WO2019174412A1 - 一种fpcb板、智能卡及其封装方法 - Google Patents

一种fpcb板、智能卡及其封装方法 Download PDF

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Publication number
WO2019174412A1
WO2019174412A1 PCT/CN2019/072994 CN2019072994W WO2019174412A1 WO 2019174412 A1 WO2019174412 A1 WO 2019174412A1 CN 2019072994 W CN2019072994 W CN 2019072994W WO 2019174412 A1 WO2019174412 A1 WO 2019174412A1
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WO
WIPO (PCT)
Prior art keywords
component
fpcb board
smart card
slot
fpcb
Prior art date
Application number
PCT/CN2019/072994
Other languages
English (en)
French (fr)
Inventor
陈柳章
Original Assignee
深圳市文鼎创数据科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市文鼎创数据科技有限公司 filed Critical 深圳市文鼎创数据科技有限公司
Priority to JP2020541494A priority Critical patent/JP2021509229A/ja
Priority to EP19767641.4A priority patent/EP3761765A4/en
Publication of WO2019174412A1 publication Critical patent/WO2019174412A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of smart card technologies, and in particular, to an FPCB board, a smart card, and a packaging method thereof.
  • the main object of the present invention is to provide an FPCB board, a smart card and a packaging method thereof, which solve the problem that the relative positions of the two components of the smart card are offset due to processing, resulting in poor appearance or poor function, and the scrap rate is higher. High problem.
  • the present invention provides an FPCB board for use in a smart card, the smart card including an upper substrate, the FPCB board is provided with a first component and a second component, and the second component position is A through slot is defined in the FPCB board, and the through slot is configured to provide a deformation space for the FPCB board when the second component and the first component are positioned on the upper substrate.
  • the through groove is disposed around the second component, and the ends of the first and last ends are not connected.
  • the second component has a first side facing the first component, two second sides adjacent to the first side, and a third side opposite the first side;
  • the through slot is disposed around the first side and the second side of the second component to form a second element on the FPCB board connected to other parts of the FPCB board on the third side a device mounting area, the second component is disposed in the second component mounting area;
  • Both ends of the through groove extend toward each other such that both ends of the through groove are on the third side of the carrier unit.
  • the first component and the second component are components visible on a surface of the smart card.
  • the first component is a display screen and the second component is a carrier tape unit.
  • the present invention also provides a smart card, including:
  • the FPCB board as described above, the FPCB board is provided with a first component and a second component, and the FPCB board of the second component position is provided with a through slot, wherein the through slot is used for the
  • the FPCB board provides a deformation space when the second component and the first component are positioned on the upper substrate;
  • An upper substrate wherein the upper substrate is provided with a through hole for assembling and fixing the second component
  • the middle frame is disposed between the upper substrate and the lower substrate, and defines a content cavity around the upper substrate and the lower substrate, wherein the content cavity is used to receive the FPCB board.
  • the present invention further provides a method for packaging a smart card, including the following steps:
  • the first component and the second component are disposed on the FPCB board, and the second component position on the FPCB board is provided with a through slot, wherein the through slot is used for
  • the FPCB board provides a deformation space when the second component and the first component are positioned on the upper substrate;
  • the upper substrate is provided with a through hole for fixing and fixing the second component, positioning and fixing the first component to the upper substrate, and passing the second component through the through slot Destroying the FPCB board to be assembled and fixed to the through hole;
  • the step of providing a through slot in the second component position on the FPCB board comprises:
  • the through slot is disposed around the second component, and the ends of the first and last ends are not connected.
  • the step of the through slot is disposed around the second component, and the ends of the first and last ends are not connected, including:
  • the second component with a first side facing the first component, two second sides adjacent to the first side, and a third side opposite the first side;
  • the through slot is disposed around the first side and the second side of the second component to form a second on the FPCB board connected to the other portion of the FPCB board on the third side a component mounting area, the second component is disposed in the second component mounting area;
  • Both ends of the through groove are extended toward each other such that both ends of the through groove are on the third side of the carrier unit.
  • the first component and the second component are components visible on a surface of the smart card, the first component is a display screen, and the second component is a carrier tape unit.
  • the through slot is divided into a first area in which the second component is disposed inside the through slot, a second area located outside the through slot, and the first connection.
  • the third region of the region and the second region if the position between the second component and the first component is in error during production and processing, the third region may be deformed, and the deformation is performed on the first region
  • the second component is adjusted to the correct position relative to the first component to fix the two components to the correct position of the smart card, thereby preventing the two components from being in position due to production and processing errors.
  • the occurrence of an offset causes a poor appearance or malfunction of the smart card, thereby ensuring the appearance and functional requirements of the components on the smart card, and improving the yield of the smart card.
  • FIG. 1 is a schematic structural view of an FPCB board provided by the present invention.
  • FIG. 2 is a schematic structural view showing welding of a first component and a second component on the FPCB board of FIG. 1;
  • FIG. 3 is a schematic structural view of a smart card provided by the present invention after being laminated and punched;
  • FIG. 4 is a cross-sectional view of the smart card of FIG. 3;
  • FIG. 5 is a schematic rear view of the upper substrate before the smart card of FIG. 3 is laminated;
  • FIG. 6 is a schematic structural view showing the FPCB board of FIG. 2 positioned and fixed on the back surface of the upper substrate of FIG. 5;
  • FIG. 7 is a schematic structural view of the rear frame of the upper substrate of FIG. 6 positioned and fixed.
