WO2020042537A1 - 显示面板以及显示装置 - Google Patents

显示面板以及显示装置 Download PDF

Info

Publication number
WO2020042537A1
WO2020042537A1 PCT/CN2019/072959 CN2019072959W WO2020042537A1 WO 2020042537 A1 WO2020042537 A1 WO 2020042537A1 CN 2019072959 W CN2019072959 W CN 2019072959W WO 2020042537 A1 WO2020042537 A1 WO 2020042537A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
display panel
display
area
inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/072959
Other languages
English (en)
French (fr)
Inventor
王刚
李威龙
张露
韩珍珍
胡思明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Publication of WO2020042537A1 publication Critical patent/WO2020042537A1/zh
Priority to US16/814,042 priority Critical patent/US11289681B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the technical field of display devices, and in particular, to a display panel and a display device.
  • the market is no longer satisfied with the narrow bezel display effect of the left and right bezels, and more and more attention is paid to the narrow bezel display of the lower bezel.
  • the lower border region has a bonding region of an integrated circuit or a flexible circuit board, currently, a narrow border effect is mainly achieved by bending a non-display region of a display panel to the back of the display region.
  • the display panel needs to be bent near the display area to fully bend the non-display area to the back of the display area.
  • the embodiments of the present application provide a display panel and a display device.
  • the display panel can effectively block water vapor and prevent water vapor from entering the display area of the display panel.
  • an embodiment of the present application provides a display panel.
  • the display panel has a display area, a non-display area located outside the display area, and a line changing area provided between the display area and the non-display area.
  • the display panel includes an array substrate.
  • the array substrate includes a laminated flexible substrate, a first metal layer, an inorganic insulating layer, a second metal layer, and an organic flat layer; a light-emitting element; and a package for packaging the light-emitting element.
  • the package has an inorganic layer, an inorganic layer, and The inorganic insulating layer is in direct contact with the wire change area.
  • the first metal layer forms a first signal line under the inorganic insulating layer
  • the second metal layer forms a second signal line
  • the second signal line is disconnected in the display area to form a signal line.
  • the first segment and the second segment in the non-display area are electrically connected by a first signal line.
  • the inorganic insulating layer has a first through hole and a second through hole disposed at intervals. A part of the first section extends to the first through hole and is electrically connected to the first signal line. A portion extends to the second through hole and is electrically connected to the first signal line.
  • the first through hole and the second through hole are both straight holes.
  • the array substrate in the wire exchange area, includes an anode material on an inorganic insulating layer, and the inorganic layer covers the anode material.
  • the non-display area can be bent in an arc shape below the display area, and the line changing area extends along the axis of the arc shape.
  • the organic flat layer is cut to form a slot in the wire exchange area to expose the inorganic insulating layer, and the inorganic layer extends into the slot to directly contact the inorganic insulating layer.
  • the slot is a through slot extending along an arc-shaped axial direction.
  • the inorganic insulating layer further includes an organic layer disposed on the inorganic layer and an external inorganic layer disposed on the organic layer.
  • the display panel includes an array substrate, a light emitting element, and a package.
  • the display panel has a display area, a non-display area located outside the display area, and a line changing area provided between the display area and the non-display area.
  • the package has an inorganic layer.
  • the inorganic layer is in contact with the inorganic insulating layer included in the array substrate at the wire exchange area to form a packaging area. Since the inorganic layer and the inorganic insulating layer are both inorganic materials, the contact sealing effect of the two is good, the reliability and stability of the package is improved, and water vapor is effectively prevented from entering the display area.
