WO2018100954A1 - 抵抗変化型記憶素子のデータ書き込み装置 - Google Patents

抵抗変化型記憶素子のデータ書き込み装置 Download PDF

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Publication number
WO2018100954A1
WO2018100954A1 PCT/JP2017/039354 JP2017039354W WO2018100954A1 WO 2018100954 A1 WO2018100954 A1 WO 2018100954A1 JP 2017039354 W JP2017039354 W JP 2017039354W WO 2018100954 A1 WO2018100954 A1 WO 2018100954A1
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Prior art keywords
resistance change
writing
storage element
state
resistance
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English (en)
French (fr)
Japanese (ja)
Inventor
貴弘 羽生
鈴木　大輔
大野　英男
哲郎 遠藤
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Tohoku University NUC
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Tohoku University NUC
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Priority to US16/463,938 priority Critical patent/US10896729B2/en
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1675—Writing or programming circuits or methods
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1653—Address circuits or decoders
    • G11C11/1655—Bit-line or column circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1653—Address circuits or decoders
    • G11C11/1657—Word-line or row circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1673—Reading or sensing circuits or methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • G11C2013/0078—Write using current through the cell

Definitions

  • the present invention relates to a resistance variable memory element data writing device.
  • a resistance change type storage element is a storage element that uses a resistance state due to a write current, but since there is variation in the timing at which the resistance state changes for each element, the supply of the write current to the resistance change type storage element is as follows: Sufficient time is required to change the resistance change state of the memory element. Therefore, even after the resistance state of the resistance change type storage element is changed, a write current is continuously supplied to the storage element, which causes a problem in terms of power consumption.
  • Patent Document 1 As a technique for detecting the end of data writing to the resistance change type storage element, a change in the end voltage of the resistance change type storage element is detected by switching according to the current direction of the write current, and based on the detected end voltage change.
  • Patent Document 1 An apparatus for detecting the end of data writing has been proposed.
  • a magnetic tunnel junction element (MTJ (Magnetic Tunnel Junction Device) element) as a resistance change type storage element has a relatively small tunnel magnetoresistance ratio TMR, and therefore requires a highly sensitive sense amplifier.
  • a complementary cell has been proposed as a configuration for increasing the output of the resistance change type storage element. For example, in a storage device in which two resistance change storage elements are provided in one cell and complementary cells that store information in different storage states are provided in each element, when reading information, by reading from each element in parallel Even when a low-sensitivity sense amplifier is used, information can be detected with high sensitivity.
  • a long write current pulse is required to reliably perform writing in the resistance change type storage element. It is assumed that the energy consumption is reduced by automatically terminating the write current when writing data.
  • the complementary resistance change memory element has a problem that the write energy is large. From such a situation, in the complementary resistance change memory element, it is required to realize automatic stop of the write operation after data writing with a simple configuration and reduce the write energy.
  • the resistance change type memory element data writing apparatus of the present invention comprises at least the following configuration.
  • a resistance variable memory element data writing device comprising: A complementary resistance variable memory element; Writing means for causing a resistance change in the complementary resistance change storage element; Detecting means for detecting a write state of the complementary resistance change type storage element; Control means, The control means controls writing of the writing means based on a detection signal of the detecting means.
  • FIG. 1A and 1B are conceptual diagrams for explaining a resistance change storage element of a data writing device according to an embodiment of the present invention
  • FIG. 3A is a diagram illustrating a configuration example
  • FIG. 2B is an example of resistance-voltage characteristics of the resistance change storage element.
  • FIG. 4C is a circuit diagram illustrating a configuration example of a complementary circuit. The figure which shows the structural example of the data writer of the resistance change type memory element which concerns on 1st Embodiment of this invention. The figure which shows an example of the operation
  • movement which writes in Y 0 of the data writer of the resistance change type memory element shown in FIG.
  • FIG. 5A is a diagram showing an example of the operation of the data write device of the resistance change type storage element shown in FIG. 5, where FIG.
  • (d) is a diagram showing the current I WY flowing in the left resistance change type memory element shown in FIG. 5
  • (e) is a diagram in FIG. The figure which shows the electric current IWYb which flows into the resistance change type memory element on the right side shown.
  • FIG. 5D is a diagram showing the current I WY flowing through the left resistance change memory element shown in FIG. 5, and FIG.
  • FIG. 8A and 8B are diagrams for explaining a data write device for a resistance change type storage element according to an example of the embodiment shown in FIG. 8, FIG. 8A is a diagram illustrating a configuration example, and FIG. 8B is a resistance diagram illustrated in FIG.
  • FIG. 10 is a diagram showing an example of a voltage V BL during a write operation of the data write device for the resistance change type memory element shown in FIG. 9.
  • FIG. 10 is a diagram showing an example of a voltage V BL during a write operation of the data write device for the resistance change type memory element shown in FIG. 9.
  • FIG. 5F is a diagram showing an example of resistance-voltage characteristics of a memory cell, and FIG.
  • FIG. 5F is a diagram showing an example of a current flowing in a complementary cell of a data writing device.
  • FIG. 7 is a diagram illustrating an example of resistance-voltage characteristics of a memory element
  • FIG. 5F is a diagram illustrating an example of a current flowing in a complementary cell of a data writing device. Diagram for explaining a data writing device resistance variable memory element according to an embodiment of the embodiment shown in FIG. 8, (a) is a diagram showing an example of a data writing device, (b) the current I w Timing chart.
