WO2019223456A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2019223456A1
WO2019223456A1 PCT/CN2019/082753 CN2019082753W WO2019223456A1 WO 2019223456 A1 WO2019223456 A1 WO 2019223456A1 CN 2019082753 W CN2019082753 W CN 2019082753W WO 2019223456 A1 WO2019223456 A1 WO 2019223456A1
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WIPO (PCT)
Prior art keywords
layer
display
flexible substrate
display panel
thickness
Prior art date
Application number
PCT/CN2019/082753
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English (en)
French (fr)
Inventor
张晓晋
王丹
陈磊
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/624,076 priority Critical patent/US11360507B2/en
Publication of WO2019223456A1 publication Critical patent/WO2019223456A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G06F1/1607—Arrangements to support accessories mechanically attached to the display housing
    • G06F1/1609—Arrangements to support accessories mechanically attached to the display housing to support filters or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • the present disclosure relates to a flexible display technology, and more particularly, to a display panel, a manufacturing method thereof, and a display device.
  • Flexible display panels include flexible organic light emitting diode (OLED) display panels, flexible electrophoretic display (EPD) panels, flexible liquid crystal display (LCD) panels, and the like.
  • some embodiments of the present disclosure provide a display panel including a flexible substrate, a display layer located on a side of the flexible substrate, and a transparent cover film on a side of the display layer remote from the flexible substrate.
  • the flexible substrate includes a middle region and a selected curved region located at at least one side of the periphery of the middle region; the selected curved region is configured to bend in a direction away from the display layer.
  • the transparent cover film layer includes a first portion located on a side of the display layer away from the intermediate region, and a second portion located on a side of the display layer away from the selected curved region; wherein, the A first part is connected to the second part, and a thickness of at least a part of the second part gradually decreases in a direction away from the first part.
  • the thickness of the second portion gradually decreases from a point where it is connected to the first portion in a direction away from the first portion.
  • the display layer includes a plurality of light emitting devices;
  • the transparent cover film layer includes a thin film encapsulation layer configured to encapsulate the plurality of light emitting devices.
  • the first portion includes at least one film layer disposed in a stack
  • the second portion includes at least one film layer that is in one-to-one correspondence with the at least one film layer in the first portion; wherein, all The thickness of at least a part of the at least one film layer of the second portion gradually decreases in a direction away from the first portion.
  • the first portion includes a first organic layer; the second portion includes a second organic layer; wherein the first organic layer is connected to the second organic layer, and the second The thickness of at least a part of the organic layer gradually decreases in a direction away from the first organic layer.
  • the first portion further includes: a first inorganic layer located on a side of the first organic layer close to the flexible substrate; and the second portion further includes: a second inorganic layer located near the flexible organic substrate.
  • the second inorganic layer on the side of the flexible substrate; wherein the first inorganic layer is connected to the second inorganic layer, and both have the same thickness.
  • the first portion further includes: a third inorganic layer located on a side of the first organic layer away from the flexible substrate; the second portion further includes: the second organic layer is located away from all The fourth inorganic layer on the side of the flexible substrate; wherein the third inorganic layer is connected to the fourth inorganic layer, and both have the same thickness.
  • the display layer includes a plurality of light emitting devices.
  • the display panel further includes a thin film encapsulation layer and an adhesive layer located between the display layer and the transparent cover film layer.
  • the thin film encapsulation layer is configured to encapsulate the plurality of light emitting devices, and the adhesive layer is configured to adhere the thin film encapsulation layer and the transparent cover film layer.
  • each of the plurality of light emitting devices includes a top emission type light emitting device.
  • the top-emission type light-emitting device includes: a reflective electrode, a light-emitting functional layer, a transmission electrode, and a light extraction layer which are away from the flexible substrate in order.
  • the thickness of the first portion is uniform, and the thickness where the second portion is connected to the first portion is equal to the thickness of the first portion.
  • the flexible substrate further includes: an edge region located on a side of the selected curved region away from the intermediate region.
  • the transparent cover film layer further includes: a third portion located on a side of the display layer away from the edge region; wherein the third portion is connected to the second portion.
  • the thickness of the third portion gradually decreases from a position where the third portion is connected to the second portion in a direction away from the second portion.
  • the thickness of the third portion is equal to the thickness where the third portion is connected to the second portion.
  • some embodiments of the present disclosure provide a display device including the display panel according to any one of the above embodiments.
  • some embodiments of the present disclosure provide a method for manufacturing a display panel, including: providing a flexible substrate, forming a display layer on one side of the flexible substrate, and on a side of the display layer remote from the flexible substrate. Forming a transparent cover film layer, and bending the selected curved area in a direction away from the display layer.
  • the flexible substrate includes: an intermediate region and a selected curved region at at least one side of the periphery of the intermediate region; wherein the selected curved region of the flexible substrate is configured to bend in a direction away from the display layer.
  • the transparent cover film layer includes a first portion located on a side of the display layer away from the intermediate region, and a second portion located on a side of the display layer away from the selected curved region; the first portion Is connected to the second portion, and a thickness of at least a part of the second portion gradually decreases in a direction away from the first portion.
  • the thickness of the second portion is gradually reduced from a position where the second portion is connected to the first portion in a direction away from the first portion.
  • the forming a display layer on one side of the flexible substrate includes forming a plurality of light emitting devices on the intermediate region and the selected curved region.
  • the forming a transparent cover film layer on a side of the display layer remote from the flexible substrate includes forming a thin film encapsulation layer on a side of the display layer remote from the flexible substrate, and the thin film encapsulation layer is configured to encapsulate The plurality of light emitting devices.
  • the step of forming a transparent cover film layer on a side of the display layer remote from the flexible substrate includes: using an inkjet printing process, forming a first layer on a side of the display layer remote from the intermediate region.
  • An organic layer, a second organic layer is formed on a side of the display layer away from the selected curved area; the first organic layer is connected to the second organic layer; wherein the inkjet printing is adjusted by adjusting A process parameter of the process controls a thickness of at least a part of the second organic layer to gradually decrease in a direction away from the first organic layer.
  • the forming a transparent cover film layer on a side of the display layer remote from the flexible substrate further includes: In a deposition process, a first inorganic layer is formed on a side of the display layer remote from the intermediate region, and a second inorganic layer is formed on a side of the display layer remote from the selected curved region; the first inorganic layer and The second inorganic layers are connected and have the same thickness.
  • the forming a transparent cover film layer on a side of the display layer away from the flexible substrate further includes: In a deposition process, a third inorganic layer is formed on a side of the first organic layer remote from the flexible substrate, and a fourth inorganic layer is formed on a side of the second organic layer remote from the flexible substrate; the third inorganic layer It is connected to the fourth inorganic layer and has the same thickness.
  • the forming a display layer on one side of the flexible substrate includes forming a plurality of light emitting devices on the intermediate region and the selected curved region.
  • the method for preparing the display panel further includes: forming a package on the side of the display layer remote from the flexible substrate. Thin film encapsulation layer of a light emitting device; an adhesive layer is formed on a side of the thin film encapsulation layer remote from the display layer, wherein the adhesive layer is configured to adhere the thin film encapsulation layer and the transparent cover film Floor.
  • FIG. 1 is a schematic structural diagram of a display panel before and after bending according to a related art
  • FIG. 2 is a schematic structural diagram of a display panel before being bent according to some embodiments of the present disclosure
  • FIG. 3 is a schematic structural diagram of a display panel after being bent according to some embodiments of the present disclosure
  • FIG. 4 is a schematic structural diagram of a transparent cover film layer in the display panel shown in FIG. 2;
  • FIG. 5 is a schematic structural diagram of another transparent cover film layer in the display panel shown in FIG. 2;
  • FIG. 6 is a schematic structural diagram of another display panel before being bent according to some embodiments of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a display panel after being bent according to some embodiments of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a transparent cover film layer in the display panel shown in FIG. 6;
  • FIG. 9 is a schematic structural diagram of another transparent cover film layer in the display panel shown in FIG. 6;
  • FIG. 10 is a schematic structural diagram of still another display panel according to some embodiments of the present disclosure.
  • FIG. 11 is a schematic structural diagram of a transparent cover film layer in the display panel shown in FIG. 10;
  • FIG. 12 is a flowchart of a method for manufacturing a display panel according to some embodiments of the present disclosure
  • FIG. 13 is a flowchart of a method of preparing a transparent cover layer according to some embodiments of the present disclosure
  • FIG. 14 is a flowchart of another method for manufacturing a display panel according to some embodiments of the present disclosure.
  • FIG. 15 is a schematic structural diagram of a display device according to some embodiments of the present disclosure.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of "a plurality” is two or more.
  • “And / or” merely describes the association relationship of the associated objects, and represents three kinds of relationships, for example, A and / or B, which are expressed as: there are three cases where A exists alone, A and B exist simultaneously, and B exists alone.
  • the display panel includes a flat area and a curved area after being bent. As shown in FIG. 1, the display panel includes a first film layer 20 ′ for emitting light, and a second film layer 30 ′ covering the first film layer 20 ′, wherein the second film layer 30 ′ has a uniform thickness. After the display panel is bent, the light emitted from the curved region of the first film layer 20 ′ enters the portion of the second film layer 30 ′ located in the curved region vertically.