  • an embodiment of the present application provides a display device, which includes the display panel according to the foregoing embodiment.
  • FIG. 1 is a schematic diagram of a front structure of a display panel according to an embodiment of the present application.
  • FIG. 2 is a partial cross-sectional structural diagram of a display panel according to an embodiment of the present application.
  • FIG. 3 is a partially enlarged view at A in FIG. 2; FIG.
  • FIG. 4 is a partial plan structural schematic view of a line changing area according to an embodiment of the present application.
  • the display panel 10 according to the embodiment of the present application is described in detail below with reference to FIGS. 1 to 4.
  • a display panel 10 has a display area 10 a and a non-display area 10 c.
  • the display area 10a of the display panel 10 has a function of emitting light and imaging, and can display a specific image in a use state.
  • the non-display area 10 c of the display panel 10 does not have a function of light emission imaging.
  • the non-display area 10c needs to be bent approximately 180 degrees and fit under the display area 10a.
  • the non-display area 10c is bent to form an arc structure.
  • a line changing area 10b is further provided between the display area 10a and the non-display area 10c.
  • the display panel 10 includes an array substrate 20, a light emitting element 30, and a package 60 for packaging the light emitting element 30.
  • the array substrate 20 of this embodiment includes a flexible substrate 200, a first metal layer 201, an inorganic insulating layer 202, a second metal layer 203, and an organic flat layer 204, which are stacked.
  • the flexible substrate 200 includes an organic base layer 200a and a barrier layer 200b. ⁇ Buffer layer 200c. These layer structures are well known to those skilled in the art and will not be described again.
  • An anode layer 40 and a cathode layer 50 are formed on opposite sides of the light emitting element 30 of this embodiment in the lamination direction.
  • the anode layer 40 is electrically connected to the second metal layer 203.
  • the package 60 of this embodiment includes an inorganic layer 601, an organic layer 602, and an external inorganic layer 603.
  • the inorganic layer 601, the organic layer 602, and the external inorganic layer 603 are stacked.
  • the package body 60 may include only one inorganic layer 601.
  • the inorganic layer 601 and the inorganic insulating layer 202 are in direct contact with each other at the wire exchange area 10b to form a packaging area.
  • the sealing area formed by the contact between the two is good in sealing performance, and can effectively prevent water vapor from entering the display area 10a through the sealing area.
  • the non-display area 10c can be bent in an arc shape to below the display area 10a.
  • the thread changing area 10b extends in the axial direction of the arc.
  • the display panel 10 as a whole has a rectangular structure having a predetermined length and width.
  • the display area 10a, the line change area 10b, and the non-display area 10c of the display panel 10 are distributed in the length direction X.
  • the organic flat layer 204 is disconnected to form a slot 204 a to expose the inorganic insulating layer 202. That is, the material of the organic flat layer 204 in the wire-changing region 10b is removed and the inorganic insulating layer 202 is exposed.
  • the inorganic layer 601 extends into the slot 204a and contacts the surface of the inorganic insulating layer 202 to form a packaging area.
  • the slot 204a of this embodiment is a through slot that is elongated and extends along an arc-shaped axial direction after the non-display area 10c is bent.
  • the slot 204 a on the organic flat layer 204 is a through slot extending along the width direction Y of the display panel 10.
  • a part of the first metal layer 201 is formed as the first signal line 201a, and another part is formed as the gate 201b.
  • the material of the first signal line 201a in this embodiment is copper.
  • the first signal line 201a and the gate 201b are made of the same material.
  • the first signal line 201a is disposed under the inorganic insulating layer 202.
