横边和下横边之间的弧形组成的轮廓。
  15. 如权利要求1-5任一项所述的高强度LED支架，其特征在于，所述绝缘隔离带的横截面轮廓相对的两条长边为弧形边，或为具有至少一处弯曲的曲线边，或为具有至少一处弯折的折线边，或为与所述负基板的短边之间的夹角大于等于10 ，小于90 的斜边。
  16. 如权利要求15所述的高强度LED支架，其特征在于，所述绝缘隔离带的横截面轮廓相对的两条长边相互平行。
  17. 一种LED，其特征在于，包括如权利要求1-16任一项所述的高强度LED支架和至少一颗LED芯片，所述LED芯片设置于所述正极基板和/或所述负极基板上，所述LED芯片的正极引脚和负极引脚分别与所述正极基板和所述负极基板电连接。
  18. 一种发光装置，其特征在于，包括如权利要求17所述的LED，所述发光装置为照明装置、光信号指示装置、补光装置或背光装置。
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