WO2020009096A1 - ３価クロムメッキ液およびこれを用いたクロムメッキ方法 - Google Patents

３価クロムメッキ液およびこれを用いたクロムメッキ方法 Download PDF

Info

Publication number
WO2020009096A1
WO2020009096A1 PCT/JP2019/026246 JP2019026246W WO2020009096A1 WO 2020009096 A1 WO2020009096 A1 WO 2020009096A1 JP 2019026246 W JP2019026246 W JP 2019026246W WO 2020009096 A1 WO2020009096 A1 WO 2020009096A1
Authority
WO
WIPO (PCT)
Prior art keywords
trivalent chromium
plating solution
chromium plating
solution according
organic compound
Prior art date
Application number
PCT/JP2019/026246
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
まどか 中上
真雄 堀
雄斗 森川
Original Assignee
株式会社Ｊｃｕ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｊｃｕ filed Critical 株式会社Ｊｃｕ
Priority to JP2020529002A priority Critical patent/JP7349427B2/ja
Priority to US17/257,348 priority patent/US20210317589A1/en
Priority to CN201980040744.7A priority patent/CN112368421A/zh
Priority to EP19830121.0A priority patent/EP3819404A4/en
Publication of WO2020009096A1 publication Critical patent/WO2020009096A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/10—Electroplating: Baths therefor from solutions of chromium characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers

Definitions

  • the present invention relates to a trivalent chromium plating solution and a chromium plating method using the same.
  • Chromium plating is used as a decorative coating film because it has a silver-white appearance. Hexavalent chromium has been used for this chromium plating, but in recent years this hexavalent chromium has an adverse effect on the environment, so its use has been restricted, and the technology has shifted to trivalent chromium. ing.
  • Patent Literature 1 reports a technique for enhancing corrosion resistance in a calcium chloride environment.
  • the trivalent chromium plating was still inferior to CASS corrosion resistance than hexavalent chromium plating and was not practical.
  • An object of the present invention is to provide a practical trivalent chromium plating which has higher corrosion resistance than conventional trivalent chromium plating.
  • the present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a trivalent chromium plating solution obtained by using a trivalent chromium plating solution containing an organic compound having 2 to 4 carbon atoms and having three or more chloro groups is added. Have found that they have high corrosion resistance and are practical, and have completed the present invention.
  • the present invention provides a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffer,
  • the trivalent chromium plating solution further contains an organic compound having 2 to 4 carbon atoms and having three or more chloro groups.
  • the present invention is also an additive for a trivalent chromium plating solution containing an organic compound having 2 to 4 carbon atoms and having three or more chloro groups as an active ingredient.
  • the present invention is also a method for chromium plating an object to be plated, wherein the object to be plated is electroplated with the above trivalent chromium plating solution.
  • the present invention further provides a method for improving the corrosion resistance of an object to be plated, wherein the object to be plated is electroplated with the above trivalent chromium plating solution.
  • the present invention is a chrome-plated product obtained by electroplating an object to be plated with the above-mentioned trivalent chromium plating solution.
  • the trivalent chromium plating solution of the present invention is a plating using trivalent chromium, the same appearance as that of plating using hexavalent chromium can be obtained, and the corrosion resistance is improved, and the plating solution is practical. It is.
  • FIG. 5 is a view showing the results of a corrosion resistance test (CASS test) (Examples 1 to 5).
  • FIG. 4 is a view showing the results of a corrosion resistance test (CASS test) (Comparative Examples 1 and 2, Reference Example).
  • FIG. 9 is a view showing the results of a corrosion resistance test (CASS test) (Examples 6 to 8).
  • the trivalent chromium plating solution of the present invention (hereinafter referred to as “the plating solution of the present invention”) comprises a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffer, and further comprises a carbon An organic compound having a number of 2 to 4 and having three or more chloro groups is contained.
  • organic compound having 2 to 4 carbon atoms and having 3 or more chloro groups (hereinafter, may be simply referred to as “organic compound”) used in the plating solution of the present invention is not particularly limited, and examples thereof include chloral hydrate, Trichloroethylene, trichloroacetic acid, trichloroacetonitrile, trichloroethanol and the like. One or two or more of these organic compounds can be used. Among these organic compounds, chloral hydrate and / or trichloroethylene are preferable, and chloral hydrate is more preferable.
  • the content of the organic compound in the plating solution of the present invention is not particularly limited, but is, for example, 10 to 5000 mg / L, preferably 20 to 2000 mg / L, and more preferably 50 to 1000 mg / L.
  • the organic compound can be used as an additive for a trivalent chromium plating solution by using it as an active ingredient.
  • This trivalent chromium plating solution additive can be added to a conventional trivalent chromium plating solution.
  • the trivalent chromium compound used in the plating solution of the present invention is not particularly limited, and examples thereof include basic chromium sulfate, chromium sulfate, chromium chloride, chromium sulfamate, and chromium acetate. It is. These trivalent chromium compounds may be used alone or in combination of two or more.
  • the content of the trivalent chromium compound in the plating solution of the present invention is not particularly limited, but is, for example, 1 to 25 g / L, preferably 1 to 15 g / L as metal chromium.
  • the complexing agent used in the plating solution of the present invention is not particularly limited, for example, formic acid, ammonium formate, aliphatic monocarboxylic acid such as potassium formate, succinic acid, maleic acid, malic acid, citric acid, triammonium citrate And carboxylic acids having two or more hydroxy groups and two or more carboxy groups, such as aliphatic dicarboxylic acids, tartaric acid, diammonium tartrate, and sodium tartrate. These complexing agents may be used alone or in combination of two or more.
  • the content of the complexing agent in the plating solution of the present invention is not particularly limited, but is, for example, 0.1 to 50 g / L, and preferably 1 to 30 g / L.