  • the second metal layer 203 forms a plurality of second signal lines 2031. This is well known to those skilled in the art and will not be described again.
  • first through holes 202a and 202a are formed on the inorganic insulating layer 202 at intervals of the display area 10a near the wire change area 10b and the non-display area 10c near the wire change area 10b.
  • the second signal line 2031 is disconnected in the line changing area 10b to form a first segment 2031a in the display area 10a and a second segment 2031b in the non-display area 10c.
  • the number of the second signal lines 2031 formed by the second metal layer 203 is plural.
  • a part of the first segment 2031a of the second signal line 2031 extends to the first through hole to be electrically connected to the first signal line 201a, and a portion of the second segment 2031b of the second signal line 2031 extends to the second through hole and the first signal line 201a. Electrical connection.
  • the first through hole 202a and the second through hole 202b are both straight holes.
  • the array substrate 20 includes an anode layer 40 on the inorganic insulating layer 202, and the inorganic layer 601 is above the anode layer 40.
  • the first segment 2031a and the second segment 2031b of the second signal line 2031 are electrically connected by the first signal line 201a. This can avoid a short circuit between the adjacent two second signal lines 2031 through the anode layer 40. This is due to the array In the manufacturing process, the anode material may remain in the area of the inorganic insulating layer 202 corresponding to the wire-changing area 10b to form the anode layer 40, and the inorganic layer 601 covers the anode material.
  • the array substrate 20 further includes a thin film transistor.
  • the thin film transistor includes a semiconductor active layer 205 on a flexible substrate 200.
  • the semiconductor active layer includes a source region and a drain region formed by doping an N-type impurity ion or a P-type impurity ion.
  • the semiconductor active layer 205 can be formed by changing the amorphous silicon into polysilicon by crystallization of the amorphous silicon.
  • the array substrate 20 further includes a gate insulating layer 206 on the flexible substrate 200.
  • the source and drain are located on the gate insulating layer 206.
  • the source and drain are electrically connected (or combined) to the source and drain regions through the contact holes, respectively.
  • the contact hole is formed by selectively removing the gate insulating layer 206 and the inorganic insulating layer 202.
  • the display panel 10 includes an array substrate 20, a light emitting element 30, and a package 60.
  • the display panel 10 includes a display area 10a, a non-display area 10c located outside the display area 10a, and a line changing area 10b provided between the display area 10a and the non-display area 10c.
  • the package 60 includes an inorganic layer 601.
  • the inorganic layer 601 of the package body 60 is in contact with the inorganic insulating layer 202 included in the array substrate 20 at the wiring area 10b to form a package area. Since the inorganic layer 601 and the inorganic insulating layer 202 are both inorganic materials, the contact sealing effect of the two is good, and the reliability and stability of the package are improved.
  • the package body 60 and the array substrate 20 jointly package the light emitting element 30, the package body 60 can effectively prevent water vapor from entering the display area 10a of the display panel 10, thereby improving the display quality of the display area 10a, and at the same time, the display panel 10 is not easily located in the display area 10a Dark spots or bubbles appear.
  • the embodiment of the present application further provides a display device including the display panel 10 of the above embodiment. Since the display panel 10 of this embodiment has a stable and reliable packaging state, it is difficult for the display panel 10 to appear black spots or bubbles in the display area 10a, so that the display device of this embodiment has good display quality and durability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请涉及一种显示面板以及显示装置。显示面板具有显示区域、位于显示区域外的非显示区域以及设置于显示区域和非显示区域之间的换线区，显示面板包括：阵列基板，阵列基板包括层叠设置的柔性基底、第一金属层、无机绝缘层、第二金属层以及有机平坦层；发光元件；以及用于封装发光元件的封装体，封装体具有无机层，无机层和无机绝缘层在换线区直接接触。本申请实施例的显示面板能够有效阻挡水汽，避免水汽侵入显示面板的显示区域。