  • the two interfaces above and below the part of the second film layer 30 'located in the curved area are parallel arcs, the light in this part will not be deflected and will continue to be emitted vertically. As shown. Since the direction in which the light exits from the curved area is directed away from the flat area in the middle of the display panel, when the viewer faces the display panel to view the screen, the viewer is more likely to produce the curved area than the flat area. The difference in viewing angle results in a difference between the screen color of the curved area seen by the viewer and the screen color of the flat area in the middle, that is, the screen of the curved area seen by the viewer when facing the display panel has a color shift, which affects The display effect of the display panel.
  • some embodiments of the present disclosure provide a display panel 100 including a flexible substrate 10, a display layer 20 located on one side of the flexible substrate 10, and a display layer 20 located away from the flexible substrate 10.
  • a display panel 100 including a flexible substrate 10, a display layer 20 located on one side of the flexible substrate 10, and a display layer 20 located away from the flexible substrate 10.
  • One side of the transparent cover film layer 30 One side of the transparent cover film layer 30.
  • the flexible substrate 10 includes a flexible substrate and a thin film transistor (TFT) array layer on the flexible substrate.
  • TFT array layer is composed of a plurality of TFTs arranged in an array.
  • the arrangement manner can be set according to actual requirements, and some embodiments of the present disclosure are not limited thereto.
  • the flexible substrate 10 includes a middle region 10a and a selected curved region 10b at at least one side around the middle region 10a.
  • the selected curved area 10b is set to be curved in a direction away from the display layer 20 (as shown by an arrow direction in FIG. 2). That is, when the viewer faces the display panel 100 to view the display screen, the curved region 10b is curved away from the viewer (the curved display panel 100 is shown in FIG. 3).
  • the bending degree of the selected bending region 10b can be flexibly set according to the design requirements of the display panel 100, which is not limited in the embodiment of the present disclosure.
  • the display layer 20 and the transparent cover film layer 30 on one side of the flexible substrate 10 also have bendability, so as to realize the bendability of the entire display panel 100.
  • the selected bending region 10 b of the flexible substrate 10 is set to bend in a direction away from the display layer 20
  • both the display layer 20 and the transparent cover film layer 30 are bent in a direction close to the flexible substrate 10, that is, the flexible substrate 10.
  • the bending directions of the display layer 20 and the transparent cover film layer 30 are the same, so that at least one side of the display panel 100 near the edge is in a curved state.
  • the selected curved region 10 b is located on two opposite sides of the middle region 10 a as an example for description.
  • the selected curved region 10b may also be located on any side of the periphery of the middle region 10a, on either side (for example, opposite sides or adjacent sides), three sides, or around the middle region 10a.
  • the actual implementation can be flexibly adjusted according to the design requirements of the display panel 100, which is not limited in the embodiments of the present disclosure.
  • the transparent cover film layer 30 includes a first portion 31 located on a side of the display layer 20 away from the intermediate region 10a, and a second portion 32 located on a side of the display layer 20 away from the selected curved region 10b.
  • the side of the display layer 20 away from the intermediate region 10a means that the portion of the display layer 20 facing the intermediate region 10a is far away from the intermediate region 10a, that is, the orthographic projection of the first portion 31 on the display layer 20 and the intermediate region 10a.
  • the orthographic projections on the display layer 20 coincide.
  • the side of the display layer 20 far from the selected curved region 10 b means that the portion of the display layer 20 facing the selected curved region 10 b is far from the selected curved region 10 b, that is, the orthographic projection of the second portion 32 on the display layer 20. It coincides with the orthographic projection of the selected curved region 10b on the display layer 20.
  • the first portion 31 is connected to the second portion 32. It can be understood that the transparent cover film layer 30 is a whole-layer film layer, and the connection of the first portion 31 and the second portion 32 means that the first portion 31 and the second portion 32 border, and the transition between the two is gentle.
  • the thickness of at least a part of the second portion 32 gradually decreases in a direction away from the first portion 31.
  • the thickness of a part of the area in the second portion 32 gradually decreases in a direction away from the first portion 31, and the thickness of the remaining area is uniform.
  • the thickness of the second portion 32 gradually decreases from a point where it is connected to the first portion 31 in a direction away from the first portion 31.
  • the thickness of the second portion 32 and the degree of its gradually decreasing thickness (that is, the slope angle of the interface b with respect to the interface a in FIG. 3) can be calculated according to the bending degree provided in the curved area 10 b in the display panel 100.
  • the present disclosure The embodiment is not limited thereto.
  • the transparent cover film layer 30 is located on a side of the display layer 20 away from the flexible substrate 10, wherein the display layer 20 is configured to provide light for screen display, and the transparent cover film layer 30 is a light-transmissive film layer (for example, transparent or approximately transparent) Made of materials), which can facilitate the light emitted from the display layer 20 to pass through the transparent cover film layer 30, so that the viewer can see the display screen.
  • a light-transmissive film layer for example, transparent or approximately transparent
  • the display panel 100 according to the embodiment of the present disclosure is shown in FIG. 3. After the display panel 100 is bent, the light emitted from the display layer 20 enters the transparent cover film layer 30 on the side of the selected curved region 10 b. In the second part 32, since the thickness of at least a part of the second part 32 gradually decreases in a direction away from the first part 31, the second part 32 is close to the interface of one side of the display layer 20 (labeled a in FIG. 3) It is non-parallel to the interface (labeled b in FIG. 3) on the side of the second portion 32 far from the display layer 20.
  • the refractive index of the transparent cover film layer 30 is greater than the refractive index of air.
  • the normal line (labeled c in Figure 3) is used as a reference.
  • the refraction angle is greater than the incident angle, so the emitted light is deflected in a direction deviating from the middle area 10a (that is, the positive direction of the screen).
  • the way the light is deflected is shown in Figure 3. As shown by the arrows, thereby reducing the viewing angle difference caused by the viewer viewing the curved area when facing the display panel, which can effectively improve the color shift of the picture in the curved area when the viewer is facing the display panel, The display effect of the display panel.
  • the display panel 100 in a region corresponding to the curved region 10b, light emitted from the display layer 20 is deflected toward the middle region 10a after exiting through the second portion 32. This part of the light can also serve as a supplementary display panel The effect of the light emitted from the middle region 10a of 100 increases the brightness of the display panel 100.
  • the thickness of at least a part of the second portion near the edge gradually decreases.
  • the thinned structure can also have the effect of facilitating the display panel 100 to be bent.
  • the display panel 100 further includes a cover plate located on the side of the transparent cover film layer 30 away from the display layer 20 to protect other film layers in the display panel 100.
  • the cover plate can be selected according to actual needs, as long as the refractive index of the cover plate is smaller than that of the transparent cover film layer 30.
  • the cover plate is a flexible material, and the cover plate can be bent along with the bending of the transparent cover film layer 30, the display layer 20 and the flexible substrate 10.
  • the cover plate is a rigid material (for example, cover glass), and the portion of the cover plate corresponding to the selected bending area 10b has a corresponding bending structure, and the degree of bending is similar to that of the transparent cover film layer 30, the display layer 20, and the flexible substrate.
  • the bending degree of each film layer such as 10 is matched, so that after the film layers are bent, the cover is attached to the side of the transparent cover film layer 30 away from the display layer 20.
  • the thickness of the second portion 32 is gradually reduced from the connection with the first portion 31 in a direction away from the first portion 31, thereby ensuring that the second portion 32 is far from the display.
  • the interface b on one side of the layer 20 is not parallel to the interface a on the side near the display layer 20 as a whole, so that light emitted from the portion of the display layer 20 corresponding to the selected curved region 10b can be more deflected toward the middle region 10a. Deflect.
  • the area of the selected curved region 10b in the display panel 100 is generally small, and the area of the second portion 32 facing the selected curved region 10b is also small.
  • the entire thickness of the second portion 32 is set to be equal to that of the first portion 32.
  • the connecting portion of the part 31 is gradually reduced in a direction away from the first part 31.
  • the area of preparing the special-shaped area as much as possible can be obtained, which is convenient for the transparent cover film layer 30. Preparation, reducing process difficulty.
  • the thickness of the first portion 31 is set to a uniform thickness, which can prevent the display layer 20 from affecting the display due to the uneven thickness of the first portion 31 when the light is emitted from the flat middle region 10 a. effect.
  • the second portion 32 is configured such that the thickness at the junction of the second portion 32 and the first portion 31 is equal to the thickness of the first portion 31, that is, a structure in which the transparent cover film layer 30 is thick in the middle and thin near the edge is formed gently, This facilitates the preparation of the transparent cover film layer 30 and reduces the process difficulty.
  • the thickness where the second portion 32 is connected to the first portion 31 is equal to the thickness of the first portion 31, so that the transparent cover film layer 30 has the first portion 31 having a uniform thickness and a second portion having a gradually decreasing thickness.
  • the gently changing structure of section 32 is equal to the thickness of the first portion 31, so that the transparent cover film layer 30 has the first portion 31 having a uniform thickness and a second portion having a gradually decreasing thickness.
  • the flexible substrate 10 further includes: an edge region 10 c located on a side of the selected curved region 10 b away from the intermediate region 10 a.
  • the transparent cover film layer 30 further includes a third portion 33 located on a side of the display layer 20 away from the edge region 10 c.
  • the side of the display layer 20 away from the edge region 10c refers to the side of the portion of the display layer 20 facing the edge region 10c away from the edge region 10c. That is, the orthographic projection of the third portion 33 on the display layer 20 coincides with the orthographic projection of the edge region 10 c on the display layer 20.
  • the transparent cover film layer 30 is a whole-layer film layer, and the third portion 33 and the second portion 32 are connected, that is, the third portion 33 and the second portion 32 border each other, and there is a smooth transition between the two.
  • the thickness of the third portion 33 may be flexibly set according to the actual needs of the display panel 100.
  • the thickness of the third portion 33 is set to a uniform thickness, and the thickness of the third portion 33 is equal to the thickness of the second portion 32 where the third portion 33 and the second portion 32 are connected, that is, the third portion.
  • the thickness of 33 is equal to the minimum thickness to which the thickness of the second portion 32 is gradually reduced.
  • FIG. 8 referring to FIG.
  • the thickness of the third portion 33 is set to gradually decrease from the point where it is connected to the second portion 32 in a direction away from the second portion 32, that is, the slope of the third portion 33 presents a form of natural decline in order to facilitate The preparation of the transparent cover film layer 30 reduces the process difficulty.
  • the display layer 20 includes a plurality of light emitting devices.
  • each of the plurality of light emitting devices is a top emission type light emitting device.
  • the top-emission type light-emitting device is a top-emission type OLED device, and includes: a reflective electrode, a light-emitting functional layer, a transmission electrode, and a light extraction layer which are far away from the flexible substrate 10 in order.
  • the top emission means that the light emitted from the light emitting device does not pass through the flexible substrate 10 but is emitted from a side of an electrode (that is, a transmission electrode) far from the side of the flexible substrate 10.
  • the reflective electrode is used as an anode, and its structure is usually a laminated structure (such as an Ag / ITO laminated structure), in which a metal layer (Ag) portion having a higher reflectance is disposed further away from the light emitting functional layer and a high work function ITO layer portion is disposed To be closer to the light emitting functional layer to improve the hole injection efficiency.
  • a laminated structure such as an Ag / ITO laminated structure
  • the light-emitting functional layer includes a hole injection layer (HIL, Hole Injection Layer), a hole transport layer (HTL, Hole Transport layer), a light emitting layer (EL, Emission Layer), and an electron transport layer (ETL, Electron Transport) Layer) and electron injection layer (EIL, Electron Injection Layer).
  • HIL hole injection layer
  • HTL Hole Transport layer
  • EL light emitting layer
  • ETL Electron Transport Layer
  • EIL Electron Injection Layer
  • the transmissive electrode serves as a cathode and is composed of a metal material (such as Li, Mg, etc.) with a low work function to improve the electron injection efficiency.
  • the thickness of the metal layer of the transmissive electrode is small to achieve a translucent shape, so that light can pass through the transmissive electrode smoothly.
  • a light extraction layer (CPL, Capping layer) is located on the side of the transmissive electrode away from the light-emitting functional layer, so as to improve the light output.
  • the material of the light extraction layer is usually an organic material having a large refractive index and a small light absorption coefficient.
  • the transparent cover film layer 30 is used as a thin film encapsulation layer (TFE, Thin Film Encapsulation), and the thin film encapsulation layer is configured to encapsulate a plurality of light emitting devices to prevent light emitting devices from generating light emission performance after being attacked by water and oxygen.
  • TFE Thin Film Encapsulation
  • the adverse effect can improve the color shift phenomenon after the display panel 100 is bent while protecting the light emitting device.
  • the first portion 31 includes at least one film layer disposed in a stack
  • the second portion 32 includes at least one film layer that is in one-to-one correspondence with the at least one film layer in the first portion 31; wherein the second portion 32 The thickness of at least a part of at least one of the film layers gradually decreases in a direction away from the first part.
  • the transparent cover film layer 30 includes a film layer.
  • the first portion 31 includes a first organic layer 311, and the second portion 32 includes a second organic layer 321.
  • the first organic layer 311 is connected to the second organic layer 321, and the thickness of at least a part of the second organic layer 321 is along the The direction away from the first organic layer 311 gradually decreases.
  • the first organic layer 311 and the second organic layer 321 form a whole-layer organic layer structure, and the first organic layer 311 and the second organic layer 321 transition smoothly.
  • the transparent cover film layer 30 includes a plurality of film layers.
  • the transparent cover film layer 30 is used as a thin-film encapsulation layer, the transparent cover film layer 30 having a structure with multiple film layers can more effectively prevent water and oxygen from eroding the light emitting device, and improve the transparency of the transparent cover film layer 30. Encapsulation effect.
  • the first portion 31 includes a first inorganic layer 312 and a first organic layer 311 that are sequentially stacked in a direction away from the flexible substrate 10.
  • the second portion 32 includes a second inorganic layer 322 and a second organic layer 321 which are sequentially stacked in a direction away from the flexible substrate 1.
  • the first organic layer 311 and the second organic layer 321 are connected to form a whole organic layer
  • the first inorganic layer 312 and the second inorganic layer 322 are connected to form a whole inorganic layer.
  • the thickness of at least a part of the second organic layer 321 is gradually reduced in a direction away from the first organic layer 311, so that the organic layer can easily obtain a gradually reduced thickness structure by adjusting the preparation process, and reduce the difficulty of the preparation process. .
  • providing the first inorganic layer 312 and the second inorganic layer 322 have the same thickness can simplify the manufacturing process.
  • the transparent cover film layer 30 When the transparent cover film layer 30 is used as a thin-film encapsulation layer, the transparent cover film layer 30 has a structure in which an inorganic layer and an organic layer are sequentially stacked in a direction away from the flexible substrate 10, which can effectively improve the entire transparent cover film layer 30.
  • Ability to block water and oxygen attack Of course, it is also possible that the transparent cover film layer 30 has a structure in which an organic layer and an inorganic layer are sequentially stacked in a direction away from the flexible substrate 10.
  • the first portion 31 includes a first organic layer 311 and a third inorganic layer 313 which are sequentially stacked in a direction away from the flexible substrate 10.
  • the second portion 32 includes a layer which is sequentially stacked in a direction away from the flexible substrate The second organic layer 321 and the fourth inorganic layer 323.
  • the first organic layer 311 and the second organic layer 321 are connected to form a whole organic layer, and the thickness of at least a part of the second organic layer 321 gradually decreases in a direction away from the first organic layer 311.
  • the third inorganic layer 313 and the fourth inorganic layer 323 are connected to form a whole inorganic layer, and both have the same thickness to simplify the manufacturing process.
  • the thickness of the third inorganic layer 313 should be as thin as possible, so that after the third inorganic layer 313 is covered on the second organic layer 321, its thickness will not affect the overall thickness of the second portion 32 away from the first layer. The effect that the direction of part 31 is gradually reduced.
  • the first portion 31 includes a first inorganic layer 312, a first organic layer 311, and a third inorganic layer 313 which are sequentially stacked in a direction away from the flexible substrate 10; the second portion 32 includes a distance away from the flexible substrate.
  • a second organic layer 322, a second inorganic layer 321, and a fourth inorganic layer 323 are stacked in this order on the substrate 10 in this order.
  • the first inorganic layer 312 and the second inorganic layer 322 are connected to form an entire inorganic layer.
  • the first organic layer 311 and the second organic layer 321 are connected to form a whole organic layer, and the thickness of at least a part of the second organic layer 321 gradually decreases in a direction away from the first organic layer 311.
  • the third inorganic layer 313 and the fourth inorganic layer 323 are connected to form a whole inorganic layer, and both have the same thickness to simplify the manufacturing process.
  • the transparent cover film layer 30 is provided with a laminated structure of an inorganic layer / organic layer / inorganic layer.
  • the transparent cover film layer 30 is used as a thin film encapsulation layer, the overall resistance of the transparent cover film layer 30 from water and oxygen can be improved ability.
  • the material for forming any of the first inorganic layer 312, the second inorganic layer 322, the third inorganic layer 313, or the fourth inorganic layer 323 may be a densely structured silicon oxynitride (for example, silicon nitride SiN x , dioxide Inorganic materials such as silicon SiO 2 , silicon oxynitride (SiON), or aluminum oxide AlO x ; materials forming the first organic layer 311 or the second organic layer 321 include acrylic polymer, silicon polymer, or epoxy polymer, etc. This is not limited in some embodiments of the present disclosure.
  • the transparent cover film layer 30 further includes a third portion 33
  • the structure of the third portion 33 matches that of the second portion 32.
  • the third portion is correspondingly formed. The layers in 33 are not repeated here.
  • the display layer 20 includes a plurality of light emitting devices, and a thin film encapsulation layer 40 and an adhesive layer 50 located between the display layer 20 and the transparent cover film layer 30.
  • the thin film encapsulation layer 40 is configured to encapsulate the plurality of light emitting devices described above, and the adhesive layer 50 is configured to adhere the thin film encapsulation layer 40 and the transparent cover film layer 30.
  • the light emitting device is, for example, a top emission type light emitting device.
  • a top emission type light emitting device For the structure of the top emission type light emitting device, refer to the above description, which is not repeated here.
  • the thin film encapsulation layer 40 is a uniform thickness encapsulation layer, and some embodiments of the present disclosure do not limit the structure thereof.
  • the adhesive layer 50 is made of an adhesive material with high transparency.
  • the adhesive material of the adhesive layer 50 is made of Dam glue (dam glue).
  • the material of the Dam glue is, for example, epoxy resin.
  • the transparent cover film layer 30 is, for example, a film obtained by processing and having a shape capable of deflecting light passing through the second portion 32 thereof in the direction of the first portion 31.
  • the transparent cover film layer 30 includes a first portion 31, a second portion 32, and a third portion 33, and each portion may have a single-layer or multi-layer structure.
  • the transparent cover film layer 30 shown in FIG. 11 is bonded to the thin film encapsulation layer 40 in the display panel 100 through the adhesive layer 50, that is, the display layer 20 is implemented by using, for example, Dam + Film. Further encapsulation, thereby improving the ability to block water and oxygen erosion in the environment, and ensuring that the light-emitting layer 20 has good light-emitting performance.
  • an embodiment of the present disclosure provides a method for manufacturing a display panel, including S1 to S3.
  • a flexible substrate 10 is provided.
  • a display layer 20 is formed on one side of the flexible substrate 10.
  • a transparent cover film layer 30 is formed on a side of the display layer 20 away from the flexible substrate 10.
  • the formed flexible substrate 10 includes a middle region 10 a and a selected curved region 10 b at at least one side around the middle region 10 a, wherein the selected curved region 10 b is set to be bent away from the display layer 20.
  • the formed transparent cover film layer 30 includes: a first portion 31 on a side of the display layer 20 away from the intermediate region 10a, and a second portion 32 on a side of the display layer 20 away from the selected curved region 10b; the first portion 31 and the first The two portions 32 are connected, and the thickness of at least a part of the second portion 32 gradually decreases in a direction away from the first portion 31.
  • the thickness of the second portion 32 formed in step S3 is gradually reduced from a point where the second portion 32 is connected to the first portion 31 in a direction away from the first portion 31.
  • the area of the selected curved area 10b in the display panel 100 is generally small, and the area of the second portion 32 facing the selected curved area 10b is also small. Therefore, the overall thickness of the second portion 32 is set to be smaller than that of the first portion 31.
  • the connection point gradually decreases in a direction away from the first portion 31, and the area of preparing the special-shaped area as much as possible can be obtained in the process of preparing the second portion 32 of the transparent cover film layer 30, which facilitates the preparation of the transparent cover film layer 30 To reduce the difficulty of the process.
  • step S3 includes: S32, using an inkjet printing process, forming a first organic layer 311 on a side of the display layer 20 away from the intermediate region 10a; and forming a first layer on the side of the display layer 20 away from the selected curved region 10b Second organic layer 321.
  • the first organic layer 311 is connected to the second organic layer 321.
  • step S32 includes: adjusting the process parameters of the inkjet printing process so that the overall thickness of the second organic layer 321 gradually decreases from the connection point with the first organic layer 311 in a direction away from the first organic layer 311, In order to increase the processing area of the thinned region in the second organic layer 321, the preparation of the second organic layer 321 is facilitated.
  • the above-mentioned process parameters include: the output amount of the inkjet printing material and / or the residence time of the inkjet printing.
  • the thickness of the transparent cover film layer 30 is gradually thinned from the middle to the curved area near the edge. structure.
  • the boundary between the middle region 10a and the selected curved region 10b can be produced.
  • the output of the inkjet printing material and / or the residence time of the inkjet printing are gradually reduced to form the thickness of the second organic layer 321 from the position where the first organic layer 311 is connected.
  • the selected curved region 10b can be made the farthest away from the intermediate region 10a.
  • the output of the inkjet printing material and / or the residence time of the inkjet printing are gradually increased to form the thickness of the second organic layer 321 from the first organic layer 311.
  • the structure gradually decreases in a direction away from the first organic layer 311.
  • S3 further includes S31 and / or S33.
  • a first inorganic layer is formed on the side of the display layer 20 away from the intermediate region 10a by the same deposition process, and the display layer 20 is away from the selected curved region.
  • a second inorganic layer 322 is formed on one side of 10b. The first inorganic layer 312 and the second inorganic layer 322 are connected and have the same thickness, and they are an integrated structure.
  • a deposition method such as CVD (Chemical Vapor Deposition) is used.
  • the same deposition process is used to form a third inorganic layer 313 on the side of the first organic layer 311 away from the flexible substrate 10, and on the second organic layer 321.
  • a fourth inorganic layer 323 is formed on the side far from the flexible substrate 10.
  • the third inorganic layer 313 and the fourth inorganic layer 323 are connected and have the same thickness, and they are an integrated structure.
  • the deposition process uses, for example, a CVD (Chemical Vapor Deposition, chemical vapor deposition) deposition method.
  • the transparent cover film layer 30 further includes the third portion 33
  • the structure of the third portion 33 matches that of the second portion 32.
  • the first portion is formed correspondingly.
  • the film layer in the third part 33 is not described herein again.
  • S2 includes: S21, forming a plurality of light emitting devices on the middle region 10a and the selected curved region 10b; wherein the light emitting device is, for example, a top emission type light emitting device.
  • the top-emission type light-emitting device is a top-emission type OLED device.
  • the manufacturing method is as follows: a reflective electrode is formed on one side of the flexible substrate 10, and a light-emitting functional layer and a transmission layer are sequentially evaporated on the side of the reflective electrode away from the flexible substrate 10. Electrode and light extraction layer.
  • a reflective electrode is formed on one side of the flexible substrate 10
  • a light-emitting functional layer and a transmission layer are sequentially evaporated on the side of the reflective electrode away from the flexible substrate 10. Electrode and light extraction layer.
  • the transparent cover film layer 30 in the display panel 100 is used as a thin film encapsulation layer, or the display panel 100 is provided with the transparent cover film layer 30 and the thin film encapsulation layer 40.
  • the transparent cover film layer 30 in the display panel 100 serves as a thin film encapsulation layer.
  • S3 includes: forming a thin film encapsulation layer on a side of the display layer 20 away from the flexible substrate 10. That is, the transparent cover film layer 30 is used as a thin-film encapsulation layer to encapsulate the plurality of light-emitting devices.
  • the display panel 100 is provided with a transparent cover film layer 30 and a thin film encapsulation layer 40. Based on this, as shown in FIG. 14, before S3, the method for manufacturing the display panel further includes S4 to S5.
  • a thin-film encapsulation layer 40 is formed on a side of the display layer 20 away from the flexible substrate 10 to encapsulate a plurality of light-emitting devices.
  • An adhesive layer 50 is formed on a side of the thin film encapsulation layer 40 away from the display layer 20.
  • the adhesive layer 50 is configured to adhere the thin film encapsulation layer 40 and the transparent cover film layer 30.
  • a film (Film) having a shape capable of deflecting light passing through the second portion 32 of the second portion 32 toward the first portion 31 can be formed by processing, and the film (Film) is used as a transparent cover film. Layer 30. Then, the transparent cover film layer 30 is bonded to the thin film encapsulation layer 40 in the display panel 100 through the adhesive layer 50, that is, to further encapsulate the display layer 20 in a manner such as Dam + Film, thereby improving the blocking of water in the environment.
  • the ability of oxygen attack ensures that the light-emitting layer 20 has good light-emitting performance.
  • an embodiment of the present disclosure further provides a display device 01 including the display panel 100 in any of the above embodiments.
  • the display device 01 is, for example, a device or component such as a smart bracelet, a smart helmet, a mobile phone, a tablet, a television, a display, a notebook computer, a digital photo frame, or a navigator having a curved display function.

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Abstract

一种显示面板（100），包括：柔性基板（10）；柔性基板（10）包括：中间区域（10a）和位于中间区域（10a）四周至少一侧处的所选弯曲区域（10b）；位于柔性基板（10）的一侧的显示层（20）；位于显示层（20）远离柔性基板（10）的一侧的透明覆盖膜层（30）；透明覆盖膜层（30）包括：位于显示层（20）远离中间区域（10a）的一侧的第一部分（31），以及位于显示层（20）远离所选弯曲区域（10b）的一侧的第二部分（32）；其中，所选弯曲区域（10b）被设置为向远离显示层（20）的方向弯曲；第一部分（31）与第二部分（32）相连接，且第二部分（32）中至少部分区域的厚度沿远离第一部分（31）的方向逐渐减小。该面板改善了观看者在面对显示面板时所看到弯曲区域的画面的色偏，提高了显示效果。

Description

显示面板及其制备方法、显示装置
本申请要求于2018年05月24日提交中国专利局、申请号为201810509065.7、申请名称为“一种显示面板及其制备方法、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及柔性显示技术，尤其涉及一种显示面板及其制备方法、显示装置。
背景技术
随着显示技术的不断发展，柔性显示面板因具有可弯曲、柔韧性佳的特性，得到了越来越多的关注。柔性显示面板包括柔性有机发光二极管(OLED)显示面板、柔性电泳显示(EPD)面板及柔性液晶显示(LCD)面板等。
发明内容
一方面，本公开的一些实施例提供一种显示面板，包括：柔性基板、位于所述柔性基板的一侧的显示层，以及位于所述显示层远离所述柔性基板的一侧的透明覆盖膜层。所述柔性基板包括：中间区域和位于所述中间区域四周至少一侧处的所选弯曲区域；所述所选弯曲区域被设置为向远离所述显示层的方向弯曲。所述透明覆盖膜层包括：位于所述显示层远离所述中间区域的一侧的第一部分，以及位于所述显示层远离所述所选弯曲区域的一侧的第二部分；其中，所述第一部分与所述第二部分相连接，且所述第二部分中至少部分区域的厚度沿远离所述第一部分的方向逐渐减小。
在一些实施例中，所述第二部分的厚度从与所述第一部分相连接处沿 远离所述第一部分的方向逐渐减小。
在一些实施例中，所述显示层包括多个发光器件；所述透明覆盖膜层包括薄膜封装层，所述薄膜封装层被配置为封装所述多个发光器件。
在一些实施例中，所述第一部分包括层叠设置的至少一个膜层，所述第二部分包括与所述第一部分中的至少一个膜层一一对应地连接的至少一个膜层；其中，所述第二部分的至少一个膜层中的至少部分区域的厚度沿远离所述第一部分的方向逐渐减小。
在一些实施例中，所述第一部分包括第一有机层；所述第二部分包括第二有机层；其中，所述第一有机层与所述第二有机层相连接，且所述第二有机层中至少部分区域的厚度沿远离所述第一有机层的方向逐渐减小。
在一些实施例中，所述第一部分还包括：位于所述第一有机层靠近所述柔性基板一侧的第一无机层；所述第二部分还包括：位于所述第二有机层靠近所述柔性基板一侧的第二无机层；其中，所述第一无机层与所述第二无机层相连接，且二者厚度相同。
在一些实施例中，所述第一部分还包括：位于所述第一有机层远离所述柔性基板一侧的第三无机层；所述第二部分还包括：位于所述第二有机层远离所述柔性基板一侧的第四无机层；其中，所述第三无机层与所述第四无机层相连接，且二者厚度相同。
在一些实施例中，所述显示层包括多个发光器件。所述显示面板还包括：位于所述显示层与所述透明覆盖膜层之间的薄膜封装层和粘结层。所述薄膜封装层被配置为封装所述多个发光器件，所述粘结层被配置为粘结所述薄膜封装层与所述透明覆盖膜层。
在一些实施例中，所述多个发光器件中的每个发光器件包括顶发光型发光器件。所述顶发光型发光器件包括：依次远离所述柔性基板的反射电极、发光功能层、透射电极和光取出层。
在一些实施例中，所述第一部分的厚度均一，且所述第二部分与所述 第一部分相连接处的厚度等于所述第一部分的厚度。
在一些实施例中，所述柔性基板还包括：位于所述所选弯曲区域远离所述中间区域一侧的边缘区域。所述透明覆盖膜层还包括：位于所述显示层远离所述边缘区域的一侧的第三部分；其中，所述第三部分与所述第二部分相连接。
在一些实施例中，所述第三部分的厚度从与所述第二部分相连接处沿远离所述第二部分的方向逐渐减小。
在一些实施例中，所述第三部分的厚度等于所述第三部分与所述第二部分连接处的厚度。
另一方面，本公开的一些实施例提供一种显示装置，包括如上任一实施例所述的显示面板。
又一方面，本公开的一些实施例提供一种显示面板的制备方法，包括：提供柔性基板，在所述柔性基板的一侧形成显示层，在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，将所述所选弯曲区域向远离所述显示层的方向弯曲。所述柔性基板包括：中间区域和位于所述中间区域四周至少一侧处的所选弯曲区域；其中，所述柔性基板的所述所选弯曲区域被设置为向远离所述显示层的方向弯曲。所述透明覆盖膜层包括：位于所述显示层远离所述中间区域的一侧的第一部分，以及位于所述显示层远离所述所选弯曲区域的一侧的第二部分；所述第一部分与所述第二部分相连接，且所述第二部分中至少部分区域的厚度沿远离所述第一部分的方向逐渐减小。
在一些实施例中，形成的所述第二部分的厚度从与所述第一部分相连接处沿远离所述第一部分的方向逐渐减小。
在一些实施例中，所述在所述柔性基板的一侧形成显示层，包括：在所述中间区域和所述所选弯曲区域上形成多个发光器件。所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，包括：在所述显示层远离 所述柔性基板的一侧形成薄膜封装层，所述薄膜封装层被配置为封装所述多个发光器件。
在一些实施例中，所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，包括：采用喷墨打印工艺，在所述显示层远离所述中间区域的一侧形成第一有机层，在所述显示层远离所述所选弯曲区域的一侧形成第二有机层；所述第一有机层与所述第二有机层相连接；其中，通过调节所述喷墨打印工艺的工艺参数，控制所述第二有机层的至少部分区域的厚度沿远离所述第一有机层的方向逐渐减小。
在一些实施例中，在形成所述第一有机层和所述第二有机层之前，所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，还包括：采用同一次沉积工艺，在所述显示层远离所述中间区域的一侧形成第一无机层，在所述显示层远离所述所选弯曲区域的一侧形成第二无机层；所述第一无机层与所述第二无机层相连接且厚度相同。
在一些实施例中，在形成所述第一有机层和所述第二有机层之后，所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，还包括：采用同一次沉积工艺，在所述第一有机层远离所述柔性基板的一侧形成第三无机层，在所述第二有机层远离所述柔性基板一侧形成第四无机层；所述第三无机层与所述第四无机层相连接且厚度相同。
在一些实施例中，所述在所述柔性基板的一侧形成显示层，包括：在所述中间区域和所述所选弯曲区域上形成多个发光器件。所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层之前，所述显示面板的制备方法还包括：在所述显示层远离所述柔性基板的一侧形成封装所述多个发光器件的薄膜封装层；在所述薄膜封装层远离所述显示层的一侧形成粘结层，其中，所述粘结层被配置为粘结所述薄膜封装层与所述透明覆盖膜层。
附图说明
为了更清楚地说明本公开的一些实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为根据相关技术中的一种显示面板在弯曲前后的结构示意图；
图2为根据本公开的一些实施例的一种显示面板在弯曲前的结构示意图；
图3为根据本公开的一些实施例的一种显示面板在弯曲后的结构示意图；
图4为图2所示显示面板中一种透明覆盖膜层的结构示意图；
图5为图2所示显示面板中另一种透明覆盖膜层的结构示意图；
图6为根据本公开的一些实施例的另一种显示面板在弯曲前的结构示意图；
图7为根据本公开的一些实施例的一种显示面板在弯曲后的结构示意图；
图8为图6所示显示面板中一种透明覆盖膜层的结构示意图；
图9为图6所示显示面板中另一种透明覆盖膜层的结构示意图；
图10为根据本公开的一些实施例的又一种显示面板的结构示意图；
图11为图10所示显示面板中透明覆盖膜层的结构示意图；
图12为根据本公开的一些实施例的一种显示面板的制备方法的流程图；
图13为根据本公开的一些实施例的一种制备透明覆盖层的方法的流程图；
图14为根据本公开的一些实施例的另一种显示面板的制备方法的流程图；
图15为根据本公开的一些实施例的一种显示装置的结构示意图。
具体实施方式
下面将结合本公开一些实施例中的附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的一些实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。“和/或”仅仅是描述关联对象的关联关系，表示三种关系，例如，A和/或B，表示为：单独存在A，同时存在A和B，单独存在B这三种情况。“上/上方”、“下/下方”、等指示的方位或位置关系的术语为基于附图所示的方位或位置关系，仅是为了便于说明本公开的技术方案的简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
并且，为了清楚起见，本公开一些实施例附图中的各区域大小和/或膜层厚度均被放大，除非另有说明，均不代表实际尺寸和/或比例。
显示装置中，利用显示面板柔性、可弯曲的优势，通过在显示面板边缘形成弯曲结构，并在显示面板外部进行3D cover(立体盖板)设计，有助于实现显示装置窄边框、全屏显示的效果。显示面板在弯曲后包括平整区域和弯曲区域。如图1所示，显示面板包括用于出光的第一膜层20'，以及覆盖在第一膜层20'上的第二膜层30'，其中，第二膜层30'厚度均一。当显示面板进行弯曲后，从第一膜层20'的弯曲区域射出的光线垂直进入第二膜层30'位于弯曲区域内的部分。由于第二膜层30'位于弯曲区域内的部分上下的两个界面为相互平行的弧线，因此这部分光线不会发生偏 转，会继续地垂直射出，光线垂直射出的方式如图1中箭头所示。由于光线从弯曲区域射出的方向指向远离显示面板中间的平整区域的方向，因此，在观看者面对显示面板观看画面的时，相对于观看平整区域而言，观看者在观看弯曲区域时容易产生视角差异，导致观看者看到的弯曲区域的画面颜色与中间的平整区域的画面颜色之间产生差异，即观看者在面对显示面板时所看到的弯曲区域的画面存在色偏，从而影响显示面板的显示效果。
如图2所示，本公开的一些实施例提供了一种显示面板100，该显示面板100包括：柔性基板10、位于柔性基板10一侧的显示层20以及位于显示层20远离柔性基板10的一侧的透明覆盖膜层30。
可选地，柔性基板10包括：柔性衬底和位于柔性衬底上的TFT(Thin Film Transistor，薄膜晶体管)阵列层，其中，TFT阵列层由阵列排布的多个TFT构成，TFT的结构和排布方式可依据实际需求设置，本公开的一些实施例对此不作限定。
柔性基板10包括：中间区域10a和位于中间区域10a四周至少一侧处的所选弯曲区域10b。所选弯曲区域10b被设置为向远离显示层20的方向弯曲(如图2中箭头方向所示)。也就是说，当观看者面对显示面板100观看显示画面时，弯曲区域10b向远离观看者的方向弯曲(弯曲后的显示面板100如图3所示)。
上述所选弯曲区域10b的弯曲程度可根据显示面板100的设计需求灵活设置，本公开的实施例对此不作限定。
在一些实施例中，位于柔性基板10的一侧的显示层20和透明覆盖膜层30也均具有可弯曲性，以实现显示面板100整体的可弯曲性。在柔性基板10的所选弯曲区域10b被设置为向远离显示层20的方向进行弯曲的情况下，显示层20和透明覆盖膜层30均向靠近柔性基板10的方向进行弯曲，即，柔性基板10、显示层20和透明覆盖膜层30三者的弯曲 方向一致，从而使得显示面板100靠近边缘的至少一侧处呈现弯曲状态。
在图2所示的显示面板100中，是以所选弯曲区域10b位于中间区域10a的四周的相对两侧为例进行说明。当然，所选弯曲区域10b也可以位于中间区域10a的四周的任一侧、任两侧(例如为相对的两侧或相邻的两侧)、三个侧面或中间区域10a的四周。实际实施时可根据显示面板100的设计需求灵活调整，本公开的实施例对此不作限定。
透明覆盖膜层30包括：位于显示层20远离中间区域10a的一侧的第一部分31，以及位于显示层20远离所选弯曲区域10b的一侧的第二部分32。此处，显示层20远离中间区域10a的一侧是指，显示层20正对中间区域10a的部分远离中间区域10a的一侧，即第一部分31在显示层20上的正投影与中间区域10a在显示层20上的正投影重合。显示层20远离所选弯曲区域10b的一侧是指，显示层20正对所选弯曲区域10b的部分远离所选弯曲区域10b的一侧，即第二部分32在显示层20上的正投影与所选弯曲区域10b在显示层20上的正投影重合。
第一部分31与第二部分32相连接。可以理解的是，透明覆盖膜层30为一个整层的膜层，第一部分31与第二部分32相连接是指第一部分31与第二部分32接壤，二者之间平缓过渡。
第二部分32中至少部分区域的厚度沿远离第一部分31的方向逐渐减小。可选地，参考图4，第二部分32中一部分区域的厚度沿远离第一部分31的方向逐渐减小，其余部分区域的厚度是均一的。或者，参考图5，第二部分32的厚度从与第一部分31相连接处沿远离第一部分31的方向逐渐减小。
这里，第二部分32的厚度以及其厚度逐渐减小的程度(即图3中界面b相对于界面a的坡角度)可根据显示面板100中弯曲区域10b被设置的弯曲程度计算得到，本公开的实施例对此不作限定。
透明覆盖膜层30位于显示层20远离柔性基板10的一侧，其中，显 示层20被配置为提供画面显示的光线，透明覆盖膜层30采用透光的膜层(例如，采用透明或近似透明的材料制成)，可以便于从显示层20射出的光线穿过透明覆盖膜层30，从而使观看者看到显示画面。
本公开的实施例提供的显示面板100，参考图3所示，显示面板100进行弯曲后，从显示层20射出的光线垂直进入到透明覆盖膜层30在位于所选弯曲区域10b一侧的第二部分32中，由于第二部分32中的至少部分区域的厚度沿远离第一部分31的方向逐渐减小，因此，第二部分32靠近显示层20的一侧界面(图3中标记为a)与第二部分32远离显示层20的一侧界面(图3中标记为b)非平行。这样一来，从显示层20出射至第二部分32的光线依次经过非平行的界面a、b后，由于透明覆盖膜层30的折射率大于空气的折射率，光从界面b射出时，以法线(图3中标记为c)为参照，折射角大于入射角，因此使得射出的光线向偏向于中间区域10a的方向(即屏幕的正方向)发生偏转，光线偏转的方式如图3中箭头所示，从而减小了观看者在面对显示面板时观看弯曲区域所产生的视角差异，进而可有效改善观看者在面对显示面板时所看到的弯曲区域的画面的色偏，提高显示面板的显示效果。
本公开的实施例提供的显示面板100，在弯曲区域10b对应的区域，从显示层20射出的光线在经过第二部分32出射后朝向中间区域10a偏转，这部分光线还可以起到补充显示面板100中间区域10a出射光线的作用，从而提高显示面板100的亮度。
本公开的实施例提供的显示面板100，靠近边缘的第二部分中至少部分区域的厚度逐渐减小，该减薄结构还可起到便于显示面板100进行弯曲的效果。
在一些实施例中，显示面板100还包括位于透明覆盖膜层30远离显示层20一侧的盖板，以对显示面板100中的其他膜层起到保护作用。
盖板的结构和材料可根据实际需要进行选择，只要盖板的折射率小 于透明覆盖膜层30的折射率即可。可选地，盖板为柔性材料，盖板可以随透明覆盖膜层30、显示层20及柔性基板10的弯曲而一并弯曲。或者，盖板为刚性材料(例如为盖板玻璃，cover glass)，盖板与所选弯曲区域10b对应的部分具有相应的弯曲结构，弯曲程度与透明覆盖膜层30、显示层20及柔性基板10等各膜层弯曲程度相匹配，以便在所述各膜层弯曲后，将盖板贴合在透明覆盖膜层30远离显示层20的一侧。
请参考图2和图3所示，在一些实施例中，第二部分32的厚度从与第一部分31相连接处沿远离第一部分31的方向逐渐减小，从而可保证第二部分32远离显示层20的一侧界面b与靠近显示层20的一侧界面a整体不平行，使得从显示层20对应所选弯曲区域10b的部分内射出的光线可更多地向偏向于中间区域10a的方向进行偏转。并且，显示面板100中所选弯曲区域10b的面积通常较小，正对所选弯曲区域10b的第二部分32的面积也较小，因此，将第二部分32的整体厚度设置为从与第一部分31相连接处沿远离第一部分31的方向逐渐减小，还可在制备透明覆盖膜层30的第二部分32的过程中获得尽可能大的制备异形区域的面积，便于透明覆盖膜层30的制备，减小工艺难度。
请继续参考图2和图3，在一些实施例中，第一部分31的厚度设置为均一厚度，可以避免显示层20从平坦的中间区域10a射出光线时由于第一部分31的厚度不均而影响显示效果。可选地，第二部分32被设置为：第二部分32与第一部分31相连接处的厚度等于第一部分31的厚度，即平缓地形成透明覆盖膜层30中间厚、靠近边缘薄的结构，以便于透明覆盖膜层30的制备，减小工艺难度。
可以理解的是，第二部分32与第一部分31相连接处的厚度等于第一部分31的厚度，从而使得透明覆盖膜层30具有从其中的厚度均一的第一部分31到厚度逐渐减小的第二部分32的平缓变化的结构。
请参考图6和图7所示，柔性基板10还包括：位于所选弯曲区域 10b远离中间区域10a一侧的边缘区域10c。透明覆盖膜层30还包括：位于显示层20远离边缘区域10c的一侧的第三部分33。此处，显示层20远离边缘区域10c的一侧是指，显示层20正对边缘区域10c的部分远离边缘区域10c的一侧。也就是说，第三部分33在显示层20上的正投影与边缘区域10c在显示层20上的正投影重合。
可以理解的是，透明覆盖膜层30为一个整层的膜层，第三部分33与第二部分32相连接，即，第三部分33与第二部分32接壤，二者之间平缓过渡。
在一些实施例中，第三部分33的厚度可根据显示面板100的实际需求灵活设置。可选地，参考图8，第三部分33的厚度设置为均一的厚度，第三部分33的厚度等于第三部分33与第二部分32连接处的第二部分32的厚度，即第三部分33的厚度等于第二部分32的厚度逐渐减小至的最小厚度。或者，参考图9，第三部分33的厚度设置为从与第二部分32相连接处沿远离第二部分32的方向逐渐减小，即第三部分33的坡度呈现自然下降的形式，以便于透明覆盖膜层30的制备、减小工艺难度。
在一些实施例中，显示层20包括多个发光器件。示例性地，多个发光器件中的每个发光器件为顶发光型发光器件。
顶发光型发光器件的结构可以有多种，本公开的实施例对此不做限定。可选地，顶发光型发光器件为顶发光型OLED器件，包括：依次远离柔性基板10的反射电极、发光功能层、透射电极和光取出层。此处，顶发光是指发光器件发出的光不穿过柔性基板10，而是从远离柔性基板10一侧的电极(即透射电极)的一侧射出的。
反射电极作为阳极，其结构通常为层叠状(如Ag/ITO层叠结构)，其中反射率较高的金属层(Ag)部分被设置为更远离发光功能层、高功函数的ITO层部分被设置为更靠近发光功能层，以提高空穴的注入效率。
