WO2017200014A1 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- WO2017200014A1 WO2017200014A1 PCT/JP2017/018562 JP2017018562W WO2017200014A1 WO 2017200014 A1 WO2017200014 A1 WO 2017200014A1 JP 2017018562 W JP2017018562 W JP 2017018562W WO 2017200014 A1 WO2017200014 A1 WO 2017200014A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- resin
- polymer block
- adhesive layer
- block copolymer
- Prior art date
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- 239000010410 layer Substances 0.000 claims abstract description 213
- 229920001400 block copolymer Polymers 0.000 claims abstract description 200
- 229920000642 polymer Polymers 0.000 claims abstract description 183
- 229920005989 resin Polymers 0.000 claims abstract description 180
- 239000011347 resin Substances 0.000 claims abstract description 180
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 42
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 42
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229920001225 polyester resin Polymers 0.000 claims abstract description 9
- 239000004645 polyester resin Substances 0.000 claims abstract description 9
- -1 aromatic vinyl compound Chemical class 0.000 claims description 189
- 239000000463 material Substances 0.000 claims description 182
- 239000012790 adhesive layer Substances 0.000 claims description 168
- 229920002554 vinyl polymer Polymers 0.000 claims description 63
- 239000000113 methacrylic resin Substances 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 42
- 239000000178 monomer Substances 0.000 claims description 41
- 229920001155 polypropylene Polymers 0.000 claims description 39
- 239000004743 Polypropylene Substances 0.000 claims description 33
- 238000000465 moulding Methods 0.000 claims description 33
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 26
- 229920000058 polyacrylate Polymers 0.000 claims description 26
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 239000012528 membrane Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 12
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 10
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 7
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 58
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 4
- 239000002585 base Substances 0.000 description 142
- 238000000034 method Methods 0.000 description 98
- 239000000203 mixture Substances 0.000 description 73
- 230000015572 biosynthetic process Effects 0.000 description 44
- 239000000243 solution Substances 0.000 description 42
- 238000003786 synthesis reaction Methods 0.000 description 41
- 238000006243 chemical reaction Methods 0.000 description 32
- 125000003118 aryl group Chemical group 0.000 description 28
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 27
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- 238000006116 polymerization reaction Methods 0.000 description 21
- 239000003963 antioxidant agent Substances 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 17
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- 229920001577 copolymer Polymers 0.000 description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 15
- 150000001993 dienes Chemical class 0.000 description 15
- 238000005984 hydrogenation reaction Methods 0.000 description 15
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 14
- 150000002148 esters Chemical class 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 229920002725 thermoplastic elastomer Polymers 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000007731 hot pressing Methods 0.000 description 12
- 238000004898 kneading Methods 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 9
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 9
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 8
- 125000005396 acrylic acid ester group Chemical group 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 239000000155 melt Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 8
- 238000007666 vacuum forming Methods 0.000 description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- WGOPGODQLGJZGL-UHFFFAOYSA-N lithium;butane Chemical compound [Li+].CC[CH-]C WGOPGODQLGJZGL-UHFFFAOYSA-N 0.000 description 7
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
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- 235000007586 terpenes Nutrition 0.000 description 7
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 7
- 229920000428 triblock copolymer Polymers 0.000 description 7
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 6
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 6
- 239000013032 Hydrocarbon resin Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 239000002879 Lewis base Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 229920006222 acrylic ester polymer Polymers 0.000 description 6
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 6
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 229920000359 diblock copolymer Polymers 0.000 description 6
- 229920006270 hydrocarbon resin Polymers 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 150000007527 lewis bases Chemical class 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- UKVIEHSSVKSQBA-UHFFFAOYSA-N methane;palladium Chemical compound C.[Pd] UKVIEHSSVKSQBA-UHFFFAOYSA-N 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 5
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 5
- 239000006057 Non-nutritive feed additive Substances 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 229920001893 acrylonitrile styrene Polymers 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 5
- 239000012295 chemical reaction liquid Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 5
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- 238000009826 distribution Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
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- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 5
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 5
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 4
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 4
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 4
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 4
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004902 Softening Agent Substances 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 description 4
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 4
- 150000001565 benzotriazoles Chemical class 0.000 description 4
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical compound C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
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- 150000003254 radicals Chemical group 0.000 description 4
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- 238000012360 testing method Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 238000006886 vinylation reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 3
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
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- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
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- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
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- 125000001931 aliphatic group Chemical group 0.000 description 3
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- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000706 filtrate Substances 0.000 description 3
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 229940119545 isobornyl methacrylate Drugs 0.000 description 3
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 150000007519 polyprotic acids Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 230000008569 process Effects 0.000 description 3
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- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
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- 238000005191 phase separation Methods 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
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- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ATZHWSYYKQKSSY-UHFFFAOYSA-N tetradecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C(C)=C ATZHWSYYKQKSSY-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- OXFUXNFMHFCELM-UHFFFAOYSA-N tripropan-2-yl phosphate Chemical compound CC(C)OP(=O)(OC(C)C)OC(C)C OXFUXNFMHFCELM-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
- B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
- B29C48/21—Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2025/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
- B29K2025/04—Polymers of styrene
- B29K2025/06—PS, i.e. polystyrene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2055/00—Use of specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of main groups B29K2023/00 - B29K2049/00, e.g. having a vinyl group, as moulding material
- B29K2055/02—ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2096/00—Use of specified macromolecular materials not provided for in a single one of main groups B29K2001/00 - B29K2095/00, as moulding material
- B29K2096/04—Block polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0085—Copolymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Definitions
- the present invention is a laminate comprising a base material layer and an adhesive layer, and the aromatic vinyl compound polymer block (S) forms a film structure phase at the interface between the base material layer and the adhesive layer.
- the present invention relates to a laminate characterized in that a base material layer and an adhesive layer are in close contact with each other.
- Ceramics, metal, synthetic resin, fiber reinforced resin or the like is selected as the material of the member. Members made of these materials may be used in applications such as the exterior of home appliances and the interior of automobiles.
- a film with an adhesive layer is often adhered to the surface of a member that is an adherend.
- examples of the purpose include decorating with a pattern such as a wood grain, and imparting design properties with a glossy surface such as a metallic tone and a piano black tone.
- functionalities such as scratch resistance, weather resistance, and chemical resistance can be given.
- synthetic resins are frequently used for the base material layer or for the outermost surface of the laminate.
- a synthetic resin is required to satisfy functions such as scratch resistance, weather resistance, and chemical resistance.
- the adhesive layer is required to have adhesiveness to both the base material made of synthetic resin and the adherend.
- the polarities of the substrate and the adherend are often different, and the adhesive layer is required to have adhesiveness to both polar and nonpolar materials.
- a film insert molding method As a method of adhering a decorative film to an adherend having a three-dimensional shape, for example, a film insert molding method is used. In this method, the decorative film is placed in a mold and injection molded. In this method, it is necessary to shape the decorative film in advance so as to match the mold shape. Further, such a method is difficult to apply to an adherend made of a metal, a thermosetting resin, or the like. As another decorating method for solving these problems, for example, vacuum forming such as three-dimensional surface decorating is cited. However, in this method, it is necessary to apply an adhesive, and there is a problem in productivity.
- Patent Document 1 proposes a method of manufacturing a molded body using a special film for insert molding.
- a film consists of a thermoplastic polymer composition.
- such a film is very poor in conformity to a three-dimensional adherend in vacuum forming. For this reason, there existed a problem which produces the fracture
- Patent Document 2 proposes a multilayer film.
- the multilayer film has a film made of a methacrylic resin composition and a film made of an acrylic block copolymer.
- the methacrylic resin composition contains a block copolymer and a methacrylic resin.
- a film made of an acrylic block copolymer has high toughness and high adhesion to a film made of a methacrylic resin composition.
- such multilayer films have low adhesion to nonpolar resins.
- Patent Document 3 discloses a multilayer article including (i) a polycarbonate layer, (ii) a polypropylene layer, and (iii) an adhesive layer.
- the adhesive layer contains a copolymer containing structural units derived from one or more alkenyl aromatic compounds and one or more conjugated dienes.
- a pre-assembly is disclosed that includes either a polycarbonate layer or a polypropylene layer in addition to an adhesive layer.
- Patent Documents 4 and 5 disclose a method of laminating an adhesive layer composed of an ethylene copolymer, a tackifier and a block copolymer and a resin layer on an adherend by a coextrusion laminating method. Yes.
- the adhesive layer is considered to be excellent in adhesion to the resin layer and the adherend mainly due to the action of the tackifier.
- JP 2014-168940 A JP 2012-213911 A Special table 2007-507374 Japanese Patent Laid-Open No. 11-131037 JP-A-11-286871
- the present invention ensures strong adhesiveness between the base material layer and the adhesive layer, both polar and nonpolar materials. It aims at providing the laminated body which is excellent in the adhesiveness with respect to.
- a laminate comprising a base material layer and an adhesive layer in contact with the base material layer,
- the substrate layer is made of (meth) acrylic resin (M), acrylonitrile-butadiene-styrene resin or polyester resin,
- the adhesive layer contains a block copolymer (A) containing an aromatic vinyl compound polymer block (S) and a conjugated diene compound polymer block (D),
- the aromatic vinyl compound polymer block (S) further forms a phase having a circular cross-section structure,
- the adhesive layer has a poor region of the circular cross-sectional structure along the phase of the membrane structure;
- the laminate of [1]. [3] The laminate of [1] or [2], wherein the adhesive layer contains more than 50% by mass of the block copolymer (A).
- the block copolymer (A) contains 5 to 40% by mass of the aromatic vinyl compound polymer block (S) and 60 to 95% by mass of the conjugated diene compound polymer block (D). ] To [4]. [6] The laminate according to any one of [1] to [5], wherein the adhesive layer further contains an adhesion-imparting component (B). [7] The content of the tackifier (aD) in the adhesive layer is less than 1 part by mass with respect to 100 parts by mass of the block copolymer (A), any one of [1] to [6] Laminated body. [8] The laminate according to any one of [1] to [7], wherein the conjugated diene compound polymer block (D) does not have a polar group.
- the base material layer is made of a (meth) acrylic resin (M).
- the (meth) acrylic resin (M) contains 10 to 99% by mass of the methacrylic resin (F) and 1 to 90% by mass of the elastic body component (R).
- the methacrylic resin (F) contains 80% by mass or more of structural units derived from methyl methacrylate
- the elastic body component (R) contains a block copolymer (G) composed of 10 to 80% by mass of a methacrylic ester polymer block (g1) and 20 to 90% by mass of an acrylate polymer block (g2). , [10] A laminate.
- the (meth) acrylic resin (M) contains 10 to 99% by mass of the methacrylic resin (F) and 1 to 90% by mass of the elastic body component (R).
- the methacrylic resin (F) contains 80% by mass or more of structural units derived from methyl methacrylate
- the elastic body component (R) forms a multilayer structure (E) having an outer layer (e1) and an inner layer (e2);
- the outer layer (e1) contains 80% by mass or more of structural units derived from methyl methacrylate,
- the inner layer (e2) contains 70 to 99.8% by mass of structural units derived from an alkyl acrylate ester and 0.2 to 30% by mass of structural units derived from a crosslinkable monomer.
- the adhesive layer has an adhesive surface on the opposite side of the base material layer,
- the laminate according to any one of [1] to [12], having a peel strength of 20 N / 25 mm or more when the adhesive surface is in close contact with a polypropylene resin.
- a method for producing a laminate comprising a base material layer and an adhesive layer in contact with the base material layer by press molding or coextrusion molding
- the substrate layer is made of (meth) acrylic resin (M), acrylonitrile-butadiene-styrene resin or polyester resin
- the adhesive layer contains a block copolymer (A) containing an aromatic vinyl compound polymer block (S) and a conjugated diene compound polymer block (D),
- the manufacturing method of a laminated body which forms the phase of the film
- the laminate of the present invention has a base material layer and an adhesive layer, and forms a film structure composed of an aromatic block derived from the adhesive layer in the vicinity of these interfaces. For this reason, the affinity (adhesion, wettability) between a base material layer and an adhesive layer can be improved. Moreover, the laminated body of this invention can be conveniently used as a film with an adhesive layer for sticking on the surface of members, such as a building material, an aircraft, a motor vehicle member, a household appliance, a mobile device.
- Example 12 is an image obtained by photographing a cross section of a laminate after TOM molding in Example 8 with a TEM. It is the image which image
- the laminate (laminate 20) of the present invention comprises a base layer 10 having polarity and an adhesive layer 11 containing a block copolymer (A).
- the drawings are illustrations for understanding the three-dimensional structures of the laminate of the present invention, and do not limit the present invention.
- the laminate of the present invention is an aromatic vinyl compound polymer block derived from the block copolymer (A) along the polar base material layer 10 at the interface between the base material layer 10 and the adhesive layer 11. It is characterized in that a phase of the film structure 17 made of (S) is formed.
- the affinity between the base material layer 10 and the adhesive layer 11 is increased, thereby causing the adhesiveness. It is preferable because the property can be improved.
- the thickness of the phase of the membrane structure 17 according to the present invention is smaller than the size of the diameter of the circular cross-sectional structure 18 of the aromatic vinyl compound polymer block (S) derived from the microphase separation structure of the block copolymer (A). It is preferable.
- the circular cross-sectional structure 18 refers to a spherical phase or a cylindrical phase of the aromatic vinyl compound polymer block (S). These phases are derived from the microphase separation structure of the block copolymer (A).
- the diameter of the circular cross-sectional structure 18 is not particularly limited.
- the diameter of the circular cross-sectional structure 18 is the molecular weight of the aromatic vinyl compound polymer block (S) and the conjugated diene compound polymer block (D) contained in the block copolymer (A), for example, gel permeation chromatography (GPC). ) Depends on the weight average molecular weight in terms of polystyrene determined by measurement.
- the thickness of the phase of the film structure 17 according to the present invention can be controlled by selecting a material for forming the phase of the film structure 17 and applying heat to the material as described below.
- the aromatic vinyl compound polymer block (S) extends to the interface with the base material layer 11 having polarity due to the microphase separation structure of the block copolymer (A). For this reason, with proper material selection and application of heat to the material, the thickness of the phase of the membrane structure 17 necessarily becomes smaller than the size of the diameter of the circular cross-sectional structure 18.
- the aromatic phase 14 made of the block copolymer (A) according to the present invention has the phase 15 adjacent to the phase of the membrane structure 17 means that the adhesiveness between the base material layer 10 and the adhesive layer 11 is It is more preferable because it helps to improve the quality.
- the phase 15 is poor in the circular cross-sectional structure 18 of the aromatic vinyl compound polymer block (S) derived from the block copolymer (A).
- the laminated body 20 shown in FIG. 1 is equipped with the base material layer 10 which consists of polar resins, and the adhesive layer 11 containing a block copolymer (A).
- the adhesive layer 11 is made of a thermoplastic elastomer containing the block copolymer (A).
- the block copolymer (A) contains an aromatic vinyl compound polymer block (S) and a conjugated diene compound polymer block (D).
- the block copolymer (A) is a hydrogenated product or a non-hydrogenated product.
- the aromatic phase 14 shown in FIG. 1 forms a film structure 17 and a circular cross-sectional structure 18.
- the membrane structure 17 is an aggregate of aromatic vinyl compound polymer blocks (S) in the vicinity of the interface 12.
- the film structure 17 is formed along the interface 12.
- the membrane structure 17 refers to a membrane-like phase in the microphase separation structure formed by the aromatic vinyl compound polymer block (S).
- the presence of the film structure 17 shown in FIG. 1 can be confirmed by visual observation or inspection of the exposed interface 12, and the method is not particularly limited.
- Examples of the confirmation method include observation by a transmission electron microscope (TEM) and analysis by secondary ion mass spectrometry (SIMS).
- the SIMS may be dynamic SIMS or static SIMS. Among these, observation by TEM is preferable.
- the cross section of the laminate 20 is stained with ruthenium oxide or the like, and the cross section is visually observed using the TEM.
- the side of the adhesive layer 11 where the interface 12 was formed is analyzed.
- the surface on which the interface 12 has been formed may be analyzed, or analysis may be performed while digging with a sputter ion gun from the surface toward the inside of the adhesive layer 11.
- SIMS the aromatic vinyl compound polymer block (S) when the surface of the film made of the same composition as the composition forming the adhesive layer 11 is analyzed. )
- the presence of the film structure 17 can be confirmed from the fact that the concentration of the aromatic vinyl compound polymer block (S) is high when the interface 12 is analyzed.
- the aromatic vinyl compound polymer block (S) inside the adhesive layer 11 in the depth profile When analyzing by SIMS while digging with a sputter ion gun toward the inside of the adhesive layer 11, the aromatic vinyl compound polymer block (S) inside the adhesive layer 11 in the depth profile.
- the presence of the membrane structure 17 can be confirmed from the fact that the concentration of the aromatic vinyl compound polymer block (S) at the interface 12 is higher than the concentration of.
- aromatic phase 14 and phase 15 composed of conjugated diene compound polymer block (D)
- die phase 15 may be present.
- each block copolymer (A) molecule remains bonded between the aromatic vinyl compound polymer block (S) and the conjugated diene compound polymer block (D).
- a phase comprising an aromatic vinyl compound polymer block (S) in which the aromatic vinyl compound polymer blocks (S) and the conjugated diene compound polymer block (D) are gathered between the block copolymer (A) molecules. And at least partially phase-separated between the conjugated diene compound polymer block (D). Conditions for forming such a microphase separation structure will be described later.
- the columnar or spherical phase is a structure that is understood from a cross-sectional image of the stacked body 20 shown in FIG. 2A.
- FIG. 2A is an image obtained by photographing the cross section of the laminate 20 with a TEM (transmission electron microscope).
- the length in the longitudinal direction of the circular cross-sectional structure 18 is not limited. Therefore, the circular cross-sectional structure 18 includes a structure having a shape that is determined to be almost spherical due to its short length.
- the cross-sectional shape of the circular cross-sectional structure 18 is not limited to a perfect circle.
- the diene phase 15 shown in FIG. 1 does not take a specific structure.
- the circular cross-sectional structure 18 may be dispersed in the diene phase 15 or may be unevenly distributed.
- the adhesive layer 11 may have a region 19 having a poor circular cross-sectional structure 18 in the diene phase 15. In region 19, the diene phase 15 is dominant over the aromatic phase 14. Region 19 is located near membrane structure 17. The region 19 is located between the region rich in the circular cross-sectional structure 18 and the film structure 17.
- Such a laminate 20 has good coating moldability with respect to an adherend having a three-dimensional curved surface.
- the laminated body 20 is easily subjected to secondary forming such as vacuum forming or pressure forming.
- the adhesive layer 11 shown in FIG. 1 preferably contains more than 50% by mass of the block copolymer (A).
- the content of the block copolymer (A) may be any of 51, 56, 61, 66, 71, 76, 81, 85, 90, 95, 99, and 100% by mass.
- composition of block copolymer (A) is a component of the thermoplastic elastomer.
- the aromatic vinyl compound polymer block (S) is a polymer mainly containing structural units derived from the aromatic vinyl compound.
- the aromatic vinyl compound include styrene, ⁇ -methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene, 4-dodecylstyrene, 2-ethyl- Examples include 4-benzylstyrene, 4- (phenylbutyl) styrene, 1-vinylnaphthalene, 2-vinylnaphthalene, and combinations thereof.
- the aromatic vinyl compound any of styrene, ⁇ -methylstyrene, 4-methylstyrene and a combination thereof is preferable.
- the composition ratio of the structural unit derived from the aromatic vinyl compound in the aromatic vinyl compound polymer block (S) is preferably 80% by mass or more, more preferably 90% by mass or more, and further preferably 95% by mass or more.
- the composition ratio of the structural unit is 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99 and 100% by mass. can do.
- the aromatic vinyl compound polymer block (S) may have a structural unit derived from another copolymerizable compound.
- Examples of such other structural units include 1-butene, pentene, hexene, butadiene, isoprene, and methyl vinyl ether.
- composition ratio of the structural units derived from other copolymerizable compounds in the aromatic vinyl compound polymer block (S) is 20% by mass or less, more preferably 10% by mass or less, and further preferably 5% by mass or less.
- the composition ratio may be 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0% by mass. Good.
- the conjugated diene compound polymer block (D) mainly contains structural units derived from the conjugated diene compound.
- the structural unit of the conjugated diene compound polymer block (D) include butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, and combinations thereof. .
- As the structural unit at least one of isoprene and butadiene is preferable.
- a combination of isoprene and butadiene is more preferable.
- the conjugated diene compound polymer block (D) does not have a polar group from the viewpoint of suppressing irregularities and foreign matters in the adhesive layer.
- the composition ratio of the structural unit derived from the conjugated diene compound in the conjugated diene compound polymer block (D) is preferably 80% by mass or more, more preferably 90% by mass or more, and further preferably 95% by mass or more.
- the said composition ratio is the value converted from the preparation amount of the raw material.
- the composition ratio of such structural units is any of 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99 and 100% by mass. It may be.
- the conjugated diene compound polymer block (D) may have a structural unit derived from another copolymerizable compound. Examples of such other structural units include styrene, ⁇ -methylstyrene, 4-methylstyrene, and the like.
- the structural unit derived from the aromatic vinyl compound is dominant in each polymer block, or the conjugated diene compound. These can be distinguished by whether the structural unit derived from is dominant.
- composition ratio of the other structural units in the conjugated diene compound polymer block (D) is preferably 20% by mass or less, more preferably 10% by mass or less, and further preferably 5% by mass or less.
- the composition ratio is as follows: 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0% by mass Also good.
- the bonding form of the structural unit in the conjugated diene compound polymer block (D) is not particularly limited.
- the conjugated diene compound is butadiene, 1,2-bonds and 1,4-bonds can be used.
- the conjugated diene compound is isoprene, 1,2-bond, 3,4-bond and 1,4-bond can be used.
- the conjugated diene compound polymer block (D) the sum of the amounts of 1,2-bonds and 3,4-bonds relative to the sum of the amounts of 1,2-bonds, 3,4-bonds and 1,4-bonds
- the ratio that is, the range of the degree of vinylation, is preferably 1 to 99 mol%, more preferably 10 to 80 mol%, still more preferably 30 to 70 mol%, and particularly preferably 40 to 60 mol%. is there.
- the said ratio can be either 10, 20, 30, 40, 50, 60, 70, 80 and 90 mol%.
- the ratio of the amount of 1,2-bond, 3,4-bond and 1,4-bond can be determined from a 1 H-NMR spectrum.
- peaks derived from 1,2-bonds and 3,4-bonds are present in the range of 4.2 to 5.0 ppm.
- a peak derived from 1,4-bond is present in the range of 5.0 to 5.45 ppm. From the ratio of the integrated values of these peaks, the above-mentioned ratio of the amount of bonds (degree of vinylation) is determined.
- the aromatic vinyl compound polymer block (S) and the conjugated diene compound polymer block (D) are bonded.
- These bonding forms are not particularly limited. That is, the bonding form can be linear, branched, radial, or any combination thereof. Since the linear bond form is dominant, the production of the block copolymer (A) can be facilitated.
- the block copolymer (A) is classified as follows based on a larger block structural unit obtained by combining the aromatic vinyl compound polymer block (S) and the conjugated diene compound polymer block (D).
- the block copolymer (A) can be, for example, any one of a diblock copolymer, a triblock copolymer, a tetrablock copolymer, and a pentablock copolymer.
- the diblock copolymer is represented by SD.
- S represents an aromatic vinyl compound polymer block (S)
- D represents a conjugated diene compound polymer block (D).
- the triblock copolymer is represented by SDS or DSD.
- the tetrablock copolymer is represented by SDDSD or the like.
- the pentablock copolymer is represented by SDDSDS or DSSDSD.
- the block copolymer (A) containing a triblock copolymer is excellent in stretchability and adhesiveness and easy to produce. Further, from the viewpoints of handleability and film forming property, those represented by SDS are more preferable.
- the block copolymer (A) can further be an (SD) n X-type copolymer.
- X represents a coupling residue
- n represents an integer of 2 or more.
- the block copolymer (A) includes a diblock copolymer, a triblock copolymer, a tetrablock copolymer and a pentablock copolymer, an (SD) n X-type copolymer, and a mixture thereof. It can also be.
- the block copolymer (A) is a non-hydrogenated product or a hydrogenated product.
- it is preferable that hydrogen is added to a part or all of the conjugated diene compound polymer block (D).
- this may be simply referred to as hydrogenation or hydrogenated.
- the hydrogenation rate (hydrogenation rate) in the conjugated diene compound polymer block (D) is preferably 80% or more, more preferably 90% or more.
- the hydrogenation rate is a value obtained by dividing the iodine value of the conjugated diene compound polymer block (D) after the hydrogenation reaction by the iodine value of the conjugated diene compound polymer block (D) before the hydrogenation reaction.
- the hydrogenation rate may be any of 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99 and 100%. .
- composition ratio of polymer block in block copolymer (A) The content (composition ratio) of the aromatic vinyl compound polymer block (S) in the block copolymer (A) is preferably 5 to 75% by mass, more preferably 5 to 60% by mass. More preferably, it is 5 to 40% by mass, and particularly preferably 10 to 40% by mass. With such a range, the flexibility, stretchability, and adhesiveness of the adhesive layer can be improved.
- the content may be any of 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, and 70% by mass.
- the range (content ratio) of the conjugated diene compound polymer block (D) in the block copolymer (A) is preferably 60 to 95% by mass.
- the content of the conjugated diene compound polymer block (D) may be any of 65, 70, 75, 80, 85, and 90% by mass.
- Weight average molecular weight of block copolymer (A) The range of the weight average molecular weight of the block copolymer (A) is preferably 30,000 to 500,000, more preferably 60,000 to 200,000, and still more preferably 80,000 to 180. , 000. With such a range, the stretchability, adhesiveness, and moldability of the adhesive layer can be improved.
- the weight average molecular weight is 40 ⁇ 10 3 , 50 ⁇ 10 3 , 60 ⁇ 10 3 , 70 ⁇ 10 3 , 80 ⁇ 10 3 , 90 ⁇ 10 3 , 100 ⁇ 10 3 , 110 ⁇ 10 3 , 120 ⁇ 10 3. , 130 ⁇ 10 3 , 140 ⁇ 10 3 , 150 ⁇ 10 3 , 160 ⁇ 10 3 , 170 ⁇ 10 3 , 180 ⁇ 10 3 , 190 ⁇ 10 3 , 200 ⁇ 10 3 , 300 ⁇ 10 3 and 400 ⁇ 10 3 It can be either.
- the weight average molecular weight is a weight average molecular weight in terms of polystyrene determined by gel permeation chromatography (GPC) measurement.
- the block copolymer (A) may have one weight average molecular weight distribution peak. Two or more block copolymers (A) having different weight average molecular weight distributions may be used in combination.
- a block copolymer (A) having a weight average molecular weight of 50,000 to 150,000 hereinafter referred to as a medium molecular weight product
- a block copolymer (A) having a weight average molecular weight of 150,000 to 300,000 hereinafter, it is preferable to combine with a high molecular weight product.
- Such a combination can balance the stretchability, adhesiveness and molding processability of the adhesive layer.
- the range of the mass ratio (medium molecular weight product / high molecular weight product) in the above combination is preferably in the range of 10/90 to 90/10, more preferably in the range of 20/80 to 75/25, and even more preferably. It is in the range of 20/80 to 55/45.
- Such mass ratios are 15/85, 20/80, 25/75, 30/70, 35/65, 40/60, 45/55, 50/50, 55/45, 60/40, 65/35, 70 / Any of 30, 75/25, 80/20, and 85/15 may be used.
- the manufacturing method of a block copolymer (A) is not specifically limited.
- the block copolymer (A) can be produced by, for example, the following anionic polymerization methods (i) to (iii).
- (I) A method of sequentially polymerizing an aromatic vinyl compound and a conjugated diene compound using an alkyllithium compound as an initiator;
- (ii) Following the polymerization of (i), a coupling agent is added to further couple the polymer.
- Method: (iii) A method of sequentially polymerizing a conjugated diene compound and an aromatic vinyl compound using a dilithium compound as an initiator.
- Examples of the alkyl lithium compound in the above methods (i) and (ii) include methyl lithium, ethyl lithium, n-butyl lithium, sec-butyl lithium, tert-butyl lithium, pentyl lithium and the like.
- Examples of the coupling agent in the above method (ii) include dichloromethane, dibromomethane, dichloroethane, dibromoethane, dibromobenzene and the like.
- Examples of the dilithium compound in (iii) above include naphthalene dilithium and dilithiohexylbenzene.
- initiators and coupling agents such as alkyl lithium compounds and dilithium compounds may be used depending on the weight average molecular weight of the target block copolymer (A).
- the initiator may be used in an amount of 0.01 to 0.2 parts by mass with respect to 100 parts by mass in total of the aromatic vinyl compound and the conjugated diene compound.
- the coupling agent may be used in an amount of 0.001 to 0.8 parts by mass.
- the above anionic polymerization reaction is preferably performed in the presence of a solvent.
- the type of the solvent is preferably one that is inert to the initiator and does not adversely affect the polymerization reaction.
- the solvent may be, for example, a saturated aliphatic hydrocarbon such as hexane, heptane, octane, or decane; an aromatic hydrocarbon such as toluene, benzene, or xylene.
- the polymerization reaction is preferably performed in the temperature range of 0 to 80 ° C. for 0.5 to 50 hours.
- an organic Lewis base may be added to the reaction liquid of the anionic polymerization reaction.
- the organic Lewis base can increase the ratio of 1,2-bond and 3,4-bond of the conjugated diene compound polymer block (D) in the block copolymer (A), that is, the degree of vinylation.
- the ratio of 1,2-bond and 3,4-bond in the block copolymer (A) can be controlled by the amount of the organic Lewis base added.
- organic Lewis base examples include esters such as ethyl acetate; amines such as triethylamine, N, N, N ′, N′-tetramethylethylenediamine and N-methylmorpholine; nitrogen-containing heterocyclic aromatic compounds such as pyridine; Amides such as acetamide; ethers such as dimethyl ether, diethyl ether, tetrahydrofuran and dioxane; glycol ethers such as ethylene glycol dimethyl ether and diethylene glycol dimethyl ether; sulfoxides such as dimethyl sulfoxide; ketones such as acetone and methyl ethyl ketone.
- esters such as ethyl acetate
- amines such as triethylamine, N, N, N ′, N′-tetramethylethylenediamine and N-methylmorpholine
- nitrogen-containing heterocyclic aromatic compounds such as pyridine
- Amides such as acetamide
- the block copolymer contained in the reaction solution may be solidified by pouring the reaction solution into a poor solvent such as methanol of the block copolymer.
- the solvent may be removed azeotropically by pouring the reaction solution together with steam into hot water (steam stripping). It is preferable to dry the block copolymer after removing the solvent.
- the non-hydrogenated block copolymer (A) can be isolated by drying.
- the hydrogenation reaction may be performed under the conditions of a hydrogen pressure of 0.1 to 20 MPa, a reaction temperature of 20 to 250 ° C., and a reaction time of 0.1 to 100 hours.
- a hydrogenated block copolymer (A) can be obtained by subjecting the non-hydrogenated block copolymer (A) to a hydrogenation reaction.
- the hydrogenation reaction is carried out, for example, in a solution containing a solvent inert to the reaction and the hydrogenation catalyst, and a non-hydrogenated block copolymer (A) in the presence of the hydrogenation catalyst.
- examples thereof include a method of reacting the additive type block copolymer (A).
- the hydrogenation catalyst examples include Raney nickel and heterogeneous catalysts in which metals such as Pt, Pd, Ru, Rh and Ni are supported on a support such as carbon, alumina, diatomaceous earth; transition metal compounds, alkylaluminum compounds, alkyllithium compounds Ziegler catalyst comprising a combination of the above; metallocene catalyst and the like.
- the thermoplastic elastomer constituting the adhesive layer 11 shown in FIG. 1 may contain an adhesion-imparting component (B) other than the block copolymer (A), but it contains an adhesion-imparting component (B).
- the amount is preferably smaller than 25 parts by mass with respect to 100 parts by mass of the block copolymer (A).
- the content is 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, with respect to 100 parts by mass of the block copolymer (A). It can be 8, 7, 6, 5, 4, 3, 2, 1, 0 parts by mass.
- Examples of the adhesion imparting component (B) include a polar group-containing polypropylene resin (B2).
- the polar group-containing polypropylene resin (B2) may be a copolymer of a structural unit derived from propylene and a structural unit derived from a monomer having a polar group, or has a polar group in the side chain of polypropylene. There may be.
- An example of the polar group-containing polypropylene resin is a carboxylic acid-modified polypropylene resin. Such a resin is a polypropylene containing a carboxy group as a polar group.
- Other examples include maleic acid modified polypropylene resins and maleic anhydride modified polypropylene resins.
- Examples of the polar group that the polar group-containing polypropylene resin (B2) has include (meth) acryloyloxy group; hydroxyl group; amide group; halogen atom such as chlorine atom; carboxy group;
- the method for producing the polar group-containing polypropylene resin (B2) is not particularly limited, and may be obtained by copolymerizing a copolymerizable monomer containing a polar group with propylene, or a polypropylene containing no polar group.
- Polar groups may be introduced into the resin.
- the copolymerizable monomer containing a polar group include vinyl acetate, vinyl chloride, ethylene oxide, propylene oxide, acrylamide, unsaturated carboxylic acid, esters thereof or anhydrides thereof.
- Examples of the unsaturated carboxylic acid or its ester or its anhydride include (meth) acrylic acid, (meth) acrylic acid ester, maleic acid, maleic anhydride, fumaric acid, itaconic acid, itaconic anhydride, highmic acid, and highmic anhydride. An acid etc. are mentioned.
- Examples of the range of the proportion of structural units containing polar groups in all structural units of the polar group-containing polypropylene resin (B2) are 0 to 10% by mass, 0 to 5% by mass, and 0 to 1% by mass.
- the polar group-containing polypropylene resin (B2) may not be included in the composition constituting the adhesive layer 11 shown in FIG.
- the content of the tackifier (aD) is 100 parts by mass of the block copolymer (A). Is preferably less than 1 part by mass, more preferably less than 0.5 part by mass, and even more preferably 0 part by mass. By setting the content of the tackifier (aD) in such a range, the surface smooth adhesive layer of the adhesive layer 11 can be improved.
- tackifier examples include aliphatic unsaturated hydrocarbon resins, aliphatic saturated hydrocarbon resins, alicyclic unsaturated hydrocarbon resins, alicyclic saturated hydrocarbon resins, aromatic hydrocarbon resins, hydrogenated resins.
- Aromatic hydrocarbon resin, rosin ester resin, hydrogenated rosin ester resin, terpene phenol resin, hydrogenated terpene phenol resin, terpene resin, hydrogenated terpene resin, aromatic hydrocarbon modified terpene resin, coumarone indene resin, phenol resin, Xylene resins and combinations thereof may be mentioned.
- At least one of an aliphatic saturated hydrocarbon resin, an alicyclic saturated hydrocarbon resin, a hydrogenated aromatic hydrocarbon resin, and a hydrogenated terpene resin is preferable. At least one of a hydrogenated aromatic hydrocarbon resin and a hydrogenated terpene resin is more preferable.
- the range of the softening point of the tackifier (aD) is preferably 50 to 200 ° C, more preferably 65 to 180 ° C, and further preferably 80 to 160 ° C.
- the softening point is a value measured according to ASTM 28-67.
- the softening point to 50 ° C. or higher helps to maintain the adhesion of the adhesive layer 11 shown in FIG. 1 to the base material layer 10 and the adherend.
- the temperature at which the laminate 20 is used is assumed to be room temperature (5-35 ° C.).
- the softening point of the tackifier (aD) can be appropriately selected according to the temperature at which the laminate 20 is used.
- the softening point By setting the softening point to 200 ° C. or lower, flexibility can be ensured at the heat treatment temperature at the time of adhesion, and thus the adhesiveness after the heat treatment can be maintained.
- the heat treatment temperature at the time of bonding can be, for example, 200 ° C. or higher.
- the composition constituting the adhesive layer 11 shown in FIG. 1 may further contain a softening agent (Sf).
- the softener (Sf) include softeners generally used for rubber and plastics, such as paraffinic, naphthenic, and aromatic process oils; phthalic acid derivatives such as dioctyl phthalate and dibutyl phthalate; white oil Mineral oil, oligomers of ethylene and ⁇ -olefin, paraffin wax, liquid paraffin, polybutene, low molecular weight polybutadiene, low molecular weight polyisoprene, and the like. Among these, process oil is preferable, and paraffinic process oil is more preferable.
- the softening agent (Sf) a known softening agent used in combination with the polyvinyl acetal resin can also be used.
- the softener include organic acid ester plasticizers such as monobasic organic acid esters and polybasic organic acid esters; phosphoric acid plasticizers such as organic phosphate esters and organic phosphite esters.
- organic acid ester plasticizers include esters of polybasic organic acids such as adipic acid, sebacic acid, azelaic acid and alcohols; triethylene glycol-di-caproic acid ester, triethylene glycol-di-2-ethylbutyric acid Glycols such as triethylene glycol, tetraethylene glycol, tripropylene glycol and the like represented by esters, triethylene glycol-di-n-octylate, triethylene glycol-di-2-ethylhexylate, butyric acid, isobutyric acid Glycol esters obtained by reaction with monobasic organic acids such as caproic acid, 2-ethylbutyric acid, heptylic acid, n-octylic acid, 2-ethylhexylic acid, pelargonic acid (n-nonylic acid), decyl acid, etc. Can be mentioned.
- polybasic acid organic ester examples include sebacic acid dibutyl ester, azelaic acid dioctyl ester, adipic acid dibutyl carbitol ester and the like.
- organic phosphate ester examples include tributoxyethyl phosphate, isodecylphenyl phosphate, triisopropyl phosphate, and the like.
- a softener (Sf) may be used individually by 1 type, and may be used in combination of 2 or more type.
- the content of the softening agent (Sf) is preferably smaller than 25 parts by mass with respect to 100 parts by mass of the block copolymer (A).
- the content is 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, with respect to 100 parts by mass of the block copolymer (A). It can be 8, 7, 6, 5, 4, 3, 2, 1, 0 parts by mass.
- the composition constituting the adhesive layer 11 shown in FIG. 1 may contain a thermoplastic polymer other than the block copolymer (A).
- a thermoplastic polymer other than the block copolymer (A) By containing another thermoplastic polymer, the mechanical strength of the adhesive layer can be increased and the peel strength can be improved.
- other thermoplastic polymers are olefin polymers, styrene polymers, polyphenylene ether resins, polyethylene glycol, and the like.
- the olefin polymer include polyethylene, polypropylene, polybutene, block copolymers of propylene and other ⁇ -olefins such as ethylene and 1-butene, random copolymers, and the like.
- a methyl methacrylate-styrene block copolymer may be used as a compatibilizing agent. Further, any (meth) acrylic resin described in this specification may be added.
- the content of the other thermoplastic polymer is preferably smaller than 25 parts by mass with respect to 100 parts by mass of the block copolymer (A).
- the content is 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, with respect to 100 parts by mass of the block copolymer (A). It can be 8, 7, 6, 5, 4, 3, 2, 1, 0 parts by mass.
- the composition constituting the adhesive layer 11 shown in FIG. 1 may contain an inorganic filler.
- the inorganic filler can adjust the heat resistance, weather resistance, and hardness of the adhesive layer 11 to appropriate ones.
- examples of the inorganic filler include calcium carbonate, talc, magnesium hydroxide, aluminum hydroxide, mica, clay, natural silicic acid, synthetic silicic acid, titanium oxide, carbon black, barium sulfate, glass balloon, and glass fiber. . Of these, one type may be used alone, or two or more types may be used in combination.
- the content is preferably within a range in which the flexibility of the composition constituting the adhesive layer 11 shown in FIG. 1 is not impaired.
- the content of the inorganic filler is preferably smaller than 25 parts by mass with respect to 100 parts by mass of the block copolymer (A).
- the content is 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, with respect to 100 parts by mass of the block copolymer (A). It can be 8, 7, 6, 5, 4, 3, 2, 1, 0 parts by mass.
- the composition constituting the adhesive layer 11 shown in FIG. 1 includes antioxidants, lubricants, light stabilizers, processing aids, colorants such as pigments and dyes, flame retardants, antistatic agents, matting agents, and silicone oil. Further, it may contain an anti-blocking agent, an ultraviolet absorber, a release agent, a foaming agent, an antibacterial agent, an antifungal agent, a fragrance and the like.
- antioxidants include hindered phenol-based, phosphorus-based, lactone-based, and hydroxy-based antioxidants. Among these, hindered phenolic antioxidants are preferable.
- the content of the additive is preferably in a range that does not give unintentional coloring to the composition.
- Content of an additive is smaller than 25 mass parts with respect to 100 mass parts of block copolymers (A).
- the content is 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, with respect to 100 parts by mass of the block copolymer (A). It can be 8, 7, 6, 5, 4, 3, 2, 1, 0 parts by mass.
- the preparation method of the composition which comprises the adhesive layer 11 shown in FIG. 1 will not be specifically limited if it is a method which can mix a content component uniformly.
- a melt kneading method may be used.
- the melt kneading method can be performed using a melt kneading apparatus such as a single screw extruder, a twin screw extruder, a kneader, a batch mixer, a roller, or a Banbury mixer.
- the temperature for melt kneading can be 170 to 270 ° C.
- the hardness range of the composition constituting the adhesive layer 11 shown in FIG. 1 is preferably 0 to 90, more preferably 30 to 90, as measured by the JIS-A method of JIS K 6253. More preferably, it is 35 to 85. When the hardness is 90 or less, the flexibility and elastic modulus of the adhesive layer 11 can be made suitable.
- the fluidity of the composition constituting the adhesive layer 11 shown in FIG. 1 can be represented by MFR (melt flow rate).
- MFR can be measured by a method according to JIS K 7210. When measured at 230 ° C. and a load of 2.16 kg (21.18 N), the MFR range is preferably 1 to 50 g / 10 minutes, more preferably 1 to 40 g / 10 minutes, and even more preferably 2 to 30 g / 10 minutes. is there. Due to such fluidity, the moldability of the adhesive layer 11 is improved. For this reason, formation of the adhesive layer 11 which is an adhesive layer becomes easy.
- the thickness range of the adhesive layer 11 shown in FIG. 1 is preferably 10 to 500 ⁇ m, more preferably 30 to 190 ⁇ m, and still more preferably 50 to 150 ⁇ m.
- the adhesiveness of the laminated body 20 and a to-be-adhered body can be improved because the thickness of the adhesive layer 11 is 10 micrometers or more.
- the surface hardness of the laminate 20 is, for example, the surface hardness measured on the surface 16 of the base material layer 10 opposite to the adhesive layer 11.
- the polar resin 1 is made of a polar resin.
- a typical example of the polar resin according to this embodiment is a (meth) acrylic resin (M), an acrylonitrile-butadiene-styrene resin, or a polyester resin.
- the polar resin is preferably a (meth) acrylic resin (M).
- the base material layer 10 made of the (meth) acrylic resin (M) is excellent in transparency, surface hardness, surface smoothness, and stretchability, and has little whitening due to heating.
- composition of (meth) acrylic resin (M) When the base material layer 10 shown in FIG. 1 consists of (meth) acrylic-type resin (M), (meth) acrylic-type resin (M) contains methacrylic-type resin (F) 10 mass% or more.
- the composition ratio of the methacrylic resin (F) may be 20, 30, 40, 50, 60, 70, 80, 90, or 100% by mass.
- the methacrylic resin (F) contains 80 mass% or more, preferably 90 mass% or more of a structural unit derived from methyl methacrylate.
- the composition ratio of the structural unit derived from methyl methacrylate is 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, Or 100% by mass.
- the methacrylic resin (F) preferably contains other structural units in an amount of 20% by mass or less, more preferably 10% by mass or less.
- Examples of the other structural units include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec-butyl acrylate, tert-butyl acrylate, and acrylic.
- the stereoregularity of the methacrylic resin (F) is not particularly limited.
- the stereoregularity may be, for example, isotactic, heterotactic, syndiotactic and the like.
- the range of the weight average molecular weight Mw (F) of the methacrylic resin (F) is preferably 30,000 to 180,000, more preferably 40,000 to 150,000, still more preferably 50,000 to 130,000. .
- Mw (F) is 30,000 or more, impact resistance and toughness of the base material layer 10 shown in FIG. 1 are improved.
- Mw (F) is 18,000 or less, the fluidity of the methacrylic resin (F) can be sufficiently ensured, so that the processability of the (meth) acrylic resin (M) is improved.
- the methacrylic resin (F) may be a commercially available product.
- Examples of such commercially available products include “Parapet H1000B” (MFR: 22 g / 10 min (230 ° C., 37.3 N)), “Parapet GF” (MFR: 15 g / 10 min (230 ° C., 37.3 N)), “ “Parapet EH” (MFR: 1.3 g / 10 min (230 ° C., 37.3 N)), “Parapet HRL” (MFR: 2.0 g / 10 min (230 ° C., 37.3 N)), “Parapet HRS” ( MFR: 2.4 g / 10 min (230 ° C., 37.3 N)) and “Parapet G” (MFR: 8.0 g / 10 min (230 ° C., 37.3 N)) [all trade names, manufactured by Kuraray Co., Ltd. ] Etc. are mentioned.
- the (meth) acrylic resin (M) preferably further contains 1 to 90% by mass of an elastic body component (R) from the viewpoints of impact resistance, toughness, stretchability, and moldability.
- the composition ratio of the elastic body component (R) may be any of 1, 10, 20, 30, 40, 50, 60, 70, 80, and 90% by mass.
- the elastic component (R) is preferably 45 to 10 parts by mass with respect to 55 to 90 parts by mass of the methacrylic resin (F). Further, the elastic component (R) is more preferably 30 to 10 parts by mass with respect to 70 to 90 parts by mass of the methacrylic resin (F).
- Elastic Body Component (R) examples include butadiene rubber, chloroprene rubber, block copolymer, multilayer structure and the like. These may be used alone or in combination.
- the block copolymer (G) or multilayer structure (E) made of (meth) acrylic resin is preferable because of its excellent transparency, impact resistance, and dispersibility.
- the elastic body component (R) contains a block copolymer (G).
- the block copolymer (G) has at least one of a methacrylic acid ester polymer block (g1) and an acrylic acid ester polymer block (g2).
- methacrylic acid ester examples include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, and amyl methacrylate.
- methacrylic acid alkyl esters such as methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, tert-butyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate, and the like are used for the transparency of base layer 10 and Heat resistance can be improved.
- methyl methacrylate is preferred.
- the methacrylic acid ester polymer block (g1) may contain a structural unit derived from a monomer other than the methacrylic acid ester.
- the ratio is preferably 20% by mass or less, more preferably 10% by mass or less, further preferably 5% by mass or less, and particularly preferably 2% by mass or less. By the ratio, the surface hardness and heat resistance of the base material layer 10 can be increased.
- Examples of monomers other than methacrylic acid esters include acrylic acid esters, unsaturated carboxylic acids, aromatic vinyl compounds, olefins, conjugated dienes, acrylonitrile, methacrylonitrile, acrylamide, methacrylamide, vinyl acetate, vinyl pyridine, vinyl ketone, Examples include vinyl chloride, vinylidene chloride, and vinylidene fluoride. These can be used alone or in combination of two or more.
- the range of the weight average molecular weight of the methacrylic acid ester polymer block (g1) is preferably 5,000 to 150,000, more preferably 8,000 to 120,000, and still more preferably 12,000 to 100,000.
- the elastic modulus of the base material layer 10 can be increased by setting the weight average molecular weight of the methacrylic acid ester polymer block (g1) to 5,000 or more. Therefore, wrinkles are less likely to occur when the base material layer 10 is stretch-molded at a high temperature. By setting the weight average molecular weight to 150,000 or less, the three-dimensional coating moldability of the laminate 20 can be improved. Moreover, it becomes difficult to fracture
- the block copolymer (G) may have a plurality of methacrylate polymer blocks (g1). At this time, the composition ratio and molecular weight of the structural units constituting the respective methacrylate polymer blocks (g1) may be the same or different from each other.
- the range of the total weight average molecular weight Mw (g1-total) of the methacrylic acid ester polymer block (g1) per molecule of the block copolymer (G) is preferably 12,000 to 150,000, more preferably 15, 000 to 120,000, more preferably 20,000 to 100,000.
- the weight average molecular weight of the methacrylic acid ester polymer block (g1) is Mw (g1-total ).
- the block copolymer (G) has a plurality of methacrylic ester polymer blocks (g1) in one molecule, the total weight average molecular weight of each methacrylic ester polymer block (g1) is Mw (g1-total ).
- a plurality of block copolymers (G) having different weight average molecular weights of the methacrylic acid ester polymer block (g1) may be mixed and used.
- the mixing ratio of each block copolymer (G) is multiplied by the weight average molecular weight of each methacrylic ester polymer block (g1), and these are added together to obtain Mw (g1-total). It is done.
- the range of Mw (F) / Mw (g1-total) is preferably 0.3 to 4.0, more preferably 1.0 to 3.5, and still more preferably 1.5 to 3.0.
- Mw (F) / Mw (g1-total) is preferably 0.3 to 4.0, more preferably 1.0 to 3.5, and still more preferably 1.5 to 3.0.
- the range of the ratio of the methacrylic ester polymer block (g1) in the block copolymer (G) is preferably 10 to 70% by mass, more preferably 25 to 60% by mass. With such a ratio, the transparency, flexibility, molding processability and surface smoothness of the base material layer 10 can be enhanced.
- the block copolymer (G) contains a plurality of types of methacrylate polymer blocks (g1), the proportion is calculated based on the total mass of all methacrylate polymer blocks (g1).
- acrylate ester examples include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec-butyl acrylate, tert-butyl acrylate, and amyl acrylate.
- the acrylic ester polymer block (g2) is preferably composed of an acrylic acid alkyl ester and a (meth) acrylic acid aromatic ester. With the acrylate polymer block (g2), the stretchability and transparency of the base material layer 10 shown in FIG. 1 can be enhanced.
- alkyl acrylate examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, and the like. Of these, n-butyl acrylate and 2-ethylhexyl acrylate are preferred.
- (Meth) acrylic acid aromatic ester means acrylic acid aromatic ester or methacrylic acid aromatic ester. Such (meth) acrylic acid aromatic ester is formed by ester-bonding a compound containing an aromatic ring to (meth) acrylic acid.
- the (meth) acrylic acid aromatic ester include phenyl acrylate, benzyl acrylate, phenoxyethyl acrylate, styryl acrylate, phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, styryl methacrylate, and the like. .
- the transparency of the base material layer 10 shown in FIG. 1 can be enhanced by phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, and benzyl acrylate.
- the acrylic ester polymer block (g2) preferably contains 50 to 90% by mass of structural units derived from alkyl acrylate and 10 to 50% by mass of structural units derived from (meth) acrylic aromatic ester.
- the acrylate polymer block (g2) more preferably contains 60 to 80% by mass of structural units derived from an alkyl acrylate ester and 20 to 40% by mass of structural units derived from a (meth) acrylic acid aromatic ester. .
- the acrylic ester polymer block (g2) can increase the transparency of the base material layer 10 shown in FIG.
- the range of the weight average molecular weight of the acrylate polymer block (g2) is preferably 5,000 to 120,000, more preferably 15,000 to 110,000, still more preferably 30,000 to 100,000. . With such a range, it is possible to improve the formability of the coating in three dimensions by the laminate 20 shown in FIG. 1 and the stretchability of the base material layer 10.
- the block copolymer (G) may have a plurality of types of acrylate polymer blocks (g2).
- the composition ratio and molecular weight of each structural unit constituting the acrylate polymer block (g2) may be the same or different from each other.
- the range of the total weight average molecular weight Mw (g2-total) of the acrylate polymer block (g2) in one molecule of the block copolymer (G) is preferably 30,000 to 140,000, more preferably It is 40,000 to 110,000, more preferably 50,000 to 100,000.
- Mw (g2-total) is 30,000 or more, the impact resistance of the base material layer 10 shown in FIG. 1 is improved.
- Mw (g2-total) is 140,000 or less, the smoothness of the surface 16 is improved.
- the block copolymer (G) may have only one acrylate polymer block (g2) in one molecule. In such a case, the weight average molecular weight of the acrylate polymer block (g2) is equal to Mw (g2-total). Moreover, the block copolymer (G) may have a plurality of acrylic acid ester polymer blocks (g2) in one molecule. In this case, the total weight average molecular weight of each acrylate polymer block (g2) is Mw (g2-total).
- a plurality of types of block copolymers (G) having different weight average molecular weights of the methacrylic acid ester polymer block (g2) may be used.
- the mixing ratio of each block copolymer (G) is multiplied by the weight average molecular weight of the methacrylic acid ester polymer block (g2) of each block, and these are added together to obtain Mw (g2 ⁇ total).
- the weight average molecular weight of the methacrylic acid ester polymer block (g1) and the weight average molecular weight of the acrylate polymer block (g2) are calculated based on the measurement in the process of producing the block copolymer (G). Value. These weight average molecular weights are calculated from the weight average molecular weights of the intermediate product measured by sampling during and after polymerization and the final product, that is, the block copolymer (G). Each weight average molecular weight is a standard polystyrene conversion value measured by GPC.
- the range of the ratio of the acrylate polymer block (g2) in the block copolymer (G) is preferably 30 to 90% by mass, more preferably 40 to 75% by mass. With such a range, the transparency, flexibility, molding processability and surface smoothness of the base material layer 10 can be improved.
- the block copolymer (G) contains a plurality of acrylate polymer blocks (g2), the proportion can be calculated based on the total mass of all the acrylate polymer blocks (g2).
- the bonding form of the methacrylic acid ester polymer block (g1) and the acrylate polymer block (g2) in the block copolymer (G) is not particularly limited.
- a structure in which a methacrylic acid ester polymer block (g1) and an acrylic acid ester polymer block (g2) are connected in series can be mentioned.
- the diblock copolymer, triblock copolymer, and star block copolymer can improve the surface smoothness and impact resistance of the base material layer 10.
- a diblock copolymer having a (g1)-(g2) structure a triblock copolymer having a (g1)-(g2)-(g1) structure, and a star shape having a [(g1)-(g2)-] nX structure
- a block copolymer, a star block copolymer having a structure of [(g1)-(g2)-(g1)-] nX is more preferable.
- a triblock copolymer having a (g1)-(g2)-(g1) structure is more preferable.
- the block copolymer (G) may have a polymer block (g3) other than the methacrylic acid ester polymer block (g1) and the acrylate polymer block (g2).
- the main structural unit constituting the other polymer block (g3) is a structural unit derived from a monomer other than methacrylic acid ester and acrylic acid ester.
- the block copolymer (G) may have a functional group such as a hydroxyl group, a carboxyl group, an acid anhydride, or an amino group in the molecular chain or at the molecular chain end.
- the range of the weight average molecular weight Mw (G) of the block copolymer (G) is preferably 60,000 to 400,000, more preferably 100,000 to 200,000.
- the weight average molecular weight of the block copolymer (G) is 60,000 or more, sufficient melt tension can be maintained in the melt extrusion molding of the base material layer 10.
- the base material layer 10 can be made into a favorable plate-shaped molded body.
- mechanical properties, such as breaking strength of the base material layer 10 obtained as a plate-shaped molded object can be improved.
- the weight average molecular weight to 400,000 or less, the viscosity of the molten resin can be lowered.
- the base material layer 10 can be obtained as a good plate-like molded body in the melt extrusion molding.
- Good plate-like molded products include those in which no fine grainy irregularities or irregularities due to unmelted high molecular weight products are generated on the surface.
- the range of the molecular weight distribution (weight average molecular weight / number average molecular weight) of the block copolymer (G) is preferably 1.0 to 2.0, more preferably 1.0 to 1.6.
- the content of unmelted material that causes the occurrence of flaws in the base material layer 10 can be reduced.
- the impact resistance of the base material layer can be increased.
- a weight average molecular weight and a number average molecular weight are molecular weights of standard polystyrene conversion measured by GPC.
- the manufacturing method of a block copolymer (G) is not specifically limited, It can manufacture by the method according to a well-known method. For example, you may use the method of living-polymerizing the monomer which comprises each polymer block.
- a method of living polymerization for example, there is a method of anionic polymerization in the presence of a mineral acid salt such as an alkali metal or alkaline earth metal salt using an organic alkali metal compound as a polymerization initiator.
- the elastic body component (R) forms a multilayer structure (E) having an outer layer (e1) and an inner layer (e2).
- the inner layer (e2) and the outer layer (e1) are arranged in this order from the center layer toward the outermost layer.
- the multilayer structure (E) may further have a crosslinkable resin layer (e3) inside the inner layer (e2) or outside the outer layer (e1).
- the inner layer (e2) is a layer composed of a crosslinked elastic body obtained by copolymerizing a monomer mixture having an acrylic acid alkyl ester and a crosslinking monomer.
- the inner layer (e2) contains 70 to 99.8% by mass of structural units derived from alkyl acrylate.
- the inner layer (e2) further contains 0.2 to 30% by mass of a structural unit derived from a crosslinkable monomer.
- Examples include polyalkenyl esters of polybasic acids such as diallyl, diallyl maleate, triallyl cyanurate, triallyl isocyanurate, unsaturated carboxylic acid esters of polyhydric alcohols such as trimethylolpropane triacrylate, and divinylbenzene. Of these, alkenyl esters of unsaturated carboxylic acids and polyalkenyl esters of polybasic acids are preferred.
- the range of the amount of the crosslinkable monomer in the total monomer mixture is preferably 0.2 to 30% by mass, and more preferably 0.2 to 10% by mass. With such a range, the impact resistance, heat resistance and surface hardness of the base material layer 10 shown in FIG. 1 can be improved.
- Another monofunctional monomer may be further mixed in the monomer mixture.
- Other monofunctional monomers are, for example, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, pentyl methacrylate, hexyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate Alkyl methacrylates such as dodecyl methacrylate, myristyl methacrylate, palmityl methacrylate, stearyl methacrylate, and behenyl methacrylate; methacrylic acid such as phenyl methacrylate and esters of phenols; methacrylic acid such as esters of methacrylic acid and aromatic alcohols such as benzyl methacrylate Esters; s
- the outer layer (e1) is composed of a hard thermoplastic resin.
- the hard thermoplastic resin contains a structural unit derived from methyl methacrylate in an amount of 80% by mass or more, preferably 90% by mass or more.
- the hard thermoplastic resin is produced by polymerizing a monomer mixture containing such methyl methacrylate.
- the rigid thermoplastic resin contains 20% by mass or less, preferably 10% by mass or less of other monofunctional monomers.
- Other monofunctional monomers include acrylic acid alkyl esters such as methyl acrylate, butyl acrylate and 2-ethylhexyl acrylate; acrylic acid; methacrylic acid and the like.
- Additives for polar resins Not only the (meth) acrylic resin (M) but also an additive may be added to the polar resin constituting the base material layer 10.
- Additives include, for example, antioxidants, light stabilizers, heat stabilizers, lubricants, processing aids, antistatic agents, antioxidants, colorants, impact resistance aids, fillers, infrared absorbers, ultraviolet absorbers, Foaming agents, fluorescent brighteners, dispersants, solvents and the like.
- the antioxidant alone has an effect of preventing oxidative deterioration of the resin in the presence of oxygen.
- the oxidizing agent include phosphorus antioxidants, hindered phenol antioxidants, thioether antioxidants, and the like. These antioxidants can be used alone or in combination of two or more. Of these, phosphorus antioxidants and hindered phenol antioxidants are preferred. These antioxidants are preferable in the base material layer 10 shown in FIG. 1 with little decrease in optical properties due to unintentional coloring. Furthermore, the combined use of a phosphorus-based antioxidant and a hindered phenol-based antioxidant is more preferable. In such a case, the mixing ratio is not particularly limited. The range of the mass ratio of phosphorus antioxidant / hindered phenol antioxidant is preferably 1/5 to 2/1, more preferably 1/2 to 1/1.
- the light stabilizer mainly has a function of capturing radicals generated by oxidation by light.
- examples of the light stabilizer include hindered amines such as a compound having a 2,2,6,6-tetraalkylpiperidine skeleton.
- the intrinsic viscosity of the processing aid is preferably in the range of 3 to 6 dl / g.
- the intrinsic viscosity is 3 dl / g or more, the effect of improving the moldability of the polar resin is high.
- the intrinsic viscosity is 6 dl / g or less, the melt fluidity of the polar resin is suitably maintained.
- the polar resin can be used as a mixture with other polymers.
- other polymers include polyolefin resins such as polyethylene, polypropylene (PP), polybutene-1, poly-4-methylpentene-1, polynorbornene, etc .; ethylene ionomers; polystyrene, styrene-maleic anhydride copolymers , High impact polystyrene, acrylonitrile-styrene (AS) resin, acrylonitrile-butadiene-styrene (ABS) resin, acrylonitrile-ethylene-styrene (AES) resin, acrylonitrile-acrylic ester-styrene (AAS) resin, acrylonitrile-chlorinated polyethylene -Styrene resins such as styrene (ACS) resin, methyl methacrylate-butadiene-styrene (MBS) resin, acrylonitrile-chlorin
- the method for preparing the master batch of the polar resin constituting the base material layer is not particularly limited.
- the dispersibility of each component which comprises polar resin can be improved by taking the method of melt-kneading and mixing.
- a known mixing or kneading apparatus can be used.
- twin screw extruder By using a twin screw extruder, kneadability and compatibility can be improved. What is necessary is just to adjust the temperature at the time of mixing and kneading
- the polar resin may be obtained in any form such as pellets or powder.
- a polar resin in the form of pellets or powder is suitable for use as a molding material.
- the base material layer is manufactured by the T-die method
- an extruder type melt extrusion apparatus having a single screw or a twin screw extrusion screw can be used.
- the molding temperature for producing the base material layer is preferably in the range of 200 to 300 ° C., more preferably in the range of 220 to 270 ° C. from the viewpoint of molding processability and quality.
- a melt-extrusion apparatus it is preferable from a viewpoint of coloring suppression to use a vent and to melt-extrude under reduced pressure or nitrogen atmosphere.
- the surface temperature of at least one of the mirror roll or mirror belt sandwiching the polar resin is 60 ° C. or higher, and both surfaces The temperature is preferably 130 ° C. or lower.
- the surface temperature of both the mirror roll or the mirror belt sandwiching the polar resin is less than 60 ° C., the surface smoothness and haze of the base material layer tend to decrease, and when at least one surface temperature exceeds 130 ° C., it is obtained.
- the surface smoothness of the base material layer tends to decrease or the haze tends to increase.
- the base material layer may be colored.
- the coloring method is not particularly limited, and examples thereof include a method of adding a colorant to the polar resin, and a method of immersing the base material layer in a liquid in which the colorant is dispersed.
- the roughness of the base material layer is preferably 1.5 nm or less, more preferably in the range of 0.1 to 1.0 nm.
- the laminate of the present invention is excellent in surface smoothness, surface gloss, and sharpness of printing.
- optical characteristics such as light transmittance and in shaping accuracy when performing surface shaping.
- the haze of the base material layer is preferably 0.3% or less, more preferably 0.2% or less.
- the base material layer may be subjected to stretching treatment.
- the stretching treatment it is possible to obtain a base material layer that has high mechanical strength and is difficult to crack.
- the stretching method is not particularly limited, and examples thereof include a simultaneous biaxial stretching method, a sequential biaxial stretching method, a tuber stretching method, and a rolling method.
- the temperature at the time of stretching is preferably (Tg + 10) to (Tg + 40) with respect to the glass transition temperature of the polar resin (hereinafter referred to as “Tg”) from the viewpoint that a base layer having high strength that can be uniformly stretched can be obtained. ° C.
- Laminate 20 In order to form the film structure 17 shown in FIG. 1, the laminate 20 is laminated while the adhesive layer 11 is brought into close contact with the base material layer 10 when the laminate 20 is manufactured.
- a solution containing a thermoplastic elastomer that becomes the adhesive layer 11 may be applied to the base material layer 10.
- a film that becomes the adhesive layer 11 may be laminated on the base material layer 10.
- Such a film is preferably made of an adhesive.
- Such a film is obtained in the same manner as the base material layer 10.
- Such an adhesive may be a melted film adhesive.
- the base material layer 10 may be formed by laminating a film made of a resin on the adhesive layer 11. Such a film may be a melted film-like substrate layer material.
- each block copolymer (A) molecule is blocked while the bond between the aromatic vinyl compound polymer block (S) and the conjugated diene compound polymer block (D) is maintained. Between the copolymer (A) molecules, the aromatic vinyl compound polymer blocks (S) and the conjugated diene compound polymer block (D) are aggregated to form a phase comprising the aromatic vinyl compound polymer block (S). At least partially phase-separates with the phase composed of the conjugated diene compound polymer block (D).
- membrane structure formation conditions combination of material selection and heat
- the affinity (adhesiveness, wettability) between them can be increased.
- the base material layer 10 is made of a polar resin
- ⁇ between the aromatic vinyl compound polymer block (S) and the polar resin is smaller than ⁇ between the conjugated diene compound polymer block (D) and the polar resin
- the aromatic phase 14 can form a membrane structure 17 in the vicinity of the interface 12.
- the layer corresponding to the base material layer 10 is made of a nonpolar resin
- ⁇ between the aromatic vinyl compound polymer block (S) and the nonpolar resin is equal to the conjugated diene compound polymer block (D) and the nonpolar resin. It is larger than ⁇ with the resin, and the film structure 17 is not formed.
- the substrate layer 10 according to the present invention may be formed of a material having polarity, and may be formed of, for example, a metal, a metal oxide, or ceramics.
- the viscoelasticity of either the block copolymer (A) or the thermoplastic elastomer containing the block copolymer (A) is considered.
- the loss tangent (tan ⁇ ) of either the block copolymer (A) or the thermoplastic elastomer is obtained by measuring the viscoelasticity.
- the loss tangent (tan ⁇ ) is obtained as a function of temperature.
- attention is focused on the peak value (tan ⁇ max ) of the loss tangent (tan ⁇ ) on the highest temperature side. Further, attention is paid to the rising start temperature of the peak value.
- the above heating temperature is preferably higher than the rise start temperature.
- the heating temperature is preferably 80 ° C. or higher, more preferably 100 ° C. or higher, still more preferably 120 ° C. or higher.
- the heating temperature may be 160 ° C. or higher.
- the heating temperature is preferably 130 ° C or higher, more preferably 150 ° C or higher, still more preferably 160 ° C or higher, and still more. Preferably it is 180 degreeC or more.
- the heating temperature may be 200 ° C. or higher.
- the heating time is preferably 1 minute or longer, more preferably 2 minutes or longer, still more preferably 3 minutes or longer.
- the adhesiveness between the base material layer 10 and the adhesive layer 11 shown in FIG. 1 can be measured by, for example, peel strength, shear adhesive strength, tensile adhesive strength, bending adhesive strength, and the like.
- the strength of the adhesiveness is also affected by the material strength (cohesive force) of the adhesive layer 11 described below.
- high affinity between the base material layer 10 and the adhesive layer 11 obtained by forming the film structure 17 is necessary.
- the peel strength is preferably more than 5 N / 25 mm, more preferably more than 15 N / 25 mm, and still more preferably more than 30 N / 25 mm.
- the peel strength is a value measured according to JIS K 6854-2. The actual measurement method will be described later in Examples.
- the peel strength is affected by the material strength (cohesive force) of the adhesive layer 11 in addition to the above-mentioned affinity.
- the material strength can be measured by a known method, and can be suitably evaluated by, for example, a tensile test described in JIS K7113, 7161, 7162, 7127.
- the tensile stress during the tensile test is preferably 20 MPa or less when the tensile strain when deformed in the uniaxial direction is 1000% or less, because the adhesive layer is sufficiently soft and the peel test can be accurately measured. The following is more preferable because it shows high peel strength.
- the tensile stress is preferably 0.1 MPa or more when the tensile strain when deformed in the uniaxial direction is 0.1 MPa or less because the adhesive layer is sufficiently hard and the peel test can be accurately measured, It is more preferable that the pressure is 1 MPa or more because high peel strength is exhibited.
- the laminated body 20 shown in FIG. 1 forms a film structure 17 at the interface 12.
- the film structure 17 is considered to increase the affinity between the adhesive layer 11 and the base material layer 10 at the interface 12, and when the laminate 20 is bonded to the adherend, the base material layer and the adherend are bonded to each other. A high adhesive force can be secured in between. For this reason, the base material layer 10 is hardly peeled off from the adherend.
- the adhesive layer 11 containing the block copolymer (A) is excellent in adhesiveness not only for polar resins but also for nonpolar resins. For this reason, for example, when the adherend surface of the adherend is made of a polypropylene resin, the peel strength of the base material layer 10 is 20 N / 25 mm or more. For this reason, it is preferable to affix the peelable protective film to the adhesive surface 13 until it is bonded to the adherend.
- the peel strength is more preferably 30 N / 25 mm or more, and still more preferably 60 N / 25 mm or more.
- the peel strength is a value measured according to JIS K 6854-2.
- the breaking elongation of the laminate 20 shown in FIG. 1 is preferably 160% or more, more preferably 200% or more, and further preferably 250% or more.
- the elongation at break is a value when measured at a temperature 5 ° C. lower than the glass transition temperature (Tg) of the polar resin forming the base material layer. Since the breaking elongation is 160% or more, the laminate 20 has high formability during three-dimensional coating, and is less likely to break or wrinkle during three-dimensional coating.
- the thickness range of the laminate 20 is preferably 20 to 1,000 ⁇ m, more preferably 50 to 500 ⁇ m, and still more preferably 100 to 250 ⁇ m.
- the thickness is 20 ⁇ m or more, the laminate 20 can be easily manufactured, has excellent impact resistance, and does not warp when heated. Further, when the laminate 20 is colored, the color of the adherend and the surface irregularities can be concealed.
- the thickness of the laminated body 20 is 1,000 ⁇ m or less, it becomes easy to form and shape so as to follow the surface of the adherend having a three-dimensional shape.
- the range of the ratio of the thickness of the base material layer 10 to the thickness of the adhesive layer 11 shown in FIG. 1 is preferably 0.2 to 5, more preferably 0.5 to 4, and still more preferably 0.8. ⁇ 3.
- the surface hardness of the surface 16 can be increased.
- the drawability of the laminated body 20 can be improved by making the value of the ratio into 4 or less.
- the drawability of the laminated body 20 can be further improved by setting the value of the ratio to 3 or less.
- the surface 16 is preferably HB or higher in pencil hardness, and more preferably H or higher. Abrasion resistance can be imparted to the adherend due to the pencil hardness higher than HB. Further, the laminate 20 may impart weather resistance to the adherend.
- thermoplastic resin examples include polycarbonate resin, polyester resin, polyamide resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, (meth) acrylic resin, and ABS resin.
- thermosetting resin examples include an epoxy resin, a phenol resin, and a melamine resin.
- non-wood fiber substrate examples include a kenaf substrate.
- the material of the adherend is preferably a thermoplastic resin, particularly preferably a polypropylene resin.
- the adhesive surface 13 shown in FIG. 1 is brought into close contact with the adherend surface of the adherend.
- the coated article whose surface is composed of the laminate 20 is excellent in surface smoothness, surface hardness, surface gloss, and the like.
- the production method of the coated article is not particularly limited, and examples thereof include an insert molding method, a vacuum molding method, a pressure forming method, a compression molding method, and a three-dimensional surface decoration method (Threee Dimension Overlay Method: TOM molding).
- TOM molding Three-dimensional surface decoration method
- the laminate 20 can be accurately shaped and adhered to various adherends.
- TOM molding is more preferable because it does not require preliminary molding.
- the laminated body 20 and the adherend are accommodated in a chamber box, the inside of the chamber box is depressurized; The pressure in the space on the side without the adherend in the chamber box is made higher than the pressure in the space on the side with the adherend; Then, the laminate 20 is covered with the laminate 20 by pressure-bonding the laminate 20 to the adherend.
- the stacked body 20 and the adherend are housed in the chamber box, the stacked body 20 may bisect the space in the chamber box.
- the pressure range in the chamber box is preferably 0.1 to 20 kPa, more preferably 0.1 to 10 kPa.
- the pressure is 20 kPa or less, the laminate 20 can be accurately shaped when the adherend is coated with the laminate 20.
- the pressure is 0.1 kPa or more, the time required for shaping and coating can be reduced. For this reason, productivity can be improved.
- the temperature range of the laminate 20 when heated is preferably 110 to 160 ° C, more preferably 110 to 140 ° C.
- the temperature range of the laminate 20 when heated is preferably 110 to 160 ° C, more preferably 110 to 140 ° C.
- the laminated body 20 is sufficiently softened. For this reason, it can form with respect to the laminated body 20 favorably.
- the adhesive force between the laminate 20 and the adherend is increased.
- the temperature of the laminated body 20 to 160 ° C. or less, excessive softening and alteration of the laminated body 20 can be prevented. For this reason, the quality of a molded object can be improved.
- the pressure range in the space on the side not having the adherend is preferably 50 to 500 kPa, more preferably 100 to 400 kPa.
- the pressure range in the space on the side not having the adherend is preferably 50 to 500 kPa, more preferably 100 to 400 kPa.
- a method of providing a pressure difference in the chamber box for example, there is a method of opening the space on the side having no adherend and returning it to atmospheric pressure. Moreover, the method of supplying compressed air in the space of the side which does not have a to-be-adhered body is mentioned. By supplying compressed air, the laminate 20 can be brought into close contact with the adherend. For this reason, the surface shape of the adherend can be transferred to the laminate 20 more accurately.
- the laminate 20 shown in FIG. 1 has good three-dimensional coating moldability, surface hardness, stretchability, molding processability, adhesiveness, and concealability as a decorative material. For this reason, the laminated body 20 can be used suitably with respect to the articles
- Such articles or structures include, for example, billboard parts such as advertising towers, stand signboards, sleeve signboards, bamboard signs, and rooftop signs; display parts such as showcases, partition plates, and store displays; fluorescent lamp covers, mood lighting covers, and lamps Lighting parts such as shades, light ceilings, light walls, and chandeliers; interior parts such as furniture, pendants, mirrors; doors, domes, safety window glass, partitions, staircases, balconies, balconies, and roofs for leisure buildings Parts for transportation equipment such as automobile exterior parts such as parts, automobile interior and exterior parts, bumpers, etc .; electronic equipment parts such as nameplates for audio visuals, stereo covers, vending machines, mobile phones, personal computers; incubators, rulers, dials, Greenhouse, large aquarium, box aquarium, bathroom parts, clock panel, bathtub, sanitary, desk mat, game parts, toys, musical instruments, wallpaper; Over King film, there is a variety of consumer electronics products.
- billboard parts such as advertising towers, stand signboards, sleeve signboards
- a pattern or color such as a grain, a pattern, a character, a figure, or the like may be printed on at least one of the base material layer 10 and the adhesive layer 11 shown in FIG.
- a glossy surface such as metallic tone and piano black tone may be attached to these.
- the pattern may be chromatic or achromatic.
- Examples of the printing method include known printing methods such as gravure printing, offset printing, screen printing, transfer printing, and ink jet printing.
- a resin such as a polyvinyl resin, a polyester resin, an acrylic resin, a polyvinyl acetal resin, or a cellulose resin may be used as a binder.
- a pigment or dye may be used as a colorant. You may use the resin composition containing these.
- a metal or a metal oxide may be formed on the surface 16 shown in FIG.
- the film forming method include vacuum film forming methods such as vapor deposition and sputtering, electrolytic plating, and electroless plating.
- the metal or metal oxide is not particularly limited as long as it is suitable for the film forming method. Examples thereof include gold, silver, copper, aluminum, zinc, nickel, chromium, indium, and oxides thereof. These metals or metal oxides may be used alone or as a mixture of two or more.
- the present invention is not limited to the following examples.
- the physical properties of the laminates of Examples and Comparative Examples were evaluated by the following methods.
- the adhesive layer 11 was peeled from the base material layer 10 with the interface 12 shown in FIG.
- the surface where the interface 12 was formed in contact with the base material layer 10 was analyzed by TOF-SIMS by the same method as described above. Based on the analysis result, the ratio R j of the signal intensity of C 7 H 7 + ion to the signal intensity of C 2 H 5 + ion was determined.
- the ratio of R j for R c, was calculated R j / R c.
- the film structure 17 and the region 19 shown in FIG. 1 were observed by staining the aromatic vinyl compound polymer block (S) in a section having a cross section of the laminate 20 as follows.
- the section was prepared by cutting the laminate 20 at ⁇ 100 ° C. with a cryoultra microtome (Leica; ULTRACUT S / FC-S). At this time, cutting was performed in parallel to the surface to be the cross section of the laminate 20 and perpendicular to the interface 12. A section having a thickness of less than 100 nm was obtained by cutting. This section was fixed on a copper mesh base and imaged.
- the imaging conditions are as follows.
- the evaluation criteria based on the observation image are as follows. A: A film structure 17 formed by the aromatic phase 14 shown in FIG. 1 was observed in the adhesive layer. B: It was difficult to observe the film structure 17 formed by the aromatic phase 14 shown in FIG. 1 in the adhesive layer. C: The film structure 17 formed by the aromatic phase 14 shown in FIG. 1 was not observed in the adhesive layer.
- the laminate 20 shown in FIG. 1 was laminated on the adherend by the method described later.
- the laminate 20 exposed on the surface of the coated article was heated to 130 ° C.
- the surface 16 was fixed to a stainless steel (SUS) plate. Fixing was performed by sticking a strong adhesive tape (manufactured by Nitto Denko Corporation; trade name Hyper Joint H9004) to the surface 16 and the stainless steel material.
- the measurement was performed according to JIS K 6854-2 using a desktop precision universal testing machine (manufactured by Shimadzu Corporation; AGS-X).
- the peeling angle was 180 °
- the tensile speed was 300 mm / min
- the environmental temperature was 23 ° C.
- the peel strength between the base material layer 10 and the adherend was measured. Based on the peel strength, the adhesive strength between the base material layer 10 and the adherend was evaluated according to the following criteria.
- Peel strength is more than 25 N / 25 mm
- the material for producing the laminates of Examples and Comparative Examples was produced by the following method.
- Methacrylic resin (F) To the monomer mixture consisting of 95 parts by mass of methyl methacrylate and 5 parts by mass of methyl acrylate, 0.1 parts by mass of the polymerization initiator and 0.28 parts by mass of the chain transfer agent are added and dissolved to dissolve the raw material liquid. Obtained.
- the polymerization initiator was 2,2′-azobis (2-methylpropionitrile) (hydrogen abstraction ability: 1%, half hour temperature at 1 hour: 83 ° C.).
- the chain transfer agent was n-octyl mercaptan.
- the obtained dispersion was washed with an appropriate amount of ion-exchanged water.
- the bead-shaped copolymer was taken out by a bucket type centrifuge.
- the taken-out copolymer was dried with a hot air dryer at 80 ° C. for 12 hours.
- a bead-like methacrylic resin (F) having a weight average molecular weight Mw of 30,000 and a glass transition temperature (Tg) of 128 ° C. was obtained.
- Block copolymer (G) To the reactor, 39.4 kg of a toluene solution, 1.17 mol of sec-butyllithium, and 35.0 kg of methyl methacrylate were added in this order at room temperature. The inside of the reactor was deaerated and then purged with nitrogen. As the toluene solution, a part of a mixture consisting of 735 kg of dry toluene, 0.4 kg of hexamethyltriethylenetetramine and 20 mol of isobutylbis (2,6-di-tert-butyl-4-methylphenoxy) aluminum was used. These compounds were allowed to react for 1 hour at room temperature in a reactor.
- the weight average molecular weight of the polymer contained in the reaction solution was measured.
- the measured value was 40,000. This value corresponds to the weight average molecular weight Mw of the first methacrylate ester polymer block (g1) made of methyl methacrylate.
- reaction solution was cooled to ⁇ 25 ° C.
- a mixed solution of 24.5 kg of n-butyl acrylate and 10.5 kg of benzyl acrylate was dropped into the reaction solution over 0.5 hours.
- the weight average molecular weight of the polymer contained in the reaction solution was 80,000. Therefore, an acrylate polymer block (a copolymer of n-butyl acrylate and benzyl acrylate) ( The weight average molecular weight Mw of g2) was determined to be 40,000.
- the weight average molecular weight Mw of the obtained block copolymer (G) was 120,000.
- the weight average molecular weight Mw of the second methacrylate polymer block (g1) was determined to be 40,000.
- the weight average molecular weight Mw of the first and second methyl methacrylate polymer blocks is both 40,000, the weight average molecular weight Mw (total) of the overall methyl methacrylate polymer block was 80,000. .
- Multilayer structure A reactor equipped with a stirrer, thermometer, nitrogen gas introduction tube, monomer introduction tube and reflux condenser was used. The reactor was charged with 1,050 parts by mass of ion exchange water, 0.5 parts by mass of sodium dioctylsulfosuccinate and 0.7 parts by mass of sodium carbonate. After sufficiently replacing the inside of the reactor with nitrogen gas, the internal temperature of the reactor was set to 80 ° C. To the aqueous solution in the reactor, 0.25 part by mass of potassium persulfate was added and stirred for 5 minutes.
- a monomer mixture consisting of methyl methacrylate: methyl acrylate: allyl methacrylate 94: 5.8: 0.2 (mass ratio) was prepared in advance. 245 parts by mass of the monomer mixture was continuously added dropwise to the aqueous solution in the reactor over 50 minutes. After completion of the dropping, a polymerization reaction was further performed for 30 minutes.
- block copolymers (A-1) to (A-4) were synthesized as synthesis examples of the block copolymer (A).
- Block copolymer (A-1) The pressure vessel was dried by replacing the pressure vessel with nitrogen in advance.
- 50.0 kg of cyclohexane as a solvent 94.1 g (sec-butyllithium 9.9 g equivalent) of a 10.5 mass% cyclohexane solution of sec-butyllithium as an anionic polymerization initiator, and 300 g of tetrahydrofuran as a Lewis base were added.
- the solution was heated to 50 ° C. After adding 1.25 kg of styrene (1) to the solution, a polymerization reaction was performed for 1 hour.
- the reaction solution was allowed to cool and released. Thereafter, the reaction solution was vacuum-dried to obtain a block copolymer (A-2) which is a mixture of the block copolymers (A-2a) and (A-2b).
- the composition ratio (A-2a) / (A-2b) of the block copolymers (A-2a) and (A-2b) in the block copolymer (A-2) confirmed by GPC measurement was 30/70. It was.
- the aromatic vinyl compound polymer block (S) / conjugated diene compound polymer block (D) represents the composition ratio (mass) of these polymer blocks.
- the peak top molecular weight (Mp) of the styrene block, block copolymer and hydrogenated block copolymer is the molecular weight at the peak of signal change of the abundance of molecules that change according to the molecular weight, obtained by GPC measurement. .
- the molecular weight distribution is the ratio of weight average molecular weight and number average molecular weight (weight average molecular weight / number average molecular weight) of the block copolymers (A-1) to (A-3).
- Adhesion imparting component (B) A polar group-containing polypropylene resin was synthesized as an adhesion-imparting component (B). The synthesis was in accordance with the description in paragraph 0075 of Japanese Patent No. 5809150. 42 g of a polypropylene resin (manufactured by Prime Polymer; trade name Prime Polypro F327), 160 mg of maleic anhydride, and 42 mg of 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane were melt-kneaded. The melt kneading was performed using a batch mixer at a temperature of 180 ° C. and a screw rotation speed of 40 rpm.
- ⁇ Manufacture example 1 Manufacture of the pellet of methacrylic resin (F) While melt-kneading 100 mass parts of bead-like methacrylic resin (F) obtained by the synthesis example 1 at 230 degreeC using a twin screw extruder, Extruded into a strand. By cutting the extruded resin, pellets of methacrylic resin (F) were obtained.
- the resin was hot-pressed with a force of 35 kgf for 20 seconds, and the stainless steel plate and the mold were immediately set in a 23 ° C. cooling press. While the resin was cooled with a cooling press, pressure was applied to the resin. A laminate was obtained as described above.
- the resin to be the base layer and the resin to be the adhesive layer were coextruded with a T-die.
- a resin pellet to be an adhesive layer obtained by a production example and a resin pellet to be a base material layer obtained by a synthesis example were mixed into a 25 mm ⁇ vent type single screw extruder (manufactured by GM ENGINEERJNG; VGM25- 28EX) were put into separate hoppers.
- a multi-manifold die was used as the T die.
- the above two resins were coextruded from a multi-manifold die at an extrusion temperature of 240 ° C.
- the extruded resin was sandwiched between a silicon rubber roll having a surface temperature of 40 ° C. and a metal rigid roll having a surface temperature of 90 ° C., and the sandwiched resin was pulled out at 1 m / min. As a result, a laminate having a width of 30 cm and a thickness of 250 ⁇ m was obtained.
- the thicknesses of the base material layer and the adhesive layer were controlled by the extrusion flow rate of the resin, and the thickness of the adhesive layer was 100 ⁇ m and the thickness of the base material layer was 150 ⁇ m.
- Example 1A The methacrylic resin (F) described in Production Example 1 and the block copolymer (A-1) described in Synthesis Example 4 to be an adhesive layer were hot-pressed at 200 ° C. by the above-described hot pressing method. A laminate was produced. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 2A shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 1B A 30% by mass solution was obtained by dissolving the block copolymer (A-1) described in Synthesis Example 4 serving as an adhesive layer in toluene. This solution was applied on a sheet made of the methacrylic resin (F) described in Production Example 1 at 25 ° C., and then the sheet was dried at 25 ° C. to prepare a laminate. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 2B shows cross sections (two locations) of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 2 Example 1A was used except that the block copolymer (A-1) described in Synthesis Example 4 serving as an adhesive layer was changed to the block copolymer (A-2) described in Synthesis Example 5.
- a laminate was produced in the same manner as described above. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 3A shows a cross section of the laminate of Example 2 taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- the aromatic phase 14 made of the styrene polymer block of the block copolymer (A-2) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 3A Example 1A was used except that the block copolymer (A-1) described in Synthesis Example 4 to be an adhesive layer was changed to the block copolymer (A-3) described in Synthesis Example 6.
- a laminate was produced in the same manner as described above. However, the temperature of the hot press was 220 ° C. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 3B shows a cross section of the laminate of Example 3A taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- the aromatic phase 14 made of the styrene polymer block of the block copolymer (A-3) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 3B a laminate was manufactured in the same manner as in Example 3A, except that the temperature of hot pressing was 200 ° C. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 3C shows a cross section of the laminate of Example 3B taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- F methacrylic resin
- Example 4 80 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4 and 20 parts by mass of the adhesion-imparting component (B) obtained in Synthesis Example 7 were melt-kneaded at 230 ° C. using a twin screw extruder. After that, it was extruded and cut into strands to obtain resin pellets that became an adhesive layer.
- Example 4 a laminate was produced in the same manner as in Example 1A, except that the block copolymer (A-1) described in Synthesis Example 4 serving as an adhesive layer was changed to such pellets. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 4 shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a methacrylic resin (F) is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a film structure 17 and a circular cross-sectional structure 18.
- a lump 22 of the adhesion-imparting component (B) is present in a part of the adhesive layer.
- Example 5 the laminated body was produced like Example 4 except having changed the temperature at the time of lamination
- Table 2 shows the evaluation results of the obtained laminate.
- Example 6 the laminated body was produced like Example 4 except having changed the temperature at the time of lamination
- Table 2 shows the evaluation results of the obtained laminate.
- Example 7 80 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4 and 20 parts by mass of the adhesion-imparting component (B) obtained in Synthesis Example 7 were melt-kneaded at 230 ° C. using a twin screw extruder. Then, it was extruded and cut into strands.
- the resin pellet used as the adhesive layer was obtained by the above.
- a laminate was obtained by molding such pellets and the (meth) acrylic resin (M-1) described in Production Example 2 by the above-described coextrusion. Further, this laminate was bonded to the adherend while being hot stretched at 130 ° C. by the above-described TOM molding.
- Example 8 A laminate was obtained in the same manner as in Example 7, except that the methacrylic resin (F) was changed to the (meth) acrylic resin (M-2) described in Production Example 3 in Example 8. Table 2 shows the evaluation results of the obtained laminate. Further, this laminate was bonded to the adherend while being hot stretched at 130 ° C. by the above-described TOM molding.
- Example 9A 70 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4 and 30 parts by mass of the adhesion-imparting component (B) obtained in Synthesis Example 7 were melt-kneaded at 230 ° C. using a twin-screw extruder. After that, it was extruded and cut into strands to obtain resin pellets that became an adhesive layer. The pellet and the (meth) acrylic resin (M-1) described in Production Example 2 were hot-pressed at 200 ° C. by the above-described hot-pressing method to produce a laminate. Table 2 shows the evaluation results of the obtained laminate.
- Example 9B 50 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4 and 50 parts by mass of the adhesion-imparting component (B) obtained in Synthesis Example 7 were melt-kneaded at 230 ° C. using a twin screw extruder. After that, it was extruded and cut into strands to obtain resin pellets that became an adhesive layer. The pellet and the (meth) acrylic resin (M-1) described in Production Example 2 were hot-pressed at 200 ° C. by the above-described hot-pressing method to produce a laminate. Table 2 shows the evaluation results of the obtained laminate.
- Example 10 70 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4, 5 parts by mass of a compatibilizer (manufactured by NOF Corporation; trade name Modiper MS10B, [other thermoplastic polymer]), (meth) acrylic Resin (made by Kuraray; trade name Parapet HRS, [other thermoplastic polymer]) 2.5 parts by mass and polypropylene resin (made by Prime Polymer; trade name Prime Polypro J229E, [other thermoplastic polymer] ] 22.5 parts by mass was melt kneaded at 230 ° C. using a twin-screw extruder, and then extruded and cut into strands to obtain resin pellets that became an adhesive layer.