Description

显示面板以及显示装置
相关申请的交叉引用
本申请要求享有于2018年8月29日提交的名称为“显示面板以及显示装置”的中国专利申请201821406723.1的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示设备技术领域，特别是涉及一种显示面板以及显示装置。
背景技术
随着显示面板窄边框技术的发展，市场上已经不满足于左右边框的窄边框显示效果，越来越关注下边框的窄边框显示。由于下边框区域具有集成电路或柔性电路板的邦定区域，因此目前主要是通过将显示面板的非显示区域弯折至显示区域的背面来实现窄边框效果。然而，为了保证下边框和上边框达到相同的尺寸，显示面板需在临近显示区域的位置进行弯折，最大限度地将非显示区域完全弯折至显示区域的背面。
发明内容
本申请实施例提供一种显示面板以及显示装置。显示面板能够有效阻挡水汽，避免水汽侵入显示面板的显示区域。
一方面，本申请实施例提出了一种显示面板，显示面板具有显示区域、位于显示区域外的非显示区域以及设置于显示区域和非显示区域之间的换线区，显示面板包括：阵列基板，阵列基板包括层叠设置的柔性基底、第一金属层、无机绝缘层、第二金属层以及有机平坦层；发光元件；以及用于封装发光元件的封装体，封装体具有无机层，无机层和无机绝缘 层在换线区直接接触。
根据本申请实施例的一个方面，第一金属层形成处于无机绝缘层下方的第一信号线，第二金属层形成第二信号线，第二信号线在换线区断开形成显示区域内的第一段和非显示区域内的第二段，第一段和第二段通过第一信号线电连接。
根据本申请实施例的一个方面，无机绝缘层具有间隔设置的第一通孔和第二通孔，第一段的一部分延伸至第一通孔并与第一信号线电连接，第二段的一部分延伸至第二通孔并与第一信号线电连接。
根据本申请实施例的一个方面，第一通孔和第二通孔均为直孔。
根据本申请实施例的一个方面，在换线区内，阵列基板包括处于无机绝缘层上的阳极材料，无机层覆盖阳极材料。
根据本申请实施例的一个方面，非显示区域能够呈弧形弯折至显示区域的下方，换线区沿弧形的轴向延伸。
根据本申请实施例的一个方面，有机平坦层在换线区断开形成开槽，以暴露无机绝缘层，无机层延伸至开槽内与无机绝缘层直接接触。
根据本申请实施例的一个方面，开槽为沿弧形的轴向延伸的通槽。
根据本申请实施例的一个方面，无机绝缘层还包括设置于无机层上的有机层以及设置于有机层上的外部无机层。
本申请实施例的显示面板，其包括阵列基板、发光元件和封装体。显示面板具有显示区域、位于显示区域外的非显示区域以及设置于显示区域和非显示区域之间的换线区。封装体具有无机层。无机层在换线区与阵列基板所包括的无机绝缘层接触以形成封装区域。由于无机层与无机绝缘层均为无机材料，因此两者接触密封效果好，提升了封装可靠性和稳定性，有效阻挡水汽侵入显示区域。
另一个方面，本申请实施例提供一种显示装置，其包括如上述实施例的显示面板。
附图说明
下面将通过参考附图来描述本申请示例性实施例的特征、优点和技术 效果。
图1是本申请实施例的显示面板的正面结构示意图；
图2是本申请实施例的显示面板的局部剖视结构示意图；
图3是图2中A处的局部放大图；
图4是本申请实施例的换线区的局部俯视结构示意图。
具体实施方式
下面结合附图和实施例对本申请的实施方式作进一步详细描述。以下实施例的详细描述和附图用于示例性地说明本申请的原理，但不能用来限制本申请的范围，即本申请不限于所描述的实施例。
在本申请的描述中，需要说明的是，除非另有说明，“多个”的含义是两个或两个以上；术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可视具体情况理解上述术语在本申请中的具体含义。
为了更好地理解本申请，下面结合图1至图4对本申请实施例的显示面板10进行详细描述。
参见图1示意性地显示，本申请实施例的显示面板10具有显示区域10a和非显示区域10c。显示面板10的显示区域10a具有发光成像的功能，在使用状态下能够呈现特定的图像。显示面板10的非显示区域10c不具有发光成像的功能。为了实现全面屏，需要将非显示区域10c弯折将近180度并贴合在显示区域10a的下方。非显示区域10c弯折后形成弧形 结构。为便于将非显示区域10c弯折，在显示区域10a和非显示区域10c之间还设有换线区10b。
参见图2和图3示意性地显示，本申请实施例的显示面板10包括阵列基板20、发光元件30以及用于封装发光元件30的封装体60。本实施例的阵列基板20包括层叠设置的柔性基底200、第一金属层201、无机绝缘层202、第二金属层203以及有机平坦层204，其中，柔性基底200包括有机基层200a、阻挡层200b和缓冲层200c。这些层结构是本领域的技术人员熟知的，不再赘述。在层叠方向上，本实施例的发光元件30相对两侧形成有阳极层40和阴极层50。阳极层40与第二金属层203电连接。本实施例的封装体60包括无机层601、有机层602以及外部无机层603。无机层601、有机层602以及外部无机层603层叠设置。可选地，封装体60也可以仅包括一层无机层601。
