WO2019109437A1 - 保护膜贴合装置及贴合方法 - Google Patents

保护膜贴合装置及贴合方法 Download PDF

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Publication number
WO2019109437A1
WO2019109437A1 PCT/CN2018/070003 CN2018070003W WO2019109437A1 WO 2019109437 A1 WO2019109437 A1 WO 2019109437A1 CN 2018070003 W CN2018070003 W CN 2018070003W WO 2019109437 A1 WO2019109437 A1 WO 2019109437A1
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stage
protective film
generating device
substrate
upper case
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PCT/CN2018/070003
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English (en)
French (fr)
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王璟
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019109437A1 publication Critical patent/WO2019109437A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
    • B65B33/02—Packaging small articles, e.g. spare parts for machines or engines

Definitions

  • the present invention relates to the field of film bonding technology, and in particular to a protective film bonding device and a bonding method.
  • the protective film bonding process (Top laminator) is generally after the TFE (Thin Film Encapsulation) process or the Touch process (touch panel process).
  • the purpose of the process is to attach a layer of PET (Polyethylene terephthalate) on the surface of the product.
  • PET Polyethylene terephthalate
  • a protective film made of ethylene terephthalate prevents the product from being damaged in subsequent processes and causes the product to be scrapped.
  • the present invention provides a protective film bonding device and a bonding method, which can ensure the flatness of the protective film, avoid the generation of bubbles, and prevent the product film from being pierced by the particles, and can Better compatible with strip and sheet fit requirements.
  • a protective film bonding device comprising:
  • a pressure plate disposed opposite to the stage and disposed above the stage, including a first slot for air to pass through a surface facing the stage, and a first one connecting all of the first slots a passage and a first intake hole, the first intake hole and the first groove being on different surfaces of the pressure plate;
  • a first vacuum generating device communicating with the first air inlet hole for generating a vacuum suction force to adsorb a protective film on the surface of the pressure plate;
  • the stage and the pressure plate may be adjacent to each other to adhere the protective film to the surface of the substrate.
  • the protective film bonding apparatus further includes a second vacuum generating device, and the stage includes a plurality of second slots for air passage opening toward a surface of the pressure plate, and all the stations are connected a second passage of the second groove and a second intake hole, the second intake hole and the second groove are on different surfaces of the stage; the second vacuum generating device and the second The air inlet holes are connected to generate vacuum suction to adsorb the substrate on the surface of the stage.
  • the protective film bonding apparatus further includes the lifting mechanism, and the lifting mechanism is disposed at a bottom of the stage for driving the stage to rise and fall.
  • the lifting mechanism includes a driving source, a slide rail perpendicular to the loading stage, and a carriage fixed to the bottom surface of the carrier for driving under the driving source Reciprocating along the slide rail.
  • the slide rails are two, and two ends of the slide frame slide on the two slide rails respectively.
  • the protective film bonding apparatus further includes an upper casing, and the upper casing includes a receiving groove formed in a bottom surface and a guiding hole formed in a bottom surface of the receiving groove, wherein the pressing plate is accommodated in the In the accommodating groove, a protrusion is protruded from a surface of the pressure plate facing away from the stage, and the protrusion is inserted into the guiding hole and slidable along the guiding hole.
  • the protective film laminating device further includes a third vacuum generating device, and the upper casing further defines a bottom surface of the receiving groove for connecting the third vacuum generating device.
  • a suction hole, a projection of the accommodating groove on the stage is located in the stage, and the third vacuum generating device is configured to pump air after the stage abuts the end surface of the upper case, and protect The air between the membrane and the substrate is withdrawn.
  • the upper case further includes a flange disposed around the bottom surface of the receiving groove surrounding the guiding hole.
  • Another object of the present invention is to provide a protective film bonding method comprising:
  • the first vacuum generating device is evacuated, and the substrate is sucked through the stage;
  • the second vacuum generating device is evacuated, and the protective film is sucked through the pressing plate;
  • the stage and the pressure plate are brought close to each other, and the protective film is attached to the surface of the substrate.
  • the protective film bonding method further includes: after the stage abuts against the end surface of the upper case, evacuating the sealed space surrounded by the stage and the upper case.
