WO2019100335A1 - 触控显示面板、柔性显示装置及其制作方法 - Google Patents

触控显示面板、柔性显示装置及其制作方法 Download PDF

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Publication number
WO2019100335A1
WO2019100335A1 PCT/CN2017/112912 CN2017112912W WO2019100335A1 WO 2019100335 A1 WO2019100335 A1 WO 2019100335A1 CN 2017112912 W CN2017112912 W CN 2017112912W WO 2019100335 A1 WO2019100335 A1 WO 2019100335A1
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WO
WIPO (PCT)
Prior art keywords
component
touch
display
emitter
display panel
Prior art date
Application number
PCT/CN2017/112912
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English (en)
French (fr)
Inventor
魏山山
梁艳峰
李健辉
龙浩晖
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2017/112912 priority Critical patent/WO2019100335A1/zh
Priority to JP2020526250A priority patent/JP7031946B2/ja
Priority to KR1020207016396A priority patent/KR102363792B1/ko
Priority to CN201780093185.7A priority patent/CN110914792B/zh
Priority to US16/766,587 priority patent/US20210004101A1/en
Publication of WO2019100335A1 publication Critical patent/WO2019100335A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • G02B5/3041—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to display technologies, and in particular, to a touch display panel, a flexible display device, and a method of fabricating the same.
  • the flexible display device is made of soft material and is a deformable and bendable display device.
  • a common flexible display device is a flexible organic light emitting diode (OLED) display device, and the OLED has wide advantages such as self-luminous, wide viewing angle, almost infinite contrast, low power consumption, and high reaction speed. application.
  • OLED organic light emitting diode
  • the flexible OLED display device includes, in order from bottom to top, a copper foil (Cu foil), a foam (Foam), and an active organic Active Matrix Organic Light Emitting Diode (AMOLED) panel, Thin Film Encapsulation (TFE) layer, Touch panel, Polarizer (POL), Solid optical transparent adhesive (Optically) Clear Adhesive (OCA) and Cover Glass (CG).
  • the signal line of the touch panel and the signal line of the AMOLED panel are concentrated and connected to an integrated circuit (IC) chip through a film on a flexo film (FOF).
  • the IC chip is a touch.
  • the IC chip for controlling and displaying functions is connected to the flexible printed circuit board (FPC) through the transferred FOF connector through the IC chip, and the board is connected through the board between the FOF connector and the FPC. Boarder to boarder connection.
  • FPC flexible printed circuit board
  • a flexible OLED display device of the prior art needs to sequentially add an AMOLED touch panel, a TFE, a touch panel, etc. on the same substrate (the AMOLED touch panel includes a substrate, and the substrate is not separately shown in FIG. 1). Longer, complicated production process and high cost.
  • the present application provides a touch display panel, a flexible display device, and a manufacturing method thereof, which shorten the manufacturing process and reduce the cost of the display device.
  • the first aspect of the present application provides a touch display panel, including:
  • a flexible substrate a display component, a touch component, and a thin film encapsulation layer
  • the touch component and the display component are located at different positions on the upper surface of the flexible substrate, and the touch component and the display component are stacked together by a folding manner to form the touch.
  • a display panel, the thin film encapsulation layer being formed on an upper surface of the touch component, the display component, and the flexible substrate.
  • the touch component includes a receiving pole and an emitter, the receiving pole and the emitter are located at different positions on an upper surface of the flexible substrate, and the receiving pole and the emitter are respectively folded to the same Above the display component.
  • the receiving pole, the emitter and the display component are stacked, and the receiving pole, the emitter and the adjacent two layers of the display component are bonded by an optical transparent adhesive.
  • the receiving pole and the emitter are located on two sides of the display component.
  • the receiving pole and the emitter are located side by side on the display component.
  • the touch component includes a receiving pole and an emitter, the receiving pole and the emitter are formed at the same position on a surface of the flexible substrate, and the receiving stage and the emitter are stacked and disposed. The receiver and the emitter are folded together over the display assembly.
  • the receiving electrode, the emitter and the adjacent two layers of the display component are bonded by an optical transparent adhesive.
  • the signal line of the display component and the signal line of the touch component are concentrated and electrically connected to an external circuit.
  • a second aspect of the present disclosure provides a flexible display device, comprising: any one of the touch display panel provided by the first aspect of the present application, and a polarizer and a cover plate, wherein the polarizer is disposed on the touch display panel The upper surface, the cover plate is disposed above the polarizer.
  • the touch display panel and the external circuit are electrically connected to each other through a chip on the flexo board, or the external display circuit is electrically connected to the external circuit through a chip on the plastic substrate.
  • the touch display panel and the external circuit are connected by a COF connector, and a connecting hole is formed at a connecting portion of the touch display panel and the COF connector;
  • the touch display panel and the external circuit are connected by a COP connector, and the connection portion of the touch display panel and the COP connector is provided with a through hole.
  • the flexible display device further includes: a foam and a copper foil, the foam is located on a lower surface of the touch display panel, and the copper foil is located on a lower surface of the foam.
  • a third aspect of the present application provides a method for manufacturing a touch display panel, including:
  • the touch component and the display component in the foldable unit are folded and laminated to form a touch display panel.
  • the touch component includes a receiving end and an emitter, and the display component and the touch component are formed at different positions on the upper surface of the flexible substrate, including:
  • the folding of the touch component and the display component are stacked and stacked to form a touch display panel, including:
  • the receiver and the emitter are respectively folded over the display assembly.
  • the receiving pole and the emitter are located on two sides of the display component.
  • the receiving pole and the emitter are located side by side on the display component.
  • the touch component includes a receiving end and an emitter, and is at different positions on the upper surface of the flexible substrate.
  • Create display components and touch components including:
  • the folding of the touch component and the display component are stacked and stacked to form a touch display panel, including:
  • the receiver and the emitter are folded together over the display assembly.
  • the touch display panel includes: a flexible substrate, a display component, a touch component, and a thin film encapsulation layer, wherein the touch component and the display component are located on the flexible substrate
  • the touch component and the display component are stacked together by different manners on the upper surface to form a touch display panel, and the thin film encapsulation layer is formed on the upper surface of the touch component, the display component and the flexible substrate.
  • the display component and the touch component are simultaneously fabricated on different positions of the flexible substrate, and the touch display panel is integrated by folding, thereby saving the process and correspondingly manufacturing the touch component separately.
  • the manufacturing cost and the touch component and the display component are interconnected by internal circuits, thereby eliminating the electrical connection process of the touch component and the display component in the assembly process, thereby shortening the manufacturing process and reducing the cost of the touch display panel.
  • FIG. 1 is a schematic structural view of a conventional flexible OLED display device
  • FIG. 2 is a schematic view of a touch display panel before folding
  • FIG. 3 is a schematic diagram showing a state change of a folding process of the touch display panel shown in FIG. 2;
  • FIG. 5 is still another schematic view of the touch display panel before folding
  • FIG. 6 is a cross-sectional view of the touch display panel after film packaging
  • Figure 7 is a schematic view showing a cross section of A-A' of a flexible display device
  • Figure 8 is a schematic view showing a B-B' cross section of the flexible display device shown in Figure 7;
  • Figure 9 is a schematic view showing a cross section taken along line A-A' of another flexible display device.
  • Figure 10 is a schematic view showing a B-B' section of the flexible display device shown in Figure 9;
  • FIG. 11 is a schematic diagram of a touch display panel and an external circuit connected by a COF method
  • FIG. 12 is a schematic diagram of a touch display panel and an external circuit connected by a COP method
  • FIG. 13 is a flowchart of a method for fabricating a touch display panel
  • FIG. 14 is a flow chart of a method of fabricating a flexible display device.
  • the present invention provides a touch display panel, wherein the touch display panel includes a flexible substrate, a display component, a touch component, and a thin film package TFE layer.
  • the touch component and the display component are located at different positions on the upper surface of the flexible substrate, and are folded.
  • the touch component and the display component are stacked together to form a touch display panel, and the TFE layer is formed on the upper surface of the touch component, the display component and the flexible substrate.
