WO2019087986A1 - Composition de résine époxy pour encapsulation et dispositif à composant électronique - Google Patents

Composition de résine époxy pour encapsulation et dispositif à composant électronique Download PDF

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Publication number
WO2019087986A1
WO2019087986A1 PCT/JP2018/039983 JP2018039983W WO2019087986A1 WO 2019087986 A1 WO2019087986 A1 WO 2019087986A1 JP 2018039983 W JP2018039983 W JP 2018039983W WO 2019087986 A1 WO2019087986 A1 WO 2019087986A1
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WIPO (PCT)
Prior art keywords
epoxy resin
acid amide
resin composition
inorganic filler
bis
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PCT/JP2018/039983
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English (en)
Japanese (ja)
Inventor
慧地 堀
東哲 姜
格 山浦
実佳 田中
拓也 児玉
健太 石橋
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日立化成株式会社
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Priority to JP2019550351A priority Critical patent/JP7226328B2/ja
Publication of WO2019087986A1 publication Critical patent/WO2019087986A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present invention relates to an epoxy resin composition for sealing and an electronic component device.
  • One aspect of the present invention aims to provide an epoxy resin composition for sealing having excellent fluidity, and an electronic component device including an element sealed using the same.
  • Means for solving the above problems include the following embodiments. ⁇ 1> (A) epoxy resin, (B) curing agent, (C) curing accelerator, (D) inorganic filler, and (E) fatty acid amide compound having 17 to 50 carbon atoms, and the (D) inorganic filler
  • the sealing epoxy resin composition whose content rate of material is over 80 volume% with respect to the composition whole quantity.
  • the sealing epoxy resin composition as described in ⁇ 2> whose content rate of the ⁇ 3> above-mentioned alumina is more than 80 volume% with respect to the composition whole quantity.
  • the (E) fatty acid amide compound having 17 to 50 carbon atoms includes oleic acid amide, stearic acid amide, erucic acid amide, ethylene bis oleic acid amide, hexamethylene bis oleic acid amide, dioleyl adipic acid amide, methylene Bis-erucic acid amide, ethylene-bis-erucic acid amide, hexamethylene-bis-erucic acid amide, m-xylene-bis-erucic acid amide, p-phenylene-bis-erucic acid amide, methylene bis-stearic acid amide, and ethylene bis lauric acid amide
  • the sealing epoxy resin composition according to any one of ⁇ 1> to ⁇ 4>, which contains at least one compound selected.
  • An electronic component device comprising: a ⁇ 6> element; and a cured product of the sealing epoxy resin composition according to any one of ⁇ 1> to ⁇ 5> for sealing the element.
  • an epoxy resin composition for sealing having excellent fluidity and an electronic component device including an element sealed using the same.
  • each component may contain a plurality of corresponding substances.
  • the content of each component means the total content of the plurality of substances present in the composition unless otherwise specified.
  • the epoxy resin composition for sealing of the present disclosure comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a fatty acid amide compound having 17 to 50 carbon atoms.
  • Including The content of the (D) inorganic filler is more than 80% by volume based on the total amount of the composition.
  • the epoxy resin composition for sealing excellent in fluidity is provided, and when the content of the (D) inorganic filler is more than 80% by volume, it tends to be excellent in thermal conductivity when it is made a cured product It is in.
  • the sealing epoxy resin composition of the present disclosure is used, for example, to seal an electronic component device.
  • epoxy resin composition of the present disclosure contains (A) an epoxy resin.
  • the type of the epoxy resin (A) is not particularly limited as long as it has an epoxy group in the molecule.
  • the epoxy resin is specifically selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcine, catechol, bisphenol A and bisphenol F and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • Novolak type epoxy resin epoxidized novolac resin obtained by condensation or cocondensation of at least one phenolic compound with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, Phenol novolac type epoxy resin, ortho cresol novolac type epoxy resin, etc.
  • Copolymer type epoxy resin which is obtained by epoxidizing a novolak resin obtained by cocondensation with an aldehyde compound under an acidic catalyst; diphenylmethane type epoxy resin which is a diglycidyl ether such as bisphenol A, bisphenol AD, bisphenol F; alkyl Biphenyl type epoxy resin which is diglycidyl ether of substituted or unsubstituted biphenol; stilbene type epoxy resin which is diglycidyl ether of stilbene type phenol compound Sulfur atom-containing epoxy resin which is a diglycidyl ether such as bisphenol S; epoxy resin which is a glycidyl ether of alcohols such as butanediol, polyethylene glycol, polypropylene glycol, etc .; many such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, dimer acid Ester type epoxy resin which is a glycidyl ester of a carboxylic acid compound;
  • the epoxy equivalent (molecular weight / epoxy group number) of the epoxy resin (A) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, electrical reliability, etc., it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.