  • Label Name 100 smart card 42 Display installation area 1 Upper substrate 43 Carrier unit mounting area 11 Positioning frame 5 First component 12 Through hole 5a Display 2 Lower substrate 6 Second component 3 Middle frame 6a Carrier unit 4 FPCB board 7 Content cavity 41 Passage
  • the directional indication is only used to explain in a certain posture (as shown in the drawing)
  • the relative positional relationship between the components, the motion situation, and the like if the specific posture changes, the directional indication also changes accordingly.
  • first”, “second”, etc. in the embodiments of the present invention, the description of the "first”, “second”, etc. is used for the purpose of description only, and is not to be construed as an Its relative importance or implicit indication of the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the technical solutions between the various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist. It is also within the scope of protection required by the present invention.
  • FIG. 1 and FIG. 2 are an embodiment of an FPCB board provided by the present invention, and the smart card includes an upper substrate.
  • the FPCB board 4 is provided with a first component 5 and a second component 6, and the FPCB board 4 at the position of the second component 6 is provided with a through slot 41.
  • the through slot 41 is provided for the FPCB board 4 to provide a deformation space when the second component 6 is positioned with the first component 5 and the upper substrate 1.
  • the through hole 41 is formed on the FPCB board 4, and the through-hole 41 divides the FPCB board 4 into a first region in which the second component 6 is disposed inside the through slot 41, and is located outside the through slot 41.
  • the third region may be deformed, thereby By the deformation, the second component 6 located on the first region is adjusted to the correct position relative to the first component 5 to fix the two components to the correct position of the smart card, thereby The two components are prevented from being displaced due to production and processing errors, resulting in poor appearance or malfunction of the smart card, thereby ensuring the appearance and functional requirements of the components on the smart card, and improving the production of the smart card. Yield rate.
  • the specific structure of the through slot 41 can be variously arranged, as long as the partial deformation of the FPCB board 4 near the position of the second component 6 can be realized, so that the second component 6 is positioned and fixed to The first position of the first component 5 is not limited thereto.
  • the through slot 41 is disposed around the second component 6 and is first and last. The two ends are not connected.
  • the through slot 41 of the arrangement only leaves a single side (ie, the third area of the FPCB board 4) for electrical connection of the traces, and the FPCB of the trace side is as narrow as possible so that the FPCB board 4 is located in the second component 6
  • the portion near the position is well deformed to adjust the machining error between the second component 6 and the first component 5.
  • the second component 6 has a first side facing the first component 5, two second sides adjacent to the first side, and opposite the first side a third side; the through groove 41 is disposed around the first side and the second side of the second component 6 to be formed on the FPCB board 4 on the third side and the FPCB a second component 6 mounting area connected to the other part of the board 4, the second component 6 is disposed in the mounting area of the second component 6; both ends of the through slot 41 extend toward each other to make the through slot Both ends of 41 are on the third side of the carrier unit 6a.
  • the through groove 41 surrounds a majority of the circumference of the second component 6 to form a first region of the FPCB board 4 on the inside of the through slot 41 where the second component 6 is disposed, and is located in the through slot 41. a second region of the outer portion and a third region connecting the first region and the second region on the third side of the second component 6 to facilitate the electronic component of the second component 6 and the smart card 100 The wiring is connected.
  • the two ends of the through slot 41 extend toward each other such that the third area on the FPCB board 4 is as narrow as possible and is easily deformed, so that the second component 6 and the first component 5 are The machining error between the two is easily adjusted, so that the second component 6 is positioned and fixed to the correct position relative to the first component 5.
  • the through slot 41 may be configured as other structures as long as the FPCB board 4 capable of realizing the position of the carrier unit 6a is deformed to position the carrier unit 6a to a predetermined position. This is not limited.
  • the first component 5 and the second component 6 may be internal components of the smart card 100 or may be components visible on the surface of the smart card 100. Specifically, in the embodiment, the first component 5 and the second component 6 are components that are visible on the surface of the smart card 100.
  • the first component 5 is a display screen 5a
  • the second component 6 is a carrier tape unit 6a.
  • the smart card 100 usually has an electronic display screen 5a and a carrier unit 6a.
  • the electronic display screen 5a and the carrier unit 6a are disposed on the FPCB board 4, and the relative positions of the carrier unit 6a and the display screen 5a are fixed, two If the position is offset, the appearance will cause the entire card to be scrapped, but in the actual production process, the carrier unit 6a and the display screen 5a will have machining errors, which will cause the position of the two to be deviated, and the tape is carried on the FPCB board 4.
  • a through groove 41 is disposed around the position of the unit 6a to deform the FPCB board 4 on the third side of the carrier unit 6a to connect the first area and the third area of the second area to adjust the carrier unit 6a. And the processing error of the display screen 5a, thereby ensuring the appearance and functional requirements of the carrier unit 6a and the display screen 5a on the smart card, thereby improving the yield of the smart card 100.
