WO2017181742A1 - 假压头及其工作方法 - Google Patents

假压头及其工作方法 Download PDF

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Publication number
WO2017181742A1
WO2017181742A1 PCT/CN2017/070400 CN2017070400W WO2017181742A1 WO 2017181742 A1 WO2017181742 A1 WO 2017181742A1 CN 2017070400 W CN2017070400 W CN 2017070400W WO 2017181742 A1 WO2017181742 A1 WO 2017181742A1
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Prior art keywords
vacuum
adsorption
valve
vacuum adsorption
false
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PCT/CN2017/070400
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English (en)
French (fr)
Inventor
牛红林
范荣华
随鹏
王光祥
陶美艳
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/534,736 priority Critical patent/US10729015B2/en
Publication of WO2017181742A1 publication Critical patent/WO2017181742A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a false indenter and a working method thereof.
  • the pseudo-pressure device is used to pseudo-press the pin circuit line on the circuit board and the display panel (also known as pre-press, false binding).
  • the module factory has a wide range of products and production equipment. Each product corresponds to a kind of circuit board. Since the size of the circuit board is different, a large number of jigs need to be replaced each time the switching model is used, resulting in low production efficiency and high procurement cost. The replacement of the jig not only takes a lot of time (about 1/3 of the switching time of the model), but also causes other problems during the disassembly and installation process, and brings great inconvenience to the management and maintenance of the production line.
  • the present invention provides a false indenter and a working method thereof, which at least partially solves the problem that the prior art needs to replace the jig due to different sizes of the circuit board, resulting in low production efficiency and high procurement cost.
  • the present invention provides a false ram comprising an adsorption unit and a control unit, the adsorption unit comprising at least two vacuum adsorption structures, each of the vacuum adsorption structures comprising a gas path and at least one vent, the gas path Connected to the air hole;
  • the control unit is configured to respectively control formation of a vacuum environment of each of the vacuum adsorption structures according to a size of a target to be adsorbed;
  • the adsorption unit is configured to perform an adsorption action on the target to be adsorbed under the control of the control unit.
  • control unit includes a correspondingly disposed at least one valve structure and at least one vacuum pump, and the valve structure and the vacuum pump are respectively connected to a gas path of a corresponding vacuum adsorption structure;
  • the valve structure and the vacuum pump are configured to control the formation of a vacuum environment of the corresponding vacuum adsorption structure.
  • valve structure is configured as:
  • the corresponding vacuum adsorption structure gas path communicates with the vacuum pump to cause the vacuum pump to vacuum the vacuum adsorption structure or eliminate the vacuum environment of the vacuum adsorption structure;
  • the corresponding vacuum adsorption structure gas path is isolated from the vacuum pump to maintain the existing environment of the corresponding vacuum adsorption structure.
  • the valve structure includes a control module, a valve module, and a pipeline, wherein the valve module is respectively connected to the control module and the pipeline, and the pipeline is connected to a gas path of a corresponding vacuum adsorption structure;
  • the valve module is configured to perform a switching action between the corresponding vacuum adsorption structure gas path and the vacuum pump under the control of the control module;
  • the vacuum pump is configured to evacuate the vacuum adsorption structure or to eliminate a vacuum environment of the vacuum adsorption structure as needed.
  • valve structure is a solenoid valve.
  • the number of the vacuum adsorption structures is three.
  • the number of the vacuum adsorption structures is three, and the number of the valve structures is three.
  • the dummy indenter comprises a vacuum pump connected to the gas paths of the at least two vacuum adsorption structures.
  • the dummy indenter comprises an equal number of one-to-one corresponding valve structures and a vacuum pump.
  • the object to be adsorbed is a flip chip or a flexible circuit board.
  • the invention provides a working method of a false indenter comprising an adsorption unit and a control unit, the adsorption unit comprising at least two vacuum adsorption structures, each of the vacuum adsorption structures comprising a gas path and at least one pore The gas path is in communication with the air hole;
  • the working method of the false indenter includes:
  • the control unit respectively controls formation of a vacuum environment of each of the vacuum adsorption structures according to a size of an object to be adsorbed;
  • the adsorption unit performs an adsorption action on the target to be adsorbed under the control of the control unit.
  • control unit includes a correspondingly disposed at least one valve structure and at least one vacuum pump, and the valve structure and the vacuum pump are respectively connected to a gas path of a corresponding vacuum adsorption structure;
  • the step of controlling, by the control unit, the formation of the vacuum environment of each of the vacuum adsorption structures according to the size of the target to be adsorbed includes:
  • valve structure and the vacuum pump control the formation of a vacuum environment of the corresponding vacuum adsorption structure.