  • the protective film of the invention is adsorbed on the pressure plate by vacuum adsorption, and is pressed on the surface of the substrate by press-pressing, which reduces the probability of generation of bubbles during the pressing process, and only needs to align the substrate with the stage.
  • the protective film and the pressing plate are aligned, and the pressing plate and the loading table are seamlessly connected, so that the precise bonding of the protective film can be realized, the indentation and the folding caused by the filming process are also avoided, and the product film layer is prevented from being punctured by the particle. Wear, and can be well compatible with strip and sheet fit requirements.
  • a small amount of air bubbles between the two is removed by vacuuming, thereby avoiding the generation of bubbles during the filming process.
  • FIG. 1 is a schematic structural view of a protective film bonding apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the internal structure of a protective film bonding apparatus according to an embodiment of the present invention
  • FIG. 3 is a partial cross-sectional structural view of a protective film bonding apparatus according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing a method of bonding a protective film according to an embodiment of the present invention.
  • a protective film bonding apparatus includes a stage 10, a platen 20, a lifting mechanism 30, and an upper case 40.
  • the stage 10 is used to place a substrate 1 to be filmed, a platen 20 and a stage. 10 is disposed oppositely, and the pressure plate 20 is disposed above the stage 10, and includes a first slot 21 for air passage opening toward the surface of the stage 10, a first passage 22 connecting all the first slots 21, and a first The air inlet hole 23, the first air inlet hole 23 and the first groove 21 are on different surfaces of the pressure plate 20, and the lifting mechanism 30 is disposed at the bottom of the stage 10 for driving the stage 10 to rise and fall to drive the stage 10 and The pressure plates 20 are close to and away from each other.
  • the stage 10 includes a plurality of air supply openings on the surface of the pressure plate 20. Passing through the second groove 11, the second passage 12 communicating with all the second grooves 11, and the second intake hole 13, the second intake hole 13 and the second groove 11 are on different surfaces of the stage 10, here
  • the two air inlet holes 13 are located on the top surface of the loading platform 10, and the second slots 11 are evenly distributed on the bottom surface of the pressure plate 20, and communicate with the second air inlet holes 13, respectively, and the first vacuum generating device (not shown) and the top of the pressure plate 20
  • the first air inlet hole 23 is connected to generate a vacuum suction force to adsorb the protective film 2 on the surface of the pressure plate 20, and a second vacuum generating device (not shown) communicates with the second air inlet hole 13 for generating vacuum suction to the substrate 1 When adsorbed on the surface of the stage 10 and the stage 10 and the pressure plate 20
  • the lifting mechanism 30 includes a driving source, a slide rail 30a perpendicular to the stage 10, and a carriage 30b.
  • the carriage 30b is fixed to the bottom surface of the stage 10 for reciprocating along the slide rail 30a under the driving of the driving source.
  • the slide rails 30a are preferably two, which can ensure the smoothness of the movement of the stage 10, and ensure that the stage 10 is parallel with the pressure plate 20 to ensure the flatness of the fit.
  • the two ends of the slide frame 30b are respectively located on the two slide rails 30a. Swipe up.
  • the upper casing 40 includes a receiving groove formed in the bottom surface and a guiding hole 400 formed in the bottom surface of the receiving groove.
  • the pressing plate 20 is received in the receiving groove.
  • the surface of the pressing plate 20 facing away from the loading table 10 is convexly provided with a stud 50. It is disposed in the guide hole 400 and slidable along the guide hole 400.
  • the protective film 2 is adsorbed and fixed on the pressing plate 20, so that the substrate 1 and the protective film 2 can achieve good positioning, and can be well compatible with strip and sheet bonding requirements.
  • the stage 10 and the pressure plate 20 are facing each other, and the stage 10 is raised to be pressed against the pressure plate 20, the substrate 1 on the stage 10 and the protective film 2 on the pressure plate 20 are attached to the entire surface at one time, and The stud 50 moves downward to further press the protective film 2, thereby improving the bonding effect of the protective film 2 and the substrate 1.
  • the protective film bonding device of the embodiment further has a third vacuum generating device (not shown).
  • the upper casing 40 is further provided with a suction hole 42 for connecting the bottom surface of the accommodating groove for connecting the third vacuum generating device.
