WO2019105104A1 - Oled显示面板及其制备方法、oled显示装置 - Google Patents

Oled显示面板及其制备方法、oled显示装置 Download PDF

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Publication number
WO2019105104A1
WO2019105104A1 PCT/CN2018/106170 CN2018106170W WO2019105104A1 WO 2019105104 A1 WO2019105104 A1 WO 2019105104A1 CN 2018106170 W CN2018106170 W CN 2018106170W WO 2019105104 A1 WO2019105104 A1 WO 2019105104A1
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WIPO (PCT)
Prior art keywords
layer
encapsulation layer
oled display
display panel
retaining wall
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PCT/CN2018/106170
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English (en)
French (fr)
Inventor
王格
蒋志亮
王婷
乔梓
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/335,966 priority Critical patent/US11367853B2/en
Priority to EP18857377.8A priority patent/EP3719858A4/en
Priority to JP2019543374A priority patent/JP2021504872A/ja
Publication of WO2019105104A1 publication Critical patent/WO2019105104A1/zh
Priority to US17/826,491 priority patent/US11864410B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to an OLED display panel, a method for fabricating the same, and an OLED display device.
  • OLED Organic Light-Emitting Diode
  • OLED devices have become a very popular one because of their all-solid-state structure, high brightness, full viewing angle, fast response, wide operating temperature range, and flexible display.
  • Next-generation display technology for competitiveness and development prospects.
  • the organic luminescent materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen, and too much moisture or excessive oxygen levels will affect the lifetime of OLED devices.
  • TFE Thin Film Packaging Technology
  • TFE Thin Film Packaging Technology
  • the present disclosure provides an OLED display panel including a substrate substrate and a planarization layer, an organic light-emitting function layer, a first package layer, and a second package layer sequentially formed on the substrate substrate, wherein the first package layer is An inorganic layer, wherein the second encapsulation layer is an organic layer; wherein, in a non-display area of the OLED display panel, a side of the first encapsulation layer away from the organic light-emitting function layer has a non-flat surface; The second encapsulation layer covers the first encapsulation layer in the display area of the OLED display panel and covers a portion of the non-planar surface adjacent to the display area.
  • the planarization layer has a concave-convex structure on a side away from the base substrate, the concave-convex structure is in a non-display area of the OLED display panel, and the concave-convex structure is opposite to the non-flat surface correspond.
  • the OLED display panel further includes a first retaining wall on a side of the non-planar surface away from the display area, and in the organic light emitting functional layer and the first package Between the layers.
  • the OLED display panel further includes a second retaining wall between the organic light emitting functional layer and the first encapsulating layer, and the first retaining wall is away from the display One side of the zone, the height of the second retaining wall is greater than the height of the first retaining wall.
  • the OLED display panel further includes a third encapsulation layer, the third encapsulation layer covering the second encapsulation layer and the first encapsulation layer not covered by the second encapsulation layer.
  • the concave-convex structure comprises a plurality of convex portions, and a concave portion is formed between the adjacent convex portions.
  • each of the protrusions has the same shape.
  • each of the protrusions is connected to each other.
  • the protrusion is zigzag.
  • the raised portion is a zigzag shape of an isosceles triangle or a right triangle.
  • each of the protrusions is disposed to be spaced apart from each other.
  • the raised portion is rectangular or trapezoidal.
  • the present disclosure also provides an OLED display device including the OLED display panel as described above.
  • the present disclosure also provides a method for preparing an OLED display panel, which is used to prepare the aforementioned OLED display panel.
  • the method includes: forming a planarization layer on the base substrate, and forming a pattern of the concave-convex structure on a side of the planarization layer away from the base substrate by a patterning process, the graphic of the concave-convex structure a non-display area of the OLED display panel; an organic light-emitting function layer, a first package layer, and a second package layer are sequentially formed on the base substrate on which the planarization layer is formed; wherein the first package The layer is an inorganic layer, and a side of the first encapsulation layer away from the organic light-emitting function layer and a position corresponding to the concave-convex structure is a non-flat surface; the second encapsulation layer is an organic layer, and the overlay display The first encapsulation layer within the region and covering a portion of the non-planar surface adjacent to the display region.
  • the method further includes: forming, in the non-display area, a first retaining wall and a second retaining wall by a patterning process, wherein The first retaining wall and the second retaining wall are on a side of the non-flat surface away from the display area, and the first retaining wall is adjacent to the display area than the second retaining wall, The height of the second retaining wall is greater than the height of the first retaining wall.
  • the method further includes: forming a third encapsulation layer on the substrate substrate on which the first encapsulation layer and the second encapsulation layer are formed, A third encapsulation layer covers the second encapsulation layer and the first encapsulation layer not covered by the second encapsulation layer.
  • FIG. 1a is a schematic diagram showing the state of the encapsulant of the related OLED display panel
  • FIG. 1b is a second schematic diagram of the state of the encapsulant of the related OLED display panel
  • FIG. 2 is a schematic structural diagram of a non-display area of an OLED display panel provided by the present disclosure
  • 3a-3d are schematic views of a concave-convex structure provided by the present disclosure.
  • FIG. 4 is a flow chart of preparing an OLED display panel provided by the present disclosure.