  • FIG. 8 is a diagram showing an example of a data writing device.
  • FIG. 14 is a diagram showing a configuration example of a write drive source (current source) of the data write device of the resistance change type storage element shown in FIG. 13.
  • FIG. 14 is a diagram showing a configuration example of a multiplexer and a sense amplifier of the data write device of the resistance change type storage element shown in FIG. 13.
  • the figure for demonstrating the 1st detection part of the data writing device of the resistance change type memory element shown in FIG. 13, and a 2nd detection part (a) is a figure which shows the structural example of a 1st detection part and a 2nd detection part.
  • (B) is a timing chart which shows an example of operation
  • movement of the 1st detection part of FIG. 14 is a timing chart for explaining an operation example of the data writing device of the resistance change type memory element shown in FIG. 13.
  • a resistance change type memory element data writing device includes a complementary resistance change type memory element, write means for causing a resistance change in the complementary resistance change type memory element, and a complementary resistance change type memory.
  • Detection means for detecting the writing state of the element, and control means.
  • the control means controls writing of the writing means based on the detection signal of the detecting means.
  • the resistance change type storage element 10 used in the embodiment of the present invention is a resistance change type storage element such as an MTJ element (Magnetic tunneling Junction) element. Yes, when a write current is supplied, its resistance state changes.
  • MTJ element Magnetic tunneling Junction
  • the resistance change storage element 10 includes a magnetization fixed layer 10a, a tunnel barrier layer 10b, and a magnetization free layer 10c.
  • a mark (*) indicating the magnetization free layer 10c of the resistance change storage element 10 is displayed in the vicinity of the magnetization free layer 10c.
  • the magnetization fixed layer 10a is directly formed on a conductive layer (not shown).
  • the tunnel barrier layer 10b is formed on the magnetization fixed layer 10a.
  • the magnetization free layer 10c is formed directly on the tunnel barrier layer 10b.
  • the magnetization fixed layer 10a and the magnetization free layer 10c are made of a material such as a ferromagnetic film (eg, CoFeB) or a ferromagnetic Heusler alloy (eg, Co 2 FeAl, Co 2 MnSi).
  • the magnetization fixed layer 10a is configured such that the direction of magnetization is fixed along the direction perpendicular to the plane of the layer even when a current flows through the layer in the direction perpendicular to the plane.
  • the magnetization free layer 10c is configured so that magnetization can be reversed. Specifically, in the present embodiment, the magnetization free layer 10c is configured such that the magnetization direction is parallel or antiparallel to the magnetization of the magnetization fixed layer 10a.
  • the tunnel barrier layer 10b is a thin film provided between the magnetization fixed layer 10a and the magnetization free layer 10c. For example, magnesium oxide (MgO), alumina (Al 2 O 3 ), spinel single crystal (MgAl 2 O 4). ) And other materials.
  • the terminal 10g is provided in the magnetization fixed layer 10a
  • the terminal 10e is provided in the magnetization free layer 10c.
  • the resistance change type memory element 10 changes its resistance value when the magnetization direction of the magnetization free layer 10c changes relative to the magnetization direction of the magnetization fixed layer 10a.
  • the resistance value R Y of the resistance change storage element 10 is a resistance value.
  • the value R0 As shown in the right diagram of FIG. 1A, when the magnetization of the magnetization free layer 10c and the magnetization of the magnetization fixed layer 10a are in an antiparallel state, the resistance value R Y of the resistance change storage element 10 is the above resistance value.
  • the resistance value R 1 is higher than R 0 (R 0 ⁇ R 1 ).
  • a current I Y having a current value (current threshold) necessary for magnetization reversal is passed.
  • current threshold current threshold
  • the absolute value of the current threshold value (I w0 ) is defined to be smaller than the absolute value of the current threshold value (I w1 ).
  • one complementary cell has two resistance change storage elements having different resistance states, and is configured to be able to store 1-bit information by combining the resistance states.
  • the complementary cell 10C includes a resistance change storage element 10A, a resistance change storage element 10B, an NMOS transistor 30a, an NMOS transistor 30b, and an NMOS transistor 30a.
  • a resistance change storage element 10A a resistance change storage element 10B
  • an NMOS transistor 30a NMOS transistor 30b
  • an NMOS transistor 30a are electrically connected to the magnetization free layer 10c side of the resistance change storage element 10A.
  • the gate of the NMOS transistor 30a and the gate of the NMOS transistor 30b are electrically connected to the word line WL.
  • the data write device for the resistance change storage element includes a complementary resistance change storage element (complementary cell 10C) and a complementary resistance change storage element (complementary cell). 10C), a writing means for causing a resistance change, a detecting means (detecting section 30) for detecting a writing state of the complementary resistance variable memory element (complementary cell 10C), and a detection signal of the detecting means (detecting section 30). And a control means (control unit 40) for controlling the writing of the writing means.
  • the writing means includes a writing unit (writing circuit 21, 10B) corresponding to each of the resistance change storage elements (10A, 10B) of the complementary resistance change storage element (complementary cell 10C). 22), and writing is performed by the writing unit (the writing circuits 21 and 22) so as to cause the resistance change memory elements 10A and 10B to simultaneously generate the opposite resistance changes.