  • the flexible substrate is bendable, the flexible display substrate under the touch component is folded together when the display component and the touch component are simultaneously fabricated on different positions of the flexible substrate by folding the integrated touch display panel. Go to the top of the display component.
  • the cost and the touch component and the display component are interconnected by internal circuits, thereby eliminating the electrical connection process of the touch component and the display component in the assembly process, thereby shortening the manufacturing process and reducing the cost of the flexible display panel.
  • the touch component includes: a receiving pole Rx and an emitter Tx, and the receiving pole Rx and the emitter pole Tx are located on the upper surface of the flexible substrate.
  • the position, the receiving pole Rx and the emitter pole Tx are respectively folded over the display assembly.
  • the receiving pole Rx, the emitter Tx and the display component are stacked, and the receiving pole Rx, the emitter Tx and the adjacent two layers of the display component are bonded by an optical transparent adhesive OCA.
  • the receiving pole Rx may be located above the emitter Tx, and the receiving pole Rx may also be located below the emitter Tx.
  • the signal line of the display component and the signal line of the touch component can be electrically connected to the external circuit after the line is concentrated, and the signal line of the touch component includes the signal line of the receiving pole Rx and the signal line of the emitter Tx.
  • the signal line of the display component and the signal line of the touch component are concentrated.
  • the signal line of the display component and the signal line of the touch component are combined into one line, and only one interface needs to be provided externally, and only the external connection process needs to be performed. Connect once. As shown in FIG.
  • the signal line of the receiving pole Rx, the signal line of the emitter Tx, and the signal line of the display component are concentrated to one side of the display component, of course, the signal line of the receiving pole Rx, the signal line of the emitter Tx, and the display.
  • the signal lines of the components can also converge to the side of the receiver Rx or to the side of the emitter Tx.
  • the signal line of the receiving pole Rx and the signal line of the emitter Tx may only pass through the area of the display component, but the receiving pole Rx and the emitter pole Tx are not electrically connected to the display component, and the receiving pole Rx and the emitter are Tx is not interconnected.
  • the receiving pole Rx and the emitter pole Tx may also share or partially share some lines with the display component, for example, the receiving pole Rx, the emitter pole Tx and the display component share the grounding end.
  • the positions of the receiving pole Rx and the emitter pole Tx are not limited in the embodiment of the present application. In one mode, the receiving pole Rx and the emitter pole Tx are located on both sides of the display assembly. In another mode, the receiver Rx and the emitter Tx are side by side on one side of the display assembly.
  • the receiving pole Rx and the emitter pole Tx may be located on two sides adjacent to the display component, or may be located on opposite sides of the display component (ie, opposite sides) ). As shown in FIG. 2, the receiving pole Rx, the emitter Tx, and the display assembly are both located on the upper surface of the flexible substrate, wherein the receiving pole Rx is located above the display assembly and the emitter Tx is located on the left side of the display assembly.
  • the receiving Rx, the emitter Tx, and the display component have the same or approximately the same area, and the receiving Rx and the emitter Tx have the same area.
  • 3 is a schematic diagram showing a state change of the folding process of the touch display panel shown in FIG. 2.
  • the emitter Tx is first folded upward to the display component, and the emitter Tx is used to cover the component, the emitter Tx and The display components are pasted by OCA, and then the receiving pole Rx is folded up to the top of the emitter Tx, the receiving pole Rx covers the emitter Tx, and the receiving pole Rx and the emitter Tx are pasted by OCA to form a laminated touch. Display panel.
  • the receiver Rx when the receiver Rx is located above the display component and the emitter Tx is located above the receiver Rx, correspondingly, when folded, the receiver Rx is first folded up to the top of the display component, and the receiver Rx is received. It is pasted with the display component by OCA, then the emitter Tx is folded up above the receiving pole Rx, and the emitter Tx and the receiving pole are pasted by OCA.
  • FIG. 4 is another schematic view of the touch display panel before folding.
  • the receiving pole Rx and the emitter pole Tx are arranged side by side on the left side of the display component, and the receiving pole Rx can be folded to the emitter pole Tx when folded.
  • the receiver Rx and the emitter Tx are pasted by OCA, and then the receiver Rx and the emitter Tx are folded in one piece. Stacked above the display assembly, the receiver Rx and the display assembly are pasted by OCA. It is also possible to first fold the emitter Tx above the display assembly and then fold the receiver Rx above the emitter Tx.
  • different folding sequences form different structures.
  • the receiving pole Rx is located above the display component, and the emitter Tx is located above the receiving pole Rx; the latter folding In the mode, the emitter Tx is located above the display component, and the receiver Rx is located above the emitter Tx.
  • the receiving pole Rx and the emitter pole Tx are sequentially arranged side by side on the left side of the display component.
  • the receiving pole Rx and the emitter pole Tx may be sequentially arranged above, below or to the right of the display component. It can be understood that the embodiment does not limit the order of the emitter Tx and the receiver Rx, and the emitter Tx and the receiver Rx may be sequentially arranged side by side on the display component.
  • the receiving pole Rx and the emitter pole Tx are located at different positions of the flexible substrate, and need to be folded twice to form a stacked touch display panel.
  • the receiving pole Rx and the emitter pole Tx are formed at the same position of the flexible substrate, the receiving pole Rx and the emitter pole Tx are stacked, and the receiving pole Rx and the emitter pole Tx are folded together above the display component.
  • the receiving pole Rx and the emitter pole Tx can be connected by OCA.
  • FIG. 5 is still another schematic view of the touch display panel before folding. Referring to FIG. 5, the receiving pole Rx and the emitter Tx are first formed at the same position on the upper surface of the flexible substrate, wherein the receiving pole Rx can be located at the emission. Above the pole Tx, the receiver Rx can also be located below the emitter Tx.
  • the receiving pole Rx and the emitter pole Tx are integrally located on either side of the display component, and the receiving pole Rx and the emitter pole Tx are folded integrally onto the display component when folded, and the receiving pole Rx is folded or
  • the emitter Tx is adjacent to the display assembly, and the receiver Rx or emitter Tx is bonded to the display assembly by the OCA.
  • this method by forming the receiving pole Rx and the emitter pole Tx at the same position of the flexible substrate, the area of the flexible substrate is saved, and only one folding process is required, which further reduces the number of steps.
  • the flexible substrate comprises a polyethylene terephthalate (PET) layer, a glue GLUE layer, and a polyimide (PI) layer, wherein the PET layer is located at a lowermost layer of the flexible substrate.
  • PET polyethylene terephthalate
  • PI polyimide
  • the PI layer and the PET layer are bonded by glue, and the PET layer is mainly for reinforcing the structure of the PI layer.
  • the structure of the flexible substrate is not limited to the above structure, and the flexibility is basically only required to be foldable.
  • a buffer layer or a flexible substrate with a buffer layer may be used before the display component and the touch component are fabricated on the flexible substrate.
  • the buffer layer prevents metal ions (aluminum, tantalum, sodium, etc.) in the PI from diffusing into the display assembly during the thermal process.
  • the display component can be an AMOLED, the AMOLED includes an OLED and a driver circuit, and the display component can also be composed of a Micro LED and a driver circuit.
  • the OLED may include an anode layer, a cathode layer, and a light emitting layer formed between the anode layer and the cathode layer, the light emitting layer being composed of an organic light emitting material.
  • the principle of OLED illumination is the phenomenon that organic semiconductor materials and luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
  • an OLED generally employs an ITO pixel electrode and a metal electrode as an anode layer and a cathode layer, respectively, at which electrons and holes are injected from the cathode and the anode to the electron transport layer and the hole transport layer, respectively, at a certain driving voltage.
  • the electrons reach the light-emitting layer through the electron transport layer, and the holes also reach the light-emitting layer after passing through the hole transport layer.
  • the electrons and holes meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the light-emitting molecules are emitted through radiation relaxation. Visible light.