  • the present disclosure provides an OLED display panel, a method for fabricating the same, and an OLED display device, which are used to at least partially solve the problem that the organic second encapsulation layer is difficult to control, the edge climbing distance is large, and the thickness is uniform during the packaging process of the OLED display panel. Poor sex.
  • the present disclosure provides an OLED display panel including: a substrate substrate 1 and a back plate (BP) 2 and a planarization layer sequentially formed on the substrate substrate 1. (PVD) 3.
  • the organic light-emitting functional layer 4 the first encapsulation layer 51, and the second encapsulation layer 52.
  • the organic light-emitting functional layer 4 may include an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode.
  • the material of the first encapsulation layer 51 is an inorganic material, which can be formed by a CVD (Chemical Vapor Deposition) method.
  • the material of the second encapsulation layer 52 is an organic material, which can be formed by inkjet printing. In the non-display area of the OLED display panel, the side of the first encapsulation layer 51 away from the organic light-emitting function layer 4 has a non-flat surface.
  • the second encapsulation layer 52 covers the first encapsulation layer in the display area of the OLED display panel and a portion of the non-flat surface covering the adjacent display area. As shown in FIG. 2, the left side of the dotted line is the non-display area of the OLED display panel, and the right side of the dotted line is the display area of the OLED display panel (ie, the AA area). In the packaging operation of the OLED device, the second encapsulation layer 52 covers the entire display area and flows from the display area to the non-display area. The non-display area is blocked by the non-flat surface of the first encapsulation layer 51.
  • the non-flat surface refers to a surface having a distinct relief structure capable of blocking a liquid organic encapsulation layer from flowing through the entire non-flat surface.
  • the disclosure of the present disclosure When the OLED display panel is formed with the organic second encapsulation layer 52, the non-planar surface of the first encapsulation layer 51 can block the flow of the second encapsulation layer 52 to a certain extent, reducing the fluidity thereof. Therefore, the OLED display panel of the present disclosure is easier to perform a packaging operation.
  • a side of the planarization layer 3 away from the substrate 1 may be provided with a concave-convex structure 31 located in a non-display area of the OLED display panel, and the concave-convex structure 31 corresponds to the non-flat surface.
  • the planarization layer 3 has a greater thickness than the organic light-emitting functional layer 4 and the first encapsulation layer 51. Therefore, providing the uneven structure on the planarization layer 3 is advantageous in obtaining a non-flat surface having a larger unevenness.
  • the first package layer 51 is disposed on the organic light-emitting function layer, and the side of the organic light-emitting function layer 4 away from the planarization layer 3 corresponds to the uneven structure 31.
  • the position is a non-flat surface, and the side of the first encapsulation layer 51 away from the organic light-emitting function layer 4 and the position corresponding to the uneven structure 31 are non-flat surfaces.
  • the second encapsulation layer 52 covers the entire display area and flows from the display area to the non-display area, and the non-display area is blocked by the non-flat surface of the first encapsulation layer 51 formed by the uneven structure 31. As shown in FIG.
  • the slope angle of the edge of the second encapsulation layer 52 is ⁇ 2, and the slope angle ⁇ 2 of the edge of the second encapsulation layer 52 in the present disclosure is larger than the slope angle ⁇ 1 of the edge of the second encapsulation layer 52 in the related structure (eg, Figure 1b) is larger.
  • the climbing distance L2 of the second encapsulation layer 52 is smaller than the climbing distance L1 of the second encapsulation layer 52 in the related structure shown in FIG. 1b.
  • the uneven structure 31 is provided on the side of the planarization layer 3 remote from the substrate 1 in the non-display area, and the organic light-emitting function layer 4 and the inorganic first package layer 51 are formed on the planarization layer 3, and the organic light-emitting layer is formed.
  • the position of the functional layer 4 and the first encapsulation layer 51 corresponding to the concavo-convex structure 31 is a non-flat surface, that is, the position corresponding to the concavo-convex structure 31 on the organic light-emitting function layer 4 and the first encapsulation layer 51 also forms a concavo-convex structure having the same shape.
  • the non-planar surface of the first encapsulation layer 51 can block the flow of the second encapsulation layer 52 to a certain extent, reduce the fluidity thereof, and reduce the creep of the edge of the second encapsulation layer 52.
  • the slope distance increases the edge stress and the slope angle, thereby achieving a narrow bezel design of the product, and improving the thickness uniformity of the edge of the second encapsulation layer 52, thereby avoiding poor mura in the non-display area and ensuring the packaging effect.
  • the side of the organic light-emitting function layer 4 in the non-display area portion away from the planarization layer 3 may be disposed to have a concave-convex structure (not shown) in the case where the planarization layer 3 adopts an overall flat arrangement.
  • the organic light-emitting function layer 4 of the portion corresponding to the planarization layer 3 in the non-display region portion may be disposed away from the planarization layer.
  • One side of 3 has a concave-convex structure (not shown).
  • the shape of the uneven structure of the organic light-emitting functional layer 4 may be different from that of the uneven structure used for the planarization layer 3 as long as the two can be attached to each other. In the above manner, such a non-flat surface can be realized, which can block the flow of the second encapsulation layer 52 to a certain extent and reduce its fluidity.