本实施例中，无机层601与无机绝缘层202在换线区10b直接接触形成封装区域。这样，由于无机层601与无机绝缘层202均为无机材料，因此两者接触形成的封装区域密封性好，能够有效阻挡水汽通过该封装区域侵入显示区域10a。
在本实施例中，非显示区域10c能够呈弧形弯折至显示区域10a的下方。换线区10b沿该弧形的轴向延伸。在一个示例中，显示面板10整体为具有预定长度和宽度的矩形结构。显示面板10的显示区域10a、换线区10b和非显示区域10c在长度方向X上分布。
在一个实施例中，参见图2或图3所示，在换线区10b，有机平坦层204断开以形成开槽204a，以暴露无机绝缘层202。也即，在换线区10b内的有机平坦层204的材料被移除并暴露出无机绝缘层202。在换线区10b，无机层601延伸至开槽204a内并与无机绝缘层202的表面接触形成封装区域。
本实施例的开槽204a呈长条状，沿非显示区域10c弯折后的弧形的轴向延伸的通槽。在一个示例中，有机平坦层204上的开槽204a为沿显示面板10的宽度方向Y延伸的通槽。
在本实施例中，第一金属层201的部分形成为第一信号线201a，另一 部分形成栅极201b。在一个实施例中，本实施例的第一信号线201a的材质为铜。第一信号线201a与栅极201b材质相同。第一信号线201a设置于无机绝缘层202的下方。第二金属层203形成多条第二信号线2031。这是本领域的技术人员公知的，不再赘述。
继续参见图2和图3，在显示区域10a临近换线区10b的位置以及在非显示区域10c临近换线区10b的位置，在无机绝缘层202上形成有间隔设置的第一通孔202a和第二通孔202b。第二信号线2031在换线区10b断开形成显示区域10a内的第一段2031a和非显示区域10c内的第二段2031b。第二金属层203形成的第二信号线2031的数量为多条。第二信号线2031的第一段2031a的一部分延伸至第一通孔与第一信号线201a电连接，第二信号线2031的第二段2031b一部分延伸至第二通孔与第一信号线201a电连接。可选地，第一通孔202a和第二通孔202b均为直孔。
在换线区10b内，阵列基板20包括处于无机绝缘层202上的阳极层40，而无机层601处于阳极层40上方。第二信号线2031的第一段2031a和第二段2031b通过第一信号线201a电连接的方式，这可以避免相邻两条第二信号线2031之间通过阳极层40短路，这是由于阵列制程中，在无机绝缘层202的对应于换线区10b的区域可能会残留阳极材料而形成阳极层40，无机层601覆盖阳极材料。
在一个实施例中，阵列基板20还包括薄膜晶体管。薄膜晶体管包括位于柔性基底200上的半导体有源层205。半导体有源层包括通过掺杂N型杂质离子或P型杂质离子而形成的源极区域和漏极区域。半导体有源层205可以通过非晶硅的结晶使非晶硅改变为多晶硅而形成。阵列基板20还包括位于柔性基底200上的栅极绝缘层206。源漏极位于栅极绝缘层206上。源漏极分别通过接触孔电连接(或结合)到源极区域和漏极区域。接触孔是通过选择性地去除栅极绝缘层206和无机绝缘层202而形成的。
本申请实施例的显示面板10，其包括阵列基板20、发光元件30和封装体60。显示面板10具有显示区域10a、位于显示区域10a外的非显示区域10c以及设置于显示区域10a和非显示区域10c之间的换线区10b。封装体60具有无机层601。封装体60的无机层601在换线区10b与阵列 基板20所包括的无机绝缘层202接触以形成封装区域。由于无机层601与无机绝缘层202均为无机材料，因此两者接触密封效果好，提升了封装可靠性和稳定性。在封装体60与阵列基板20共同将发光元件30封装后，封装体60能够有效阻挡水汽侵入显示面板10的显示区域10a，从而提升显示区域10a的显示质量，同时显示面板10不易在显示区域10a出现黑斑或气泡。
本申请实施例还提出一种显示装置，其包括上述实施例的显示面板10。由于本实施例的显示面板10具有稳定可靠的封装状态，因此显示面板10不易在显示区域10a出现黑斑或气泡，从而使得本实施例的显示装置具有良好的显示品质和耐用性。
虽然已经参考优选实施例对本申请进行了描述，但在不脱离本申请的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件，尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (10)