  • the Micro LED is a thin-film, miniaturized, and arrayed LED light-emitting diode (LED) structure. Its size is only about 1 to 10 ⁇ m. It is a wide color gamut, high brightness, and long life. Fast-responding, low-power, self-illuminating display technology. Both OLED and Micro LED are self-illuminating, except that OLEDs emit light through organic materials, while Micro LEDs emit light through inorganic materials.
  • the driving circuit may be low temperature polysilicon (LTPS), amorphous silicon (a-Si), indium gallium zinc oxide (Indium Gallium Zinc Oxide, IGZO) or the like.
  • LTPS low temperature polysilicon
  • a-Si amorphous silicon
  • IGZO indium gallium zinc oxide
  • metal ions aluminum, germanium, sodium, etc.
  • the quality while helping to reduce heat conduction, slow down the cooling rate of silicon heated by the laser, is conducive to the crystallization of silicon.
  • a driving circuit and an OLED are first formed on a flexible substrate to form a display component, and then the display component is thin-film-packed, and further, a touch component is superimposed on the film, so that Lead to longer processes.
  • the driving circuit and the touch component are fabricated at different positions on the same flexible substrate.
  • the manufacturing of the touch component is completed while the driving circuit is being fabricated, and the OLED is in the driving circuit.
  • the driving circuit is first made, then the OLED is further fabricated on the basis of the driving circuit, and the touch component is simultaneously fabricated in the manufacturing stage of the OLED.
  • the process of separately manufacturing the touch component and the corresponding manufacturing cost are saved, and the electrical connection process of the touch component and the display component is saved.
  • the flexible display device using the OLED has a very high packaging requirement.
  • the TFE is performed after the flexible substrate completes the fabrication of the touch component and the display component.
  • 6 is a cross-sectional view of the touch display panel after thin film encapsulation.
  • the flexible substrate includes a PI layer, a GLUE layer, and a PET layer.
  • the buffer layer is located above the PI layer, the touch component and the display component are located at different positions on the upper surface of the buffer layer, and the display component comprises an OLED and a driving circuit, wherein the driving circuit is located on the upper surface of the buffer layer, and the OLED is located on the driving circuit surface.
  • the TFE layer is formed on the upper surface of the touch display panel before the folding of the touch display panel, that is, the TFE layer is entirely covered on the touch component, the display component, and the flexible substrate (or the buffer layer), and can block the water and oxygen from entering the display component and the touch component.
  • the touch display panel serves as a protection.
  • the present application further provides a flexible display device comprising the touch display panel of any of the above, and the polarizer POL and the cover.
  • the POL is disposed on the upper surface of the touch display panel, and the cover plate is disposed above the POL.
  • the POL is used to prevent external light from reflecting out of the touch display panel.
  • the cover plate and the POL may be pasted by OCA, and the cover plate may be glass or other. Transparent material, the cover mainly protects the touch display panel.
  • the flexible display device further comprises a foam and a copper foil.
  • the foam is located on the lower surface of the touch display panel, and the copper foil is disposed on the lower surface of the foam.
  • the foam mainly protects the flexible display device, and the copper foil has the following functions: preventing electromagnetic shielding and preventing other electromagnetic signals of the device and The interference between the touch signals is displayed; the heat dissipation can quickly transmit the local high temperature of the touch display panel to the entire surface; the buffer protection prevents the shell of the device from being crushed, impacted, etc. on the back of the touch display panel; Grounding, as the grounding electrode for display, touch, and housing.
  • FIG. 7 is a schematic view of a cross section taken along the line A-A' of the flexible display device
  • FIG. 8 is a schematic view showing a cross section taken along line BB' of the flexible display device shown in FIG. 7.
  • the flexible display device is from below.
  • the second embodiment includes: a copper foil, a foam, a touch display panel, a POL, and a cover.
  • the touch display panel in this embodiment can adopt FIG. 2 and
  • the touch display panel shown in FIG. 4 is folded and formed twice to form the flexible display device shown in FIGS. 7 and 8.
  • the touch display panel shown in FIG. 7 and FIG. 8 only includes the receiving pole Rx, the emitter pole Tx, the display component and the TFE layer, and the flexible substrate is not marked, but does not represent touch.
  • the display panel does not include a flexible substrate.
  • the receiving pole Rx and the emitter Tx are folded together with the flexible substrate.
  • the flexible substrate can be considered as being integrated with the receiving pole Rx, the emitter Tx and the display assembly.
  • the receiving pole Rx is located above the emitter Tx, which is merely an example. In practical applications, the receiving pole Rx may also be located below the emitter Tx.
  • FIG. 9 is a schematic view showing a cross section taken along line A-A' of another flexible display device
  • FIG. 10 is a schematic view showing a cross section taken along line BB' of the flexible display device shown in FIG. 9.
  • the flexible display device is from below.
  • the touch display panel of the present embodiment can be folded and formed by using the touch display panel shown in FIG. 5, and needs to be folded once to form a picture.
  • 9 and the flexible display device shown in FIG. It should be clarified that in the touch display panel shown in FIG. 9, the receiving pole Rx may be located above the emitter Tx, and the receiving pole Rx may also be located below the emitter Tx. In the bent portion, the display component and the touch component have electrical connections.
  • the flexible substrate is also not shown in the flexible display device shown in FIGS. 9 and 10.
  • the flexible display device needs to be connected to other circuits in the terminal device.
  • the touch display panel of the flexible display device is connected to an external circuit.
  • the touch display panel and the external circuit are electrically connected through the chip on the flexible board. (Chip on film, or, Chip On Film, COF for short), in another mode, the touch display panel and the external circuit are electrically connected through a chip on a plastic substrate (Chip on plastic, or Chip On Panel, COP for short) ) way to connect.
  • COF also known as flip chip
  • flip chip generally refers to the use of Au-Sn eutectic hot pressing technology or anisotropic conductive film (ACF) hot pressing technology to fix the chip on the flexible circuit board.
  • ACF anisotropic conductive film
  • the film assembly technology is a technique in which a flexible additional circuit board (which can be referred to as a COF connector) is used as a package chip carrier to bond a chip to a flexible substrate circuit.
  • COP also known as flip-chip flexible panel
  • COP connector A technique for packaging a chip carrier to bond a chip to a flexible panel circuit.
  • FIG. 11 is a schematic diagram of a touch display panel and an external circuit connected by a COF method.
  • the touch display panel and the FPC are connected by a COF connector, and the COF connector is made of a soft material and can be bent to The back of the touch display panel, the COF connector and the touch display panel can be connected together by a hot pressing process.
  • the connection portion of the touch display panel and the COF connector is provided with a through hole, and the through hole can be used for installing a camera or various sensors.
  • the shape of the through hole is not limited. As shown in FIG. 11 , the through hole is semicircular on one side of the touch display panel, and the through hole is trapezoidal on the side of the COF connector.
  • the shape can correspond to the shape of the camera or sensor.
  • the touch display panel usually has only one side connected to the COF connector, and the through hole can also be disposed on the other side of the touch display panel that is not connected to the COF connector.
  • the through hole is disposed on the touch display panel and connected to the COF. On the opposite side of the body, this embodiment does not limit this.
  • FIG. 12 is a schematic diagram of the touch display panel and the external circuit connected by the COP method.
  • the touch display panel needs to be extended, that is, the signal line in the touch display panel (including the touch component and the display)
  • the signal line of the component is made into a concentrated bare COP connector, and then the FPC is bound by a hot pressing process.
  • the connection portion of the touch display panel and the COP connector is provided with a through hole, and the through hole can be used for installing a camera or various sensors.
  • the shape of the through hole is not limited. As shown in FIG.
  • the through hole is semicircular on one side of the touch display panel, and the through hole is trapezoidal on the side of the COP connector.
  • the shape can correspond to the shape of the camera or sensor.
  • the touch display panel usually has only one side connected to the COP connector.
  • the through hole can also be disposed on the other side of the touch display panel that is not connected to the COP connector. This embodiment does not limit this.
  • the signal line of the display component and the signal line of the touch component are concentrated out of the line, and only the COF connection or the COP connection of the touch display panel and the external circuit is required, thereby reducing the display component and the touch component.