  • FIG. 1 to FIG. 7 are an embodiment of a smart card provided by the present invention.
  • the smart card 100 includes an FPCB board 4 , an upper substrate 1 , a middle frame 3 , and a lower substrate 2 .
  • the FPCB board 4 is provided with a first component 5 and a second component 6 .
  • the FPCB board 4 at the position of the second component 6 is provided with a through slot 41 for the FPCB board 4 to be in the second component 6 and the first component 5 and the upper substrate 1 Providing a deformation space;
  • the upper substrate 1 is provided with a through hole 12 for mounting and fixing the second component 6;
  • the lower substrate 2 is disposed at a lower side of the upper substrate 1;
  • the middle frame 3 is sandwiched between Between the upper substrate 1 and the lower substrate 2, the middle frame 3 and the upper substrate 1 and the lower substrate 2 enclose a content cavity 7 for receiving the content cavity 7 FPCB board 4.
  • the through slot 41 is disposed around the second component 6, and the ends of the first and last ends are not connected.
  • the first component 5 and the second component 6 are components that are visible on the surface of the smart card.
  • the smart card 100 is a visual smart card, wherein the first component 5 is the display 5a and the second component 6 is It is the carrier unit 6a.
  • the upper substrate 1 is also provided with a transparent window corresponding to the display screen 5a, and a visual smart card is produced.
  • the through hole 41 is formed on the FPCB board 4, and the through-hole 41 divides the FPCB board 4 into a first region in which the second component 6 is disposed inside the through slot 41, and is located outside the through slot 41.
  • the third region may be deformed, thereby Adjusting the machining error between the two components by the deformation, so that the second component 6 located on the first region is adjusted to the correct position relative to the first component 5, in this embodiment, That is, the second component 6 is accurately assembled and fixed in the through hole 12 of the upper substrate 1 to prevent the two components from being displaced due to production and processing errors, resulting in poor appearance or The phenomenon of dysfunction, in turn, ensures the appearance and functional requirements of the components on the smart card, and improves the yield of the smart card 100.
  • the present invention also provides a method for packaging a smart card.
  • FIG. 1 to FIG. 7 are an embodiment of a method for packaging a smart card according to the present invention.
  • the method for packaging the smart card includes the following steps:
  • An FPCB board 4 is provided, and a first component 5 and a second component 6 are disposed on the FPCB board 4, and a through slot 41 is defined in the second component 6 on the FPCB board 4,
  • the through slot 41 is configured to provide the FPCB board 4 with a deformation space when the second component 6 is positioned with the first component 5 and the upper substrate;
  • An upper substrate 1 is provided, and the upper substrate 1 is provided with a through hole 12 for fixing and fixing the second component 6; the first component 5 is positioned and fixed to the upper substrate 1, and the second component is The device 6 deforms the FPCB board 4 through the through slot 41 to be assembled and fixed to the through hole 12;
  • the substrate 2 is provided, the lower substrate 2 and the middle frame 3 are positioned and fixed, and the smart card 100 is obtained after lamination and punching.
  • the through slot 41 divides the FPCB board 4 into a first area in which the second component 6 is disposed inside the through slot 41, a second region located outside the through slot 41 and a third region connecting the first region and the second region, if the position between the second component 6 and the first component 5 is in error during production, the third region Deformation may be generated, thereby adjusting a machining error between the two components by the deformation, so that the second component 6 located on the first region is adjusted to a correct position relative to the first component 5,
  • the two components are positioned and fixed, so as to avoid the two components being offset due to production and processing errors, resulting in poor appearance or malfunction of the smart card, thereby ensuring components on the smart card.
  • the appearance and functional requirements further increase the yield of the smart card production.
  • the specific structure of the through slot 41 can be variously configured, as long as the FPCB board 4 is partially deformed in the vicinity of the position of the second component 6 to fix the second component 6 to the relative position.
  • the correct position of the first component 5 is sufficient, and is not limited herein.
  • the step of disposing the through hole 41 in the second component 6 on the FPCB board 4 includes: wrapping the through slot 41 The second component 6 is disposed, and the ends of the first and last ends are not connected.
  • the second component 6 is disposed to have a first side facing the first component 5, two second sides adjacent to the first side, and a first side opposite to the first side Three sides; the through groove 41 is disposed around the first side and the second side of the second component 6 to be formed on the FPCB board 4 on the third side and the FPCB board 4: a second component 6 mounting area connected to the other portion, the second component 6 is disposed in the mounting area of the second component 6; and the two ends of the through slot 41 are oppositely extended to make the through slot Both ends of 41 are on the third side of the carrier unit 6a.
  • the through slot 41 is disposed such that the through slot 41 surrounds a majority of the circumference of the second component 6 to form a second component 6 disposed on the FPCB board 4 inside the through slot 41. a first area, a second area outside the through slot 41, and a third area connecting the first area and the second area on the third side of the second component 6 to facilitate the second element
  • the device 6 is connected to the trace of the electronic module of the smart card 100.
  • the two ends of the through slot 41 extend toward each other such that the third area on the FPCB board 4 is as narrow as possible and is easily deformed, so that the second component 6 and the first component 5 are The machining error between the two is easily adjusted, so that the second component 6 is positioned and fixed to the correct position relative to the first component 5.
  • the through slot 41 may be configured as other structures as long as the FPCB board 4 capable of realizing the position of the carrier unit 6a is deformed to position the carrier unit 6a to a predetermined position. This is not limited.
  • the first component 5 and the second component 6 described above may be internal components of the smart card 100 or may be components visible on the surface of the smart card 100.
  • the smart card 100 is a visual smart card
  • the visual smart card 100 is generally provided with an electronic display screen 5a and a carrier unit 6a, and the relative positions of the carrier unit 6a and the display screen 5a. It is fixed, and the upper substrate 1 is provided with a transparent window (not shown) corresponding to the position of the display screen, and the positioning frame of the fixed display screen 5a is positioned on the back surface of the upper substrate 1 corresponding to the transparent window.
  • the first component 5 and the second component 6 are components visible on the surface of the smart card 100, and the first component 5 is a display screen 5a.
  • the second component 6 is a carrier tape unit 6a.
  • the step of providing the first component 5 and the second component 6 on the FPCB board 4 includes: referring to FIG. 1 to FIG. 2, the FPCB board 4 is provided with the display screen mounting area 42 and The carrier unit mounting area 43 has a plurality of settings for the specific connection manner of the display screen 5a and the carrier unit 6a disposed in the display screen mounting area 42 and the carrier unit mounting area 43. No restrictions.
  • a transparent window (not shown) is disposed on the display screen of the upper substrate 1, and the screen is fixed on the back surface of the upper substrate 1 corresponding to the transparent window.
  • the substrate 1 is provided with a through hole 12 for fixing and fixing the carrier unit 6a to position the carrier unit 6a, and the carrier unit 6a passes the through slot 41 to make the FPCB board 4 is deformed to be fixed to the through hole 12 to complete assembly fixing of the display screen 5a and the carrier unit 6a on the FPCB board 4 and the upper substrate 1.
  • the order of providing the FPCB board 4 and the step of providing an upper substrate 1 in the above steps is not limited, and an upper substrate 1 may be provided first, or an FPCB board 4 may be provided first. Make a limit.
  • the order of the steps of setting the positioning frame 11 of the display screen 5a and the through hole 12 of the carrier tape unit 6a in the above steps is not limited, and the positioning frame 11 of the display screen 5a may be first set, or may be set first.
  • the through hole 12 of the carrier unit 6a is not limited herein.
  • the specific operation steps of packaging the smart card 100 are as follows: Referring to FIG. 1 to FIG. 7 together, a display screen 5a and a carrier unit 6a are disposed on the FPCB board 4, and the FPCB board 4 is disposed on the FPCB board 4.
  • the carrier tape unit 6a is provided with a through groove 41; the positioning frame 11 of the display screen 5a is fixed on the back surface of the upper substrate 1, and the upper substrate 1 is provided with the carrier unit 6a.
  • the FPCB board 4 provided with the display screen 5a and the carrier unit 6a is assembled and fixed with the upper substrate 1; the middle frame 3 and the upper substrate 1 are positioned and fixed, and the middle frame 3 is filled. Glue; positioning and fixing the lower substrate 2 and the middle frame 3, and laminating and punching to obtain the smart card 100 to complete the packaging of the smart card 100.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
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Abstract

一种FPCB板、智能卡及其封装方法，其中，所述FPCB板(4)上设有第一元器件(5)和第二元器件(6)，且第二元器件(6)位置的所述FPCB板(4)上开设有通槽(41)，所述通槽(41)用以供所述FPCB板(4)在第二元器件(6)与第一元器件(5)和上基板(1)定位时，提供形变空间。通过此变形以调整所述两个元器件之间的加工误差，以将所述FPCB板(4)上的所述两个元器件定位固定，从而避免所述两个元器件因生产加工误差导致两个位置会发生偏移，而导致的外观不良或者功能不良的现象，进而保证智能卡(100)上元器件的外观和功能要求，提高智能卡(100)生产的良品率。

Description

一种FPCB板、智能卡及其封装方法 技术领域
本发明涉及智能卡技术领域，特别涉及一种FPCB板、智能卡及其封装方法。
 背景技术
目前生产的智能卡通常都带有电子显示屏和载带单元，载带单元和显示屏的相对位置是固定的，两个位置如果发生偏移就会影响外观导致整张卡片的报废，但在实际生产加工过程中载带单元和显示屏都会有加工误差导致两个的位置发生偏移，而无法准确定位，从而导致外观不良或功能不良，智能卡报废率较高。
 技术问题
本发明的主要目的是提出一种FPCB板、智能卡及其封装方法，解决智能卡的至少两个元器件因加工造成的两者的相对位置发生偏移，从而导致外观不良或功能不良，报废率较高的问题。
 技术解决方案
为实现上述目的，本发明提出一种FPCB板，应用于智能卡，所述智能卡包括上基板，所述FPCB板上设有第一元器件和第二元器件，且第二元器件位置的所述FPCB板上开设有通槽，所述通槽用以供所述FPCB板在第二元器件和第一元器件定位于上基板时，提供形变空间。
优选地，所述通槽环绕所述第二元器件设置，且首尾两端不连通。
优选地，所述第二元器件具有朝向所述第一元器件的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；
所述通槽环绕所述第二元器件的第一侧和两个第二侧设置，以在所述FPCB板上形成有在所述第三侧与所述FPCB板其他部分相连的第二元器件安装区，所述第二元器件设于所述第二元器件安装区；
所述通槽的两端相向延伸，以使得所述通槽的两端处在所述载带单元的第三侧。
优选地，所述第一元器件和第二元器件为所述智能卡的表面可视的元器件。
优选地，所述第一元器件为显示屏，第二元器件为载带单元。
此外，为实现上述目的，本发明还提出一种智能卡，包括：
如上所述的FPCB板，所述FPCB板上设有第一元器件和第二元器件，且第二元器件位置的所述FPCB板上开设有通槽，所述通槽用以供所述FPCB板在第二元器件和第一元器件定位于上基板时，提供形变空间；