  • the projection of the accommodating groove on the stage 10 is located in the stage 10, and the third vacuum generating device is used for After the stage 10 abuts against the end surface of the upper case 40, the air is sucked, and the protective film 2 and the substrate 1 are pressed again to extract air between the two, thereby eliminating a small amount of air bubbles which may remain.
  • the substrate 1, the protective film 2, and the pressing plate 20 are all located in the upper casing 40, so that the generation of particles can be well avoided, and the protective film 2 is not pierced by the Particle.
  • a sealing ring may be disposed on a surface of the upper surface of the upper casing 40 opposite to the end surface of the upper casing 40, or a sealing ring may be disposed on the end surface of the upper casing 40, so that the contact portion of the upper surface of the upper casing 40 can be abutted against the end surface of the upper casing 40. It has good sealing performance and ensures the vacuuming effect of the third vacuum generating device.
  • the upper casing 40 of the present embodiment further includes a ring 41 disposed around the bottom surface of the accommodating groove to surround the guiding hole 400.
  • the flange 41 has a certain height so that the pressure plate 20 is accommodated. During the movement of the groove, the bottom surface of the receiving groove is not completely adhered. On the one hand, the pressure plate 20 and the bottom surface of the receiving groove are prevented from being vacuum-fitted and difficult to separate.
  • the first plate of the pressure plate 20 of the embodiment is The air hole 23 is formed on a top surface thereof, and a joint 60 connecting the first air inlet hole 23 and the second vacuum generating device is further disposed at the top of the upper casing 40, and the air pipe is connected between the joint 60 and the first air inlet hole 23 61.
  • the gap between the bottom surface of the receiving groove and the pressure plate 20 caused by the flange 41 can also serve as an accommodation space of the air pipe 61.
  • FIG. 4 it is a schematic diagram of a method for bonding a protective film according to an embodiment of the present invention.
  • the protective film bonding method of the present embodiment mainly includes:
  • the first vacuum generating device is evacuated, and the substrate 1 is sucked through the stage 10.
  • the substrate 1 is adsorbed on the substrate transfer platform by vacuum adsorption for bulk transfer.
  • the substrate transfer platform removes the adsorption force to the substrate 1, and the stage 10 and the substrate The substrate 1 is aligned, and the suction of the substrate 1 is achieved by evacuation by the first vacuum generating device.
  • the second vacuum generating device is evacuated, and the protective film 2 is sucked through the pressing plate 20.
  • the protective film 2 for tearing off the release film is adsorbed on the protective film transfer platform by vacuum adsorption for bulk transfer.
  • the pressure plate 20 draws the protective film 2 from the protective film transfer platform, the protective film transfer platform is removed for the protection.
  • the adsorption force of the film 2, the platen 20 is aligned with the protective film 2, and the suction of the protective film 2 is achieved by evacuation by a second vacuum generating device.
  • the stage 10 and the platen 20 are brought close to each other by the elevating mechanism 30, and the protective film 2 is entirely bonded to the surface of the substrate 1 at a time.
  • the protrusion 50 can also be controlled to move down along the guiding hole 400, and the protective film 2 is pressed against the surface of the substrate 1 to improve the bonding effect.
  • the protective film of the present invention is adsorbed on the pressure plate by vacuum adsorption, and is pressed on the surface of the substrate by press-fitting, thereby reducing the probability of generation of bubbles during the pressing process, and only the substrate is required. Alignment with the stage, the protective film and the platen are aligned, and the platen and the stage are seamlessly connected, so that the protective film can be accurately fitted, and the indentation and breakage caused by the filming process are avoided, and the product is also avoided.
  • the film is pierced by the particles and is well compatible with the strip and sheet conformation requirements.
  • the protective film laminating device of the invention can realize the laminating, aligning and defoaming functions at the same time, can ensure the filming precision, and avoid the occurrence of indentation and breakage on the surface of the substrate.

Abstract

一种保护膜贴合装置及其贴合方法，包括：载台（10），用于放置待贴膜的基板（1）；压板（20），与载台（10）对向设置且设于载台（10）上方，包括在朝向载台（10）的表面开设的若干供空气通过的第一槽（21）、连通所有的第一槽（21）的第一通道（22）以及第一进气孔（23），第一进气孔（23）与第一槽（21）在压板（20）的不同的表面；第一真空发生装置，与所述第一进气孔（23）连通，用于产生真空吸力将保护膜吸附在所述压板（20）表面；所述载台（10）与所述压板（20）可相互靠近而将保护膜贴合在基板（1）表面。通过上述技术方案，减小了压合过程中气泡的产生几率，实现了保护膜的精确贴合，也避免了贴膜过程中带来的压痕和折伤，也避免了产品膜层被微粒刺穿，且能较好地兼容条状和片状的贴合要求。

Description

保护膜贴合装置及贴合方法 技术领域
本发明涉及膜片贴合技术领域，尤其涉及一种保护膜贴合装置及贴合方法。
背景技术
保护膜贴合制程(Top laminator)一般在TFE(Thin Film Encapsulation，薄膜封装)制程或者Touch制程(触摸面板制程)之后，其制程目的是为了在产品表面贴附一层PET(Polyethylene terephthalate，即聚对苯二甲酸乙二醇酯)材质的保护膜，避免产品在后续的工序中受到损伤而导致产品报废。
目前大多数面板厂商OLED touch(有机发光显示屏触摸)技术仍不成熟，所以会采用将touch制程外包，即将触摸面板与保护膜一起制作成TP film(触摸面板膜)的形式，对于类似产品，现有的利用滚轴贴膜的方式则会容易在产品表面形成压痕，且如果工厂环境管控不好，导致产品表面的particle(微粒)较多，OLED或TFE膜层被刺穿的风险会大大增加。此外，现有的技术需要另外购置脱泡仪器，设备费用也相对昂贵。再则，现有技术对无法做到对条状保护膜以及片状保护膜的完全兼容，即同一设备无法同时满足条贴与面贴的贴附要求。
发明内容
鉴于现有技术存在的不足，本发明提供了一种保护膜贴合装置及贴合方法，可以保证保护膜贴合的平整度，避免气泡的产生，避免产品膜层被particle刺穿，且能较好地兼容条状和片状的贴合要求。
为了实现上述的目的，本发明采用了如下的技术方案：
一种保护膜贴合装置，包括：
载台，用于放置待贴膜的基板；
压板，与所述载台对向设置且设于所述载台上方，包括在朝向所述载台的表面开设的若干供空气通过的第一槽、连通所有的所述第一槽的第一通道以及 第一进气孔，所述第一进气孔与所述第一槽在所述压板的不同的表面；
第一真空发生装置，与所述第一进气孔连通，用于产生真空吸力将保护膜吸附在所述压板表面；
所述载台与所述压板可相互靠近而将保护膜贴合在基板表面。
作为其中一种实施方式，所述的保护膜贴合装置还包括第二真空发生装置，所述载台包括在朝向所述压板的表面开设的若干供空气通过的第二槽、连通所有的所述第二槽的第二通道以及第二进气孔，所述第二进气孔与所述第二槽在所述载台的不同的表面；所述第二真空发生装置与所述第二进气孔连通，用于产生真空吸力将基板吸附在所述载台表面。
作为其中一种实施方式，所述的保护膜贴合装置还包括所述升降机构，所述升降机构设于所述载台底部，用于驱动所述载台上升和下降。
作为其中一种实施方式，所述升降机构包括驱动源、垂直于所述载台的滑轨和滑动架，所述滑动架固定在所述载台底面，用于在所述驱动源的驱动下沿所述滑轨往复移动。
作为其中一种实施方式，所述滑轨为两条，所述滑动架的两端分别在两条所述滑轨上滑动。
作为其中一种实施方式，所述的保护膜贴合装置还包括上壳，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内且可沿所述引导孔滑动。
作为其中一种实施方式，所述的保护膜贴合装置还包括第三真空发生装置，所述上壳上还开设有贯穿所述容置槽底面、用于连接所述第三真空发生装置的抽气孔，所述容置槽在所述载台上的投影位于所述载台内，所述第三真空发生装置用于在所述载台抵接所述上壳端面后抽气，将保护膜与基板之间的空气抽出。
作为其中一种实施方式，所述上壳还包括设于所述容置槽底面的一圈环绕所述引导孔的凸缘。
本发明的另一目的在于提供一种保护膜贴合方法，包括：
第一真空发生装置抽真空，通过载台吸取基板；
第二真空发生装置抽真空，通过压板吸取保护膜；
将载台与压板正对，使基板与保护膜实现对位；
使载台与压板相互靠近，将保护膜贴合在基板表面。
作为其中一种实施方式，所述的保护膜贴合方法还包括：在载台抵接上壳端面后，对载台、上壳围成的密闭空间抽气。
本发明的保护膜采用真空吸附的方式吸附在压板上，并采用压板压合的方式贴合在基板表面，减小了压合过程中气泡的产生几率，且只需将基板与载台对位、保护膜与压板对位，压板与载台无缝对接，即可实现保护膜的精确贴合，也避免了贴膜过程中带来的压痕和折伤，也避免了产品膜层被particle刺穿，且能较好地兼容条状和片状的贴合要求。另外，保护膜与压板贴合后，还采用抽真空的方式将二者之间的少量气泡去除，最大限度避免了贴膜过程中气泡的产生。
附图说明
图1为本发明实施例的保护膜贴合装置的结构示意图；
图2为本发明实施例的保护膜贴合装置的内部结构示意图；
图3为本发明实施例的保护膜贴合装置的局部断面结构示意图；
图4为本发明实施例的保护膜贴合方法示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1和图2，本发明实施例的保护膜贴合装置包括载台10、压板20、升降机构30和上壳40，载台10用于放置待贴膜的基板1，压板20与载台10对向设置，且压板20设于载台10上方，包括在朝向载台10的表面开设的若干供空气通过的第一槽21、连通所有的第一槽21的第一通道22以及第一进气孔23，第一进气孔23与第一槽21在压板20的不同的表面，升降机构30设于载台10底部，用于驱动载台10上升和下降，以驱动载台10与压板20相互靠近和远离。
在对基板1与保护膜2分别进行对位时，本实施例均采用真空吸附方式对基板1与保护膜2进行吸取，具体是，载台10包括在朝向压板20的表面开设的若干供空气通过的第二槽11、连通所有的第二槽11的第二通道12以及第二进气孔13，第二进气孔13与第二槽11在载台10的不同的表面，这里的第二进气孔13位于载台10顶面，第二槽11均匀分布在压板20的底面，并分别与第二进气孔13连通，第一真空发生装置(图未示)与压板20顶部的第一进气孔23连通，用于产生真空吸力将保护膜2吸附在压板20表面，第二真空发生装置(图未示)与第二进气孔13连通，用于产生真空吸力将基板1吸附在载台10表面，载台10与压板20相互靠近时，利用二者之间的压合力将保护膜2贴合在基板1表面。
如图2所示，升降机构30包括驱动源、垂直于载台10的滑轨30a和滑动架30b，滑动架30b固定在载台10底面，用于在驱动源的驱动下沿滑轨30a往复移动。这里，滑轨30a最好是两条，可以保证载台10运动的平稳性，保证载台10与压板20平行，以保证贴合平整度，滑动架30b的两端分别在两条滑轨30a上滑动。
上壳40包括底面开设的容置槽和容置槽底面开设的引导孔400，压板20容纳于容置槽内，压板20背向载台10的表面凸设有凸柱50，凸柱50穿设于引导孔400内且可沿引导孔400滑动。
由于基板1被吸附固定在载台10上，保护膜2被吸附固定在压板20上，使得基板1、保护膜2可以实现良好的定位，能较好地兼容条状和片状的贴合要求，当载台10与压板20正对，且载台10上升至朝压板20压合时，载台10上的基板1与压板20上的保护膜2一次性整面贴合，还可以通过使凸柱50朝下运动而进一步按压保护膜2，提升保护膜2与基板1的贴合效果。
考虑到保护膜2贴合到基板1表面后，基板1与保护膜2之间仍有可能存在少量气泡，本实施例的保护膜贴合装置还具有第三真空发生装置(图未示)，上壳40上还开设有贯穿容置槽底面、用于连接第三真空发生装置的抽气孔42，容置槽在载台10上的投影位于载台10内，第三真空发生装置用于在载台10抵接上壳40端面后抽气，再次压紧保护膜2与基板1而将二者之间的空气抽出，消除可能残留的少量气泡。贴合时，基板1、保护膜2、压板20均位于上壳40内，因此可以很好地避免particle的产生，保护膜2不会被Particle刺穿。