  • the conductive salt used in the plating solution of the present invention is not particularly limited. Examples include sulfamic acid salts such as ammonium and sodium sulfamate. These conductive salts are used for each group, for example, for each group of sulfate, chloride and the like. Of these conductive salts, sulfates or chlorides are preferred. These conductive salts may be used alone or in combination of two or more.
  • the content of the conductive salt in the plating solution of the present invention is not particularly limited, but is, for example, 100 to 500 g / L, and preferably 150 to 300 g / L.
  • the pH buffer used in the plating solution of the present invention is not particularly limited, and examples thereof include boric acid, sodium borate, potassium borate, phosphoric acid, and dipotassium hydrogen phosphate. Among these, boric acid and sodium borate are preferred. These pH buffers may be used alone or in combination of two or more.
  • the content of the pH buffer in the plating solution of the present invention is not particularly limited, but is, for example, 25 to 200 g / L, and preferably 50 to 100 g / L.
  • the plating solution of the present invention may further contain tin salts such as ascorbic acid, sodium ascorbate, hydrogen peroxide, polyethylene glycol, tin sulfate, tin chloride and the like.
  • tin salts such as ascorbic acid, sodium ascorbate, hydrogen peroxide, polyethylene glycol, tin sulfate, tin chloride and the like.
  • the pH of the plating solution of the present invention is not particularly limited as long as it is acidic.
  • the pH is preferably 2 to 4.5, and more preferably 2.5 to 4.0.
  • the conductive salt of the plating solution of the present invention is a sulfate
  • a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof as a complexing agent.
  • the complexing agent include carboxylic acids such as tartaric acid, and salts of the above carboxylic acids such as diammonium tartrate, Rochelle salt, and sodium tartrate.
  • tartaric acid or diammonium tartrate is preferred, and diammonium tartrate is more preferred.
  • These complexing agents may be used alone or in combination of two or more.
  • the content of the carboxylic acid or a salt thereof in the plating solution of the present invention is not particularly limited, but is, for example, 0.1 to 90 g / L, and preferably 1 to 60 g / L.
  • the hydroxy group in a carboxy group is not counted as a hydroxy group.
  • the complexing agent is further used in combination with a carboxylic acid having two or more carboxy groups and having 4 or more carbon atoms or a salt thereof.
  • carboxylic acid having two or more carboxy groups and having 4 or more carbon atoms or a salt thereof include carboxylic acids such as adipic acid, phthalic acid, pimelic acid, and sebacic acid, and salts of the carboxylic acids.
  • carboxylic acids such as adipic acid, phthalic acid, pimelic acid, and sebacic acid, and salts of the carboxylic acids.
  • Can be These complexing agents may be used alone or in combination of two or more, and are preferably phthalic acid and / or adipic acid.
  • the plating solution of the present invention has two or more carboxy groups, and the content of the carboxylic acid or a salt thereof having 4 or more carbon atoms is not particularly limited, but has two or more hydroxy groups and two or more carboxy groups.
  • a part of the carboxylic acid or its salt may be a carboxylic acid or its salt having at least two carboxy groups and having at least 4 carbon atoms within the range of the content of the carboxylic acid or its salt.
  • the conductive salt of the plating solution of the present invention is a sulfate
  • the sulfur-containing organic compound used in the plating solution of the present invention is not particularly limited.
  • saccharin or a salt thereof, a sulfur-containing organic compound having an allyl group, a carboxylic acid having a carbamimidylthio group and a dehydration reaction product thereof examples include urea and sodium thiocyanate.
  • saccharin or a salt thereof examples include saccharin and sodium saccharinate. Among these, sodium saccharinate is preferred.
  • sulfur-containing organic compound having an allyl group examples include sodium allyl sulfonate, allyl thiourea, ammonium 2-methylallyl sulfonate, and allyl isothiocyanate. Among these, sodium allyl sulfonate and / or allyl thiourea are preferred.
  • Examples of the carboxylic acid having a carbamimidylthio group and the dehydration product thereof include a carboxylic acid having a carbamimidylthio group represented by the general formula (1) and a carbamimidyl represented by the general formula (2). Dehydration products of carboxylic acids having a thio group may be mentioned.
  • n represents an integer of 1 to 5, preferably 1 to 2.
  • m represents an integer of 1 to 2.
  • carboxylic acid having a carbamimidylthio group and a dehydration product thereof examples include [[amino (imino) methyl] thio] acetic acid, 3-[[amino (imino) methyl] thio] propanoic acid, -Iminothiazolidine-4-one, 2-amino-5,6-dihydro-4H-1,3-thiazin-4-one and the like.
  • sulfur-containing organic compounds may be used alone or in combination of two or more.
  • the content of the sulfur-containing organic compound in the plating solution of the present invention is not particularly limited, but is, for example, 0.5 to 10 g / L, and preferably 2 to 8 g / L.
  • a carboxylic acid or a salt thereof having two or more hydroxy groups and two or more carboxy groups is used as a complexing agent, and saccharin or a sulfur-containing organic compound is used as a sulfur-containing organic compound. It is particularly preferable to use the salt in combination with one or more selected from the group consisting of a sulfur-containing organic compound having an allyl group, a carboxylic acid having a carbamimidylthio group, and / or a dehydration product thereof.
