WO2019043810A1 - 粘着テープ - Google Patents

粘着テープ Download PDF

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Publication number
WO2019043810A1
WO2019043810A1 PCT/JP2017/031062 JP2017031062W WO2019043810A1 WO 2019043810 A1 WO2019043810 A1 WO 2019043810A1 JP 2017031062 W JP2017031062 W JP 2017031062W WO 2019043810 A1 WO2019043810 A1 WO 2019043810A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive tape
compressive strength
foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/031062
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
一誠 坪内
靖史 土屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teraoka Seisakusho Co Ltd
Original Assignee
Teraoka Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teraoka Seisakusho Co Ltd filed Critical Teraoka Seisakusho Co Ltd
Priority to US16/642,623 priority Critical patent/US11286406B2/en
Priority to KR1020207006843A priority patent/KR102422209B1/ko
Priority to PCT/JP2017/031062 priority patent/WO2019043810A1/ja
Priority to JP2019538808A priority patent/JPWO2019043810A1/ja
Priority to CN201780094506.5A priority patent/CN111032808B/zh
Priority to EP17922988.5A priority patent/EP3680305B1/en
Priority to TW107129133A priority patent/TWI789417B/zh
Publication of WO2019043810A1 publication Critical patent/WO2019043810A1/ja
Anticipated expiration legal-status Critical
Priority to JP2022199112A priority patent/JP7565330B2/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/36—After-treatment
    • C08J9/365—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00—Foams characterised by their properties
    • C08J2205/04—Foams characterised by their properties characterised by the foam pores
    • C08J2205/052—Closed cells, i.e. more than 50% of the pores are closed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present invention relates to a pressure-sensitive adhesive tape excellent in flexibility at high compression, such as impact resistance and stability when greatly deformed.
  • Portable electronic devices such as smartphones and tablet terminals generally have a structure in which a touch panel and a housing for housing a liquid crystal module are combined. And, for example, an adhesive tape is used to fix the touch panel and the housing. Further, in electronic devices such as in-vehicle display devices and TVs, adhesive tapes are used to fix a liquid crystal display (LCD) panel or an organic EL panel and a housing.
  • LCD liquid crystal display
  • the adhesive tape may be largely deformed in the thickness direction, breakage may occur between the layers due to internal stress or external stress, and the device may be broken. Furthermore, when pasting to a case, it is inferior to dimensional stability, and becomes the cause of generating twist. On the other hand, if the substrate is too hard, the tape can not follow the curved adherend, peeling of the adhesive tape may occur, and the device may be damaged.
  • Patent Document 1 describes a waterproof double-sided tape having a pressure-sensitive adhesive layer on at least one surface of a foam substrate.
  • the foam base is preferably a polyolefin foam, and among them, a polyethylene foam, and the interlayer strength is preferably 6 to 50 N / cm, and the 25% compressive strength is preferably 30 to 500 kPa.
  • Patent Document 2 describes a pressure-sensitive adhesive sheet which has a pressure-sensitive adhesive layer on one side or both sides of a foam base and which is used for fixing a housing and parts at the time of manufacturing an electronic device.
  • the foam base is preferably a polyolefin foam, in particular a polyethylene foam, and the interlayer strength is preferably 20 N / cm or more, and the 25% compressive strength is preferably 80 kPa or more.
  • Patent Document 3 describes an impact resistant double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on both sides of a foam substrate.
  • the foam base material is preferably a polyolefin foam, particularly a polyethylene foam, and the 25% compressive strength in the thickness direction is 380 kPa or less, and the interlayer strength is preferably 400 mJ / cm 2 (39 N / cm) or more. It is done.
  • Patent Document 4 describes a pressure-sensitive adhesive tape that has a pressure-sensitive adhesive layer on at least one surface of a foam base and is used for fixing components such as portable electronic devices.
  • the foam base is preferably a polyolefin foam, in particular a polyethylene foam, and the interlayer strength is preferably 20 N / cm or more, and the 25% compressive strength is preferably 80 kPa or more.
  • Patent Document 5 describes a pressure-sensitive adhesive tape that has a pressure-sensitive adhesive layer on at least one surface of a foam base and is used for fixing components such as portable electronic devices.