  • the step of controlling the formation of the vacuum environment of the corresponding vacuum adsorption structure by the valve structure and the vacuum pump comprises:
  • the gas path of the corresponding vacuum adsorption structure is in communication with the vacuum pump, so that the vacuum pump vacuums the vacuum adsorption structure or eliminates the vacuum environment of the vacuum adsorption structure;
  • the corresponding vacuum adsorption structure gas path is isolated from the vacuum pump to maintain the existing environment of the corresponding vacuum adsorption structure.
  • the valve structure includes a control module, a valve module, and a pipeline, wherein the valve module is respectively connected to the control module and the pipeline, and the pipeline is connected to a gas path of a corresponding vacuum adsorption structure;
  • the step of controlling the valve structure and the vacuum pump to form a vacuum environment of the corresponding vacuum adsorption structure includes:
  • the valve module performs a switching action on the communication between the gas path of the corresponding vacuum adsorption structure and the vacuum pump under the control of the control module;
  • the vacuum pump evacuates the vacuum adsorption structure or eliminates the vacuum environment of the vacuum adsorption structure as needed.
  • valve structure is a solenoid valve.
  • the object to be adsorbed is a flip chip or a flexible circuit board.
  • the pseudo indenter comprises an adsorption unit and a control unit
  • the adsorption unit comprises at least two vacuum adsorption structures
  • the vacuum adsorption structure comprises an air passage and at least one air hole
  • the gas path is connected to the pore through.
  • the control unit is configured to respectively control formation of a vacuum environment of each of the vacuum adsorption structures according to a size of a target to be adsorbed, wherein the adsorption unit is configured to perform adsorption on a target under the control of the control unit Adsorption action.
  • the technical solution provided by the invention adjusts the adsorption function of the vacuum adsorption structure according to the size of the circuit board, so that the false pressure head can adapt to different size circuit boards. Therefore, the false indenter provided by the present invention does not need to replace the jig according to the size of the circuit board, thereby achieving the purpose of generalization, improving the production efficiency, reducing the throwing rate of the circuit board, and reducing the procurement cost. At the same time, it is also possible to avoid the inconvenience caused by the management and maintenance of the production line due to the disassembly and installation of the jig. In addition, by independently controlling a single vacuum adsorption structure, not only can the use requirements be maximized, but also the accuracy of the circuit board can be ensured, the equipment grafting rate can be effectively improved, and the defect can be reduced.
  • FIG. 1 is a schematic structural view of a false ram according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of the adsorption unit shown in FIG. 1;
  • FIG 3 is a schematic structural view of the control unit shown in Figure 1;
  • FIG. 4 is a flow chart of a working method of a false ram according to a second embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a dummy indenter according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of the adsorption unit shown in FIG. 1
  • FIG. 3 is a schematic structural view of the control unit shown in FIG.
  • the pseudo indenter includes an adsorption unit 100 and a control unit
  • the adsorption unit 100 includes at least two vacuum adsorption structures, each of the vacuum adsorption structures including a gas path 101 and at least one air hole 102.
  • the gas path 101 is in communication with the air hole 102.
  • the number of the vacuum adsorption structures is three, and the target to be adsorbed is COF (Chip On Flex or Chip On Film) or FPC. (Flexible Printed Circuit, flexible circuit board).
  • COF Chip On Flex or Chip On Film
  • FPC Flexible Printed Circuit, flexible circuit board
  • control unit controls the formation of the vacuum environment of each of the vacuum adsorption structures according to the size of the target to be adsorbed, and the adsorption unit 100 treats the target under the control of the control unit.
  • the object performs the adsorption action.
  • the control unit can control all three vacuum adsorption structures to form a vacuum environment, and use three vacuum adsorption structures to carry out the circuit board. Adsorption action.
  • the control unit may control a part of the three vacuum adsorption structures (one or two vacuum adsorption structures) to form a vacuum environment, and utilize a part of the three vacuum adsorption structures.
  • the board performs the adsorption action in such a way that the dummy head is adapted to boards of different sizes. Therefore, the false indenter provided in this embodiment does not need to replace the jig according to the size of the circuit board, thereby achieving the purpose of generalization, improving the production efficiency, reducing the throwing rate of the circuit board, and reducing the procurement cost. At the same time, it is also possible to avoid the inconvenience caused by the management and maintenance of the production line due to the disassembly and installation of the jig.