  • the OLED display panel further includes a first retaining wall 61.
  • the first retaining wall 61 is located on a side of the non-flat surface away from the display area, and is disposed on the organic light-emitting functional layer 4 and the first package. Between layers 51. That is, the uneven surface is located on the side of the first retaining wall 61 adjacent to the display area. Since the second encapsulation layer 52 covers only a part of the non-flat surface adjacent to the display area, the second encapsulation layer 52 does not flow out of the first barrier wall 61, thereby ensuring the sealing effect of the OLED display panel.
  • the OLED display panel may further include a second retaining wall 62, and the second retaining wall 62 is disposed on the organic light emitting functional layer 4 and the first Between the encapsulation layers 51 and on the side of the first retaining wall 61 away from the display area. That is, the second retaining wall 62 is closer to the edge of the OLED display panel than the first retaining wall 61. The height of the second retaining wall 62 is greater than the height of the first retaining wall 61. Thus, even if the second encapsulating layer 52 flows out of the first retaining wall 61, it is blocked by the second retaining wall 62, thereby ensuring the packaging effect.
  • the OLED display panel further includes a third encapsulation layer 53 formed on the first encapsulation layer 51 and the second encapsulation layer 52 and covering the second encapsulation layer 52. And the first encapsulation layer 51 that is not covered by the second encapsulation layer 52. That is, the third encapsulation layer 53 is directly disposed on the second encapsulation layer 52 in a portion of the uneven surface region and the display region adjacent to the display region. And in the other non-display area except the partial uneven surface, since the second encapsulation layer 52 is absent, the third encapsulation layer 53 is directly disposed on the first encapsulation layer 51. Thus, the third encapsulation layer 53, the second encapsulation layer 52 and the first encapsulation layer 51 together implement encapsulation of the OLED display panel.
  • the uneven structure 31 includes a plurality of convex portions 311, and recess portions 312 are formed between the adjacent convex portions 311, and the uneven structure 31 can be formed by a photolithography process by means of a mask.
  • each convex portion 311 is the same.
  • each of the convex portions 311 and each of the concave portions 312 have the same shape. It should be noted that the shape of each convex portion 311 and each concave portion 312 may be different as long as the surface of the planarization layer 3 away from the base substrate 1 is a non-flat surface (concavo-convex structure), and the non-flat surface can ensure After the completion of the organic light-emitting layer 4 and the first encapsulation layer 51, the surface of the first encapsulation layer 51 away from the substrate 1 is still a non-flat surface.
  • each of the protrusions 311 and each of the recesses 312 may have a zigzag shape.
  • each of the raised portions 311 and each of the recessed portions 312 may have a zigzag shape of an isosceles triangle.
  • each of the convex portions 311 and each of the concave portions 312 may also have a zigzag shape of a right triangle.
  • each of the raised portions 311 may also be spaced apart. As shown in FIG. 3c, each of the raised portions 311 and each of the recessed portions 312 may be rectangular. As shown in FIG. 3d, each of the raised portions 311 and each of the recessed portions 312 may be trapezoidal.
  • the specific shapes of the convex portion 311 and the concave portion 312 in the embodiment of the present disclosure are merely illustrative examples, and those skilled in the art may know that the convex portion 311 and the concave portion 312 are not limited to the above shapes.
  • the third encapsulating layer 53 is difficult to effectively wrap the second encapsulating layer 52, and water oxygen in the external environment easily enters the inside of the display device, corroding the organic light emitting layer 4 , causing the display of dark spots.
  • the present disclosure forms the uneven structure 31 by the upper surface of the planarization layer 3 in the non-display area, so that the surfaces of the organic light-emitting layer 4 and the inorganic first encapsulation layer 51 on the planarization layer 3 form corresponding concavo-convex structures (ie, Non-flat surface).
  • the non-planar surface can slow the flow rate of the material of the second encapsulation layer 52, preventing it from flowing through the retaining wall, thereby increasing the edge of the second encapsulation layer 52.
  • the slope angle, and maintaining the thickness uniformity of the second encapsulation layer 52 can improve the display black spot problem caused by the leakage of the second encapsulation layer 52 which is easy to occur in the conventional TFE package, and the poor Mura caused by the poor uniformity of the non-display area film layer problem.
  • the present disclosure also provides an OLED display device including the OLED display panel as described above.
  • the OLED display device may be any product or component having a liquid crystal display function, such as an electronic paper, a mobile phone, a tablet computer, a television, a digital photo frame, or the like.
  • the OLED display device forms the organic light-emitting functional layer 4 and the inorganic layer on the planarization layer 3 by providing the uneven structure 31 on the side of the planarization layer 3 remote from the substrate 1 in the non-display region.
  • the positions of the organic light-emitting function layer 4 and the first encapsulation layer 51 corresponding to the concavo-convex structure 31 are non-planar surfaces, that is, the organic light-emitting function layer 4 and the first encapsulation layer 51 correspond to the concavo-convex structure 31.
  • the position also forms a concave-convex structure having the same shape; when the organic second encapsulation layer 52 is formed, the non-planar surface of the first encapsulation layer 51 can block the flow of the second encapsulation layer 52 to a certain extent, reducing the fluidity thereof and reducing
  • the climbing distance of the edge of the second encapsulation layer 52 increases the edge stress and the slope angle, thereby realizing the narrow bezel design of the product, and improving the thickness uniformity of the edge of the second encapsulation layer 52, thereby avoiding the defect of the non-display area mura and ensuring the packaging effect.