  1. 一种显示面板，所述显示面板具有显示区域、位于所述显示区域外的非显示区域以及设置于所述显示区域和所述非显示区域之间的换线区，所述显示面板包括：
    阵列基板，所述阵列基板包括层叠设置的柔性基底、第一金属层、无机绝缘层、第二金属层以及有机平坦层；
    发光元件；以及
    用于封装所述发光元件的封装体，所述封装体具有无机层，所述无机层和所述无机绝缘层在所述换线区直接接触。
  2. 根据权利要求1所述的显示面板，其中，所述第一金属层形成处于所述无机绝缘层下方的第一信号线，所述第二金属层形成第二信号线，所述第二信号线在所述换线区断开形成所述显示区域内的第一段和所述非显示区域内的第二段，所述第一段和所述第二段通过所述第一信号线电连接。
  3. 根据权利要求2所述的显示面板，其中，所述无机绝缘层具有间隔设置的第一通孔和第二通孔，所述第一段的一部分延伸至所述第一通孔并与所述第一信号线电连接，所述第二段的一部分延伸至所述第二通孔并与所述第一信号线电连接。
  4. 根据权利要求3所述的显示面板，其中，所述第一通孔和所述第二通孔均为直孔。
  5. 根据权利要求1至4任一项所述的显示面板，其中，在所述换线区内，所述阵列基板包括处于所述无机绝缘层上的阳极材料，所述无机层覆盖所述阳极材料。
  6. 根据权利要求1所述的显示面板，其中，所述非显示区域能够呈弧形弯折至所述显示区域的下方，所述换线区沿所述弧形的轴向延伸。
  7. 根据权利要求1所述的显示面板，其中，所述有机平坦层在所述换线区断开形成开槽，以暴露所述无机绝缘层，所述无机层延伸至所述开槽内与所述无机绝缘层直接接触。
  8. 根据权利要求7所述的显示面板，其中，所述开槽为沿所述弧形的轴向延伸的通槽。
  9. 根据权利要求1所述的显示面板，其中，所述封装体还包括设置于所述无机层上的有机层以及设置于所述有机层上的外部无机层。
  10. 一种显示装置，包括如权利要求1至9任一项所述的显示面板。
PCT/CN2019/072959 2018-08-29 2019-01-24 显示面板以及显示装置 Ceased WO2020042537A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/814,042 US11289681B2 (en) 2018-08-29 2020-03-10 Display panel having a wire exchange area

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201821406723.1 2018-08-29
CN201821406723.1U CN208848933U (zh) 2018-08-29 2018-08-29 显示面板以及显示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/814,042 Continuation US11289681B2 (en) 2018-08-29 2020-03-10 Display panel having a wire exchange area

Publications (1)

Publication Number Publication Date
WO2020042537A1 true WO2020042537A1 (zh) 2020-03-05

Family

ID=66357776

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/072959 Ceased WO2020042537A1 (zh) 2018-08-29 2019-01-24 显示面板以及显示装置

Country Status (4)

Country Link
US (1) US11289681B2 (zh)
CN (1) CN208848933U (zh)
TW (1) TWM579370U (zh)
WO (1) WO2020042537A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109326634B (zh) * 2018-09-30 2020-11-06 云谷（固安）科技有限公司 显示面板及其制备方法、显示装置
CN110689848B (zh) * 2019-12-10 2020-04-14 京东方科技集团股份有限公司 显示装置和驱动方法
CN113363304B (zh) 2021-06-03 2022-09-13 武汉天马微电子有限公司 一种显示面板和显示装置
CN113851520B (zh) * 2021-11-29 2022-04-22 荣耀终端有限公司 显示面板及其制作方法、终端设备
CN115275037B (zh) * 2022-04-06 2025-07-25 武汉华星光电半导体显示技术有限公司 显示面板以及显示装置
WO2023201581A1 (zh) * 2022-04-20 2023-10-26 京东方科技集团股份有限公司 显示面板及制作方法、显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104503122A (zh) * 2014-12-25 2015-04-08 上海天马微电子有限公司 一种显示面板、显示器及其制作方法
CN107342310A (zh) * 2017-08-23 2017-11-10 京东方科技集团股份有限公司 柔性显示装置及其制作方法
CN107579078A (zh) * 2017-08-31 2018-01-12 上海天马有机发光显示技术有限公司 显示面板及其制造方法和显示装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102178796B1 (ko) * 2014-01-22 2020-11-16 삼성디스플레이 주식회사 표시 장치
US9535522B2 (en) * 2014-12-22 2017-01-03 Lg Display Co., Ltd. Flexible organic light emitting diode display device
KR102362189B1 (ko) * 2015-04-16 2022-02-11 삼성디스플레이 주식회사 유기 발광 표시 장치
KR101763616B1 (ko) * 2015-07-29 2017-08-02 삼성디스플레이 주식회사 유기 발광 표시 장치
JP2017068928A (ja) * 2015-09-28 2017-04-06 セイコーエプソン株式会社 有機発光装置および電子機器
KR102427249B1 (ko) * 2015-10-16 2022-08-01 삼성디스플레이 주식회사 디스플레이 장치
KR102446425B1 (ko) * 2015-11-17 2022-09-23 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
KR102465379B1 (ko) * 2015-12-02 2022-11-10 삼성디스플레이 주식회사 디스플레이 장치
KR102490891B1 (ko) * 2015-12-04 2023-01-25 삼성디스플레이 주식회사 표시 장치
KR102407869B1 (ko) * 2016-02-16 2022-06-13 삼성디스플레이 주식회사 유기 발광 디스플레이 장치와, 이의 제조 방법
KR102562898B1 (ko) * 2016-03-31 2023-08-04 삼성디스플레이 주식회사 표시 장치
KR102571085B1 (ko) * 2016-04-04 2023-08-28 삼성디스플레이 주식회사 디스플레이 장치
KR102663900B1 (ko) * 2016-05-26 2024-05-08 삼성디스플레이 주식회사 유기발광표시장치 및 유기발광표시장치의 제조 방법
JP2017224095A (ja) * 2016-06-14 2017-12-21 株式会社ジャパンディスプレイ 表示装置
JP2018017978A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
JP6668193B2 (ja) * 2016-07-29 2020-03-18 株式会社ジャパンディスプレイ センサ及び表示装置
KR102007435B1 (ko) * 2016-08-02 2019-08-06 삼성디스플레이 주식회사 유기발광 표시모듈 및 이를 포함하는 유기발광 표시장치
KR101810050B1 (ko) * 2016-08-11 2017-12-19 삼성디스플레이 주식회사 스트레처블 디스플레이 장치 및 스트레처블 디스플레이 장치의 제조 방법
CN106249977B (zh) * 2016-08-23 2020-01-07 厦门天马微电子有限公司 一种触控显示面板及电子设备
KR102602192B1 (ko) * 2016-11-02 2023-11-15 삼성디스플레이 주식회사 디스플레이 장치
CN110214470B (zh) * 2017-01-25 2021-06-29 夏普株式会社 Oled面板
CN110326363A (zh) * 2017-02-24 2019-10-11 夏普株式会社 Oled面板的制造方法、oled面板、oled面板的制造装置
WO2018158953A1 (ja) * 2017-03-03 2018-09-07 シャープ株式会社 表示装置およびその製造方法
WO2018179132A1 (ja) * 2017-03-29 2018-10-04 シャープ株式会社 表示デバイスの製造方法、表示デバイス、表示デバイスの製造装置、成膜装置
WO2018179308A1 (ja) * 2017-03-31 2018-10-04 シャープ株式会社 表示装置およびその製造方法
WO2018198262A1 (ja) * 2017-04-27 2018-11-01 シャープ株式会社 フレキシブル表示装置
JP2019012098A (ja) * 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置
CN207134068U (zh) 2017-08-31 2018-03-23 昆山国显光电有限公司 柔性显示面板和柔性显示装置
CN107634086B (zh) 2017-09-15 2020-03-03 京东方科技集团股份有限公司 一种柔性阵列基板及制备方法、显示装置
JP6792723B2 (ja) * 2017-09-26 2020-11-25 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置
WO2019064488A1 (ja) * 2017-09-29 2019-04-04 シャープ株式会社 フレキシブルディスプレイ用の弾性支持基板、フレキシブルディスプレイ、及びフレキシブルディスプレイ積層体
US11653547B2 (en) * 2018-07-12 2023-05-16 Sharp Kabushiki Kaisha Display device
US11416108B2 (en) * 2018-07-25 2022-08-16 Sharp Kabushiki Kaisha Display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104503122A (zh) * 2014-12-25 2015-04-08 上海天马微电子有限公司 一种显示面板、显示器及其制作方法
CN107342310A (zh) * 2017-08-23 2017-11-10 京东方科技集团股份有限公司 柔性显示装置及其制作方法
CN107579078A (zh) * 2017-08-31 2018-01-12 上海天马有机发光显示技术有限公司 显示面板及其制造方法和显示装置

Also Published As

Publication number Publication date
US20200212359A1 (en) 2020-07-02
TWM579370U (zh) 2019-06-11
CN208848933U (zh) 2019-05-10
US11289681B2 (en) 2022-03-29

Similar Documents

Publication Publication Date Title
US11289681B2 (en) Display panel having a wire exchange area
CN114097089B (zh) 显示基板以及显示装置
CN108766979B (zh) 显示面板及显示装置
CN112602198B (zh) 显示基板及显示装置
US12341140B2 (en) Display panel and display device
JP7629071B2 (ja) アレイ基板及び表示装置
CN110729328A (zh) 有机发光二极管显示面板及有机发光二极管显示装置
CN110471219A (zh) Led基板及显示装置
CN112183398B (zh) 显示基板及其制作方法、显示装置
CN114824128A (zh) 显示面板及显示装置
CN114566529B (zh) 一种显示面板及显示装置
JP5637629B2 (ja) 表示装置
CN101132019A (zh) 有机发光显示设备及其制造方法
CN117406505A (zh) 阵列基板、阵列基板的制备方法、显示面板和显示装置
JPS63208896A (ja) 薄膜トランジスタアレイ
CN115224097B (zh) 显示基板以及显示装置
WO2021102626A9 (zh) 一种显示基板及其制作方法、显示装置
CN113327940B (zh) 显示面板及其制作方法、显示装置
CN112289812B (zh) 阵列基板、显示面板及显示装置
CN108807422A (zh) 阵列基板制作方法及阵列基板、显示面板
CN114256299B (zh) 显示面板及显示装置
CN111081723B (zh) 阵列基板、阵列基板的制作方法、显示面板以及显示装置
CN114335093A (zh) 柔性显示面板及其制作方法以及显示装置
WO2022204862A1 (zh) 像素电路、显示面板及显示装置
CN117542861A (zh) 显示面板及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19855087

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19855087

Country of ref document: EP

Kind code of ref document: A1