  • the flexible display device of the present embodiment includes: a touch display panel, a polarizer, and a cover.
  • the touch display panel includes a flexible substrate, a display component, a touch component, and a TFE layer, wherein the touch component and the display component are respectively located
  • the TFE layer is formed on the upper surface of the touch component, the display component, and the flexible substrate, and the touch component is formed on the upper surface of the display component by a folding manner, and the polarizer is located on the upper surface of the touch display panel.
  • the cover is located above the polarizer.
  • FIG. 13 is a flowchart of a method for manufacturing a touch display panel. As shown in FIG. 13 , the method for manufacturing the touch display panel includes the following steps:
  • Step S101 manufacturing a display component and a touch component at different positions of the flexible substrate.
  • the flexible substrate may include a buffer layer. If the flexible substrate does not include a buffer layer, optionally, a buffer layer may be deposited on the flexible substrate to fabricate the display component and the touch component.
  • the specific fabrication process may vary from flexible substrate to flexible substrate. For example, when the flexible substrate includes a PI layer, a GULE layer, and a PET layer, the display component and the touch component are fabricated at different positions of the flexible substrate, including:
  • a buffer layer is deposited on a glass plate coated with PI.
  • the buffer layer can be deposited on the PI by, for example, Chemical Vapor Deposition (CVD).
  • CVD Chemical Vapor Deposition
  • the reason why glass is used is because the flatness of the glass is high, and the accurate exposure size can be obtained. At the same time, the glass has a certain strength, and the automatic water flow is convenient.
  • the display component and the touch component are fabricated at different positions of the buffer layer.
  • PET does not have many excellent properties such as high temperature resistance, so the driving circuit of the touch component and the display component cannot be directly fabricated directly on the flexible substrate.
  • the common practice is to apply PI on a glass plate, and then make a driving circuit for the display component, an OLED or a Micro LED, and a touch component on the PI, and the high-temperature process is higher than 400 degrees in the manufacturing process.
  • the display component includes a driving circuit, an OLED or a Micro LED.
  • a driving circuit an OLED or a Micro LED.
  • the manufacturing of the touch component is completed while the driving circuit is being fabricated, and the OLED is based on the driving circuit. Further on.
  • the driving circuit is first fabricated, and then the OLED is further fabricated on the basis of the driving circuit, and the touch component is simultaneously fabricated in the manufacturing stage of the OLED.
  • the prior art saves the process of separately manufacturing the touch component and the corresponding manufacturing cost, and saves the electrical connection process of the touch component and the display component.
  • the touch component includes a receiving pole Rx and an emitter Tx, and the order of the receiving pole Rx and the emitter pole Tx is not limited.
  • the receiver Rx and the emitter Tx are formed at the same position on the upper surface of the flexible substrate, wherein the receiving electrode Rx and the emitter Tx are stacked.
  • the receiver Rx and the emitter Tx are formed at different positions on the upper surface of the flexible substrate.
  • the receiving pole Rx and the emitter Tx are located on both sides of the display component, or the receiving pole Rx and the emitter pole Tx are located side by side on the display component.
  • the TFE is performed, and the stack on the PI and PI is transferred onto the PET to form a touch display component.
  • the TFE layer is entirely covered on the touch component, the display component, and the flexible substrate (or buffer layer). During the transfer process, the glass plate is separated, and the PI and PET are bonded by glue or other adhesive. The touch display component formed in this step needs to be cut into a touch display panel.
  • Step S102 performing thin film encapsulation on the flexible substrate, the display component, and the touch component to form a touch display component.
  • Step S103 cutting the touch display component into a smallest foldable unit.
  • the foldable unit is a structure before the touch display panel is folded.
  • Step S104 Folding the touch component and the display component in the foldable unit and stacking them together to form a touch display panel.
  • the touch component and the display component in the foldable unit are folded and laminated to form a touch display panel, specifically: receiving The pole Rx and the emitter Tx are respectively folded over the display assembly, requiring a total of two folds.
  • the touch component and the display component in the foldable unit are folded and laminated to form a touch display panel, specifically: receiving The pole Rx and the emitter Tx are folded together over the display assembly, requiring a total fold.
  • the method of the present embodiment can be used to fabricate the touch display panel provided in the above embodiments.
  • the method of the embodiment can simultaneously manufacture the touch component and the display component on the flexible component, which saves the separate touch control compared to the prior art.
  • the process of the component and the corresponding manufacturing cost, and the electrical connection process of the touch component and the display component are saved.
  • FIG. 14 is a flowchart of a method for fabricating a flexible display device. As shown in FIG. The following steps:
  • Step S201 depositing a buffer layer on a glass plate coated with a flexible PI.
  • Step S202 creating a display component and a touch component at different positions of the buffer layer.
  • Step S203 performing TFE, and transferring the stack on the PI and the PI onto the PET to form a touch display component.
  • Step S204 cutting the touch display component into a smallest foldable unit.
  • the smallest foldable unit can be as shown in FIG.
  • Step S205 Folding the touch component and the display component in the foldable unit and laminating together to form a touch display panel.
  • the touch component and the display component are bonded by OCA, and the receiving electrode Rx and the emitter Tx of the touch component are also bonded by OCA.
  • Step S206 attaching a polarizer to the upper surface of the touch display panel.
  • Step S207 electrically connecting the touch display panel to the IC chip and the PCB.
  • connection between the CPF and the COP can be used.
  • specific connection manner refer to the description of the foregoing embodiment, and details are not described herein again.
  • Step S208 bonding the cover plate to the polarizer.
  • step S209 the foam is attached to the lower side of the touch display panel, and the copper foil is attached under the foam.