另外，在载台10的外围与上壳40端面正对的区域，或者在上壳40端面可 设有密封圈，使得载台10运动至抵接上壳40端面时，二者的接触部位可以具有良好的密封性能，保证第三真空发生装置抽真空效果。
如图2和图3所示，本实施例的上壳40还包括设于容置槽底面的一圈环绕引导孔400的凸缘41，该凸缘41具有一定的高度使得压板20在容置槽内运动的过程中不会完全与容置槽底面贴合，一方面可以避免压板20与容置槽底面真空贴合而难以分离，另一方面，由于本实施例的压板20的第一进气孔23开设于其顶面，这里在上壳40的顶部还设置有连通第一进气孔23和第二真空发生装置的接头60，接头60与第一进气孔23之间连接有气管61，该凸缘41造成的容置槽底面与压板20之间的间隙还可以作为气管61的容纳空间。
如图4所示，为本发明实施例的保护膜贴合方法示意图，本实施例的保护膜贴合方法主要包括：
S01、第一真空发生装置抽真空，通过载台10吸取基板1。这里，基板1采用真空吸附的方式吸附在基板传输平台上进行批量传输，当载台10从基板传输平台上吸取基板1时，基板传输平台撤去对该基板1的吸附力，载台10与该基板1对位，并通过第一真空发生装置抽真空实现对基板1的吸取。
S02、第二真空发生装置抽真空，通过压板20吸取保护膜2。这里，撕除离型膜的保护膜2采用真空吸附的方式吸附在保护膜传输平台上进行批量传输，当压板20从保护膜传输平台上吸取保护膜2时，保护膜传输平台撤去对该保护膜2的吸附力，压板20与该保护膜2对位，并通过第二真空发生装置抽真空实现对保护膜2的吸取。
S03、将载台10与压板20正对，间接实现基板1与保护膜2的对位过程；
S04、通过升降机构30使载台10与压板20相互靠近，从而将保护膜2一次性地整面贴合在基板1表面。此处，还可控制凸柱50沿引导孔400下移，将保护膜2压紧在基板1表面，提高贴合效果。
S05、在载台10抵接上壳40端面后，对载台10、上壳40围成的密闭空间抽气，利用真空吸力消除保护膜2与基板1之间的残留气泡。
综上所述，本发明的保护膜采用真空吸附的方式吸附在压板上，并采用压板压合的方式贴合在基板表面，减小了压合过程中气泡的产生几率，且只需将基板与载台对位、保护膜与压板对位，压板与载台无缝对接，即可实现保护膜的精确贴合，也避免了贴膜过程中带来的压痕和折伤，也避免了产品膜层被 particle刺穿，且能较好地兼容条状和片状的贴合要求。另外，保护膜与压板贴合后，还采用抽真空的方式将二者之间的少量气泡去除，最大限度避免了贴膜过程中气泡的产生。本发明的保护膜贴合装置可以同时实现贴合、对位与脱泡功能，可以保证贴膜精度，避免基板表面压痕与折伤的产生。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种保护膜贴合装置，其中，包括：
    载台，用于放置待贴膜的基板；
    压板，与所述载台对向设置且设于所述载台上方，包括在朝向所述载台的表面开设的若干供空气通过的第一槽、连通所有的所述第一槽的第一通道以及第一进气孔，所述第一进气孔与所述第一槽在所述压板的不同的表面；
    第一真空发生装置，与所述第一进气孔连通，用于产生真空吸力将保护膜吸附在所述压板表面；
    所述载台与所述压板可相互靠近而将保护膜贴合在基板表面。
  2. 根据权利要求1所述的保护膜贴合装置，其中，还包括第二真空发生装置，所述载台包括在朝向所述压板的表面开设的若干供空气通过的第二槽、连通所有的所述第二槽的第二通道以及第二进气孔，所述第二进气孔与所述第二槽在所述载台的不同的表面；所述第二真空发生装置与所述第二进气孔连通，用于产生真空吸力将基板吸附在所述载台表面。
  3. 根据权利要求1所述的保护膜贴合装置，其中，还包括所述升降机构，所述升降机构设于所述载台底部，用于驱动所述载台上升和下降。
  4. 根据权利要求3所述的保护膜贴合装置，其中，所述升降机构包括驱动源、垂直于所述载台的滑轨和滑动架，所述滑动架固定在所述载台底面，用于在所述驱动源的驱动下沿所述滑轨往复移动。
