WO2018159267A1 - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
- Publication number
- WO2018159267A1 WO2018159267A1 PCT/JP2018/004634 JP2018004634W WO2018159267A1 WO 2018159267 A1 WO2018159267 A1 WO 2018159267A1 JP 2018004634 W JP2018004634 W JP 2018004634W WO 2018159267 A1 WO2018159267 A1 WO 2018159267A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- epoxy resin
- resin composition
- parts
- mass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Definitions
- the present invention relates to an epoxy resin composition having excellent adhesion to Ni.
- epoxy resin compositions are widely used in electrical / electronic equipment parts, automobile parts, aviation parts, building materials, and the like.
- a thermosetting epoxy resin composition is widely used for assembling a camera module such as a CMOS sensor.
- an epoxy resin composition having an adhesive force capable of withstanding impact and vibration accompanying carrying is required.
- Ni members are frequently used for these members from the viewpoint of electrical conductivity, there is a problem that adhesion is difficult with conventional epoxy resin compositions.
- JP 2016-021033 discloses (1) siloxane-modified epoxy resin, (2) phenol resin, (3) latent curing agent, (4) rubber filler having an average particle diameter of 0.01 to 1 ⁇ m, and (5) average An impact-resistant adhesive for camera modules containing a rubber filler having a particle diameter of 4 to 6 ⁇ m and (6) an inorganic filler having an average particle diameter of 0.01 to 10 ⁇ m is disclosed.
- the present invention has been made in view of the above situation, and an object thereof is to provide an epoxy resin composition having high adhesive strength to Ni.
- the present invention has the following gist.
- a first embodiment of the present invention is an epoxy resin composition for adhesion of electronic components containing the following components (A) to (C):
- Component A component for curing the (A) component.
- a second embodiment of the present invention is the epoxy resin composition according to the first embodiment, wherein the component (B) is a polystyrene filler of a styrene-divinylbenzene copolymer.
- a third embodiment of the present invention is the epoxy resin composition according to any one of the first or second embodiments, wherein the electronic component is a camera module.
- the component (B) is contained in an amount of 1.5 to 120 parts by mass with respect to 100 parts by mass of the component (A).
- the epoxy resin composition is contained in an amount of 1.5 to 120 parts by mass with respect to 100 parts by mass of the component (A).
- the fifth embodiment of the present invention is a cured product obtained by curing the epoxy resin composition according to any one of the first to fourth embodiments.
- the sixth embodiment of the present invention is a camera module formed by bonding with the epoxy resin composition according to any one of the first to fourth embodiments.
- the epoxy resin composition for bonding electronic parts of the present invention is: (A) component: a compound having an epoxy group, (B) component: polystyrene filler having a glass transition point of 50 ° C. or higher, and (C) component: a component for curing the (A) component, It is characterized by containing.
- this invention can provide the epoxy resin composition which has the high adhesive strength with respect to Ni.
- (A) component of this invention is a compound which has an epoxy group, and if it is a compound which has 1 or more of epoxy groups in 1 molecule, it will not specifically limit. Moreover, (A) component is obtained by condensation with epichlorohydrin, phenols, such as bisphenol, and alcohol.
- (A) component For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, glycidylamine Type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin and the like.
- Other examples include, but are not limited to, glycidyl ester type epoxy resins obtained by condensation of epichlorohydrin with carboxylic acids such as phthalic acid derivatives and fatty acids, and epoxy resins modified by various methods. These may be used alone or in combination.
- bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferable from the viewpoint that the resin is easily available.
- Examples of commercially available products of the component (A) include jER828, 1001, 806, 807, 152, 604, 630, 871, YX8000, YX8034, manufactured by Mitsubishi Chemical Corporation, Epicron 830, EXA-830LVP, EXA- 850CRP, EXA-835LV, HP4032D, HP4700, HP820 (manufactured by DIC Corporation), EP4100, EP4000, EP4000G, EP4000E, EP4000TX, EP4400, EP4520S, EP4530, EP4901, EP4080, EP4085, EP4088, EPU7NEP200 10N (manufactured by ADEKA Corporation), Denacol EX-121, EX146, EX411, EX314, EX201, EX212 EX216, EX252 (manufactured by Nagase ChemteX Corporation), TEPIC, TEPIC-S, TEPIC-VL (manufactured by
- the component (B) of the present invention is a polystyrene filler having a glass transition point (Tg) of 50 ° C. or higher, and is a polystyrene filler obtained by polymerizing or copolymerizing at least one styrene derivative.
- Tg glass transition point
- these styrene derivatives include compounds containing styrene and other halogens, alkyl groups, esters, sulfonates, etc.
- styrene such as metachlorostyrene, parachlorostyrene, parafluorostyrene, paramethoxystyrene
- examples include, but are not limited to, meta tertiary butoxystyrene, paravinyl benzoic acid, paramethyl- ⁇ -methylstyrene, divinylbenzene, and vinyl toluene.
- Monomers that can be copolymerized with styrene derivatives include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, acrylic Acrylic acid esters such as acid-n-butyl and methacrylic acid-n-butyl, or methacrylic acid esters, acrylic nitriles such as acrylonitrile and methacrylonitrile, or methacrylonitriles, and acrylic aldehydes such as acrolein and methacrolein Or methacrylic aldehydes, acrylamide, methacrylamide, N-methylol-acrylamide, N-methylol-methacrylamide, methylenebisacrylamide, methylenebismethacrylamide, etc.
- unsaturated carboxylic acids such as acrylic acid, methacrylic acid, ita
- vinyl monomers such as vinyl acetate, vinyl pyridine, N-vinyl pyrrolidone, vinyl chloride, vinylidene chloride and vinyl bromide, but are not limited thereto. It is not something. These may be used alone or in combination.
- a polystyrene filler of a copolymer of styrene derivatives is preferable, and a polystyrene filler of a copolymer of styrene and divinylbenzene is more preferable.
- the glass transition point (Tg) of the component (B) may be 50 ° C. or higher, more preferably 60 ° C. or higher, and particularly preferably 70 ° C. or higher.
- the epoxy resin composition which has the high adhesive force with respect to Ni can be obtained because the glass transition point of a component is 50 degreeC or more. Further, since the glass transition point of the component (B) is high, the glass transition point of the cured product of the epoxy resin composition itself is difficult to be lowered, so that it is difficult for the adhesive force to decrease due to temperature changes in the use environment.
- the upper limit value of the glass transition point of the component (B) is not particularly limited, but may be about 120 ° C. or less.
- the glass transition point of (B) component is 120 degrees C or less, since a glass transition point (Tg) is too high and it becomes brittle, it is preferable.
- Tg glass transition point
- the substance is an amorphous solid
- solids that are not as solid (high rigidity) and have no fluidity at low temperatures flow rapidly as the stiffness and viscosity rapidly decrease in a narrow temperature range due to heating. Increases nature.
- Such a temperature is the glass transition point.
- the glass transition point can be measured by the TMA method or DMA method (tan ⁇ peak), which measures changes in mechanical properties while changing the sample temperature at a constant rate, and endotherm while changing the sample temperature at a constant rate.
- DSC for measuring exotherm, but not limited thereto. Of these, the DSC measurement method is preferred because the shape of the sample is not selected.
- the shape of the component (B) is preferably spherical, and the average particle size thereof is preferably in the range of 0.01 ⁇ m to 30 ⁇ m, more preferably in the range of 0.03 ⁇ m to 20 ⁇ m, particularly preferably 0.8. The range is from 05 ⁇ m to 10 ⁇ m.
- the epoxy resin composition which can obtain the outstanding workability without becoming high viscosity because the average particle diameter of a component is 0.01 micrometer or more, and has the high adhesive force with respect to Ni because it is 30 micrometers or less. can get.
- the average particle diameter is a 50% particle diameter (D50 value) in the number cumulative distribution measured by a laser diffraction particle size distribution measuring apparatus.
- the content of the component (B) is not particularly limited, but may include 1.5 to 120 parts by weight, more preferably 2 to 110 parts by weight, with respect to 100 parts by weight of the component (A). Preferably 2.5 to 100 parts by mass can be contained, and particularly preferably 3 to 95 parts by mass.
- An epoxy resin composition having a high adhesion to Ni can be obtained when the content of the component (B) is 1.5 parts by mass or more, while the content of the component (B) is 120 parts by mass or less. Therefore, excellent workability can be obtained without increasing the viscosity.
- content of the said (B) component is the said range, the resin composition strong in both T-type peeling adhesive strength and tensile shear adhesive strength can be provided. In particular, both the tensile shear adhesive strength of 10 MPa or more and the T-type peel adhesive strength of 400 N / m or more can be satisfied, which is optimal (see Tables 1-1 to 1-2 in the examples).
- (C) component of this invention is a component which hardens said (A).
- the component (C) include a curing agent, a latent curing agent, a cationic photopolymerization initiator, and a photobase generator.
- the curing agent is generally a liquid to a semi-solid at 25 ° C.
- the latent curing agent is a solid at 25 ° C., and these are activated by stimulation of heating to cure the component (A). If so, there is no particular limitation.
- the cationic photopolymerization initiator and the photobase generator are not particularly limited as long as they are stable in the dark, but can be activated by light stimulation to cure the component (A).
- the curing agent include, for example, aliphatic and aromatic amine compounds, ketimine compounds, aliphatic and aromatic thiol compounds, imidazole and derivatives thereof, acid anhydride compounds, polyamide compounds, hydrazide compounds, phenol novolacs, cresol novolacs. And novolak resins.
- Specific examples of the latent curing agent include amine adduct compounds, urea adduct compounds, imidazole adduct compounds, dicyandiamide and derivatives thereof.
- Examples of the photocationic polymerization initiator include iron-allene complex compounds, aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, onium salts, pyridinium salts, aluminum complexes / silanol salts, and trichloromethyltriazine derivatives.
- Examples of the photobase generator include ⁇ -aminoketone compounds, piperidine derivatives, phosphonium cation borate salts, alkali metal cation borate salts, ammonium cation borate salts, cyclohexyl carbamate derivatives, amine imide compounds, and the like.
- a curing agent or a latent curing agent is preferable because it can adhere to a portion that is not exposed to light, and is a substance that is stable at room temperature and quickly initiates a curing reaction by heating at a relatively low temperature.
- it is preferable that one or more of aliphatic and aromatic thiol compounds, amine adduct compounds, urea adduct compounds, and imidazole adduct compounds are included.
- amine adduct compound and urea adduct compound include Amicure PN-23, Amicure PN-31J, Amicure MY-24, Amicure MY-D, Amicure MY-H, etc.
- the content of the component (C) is not particularly limited, but is preferably 0.3 to 95 parts by mass, more preferably 1 to 80 parts by mass with respect to 100 parts by mass of the component (A). More preferably, it can be contained in an amount of 3 to 75 parts by mass. It is possible to obtain excellent cured product properties when the content of the component (C) is 0.3 parts by mass or more, while storage stability is achieved when the content of the component (C) is 95 parts by mass or less. Excellent in properties.
- the epoxy resin composition of the present invention includes a storage stabilizer, a filler, a conductive filler, an antioxidant, a light stabilizer, a heavy metal deactivator, a silane coupling agent, and a tackifier as long as the object of the present invention is not impaired.
- the epoxy resin composition of the present invention may contain (add) a storage stabilizer.
- the storage stabilizer is not particularly limited as long as it improves storage stability.
- a boric acid ester compound, phosphoric acid, alkyl phosphate ester, p-toluenesulfonic acid, methyl p-toluenesulfonate, etc. Also good.
- the boric acid ester compound include trimethyl borate, triethyl borate, tri-n-propyl borate, triisopropyl borate, tri-n-butyl borate, tris (2-ethylhexyloxy) borane, triphenyl borate, trimethoxyboro Xin and the like.
- boric acid ester compounds examples include “Cure Duct L-07N” (manufactured by Shikoku Kasei Kogyo Co., Ltd.).
- alkyl phosphate ester examples include trimethyl phosphate and tributyl phosphate, but are not limited thereto.
- Storage stabilizers may be used alone or in combination. In view of storage stability, phosphoric acid, tributyl borate (tri-n-butyl borate), trimethoxyboroxine, and methyl p-toluenesulfonate are preferable.
- the content of the storage stabilizer is preferably 0.01 to 5.0 parts by mass with respect to 100 parts by mass of component (A).
- the content of the storage stabilizer is 0.01 parts by mass or more, storage stability is exhibited, and when it is 5.0 parts by mass or less, curability can be maintained.
- the epoxy resin composition of the present invention may contain (add) a filler that does not impair storage stability for the purpose of improving the elastic modulus and fluidity of the cured product.
- a filler that does not impair storage stability for the purpose of improving the elastic modulus and fluidity of the cured product.
- Specific examples include organic powders and inorganic powders other than the component (B).
- the filler for the inorganic powder examples include glass, fumed silica, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, dry clay mineral, and dry diatomaceous earth. It is not limited to these. These may be used alone or in admixture of two or more.
- the filler content of the inorganic powder is preferably about 0.1 to 200 parts by mass with respect to 100 parts by mass of component (A). When the content of the filler of the inorganic powder is 0.1 parts by mass or more, the resin strength is improved, and when it is 200 parts by mass or less, the handleability at the time of application can be ensured.
- the filler of the inorganic powder is preferably spherical, and the average particle size is preferably in the range of 0.1 to 100 ⁇ m.
- the average particle size of the inorganic powder filler is 0.1 ⁇ m or more, so that it does not have a low viscosity and has excellent workability (coating property, paint film stretchability, uniform stretch-free paint film formability) When the thickness is 100 ⁇ m or less, excellent workability (coating property, stretchability of the coating film, formability of a uniform stretched coating film without unevenness, etc.) can be obtained.
- the average particle diameter is a 50% particle diameter (D50 value; also referred to as 50% average particle diameter) in a number cumulative distribution measured by a laser diffraction particle size distribution measuring apparatus.
- the maximum particle size of the inorganic powder filler Is preferably 100 ⁇ m or less.
- the fumed silica is blended for the purpose of adjusting the viscosity of the epoxy resin composition or improving the mechanical strength of the cured product.
- fumed silica or the like surface-treated with dimethylsilane, trimethylsilane, alkylsilane, methacryloxysilane, organochlorosilane, polydimethylsiloxane, hexamethyldisilazane, or the like is used.
- Examples of commercially available fumed silica include Aerosil R972, R972V, R972CF, R974, R976, R976S, R9200, RX50, NAX50, NX90, RX200, RX300, R812, R812S, R8200, RY50, NY50, RY200S, RY200, RY300, R104, R106, R202, R805, R816, T805, R711, RM50, R7200 and the like (manufactured by Nippon Aerosil Co., Ltd.) are exemplified, but not limited thereto. These may be used alone or in admixture of two or more.
- Examples of the filler for the organic powder other than the component (B) include, but are not limited to, polyethylene, polypropylene, nylon, crosslinked acrylic, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate. These may be used alone or in admixture of two or more.
- the content of the organic powder filler is preferably about 0.1 to 200 parts by mass with respect to 100 parts by mass of component (A). When the content of the organic powder filler is 0.1 parts by mass or more, the resin strength is improved, and when the content is 200 parts by mass or less, handleability at the time of application can be ensured.
- the organic powder filler preferably has a spherical shape, and the average particle diameter is preferably in the range of 0.1 to 100 ⁇ m.
- the average particle size of the organic powder filler is 0.1 ⁇ m or more, so that it does not have a low viscosity and has excellent workability (coating property, stretchability of the coating film, and formation of a uniform stretch-free coating film.
- the thickness is 100 ⁇ m or less, excellent workability (coating property, stretchability of the coating film, formability of a uniform stretched coating film without unevenness, etc.) can be obtained.
- the average particle diameter is a 50% particle diameter (D50 value; also referred to as 50% average particle diameter) in a number cumulative distribution measured by a laser diffraction particle size distribution measuring apparatus.
- the maximum particle size of the filler of the organic powder Is preferably 100 ⁇ m or less.
- the epoxy resin composition of the present invention may contain (add) a conductive filler.
- a conductive filler examples include, but are not limited to, gold, silver, platinum, nickel, palladium, and plated particles obtained by coating a metal thin film on organic polymer particles. These may be used alone or in admixture of two or more.
- the epoxy resin composition of the present invention may contain (add) an antioxidant.
- an antioxidant include ⁇ -naphthoquinone, 2-methoxy-1,4-naphthoquinone, methyl hydroquinone, hydroquinone, hydroquinone monomethyl ether, mono-tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, p Quinone compounds such as benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tert-butyl-p-benzoquinone; phenothiazine, 2,2-methylene-bis (4-methyl-6-tert- Butylphenol), catechol, tert-butylcatechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, 2-tert-butyl-6- (3-tert-butyl-2- Hydroxy-5-methylbenzyl) -4-methyl Ph
- the epoxy resin composition of the present invention may contain (add) a silane coupling agent.
- silane coupling agents include ⁇ -chloropropyltrimethoxysilane, octenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and ⁇ -glycidoxy.
- Propyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -amino Examples include, but are not limited to, propylmethyldimethoxysilane, ⁇ -ureidopropyltriethoxysilane, and p-styryltrimethoxysilane. These may be used alone or in admixture of two or more.
- the content of the silane coupling agent is preferably 0.05 to 30 parts by mass, more preferably 0.2 to 10 parts by mass with respect to 100 parts by mass of the component (A).
- the content of the silane coupling agent is 0.05 parts by mass or more, the adhesion to the adherend is improved, and when it is 30 parts by mass or less, the outgas generation amount can be suppressed.
- the epoxy resin composition of the present invention may contain (add) a compound having a (meth) acryl group.
- the compound having a (meth) acryl group include ethylene glycol diacrylate, ethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A dimethacrylate, and ethoxylated tri Methylolpropane triacrylate, ethoxylated trimethylolpropane trimethacrylate, ethoxylated glycerin triacrylate, ethoxylated glycerin trimethacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetramethacrylate, ethoxylated dipentaerythritol hexaacrylate, polyglycerol mono Eth
- the epoxy resin composition of the present invention may contain (add) a compound that generates radicals by light irradiation.
- a compound that generates radicals upon irradiation with light include benzoin derivatives such as benzoin and benzoin ether, quinones such as anthraquinone, sulfide compounds such as diphenyldisulfide, ketones such as Michler's ketone, carbon tetrabromide and the like.
- examples thereof include halides, but are not limited thereto. These may be used alone or in admixture of two or more.
- the epoxy resin composition of the present invention can be produced by a conventionally known method. For example, a predetermined amount of the components (A) to (C) is blended, and using a mixing means such as a three-roll, planetary mixer, etc., preferably at a temperature of 10 to 50 ° C., preferably 0.1 to It can be produced by mixing for 5 hours.
- a mixing means such as a three-roll, planetary mixer, etc., preferably at a temperature of 10 to 50 ° C., preferably 0.1 to It can be produced by mixing for 5 hours.
- the epoxy resin composition for bonding electronic parts according to the present invention are preferably used as coating agents, casting resins, sealing agents, potting agents, adhesives, coating agents, and linings for bonding electronic components. Agents, inks and the like.
- the epoxy resin composition for adhering electronic parts of the present invention has a high adhesive strength to Ni, and is therefore suitable for adhering electronic parts using Ni members.
- it can be used for bonding an electronic component such as a camera module component, and among others, it can be used for bonding an electronic component of an actuator or an electronic component of a housing and a substrate, but is not limited thereto.
- the present invention provides a cured product obtained by curing the epoxy resin composition for adhesion of electronic parts of the present invention.
- a cured product has high adhesive strength to the Ni member, and from the viewpoint of electrical conductivity, the camera module using the Ni member (including the Ni plated member; the same applies hereinafter) can be firmly joined to carry it. It is possible to provide a camera module that can withstand the accompanying shock and vibration.
- the cured product has a high adhesive strength with respect to the Ni member, so that each constituent member of the actuator using the Ni-plated member can be firmly joined from the viewpoint of conductivity. An actuator that can withstand friction and load can be provided.
- the above-mentioned cured product is produced when the electronic component receives and is handled by being able to firmly bond the housing and the substrate in which the Ni-plated member is used from the viewpoint of conductivity due to the high adhesive strength to the Ni member. It is possible to provide an electronic component with a built-in substrate that can withstand various types of shocks, vibrations, friction, and loads.
- a camera module formed by bonding (each component part) with the epoxy resin composition for bonding electronic parts of the present invention Due to the high adhesive strength of the epoxy resin composition to the Ni member, the camera module using the Ni member (including Ni-plated member; the same shall apply hereinafter) from the viewpoint of conductivity can withstand the impact and vibration associated with carrying. .
- the actuator formed by bonding (each component) with the epoxy resin composition for bonding electronic components of the present invention can be provided. Due to the high adhesive strength of the epoxy resin composition to the Ni member, it is possible to withstand the impact, vibration, friction, and load associated with the complicated operation of the actuator using the Ni member from the viewpoint of conductivity.
- attachment of this invention can be provided. Due to the high adhesive strength of the epoxy resin composition to the Ni member, it can withstand various impacts, vibrations, friction, and loads that may occur during transportation and handling of the electronic component in which the Ni member is used from the viewpoint of conductivity. Can be obtained.
- ⁇ (A) component> Epoxy resin composition comprising 50% by mass of bisphenol A type epoxy resin and 50% by mass of bisphenol F type epoxy resin (EXA-835LV, epoxy equivalent of 160 to 170 g / eq, manufactured by DIC Corporation)
- a2 Epoxy resin component of polybutadiene rubber dispersed bisphenol F type epoxy resin (MX-139, 67% by mass of epoxy resin component, manufactured by Kaneka Corporation).
- ⁇ (B) component> b1: Styrene filler of styrene-divinylbenzene copolymer (Fine Pearl PB-3006E, spherical filler having an average particle diameter of 0.6 ⁇ m, Tg 90 to 110 ° C., manufactured by Matsuura Corporation).
- c1 Amine adduct-based latent curing agent (FXR-1081, manufactured by T & K TOKA Corporation)
- c2 Imidazole adduct-based latent curing agent (PN-31J, manufactured by Ajinomoto Fine Techno Co., Ltd.)
- c3 First grade tetrafunctional aliphatic thiol curing agent (PEMP2-20P, manufactured by SC Organic Chemical Co., Ltd.).
- d1 50% average particle size: 3.5 ⁇ m, maximum particle size: 32 ⁇ m alumina powder (AX3-32, manufactured by Micron)
- d2 Silica powder (SO-C2, manufactured by Admatechs Co., Ltd.) having a 50% average particle diameter: 0.55 ⁇ m and a specific surface area: 6.0 m 2 / g.
- Table 1-1 shows the content (parts by mass) of each component (raw material) of the epoxy resin composition used in Examples and Comparative Examples.
- the test methods used in the examples and comparative examples shown in Table 1-2 are as follows. The test results obtained are shown in Table 1-2.
- ⁇ Glass transition point measurement> The epoxy resin composition was cured at 80 ° C. for 30 minutes to produce a cylindrical cured product having a diameter of 5 mm, and was cut into a length of 10 mm. Measurement was performed by increasing the temperature at a temperature increase rate of 10 ° C./min with TMA (thermomechanical analyzer). “Linear expansion coefficient ( ⁇ 1) (ppm / ° C.)” and “Linear expansion coefficient ( ⁇ 2) (ppm / ° C.)” were measured, and “glass transition point (° C.)” was measured by the intersection of tangent lines of ⁇ 1 and ⁇ 2. .
- TMA thermomechanical analyzer
- Test pieces Ni-plated plate: 25 mm ⁇ 100 mm ⁇ 1.6 mm, SPCC-SD (the surface of the cold-rolled steel sheet is usually finished (dull finish)) Ni-plated 5 ⁇ m made by Test Piece Co., Ltd.) Glued. After the epoxy resin composition is applied to the end of one test piece and stretched uniformly, the other test piece is bonded so that the adhesive surface is 25 mm in the width direction and 10 mm in the length direction. In the state fixed by, it heated at 80 degreeC for 30 minutes with the hot-air drying furnace, and was hardened.
- test piece After the temperature of the test piece returned to room temperature, the prepared test piece was measured with a tensile tester at a tensile rate of 10 mm / min, and was defined as “tensile shear bond strength” (MPa). The details of the test are in accordance with JISK6850.
- Test pieces bent into L-shapes (Ni-plated plate: 25 mm x 150 mm x 0.5 mm, but bent into an L-shape at a point of 100 mm in length, SPCC-SD Ni-plated 5 ⁇ m, manufactured by Test Piece Co., Ltd.) Bonding was performed by the following procedure. After applying the epoxy resin composition to a 100 mm long surface of one test piece and extending it uniformly, the other test piece is bonded in a T-shape and fixed with a jig. It was cured by heating at 80 ° C. for 30 minutes in a drying furnace.
- test piece After the temperature of the test piece returned to room temperature, the prepared test piece was measured with a tensile tester at a pulling speed of 50 mm / min to obtain “T-type peel adhesion strength” (N / m). The details of the test are in accordance with JISK6854-3.
- the present invention is an epoxy resin composition having high adhesive strength to Ni members.
- a resin having a strong T-type peel adhesive strength has a general tendency that a tensile shear adhesive strength is weak.
- it turns out that it is excellent at the point which can provide a strong epoxy resin composition with both T-type peeling adhesive strength and tensile shear adhesive strength.
- the Ni member can satisfy both a tensile shear bond strength of 10 MPa or more and a T-type peel bond strength of 400 N / m or more ( It ’s good)
- Comparative Examples 1 and 2 do not contain the component (B) of the present invention, but Comparative Example 1 has poor T-type peel adhesion strength, and Comparative Example 2 has tensile shear adhesion. The strength and the T-type peel adhesion strength were inferior. Further, in Comparative Examples 3 to 9, the amount of the filler b′1 to b′7 which is not the component (B) of the present invention (component b1) is used as the constant amount (15 parts by mass). It was found that the tensile shear adhesive strength and the T-type peel adhesive strength were inferior to those of Example 1 used.
- Comparative Examples 1 to 9 that do not satisfy the requirements of the present invention, it is not possible to satisfy both of the Ni member with a tensile shear bond strength of 10 MPa or more and a T-type peel bond strength of 400 N / m or more. Recognize.
- Examples 1 to 3 and Comparative Examples 2 to 9 all use an amine adduct type curing agent (component c1), but the glass transition of the cured product.
- the points are higher in Examples 1 to 3 containing the component (B) than in Comparative Example 2 containing no component (B), and Comparative Example 2 containing no component (B)
- the results of Comparative Examples 3 to 9 containing fillers other than the component (B) were lower.
- Examples 4 to 6 and Comparative Example 1 both use an imidazole adduct-based curing agent (c2 component) and a thiol-based curing agent (c3 component) at the same blending ratio.
- the glass transition point was higher in Examples 4 to 6 containing the component (B) than in Comparative Example 1 containing no component (B).
- the viscosity of the epoxy resin composition depends on the kind of the fillers d1 and d2 components of the inorganic powder other than the component (B) and the difference in the content. It was found that the viscosity was higher when the larger d1 component was used. Furthermore, since (B) component is also a filler, it turned out that a viscosity increases with the increase in the content.
- LCP Liquid Crystal Polymer
- the epoxy resin compositions of Examples 4 to 6 and Comparative Example 1 are both imidazole adduct type curing agents (c2 component) and thiol.
- Comparative Curing Agent (c3 Component) is used at the same blending ratio, but in the cured products of Examples 4 to 6, the (B) Component is contained and the Comparative Example does not contain the (B) Component It turned out that it has higher adhesive force (about 2 times) to the LCP (liquid crystal polymer) member than the cured product of 1.
- the epoxy resin composition for adhering electronic parts of the present invention is an epoxy resin composition having a high adhesive force with respect to Ni, it is suitably used for applications in which Ni members are used.
- it can be used for bonding an electronic component such as a camera module component, and in particular, it can be used for bonding an electronic component of an actuator or an electronic component of a housing and a substrate.
- it is extremely effective as a coating agent, a casting resin, a sealing agent, a potting agent, an adhesive, a coating agent and the like, and is industrially useful because it can be applied to a wide range of fields.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
(A)成分:エポキシ基を有する化合物
(B)成分:ガラス転移点が50℃以上のポリスチレン系フィラー
(C)成分:(A)成分を硬化させる成分。
(A)成分:エポキシ基を有する化合物、
(B)成分:ガラス転移点が50℃以上のポリスチレン系フィラー、および
(C)成分:(A)成分を硬化させる成分、
を含有することを特徴とするものである。かかる構成を有することにより、本発明は、Niに対する高い接着強度を有するエポキシ樹脂組成物を提供することができる。
本発明の(A)成分はエポキシ基を有する化合物であり、1分子中にエポキシ基を1以上有する化合物であれば特に限定されない。また、(A)成分は、エピクロルヒドリンとビスフェノール類などのフェノール類やアルコールとの縮合によって得られるものである。
本発明の(B)成分はガラス転移点(Tg)が50℃以上のポリスチレン系フィラーであり、少なくとも一種のスチレン誘導体を重合または共重合させたポリスチレン系フィラーである。これらスチレン誘導体としては、スチレンを含み、その他ハロゲンやアルキル基やエステルやスルホン酸塩等をスチレンに付加させた化合物が挙げられ、例えばメタクロロスチレン、パラクロロスチレン、パラフロロスチレン、パラメトキシスチレン、メタターシャリーブトキシスチレン、パラビニル安息香酸、パラメチル-α-メチルスチレン、ジビニルベンゼン、ビニルトルエン等が挙げられるが、これらに限定されるものではない。またスチレン誘導体と共重合できるモノマーは、例えばアクリル酸、メタクリル酸、イタコン酸、マレイン酸、フマール酸等の不飽和カルボン酸類、例えばアクリル酸メチル、メタクリル酸メチル、アクリル酸エチル、メタクリル酸エチル、アクリル酸-n-ブチル、メタクリル酸-n-ブチル等のアクリル酸エステル類またはメタクリル酸エステル類、アクリロニトリル、メタクリロニトリル等のアクリル酸ニトリル類またはメタクリル酸ニトリル類、アクロレイン、メタクロレイン等のアクリル酸アルデヒド類またはメタクリル酸アルデヒド類、アクリルアミド、メタクリルアミド、N-メチロール-アクリルアミド、N-メチロール-メタクリルアミド、メチレンビスアクリルアミド、メチレンビスメタクリルアミド等のアクリル酸アミド類またはメタクリル酸アミド類、イソプレン等の共役ジエン類、酢酸ビニル、ビニルピリジン、N-ビニルピロリドン、塩化ビニル、塩化ビニリデン、臭化ビニル等のビニル単量体等が挙げられるがこれらに限定されるものではない。これらは単独あるいは混合で使用してもよい。これらの(B)成分の中でもNiに対する接着強度が高いという観点から、スチレン誘導体同士の共重合体のポリスチレン系フィラーが好ましく、さらに好ましくはスチレンとジビニルベンゼンの共重合体のポリスチレン系フィラーである。
本発明の(C)成分は前記(A)を硬化させる成分である。前記(C)成分としては、硬化剤、潜在性硬化剤、光カチオン重合開始剤、光塩基発生剤等が挙げられる。前記硬化剤は一般的に25℃で液体から半固体であり、前記潜在性硬化剤は25℃で固体であり、これらは加熱の刺激により活性化して、前記(A)成分を硬化させられる物質であれば特段の制限はない。また前記光カチオン重合開始剤や前記光塩基発生剤は暗所では安定だが、光の刺激により活性化して前記(A)成分を硬化させられる物質であれば特段の制限はない。これらは従来公知の材料を利用することができ、それぞれ単独で用いてもよく、また2種類以上を混合して用いてもよい。前記硬化剤の具体例としては例えば、脂肪族及び芳香族アミン化合物、ケチミン化合物、脂肪族及び芳香族チオール化合物、イミダゾール及びその誘導体、酸無水物化合物、ポリアミド化合物、ヒドラジド化合物、フェノールノボラック、クレゾールノボラック等のノボラック樹脂が挙げられる。潜在性硬化剤の具体例としては例えば、アミンアダクト化合物、尿素アダクト化合物、イミダゾールアダクト化合物、ジシアンジアミド及びその誘導体等が挙げられる。光カチオン重合開始剤としては例えば、鉄-アレン錯体化合物、芳香族ジアゾニウム塩、芳香族ヨードニウム塩、芳香族スルホニウム塩、オニウム塩、ピリジニウム塩、アルミニウム錯体/シラノール塩、トリクロロメチルトリアジン誘導体等が挙げられる。光塩基発生剤としては例えば、α-アミノケトン化合物、ピペリジン誘導体、ホスホニウムカチオンボレート塩、アルカリ金属カチオンボレート塩、アンモニウムカチオンボレート塩、シクロヘキシルカーバメート誘導体、アミンイミド化合物等が挙げられる。
本発明のエポキシ樹脂組成物は、本発明の目的を損なわない範囲で、保存安定剤、充填剤、導電性フィラー、酸化防止剤、光安定剤、重金属不活性剤、シランカップリング剤、タッキファイヤー、可塑剤、消泡剤、顔料、防錆剤、レベリング剤、分散剤、レオロジー調整剤、難燃剤、(メタ)アクリル基を有する化合物、光照射によりラジカルを発生する化合物及び界面活性剤等の添加剤を使用することができる。
各成分を表1に示す重量部で採取し、25℃環境下でプラネタリーミキサーで60分混合し、エポキシ樹脂組成物を調製し、各種物性に関して次のようにして測定した。
a1:ビスフェノールA型エポキシ樹脂50質量%、ビスフェノールF型エポキシ樹脂50質量%からなるエポキシ樹脂組成物(EXA-835LV、エポキシ当量160~170g/eq、DIC株式会社製)
a2:ポリブタジエンゴム分散ビスフェノールF型エポキシ樹脂のエポキシ樹脂成分(MX-139、エポキシ樹脂成分67質量%、株式会社カネカ製)。
b1:スチレン-ジビニルベンゼン共重合体のスチレン系フィラー(ファインパールPB-3006E、平均粒径0.6μm球状フィラー、Tg=90~110℃、松浦株式会社製)。
b’1:ポリブタジエンゴム分散ビスフェノールF型エポキシ樹脂のゴム成分(MX-139、ゴム成分33質量%、平均粒径0.1μm球状フィラー、Tg=-105~-75℃、株式会社カネカ製)
b’2:スチレンブタジエンゴム(平均粒径0.05~0.15μm球状フィラー、Tg=-75~-44℃)
b’3:スチレンブタジエンゴム(平均粒径0.1~0.3μm球状フィラー、Tg=-75~-44℃)
b’4:アクリルゴム(平均粒径0.5μm球状フィラー、Tg=-20~-10℃)
b’5:アクリルゴム(平均粒径0.3~0.4μm球状フィラー、Tg=-20~-10℃)
b’6:シリコーンゴム(平均粒径0.4μm球状フィラー、Tg=-125~-112℃)
b’7:アクリル系コアシェルゴム(F-351、平均粒径0.3μm球状フィラー、Tg=70℃、アイカ工業株式会社製)。
c1:アミンアダクト系潜在性硬化剤(FXR-1081、株式会社T&K TOKA製)
c2:イミダゾールアダクト系潜在性硬化剤(PN-31J、味の素ファインテクノ株式会社製)
c3:1級4官能脂肪族チオール硬化剤(PEMP2-20P、SC有機化学株式会社製)。
d1:50%平均粒径:3.5μm、最大粒径:32μmのアルミナ粉(AX3-32、マイクロン社製)
d2:50%平均粒径:0.55μm、比表面積:6.0m2/gのシリカ粉(SO-C2、株式会社アドマテックス製)。
0.5mlのエポキシ樹脂組成物を採取して、測定用カップに吐出した。以下の条件で、EHD型粘度計(東機産業株式会社製)にて粘度[Pa・s]を測定した。
コーンローター:3°×R14
回転速度:1rpm
測定時間:3分
測定温度:25℃。
エポキシ樹脂組成物を80℃雰囲気で30分硬化させ、直径5mmの円筒形硬化物を作製し、長さ10mmに切断した。TMA(熱機械分析装置)により昇温速度10℃/minで昇温して測定を行った。「線膨張率(α1)(ppm/℃)」、「線膨張率(α2)(ppm/℃)」を測定し、α1とα2の接線の交点により「ガラス転移点(℃)」を測定した。
試験片(Niメッキ板:25mm×100mm×1.6mm、SPCC-SD(冷間圧延鋼板の表面を通常仕上げ(ダル仕上げ)したもの) Niメッキ5μm 株式会社テストピース製)同士を以下の手順で接着した。エポキシ樹脂組成物を一方の試験片の端部に塗布して均一に延ばした後、幅方向に25mm、長さ方向に10mmの接着面になるようにもう一方の試験片を貼り合わせ、治具で固定した状態で熱風乾燥炉により80℃にて30分間加熱を行い、硬化させた。試験片の温度が室温に戻った後、準備した試験片を引張り試験機により引張速度10mm/minにて測定し、「引張せん断接着強さ」(MPa)とした。試験の詳細についてはJISK6850に従う。
13MPa以上:優れている、13MPa未満10MPa以上:やや優れている、10MPa未満:劣っている。
L字型に曲げた試験片同士(Niメッキ板:25mm×150mm×0.5mm、ただし長さ100mmの地点でL字型に曲げたもの、SPCC-SD Niメッキ5μm 株式会社テストピース製)を以下の手順で接着した。エポキシ樹脂組成物を一方の試験片の長さ100mmの面に塗布して均一に延ばした後、もう一方の試験片をT字型になるように貼り合わせ、治具で固定した状態で、熱風乾燥炉により80℃にて30分間加熱を行い、硬化させた。試験片の温度が室温に戻った後、準備した試験片を引張り試験機により引張速度50mm/minにて測定し「T型剥離接着強さ」(N/m)とした。試験の詳細についてはJISK6854-3に従う。
500N/m以上:優れている、500N/m未満400N/m以上:やや優れている、400N/m未満:劣っている。
試験片にLCP(LCP(液晶ポリマー)板:25mm×100mm×3mm、VECTRA E130i ポリプラスチック株式会社製)を用いて上記引張りせん断接着強さ測定と同様に実施した。
Claims (7)
- 下記の(A)~(C)成分を含有する電子部品接着のためのエポキシ樹脂組成物:
(A)成分:エポキシ基を有する化合物
(B)成分:ガラス転移点が50℃以上のポリスチレン系フィラー
(C)成分:(A)成分を硬化させる成分。 - 前記(B)成分がスチレン-ジビニルベンゼン共重合体のポリスチレン系フィラーである、請求項1に記載のエポキシ樹脂組成物。
- 前記電子部品がカメラモジュールである、請求項1または2の何れか1項に記載のエポキシ樹脂組成物。
- 前記(A)成分100質量部に対して、(B)成分1.5~120質量部含有する、請求項1~3の何れか1項に記載のエポキシ樹脂組成物。
- 前記(A)成分100質量部に対して、(C)成分0.3~95質量部含有する、請求項1~4の何れか1項に記載のエポキシ樹脂組成物。
- 請求項1~5の何れか1項に記載のエポキシ樹脂組成物を硬化させてなる硬化物。
- 請求項1~5の何れか1項に記載のエポキシ樹脂組成物により貼り合わせてなるカメラモジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880014070.9A CN110382619B (zh) | 2017-02-28 | 2018-02-09 | 环氧树脂组合物 |
KR1020197022959A KR102507959B1 (ko) | 2017-02-28 | 2018-02-09 | 에폭시 수지 조성물 |
JP2019502847A JP7152671B2 (ja) | 2017-02-28 | 2018-02-09 | エポキシ樹脂組成物 |
PH12019501915A PH12019501915A1 (en) | 2017-02-28 | 2019-08-16 | Epoxy resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017035733 | 2017-02-28 | ||
JP2017-035733 | 2017-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018159267A1 true WO2018159267A1 (ja) | 2018-09-07 |
Family
ID=63370919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/004634 WO2018159267A1 (ja) | 2017-02-28 | 2018-02-09 | エポキシ樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7152671B2 (ja) |
KR (1) | KR102507959B1 (ja) |
CN (1) | CN110382619B (ja) |
PH (1) | PH12019501915A1 (ja) |
WO (1) | WO2018159267A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018165796A (ja) * | 2017-03-28 | 2018-10-25 | 味の素株式会社 | 感光性樹脂組成物 |
JP2020081076A (ja) * | 2018-11-19 | 2020-06-04 | 株式会社中島製作所 | トレイメイクシステム及びトレイメイク方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03161719A (ja) * | 1989-11-21 | 1991-07-11 | I C I Japan Kk | 液晶表示素子の製造方法 |
JP2009158713A (ja) * | 2007-12-26 | 2009-07-16 | Sekisui Chem Co Ltd | センサ素子実装体の製造方法 |
JP2009221424A (ja) * | 2008-03-18 | 2009-10-01 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
JP2009231605A (ja) * | 2008-03-24 | 2009-10-08 | Sekisui Chem Co Ltd | 接着剤及び接合体の製造方法 |
JP2010225625A (ja) * | 2009-03-19 | 2010-10-07 | Sekisui Chem Co Ltd | 接着シート及びダイシング−ダイボンディングテープ |
JP2012142138A (ja) * | 2010-12-28 | 2012-07-26 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5913884B2 (ja) * | 2011-09-27 | 2016-04-27 | 積水化学工業株式会社 | 絶縁材料及び積層構造体 |
JP6536407B2 (ja) * | 2013-12-05 | 2019-07-03 | 株式会社スリーボンド | 熱硬化性樹脂組成物 |
WO2016093253A1 (ja) * | 2014-12-08 | 2016-06-16 | 株式会社スリーボンド | 熱硬化性樹脂組成物 |
-
2018
- 2018-02-09 JP JP2019502847A patent/JP7152671B2/ja active Active
- 2018-02-09 CN CN201880014070.9A patent/CN110382619B/zh active Active
- 2018-02-09 KR KR1020197022959A patent/KR102507959B1/ko active IP Right Grant
- 2018-02-09 WO PCT/JP2018/004634 patent/WO2018159267A1/ja active Application Filing
-
2019
- 2019-08-16 PH PH12019501915A patent/PH12019501915A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03161719A (ja) * | 1989-11-21 | 1991-07-11 | I C I Japan Kk | 液晶表示素子の製造方法 |
JP2009158713A (ja) * | 2007-12-26 | 2009-07-16 | Sekisui Chem Co Ltd | センサ素子実装体の製造方法 |
JP2009221424A (ja) * | 2008-03-18 | 2009-10-01 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
JP2009231605A (ja) * | 2008-03-24 | 2009-10-08 | Sekisui Chem Co Ltd | 接着剤及び接合体の製造方法 |
JP2010225625A (ja) * | 2009-03-19 | 2010-10-07 | Sekisui Chem Co Ltd | 接着シート及びダイシング−ダイボンディングテープ |
JP2012142138A (ja) * | 2010-12-28 | 2012-07-26 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018165796A (ja) * | 2017-03-28 | 2018-10-25 | 味の素株式会社 | 感光性樹脂組成物 |
JP2020081076A (ja) * | 2018-11-19 | 2020-06-04 | 株式会社中島製作所 | トレイメイクシステム及びトレイメイク方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20190120187A (ko) | 2019-10-23 |
CN110382619A (zh) | 2019-10-25 |
JP7152671B2 (ja) | 2022-10-13 |
JPWO2018159267A1 (ja) | 2019-12-26 |
PH12019501915A1 (en) | 2019-10-21 |
CN110382619B (zh) | 2022-10-18 |
KR102507959B1 (ko) | 2023-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6955661B2 (ja) | エポキシ樹脂組成物 | |
JP7244762B2 (ja) | 接着積層鋼板用ラジカル重合性接着剤組成物、接着積層体、モータおよび接着積層体の製造方法 | |
JP2017031268A (ja) | 加熱硬化性エポキシ樹脂組成物 | |
JP6134089B2 (ja) | 絶縁材料及び積層構造体 | |
WO2014007219A1 (ja) | シート状接着剤およびこれを用いた有機elパネル | |
JP7152671B2 (ja) | エポキシ樹脂組成物 | |
KR20140017509A (ko) | 혐기 경화성 조성물 | |
JP6810659B2 (ja) | 電子部品用樹脂組成物 | |
JP2013127034A (ja) | シート状電子部品封止用エポキシ樹脂組成物およびそれを用いた電子部品装置 | |
KR102076888B1 (ko) | 수지 조성물, 접착 필름, 및 반도체 장치 | |
WO2012073360A1 (ja) | 絶縁シート及び積層構造体 | |
JP2011184668A (ja) | 熱伝導性熱可塑性接着剤組成物 | |
JP2016108453A (ja) | 二液硬化型樹脂組成物 | |
JP7220974B2 (ja) | エポキシ樹脂組成物 | |
JP2016050301A (ja) | 熱伝導性樹脂組成物 | |
JP2020059825A (ja) | 熱伝導性シート | |
JP2016098312A (ja) | 硬化性樹脂組成物、ディスペンス用ダイアタッチ材、および半導体装置 | |
JP2008169240A (ja) | 接着剤組成物 | |
JP7397322B2 (ja) | エポキシ樹脂接着剤、硬化物およびモータ | |
JP2014152190A (ja) | エネルギー線硬化性樹脂組成物 | |
WO2021192559A1 (ja) | エポキシ樹脂組成物 | |
JP2024119271A (ja) | 導電性樹脂組成物 | |
JP2018203823A (ja) | 表面保護フィルム用粘着剤組成物、表面保護膜、及び表面保護フィルム | |
JP2021191828A (ja) | 接着剤、及び接着体 | |
WO2023243621A1 (ja) | 導電性樹脂組成物およびその硬化物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18761203 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019502847 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197022959 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18761203 Country of ref document: EP Kind code of ref document: A1 |