  • the control unit ends writing of each resistance change type storage element (10A, 10B) based on the writing state of each resistance change type storage element (10A, 10B) by the detection unit (detection unit 30). Take control.
  • the write operation of the resistance change type storage element 10A and the resistance change type storage element 10B can be performed independently, and therefore each operation may be performed simultaneously or at an arbitrary timing. When each operation is performed simultaneously, the writing time can be shortened.
  • the complementary cell 10C includes a resistance change storage element 10A and a resistance change storage element 10B.
  • a writing circuit 21 for writing data to the resistance change type storage element 10A is provided, and a writing circuit 22 for writing data to the resistance change type storage element 10B is provided. That is, the write circuit (21, 22) is provided in each of the resistance change storage elements (10A, 10B) of the complementary cell.
  • the bit line BL 1 is connected to the source of the NMOS transistor 30a, and the bit line BLb is electrically connected to the magnetization fixed layer 10a of the resistance change storage element 10A and the magnetization free layer 10c of the resistance change storage element 10B.
  • the bit line BL 2 is connected to the source of the NMOS transistor 30b.
  • the bit line BLb of the write circuit 22 is common with the bit line BLb of the write circuit 21.
  • a word line WL is connected to the gate of the NMOS transistor 30a and the gate of the NMOS transistor 30b.
  • the word line WL is electrically connected to the control unit 40.
  • the drain of the NMOS transistor 30a is electrically connected to the magnetization free layer 10c of the resistance change storage element 10A.
  • the drain of the NMOS transistor 30b is electrically connected to the magnetization fixed layer 10a of the resistance change storage element 10B.
  • FIG. 3C is a conceptual diagram showing the state of R 1
  • FIG. 3C is a diagram showing the current I WY flowing through the left resistance change storage element 10A shown in FIG. 2
  • FIG. 3D is the right side shown in FIG. It is a figure which shows the electric current IWYb which flows into the resistance change type memory element 10B.
  • the direction of the current flowing from the magnetization free layer 10c to the magnetization fixed layer 10a of each resistance change memory element is positive.
  • each word line WL is set to a high level so that a current I WY greater than or equal to the threshold flows through the resistance change storage element 10A and a current I WYb greater than or equal to the threshold flows through the resistance change storage element 10B.
  • Embedded circuits 21 and 22 perform the control.
  • Each resistance change type memory element has variations in write characteristics.
  • writing to the resistance change storage element 10A is completed.
  • writing to the resistance change storage element 10B is completed.
  • the word line WL is set to the L level.
  • FIG. 4C is a diagram showing the current I WY flowing through the resistance change memory element 10A on the left side shown in FIG. 2
  • FIG. 4D is the right side shown in FIG. It is a figure which shows the electric current IWYb which flows into the resistance change type memory element 10B.
  • each word line WL is set to a high level so that a current I WY greater than or equal to the threshold flows through the resistance change storage element 10A and a current I WYb greater than or equal to the threshold flows through the resistance change storage element 10B.
  • Embedded circuits 21 and 22 perform the control.
  • the resistance variable memory element data writing device has two write circuits 21 and 22, and writes data to the variable resistance memory elements 10A and 10B of the complementary cell 10C, respectively. Therefore, the write operation can be performed at high speed.
  • the resistance variable memory element data writing device includes the complementary variable resistance memory element (complementary cell 10C) including the variable resistance memory elements 10A and 10B.
  • Write means write circuit
  • detection means detection means
  • control unit 40 controls the end of writing by the writing unit (writing circuit) based on the detection signal of the detection unit (detection unit 30). For example, when the detection unit 30 detects the end of writing, the control unit 40 stops the writing current output by the writing unit (writing circuit) and ends the writing.
  • the writing means is a memory element (resistance variable memory element) of each complementary resistance variable memory element (complementary cell 10C). 10A, 10B) corresponding to each of the storage elements (resistance change type storage elements 10A, 10B) by the writing unit (writing circuits 21, 22). Write to cause resistance change.
  • the control means (control unit 40) is configured to store the respective storage elements (resistance change type storage elements 10A, 10B) based on the writing states of the storage elements (resistance change type storage elements 10A, 10B) by the detection means (detection unit 30). ) Write control. That is, the write circuit 21 and the write circuit 22 can simultaneously write to each of the resistance change storage elements 10A and 10B of the complementary cell 10C, so that the write process can be performed at high speed with a simple configuration.
  • FIG. 5 is a diagram showing a configuration example of a data write device for a resistance change type storage element according to the second embodiment of the present invention.
  • the writing means sequentially applies reverse resistance changes to the write circuit 121 and the write complementary resistance variable memory elements (10A, 10B).
  • a switching means switching section 122 for writing to be generated.
  • the writing circuit 121 and the switching unit 122 are included as writing means. That is, in this embodiment, the writing device includes one writing circuit 121 and writes a write signal from the writing circuit 121 to one of the resistance change type storage elements 10A and 10B by the switching unit 122. Thereafter, control is performed to write to the other resistance change type storage element.
  • the bit line BL is connected to the switching unit 122, and the bit line BLb is electrically connected to the resistance change memory element 10A and the magnetization fixed layer 10a of the resistance change memory element 10B.
  • the bit line BL1 from the switching unit 122 is connected to the source of the NMOS transistor 30a, and the bit line BL2 from the switching unit 122 is connected to the source of the NMOS transistor 30b.
