WO2019029602A1 - 半导体制造装置 - Google Patents

半导体制造装置 Download PDF

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Publication number
WO2019029602A1
WO2019029602A1 PCT/CN2018/099545 CN2018099545W WO2019029602A1 WO 2019029602 A1 WO2019029602 A1 WO 2019029602A1 CN 2018099545 W CN2018099545 W CN 2018099545W WO 2019029602 A1 WO2019029602 A1 WO 2019029602A1
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Prior art keywords
chip
carrier
stage
semiconductor manufacturing
manufacturing apparatus
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PCT/CN2018/099545
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English (en)
French (fr)
Inventor
陈飞彪
郭耸
Original Assignee
上海微电子装备（集团）股份有限公司
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Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Priority to US16/637,639 priority Critical patent/US11551948B2/en
Priority to SG11202001118WA priority patent/SG11202001118WA/en
Priority to KR1020207006430A priority patent/KR102358962B1/ko
Priority to JP2020506865A priority patent/JP7029520B2/ja
Publication of WO2019029602A1 publication Critical patent/WO2019029602A1/zh

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    • H—ELECTRICITY
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    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14008—Inserting articles into the mould
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
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    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Definitions

  • the present invention relates to the field of semiconductor manufacturing, and more particularly to a semiconductor manufacturing apparatus.
  • Chip bonding technology enables maximum chip stacking and integration in a limited area without reducing line width, while reducing chip package size and line conduction length, thereby increasing wafer transfer efficiency. Due to the trend of light, thin and miniaturized electronic products, the application of chip bonding technology is increasing. Combining the chip bonding process with the wafer level packaging process enables the fabrication of packages with smaller package sizes and higher performance. Form, in addition, if the chip bonding process is combined with the TSV (through-silicon via) process, it is possible to produce a chip structure that is more competitive in cost and performance.
  • TSV through-silicon via
  • Chip-to-wafer bonding technology has higher yield and lower product cost than wafer-to-wafer bonding technology.
  • the current production process needs to be divided into two processes of bonding and encapsulation, and the process is complicated and laborious.
  • An object of the present invention is to provide a semiconductor manufacturing apparatus which solves the problem that the bonding and packaging of a chip need to be divided into two processes and the manufacturing process is complicated in the prior art.
  • the present invention provides a semiconductor manufacturing apparatus including: a chip supply module for providing a plurality of chips; a carrier supply module including a carrier and a carrier for carrying the carrier a motion stage; a chip transfer module including a chip transfer stage for adsorbing the plurality of chips, wherein the chip transfer stage is configured to transfer the plurality of chips from the chip supply module at a first location, a chip transfer station carrying the plurality of chips to a second position to bond the plurality of chips to the carrier to form a bonding sheet; and a packaging module for the board on the carrier The bonding sheets are packaged to form a packaged chip.
  • the chip supply module includes a chip supply station, and the chip transfer stage is disposed above the chip supply station, and the chip transfer stage has a chip adsorption surface disposed opposite to the chip on the chip supply station.
  • the semiconductor manufacturing apparatus further includes a chip pickup hand located between the chip transfer stage and the chip supply stage for picking up a chip from the chip supply stage and axially flipping 180 degrees and handing over to the chip for reprinting station.
  • the chip supply module further includes a blue film library, a loading robot, and a thimble mechanism, wherein the blue film library stores a plurality of blue films, and the plurality of blue films are disposed on the blue film a chip, the loading robot is used to pick up the blue film from the blue film library and then placed on the chip supply table, the thimble mechanism is used to lift the chip on the blue film .
  • the blue film library stores a plurality of blue films
  • the plurality of blue films are disposed on the blue film a chip
  • the loading robot is used to pick up the blue film from the blue film library and then placed on the chip supply table
  • the thimble mechanism is used to lift the chip on the blue film .
  • the carrier supply module further includes a package chip library and a blanking robot, wherein the blanking robot is used to pick up the package chip from the carrier motion stage and then place it in the package chip library.
  • the semiconductor manufacturing apparatus further includes a position adjustment module located between the chip supply module and the carrier supply module for adjusting a position of the chip on the chip transfer stage.
  • the position adjustment module includes an aligning unit and an adjusting unit; and the adjusting unit is configured to move the chip when the aligning unit detects that the position of the chip is offset.
  • the package module includes a package material supply unit and one or more injection units; the package material supply unit is configured to store the package material and heat the package material to the injection unit, where the injection unit is used for The encapsulating material is processed and delivered to the bonding sheet.
  • the package module includes two injection units symmetrically distributed on two sides of the carrier.
  • each of the injection units has a flow path for the packaging material to flow out, and a flow path of the injection unit is opposite to a gap between the transfer table and the carrier.
  • the package module further includes a glue supply unit disposed under the injection unit and a glue unit disposed above the glue supply unit; the glue supply unit is configured to supply the glue The gumming unit is configured to apply the bonding glue to a surface of the carrier.
  • the carrier moving platform is capable of heating the carrier.
  • the chip transfer module further includes a transport mechanism, the chip transfer station is disposed on the transport mechanism, and the transport mechanism is configured to drive the chip transfer station to move.
  • the semiconductor manufacturing apparatus includes: a chip supply module, a chip pickup hand, a chip transfer module, a carrier supply module, and a package module, wherein the chip transfer module includes a chip transfer stage that can adsorb a plurality of chips,
  • the carrier supply module includes a carrier board and a carrier moving stage; the chip picking hand picks up the chip from the chip supply module and hands it over to the chip transfer stage, and the chip transfer stage carries a plurality of chips and moves to the bonding a station, the carrier moving table carries the carrier and then moves to the bonding station, the chip transfer station moves relative to the carrier moving table, and the plurality of chips are bonded to the A bonding sheet is formed on the carrier board; the packaging module encapsulates the bonding sheets on the carrier moving table to form a packaged chip.
  • the semiconductor manufacturing device integrates bonding and packaging, optimizes the manufacturing process, reduces the process and reduces the equipment cost, and completes the work required in the prior art for multiple devices to be completed by one device, thereby reducing the equipment cost.
  • the carrier board of the present invention can be quickly reused, which saves the cost of the existing process materials.
  • FIG. 1 to 2 are schematic views of a semiconductor manufacturing apparatus provided in Embodiment 1;
  • FIG. 3 is a schematic diagram of a packaging device provided in Embodiment 1;
  • FIGS. 4 to 5 are schematic views of a semiconductor manufacturing apparatus provided in Embodiment 2;
  • FIG. 6 is a schematic diagram of a packaging device provided in Embodiment 2.
  • 1-chip transfer module 11-transport mechanism, 12-transfer stage, 21-carrier board, 22-carrier board, 23-package chip library, 23n-package chip, 24-feed robot, 25-test Unit, 3-position adjustment module, 31-position adjustment table, 32-alignment unit, 33-adjustment unit, 41-chip supply station, 42-pin mechanism, 43-blue diaphragm library, 43n-blue diaphragm, 431 - chip, 44-loading robot, 5-package module, 51-package material supply unit, 52-injection unit, 53-package motion table, 54-storage supply unit, 55-coating unit, 6-chip pick-up hand , POS A-bonding and packaging station, POS B-feeding station, POS C-bonding station, POS D-packaging station, POS E-debonding station.
  • the semiconductor manufacturing apparatus includes: a chip supply module, a chip pickup hand 6, a chip transfer module 1, a carrier supply module, and a package.
  • the chip transfer module 1 includes a transfer stage 12 that can adsorb a plurality of chips 431, the carrier supply module includes a carrier 22 and a carrier moving stage 21; the chip pickup 6 is supplied from the chip supply module After the chip is picked up, it is transferred to the transfer station 12, and the transfer stage 12 carries a plurality of chips and then moves to the bonding station.
  • the carrier moving table 21 carries the carrier 22 and moves to the bonding machine.
  • the transfer stage 12 moves relative to the carrier moving table 21, and the plurality of chips 431 are bonded to the carrier 22 to form a bonding sheet; the package module 5 moves the carrier
  • the bonding pads on the stage 21 are packaged to form a packaged chip.
  • the semiconductor manufacturing device provided by the invention integrates bonding and packaging, optimizes the manufacturing process, reduces the process and reduces the equipment cost, and completes the work required in the prior art for multiple devices to be completed by one device, thereby reducing the equipment cost.
  • the carrier board of the present invention can be quickly reused, which saves the cost of the existing process materials.
  • the loading robot 44 grabs the blue film 43n and places it.
  • the chip supply stage 41 of the chip supply module a plurality of chips 431 are placed on the blue film 43n, and the chip supply stage 41 is horizontally moved, and when one of the plurality of chips 431 is moved to the ejector mechanism Directly above 42 , the ejector mechanism 42 moves upward to jack up the chip 431 , and the chip picking hand 6 picks up the chip 431 and flips it 180 degrees axially to place the chip 431 on the chip reloading module 1 On the stage 12.
  • the chip supply stage 41 and the chip pickup hand 6 are engaged until a set of chips 431 is placed on the transfer stage 12.
  • the transfer stage 12 is disposed above the chip supply stage 41.
  • the transfer stage 12 has a chip adsorption surface, and the chip adsorption surface is disposed opposite to the chip on the chip supply stage 41.
  • the chip pickup hand 6 Located between the transfer stage 12 and the chip supply stage 41, the chip is picked up from the chip supply stage 41 and flipped 180 degrees in the axial direction and then transferred to the transfer stage 12.
  • the transfer table 12 adsorbs a set of chips 431, and the transport mechanism 11 drives the transfer stage 12 to move above the position adjustment module 3.
  • the position adjustment module 3 includes a position adjustment table 31 and a pair disposed on the position adjustment table 31.
  • the quasi unit 32 and the adjusting unit 33, the aligning unit 32 detects the position of the chip 431, and if the position of the chip 431 is offset, the adjusting unit 33 moves to the offset chip, dials The chip is adjusted to the correct position, or when the offset of the chip 431 is too large to be adjusted, the adjusting unit 33 removes the offset chip 431 and then repositions the chip 431. In the right place.
  • the number of the aligning unit 32 and the adjusting unit 33 may be multiple, and the plurality of aligning units 32 and the adjusting unit 33 simultaneously detect and adjust, thereby improving the efficiency of the machine.
  • the transport mechanism 11 drives the transfer stage 12 to move to the bonding station (ie, to the POS A station), where the bonding station refers to The plurality of chips 431 are bonded to the carrier 22 to form a bonding sheet.
  • the carrier supply module includes a carrier moving table 21 and a carrier 22 disposed on the carrier moving table 21.
  • the carrier 22 may be coated with a layer of chip protection material to protect the chip 431 from damage. .
  • the transfer stage 12 reaches the POS A station, and the carrier moving stage 21 transports the carrier 22 to the POS A station, so that the carrier 22 corresponds to the chip on the transfer stage 12,
  • the plate moving table 21 moves vertically and is docked with the transfer table 12 for bonding the chip carried by the transfer table 12 to the carrier 22.
  • the carrier supply module further includes a detecting unit 25 for detecting whether the transfer station 12 has reached the POS A station.
  • the package module 5 includes a package material supply unit 51, an injection unit 52, and a package moving stage 53 for carrying the package material supply unit 51 and the injection unit 52, and the package material supply unit 51 can store the package.
  • the material is heated and the encapsulating material is heated.
  • the encapsulating material supply unit 51 may be a plurality of materials, and the plurality of encapsulating material supply units 51 may store more packaging materials, reducing the number of times of replacing or adding the packaging materials, and increasing the machine.
  • the output of Taiwan The injection unit 52 is used for processing and transporting the encapsulating material, and has a flow path for the outflow of the encapsulating material.
  • the injection unit 52 may be a plurality of, preferably two, two injection units 52 symmetrically distributed in the On both sides of the carrier 22 on the carrier moving table 21, the injection unit 52 can pressurize the packaging material in the flow path to better control the flow rate of the packaging material.
  • the package moving table 53 of the package module 5 drives the material supply unit 51 and the injection unit 52 to move downward, and the flow path of the injection unit 52 is
  • a boss is formed on the suction pad of the transfer table 12 for adsorbing the chip.
  • the transfer table 12 and the carrier movement table 21 are kept in a bonding operation, and the boss can press the chip at the same. On the carrier 22, the momentum of the injection is prevented to shift the chip.
  • the transfer stage 12 moves to receive the next set of chips above the chip supply module, and the carrier 22 carries the package chip 23n, and the carrier motion stage 21 will
  • the carrier 22 is moved to the blanking station, that is, the POS B station, where the blanking station refers to the position of the packaged chip on the carrier that will be moved into the packaged chip library.
  • the blanking robot 24 grabs the packaged chip 23n on the carrier 22 and places it in the packaged chip library 23, and then the carrier moving stage 21 moves the carrier 22 back to the POS A station. This cycle.
  • the bonding and packaging of the chip are not completed in the same step and station.
  • the chip 431 is first bonded to the carrier 22 at the POS C station. Then complete the package at the POS D station.
  • the package module 5 has not only a package material supply unit 51 , an injection unit 52 , and a package movement table 53 .
  • the package module 5 further includes a glue supply unit 54 and a glue application unit 55 .
  • the glue supply unit 54 and the glue application unit 55 may be plural to increase the glue application efficiency.
  • the glue supply unit 54 supplies the bonding glue to the glue application unit 55, and the glue unit 55 applies the surface of the carrier 22 to the bonding glue.
  • the glue unit 55 can be bonded.
  • the glue is pressurized to better control the flow rate of the glue.
  • the carrier 22 is stopped at the POS D station, and the package moving table 53 of the package module 5 is lowered.
  • the glue unit 55 uniformly coats the bonding adhesive on the surface of the carrier 22, and the glue is completed.
  • the package motion table 53 is reset, the carrier board 22 is moved to the POS C station, and after the transfer station 12 reaches the POS C station, the chip 431 is bonded to the carrier board 22 in cooperation with the transfer stage 12, and the chip is to be chipped. 431 is firmly bonded on the carrier 22, and after the bonding sheet is formed, the transfer stage 12 is reset, the carrier 22 is moved to the POS D station, the package moving stage 53 of the package module 5 is lowered, and the package operation is performed. Formed packaged package chip 23n.
  • the carrier moving table 21 continues to move the carrier 21 having the packaged chip 23n to the POS E station, and the carrier moving stage 21 heats the packaged chip 23n to bond the packaged chip 23n and the carrier 22
  • the glue loses its viscosity, and the blanking robot 24 grabs the packaged chip 23n and places it into the packaged chip library 23, which is then moved to the POS D station to circulate.
  • the present invention does not limit the debonding by heating in the embodiment, and any method for making the bonding adhesive lose the viscosity is within the protection scope of the present invention.
  • the semiconductor manufacturing device provided by the invention integrates bonding and packaging, optimizes the manufacturing process, reduces the process and reduces the equipment cost, and completes the work required in the prior art for multiple devices to be completed by one device, thereby reducing the equipment cost.
  • the carrier board of the present invention can be quickly reused, which saves the cost of the existing process materials.

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Abstract

一种半导体制造装置，包括：芯片供应模块，用于提供多个芯片；载板供应模块，包括载板和用于承载载板的载板运动台；芯片转载模块，包括用于吸附多个芯片的芯片转载台，其中芯片转载台用于在第一位置处从芯片供应模块上交接多个芯片，芯片转载台承载多个芯片至第二位置，以将多个芯片键合至载板上形成键合片；以及封装模块，用于对载板运动台上的键合片进行封装，以形成封装芯片。

Description

半导体制造装置 技术领域
本发明涉及半导体制造领域，尤其涉及一种半导体制造装置。
背景技术
芯片键合技术能够在不缩小线宽的情况下，在有限面积内进行最大程度的芯片叠加与整合，同时缩减晶片封装体积与线路传导长度，进而提升晶片传输效率。由于电子产品轻、薄和小型化的发展趋势，使得芯片键合技术的应用日益增多，将芯片键合工艺与晶圆级封装工艺相结合，能够制作出封装尺寸更小、性能更高的封装形式，另外，如果将芯片键合工艺与TSV(硅通孔)工艺相结合，能够制作出成本和性能更有竞争力的芯片结构。
芯片-晶圆键合技术相对于晶圆-晶圆键合技术具有更高的良率和更低的产品成本。目前的生产制程需要分为键合和封装两个工序，流程复杂，费事费力。
发明内容
本发明的目的在于提供一种半导体制造装置，以解决现有技术中需要将芯片的键合和封装分成两个工序、制造流程复杂的问题。
为了达到上述目的，本发明提供了半导体制造装置，所述半导体制造装置包括：芯片供应模块，用于提供多个芯片；载板供应模块，包括载板和用于承载所述载板的载板运动台；芯片转载模块，包括用于吸附所述多个芯片的芯片转载台，其中所述芯片转载台用于在第一位置处从所述芯片供应模块上交接所述多个芯片，所述芯片转载台承载所述多个芯片至第二位置，以将所述多个芯片键合至所述载板上形成键合片；以及封装模块，用于对所述载板运动台上的所述键合片进行封装，以形成封装芯片。
可选的，所述芯片供应模块包括芯片供应台，所述芯片转载台设置在所述芯片供应台上方，所述芯片转载台具有一芯片吸附面与所述芯片供应台上的芯片相对设置，所述半导体制造装置还包括位于所述芯片转载台和所述芯片供应台之间的芯片拾取手，用于从所述芯片供应台上拾取芯片并轴向翻转180度后交接给所述芯片转载台。
可选的，所述芯片供应模块还包括蓝膜片库、上料机械手及顶针机构，所述蓝膜片库中存储有多个蓝膜片，所述蓝膜片上放置有所述多个芯片，所述上料机械手用于从所述蓝膜片库中拾取所述蓝膜片后放置在所述芯片供应台上，所述顶针机构用于将所述蓝膜片上的芯片顶起。
可选的，所述载板供应模块还包括封装芯片库和下料机械手，所述下料机械手用于从所述载板运动台上拾取所述封装芯片后放置在所述封装芯片库中。
可选的，所述半导体制造装置还包括位置调整模块，所述位置调整模块位于所述芯片供应模块和所述载板供应模块之间，用于调整所述芯片转载台上芯片的位置。
可选的，所述位置调整模块包括对准单元和调整单元；所述调整单元用于当所述对准单元检测到所述芯片的位置有偏移时，移动所述芯片。
可选的，所述封装模块包括封装材料供给单元和一个或多个注塑单元；所述封装材料供给单元用于存储封装材料并将封装材料加热后供给所述注塑单元，所述注塑单元用于处理封装材料并输送至所述键合片上。
可选的，所述封装模块包括两个注塑单元对称分布于所述载板的两侧。
可选的，每个所述注塑单元具有供所述封装材料流出的流道，所述注塑单元的流道与所述转载台与所述载板之间的空隙相对接。
可选的，所述封装模块还包括设置在所述注塑单元下方的储胶供给单元和设置在所述储胶供给单元上方的涂胶单元；所述储胶供给单元用于将键合胶供给所述涂胶单元，所述涂胶单元用于将所述载板的表面涂上所述键合胶。
可选的，所述载板运动台能够对所述载板进行加热。
可选的，所述芯片转载模块还包括输送机构，所述芯片转载台设置于所述输送机构上，所述输送机构用于驱动所述芯片转载台运动。
在本发明提供的半导体制造装置中，包括：芯片供应模块、芯片拾取手、芯片转载模块、载板供应模块及封装模块，所述芯片转载模块包括可吸附多个芯片的芯片转载台，所述载板供应模块包括载板和载板运动台；所述芯片拾取手从所述芯片供应模块上拾取芯片后交接给所述芯片转载台，所述芯片转载台承载多个芯片后运动至键合工位，所述载板运动台承载所述载板后运动至所述键合工位，所述芯片转载台与所述载板运动台相对运动，将所述多个芯片键合至所述载板上形成键合片；所述封装模块对所述载板运动台上的键合片进行封装，以形成封装芯片。本发明提供的半导体制造装置集键合与封装为一体，优化制造流程、减少了工序并降低设备成本，将现有技术中需要多台设备完成的工作由一台设备完成，降低设备成本。并且本发明中的载板可以快速重复使用，节省了现有制程物料成本。
附图说明
图1-图2为实施例一提供的半导体制造装置的示意图；
图3为实施例一提供的封装装置的示意图；
图4-图5为实施例二提供的半导体制造装置的示意图；
图6为实施例二提供的封装装置的示意图；
其中，1-芯片转载模块，11-输送机构，12-转载台，21-载板运动台，22-载板，23-封装芯片库，23n-封装芯片，24-下料机械手，25-检测单元，3-位置调整模块，31-位置调整台，32-对准单元，33-调整单元，41-芯片供应台，42-顶针机构，43-蓝膜片库，43n-蓝膜片，431-芯片，44-上料机械手，5-封装模块，51-封装材料供给单元，52-注塑单元，53-封装运动台，54-储胶供给单元，55-涂胶单元，6-芯片拾取手，POS A-键合及封装工位，POS B-下料工位，POS  C-键合工位，POS D-封装工位，POS E-解键合工位。
具体实施方式
下面将结合示意图对本发明的具体实施方式进行更详细的描述。根据下列描述和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
实施例一
参阅图1，其为实施例一提供的半导体制造装置的示意图，如图1所示，所述半导体制造装置包括：芯片供应模块、芯片拾取手6、芯片转载模块1、载板供应模块及封装模块5，所述芯片转载模块1包括可吸附多个芯片431的转载台12，所述载板供应模块包括载板22和载板运动台21；所述芯片拾取手6从所述芯片供应模块上拾取芯片后交接给所述转载台12，所述转载台12承载多个芯片后运动至键合工位，所述载板运动台21承载所述载板22后运动至所述键合工位，所述转载台12与所述载板运动台21相对运动，将所述多个芯片431键合至所述载板22上形成键合片；所述封装模块5对所述载板运动台21上的键合片进行封装，以形成封装芯片。本发明提供的半导体制造装置集键合与封装为一体，优化制造流程、减少了工序并降低设备成本，将现有技术中需要多台设备完成的工作由一台设备完成，降低设备成本。并且本发明中的载板可以快速重复使用，节省了现有制程物料成本。
请参阅图1-图2，所述蓝膜片库43用于存放蓝膜片43n(n＝1，2，…)，所述上料机械手44抓取所述蓝膜片43n并将其放置在芯片供应模块的芯片供应台41上，所述蓝膜片43n上放置有多个芯片431，所述芯片供应台41进行水平移动，当多个芯片431中的某一个移动到所述顶针机构42的正上方时，所述顶针机构42向上运动，将芯片431顶起来，所述芯片拾取手6拾取这个 芯片431，并轴向翻转180度，以将芯片431放置在芯片转载模块1的转载台12上。所述芯片供应台41和所述芯片拾取手6配合，直到将一组芯片431放置在所述转载台12上。
所述转载台12设置在所述芯片供应台41上方，所述转载台12具有一芯片吸附面，所述芯片吸附面与所述芯片供应台41上的芯片相对设置，所述芯片拾取手6位于所述转载台12和所述芯片供应台41之间，从所述芯片供应台41上拾取芯片并轴向翻转180度后交接给所述转载台12。所述转载台12将一组芯片431吸附住，输送机构11驱动转载台12移动至位置调整模块3的上方，所述位置调整模块3包括位置调整台31及设置于位置调整台31上的对准单元32和调整单元33，所述对准单元32对所述芯片431的位置进行检测，若所述芯片431的位置有偏移，所述调整单元33移动至有偏移的芯片处，拨动芯片以将其调整到正确的位置，或者，当芯片431的偏移量太大不好调整时，所述调整单元33将所述有偏移的芯片431取下，再重新将芯片431放置在正确的位置上。优选的，所述对准单元32和所述调整单元33的数量可以为多个，多个所述对准单元32和所述调整单元33同时进行检测和调整，提高了机台的效率。
当转载台12上的一组芯片431均在正确的位置上时，所述输送机构11驱动转载台12移动至键合工位(即到达POS A工位)，此处键合工位指的是将所述多个芯片431键合至所述载板22上形成键合片的位置。所述载板供应模块包括载板运动台21及设置于所述载板运动台21上的载板22，所述载板22上可以涂覆一层芯片保护材料，以保护芯片431不受损伤。所述转载台12到达POS A工位，所述载板运动台21将载板22运送至POS A工位，使所述载板22与所述转载台12上的芯片相对应，所述载板运动台21垂向运动，与所述转载台12对接，用于将所述转载台12携带的芯片键合在所述载板22上。优选的，所述载板供应模块还包括一检测单元25，用于检测所述转载台12是否到达了POS A工位。
如图3所示，所述封装模块5包括封装材料供给单元51、注塑单元52和用于承载封装材料供给单元51和注塑单元52的封装运动台53，所述封装材料供给单元51可以存储封装材料并且对封装材料进行加热，优选的，所述封装材料供给单元51可以是多个，多个封装材料供给单元51可以存储更多的封装材料，减少更换或添加封装材料的次数，增加了机台的产量。所述注塑单元52用于处理和传输封装材料，其具有供封装材料流出的流道，优选的，所述注塑单元52可以是多个，优选为两个，两个注塑单元52对称分布于所述载板运动台21上的载板22的两侧，所述注塑单元52可以对流道内的封装材料进行加压，以更好的控制封装材料的流速。
参阅图1-图3，所述芯片431键合到位后，所述封装模块5的封装运动台53带动所述材料供给单元51和注塑单元52向下移动，所述注塑单元52的流道与所述转载台12与载板22间的空隙相对接，将封装材料注入转载台12与基底22之间，对一组芯片431进行封装作业，形成封装芯片23n(n＝1，2，…)。所述转载台12上用于吸附芯片的吸盘上形成有凸台，在封装的过程中，所述转载台12与载板运动台21之间保持键合动作，凸台可将芯片压紧在载板22上，避免注塑的冲力使芯片移位。
待封装完成后，所述封装模块5复位，所述转载台12移动至芯片供应模块上方处接收下一组芯片，所述载板22上承载着封装芯片23n，所述载板运动台21将载板22移动至下料工位，即POS B工位，此处所述下料工位是指封装好的芯片在载板上的将移入至封装芯片库的位置。所述下料机械手24抓取载板22上的封装芯片23n，并将其放入封装芯片库23中，然后所述载板运动台21将所述载板22再移动回POS A工位，以此循环。
实施例二
请参阅图4-图5，本实施例中，芯片的键合和封装不在同一步骤和工位中完成，如图4所示，芯片431先在POS C工位被键合至载板22上，再在POS  D工位上完成封装。
请参阅图6，本实施例中，所述封装模块5不仅具有封装材料供给单元51、注塑单元52和封装运动台53，所述封装模块5还包括储胶供给单元54和涂胶单元55，优选的，储胶供给单元54和涂胶单元55可以是多个，以增加涂胶效率。所述储胶供给单元54将键合胶供给所述涂胶单元55，所述涂胶单元55将所述载板22的表面涂上键合胶，优选的，所述涂胶单元55可以对键合胶进行加压，以更好的控制胶的流速。
具体的，所述载板22先停止在POS D工位，封装模块5的封装运动台53下降，所述涂胶单元55将键合胶均匀的涂覆在载板22的表面，涂胶完成后，封装运动台53复位，所述载板22移动至POS C工位，所述转载台12到达POS C工位后，与转载台12配合将芯片431键合到载板22上，待芯片431在载板22上粘接牢固，形成键合片后，所述转载台12复位，所述载板22再移动至POS D工位，封装模块5的封装运动台53下降，并进行封装作业，形成了封装好的封装芯片23n。载板运动台21继续运动将具有封装芯片23n的载板21移至POS E工位，载板运动台21对所述封装芯片23n进行加热，使封装芯片23n与载板22之间的键合胶失去粘性，下料机械手24抓取所述封装芯片23n，并将其放置进封装芯片库23中，所述载板22再移动至POS D工位，以此循环。
本实施例中，对芯片431进行封装前，在载板22表面涂一层键合胶，封装完成后对所述封装芯片23n进行加热使胶失去粘性，将封装芯片23n取下后载板22可直接被循环利用，避免了上片、下片等多道复杂工序。要说明的是，本发明并不限定本实施例所述的采用加热的方式解键合，任何可使键合胶失去粘性的方法均在本发明的保护范围内。本发明提供的半导体制造装置集键合与封装为一体，优化制造流程、减少了工序并降低设备成本，将现有技术中需要多台设备完成的工作由一台设备完成，降低设备成本。并且本发明中的载板可以快速重复使用，节省了现有制程物料成本。
上述仅为本发明的优选实施例而已，并不对本发明起到任何限制作用。任何所属技术领域的技术人员，在不脱离本发明的技术方案的范围内，对本发明揭露的技术方案和技术内容做任何形式的等同替换或修改等变动，均属未脱离本发明的技术方案的内容，仍属于本发明的保护范围之内。

Claims (12)

  1. 一种半导体制造装置，其特征在于，包括：
    芯片供应模块，用于提供多个芯片；
    载板供应模块，包括载板和用于承载所述载板的载板运动台；
    芯片转载模块，包括用于吸附所述多个芯片的芯片转载台，其中所述芯片转载台用于在第一位置处从所述芯片供应模块上交接所述多个芯片，所述芯片转载台承载所述多个芯片至第二位置，以将所述多个芯片键合至所述载板上形成键合片；以及
    封装模块，用于对所述载板运动台上的所述键合片进行封装，以形成封装芯片。
  2. 如权利要求1所述的半导体制造装置，其特征在于，所述芯片供应模块包括芯片供应台，所述芯片转载台设置在所述芯片供应台上方，所述芯片转载台具有一芯片吸附面与所述芯片供应台上的芯片相对设置，所述半导体制造装置还包括位于所述芯片转载台和所述芯片供应台之间的芯片拾取手，用于从所述芯片供应台上拾取芯片并轴向翻转180度后交接给所述芯片转载台。
  3. 如权利要求2所述的半导体制造装置，其特征在于，所述芯片供应模块还包括蓝膜片库、上料机械手及顶针机构，所述蓝膜片库中存储有多个蓝膜片，所述蓝膜片上放置有所述多个芯片，所述上料机械手用于从所述蓝膜片库中拾取所述蓝膜片后放置在所述芯片供应台上，所述顶针机构用于将所述蓝膜片上的芯片顶起。
  4. 如权利要求1所述的半导体制造装置，其特征在于，所述载板供应模块还包括封装芯片库和下料机械手，所述下料机械手用于从所述载板运动台上拾取所述封装芯片后放置在所述封装芯片库中。
  5. 如权利要求1所述的半导体制造装置，其特征在于，所述半导体制造 装置还包括位置调整模块，所述位置调整模块位于所述芯片供应模块和所述载板供应模块之间，用于调整所述芯片转载台上芯片的位置。
  6. 如权利要求5所述的半导体制造装置，其特征在于，所述位置调整模块包括对准单元和调整单元；
    所述调整单元用于当所述对准单元检测到所述芯片的位置有偏移时，移动所述芯片。
  7. 如权利要求1所述的半导体制造装置，其特征在于，所述封装模块包括封装材料供给单元和一个或多个注塑单元；
    所述封装材料供给单元用于存储封装材料并将封装材料加热后供给所述注塑单元，所述注塑单元用于处理封装材料并输送至所述键合片上。
  8. 如权利要求7所述的半导体制造装置，其特征在于，所述封装模块包括两个注塑单元对称分布于所述载板的两侧。
  9. 如权利要求7或8所述的半导体制造装置，其特征在于，每个所述注塑单元具有供所述封装材料流出的流道，所述注塑单元的流道与所述转载台与所述载板之间的空隙相对接。
  10. 如权利要求7所述的半导体制造装置，其特征在于，所述封装模块还包括设置在所述注塑单元下方的储胶供给单元和设置在所述储胶供给单元上方的涂胶单元；
    所述储胶供给单元用于将键合胶供给所述涂胶单元，所述涂胶单元用于将所述载板的表面涂上所述键合胶。
  11. 如权利要求10所述的半导体制造装置，其特征在于，所述载板运动台能够对所述载板进行加热。
  12. 如权利要求10所述的半导体制造装置，其特征在于，所述芯片转载模块还包括输送机构，所述芯片转载台设置于所述输送机构上，所述输送机构用于驱动所述芯片转载台运动。
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