发光功能层包括依次远离反射电极的空穴注入层(HIL，Hole  Injection Layer)、空穴传输层(HTL，Hole Transportation Layer)、发光层(EL，Emission Layer)、电子传输层(ETL，Electron Transportation Layer)和电子注入层(EIL，Electron Injection Layer)等。
透射电极作为阴极，由低功函数的金属材料(如Li、Mg等)构成，以提高电子的注入效率。透射电极的金属层厚度很小，以实现半透明状，从而使光线顺利透过透射电极。
光取出层(CPL，Capping layer)位于透射电极远离发光功能层的一侧，以提高出光率。光取出层的材料通常为折射率大、且吸光系数较小的有机材料。
在一些实施例中，将透明覆盖膜层30作为薄膜封装层(TFE，Thin Film Encapsulation)，薄膜封装层被配置为封装多个发光器件，以防止发光器件受水氧侵蚀后对其发光性能产生不利影响，从而可在对发光器件进行封装保护的同时，改善显示面板100弯曲后的色偏现象。
透明覆盖膜层30的结构可以有多种。在一些实施例中，第一部分31包括层叠设置的至少一个膜层，第二部分32包括与第一部分31中的至少一个膜层一一对应地连接的至少一个膜层；其中，第二部分32的至少一个膜层中的至少部分区域的厚度沿远离第一部分的方向逐渐减小。
示例性地，如图4所示，透明覆盖膜层30包括一个膜层。第一部分31包括第一有机层311，第二部分32包括第二有机层321；其中，第一有机层311与第二有机层321相连接，且第二有机层321中至少部分区域的厚度沿远离第一有机层311的方向逐渐减小。此处，第一有机层311和第二有机层321组成一个整层的有机层结构，第一有机层311和第二有机层321之间平缓过渡。
示例性地，透明覆盖膜层30包括多个膜层。在将透明覆盖膜层30作为薄膜封装层的情况下，采用具有多个膜层的结构的透明覆盖膜层30，可以更有效地防止水氧对发光器件的侵蚀，提高透明覆盖膜层30的封装 效果。
可选地，参考图5所示，第一部分31包括沿远离柔性基板10的方向依次层叠设置第一无机层312和第一有机层311。第二部分32包括沿远离柔性基板1的方向依次层叠设置的第二无机层322和第二有机层321。此处，第一有机层311和第二有机层321相连接，组成一个整层的有机层，第一无机层312与第二无机层322相连接，组成一个整层的无机层。
第二有机层321中至少部分区域的厚度沿远离第一有机层311的方向逐渐减小，以便于通过调节制备工艺使有机层较容易地获得厚度逐渐减小的结构，减小制备工艺的难度。另外，设置第一无机层312与第二无机层322的厚度相同，可以简化制备工艺。
在将透明覆盖膜层30作为薄膜封装层的情况下，上述透明覆盖膜层30采用在远离柔性基板10的方向依次层叠设置无机层和有机层的结构，可以有效地提高透明覆盖膜层30整体阻隔水氧侵蚀的能力。当然，透明覆盖膜层30采用在远离柔性基板10的方向依次层叠设置有机层和无机层的结构，也是可以的。
可选地，请参考图8，第一部分31包括沿远离柔性基板10的方向依次层叠设置的第一有机层311和第三无机层313.第二部分32包括沿远离柔性基板的方向依次层叠设置的第二有机层321和第四无机层323。第一有机层311和第二有机层321相连接，组成一个整层的有机层，且第二有机层321中至少部分区域的厚度沿远离第一有机层311的方向逐渐减小。第三无机层313与第四无机层323相连接，组成一个整层的无机层，且二者厚度相同，以简化制备工艺。
需要指出的是，第三无机层313的厚度应尽可能地薄，以使第三无机层313覆盖在第二有机层321上后，其厚度不会影响第二部分32实现整体厚度沿远离第一部分31的方向逐渐减小的效果。
可选地，请参考图9，第一部分31包括沿远离柔性基板10的方向依次层叠设置的第一无机层312、第一有机层311和第三无机层313；第二部分32包括沿远离柔性基板10的方向依次层叠设置的第二有机层322、第二无机层321和第四无机层323。第一无机层312与第二无机层322相连接，组成一个整层的无机层。第一有机层311和第二有机层321相连接，组成一个整层的有机层，且第二有机层321中至少部分区域的厚度沿远离第一有机层311的方向逐渐减小。第三无机层313与第四无机层323相连接，组成一个整层的无机层，且二者厚度相同，以简化制备工艺。此处，透明覆盖膜层30采用无机层/有机层/无机层的层叠结构设置，在将透明覆盖膜层30作为薄膜封装层的情况下，可以提高透明覆盖膜层30整体阻隔水氧侵蚀的能力。
形成上述第一无机层312、第二无机层322、第三无机层313或第四无机层323中任一无机层的材料可以选用结构致密的氮氧化硅(例如氮化硅SiN x、二氧化硅SiO 2、氮氧化硅SiON)或氧化铝AlO x等无机材料；形成第一有机层311或第二有机层321的材料包括丙烯酸基聚合物、硅基聚合物或环氧基聚合物等，本公开的一些实施例对此不作限定。
对于透明覆盖膜层30还包括第三部分33的情况，第三部分33的结构与第二部分32相匹配，在形成第二部分中的各无机或有机膜层时，对应地形成第三部分33中的膜层，此处不再赘述。
请参阅图10，在一些实施例中，显示层20包括：多个发光器件，以及位于显示层20与透明覆盖膜层30之间的薄膜封装层40和粘结层50。薄膜封装层40被配置为封装上述的多个发光器件，粘结层50被配置为粘结薄膜封装层40与透明覆盖膜层30。
这里，发光器件例如为顶发光型发光器件。顶发光型发光器件的结构参见上述说明，此处不再赘述。薄膜封装层40为厚度均一的封装层，本公开的一些实施例对其结构不做限定。
粘结层50采用透光性较高的胶材，可选地，粘结层50的胶材采用Dam胶(围堰胶)，Dam胶的材料例如为环氧树脂。
如图11所示，透明覆盖膜层30例如为通过加工得到的具有能够使穿过其第二部分32的光线向第一部分31的方向发生偏转的形状的薄膜(Film)。透明覆盖膜层30包括第一部分31、第二部分32及第三部分33，各部分可以为单层或多层结构。透明覆盖膜层30的结构可以参考上述描述，此处不再赘述。
如图10所示，将如图11所示的透明覆盖膜层30通过粘结层50与显示面板100中的薄膜封装层40进行贴合，即采用例如Dam+Film的方式实现对显示层20的进一步封装，从而提高了阻挡环境中水氧侵蚀的能力，确保发光层20具有良好的发光性能。
请参阅图12，本公开的实施例提供了一种显示面板的制备方法，包括S1～S3。
S1，提供柔性基板10。
S2，在柔性基板10的一侧形成显示层20。
S3，在显示层20远离柔性基板10的一侧形成透明覆盖膜层30。
形成的柔性基板10包括：中间区域10a和位于中间区域10a四周至少一侧处的所选弯曲区域10b，其中，所选弯曲区域10b被设置为向远离显示层20的方向弯曲。形成的透明覆盖膜层30包括：位于显示层20远离中间区域10a的一侧的第一部分31，以及位于显示层20远离所选弯曲区域10b的一侧的第二部分32；第一部分31与第二部分32相连接，且第二部分32中至少部分区域的厚度沿远离第一部分31的方向逐渐减小。
形成的显示面板100的有益效果可以参见前述显示面板100的一些实施例中的描述，此处不再赘述。
在一些实施例中，步骤S3中形成的第二部分32的厚度从与第一部分31相连接处沿远离第一部分31的方向逐渐减小。显示面板100中所 选弯曲区域10b的面积通常较小，正对所选弯曲区域10b的第二部分32的面积也较小，因此，将第二部分32的整体厚度设置为从与第一部分31相连接处沿远离第一部分31的方向逐渐减小，还可在制备透明覆盖膜层30的第二部分32的过程中获得尽可能大的制备异形区域的面积，便于透明覆盖膜层30的制备，减小工艺难度。
在一些实施例中，步骤S3包括：S32，采用喷墨打印工艺，在显示层20远离中间区域10a的一侧形成第一有机层311；在显示层20远离所选弯曲区域10b的一侧形成第二有机层321。第一有机层311与第二有机层321相连接。
形成第二有机层321的过程中，通过调节喷墨打印工艺的工艺参数，使得第二有机层321中至少部分区域的厚度沿远离第一有机层311的方向逐渐减小。可选地，步骤S32包括：通过调节喷墨打印工艺的工艺参数，使得第二有机层321整体的厚度从与第一有机层311相连接处沿远离第一有机层311的方向逐渐减小，以增大第二有机层321中厚度减薄区域的加工面积，便于第二有机层321的制备。
上述的工艺参数包括：喷墨打印材料的输出量和/或喷墨打印的停留时间，通过调节上述工艺参数实现透明覆盖膜层30的厚度平缓地从中间到靠近边缘的弯曲区域逐渐变薄的结构。
例如，在采用喷墨打印工艺，按照从中间区域10a向外侧的所选弯曲区域10b的方向进行透明覆盖膜层30的打印的情况下，可以在制作中间区域10a与所选弯曲区域10b的交界处对应的透明覆盖膜层30时，逐渐减小喷墨打印材料的输出量和/或喷墨打印的停留时间，以形成上述第二有机层321的厚度从与第一有机层311相连接处沿远离第一有机层311的方向逐渐减小的结构。
例如，在采用喷墨打印工艺，按照从所选弯曲区域10b向内侧的中间区域10a的方向进行透明覆盖膜层30的打印的情况下，可以在制作所 选弯曲区域10b远离中间区域10a的最外侧边界处对应的透明覆盖膜层30时，逐渐增加喷墨打印材料的输出量和/或喷墨打印的停留时间，以形成上述第二有机层321的厚度从与第一有机层311相连接处沿远离第一有机层311的方向逐渐减小的结构。
如图13所示，在一些实施例中，S3还包括S31和/或S33。
S31，在形成上述第一有机层311和第二有机层321之前，采用同一次沉积工艺，在显示层20远离中间区域10a的一侧形成第一无机层，在显示层20远离所选弯曲区域10b的一侧形成第二无机层322。第一无机层312与第二无机层322相连接且厚度相同，二者为一体结构。
沉积工艺例如采用CVD(Chemical Vapor Deposition，化学气相沉积法)等沉积方法。