  • the control unit includes a correspondingly disposed at least one valve structure 200 and at least one vacuum pump 301, which are respectively coupled to a corresponding vacuum adsorption structure gas path 101.
  • the valve structure 200 and the vacuum pump 301 control the formation of a vacuum environment of the vacuum adsorption structure. Specifically, when the valve structure 200 is opened, the air passage 101 communicates with the vacuum pump, and the gas is pumped into the air passage 101 according to whether or not the adsorption operation is performed to eliminate the vacuum environment of the vacuum adsorption structure. Alternatively, the vacuum adsorption structure is evacuated for adsorption of the circuit board.
  • the valve structure 200 When the valve structure 200 is closed, the gas path 101 is isolated from the vacuum pump, at which time the gas path 101 is in a sealed state, maintaining the existing environment.
  • the valve structure 200 is a solenoid valve
  • the number of the vacuum adsorption structures is three
  • the number of the valve structures 200 is three, that is, an equal number of one-to-one corresponding valve structures and vacuums may be disposed.
  • Adsorption structure Adsorption structure.
  • the present invention is not limited thereto.
  • three vacuum adsorption structures and two valve structures may be provided, one of which is configured to simultaneously control the formation of a vacuum environment of two vacuum adsorption structures, for example, the valve structure may be a two-way valve.
  • Figure 1 shows only one vacuum pump 301, but the invention is not limited thereto, for example, for each of a plurality of valve configurations
  • a vacuum pump is provided to enable a plurality of vacuum adsorption structures to quickly switch states.
  • the technical solution provided by the embodiment independently controls a single vacuum adsorption structure, and does not need to replace the fixture according to the size of the circuit board, thereby achieving the purpose of generalization, ensuring the accuracy of the circuit board, and effectively improving the device grafting.
  • the rate is conducive to reducing bad.
  • the valve structure 200 includes a control module 201, a valve module 202, and a pipe 203.
  • the valve module 202 is respectively connected to the control module 201 and the pipe 203, and the pipe 203 and the gas path 101. connection.
  • the valve module 202 performs a switching operation between the air passage 101 and the vacuum pump under the control of the control module 201.
  • the vacuum pump changes the internal environment of the vacuum adsorption structure according to the switching action of the valve module 202 and the need to adsorb an object (vacuum or eliminate the vacuum environment).
  • the air passage 101 communicates with the vacuum pump, and at this time, the vacuum pump 301 can be used to pump the air passage 101 through the duct 203 as needed.
  • the gas is introduced to eliminate the vacuum environment of the vacuum adsorption structure or the vacuum path 301 is used to evacuate the gas path 101 for adsorbing an object.
  • the control module 201 controls the valve module 202 to be closed, the air passage 101 is isolated from the vacuum pump 301, and the air passage 101 is in a sealed state to maintain the existing environment.
  • the pseudo indenter provided in this embodiment includes an adsorption unit and a control unit, and the adsorption unit includes at least two vacuum adsorption structures, each of the vacuum adsorption structures includes a gas path and at least one air hole, and the air path and the air hole Connected.
  • the control unit is configured to respectively control formation of a vacuum environment of each of the vacuum adsorption structures according to a size of a target to be adsorbed, wherein the adsorption unit is configured to perform adsorption on a target under the control of the control unit Adsorption action.
  • the technical solution provided by the embodiment adjusts the adsorption function of the vacuum adsorption structure according to the size of the circuit board to be adsorbed, so that the dummy pressure head is adapted to the circuit boards of different sizes. Therefore, the false indenter provided in this embodiment does not need to replace the jig according to the size of the circuit board to be adsorbed, thereby achieving the purpose of generalization, improving the production efficiency, reducing the throwing rate of the circuit board, and reducing the procurement cost. At the same time, it is also possible to avoid the inconvenience caused by the management and maintenance of the production line due to the disassembly and installation of the jig. In addition, by independently controlling a single vacuum adsorption structure, not only can the use requirements be maximized, but also the accuracy of the circuit board can be ensured, and the equipment grafting rate can be effectively improved. Conducive to reducing bad.
  • the pseudo indenter includes an adsorption unit and a control unit, and the adsorption unit includes at least two vacuum adsorption structures, each of the vacuum adsorption structures including a gas path and at least one air hole, and the gas path and The pores are connected.
  • the working method of the false indenter includes:
  • Step 1001 The control unit controls the formation of a vacuum environment of each of the vacuum adsorption structures according to the size of the target to be adsorbed.
  • Step 1002 The adsorption unit performs an adsorption operation on the target to be adsorbed under the control of the control unit.
  • the number of the vacuum adsorption structures is three, and the target to be adsorbed is a COF (Chip On Flex or Chip On Film) or an FPC (Flexible Printed Circuit).
  • the control unit can control all three vacuum adsorption structures to form a vacuum environment, and use three vacuum adsorption structures to carry out the circuit board. Adsorption action.
  • the control unit controls a part of the three vacuum adsorption structures to form a vacuum environment, and uses a part of the three vacuum adsorption structures to adsorb the circuit board to make the false pressure head Adapt to different sizes of boards. Therefore, the false indenter provided in this embodiment does not need to replace the jig according to the size of the circuit board, thereby achieving the purpose of generalization, improving the production efficiency, reducing the throwing rate of the circuit board, and reducing the procurement cost. At the same time, it is also possible to avoid the inconvenience caused by the management and maintenance of the production line due to the disassembly and installation of the jig.
  • the control unit includes a correspondingly disposed at least one valve structure 200 and at least one vacuum pump 301, and the valve structure 200 and the vacuum pump 301 are respectively connected to the gas path 101 of the corresponding vacuum adsorption structure.
  • the step of controlling, by the control unit, the formation of the vacuum environment of each of the vacuum adsorption structures according to the size of the object to be adsorbed includes: the valve structure and the vacuum pump of the corresponding vacuum adsorption structure of the vacuum pump Formation is controlled.
  • the valve structure and the vacuum The step of controlling the formation of the vacuum environment of the corresponding vacuum adsorption structure by the pump includes: when the valve structure is opened, the gas path is in communication with the vacuum pump to cause the vacuum pump to pump the vacuum adsorption structure Vacuuming or eliminating the vacuum environment of the vacuum adsorption structure; when the valve structure is closed, the gas path is isolated from the vacuum pump to maintain the existing environment of the vacuum adsorption structure.
  • the gas path 101 is in communication with the vacuum pump 301, and at this time, gas can be pumped into the gas path 101 as needed to eliminate the vacuum environment of the vacuum adsorption structure or The gas path 101 is evacuated.
  • valve structure 200 When the valve structure 200 is closed, the gas path 101 is isolated from the vacuum pump 301, at which time the gas path 101 is in a sealed state to maintain the existing environment.
  • the valve structure 200 is a solenoid valve
  • the number of the vacuum adsorption structures is three
  • the number of the valve structures 200 is three. Therefore, the technical solution provided by the embodiment provides independent control of a single vacuum adsorption structure, and does not need to replace the fixture according to the size of the circuit board, thereby achieving the purpose of generalization, ensuring the accuracy of the circuit board, and effectively improving the equipment grafting rate. It is conducive to reducing bad.
  • the valve structure 200 includes a control module 201, a valve module 202, and a pipe 203.
  • the valve module 202 is respectively connected to the control module 201 and the pipe 203, and the pipe 203 and the gas path 101. connection.
  • the valve structure and the vacuum pump controlling the formation of the vacuum environment of the vacuum adsorption structure includes: the valve module performs communication between the gas path and the vacuum pump under the control of the control module Switching action; the vacuum pump evacuates the vacuum adsorption structure or eliminates the vacuum environment of the vacuum adsorption structure according to whether or not the adsorption operation is performed.
  • the air passage 101 communicates with the vacuum pump 301, and the gas is pumped into the air passage 101 through the duct 203, thereby eliminating the The vacuum environment of the vacuum adsorption structure or vacuuming the gas path 101 to perform an adsorption operation.
  • the control module 201 controls the valve module 202 to be closed, the air passage 101 is isolated from the vacuum pump 301, and the air passage 101 is in a sealed state to maintain the current environment.
  • the pseudo indenter includes an adsorption unit and a control unit, and the adsorption unit includes at least two vacuum adsorption structures, each of the vacuum adsorption structures including a gas path and at least a vent, the gas path and the gas The holes are connected.
  • the control unit is configured to respectively control formation of a vacuum environment of each of the vacuum adsorption structures according to a size of a target to be adsorbed, wherein the adsorption unit is configured to perform adsorption on a target under the control of the control unit Adsorption action.
  • the technical solution provided by the embodiment adjusts the adsorption function of the vacuum adsorption structure according to the size of the circuit board to be adsorbed, so that the dummy pressure head is adapted to the circuit boards of different sizes. Therefore, the false indenter provided in this embodiment does not need to replace the jig according to the size of the circuit board, thereby achieving the purpose of generalization, improving the production efficiency, reducing the throwing rate of the circuit board, and reducing the procurement cost. At the same time, it is also possible to avoid the inconvenience caused by the management and maintenance of the production line due to the disassembly and installation of the jig. In addition, by independently controlling a single vacuum adsorption structure, not only can the use requirements be maximized, but also the accuracy of the circuit board can be ensured, the equipment grafting rate can be effectively improved, and the defect can be reduced.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种假压头及其工作方法，所述假压头包括吸附单元（100）和控制单元，所述吸附单元（100）包括至少两个真空吸附结构，每个所述真空吸附结构包括气路（101）以及至少一个气孔（102），所述气路（101）与所述气孔（102）连通。所述控制单元用于根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制，所述吸附单元（100）用于在所述控制单元的控制之下对待吸附目标物进行吸附动作。所述假压头能够根据待吸附的电路板的尺寸对真空吸附结构的吸附功能进行调节，使得假压头适应不同尺寸的电路板。因此，所述假压头不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。

Description

假压头及其工作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种假压头及其工作方法。
背景技术
在显示器制备过程中，假压设备用于将电路板上的引脚电路线与显示面板进行假压(又称预压、假绑定)。目前，模组工厂的生产产品种类繁多，生产设备也不尽相同。每种产品对应一种电路板，由于电路板的尺寸不一，每次切换机种都需要更换大量的治具，导致生产效率低下，采购成本偏高。治具的更换不仅需要花费大量时间(约占机种切换时间的1/3)，而且拆卸安装过程中也容易造成其他问题，还会给产线的管理与维护带来极大的不便。
发明内容
为解决上述问题，本发明提供一种假压头及其工作方法，至少部分解决现有技术由于电路板的不同尺寸需要更换治具，导致生产效率低下，采购成本偏高的问题。
为此，本发明提供一种假压头，包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通；
所述控制单元配置为根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制；
所述吸附单元配置为在所述控制单元的控制之下对待吸附目标物进行吸附动作。
可选的，所述控制单元包括对应设置的至少一个阀门结构和至少一个真空泵，所述阀门结构和所述真空泵分别与对应的真空吸附结构的气路连接；
所述阀门结构和所述真空泵配置为对所对应的真空吸附结构的真空环境的形成进行控制。
可选的，所述阀门结构配置为：
当打开时，所对应的真空吸附结构的气路与所述真空泵进行连通，以使所述真空泵对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境；
当关闭时，所对应的真空吸附结构的气路与所述真空泵进行隔离，以保持所对应的真空吸附结构的现有环境。
可选的，所述阀门结构包括控制模块、阀门模块以及管道，所述阀门模块分别与所述控制模块和所述管道连接，所述管道与所对应的真空吸附结构的气路连接；
所述阀门模块配置为在所述控制模块的控制之下对所对应的真空吸附结构气路与所述真空泵之间的连通进行开关动作；
所述真空泵配置为根据需要对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境。
可选的，所述阀门结构为电磁阀。
可选的，所述真空吸附结构的数量为3个。
可选的，所述真空吸附结构的数量为3个，所述阀门结构的数量为3个。
可选的，所述假压头包括一个真空泵，其与所述至少两个真空吸附结构的气路分别连接。
可选的，所述假压头包括数量相等且一一对应设置的阀门结构和真空泵。可选的，所述待吸附目标物为覆晶薄膜或者柔性电路板。
本发明提供一种假压头的工作方法，所述假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通；
所述假压头的工作方法包括：
所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制；
所述吸附单元在所述控制单元的控制之下对待吸附目标物进行吸附动作。
可选的，所述控制单元包括对应设置的至少一个阀门结构和至少一个真空泵，所述阀门结构和所述真空泵分别与对应的真空吸附结构的气路连接；
所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制的步骤包括：
所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制。
可选的，所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制的步骤包括：
当所述阀门结构打开时，所对应的真空吸附结构的气路与所述真空泵进行连通，以使所述真空泵对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境；
当所述阀门结构关闭时，所对应的真空吸附结构的气路与所述真空泵进行隔离，以保持所对应的真空吸附结构的现有环境。
可选的，所述阀门结构包括控制模块、阀门模块以及管道，所述阀门模块分别与所述控制模块和所述管道连接，所述管道与所对应的真空吸附结构的气路连接；
所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制的步骤包括：
所述阀门模块在所述控制模块的控制之下对所对应的真空吸附结构的气路与所述真空泵之间的连通进行开关动作；
所述真空泵根据需要对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境。
可选的，所述阀门结构为电磁阀。
可选的，所述待吸附目标物为覆晶薄膜或者柔性电路板。
本发明具有下述有益效果：
本发明提供的假压头及其工作方法之中，所述假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连 通。所述控制单元用于根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制，所述吸附单元用于在所述控制单元的控制之下对待吸附目标物进行吸附动作。本发明提供的技术方案根据电路板的尺寸对真空吸附结构的吸附功能进行调节，使得假压头能够适应不同尺寸的电路板。因此，本发明提供的假压头不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。同时，也可以避免由于治具的拆卸安装给产线的管理与维护带来的不便。另外，通过独立控制单个真空吸附结构，不仅能够最大限度地满足使用要求，而且还能够保证电路板的交接精度，有效提升设备嫁动率，有利于减少不良。
附图说明
图1为本发明实施例一提供的一种假压头的结构示意图；
图2为图1所示吸附单元的结构示意图；
图3为图1所示控制单元的结构示意图；
图4为本发明实施例二提供的一种假压头的工作方法的流程图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图对本发明提供的假压头及其工作方法进行详细描述。
实施例一
图1为本发明实施例一提供的一种假压头的结构示意图，图2为图1所示吸附单元的结构示意图，图3为图1所示控制单元的结构示意图。如图1-3所示，所述假压头包括吸附单元100和控制单元，所述吸附单元100包括至少两个真空吸附结构，每个所述真空吸附结构包括气路101以及至少一个气孔102，所述气路101与所述气孔102连通。参见图1-2，所述真空吸附结构的数量为3个，所述待吸附目标物为COF(Chip On Flex or Chip On Film，覆晶薄膜)或者FPC (Flexible Printed Circuit，柔性电路板)。
本实施例中，所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制，所述吸附单元100在所述控制单元的控制之下对待吸附目标物进行吸附动作。以3个真空吸附结构为例进行具体说明，当待吸附的电路板的尺寸较大时，所述控制单元可以控制3个真空吸附结构全部形成真空环境，利用3个真空吸附结构对电路板进行吸附动作。当待吸附的电路板的尺寸较小时，所述控制单元可以控制3个真空吸附结构之中的一部分(一个或两个真空吸附结构)形成真空环境，利用3个真空吸附结构之中的一部分对电路板进行吸附动作，以此方式来使得假压头适应不同尺寸的电路板。因此，本实施例提供的假压头不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。同时，也可以避免由于治具的拆卸安装给产线的管理与维护带来的不便。
参见图1和图3，所述控制单元包括对应设置的至少一个阀门结构200和至少一个真空泵301，所述阀门结构200和所述真空泵301分别与对应的真空吸附结构的气路101连接。所述阀门结构200和所述真空泵301对所述真空吸附结构的真空环境的形成进行控制。具体来说，当所述阀门结构200打开时，所述气路101与所述真空泵进行连通，根据是否进行吸附操作的需要将气体泵入所述气路101消除所述真空吸附结构的真空环境或者对所述真空吸附结构进行抽真空以用于吸附电路板。当所述阀门结构200关闭时，所述气路101与所述真空泵进行隔离，此时气路101处于密封状态，保持现有环境。可选的，所述阀门结构200为电磁阀，所述真空吸附结构的数量为3个，所述阀门结构200的数量为3个，即，可以设置数量相等且一一对应的阀门结构和真空吸附结构。但是本发明不限于此，例如可以设置三个真空吸附结构和两个阀门结构，其中一个阀门结构配置为同时对两个真空吸附结构的真空环境的形成进行控制，例如该阀门结构可以为二通阀。图1仅仅示出了一个真空泵301，但是本发明不限于此，例如，可以针对多个阀门结构中的每一个阀门结 构设置一个真空泵从而可以使得多个真空吸附结构快速切换状态。综上，本实施例提供的技术方案独立控制单个真空吸附结构，不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，还能够保证电路板的交接精度，有效提升设备嫁动率，有利于减少不良。