  • the method for preparing the plating solution of the present invention described above is not particularly limited.
  • a trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffer are added to water at 40 to 60 ° C., mixed, and dissolved.
  • An organic compound having 2 to 4 carbon atoms and having three or more chloro groups, and if necessary, adding and mixing a sulfur-containing organic compound, and finally adjusting the pH with sulfuric acid, aqueous ammonia or the like. can be.
  • the plating solution of the present invention can perform chromium plating on an object to be plated by electroplating the object to be plated with the plating solution of the present invention, similarly to the conventional chromium plating solution.
  • the corrosion resistance is improved by this electroplating.
  • the conditions for the electroplating are not particularly limited.
  • the electroplating may be performed at a bath temperature of 30 to 60 ° C., an anode of carbon or iridium oxide, a cathode current density of 2 to 20 A / dm 2 for 1 to 15 minutes.
  • Examples of the object to be electroplated include metals such as iron, stainless steel and brass, and resins such as ABS and PC / ABS.
  • the object to be plated may be preliminarily treated with copper plating, nickel plating or the like before being treated with the plating solution of the present invention.
  • the potential difference of each layer is not particularly limited.
  • the potential difference of bright nickel plating is -200 to -60 mV for semi-bright nickel plating
  • the potential difference of microporous nickel plating is 20 to -60 mV for bright nickel plating.
  • it is 100 mV.
  • layers may be provided in the order of semi-bright nickel plating, high sulfur-containing nickel plating, bright nickel plating, and microporous nickel plating.
  • the potential difference of each layer is not particularly limited.
  • the potential difference of bright nickel plating is -200 to -60 mV for semi-bright nickel plating
  • the potential difference of high sulfur content nickel plating is-
  • the potential difference of the microporous nickel plating is preferably in the range of 20 to 100 mV with respect to 50 to -5 mV and bright nickel plating.
  • the chromium-plated product thus obtained has improved corrosion resistance.
  • that the corrosion resistance has been improved means that the evaluation is performed in accordance with JIS H # 8502 and the rating number (RN) is improved.
  • chrome plating may be subjected to a chromate treatment. This further improves the corrosion resistance.
  • the conditions for the chromate treatment are not particularly limited.
  • the bath temperature is 25 to 70 ° C.
  • the anode is an insoluble anode such as a lead-tin alloy
  • the cathode current density is 0.1 to 1 A / dm 2
  • the electroplating is performed for 1 minute. Good.
  • Trivalent chrome plating A trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffering agent shown in Table 1 are added to water at 60 ° C., mixed, and dissolved, and then, having 2 to 4 carbon atoms and three or more chloro groups. The organic compound and the sulfur-containing organic compound were added and mixed, and finally, the pH was adjusted with sulfuric acid, aqueous ammonia, and the like to prepare a trivalent chromium plating solution.
  • RN was evaluated based on the total corrosion rate.
  • the chromate treatment was performed using "EBACHRO-500" manufactured by JCU Co., Ltd. at a bath temperature of 40.degree.
  • Flow density is performed under the conditions of 1 minute at 0.2 A / dm 2.
  • Trivalent chrome plating A trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffering agent shown in Table 2 are added to water at 60 ° C., mixed, and dissolved. The organic compound and the sulfur-containing organic compound were added and mixed, and finally, the pH was adjusted with sulfuric acid, aqueous ammonia, and the like to prepare a trivalent chromium plating solution. Copper plating ("CU-BRITE EP-30" manufactured by JCU Co., Ltd.), semi-bright nickel plating (“CF-24T” manufactured by JCU Co., Ltd.), and glossy nickel plating ("HI-BRITE # manufactured by JCU Co., Ltd.”) on ABS resin.
  • Example 6 As a result of the CASS test, it was revealed that the corrosion hole of Example 6 was smaller than that of Comparative Example 3. Similar results were obtained in Examples 7 and 8. From the above, it was found that the corrosion resistance was improved by adding an organic compound having 2 to 4 carbon atoms and having three or more chloro groups to the trivalent chromium plating solution.
  • Trivalent chromium plating bath A trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffer described in the following compositions 1 to 3 are added to water at 50 ° C., mixed, and dissolved. Was added and mixed, and finally the pH was adjusted with hydrochloric acid, aqueous ammonia, or the like to prepare a trivalent chromium plating solution.
  • Trivalent chrome plating A trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffering agent shown in Table 3 are added to water at 60 ° C., mixed, and dissolved. The organic compound was added and mixed, and finally the pH was adjusted with hydrochloric acid and aqueous ammonia to prepare a trivalent chromium plating solution. Copper plating ("CU-BRITE EP-30” manufactured by JCU Co., Ltd.), semi-bright nickel plating (“CF-24T” manufactured by JCU Co., Ltd.), and glossy nickel plating ("HI-BRITE # manufactured by JCU Co., Ltd.”) on ABS resin.
  • the trivalent chromium plating solution of the present invention can be used for various applications similarly to plating using hexavalent chromium. That's all

