TWI692844B - 半導體製造裝置 - Google Patents

半導體製造裝置 Download PDF

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TWI692844B
TWI692844B TW107127896A TW107127896A TWI692844B TW I692844 B TWI692844 B TW I692844B TW 107127896 A TW107127896 A TW 107127896A TW 107127896 A TW107127896 A TW 107127896A TW I692844 B TWI692844 B TW I692844B
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wafer
carrier board
supply
semiconductor manufacturing
module
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TW201911495A (zh
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陳飛彪
郭聳
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大陸商上海微電子裝備（集團）股份有限公司
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Abstract

本發明提供了一種半導體製造裝置，包括：晶片供應模組，用於提供多個晶片；載板供應模組，包括載板和用於承載所述載板的載板運動台；晶片轉載模組，包括用於吸附所述多個晶片的晶片轉載台，其中所述晶片轉載台用於在第一位置處從所述晶片供應模組上交接所述多個晶片，所述晶片轉載台承載所述多個晶片至第二位置，以將所述多個晶片鍵合至所述載板上形成鍵合片；以及封裝模組，用於對所述載板運動台上的所述鍵合片進行封裝，以形成封裝晶片。本發明提供的半導體製造裝置集鍵合與封裝為一體，優化製造流程、減少了工序，降低設備成本。並且本發明中的載板可以快速重複使用，節省了現有製程物料成本。

Description

半導體製造裝置
本發明是關於半導體製造領域，尤其是關於一種半導體製造裝置。
晶片鍵合技術能夠在不縮小線寬的情況下，在有限面積內進行最大程度的晶片疊加與整合，同時縮減晶片封裝體積與線路傳導長度，進而提升晶片傳輸效率。由於電子產品輕、薄和小型化的發展趨勢，使得晶片鍵合技術的應用日益增多，將晶片鍵合工藝與晶圓級封裝工藝相結合，能夠製作出封裝尺寸更小、性能更高的封裝形式，另外，如果將晶片鍵合工藝與TSV（矽通孔）工藝相結合，能夠製作出成本和性能更有競爭力的晶片結構。
晶片-晶圓鍵合技術相對於晶圓-晶圓鍵合技術具有更高的良率和更低的產品成本。目前的生產製程需要分為鍵合和封裝兩個工序，流程複雜，費事費力。
本發明的目的在於提供一種半導體製造裝置，以解決現有技術中需要將晶片的鍵合和封裝分成兩個工序、製造流程複雜的問題。
為了達到上述目的，本發明提供了半導體製造裝置，所述半導體製造裝置包括：晶片供應模組，用於提供多個晶片；載板供應模組，包括載板和用於承載所述載板的載板運動台；晶片轉載模組，包括用於吸附所述多個晶片的晶片轉載台，其中所述晶片轉載台用於在第一位置處從所述晶片供應模組上交接所述多個晶片，所述晶片轉載台承載所述多個晶片至第二位置，以將所述多個晶片鍵合至所述載板上形成鍵合片；以及封裝模組，用於對所述載板運動台上的所述鍵合片進行封裝，以形成封裝晶片。