  • the epoxy equivalent of the epoxy resin (A) is a value measured by a method according to JIS K 7236: 2009.
  • the epoxy resin (A) When the epoxy resin (A) is solid, its melting point or softening point is not particularly limited.
  • the temperature is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and more preferably 50 ° C. to 130 ° C. from the viewpoint of handleability in preparation of the epoxy resin composition.
  • the melting point of the epoxy resin (A) is a value measured by differential scanning calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a method (ring and ball method) according to JIS K 7234: 1986.
  • the content of the (A) epoxy resin in the epoxy resin composition is preferably 0.5% by mass to 30% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc., and is preferably 2% by mass to 20%.
  • the content is more preferably mass%, still more preferably 3 mass% to 15 mass%, and particularly preferably 5 mass% to 10 mass%.
  • the epoxy resin composition of the present disclosure contains (B) a curing agent.
  • the type of curing agent is not particularly limited, and can be selected according to the type of epoxy resin (A), the desired properties of the epoxy resin composition, and the like.
  • the curing agent (B) examples include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like. From the viewpoint of heat resistance improvement, the curing agent is preferably a phenol curing agent.
  • phenol curing agent examples include resorcin, catechol, bisphenol A, bisphenol F, phenol, cresol, xylenol, phenylphenol, aminophenol and other phenol compounds and ⁇ -naphthol, ⁇ -naphthol, dihydroxynaphthalene and other naphthol compounds.
  • Novolak-type phenolic resin obtained by condensation or co-condensation of at least one phenolic compound selected from the group consisting of: and aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde under acidic catalysis; Phenol aralkyl resin, naphthol aralkyl resin, etc. synthesized from a compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl etc.
  • aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde under acidic catalysis
  • Phenol aralkyl resin, naphthol aralkyl resin, etc. synthesized from a compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl etc.
  • Aralkyl type phenolic resin paraxylylene modified phenolic resin; metaxylylene modified phenolic resin; melamine modified phenolic resin; terpene modified phenolic resin; dicyclopentadiene type phenolic resin synthesized by copolymerization with the above phenolic compound and dicyclopentadiene Cyclopentadiene type naphthol resin; cyclopentadiene modified phenolic resin; polycyclic aromatic ring modified phenolic resin; biphenyl type phenolic resin and the like.
  • These phenol curing agents may be used alone or in combination of two or more.
  • the functional group equivalent (hydroxyl equivalent in the case of a phenol curing agent) of the curing agent (B) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, electrical reliability, etc., 70 g / eq to 1000 g / eq is preferable, and 80 g / eq to 500 g / eq is more preferable.
  • the hydroxyl equivalent of the phenol curing agent is a value measured by a method according to JIS K 0070: 1992.
  • the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability at the time of production of the epoxy resin composition, it is more preferably 50 ° C. to 130 ° C.
  • the melting point or softening point of the curing agent (B) is a value measured in the same manner as the melting point or softening point of the epoxy resin.
  • the equivalent ratio of (A) epoxy resin to (B) curing agent ie, the ratio of the number of functional groups in (B) curing agent to the number of functional groups in (A) epoxy resin (number of functional groups in (B) curing agent A)
  • the number of functional groups in the epoxy resin is not particularly limited. It is preferable to set in the range of 0.5 to 1.5, and more preferable to be set in the range of 0.6 to 1.3, from the viewpoint of reducing the amount of each unreacted component. It is more preferable to set in the range of ⁇ 1.2.
  • the epoxy resin composition of the present disclosure contains (C) a curing accelerator.
  • the kind in particular of a hardening accelerator is not restrict
  • curing accelerator (C) examples include 1,8-diaza-bicyclo (5,4,0) undecen-7, 1,5-diaza-bicyclo (4,3,0) nonene, 5,6- Tertiary amines such as dibutylamino-1,8-diaza-bicyclo (5,4,0) undecen-7, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and derivatives thereof Imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and derivatives thereof, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine and the like These phosphines are maleic anhydride, ben Phosphorus compounds having an intramolecular polarization formed by addition
  • the content of the (C) curing accelerator in the epoxy resin composition is not particularly limited as long as the curing promoting effect is obtained.