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PCT/JP2019/026246 2018-07-03 2019-07-02 ３価クロムメッキ液およびこれを用いたクロムメッキ方法 WO2020009096A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020529002A JP7349427B2 (ja) 2018-07-03 2019-07-02 ３価クロムメッキ液およびこれを用いたクロムメッキ方法
US17/257,348 US20210317589A1 (en) 2018-07-03 2019-07-02 Trivalent chromium plating solution and chromium plating method using same
CN201980040744.7A CN112368421A (zh) 2018-07-03 2019-07-02 三价铬镀液和使用了它的镀铬方法
EP19830121.0A EP3819404A4 (en) 2018-07-03 2019-07-02 TRIVAL CHROME PLATING SOLUTION AND CHROME COATING PROCESS WITH IT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018126508 2018-07-03
JP2018-126508 2018-07-03

Publications (1)

Publication Number Publication Date
WO2020009096A1 true WO2020009096A1 (ja) 2020-01-09

Family

ID=69060417

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/026246 WO2020009096A1 (ja) 2018-07-03 2019-07-02 ３価クロムメッキ液およびこれを用いたクロムメッキ方法

Country Status (5)

Country Link
US (1) US20210317589A1 (zh)
EP (1) EP3819404A4 (zh)
JP (1) JP7349427B2 (zh)
CN (1) CN112368421A (zh)
WO (1) WO2020009096A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023008406A1 (ja) * 2021-07-28 2023-02-02 株式会社Jcu 白色３価クロムめっき浴およびこれを利用した被めっき物への白色３価クロムめっき方法
WO2023095774A1 (ja) * 2021-11-29 2023-06-01 株式会社Jcu クロムめっき部品およびその製造方法
JP7330349B1 (ja) 2022-11-11 2023-08-21 株式会社Jcu クロムめっき部品及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3155524C (en) * 2019-10-31 2024-02-27 Diego DAL ZILIO Sulfate based, ammonium free trivalent chromium decorative plating process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839791A (ja) * 1981-08-24 1983-03-08 エム・アンド・テイ・ケミカルズ・インコ−ポレツド 光沢クロムメツキ浴
JPH01100291A (ja) * 1987-10-12 1989-04-18 Japan Carlit Co Ltd:The クロムメッキ方法
JP2012521495A (ja) 2009-03-24 2012-09-13 マクダーミッド アキューメン インコーポレーテッド 塩化カルシウム環境における耐食性が強化されたクロム合金コーティング
JP2015221944A (ja) * 2015-08-07 2015-12-10 日産自動車株式会社 クロムめっき部品及びその製造方法
JP2016027211A (ja) * 2013-05-08 2016-02-18 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 半光沢ニッケルまたはニッケル合金を堆積するためのニッケルまたはニッケル合金の直流電気めっき浴、電気めっきのための方法、およびそのための浴および化合物の使用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092226A (en) * 1974-12-11 1978-05-30 Nikolaus Laing Process for the treatment of metal surfaces by electro-deposition of metal coatings at high current densities
US20030178314A1 (en) * 2002-03-21 2003-09-25 United States Steel Corporation Stainless steel electrolytic coating
JP5379426B2 (ja) * 2007-08-30 2013-12-25 日産自動車株式会社 クロムめっき部品およびその製造方法
CN101967662A (zh) 2010-10-26 2011-02-09 广东多正化工科技有限公司 可形成黑色镀层的三价铬电镀液
CN103014784A (zh) * 2012-12-13 2013-04-03 合肥华清方兴表面技术有限公司 一种常温环保型三价铬电镀液及其电镀方法
BR112015016551B1 (pt) * 2013-01-10 2021-08-31 Coventya , Inc Aparato para manutenção de eficiência de banho de chapeamento de crômio trivalente e método para manutenção de eficiência de banho de chapeamento de cromo trivalente
CN105671599A (zh) * 2016-04-11 2016-06-15 济南德锡科技有限公司 一种硫酸盐三价铬电镀液及其制备方法
CN107254693A (zh) 2017-06-28 2017-10-17 合肥博之泰电子科技有限公司 一种装饰条的铬电镀方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839791A (ja) * 1981-08-24 1983-03-08 エム・アンド・テイ・ケミカルズ・インコ−ポレツド 光沢クロムメツキ浴
JPH01100291A (ja) * 1987-10-12 1989-04-18 Japan Carlit Co Ltd:The クロムメッキ方法
JP2012521495A (ja) 2009-03-24 2012-09-13 マクダーミッド アキューメン インコーポレーテッド 塩化カルシウム環境における耐食性が強化されたクロム合金コーティング
JP2016027211A (ja) * 2013-05-08 2016-02-18 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 半光沢ニッケルまたはニッケル合金を堆積するためのニッケルまたはニッケル合金の直流電気めっき浴、電気めっきのための方法、およびそのための浴および化合物の使用
JP2015221944A (ja) * 2015-08-07 2015-12-10 日産自動車株式会社 クロムめっき部品及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023008406A1 (ja) * 2021-07-28 2023-02-02 株式会社Jcu 白色３価クロムめっき浴およびこれを利用した被めっき物への白色３価クロムめっき方法
WO2023095774A1 (ja) * 2021-11-29 2023-06-01 株式会社Jcu クロムめっき部品およびその製造方法
JP7330349B1 (ja) 2022-11-11 2023-08-21 株式会社Jcu クロムめっき部品及びその製造方法
JP2024070598A (ja) * 2022-11-11 2024-05-23 株式会社Jcu クロムめっき部品及びその製造方法

