WO2019142257A1 - 電子モジュール - Google Patents

電子モジュール Download PDF

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Publication number
WO2019142257A1
WO2019142257A1 PCT/JP2018/001168 JP2018001168W WO2019142257A1 WO 2019142257 A1 WO2019142257 A1 WO 2019142257A1 JP 2018001168 W JP2018001168 W JP 2018001168W WO 2019142257 A1 WO2019142257 A1 WO 2019142257A1
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WO
WIPO (PCT)
Prior art keywords
terminal
substrate
electronic
stress relaxation
power
Prior art date
Application number
PCT/JP2018/001168
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English (en)
French (fr)
Inventor
康亮 池田
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to US16/962,492 priority Critical patent/US11309250B2/en
Priority to PCT/JP2018/001168 priority patent/WO2019142257A1/ja
Priority to CN201880086539.XA priority patent/CN111602241B/zh
Priority to JP2018538252A priority patent/JP6594556B1/ja
Priority to NL2022346A priority patent/NL2022346B1/en
Priority to TW108101840A priority patent/TWI684261B/zh
Publication of WO2019142257A1 publication Critical patent/WO2019142257A1/ja

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Definitions

  • the present invention relates to an electronic module including an electronic element in a sealing portion and having a connection terminal connected to the electronic element.
  • An electronic module in which a plurality of electronic elements are provided in a sealing resin is conventionally known (see, for example, JP-A-2014-45157). There is a need for more electronic devices in such electronic modules.
  • the electronic elements are stacked in layers.
  • second electronic element on one side (for example, the front surface side) of the electronic element (first electronic element).
  • the in-plane of the substrate The size in the direction becomes large. As described above, when the size in the in-plane direction of the substrate is increased, the substrate may be warped in the heat treatment step.
  • the thickness of the metal circuit board on which the circuit pattern is formed is made larger than the thickness of the metal heat dissipation plate, and the surface area of the metal heat dissipation plate opposite to the ceramic substrate It is proposed to suppress the warpage of the ceramic substrate due to the thermal stress generated in the ceramic substrate by making the surface area of the metal circuit board larger than the surface area of the surface opposite to the ceramic substrate (Japanese Patent Laid-Open No. 2016-72281). ).
  • the insulating circuit boards are electrically connected by the conductive member straddling the cross bar portion, the partition portion of the upper lid presses the cross bar portion of the resin frame, and the cross bar portion presses the first outer edge portion of the insulating circuit board In this way, it is also proposed to suppress the warpage of the insulating circuit board (WO2015 / 107804).
  • This invention is made in view of such a point, and provides the electronic module which can prevent the curvature in a board
  • the electronic module according to the invention is A first substrate, An electronic device provided on one side of the first substrate; A sealing portion for sealing at least the electronic element; A connection terminal electrically connected to the electronic element and exposed from the side surface of the sealing portion; A stress relaxation terminal which is not electrically connected to the electronic element and exposed from the side surface of the sealing portion; May be provided.
  • connection terminal has a control terminal for inputting a control signal to the electronic element
  • the width of the stress relaxation terminal may be wider than the width of the control terminal.
  • connection terminal has a power terminal for supplying power to the electronic device,
  • the width of the stress relief terminal may be smaller than the width of the power terminal.
  • the electronic device includes a first electronic device and a second electronic device provided on one side of the first electronic device,
  • the stress relieving terminal may not be electrically connected to the first electronic element and the second electronic element.
  • the stress relieving terminal includes a stress relieving terminal proximal end provided in the second conductor layer, a stress relieving terminal outer portion exposed at least in part from the sealing portion, and the stress relieving terminal proximal end.
  • the stress relaxation terminal may have a stress relaxation terminal bending portion provided between the stress relaxation terminal outer portion and the stress relaxation terminal proximal end side and bent to one side.
  • a non-connecting conductor layer not electrically connected to the first electronic device and the second electronic device may be provided on one side of the first substrate.
  • connection terminal has a plurality of power terminals for supplying power to the first electronic element or the second electronic element, At least one power terminal includes a power terminal proximal end electrically connected to the second conductor layer, a power terminal outer portion at least a portion of which is exposed from the sealing portion, and the power terminal proximal end And a power terminal bending portion provided between the power terminal outer portion and bent to one side on the power terminal base end side.
  • connection terminal has a power terminal for supplying power to the first electronic element or the second electronic element
  • the stress relaxation terminal may be provided outward in the circumferential direction in the surface direction than the power terminal.
  • connection terminal has a plurality of control terminals for inputting control signals to the first electronic element or the second electronic element
  • the stress relieving terminal extends outward of the periphery of the first substrate so as to straddle the first side surface of the first substrate or a second side surface opposite to the first side surface in the in-plane direction
  • the first substrate has a third side and a fourth side extending between the first side and the second side
  • At least one of the control terminals may extend to the outer periphery of the first substrate so as to straddle the third side surface or the fourth side surface of the first substrate in the in-plane direction.
  • the stress relaxation terminal which is not electrically connected to the electronic element and exposed from the side surface of the sealing portion is provided. According to the experiment conducted by the inventor and confirmed, the provision of such a terminal can prevent the substrate from being warped, in particular, the substrate peripheral portion from being warped toward the inside of the sealing portion.
  • FIG. 1 is a plan view showing an electronic module that can be used in the first embodiment of the present invention and does not show a sealing portion, a second substrate, a second heat dissipation layer and the like.
  • FIG. 2 is an electronic module that can be used in the first embodiment of the present invention, and is a side view that does not show the sealing portion.
  • FIG. 3 is an electronic module that can be used in the first embodiment of the present invention, and is a plan view not showing a sealing portion.
  • FIG. 4 (a) is a side view of a power terminal that can be used in the first embodiment of the present invention, and FIG. 4 (b) is another one that can be used in the first embodiment of the present invention.
  • FIG. 7 is a side view of the power terminal of the embodiment of FIG. FIG.
  • FIG. 5 is a side view of a stress relaxation terminal that can be used in the first embodiment of the present invention.
  • FIG. 6 is a side view of a control terminal that can be used in the first embodiment of the present invention.
  • FIG. 7 is a plan view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 8 is a side sectional view showing the relationship among the first electronic device, the first connector, the second electronic device, the second connector, etc. which can be used in the first embodiment of the present invention.
  • FIG. 9 is a plan view showing a first electronic device that can be used in the first embodiment of the present invention.
  • FIG. 10 is a plan view showing a second electronic device that can be used in the first embodiment of the present invention.
  • FIG. 11 is a drawing corresponding to FIG.
  • FIG. 8 is a side cross-sectional view of an electronic module that can be used in the second embodiment of the present invention.
  • FIG. 12 is a drawing corresponding to FIG. 8 and is a side sectional view of an electronic module that can be used in the third embodiment of the present invention.
  • first direction the front and back direction of the sheet
  • second direction the front and back direction of the sheet
  • third direction the left and right direction
  • in-plane direction including the second direction and the third direction is referred to as "in-plane direction”
  • planear view when viewed from one side to the other side, it is referred to as "planar view”.
  • the electronic module includes a first heat dissipation layer 19, a first substrate 11 provided on one side of the first heat dissipation layer 19, and a first conductor provided on one side of the first substrate 11.
  • a sealing portion 90 made of a sealing resin or the like for sealing the element 13 and the second electronic element 23 may be included.
  • Both or any one of the first conductor layer 12 and the second conductor layer 22 may be connected to the terminals 110 and 150 (see FIG. 1), and the tip sides of the terminals 110 and 150 are outward of the sealing portion 90 It may be exposed and connectable to an external device such as a control board.
  • the terminals 110 and 150 are electrically connected to the first electronic element 13 or the second electronic element 23, and the connection terminals 110 exposed from the side surface of the sealing portion 90, and the first electronic element 13. And the stress relieving terminal 150 which is not electrically connected to any of the second electronic elements 23 and is exposed from the side surface of the sealing portion 90.
  • the connection terminal 110 may have one or more control terminals 120 for inputting control signals to the first electronic device 13 or the second electronic device 23.
  • the width of the stress relaxation terminal 150 (the length in the short direction in the in-plane direction, the length in the second direction in FIG. 1) is wider than the thickest portion of the width of the control terminal 120 at any location. It may be
  • the connection terminal 110 may have one or more power terminals 130 for supplying power to the first electronic device 13 or the second electronic device 23.
  • the width of the stress relaxation terminal 150 may be narrower at any point than the narrowest portion of the width of the power terminal 130.
  • the stress relaxation terminal 150 has a stress relaxation terminal proximal end 151 indirectly provided on the second conductor layer 22 via the conductive adhesive 95, and at least a part of the stress relaxation terminal 150.
  • the stress relaxation terminal outer portion 153 exposed from the stress relieving terminal base end portion 151 and the stress relaxation terminal outer portion 153, and the stress being bent to one side or the other side in the sealing portion 90 It may have a relaxation terminal bending portion 152.
  • the conductive adhesive 95 is not provided between the stress relaxation terminal base end 151 and the second conductor layer 22, and the stress relaxation terminal base end 151 is provided directly on the second conductor layer 22. May be
  • the power terminal 130 has the power terminal base end portion 131 indirectly provided on the conductor layers 12 and 22 via the conductive adhesive 95, and at least a part of which is exposed from the sealing portion 90.
  • a power terminal bending portion provided between the power terminal outer portion 133, the power terminal base end portion 131 and the power terminal outer portion 133, and bent to one side or the other side on the power terminal base end portion 131 side And 132 may be included.
  • the power terminal 130 at the upper left is indirectly provided to the second conductor layer 22 via the conductive adhesive 95 as shown in FIG. 4 (a).
  • a power terminal bending portion 132 bent to one side or the other side on the power terminal proximal end portion 131 side.
  • the other four power terminals 130 are, as shown in FIG. 4B, a power terminal base end portion 131 indirectly provided on the first conductor layer 12 via the conductive adhesive 95, and a power terminal And a power terminal bending portion 132 bent to the other side at the proximal end portion 131 side.
  • the control terminal 120 includes a control terminal base end portion 121 indirectly provided on the conductor layers 12 and 22 via the conductive adhesive 95, and a control terminal outer portion 123 at least a part of which is exposed from the sealing portion 90. And the control terminal bending portion 122 provided between the control terminal base end portion 121 and the control terminal outer portion 123 and bent to one side or the other side on the control terminal base end portion 121 side. Good.
  • the control terminal base end portion 121 provided indirectly on the first conductor layer 12 via the conductive adhesive 95, and the control terminal group, as shown in FIG. And a control terminal bending portion 122 bent to the other side at the end portion 121 side.
  • the control terminal 120 includes a control terminal base end 121 electrically connected to the first conductor layer 12, a control terminal outer side 123 exposed at least partially from the sealing portion 90, and a control terminal base end 121. And the control terminal outer portion 123, and may have a control terminal bending portion 122 bent on one side in the sealing portion 90.
  • a non-connecting conductor layer 50 which is not electrically connected to the first electronic element 13 and the second electronic element 23, which is pressed by a mold when resin sealing is provided It is also good.
  • the size in the in-plane direction of the second substrate 21 is smaller than the size in the in-plane direction of the first substrate 11, and as shown in FIG.
  • the non-connecting conductor layer 50 provided on the substrate 11 may be located outside the first substrate 11.
  • the sealing portion 90 may have a substantially rectangular shape in a plan view as shown in FIG.
  • substantially rectangular means a quadrangle having two pairs of opposing sides, and for example, the corner in a plan view may be a right angle, but may be rounded.
  • the corners may be inclined as shown in FIG. 7 or concaves may be provided at some of the side surfaces as shown in FIG.
  • each of the first substrate 11 and the second substrate 21 may also be substantially rectangular in plan view.
  • the sealing portion 90 has a first side 91, a second side 92 opposite to the first side 91, and a third side 93 extending between the first side 91 and the second side 92. And a fourth side 94.
  • the sealing portion 90 has a substantially rectangular shape in plan view
  • the first side surface 91 and the second side surface 92 become parallel in plan view
  • the third side surface 93 and the fourth side surface 94 become parallel in plan view.
  • the lengths of the first side surface 91 and the second side surface 92 in view may be substantially the same
  • the lengths of the third side surface 93 and the fourth side surface 94 in plan view may be substantially the same.
  • substantially the same means that the difference between the two lengths is within 10% of the longer one, and the lengths A1 and A2 (A1AA2) are approximately the same. Being identical means that A1 ⁇ 0.9 ⁇ A2 ⁇ A1.
  • the sealing portion 90 will be described using an aspect in which the sealing portion 90 has a substantially rectangular shape in plan view, but the present invention is not limited thereto.
  • the sealing portion 90 has a substantially square shape in plan view It may be substantially trapezoidal.
  • the stress relief terminal 150 may be provided along the first side surface 91 of the sealing portion 90 and / or a second side surface 92 opposite to the first side surface 91.
  • At least one of the control terminals 120 may be exposed outward from the third side surface 93 and / or the fourth side surface 94 of the sealing portion 90.
  • the stress relieving terminal 150 may be provided outward in the circumferential direction in the surface direction than the power terminal 130.
  • three power terminals 130 are provided on the first side surface 91 side, and the upper side (peripheral direction outward) than the power terminal 130 located at the uppermost position along the second direction in FIG. 1), and one stress relaxation terminal 150 is provided on the lower side (peripheral direction outward) than the power terminal 130 located at the lowermost position in the second direction of FIG. There is.
  • the first substrate 11 may have a first side surface 11a, a second side surface 11b, a third side surface 11c and a fourth side surface 11d corresponding to the sealing portion 90, as shown in FIG.
  • the second substrate 21 may also have a first side 21a, a second side 21b, a third side 21c, and a fourth side 21d, corresponding to the sealing portion 90, as shown in FIG.
  • the two stress relaxation terminals 150 extend to the outer periphery of the first substrate 11 so as to straddle the first side surface 11 a of the first substrate 11 in the in-plane direction.
  • one control terminal 120a located at the upper right of FIG. 1 extends to the outer periphery of the first substrate 11 so as to straddle the third side surface 11c of the first substrate 11 in the in-plane direction (see FIG. 1) It is exposed outward from the 1st side 91 of the sealing part 90 (refer FIG. 7).
  • FIG. 1 extends outward of the peripheral edge of the first substrate 11 so as to straddle the third side surface 11c of the first substrate 11 in the in-plane direction (see FIG. 1) It is exposed outward from the second side surface 92 of the sealing portion 90 (see FIG. 7).
  • one control terminal 120c located at the lower right of FIG. 1 extends outward of the peripheral edge of the first substrate 11 so as to straddle the fourth side surface 11d of the first substrate 11 in the in-plane direction (see FIG. 1) , And is exposed outward from the first side surface 91 of the sealing portion 90 (see FIG. 7).
  • control terminals 120 extend outward of the periphery of the first substrate 11 so as to straddle the first side surface 11a of the first substrate 11 in the in-plane direction (see FIG. 1) It is exposed outward from the first side surface 91 of the portion 90 (see FIG. 7). Further, seven other control terminals 120 extend to the outer periphery of the first substrate 11 so as to straddle the second side surface 11b of the first substrate 11 in the in-plane direction (see FIG. 1). It is exposed outward from the two side surfaces 92 (see FIG. 7).
  • the three power terminals 130 extend to the outer periphery of the first substrate 11 so as to straddle the first side surface 11 a of the first substrate 11 in the in-plane direction (see FIG. 1). Exposed outward (see Fig. 7). Further, the two power terminals 130 extend to the outer periphery of the first substrate 11 so as to straddle the second side surface 11b of the first substrate 11 in the in-plane direction (see FIG. 1). It is exposed outward from (see Figure 7).
  • the opening 130a is provided in the power terminal 130 located in the middle on the first side 91 side of the sealing unit 90, and the non-connection conductor layer 50 can be viewed through the opening 130a of the power terminal 130 in plan view. May be By providing such an opening 130a, the non-connecting conductor layer 50 can be pressed by a mold when resin sealing is performed.
  • the electronic module of the present embodiment may have connectors 60 and 70.
  • the connection bodies 60 and 70 are provided on the opposite side of the first connection body 60 provided between the first electronic element 13 and the second electronic element 23 and the first connection body 60 of the second electronic element 23.
  • the second connector 70 may be included.
  • the connecting members 60 and 70 may have head portions 61 and 71 and pillar portions 62 and 72 extending from the head portions 61 and 71 in the thickness direction of the head portions 61 and 71.
  • the first connecting member 60 includes the first head portion 61 and the thickness direction of the first head portion 61 from the first head portion 61.
  • the first post portion 62 extending in the
  • the second connection body 70 may have a second head portion 71 and a second pillar portion 72 extending from the second head portion 71 in the thickness direction of the second head portion 71.
  • a plurality of first conductor layers 12 may be provided on one side of the first substrate 11.
  • Each or any one of the first electronic element 13 and the second electronic element 23 may be a switching element or a control element.
  • a MOSFET, an IGBT or the like may be used as the switching element.
  • Each of the first electronic element 13 and the second electronic element 23 may be composed of a semiconductor element, and the semiconductor material may be silicon, silicon carbide, gallium nitride or the like.
  • a conductive adhesive 95 such as a solder is provided between the first electronic element 13 and the first connection body 60, and the first electronic element 13 and the first connection body 60 are connected via the conductive adhesive 95.
  • a conductive adhesive 95 such as a solder is provided between the first connector 60 and the second electronic element 23, and the first connector 60 and the second electronic element 23 are connected via the conductive adhesive 95. May be connected.
  • a conductive adhesive 95 such as a solder is provided between the second electronic element 23 and the second connector 70, and the second electronic element 23 and the second connector 70 are connected via the conductive adhesive 95. May be connected.
  • an insulating substrate such as a ceramic substrate or an insulating resin layer can be employed.
  • a material having Ag or Cu as a main component can also be used.
  • a metal such as Cu can be used as a material of the first connection body 60 and the second connection body 70.
  • a metal substrate subjected to circuit patterning can be used as the substrates 11 and 21. In this case, the substrates 11 and 21 also serve as the conductor layers 12 and 22, respectively.
  • the first electronic element 13 is a switching element such as a MOSFET
  • the first gate electrode 13g and the first source electrode 13s are provided on the surface on the first connection body 60 side. May be Similarly, as shown in FIGS. 8 and 10, when the second electronic element 23 is a switching element such as a MOSFET, the second gate electrode 23g and the second source electrode 23s are provided on the surface on the second connection body 70 side. May be provided.
  • the second connection body 70 may be connected to the second source electrode 23 s of the second electronic element 23 via the conductive adhesive 95.
  • the first connection body 60 is conductively bonded to the first source electrode 13s of the first electronic element 13 and the second drain electrode 23d provided on the surface of the second electronic element 23 opposite to the second connection body 70. It may be connected via the agent 95.
  • the first drain electrode 13 d may be provided on the surface of the first electronic element 13 opposite to the first connection body 60.
  • the first gate electrode 13 g shown in FIG. 9 may be connected to the connector 30 via the conductive adhesive 95, and the connector 30 may be connected to the first conductor layer 12 via the conductive adhesive 95.
  • the second gate electrode 23 g shown in FIG. 10 may be connected to the connector 40 via the conductive adhesive 95, and the connector 40 may be connected to the first conductor layer 12 via the conductive adhesive 95. .
  • the bonding between the terminals 110 and 150 and the conductor layers 12 and 22 may be performed not only by using a conductive adhesive 95 such as solder, but also by laser welding or ultrasonic bonding. .
  • the substrate 11 is not electrically connected to the electronic elements 13 and 23, and the stress relaxation terminal 150 exposed from the side surface of the sealing portion 90 is provided. It is possible to prevent the warping of the substrate 21, and in particular, the warping of the peripheral portions of the substrates 11 and 21 toward the inside of the sealing portion. More specifically, if the stress relaxation terminal 150 is provided on the first substrate 11 side, the peripheral portion of the first substrate 11 can be prevented from being bent upward, and stress relaxation on the second substrate 21 side can be prevented. If the terminal 150 is provided, the peripheral portion of the second substrate 21 can be prevented from bending downward.
  • the width of the stress relaxation terminal 150 is larger than the width of the control terminal 120, the strain of the substrates 11 and 21 due to the stress relaxation terminal can be effectively suppressed.
  • the width of the stress relaxation terminal base end 151 is 2 to 5 times the width of the control terminal base end 121, and more specifically, 2.5 to 4 times as large as the width of the control terminal base end 121 Is advantageous in that distortion of the substrates 11 and 21 can be effectively suppressed while saving the
  • the width of the stress relaxation terminal 150 is smaller than the width of the power terminal 130, the space in the plane used for the non-electrically functional stress relaxation terminal 150 can be saved.
  • the present invention is not limited to such an aspect, and the width of the stress relaxation terminal 150 may be the same as the width of the power terminal 130, or the width of the stress relaxation terminal 150 is larger than the width of the power terminal 130. May be However, in these aspects, it is necessary to keep in mind that space in the plane used for the stress-relieving terminal 150 which does not function electrically is required.
  • the width of the stress relaxation terminal base end 151 is 1/5 to 1/15 times the width of the power terminal base end 131, 1/10 to 1/14 times the width if more restrictive In such a case, it is advantageous in that the distortion of the substrates 11 and 21 can be effectively suppressed while saving the space in the plane.
  • the stress relaxation terminal 150 includes a stress relaxation terminal base end 151 provided directly or indirectly on the second conductor layer 22 and a stress relaxation terminal at least a part of which is exposed from the sealing portion 90.
  • the non-connecting conductor layer 50 not electrically connected to the first electronic element 13 and the second electronic element 23 is provided on one side of the first substrate 11, the non-connecting conductor layer Since 50 is pressed by the mold, warpage of the first substrate 11 can be prevented.
  • the non-connection conductor layer 50 provided on the first substrate 11 side is adopted while adopting the stress relaxation terminal 150 provided on the second substrate 21 side as described above, the first substrate 11 and the It is advantageous in that distortion in both of the second substrates 21 can be prevented.
  • the power terminal 130 includes a power terminal base end portion 131 electrically connected to the second conductor layer 22, and a power terminal outer portion 133 at least a part of which is exposed from the sealing portion 90.
  • the power terminal bending portion 132 provided between the power terminal base end portion 131 and the power terminal outer portion 133 and bent to one side on the power terminal base end portion 131 side.
  • the physical force from the power terminal 130 is also advantageous in that distortion of the second substrate 21 can be prevented.
  • control terminals 120 When at least one of the control terminals 120 is extended to the outer periphery of the first substrate 11 so as to straddle the third side surface 11 c or the fourth side surface 11 d of the first substrate 11 in the in-plane direction
  • the heat radiation efficiency can be enhanced by such a control terminal 120, and the warping of the substrates 11 and 21 in the circumferential direction outward where distortion is easily generated can be prevented.
  • the heat radiation efficiency can be more uniformly and efficiently enhanced.
  • the number of stress relieving terminals 150 may be increased on the side surface where the number of power terminals 130 is large, and heat dissipation may be balanced.
  • three power terminals 130 are provided on the first side 91 side (the first side 11 a side of the first substrate 11) of the sealing portion 90, and the second side 92 (the first side Although two power terminals 130 are provided on the second side surface 11 b side, distortion of the substrates 11 and 21 occurs on the side surface (first side surface 91 in FIG. 1) side where the three power terminals 130 are provided. It may be easier.
  • one stress relieving terminal 150 may be provided on the side of the second side 91 where the two power terminals 130 are provided (the side of the second side 21 b of the second substrate 21). Note that, in an aspect in which the number of stress relaxation terminals 150 is increased on the side surface with a large number of power terminals 130, the stress relaxation terminals 150 may not be provided on the side surfaces with a small number of power terminals 130. The stress relaxation terminal 150 may not be provided on the second side surface 91 side (the second side surface 21b side of the second substrate 21) of FIG.
  • the stack structure is provided in which the second electronic device 23 is provided on one side of the first electronic device 13 and the connecting members 60 and 70 are provided.
  • the connectors 60 and 70 are not provided.
  • any aspect described in the first embodiment can be adopted.
  • the members described in the first embodiment will be described using the same reference numerals.
  • the effect of providing the stress relaxation terminal 150 can be obtained.
  • a stress relaxation terminal proximal end 151 provided on the second conductor layer 22 via the conductive adhesive 95, a stress relaxation terminal outer portion 153 at least a part of which is exposed from the sealing portion 90, and a stress When a mode is provided between the relaxation terminal proximal end portion 151 and the stress relaxation terminal outer portion 153 and having a stress relaxation terminal bending portion 152 bent on one side at the stress relaxation terminal proximal end 151 side Not only can the distortion of the second substrate 21 be prevented by heat dissipation by the stress relaxation terminals 150, but also the distortion of the second substrate 21 can be prevented by the physical force from the stress relaxation terminals 150.
  • the stack structure is provided in which the second electronic device 23 is provided on one side of the first electronic device 13 and the connecting members 60 and 70 are provided.
  • the stack structure is not provided, and the first electronic element 13 is provided but the second electronic element 23 is not provided.
  • the second substrate 13 is not provided.
  • the stress relaxation terminal 150 is connected to the first conductor layer 13.
  • any of the aspects described in the above embodiments can be adopted. About the member demonstrated by said each embodiment, it demonstrates using the same code
  • the effect of providing the stress relaxation terminal 150 can be obtained, and the distortion of the first substrate 11 can be prevented by the heat radiation by the stress relaxation terminal 150.
  • the stress relaxation terminal base end 151 is provided on the first conductor layer 12 via the conductive adhesive 95 (not shown in FIG. 12).

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Abstract

電子モジュールは、第一基板１１と、前記第一基板１１の一方側に設けられた電子素子１３，２３と、少なくとも前記電子素子１３，２３を封止する封止部９０と、前記電子素子１３，２３に電気的に接続され、前記封止部９０の側面から露出した接続端子１１０と、前記電子素子１３，２３に電気的に接続されておらず、前記封止部９０の側面から露出した応力緩和端子１５０と、を有している。

Description

電子モジュール
　本発明は、電子素子を封止部内に含み、電子素子に接続された接続端子を有する電子モジュールに関する。
　複数の電子素子が封止樹脂内に設けられた電子モジュールが従来から知られている（例えば特開２０１４－４５１５７号参照）。このような電子モジュールにおいて電子素子をより多くしたいニーズがある。
　より多くの電子素子を設ける手段として、電子素子を層状に積み重ねていく態様を採用することが考えられる。その際には、電子素子（第一電子素子）の一方側（例えばおもて面側）に別の電子素子（第二電子素子）を設けることが考えられる。また、このように電子素子を層状に積み重ねていく態様を採用しない場合、または電子素子を層状に積み重ねていく態様を採用しつつもより多くの電子素子を封入する場合には、基板の面内方向での大きさが大きくなってしまう。このように、基板の面内方向での大きさが大きくなると、熱処理工程で基板が反ってしまうことがある。
　この点、基板の反りを防止するために、例えば、回路パターンが形成される金属回路板の厚さを金属放熱板の厚さよりも大きくし、金属放熱板のセラミックス基板の反対側の面の表面積を、金属回路板のセラミックス基板と反対側の面の表面積よりも大きくすることで、セラミックス基板に発生する熱応力によるセラミックス基板の反りを抑制することが提案されている（特開２０１６－７２２８１号）。また、桟部を跨ぐ導電部材によって絶縁回路基板間を電気的に接続し、上蓋の隔壁部が樹脂枠体の桟部を押圧し、さらに桟部が絶縁回路基板の第１外縁部を押圧することで、絶縁回路基板が反ることを抑制する態様も提案されている（ＷＯ２０１５/１０７８０４）。
　しかしながら、前述した先行文献のいずれも、基板の反り、特に周縁部における反りを抑制するという観点からは不十分なものであった。
　本発明は、このような点を鑑みてなされたものであり、基板における反り、特に基板の周縁部が封止部内方に向かう反りを防止できる電子モジュールを提供する。
［概念１］
　本発明による電子モジュールは、
　第一基板と、
　前記第一基板の一方側に設けられた電子素子と、
　少なくとも前記電子素子を封止する封止部と、
　前記電子素子に電気的に接続され、前記封止部の側面から露出した接続端子と、
　前記電子素子に電気的に接続されておらず、前記封止部の側面から露出した応力緩和端子と、
　を備えてもよい。
［概念２］
　本発明の概念１による電子モジュールにおいて、
　前記接続端子は、前記電子素子に対する制御信号を入力するための制御端子を有し、
　前記応力緩和端子の幅は前記制御端子の幅よりも太くなってもよい。
［概念３］
　本発明の概念１又は２による電子モジュールにおいて、
　前記接続端子は前記電子素子に電力を供給するパワー端子を有し、
　前記応力緩和端子の幅は前記パワー端子の幅よりも細くなってもよい。
［概念４］
　本発明の概念１乃至３のいずれか１つによる電子モジュールにおいて、
　前記電子素子は、第一電子素子と、前記第一電子素子の一方側に設けられた第二電子素子と、を有し、
　前記応力緩和端子は、前記第一電子素子及び前記第二電子素子に電気的に接続されていなくてもよい。
［概念５］
　本発明の概念４による電子モジュールにおいて、
　前記第二電子素子の一方側に設けられた第二導体層と、
　前記第二導体層の一方側に設けられた第二基板と、をさらに備え、
　前記応力緩和端子は、前記第二導体層に設けられた応力緩和端子基端部と、少なくとも一部が前記封止部から露出した応力緩和端子外方部と、前記応力緩和端子基端部と前記応力緩和端子外方部との間に設けられ、前記応力緩和端子基端部側で一方側に曲げられた応力緩和端子屈曲部とを有してもよい。
［概念６］
　本発明の概念５よる電子モジュールにおいて、
　前記第一基板の一方側に、前記第一電子素子及び前記第二電子素子に電気的に接続されていない非接続導体層が設けられてもよい。
［概念７］
　本発明の概念１乃至６のいずれか１つによる電子モジュールにおいて、
　前記接続端子は、前記第一電子素子又は前記第二電子素子に電力を供給する複数のパワー端子を有し、
　少なくとも一つのパワー端子は、前記第二導体層に電気的に接続されたパワー端子基端部と、少なくとも一部が前記封止部から露出したパワー端子外方部と、前記パワー端子基端部と前記パワー端子外方部との間に設けられ、前記パワー端子基端部側で一方側に曲げられたパワー端子屈曲部とを有してもよい。
［概念８］
　本発明の概念１乃至７のいずれか１つによる電子モジュールにおいて、
　前記接続端子は、前記第一電子素子又は前記第二電子素子に電力を供給するパワー端子を有し、
　前記応力緩和端子は、前記パワー端子よりも面方向で周縁方向外方に設けられてもよい。
［概念９］
　本発明の概念１乃至８のいずれか１つによる電子モジュールにおいて、
　前記接続端子は、前記第一電子素子又は前記第二電子素子に対する制御信号を入力するための複数の制御端子を有し、
　前記応力緩和端子が、面内方向において、前記第一基板の第一側面又は前記第一側面と反対側の側面である第二側面を跨ぐようにして前記第一基板の周縁外方まで延び、
　前記第一基板は、前記第一側面と前記第二側面との間で延在する第三側面及び第四側面を有し、
　前記制御端子のうちの少なくとも一つは、面内方向において、前記第一基板の前記第三側面又は前記第四側面を跨ぐようにして前記第一基板の周縁外方まで延びてもよい。
　本発明では、電子素子に電気的に接続されておらず、封止部の側面から露出した応力緩和端子が設けられている。発明者が実験を行って確認したところによると、このような端子を設けることで基板が反ること、特に基板の周縁部が封止部内方に向かって反ることを防止できる。
図１は、本発明の第１の実施の形態で用いられうる電子モジュールであって、封止部、第二基板、第二放熱層等を示していない平面図である。 図２は、本発明の第１の実施の形態で用いられうる電子モジュールであって、封止部を示していない側方図である。 図３は、本発明の第１の実施の形態で用いられうる電子モジュールであって、封止部を示していない平面図である。 図４（ａ）は、本発明の第１の実施の形態で用いられうるパワー端子の側方図であり、図４（ｂ）は、本発明の第１の実施の形態で用いられうる別の態様のパワー端子の側方図である。 図５は、本発明の第１の実施の形態で用いられうる応力緩和端子の側方図である。 図６は、本発明の第１の実施の形態で用いられうる制御端子の側方図である。 図７は、本発明の第１の実施の形態で用いられうる電子モジュールの平面図である。 図８は、本発明の第１の実施の形態で用いられうる第一電子素子、第一接続体、第二電子素子、第二接続体等の関係を示した側方断面図である。 図９は、本発明の第１の実施の形態で用いられうる第一電子素子を示した平面図である。 図１０は、本発明の第１の実施の形態で用いられうる第二電子素子を示した平面図である。 図１１は、図８に対応する図面であり、本発明の第２の実施の形態で用いられうる電子モジュールの側方断面図である。 図１２は、図８に対応する図面であり、本発明の第３の実施の形態で用いられうる電子モジュールの側方断面図である。