可選的，所述晶片供應模組包括晶片供應台，所述晶片轉載台設置在所述晶片供應台上方，所述晶片轉載台具有一晶片吸附面與所述晶片供應台上的晶片相對設置，所述半導體製造裝置還包括位於所述晶片轉載台和所述晶片供應台之間的晶片拾取手，用於從所述晶片供應台上拾取晶片並軸向翻轉180度後交接給所述晶片轉載台。
可選的，所述晶片供應模組還包括藍膜片庫、上料機械手及頂針機構，所述藍膜片庫中存儲有多個藍膜片，所述藍膜片上放置有所述多個晶片，所述上料機械手用於從所述藍膜片庫中拾取所述藍膜片後放置在所述晶片供應台上，所述頂針機構用於將所述藍膜片上的晶片頂起。
可選的，所述載板供應模組還包括封裝晶片庫和下料機械手，所述下料機械手用於從所述載板運動台上拾取所述封裝晶片後放置在所述封裝晶片庫中。
可選的，所述半導體製造裝置還包括位置調整模組，所述位置調整模組位於所述晶片供應模組和所述載板供應模組之間，用於調整所述晶片轉載台上晶片的位置。
可選的，所述位置調整模組包括對準單元和調整單元；所述調整單元用於當所述對準單元檢測到所述晶片的位置有偏移時，移動所述晶片。
可選的，所述封裝模組包括封裝材料供給單元和一個或多個注塑單元；所述封裝材料供給單元用於存儲封裝材料並將封裝材料加熱後供給所述注塑單元，所述注塑單元用於處理封裝材料並輸送至所述鍵合片上。
可選的，所述封裝模組包括兩個注塑單元對稱分佈於所述載板的兩側。
可選的，每個所述注塑單元具有供所述封裝材料流出的流道，所述注塑單元的流道與所述轉載台與所述載板之間的空隙相對接。
可選的，所述封裝模組還包括設置在所述注塑單元下方的儲膠供給單元和設置在所述儲膠供給單元上方的塗膠單元；所述儲膠供給單元用於將鍵合膠供給所述塗膠單元，所述塗膠單元用於將所述載板的表面塗上所述鍵合膠。
可選的，所述載板運動台能夠對所述載板進行加熱。
可選的，所述晶片轉載模組還包括輸送機構，所述晶片轉載台設置於所述輸送機構上，所述輸送機構用於驅動所述晶片轉載台運動。
在本發明提供的半導體製造裝置中，包括：晶片供應模組、晶片拾取手、晶片轉載模組、載板供應模組及封裝模組，所述晶片轉載模組包括可吸附多個晶片的晶片轉載台，所述載板供應模組包括載板和載板運動台；所述晶片拾取手從所述晶片供應模組上拾取晶片後交接給所述晶片轉載台，所述晶片轉載台承載多個晶片後運動至鍵合工位，所述載板運動台承載所述載板後運動至所述鍵合工位，所述晶片轉載台與所述載板運動台相對運動，將所述多個晶片鍵合至所述載板上形成鍵合片；所述封裝模組對所述載板運動台上的鍵合片進行封裝，以形成封裝晶片。本發明提供的半導體製造裝置集鍵合與封裝為一體，優化製造流程、減少了工序並降低設備成本，將現有技術中需要多台設備完成的工作由一台設備完成，降低設備成本。並且本發明中的載板可以快速重複使用，節省了現有製程物料成本。
下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍，本發明的優點和特徵將更清楚。需說明的是，附圖均採用非常簡化的形式且均使用非精准的比例，僅用以方便、明晰地輔助說明本發明實施例的目的。
實施例一
參閱圖1，其為實施例一提供的半導體製造裝置的示意圖，如圖1所示，所述半導體製造裝置包括：晶片供應模組、晶片拾取手6、晶片轉載模組1、載板供應模組及封裝模組5，所述晶片轉載模組1包括可吸附多個晶片431的轉載台12，所述載板供應模組包括載板22和載板運動台21；所述晶片拾取手6從所述晶片供應模組上拾取晶片後交接給所述轉載台12，所述轉載台12承載多個晶片後運動至鍵合工位，所述載板運動台21承載所述載板22後運動至所述鍵合工位，所述轉載台12與所述載板運動台21相對運動，將所述多個晶片431鍵合至所述載板22上形成鍵合片；所述封裝模組5對所述載板運動台21上的鍵合片進行封裝，以形成封裝晶片。本發明提供的半導體製造裝置集鍵合與封裝為一體，優化製造流程、減少了工序並降低設備成本，將現有技術中需要多台設備完成的工作由一台設備完成，降低設備成本。並且本發明中的載板可以快速重複使用，節省了現有製程物料成本。
請參閱圖1及圖2，所述藍膜片庫43用於存放藍膜片43n（n=1，2，…），所述上料機械手44抓取所述藍膜片43n並將其放置在晶片供應模組的晶片供應台41上，所述藍膜片43n上放置有多個晶片431，所述晶片供應台41進行水平移動，當多個晶片431中的某一個移動到所述頂針機構42的正上方時，所述頂針機構42向上運動，將晶片431頂起來，所述晶片拾取手6拾取這個晶片431，並軸向翻轉180度，以將晶片431放置在晶片轉載模組1的轉載台12上。所述晶片供應台41和所述晶片拾取手6配合，直到將一組晶片431放置在所述轉載台12上。
所述轉載台12設置在所述晶片供應台41上方，所述轉載台12具有一晶片吸附面，所述晶片吸附面與所述晶片供應台41上的晶片相對設置，所述晶片拾取手6位於所述轉載台12和所述晶片供應台41之間，從所述晶片供應台41上拾取晶片並軸向翻轉180度後交接給所述轉載台12。所述轉載台12將一組晶片431吸附住，輸送機構11驅動轉載台12移動至位置調整模組3的上方，所述位置調整模組3包括位置調整台31及設置於位置調整台31上的對準單元32和調整單元33，所述對準單元32對所述晶片431的位置進行檢測，若所述晶片431的位置有偏移，所述調整單元33移動至有偏移的晶片處，撥動晶片以將其調整到正確的位置，或者，當晶片431的偏移量太大不好調整時，所述調整單元33將所述有偏移的晶片431取下，再重新將晶片431放置在正確的位置上。優選的，所述對準單元32和所述調整單元33的數量可以為多個，多個所述對準單元32和所述調整單元33同時進行檢測和調整，提高了機台的效率。
當轉載台12上的一組晶片431均在正確的位置上時，所述輸送機構11驅動轉載台12移動至鍵合工位（即到達POS A工位），此處鍵合工位指的是將所述多個晶片431鍵合至所述載板22上形成鍵合片的位置。所述載板供應模組包括載板運動台21及設置於所述載板運動台21上的載板22，所述載板22上可以塗覆一層晶片保護材料，以保護晶片431不受損傷。所述轉載台12到達POS A工位，所述載板運動台21將載板22運送至POS A工位，使所述載板22與所述轉載台12上的晶片相對應，所述載板運動台21垂向運動，與所述轉載台12對接，用於將所述轉載台12攜帶的晶片鍵合在所述載板22上。優選的，所述載板供應模組還包括一檢測單元25，用於檢測所述轉載台12是否到達了POS A工位。
如圖3所示，所述封裝模組5包括封裝材料供給單元51、注塑單元52和用於承載封裝材料供給單元51和注塑單元52的封裝運動台53，所述封裝材料供給單元51可以存儲封裝材料並且對封裝材料進行加熱，優選的，所述封裝材料供給單元51可以是多個，多個封裝材料供給單元51可以存儲更多的封裝材料，減少更換或添加封裝材料的次數，增加了機台的產量。所述注塑單元52用於處理和傳輸封裝材料，其具有供封裝材料流出的流道，優選的，所述注塑單元52可以是多個，優選為兩個，兩個注塑單元52對稱分佈於所述載板運動台21上的載板22的兩側，所述注塑單元52可以對流道內的封裝材料進行加壓，以更好的控制封裝材料的流速。
參閱圖1至圖3，所述晶片431鍵合到位後，所述封裝模組5的封裝運動台53帶動所述材料供給單元51和注塑單元52向下移動，所述注塑單元52的流道與所述轉載台12與載板22間的空隙相對接，將封裝材料注入轉載台12與基底22之間，對一組晶片431進行封裝作業，形成封裝晶片23n（n=1，2，…）。所述轉載台12上用於吸附晶片的吸盤上形成有凸台，在封裝的過程中，所述轉載台12與載板運動台21之間保持鍵合動作，凸台可將晶片壓緊在載板22上，避免注塑的衝力使晶片移位。
待封裝完成後，所述封裝模組5複位，所述轉載台12移動至晶片供應模組上方處接收下一組晶片，所述載板22上承載著封裝晶片23n，所述載板運動台21將載板22移動至下料工位，即POS B工位，此處所述下料工位是指封裝好的晶片在載板上的將移入至封裝晶片庫的位置。所述下料機械手24抓取載板22上的封裝晶片23n，並將其放入封裝晶片庫23中，然後所述載板運動台21將所述載板22再移動回POS A工位，以此循環。
實施例二
請參閱圖4及圖5，本實施例中，晶片的鍵合和封裝不在同一步驟和工位中完成，如圖4所示，晶片431先在POS C工位被鍵合至載板22上，再在POS D工位上完成封裝。
請參閱圖6，本實施例中，所述封裝模組5不僅具有封裝材料供給單元51、注塑單元52和封裝運動台53，所述封裝模組5還包括儲膠供給單元54和塗膠單元55，優選的，儲膠供給單元54和塗膠單元55可以是多個，以增加塗膠效率。所述儲膠供給單元54將鍵合膠供給所述塗膠單元55，所述塗膠單元55將所述載板22的表面塗上鍵合膠，優選的，所述塗膠單元55可以對鍵合膠進行加壓，以更好的控制膠的流速。
具體的，所述載板22先停止在POS D工位，封裝模組5的封裝運動台53下降，所述塗膠單元55將鍵合膠均勻的塗覆在載板22的表面，塗膠完成後，封裝運動台53複位，所述載板22移動至POS C工位，所述轉載台12到達POS C工位後，與轉載台12配合將晶片431鍵合到載板22上，待晶片431在載板22上黏接牢固，形成鍵合片後，所述轉載台12複位，所述載板22再移動至POS D工位，封裝模組5的封裝運動台53下降，並進行封裝作業，形成了封裝好的封裝晶片23n。載板運動台21繼續運動將具有封裝晶片23n的載板21移至POS E工位，載板運動台21對所述封裝晶片23n進行加熱，使封裝晶片23n與載板22之間的鍵合膠失去黏性，下料機械手24抓取所述封裝晶片23n，並將其放置進封裝晶片庫23中，所述載板22再移動至POS D工位，以此循環。
本實施例中，對晶片431進行封裝前，在載板22表面塗一層鍵合膠，封裝完成後對所述封裝晶片23n進行加熱使膠失去黏性，將封裝晶片23n取下後載板22可直接被循環利用，避免了上片、下片等多道複雜工序。要說明的是，本發明並不限定本實施例所述的採用加熱的方式解鍵合，任何可使鍵合膠失去黏性的方法均在本發明的保護範圍內。本發明提供的半導體製造裝置集鍵合與封裝為一體，優化製造流程、減少了工序並降低設備成本，將現有技術中需要多台設備完成的工作由一台設備完成，降低設備成本。並且本發明中的載板可以快速重複使用，節省了現有製程物料成本。
上述僅為本發明的優選實施例而已，並不對本發明起到任何限制作用。任何所屬技術領域的技術人員，在不脫離本發明的技術方案的範圍內，對本發明揭露的技術方案和技術內容做任何形式的等同替換或修改等變動，均屬未脫離本發明的技術方案的內容，仍屬於本發明的保護範圍之內。
1‧‧‧晶片轉載模組11‧‧‧輸送機構12‧‧‧轉載台21‧‧‧載板運動台22‧‧‧載板23‧‧‧封裝晶片庫23n‧‧‧封裝晶片24‧‧‧下料機械手25‧‧‧檢測單元3‧‧‧位置調整模組31‧‧‧位置調整台32‧‧‧對準單元33‧‧‧調整單元41‧‧‧晶片供應台42‧‧‧頂針機構43‧‧‧藍膜片庫43n‧‧‧藍膜片431‧‧‧晶片44‧‧‧上料機械手5‧‧‧封裝模組51‧‧‧封裝材料供給單元52‧‧‧注塑單元53‧‧‧封裝運動台54‧‧‧儲膠供給單元55‧‧‧塗膠單元6‧‧‧晶片拾取手POS A‧‧‧鍵合及封裝工位POS B‧‧‧下料工位POS C‧‧‧鍵合工位POS D‧‧‧封裝工位POS E‧‧‧解鍵合工位