  5. 根据权利要求4所述的保护膜贴合装置，其中，所述滑轨为两条，所述滑动架的两端分别在两条所述滑轨上滑动。
  6. 根据权利要求1所述的保护膜贴合装置，其中，还包括上壳，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内且可沿所述引导孔滑动。
  7. 根据权利要求6所述的保护膜贴合装置，其中，还包括第三真空发生装置，所述上壳上还开设有贯穿所述容置槽底面、用于连接所述第三真空发生装置的抽气孔，所述容置槽在所述载台上的投影位于所述载台内，所述第三真空 发生装置用于在所述载台抵接所述上壳端面后抽气，将保护膜与基板之间的空气抽出。
  8. 根据权利要求7所述的保护膜贴合装置，其中，所述上壳还包括设于所述容置槽底面的一圈环绕所述引导孔的凸缘。
  9. 根据权利要求2所述的保护膜贴合装置，其中，还包括上壳，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内且可沿所述引导孔滑动。
  10. 根据权利要求9所述的保护膜贴合装置，其中，还包括第三真空发生装置，所述上壳上还开设有贯穿所述容置槽底面、用于连接所述第三真空发生装置的抽气孔，所述容置槽在所述载台上的投影位于所述载台内，所述第三真空发生装置用于在所述载台抵接所述上壳端面后抽气，将保护膜与基板之间的空气抽出。
  11. 根据权利要求10所述的保护膜贴合装置，其中，所述上壳还包括设于所述容置槽底面的一圈环绕所述引导孔的凸缘。
  12. 根据权利要求3所述的保护膜贴合装置，其中，还包括上壳，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内且可沿所述引导孔滑动。
  13. 根据权利要求12所述的保护膜贴合装置，其中，还包括第三真空发生装置，所述上壳上还开设有贯穿所述容置槽底面、用于连接所述第三真空发生装置的抽气孔，所述容置槽在所述载台上的投影位于所述载台内，所述第三真空发生装置用于在所述载台抵接所述上壳端面后抽气，将保护膜与基板之间的空气抽出。
  14. 根据权利要求13所述的保护膜贴合装置，其中，所述上壳还包括设于所述容置槽底面的一圈环绕所述引导孔的凸缘。
  15. 根据权利要求4所述的保护膜贴合装置，其中，还包括上壳，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内且可沿所述引导孔滑动。
  16. 根据权利要求15所述的保护膜贴合装置，其中，还包括第三真空发生装置，所述上壳上还开设有贯穿所述容置槽底面、用于连接所述第三真空发生装置的抽气孔，所述容置槽在所述载台上的投影位于所述载台内，所述第三真空发生装置用于在所述载台抵接所述上壳端面后抽气，将保护膜与基板之间的空气抽出。
  17. 根据权利要求16所述的保护膜贴合装置，其中，所述上壳还包括设于所述容置槽底面的一圈环绕所述引导孔的凸缘。
  18. 一种保护膜贴合方法，其中，包括：
    第一真空发生装置抽真空，通过载台吸取基板；
    第二真空发生装置抽真空，通过压板吸取保护膜；
    将载台与压板正对，使基板与保护膜实现对位；
    使载台与压板相互靠近，将保护膜贴合在基板表面。
  19. 根据权利要求18所述的保护膜贴合方法，其中，还包括：在载台抵接上壳端面后，对载台、上壳围成的密闭空间抽气。
  20. 根据权利要求19所述的保护膜贴合方法，其中，所述上壳包括底面开设的容置槽和所述容置槽底面开设的引导孔，所述压板容纳于所述容置槽内，所述压板背向所述载台的表面凸设有凸柱，所述凸柱穿设于所述引导孔内；对载台、上壳围成的密闭空间抽气前，还包括：控制凸柱沿引导孔下移，将保护膜压紧在基板表面。
PCT/CN2018/070003 2017-12-08 2018-01-02 保护膜贴合装置及贴合方法 WO2019109437A1 (zh)

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