- the pellet and the (meth) acrylic resin (M-1) described in Production Example 2 were hot-pressed at 200 ° C. by the above-described hot-pressing method to produce a laminate. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 7 shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of (meth) acrylic resin (M-1) is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 11 72.5 parts by mass of the block copolymer (A-1) obtained in Synthesis Example 4, (meth) acrylic resin (manufactured by Kuraray; trade name Parapet HRS, [other thermoplastic polymer]) 7.5 mass And 20 parts by mass of polypropylene resin (made by Nippon Polypro Co., Ltd .; trade name Wintech WFX4TA, [other thermoplastic polymer]) at 230 ° C. using a twin screw extruder, To obtain resin pellets to be an adhesive layer. The pellet and the (meth) acrylic resin (M-2) described in Production Example 3 were hot-pressed at 200 ° C. by the above-described hot-pressing method to produce a laminate. Table 2 shows the evaluation results of the obtained laminate.
- FIG. 8 shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of (meth) acrylic resin (M-2) is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a film structure 17 and a circular cross-sectional structure 18.
- Example 12 The block copolymer (A-1) obtained in Synthesis Example 4 and acrylonitrile-butadiene-styrene resin (manufactured by Asahi Kasei Co., Ltd .; trade name Stylac 220S27) were hot-pressed at 200 ° C. by the above-mentioned hot press method. A laminate was produced. Table 2 shows the evaluation results of the obtained laminate.
- Example 14 The block copolymer (A-3) obtained in Synthesis Example 6 and a polyethylene terephthalate resin (manufactured by Kuraray Co., Ltd .; trade name Kurapet KS710B-8S) were hot-pressed at 200 ° C. by the above-described hot-pressing method, and laminated. The body was made. Table 2 shows the evaluation results of the obtained laminate.
- Comparative Example 1 a laminate was produced in the same manner as in Example 4 except that the temperature at the time of laminating the adhesive layer material and the base material layer material was changed from 200 ° C to 140 ° C. Table 2 shows the evaluation results of the obtained laminate. In addition, when trying to observe the cross section of such a laminate using a TEM, the peel strength between the adhesive layer and the base material layer was small, and the adhesive layer and the base material layer were peeled off during the section preparation. The section could not be prepared and observed.
- FIG. 9 shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a cycloolefin polymer resin is observed.
- the aromatic phase composed of the styrene polymer block of the block copolymer (A-1) formed a circular cross-sectional structure 18, but no film structure was observed. From the comparison with Example 1, it is thought that this is because the base material layer is made of a nonpolar resin. Therefore, it was found that an appropriate combination of the composition of the adhesive layer and the composition of the base material layer is important for forming the film structure.
- FIG. 10 shows a cross section of the laminate taken with a TEM (transmission electron microscope).
- a base material layer 10 made of a polypropylene resin is observed.
- the aromatic phase 14 composed of the styrene polymer block of the block copolymer (A-1) forms a circular cross-sectional structure 18.
- the membrane structure 17 of the aromatic phase was not seen. From the comparison with Example 4, it is thought that this is because the base material layer is made of a nonpolar resin. Therefore, it was found that an appropriate combination of the composition of the adhesive layer and the composition of the base material layer is important for forming the film structure.
- the adhesive layer which the laminated body of this invention has has high adhesiveness with respect to not only polar resin but nonpolar resin.
- the row of “base material layer” represents the resin used for the base material layer.
- F is the methacrylic resin (F) of Production Example 1.
- M-1 is the (meth) acrylic resin (M-1) of Production Example 2.
- M-2 is the (meth) acrylic resin (M-2) of Production Example 3.
- ABS is acrylonitrile-butadiene-styrene (ABS) resin.
- PET is polyethylene terephthalate (PET) resin.
- COP is a cycloolefin polymer (COP) resin.
- PP is a polypropylene (PP) resin.
- A-1” to “A-3” are the block copolymers (A-1) to (A-3) obtained in Synthesis Examples 4 to 6.
- B is the adhesion-imparting component (B) used for the adhesive layer.
- MS10B is a Moda MS10B manufactured by NOF Corporation used for the adhesive layer.
- HRS is a parapet HRS manufactured by Kuraray Co., Ltd. used for the adhesive layer.
- J229E is Prime Polypro J229E manufactured by Prime Polymer Co., Ltd. used for the adhesive layer.
- WFX4TA is Wintech WFX4TA manufactured by Nippon Polypro Co., Ltd. used for the adhesive layer.
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- Graft Or Block Polymers (AREA)
Abstract
Description
前記基材層が(メタ)アクリル系樹脂(M)、アクリロニトリル-ブタジエン-スチレン系樹脂又はポリエステル系樹脂からなり、
前記粘接着層は、芳香族ビニル化合物重合体ブロック(S)及び共役ジエン化合物重合体ブロック(D)を含有するブロック共重合体(A)を含有し、
前記基材層と前記粘接着層の界面に沿って、前記芳香族ビニル化合物重合体ブロック(S)が膜構造の相を形成している、積層体。
[2] 前記芳香族ビニル化合物重合体ブロック(S)がさらに円断面構造の相を形成し、
前記粘接着層が、前記膜構造の相に沿って前記円断面構造の相の乏しい領域を有する、
[1]の積層体。
[3] 前記粘接着層が前記ブロック共重合体(A)を50質量%超含有する、[1]又は[2]の積層体。
[4] 前記ブロック共重合体(A)における共役ジエン化合物重合体ブロック(D)のビニル化度が40モル%以上である、[1]~[3]のいずれかの積層体。
[5] 前記ブロック共重合体(A)が前記芳香族ビニル化合物重合体ブロック(S)5~40質量%及び前記共役ジエン化合物重合体ブロック(D)60~95質量%を含有する、[1]~[4]のいずれかの積層体。
[6] 前記粘接着層がさらに接着付与成分(B)を含有する、[1]~[5]のいずれかの積層体。
[7] 前記粘接着層における粘着付与剤(aD)の含有量がブロック共重合体(A)100質量部に対して1質量部未満である、[1]~[6]のいずれかの積層体。
[8] 前記共役ジエン化合物重合体ブロック(D)が極性基を有しない、[1]~[7]のいずれかの積層体。
[9] 前記共役ジエン化合物重合体ブロック(D)が、イソプレン及びブタジエンの少なくともいずれか一方に由来する構造単位を含有する、[1]~[8]のいずれかの積層体。
[10] 前記基材層が(メタ)アクリル系樹脂(M)からなる、[1]~[9]のいずれかの積層体。
[11] 前記(メタ)アクリル系樹脂(M)がメタクリル系樹脂(F)10~99質量%及び弾性体成分(R)1~90質量%を含有し、
前記メタクリル系樹脂(F)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記弾性体成分(R)が、メタクリル酸エステル重合体ブロック(g1)10~80質量%及びアクリル酸エステル重合体ブロック(g2)20~90質量%からなるブロック共重合体(G)を含有する、
[10]の積層体。
[12] 前記(メタ)アクリル系樹脂(M)が、メタクリル系樹脂(F)10~99質量%及び弾性体成分(R)1~90質量%を含有し、
前記メタクリル系樹脂(F)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記弾性体成分(R)が外層(e1)及び内層(e2)を有する多層構造体(E)を形成しており、
前記外層(e1)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記内層(e2)が、アクリル酸アルキルエステルに由来する構造単位70~99.8質量%及び架橋性単量体に由来する構造単位0.2~30質量%を含有する、
[10]の積層体。
[13] 前記粘接着層が前記基材層の反対側に接着面を有し、
前記接着面をポリプロピレン樹脂に密着させた時の剥離強度が20N/25mm以上である、[1]~[12]のいずれかの積層体。
[14] プレス成形又は共押出成形により、基材層と前記基材層に接する粘接着層とを備える積層体を製造する方法であって、
前記基材層が(メタ)アクリル系樹脂(M)、アクリロニトリル-ブタジエン-スチレン系樹脂又はポリエステル系樹脂からなり、
前記粘接着層は、芳香族ビニル化合物重合体ブロック(S)及び共役ジエン化合物重合体ブロック(D)を含有するブロック共重合体(A)を含有し、
前記基材層と前記粘接着層の界面に沿って、前記芳香族ビニル化合物重合体ブロック(S)の膜構造の相を形成させる、積層体の製造方法。
図1に示す積層体20は、極性樹脂からなる基材層10と、ブロック共重合体(A)を含有する粘接着層11とを備える。
図1に示す膜構造17は、目視による観察や露出させた界面12に対する検査によりその存在を確認することができ、その方法は特に限定されない。係る確認方法として、例えば透過型電子顕微鏡(TEM)による観察や二次イオン質量分析法(SIMS)による分析等が挙げられる。SIMSはダイナミックSIMSでもスタティックSIMSでもよい。中でも、TEMによる観察が好ましい。
図1に示す粘接着層11はブロック共重合体(A)を50質量%超含有することが好ましい。ブロック共重合体(A)の含有量は、51、56、61、66、71、76、81、85、90、95、99、及び100質量%のいずれかでもよい。
ブロック共重合体(A)は熱可塑性エラストマーの構成要素である。
芳香族ビニル化合物重合体ブロック(S)は芳香族ビニル化合物に由来する構造単位を主に含有する重合体である。係る芳香族ビニル化合物としては、例えばスチレン、α-メチルスチレン、2-メチルスチレン、3-メチルスチレン、4-メチルスチレン、4-プロピルスチレン、4-シクロヘキシルスチレン、4-ドデシルスチレン、2-エチル-4-ベンジルスチレン、4-(フェニルブチル)スチレン、1-ビニルナフタレン、2-ビニルナフタレン及びこれらの組み合わせが挙げられる。係る芳香族ビニル化合物としてスチレン、α-メチルスチレン、4-メチルスチレン及びこれらの組み合わせのいずれかが好ましい。これらの構造単位は、芳香族ビニル化合物重合体ブロック(S)の流動性を好適なものとすることができる。
共役ジエン化合物重合体ブロック(D)は共役ジエン化合物に由来する構造単位を主に含有する。共役ジエン化合物重合体ブロック(D)の構成単位としては、例えばブタジエン、イソプレン、2,3-ジメチル-1,3-ブタジエン、1,3-ペンタジエン、1,3-ヘキサジエン及びこれらの組み合わせが挙げられる。係る構造単位としてイソプレン及びブタジエンの少なくともいずれか一方が好ましい。係る構造単位としてイソプレン及びブタジエンの組み合わせがより好ましい。また、粘接着層におけるブツや異物を抑制する観点から、共役ジエン化合物重合体ブロック(D)は極性基を有しないことがさらに好ましい。
ブロック共重合体(A)において芳香族ビニル化合物重合体ブロック(S)と共役ジエン化合物重合体ブロック(D)とは結合している。これらの結合形態は特に制限されない。すなわち結合形態は直鎖状、分岐状、放射状及びこれらの任意の組み合わせとすることができる。直鎖状の結合形態が支配的であることでブロック共重合体(A)の製造を容易にすることができる。
ブロック共重合体(A)は水素非添加物又は水素添加物である。ブロック共重合体(A)では、共役ジエン化合物重合体ブロック(D)の一部又は全部に対して水素が添加されていることが好ましい。以下、これを単に水添(hydrogenation又はhydrogenated)という場合がある。
ブロック共重合体(A)中の芳香族ビニル化合物重合体ブロック(S)の含有量(組成比)の範囲は、好ましくは5~75質量%であり、より好ましくは5~60質量%であり、さらに好ましくは5~40質量%であり、特に好ましくは10~40質量%である。係る範囲により、粘接着層の柔軟性、延伸性及び接着性を良好なものとすることができる。上記含有量は、15、20、25、30、35、40、45、50、55、60、65及び70質量%のいずれかでもよい。
また、ブロック共重合体(A)の重量平均分子量の範囲は、好ましくは30,000~500,000であり、より好ましくは60,000~200,000であり、さらに好ましくは80,000~180,000である。係る範囲により、粘接着層の延伸性、接着性、成形加工性を良好なものとすることができる。
ブロック共重合体(A)の製造方法は特に限定されない。ブロック共重合体(A)は例えば次の(i)~(iii)のようなアニオン重合法により製造することができる。(i)アルキルリチウム化合物を開始剤として用い、芳香族ビニル化合物及び共役ジエン化合物を逐次重合させる方法;(ii)(i)の重合に次いで、カップリング剤を加えて重合物をさらにカップリングする方法;(iii)ジリチウム化合物を開始剤として用いて共役ジエン化合物、芳香族ビニル化合物を逐次重合させる方法。
図1に示す粘接着層11を構成する熱可塑性エラストマーには、ブロック共重合体(A)以外の接着付与成分(B)が含まれていてもよいが、接着付与成分(B)の含有量は、ブロック共重合体(A)100質量部に対して25質量部より小さいことが好ましい。係る含有量はブロック共重合体(A)100質量部に対して、24、23、22、21、20、19、18、17、16、15、14、13、12、11、10、9、8、7、6、5、4、3、2、1、0質量部とすることができる。接着付与成分(B)の含有量をこのような範囲とすることで、粘接着層の表面平滑性を向上できる。
図1に示す粘接着層11を構成する組成物が粘着付与剤(aD)をさらに含有する場合、粘着付与剤(aD)の含有量は、ブロック共重合体(A)100質量部に対して1質量部より小さいことが好ましく、0.5質量部より小さいことがより好ましく、0質量部であることがさらに好ましい。粘着付与剤(aD)の含有量を係る範囲とすることで、粘接着層11の表面平滑性粘接着層を向上させることができる。
図1に示す粘接着層11を構成する組成物は軟化剤(Sf)をさらに含有してもよい。係る軟化剤(Sf)としては、一般にゴム、プラスチックスに用いられる軟化剤が挙げられ、例えばパラフィン系、ナフテン系、芳香族系のプロセスオイル;ジオクチルフタレート、ジブチルフタレート等のフタル酸誘導体;ホワイトオイル、ミネラルオイル、エチレンとα-オレフィンのオリゴマー、パラフィンワックス、流動パラフィン、ポリブテン、低分子量ポリブタジエン、低分子量ポリイソプレン等が挙げられる。これらの中でもプロセスオイルが好ましく、パラフィン系プロセスオイルがより好ましい。
図1に示す粘接着層11を構成する組成物は、ブロック共重合体(A)以外の他の熱可塑性重合体を含有してもよい。他の熱可塑性重合体を含有することで、粘接着層の機械強度を高め、剥離強度を向上させることができる。他の熱可塑性重合体の例は、オレフィン系重合体、スチレン系重合体、ポリフェニレンエーテル系樹脂、ポリエチレングリコール等である。オレフィン系重合体としては、例えばポリエチレン、ポリプロピレン、ポリブテン、プロピレンとエチレンや1-ブテン等の他のα-オレフィンとのブロック共重合体やランダム共重合体等が挙げられる。メタクリル酸メチル-スチレン系ブロック共重合体を相溶化剤として用いてもよい。また本明細書に記載の任意の(メタ)アクリル系樹脂を添加してもよい。
図1に示す粘接着層11を構成する組成物は、無機充填材を含有してもよい。無機充填材は粘接着層11の耐熱性、耐候性及び硬度を適切なものに調整することができる。無機充填材としては、例えば炭酸カルシウム、タルク、水酸化マグネシウム、水酸化アルミニウム、マイカ、クレー、天然ケイ酸、合成ケイ酸、酸化チタン、カーボンブラック、硫酸バリウム、ガラスバルーン、ガラス繊維等が挙げられる。これらのうち1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
図1に示す粘接着層11を構成する組成物は酸化防止剤、滑剤、光安定剤、加工助剤、顔料や色素等の着色剤、難燃剤、帯電防止剤、艶消し剤、シリコンオイル、ブロッキング防止剤、紫外線吸収剤、離型剤、発泡剤、抗菌剤、防カビ剤、香料等を含有してもよい。酸化防止剤としては、例えばヒンダードフェノール系、リン系、ラクトン系、ヒドロキシ系の酸化防止剤等が挙げられる。これらの中でもヒンダードフェノール系酸化防止剤が好ましい。
図1に示す粘接着層11を構成する組成物の調製方法は、含有成分を均一に混合できる方法であれば特に限定されない。溶融混練法を用いてもよい。溶融混練法は、例えば単軸押出機、2軸押出機、ニーダー、バッチミキサー、ローラー、バンバリーミキサー等の溶融混練装置を用いて行うことができる。溶融混練の温度は170~270℃とすることができる。
図1に示す粘接着層11を構成する組成物の硬度の範囲は、JIS K 6253のJIS-A法により測定したとき、好ましくは0~90であり、より好ましくは30~90であり、さらに好ましくは35~85である。係る硬度が90以下であることで、粘接着層11の柔軟性及び弾性率を好適なものとすることができる。
図1に示す粘接着層11を構成する組成物の流動性はMFR(メルトフローレート)で表すことができる。MFRは、JIS K 7210に準じた方法で測定できる。230℃、荷重2.16kg(21.18N)で測定した時にMFRの範囲は、好ましくは1~50g/10分、より好ましくは1~40g/10分、さらに好ましくは2~30g/10分である。係る流動性により、粘接着層11の成形加工性が良好になる。このため粘接着層である粘接着層11の形成が容易となる。
図1に示す粘接着層11の厚さの範囲は好ましくは10~500μm、より好ましくは30~190μm、さらに好ましくは50~150μmである。粘接着層11の厚さが10μm以上であることで、積層体20と被着体との接着性を高めることができる。粘接着層11の厚さを500μm以下とすることで、積層体20の取扱性、表面硬度及び賦形性を良好なものとすることができる。積層体20の表面硬度とは、例えば基材層10の粘接着層11と反対側の表面16上で測定される表面の硬度である。
図1に示す基材層10が(メタ)アクリル系樹脂(M)からなる場合、(メタ)アクリル系樹脂(M)は、メタクリル系樹脂(F)を10質量%以上含有する。メタクリル系樹脂(F)の組成比は20、30、40、50、60、70、80、90及び100質量%のいずれかでもよい。メタクリル系樹脂(F)の含有量を10質量部以上とすることで、表面16の表面硬度を高めることができる。
メタクリル系樹脂(F)はメタクリル酸メチルに由来する構造単位を80質量%以上、好ましくは90質量%以上含有する。メタクリル酸メチルに由来する構造単位の組成比は81、82、83、84、85、86,87、88、89、90、91、92、93、94、95、96、97、98、99、及び100質量%のいずれかでもよい。メタクリル系樹脂(F)は、他の構造単位を好ましくは20質量%以下、より好ましくは10質量%以下含有する。
メタクリル系樹脂(F)の製造方法は特に限定されず、メタクリル酸メチル単量体をメタクリル酸メチル以外の単量体と共重合してもよい。
弾性体成分(R)としてはブタジエン系ゴム、クロロプレン系ゴム、ブロック共重合体、多層構造体等が挙げられる。これらを単独で又は組み合わせて用いてもよい。これらの中でも(メタ)アクリル系樹脂からなるブロック共重合体(G)又は多層構造体(E)は透明性、耐衝撃性、及び分散性に優れ好ましい。
メタクリル酸エステル重合体ブロック(g1)はメタクリル酸エステルに由来する構造単位を支配的な構成単位とするものである。メタクリル酸エステル重合体ブロック(g1)におけるメタクリル酸エステルに由来する構造単位の割合は、好ましくは80質量%以上、より好ましくは90質量%以上、さらに好ましくは95質量%以上、特に好ましくは98質量%以上である。係る割合により、基材層10の表面硬度及び耐熱性を高めることができる。
一態様において、ブロック共重合体(G)はさらに、アクリル酸エステル重合体ブロック(g2)20~90質量%を含有する。アクリル酸エステル重合体ブロック(g2)はアクリル酸エステルに由来する構造単位を支配的な構成単位とするものである。アクリル酸エステル重合体ブロック(g2)におけるアクリル酸エステルに由来する構造単位の割合は、三次元被覆成形性及び延伸性の観点から好ましくは45質量%以上、より好ましくは50質量%以上、さらに好ましくは60質量%以上、特に好ましくは90質量%である。
ブロック共重合体(G)におけるメタクリル酸エステル重合体ブロック(g1)とアクリル酸エステル重合体ブロック(g2)の結合形態は特に限定されない。例えば、メタクリル酸エステル重合体ブロック(g1)及びアクリル酸エステル重合体ブロック(g2)が直列に繋がった構造が挙げられる。係る構造として、メタクリル酸エステル重合体ブロック(g1)の一末端にアクリル酸エステル重合体ブロック(g2)の一末端が繋がった構造((g1)-(g2)構造);メタクリル酸エステル重合体ブロック(g1)の両末端にアクリル酸エステル重合体ブロック(g2)の一末端が繋がった構造((g2)-(g1)-(g2)構造);アクリル酸エステル重合体ブロック(b2)の両末端にメタクリル酸エステル重合体ブロック(g1)の一末端が繋がった構造((g1)-(g2)-(g1)構造)等が挙げられる。
ブロック共重合体(G)は、メタクリル酸エステル重合体ブロック(g1)及びアクリル酸エステル重合体ブロック(g2)以外の他の重合体ブロック(g3)を有してもよい。他の重合体ブロック(g3)を構成する、主たる構造単位はメタクリル酸エステル及びアクリル酸エステル以外の単量体に由来する構造単位である。係る単量体としては、例えばエチレン、プロピレン、1-ブテン、イソブテン、1-オクテン等のオレフィン;ブタジエン、イソプレン、ミルセン等の共役ジエン;スチレン、α-メチルスチレン、p-メチルスチレン、m-メチルスチレン等の芳香族ビニル化合物;酢酸ビニル、ビニルピリジン、アクリロニトリル、メタクリロニトリル、ビニルケトン、塩化ビニル、塩化ビニリデン、フッ化ビニリデン、アクリルアミド、メタクリルアミド、ε-カプロラクトン、バレロラクトン等が挙げられる。
ブロック共重合体(G)は、分子鎖中又は分子鎖末端に水酸基、カルボキシル基、酸無水物、アミノ基等の官能基を有してもよい。
ブロック共重合体(G)の製造方法は特に限定されず、公知の手法に準じた方法で製造できる。例えば各重合体ブロックを構成する単量体をリビング重合する方法を使用してもよい。リビング重合の手法としては、例えば有機アルカリ金属化合物を重合開始剤として用いアルカリ金属又はアルカリ土類金属塩等の鉱酸塩の存在下でアニオン重合する方法がある。
一態様において弾性体成分(R)は、外層(e1)及び内層(e2)を有する多層構造体(E)を形成している。内層(e2)及び外層(e1)が中心層から最外層方向へこの順に配されている。多層構造体(E)は内層(e2)の内側又は外層(e1)の外側にさらに架橋性樹脂層(e3)を有してもよい。
内層(e2)は、アクリル酸アルキルエステル及び架橋性単量体を有する単量体混合物を共重合してなる架橋弾性体から構成される層である。内層(e2)は、アクリル酸アルキルエステルに由来する構造単位70~99.8質量%を含有する。内層(e2)はさらに、架橋性単量体に由来する構造単位0.2~30質量%を含有する。
外層(e1)は、硬質熱可塑性樹脂から構成される。硬質熱可塑性樹脂は、メタクリル酸メチルに由来する構造単位を80質量%以上、好ましくは90質量%以上含有する。硬質熱可塑性樹脂は、係るメタクリル酸メチルを含有する単量体混合物を重合して作製する。
多層構造体(E)における内層(e2)の割合は、多層構造体(E)の質量を基準として40~80質量%が好ましい。同様に外層(e1)の割合は、20~60質量%が好ましい。係る外層(e1)及び内層(e2)の組み合わせにより、図1に示す基材層10の耐衝撃性、耐熱性、表面硬度及び取扱性が向上する。また弾性体成分(R)とメタクリル系樹脂(F)との溶融混練が容易になる。
基材層10を構成する極性樹脂としては、(メタ)アクリル系樹脂(M)以外の樹脂を用いてもよい。例えばポリスチレン樹脂、ポリ塩化ビニル樹脂、ポリエチレンテレフタレート(PET)樹脂、ポリブチレンテレフタレート樹脂(PBT)、アクリロニトリル-スチレン(AS)樹脂、アクリロニトリル-ブタジエン-スチレン(ABS)樹脂、ポリ塩化ビニル樹脂、ポリ塩化ビニリデン樹脂、ポリビニルアルコール樹脂、エチレン-ビニルアルコール樹脂、ポリアセタール樹脂、ポリフッ化ビニリデン樹脂、ポリウレタン樹脂、変性ポリフェニレンエーテル樹脂、ポリフェニレンスルフィド樹脂、シリコーン変性樹脂などが挙げられる。中でも接着性、透明性、耐候性、表面光沢性、耐擦傷性の観点から、PET樹脂、PBT樹脂、AS樹脂、ABS樹脂が好ましい。
(メタ)アクリル系樹脂(M)に限らず、基材層10を構成する極性樹脂には添加剤を加えてもよい。添加剤は、例えば酸化防止剤、光安定剤、熱安定剤、滑剤、加工助剤、帯電防止剤、酸化防止剤、着色剤、耐衝撃助剤、充填材、赤外線吸収剤、紫外線吸収剤、発泡剤、蛍光増白剤、分散剤、溶剤等である。
酸化防止剤は、酸素存在下においてそれ単体で樹脂の酸化劣化防止に効果を有するものである。酸化剤としては、例えばリン系酸化防止剤、ヒンダードフェノール系酸化防止剤、チオエーテル系酸化防止剤等が挙げられる。これらの酸化防止剤は1種単独で又は2種以上を組み合わせて使用できる。中でもリン系酸化防止剤やヒンダードフェノール系酸化防止剤が好ましい。これらの酸化防止剤は、図1に示す基材層10において、意図しない着色による光学特性の低下が少なく好ましい。さらに、リン系酸化防止剤とヒンダードフェノール系酸化防止剤の併用がより好ましい。係る場合、それらの混合割合は特に制限されない。リン系酸化防止剤/ヒンダードフェノール系酸化防止剤の質量比の範囲は好ましくは1/5~2/1、より好ましくは1/2~1/1である。
熱劣化防止剤はポリマーラジカルを捕捉することで樹脂の熱劣化を低減できるものである。ポリマーラジカルは、例えば極性樹脂が実質上無酸素の状態で高温になったときに生じる。熱劣化防止剤としては、例えば2-tert-ブチル-6-(3’-tert-ブチル-5’-メチル-ヒドロキシベンジル)-4-メチルフェニルアクリレート(住友化学社製;商品名スミライザーGM)、2,4-ジ-tert-アミル-6-(3’,5’-ジ-tert-アミル-2’-ヒドロキシ-α-メチルベンジル)フェニルアクリレート(住友化学社製;商品名スミライザーGS)等が挙げられる。
極性樹脂は他の重合体と混合して使用できる。係る他の重合体としては、例えばポリエチレン、ポリプロピレン(PP)、ポリブテン-1、ポリ-4-メチルペンテン-1、ポリノルボルネン等のポリオレフィン樹脂;エチレン系アイオノマー;ポリスチレン、スチレン-無水マレイン酸共重合体、ハイインパクトポリスチレン、アクリロニトリル-スチレン(AS)樹脂、アクリロニトリル-ブタジエン-スチレン(ABS)樹脂、アクリロニトリル-エチレン-スチレン(AES)樹脂、アクリロニトリル-アクリル酸エステル-スチレン(AAS)樹脂、アクリロニトリル-塩素化ポリエチレン-スチレン(ACS)樹脂、メタクリル酸メチル-ブタジエン-スチレン(MBS)樹脂等のスチレン系樹脂;メタクリル酸メチル-スチレン樹脂;ポリエチレンテレフタレート(PET)樹脂、ポリブチレンテレフタレート樹脂等のポリエステル樹脂;ナイロン6、ナイロン66、ポリアミドエラストマー等のポリアミド;ポリカーボネート、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリビニルアルコール、エチレンービニルアルコール共重合体、ポリアセタール、ポリフッ化ビニリデン、ポリウレタン、変性ポリフェニレンエーテル、ポリフェニレンスルフィド、シリコーン変性樹脂;アクリルゴム、シリコーンゴム;スチレン-エチレン/プロピレン-スチレン共重合体(SEPS)、スチレン-エチレン/ブタジエン-スチレン共重合体(SEBS)、スチレン-イソプレン-スチレン共重合体(SIS)等のスチレン系熱可塑性エラストマー;イソプレンゴム(IR)、エチレンプロピレンゴム(EPR)、エチレンプロピレンジエンゴム(EPDM)等のオレフィン系ゴム等が挙げられる。
基材層を構成する極性樹脂のマスターバッチを調製する方法は特に制限されない。例えば溶融混練して混合する方法をとることで、極性樹脂を構成する各成分の分散性を高めることができる。混合操作では既知の混合又は混練装置を使用できる。例えばニーダールーダー、押出機、ミキシングロール、バンバリーミキサー等である。二軸押出機を使用することで、混練性、相溶性を向上させることができる。混合・混練時の温度は使用する極性樹脂の溶融温度等に応じて適宜調節すればよい。例えば110~300℃の範囲である。二軸押出機を使用し溶融混練する場合、ベントを使用するとともに、減圧下、窒素雰囲気下で溶融混練することで極性樹脂に対する意図しない着色を抑制できる。減圧及び窒素雰囲気はいずか一方のみでもよい。極性樹脂はペレット又は粉末等の任意の形態で得てもよい。ペレット又は粉末等の形態の極性樹脂は成形材料として使用するのに好適である。
図1に示す膜構造17を形成するため、積層体20の製造時に基材層10に対して粘接着層11を密着させながら積層する。
図1に示す膜構造17を形成するためには、基材層10を構成する樹脂と、芳香族ビニル化合物重合体ブロック(S)との間の親和性を高めることが好ましく、さらに、ブロック共重合体(A)を、少なくとも一部相分離させるために十分な熱を加えることが好ましい。
基材層10を構成する樹脂と芳香族ビニル化合物重合体ブロック(S)との組み合わせの選択により、両者の間の親和性(密着性、濡れ性)を高めることができる。各層の親和性は、公知の方法を用いて試算することができる。例えば、各層を構成する少なくとも2つの分子A、Bの親和性は、Hansenの溶解度パラメーターにより試算することができ、その親和性δは、溶解度パラメーターであるモル体積あたりの分散力項(δd)、双極子間力項(δp)、および水素結合力項(δh)を用いて、以下の式から求めることができる。
δ={(δdA-δdB)2+(δpA-δpB)2+(δhA-δhB)2}1/2
係るδが小さいほど親和性は高く、δが大きいほど親和性は低い。
図1に示す膜構造17を形成するために、積層体20に十分な熱を与えることが好ましい。積層体20に与える熱量の指標としては、積層体20の加熱温度及び加熱時間が挙げられる。
図1に示す基材層10と粘接着層11との間の粘接着性は、例えば、剥離強度、せん断接着強さ、引張接着強さ、曲げ接着強さ、等で測定できる。この粘接着性の強弱は、下記、粘接着層11の材料強度(凝集力)にも影響を受ける。粘接着性を強くする上では、上記の膜構造17の形成によって得られる、基材層10と粘接着層11との間の高い親和性が必要である。
図1に示す基材層10と粘接着層11との間の粘接着性は、例えば、剥離強度で表される。
図1に示す粘接着層11は、基材層10又は界面12の反対側に接着面13を有する。接着面13は図示していない被着体に密着することができ、積層体20はいわゆる粘接着層付きフィルムとして好適に使用できる。
図1に示す積層体20を被着体に貼り付けることで、加飾された被覆物品を製造することができる。被着体の被着面の材質の例としては、熱可塑性樹脂、熱硬化性樹脂、木質又は非木質繊維基材、炭素繊維、セラミックス、金属、ガラス等が挙げられる。
図1に示す積層体20は加飾材料として、良好な三次元被覆成形性、表面硬度、延伸性、成形加工性、接着性及び隠蔽性を有する。このため、積層体20は、意匠性が要求される物品又は構造物に対して好適に使用できる。係る物品又は構造物としては、例えば広告塔、スタンド看板、袖看板、欄間看板、屋上看板等の看板部品;ショーケース、仕切板、店舗ディスプレイ等のディスプレイ部品;蛍光灯カバー、ムード照明カバー、ランプシェード、光天井、光壁、シャンデリア等の照明部品;家具、ペンダント、ミラー等のインテリア部品;ドア、ドーム、安全窓ガラス、間仕切り、階段腰板、バルコニー腰板、レジャー用建築物の屋根等の建築用部品、自動車内外装部材、バンパー等の自動車外装部材等の輸送機関係部品;音響映像用銘板、ステレオカバー、自動販売機、携帯電話、パソコン等の電子機器部品;保育器、定規、文字盤、温室、大型水槽、箱水槽、浴室部材、時計パネル、バスタブ、サニタリー、デスクマット、遊技部品、玩具、楽器、壁紙;マーキングフィルム、各種家電製品がある。
積層体20を被着体に貼り合わせる際には、図1に示す基材層10の粘接着層11と反対側の表面16を露出させて被着体を加飾する。
TOF-SIMS(飛行時間型二次イオン質量分析法)による膜構造17の確認は次の通り行った。TOF-SIMS測定では、まず粘接着層11の原材料として用いられる熱可塑性エラストマーのペレットを切断し、その断面を、TOF-SIMSで分析した。分析の結果に基づき、C2H5 +イオンのシグナル強度に対するC7H7 +イオンのシグナル強度の比Rcを求めた。
試料導入前の測定真空度:4×10-7Pa(4×10-9mbar)以下
1次イオン種:Bi3+(30 keV)
1次イオン加速電圧:25kV
パルス幅:4.3ns
バンチング:あり(高質量分解能測定)
帯電中和:あり
後段加速:10kV
ラスターサイズ:300μm角
質量範囲(m/z):0~1,500
スキャン数:32スキャン
一辺のピクセル数:256pixel
2次イオンの極性:正、陽イオンC3H7 +及びC7H7 +の観測
分析:GCIB-TOF-SIMSによる深さ方向分析
図1に示す膜構造17及び領域19は、以下のように積層体20の断面を有する切片において芳香族ビニル化合物重合体ブロック(S)を染色することで観察した。切片の作製は、クライオウルトラミクロトーム(ライカ社製;ULTRACUT S/FC-S)にて、-100℃で、積層体20を切削することで行った。このとき、積層体20の断面となるべき面と平行に、かつ界面12に対して垂直に切削した。切削により厚さ100nm未満の切片を得た。この切片を銅メッシュの台座に固定して撮像した。撮像の条件は以下の通りである。
撮像装置:透過電子顕微鏡(日立ハイテクノロジーズ社製;HT7700)
撮像モード:ハイコントラストモード
加速電圧:100kV
倍率:2×103~100×103倍
A:粘接着層中に、図1に示す芳香族相14の形成する膜構造17が観察された。
B:粘接着層中に、図1に示す芳香族相14の形成する膜構造17が観察し難かった。
C:粘接着層中に、図1に示す芳香族相14の形成する膜構造17が観察されなかった。
図1及び2に示す積層体20に対して、JIS K 7161に準拠した方法で、破断伸度の値を測定した。測定は引張試験機(インストロン社製万能試験機5566型)を用いて行った。測定温度は極性樹脂のガラス転移温度(Tg)よりも5℃低い温度であった。
まず後述する方法で被着体に図1に示す積層体20を積層した。次に被覆物品の表面に露出した積層体20を130℃まで加熱した。次に表面16をステンレス鋼材(SUS)板に対して固定した。固定は強粘着テープ(日東電工社製;商品名ハイパージョイントH9004)を表面16とステンレス鋼材に貼付することで行った。測定は卓上精密万能試験機(島津製作所社製;AGS-X)を使用し、JIS K 6854-2に準じて行った。剥離角度は180°、引張速度は300mm/分、環境温度は23℃であった。基材層10と被着体との間の剥離強度を測定した。剥離強度に基づき、基材層10と被着体との間の接着強度を以下の基準に沿って評価した。
B:剥離強度が5N/25mm超、25N/25mm以下
C:剥離強度が5N/25mm以下
メタクリル酸メチル95質量部およびアクリル酸メチル5質量部からなる単量体混合物に重合開始剤0.1質量部及び連鎖移動剤0.28質量部を加えて、これらを溶解させることで原料液を得た。重合開始剤は2,2’-アゾビス(2-メチルプロピオニトリル)(水素引抜能:1%、1時間半減期温度:83℃)であった。連鎖移動剤はn-オクチルメルカプタンであった。
反応器に室温にてトルエン溶液39.4kg、sec-ブチルリチウム1.17mol、メタクリル酸メチル35.0kgをこの順で加えた。反応器の内部は予め、脱気した上で窒素置換した。トルエン溶液は、乾燥トルエン735kg、ヘキサメチルトリエチレンテトラミン0.4kg及びイソブチルビス(2,6-ジ-tert-ブチル-4-メチルフェノキシ)アルミニウム20molからなる混合物の一部を使用した。反応器中で、これらの化合物を室温で1時間反応させた。反応液の一部をサンプリングすることで、反応液中に含まれる重合体の重量平均分子量を測定した。測定値は40,000であった。係る値は、メタクリル酸メチルからなる1つ目のメタクリル酸エステル重合体ブロック(g1)の重量平均分子量Mwに相当する。
攪拌機、温度計、窒素ガス導入管、単量体導入管及び還流冷却器を備えた反応器を用いた。係る反応器に、イオン交換水1,050質量部、ジオクチルスルホコハク酸ナトリウム0.5質量部及び炭酸ナトリウム0.7質量部を仕込んだ。反応器内を窒素ガスで十分に置換した後、反応器の内温を80℃に設定した。反応器内の水溶液に過硫酸カリウム0.25質量部を投入して5分間攪拌した。
予め耐圧容器を窒素置換することで、耐圧容器を乾燥させた。係る耐圧容器に、溶媒としてシクロヘキサン50.0kg、アニオン重合開始剤としてsec-ブチルリチウムの10.5質量%シクロヘキサン溶液94.1g(sec-ブチルリチウム9.9g当量)、及びルイス塩基としてテトラヒドロフラン300gを仕込んだ。係る溶液を50℃に昇温した。係る溶液に、スチレン(1)1.25kgを加えた後に、1時間の重合反応を行った。引き続いて係る溶液に、イソプレン10.00kgを加えた後に、2時間の重合反応を行った。更に係る溶液に、スチレン(2)1.25kgを加えた後に、1時間の重合反応を行った。以上により、スチレン-イソプレン-スチレントリブロック共重合体を含む反応液を得た。
予め耐圧容器を窒素置換することで、耐圧容器を乾燥させた。係る耐圧容器に、溶媒としてシクロヘキサン50.0kg、アニオン重合開始剤としてsec-ブチルリチウムの10.5質量%シクロヘキサン溶液137.1g(sec-ブチルリチウム14.4g当量)を仕込んだ。係る溶液を50℃に昇温した。係る溶液にスチレン(1)2.59kgを加えた後に、1時間の重合反応を行った。引き続いて係る溶液にイソプレン9.91kgを加えた後に、2時間の重合反応を行った。以上により、スチレン-イソプレンジブロック共重合体であるブロック共重合体(A-2a)を含む反応液を得た。
予め耐圧容器を窒素置換することで、耐圧容器を乾燥させた。係る耐圧容器に、溶媒としてシクロヘキサン50.0kg、アニオン重合開始剤としてsec-ブチルリチウム10.5質量%シクロヘキサン溶液145.6g(sec-ブチルリチウム15.3g当量)、ルイス塩基としてテトラヒドロフラン76gを仕込んだ。係る溶液を50℃に昇温した。係る溶液にスチレン(1)1.87kgを加えた後に、1時間の重合反応を行った。引き続いて係る溶液にブタジエン8.75kgを加えた後に、2時間の重合反応を行った。更にスチレン(2)1.87kgを加えた後に、1時間の重合反応を行った。以上により、スチレン-ブタジエン-スチレントリブロック共重合体を含む反応液を得た。
接着付与成分(B)として極性基含有ポリプロピレン系樹脂を合成した。合成は特許第5809150号公報の段落0075の記述に従った。ポリプロピレン樹脂(プライムポリマー社製;商品名プライムポリプロF327)42g、無水マレイン酸160mg、2,5-ジメチル-2,5-ジ(tert-ブチルパーオキシ)ヘキサン42mgを溶融混練した。溶融混練はバッチミキサーを用いて、温度180℃、スクリュー回転数40rpmで行った。
合成例1で得たビーズ状のメタクリル系樹脂(F)100質量部を、二軸押出機を用いて230℃で溶融混練しながら、ストランド状に押出した。押し出された樹脂を切断することで、メタクリル系樹脂(F)のペレットを得た。
製造例1で得たメタクリル系樹脂(F)のペレット80質量部及び合成例2で得たブロック共重合体(G)20質量部を、二軸押出機を用いて230℃で互いに溶融混練しながら、ストランド状に押出した。押し出された樹脂を切断することで、(メタ)アクリル系樹脂(M-1)のペレットを得た。
製造例1で得たメタクリル系樹脂(F)のペレット70質量部及び合成例3で得た多層積層体(E)30質量部を、二軸押出機を用いて230℃で互いに溶融混練した後、ストランド状に押出した。押し出された樹脂を切断することで、(メタ)アクリル系樹脂(M-2)のペレットを得た。
以下の実施例及び比較例の一部において、基材層と粘接着層とを熱及び圧力で結着させることで積層体を得た。まず粘接着層となる樹脂10gを、2枚のステンレス(SUS)板の間に設置した厚さ0.5mmの型枠内に充填した。ステンレス(SUS)板の大きさは20cm角の正方形であり、型枠の枠内の空間の形状は約15cm角の正方形であった。係るステンレス板及び型枠を熱プレス機(神藤金属工業社製;AYS.10、以下の製造例及び実施例において同様である)にセットした。200℃において1分間、樹脂に圧力をかけずに樹脂を加熱した。その後20秒間35kgfの力で樹脂を熱プレスした。その後、直ちにステンレス板及び型枠を23℃の冷却プレス機にセットした。冷却プレス機で樹脂を冷却しながら、樹脂に圧力を加えた。型枠内の樹脂を切り出すことで、15cm×15cm、厚さ0.5mmの粘接着層材料を得た。
実施例及び比較例の一部において、基材層となる樹脂及び粘接着層となる樹脂とをTダイで共押出しした。まず、製造例により得た粘接着層となる樹脂ペレットと、合成例により得た基材層となる樹脂ペレットとを、25mmΦベント式単軸押出機(G.M.ENGINEERJNG社製;VGM25-28EX)が有する別のホッパーにそれぞれ投入した。Tダイとしてマルチマニホールドダイを用いた。マルチマニホールドダイより押出温度240℃で上記の2つの樹脂を共押出しした。押し出された樹脂を、表面温度40℃のシリコンゴムロールと表面温度90℃の金属剛体ロールとの間に挟み込み、挟み込まれた樹脂を1m/分で引き出した。これにより、幅30cm、厚さ250μmの積層体を得た。基材層及び粘接着層の厚さは樹脂の押出流量により制御し、粘接着層の厚さを100μm、基材層の厚さを150μmとした。
製造例1に記載のメタクリル系樹脂(F)と、粘接着層となる合成例4に記載のブロック共重合体(A-1)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
粘接着層となる合成例4に記載のブロック共重合体(A-1)をトルエンに溶かすことで30質量パーセントの溶液を得た。この溶液を製造例1に記載のメタクリル系樹脂(F)からなるシート上に25℃で塗工した後、25℃でシートを乾燥することで、積層体を作製した。得られた積層体の評価結果を表2に示す。
実施例2において、粘接着層となる合成例4に記載のブロック共重合体(A-1)を合成例5に記載のブロック共重合体(A-2)に変更した以外は実施例1Aと同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。
実施例3Aにおいて、粘接着層となる合成例4に記載のブロック共重合体(A-1)を合成例6に記載のブロック共重合体(A-3)に変更した以外は実施例1Aと同様にして、積層体を作製した。ただし、熱プレスの温度は220℃で実施した。得られた積層体の評価結果を表2に示す。
実施例3Bにおいて、熱プレスの温度を200℃とした以外は実施例3Aと同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)80質量部と、合成例7で得た接着付与成分(B)20質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。実施例4において、粘接着層となる合成例4に記載のブロック共重合体(A-1)を係るペレットに変更した以外は実施例1Aと同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。
実施例5において、粘接着層材料と基材層材料の積層時の温度を200℃から240℃に変更した以外は実施例4と同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。
実施例6において、粘接着層材料と基材層材料の積層時の温度を200℃から150℃に変更した以外は実施例4と同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)80質量部と、合成例7で得た接着付与成分(B)20質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断した。以上により、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例2に記載の(メタ)アクリル系樹脂(M-1)とを、上述の共押出によって成形することで積層体を得た。さらにこの積層体を上述のTOM成形によって130℃で熱延伸成形しながら被着体に貼り合わせた。
実施例8において、メタクリル系樹脂(F)を製造例3に記載の(メタ)アクリル系樹脂(M-2)に変更した以外は実施例7と同様にして、積層体を得た。得られた積層体の評価結果を表2に示す。さらにこの積層体を上述のTOM成形によって130℃で熱延伸成形しながら被着体に貼り合わせた。
合成例4で得たブロック共重合体(A-1)70質量部と、合成例7で得た接着付与成分(B)30質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例2に記載の(メタ)アクリル系樹脂(M-1)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)50質量部と、合成例7で得た接着付与成分(B)50質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例2に記載の(メタ)アクリル系樹脂(M-1)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)70質量部、相溶化剤(日油社製;商品名モディパーMS10B、[他の熱可塑性重合体])5質量部、(メタ)アクリル系樹脂(クラレ社製;商品名パラペットHRS、[他の熱可塑性重合体])2.5質量部と、ポリプロピレン系樹脂(プライムポリマー社製;商品名プライムポリプロJ229E、[他の熱可塑性重合体])22.5質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例2に記載の(メタ)アクリル系樹脂(M-1)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)72.5質量部、(メタ)アクリル系樹脂(クラレ社製;商品名パラペットHRS、[他の熱可塑性重合体])7.5質量部と、ポリプロピレン系樹脂(日本ポリプロ社製;商品名ウィンテックWFX4TA、[他の熱可塑性重合体])20質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例3に記載の(メタ)アクリル系樹脂(M-2)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)と、アクリロニトリル-ブタジエン-スチレン系樹脂(旭化成社製;商品名スタイラック220S27)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)と、ポリエチレンテレフタレート系樹脂(クラレ社製;商品名クラペットKS710B-8S)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例6で得たブロック共重合体(A-3)と、ポリエチレンテレフタレート系樹脂(クラレ社製;商品名クラペットKS710B-8S)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
比較例1において、粘接着層材料と基材層材料の積層時の温度を200℃から140℃に変更した以外は実施例4と同様にして、積層体を作製した。得られた積層体の評価結果を表2に示す。なお、係る積層体の断面を、TEMを用いて観察しようと試みたところ、粘接着層と基材層の剥離強度が小さく、切片作製時に粘接着層と基材層が剥離してしまい、切片を作製できず、観察できなかった。
合成例4で得たブロック共重合体(A-1)30質量部と、合成例7で得た接着付与成分(B)70質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、製造例2に記載の(メタ)アクリル系樹脂(M-1)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。なお、係る積層体の断面を、TEMを用いて観察しようと試みたところ、粘接着層と基材層の剥離強度が小さく、切片作製時に粘接着層と基材層が剥離してしまい、切片を作製できず、観察できなかった。
合成例4で得たブロック共重合体(A-1)と、シクロオレフィンポリマー系樹脂(ZEON社製;商品名ゼオノア1020R)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例6で得たブロック共重合体(A-3)と、シクロオレフィンポリマー系樹脂(ZEON社製;商品名ゼオノア1020R)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
合成例4で得たブロック共重合体(A-1)80質量部と、合成例7で得た接着付与成分(B)20質量部とを、二軸押出機を用いて230℃で溶融混練した後、ストランド状に押出して切断し、粘接着層となる樹脂ペレットを得た。係るペレットと、ポリプロピレン系樹脂(日本ポリプロ社製;商品名MA3)とを、上述の熱プレス法によって200℃で熱プレスし、積層体を作製した。得られた積層体の評価結果を表2に示す。
Claims (14)
- 基材層と、前記基材層に接する粘接着層とを備える積層体であって、
前記基材層が(メタ)アクリル系樹脂(M)、アクリロニトリル-ブタジエン-スチレン系樹脂又はポリエステル系樹脂からなり、
前記粘接着層は、芳香族ビニル化合物重合体ブロック(S)及び共役ジエン化合物重合体ブロック(D)を含有するブロック共重合体(A)を含有し、
前記基材層と前記粘接着層の界面に沿って、前記芳香族ビニル化合物重合体ブロック(S)が膜構造の相を形成している、積層体。 - 前記芳香族ビニル化合物重合体ブロック(S)がさらに円断面構造の相を形成し、
前記粘接着層が、前記膜構造の相に沿って前記円断面構造の相の乏しい領域を有する、
請求項1に記載の積層体。 - 前記粘接着層が前記ブロック共重合体(A)を50質量%超含有する、請求項1又は2に記載の積層体。
- 前記ブロック共重合体(A)における共役ジエン化合物重合体ブロック(D)のビニル化度が40モル%以上である、請求項1~3のいずれかに記載の積層体。
- 前記ブロック共重合体(A)が前記芳香族ビニル化合物重合体ブロック(S)5~40質量%及び前記共役ジエン化合物重合体ブロック(D)60~95質量%を含有する、請求項1~4のいずれかに記載の積層体。
- 前記粘接着層がさらに接着付与成分(B)を含有する、請求項1~5のいずれかに記載の積層体。
- 前記粘接着層における粘着付与剤(aD)の含有量がブロック共重合体(A)100質量部に対して1質量部未満である、請求項1~6のいずれかに記載の積層体。
- 前記共役ジエン化合物重合体ブロック(D)が極性基を有しない、請求項1~7のいずれかに記載の積層体。
- 前記共役ジエン化合物重合体ブロック(D)が、イソプレン及びブタジエンの少なくともいずれか一方に由来する構造単位を含有する、請求項1~8のいずれかに記載の積層体。
- 前記基材層が(メタ)アクリル系樹脂(M)からなる、請求項1~9のいずれかに記載の積層体。
- 前記(メタ)アクリル系樹脂(M)がメタクリル系樹脂(F)10~99質量%及び弾性体成分(R)1~90質量%を含有し、
前記メタクリル系樹脂(F)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記弾性体成分(R)が、メタクリル酸エステル重合体ブロック(g1)10~80質量%及びアクリル酸エステル重合体ブロック(g2)20~90質量%からなるブロック共重合体(G)を含有する、
請求項10に記載の積層体。 - 前記(メタ)アクリル系樹脂(M)が、メタクリル系樹脂(F)10~99質量%及び弾性体成分(R)1~90質量%を含有し、
前記メタクリル系樹脂(F)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記弾性体成分(R)が外層(e1)及び内層(e2)を有する多層構造体(E)を形成しており、
前記外層(e1)がメタクリル酸メチルに由来する構造単位80質量%以上を含有し、
前記内層(e2)が、アクリル酸アルキルエステルに由来する構造単位70~99.8質量%及び架橋性単量体に由来する構造単位0.2~30質量%を含有する、
請求項10に記載の積層体。 - 前記粘接着層が前記基材層の反対側に接着面を有し、
前記接着面をポリプロピレン樹脂に密着させた時の剥離強度が20N/25mm以上である、
請求項1~12のいずれかに記載の積層体。 - プレス成形又は共押出成形により、基材層と前記基材層に接する粘接着層とを備える積層体を製造する方法であって、
前記基材層が(メタ)アクリル系樹脂(M)、アクリロニトリル-ブタジエン-スチレン系樹脂又はポリエステル系樹脂からなり、
前記粘接着層は、芳香族ビニル化合物重合体ブロック(S)及び共役ジエン化合物重合体ブロック(D)を含有するブロック共重合体(A)を含有し、
前記基材層と前記粘接着層の界面に沿って、前記芳香族ビニル化合物重合体ブロック(S)の膜構造の相を形成させる、積層体の製造方法。
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CN (1) | CN110139906B (ja) |
TW (1) | TW201817594A (ja) |
WO (1) | WO2017200014A1 (ja) |
Cited By (6)
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WO2019198823A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
WO2019198827A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
WO2020179923A1 (ja) | 2019-03-07 | 2020-09-10 | 株式会社クラレ | エラストマー樹脂組成物、粘接着フィルム及びその製造方法、フィルム、並びに成形体 |
JPWO2020235660A1 (ja) * | 2019-05-22 | 2020-11-26 | ||
JP7120492B1 (ja) * | 2020-11-10 | 2022-08-17 | Dic株式会社 | ヒートシール剤、積層体、包装材 |
WO2023238519A1 (ja) * | 2022-06-07 | 2023-12-14 | 旭化成株式会社 | 積層体、及び積層体の製造方法 |
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KR102324559B1 (ko) * | 2020-02-28 | 2021-11-10 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102370666B1 (ko) * | 2021-03-25 | 2022-03-07 | 의림환경에너텍(주) | 폐전선 피복을 재활용한 플라스틱 블록의 제조방법 |
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WO2019198823A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
WO2019198827A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
CN111971355A (zh) * | 2018-04-13 | 2020-11-20 | 株式会社可乐丽 | 多层膜和具备该多层膜的成形体 |
JPWO2019198827A1 (ja) * | 2018-04-13 | 2021-05-13 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
JP7293199B2 (ja) | 2018-04-13 | 2023-06-19 | 株式会社クラレ | 多層フィルムおよびそれを備える成形体 |
WO2020179923A1 (ja) | 2019-03-07 | 2020-09-10 | 株式会社クラレ | エラストマー樹脂組成物、粘接着フィルム及びその製造方法、フィルム、並びに成形体 |
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WO2023238519A1 (ja) * | 2022-06-07 | 2023-12-14 | 旭化成株式会社 | 積層体、及び積層体の製造方法 |
Also Published As
Publication number | Publication date |
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TW201817594A (zh) | 2018-05-16 |
JP6934864B2 (ja) | 2021-09-15 |
US20190136092A1 (en) | 2019-05-09 |
JPWO2017200014A1 (ja) | 2019-03-14 |
CN110139906A (zh) | 2019-08-16 |
EP3460016A1 (en) | 2019-03-27 |
EP3460016A4 (en) | 2020-01-15 |
KR102194359B1 (ko) | 2020-12-23 |
KR20190005178A (ko) | 2019-01-15 |
CN110139906B (zh) | 2022-01-07 |
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