圖1及圖2為實施例一提供的半導體製造裝置的示意圖； 圖3為實施例一提供的封裝裝置的示意圖； 圖4及圖5為實施例二提供的半導體製造裝置的示意圖； 圖6為實施例二提供的封裝裝置的示意圖
1‧‧‧晶片轉載模組
11‧‧‧輸送機構
12‧‧‧轉載台
21‧‧‧載板運動台
22‧‧‧載板
23‧‧‧封裝晶片庫
23n‧‧‧封裝晶片
24‧‧‧下料機械手
25‧‧‧檢測單元
3‧‧‧位置調整模組
31‧‧‧位置調整台
32‧‧‧對準單元
33‧‧‧調整單元
41‧‧‧晶片供應台
42‧‧‧頂針機構
43‧‧‧藍膜片庫
43n‧‧‧藍膜片
431‧‧‧晶片
44‧‧‧上料機械手
5‧‧‧封裝模組
6‧‧‧晶片拾取手
POS A‧‧‧鍵合及封裝工位
POS B‧‧‧下料工位

Claims (11)

  1. 一種半導體製造裝置，其特徵在於包括：晶片供應模組，用於提供多個晶片；載板供應模組，包括載板、用於承載所述載板的載板運動台、封裝晶片庫和下料機械手，所述下料機械手用於從所述載板運動台上拾取所述封裝晶片後放置在所述封裝晶片庫中；晶片轉載模組，包括用於吸附所述多個晶片的晶片轉載台，其中所述晶片轉載台用於在第一位置處從所述晶片供應模組上交接所述多個晶片，所述晶片轉載台承載所述多個晶片至第二位置，以將所述多個晶片鍵合至所述載板上形成鍵合片；以及封裝模組，用於對所述載板運動台上的所述鍵合片進行封裝，以形成封裝晶片。
  2. 如請求項1所述的半導體製造裝置，其中所述晶片供應模組包括晶片供應台，所述晶片轉載台設置在所述晶片供應台上方，所述晶片轉載台具有一晶片吸附面與所述晶片供應台上的晶片相對設置，所述半導體製造裝置還包括位於所述晶片轉載台和所述晶片供應台之間的晶片拾取手，用於從所述晶片供應台上拾取晶片並軸向翻轉180度後交接給所述晶片轉載台。
  3. 如請求項2所述的半導體製造裝置，其中所述晶片供應模組還包括藍膜片庫、上料機械手及頂針機構，所述藍膜片庫中存儲有多個藍膜片，所述藍膜片上放置有所述多個晶片，所述上料機械手用於從所述藍膜片庫中拾取所述藍膜片後放置在所述晶片供應台上，所述頂針機構用於將所述藍膜片上的晶片頂起。
  4. 如請求項1所述的半導體製造裝置，其中所述半導體製造裝置還包括位置調整模組，所述位置調整模組位於所述晶片供應模組和所述載板供應模組之間，用於調整所述晶片轉載台上晶片的位置。
  5. 如請求項4所述的半導體製造裝置，其中所述位置調整模組包括對準單元和調整單元；所述調整單元用於當所述對準單元檢測到所述晶片的位置有偏移時，移動所述晶片。
  6. 如請求項1所述的半導體製造裝置，其中所述封裝模組包括封裝材料供給單元和一個或多個注塑單元；所述封裝材料供給單元用於存儲封裝材料並將封裝材料加熱後供給所述注塑單元，所述注塑單元用於處理封裝材料並輸送至所述鍵合片上。
  7. 如請求項6所述的半導體製造裝置，其中所述封裝模組包括兩個注塑單元對稱分佈於所述載板的兩側。
  8. 如請求項6或7所述的半導體製造裝置，其中每個所述注塑單元具有供所述封裝材料流出的流道，所述注塑單元的流道與所述轉載台與所述載板之間的空隙相對接。
  9. 如請求項6所述的半導體製造裝置，其中所述封裝模組還包括設置在所述注塑單元下方的儲膠供給單元和設置在所述儲膠供給單元上方的塗膠單元；所述儲膠供給單元用於將鍵合膠供給所述塗膠單元，所述塗膠單元用於將所述載板的表面塗上所述鍵合膠。
  10. 如請求項9所述的半導體製造裝置，其中所述載板運動台能夠對所述載板進行加熱。
  11. 如請求項9所述的半導體製造裝置，其中所述晶片轉載模組還包括輸送機構，所述晶片轉載台設置於所述輸送機構上，所述輸送機構用於驅動所述晶片轉載台運動。
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