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Abstract

本申请提供一种触控显示面板、柔性显示装置及其制作方法，该触控显示面板包括：柔性基板、显示组件、触控组件和薄膜封装层，其中，触控组件和显示组件位于柔性基板的上表面的不同位置，通过折叠的方式，将触控组件和显示组件层叠在一起，以形成触控显示面板，薄膜封装层形成于触控组件、显示组件和柔性基板的上表面。通过利用柔性基板可弯曲的特性，将显示组件和触控组件同时制作在柔性基板的不同位置上，通过折叠方式形式一体化的触控显示面板，从而节省了单独制作触控组件的工序和相应的制造成本，并且触控组件和显示组件通过内部电路互联，省去了组装环节触控组件和显示组件电连接工序，从而缩短了制作工序，并且降低了触控显示面板的成本。

Description

触控显示面板、柔性显示装置及其制作方法 技术领域
本申请涉及显示技术，尤其涉及一种触控显示面板、柔性显示装置及其制作方法。
背景技术
随着显示技术的发展，柔性显示技术应用越来越广泛，柔性显示装置由柔软的材料制成，是一种可变形可弯曲的显示装置。常见的柔性显示装置为柔性有机发光二极管(Organic Light Emitting Diode，OLED)显示装置，OLED具有自发光、广视角、几乎无穷高的对比度、较低耗电、极高反应速度等优点，因而得到广泛应用。
图1为一种现有的柔性OLED显示装置的结构示意图，如图1所示，该柔性OLED显示装置自下而上依次包括：铜箔(Cu foil)、泡棉(Foam)、有源有机发光二极管(Active Matrix Organic Light Emitting Diode，AMOLED)面板(panel)、薄膜封装(Thin Film Encapsulation，TFE)层、触控面板(Touch panel)、偏光片(Polarizer，POL)、固态光学透明胶(Optically Clear Adhesive，OCA)和盖板玻璃(Cover Glass，CG)。触控面板的信号线与AMOLED面板的信号线集中后通过柔板上柔板电(Film on film，FOF)的方式连接至一个集成电路(integrated circuit，IC)芯片，该IC芯片为一个具有触控与显示功能的IC芯片，FOF连接体经IC芯片后通过转接的FOF连接体连接至柔性印刷电路板(Flexible Printed Circuit，FPC)上的，FOF连接体与FPC之间通过板对板连接器(Boarder to boarder)连接。
现有技术的柔性OLED显示装置，需要在同一基板(图1中AMOLED触控面板包括基板，未单独示出基板)上依次累加AMOLED触控面板、TFE、触控面板等，整个装置的制作工序较长，制作过程复杂，成本高。
发明内容
本申请提供一种触控显示面板、柔性显示装置及其制作方法，缩短了制作工序，并且降低了显示装置的成本。
本申请第一方面提供一种触控显示面板，包括：
柔性基板、显示组件、触控组件和薄膜封装层；
其中，所述触控组件和所述显示组件位于所述柔性基板的上表面的不同位置，通过折叠的方式，将所述触控组件和所述显示组件层叠在一起，以形成所述触控显示面板，所述薄膜封装层形成于所述触控组件、所述显示组件和所述柔性基板的上表面。
可选的，所述触控组件包括接收极和发射极，所述接收极和所述发射极位于所述柔性基板的上表面的不同位置，所述接收极和所述发射极分别折叠至所述显示组件的上方。
可选的，所述接收极、所述发射极和所述显示组件呈层叠状，所述接收极、所述发射极和所述显示组件中相邻两层之间通过光学透明胶粘结。
可选的，所述接收极和所述发射极位于所述显示组件的两侧。
可选的，所述接收极和所述发射极并排位于所述显示组件的一侧。
可选的，所述触控组件包括接收极和发射极，所述接收极和所述发射极形成在所述柔性基板的表面的同一位置，所述接收级和所述发射极层叠设置，所述接收极和所述发射极一起折叠至所述显示组件的上方。
可选的，所述接收极、所述发射极和所述显示组件中相邻两层之间通过光学透明胶粘接。
可选的，所述显示组件的信号线和所述触控组件的信号线集中出线后与外部电路电连接。
本申请第二方面提供一种柔性显示装置，包括：本申请第一方面提供的任一项触控显示面板，以及偏光片和盖板，所述偏光片，设置在所述触控显示面板的上表面，所述盖板，设置在所述偏光片的上方。
可选的，所述触控显示面板与所述外部电路通过柔板上芯片电连接COF方式连接，或者，所述触控显示面板与所述外部电路通过塑料基板上芯片电连接COP方式连接。
可选的，所述触控显示面板与所述外部电路通过COF连接体连接，所述触控显示面板与所述COF连接体的连接部位开设有通孔；
或者，所述触控显示面板与所述外部电路通过COP连接体连接，所述触控显示面板与所述COP连接体的连接部位开设有通孔。
可选的，所述柔性显示装置还包括：泡棉和铜箔，所述泡棉位于所述触控显示面板的下表面，所述铜箔位于所述泡棉的下表面。
本申请第三方面提供一种触显示面板的制作方法，包括：
在柔性基板的上表面的不同位置上制作显示组件和触控组件；
对所述柔性基板、所述显示组件和所述触控组件进行薄膜封装，形成触控显示组件；
将所述触控显示组件切割为最小的可折叠单元；
将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板。
可选的，所述触控组件包括接收极和发射极，则在柔性基板的上表面的不同位置上制作显示组件和触控组件，包括：
在所述柔性基板的上表面的不同位置上制作所述接收极、所述发射极和所述显示组件；
所述将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板，包括：
将所述接收极和所述发射极分别折叠至所述显示组件的上方。
可选的，所述接收极和所述发射极位于所述显示组件的两侧。
可选的，所述接收极和所述发射极并排位于所述显示组件的一侧。
可选的，所述触控组件包括接收极和发射极，则在柔性基板的上表面的不同位置 上制作显示组件和触控组件，包括：
在所述柔性基板的上表面的第一位置制作所述接收极和所述发射极，在所述柔性基板的第二位置制作显示组件，其中，所述接收级和所述发射极层叠设置；
所述将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板，包括：
将所述接收极和所述发射极一起折叠至所述显示组件的上方。
本申请提供的触控显示面板、柔性显示装置及其制作方法，该触控显示面板包括：柔性基板、显示组件、触控组件和薄膜封装层，其中，触控组件和显示组件位于柔性基板的上表面的不同位置，通过折叠的方式，将触控组件和显示组件层叠在一起，以形成触控显示面板，薄膜封装层形成于触控组件、显示组件和柔性基板的上表面。通过利用柔性基板可弯曲的特性，将显示组件和触控组件同时制作在柔性基板的不同位置上，通过折叠方式形式一体化的触控显示面板，从而节省了单独制作触控组件的工序和相应的制造成本，并且触控组件和显示组件通过内部电路互联，省去了组装环节触控组件和显示组件电连接工序，从而缩短了制作工序，并且降低了触控显示面板的成本。
附图说明
图1为一种现有的柔性OLED显示装置的结构示意图；
图2一种触控显示面板折叠之前的一种示意图；
图3为图2所示触控显示面板的折叠过程的状态变化示意图；
图4为触控显示面板折叠之前的另一种示意图；
图5为触控显示面板折叠之前的又一种示意图；
图6为薄膜封装之后触控显示面板的截面图；
图7为一种柔性显示装置的A-A’截面的示意图；
图8为图7所示的柔性显示装置的B-B’截面的示意图；
图9为另一种柔性显示装置的A-A’截面的示意图；
图10为图9所示柔性显示装置的B-B’截面的示意图；
图11为触控显示面板与外部电路通过COF方式连接的示意图；
图12为触控显示面板与外部电路通过COP方式连接的示意图；
图13为一种触控显示面板的制作方法的流程图；
图14为一种柔性显示装置的制作方法的流程图。
具体实施方式
本申请提供一种触控显示面板，其中，触控显示面板包括柔性基板、显示组件、触控组件和薄膜封装TFE层，触控组件和显示组件位于柔性基板的上表面的不同位置，通过折叠的方式将触控组件和显示组件层叠在一起，以形成触控显示面板，TFE层形成于触控组件、显示组件和柔性基板的上表面。