  • the present disclosure also provides a method of fabricating an OLED display panel for preparing an OLED display panel as described above.
  • One embodiment of the method for fabricating the OLED display panel will be described below with reference to FIGS. 2, 3a-3d and 4.
  • the method can include the following steps:
  • step 101 a planarization layer 3 is formed on the base substrate 1, and a pattern of the uneven structure 31 is formed on the side of the planarization layer 3 away from the base substrate 1 by a patterning process.
  • the pattern of the concave-convex structure 31 is located in the non-display area of the OLED display panel, and the specific structure thereof may be the structure shown in FIG. 3a to FIG. 3d, and details are not described herein again.
  • step 102 the organic light-emitting function layer 4, the first encapsulation layer 51, and the second encapsulation layer 52 are sequentially formed on the base substrate 1 on which the planarization layer 3 is formed.
  • the first encapsulation layer 51 is an inorganic layer, and a position of the first encapsulation layer 51 away from the organic light-emitting function layer 4 and a position corresponding to the uneven structure 31 is an uneven surface.
  • the second encapsulation layer 52 is an organic layer and covers the first encapsulation layer 51 in the display region and covers a portion of the non-planar surface adjacent to the display region.
  • the method may further include the following steps:
  • the first retaining wall 61 and the second retaining wall 62 are formed by a patterning process.
  • the first retaining wall 61 and the second retaining wall 62 are located on a side of the non-flat surface away from the display area, and are disposed between the organic light-emitting functional layer 4 and the first encapsulating layer 51, and the first retaining wall 61 is closer to the second block.
  • the wall 62 is adjacent to the display area, and the height of the second retaining wall 62 is greater than the height of the first retaining wall 61.
  • the OLED display panel provided by the present embodiment is provided with a concave-convex structure 31 on the side of the planarization layer 3 away from the substrate 1 in the non-display area, and is planarized.
  • the positions of the organic light-emitting function layer 4 and the first encapsulation layer 51 corresponding to the uneven structure 31 are non-flat surfaces, that is, the organic light-emitting function layer 4 and
  • the position of the first encapsulation layer 51 corresponding to the concavo-convex structure 31 also forms a concavo-convex structure of the same shape; when the organic second encapsulation layer 52 is formed, the non-flat surface of the first encapsulation layer 51 can block the second to some extent
  • the flow of the encapsulation layer 52 reduces the fluidity, reduces the climbing distance of the edge of the second encapsulation layer 52, increases the edge stress and the slope angle, thereby achieving a narrow bezel design of the product and improving the thickness uniformity of the edge of the second encapsulation layer 52. Avoid mura in the non-display area and ensure the packaging effect.
  • the existing mask reduces the fluidity, reduces the climbing distance of the edge of the second encapsulation layer 52, increases the edge stress and the
  • the OLED display panel preparation method further includes the following steps:
  • Step 103 forming a third encapsulation layer 53 on the base substrate 1 on which the first encapsulation layer 51 and the second encapsulation layer 52 are formed.
  • the third encapsulation layer 53 covers the second encapsulation layer 52 and the first encapsulation layer 51 not covered by the second encapsulation layer 52.
  • the side of the organic light-emitting function layer 4 in the non-display region portion away from the planarization layer 3 may be disposed to have a concave-convex structure.
  • the organic light-emitting function layer 4 of the portion corresponding to the planarization layer 3 in the non-display region portion may be disposed away from the planarization layer.
  • One side of the 3 has a concave-convex structure.
  • the shape of the uneven structure of the organic light-emitting functional layer 4 may be different from that of the uneven structure used for the planarization layer 3 as long as the two can be attached to each other. Similar to the formation of the uneven structure on the planarization layer 3, a textured structure can be formed on the organic light-emitting functional layer 4 by a patterning process. The above manner can also realize such a non-flat surface which can block the flow of the second encapsulation layer 52 to a certain extent and reduce its fluidity.