  • a word line WL is connected to the gate of the NMOS transistor 30a and the gate of the NMOS transistor 30b.
  • the word line WL is electrically connected to the control unit 40.
  • the drain of the NMOS transistor 30a is electrically connected to the magnetization free layer 10c of the resistance change storage element 10A.
  • the drain of the NMOS transistor 30b is electrically connected to the magnetization free layer 10c of the resistance change storage element 10B.
  • 6D is a diagram showing the current I WY flowing in the left resistance change storage element 10A shown in FIG. 5
  • FIG. 6E is the current flowing in the right resistance change storage element 10B shown in FIG. It is a figure which shows IWYb . 6D and 6E, the direction of the current flowing from the magnetization free layer 10c to the magnetization fixed layer 10a of each resistance change type storage element is positive.
  • the word line WL is set to a high level, and the writing circuit 121 and the switching unit 122 perform control so that a current I WY that is equal to or greater than the threshold flows through the resistance change storage element 10A.
  • Each resistance change type memory element has variations in write characteristics. Specifically, since there is a variation in the write end time of each resistance change type storage element, the resistance change type storage element at time T32 after the longest write end time of the resistance change type storage element 10A has elapsed. Start writing to 10B.
  • the write circuit 121 and the switching unit 122 perform control so that a current I WYb that is equal to or greater than the threshold value flows in the resistance change storage element 10B.
  • the word line WL is set to the L level.
  • FIG. 7D is a diagram showing the current I WY flowing through the left resistance change storage element 10A shown in FIG. 5, and FIG.
  • FIG. 7E is the current flowing through the right resistance change storage element 10B shown in FIG. It is a figure which shows IWYb .
  • the direction of the current flowing from the magnetization free layer 10c to the magnetization fixed layer 10a of each resistance change memory element is positive.
  • the word line WL is set to a high level, and the writing circuit 121 and the switching unit 122 perform control so that a current I WY that is equal to or greater than the threshold flows through the resistance change storage element 10A.
  • Writing to the element 10A is completed (state [3] in FIG. 7B, state [3] in FIG. 7D). Since there is a variation in the write end time of each resistance change memory element, the write to the resistance change memory element 10B is performed at time T42 after the longest write end time of the resistance change memory element 10A has elapsed. To start.
  • the writing circuit 121 and the switching unit 122 perform control so that a current I WYb that is equal to or greater than the threshold value flows in the resistance change storage element 10B.
  • the word line WL is set to the L level.
  • the resistance variable memory element data writing device includes the complementary variable resistance memory element (complementary cell 10C) including the variable resistance memory elements 10A and 10B. And a writing means (writing circuit 121) for causing a resistance change in the complementary resistance change storage element, and a detection means (detection unit) for detecting a writing state of the complementary resistance change storage element (complementary cell 10C). 30) and control means (control section 40) for controlling the end of writing of the writing means (writing circuit 121) based on the detection signal of the detecting means (detecting section 30).
  • the writing means (the writing circuit 121) is a switching means (a writing means for sequentially causing reverse resistance changes in each of the resistance change storage elements 10A and 10B of the complementary resistance change storage element (complementary cell 10C).
  • a switching unit 122) that is, in the resistance variable memory element data writing apparatus of the second embodiment, the switching unit 122 performs writing while switching the write target to one or the other of the variable resistance memory elements 10A and 10B of the complementary cell 10C. Therefore, the writing circuit can have a single circuit configuration, and the number of components such as transistors is reduced as compared with the data writing device including the two writing circuits of the first embodiment. And the overall circuit scale can be reduced.
  • FIG. 8 is a diagram for explaining a data write device for a resistance change type storage element according to a third embodiment of the present invention.
  • FIG. 8A is a conceptual diagram illustrating a configuration example of a data writing device of a resistance change type storage element.
  • FIG. 8B is a timing chart showing an example of the operation of the data write device of the resistance change type memory element shown in FIG.
  • the data writing device shown in FIG. 8A includes a complementary cell 10C, a writing circuit 20, a detection unit 30, and a control unit 40.
  • the complementary cell 10C includes two resistance change storage elements 10A and a resistance change storage element 10B.
  • the storage state of the resistance change type storage element 10A is indicated by Y, and the storage state of the resistance change type storage element 10B is indicated by Yb.
  • the write data signal A is input to the write circuit 20. Further, the write signal WCK (write clock) is input to the write circuit 20.
  • the write circuit 20 and the complementary cell 10C are electrically connected by a bit line BL, a bit line BLb, and a word line WL.
  • bit line BL is electrically connected to the source of the NMOS transistor 30a
  • the drain of the NMOS transistor 30a is electrically connected to the magnetization free layer 10c side of the resistance change storage element 10A.
  • bit line BLb is electrically connected to the source of the NMOS transistor 30b
  • the drain of the NMOS transistor 30b is electrically connected to the magnetization free layer 10c side of the resistance change storage element 10B.
  • a word line (WL) is electrically connected to the source of the NMOS transistor 30a and the source of the NMOS transistor 30b.
  • the write circuit 20 causes a current to flow through the resistance-change storage elements (10A, 10B) connected in series with the complementary resistance-change elements (complementary cells 10C), and the direction in which the current flows.
  • Switching means switching unit 50 for switching between.
  • the detecting unit 30 detects the write state (write circuit 20) of the complementary resistance change storage element (complementary cell 10C). Specifically, the detection unit 30 detects the voltage of the bit line BL and the voltage of the bit line BLb, and outputs a detection signal to the control unit 40.
  • the control unit 40 controls the writing end of the writing unit (writing circuit 20) based on the detection signal of the detecting unit (detecting unit 30).
  • the resistance value of the write path increases and I W decreases.
  • the voltage of the bit line BL changes from V L to V H.
  • the word line WL is set to H level.
  • the current is set to flow from the bit line BLb to the bit line BL.
  • the voltage change on the bit line BLb side is monitored.
  • the resistance value of the write path increases and I W decreases.
  • the voltage of the bit line BLb transits from V L to V H.
  • the data write device of the resistance change type memory element of this embodiment is divided into an A portion (Part A) and a B portion (Part B) with the output end as a boundary.
  • the data writing device includes a PMOS transistor 9a (M p ) as an A portion (Part A), and a complementary cell 10C and an NMOS transistor 9b (M N ) as a B portion (Part B). That is, the portion A (Part A) corresponds to the PMOS transistor 9a and serves as a load resistance.
  • FIG. 9A shows a configuration in which the voltage of the bit line BL is detected as the A portion (PartA) and only the configuration in which the bit line BLb is grounded as the B portion (PartB) in the data writing device.
  • Part A A configuration for detecting the voltage of the bit line BLb as a portion (Part A) and a configuration for grounding the bit line BL as a B portion (Part B) are omitted.
  • Part B a configuration for grounding the bit line BL as a B portion
  • the PMOS transistor 9a (M p ) has a source connected to the power supply voltage V DD and a drain electrically connected to the complementary cell 10C via the bit line BL.
  • the connection node between the transistors 9a and complementary cell 10C is an output terminal for outputting a voltage V BL, connected to the detection unit 30 (see Figure 8).
  • the control gate of the PMOS transistor 9a (M p ) is connected to the reference voltage (0 V) as necessary under the control of the control unit.
  • the NMOS transistor 9b (M N ) has a source connected to the complementary cell 10C via the bit line BLb, and a drain grounded to the reference voltage GND (0 V).
  • the control gate of the NMOS transistor 9b (M N ) is connected to the power supply voltage V DD as necessary under the control of the control unit.
  • the complementary cell 10C includes two resistance change storage elements 10A and a resistance change storage element 10B.
  • the tunnel barrier layer 10b is provided between the magnetization fixed layer 10a and the magnetization free layer 10c.
  • the bit line BL is electrically connected to the source of the NMOS transistor 30a, and the drain of the NMOS transistor 30a is electrically connected to the magnetization free layer 10c side of the resistance change storage element 10A.
  • the bit line BLb is electrically connected to the source of the NMOS transistor 30b, and the drain of the NMOS transistor 30b is electrically connected to the magnetization free layer 10c side of the resistance change storage element 10B.
  • the control sources of the NMOS transistors 30a and 30b are connected to the word line WL.
  • FIG. 9B shows a load characteristic curve and a voltage-current characteristic curve of the data write device of the resistance change type storage element shown in FIG. 9A. Since a common current Iw flows through the A portion (Part A) and the B portion (Part B) shown in FIG. 9A, the voltage at the output terminal of the V BL is the load of the A portion (Part A). This is the voltage at the intersection of the characteristic curve and the voltage-current characteristic curve of part B (Part B). Specifically, FIG. 9B shows a curve of the load characteristic of the A part (Part A) and a voltage-current characteristic curve of the B part (Part B).
  • the voltage at the output terminal of V BL is the A portion (Part A).
  • the voltage V L at the intersection of the load characteristic curve and the voltage-current characteristic curve of part B (Part B) is obtained.
  • the current I w flowing through the A portion (Part A) and the B portion (Part B) is a current value I W1a .
  • the output terminal of V BL Is the voltage V H at the intersection where the curve of the load characteristic of the A part (Part A) and the voltage-current characteristic curve of the B part (Part B) intersect.
  • the current I w flowing through the A portion (Part A) and the B portion (Part B) is a current value I W0a .
  • I ⁇ is a slight current value. I ⁇ may have the same current value as I ⁇ or a different current value.
  • the detection unit can determine the writing state of the resistance change storage elements 10A and 10B depending on whether the voltage V BL at the connection node is the voltage VH or the voltage VL.
  • FIG. 10 is a diagram showing an example of the voltage VBL during the write operation of the data write device for the resistance change type memory element shown in FIG.
  • the detection unit 30 (see FIG. 8) has a sense amplifier and detects the voltage V BL at the connection node.
  • FIG. 11B shows the storage state of the complementary cell.
  • the resistance value of the complementary cell 10C is R 1 + R 0 .
  • the writing circuit sets the bit line voltage V BL to V H and a current I w0a flows through the complementary cell 10C.
  • the resistance value of the complementary cell 10C becomes R 0 + R 1
  • the bit line voltage V BL becomes V H
  • the current I w0a flows ([B] state in FIG. 11 (f), [B] state in FIG. 11 (d)).
  • FIG. 12D shows a load characteristic curve and a voltage-current characteristic curve of the data writing device
  • FIG. 12E shows an example of a resistance-voltage characteristic of the resistance change type storage element
  • FIG. ) Is a diagram showing an example of a current flowing in a complementary cell of the data writing device.
  • FIG. 12 shows a write operation in which the voltage of the bit line BLb not shown in FIG. 9A is detected.
  • the resistance value of the complementary cell 10C is R 0 + R 1 .
  • the writing circuit sets the bit line voltage V BLb to V H and a current I w0a flows through the complementary cell 10C.
  • the current I w0a flows ([D] state in FIG. 12 (f), [D] state in FIG. 12 (d)).
  • FIG. 13 is a diagram for explaining a data write device for a resistance change type storage element according to an example of the embodiment shown in FIG.
  • FIG. 13A is a diagram illustrating an example of the data writing device
  • FIG. 13B is a timing chart of the current Iw .
  • the vertical axis indicates the absolute value of the current Iw
  • the horizontal axis indicates time (Time). Since FIG. 13B is the same as FIG. 11F and FIG. 12F, description thereof is omitted.
  • the resistance change type memory element data writing apparatus shown in FIG. 13 includes a writing circuit 20 as a writing means, a complementary cell 10C, a detection unit 30, and a control unit 40.
  • the write circuit 20 includes a write drive source 25 and a switching unit 50 (switching means).
  • the write drive source 25 (current source) is a current source for writing to the resistance change storage elements 10A and 10B of the complementary cell 10C.
  • the switching unit 50 (switching unit) causes a current to flow through the memory elements connected in series with the complementary resistance change memory elements, and switches the direction in which the current flows.
  • the detection unit 30 detects a potential change between the storage elements (resistance change storage elements 10 ⁇ / b> A and 10 ⁇ / b> B) connected in series with the write drive source 25.
  • the detection unit 30 also changes the storage state of one storage element (resistance change storage element) of the complementary resistance change storage element (complementary cell 10C) and the other storage element (resistance change storage element). Detects changes in memory state.
  • the control unit 40 performs writing control of each storage element based on the writing state of each storage element by the detection unit 30.
  • the detection unit 30 as detection means includes a multiplexer 311 (selection circuit), a sense amplifier 312, and a detection device 320.
  • the multiplexer 311 switches and outputs a voltage signal indicating a resistance change of any one of the resistance change type storage elements 10A and 10B of the complementary cell 10C.
  • the sense amplifier 312 amplifies the voltage of the signal output from the multiplexer 311 and outputs it to the detection device 320 as the voltage signal Vs.
  • the detection device 320 includes first detection means (first detection unit 321) that detects a resistance change of one storage element (resistance change storage element) of the complementary resistance change storage element (complementary cell 10C); And second detection means (second detection unit 322) for detecting a resistance change of the other storage element (resistance change type storage element) of the complementary resistance change type storage element (complementary type cell 10C).
  • the first detection unit 321 detects the end of writing to one of the resistance change type storage elements 10A, 10B by the first voltage change, and the second detection unit 322 writes to the other resistance change type storage element. The end is detected by the second voltage change, and a detection signal is output.
  • the write data signal A and the write data signal Ab (inverted) are input to the write circuit 20.
  • Signal lines for inputting the write clock signal WCK to the write circuit 20 and the detection device 320 are provided in the write circuit 20 and the detection device 320.
  • the write drive source 25 (current source) and the multiplexer 311 are electrically connected to the bit lines BL and BLb, and the bit lines BL and BLb are connected to the sources of the transistors 30a and 30b.
  • a detection signal EN such as a write end signal is output from the detection device 320 to the write circuit 20.
  • the write drive source 25 includes a NAND circuit 25a, a NOR circuit 25b, a NOR circuit 25c, a PMOS transistor 25d, an NMOS transistor 25e, a PMOS transistor 25f, and an NMOS transistor 25g.
  • the NAND circuit 25a receives an enable signal EN for enabling the clock signal and a write clock signal WCK.
  • the enable signal EN is an end signal indicating the end of writing from the detection device, and indicates that the previous writing operation is completed and the next writing operation is permitted.
  • the enable signal EN is expressed as a detection signal EN.
  • the NAND circuit 25a is configured so that when the detection signal EN and the write clock signal WCK are both “Low”, and when either the detection signal EN or the write clock signal WCK is “Low” and the other is “High”, “High” is output, and when the detection signal EN and the write clock signal WCK are both “High”, “Low” is output.
  • the NOR circuit 25b receives an output from the NAND circuit 25a and a write data signal Ab (inverted). The output from the NAND circuit 25a and the write data signal A are input to the NOR circuit 25c.
  • the source of the PMOS transistor 25d is connected to the power supply voltage V DD , the drain is connected to the bit line BL, and the gate is connected to the output terminal of the NOR circuit 25c.
  • the source of the NMOS transistor 25e is connected to the bit line BL, the drain is grounded, and the gate is connected to the output terminal of the NOR circuit 25c.
  • the source of the PMOS transistor 25f is connected to the power supply voltage VDD , the drain is connected to the bit line BLb, and the gate is connected to the output terminal of the NOR circuit 25b.
  • the source of the NMOS transistor 25g is connected to the bit line BLb, the drain is grounded, and the gate is connected to the output terminal of the NOR circuit 25b.
  • FIG. 15 is a diagram showing a configuration example of the multiplexer 311 and the sense amplifier 312 of the data write device of the resistance change type storage element shown in FIG.
  • the multiplexer 311 includes a PMOS transistor 311a, an NMOS transistor 311b, a PMOS transistor 311c, and an NMOS transistor 311d.
  • the write data signal A is input to the gate of the PMOS transistor 311a, the source is connected to the bit line BL, and the drain is connected to the sense amplifier 312.
  • the bit line BL is connected to the source of the NMOS transistor 311b, the drain is connected to the sense amplifier 312, and the write data signal Ab (inverted) is input to the gate.
  • the bit line BLb is connected to the source of the PMOS transistor 311c, the drain is connected to the sense amplifier 312, and the write data signal Ab is input to the gate.
  • the bit line BLb is connected to the source of the NMOS transistor 311d, the write data signal A is input to the gate, and the drain is connected to the sense amplifier 312.
  • the write data signal A when the write data signal A is in the L state, the voltage of the bit line BL is output to the sense amplifier, and when the write data signal A is in the H state, the voltage of the bit line BLb is output to the sense amplifier.
  • the sense amplifier 312 includes a PMOS transistor 312a, an NMOS transistor 312b, a PMOS transistor 312c, and an NMOS transistor 312d.
  • the source of the PMOS transistor 312a is connected to the power supply voltage V DD , the gate is connected to the output terminal of the multiplexer, and the drain is connected to the gates of the next stage transistors 312c and 312d.
  • the drain of the NMOS transistor 312b is grounded, the gate is connected to the output terminal of the multiplexer, and the drain is connected to the gates of the transistors 312c and 312d in the next stage.
  • the source of the PMOS transistor 312c is connected to the power supply voltage V DD , the gate is connected to the drain of the preceding PMOS transistor 312a and the source of the transistor 312b, and the drain is connected to the output terminal that outputs the signal S.
  • the drain of the NMOS transistor 312d is grounded, the gate is connected to the drain of the preceding PMOS transistor 312a and the source of the transistor 312b, and the source is connected to the output terminal for outputting the signal S. That is, the sense amplifier 312 inverts and amplifies the input signal and outputs it.
  • FIG. 16A is a diagram illustrating a configuration example of the first detection unit 321 (Detector0) and the second detection unit (Detector1) of the resistance variable storage element data writing device illustrated in FIG.
  • FIG. 16B is a timing chart illustrating an example of operations of the first detection unit 321 and the second detection unit 322 in FIG.
  • the first detection unit 321 includes a PMOS transistor 321a, an NMOS transistor 321b, a PMOS transistor 321c (MP0), an NMOS transistor 321d (MN0), and an NMOS transistor 321e (MN1).
  • the signal S from the sense amplifier is input to the gate of the PMOS transistor 321a, the source is connected to the power supply voltage V DD , and the drain is connected to the gate of the NMOS transistor 321d, the node N0, and the source of the NMOS transistor 321b.
  • the signal S from the sense amplifier is input to the gate of the NMOS transistor 321b, the source is connected to the drain of the PMOS transistor 321a, and the drain is grounded (GND (0V)).
  • the gate of the PMOS transistor 321c receives the write clock signal WCK, the source is connected to the power supply voltage V DD , and the drain is connected to the node N1 and the input terminal of the second detection unit 322.
  • the gate of the NMOS transistor 321d (MN0) is connected to the node N0, the source is connected to the node N1, and the drain is connected to the source of the NMOS transistor 321e.
  • a write clock signal WCK is input to the gate of the NMOS transistor 321e (MN1), the drain is grounded, and the source is connected to the drain of the NMOS transistor 321d.
  • the second detection unit 322 includes a PMOS transistor 322a, an NMOST transistor 322b, a PMOS transistor 322c (MP1), an NMOS transistor 322d (MN2), and an NMOS transistor 322e (MN3).
  • the gate of the PMOS transistor 322a is connected to the node N1, which is the output terminal of the first detection unit, the source is connected to the power supply voltage V DD , and the drain is connected to the node N2.
  • the gate of the NMOST transistor 322b is connected to the node N1, which is the output terminal of the first detection unit, the source is connected to the node N2, and the drain is grounded (GND (0V)).
  • the gate of the PMOS transistor 322c (MP1) is connected to the node N2, the source is connected to the power supply voltage VDD, and the drain is connected to the output terminal.
  • a detection signal EN is output from the output terminal.
  • the signal S from the sense amplifier is input to the gate of the NMOS transistor 322d (MN2), the source is connected to the output terminal, and the drain is connected to the source of the NMOS transistor 322e (MN3).
  • the gate of the NMOS transistor 322e (MN3) is connected to the node N2, the source is connected to the drain of the NMOS transistor 322d (MN2), and the drain is grounded (GND (0V)).
  • the write clock signal WCK is L level
  • the signal S is H level
  • the node N0 is L level
  • the node N1 is L level
  • the node N2 is L level
  • the detection signal EN is at H level.
  • the detection signal EN is at the H level, no write current flows.
  • the write clock signal WCK is set to H level, and writing starts and monitoring starts.
  • the PMOS transistor 321c (MP0) and the NMOS transistor 321d (MN0) are turned off, and the node N1 is charged to the H level (1).
  • the NMOS transistor 321e (MN1) is in an on state.
  • a signal S of L level (0) is input from the sense amplifier, the node N0 becomes H level (1), the NMOS transistor 321d (MN0) is turned on, and the node N1 becomes L level (0) and discharged.
  • the node N2 becomes high level, the PMOS transistor 322c (MP1) and the NMOS transistor 322d (MN2) are in the off state, and the NMOS transistor 322e (MN3) is in the on state.
  • the output terminal holds an H level detection signal EN.
  • the L level detection signal EN is output from the output terminal. That is, the end of writing is detected by a total of two voltage changes accompanying switching of the resistance change type storage elements 10A and 10B. Based on the detection signal EN indicating the end of writing, the control unit ends the writing operation to the complementary cell 10C. That is, the first detection unit 321 detects the end of writing to one of the resistance change type storage elements 10A and 10B by the first voltage change, and the second detection unit 322 moves to the other resistance change type storage element. Is detected by the second voltage change.
  • FIG. 17 is a timing chart for explaining an operation example of the data write device of the resistance change type storage element shown in FIG.
  • V WCK [V] indicates the voltage value of the write clock signal
  • R Yb [k ⁇ ] indicates the resistance value of the resistance change type storage element 10B
  • R Y [k ⁇ ] indicates the resistance change type storage element 10A.
  • V BLb [V] indicates the voltage value of the bit line BLb
  • V BL [V] indicates the voltage value of the bit line BL
  • I W [ ⁇ A] is a resistance change type connected in series. The current value flowing through the memory elements 10A and 10B is shown.
  • the resistance variable storage element data writing device is configured to change each resistance variable type from one write circuit to the resistance variable storage elements 10A and 10B connected in series to the complementary cell 10C.
  • a current according to the storage state of the storage element flows, data is sequentially written to each of the resistance change type storage elements 10A and 10B, and the change of the current is detected by the detection unit, so that the writing operation can be completed with high accuracy. Can do.
  • time 20 nsec ⁇ about 31nsec current I w for writing flows, after detecting the writing end, about 31nsec after, the control unit so that the current I w is 0 is performing control, write energy during writing Is 331 fJ (femto joule).
  • the inventor of the present application used the resistance change type storage element (MTJ element) shown in Table 1 when producing the data write device of the resistance change type storage element according to the present invention.
  • Dimeter indicates the diameter [nm] of the MTJ element
  • RA indicates the resistance [ ⁇ ⁇ cm 2 ] of the element
  • TMR indicates a low resistance when the magnetization of the magnetization fixed layer and the magnetization free layer are parallel, and a high when the magnetization is antiparallel
  • J co and J c1 indicate the write threshold current [MA / cm 2 ] when shifting the element from the low resistance state to the high resistance state or from the high resistance state to the low resistance state. ing.
  • Table 2 shows a case where a specific circuit is manufactured for the data write device of the resistance change type memory element of the first embodiment (Type 1), the second embodiment (Type 2), and the third embodiment (Type 3). A comparison is made between the number of transistors (transistor counts) used in the writing device of each embodiment, the number of write operations (# of write cycles) when writing to a complementary cell, and a sense margin (Sense margin).
  • (* 1) indicates a device using two writing circuits each including 26 transistors
  • (* 2) indicates a writing circuit including 26 transistors and two devices. Shows a device using an AND circuit (6 transistors) and 2 NMOS pass gates
  • the data write device of the resistance change type memory element of the third embodiment can be configured with a small amount of transistors and can reduce the circuit scale as compared with the first embodiment and the second embodiment.
  • the resistance change type memory element data writing apparatus of the second embodiment after writing to one of the resistance change type memory elements 10A and 10B of the complementary cell 10C is completed, the other resistance change type memory element is transferred. Therefore, it takes a relatively long time until the writing is completed.
  • the data write device of the resistance change type memory element of the third embodiment it is possible to easily write to the complementary cell 10C by one write operation by one write circuit.
  • a self-terminated mechanism for a complementary cell can be realized while minimizing area and time overhead.
  • the resistance variable memory element data writing device includes the complementary variable resistance memory element (complementary cell 10C) including the variable resistance memory elements 10A and 10B. And a writing means (writing circuit 20) for causing a resistance change in the complementary resistance change storage element, and a detection means (detection unit) for detecting a writing state of the complementary resistance change storage element (complementary cell 10C). 30) and control means (control section 40) for controlling writing of the writing means (writing circuit 20) based on the detection signal of the detection means (detecting section 30).
  • the writing means causes a current to flow through the storage elements (resistance change storage elements 10A and 10B) connected in series with the complementary resistance change storage elements (complementary cells 10C), and changes the current flow direction.
  • Switching means switching unit 50 for switching is provided.
  • the detection means detection unit 30 detects a potential change between the storage elements (resistance change storage elements 10A and 10B) connected in series with the write drive source 25 of the write circuit 20, so that the complementary resistance is detected.
  • the control unit 40 performs control so that the writing operation is immediately ended, so that the energy during writing is small.
  • the detection means detects the resistance change of one of the storage elements (resistance change storage elements 10A and 10B) of the complementary resistance change storage element (complementary cell 10C).
  • Means first detection unit 321) and second detection means for detecting a resistance change of the other storage element (resistance change type storage element 10A, 10B) of the complementary resistance change type storage element (complementary type cell 10C).
  • Second detector 322 That is, the first detection unit 321 and the second detection unit 322 can easily increase the resistance change of each storage element (resistance change storage element 10A, 10B) of the complementary resistance change storage element (complementary cell 10C). It can be detected with accuracy.
  • control unit 40 performs control so that the writing operation is immediately ended, so that the energy during writing is small. .
  • the sense amplifier 312 may be of relatively low accuracy.

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