Also Published As

Publication number Publication date
CN112368421A (zh) 2021-02-12
EP3819404A1 (en) 2021-05-12
EP3819404A4 (en) 2022-02-09
JPWO2020009096A1 (ja) 2021-07-08
JP7349427B2 (ja) 2023-09-22
US20210317589A1 (en) 2021-10-14

Similar Documents

Publication Publication Date Title
WO2020009096A1 (ja) ３価クロムメッキ液およびこれを用いたクロムメッキ方法
JP6951465B2 (ja) ３価クロムメッキ液およびこれを用いたクロムメッキ方法
JPS6056084A (ja) 亜鉛及び亜鉛合金電着浴及びその方法
US20170114470A1 (en) Multilayer plating film and article having multilayer plating film
JP3674887B2 (ja) 銅−スズ合金メッキ用ピロリン酸浴
US9206321B2 (en) Trivalent chromium-conversion processing solution containing aluminum-modified colloidal silica
JPS62103387A (ja) 電気めつき液
KR101861626B1 (ko) Pc-abs 수지 부품의 비전해성 금속도금방법
JP5652585B2 (ja) ３価クロムめっき浴
JP5419021B2 (ja) ジンケート型亜鉛めっき浴
JP6960677B2 (ja) 無電解Ｎｉ−Ｆｅ合金めっき液
JP2012082475A (ja) バレルめっきによる３価クロムめっき方法
CN110785516A (zh) 用于在衬底上沉积装饰用镍涂层的镍电镀浴
JP4705776B2 (ja) リン酸塩被膜を有する無電解ニッケルめっき膜の形成方法およびその形成膜
JP2016060918A (ja) 装飾用３価クロムめっき液およびこれを利用した装飾クロムめっき方法
JPS62287092A (ja) 亜鉛−ニツケル合金用めつき浴
WO2022224901A1 (ja) ３価クロムメッキ液およびこれを用いたクロムメッキ方法
JPS6324092A (ja) 亜鉛−鉄合金の電着用の酸性硫酸塩含有浴
US4470886A (en) Gold alloy electroplating bath and process
JP6373185B2 (ja) ３価クロムめっき液および３価クロムめっき方法
JPS63114997A (ja) 電気めつき方法
JPWO2019117230A1 (ja) ３価クロムメッキ液およびこれを用いた３価クロムメッキ方法
JPS6319600B2 (zh)
US20190112713A1 (en) Compressively Stressed Medium Phosphorus Electroless Nickel
JPS6324091A (ja) 亜鉛−鉄合金の電着用の酸性塩化物含有浴

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19830121

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020529002

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE