WO2017143966A1 - 具有捕尘结构的摄像模组 - Google Patents
具有捕尘结构的摄像模组 Download PDFInfo
- Publication number
- WO2017143966A1 WO2017143966A1 PCT/CN2017/074267 CN2017074267W WO2017143966A1 WO 2017143966 A1 WO2017143966 A1 WO 2017143966A1 CN 2017074267 W CN2017074267 W CN 2017074267W WO 2017143966 A1 WO2017143966 A1 WO 2017143966A1
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- WO
- WIPO (PCT)
- Prior art keywords
- dust collecting
- filter
- collecting structure
- camera module
- boss
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
- G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Definitions
- the present invention relates to the field of camera modules. More specifically, the present invention relates to a camera module having a dust collecting structure to improve imaging quality and production yield of the camera module.
- camera modules/modules have been widely used in various fields of society, such as laptops, mobile phones, medical endoscopes, real-time detection of industrial manufacturing products or security monitoring.
- CMOS Camera Module or CCM for short, is the core device used in various new generations of portable camera equipment. Compared with traditional camera systems, it has the advantages of miniaturization, low power consumption, low cost and high image quality. .
- the conventional high-pixel CSP process camera module is composed of a photosensitive chip, a lens assembly + a filter, a motor, a motor base, and a planar substrate.
- An electrical signal generated by the photosensitive chip is outputted outward through a connection point on the bottom of the chip and the planar substrate, the filter is bonded to the lens assembly, and the motor base is bonded on the planar substrate The motor is bonded above the base.
- the stains and dead pixels of the finished camera module are a very important factor leading to poor quality of the camera module, wherein a large part of the stain is caused by the movable or non-movable particles attached to the filter, and the bad A large part of the dots are also caused by the attachment of movable or non-movable particles to the photosensitive chip.
- the invention is characterized in that the sealing layer and the protective layer are disposed on the photosensitive chip to increase the imaging distance, so that the size of the particles such as dust falling on the protective layer is greater than 30 um, so as to image, thereby solving the camera module. Imaging problem.
- the method belongs to a palliative problem, and increases the imaging distance, thereby making dust of a smaller size, etc.
- Particles are not imaged, but particulate matter such as dust is still present, and the imaging effect of particles such as dust is related to the specific position of the particles such as dust and the angle of imaging, and the above invention
- the above invention does not image the particles of a smaller size such as dust by increasing the imaging distance, it does not ensure that particles of such smaller size dust are not changed by the position or the angle of imaging. Zoom in and image it out.
- the structure and preparation method of the dust-proof camera module provided by the above invention are relatively complicated.
- the dustproof structure of the camera module, which is usually disposed inside the motor.
- the dustproof structure has a certain preventive effect on the movable particles generated by the camera module during operation, but cannot be completely prevented.
- the dust-proof structure has no effect on the movable particles or non-movable particles that have been inserted during the assembly of the camera module, and the movable or non-movable particles may fall on the filter in the camera module or
- the surface of the sensor chip causes stains or bad dots in the camera module.
- the dustproof structure disposed inside the motor can prevent a part of the movable particles from entering the surface of the photosensitive chip during the operation of the camera module, but has no effect on the movable particles that have entered the surface of the photosensitive chip. .
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having a dust collecting structure can adsorb movable particles such as dust and debris around the filter in the camera module. Therefore, the surface of the filter is prevented from falling due to the random movement of the movable particles such as dust and debris, thereby causing the camera module to generate stains.
- An object of the present invention is to provide a camera module having a dust-collecting structure, wherein the camera module having a dust-collecting structure can adsorb particles, such as dust and debris, into the camera module, thereby avoiding dust and debris. Particulate matter such as chips falls on the surface of the filter to cause a bad stain or fall on the surface of the photosensitive chip in the image pickup module to cause a bad dot defect.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having a dust collecting structure can prevent movable particles such as dust and debris from passing through the filter in the camera module.
- the gap between the sheet and the photosensitive chip enters the inside of the camera module, thereby preventing the camera module from being stained or badly damaged due to the random movement of the movable particles such as the dust.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having a dust collecting structure can capture particles such as dust and debris around the photosensitive chip inside the camera module, thereby avoiding The movable particles such as dust and debris fall into the surface of the photosensitive chip to cause a bad point.
- An object of the present invention is to provide a camera module having a dust collecting structure, and the camera module having the dust collecting structure can not only improve the stability of the lens holder and the filter in the camera module, but also avoid Movable particles such as dust and debris fall into the surface of the filter to cause poor staining.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having a dust collecting structure can prevent movable particles such as dust and debris from passing through a motor casing in the camera module. Falling into the surface of the filter or the photosensitive chip, resulting in poor staining or bad pixels of the camera module.
- An object of the present invention is to provide a camera module having a dust-collecting structure, which has water washing resistance and baking resistance, and can still be adhered after repeated washing and baking.
- a movable particulate matter such as dust, debris, or the like on the surface of the filter or the surface of the photosensitive chip.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having a dust collecting structure can capture movable particles such as dust and debris entering the camera module, thereby avoiding dust.
- the movable particles such as debris may form a bad spot on the surface of the filter or may form a bad spot on the surface of the photosensitive chip.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having the dust collecting structure can not only adhere to movable particles such as dust and debris around the filter, but also Further opaque, can block or absorb Stray light can also have the characteristics of non-reflective.
- An object of the present invention is to provide a camera module having a dust collecting structure, wherein the camera module having the dust collecting structure can not only adhere to movable particles such as dust and debris around the photosensitive chip, but also has The light transmission performance can block or absorb stray light, and it can also have the characteristics of non-reflective light.
- the present invention provides a camera module having a dust collecting structure, comprising: a lens, a sensor chip, a lens holder, a filter, and at least one dust collecting structure having a viscosity, wherein the filter a light sheet is mounted on the lens holder, the lens is located in a photosensitive path of the photosensitive chip, and the dust collecting structure is disposed in the camera module for capturing movable particles in the camera module .
- the filter may be mounted on the lens or mounted on a motor or attached to the photosensitive chip, and the lens holder is integrally packaged in the Photosensitive chip and the filter.
- the position of the dust-collecting structure is selected from one or more combinations of the following structures:
- the dust collecting structure extends between the filter and the mirror holder and covers an outer edge fixed to a top surface of the filter, and does not affect an optical path incident on the photosensitive chip
- the longitudinal section of the lens holder includes a first protrusion and a second protrusion, and two ends of the longitudinal section of the filter are respectively fixed to the top surface or the bottom of the first protrusion and the second protrusion surface;
- the dust collecting structure is fixed to an outer edge of a top surface of the filter and does not affect an optical path incident on the photosensitive chip
- the longitudinal section of the lens holder includes a first boss and a second protrusion The two ends of the longitudinal section of the filter are respectively fixed to the top surface or the bottom surface of the first boss and the second boss;
- the dust collecting structure extends between the filter and the mirror holder and covers an outer edge of a bottom surface of the filter, and is fixed to a bottom surface of the filter, the lens holder
- the longitudinal section includes a first protrusion and a second protrusion, and the two ends of the longitudinal section of the filter are respectively fixed to the top surface or the bottom surface of the first protrusion and the second protrusion;
- the dust collecting structure is disposed on an outer edge of the bottom surface of the filter and does not affect an optical path incident on the photosensitive chip
- the longitudinal section of the lens holder includes a first boss and a second protrusion The two ends of the longitudinal section of the filter are respectively fixed to the top surface or the bottom surface of the first boss and the second boss;
- the dust collecting structure is filled in a gap between the filter and the mirror base;
- the longitudinal section of the dust-removing structure is L-shaped, having a vertical portion and a horizontal portion, the vertical portion being fixed between the outer peripheral surface of the filter and the inner surface of the lens holder, The horizontal portion is fixed to a gap between the outer edge of the bottom surface of the filter and the lens holder, and the longitudinal section of the lens holder includes a first boss and a second boss, and the filter Both ends of the longitudinal section of the sheet are respectively fixed to the top surface or the bottom surface of the first boss and the second boss.
- the dust collecting structure has a cylindrical shape and is fixed between the outer peripheral surface of the filter and the inner surface of the lens holder.
- the longitudinal section of the lens holder includes a first boss and a second boss. The two ends of the longitudinal section of the filter are respectively fixed to the top surface or the bottom surface of the first boss and the second boss.
- the dust collecting structure is fixed to one or more partial regions, or all regions, of the inner surface of the mirror mount.
- the dust collecting structure is located on the inner side surface of the lens holder between the filter and the photosensitive chip, wherein the longitudinal section of the lens holder comprises a first boss and a second boss, the filter Both ends of the longitudinal section of the sheet are respectively fixed to the top surface or the bottom surface of the first boss and the second boss.
- the camera module further includes a motor including a motor housing and a mover, the motor housing is extended upwardly on the lens holder, and the dust collecting structure is configured to capture the motor housing and the movement a movable particle in a gap between the sub-substrates, wherein the longitudinal section of the lens holder includes a first boss and a second boss, the motor housing integrally extending or being assembled to the lens holder, the catch a dust structure is fixed at an intersection of the first boss and the second boss with an inner side of the motor casing;
- the camera module with a dust collecting structure further includes a circuit board, the photosensitive chip is electrically connected to the circuit board, wherein the dust collecting structure is disposed on the circuit board corresponding to the photosensitive chip An area in which the circuit board is integrated with a plurality of integrated circuit components, wherein the integrated circuit component located at a periphery of the photosensitive chip is selectively covered by the dust collecting structure;
- the photosensitive chip comprises a photosensitive area and a logic area, wherein the circuit board is integrated with a plurality of integrated circuit components, wherein the integrated circuit component at a periphery of the photosensitive area of the photosensitive chip is Optionally being coated by the dust capture structure;
- the circuit board is integrated with a gold wire, one end of the gold wire is connected to the circuit board, and the other end of the gold wire is connected to the logic area of the photosensitive chip, wherein the dust collecting structure is located a periphery of the photosensitive region of the photosensitive chip and covering the gold wire;
- the dust collecting structure is disposed on a non-photosensitive area of a top surface of the photosensitive chip.
- the dust collecting structure is a viscous gel layer.
- the dust collecting structure can remain viscous after being solidified, washed with water, and baked.
- the gelatinous layer is preferably a UV glue, a thermosetting glue, a naturally drying type glue or a double-sided adhesive.
- the gel layer is a light transmissive material.
- the gel layer is an opaque material to further provide stray light blocking properties.
- the gel layer is an opaque material which does not reflect light, or a dark color absorbing light irradiated onto the surface thereof, or the surface roughness does not form a specular reflection on the light irradiated to the surface thereof. Provides performance that does not reflect light, absorb stray light, or block stray light.
- the dust collecting structure is formed inside the camera module by a dispensing, gluing, dispensing, printing or attaching process.
- the gelatinous layer is further embodied as a black glue layer.
- a filter having a dust collecting structure applied to a camera module comprising a filter and a dust collecting structure having a viscosity, the filter being suitable for application a camera module having a photosensitive chip, wherein the dust collecting structure is disposed on the filter and does not affect an optical path irradiated to the photosensitive chip, and the dust collecting structure is configured to adsorb and drop on the filter.
- the movable particles on the surface of the light sheet prevent the movable stain image from appearing inside the camera module.
- the dust collecting structure is disposed on an outer edge of the top surface or/and the bottom surface of the filter. Or preferably, the dust collecting structure is provided on an outer peripheral surface of the filter.
- the present invention further provides a lens holder having a dust collecting structure applied to a camera module, comprising a lens holder and a dust collecting structure having a viscosity, the lens holder being suitable for installation A filter of a camera module, wherein the dust collecting structure is configured to adsorb movable particles inside the lens holder to prevent movable stain imaging from occurring inside the camera module.
- the dust collecting structure is disposed on one or more partial regions of the inner surface of the lens holder or on all inner surfaces of the lens holder.
- the lens holder comprises a top side mirror base portion, an intermediate mirror seat portion and a bottom side mirror seat portion, wherein the top side mirror base portion forms a top side groove, and the intermediate mirror seat portion is formed a through hole, the bottom side mirror base portion forming a bottom side groove, wherein the intermediate mirror seat portion protrudes inwardly with respect to the top side mirror base portion and the bottom side mirror base portion to form a convex portion a stage such that an inner diameter of the through hole is smaller than an inner diameter of the top side groove and the bottom side groove, wherein the filter is adapted to be mounted to the top side groove or the bottom side groove Inside.
- the dust collecting structure is disposed at a part or the whole of an inner surface of the top side mirror portion, a part or all of a top surface of the boss of the intermediate mirror portion, and the intermediate mirror a partial or full area of the inner surface of the boss of the seat, a partial or full area of the bottom surface of the boss of the intermediate mirror portion, or a partial or inner surface of the bottom side mirror portion All areas, or a combination of the above two.
- the dust collecting structure fills a gap between the lens holders of the filter.
- it further includes a motor housing, wherein the motor housing extends to the mirror mount, and the dust collecting structure is disposed inside the motor housing and on a top side of the lens holder.
- the present invention further provides a circuit board having a dust collecting structure applied to a camera module, comprising a circuit board and a dust collecting structure having a viscosity, the circuit board being suitable for electrical connection a photosensitive chip of a camera module, wherein the dust collecting structure is disposed on an area of the circuit board corresponding to the mounting of the photosensitive chip to adsorb movable particles inside the camera module to prevent the image capturing module Moving stain imaging occurs inside the group.
- the circuit board is integrated with a plurality of integrated circuit components, wherein the integrated circuit components are also selectively covered by the dust collecting structure.
- the present invention further provides a photosensitive chip having a dust collecting structure applied to a camera module, comprising a photosensitive chip and a dust collecting structure having a viscosity, wherein the dust collecting structure is disposed at the The non-photosensitive area of the top surface of the photosensitive chip is used to adsorb the movable particles dropped to the top surface of the photosensitive chip.
- the dust collecting structure may further extend to an outer peripheral surface of the photosensitive chip.
- the present invention further provides a motor having a dust collecting structure applied to a camera module, comprising a motor and a dust collecting structure having a viscosity, the dust collecting structure being disposed inside the motor
- the movable dust particles are used to adhere to the movable particles entering the camera module through the internal gap of the motor, and the dust collecting structure is a gel layer, which is a UV glue, a thermosetting glue, a natural dry type glue or a double-sided adhesive. Glue, which remains tacky after curing, water washing, and baking.
- the camera module with the dust-collecting structure of the present invention can prevent the movable particles such as dust and debris from falling on the surface of the filter, thereby causing the image of the movable particles of dust, debris and the like to be imaged.
- the camera module becomes poor in staining, and prevents movable particles such as dust and debris from entering the surface of the image sensor module and falling into the surface of the photosensitive chip, thereby causing stains of movable particles such as dust and debris to be imaged.
- the camera module with the dust collecting structure of the present invention can not only increase the stability, but also can be a certain degree compared with the camera module of the prior art. The stray light incident on the photosensitive chip is shielded, thereby further improving the imaging effect of the camera module.
- FIG. 1 is a partial cross-sectional view showing a first embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 2 is a partial cross-sectional view showing a second embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG 3 is a partial cross-sectional view showing a third embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 4 is a partial cross-sectional view showing a fourth embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 5 is a schematic cross-sectional structural view showing a fourth embodiment of a camera module having a dust collecting structure according to the present invention.
- FIG. 6 is a partial cross-sectional view showing a fifth embodiment of a camera module having a dust collecting structure according to the present invention, showing the sensor chip, the circuit board circuit board, the integrated circuit component, and the capture The structure and positional relationship of the dust structure.
- FIG. 7 is a partial cross-sectional view showing a sixth embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 8 is a partial cross-sectional view showing a seventh embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 9 is a partial cross-sectional view showing an eighth embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 10 is a partial cross-sectional view showing a ninth embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- Figure 11 is a partial cross-sectional view showing a tenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the structure and positional relationship of the lens holder, the filter, and the dust collecting structure.
- FIG. 12 is a schematic cross-sectional structural view showing a tenth embodiment of a camera module having a dust collecting structure according to the present invention.
- FIG. 13 is a partial cross-sectional view showing an eleventh embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder, the motor housing, the mover, and the dust collecting structure. Structure and positional relationship.
- FIG. 14 is a schematic cross-sectional structural view showing an eleventh embodiment of a camera module having a dust collecting structure according to the present invention.
- FIG. 15 is a cross-sectional structural view showing a twelfth embodiment of a camera module having a dust collecting structure according to the present invention.
- 16 is a cross-sectional structural view showing a thirteenth embodiment of a camera module having a dust collecting structure according to the present invention.
- Fig. 17 is a view showing the structure of a photosensitive chip having a dust collecting structure according to the thirteenth embodiment.
- FIG. 18 is a partial cross-sectional view showing a fourteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip, the circuit board, the gold wire, and the integrated circuit component. And the structure and positional relationship of the dust collecting structure.
- FIG. 19 is a partial cross-sectional view showing a fifteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip, the circuit board, the gold wire, and the integrated circuit component. And the structure and positional relationship of the dust collecting structure.
- FIG. 20 is a partial cross-sectional view showing a sixteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip, the circuit board, the gold wire, and the integrated circuit component. And the structure and positional relationship of the dust collecting structure.
- 21 is a partial cross-sectional view showing a seventeenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip, the circuit board, the gold wire, and the integrated circuit component. And the structure and positional relationship of the dust collecting structure.
- FIG. 22 is a schematic diagram of a camera module according to an eighteenth preferred embodiment of the present invention.
- Figure 23 is a view showing a first alternative embodiment of the camera module of the above-described eighteenth preferred embodiment of the present invention.
- Figure 24 is a diagram showing a second alternative embodiment of the camera module of the above-described eighteenth preferred embodiment of the present invention.
- Figure 25 is a schematic illustration of a camera module of a nineteenth preferred embodiment of the present invention.
- Figure 26 is a first alternative embodiment of the camera module of the above-described nineteenth preferred embodiment of the present invention.
- Figure 27 is a second alternative embodiment of the camera module of the above-described nineteenth preferred embodiment of the present invention.
- Figure 28 is a schematic illustration of a camera module of a twentieth preferred embodiment of the present invention.
- Figure 29 is an alternative embodiment of the camera module of the above-described twentieth preferred embodiment of the present invention.
- Figure 30 is a schematic illustration of a camera module of a twenty-first preferred embodiment of the present invention.
- Figure 31 is an alternative embodiment of the camera module of the twenty-first preferred embodiment of the present invention.
- 32 is a schematic diagram of a camera module according to a twenty-second preferred embodiment of the present invention.
- the camera module with a dust collecting structure includes a lens holder, a filter, a photosensitive chip, a circuit board, a lens and a dust collecting structure, wherein the circuit board is integrally integrated with the substrate a plurality of integrated circuit components, the filter is horizontally connected to the lens holder and located above the photosensitive chip, and the circuit board is electrically connected to the photosensitive chip.
- the camera module may be a fixed focus camera module or a moving focus camera module.
- the camera module further includes a motor as a focus drive mechanism.
- the lens holder is fixedly connected to the motor for being used as the camera module bracket, and the lens is disposed on the motor to enable the motor to drive the lens to focus on the camera module.
- the dust collecting structure is disposed on the camera module for capturing movable particles such as dust and debris, thereby preventing particles such as dust and debris from being stained on the camera module.
- FIG. 1 is a partial cross-sectional structural view showing a first embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101 and the filter 102. And a positional relationship of the dust collecting structure 110.
- the lens holder 101 has an annular structure with a through hole therebetween to enable light passing through the lens 108 to reach the photosensitive chip 103.
- the mirror mount 101 further functions to support the filter 102.
- the slit mask of the lens holder 101 has a first boss 1011 and a second boss 1012.
- first and second The bosses 1011 and 1012 may be two portions of an integral annular boss, or may be two separate portions of the segmented plurality of boss portions, and the invention is not limited. In the preferred embodiment, the first and second bosses 1011 and 1012 are two portions of an integral annular boss.
- the first boss 1011 and the second boss 1012 are symmetrical to each other, and the slit mask of the filter 102 has a first end 1021 and a second end 1022, and the longitudinal section of the filter 102
- the first end 1021 is fixed to a top surface of the first boss 1011 of the longitudinal section of the lens holder 101, and the second end 1022 of the longitudinal section of the filter 102 is fixed to the lens holder 101.
- the dust collecting structure 110 is disposed on a periphery of a top surface of the filter 102 and a gap between the filter 102 and the lens holder 101, It is used to capture movable particles such as dust and debris, thereby preventing movable particles such as dust and debris from entering the interior of the camera module 10.
- the dust collecting structure 110 is an inverted annular L-shaped structure. As shown in FIG. 1 , the longitudinal section of the dust collecting structure 110 includes a vertical portion 1101 and a horizontal portion 1102. The straight portion 1101 is inserted into a gap between the first end 1021 of the filter 102 and the lens holder 101 and the second end 1022 of the filter 102 and the lens holder 101, respectively. The horizontal portion 1102 is overlapped with the first end 1021 of the filter 102 and the top surface of the second end 102, respectively, and the dust-preventing structure 110 neither blocks the light path incident on the photosensitive chip. It is also possible to stick the movable particles dropped on the top surface of the filter 102, thereby preventing the movable image of the inside of the camera module 10 from appearing.
- the dust collecting structure 110 includes an annular vertical portion and an annular horizontal portion, the annular vertical portion being located at the outer periphery of the filter 102 and Between the inner surfaces of the lens holder 101 and above the bosses 1011 and 1012, the annular horizontal portion is located at the outer edge of the top surface of the filter 102, and does not block the injection.
- the optical path of the photosensitive chip is located at the outer edge of the top surface of the filter 102, and does not block the injection.
- the dust-preventing structure 110 of the annular L-shaped structure is viscous, capable of adhering to movable particles such as dust and debris on the surface of the filter 102, and is intended to pass through the filter 102 and the
- the inverted annular L-shaped dust collecting structure 110 is formed as a viscous gel layer because of the gelatinous shape.
- the layer is viscous, so that movable particles such as dust can be adhered and fixed, so that movable stain imaging can be prevented from occurring inside the camera module 10.
- the gel layer as the inverted annular L-shaped dust collecting structure 110 may be a light transmissive material or may be implemented as an opaque material.
- the opaque gel-like material is capable of blocking stray light that would otherwise be emitted onto the lens holder 101 to the photosensitive chip, and at the same time
- the properties of the material can fix the movable particles such as dust and debris, thereby reducing the generation of stains.
- the opaque gel layer of the dust-preventing structure 110 can remain viscous after curing, thereby adhering the movable particles such as dust and firmly fixing them.
- the opaque gel-like material has water washing and baking resistance characteristics, in other words, the opaque gel layer as the dust collecting structure 110 is washed or baked one or more times. It remains tacky and has a stable composition that retains its viscosity for a long time.
- the opaque gel layer may have opaque, non-reflective light, or a dark color that absorbs light that strikes the surface, or has a rough surface, and thus does not form a specular reflection effect on light that impinges on its surface.
- the opaque gel material as the dust collecting structure 110 has a property of blocking stray light, absorbing stray light, or not reflecting stray light.
- the gel layer of the dust-preventing structure 110 is further formed by a liquid colloid, and the gel-like coating formed by the liquid colloid is opaque. Since the gel-like substance has adhesiveness and the opaque object has opacity, the gel-like layer as the dust-collecting structure 110 can not only adhere to movable particles such as dust and debris, but also Block stray light.
- the gel layer as the dust collecting structure 110 may also be formed to be formed by a UV type glue which is cured by ultraviolet light exposure. However, it is still viscous, so that it is possible to adhere to movable particles such as dust, and at the same time, since the opaque gel layer is opaque, it can block stray light, and thus the gel as the dust collecting structure 110 The layer not only adheres to movable particles such as dust, but also blocks stray light.
- the gel layer as the dust collecting structure 110 may also be formed to be formed by a thermosetting glue, the thermosetting glue After baking and heating, it solidifies, but it still has viscosity, so it can adhere to movable particles such as dust and debris. At the same time, since the opaque gel layer is opaque, it can block stray light. The gel layer of the dust collecting structure 110 can not only adhere to movable particles such as dust and debris, but also block stray light.
- the gel layer as the dust collecting structure 110 may also be formed to be formed by a sticker which is in the form of a sheet and double-sided It has a viscosity, so that it can adhere to movable particles such as dust, and at the same time, since the gel layer is opaque, it can block stray light, so the gel layer as the dust collecting structure 110 can not only adhere to dust or the like. Move particles and block stray light.
- a specific embodiment and type of the gel layer as the dust collecting structure 110 can be determined by a person skilled in the art according to actual conditions, for example, by natural drying or curing type glue or other reagents, and placed after coating.
- the characteristics of the movable particles are all within the scope of the present invention, and the specific embodiments of the present invention are not limited thereto.
- the gel layer as the dust collecting structure 110 can be embodied as a black colloid, which can provide opacity performance, and is in the process of making or using the camera module. It can be used to adhere to movable particles such as dust and debris.
- Those skilled in the art can determine the specific type of the dust collecting structure 110 according to the specific disclosure of the present invention. In other words, as long as the technical solution identical or similar to the present invention is adopted, the technical problem that is the same as or similar to the present invention is solved, and the technical effects identical or similar to those of the present invention are achieved, and are all within the scope of protection of the present invention.
- the specific implementation means of the present invention are not limited thereto.
- the top side of the lens holder 101 has a stepped shape, and the filter 102 is located in a groove formed by the top side step, and a bottom surface thereof may be bonded to the lens holder.
- the annular boss of 101 is bonded and fixed to the lens holder 101.
- the outer edge region and the outer peripheral surface of the top surface of the filter 102 are formed with a gel-like dust-removing structure 110, which is cured, washed, After the baking process, the adhesive remains viscous, thereby adsorbing the movable particles above the filter 102, preventing the movable particles from falling into the effective working area of the filter 102, so as to prevent the inside of the camera module from appearing. Move the stain image.
- the dust collecting structure 110 may be formed on the top surface of the filter 102 by various methods such as dispensing, gluing, spraying, printing, attaching, etc. during the manufacturing process of the filter 102.
- the outer peripheral surface, however, the filter 102 having the dust collecting structure 110 is assembled to the mirror mount 101.
- a gel material may also be applied to the outer edge region of the top surface of the filter 102 and the filter 102 and the lens holder during assembly of the filter 102 to the lens holder 101.
- the gap between the 101, and then after natural curing or other curing means such as ultraviolet curing, heat curing, the dust collecting structure 110 is still sticky, so as to adhere to the movable particles such as dust, debris, etc., and
- the material of the dust collecting structure 110 may be a light transmissive material or an opaque material, and the opaque material can further function to block stray light.
- FIG. 2 is a partial cross-sectional structural view showing a second embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101A, the filter 102A, and the catch.
- the positional relationship of the dust structure 110A in the second embodiment of the present invention, the slit mask of the lens holder 101A has a first boss 1011A and a second boss 1012A, and the first boss 1011A and the second boss 1012A are symmetrical to each other.
- the longitudinal section of the filter 102A has a first end 1021A and a second end 1022A, and the first end 1021A of the longitudinal section of the filter 102A is fixed to the longitudinal section of the lens holder 101A.
- the top surface of the first boss 1011A, the second end 1022A of the longitudinal section of the filter 102A is fixed to the top surface of the second boss 1012A of the longitudinal section of the lens holder 101A,
- the dust collecting structure 110A is disposed on the outer periphery of the top surface of the filter 102A for capturing movable particles such as dust and debris, so that movable particles such as dust and debris prevent movable particles such as dust and debris from entering.
- the inside of the camera module 10A is disposed on the outer periphery of the top surface of the filter 102A for capturing movable particles such as dust and debris, so that movable particles such as dust and debris prevent movable particles such as dust and debris from entering.
- the dust collecting structure 110A has a ring-shaped structure, and a longitudinal section thereof is a horizontally straight strip shape, and the dust collecting structure 110A is respectively disposed on the filter 102A.
- the top surfaces of the one end 1021A and the second end 1022A are respectively overlapped with the first end 1021A and the second end 1022A of the filter 102A, so that the dust collecting structure 110A neither blocks the injection site
- the optical path of the photosensitive chip 103A can be adhered to the movable particles dropped on the top surface of the filter 102A, thereby preventing the movable image from being imaged inside the camera module 10A.
- the annular structure dust collecting structure 110A is adhesive, located at the outer edge of the top surface of the filter 102A, and does not block the light path incident on the photosensitive chip, which can adhere to the surface of the filter 102A. Movable particles such as dust, debris, and the like, more specifically, similarly in the second embodiment of the present invention, the dust collecting structure 110A is formed by a viscous gel layer, because the gel layer It is viscous, so that movable particles such as dust can be adhered and fixed, so that movable stain imaging can be prevented from occurring inside the camera module 10A.
- the viscous layer may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, or a self-drying glue, or may It is a viscous sheet-shaped self-adhesive which can maintain the viscosity after the curing, water washing and baking processes, and the specific material thereof may be the same as or similar to the material in the first embodiment described above, and details are not described herein again.
- a light-transmitting or opaque material which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, or a self-drying glue, or may It is a viscous sheet-shaped self-adhesive which can maintain the viscosity after the curing, water washing and baking processes, and the specific material thereof may be the same as or similar to the material in the first embodiment described above, and details are not described herein again.
- the dust-preventing structure 110A may be disposed only on the outer edge of the top surface of the filter 102A without being further disposed in the filter.
- the outer edge region of the top surface of the filter 102A is formed with a colloidal dust collecting structure 110A for adsorbing movable particles above the filter 102A to prevent the movable particles from falling into the filter 102.
- the dust-preventing structure 110A may be formed on the top surface of the filter 102A by various methods such as dispensing, gluing, spraying, printing, and attaching during the manufacturing process of the filter 102A. Outer edge, however, will have the filter of the dust capture structure 110A
- the 102A is assembled to the lens holder 101A. It is also possible to apply a gelatinous material to the outer edge region of the top surface of the filter 102 after assembling the filter 102A to the lens holder 101A, and then undergo natural curing or other curing means such as ultraviolet curing, heat. After curing, the dust-preventing structure 110A is still viscous, thereby functioning to adhere to movable particles such as dust and debris.
- the dust collecting structure 110A is an opaque material, and further provides a property of not reflecting stray light, absorbing stray light, or blocking stray light by not reflecting light, or absorbing light, or forming specular reflection.
- FIG. 3 is a partial cross-sectional structural view showing a third embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101B, the filter 102B, and the catch.
- the slit mask of the lens holder 101B has a first boss 1011B and a second boss 1012B, and the first boss 1011B and the second boss 1012B are symmetrical to each other.
- the longitudinal section of the filter 102B has a first end 1021B and a second end 1022B, and the first end 1021B of the longitudinal section of the filter 102B is fixed to the longitudinal section of the lens holder 101B.
- the bottom surface of the first boss 1011B, the second end 1022B of the longitudinal section of the filter 102B is fixed to the bottom surface of the second boss 1012B of the longitudinal section of the lens holder 101B,
- the dust collecting structure 110B is disposed at an outer edge of the bottom surface of the filter and a gap between the filter 102B and the lens holder 101B for capturing movable particles such as dust and debris, thereby preventing dust.
- the movable particles such as debris enter the inside of the camera module 10B.
- the dust-preventing structure 110B is a pair of L-shaped tubular structures. As shown in FIG. 3, the longitudinal section includes a vertical portion 1101B and a horizontal portion 1102B, and the vertical portions 1101B are respectively inserted and disposed. a gap between the first end 1021B of the filter 102B and the lens holder 101B and the second end 1022B of the filter 102 and the lens holder 101B, wherein the horizontal portion 1102B overlaps The first end 1021B of the filter 102B and the bottom surface of the second end 102B, so that the dust-preventing structure 110B neither blocks the light path incident on the photosensitive chip 103B, but also sticks to the falling The movable particles on the bottom surface of the filter 102B, as well as the movable particles that may fall to the photosensitive chip 103B, prevent the occurrence of movable stain imaging inside the camera module 10B.
- the L-shaped tubular structure is viscous, capable of adhering to movable particles such as dust and debris on the surface of the filter 102B, and is intended to pass through a gap between the filter 102B and the lens holder 101B.
- the L-shaped structure formed by the vertical portion 1101B and the horizontal portion 1102B may be integrally formed or spliced, as long as
- the dust-collecting structure 110B of the present embodiment can solve the same technical problem and achieve the same technical effect, and is within the protection scope of the present invention.
- the specific embodiment of the present invention is not limited thereto.
- the dust-collecting structure 110B of the L-shaped tubular structure is a viscous gel-like layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue or a thermoset. a type of glue, or a self-drying type of glue, or the like, or may be a double-sided adhesive sheet-like sticker, which can remain sticky after the curing, water washing and baking processes, and the specific material thereof may be the same as in the first embodiment described above. The materials are the same or similar and will not be described here.
- the bottom side of the lens holder 101B has a stepped shape, and the filter 102B is located in a groove formed by the bottom side step, and the top surface thereof can be bonded to the ring of the lens holder 101B.
- the bottom surface of the boss is bonded and fixed to the lens holder 101B, and the outer edge region and the outer peripheral surface of the bottom surface of the filter 102B are formed with a gel-like dust collecting structure 110B for adsorbing the filter.
- the movable particles above the sheet 102B prevent the movable particles from entering the effective working area of the filter 102B, and prevent the movable particles from falling onto the surface of the photosensitive chip, thereby preventing movable stain imaging inside the camera module. .
- the dust-preventing structure 110B may be formed on the bottom surface of the filter 102B by various methods such as dispensing, gluing, spraying, printing, and attaching during the manufacturing process of the filter 102B.
- the outer edge and the outer peripheral surface, however, the filter 102B having the dust collecting structure 110B is assembled to the mirror holder 101B.
- the dust collecting structure 110B When it is an opaque material, it can further provide the property of not reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or absorbing light, or forming specular reflection.
- the camera module having a dust collecting structure includes a lens holder 101C, a filter 102C, a photosensitive chip 103C, a circuit board 105C, a lens 108C, and a dust collecting structure 110C.
- the circuit board 105C is integrally integrated with the plurality of integrated circuit components 104C of the substrate.
- the filter 102C is horizontally connected to the lens mount 101C and located above the photosensor 103C.
- the circuit board 105C is electrically Connected to the photosensitive chip 103C.
- the slit mask of the lens holder 101C has a first boss 1011C and a second boss 1012C, and the first boss 1011C and the second boss 1012C are symmetrical to each other.
- the longitudinal section of the filter 102C has a first end 1021C and a second end 1022C, and the first end 1021C of the longitudinal section of the filter 102C is fixed to the longitudinal section of the lens holder 101C.
- the second end 1022C of the longitudinal section of the filter 102C is fixed to a bottom surface of the second boss 1012C of the longitudinal section of the lens holder 101C,
- the dust structure 110C is disposed on the outer edge of the bottom surface of the filter 102C for capturing movable particles such as dust and debris, thereby preventing movable particles such as dust and debris from entering the interior of the camera module 10C. .
- the dust-collecting structure 110C is an annular structure, and the longitudinal cutting surface thereof is a transverse straight strip shape, and the dust-preserving structure 110C is respectively disposed on the filter.
- the straight-shaped dust-collecting structure 110C is viscous and can adhere to movable particles such as dust and debris on the surface of the filter 102C. More specifically, in the fourth embodiment of the present invention, the straight The strip-shaped dust-collecting structure 110C is formed by a viscous gel-like layer. Since the gel-like layer is sticky, it can adhere to movable particles such as dust and be fixed, so that the inside of the camera module 10C can be avoided. Removable stain imaging.
- the dust-collecting structure 110C of the annular structure is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker, which can maintain the viscosity after the curing, water washing and baking processes, and the specific material thereof can be the same as the material in the first embodiment described above. The same or similar, will not be described here.
- This embodiment of the present invention differs from the above-described third embodiment in that the side surface of the outer circumference of the optical filter 102C of the present invention may not be provided with a viscous gel layer.
- the dust-preventing structure 110C may be formed on the bottom surface of the filter 102C by various methods such as dispensing, gluing, spraying, printing, and attaching during the manufacturing process of the filter 102C. The outer edge, however, the filter 102C having the dust collecting structure 110B is assembled to the lens holder 101C.
- the dust-preventing structure 110C is still viscous, thereby functioning to adhere to movable particles such as dust and debris.
- the dust collecting structure 110C is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. . .
- FIG. 6 is a partial cross-sectional structural view showing a fifth embodiment of a camera module having a dust collecting structure according to the present invention, showing a photosensitive chip 103D, the circuit board 105D, and the integrated circuit element.
- the dust collecting structure 110D is disposed on a portion or all of the circuit board 105D except for the photosensitive chip 103D.
- the dust-preventing structure 110D is located at the periphery of the photosensitive chip 103D to avoid dust, debris, etc. The movable particles fall into the top surface of the photosensitive chip 103D, causing a bad point defect in the camera module 10D.
- the dust-collecting structure 110D is a viscous gel layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the outer peripheral region of the circuit board 105D corresponding to the photosensitive chip 103D may be provided with the adhesive layer, and the movable particles may be prevented from falling onto the surface of the photosensitive chip, thereby preventing the camera module. Visible stain imaging occurs inside.
- the dust-collecting structure 110D is still sticky after being attached to a part or the whole of the outer periphery of the circuit board 105D by a plurality of methods such as attaching and the like, and then after natural curing or other curing means such as ultraviolet curing or heat curing. Therefore, it can function to adhere to movable particles such as dust and debris.
- the viscous gel layer can be used to bond the circuit board 105D and the lens holder in addition to dust removal.
- the dust collecting structure 110D is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. Performance.
- FIG. 7 is a partial cross-sectional structural view showing a sixth embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101E, the filter 102E, and the capture.
- the positional relationship of the dust structure 110E in a sixth embodiment of the present invention, the slit mask of the lens holder 101E has a first boss 1011E and a second boss 1012E, and the first boss 1011E and the second boss 1012E are symmetrical to each other.
- the longitudinal section of the filter 102E has a first end 1021 and a second end 1022E.
- the dust collecting structure 110E is fixed to a gap between the lens holder 101E and the filter 102E.
- the dust-collecting structure 110E is an L-shaped tubular structure, and the longitudinal section thereof includes a vertical portion 1101E and a horizontal portion 1102E, and the vertical portion 1101E is inserted into the vertical portion. a gap between a side of the first end 1021E of the filter 102 and the lens holder 101E and between a side of the second end 1022E of the filter 102E and the lens holder 101E.
- the horizontal portion 1102E is inserted between a bottom surface of the first end 1021E of the filter 102E and a top surface of the first boss 1011E of the lens holder 101E, and a portion of the filter 102E.
- the L-shaped tubular structure is viscous, capable of adhering to movable particles such as dust and debris around the filter 102E, and is intended to pass through a gap between the filter 102E and the lens holder 101E.
- the movable particulate matter such as dust and debris entering the surface of the image sensing chip 103E, the vertical portion 1101E and the L-shaped structure formed by the horizontal portion 1102E may be integrally formed or spliced.
- the dust-collecting structure 110 in the embodiment can solve the same technical problem and achieve the same technical effect, it is within the protection scope of the present invention, and the specific embodiment of the present invention is not limited thereto.
- the 110E of the L-shaped cylindrical dust-collecting structure is embodied as a viscous gel layer. Because the gel layer is viscous, not only can the movable particles such as dust and debris be adhered and fixed, so that the movable stain imaging inside the camera module 10E can be avoided, and the filter can be fixed.
- the sheet 102E functions with the lens holder 101E to increase the stability between the color filter 102E and the lens holder 101E.
- the dust-collecting structure 110E is a viscous gel layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the longitudinal section of the top side of the lens holder 101E is stepped, and the stepped inner surface is provided with the dust-removing structure 110E having a stepped shape in a longitudinal section, so that the longitudinal section is stepped.
- the dust collecting structure 110E is located between the lens holder 101E and the filter 102E to prevent movable particles such as dust and debris from falling between the lens holder 101E and the filter 102E. On the sensor chip.
- the stepped inner surface of the top side of the lens holder 101E may be first disposed with the dust collecting structure 110E, and then the filter 102E may be mounted on the filter.
- the dust collecting structure 110E forms a groove. Further, in this embodiment, the dust collecting structure 110E functions not only to capture the movable particles but also to bond and fix the filter 102E.
- the viscous gel layer can be used for dust removal, and when the dust collecting structure 110D is opaque, it can not absorb light, or can absorb light, or does not form specular reflection. The method can further provide the property of not reflecting stray light, absorbing stray light or blocking stray light.
- FIG. 8 is a partial cross-sectional structural view showing a seventh embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101F, the filter 102F, and the The positional relationship of the dust collecting structure 110F.
- the slit mask of the lens holder 101F has a first boss 1011F and a second boss 1012F, and the first boss 1011F and the second boss 1012 Symmetrically
- the longitudinal section of the filter 102F has a first end 1021F and a second end 1022F
- the first end 1021F of the longitudinal section of the filter 102F is fixed to the longitudinal section of the lens holder 101F.
- the gap between the filter 102F and the lens holder 101F enters the inside of the camera module 10F, and adheres to movable particles such as dust around the filter 102F, thereby preventing dust and the like from moving. The particles fall on the filter 102F to cause the generation of stains.
- the dust collecting structure 110F is a vertical cylindrical structure, and the longitudinal cutting surface is a vertical strip shape, and is respectively inserted into the lens holder 101F and the filter.
- the longitudinal cutting surface is a vertical strip shape, and is respectively inserted into the lens holder 101F and the filter.
- the dust-preventing structure 110F neither blocks the injection into the
- the optical path of the photosensitive chip 103F can adhere to movable particles such as dust in the vicinity of the filter 102F, thereby preventing movable particles such as dust and debris from forming a stain defect on the filter 102F.
- the dust-collecting structure 110F is a viscous gel layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the longitudinal section of the top side of the lens holder 101F is stepped, and the stepped inner surface is provided with the dust collecting structure 110E having a vertical longitudinal section, which is the same as the sixth embodiment described above.
- the top surface of the boss of the lens holder 101F may not be provided with the dust collecting structure 110E, that is, the cylindrical dust collecting structure 110F is located on the outer peripheral surface of the color filter 102F and the lens holder 101F.
- the inner surface of the top side of the lens holder 101F may be first provided with the cylindrical dust collecting structure 110E, and then the filter 102E is installed. a groove formed in the dust collecting structure 110E.
- the filter 102F may be fixed to the step surface of the lens holder 101F, and then on the outer circumference of the filter 102F.
- a dust-collecting structure 110F having a viscous gel is formed between the surface and the inner surface of the lens holder 101F to form a cylindrical shape.
- the viscous gel layer can be used for dust removal, and when the dust-collecting structure 110F is opaque, it does not reflect light, or can absorb light, or does not form specular reflection.
- the method can further provide the property of not reflecting stray light, absorbing stray light or blocking stray light.
- FIG. 9 is a partial cross-sectional structural view showing an eighth embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101G, the filter 102G, and the capture.
- the slit mask of the lens holder 101G has a first boss 1011G and a second boss 1012G, and the first boss 1011G and the second boss 1012G are symmetrical to each other.
- the longitudinal section of the filter 102G has a first end 1021G and a second end 1022G, and the first end 1021G of the longitudinal section of the filter 102G is fixed to the longitudinal section of the lens holder 101G.
- the inside of the lens holder 101G is located between the filter 102G and the photosensitive chip 103G, and is used for capturing movable particles such as dust and debris around the filter 102G and the photosensitive chip, thereby The movable particles such as dust and debris prevent the movable particles such as dust and debris from forming a bad stain on the bottom surface of the filter 102G or falling on the surface of the photosensitive chip to form a bad point.
- the dust-preventing structure 110G is a stepped structure, such as an inverted zigzag shape, the longitudinal section of which is along the first boss 1011G of the lens holder 101G and the The bottom surface of the second boss 1012G is fixed, so that the dust collecting structure 110G can neither block the light path incident on the photosensitive chip, and can stick the filter 102G and the dust near the photosensitive chip.
- the particles are moved to prevent the movable particles such as dust and debris from forming a stain on the filter 102G or falling on the surface of the photosensitive chip 103G to form a defective dot.
- the dust-collecting structure 110G is a viscous gel layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the inner surface portion of the lens holder 101G between the filter 102G and the photosensitive chip may be disposed before or after the assembly of the lens holder 101G and the filter 102G.
- the dust-collecting structure 110G is cylindrically shaped to capture movable particles located in a space between the filter 102G and the photosensitive chip. It is also worth mentioning that the viscous gel layer of the dust-collecting structure 110G can be used for dust removal, and when the dust-collecting structure 110G is opaque, it can not absorb light or absorb light. The manner of not forming specular reflection can further provide the property of not reflecting stray light, absorbing stray light or blocking stray light.
- FIG. 10 is a partial cross-sectional structural view showing a ninth embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101H, the filter 102H, and the catch.
- the positional relationship of the dust structure 110H the slit mask of the lens holder 101H.
- the slit mask of the lens holder 101H has a first boss 1011H and a second boss 1012H, and the first boss 1011H and the second boss 1012H are symmetrical to each other.
- the slit mask of the filter 102H has a first end 1021H and a second end 1022H, and the first end 1021H of the longitudinal section of the filter 102H is fixed to the longitudinal section of the lens holder 101H.
- the second end 1022H of the longitudinal section of the filter 102H is fixed to a bottom surface of the second boss 1012H of the longitudinal section of the lens holder 101H,
- the dust structure 110H is disposed on a gap between the filter 102H and the lens holder 101H and located on an inner surface of the lens holder 101H on the bottom side of the boss for capturing the inside of the camera module 10H. Movable particles such as dust and debris.
- the longitudinal section of the dust-collecting structure 110H is a pair of inverted L-shaped tubular structures, as shown in FIG. 10, and the longitudinal section thereof includes a a vertical portion 1101H and a horizontal portion 1102H respectively inserted between a side of the first end 1021H of the filter 102H and a first portion of the lens holder 101H and may be further extended
- the level Portions 1102H are respectively overlapped between a top surface of the first end 1021H of the filter 102H and a bottom surface of the first boss 1011H of the lens holder 101H and the second of the filter 102H
- the top surface of the end 1022H is between the bottom surface of the second boss 1012H of the lens holder 101H, so that the dust collecting structure 110H neither blocks the light path incident on the photosensitive chip nor sticks the filter.
- the viscous dust-preventing structure 110H can further function to bond and fix the filter 102H while removing dust.
- the dust-preventing structure 110H is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the bottom surface of the lens holder 101H is formed with a stepped surface, and the step surface of the bottom side of the lens holder 101H can be cylindrically disposed before the lens holder 101H and the filter 102H are assembled.
- the dust collecting structure 110H fixes the filter 102H to the lower side of the horizontal portion of the dust collecting structure 110H. It is also worth mentioning that when the dust-collecting structure 110H is an opaque material, it can further provide non-reflecting stray light and absorb impurities by not reflecting light, or adsorbing light, or forming specular reflection. Light or occlusion of stray light performance.
- FIG. 11 and FIG. 12 are a partial cross-sectional structural view and a whole cross-sectional structural view of a tenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the lens holder 101I, The positional relationship between the filter 102I and the dust collecting structure 110I.
- the slit mask of the lens holder 101I has a first boss 1011I and a second boss 1012I, and the first boss 1011I and the second boss 1012I Symmetrically, the longitudinal section of the filter 102I has a first end 1021I and a second end 1022I, and the first end 1021I of the longitudinal section of the filter 102I is fixed to the longitudinal section of the lens holder 101I.
- a bottom surface of the first boss 1011I a second end 1022I of the longitudinal section of the filter 102I is fixed to a bottom surface of the second boss 1012I of the longitudinal section of the lens holder 101I, and the dust collecting structure 110I Is fixed to a gap between the lens holder 101I and the filter 102I and extends to the bottom side of the lens holder 101I for capturing and adhering movable particles such as dust and debris to prevent dust, Removable particles such as debris fall into the surface of the filter 102I and the photosensitive chip 103I, thereby preventing movable particles such as dust from falling onto the filter 102I to cause stain generation or fall into the photosensitive
- the surface of the chip 103I forms a defective dot.
- the dust-preventing structure 110I is a vertical annular structure, and the longitudinal section is a vertical strip shape, and is respectively inserted into the lens holder 101I and the Between the sides of the first end 1021I of the filter 102I and between the side of the lens holder 101I and the second end 1022I of the filter 102I, the dust collecting structure 110I is neither blocked
- the optical path of the photosensitive chip 103I can adhere to movable particles such as dust in the vicinity of the filter 102I, thereby preventing movable particles such as dust and debris from forming a stain defect on the filter 102I.
- This is different from the above-described ninth embodiment in that there is no horizontal portion 1102H in the ninth embodiment.
- the dust-preventing structure 110H is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the bottom side of the lens holder 101H forms a stepped surface, and the lens holder 101H and the filter 102H are assembled or assembled, and the inside of the lens holder 101H can be formed into a cylindrical shape.
- the dust collecting structure 110H is such that the dust is collected in the final assembled structure
- the structure 110H is fixed between the outer periphery of the filter 102H and the mirror holder 101H. It is also worth mentioning that when the dust-collecting structure 110H is an opaque material, it can further provide non-reflecting stray light and absorb impurities by not reflecting light, or adsorbing light, or forming specular reflection. Light or occlusion of stray light performance.
- the lens holder 101I includes a top side mirror portion 1013I, an intermediate mirror portion 1014I and a bottom side mirror portion 1015I, each of the top side mirror portions. 1013I, the lens holder portion 1014I and the bottom side lens holder portion 1015I are annular, wherein the top side lens holder portion 1013I forms a top side groove 1016I, and the middle mirror seat portion 1014I forms a central through hole 1017I.
- the bottom side mirror seat portion 1015I forms a bottom side groove 1018I.
- the lens holder 101I has the above-described three portions integrally formed, wherein the intermediate mirror portion 1014I is inward with respect to the top side mirror portion 1013I and the plated side mirror portion 1015I. Projectingly extending a boss (1011I, 1012I) such that an inner diameter of the through hole 1017I is smaller than an inner diameter of the top side groove 1016I and the bottom side groove 1018I, such that the lens holder 101I Both the top side and the bottom side have surface stepped surfaces.
- the filter 102I is located in the bottom side groove 1018I and is attached to the bottom surface of the boss (1011I, 1012I) of the intermediate mirror portion 1014I.
- the dust structure 110H is disposed on an inner surface of the bottom side mirror portion 1015I for capturing movable particles between the filter 101I and the photosensitive chip 103I.
- the lens holders are equivalent to including the above-described top side mirror portion 1013I, the mirror portion 1014I and the bottom side.
- the inner surface of the top side mirror portion corresponding to the lens holder 101 is provided with the viscous dust collecting structure 110; in FIG. 3, the bottom side mirror portion corresponding to the lens holder 101B.
- the dust collecting structure 110B is provided, that is, only a partial inner surface of the bottom side mirror portion of the lens holder 101B; in FIGS.
- the dust collecting structure may be located at any position on the inner surface of the lens holder, and may not be limited to a specific position shown in the above drawings, and may also be one of a certain mirror portion or A plurality of partial inner surfaces, or may be a combination of the positions shown in the above figures. That is, the position where the dust collecting structure is disposed on the inner surface of the lens holder may be not limited, and may be one or more partial positions, and all the inner surfaces of the lens holder may be provided with the dust collection. Structure, which can play the role of capturing movable particles.
- FIG. 13 and FIG. 14 are a partial cross-sectional structural view and an overall cross-sectional structural view of an eleventh embodiment of a camera module having a dust collecting structure according to the present invention, showing the motor housing 106J.
- the camera module 10J further includes a motor 1J having a motor housing 106J and a mover 107J extending upwardly from the mirror
- the camera 101 is a dynamic focus camera module and includes a motor 1J for driving the lens to perform auto focus, and the dust collecting structure 110J is disposed corresponding to the mover 107J and the motor housing 106J.
- the surface of the filter 102J or the photosensitive chip 103J below causes a stain defect or a bad dot defect.
- the dust collecting structure may be disposed inside the motor 1J to adhere to particulate foreign matter entering through the gap of the motor structure.
- the motor housing 106J extends upwardly to the lens holder 101J and is integrally assembled with or can be assembled with the lens holder 101J.
- the longitudinal section of the lens holder 101J includes a first a boss 1011J and a second boss 1012J, the first boss 1011J and the second boss 1012J are parallel to each other and the first boss 1011J and the second boss 1012J are located
- Filter 102J Above the photosensitive chip 103J, the dust collecting structure 110J is a tubular structure having an L-shaped cross section, and in a longitudinal sectional view, it is located at the top of the first boss 1011J and the second boss 1012J Surfaces and respectively adjacent to sides of the motor casing 106J to adsorb movable particles such as dust around the motor casing 106J and the mover 107J, thereby preventing movable particles such as dust from falling through the motor casing 106J
- the dust collecting structure is cylindrical, located on the top side of the lens holder 101J and inside the motor housing 106J, and preferably has a size larger than the interval between the motor housing 106J and the mover 107J, thereby
- the movable casing such as dust around the motor casing 106J and the mover 107J is adsorbed.
- the filter 102J is illustrated in the figure as being mounted in a groove on the bottom side of the lens holder 101J, which may also be mounted on the top side of the lens holder 101J in other embodiments. In the groove.
- the dust-collecting structure 110J is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here. It is also worth mentioning that when the dust collecting structure 110J is an opaque material, it can further provide non-reflecting stray light and absorbing impurities by not reflecting light, or adsorbing light, or forming specular reflection. Light or occlusion of stray light performance.
- FIG. 15 is a cross-sectional structural view showing a twelfth embodiment of an image pickup module having a dust collecting structure according to the present invention.
- the twelfth embodiment of the present invention is a combination of the above first embodiment and the above fifth embodiment.
- the camera module includes a plurality of the dust collecting structures 110K, such as a first dust collecting structure 110K' and a second dust collecting structure 110K", and the first dust collecting structure 110K' is identical to the structure, position, function, function and composition of the dust collecting structure 110 in the first embodiment, and the structure of the second dust collecting structure 110K" and the dust collecting structure 110D in the fifth embodiment described above
- the position, function, function and composition are completely the same, and therefore will not be described again in this embodiment.
- FIG. 16 is a cross-sectional structural view showing a thirteenth embodiment of an image pickup module having a dust collecting structure according to the present invention.
- the fourteenth embodiment of the present invention is a combination of the above sixth embodiment and the above fifth embodiment.
- the camera module includes a plurality of the dust collecting structures 110L, such as a first dust collecting structure 110L' and a second dust collecting structure 110L", and the first dust collecting structure 110L' and the above
- the structure, position, function, function and composition of the dust collecting structure 110E in the sixth embodiment are completely the same, and the structure, position and function of the second dust collecting structure 110L" and the dust collecting structure 110D in the fifth embodiment described above are identical.
- the functions, components, and components are identical, and therefore will not be described again in this embodiment.
- the second dust-preserving structure 110L" may be further disposed on the outer peripheral surface of the photosensitive chip 103L.
- the camera module further includes a third dust-collecting structure 110L"', Referring to FIG. 17, the third dust-preventing structure 110L"' may be in a ring shape or a multi-segment structure provided in a non-photosensitive area at the outer edge of the top surface of the photosensitive chip 103L, that is, in Under the premise of normal operation of the central photosensitive region, the movable particles inside the camera module can be adhered to prevent the movable particles from falling into the photosensitive region of the top surface of the photosensitive chip 103L.
- FIG. 5 a longitudinal sectional view of the image pickup module having the dust collecting structure is shown in FIG. 5, FIG. 10, FIG. 12, and FIG. 14 to FIG.
- the dust collecting structure according to at least one of FIGS. 1-4, 6-9 and FIGS. 11-13 and FIG. 17 may be matched, and may also be A combination of the dust capture structures in one or more locations.
- the dust collecting structure of the present invention can be positioned at any position without limitation on the normal function of the filter and the photosensitive chip, and has an unlimited size and an unlimited shape.
- FIG. 18 is a partial cross-sectional view showing a fourteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip 103M, the circuit board 105M, the gold wire 109M, and the integration. The structure and positional relationship of the circuit component 104M and the dust collecting structure 110M.
- a gold wire 109M is further connected between the photosensitive chip 103M and the circuit board 105M for turning on a signal.
- the photosensitive chip 103M includes a photosensitive area 1031M and a logic area 1032M, the gold line 109M One end is connected to the logic area 1032M of the photosensitive chip 103M, and the other end is connected to the circuit board 105M and located between the photosensitive chip 103M and the integrated circuit component 104M.
- the dust collecting structure 110M A portion or all of the area of the circuit board 105M except the photosensitive area 1031M corresponding to the photosensitive chip 103M. As shown in FIG. 18, the dust collecting structure 110M is covered in a convex shape on the outer surface of the integrated circuit component 104M, so that the dust collecting structure 110M is located at the periphery of the photosensitive chip 103M to avoid dust.
- the movable particles such as debris fall into the top surface of the photosensitive region 1031M of the photosensitive chip 103M, causing a bad dot defect in the camera module 10M.
- the dust-collecting structure 110M is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the adhesive glue can be disposed in the integration by various methods such as dispensing, gluing, spraying, printing, and attaching. After the entire area of the outer periphery of the circuit component 104M is then cured by natural curing or other curing means such as ultraviolet curing or heat curing, the dust collecting structure 110M is sticky, thereby adhering to movable particles such as dust and debris. effect.
- the circuit board 105M integrated with the integrated circuit component 104M may be assembled with the photosensitive chip 103M, and then the adhesive glue may be disposed in the entire area of the outer circumference of the integrated circuit component 104M.
- the gold wire 109M can also be a material with good conduction properties such as copper wire, silver wire or aluminum wire.
- the dust collecting structure 110M when it is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. Performance.
- Figure 19 is a partial cross-sectional view showing a fifteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip 103N, the circuit board 105N, the gold wire 109N, the integration The structure and positional relationship of the circuit component 104N and the dust collecting structure 110N.
- a gold wire 109N is further connected between the photosensitive chip 103N and the circuit board 105N for turning on a signal.
- the photosensitive chip 103N includes a photosensitive area 1031N and a logic area 1032N.
- the fifteenth embodiment of the present invention is different from the above-described fourteenth embodiment in that, in the fifteenth embodiment, the dust collecting structure 110N covers the gold wire 109N.
- the lower end is located on the upper surface of the circuit board 105N and is in close contact with the photosensitive chip 103N, so that the dust-preventing structure 110N is in close contact with the periphery of the side of the photosensitive chip 103N to prevent dust particles, debris and the like from moving particles.
- the top surface of the photosensitive region 1031N of the photosensitive chip 103N causes a defect in the camera module 10N.
- the dust collecting structure 110N is a viscous gel layer, which may be made of a light transmissive or opaque material, and may be a liquid gel coat, such as a UV glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light transmissive or opaque material, and may be a liquid gel coat, such as a UV glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the adhesive glue can be covered on the gold wire 109N by various methods such as dispensing, gluing, spraying, printing, and attaching. After the lower end is then cured by natural curing or other curing means such as ultraviolet curing or heat curing, the dust collecting structure 110N is sticky, so as to adhere to movable particles such as dust and debris.
- the circuit board 105N integrating the gold wire 109N may be assembled with the photosensitive chip 103N, and then a viscous glue may be disposed at a lower end of the gold wire 109N.
- the gold wire 109N can also be a material with good conductivity such as copper wire, silver wire or aluminum wire.
- the dust collecting structure 110N is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. Performance.
- FIG. 20 is a partial cross-sectional view showing a fourteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip 103O, the circuit board 105O, the gold wire 109O, the integration The structure and positional relationship of the circuit component 104O and the dust collecting structure 110O.
- a gold wire 109O is further connected between the photosensitive chip 103O and the circuit board 105O for turning on a signal.
- the photosensitive chip 103O includes a photosensitive area 1031O and a logic area 1032O.
- the dust-preventing structure 110O is disposed on the upper surface of the logic region 1032O of the photosensitive chip 103O or the non-photosensitive region 1031 of the photosensitive chip 103O. surface. As shown in FIG. 20, the dust collecting structure 110O is disposed on the upper surface of the logic region 1032O of the photosensitive chip 103O, so that the dust collecting structure 110O is located in the photosensitive chip 103O.
- the periphery of the region 1031O prevents the movable particles such as dust and debris from falling into the top surface of the photosensitive region 1031 of the photosensitive chip 103O, causing a bad dot defect in the camera module 10O.
- the dust-collecting structure 110O is a viscous gel layer, which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, which may be a liquid gel-like coating, such as a UV-type glue, a thermosetting glue, Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the adhesive glue can be disposed in the logic area 1032O of the photosensitive chip 103O by various methods such as dispensing, gluing, spraying, printing, attaching, etc., and then After natural curing or other curing means such as ultraviolet curing and heat curing, the dust collecting structure 110O is sticky, so as to adhere to movable particles such as dust and debris.
- the adhesive glue may be disposed in the logic area 1032O of the photosensitive chip 103O.
- the gold wire 109O can also be a material with good electrical conductivity such as copper wire, silver wire or aluminum wire.
- the dust collecting structure 110O when it is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. Performance.
- 21 is a partial cross-sectional view showing a fourteenth embodiment of a camera module having a dust collecting structure according to the present invention, showing the photosensitive chip 103P, the circuit board 105P, the gold wire 109P, and the integration. The structure and positional relationship of the circuit component 104P and the dust collecting structure 110P.
- a gold wire 109P is further connected between the photosensitive chip 103P and the circuit board 105P for turning on a signal.
- the photosensitive chip 103P includes a photosensitive area 1031P and a logic area 1032P.
- the dust collecting structure 110P covers a region of all the gold wires 109P. As shown in FIG. 21, the dust-collecting structure 110P is stepped on the outer surface of the gold wire 109P, that is, the dust-collecting structure 110P covers both the lower end and the bottom of the gold wire 109P.
- the portion where the circuit board 105P is connected also covers a portion where the upper end of the gold wire 109P is connected to the logic region 1032P of the photosensitive chip 103, so that the dust collecting structure 110P is located at the photosensitive chip 103P.
- the periphery of the photosensitive region 1031P prevents the movable particles such as dust and debris from falling into the top surface of the photosensitive region 1031P of the photosensitive chip 103P, causing a bad dot defect in the camera module 10P.
- the dust-collecting structure 110P is a viscous gel layer, which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- a viscous gel layer which may be made of a light-transmitting or opaque material, and may be a liquid gel-like coating, such as a UV-type glue or a thermosetting glue. Or self-drying glue or the like, or may be a double-sided adhesive sheet-like sticker which remains tacky after the curing, water washing and baking processes, and the specific material thereof may be the same as the material in the first embodiment described above. Or similar, it will not be repeated here.
- the adhesive glue may be disposed in the plurality of manners by dispensing, gluing, spraying, printing, attaching, and the like.
- the entire area of the outer periphery of the integrated circuit component 104P is then cured by natural curing or other curing means such as ultraviolet curing or heat curing, and the dust collecting structure 110P is sticky, thereby being capable of adhering dust, debris, etc. The role of moving particles.
- the gold wire 109P can also be a material with good conduction performance such as copper wire, silver wire or aluminum wire.
- the dust collecting structure 110P when it is an opaque material, it can further provide non-reflecting stray light, absorbing stray light or blocking stray light by not reflecting light, or adsorbing light, or forming specular reflection. Performance.
- FIG. 22 is a schematic illustration of a camera module in accordance with an eighteenth preferred embodiment of the present invention.
- the camera module includes an optical lens 210, a light sensor chip 220, a filter 230, a bracket 240, a circuit board 250, a series of electronic components 260, and a set of dust collecting structures 270.
- the optical lens 210 is disposed on the photosensitive path of the photosensitive chip 220, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210. It is further accepted by the photosensitive chip 220 to be suitable for photoelectric conversion.
- the bracket 240 is provided to provide support for the optical lens 210 and the filter 230 such that the optical lens 210 and The filter 230 can be stably held at a preset position. More specifically, the bracket 240 includes a first support body 241 and a second support body 242. The optical lens 210 is disposed on the first support body 241 to be supported by the first support body 241. The filter 230 is supported by the second support 242.
- the electronic component 260 and the circuit board 250 are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220 and the circuit board 250 can be electrically connected to enable the photosensitive chip 220 to perform photoelectric conversion.
- the camera module further includes at least one set of leads, such as leads 280, for electrically conducting the photosensor 220 and the circuit board 250.
- the dust collecting structure 270 includes at least a first bonding layer 271 and at least a second bonding layer 272.
- the first adhesive layer 271 is disposed in the vicinity of the color filter 230, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230. That is, the first bonding layer 271 has a function of adhering dirt, and when the dust passes therethrough, the first bonding layer 271 can bond the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230 to prevent the dust from affecting the filter 230, thereby preventing stain imaging from occurring inside the camera module.
- the first adhesive layer 271 has a viscosity which is capable of adhering to dust to bond the dirt. More specifically, the material of the first adhesive layer 271 is selected from the group consisting of a thermosetting adhesive and a self-drying adhesive.
- thermosetting glue is cured by baking to form a thermosetting glue which, after being cured, remains tacky and can adhere to dirt, such as movable particles. It is worth mentioning that the thermosetting glue also has the function of blocking stray light, thereby improving the performance of the camera module.
- Self-drying glue refers to a glue formed after the natural dry (curing) type glue is cured.
- the naturally dry (cured) type of glue is naturally cured after being applied, and the surface is still tacky after curing, and can adhere to dust, such as movable particles.
- the self-drying glue formed after the natural drying (curing) type glue is cured is opaque, and has the function of blocking stray light, thereby improving the performance of the camera module.
- the second support body 242 of the bracket 240 has a first inner side surface 24211, a second inner side surface 24212, a third inner side surface 24213, an inner top surface 24214 and an inner bottom surface 24215.
- the first inner side surface 24211 , the second inner side surface 24212 , the third inner side surface 24213 , the inner top surface 24214 and the inner bottom surface 24215 are connected to each other to form an inner surface 2421 of the second support body 242 .
- the second support body 242 has a receiving space 2420.
- the first inner side surface 24211 , the second inner side surface 24212 , the third inner side surface 24213 , the inner top surface 24214 and the inner bottom surface 24215 are disposed around the accommodation space 2420 .
- the filter 230 and the photosensitive chip 220 are both disposed in the accommodating space 2420.
- the first adhesive layer 271 is disposed on the inner surface 2421 of the second support body 242 to facilitate cleaning of the environment in the second support body 242, thereby securing the filter 230 And cleaning of the photosensitive chip 220.
- the first adhesive layer 271 is uniformly disposed on the first inner side surface 24211 of the second support body 242.
- the filter 230 is disposed on the first adhesive layer 271. That is, the first bonding layer 271 is disposed between the second support 242 and the filter 230. It is worth mentioning that, because the first adhesive layer 271 has adhesiveness, the first adhesive layer 271 can not only function to adhere to dirt, but also can fix and connect the second support. The function of the body 242 and the filter 230.
- thermosetting glue and the self-drying glue can be converted from a liquid state to a solid state
- shape of the first bonding layer 271 can be formed according to the shape of the second supporting body 242 and the filter 230. Changing, such that the first bonding layer 271 effectively fills a gap between the second support 242 and the filter 230, thereby preventing dirt from entering the second support 242 and the filter Between the sheets 230, the disadvantages of performance caused by these contaminants are avoided.
- the first adhesive layer 271 is disposed outside the filter 230, and when dust is generated, enters the interior of the camera module from the outside of the camera module and further During the diffusion of the filter 230, the first bonding layer 271 is applied by the first bonding layer 271 to be bonded by the first bonding layer 271 before it reaches the filter 230, thereby securing the filter.
- the cleanliness of the light sheet 230 is to be noted that the first adhesive layer 271 is disposed outside the filter 230, and when dust is generated, enters the interior of the camera module from the outside of the camera module and further During the diffusion of the filter 230, the first bonding layer 271 is applied by the first bonding layer 271 to be bonded by the first bonding layer 271 before it reaches the filter 230, thereby securing the filter.
- the cleanliness of the light sheet 230 is to be noted that the light sheet 230.
- the filter 230 has a top surface 231 and a bottom surface 232.
- the first bonding layer 271 includes a first exposed surface 2711.
- the first exposed surface 2711 is exposed in the surrounding environment in the vicinity of the top surface 231 of the filter 230, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230 Cleaning of the top surface 231.
- the first exposed surface 2711 has a bonding effect. In other words, the first exposed surface 2711 is viscous so as to be able to bond the dirt reaching it.
- the second bonding layer 272 is disposed in the vicinity of the photosensitive chip 220 and the bottom surface 232 of the filter 230, thereby preventing dust, such as movable particles from adhering to The surface of the photosensitive chip 220 and the bottom surface 232 of the filter 230. That is, the second bonding layer 272 has a function of adhering dirt, and when the dust passes therethrough, the second bonding layer 272 can bond the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the photosensitive chip 220 and the bottom surface 232 of the filter 230, thereby preventing dirt from affecting the photosensitive chip 220 and the filter 230, thereby preventing the imaging mode
- the group showed stains and dead spots.
- the second bonding layer 272 has a viscosity which is capable of adhering to dust to bond the dirt. More specifically, the second bonding layer 272 is embodied as a jelly or a film.
- the photosensitive chip 220 is disposed on the circuit board 250.
- the electronic component 260 is disposed on the circuit board 250 and in the vicinity of the photosensitive chip 220.
- the second bonding layer 272 is covered by the electronic component 260 to protect the electronic component 260. It is worth mentioning that the electronic components placed on the surface of the circuit board are usually places where dirt is easily collected. The dust often affects its energizable connection, which affects the circuit of the camera module and further affects the service life of the entire camera module.
- the second bonding layer 272 is overlaid on the electronic component 260 and the electronic component 260 is fixed to the circuit board 250.
- the second adhesive layer 272 seals the surrounding environment of the electronic component 260 to prevent dirt from entering the gap between the electronic component 260 and the circuit board 250, thereby preventing the camera module from being affected. The circuit and the lifetime of the camera module.
- the second bonding layer 272 is disposed in the vicinity of the photosensitive chip 220 and the bottom surface 232 of the filter 230, so that the photosensitive chip 220 and the filter 230 can be bonded.
- the dirt near the bottom surface 232 helps to maintain the cleanliness of the photosensitive chip 220 and the bottom surface 232 of the filter 230, thereby ensuring normal operation of the camera module.
- the second bonding layer 272 is disposed on the periphery of the photosensitive chip 220.
- the second adhesive layer 272 is viscous, and passes through the second adhesive layer 272 when the dust enters the camera module from the outside of the camera module and moves toward the photosensitive chip 220.
- the second adhesive layer 272 is bonded to prevent it from reaching the photosensitive chip 220, thereby ensuring the cleanliness of the photosensitive chip 220, thereby enabling the photosensitive chip 220 to work better, thereby improving the The quality of the camera module.
- the top surface 231 includes an edge top surface 2311.
- the filter 230 is supported by the inner top surface 24214 of the second support body 242. As shown in FIG. 22, the edge top surface 2311 is above the inner top surface 24214 of the second support body 242.
- FIG 23 illustrates a first alternative embodiment of the camera module of the eighteenth preferred embodiment of the present invention.
- a camera module according to the first alternative embodiment includes an optical lens 210, a light sensor chip 220, a filter 230, a bracket 240, a circuit board 250, a series of electronic components 260, and a group of captures.
- Dust structure 270A includes at least one first bonding layer 271A and at least one second bonding layer 272.
- the bracket 240 includes a first support body 241 and a second support body 242.
- the second support body 242 has a first inner side surface 24211, a second inner side surface 24212, a third inner side surface 24213, and an inner top. Face 24214 and an inner bottom surface 24215.
- the first bonding layer 271A is uniformly disposed on the first inner side surface 24211 and the inner top surface 24214. More specifically, the first adhesive layer 271A is uniformly and continuously disposed on the first inner side surface 24211 and the inner top surface 24214, thereby more firmly fixing the filter 230.
- the filter 230 has a top surface 231 and a bottom surface 232.
- the first bonding layer 271A has a first exposed surface 2711 and a second exposed surface 2712A. More specifically, the first adhesive layer 271A disposed on the first inner side surface 24211 has the first exposed surface 2711. The first adhesive layer 271A disposed on the inner top surface 24214 has the second exposed surface 2712A. It is worth mentioning that the first exposed surface 2711 and the second exposed surface 2712A both have a bonding effect. In other words, the first exposed surface 2711 and the second exposed surface 2712A are both viscous so as to be able to bond the dirt reaching them.
- the first exposed surface 2711 is exposed in the surrounding environment in the vicinity of the top surface 231 of the filter 230, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the structure of the filter 230.
- the cleaning of the top surface 231 is described.
- the second exposed surface 2712A is exposed to the surrounding environment in the vicinity of the bottom surface 232 of the filter 230, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the structure of the filter 230.
- the cleaning of the bottom surface 232 is described. It is worth mentioning that the second exposed surface 2712A is also exposed in the vicinity of the photosensitive chip 220, so the arrangement of the second exposed surface 2712A is simultaneously advantageous for keeping the photosensitive chip 220 clean.
- FIG. 24 illustrates a second alternative embodiment of the camera module of the eighteenth preferred embodiment of the present invention.
- a camera module according to the second alternative embodiment includes an optical lens 210, a light sensor chip 220, a filter 230, a bracket 240, a circuit board 250, a series of electronic components 260, and a group of captures.
- the set of dust collecting structures 270B includes at least one first bonding layer 271B and at least one second bonding layer 272.
- the bracket 240 includes a first support body 241 and a second support body 242.
- the second support body 242 has a first inner side surface 24211, a second inner side surface 24212, a third inner side surface 24213, and an inner top. Face 24214 and an inner bottom surface 24215.
- the filter 230 has a top surface 231 and a bottom surface 232.
- the filter 230 is supported by the inner top surface 24214 of the second support body 242.
- the first adhesive layer 271B is uniformly disposed on the edge top surface 2311 of the filter 230 and the first inside of the second support body 242.
- the first adhesive layer 271B is uniformly and continuously disposed on the edge top surface 2311 of the color filter 230, the first inner side surface 24211 of the second support body 242, and the first The inner top surface 24214 of the second support body 242 and the second inner side surface 24212 of the second support body 242.
- the first adhesive layer 271B has a first exposed surface 2711B and a second exposed surface 2712B. More specifically, the first adhesive layer 271B disposed on the first inner side surface 24211 has the first exposed surface 2711B. The first adhesive layer 271B disposed on the inner top surface 24214 has the second exposed surface 2712B. It is worth mentioning that the first exposed surface 2711B and the The second exposed surface 2712B has a bonding effect. In other words, the first exposed surface 2711B and the second exposed surface 2712B are both viscous so as to be able to bond the dirt reaching them.
- the first exposed surface 2711B is exposed in the surrounding environment in the vicinity of the top surface 231 of the filter 230 so as to be able to bond the dirt of its surrounding environment, thereby maintaining the color of the filter 230.
- the cleaning of the top surface 231 is described.
- the second exposed surface 2712B is exposed in the surrounding environment in the vicinity of the bottom surface 232 of the filter 230, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the structure of the filter 230.
- the cleaning of the bottom surface 232 is described. It is worth mentioning that the second exposed surface 2712B is also exposed in the vicinity of the photosensitive chip 220, so the arrangement of the second exposed surface 2712B is simultaneously advantageous for keeping the photosensitive chip 220 clean.
- the first exposed surface 2711B has a larger surface area and the filtering of the first exposed surface 2711 of the eighteenth preferred embodiment and its first alternative embodiment.
- the sheet 230 is more rigidly joined and has a stronger joining and bonding action.
- the second exposed surface 2712B has a larger surface area relative to the second exposed surface 2712 of the first preferred embodiment and the second exposed surface 2712A according to the first alternative embodiment thereof. Stronger.
- FIG. 25 is a schematic illustration of a camera module in accordance with a nineteenth preferred embodiment of the present invention.
- the camera module includes an optical lens 210C, a light sensor chip 220C, a filter 230C, a bracket 240C, a circuit board 250C, a series of electronic components 260C, and a set of dust collecting structures 270C.
- the lead 280C is provided to be used to electrically conduct the photoreceptor chip 220C and the circuit board 250C.
- the optical lens 210C is disposed on the photosensitive path of the photosensitive chip 220C, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210C. It is further accepted by the photosensitive chip 220C to be suitable for photoelectric conversion.
- the bracket 240C is provided to provide support for the filter 230C, so that the filter 230C can be stably maintained in advance.
- the optical lens 210C is disposed to the motor 290C to be supported by the motor 290C and capable of adjusting the optical lens 210C by the motor 290C.
- the electronic component 260C and the circuit board 250C are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220C and the circuit board 250C are electrically connected to each other, so that the photosensitive chip 220C can perform photoelectric conversion.
- the dust collecting structure 270C includes at least one first bonding layer 271C and at least one second bonding layer 272C.
- the first adhesive layer 271C is disposed in the vicinity of the color filter 230C, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230C. That is, the first adhesive layer 271C has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271C can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230C, thereby preventing the dust from affecting the filter 230C, thereby preventing stain imaging from occurring inside the camera module.
- the first adhesive layer 271C has a viscous gel-like coating that is capable of adhering to dust to bond the dirt. More specifically, the material of the first adhesive layer 271C is a UV-type glue.
- the UV-type glue is cured by UV exposure to form a solid glue which, after being cured, remains tacky and adheres to dust, such as movable particles. It is worth mentioning that the UV-type glue also has the function of blocking stray light, thereby improving the performance of the camera module.
- the bracket 240C of the bracket 240C has a first inner side surface 24211C, a second inner side surface 24212C, a third inner side surface 24213C, an inner top surface 24214C and an inner bottom surface 24215C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are connected to each other to form an inner surface 2421C of the bracket 240C.
- the bracket 240C has a receiving space 2420C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are disposed around the accommodation space 2420C.
- the filter 230C and the photosensitive chip 220C are both disposed in the accommodating space 2420C.
- the first adhesive layer 271C is disposed on the inner surface 2421C of the bracket 240C to facilitate maintaining the environment in the bracket 240C, thereby securing the filter 230C and the photosensitive chip 220C. Clean.
- the first adhesive layer 271C is uniformly disposed on the inner bottom surface 24215C of the bracket 240C.
- the filter 230C is disposed on the first adhesive layer 271C. That is, the first bonding layer 271C is disposed between the holder 240C and the filter 230C. It is worth mentioning that, since the first adhesive layer 271C has adhesiveness, the first adhesive layer 271C can not only function to adhere to dirt, but also can fix and connect the bracket 240C and The function of the filter 230C. According to the nineteenth preferred embodiment of the present invention, the filter 230C is flipped over the holder 240C.
- the shape of the first adhesive layer 271C can be changed according to the shape of the holder 240C and the filter 230C, such that the first stick
- the junction layer 271C effectively fills the gap between the bracket 240C and the filter 230C, thereby preventing dirt from entering between the bracket 240C and the filter 230C, thereby avoiding the performance of the dirt. Bad hidden dangers.
- the first adhesive layer 271C is disposed outside the filter 230C. The dust enters the interior of the camera module from the outside of the camera module and further spreads toward the filter 230C, and is subjected to the first bonding layer 271C to reach the filter.
- the sheet 230C is previously bonded by the first adhesive layer 271C, thereby ensuring the cleanliness of the filter 230C.
- the filter 230C has a top surface 231C and a bottom surface 232C.
- the first bonding layer 271C includes a first exposed surface 2711C.
- the first exposed surface 2711C is exposed to the surrounding environment in the vicinity of the top surface 231C of the filter 230C, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230C Cleaning of the top surface 231C.
- the first exposed surface 2711C has a bonding effect. In other words, the first exposed surface 2711C is viscous so as to be able to bond the dirt reaching it.
- the second bonding layer 272C is disposed in the vicinity of the photosensitive chip 220C and the bottom surface 232C of the filter 230C, so that dust can be prevented, for example, the movable particles are attached to The surface of the photosensitive chip 220C and the bottom surface 232C of the filter 230C. That is, the second bonding layer 272C has a function of adhering dirt, and when the dust passes therethrough, the second bonding layer 272C can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the photosensitive chip 220C and the bottom surface 232C of the filter 230C, thereby preventing dirt from affecting the photosensitive chip 220C and the filter 230C, thereby preventing the imaging mode
- the group showed stains and dead spots.
- the second bonding layer 272C has a viscosity which is capable of adhering to dust to bond the dirt. More specifically, the second bonding layer 272C is embodied as a jelly or a film.
- the photosensitive chip 220C is disposed on the circuit board 250C.
- the electronic component 260C is disposed on the circuit board 250C and in the vicinity of the photosensitive chip 220C.
- the connection between the lead 280C and the circuit board 250C is easy to collect dust. The dust often affects its energizable connection, thereby affecting the energizable conduction of the photosensitive chip 220C and the circuit connection of the camera module, and thereby affecting the service life of the entire camera module.
- the lead 280C has a circuit board connection end 281C.
- the second bonding layer 272C is covered on the wiring board connection end 281C of the lead 280C and the lead wire 280C is fixed to the circuit board 250C.
- the second bonding layer 272C seals the surrounding environment of the circuit board connection end 281C of the lead 280C, thereby preventing dirt from entering the circuit board connection end 281C of the lead 280C and the circuit board 250C. The gap between them prevents it from affecting the circuit of the camera module and the service life of the camera module.
- the second bonding layer 272C is disposed on the photosensitive chip 220C and the bottom surface 232C of the filter 230C. In the vicinity thereof, thereby being able to bond the photosensitive chip 220C and the dust near the bottom surface 232C of the filter 230C, thereby contributing to maintaining the photosensitive chip 220C and the filter 230C.
- the cleanliness of the bottom surface 232C ensures the normal operation of the camera module.
- the second bonding layer 272C is disposed on the periphery of the photosensitive chip 220C. Since the second adhesive layer 272C has adhesiveness, the dirt passes through the second adhesive layer 272C when it enters the camera module from the outside of the camera module and moves toward the photosensitive chip 220C.
- the second adhesive layer 272C is bonded to prevent it from reaching the photosensitive chip 220C, thereby ensuring the cleanliness of the photosensitive chip 220C, thereby enabling the photosensitive chip 220C to work better, thereby improving the The quality of the camera module.
- the top surface 231C includes an edge top surface 2311C.
- the filter 230C is disposed on the inner bottom surface 24215C of the bracket 240C. As shown in FIG. 25, the edge top surface 2311C is below the inner bottom surface 24215C of the bracket 240C. It is worth mentioning that the arrangement of the edge portions of the filter 230C where the edge top surface 2311C is located enables the filter 230C to be stably connected and supported without the need for a filtering effect.
- the first adhesive layer 271C is disposed on the edge top surface 2311C and does not affect the filter effect of the filter 230C. In contrast, the first bonding layer 271C has a function of blocking stray light, thereby improving the performance of the camera module.
- FIG. 26 is a schematic diagram of a first alternative embodiment of the camera module in accordance with a nineteenth preferred embodiment of the present invention.
- the camera module includes an optical lens 210C, a light sensor chip 220C, a filter 230C, a bracket 240C, a circuit board 250C, a series of electronic components 260C, and a set of dust collecting structures 270D.
- the lead 280C is provided to be used to electrically conduct the photoreceptor chip 220C and the circuit board 250C.
- the optical lens 210C is disposed on the photosensitive path of the photosensitive chip 220C, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210C. It is further accepted by the photosensitive chip 220C to be suitable for photoelectric conversion.
- the bracket 240C is provided to provide support for the filter 230C so that the filter 230C can be stably held at a preset position.
- the optical lens 210C is disposed to the motor 290C to be supported by the motor 290C and capable of adjusting the optical lens 210C by the motor 290C.
- the electronic component 260C and the circuit board 250C are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220C and the circuit board 250C are electrically connected to each other, so that the photosensitive chip 220C can perform photoelectric conversion.
- the dust collecting structure 270D includes at least a first bonding layer 271D and at least a second bonding layer 272C.
- the first adhesive layer 271D is disposed in the vicinity of the color filter 230C, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230C. That is, the first adhesive layer 271D has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271D can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230C, thereby preventing the dust from affecting the filter 230C, thereby preventing stain imaging from occurring inside the camera module.
- the bracket 240C of the bracket 240C has a first inner side surface 24211C, a second inner side surface 24212C, a third inner side surface 24213C, an inner top surface 24214C, and an inner bottom surface 24215C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are connected to each other to form an inner surface 2421C of the bracket 240C.
- the bracket 240C has a receiving space 2420C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are disposed around the accommodation space 2420C.
- the filter 230C and the photosensitive chip 220C are both disposed in the accommodating space 2420C.
- the first adhesive layer 271D is disposed on the inner surface 2421C of the bracket 240C to facilitate maintaining the environment in the bracket 240C, thereby securing the filter 230C and the photosensitive chip 220C. Clean.
- the first adhesive layer 271D is uniformly disposed on the inner bottom surface 24215C and the third inner side surface 24213C of the bracket 240C.
- the filter 230C is disposed on the first adhesive layer 271D. It is worth mentioning that, since the first adhesive layer 271D has adhesiveness, the first adhesive layer 271D can not only function to adhere to dirt, but also can fix and connect the bracket 240C and The function of the filter 230C. According to the first alternative embodiment of the nineteenth preferred embodiment of the present invention, the filter 230C is flipped over the bracket 240C.
- the filter 230C has a top surface 231C and a bottom surface 232C.
- the first bonding layer 271D includes a first exposed surface 2711D and a second exposed surface 2712D.
- the first exposed surface 2711D is exposed to the surrounding environment in the vicinity of the top surface 231C of the filter 230C, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230C Cleaning of the top surface 231C.
- the second exposed surface 2712D is exposed to the surrounding environment in the vicinity of the bottom surface 232C of the filter 230C, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230C Cleaning of the bottom surface 232C.
- the first exposed surface 2711D and the second exposed surface 2712D are adhesive so as to be able to bond the dirt reaching them.
- the second exposed surface 2712D is also exposed in the vicinity of the photosensitive chip 220C and the electronic component 260C, so the arrangement of the second exposed surface 2712D is beneficial to retain the photosensitive chip 220C. And cleaning of the electronic component 260C.
- FIG. 27 is a schematic diagram of a second alternative embodiment of the camera module in accordance with a nineteenth preferred embodiment of the present invention.
- the camera module includes an optical lens 210C, a photosensitive chip 220C, a filter 230C, a bracket 240C, a circuit board 250C, a series of electronic components 260C, and a set of dust collecting structures 270E.
- the lead 280C is provided to be used to electrically conduct the photoreceptor chip 220C and the circuit board 250C.
- the optical lens 210C is disposed on the photosensitive path of the photosensitive chip 220C, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210C. It is further accepted by the photosensitive chip 220C to be suitable for photoelectric conversion.
- the bracket 240C is provided to provide support for the filter 230C so that the filter 230C can be stably held at a preset position.
- the optical lens 210C is disposed to the motor 290C to be supported by the motor 290C and capable of adjusting the optical lens 210C by the motor 290C.
- the electronic component 260C and the circuit board 250C are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220C and the circuit board 250C are electrically connected to each other, so that the photosensitive chip 220C can perform photoelectric conversion.
- the dust collecting structure 270E includes at least a first bonding layer 271E and at least a second bonding layer 272C.
- the first adhesive layer 271E is disposed in the vicinity of the color filter 230C, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230C. That is, the first adhesive layer 271E has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271E can bond the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230C, thereby preventing the dust from affecting the filter 230C, thereby preventing stain imaging from occurring inside the camera module.
- the bracket 240C of the bracket 240C has a first inner side surface 24211C, a second inner side surface 24212C, a third inner side surface 24213C, an inner top surface 24214C, and an inner bottom surface 24215C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are connected to each other to form an inner surface 2421C of the bracket 240C.
- the bracket 240C has a receiving space 2420C.
- the first inner side surface 24211C, the second inner side surface 24212C, the third inner side surface 24213C, the inner top surface 24214C, and the inner bottom surface 24215C are disposed around the accommodation space 2420C.
- the filter 230C and the photosensitive chip 220C are both disposed in the accommodating space 2420C.
- the first bonding layer 271E is disposed on the inner surface 2421C of the bracket 240C to facilitate maintaining the environment in the bracket 240C, thereby securing the filter 230C and the photosensitive chip 220C. Clean.
- the first adhesive layer 271E is uniformly disposed The first inner side surface 24211C, the second inner side surface 24212C, the inner bottom surface 24215C, and the third inner side surface 24213C of the bracket 240C.
- the filter 230C is disposed on the inner top surface 24214C of the bracket 240C. It is worth mentioning that, since the first adhesive layer 271E has adhesiveness, the first adhesive layer 271E can not only function to adhere to dirt, but also can fix and connect the bracket 240C and The function of the filter 230C.
- the filter 230C has a top surface 231C and a bottom surface 232C.
- the first bonding layer 271E includes a first exposed surface 2711E and a second exposed surface 2712E.
- the first exposed surface 2711E is exposed in the surrounding environment in the vicinity of the top surface 231C of the filter 230C, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230C Cleaning of the top surface 231C.
- the second exposed surface 2712E is exposed to the surrounding environment in the vicinity of the bottom surface 232C of the filter 230C, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230C Cleaning of the bottom surface 232C.
- the first exposed surface 2711E and the second exposed surface 2712E are adhesive so as to be able to bond the dirt reaching them.
- the second exposed surface 2712E is also exposed in the vicinity of the photosensitive chip 220C and the electronic component 260C, so that the arrangement of the second exposed surface 2712E is advantageous to maintain the photosensitive chip 220C. And cleaning of the electronic component 260C.
- FIG. 28 is a schematic illustration of a camera module in accordance with a twentieth preferred embodiment of the present invention.
- the camera module includes an optical lens 210F, a light sensor chip 220F, a filter 230F, a bracket 240F, a circuit board 250F, a series of electronic components 260F, and a set of dust collecting structures 270F.
- the lead 280F is provided to be used to electrically conduct the photoreceptor chip 220F and the circuit board 250F.
- the optical lens 210F is disposed on the photosensitive path of the photosensitive chip 220F, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the optical lens 210F. It is further accepted by the photosensitive chip 220F to be suitable for photoelectric conversion.
- the bracket 240F is provided to provide support for the filter 230F, so that the filter 230F can be stably maintained in advance.
- the optical lens 210F is disposed to the motor 290F to be supported by the motor 290F and is capable of adjusting the optical lens 210F by the motor 290F.
- the electronic component 260F and the circuit board 250F are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220F and the circuit board 250F are electrically connected to each other, so that the photosensitive chip 220F can perform photoelectric conversion.
- the dust collecting structure 270F includes at least a first bonding layer 271F and at least a second bonding layer 272F.
- the first adhesive layer 271F is disposed in the vicinity of the color filter 230F, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230F. That is, the first adhesive layer 271F has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271F can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230F, thereby preventing the dust from affecting the filter 230F, thereby preventing stain imaging from occurring inside the camera module.
- the first adhesive layer 271F has a viscous gel-like coating that is capable of adhering to dust to bond the dirt. More specifically, the material of the first bonding layer 271F is selected from the group consisting of thermosetting glues and self-drying glues and UV type glues.
- thermosetting glue is cured by baking to form a thermosetting glue which, after being cured, remains tacky and can adhere to dirt, such as movable particles. It is worth mentioning that the thermosetting glue also has the function of blocking stray light, thereby improving the performance of the camera module.
- Self-drying glue refers to a glue formed after the natural dry (curing) type glue is cured.
- the naturally dry (cured) type of glue is naturally cured after being applied, and the surface is still tacky after curing, and can adhere to dust, such as movable particles.
- the self-drying glue formed after the natural drying (curing) type glue is cured is opaque, and has the function of blocking stray light, thereby improving the performance of the camera module.
- UV type glue is cured by UV exposure to form a solid glue, which is still sticky after being cured, and can adhere to dust, such as movable particles. grain. It is worth mentioning that the UV-type glue also has the function of blocking stray light, thereby improving the performance of the camera module.
- the bracket 240F of the bracket 240F has a first inner side surface 24211F, a second inner side surface 24212F, a third inner side surface 24213F, an inner top surface 24214F and an inner bottom surface 24215F.
- the first inner side surface 24211F, the second inner side surface 24212F, the third inner side surface 24213F, the inner top surface 24214F and the inner bottom surface 24215F are connected to each other to form an inner surface 2421F of the bracket 240F.
- the bracket 240F has a receiving space 2420F.
- the first inner side surface 24211F, the second inner side surface 24212F, the third inner side surface 24213F, the inner top surface 24214F, and the inner bottom surface 24215F are disposed around the accommodating space 2420F.
- the filter 230F and the photosensitive chip 220F are both disposed in the accommodating space 2420F.
- the filter 230F has a top surface 231F and a bottom surface 232F.
- the top surface 231F includes an edge top surface 2311F.
- the filter 230F is supported on the inner top surface 24214F of the bracket 240F.
- the edge top surface 2311F is above the inner top surface 24214F of the bracket 240F.
- the first adhesive layer 271F is uniformly and continuously disposed on the edge top surface 2311F of the filter 230F and the first inner side surface 24211F of the bracket 240F.
- the first adhesive layer 271F is disposed outside the filter 230F, and when dust is generated, enters the inside of the camera module from the outside of the camera module, and further During the diffusion of the filter 230F, the first bonding layer 271F is bonded by the first bonding layer 271F before it reaches the filter 230F, thereby securing the filter. The cleanliness of the light sheet 230F.
- the first bonding layer 271F includes a first exposed surface 2711F.
- the first exposed surface 2711F is exposed in the surrounding environment in the vicinity of the top surface 231F of the filter 230F, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230F Cleaning of the top surface 231F.
- the first exposed surface 2711F has a bonding effect. In other words, the first exposed surface 2711F is viscous so as to be able to bond the dirt reaching it.
- the second bonding layer 272F is disposed in the vicinity of the photosensitive chip 220F and the bottom surface 232F of the filter 230F, thereby preventing dust, such as movable particles from adhering to The surface of the photosensitive chip 220F and the bottom surface 232F of the filter 230F. That is, the second bonding layer 272F has a function of adhering dirt, and when the dust passes therethrough, the second bonding layer 272F can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the photosensitive chip 220F and the bottom surface 232F of the filter 230F, thereby preventing dirt from affecting the photosensitive chip 220F and the filter 230F, thereby preventing the imaging mode
- the group showed stains and dead spots.
- the second adhesive layer 272F has a viscosity which is capable of adhering to dust to bond the dirt. More specifically, the second bonding layer 272F is embodied as a jelly or a film.
- the photosensitive chip 220F is disposed on the circuit board 250F.
- the electronic component 260F is disposed on the circuit board 250F.
- the second bonding layer 272F is disposed on a non-photosensitive area (chip logic area) of the photosensitive chip 220F. Not only can the cleaning of the photosensitive chip 220F be maintained, but it does not adversely affect its photoelectric conversion.
- the second adhesive layer 272F is disposed in the vicinity of the photosensitive chip 220F and the bottom surface 232F of the filter 230F, so that the photosensitive chip 220F and the filter 230F can be bonded.
- the dust near the bottom surface 232F helps to maintain the cleanliness of the photosensitive chip 220F and the bottom surface 232F of the filter 230F, thereby ensuring the normal operation of the camera module.
- the second bonding layer 272F is disposed on the periphery of the photosensitive chip 220F. Since the second adhesive layer 272F has adhesiveness, the dirt passes through the second adhesive layer 272F when the dirt enters the camera module from the outside of the camera module and moves toward the photosensitive chip 220F.
- the second adhesive layer 272F is bonded to prevent it from reaching the photosensitive chip 220F, thereby ensuring the cleanliness of the photosensitive chip 220F, thereby enabling the photosensitive chip 220F to work better, thereby improving the The quality of the camera module.
- FIG. 29 is a schematic diagram of an alternative embodiment of the camera module in accordance with a twentieth preferred embodiment of the present invention.
- the camera module includes an optical lens 210F, a light sensor chip 220F, a filter 230F, a bracket 240F, a circuit board 250F, a series of electronic components 260F, and a set of dust collecting structures 270G.
- the lead 280F is provided to be used to electrically conduct the photoreceptor chip 220F and the circuit board 250F.
- the optical lens 210F is disposed on the photosensitive path of the photosensitive chip 220F, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the optical lens 210F. It is further accepted by the photosensitive chip 220F to be suitable for photoelectric conversion.
- the bracket 240F is provided to provide support for the filter 230F so that the filter 230F can be stably held at a preset position.
- the optical lens 210F is disposed to the motor 290F to be supported by the motor 290F and is capable of adjusting the optical lens 210F by the motor 290F.
- the electronic component 260F and the circuit board 250F are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220F and the circuit board 250F are electrically connected to each other, so that the photosensitive chip 220F can perform photoelectric conversion.
- the dust collecting structure 270G includes at least one first bonding layer 271G and at least one second bonding layer 272F.
- the first adhesive layer 271G is disposed in the vicinity of the color filter 230F, so that dust can be prevented, for example, the movable particles adhere to the surface of the filter 230F. That is, the first adhesive layer 271G has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271G can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230F, thereby preventing the dust from affecting the filter 230F, thereby preventing stain imaging from occurring inside the camera module.
- the bracket 240F of the bracket 240F has a first inner side surface 24211F, a second inner side surface 24212F, a third inner side surface 24213F, an inner top surface 24214F and an inner bottom surface 24215F.
- the first inner side surface 24211F, the second inner side surface 24212F, the third inner side surface 24213F, the inner top surface 24214F and the inner bottom surface 24215F are connected to each other to form an inner surface 2421F of the bracket 240F.
- the bracket 240F has a receiving space 2420F.
- the first inner side surface 24211F, the second inner side surface 24212F, the third inner side surface 24213F, the inner top surface 24214F, and the inner bottom surface 24215F are disposed around the accommodating space 2420F.
- the filter 230F and the photosensitive chip 220F are both disposed in the accommodating space 2420F.
- the filter 230F is disposed on the inner top surface 24214F of the bracket 240F.
- the filter 230F has a top surface 231F and a bottom surface 232F.
- the top surface 231F includes an edge top surface 2311F.
- the edge top surface 2311F is above the inner top surface 24214F of the bracket 240F.
- the first adhesive layer 271G is uniformly disposed on the The edge top surface 2311F of the filter 230F of the bracket 240F. It is worth mentioning that, since the first adhesive layer 271G has adhesiveness, the first adhesive layer 271G can not only function to adhere to dirt, but also can fix and connect the bracket 240F and The function of the filter 230F. It is worth mentioning that the provision of the edge portion of the filter 230F where the edge top surface 2311F is located enables the filter 230F to be stably connected and supported without the need for a filtering effect. The first adhesive layer 271F is disposed on the edge top surface 2311F and does not affect the filter effect of the filter 230F.
- the first bonding layer 271G includes a first exposed surface 2711G and a second exposed surface 2712G.
- the first exposed surface 2711G is exposed in the surrounding environment in the vicinity of the top surface 231F of the filter 230F, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230F Cleaning of the top surface 231F.
- the second exposed surface 2712G is exposed in the surrounding environment in the vicinity of the bottom surface 232F of the filter 230F, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230F Cleaning of the bottom surface 232F. It is worth mentioning that the first exposed surface 2711G and the second exposed surface 2712G are adhesive so as to be able to bond the dirt reaching them.
- the second exposed surface 2712G is also exposed in the vicinity of the photosensitive chip 220F and the electronic component 260F, so that the arrangement of the second exposed surface 2712G is beneficial to maintaining the photosensitive chip 220F. And cleaning of the electronic component 260F.
- FIG. 30 is a schematic illustration of a camera module in accordance with a twenty-first preferred embodiment of the present invention.
- the camera module includes an optical lens 210H, a photosensitive chip 220H, a filter 230H, a bracket 240H, a circuit board 250H, a series of electronic components 260H, and a set of dust collecting structures 270H.
- the lead 280H is provided to be used to electrically conduct the photoreceptor chip 220H and the circuit board 250H.
- the optical lens 210H is disposed on the photosensitive path of the photosensitive chip 220H, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210H. It is further accepted by the photosensitive chip 220H to be suitable for photoelectric conversion.
- the bracket 240H is provided to provide support for the filter 230H so that the filter 230H can be stably held by Preset location.
- the optical lens 210H is disposed to the motor 290H to be supported by the motor 290H and is capable of adjusting the optical lens 210H by the motor 290H.
- the electronic component 260H and the circuit board 250H are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220H and the circuit board 250H are electrically connected to each other, so that the photosensitive chip 220H can perform photoelectric conversion.
- the dust collecting structure 270H includes at least one first bonding layer 271H and at least one second bonding layer 272H.
- the first adhesive layer 271H is disposed in the vicinity of the color filter 230H, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230H. That is, the first adhesive layer 271H has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271H can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230H, thereby preventing the dust from affecting the filter 230H, thereby preventing stain imaging from occurring inside the camera module.
- the first adhesive layer 271H has a viscous gel-like coating that is capable of adhering to dirt to bond the dirt. More specifically, the material of the first adhesive layer 271H is a UV-type glue.
- the UV-type glue is cured by UV exposure to form a solid glue which, after being cured, remains tacky and adheres to dust, such as movable particles. It is worth mentioning that the UV-type glue also has the function of blocking stray light, thereby improving the performance of the camera module.
- the bracket 240H of the bracket 240H has a first inner side surface 24211H, a second inner side surface 24212H, a third inner side surface 24213H, an inner top surface 24214H and an inner bottom surface 24215H.
- the first inner side surface 24211H, the second inner side surface 24212H, the third inner side surface 24213H, the inner top surface 24214H and the inner bottom surface 24215H are connected to each other to form an inner surface 2421H of the bracket 240H.
- the bracket 240H has a receiving space 2420H.
- the first inner side surface 24211H, the second inner side surface 24212H, the third inner side surface 24213H, the inner top surface 24214H, and the inner bottom surface 24215H are disposed around the accommodation space 2420H.
- the filter 230H and the photosensitive chip 220H are both disposed in the accommodating space 2420H.
- the first adhesive layer 271H is disposed on the inner surface 2421H of the bracket 240H to facilitate maintaining the environment in the bracket 240H, thereby securing the filter 230H and the photosensitive chip 220H. Clean.
- the filter 230H has a top surface 231H and a bottom surface 232H.
- the bottom surface 232H includes an edge bottom surface 2321H.
- the filter 230H is disposed on the inner bottom surface 24215H of the bracket 240H. As shown in FIG. 30, the edge bottom surface 2321H is below the inner bottom surface 24215H of the bracket 240H.
- the first bonding layer 271H is uniformly disposed on the third inner side 24213H of the bracket 240H and the filter 230H. Edge bottom surface 2321H. It is worth mentioning that, because the first adhesive layer 271H has adhesiveness, the first adhesive layer 271H can not only function to adhere to dirt, but also can connect the bracket 240H and the The role of the filter 230H. According to the twenty-first preferred embodiment of the present invention, the filter 230H is flip-chip mounted to the bracket 240H.
- the shape of the first bonding layer 271H can be determined according to the bracket
- the shape of 240H and the filter 230H is changed such that the first bonding layer 271H effectively fills a gap between the bracket 240H and the filter 230H, thereby preventing dirt from entering the bracket 240H.