上基板，所述上基板设有装配固定所述第二元器件的通孔；
下基板，设于所述上基板的下侧；以及，
中框，夹设于所述上基板和所述下基板之间，与所述上基板和所述下基板围设形成一内容腔，所述内容腔用以容设所述FPCB板。
此外，为实现上述目的，本发明还提出一种智能卡的封装方法，包括如下步骤：
提供一FPCB板，在所述FPCB板上设有第一元器件和第二元器件，且在所述FPCB板上的所述第二元器件位置开设有通槽，所述通槽用以供所述FPCB板在所述第二元器件和所述第一元器件定位于上基板时提供形变空间；
提供一上基板，所述上基板设有装配固定所述第二元器件的通孔，将所述第一元器件定位固定于所述上基板，将所述第二元器件通过所述通槽使所述FPCB板变形以装配固定于所述通孔；
提供一中框，将所述中框与所述上基板定位固定，在中框内灌入胶水；
提供一下基板，将所述下基板与所述中框定位固定，经过层压和冲裁后得到所述智能卡。
优选地，在所述FPCB板上的所述第二元器件位置开设有通槽的步骤，包括：
将所述通槽环绕所述第二元器件设置，且首尾两端不连通。
优选地，所述通槽环绕所述第二元器件设置，且首尾两端不连通的步骤，包括：
设置所述第二元器件具有朝向所述第一元器件的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；
将所述通槽环绕所述第二元器件的第一侧和两个第二侧设置，以在所述FPCB板上形成有在所述第三侧与所述FPCB板其他部分相连的第二元器件安装区，所述第二元器件设于所述第二元器件安装区；
将所述通槽的两端相向延伸，以使得所述通槽的两端处在所述载带单元的第三侧。
优选地，所述第一元器件和第二元器件为所述智能卡的表面可视的元器件，所述第一元器件为显示屏，第二元器件为载带单元。
 有益效果
本发明提供的技术方案中，通过在FPCB板上设置通槽，通槽将分为位于通槽内部的设置第二元器件的第一区域、位于通槽外部的第二区域、以及连接第一区域与第二区域的第三区域，若第二元器件与第一元器件之间的位置在生产加工过程中产生误差时，第三区域可产生形变，通过此变形使位于第一区域上的第二元器件调整至相对第一元器件的正确位置上，以将所述两个元器件定位固定于智能卡的正确位置上，从而避免所述两个元器件因生产加工误差导致两个位置会发生偏移，而导致智能卡的外观不良或功能不良的现象，进而保证智能卡上元器件的外观和功能要求，提高所述智能卡生产的良品率。
 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明提供的FPCB板的结构示意图；
图2为图1的FPCB板上焊接第一元器件和第二元器件的结构示意图；
图3为本发明提供的智能卡经层压冲裁后的结构示意图；
图4为图3的智能卡的剖视示意图；
图5为图3的智能卡层压前的上基板的背视示意图；
图6为图2的FPCB板定位固定在图5的上基板背面的结构示意图；
图7为图6的上基板背面定位固定中框的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 智能卡 42 显示屏安装区
1 上基板 43 载带单元安装区
11 定位框 5 第一元器件
12 通孔 5a 显示屏
2 下基板 6 第二元器件
3 中框 6a 载带单元
4 FPCB板 7 内容腔
41 通槽    
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种FPCB板，应用于智能卡，图1和图2为本发明提供的FPCB板的一实施例，该智能卡包括上基板。
请参阅图1和图2，所述FPCB板4上设有第一元器件5和第二元器件6，且第二元器件6位置的所述FPCB板4上开设有通槽41，所述通槽41用以供所述FPCB板4在第二元器件6与第一元器件5和上基板1定位时，提供形变空间。
本发明提供的技术方案中，通过在FPCB板4上设置通槽41，通槽41将FPCB板4分为位于通槽41内部的设置第二元器件6的第一区域、位于通槽41外部的第二区域、以及连接第一区域与第二区域的第三区域，若第二元器件6与第一元器件5之间的位置在生产时产生误差时，第三区域可产生形变，从而通过此变形使位于第一区域上的所述第二元器件6调整至相对所述第一元器件5的正确位置上，以将所述两个元器件定位固定于智能卡的正确位置上，从而避免所述两个元器件因生产加工误差导致两个位置会发生偏移，而导致智能卡的外观不良或功能不良的现象，进而保证智能卡上元器件的外观和功能要求，提高所述智能卡生产的良品率。
所述通槽41的具体结构可以有多种设置，只要是能实现使所述FPCB板4位于所述第二元器件6位置附近的部分变形，以使所述第二元器件6定位固定至相对第一元器件5的正确位置上即可，在此不做限定，具体地，在本实施例中，请参阅图1，所述通槽41环绕所述第二元器件6设置，且首尾两端不连通。该设置的所述通槽41只留单边（即FPCB板4的第三区域）以便走线电连接，走线此边的FPCB要尽量窄，以便所述FPCB板4位于第二元器件6位置附近的部分好变形，来调整所述第二元器件6和所述第一元器件5之间的加工误差。
进一步，更具体地，所述第二元器件6具有朝向所述第一元器件5的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；所述通槽41环绕所述第二元器件6的第一侧和两个第二侧设置，以在所述FPCB板4上形成有在所述第三侧与所述FPCB板4其他部分相连的第二元器件6安装区，所述第二元器件6设于所述第二元器件6安装区；所述通槽41的两端相向延伸，以使得所述通槽41的两端处在所述载带单元6a的第三侧。
该设置所述通槽41环绕所述第二元器件6的大部分周缘，以在所述FPCB板4上形成位于通槽41内部的设置第二元器件6的第一区域、位于通槽41外部的第二区域、以及在所述第二元器件6的第三侧留出连接第一区域与第二区域的第三区域，以便于所述第二元器件6与智能卡100的电子模组的走线连接。
进一步地，所述通槽41的两端相向延伸，以使所述FPCB板4上的第三区域尽量窄而容易变形，从而使所述第二元器件6和所述第一元器件5之间的加工误差易于调整，进而使所述第二元器件6定位固定至相对第一元器件5的正确位置上。当然，所述通槽41还可以设置为其他结构，只要是能实现使所述载带单元6a位置的所述FPCB板4变形，以使所述载带单元6a定位到预定位置即可，在此不做限定。