  • the foam base is preferably a polyolefin foam, in particular a polyethylene foam, and the 25% compressive strength is preferably 160 kPa or more, and the interlayer strength is preferably 13 N / cm or more.
  • Patent Document 6 describes a pressure-sensitive adhesive tape which has a pressure-sensitive adhesive layer on at least one surface of a foam substrate and is used for fixing parts of portable electronic devices and the like.
  • the foam base is preferably a polyolefin foam, in particular a polyethylene foam, and the 25% compressive strength is preferably 250 kPa or more, and the interlayer strength is preferably 25 N / cm or more.
  • Patent Document 7 describes a pressure-sensitive adhesive tape that has a pressure-sensitive adhesive layer on both sides of a foam substrate and is used for fixing an organic EL display or the like.
  • the foam base is preferably a polyolefin foam, particularly a polyethylene foam, and the interlayer strength is 10-18 N / cm, and the 25% compressive strength is preferably 30 kPa or more.
  • Patent Document 8 describes a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on at least one surface of a foam substrate and used for fixing a protective panel of a screen display unit or an image display module.
  • the foam base is preferably a polyolefin foam, particularly a polyethylene foam, and the interlayer strength is 6 to 50 N / cm, and the 25% compressive strength is preferably 30 kPa or more.
  • Patent Document 9 describes a pressure-sensitive adhesive tape that has a pressure-sensitive adhesive layer on both sides of a foam substrate and is used for fixing parts of electronic devices and the like.
  • the foam substrate is preferably a polyolefin foam, particularly a polyethylene foam, and it is described that the interlayer strength is 10 to 50 N / cm, and the 25% compressive strength is preferably 10 to 500 kPa.
  • the foam substrates of Patent Documents 1 to 9 are formed of a relatively hard foam, the compressive strength at high compression is too high, that is, the flexibility at high compression is poor, for example, impact resistance It is considered that the performance such as stability when greatly deformed is inferior.
  • Patent Document 10 describes a polyolefin resin foam sheet used as a heat insulating material of an electronic device and a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on at least one surface of the sheet.
  • the polyolefin-based foam sheet is preferably a polyethylene-based resin, and is described as having a 50% compression strength of 120 kPa or less and preferably having 70 to 100% of closed cells.
  • the foamed sheet of Patent Document 10 has a low 50% compression strength, the compression strength at a compression ratio higher than that is unknown. Therefore, the flexibility at the time of high compression is unknown, and it is considered that, for example, the performance such as impact resistance and stability at the time of large deformation may be inferior.
  • an object of the present invention is to provide a pressure-sensitive adhesive tape excellent in flexibility at high compression, for example, excellent in performance such as impact resistance and stability at the time of large deformation.
  • the present invention is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on one side or both sides of a polyolefin foam substrate containing closed cells, wherein 65% compressive strength measured by compressive strength measurement according to JIS K 7181 is 4 A pressure-sensitive adhesive tape having an 80% compressive strength of 20 MPa or less.
  • the identification by the compressive strength at high compression of the pressure-sensitive adhesive tape having a foam substrate is very suitable as an index for evaluating the followability to a curved adherend.
  • the pressure-sensitive adhesive tape having a foam base has a property that, when compressed at the time of bonding, the compressive strength rapidly rises from a certain point at which the air bubbles in the foam are completely crushed and becomes hard. The hardened adhesive tape can not follow the adherend sufficiently when the adherend is curved.
  • the present inventors pay attention to this point, and by setting the compressive strength at high compression to the above-mentioned specific range, by suppressing the rapid rise of the compressive strength, for example, the impact resistance, the stability when greatly deformed ( It has become possible to provide a pressure-sensitive adhesive tape excellent in the ability to follow curved adherends, etc.).
  • 7 is a graph showing a master curve in measurement of compressive strength in Examples 1 to 3 and Comparative Example 1. It is a schematic diagram for demonstrating the evaluation method of the 10 surface drop impact test of an Example and a comparative example. It is a schematic diagram for demonstrating the evaluation method of the electrostatic resistance test of an Example. It is a graph which shows the master curve in measurement of compression intensity of Example 4 and comparative example 2.
  • the foam base used in the present invention is a base made of a foam of a polyolefin resin composition.
  • the polyolefin resin composition preferably contains an ethylene-vinyl acetate copolymer and another polyolefin resin.
  • Ethylene-vinyl acetate copolymers exhibit high rubber elasticity compared to linear low density polyethylene. Therefore, if an appropriate amount of ethylene-vinyl acetate copolymer is compounded in the polyolefin resin composition, it is suitable for the use of the substrate of the adhesive tape even if the cell diameter of the closed cells in the foam substrate is reduced. Tend to maintain the rubber elasticity.
  • the cell diameter can be reduced, and the adjustment of the compressive strength and the interlaminar strength at high compression can be facilitated.
  • a polyethylene resin a polypropylene resin, or these mixtures are mentioned, for example.
  • linear low density polyethylene (LLDPE) and ethylene propylene rubber (EPDM) are more preferable.
  • the polyolefin resin composition can be produced by a known method.
  • the resin composition containing an ethylene-vinyl acetate copolymer and any other polyolefin resin can be obtained by irradiating an electron beam to crosslink the resin composition. It may be foamed simultaneously with or separately from the crosslinking.
  • the polyolefin resin composition may contain other additives as long as the effects of the present invention are not impaired.
  • specific examples thereof include an extender, a crosslinking agent, an antioxidant, a stabilizer, and a coupling agent.
  • it may contain a light shielding filler and a pigment.
  • Specific examples of the light shielding filler include carbon black, carbon nanotubes, and black inorganic fillers.
  • Specific examples of the pigment include carbon black, aniline black, acetylene black and ketjen black.
  • the polyolefin based foam substrate comprises closed cells. Therefore, the adhesive tape of the present invention is also excellent in waterproofness and dust resistance.
  • the average cell diameter of the closed cells is preferably 0.04 to 0.45 mm, more preferably 0.10 to 0.35 mm.
  • the density of the foam substrate is preferably 50 to 300 kg / m 3 , more preferably 80 to 200 kg / m 3 .
  • a foam substrate having such an average cell diameter and density is a substrate containing a relatively large number of relatively small closed cells.
  • the expansion ratio of the foam constituting the polyolefin foam substrate is preferably 2.0 to 15 times, more preferably 4.0 to 12 times.
  • the thickness of the polyolefin foam substrate is preferably 0.06 to 2.0 mm, more preferably 0.1 to 1.8 mm.
  • the interlayer strength of the polyolefin foam substrate is preferably 7 N / cm or more, more preferably 8 to 17 N / cm.
  • Interlayer strength is an indicator that represents the strength of the foam substrate. The specific measuring method of interlayer strength is described in the column of the Example.
  • the tensile modulus of the foam substrate is preferably 70 ⁇ 500N / mm 2, more preferably 100 ⁇ 450N / mm 2.
  • the specific measuring method of a tensile elasticity modulus is described in the column of an Example.
  • the bending moment (bending stiffness) in the MD direction and TD direction of the substrate is preferably 1 to 35 gf / cm, more preferably 2 to 30 gf / cm.
  • the specific measuring method of a bending moment is described in the column of an Example.
  • the foam substrate should have no support film.
  • the support film is a film for compensating for the defect that it is easily stretched when handling a soft foam.
  • a film support foam in which a foam and a support film are integrally formed is known as a commercial product.
  • the pressure-sensitive adhesive layer used in the present invention is not particularly limited.
  • an adhesive composition which comprises an adhesive layer well-known various adhesive compositions, such as an acryl type, a rubber type, silicone type, a urethane type, can be used, for example.
  • an acrylic pressure-sensitive adhesive composition containing a (meth) acrylic acid ester copolymer is preferable from the viewpoint of impact resistance, adhesive strength, waterproofness and the like.
  • the pressure-sensitive adhesive layer preferably does not contain a tackifying resin. When the tackifying resin is contained, the pressure-sensitive adhesive may be softened to reduce the impact resistance and the adhesiveness.
  • the components of the acrylic pressure-sensitive adhesive composition are not particularly limited, but 10 to 20% by mass of a (meth) acrylic acid alkyl ester (A1) having an alkyl group having 1 to 3 carbon atoms, a carbon atom 50 to 80 mass% of (meth) acrylic acid alkyl ester (A2) having an alkyl group of 4 to 12, 10 to 15 mass% of carboxyl group-containing monomer (A3), and 0.01 to 0 group of hydroxyl group-containing monomer (A4)
  • the resin component is preferably an acrylic copolymer (A) containing 5% by mass and 1 to 5% by mass of vinyl acetate (A5) as a component of the polymer chain.
  • a crosslinking agent capable of reacting with the carboxyl group and / or hydroxyl group of the acrylic copolymer (A) may be blended to form a crosslinked structure with the acrylic copolymer (A).
  • a silane coupling agent or an antioxidant may be blended.
  • the thickness of the pressure-sensitive adhesive layer is preferably 5 to 125 ⁇ m, more preferably 10 to 80 ⁇ m.
  • the pressure-sensitive adhesive layer can be formed, for example, by crosslinking the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition can be coated on a substrate and crosslinked by heating to form a pressure-sensitive adhesive layer on a foam substrate.
  • the pressure-sensitive adhesive composition can be coated on a release paper or other film, and crosslinked by heating to form a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer can be bonded to one side or both sides of a foam substrate.
  • a coating apparatus such as a roll coater, a die coater, or a lip coater can be used.
  • the solvent in the pressure-sensitive adhesive composition can be removed together with the crosslinking reaction by heating.
  • the pressure-sensitive adhesive tape of the present invention has a pressure-sensitive adhesive layer on one side or both sides of a polyolefin foam substrate.
  • the pressure-sensitive adhesive layer may be formed only on one side of the substrate, but is preferably formed on both sides to form a double-sided pressure-sensitive adhesive tape.
  • the thickness of the pressure-sensitive adhesive tape of the present invention is preferably 0.2 to 2.0 mm, more preferably 0.3 to 2.0 mm.
  • the width of the adhesive tape is preferably 0.8 to 10 mm, more preferably 1 to 5 mm.
  • the pressure-sensitive adhesive tape of the present invention has a 65% compressive strength of 6.0 MPa or less (preferably 0.09 to 5.5 MPa, more preferably 0.15 to 5.0 MPa) as measured by compressive strength measurement according to JIS K 7181. And 80% compressive strength is 20 MPa or less (preferably 0.5 to 17 MPa, more preferably 0.7 to 14 MPa). In addition, 70% compressive strength, which is similarly measured, is preferably 7.0 MPa or less (more preferably 0.3 to 6.5 MPa), and 75% compressive strength is preferably 9.5 MPa or less (more preferably 0. 4 to 9.0 MPa).
  • the pressure-sensitive adhesive tape of the present invention having such compressive strength is excellent in performance such as impact resistance and stability when it is greatly deformed, because a rapid rise in compressive strength is suppressed.
  • the 65% compressive strength of the pressure-sensitive adhesive tape is 6.0 MPa or less (preferably 0.15 to 5.5 MPa, more preferably Is 0.3 to 5.0 MPa), and 80% compression strength is 20 MPa or less (preferably 2.0 to 17 MPa, more preferably 3.0 to 14 MPa).
  • 70% compressive strength is preferably 7.0 MPa or less (more preferably 0.8 to 6.5 MPa), and 75% compressive strength is preferably 9.5 MPa or less (more preferably 1.0 to 9.0 MPa) ).
  • the 65% compressive strength of the pressure-sensitive adhesive tape is preferably 0.5 MPa or less (more preferably 0.09 to 0.4 MPa) Or less, particularly preferably 0.15 to 0.35 MPa), and 80% compression strength is preferably 2.5 MPa or less (more preferably 0.5 to 2.0 MPa, particularly preferably 0.7 to 1.5 MPa) It is.
  • 70% compressive strength is preferably 0.8 MPa or less (more preferably 0.3 to 0.7 MPa), and 75% compressive strength is preferably 1.3 MPa or less (more preferably 0.4 to 1.0 MPa) ).