  • the content of the (C) curing accelerator in the epoxy resin composition is, for example, 0.1% by mass to 8.0% by mass with respect to the total amount of (A) epoxy resin and (B) curing agent. Is preferably 0.5% by mass to 5.0% by mass, more preferably 1.0% by mass to 4.0% by mass, and 1.0% by mass to 3.0% by mass. % Is particularly preferred.
  • the curing time tends to be shortened, and 8 If the amount is less than 0% by mass, the curing rate tends to be too fast to obtain a good molded product.
  • the epoxy resin composition of the present disclosure comprises (D) an inorganic filler.
  • (D) By containing an inorganic filler, when it is set as hardened
  • the epoxy resin composition of the present disclosure has a content of the (D) inorganic filler of more than 80% by volume based on the total amount of the composition. Thereby, the heat conductivity at the time of making an epoxy resin composition into a hardened
  • the epoxy resin composition of the present disclosure preferably has a content of the (D) inorganic filler of 81% by volume or more based on the total amount of the composition, 83 It is more preferable that it is volume% or more, and it is still more preferable that it is 84 volume% or more.
  • the epoxy resin composition of the present disclosure preferably has a content of (D) inorganic filler of 90 volume% or less and 87 volume% or less based on the total amount of the composition. Is more preferable, and 86% by volume or less is even more preferable.
  • the inorganic filler (D) preferably contains alumina from the viewpoint of enhancing the thermal conductivity when the epoxy resin composition is a cured product.
  • the epoxy resin composition of the present disclosure preferably contains 80% by volume or more of alumina, and 81% by volume or more of the total amount of the composition. Is more preferably 83% by volume or more, and particularly preferably 84% by volume or more.
  • the content of alumina is preferably 90% by volume or less, and more preferably 87% by volume or less, with respect to the total amount of the composition, in the epoxy resin composition of the present disclosure. More preferably, it is 86% by volume or less.
  • the content of alumina in the inorganic filler (D) is 70% by volume or more with respect to the total amount of the inorganic filler (D) from the viewpoint of enhancing the thermal conductivity when the epoxy resin composition is cured. Is more preferably 75% by volume or more, still more preferably 85% by volume or more, particularly preferably 90% by volume to 100% by volume, and 95% by volume to 100% by volume. Even more preferred.
  • the content of alumina in the (D) inorganic filler may be 97% by volume to 99.9% by volume, or 98.5% by volume to 99.5% by volume, relative to the total amount of the inorganic filler (D). It may be.
  • the inorganic filler (D) may contain an inorganic filler other than alumina.
  • the inorganic filler other than alumina includes at least one inorganic filler (specific inorganic filler) selected from the group consisting of silica, silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride Is preferred.
  • the inorganic filler may contain, as an inorganic filler other than alumina, other inorganic fillers other than the specific inorganic filler described above.
  • Other inorganic fillers include fused silica, crystalline silica, zircon, calcium silicate, calcium carbonate, potassium titanate, beryllia, zirconia, forsterite, steatite, spinel, mullite, titania, etc. Beads, single crystal fibers such as potassium titanate, glass fibers, aramid fibers, carbon fibers and the like.
  • fused silica is preferable from the viewpoint of reducing the linear expansion coefficient.
  • aluminum hydroxide, zinc borate, magnesium hydroxide and the like can be mentioned from the viewpoint of the flame retardant effect.
  • the other inorganic fillers may be used alone or in combination of two or more.
  • the content of the inorganic filler other than alumina in the (D) inorganic filler may be 30% by volume or less, or 15% by volume or less, with respect to the total amount of the inorganic filler (D), 10 volumes % Or less, 5% by volume or less, 0.1% by volume to 3% by volume, 0.5% by volume to 1.5% by volume or less .
  • the content of the inorganic filler (D) in the epoxy resin composition is 75% by mass to 97% by mass with respect to the total amount of the composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement and solder heat resistance. Is preferably 80% by mass to 95% by mass, and more preferably 85% by mass to 92% by mass.