所述第一元器件5和第二元器件6可以是所述智能卡100的内部的元器件，也可以是所述智能卡100的表面可视的元器件。具体地，在本实施例中，所述第一元器件5和第二元器件6为所述智能卡100的表面可视的元器件。
进一步，更具体地，所述第一元器件5为显示屏5a，第二元器件6为载带单元6a。智能卡100通常都带有电子显示屏5a和载带单元6a，电子显示屏5a和载带单元6a设置于FPCB板4上，且载带单元6a和显示屏5a的相对位置是固定的，两个位置如果发生偏移就会影响外观导致整张卡片的报废，但在实际生产加工过程中载带单元6a和显示屏5a都会有加工误差导致两者的位置发生偏差，通过在FPCB板4上载带单元6a位置周边设置通槽41，以使所述FPCB板4在所述载带单元6a的第三侧连接第一区域与第二区域的第三区域发生形变，以调整所述载带单元6a和所述显示屏5a的加工误差，从而保证智能卡上所述载带单元6a和所述显示屏5a的外观和功能要求，进而提高智能卡100生产的良品率。
本发明提出一种智能卡，图1至图7为本发明提供的智能卡的一实施例。
请一并参阅图1至图7，所述智能卡100包括FPCB板4、上基板1、中框3和下基板2，所述FPCB板4上设有第一元器件5和第二元器件6，且第二元器件6位置的所述FPCB板4上开设有通槽41，所述通槽41用以供所述FPCB板4在第二元器件6与第一元器件5与上基板1定位时，提供形变空间；所述上基板1设有装配固定所述第二元器件6的通孔12；下基板2设于所述上基板1的下侧；所述中框3夹设于所述上基板1和所述下基板2之间，所述中框3与所述上基板1和所述下基板2围设形成一内容腔7，所述内容腔7用以容设所述FPCB板4。
进一步的，通槽41环绕第二元器件6设置，且首尾两端不连通。其中，第一元器件5和第二元器件6为智能卡表面可视的元器件，本实施例中，智能卡100为可视智能卡，其中第一元器件5为显示屏5a，第二元器件6为载带单元6a。上基板1还设有与显示屏5a相对应的透明窗口，生产得到可视智能卡。
本发明提供的技术方案中，通过在FPCB板4上设置通槽41，通槽41将FPCB板4分为位于通槽41内部的设置第二元器件6的第一区域、位于通槽41外部的第二区域、以及连接第一区域与第二区域的第三区域，若第二元器件6与第一元器件5之间的位置在生产时产生误差时，第三区域可产生形变，从而通过此变形调整所述两个元器件之间的加工误差，使位于第一区域上的所述第二元器件6调整至相对所述第一元器件5的正确位置上，本实施例中，即将所述第二元器件6准确装配固定于所述上基板1的通孔12内，从而避免所述两个元器件因生产加工误差导致两个位置会发生偏移，而导致的外观不良或功能不良的现象，进而保证智能卡上元器件的外观和功能要求，提高智能卡100生产的良品率。
本发明还提出一种智能卡的封装方法，图1至图7为本发明提供的智能卡的封装方法的一实施例，所述智能卡的封装方法包括如下步骤：
提供一FPCB板4，在所述FPCB板4上设有第一元器件5和第二元器件6，且在所述FPCB板4上的所述第二元器件6位置开设有通槽41，所述通槽41用以供所述FPCB板4在所述第二元器件6与所述第一元器件5和上基板定位时提供形变空间；
提供一上基板1，所述上基板1设有装配固定所述第二元器件6的通孔12；将所述第一元器件5定位固定于所述上基板1，将所述第二元器件6通过所述通槽41使所述FPCB板4变形以装配固定于所述通孔12；
提供一中框3，将所述中框3与所述上基板1定位固定，在中框3内灌入胶水；
提供一下基板2，将所述下基板2与所述中框3定位固定，经过层压和冲裁后得到所述智能卡100。
本实施例中，请参阅图1和图2，通过在FPCB板4上设置通槽41，通槽41将FPCB板4分为位于通槽41内部的设置第二元器件6的第一区域、位于通槽41外部的第二区域、以及连接第一区域与第二区域的第三区域，若第二元器件6与第一元器件5之间的位置在生产时产生误差时，第三区域可产生形变，从而通过此变形调整所述两个元器件之间的加工误差，使位于第一区域上的所述第二元器件6调整至相对所述第一元器件5的正确位置上，以将所述两个元器件定位固定，从而避免所述两个元器件因生产加工误差导致两个位置会发生偏移，而导致智能卡的外观不良或功能不良的现象，进而保证智能卡上元器件的外观和功能要求，进而提高所述智能卡生产的良品率。
所述通槽41的具体结构可以有多种设置，只要是能实现使所述FPCB板4位于所述第二元器件6位置附近部分变形，以使所述第二元器件6定位固定至相对第一元器件5的正确位置上即可，在此不做限定。具体地，在本实施例中，请参阅图1和图2，在所述FPCB板4上的所述第二元器件6位置开设有通槽41的步骤包括：将所述通槽41环绕所述第二元器件6设置，且首尾两端不连通。
进一步地，设置所述第二元器件6具有朝向所述第一元器件5的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；将所述通槽41环绕所述第二元器件6的第一侧和两个第二侧设置，以在所述FPCB板4上形成有在所述第三侧与所述FPCB板4其他部分相连的第二元器件6安装区，所述第二元器件6设于所述第二元器件6安装区；将所述通槽41的两端相向延伸，以使得所述通槽41的两端处在所述载带单元6a的第三侧。
该所述通槽41的结构设置，使所述通槽41环绕所述第二元器件6的大部分周缘，以在所述FPCB板4上形成位于通槽41内部的设置第二元器件6的第一区域、位于通槽41外部的第二区域、以及在所述第二元器件6的第三侧留出连接第一区域与第二区域的第三区域，以便于所述第二元器件6与智能卡100的电子模组的走线连接。
进一步地，所述通槽41的两端相向延伸，以使所述FPCB板4上的第三区域尽量窄而容易变形，从而使所述第二元器件6和所述第一元器件5之间的加工误差易于调整，进而使所述第二元器件6定位固定至相对第一元器件5的正确位置上。当然，所述通槽41还可以设置为其他结构，只要是能实现使所述载带单元6a位置的所述FPCB板4变形，以使所述载带单元6a定位到预定位置即可，在此不做限定。