  • the foam base material having a relatively small average cell diameter of the closed cells and containing a relatively large number of small closed cells has a low compressive strength at high compression and an interlayer. The strength is not too low. Therefore, in the present invention, it is preferable to use such type of foam substrate.
  • the weight average molecular weight (Mw) and theoretical Tg of each acrylic copolymer are shown in the table.
  • the weight average molecular weight (Mw) is a value obtained by measuring the molecular weight of the acrylic copolymer in terms of standard polystyrene by the GPC method using the following measuring apparatus and conditions.
  • ⁇ Device LC-2000 series (manufactured by JASCO Corporation)
  • Column Shodex KF-806M x 2 pcs, Shodex KF-802 x 1 pc ⁇
  • Eluent Tetrahydrofuran (THF) Flow rate: 1.0 mL / min Column temperature: 40 ° C.
  • Injection volume 100 ⁇ L ⁇ Detector: Refractometer (RI) Measurement sample: An acrylic polymer is dissolved in THF to prepare a solution having a concentration of 0.5% by mass of the acrylic polymer, and dust is removed by filtration through a filter.
  • RI Refractometer
  • the theoretical Tg is a value calculated by the formula of FOX.
  • each acrylic copolymer (A) an isocyanate crosslinking agent (CORONATE (registered trademark) L-45E, 45% solution) manufactured by Nippon Polyurethane Industry Co., Ltd. as a crosslinking agent (B) 0 .04 parts and 0.001 part of an epoxy-based crosslinking agent (TEDRAD (registered trademark) -C) manufactured by Mitsubishi Gas Chemical Co., Ltd., a silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd.
  • CORONATE registered trademark
  • L-45E 45% solution
  • B 0 .04 parts
  • TEDRAD epoxy-based crosslinking agent manufactured by Mitsubishi Gas Chemical Co., Ltd.
  • silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd.
  • a pressure-sensitive adhesive composition was prepared by adding 0.1 part of an antioxidant (D) and 0.2 part of an antioxidant (IRGANOX (registered trademark) 1010) manufactured by BASF as an antioxidant (D). Furthermore, this pressure-sensitive adhesive composition was applied onto a silicone-treated release paper so that the thickness after drying was 0.075 mm. Then, the solvent was removed and dried at 110 ° C. and a crosslinking reaction was carried out to form pressure-sensitive adhesive layers 1 to 3.
  • PE polyethylene
  • EVA ethylene-vinyl acetate copolymer
  • Examples 2 and 3 A double-sided pressure-sensitive adhesive tape was obtained in the same manner as Example 1, except that the pressure-sensitive adhesive layers obtained in Production Examples 2 and 3 were used as the pressure-sensitive adhesive layer.
  • a double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that the average cell diameter was 0.063 mm and the density was 410 kg / m 3 ).
  • the tensile modulus of elasticity of the substrates of Examples and Comparative Examples, and the bending moment of the substrate and the pressure-sensitive adhesive tape are values measured by the following method. Each measured value is shown in Table 2.
  • the chuck interval (L) of a commercially available tensile testing device (made by Toyo Seiki Seisakusho, device name Strograph V-10C, full scale 50N) is set to 20 mm according to JIS K7161 2014, and the upper and lower ends of the test piece are chucked did. Thereafter, a tensile load-displacement curve was obtained at a tensile speed of 10 mm / min. The linear equation was determined from the tensile load of 0.05 mm and 0.25 mm for the displacement of the obtained tensile load-displacement curve.
  • the double-sided pressure-sensitive adhesive tape was cut into a strip (width 10 mm, length 70 mm) in a strip shape (long side in the MD direction), and this was used as a test piece.
  • the chuck interval (L) of a tensile test apparatus manufactured by Toyo Seiki Seisakusho, product name Strograph V1-C, full scale 200N was set to 50 mm, and the upper end and the lower end of the test piece were chucked. Thereafter, the film was pulled at a tensile speed of 300 mm / min, and the force (N / cm) applied when the adhesive tape was broken and the length (%) stretched until it was broken were measured.