由于柔性基板可弯曲，通过将显示组件和触控组件同时制作在柔性基板的不同位置上，通过折叠方式形式一体化的触控显示面板，在折叠时触控组件下方的柔性基板会被一同折叠到显示组件的上方。从而节省了单独制作触控组件的工序和相应的制造 成本，并且触控组件和显示组件通过内部电路互联，省去了组装环节触控组件和显示组件电连接工序，从而缩短了制作工序，并且降低了柔性显示面板的成本。
图2一种触控显示面板折叠之前的一种示意图，如图2所示，该触控组件包括：接收极Rx和发射极Tx，接收极Rx和发射极Tx位于柔性基板的上表面的不同位置，接收极Rx、发射极Tx分别折叠至显示组件的上方。具体的，接收极Rx、发射极Tx和显示组件呈层叠状，接收极Rx、发射极Tx和显示组件中相邻两层之间通过光学透明胶OCA粘结。其中，折叠后，接收极Rx可以位于发射极Tx的上方，接收极Rx也可以位于发射极Tx的下方。
本实施例中，显示组件的信号线和触控组件的信号线可以集中出线后与外部电路电连接，触控组件的信号线包括接收极Rx的信号线和发射极Tx的信号线。显示组件的信号线和触控组件的信号线集中出线是指：显示组件的信号线和触控组件的信号线合成一股线，对外只需提供一个接口，后续与外部连接过程中只需要进行一次连接。如图2所示，接收极Rx的信号线、发射极Tx的信号线和显示组件的信号线汇聚到显示组件的一侧，当然，接收极Rx的信号线、发射极Tx的信号线和显示组件的信号线也可以汇聚到接收极Rx的一侧，或者汇聚到发射极Tx的一侧。
可以理解的是，接收极Rx的信号线和发射极Tx的信号线可以只是经过显示组件的区域，但是，接收极Rx和发射极Tx并不与显示组件电连接，并且接收极Rx和发射极Tx之间也不互联。可选的，接收极Rx和发射极Tx也可能与显示组件共用或者局部共用一些线路，例如，接收极Rx、发射极Tx和显示组件共用接地端。
本申请的实施例中不对接收极Rx和发射极Tx的位置进行限定，一种方式中，接收极Rx和发射极Tx位于显示组件的两侧。另一种方式中，接收极Rx和发射极Tx并排位于显示组件的一侧。
当接收极Rx和发射极Tx位于显示组件的两侧时，接收极Rx和发射极Tx可以位于显示组件相邻的两侧，也可以位于显示组件不相邻的两侧(即相对的两侧)。如图2所示，接收极Rx、发射极Tx和显示组件均位于柔性基板的上表面，其中，接收极Rx位于显示组件的上方，发射极Tx位于显示组件的左侧。
可选的，接收极Rx、发射极Tx和显示组件的面积相同或者近似相同，接收极Rx、发射极Tx的面积相同。图3为图2所示触控显示面板的折叠过程的状态变化示意图，如图3所示，先将发射极Tx向上折叠至显示组件的上方，发射极Tx将显示组件覆盖，发射极Tx和显示组件之间通过OCA粘贴，然后将接收极Rx向上折叠至发射极Tx的上方，接收极Rx将发射极Tx覆盖，接收极Rx和发射极Tx之间通过OCA粘贴，形成层叠状的触控显示面板。
当触控显示面板中，接收极Rx位于显示组件之上，发射极Tx位于接收极Rx之上时，相应的，在折叠时，先将接收极Rx向上折叠至显示组件的上方，接收极Rx和显示组件之间通过OCA粘贴，然后将发射极Tx向上折叠至接收极Rx的上方，发射极Tx和接收极之间通过OCA粘贴。
图4为触控显示面板折叠之前的另一种示意图，如图4所示，接收极Rx和发射极Tx并排位于显示组件的左侧，在折叠时可以先将接收极Rx折叠到发射极Tx上方，接收极Rx和发射极Tx之间通过OCA粘贴，然后，将接收极Rx和发射极Tx整体折 叠到显示组件的上方，接收极Rx和显示组件之间通过OCA粘贴。也可以先将发射极Tx折叠到显示组件的上方，再将接收极Rx折叠到发射极Tx的上方。图4所示触控显示面板中，不同的折叠顺序会形成不同的结构，前一种折叠方式中，接收极Rx位于显示组件之上，发射极Tx位于接收极Rx之上；后一种折叠方式中，发射极Tx位于显示组件之上，接收极Rx位于发射极Tx之上。
图4所示触控显示面板中，接收极Rx、发射极Tx依次并排位于显示组件的左侧，当然，接收极Rx、发射极Tx也可以依次并排位于显示组件的上方、下方或右侧。可以理解的是，本实施例并不对发射极Tx和接收极Rx的顺序进行限制，也可以是发射极Tx、接收极Rx依次并排位于显示组件的一侧。
图2、图4所示的触控显示面板中，接收极Rx和发射极Tx位于柔性基板的不同位置，需要两次折叠才能形成层叠状的触控显示面板。
在本申请另一种实现方式中，接收极Rx和发射极Tx形成在柔性基板的同一位置，接收极Rx和发射极Tx层叠设置，接收极Rx和发射极Tx一起折叠至显示组件的上方，其中，接收极Rx和发射极Tx之间可以通过OCA连接。图5为触控显示面板折叠之前的又一种示意图，参照图5所示，先将接收极Rx和发射极Tx制作在柔性基板的上表面的同一位置上，其中，接收极Rx可以位于发射极Tx之上，接收极Rx也可以位于发射极Tx之下。
图5所示触控显示面板中，接收极Rx和发射极Tx整体位于显示组件的任意一侧，折叠时将接收极Rx和发射极Tx整体折叠到显示组件之上，折叠后接收极Rx或发射极Tx与显示组件相邻，接收极Rx或发射极Tx通过OCA与显示组件粘接。该方式中通过将接收极Rx和发射极Tx制作在柔性基板的同一位置上，节省了柔性基板的面积，并且只需要一次折叠工序，进一步减少了工序。
可选的，柔性基板包括聚对苯二甲酸乙二醇酯(Polyethylene terephthalate，PET)层、胶水GLUE层、聚酰亚胺(Polyimide，PI，)层，其中，PET层位于柔性基板的最下层，PI层和PET层之间通过胶水粘接，PET层主要是为了加固PI层的结构。这里只是举例说明，柔性基板的结构不限于上述结构，柔性基本只需要满足可折叠即可。
可选的，在柔性基板上制作显示组件和触控组件之前，还需要制作一个缓冲层，也可以采用自带缓冲层的柔性基板。缓冲层可以防止PI中的金属离子(铝、钡、钠等)在热工艺中扩散到显示组件。显示组件可以为AMOLED，AMOLED包括OLED和驱动电路，显示组件也可以由Micro LED和驱动电路组成。
OLED可以包括阳极层、阴极层以及形成于阳极层和阴极层之间的发光层，发光层由有机发光材料组成。OLED的发光原理为有机半导体材料和发光材料在电场的驱动下，通过载流子注入和复合导致发光的现象。示例性的，OLED通常采用ITO像素电极和金属电极作为分别作为器件的阳极层和阴极层，在一定的驱动电压下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子经过电子传输层到达发光层，空穴经过空穴传输层后也到达发光层，电子和空穴在发光层中相遇，形成激子并使发光分子激发，发光分子经过辐射弛豫而发出可见光。
Micro LED是将发光二极管(Light Emitting Diode，LED)结构设计进行薄膜化、微小化、阵列化，其尺寸仅在1～10μm等级左右，是一种广色域、高亮度、长寿命、 快响应、低功耗的自发光型显示技术。OLED和Micro LED都能够自发光，不同的是：OLED通过有机材料发光，而Micro LED通过无机材料发光。
驱动电路可以为低温多晶硅(Low Temperature Polysilicon，LTPS)、非晶硅(Amorphous Silicon，a-Si)、铟镓锌氧化物(Indium Gallium Zinc Oxide，IGZO)等。以LTPS驱动电路为例，如果直接在PI上制作LTPS，金属离子(铝、钡、钠等)在热工艺中可能会扩散到LTPS的有源区，通过缓冲层厚度或沉积条件可以改善多晶硅背面的质量，同时有利于降低热传导，减缓被激光加热的硅冷却速率，有利于硅的结晶。
在柔性基板上制作触控组件、驱动电路、OLED或Micro LED的工艺较为成熟，而且工艺变化较多，此处对详细流程不做赘述。
以显示组件为AMOLED为例，现有技术中，需要先在柔性基板上制作驱动电路和OLED以形成显示组件，然后对显示组件进行薄膜封装，进一步在薄膜之上叠加制作触控组件，这样，导致工序较长。
与现有技术不同的是，本申请中将驱动电路和触控组件制作在同一柔性基板的不同位置，一种方式中，在制作驱动电路的同时完成触控组件的制作，OLED在驱动电路的基础上进一步完成；另一种方式中，先制作驱动电路，然后在驱动电路的基础上进一步制作OLED，并且在OLED的制作阶段同时进行触控组件的制作。相比于现有技术节省了单独制作触控组件的工序和相应的制造成本，并且节省了触控组件和显示组件的电连接工序。