上述所述第一元器件5和第二元器件6可以是所述智能卡100的内部的元器件，也可以是所述智能卡100的表面可视的元器件。在本实施例中，所述智能卡100为可视智能卡，该可视智能卡100通常都设有电子显示屏5a和载带单元6a，且所述载带单元6a和所述显示屏5a的相对位置是固定的，且上基板1对应显示屏位置设置透明窗口（未图示），在上基板1的背面对应透明窗口丝印定位固定显示屏5a的定位框。在本实施例中，请参阅图3，所述第一元器件5和第二元器件6为所述智能卡100的表面可视的元器件，所述第一元器件5为显示屏5a，第二元器件6为载带单元6a。
上述在所述FPCB板4上设有第一元器件5和第二元器件6的步骤，包括：请参阅图1至图2，所述FPCB板4上设有所述显示屏安装区42和所述载带单元安装区43，所述显示屏5a和所述载带单元6a设置于所述显示屏安装区42和所述载带单元安装区43的具体连接方式有多种设置，在此不作限制。
上述将所述第一元器件5定位固定于所述上基板1的下表面；将所述第二元器件6通过所述通槽41使所述FPCB板4变形以装配固定于所述通孔12的步骤，包括：请参阅图5和图6，在所述上基板1对应显示屏设置透明窗口（未图示），在所述上基板1的背面对应所述透明窗口丝印定位固定所述显示屏5a的定位框11，在所述上基板1的背面印刷一层胶水，以定位出所述显示屏5a的位置，并将所述显示屏5a定位固定于所述定位框11；在所述上基板1设有装配固定所述载带单元6a的通孔12，以定位出所述载带单元6a的位置，并将所述载带单元6a通过所述通槽41使所述FPCB板4变形以装配固定于所述通孔12，以完成所述FPCB板4上的所述显示屏5a和载带单元6a与所述上基板1的装配固定。
需要说明的是，上述步骤的提供一FPCB板4和提供一上基板1的步骤的先后顺序没有固定的限制，可以是先提供一上基板1，或者是先提供一FPCB板4，在此不做限定。
同样的，上述步骤的设置显示屏5a的定位框11和设置载带单元6a的通孔12的步骤的先后顺序没有固定的限制，可以是先设置显示屏5a的定位框11，或者是先设置载带单元6a的通孔12，在此不做限定。
将所述智能卡100封装的具体操作步骤为：请一并参阅图1至图7，在所述FPCB板4上设有显示屏5a和载带单元6a，且在所述FPCB板4上的所述载带单元6a位置开设有通槽41；在所述上基板1的背面丝印定位固定所述显示屏5a的定位框11，在所述上基板1设有装配固定所述载带单元6a的通孔12，并将所述显示屏5a定位固定于所述定位框11、以及将所述载带单元6a通过所述通槽41使所述FPCB板4变形以装配固定于所述通孔12，将设置有显示屏5a和载带单元6a的所述FPCB板4与所述上基板1装配固定；再将所述中框3与所述上基板1定位固定，在中框3内灌入胶水；将所述下基板2与所述中框3定位固定，经过层压和冲裁后得到所述智能卡100，以完成智能卡100的封装。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种FPCB板，应用于智能卡，所述智能卡包括上基板，其特征在于，所述FPCB板上设有第一元器件和第二元器件，且第二元器件位置的所述FPCB板上开设有通槽，所述通槽用以供所述FPCB板在第二元器件和第一元器件定位于上基板时，提供形变空间。
  2. 如权利要求1所述的FPCB板，其特征在于，所述通槽环绕所述第二元器件设置，且首尾两端不连通。
  3. 如权利要求2所述的FPCB板，其特征在于，所述第二元器件具有朝向所述第一元器件的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；
    所述通槽环绕所述第二元器件的第一侧和两个第二侧设置，以在所述FPCB板上形成有在所述第三侧与所述FPCB板其他部分相连的第二元器件安装区，所述第二元器件设于所述第二元器件安装区；
    所述通槽的两端相向延伸，以使得所述通槽的两端处在所述载带单元的第三侧。
  4. 如权利要求1所述的FPCB板，其特征在于，所述第一元器件和第二元器件为所述智能卡的表面可视的元器件。
  5. 如权利要求1所述的FPCB板，其特征在于，所述第一元器件为显示屏，第二元器件为载带单元。
  6. 一种智能卡，其特征在于，包括：
    如权利要求1至5任意一项所述的FPCB板；
    上基板，所述上基板设有装配固定所述第二元器件的通孔；
    下基板，设于所述上基板的下侧；以及，
    中框，夹设于所述上基板和所述下基板之间，与所述上基板和所述下基板围设形成一内容腔，所述内容腔用以容设所述FPCB板。
  7. 一种智能卡的封装方法，其特征在于，包括如下步骤：
    提供一FPCB板，在所述FPCB板上设有第一元器件和第二元器件，且在所述FPCB板上的所述第二元器件位置开设有通槽，所述通槽用以供所述FPCB板在所述第二元器件与所述第一元器件定位时提供形变空间；
    提供一上基板，所述上基板设有装配固定所述第二元器件的通孔，将所述第一元器件定位固定于所述上基板，将所述第二元器件通过所述通槽使所述FPCB板变形以装配固定于所述通孔；
    提供一中框，将所述中框和所述FPCB板与所述上基板定位固定，在中框内灌入胶水；
    提供一下基板，将所述下基板与所述中框定位固定，经过层压和冲裁后得到所述智能卡。
  8. 如权利要求7所述的智能卡的封装方法，其特征在于，在所述FPCB板上的所述第二元器件位置开设有通槽的步骤，包括：
    将所述通槽环绕所述第二元器件设置，且首尾两端不连通。
  9. 如权利要求8所述的智能卡的封装方法，其特征在于，所述通槽环绕所述第二元器件设置，且首尾两端不连通的步骤，包括：
    设置所述第二元器件具有朝向所述第一元器件的第一侧、与所述第一侧相邻的两个第二侧、以及与所述第一侧相对的第三侧；
    将所述通槽环绕所述第二元器件的第一侧和两个第二侧设置，以在所述FPCB板上形成有在所述第三侧与所述FPCB板其他部分相连的第二元器件安装区，所述第二元器件设于所述第二元器件安装区；
    将所述通槽的两端相向延伸，以使得所述通槽的两端处在所述载带单元的第三侧。
  10. 如权利要求7所述的智能卡的封装方法，其特征在于，所述第一元器件和第二元器件为所述智能卡的表面可视的元器件，所述第一元器件为显示屏，第二元器件为载带单元。
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