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Abstract

一种OLED显示面板、其制备方法以及OLED显示装置，通过在非显示区内，在第一封装层（51）远离有机发光功能层（4）的一侧设置非平坦表面，第一封装层（51）的非平坦表面能够在一定程度上阻挡第二封装层（52）的流动，降低其流动性，减小第二封装层（52）边缘的爬坡距离，增加边缘应力和坡度角，从而实现产品窄边框设计，并提高第二封装层（52）边缘厚度均一性，避免非显示区mura不良，保证封装效果。

Description

OLED显示面板及其制备方法、OLED显示装置
本申请要求于2017年11月30日提交至中国知识产权局的中国专利申请NO.201711240850.9的优先权，所公开的内容以引用的方式合并于此。
技术领域
本公开涉及显示技术领域，具体涉及一种OLED显示面板及其制备方法、以及OLED显示装置。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管)器件由于其具有的全固态结构、高亮度、全视角、响应速度快、工作温度范围宽、可实现柔性显示等一系列优点，目前已经成为极具竞争力和发展前景的下一代显示技术。OLED器件中使用的有机发光材料和阴极材料对水和氧气特别敏感，过于潮湿或氧气含量过高都将影响OLED器件的使用寿命。为了有效阻隔水和氧对OLED器件的影响，需要对其进行封装。TFE(薄膜封装技术)封装阻水阻氧效果优秀，且可对应柔性封装，已成为柔性OLED显示面板封装的主流封装技术。
公开内容
本公开提供一种OLED显示面板，包括衬底基板以及依次形成在所述衬底基板上的平坦化层、有机发光功能层、第一封装层和第二封装层，所述第一封装层为无机层，所述第二封装层为有机层；其中，在所述OLED显示面板的非显示区中，所述第一封装层远离所述有机发光功能层的一侧具有非平坦表面；所述第二封装层覆盖所述OLED显示面板的显示区内的第一封装层以及覆 盖邻近所述显示区的一部分所述非平坦表面。
可选的，所述平坦化层远离所述衬底基板的一侧有凹凸结构，所述凹凸结构在所述OLED显示面板的非显示区，以及，所述凹凸结构与所述非平坦表面相对应。
进一步的，所述OLED显示面板还包括第一挡墙，所述第一挡墙在所述非平坦表面远离所述显示区的一侧，并且在所述有机发光功能层和所述第一封装层之间。
进一步的，所述OLED显示面板还包括第二挡墙，所述第二挡墙在所述有机发光功能层和所述第一封装层之间，并且在所述第一挡墙远离所述显示区的一侧，所述第二挡墙的高度大于所述第一挡墙的高度。
进一步的，所述OLED显示面板还包括第三封装层，所述第三封装层覆盖所述第二封装层和未被所述第二封装层覆盖的所述第一封装层。
可选的，所述凹凸结构包括多个凸起部，相邻的所述凸起部之间形成有凹陷部。
可选的，各所述凸起部的形状相同。
可选的，各所述凸起部相互连接。
可选的，所述凸起部为锯齿形。
可选的，所述凸起部为等腰三角形或直角三角形的锯齿形。
可选的，各所述凸起部设置为互相间隔。
可选的，所述凸起部为矩形或梯形。
本公开还提供一种OLED显示装置，包括如前所述的OLED显示面板。
本公开还提供一种OLED显示面板的制备方法，所述制备方法用于制备前述的OLED显示面板。
可选的，所述方法包括：在衬底基板上形成平坦化层，并通过构图工艺在所述平坦化层远离所述衬底基板的一侧形成凹凸结构的图形，所述凹凸结构的图形在所述OLED显示面板的非显示区；在形成有所述平坦化层的所述衬底基板上依次形成有机发光 功能层、第一封装层和第二封装层；其中，所述第一封装层为无机层，且所述第一封装层远离所述有机发光功能层的一侧、与所述凹凸结构相对应的位置为非平坦表面；所述第二封装层为有机层，且覆盖显示区内的第一封装层且覆盖邻近显示区的一部分所述非平坦表面。
进一步的，在形成所述有机发光功能层之后、形成所述第一封装层之前，所述方法还包括：在所述非显示区，通过构图工艺形成第一挡墙和第二挡墙，其中，所述第一挡墙和所述第二挡墙在所述非平坦表面远离所述显示区的一侧，所述第一挡墙比所述第二挡墙邻近所述显示区，所述第二挡墙的高度大于所述第一挡墙的高度。
进一步的，形成所述第二封装层之后，所述方法还包括：在形成有所述第一封装层和所述第二封装层的所述衬底基板上形成第三封装层，所述第三封装层覆盖所述第二封装层和未被所述第二封装层覆盖的所述第一封装层。
附图说明
图1a为相关的OLED显示面板的封装胶的状态示意图之一；
图1b为相关的OLED显示面板的封装胶的状态示意图之二；
图2为本公开提供的OLED显示面板的非显示区的结构示意图；
图3a-图3d为本公开提供的凹凸结构的示意图；
图4为本公开提供的OLED显示面板的制备流程图。
具体实施方式
下面将结合本公开中的附图，对本公开中的技术方案进行清楚、完整的描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开提供一种OLED显示面板及其制备方法、OLED显示 装置，用以至少部分解决OLED显示面板在封装过程中，有机的第二封装层流动性难以控制，边缘爬坡距离较大及厚度均一性差的问题。结合如图2所示，本公开提供一种OLED显示面板，所述OLED显示面板包括：衬底基板1以及依次形成在衬底基板1上的背板(Back Plate，BP)2、平坦化层(PVD)3、有机发光功能层4、第一封装层51和第二封装层52。有机发光功能层4可以包括：阳极、空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极。第一封装层51的材料为无机材料，可以通过CVD(Chemical Vapor Deposition，化学气相淀积)方式制备形成，第二封装层52的材料为有机材料，可以通过喷墨打印方式制备形成。在OLED显示面板的非显示区中，第一封装层51远离有机发光功能层4的一侧具有非平坦表面。第二封装层52覆盖OLED显示面板的显示区内的第一封装层以及覆盖邻近显示区的一部分非平坦表面。如图2所示，虚线左侧为OLED显示面板的非显示区，虚线右侧为OLED显示面板的显示区(即AA区)。在OLED器件的封装操作中，第二封装层52覆盖整个显示区，并从显示区流动至非显示区。在非显示区被第一封装层51的非平坦表面所阻挡。这里，非平坦表面是指具有明显凹凸结构的表面，其能够阻挡液态的有机封装层流过整个非平坦表面。相比于常规TFE过程中可能出现的以下问题：由于有机封装层固化前为液态，流动性较大，难以精确控制其扩散，使得其容易流出，导致OLED显示面板密闭效果变差，本公开的OLED显示面板在形成有机的第二封装层52时，第一封装层51的非平坦表面能够在一定程度上阻挡第二封装层52的流动，降低其流动性。因此，本公开的OLED显示面板更容易进行封装操作。
可选的，平坦化层3远离衬底基板1的一侧可以设置有凹凸结构31，凹凸结构31位于所述OLED显示面板的非显示区，并且该凹凸结构31与非平坦表面相对应。通常而言，平坦化层3相比于有机发光功能层4以及第一封装层51具有更大的厚度。因此，在平坦化层3上设置凹凸结构有利于获得具有更大非平坦度的非 平坦表面。具体地，由于有机发光功能层4设置在平坦化层3上，第一封装层51设置在有机发光功能层上，有机发光功能层4远离平坦化层3的一侧、与凹凸结构31相对应的位置为非平坦表面，以及，第一封装层51远离有机发光功能层4的一侧、与凹凸结构31相对应的位置为非平坦表面。第二封装层52覆盖整个显示区，并从显示区流动至非显示区，在非显示区被由凹凸结构31形成的第一封装层51的非平坦表面所阻挡。如图2所示，第二封装层52边缘的坡度角为α2，本公开中的第二封装层52边缘的坡度角α2，比相关结构中的第二封装层52边缘的坡度角α1(如图1b所示)更大。相应的，第二封装层52的爬坡距离L2相对于图1b所示的相关结构中的第二封装层52的爬坡距离L1更小。通过在非显示区内，在平坦化层3上远离衬底基板1的一侧设置凹凸结构31，在平坦化层3上形成有机发光功能层4和无机的第一封装层51后，有机发光功能层4和第一封装层51与凹凸结构31相对应的位置为非平坦表面，即有机发光功能层4和第一封装层51上与凹凸结构31相对应的位置也形成形状相同的凹凸结构；在形成有机的第二封装层52时，第一封装层51的非平坦表面能够在一定程度上阻挡第二封装层52的流动，降低其流动性，减小第二封装层52边缘的爬坡距离，增加边缘应力和坡度角，从而实现产品窄边框设计，并提高第二封装层52边缘厚度均一性，避免非显示区mura不良，保证封装效果。
可以理解的，可以在平坦化层3采用整体平坦设置的情况下，将非显示区部分中的有机发光功能层4远离平坦化层3的一侧设置为具有凹凸结构(未示出)。或者，也可以在非显示区部分中的平坦化层3具有凹凸结构的情况下，将非显示区部分中与平坦化层3相对应部分的有机发光功能层4设置为在其远离平坦化层3的一侧具有凹凸结构(未示出)。有机发光功能层4的凹凸结构的造型可以不同于平坦化层3所采用的凹凸结构的造型，只要二者可以彼此贴合即可。以上方式均可以实现这样的非平坦表面，其能够在一定程度上阻挡第二封装层52的流动，降低其流动性。
进一步的，如图2所示，所述OLED显示面板还包括第一挡墙61，第一挡墙61位于非平坦表面远离显示区的一侧，且设置在有机发光功能层4和第一封装层51之间。也就是说，非平坦表面位于第一挡墙61邻近显示区的一侧。由于第二封装层52只覆盖邻近显示区的一部分非平坦表面，因此，第二封装层52不会流出第一挡墙61，从而保证所述OLED显示面板的密闭效果。
进一步的，为了进一步保证所述OLED显示面板的密闭效果，如图2所示，所述OLED显示面板还可以包括第二挡墙62，第二挡墙62设置在有机发光功能层4和第一封装层51之间，并位于第一挡墙61远离显示区的一侧。即第二挡墙62相较于第一挡墙61更邻近所述OLED显示面板的边缘。第二挡墙62的高度大于第一挡墙61的高度，这样，即使第二封装层52从第一挡墙61流出，也会被第二挡墙62阻挡，从而保证封装效果。
进一步的，如图2所示，所述OLED显示面板还包括第三封装层53，第三封装层53形成在第一封装层51和第二封装层52上，并覆盖述第二封装层52和未被第二封装层52覆盖的第一封装层51。也就是说，在邻近显示区的部分非平坦表面区域和显示区内，第三封装层53直接设置在第二封装层52上。而在除了该部分非平坦表面之外的其他非显示区内，由于没有第二封装层52，第三封装层53直接设置在第一封装层51上。这样，第三封装层53、第二封装层52和第一封装层51共同实现对所述OLED显示面板的封装。
以下结合图3a-图3d，对凹凸结构31的具体结构进行详细说明。
如图3a-图3d所示，凹凸结构31包括多个凸起部311，相邻的凸起部311之间形成凹陷部312，凹凸结构31可以借助掩膜板通过光刻工艺形成。
可选的，各凸起部311的形状相同。
在本公开实施例中，各凸起部311和各凹陷部312的形状相同。需要说明的是，各凸起部311和各凹陷部312的形状也可以 不同，只要平坦化层3远离衬底基板1的表面为非平坦表面(凹凸结构)，且该非平坦表面能够保证在制备完成有机发光层4和第一封装层51之后，使第一封装层51远离衬底基板1的表面仍然为非平坦表面即可。
参见图3a和图3b，各凸起部311可以相互连接。可选的，各凸起部311和各凹陷部312可以为锯齿形。如图3a所示，各凸起部311和各凹陷部312可以为等腰三角形的锯齿形。如图3b所示，各凸起部311和各凹陷部312也可以为直角三角形的锯齿形。
参见图3c和图3d，各凸起部311也可以间隔设置。如图3c所示，各凸起部311和各凹陷部312可以为矩形。如图3d所示，各凸起部311和各凹陷部312可以为梯形。
需要说明的是，本公开实施例中的凸起部311和凹陷部312的具体形状只是示意性举例说明，本领域技术人员可知，凸起部311和凹陷部312不限于以上的形状。
如果第二封装层52流出第一挡墙61和第二挡墙62，第三封装层53难以有效包裹第二封装层52，外界环境中的水氧容易进入显示器件内部，腐蚀有机发光层4，造成显示黑斑。
本公开通过非显示区内的平坦化层3的上表面形成凹凸结构31，使得位于平坦化层3上的有机发光层4和无机的第一封装层51的表面均形成相应的凹凸结构(即非平坦表面)。将有机的第二封装层52的材料打印在该非平坦表面上后，该非平坦表面可以减缓第二封装层52的材料的流速，防止其流过挡墙，从而增加第二封装层52边缘的坡度角，并保持第二封装层52厚度均一性，这样可以改善传统TFE封装容易出现的第二封装层52泄露带来的显示黑斑问题，及非显示区膜层均一性差导致的Mura不良问题。
本公开还提供一种OLED显示装置，所述OLED显示装置包括如前所述的OLED显示面板。
所述OLED显示装置可以为电子纸、手机、平板电脑、电视机、数码相框等任何具有液晶显示功能的产品或部件。
本公开提供的OLED显示装置，通过在非显示区内，在平坦化层3上远离衬底基板1的一侧设置凹凸结构31，在平坦化层3上形成有机发光功能层4和无机的第一封装层51后，有机发光功能层4和第一封装层51与凹凸结构31相对应的位置为非平坦表面，即有机发光功能层4和第一封装层51上与凹凸结构31相对应的位置也形成形状相同的凹凸结构；在形成有机的第二封装层52时，第一封装层51的非平坦表面能够在一定程度上阻挡第二封装层52的流动，降低其流动性，减小第二封装层52边缘的爬坡距离，增加边缘应力和坡度角，从而实现产品窄边框设计，并提高第二封装层52边缘厚度均一性，避免非显示区mura不良，保证封装效果。
本公开还提供一种OLED显示面板制备方法，所述方法用于制备如前所述的OLED显示面板。下面结合图2、图3a-图3d和图4所示，描述该OLED显示面板制备方法的一种实施方式。所述方法可以包括以下步骤：
步骤101，在衬底基板1上形成平坦化层3，并通过构图工艺在平坦化层3远离衬底基板1的一侧形成凹凸结构31的图形。
具体的，凹凸结构31的图形位于所述OLED显示面板的非显示区，其具体结构可以为图3a-图3d所示的结构，在此不再赘述。
步骤102，在形成有平坦化层3的衬底基板1上依次形成有机发光功能层4、第一封装层51和第二封装层52。
具体的，第一封装层51为无机层，且第一封装层51远离有机发光功能层4的一侧、与凹凸结构31相对应的位置为非平坦表面。第二封装层52为有机层，且覆盖显示区内的第一封装层51且覆盖邻近显示区的一部分非平坦表面。
需要说明的是，在形成有机发光功能层4之后、形成第一封装层51之前，所述方法还可以包括以下步骤：
在非显示区，通过构图工艺形成第一挡墙61和第二挡墙62。其中，第一挡墙61和第二挡墙62位于非平坦表面远离显示区的 一侧，且设置在有机发光功能层4和第一封装层51之间，第一挡墙61比第二挡墙62邻近显示区，且第二挡墙62的高度大于第一挡墙61的高度。
通过步骤101-102可以看出，本实施方式提供的OLED显示面板的制备方法，通过在非显示区内，在平坦化层3上远离衬底基板1的一侧设置凹凸结构31，在平坦化层3上形成有机发光功能层4和无机的第一封装层51后，有机发光功能层4和第一封装层51与凹凸结构31相对应的位置为非平坦表面，即有机发光功能层4和第一封装层51上与凹凸结构31相对应的位置也形成形状相同的凹凸结构；在形成有机的第二封装层52时，第一封装层51的非平坦表面能够在一定程度上阻挡第二封装层52的流动，降低其流动性，减小第二封装层52边缘的爬坡距离，增加边缘应力和坡度角，从而实现产品窄边框设计，并提高第二封装层52边缘厚度均一性，避免非显示区mura不良，保证封装效果。本实施方式的制备方法，可以对现有的掩膜板进行改造，不会增加构图工艺，且制备工艺流程也不变，易于实现。
进一步的，如图4所示，在形成第二封装层52(即步骤102)之后，所述OLED显示面板制备方法还包括以下步骤：
步骤103，在形成有第一封装层51和第二封装层52的衬底基板1上形成第三封装层53。
具体的，第三封装层53覆盖第二封装层52和未被第二封装层52覆盖的第一封装层51。
可以理解的，可以在平坦化层3采用整体平坦设置的情况下，将非显示区部分中的有机发光功能层4远离平坦化层3的一侧设置为具有凹凸结构。或者，也可以在非显示区部分中的平坦化层3具有凹凸结构的情况下，将非显示区部分中与平坦化层3相对应部分的有机发光功能层4设置为在其远离平坦化层3的一侧具有凹凸结构。有机发光功能层4的凹凸结构的造型可以不同于平坦化层3所采用的凹凸结构的造型，只要二者可以彼此贴合即可。与在平坦化层3上形成凹凸结构相类似的，可以采用构图工艺在 有机发光功能层4上形成凹凸结构。以上方式同样可以实现这样的非平坦表面，其能够在一定程度上阻挡第二封装层52的流动，降低其流动性。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (17)

  1. 一种OLED显示面板，包括衬底基板以及依次形成在所述衬底基板上的平坦化层、有机发光功能层、第一封装层和第二封装层，所述第一封装层为无机层，所述第二封装层为有机层；其中，
    在所述OLED显示面板的非显示区中，所述第一封装层远离所述有机发光功能层的一侧具有非平坦表面；所述第二封装层覆盖所述OLED显示面板的显示区内的第一封装层以及覆盖邻近所述显示区的一部分所述非平坦表面。
  2. 如权利要求1所述的OLED显示面板，其中，所述平坦化层远离所述衬底基板的一侧有凹凸结构，所述凹凸结构在所述OLED显示面板的非显示区，以及，所述凹凸结构与所述非平坦表面相对应。
  3. 如权利要求1所述的OLED显示面板，其中，还包括第一挡墙，所述第一挡墙在所述非平坦表面远离所述显示区的一侧，并且在所述有机发光功能层和所述第一封装层之间。
  4. 如权利要求3所述的OLED显示面板，其中，还包括第二挡墙，所述第二挡墙在所述有机发光功能层和所述第一封装层之间，并且在所述第一挡墙远离所述显示区的一侧，所述第二挡墙的高度大于所述第一挡墙的高度。
  5. 如权利要求1所述的OLED显示面板，其中，还包括第三封装层，所述第三封装层覆盖所述第二封装层和未被所述第二封装层覆盖的所述第一封装层。
  6. 如权利要求2-5任一项所述的OLED显示面板，其中，所 述凹凸结构包括多个凸起部，相邻的所述凸起部之间形成有凹陷部。
  7. 如权利要求6所述的OLED显示面板，其中，各所述凸起部的形状相同。
  8. 如权利要求6所述的OLED显示面板，其中，各所述凸起部相互连接。
  9. 如权利要求8所述的OLED显示面板，其中，所述凸起部为锯齿形。
  10. 如权利要求9所述的OLED显示面板，其中，所述凸起部为等腰三角形或直角三角形的锯齿形。
  11. 如权利要求6所述的OLED显示面板，其中，各所述凸起部设置为互相间隔。
  12. 如权利要求11所述的OLED显示面板，其中，所述凸起部为矩形或梯形。
  13. 一种OLED显示装置，其中，包括如权利要求1-12任一项所述OLED显示面板。
  14. 一种OLED显示面板制备方法，其中，所述制备方法用于制备如权利要求1所述的OLED显示面板。
  15. 如权利要求14所述的OLED显示面板制备方法，其中，所述方法包括：
    在衬底基板上形成平坦化层，并通过构图工艺在所述平坦化 层远离所述衬底基板的一侧形成凹凸结构的图形，所述凹凸结构的图形在所述OLED显示面板的非显示区；
    在形成有所述平坦化层的所述衬底基板上依次形成有机发光功能层、第一封装层和第二封装层；其中，所述第一封装层为无机层，且所述第一封装层远离所述有机发光功能层的一侧、与所述凹凸结构相对应的位置为非平坦表面；所述第二封装层为有机层，且覆盖显示区内的第一封装层且覆盖邻近显示区的一部分所述非平坦表面。
  16. 如权利要求15所述的OLED显示面板制备方法，其中，在形成所述有机发光功能层之后、形成所述第一封装层之前，所述方法还包括：
    在所述非显示区，通过构图工艺形成第一挡墙和第二挡墙，其中，所述第一挡墙和所述第二挡墙在所述非平坦表面远离所述显示区的一侧，所述第一挡墙比所述第二挡墙邻近所述显示区，所述第二挡墙的高度大于所述第一挡墙的高度。
  17. 如权利要求15所述的OLED显示面板制备方法，其中，形成所述第二封装层之后，所述方法还包括：
    在形成有所述第一封装层和所述第二封装层的所述衬底基板上形成第三封装层，所述第三封装层覆盖所述第二封装层和未被所述第二封装层覆盖的所述第一封装层。
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