第１の実施の形態
《構成》
　本実施の形態において、「一方側」は図２の上方側を意味し、「他方側」は図２の下方側を意味する。図２の上下方向を「第一方向」と呼び、紙面の表裏方向を「第二方向」と呼び、左右方向を「第三方向」と呼ぶ。第二方向及び第三方向を含む面内方向を「面内方向」といい、一方側から他方側に向かって見た場合には「平面視」という。
　図８に示すように、電子モジュールは、第一放熱層１９と、第一放熱層１９の一方側に設けられた第一基板１１と、第一基板１１の一方側に設けられた第一導体層１２と、第一導体層１２の一方側に設けられた第一電子素子１３と、第一電子素子１３の一方側に設けられた第二電子素子２３と、第二電子素子２３の一方側に設けられた第二導体層２２と、第二導体層２２の一方側に設けられた第二基板２１と、第二基板２１の一方側に設けられた第二放熱層２９と、第一電子素子１３及び第二電子素子２３を封止する封止樹脂等から構成される封止部９０と、を有してもよい。
　第一導体層１２及び第二導体層２２の両方又はいずれか一方は端子１１０，１５０と接続されてもよく（図１参照）、端子１１０，１５０の先端側は封止部９０の外方に露出して、制御基板等の外部装置と接続可能となってもよい。
　図１に示すように、端子１１０，１５０は、第一電子素子１３又は第二電子素子２３に電気的に接続され、封止部９０の側面から露出した接続端子１１０と、第一電子素子１３及び第二電子素子２３のいずれにも電気的に接続されておらず、封止部９０の側面から露出した応力緩和端子１５０と、を有してもよい。
　接続端子１１０は、第一電子素子１３又は第二電子素子２３に対する制御信号を入力するための一つ又は複数の制御端子１２０を有してもよい。応力緩和端子１５０の幅（面内方向の短手方向における長さであり、図１の第二方向における長さ）は、いずれの箇所においても、制御端子１２０の幅の最も太い部分よりも太くなってもよい。
　接続端子１１０は、第一電子素子１３又は第二電子素子２３に電力を供給する一つ又は複数のパワー端子１３０を有してもよい。応力緩和端子１５０の幅は、いずれの箇所においても、パワー端子１３０の幅の最も細い部分よりも細くなってもよい。
　図５に示すように、応力緩和端子１５０は、第二導体層２２に導電性接着剤９５を介して間接的に設けられた応力緩和端子基端部１５１と、少なくとも一部が封止部９０から露出した応力緩和端子外方部１５３と、応力緩和端子基端部１５１と応力緩和端子外方部１５３との間に設けられ、封止部９０内において一方側又は他方側に曲げられた応力緩和端子屈曲部１５２とを有してもよい。なお、応力緩和端子基端部１５１と第二導体層２２との間には導電性接着剤９５が設けられておらず、応力緩和端子基端部１５１が第二導体層２２に直接設けられるようになってもよい。
　図４に示すように、パワー端子１３０は、導体層１２，２２に導電性接着剤９５を介して間接的に設けられたパワー端子基端部１３１と、少なくとも一部が封止部９０から露出したパワー端子外方部１３３と、パワー端子基端部１３１とパワー端子外方部１３３との間に設けられ、パワー端子基端部１３１側で一方側又は他方側に曲げられたパワー端子屈曲部１３２とを有してもよい。図１に示す態様では、左上のパワー端子１３０は、図４（ａ）に示すように、第二導体層２２に導電性接着剤９５を介して間接的に設けられたパワー端子基端部１３１と、パワー端子基端部１３１側で一方側又は他方側に曲げられたパワー端子屈曲部１３２とを有している。それ以外の４つのパワー端子１３０は、図４（ｂ）に示すように、第一導体層１２に導電性接着剤９５を介して間接的に設けられたパワー端子基端部１３１と、パワー端子基端部１３１側で他方側に曲げられたパワー端子屈曲部１３２とを有している。
　制御端子１２０は、導体層１２，２２に導電性接着剤９５を介して間接的に設けられた制御端子基端部１２１と、少なくとも一部が封止部９０から露出した制御端子外方部１２３と、制御端子基端部１２１と制御端子外方部１２３との間に設けられ、制御端子基端部１２１側で一方側又は他方側に曲げられた制御端子屈曲部１２２とを有してもよい。図１に示す態様では、図６に示すように、制御端子１２０が、第一導体層１２に導電性接着剤９５を介して間接的に設けられた制御端子基端部１２１と、制御端子基端部１２１側で他方側に曲げられた制御端子屈曲部１２２とを有している。
　制御端子１２０は、第一導体層１２に電気的に接続された制御端子基端部１２１と、少なくとも一部が封止部９０から露出した制御端子外方部１２３と、制御端子基端部１２１と制御端子外方部１２３との間に設けられ、封止部９０内において一方側に曲げられた制御端子屈曲部１２２とを有してもよい。
　第一基板１１の一方側に、樹脂封止する際に金型で押圧される、第一電子素子１３及び第二電子素子２３に電気的に接続されていない非接続導体層５０が設けられてもよい。図２及び図３に示すように、第二基板２１の面内方向における大きさは第一基板１１の面内方向における大きさよりも小さくなり、図３に示すように、平面視において、第一基板１１に設けられる非接続導体層５０が第一基板１１の外方に位置するようになってもよい。
　封止部９０は図７に示すように平面視において略矩形状となってもよい。本実施の形態において「略矩形状」とは対向する２対の辺を有する四角形のことを意味し、例えば平面視における角部が直角であってもよいが丸みを帯びていてもよいし、図７に示すように角が傾斜するようになってもよいし、図７に示すように側面の所々に凹部が設けられてもよい。図３に示すように、第一基板１１及び第二基板２１の各々も平面視において略矩形状となってもよい。
　封止部９０は、第一側面９１と、第一側面９１と反対側の側面である第二側面９２と、これら第一側面９１と第二側面９２との間で延在する第三側面９３及び第四側面９４を有してもよい。封止部９０が平面視において略長方形状となる場合には、第一側面９１と第二側面９２が平面視において平行となり、第三側面９３と第四側面９４が平面視において平行となり、平面視における第一側面９１と第二側面９２の長さが略同一となり、平面視における第三側面９３と第四側面９４の長さが略同一となってもよい。本実施の形態において「略同一」とは、両者の長さの差が長さの長い方の１０％以内にあることを意味し、長さＡ１と長さＡ２（Ａ１≧Ａ２）とが略同一であるというのは、Ａ１×０．９≦Ａ２≦Ａ１となることを意味している。本実施の形態では、封止部９０が平面視において略長方形状となる態様を用いて説明するが、これに限られることはなく、封止部９０は平面視において、略正方形状であってもよいし略台形状であってもよい。
　応力緩和端子１５０が封止部９０の第一側面９１及び／又は第一側面９１と反対側の側面である第二側面９２に沿って設けられてもよい。
　制御端子１２０のうちの少なくとも一つは、封止部９０の第三側面９３及び／又は第四側面９４から外方に露出してもよい。
　応力緩和端子１５０はパワー端子１３０よりも面方向で周縁方向外方に設けられてもよい。図１に示す態様では、第一側面９１側に３つのパワー端子１３０が設けられており、図１の第二方向に沿った最も上方に位置するパワー端子１３０よりも上方側（周縁方向外方）に１つの応力緩和端子１５０が設けられ、図１の第二方向に沿った最も下方に位置するパワー端子１３０よりも下方側（周縁方向外方）に１つの応力緩和端子１５０が設けられている。
　第一基板１１は、図１に示すように、封止部９０に対応して、第一側面１１ａ、第二側面１１ｂ、第三側面１１ｃ及び第四側面１１ｄを有してもよい。第二基板２１も、図３に示すように、封止部９０に対応して、第一側面２１ａ、第二側面２１ｂ、第三側面２１ｃ及び第四側面２１ｄを有してもよい。
　図１に示す態様では、２つの応力緩和端子１５０が、面内方向において第一基板１１の第一側面１１ａを跨ぐようにして第一基板１１の周縁外方まで延びるようになっている。また、図１の右上に位置する１つの制御端子１２０ａが、面内方向において第一基板１１の第三側面１１ｃを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第一側面９１から外方に露出している（図７参照）。図１の左上に位置する別の１つの制御端子１２０ｂが、面内方向において第一基板１１の第三側面１１ｃを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第二側面９２から外方に露出している（図７参照）。また、図１の右下に位置する１つの制御端子１２０ｃが、面内方向において第一基板１１の第四側面１１ｄを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第一側面９１から外方に露出している（図７参照）。図１の左下に位置する別の１つの制御端子１２０ｄが、面内方向において第一基板１１の第四側面１１ｄを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第二側面９２から外方に露出している（図７参照）。