由于有机材料易于水氧反应，因此，使用OLED的柔性显示装置对封装要求非常高，本实施例中，在柔性基板完成触控组件和显示组件的制作之后，进行TFE。图6为薄膜封装之后触控显示面板的截面图，如图6所示，柔性基板包括PI层、GLUE层和PET层。缓冲层位于PI层之上，触控组件和显示组件位于缓冲层的上表面的不同位置上，显示组件包括OLED和驱动电路，其中，驱动电路位于缓冲层的上表面，OLED位于驱动电路的上表面。TFE层形成于触控显示面板折叠之前的上表面，即TFE层整体覆盖在触控组件、显示组件以及柔性基板(或缓冲层)之上，能够隔绝水氧进入显示组件和触控组件，对触控显示面板起到保护作用。
本申请还提供一种柔性显示装置，包括上述任一所述的触控显示面板，以及偏光片POL和盖板。其中，POL设置在触控显示面板的上表面，盖板设置在POL的上方，POL是为了防止外界光反射出触控显示面板，盖板与POL可以通过OCA粘贴，盖板可以采用玻璃或者其他透明材料，盖板主要对触控显示面板起保护作用。
可选的，该柔性显示装置还包括泡棉和铜箔。泡棉位于触控显示面板的下表面，铜箔位于泡棉下表面设置有，泡棉主要对柔性显示装置起到保护作用，铜箔具有以下作用：防止电磁屏蔽，防止设备的其他电磁信号和显示触控信号之间的干扰；散热，能够快速的将触控显示面板的局部高温温度传递到整面；缓冲保护，防止设备的壳体对触控显示面板背部的挤压、冲击等破坏；接地，作为显示、触控、壳体的接地电极。
图7为一种柔性显示装置的A-A’截面的示意图，图8为图7所示的柔性显示装置的B-B’截面的示意图，参照图7和图8，该柔性显示装置从下到上依次包括：铜箔、泡棉、触控显示面板、POL和盖板，其中，本实施例中触控显示面板可以采用图2和 图4所示的触控显示面板折叠形成，需要两次折叠才能形成图7和图8所示柔性显示装置。
需要明确的是，图7和图8所示触控显示面板中，触控显示面板只包括接收极Rx、发射极Tx、显示组件和TFE层，柔性基板未标示出，但是并不表示触控显示面板不包括柔性基板，触控显示面板在折叠时，接收极Rx和发射极Tx与柔性基板一起被折叠上去，可以认为柔性基板与接收极Rx、发射极Tx和显示组件为一体。另外，图7和图8中，接收极Rx位于发射极Tx之上，这里只是举例说明，实际应用中接收极Rx也可以位于发射极Tx之下。
图9为另一种柔性显示装置的A-A’截面的示意图，图10为图9所示柔性显示装置的B-B’截面的示意图，参照图9和图10，该柔性显示装置从下到上依次包括：铜箔、泡棉、触控显示面板、POL和盖板，其中，本实施例中触控显示面板可以采用图5所示的触控显示面板折叠形成，需要一次折叠形成图9和图10所示的柔性显示装置。需要明确的是，图9所示触控显示面板中，接收极Rx可以位于发射极Tx之上，接收极Rx也可以位于发射极Tx之下。在弯折部位，显示组件和触控组件具有电连接。图9和图10所示柔性显示装置中也未标示出柔性基板。
柔性显示装置需要与终端设备中的其他电路连接，具体的，将柔性显示装置的触控显示面板与外部电路连接，一种实现方式中，触控显示面板与外部电路通过柔板上芯片电连接(Chip on film，或，Chip On Film，简称COF)方式连接，另一种方式中，触控显示面板与外部电路通过塑料基板上芯片电连接(Chip on plastic，或，Chip On Panel，简称COP)方式连接。
COF也称为覆晶薄膜)，一般是指采用Au-Sn共晶热压技术或者异方性导电胶膜(Anisotropic Conductive Film，ACF)热压技术将芯片固定于柔性线路板上的晶粒软膜构装技术，是运用软质附加电路板(可称为COF连接体)作封装芯片载体将芯片与软性基板电路接合的技术。
COP也称为覆晶柔性面板，一般采用Au-Sn共晶热压技术或者ACF热压技术将芯片固定于柔性面板上晶粒的面板构装技术，是运用柔性面板(可称为COP连接体)作封装芯片载体将芯片与柔性面板电路接合的技术。
图11为触控显示面板与外部电路通过COF方式连接的示意图，如图11所示，触控显示面板和FPC通过COF连接体进行连接，COF连接体为软性材料制成，可以弯折至触控显示面板的背部，COF连接体和触控显示面板可以通过热压工艺连接在一起。可选的，触控显示面板与COF连接体的连接部位开设有通孔，该通孔可用于安装摄像头或者各种感应器。本申请并不对通孔的形状进行限定，如图11所示，该通孔位于触控显示面板的一侧为半圆形，该通孔位于COF连接体一侧的形状为梯形，该通孔的形状可以随摄像头或感应器的形状相对应。触控显示面板通常只有一条边与COF连接体连接，该通孔也可以设置在触控显示面板不与COF连接体连接的其他边上，例如，该通孔设置在触控显示面板与COF连接体相对的一条边上，本实施例不对此进行限制。
图12为触控显示面板与外部电路通过COP方式连接的示意图，如图12所示，该方式中需要将触控显示面板延长，即将触控显示面板中的信号线(包括触控组件和显示组件的信号线)做成集中的裸露的COP连接体，然后，通过热压工艺将FPC绑定 在COP连接体上，实现电路整合和简化，大幅度减少出现数量。可选的，触控显示面板与COP连接体的连接部位开设有通孔，该通孔可用于安装摄像头或者各种感应器。本申请并不对通孔的形状进行限定，如图12所示，该通孔位于触控显示面板的一侧为半圆形，该通孔位于COP连接体一侧的形状为梯形，该通孔的形状可以随摄像头或感应器的形状相对应。触控显示面板通常只有一条边与COP连接体连接，该通孔也可以设置在触控显示面板不与COP连接体连接的其他边上，本实施例不对此进行限制。
本实施例的方法，通过将显示组件的信号线和触控组件的信号线集中出线，只需要将触控显示面板整体与外部电路进行一次COF连接或COP连接，可以减少显示组件、触控组件与外部电路的连接工序，并节省相应的电连接耗材。
本实施例提供的柔性显示装置，包括：触控显示面板、偏光片和盖板，触控显示面板包括柔性基板、显示组件、触控组件和TFE层，其中，触控组件和显示组件分别位于柔性基板的上表面的不同位置，TFE层形成于触控组件、显示组件和柔性基板的上表面，触控组件通过折叠的方式形成于显示组件的上方，偏光片位于触控显示面板的上表面，盖板位于偏光片的上方。通过利用柔性基板可弯曲的特性，将显示组件和触控组件制作在同一块柔性基板的不同位置上，通过折叠方式形成一体化的触控显示面板，从而节省了单独制作触控组件的工序和相应的制造成本，并且触控组件和显示组件通过内部电路互联，省去了组装环节触控组件和显示组件电连接工序，从而缩短了制作工序，并且降低了柔性显示装置的成本。
本申请还提供一种触控显示面板的制作方法，本实施例提供的触控显示面板的制作方法可以用于制作上述的触控显示面板。图13为一种触控显示面板的制作方法的流程图，如图13所示，该触控显示面板的制作方法包括以下步骤：
步骤S101、在柔性基板的不同位置上制作显示组件和触控组件。
该柔性基板可能包括缓冲层，如果柔性基板不包括缓冲层，可选的，可以在柔性基板上先沉积缓冲层，再制作显示组件和触控组件。具体的制作工序可能随柔性基板的不同而有所不同。例如，当柔性基板包括PI层、GULE层和PET层时，在柔性基板的不同位置上制作显示组件和触控组件，包括：
第一步、在布有PI的玻璃板上沉积缓冲层。
可以通过例如化学气相沉积(Chemical Vapor Deposition，CVD)的方式在PI上沉积缓冲层。之所以需要使用玻璃是因为玻璃平面度高，可以得到准确的曝光尺寸，同时玻璃有一定强度，自动流水便捷。
第二步、在缓冲层的不同位置上制作显示组件和触控组件。
这是因为PI耐高温等诸多优良特性PET不具备，因此不能直接在柔性基板上直接制作触控组件和显示组件的驱动电路。目前通用的做法是将PI涂布在玻璃板上，然后在PI上制作显示组件的驱动电路、OLED或Micro LED，以及触控组件，该制作过程中有高于400度的高温工序。