参见图3，所述阀门结构200包括控制模块201、阀门模块202以及管道203，所述阀门模块202分别与所述控制模块201和所述管道203连接，所述管道203与所述气路101连接。所述阀门模块202在所述控制模块201的控制之下对所述气路101与真空泵之间的连通进行开关动作。所述真空泵根据所述阀门模块202的开关动作和是否吸附物体的需要对所述真空吸附结构内部环境进行改变(抽真空或者消除真空环境)。本实施例中，当所述控制模块201控制所述阀门模块202打开时，所述气路101与真空泵进行连通，此时根据需要可以利用真空泵301通过所述管道203向所述气路101泵入气体从而消除所述真空吸附结构的真空环境或者利用真空泵301对所述气路101抽真空以用于吸附物体。当所述控制模块201控制所述阀门模块202关闭时，所述气路101与真空泵301进行隔离，此时气路101处于密封状态，保持现有环境。
本实施例提供的假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通。所述控制单元用于根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制，所述吸附单元用于在所述控制单元的控制之下对待吸附目标物进行吸附动作。本实施例提供的技术方案根据待吸附的电路板的尺寸对真空吸附结构的吸附功能进行调节，使得假压头适应不同尺寸的电路板。因此，本实施例提供的假压头不需要根据待吸附的电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。同时，也可以避免由于治具的拆卸安装给产线的管理与维护带来的不便。另外，通过独立控制单个真空吸附结构，不仅能够最大限度地满足使用要求，而且还能够保证电路板的交接精度，有效提升设备嫁动率，有 利于减少不良。
实施例二
图4为本发明实施例二提供的一种假压头的工作方法的流程图。如图4所示，所述假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通。所述假压头的工作方法包括：
步骤1001、所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制。
步骤1002、所述吸附单元在所述控制单元的控制之下对待吸附目标物进行吸附动作。
参见图1-3，所述真空吸附结构的数量为3个，所述待吸附目标物为COF(Chip On Flex or Chip On Film，覆晶薄膜)或者FPC(Flexible Printed Circuit，柔性电路板)。以3个真空吸附结构为例进行具体说明，当待吸附的电路板的尺寸较大时，所述控制单元可以控制3个真空吸附结构全部形成真空环境，利用3个真空吸附结构对电路板进行吸附动作。当待吸附的电路板的尺寸较小时，所述控制单元控制3个真空吸附结构之中的一部分形成真空环境，利用3个真空吸附结构之中的一部分对电路板进行吸附动作，使得假压头适应不同尺寸的电路板。因此，本实施例提供的假压头不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。同时，也可以避免由于治具的拆卸安装给产线的管理与维护带来的不便。
参见图1，所述控制单元包括对应设置的至少一个阀门结构200和至少一个真空泵301，所述阀门结构200和所述真空泵301分别与对应的真空吸附结构的气路101连接。所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制的步骤包括：所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制。可选的，所述阀门结构和所述真空 泵对所对应的真空吸附结构的真空环境的形成进行控制的步骤包括：当所述阀门结构打开时，所述气路与所述真空泵进行连通，以使所述真空泵对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境；当所述阀门结构关闭时，所述气路与所述真空泵进行隔离，以保持所述真空吸附结构的现有环境。具体来说，当所述阀门结构200打开时，所述气路101与真空泵301进行连通，此时可以根据需要将气体泵入所述气路101从而消除所述真空吸附结构的真空环境或者对所述气路101进行抽真空。当所述阀门结构200关闭时，所述气路101与所述真空泵301进行隔离，此时气路101处于密封状态，以保持现有环境。可选的，所述阀门结构200为电磁阀，所述真空吸附结构的数量为3个，所述阀门结构200的数量为3个。因此，本实施例提供技术方案通过独立控制单个真空吸附结构，不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，还能够保证电路板的交接精度，有效提升设备嫁动率，有利于减少不良。
参见图3，所述阀门结构200包括控制模块201、阀门模块202以及管道203，所述阀门模块202分别与所述控制模块201和所述管道203连接，所述管道203与所述气路101连接。所述阀门结构和所述真空泵对所述真空吸附结构的真空环境的形成进行控制的步骤包括：所述阀门模块在所述控制模块的控制之下对所述气路与真空泵之间的连通进行开关动作；所述真空泵根据是否进行吸附操作的需要对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境。本实施例中，当所述控制模块201控制所述阀门模块202打开时，所述气路101与真空泵301进行连通，将气体通过所述管道203泵入所述气路101，从而消除所述真空吸附结构的真空环境或者将所述气路101抽真空以进行吸附操作。当所述控制模块201控制所述阀门模块202关闭时，所述气路101与所述真空泵301进行隔离，此时气路101处于密封状态，以保持当前环境。