  • the double-sided pressure-sensitive adhesive tape 4 was cut into a frame of 60 mm ⁇ 120 mm with a predetermined width (about 1 mm), one release paper was peeled off and bonded to the glass plate 5 of 0.5 mm thickness. . Then, the other release paper was peeled off and bonded to a 1.5 mm thick polycarbonate plate 5.
  • the bonded members were pressure-treated (0.5 MPa) for 5 seconds at 23 ° C. using an autoclave, and then aged for 24 hours under an atmosphere of 23 ° C. And this bonded member was dropped 20 times from the height of 1 m. Moreover, this fall was implemented so that the location where the stuck member collides with the landing surface changes every time.
  • the places where the bonded members collide with the landing surface are the ten places indicated by the arrows in FIG. 3. And the following criteria evaluated. " ⁇ ”: Tape peeling did not occur even when dropped 20 times. "X”: Tape peeling occurred before dropping 20 times.
  • the double-sided adhesive tape 1 is cut into a strip of 80 mm at a width of 0.8 mm, one release paper is peeled off, and a copper electrode 7 and a copper electrode 8 formed on a 2.0 mm thick ⁇ 80 mm ⁇ 120 mm acrylic plate 6 It bonded together (distance between electrodes 1.0 mm), and also peeled another release paper, and bonded together the acrylic board 6 of 2.0 mm thickness x 80 mm x 80 mm.
  • the sample was subjected to pressure treatment (0.5 MPa) for 5 seconds at 23 ° C. using an autoclave. Then, as shown in FIG. 4, the electrostatic resistance of this sample was evaluated based on IEC 61000-4-2 (electrostatic resistance standard).
  • an electrostatic gun was applied to the copper electrode 7 50 times at each voltage, and the applied voltage (ESD withstand voltage) when current flowed to the copper electrode 8 side was measured.
  • the sample is placed on the stainless steel table 10 via the insulating sheet 9, and the copper electrode is grounded to the stainless steel table 10.
  • PE polyethylene
  • EVA ethylene-vinyl acetate copolymer
  • PE polyethylene
  • EVA ethylene-vinyl acetate copolymer
  • Example 4 ⁇ Evaluation of Example 4 and Comparative Example 2> As apparent from the evaluation results of Table 7, the thin adhesive tape of Example 4 was excellent in all the properties.
  • the pressure-sensitive adhesive tape of the present invention is excellent in flexibility at high compression, for example, excellent in performance such as impact resistance, stability when greatly deformed, for example, excellent in performance such as impact resistance, stability when large deformed. There is. Therefore, it is useful for various applications in the field where such characteristics are required. In particular, it can be suitably used in applications of electronic devices such as smartphones, tablet terminals, in-vehicle display devices, TVs, etc., and can be particularly suitably used in applications of small electronic devices which often receive impact force due to accidents such as falling. .

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
PCT/JP2017/031062 2017-08-30 2017-08-30 粘着テープ Ceased WO2019043810A1 (ja)

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US16/642,623 US11286406B2 (en) 2017-08-30 2017-08-30 Adhesive tape
KR1020207006843A KR102422209B1 (ko) 2017-08-30 2017-08-30 점착 테이프
PCT/JP2017/031062 WO2019043810A1 (ja) 2017-08-30 2017-08-30 粘着テープ
JP2019538808A JPWO2019043810A1 (ja) 2017-08-30 2017-08-30 粘着テープ
CN201780094506.5A CN111032808B (zh) 2017-08-30 2017-08-30 粘胶带
EP17922988.5A EP3680305B1 (en) 2017-08-30 2017-08-30 Adhesive tape
TW107129133A TWI789417B (zh) 2017-08-30 2018-08-21 黏著帶
JP2022199112A JP7565330B2 (ja) 2017-08-30 2022-12-14 粘着テープ

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CN111032808A (zh) 2020-04-17
KR102422209B1 (ko) 2022-07-18
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US20200239740A1 (en) 2020-07-30
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JP7565330B2 (ja) 2024-10-10
EP3680305A1 (en) 2020-07-15
TW201923004A (zh) 2019-06-16
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