　図１に示す態様では、７つの制御端子１２０が、面内方向において第一基板１１の第一側面１１ａを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第一側面９１から外方に露出している（図７参照）。また別の７つの制御端子１２０が、面内方向において第一基板１１の第二側面１１ｂを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第二側面９２から外方に露出している（図７参照）。３つのパワー端子１３０が面内方向において第一基板１１の第一側面１１ａを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第一側面９１から外方に露出している（図７参照）。また２つのパワー端子１３０が面内方向において第一基板１１の第二側面１１ｂを跨ぐようにして第一基板１１の周縁外方まで延び（図１参照）、封止部９０の第二側面９２から外方に露出している（図７参照）。
　封止部９０の第一側面９１側の真ん中に位置するパワー端子１３０に開口部１３０ａが設けられ、平面視において、パワー端子１３０の開口部１３０ａを介して非接続導体層５０が視認可能となってもよい。このような開口部１３０ａを設けることで、樹脂封止する際に金型によって非接続導体層５０を押圧することができるようになる。
　図８に示すように、本実施の形態の電子モジュールは、接続体６０，７０を有してもよい。接続体６０，７０は、第一電子素子１３と第二電子素子２３との間に設けられた第一接続体６０と、第二電子素子２３の第一接続体６０と反対側に設けられた第二接続体７０とを有してもよい。
　接続体６０，７０は、ヘッド部６１，７１と、ヘッド部６１，７１からヘッド部６１，７１の厚み方向で延びた柱部６２，７２とを有してもよい。接続体６０，７０が第一接続体６０及び第二接続体７０を有する態様では、第一接続体６０が、第一ヘッド部６１と、第一ヘッド部６１から第一ヘッド部６１の厚み方向で延びた第一柱部６２とを有してもよい。また、第二接続体７０が、第二ヘッド部７１と、第二ヘッド部７１から第二ヘッド部７１の厚み方向で延びた第二柱部７２とを有してもよい。
　第一基板１１の一方側には複数の第一導体層１２が設けられてもよい。第一電子素子１３及び第二電子素子２３の各々又はいずれか一方はスイッチング素子であってもよいし、制御素子であってもよい。スイッチング素子としてはＭＯＳＦＥＴやＩＧＢＴ等を用いてもよい。第一電子素子１３及び第二電子素子２３の各々は半導体素子から構成されてもよく、半導体材料としてはシリコン、炭化ケイ素、窒化ガリウム等であってもよい。
　第一電子素子１３と第一接続体６０との間にははんだ等の導電性接着剤９５が設けられ、第一電子素子１３と第一接続体６０は導電性接着剤９５を介して接続されてもよい。同様に、第一接続体６０と第二電子素子２３との間にははんだ等の導電性接着剤９５が設けられ、第一接続体６０と第二電子素子２３は導電性接着剤９５を介して接続されてもよい。同様に、第二電子素子２３と第二接続体７０との間にははんだ等の導電性接着剤９５が設けられ、第二電子素子２３と第二接続体７０は導電性接着剤９５を介して接続されてもよい。
　第一基板１１及び第二基板２１としては、セラミック基板、絶縁樹脂層等の絶縁性基板を採用することができる。導電性接着剤９５としては、はんだの他、ＡｇやＣｕを主成分とする材料を用いることもできる。第一接続体６０及び第二接続体７０の材料としてはＣｕ等の金属を用いることができる。なお、基板１１，２１としては例えば回路パターニングを施した金属基板を用いることもでき、この場合には、基板１１，２１が導体層１２，２２を兼ねることになる。
　第一電子素子１３がＭＯＳＦＥＴ等のスイッチング素子である場合には、図８及び図９に示すように、第一接続体６０側の面に第一ゲート電極１３ｇ及び第一ソース電極１３ｓが設けられてもよい。同様に、図８及び図１０に示すように、第二電子素子２３がＭＯＳＦＥＴ等のスイッチング素子である場合には、第二接続体７０側の面に第二ゲート電極２３ｇ及び第二ソース電極２３ｓが設けられてもよい。この場合、第二接続体７０が第二電子素子２３の第二ソース電極２３ｓに導電性接着剤９５を介して接続されてもよい。また、第一接続体６０が第一電子素子１３の第一ソース電極１３ｓと第二電子素子２３の第二接続体７０と反対側の面に設けられた第二ドレイン電極２３ｄとを導電性接着剤９５を介して接続してもよい。第一電子素子１３の第一接続体６０と反対側の面には第一ドレイン電極１３ｄが設けられてもよい。図９に示す第一ゲート電極１３ｇは接続子３０と導電性接着剤９５を介して接続され、この接続子３０は第一導体層１２と導電性接着剤９５を介して接続されてもよい。図１０に示す第二ゲート電極２３ｇは接続子４０と導電性接着剤９５を介して接続されて、この接続子４０は第一導体層１２と導電性接着剤９５を介して接続されてもよい。
　端子１１０，１５０と導体層１２，２２との接合は、はんだ等の導電性接着剤９５を利用する態様だけではなく、レーザ溶接を利用してもよいし、超音波接合を利用してもよい。
《作用・効果》
　次に、上述した構成からなる本実施の形態による作用・効果の一例について説明する。なお、「作用・効果」で説明するあらゆる態様を、上記構成で採用することができる。
　本実施の形態において、電子素子１３，２３に電気的に接続されておらず、封止部９０の側面から露出した応力緩和端子１５０が設けられている態様を採用した場合には、基板１１，２１が反ること、特に基板１１，２１の周縁部が封止部内方に向かって反ることを防止できる。より具体的には、第一基板１１側に応力緩和端子１５０が設けられている態様であれば第一基板１１の周縁部が上方に反ることを防止でき、第二基板２１側に応力緩和端子１５０が設けられている態様であれば第二基板２１の周縁部が下方に反ることを防止できる。
　応力緩和端子１５０の幅が制御端子１２０の幅よりも太い態様を採用した場合には、応力緩和端子による基板１１，２１のひずみを効果的に抑制することができる。応力緩和端子基端部１５１の幅が制御端子基端部１２１の幅の２倍～５倍となる場合、より限定するならば２．５倍～４倍となる場合には、面内におけるスペースを節約しつつ、基板１１，２１のひずみを効果的に抑制できる点で有益である。
　応力緩和端子１５０の幅がパワー端子１３０の幅よりも細い態様を採用した場合には、電気的に機能しない応力緩和端子１５０に利用される面内におけるスペースを節約することができる。なお、このような態様に限られることはなく、応力緩和端子１５０の幅がパワー端子１３０の幅と同一であってもよいし、応力緩和端子１５０の幅がパワー端子１３０の幅よりも太くなってもよい。但し、これらの態様では、電気的に機能しない応力緩和端子１５０に利用される面内におけるスペースが必要となることから留意が必要である。一例としては、応力緩和端子基端部１５１の幅がパワー端子基端部１３１の幅の１／５倍～１／１５倍となる場合、より限定するならば１／１０倍～１／１４倍となる場合には、面内におけるスペースを節約しつつ、基板１１，２１のひずみを効果的に抑制できる点で有益である。
　図５に示すように、応力緩和端子１５０が、第二導体層２２に直接又は間接的に設けられた応力緩和端子基端部１５１と、少なくとも一部が封止部９０から露出した応力緩和端子外方部１５３と、応力緩和端子基端部１５１と応力緩和端子外方部１５３との間に設けられ、応力緩和端子基端部１５１側で一方側に曲げられた応力緩和端子屈曲部１５２とを有する態様を採用した場合には、応力緩和端子１５０による放熱によって第二基板２１のひずみを防止できるだけではなく、応力緩和端子１５０からの物理的な力によっても第二基板２１のひずみを防止できる点で有益である。
　図１に示すように、第一基板１１の一方側に第一電子素子１３及び第二電子素子２３に電気的に接続されていない非接続導体層５０が設けられる場合には、非接続導体層５０が金型で押圧されることから、第一基板１１における反りを防止できる。特に、前述したような第二基板２１側に設けられた応力緩和端子１５０を採用しつつ、第一基板１１側に設けられた非接続導体層５０を採用した場合には、第一基板１１及び第二基板２１の両方におけるひずみを防止できる点で有益である。
　図４に示すように、パワー端子１３０が、第二導体層２２に電気的に接続されたパワー端子基端部１３１と、少なくとも一部が封止部９０から露出したパワー端子外方部１３３と、パワー端子基端部１３１とパワー端子外方部１３３との間に設けられ、パワー端子基端部１３１側で一方側に曲げられたパワー端子屈曲部１３２とを有する態様を採用した場合には、パワー端子１３０からの物理的な力によっても第二基板２１のひずみを防止できる点で有益である。