本实施例提供的假压头的工作方法之中，所述假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气 孔连通。所述控制单元用于根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制，所述吸附单元用于在所述控制单元的控制之下对待吸附目标物进行吸附动作。本实施例提供的技术方案根据待吸附的电路板的尺寸对真空吸附结构的吸附功能进行调节，使得假压头适应不同尺寸的电路板。因此，本实施例提供的假压头不需要根据电路板的尺寸更换治具，从而实现了通用化的目的，提高了生产效率，减少了电路板的抛料率，降低了采购成本。同时，也可以避免由于治具的拆卸安装给产线的管理与维护带来的不便。另外，通过独立控制单个真空吸附结构，不仅能够最大限度地满足使用要求，而且还能够保证电路板的交接精度，有效提升设备嫁动率，有利于减少不良。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (16)

  1. 一种假压头，包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通；
    所述控制单元配置为根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制；
    所述吸附单元配置为在所述控制单元的控制之下对待吸附目标物进行吸附动作。
  2. 根据权利要求1所述的假压头，其中，所述控制单元包括对应设置的至少一个阀门结构和至少一个真空泵，所述阀门结构和所述真空泵分别与对应的真空吸附结构的气路连接；
    所述阀门结构和所述真空泵配置为对所对应的真空吸附结构的真空环境的形成进行控制。
  3. 根据权利要求2所述的假压头，其中，所述阀门结构配置为：
    当打开时，所对应的真空吸附结构的气路与所述真空泵进行连通，以使所述真空泵对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境；
    当关闭时，所对应的真空吸附结构的气路与所述真空泵进行隔离，以保持所对应的真空吸附结构的现有环境。
  4. 根据权利要求2所述的假压头，其中，所述阀门结构包括控制模块、阀门模块以及管道，所述阀门模块分别与所述控制模块和所述管道连接，所述管道与所对应的真空吸附结构的气路连接；
    所述阀门模块配置为在所述控制模块的控制之下对所对应的真空吸附结构的气路与所述真空泵之间的连通进行开关动作；
    所述真空泵配置为根据需要对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境。
  5. 根据权利要求2所述的假压头，其中，所述阀门结构为电磁阀。
  6. 根据权利要求1所述的假压头，其中，所述真空吸附结构的数量为3个。
  7. 根据权利要求2所述的假压头，其中，所述真空吸附结构的数量为3个，所述阀门结构的数量为3个。
  8. 根据权利要求2所述的假压头，包括一个真空泵，其与所述至少两个真空吸附结构的气路分别连接。
  9. 根据权利要求2所述的假压头，包括数量相等且一一对应设置的阀门结构和真空泵。
  10. 根据权利要求1所述的假压头，其中，所述待吸附目标物为覆晶薄膜或者柔性电路板。
  11. 一种假压头的工作方法，其中，所述假压头包括吸附单元和控制单元，所述吸附单元包括至少两个真空吸附结构，每个所述真空吸附结构包括气路以及至少一个气孔，所述气路与所述气孔连通；
    所述假压头的工作方法包括：
    所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制；
    所述吸附单元在所述控制单元的控制之下对待吸附目标物进行吸附动作。
  12. 根据权利要求11所述的假压头的工作方法，其中，所述控 制单元包括对应设置的至少一个阀门结构和至少一个真空泵，所述阀门结构和所述真空泵分别与对应的真空吸附结构的气路连接；
    所述控制单元根据待吸附目标物的尺寸分别对每个所述真空吸附结构的真空环境的形成进行控制的步骤包括：
    所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制。
  13. 根据权利要求12所述的假压头的工作方法，其中，所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制的步骤包括：
    当所述阀门结构打开时，所对应的真空吸附结构的气路与所述真空泵进行连通，以使所述真空泵对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境；
    当所述阀门结构关闭时，所对应的真空吸附结构的气路与所述真空泵进行隔离，以保持所对应的真空吸附结构的现有环境。
  14. 根据权利要求12所述的假压头的工作方法，其中，所述阀门结构包括控制模块、阀门模块以及管道，所述阀门模块分别与所述控制模块和所述管道连接，所述管道与所对应的真空吸附结构的气路连接；
    所述阀门结构和所述真空泵对所对应的真空吸附结构的真空环境的形成进行控制的步骤包括：
    所述阀门模块在所述控制模块的控制之下对所对应的真空吸附结构的气路与所述真空泵之间的连通进行开关动作；
    所述真空泵根据需要对所述真空吸附结构抽真空或者消除所述真空吸附结构的真空环境。
  15. 根据权利要求12所述的假压头的工作方法，其中，所述阀门结构为电磁阀。
  16. 根据权利要求11所述的假压头的工作方法，其中，所述待吸附目标物为覆晶薄膜或者柔性电路板。
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