显示组件包括驱动电路、OLED或Micro LED，以OLED为例，在制作显示组件和触控组件时，一种方式中，在制作驱动电路的同时完成触控组件的制作，OLED在驱动电路的基础上进一步完成。另一种方式中，先制作驱动电路，然后在驱动电路的基础上进一步制作OLED，并且在OLED的制作阶段同时进行触控组件的制作。相比 于现有技术节省了单独制作触控组件的工序和相应的制造成本，并且节省了触控组件和显示组件的电连接工序。
其中，触控组件包括接收极Rx和发射极Tx，接收极Rx和发射极Tx的制作顺序不做限制。在制作过程中，一种方式中，在柔性基板的上表面的同一位置上制作接收极Rx和发射极Tx，其中，接收极Rx和发射极Tx层叠设置。另一种方式中，在柔性基板的上表面的不同位置上制作接收极Rx和发射极Tx。可选的，接收极Rx和发射极Tx位于显示组件的两侧，或者，接收极Rx和发射极Tx并排位于显示组件的一侧。
第三步、进行TFE，并将PI及PI上的层叠转移至PET之上，形成触控显示组件。
TFE层整体覆盖在触控组件、显示组件和柔性基板(或缓冲层)上。转移过程中将玻璃板抽离，PI和PET之间通过胶水或其他粘结剂进行粘接，本步骤形成的触控显示组件需要切割为触控显示面板。
步骤S102、对柔性基板、显示组件和触控组件进行薄膜封装，形成触控显示组件。
步骤S103、将触控显示组件切割为最小的可折叠单元。
该可折叠单元即触控显示面板折叠之前的结构。
步骤S104、将可折叠单元中的触控组件和显示组件进行折叠后层叠在一起，以形成触控显示面板。
当接收极Rx和发射极Tx位于柔性基板的上表面的不同位置时，将可折叠单元中的触控组件和显示组件进行折叠后层叠在一起，以形成触控显示面板，具体为：将接收极Rx和发射极Tx分别折叠至显示组件的上方，总共需要两次折叠。
当接收极Rx和发射极Tx位于柔性基板的上表面的同一位置时，将可折叠单元中的触控组件和显示组件进行折叠后层叠在一起，以形成触控显示面板，具体为：将接收极Rx和发射极Tx一起折叠至显示组件的上方，总共需要一次折叠。
本实施例的方法可用于制作上述实施例中提供的触控显示面板，本实施例的方法可以在柔性组件上同时制作触控组件和显示组件，相比于现有技术节省了单独制作触控组件的工序和相应的制造成本，并且节省了触控组件和显示组件的电连接工序。
本申请还提供一种柔性显示装置的制作方法，用于制作上述的柔性显示装置，图14为一种柔性显示装置的制作方法的流程图，如图14所示，本实施例提供的方法包括以下步骤：
步骤S201、在布有柔性PI的玻璃板上沉积缓冲层。
步骤S202、在缓冲层的不同位置上制作显示组件和触控组件。
步骤S203、进行TFE，并将PI及PI上的层叠转移至PET之上，形成触控显示组件。
步骤S201-S203的具体实现方式参照图13所示实施例的描述，这里不再赘述。
步骤S204、将触控显示组件切割为最小的可折叠单元。
该最小可折叠单元可以如图6所示。
步骤S205、将可折叠单元中的触控组件和显示组件进行折叠后层叠在一起，以形成触控显示面板。
触控组件和显示组件之间通过OCA粘接，触控组件的接收极Rx和发射极Tx之间也通过OCA粘接。
步骤S206、在触控显示面板的上表面装贴偏光片。
步骤S207、将触控显示面板与IC芯片以及PCB电连接。
可以通过CPF和COP的方式连接，具体连接方式参照上述实施例的描述，这里不再赘述。
步骤S208、将盖板与偏光片粘接。
步骤S209、将泡棉装贴在触控显示面板的下方，将铜箔装贴在泡棉下方。
显然，本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请实施例的这些修改和变型属于本申请权利要求书及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (17)

  1. 一种触控显示面板，其特征在于，包括：
    柔性基板、显示组件、触控组件和薄膜封装层；
    其中，所述触控组件和所述显示组件位于所述柔性基板的上表面的不同位置，通过折叠的方式，将所述触控组件和所述显示组件层叠在一起，以形成所述触控显示面板，所述薄膜封装层形成于所述触控组件、所述显示组件和所述柔性基板的上表面。
  2. 根据权利要求1所述的面板，其特征在于，所述触控组件包括接收极和发射极，所述接收极和所述发射极位于所述柔性基板的上表面的不同位置，所述接收极和所述发射极分别折叠至所述显示组件的上方。
  3. 根据权利要求2所述的面板，其特征在于，所述接收极、所述发射极和所述显示组件呈层叠状，所述接收极、所述发射极和所述显示组件中相邻两层之间通过光学透明胶粘结。
  4. 根据权利要求2或3所述的面板，其特征在于，所述接收极和所述发射极位于所述显示组件的两侧。
  5. 根据权利要求2或3所述的面板，其特征在于，所述接收极和所述发射极并排位于所述显示组件的一侧。
  6. 根据权利要求1所述的面板，其特征在于，所述触控组件包括接收极和发射极，所述接收极和所述发射极形成在所述柔性基板的表面的同一位置，所述接收级和所述发射极层叠设置，所述接收极和所述发射极一起折叠至所述显示组件的上方。
  7. 根据权利要求6所述的面板，其特征在于，所述接收极、所述发射极和所述显示组件中相邻两层之间通过光学透明胶粘接。
  8. 根据权利要求1-7任一项所述的面板，其特征在于，所述显示组件的信号线和所述触控组件的信号线集中出线后与外部电路电连接。
  9. 一种柔性显示装置，其特征在于，包括：偏光片、盖板、和如权利要求1-8任一项所述的触控显示面板；
    所述偏光片，设置在所述触控显示面板的上表面；
    所述盖板，设置在所述偏光片的上方。
  10. 根据权利要求9所述的装置，其特征在于，所述触控显示面板与所述外部电路通过柔板上芯片电连接COF方式连接，或者，所述触控显示面板与所述外部电路通过塑料基板上芯片电连接COP方式连接。
  11. 根据权利要求10所述的装置，其特征在于，所述触控显示面板与所述外部电路通过COF连接体连接，所述触控显示面板与所述COF连接体的连接部位开设有通孔；
    或者，所述触控显示面板与所述外部电路通过COP连接体连接，所述触控显示面板与所述COP连接体的连接部位开设有通孔。
  12. 根据权利要求9-11任一项所述的装置，其特征在于，还包括：泡棉和铜箔；
    所述泡棉位于所述触控显示面板的下表面；
    所述铜箔位于所述泡棉的下表面。
  13. 一种触显示面板的制作方法，其特征在于，包括：
    在柔性基板的上表面的不同位置上制作显示组件和触控组件；
    对所述柔性基板、所述显示组件和所述触控组件进行薄膜封装，形成触控显示组件；
    将所述触控显示组件切割为最小的可折叠单元；
    将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板。
  14. 根据权利要求13所述的方法，其特征在于，所述触控组件包括接收极和发射极，则在柔性基板的上表面的不同位置上制作显示组件和触控组件，包括：
    在所述柔性基板的上表面的不同位置上制作所述接收极、所述发射极和所述显示组件；
    所述将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板，包括：
    将所述接收极和所述发射极折叠至所述显示组件的上方。
  15. 根据权利要求14所述的方法，其特征在于，所述接收极和所述发射极位于所述显示组件的两侧。
  16. 根据权利要求14所述的方法，其特征在于，所述接收极和所述发射极并排位于所述显示组件的一侧。
  17. 根据权利要求13所述的方法，其特征在于，所述触控组件包括接收极和发射极，则在柔性基板的上表面的不同位置上制作显示组件和触控组件，包括：
    在所述柔性基板的上表面的第一位置制作所述接收极和所述发射极，在所述柔性基板的第二位置制作显示组件，其中，所述接收级和所述发射极层叠设置；
    所述将所述可折叠单元中的所述触控组件和所述显示组件进行折叠后层叠在一起，以形成触控显示面板，包括：
    将所述接收极和所述发射极一起折叠至所述显示组件的上方。
PCT/CN2017/112912 2017-11-24 2017-11-24 触控显示面板、柔性显示装置及其制作方法 WO2019100335A1 (zh)

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