S33，在形成上述第一有机层311、第二有机层321之后，采用同一次沉积工艺，在第一有机层311远离柔性基板10的一侧形成第三无机层313，在第二有机层321远离柔性基板10一侧形成第四无机层323。第三无机层313与第四无机层323相连接且厚度相同，二者为一体结构。沉积工艺例如采用CVD(Chemical Vapor Deposition，化学气相沉积法)的沉积方法。
这里，对于透明覆盖膜层30还包括第三部分33的情况，第三部分33的结构与第二部分32相匹配，在形成第二部分中的各无机或有机膜层时，对应地形成第三部分33中的膜层，此处第三部分33的制备过程不再赘述。
在一些实施例中，S2包括：S21，在中间区域10a和所选弯曲区域10b上形成多个发光器件；其中，该发光器件例如为顶发光型发光器件。
可选地，顶发光型发光器件为顶发光型OLED器件，其制作方法为：在柔性基板10的一侧形成反射电极，在反射电极远离柔性基板10的一侧依次蒸镀发光功能层、透射电极和光取出层。各层具体结构请参见前述 说明，此处不再赘述。
在一些实施例中，将显示面板100中的透明覆盖膜层30作为薄膜封装层，或者，显示面板100设置有透明覆盖膜层30和薄膜封装层40。
示例性地，显示面板100中的透明覆盖膜层30作为薄膜封装层。基于此，S3包括：在显示层20远离柔性基板10的一侧形成薄膜封装层。也就是说，将透明覆盖膜层30作为薄膜封装层，以封装上述多个发光器件。
示例性地，显示面板100设置有透明覆盖膜层30和薄膜封装层40。基于此，如图14所示，在S3之前，上述显示面板的制备方法还包括S4～S5。
S4，在显示层20远离柔性基板10的一侧形成封装多个发光器件的薄膜封装层40。
S5，在薄膜封装层40远离显示层20的一侧形成粘结层50。粘结层50被配置为粘结薄膜封装层40与透明覆盖膜层30。
这里可参考图11所示，通过加工形成具有能够使穿过其第二部分32的光线向其第一部分31的方向发生偏转的形状的薄膜(Film)，将该薄膜(Film)作为透明覆盖膜层30。然后将透明覆盖膜层30通过粘结层50与显示面板100中的薄膜封装层40进行贴合，即采用例如Dam+Film的方式实现对显示层20的进一步封装，从而提高了阻挡环境中水氧侵蚀的能力，确保发光层20具有良好的发光性能。
需要说明的是，本公开的显示面板制备方法的实施例中，形成的显示面板100中各部件的结构和有益效果的描述较为简单，其具体可以参见前述显示面板的实施例中的描述，此处不再赘述。
请参阅图15，本公开的实施例还提供了一种显示装置01，包括上述任一实施例中的显示面板100。
显示装置01例如为具有弯曲显示功能的智能手环、智能头盔、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框或导航仪等装置或部 件。
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种显示面板，包括：
    柔性基板；所述柔性基板包括：中间区域和位于所述中间区域四周至少一侧处的所选弯曲区域；
    位于所述柔性基板的一侧的显示层；
    位于所述显示层远离所述柔性基板的一侧的透明覆盖膜层；所述透明覆盖膜层包括：位于所述显示层远离所述中间区域的一侧的第一部分，以及位于所述显示层远离所述所选弯曲区域的一侧的第二部分；
    其中，所述所选弯曲区域被设置为向远离所述显示层的方向弯曲；所述第一部分与所述第二部分相连接，且所述第二部分中至少部分区域的厚度沿远离所述第一部分的方向逐渐减小。
  2. 根据权利要求1所述的显示面板，其中，所述第二部分的厚度从与所述第一部分相连接处沿远离所述第一部分的方向逐渐减小。
  3. 根据权利要求1所述的显示面板，其中，所述显示层包括多个发光器件；所述透明覆盖膜层包括薄膜封装层，所述薄膜封装层被配置为封装所述多个发光器件。
  4. 根据权利要求1～3任一项所述的显示面板，其中，所述第一部分包括层叠设置的至少一个膜层，所述第二部分包括与所述第一部分中的至少一个膜层一一对应地连接的至少一个膜层；
    其中，所述第二部分的至少一个膜层中的至少部分区域的厚度沿远离所述第一部分的方向逐渐减小。
  5. 根据权利要求4所述的显示面板，其中，所述第一部分包括第一有机层；所述第二部分包括第二有机层；
    其中，所述第一有机层与所述第二有机层相连接，且所述第二有机层中至少部分区域的厚度沿远离所述第一有机层的方向逐渐减小。
  6. 根据权利要求5所述的显示面板，其中，
    所述第一部分还包括：位于所述第一有机层靠近所述柔性基板一侧的第一无机层；所述第二部分还包括：位于所述第二有机层靠近所述柔性基板一侧的第二无机层；其中，所述第一无机层与所述第二无机层相连接，且二者厚度相同。
  7. 根据权利要求5或6所述的显示面板，其中，
    所述第一部分还包括：位于所述第一有机层远离所述柔性基板一侧的第三无机层；所述第二部分还包括：位于所述第二有机层远离所述柔性基板一侧的第四无机层；其中，所述第三无机层与所述第四无机层相连接，且二者厚度相同。
  8. 根据权利要求1所述的显示面板，其中，所述显示层包括多个发光器件；
    所述显示面板还包括：位于所述显示层与所述透明覆盖膜层之间的薄膜封装层和粘结层；所述薄膜封装层被配置为封装所述多个发光器件，所述粘结层被配置为粘结所述薄膜封装层与所述透明覆盖膜层。
  9. 根据权利要求3或8所述的显示面板，其中，所述多个发光器件中的每个发光器件包括顶发光型发光器件；
    所述顶发光型发光器件包括：依次远离所述柔性基板的反射电极、发光功能层、透射电极和光取出层。
  10. 根据权利要求2所述的显示面板，其中，所述第一部分的厚度均一，且所述第二部分与所述第一部分相连接处的厚度等于所述第一部分的厚度。
  11. 根据权利要求1所述的显示面板，其中，所述柔性基板还包括：位于所述所选弯曲区域远离所述中间区域一侧的边缘区域；
    所述透明覆盖膜层还包括：位于所述显示层远离所述边缘区域的一侧的第三部分；其中，所述第三部分与所述第二部分相连接。
  12. 根据权利要求11所述的显示面板，其中，所述第三部分的厚度从 与所述第二部分相连接处沿远离所述第二部分的方向逐渐减小。
  13. 根据权利要求11所述的显示面板，其中，所述第三部分的厚度等于所述第三部分与所述第二部分连接处的第二部分的厚度。
  14. 一种显示装置，其中，包括如权利要求1～13任一项所述的显示面板。
  15. 一种显示面板的制备方法，包括：
    提供柔性基板；所述柔性基板包括：中间区域和位于所述中间区域四周至少一侧处的所选弯曲区域；
    在所述柔性基板的一侧形成显示层；
    在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层；所述透明覆盖膜层包括：位于所述显示层远离所述中间区域的一侧的第一部分，以及位于所述显示层远离所述所选弯曲区域的一侧的第二部分；所述第一部分与所述第二部分相连接，且所述第二部分中至少部分区域的厚度沿远离所述第一部分的方向逐渐减小；
    其中，所述柔性基板的所述所选弯曲区域被设置为向远离所述显示层的方向弯曲。
  16. 根据权利要求15所述的显示面板的制备方法，其中，形成的所述第二部分的厚度从与所述第一部分相连接处沿远离所述第一部分的方向逐渐减小。
  17. 根据权利要求15所述的显示面板的制备方法，其中，
    所述在所述柔性基板的一侧形成显示层，包括：在所述中间区域和所述所选弯曲区域上形成多个发光器件；
    所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，包括：在所述显示层远离所述柔性基板的一侧形成薄膜封装层，所述薄膜封装层被配置为封装所述多个发光器件。
  18. 根据权利要求15～17任一项所述的显示面板的制备方法，其中， 所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，包括：
    采用喷墨打印工艺，在所述显示层远离所述中间区域的一侧形成第一有机层，在所述显示层远离所述所选弯曲区域的一侧形成第二有机层；所述第一有机层与所述第二有机层相连接；
    其中，通过调节所述喷墨打印工艺的工艺参数，控制所述第二有机层的至少部分区域的厚度沿远离所述第一有机层的方向逐渐减小。
  19. 根据权利要求18所述的显示面板的制备方法，其中，
    在形成所述第一有机层和所述第二有机层之前，所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，还包括：采用同一次沉积工艺，在所述显示层远离所述中间区域的一侧形成第一无机层，在所述显示层远离所述所选弯曲区域的一侧形成第二无机层；所述第一无机层与所述第二无机层相连接且厚度相同。
  20. 根据权利要求18或19所述的显示面板的制备方法，其中，
    在形成所述第一有机层和所述第二有机层之后，所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层，还包括：采用同一次沉积工艺，在所述第一有机层远离所述柔性基板的一侧形成第三无机层，在所述第二有机层远离所述柔性基板一侧形成第四无机层；所述第三无机层与所述第四无机层相连接且厚度相同。
  21. 根据权利要求15所述的显示面板的制备方法，其中，
    所述在所述柔性基板的一侧形成显示层，包括：在所述中间区域和所述所选弯曲区域上形成多个发光器件；
    所述在所述显示层远离所述柔性基板的一侧形成透明覆盖膜层之前，所述显示面板的制备方法还包括：在所述显示层远离所述柔性基板的一侧形成封装所述多个发光器件的薄膜封装层；在所述薄膜封装层远离所述显示层的一侧形成粘结层，其中，所述粘结层被配置为粘结所述薄膜封装层与所述透明覆盖膜层。
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