  • the shape of the (D) inorganic filler is not particularly limited, and examples thereof include powder, sphere, and fiber. Among them, a spherical shape is preferable from the viewpoint of moldability and moldability of an epoxy resin composition.
  • the epoxy resin composition of the present disclosure includes (E) a fatty acid amide compound having 17 to 50 carbon atoms.
  • (E) The fluidity of the epoxy resin composition is improved by containing a fatty acid amide compound having 17 to 50 carbon atoms.
  • the improvement of the fluidity of the epoxy resin composition is caused by the improvement of the dispersibility of the (E) fatty acid amide compound having 17 to 50 carbon atoms such as (A) epoxy resin, (D) inorganic filler and the like. Be done. In more detail, it is guessed as follows.
  • the (D) inorganic filler is obtained by having (E) a fatty acid amide compound having 17 to 50 carbon atoms having a group having affinity to a resin component and (D) a group having excellent adsorptivity with the inorganic filler.
  • the group having excellent adsorptivity adsorbs to the (D) inorganic filler, and the wettability of the resin component and the (D) inorganic filler is improved by the action of the group having an affinity to the resin component.
  • the content of the (D) inorganic filler is increased to achieve high loading, the aggregation of the (D) inorganic filler is suppressed, and the dispersibility of the (D) inorganic filler is enhanced. It is considered that the fluidity of the epoxy resin composition is improved.
  • fatty acid amide compound having 17 to 50 carbon atoms include monoamides such as oleic acid amide, stearic acid amide and erucic acid amide, ethylene bis oleic acid amide, hexamethylene bis oleic acid amide, dioleyl adipic acid Amide, methylene biserucic acid amide, ethylene biserucic acid amide, hexamethylene biserucic acid amide, m-xylene biserucic acid amide, p-phenylene biserucic acid amide, methylene bisstearic acid amide, ethylene bis lauric acid amide, etc.
  • Bisamide is mentioned.
  • the fatty acid amide compounds having 17 to 50 carbon atoms may be used alone or in combination of two or more.
  • oleic acid amide, ethylene bis oleic acid amide and methylene bis stearic acid amide are preferable from the viewpoint of fluidity.
  • the decrease in compatibility with the epoxy resin (A) and the decrease in fluidity tend to be suppressed. Furthermore, there is a tendency to be able to suppress the mold dirt due to the fatty acid amide compound exuding from the epoxy resin composition at the time of molding and the adhesive strength reduction with the substrate.
  • carbon number in a fatty-acid amide compound points out carbon number of the hydrocarbon part in a compound, and shall not contain carbon number of an amide group.
  • hydrogen of the hydrocarbon moiety may be substituted with another functional group. When the hydrogen of the hydrocarbon moiety is substituted by another functional group and the substituent has a carbon atom, the number of carbon atoms of the substituent is not included in the number of carbon atoms in the fatty acid amide compound.
  • the (E) fatty acid amide compound having 17 to 50 carbon atoms may be an unsaturated fatty acid amide having a double bond or a saturated fatty acid amide having no double bond.
  • the fatty acid amide compound having 17 to 50 carbon atoms may or may not have an aromatic ring in the molecule.
  • the content of the (E) fatty acid amide compound having 17 to 50 carbon atoms in the epoxy resin composition is not particularly limited.
  • 0.005% by mass to 1.0% by mass with respect to the total amount of the composition % May be 0.01% by mass to 1.0% by mass, may be 0.02% by mass to 1.0% by mass, or 0.1% by mass to 0.8 It may be mass%, and may be 0.3 mass% to 0.7 mass%.
  • the content of the fatty acid amide compound having 17 to 50 carbon atoms in the epoxy resin composition may be 0.5 mass% or less and 0.4 mass% or less based on the total amount of the composition. It may be 0.3 mass% or less.
  • the epoxy resin composition may contain a fatty acid amide compound having 16 or less carbon atoms, or may contain a fatty acid amide compound having 51 or more carbon atoms, as long as the effects of the present invention are exhibited.
  • the epoxy resin composition of the present disclosure is not limited to the above-mentioned (A) epoxy resin, (B) curing agent, (C) curing accelerator, (D) inorganic filler and (E) fatty acid amide compound having 17 to 50 carbon atoms.