　図１に示すように、応力緩和端子１５０がパワー端子１３０よりも面方向で周縁方向外方に設けられる態様を採用した場合には、周縁方向外方における放熱効率を高めることができ、ひずみの生じやすい周縁方向外方においての基板１１，２１の反りを防止できる。また、駆動時にはパワー端子１３０による発熱が生じるが、このように応力緩和端子１５０をパワー端子１３０よりも面方向で周縁方向外方に設けることで、パワー端子１３０からの熱を周縁外方に逃がすことも期待できる。
　制御端子１２０のうちの少なくとも一つが、面内方向において第一基板１１の第三側面１１ｃ又は第四側面１１ｄを跨ぐようにして第一基板１１の周縁外方まで延びる態様を採用した場合には、このような制御端子１２０によって放熱効率を高めることができ、ひずみの生じやすい周縁方向外方においての基板１１，２１の反りを防止できる。図１に示す態様では４つの制御端子１２０ａ－１２０ｄの各々が第一基板１１の四隅に対応して設けられていることから、より均一に効率よく放熱効率を高めることができる。
　応力緩和端子１５０の数はパワー端子１３０の数の多い側面で多く設けられるようにし、放熱のバランスを取るようにしてもよい。図１に示す態様では、封止部９０の第一側面９１側（第一基板１１の第一側面１１ａ側）に３つのパワー端子１３０が設けられ、第二側面９２側（第一基板１１の第二側面１１ｂ側）に２つのパワー端子１３０が設けられているが、３つのパワー端子１３０が設けられている側面（図１では第一側面９１）側において、基板１１，２１のひずみが生じやすくなる可能性がある。このため、ひずみの生じやすい可能性のある第一側面９１側（第二基板２１の第一側面２１ａ側）に２つの応力緩和端子１５０を設けることで基板１１，２１にひずみが発生することを防止し、他方、２つのパワー端子１３０が設けられている第二側面９１側（第二基板２１の第二側面２１ｂ側）では１つの応力緩和端子１５０が設けられるようにしてもよい。なお、応力緩和端子１５０の数がパワー端子１３０の数の多い側面で多く設けられるようにする態様では、パワー端子１３０の数の少ない側面において応力緩和端子１５０が設けられないようにしてもよく、図１の第二側面９１側（第二基板２１の第二側面２１ｂ側）に応力緩和端子１５０が設けられないようにしてもよい。
第２の実施の形態
　次に、本発明の第２の実施の形態について説明する。
　第１の実施の形態では、第一電子素子１３の一方側に第二電子素子２３が設けられるスタック構造となり、接続体６０，７０が設けられる態様となっていたが、本実施の形態では、接続体６０，７０が設けられていない。本実施の形態では、第１の実施の形態で説明したあらゆる態様を採用することができる。第１の実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態でも、第１の実施の形態と同様、応力緩和端子１５０を設ける効果を得ることができる。一例として、第二導体層２２に導電性接着剤９５を介して設けられた応力緩和端子基端部１５１と、少なくとも一部が封止部９０から露出した応力緩和端子外方部１５３と、応力緩和端子基端部１５１と応力緩和端子外方部１５３との間に設けられ、応力緩和端子基端部１５１側で一方側に曲げられた応力緩和端子屈曲部１５２とを有する態様を採用した場合には、応力緩和端子１５０による放熱によって第二基板２１のひずみを防止できるだけではなく、応力緩和端子１５０からの物理的な力によっても第二基板２１のひずみを防止できる。
第３の実施の形態
　次に、本発明の第３の実施の形態について説明する。
　第１の実施の形態では、第一電子素子１３の一方側に第二電子素子２３が設けられるスタック構造となり、接続体６０，７０が設けられる態様となっていたが、本実施の形態では、本実施の形態ではスタック構造とはなっておらず、第一電子素子１３は設けられるが第二電子素子２３が設けられていない態様となっている。また、第二基板１３も設けられていない態様となっている。本実施の形態では、応力緩和端子１５０が第一導体層１３に接続される態様となっている。本実施の形態では、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態でも、第１の実施の形態と同様、応力緩和端子１５０を設ける効果を得ることができ、応力緩和端子１５０による放熱によって第一基板１１のひずみを防止できる。なお、本実施の形態では、応力緩和端子基端部１５１は第一導体層１２に導電性接着剤９５（図１２では図示せず。）を介して設けられている。
　上述した各実施の形態の記載及び図面の開示は、請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって請求の範囲に記載された発明が限定されることはない。また、出願当初の請求項の記載はあくまでも一例であり、明細書、図面等の記載に基づき、請求項の記載を適宜変更することもできる。
１１　　　　第一基板
１３　　　　第一電子素子
２１　　　　第二基板
２２　　　　第二導体層
２３　　　　第二電子素子
５０　　　　非接続導体層
９０　　　　封止部
１２０　　　制御端子（接続端子）
１３０　　　パワー端子（接続端子）
１３１　　　パワー端子基端部
１３２　　　パワー端子屈曲部
１３３　　　パワー端子外方部
１５０　　　応力緩和端子
１５１　　　応力緩和端子基端部
１５２　　　応力緩和端子屈曲部
１５３　　　応力緩和端子外方部
 

Claims (9)

  1. 　第一基板と、
    　前記第一基板の一方側に設けられた電子素子と、
    　少なくとも前記電子素子を封止する封止部と、
    　前記電子素子に電気的に接続され、前記封止部の側面から露出した接続端子と、
    　前記電子素子に電気的に接続されておらず、前記封止部の側面から露出した応力緩和端子と、
    　を備えることを特徴とする電子モジュール。
  2. 　前記接続端子は、前記電子素子に対する制御信号を入力するための制御端子を有し、
    　前記応力緩和端子の幅は前記制御端子の幅よりも太いことを特徴とする請求項１に記載の電子モジュール。
  3. 　前記接続端子は前記電子素子に電力を供給するパワー端子を有し、
    　前記応力緩和端子の幅は前記パワー端子の幅よりも細いことを特徴とする請求項１に記載の電子モジュール。
  4. 　前記電子素子は、第一電子素子と、前記第一電子素子の一方側に設けられた第二電子素子と、を有し、
    　前記応力緩和端子は、前記第一電子素子及び前記第二電子素子に電気的に接続されていないことを特徴とする請求項１に記載の電子モジュール。
  5. 　前記第二電子素子の一方側に設けられた第二導体層と、
    　前記第二導体層の一方側に設けられた第二基板と、をさらに備え、
    　前記応力緩和端子は、前記第二導体層に設けられた応力緩和端子基端部と、少なくとも一部が前記封止部から露出した応力緩和端子外方部と、前記応力緩和端子基端部と前記応力緩和端子外方部との間に設けられ、前記応力緩和端子基端部側で一方側に曲げられた応力緩和端子屈曲部とを有することを特徴とする請求項４に記載の電子モジュール。
  6. 　前記第一基板の一方側に、前記第一電子素子及び前記第二電子素子に電気的に接続されていない非接続導体層が設けられることを特徴とする請求項５に記載の電子モジュール。
  7. 　前記接続端子は、前記第一電子素子又は前記第二電子素子に電力を供給する複数のパワー端子を有し、
    　少なくとも一つのパワー端子は、前記第二導体層に電気的に接続されたパワー端子基端部と、少なくとも一部が前記封止部から露出したパワー端子外方部と、前記パワー端子基端部と前記パワー端子外方部との間に設けられ、前記パワー端子基端部側で一方側に曲げられたパワー端子屈曲部とを有することを特徴とする請求項１に記載の電子モジュール。
  8. 　前記接続端子は、前記第一電子素子又は前記第二電子素子に電力を供給するパワー端子を有し、
    　前記応力緩和端子は、前記パワー端子よりも面方向で周縁方向外方に設けられることを特徴とする請求項１に記載の電子モジュール。
  9. 　前記接続端子は、前記第一電子素子又は前記第二電子素子に対する制御信号を入力するための複数の制御端子を有し、
    　前記応力緩和端子が、面内方向において、前記第一基板の第一側面又は前記第一側面と反対側の側面である第二側面を跨ぐようにして前記第一基板の周縁外方まで延び、
    　前記第一基板は、前記第一側面と前記第二側面との間で延在する第三側面及び第四側面を有し、
    　前記制御端子のうちの少なくとも一つは、面内方向において、前記第一基板の前記第三側面又は前記第四側面を跨ぐようにして前記第一基板の周縁外方まで延びることを特徴とする請求項１に記載の電子モジュール。
     
PCT/JP2018/001168 2018-01-17 2018-01-17 電子モジュール WO2019142257A1 (ja)

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