  • the other components are not particularly limited as long as the effects of the present invention are exhibited, and they are release agents such as paraffin, fatty acid ester and fatty acid metal salt; coupling agents such as silane coupling agent and titanate coupling agent; Flame retardants such as epoxy resins and phosphorus compounds; flame retardant aids such as antimony trioxide and antimony tetraoxide; colorants such as carbon black and iron oxide; stress relaxation agents such as silicone oil, silicone rubber and synthetic rubber; Various additives such as inhibitors may be mentioned.
  • the preparation method of the epoxy resin composition is not particularly limited.
  • a general method there is a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled, and crushed. More specifically, for example, a method of stirring and mixing predetermined amounts of the above-mentioned components, kneading with a kneader, roll, extruder or the like which has been heated to 70 ° C. to 140 ° C. in advance, cooling and grinding be able to.
  • the electronic component device of the present disclosure includes a device and a cured product of the above-described sealing epoxy resin composition for sealing the device.
  • a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, an organic substrate or the like, an element (an active element such as a semiconductor chip, a transistor, a diode or a thyristor, a capacitor, a resistor , An element part obtained by mounting a passive element such as a coil, etc. is sealed with an epoxy resin composition.
  • the element is fixed on a lead frame, and the terminal portion and the lead portion of the element such as a bonding pad are connected by wire bonding, bumps or the like, and then sealed by transfer molding using an epoxy resin composition.
  • Inlined Package DIP
  • Plastic Leaded Chip Carrier PLCC
  • Quad Flat Package QFP
  • Small Outline Package SOP
  • Small Outline J-lead package SOJ
  • Thin Small Outline Package TSOP
  • General resin-sealed IC Integrated Circuit
  • TQFP Thin Small Outline Package
  • tape TCP Tape Carrier Package having a structure in which an element connected to a carrier by bumps is sealed with an epoxy resin composition
  • an epoxy resin composition can be used suitably also in a printed wiring board.
  • a low pressure transfer molding method As a method of sealing an electronic component device using an epoxy resin composition, a low pressure transfer molding method, an injection molding method, a compression molding method and the like can be mentioned. Among these, low pressure transfer molding is common.
  • A Epoxy resin / biphenyl type epoxy resin, Mitsubishi Chemical Corporation, product name "YL6121HA” ⁇ Bisphenol F type epoxy resin, Nippon Steel & Sumikin Chemical Co., Ltd., product name "YDF-8170C”
  • B Hardening agent ⁇ Aralkyl phenol resin, Air Water Co., Ltd., product name "HE 910-09”
  • C curing accelerator / phosphorus curing accelerator
  • D inorganic filler / fused silica (silica particles having a volume average particle diameter of 15 nm) ⁇
  • Alumina 1 alumina particles having a volume average particle size of 10.4 ⁇ m
  • Alumina 2 alumina particles having a volume average particle diameter of 2.0 ⁇ m
  • Alumina 3 alumina particles having a volume average particle size of 0.40 ⁇ m
  • E Fatty acid amide compound having 17 to 50 carbon atoms ⁇ Ethylene bis oleic acid amide (unsaturated fatty acid amide having 36
  • curing material was able to be manufactured suitably with the epoxy resin composition in which kneading
  • the thermal conductivity of the epoxy resin composition was evaluated as follows. First, an epoxy resin composition for measurement of thermal conductivity was molded using the prepared epoxy resin composition. Molding of the epoxy resin composition for measurement of thermal conductivity was performed using a vacuum hand press molding machine under conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 10 minutes. The thermal diffusivity of the thickness direction of the hardened
  • the epoxy resin compositions of Examples 1 and 2 were superior to the epoxy resin composition of Comparative Example 1 in thermal conductivity after curing. Furthermore, in Examples 1 and 2, kneading was possible even when alumina was highly filled, and it was possible to produce a sealing epoxy resin composition having excellent fluidity. On the other hand, in Comparative Examples 2 and 3, when alumina was highly filled, it was not possible to knead well and an epoxy resin composition for sealing could not be produced.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne une composition de résine époxy pour encapsulation qui comprend (A) une résine époxy, (B) un agent de durcissement, (C) un accélérateur de durcissement, (D) une charge inorganique, et (E) un composé amide d'acide gras ayant 17 à 50 atomes de carbone, (D) la charge inorganique étant contenue dans une quantité dépassant 80 % en volume par rapport à la composition totale.
PCT/JP2018/039983 2017-10-30 2018-10-26 Composition de résine époxy pour encapsulation et dispositif à composant électronique WO2019087986A1 (fr)

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