- the disadvantage of performance caused by these contaminants is avoided.
- the first adhesive layer 271H is disposed outside the filter 230H, and when dust is generated, enters the interior of the camera module from the outside of the camera module and further During the diffusion of the filter 230H, the first bonding layer 271H is bonded by the first bonding layer 271H before it reaches the filter 230H, thereby securing the filter. The cleanliness of the light sheet 230H.
- the first bonding layer 271H includes a second exposed surface 2712H.
- the second exposed surface 2712H is exposed to the surrounding environment in the vicinity of the filter 230H, so that the dirt of its surrounding environment can be bonded, thereby keeping the filter 230H clean. It is worth mentioning that the second exposed surface 2712H has a bonding effect. In other words, the second exposed surface 2712H is viscous so as to be able to bond the dirt reaching it.
- the second adhesive layer 272H is disposed in the vicinity of the photosensitive chip 220H and the bottom surface 232H of the filter 230H, so that dust can be prevented, for example, the movable particles are attached to The surface of the photosensitive chip 220H and the bottom surface 232H of the filter 230H. That is, the second bonding layer 272H has a function of adhering dirt, and when the dust passes therethrough, the second bonding layer 272H can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the photosensitive chip 220H and the bottom surface 232H of the filter 230H, thereby preventing dirt from affecting the photosensitive chip 220H and the filter 230H, thereby preventing the imaging mode
- the group showed stains and dead spots.
- the second bonding layer 272H has a viscosity which is capable of adhering to dust to bond the dirt. More specifically, the second bonding layer 272H is embodied as a jelly or a film.
- the photosensitive chip 220H is disposed on the circuit board 250H.
- the second bonding layer 272H covers the lead 280H to protect the lead 280H. It is worth mentioning that the lead 280H and its joints are prone to collect dust. The dust often affects its energizable connection, thereby affecting the energizable conduction of the photosensitive chip 220H and the circuit connection of the camera module, and thereby affecting the service life of the entire camera module.
- the second bonding layer 272H is provided to cover the lead 280H and fix the lead 280H. The second bonding layer 272H protects the surrounding environment of the lead 280H, thereby preventing dirt from reaching the lead 280H, thereby preventing the circuit of the camera module and the life of the camera module from being affected.
- the second adhesive layer 272H is disposed in the vicinity of the photosensitive chip 220H, the electronic component 260H, and the bottom surface 232H of the filter 230H, so that the photosensitive chip 220H can be bonded,
- the cleanliness of the surface 232H ensures the normal operation of the camera module.
- the second bonding layer 272H is disposed on the periphery of the photosensitive chip 220H.
- the second adhesive layer 272H has adhesiveness, the second pass through the second when the dirt enters the camera module from the outside of the camera module and moves toward the photosensitive chip 220H and the electronic component 260H.
- the bonding layer 272H is bonded by the second bonding layer 272H to prevent it from reaching the photosensitive chip 220H and the electronic component 260H, thereby ensuring cleaning of the photosensitive chip 220H and the electronic component 260H. Degrees, so that the photosensitive chip 220H can work better, thereby improving the quality of the camera module.
- FIG. 31 is a schematic diagram of an alternative embodiment of the camera module in accordance with a twenty-first preferred embodiment of the present invention.
- the camera module includes an optical lens 210H, a photosensitive chip 220H, a filter 230H, a bracket 240H, a circuit board 250H, a series of electronic components 260H, and a set of dust collecting structures 270K.
- the lead 280H is provided to be used to electrically conduct the photoreceptor chip 220H and the circuit board 250H.
- the optical lens 210H is disposed on the photosensitive path of the photosensitive chip 220H, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210H. It is further accepted by the photosensitive chip 220H to be suitable for photoelectric conversion.
- the bracket 240H is provided to provide support for the filter 230H so that the filter 230H can be stably held at a preset position.
- the optical lens 210H is disposed to the motor 290H to be supported by the motor 290H and is capable of adjusting the optical lens 210H by the motor 290H.
- the electronic component 260H and the circuit board 250H are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220H and the circuit board 250H are electrically connected to each other, so that the photosensitive chip 220H can perform photoelectric conversion.
- the dust collecting structure 270K includes at least a first bonding layer 271K and at least a second bonding layer 272H.
- the first adhesive layer 271K is disposed in the vicinity of the color filter 230H, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230H. That is, the first adhesive layer 271K has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271K can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230H, thereby preventing the dust from affecting the filter 230H, thereby preventing stain imaging from occurring inside the camera module.
- the bracket 240H of the bracket 240H has a first inner side surface 24211H, a second inner side surface 24212H, a third inner side surface 24213H, an inner top surface 24214H and an inner bottom surface 24215H.
- the first inner side surface 24211H, the second inner side surface 24212H, the third inner side surface 24213H, the inner top surface 24214H and the inner bottom surface 24215H are connected to each other to form an inner surface 2421H of the bracket 240H.
- the bracket 240H has a receiving space 2420H.
- the first inner side surface 24211H, the second inner side surface 24212H, the third inner side surface 24213H, the inner top surface 24214H, and the inner bottom surface 24215H are disposed around the accommodation space 2420H.
- the filter 230H and the photosensitive chip 220H are both disposed in the accommodating space 2420H.
- the first adhesive layer 271K is disposed on the inner surface 2421H of the bracket 240H to facilitate maintaining the environment in the bracket 240H, thereby securing the filter 230H and the photosensitive chip 220H. Clean.
- the filter 230H is disposed on the inner top surface 24214H of the bracket 240H.
- the filter 230H has a top surface 231H and a bottom surface 232H.
- the bottom surface 232H includes an edge bottom surface 2321H.
- the filter 230H is disposed on the inner bottom surface 24215H of the bracket 240H. As shown in FIG. 30, the edge bottom surface 2321H is below the inner bottom surface 24215H of the bracket 240H.
- the first adhesive layer 271K is uniformly disposed on The edge bottom surface 2321H of the filter 230H of the bracket 240H. It is worth mentioning that, since the first adhesive layer 271K has adhesiveness, the first adhesive layer 271K can not only function to adhere to dirt, but also can fix and connect the bracket 240H and The function of the filter 230H. It is worth mentioning that the arrangement of the edge portions of the filter 230H where the edge bottom surface 2321H is located enables the filter 230H to be stably connected and supported without the need for a filtering effect. The first adhesive layer 271H is disposed on the edge bottom surface 2321H and does not affect the filter effect of the filter 230H.
- the first bonding layer 271K includes a second exposed surface 2712K.
- the second exposed surface 2712K is exposed in the surrounding environment in the vicinity of the bottom surface 232H of the filter 230H, thereby being capable of bonding dirt of its surrounding environment, thereby maintaining the said filter 230H Cleaning of the bottom surface 232H. It is worth mentioning that the second exposed surface 2712K is adhesive so as to be able to bond the dirt reaching it.
- the second exposed surface 2712K is also exposed in the vicinity of the photosensitive chip 220H and the electronic component 260H, so that the arrangement of the second exposed surface 2712K is simultaneously advantageous for holding the photosensitive chip 220H. And cleaning of the electronic component 260H.
- FIG. 32 is a camera module according to a twenty-second preferred embodiment of the present invention, wherein the camera module includes an optical lens 210L, a light sensor chip 220L, a filter 230L, and a bracket 240L.
- the lead 280L is disposed to be used to electrically conduct the photosensitive The chip 220L and the circuit board 250L.
- the optical lens 210L is disposed on the photosensitive path of the photosensitive chip 220L, so that when the camera module is used to collect an image of an object, the light reflected by the object can be processed by the optical lens 210L. It is further accepted by the photosensitive chip 220L to be suitable for photoelectric conversion.
- the bracket 240L is provided to provide support for the filter 230L so that the filter 230L can be stably held at a preset position.
- the optical lens 210L is disposed to the motor 290L to be supported by the motor 290L and is capable of adjusting the optical lens 210L by the motor 290L.
- the electronic component 260L and the circuit board 250L are electrically conductive to enable the camera module to have a preset function.
- the photosensitive chip 220L and the circuit board 250L are electrically connected to each other, so that the photosensitive chip 220L can perform photoelectric conversion.
- the dust collecting structure 270L includes at least one first bonding layer 271L and at least one second bonding layer 272L.
- the first adhesive layer 271L is disposed in the vicinity of the color filter 230L, so that dust can be prevented, for example, movable particles adhere to the surface of the filter 230L. That is, the first adhesive layer 271L has a function of adhering dirt, and when the dust passes therethrough, the first adhesive layer 271L can adhere the dirt passing therethrough, thereby preventing contamination.
- the dust moves to the surface of the filter 230L, thereby preventing the dust from affecting the filter 230L, thereby preventing stain imaging from occurring inside the camera module.
- the bracket 240L of the bracket 240L has a first inner side surface 24211L, a second inner side surface 24212L, a third inner side surface 24213L, an inner top surface 24214L and an inner bottom surface 24215L.
- the first inner side surface 24211L, the second inner side surface 24212L, the third inner side surface 24213L, the inner top surface 24214L, and the inner bottom surface 24215L are connected to each other to form an inner surface 2421L of the bracket 240L.
- the bracket 240L has a receiving space 2420L.
- the first inner side surface 24211L, the second inner side surface 24212L, the third inner side surface 24213L, the inner top surface 24214L, and the inner bottom surface 24215L are disposed around the accommodation space 2420L.
- the filter 230L and the photosensitive chip 220L are both disposed in the accommodating space 2420L. It can be understood that the position of the first adhesive layer 271L may be disposed on the first inner side surface 24211L, the second inner side surface 24212L, the third inner side surface 24213L, and the inner top surface 24214L. And at least one of the inner bottom surfaces 24215L.
- the first adhesive layer 271L is disposed on the third inner side surface 24213L of the bracket 240L to facilitate maintaining the environment in the bracket 240L, thereby securing the filter 230L and the The cleaning of the photosensitive chip 220L is described.
- the camera module is a dynamic focus camera module and includes a motor 290L for driving the lens to perform auto focus, and includes a mover 291L and a motor housing 292L, and the second adhesive layer 272L of the dust catching structure 270L.
- An area corresponding between the mover 291L and the motor housing 292L is provided to adsorb movable particles such as dust and debris around the motor housing 292L and the mover 291L, thereby preventing dust and debris.
- the movable particles pass through the motor casing 292L and fall into the surface of the filter 230L or the photosensitive chip 220L located therebelow to cause generation of stains or bad spots.
- the second bonding layer 272L of the dust collecting structure 270L may be disposed inside the motor 290L to adhere to particulate foreign matter entering through the gap of the motor structure.
- the motor housing 292L extends upwardly from the bracket 240L and is integrally provided with the bracket 240L, and in other variations, it may also be a mounting.
- the second adhesive layer 272L is disposed on a top surface of the bracket 240L and adjacent to a side of the motor housing 292L, respectively, to adsorb movable particles such as dust around the motor housing 292L and the mover 291L. Thereby, movable particles such as dust are prevented from passing through the motor casing 292L and falling into the surface of the filter 230L or the photosensitive chip 220L located below it to cause generation of stains or bad spots.
- the second adhesive layer 272L has a cylindrical shape, is located on the top side of the bracket 240L and inside the motor housing 292L, and preferably has a size larger than the interval between the motor housing 292L and the mover 291L. Thereby, the motor casing 292L and the movable particles such as dust around the mover 291L are adsorbed.
- the dust collecting structure 270, 270A, 270B, 270C, 270D, 270E, 270F according to the above preferred embodiment
- the set positions of 270G, 270H, 270K, 270L are merely examples of the invention and are not limiting. Bonding elements according to other embodiments of the present invention may also be provided at other locations of its camera module, such as the inside of its motor, to provide a bare side with adhesive properties in its motor inner layer.
- the present invention is not limited in this regard as long as the object of the present invention can be attained.
- the filter may be disposed on the lens holder or the bracket, or may be assembled with the lens. Together, or can be assembled with the motor.
- the mirror mount or the bracket may be mounted or integrally packaged with the circuit board.
- the photosensitive chip and the circuit board may be electrically connected by a COB (Chip On Board) process, or may be a conductive connection by other means such as soldering or conductive bonding.
- the photosensitive chip may also be in the form of a flip chip with the circuit board.
- a plurality of the camera modules can be combined to form an array camera module, that is, the dust collecting structure of the present invention can be applied to an array camera module, and the array camera module can be It is a split array module, or it can be an integrated module such as a shared circuit board or a shared mirror mount (bracket).
- the camera module with the dust-collecting structure of the present invention can prevent dust particles, debris and other movable particles from falling on the surface of the filter, thereby causing dust, debris and other movable particles to stain.
- Imaging causes the camera module to become poorly stained, and prevents movable particles such as dust and debris from entering the interior of the camera module and falling into the surface of the photosensitive chip or the filter or the lens.
- the image of the movable particle of dust, debris, and the like is imaged to cause a bad point in the camera module.
- the camera module with the dust collecting structure of the present invention is compared with the camera module of the prior art. The group can not only increase the stability, but also can block the stray light incident on the photosensitive chip to a certain extent when the opaque material is implemented, thereby further improving the imaging effect of the camera module.
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Abstract
一具有捕尘结构(110)的摄像模组,其包括:镜头(108)、感光芯片(103)、镜座(101)、滤光片(102)、电路板以及具有粘性的捕尘结构(110),镜头(108)位于感光芯片(103)的感光路径,捕尘结构(110)被设置于感光芯片(103)的非感光区域,或镜座(101)内壁,或滤光片(102)外边缘或侧面,或电路板的顶表面,经固化、水洗、烘烤后仍能保持粘性,以用于捕捉摄像模组内的可移动颗粒物,从而防止粉尘、碎屑等颗粒物在摄像模组上成像。
Description
本发明涉及摄像模组领域,更详而言之,本发明涉及一种具有捕尘结构的摄像模组,以提高所述摄像模组的成像质量和生产良率。
随着科技的快速发展,摄像模块/模组在社会各个领域都得到了广泛的应用,比如在笔记本电脑、手机、医学用内窥镜、工业制造用的产品实时检测或安全监控等方面。
摄像模块/模组(CMOS Camera Module),简称CCM,是用于各种新一代便携式摄像设备的核心器件,与传统摄像系统相比具有小型化、低功耗、低成本及高影像品质等优点。
传统的高像素CSP工艺摄像模块由感光芯片、镜头组件+滤光片、马达、马达底座和平面基板等构成。感光芯片产生的电信号通过所述芯片底部与所述平面基板上的连接点向外输出,所述滤光片粘接在所述镜头组件上,所述马达底座粘接在所述平面基板上,所述马达粘接在所述底座的上方。而粉尘等颗粒物一旦掉落在这种结构的摄像头模块上,由于离成像面的距离较小,实际颗粒物的大小尺寸即使很小(15um)就能成像,从而影响所述高像素摄像模块的成像质量。
而摄像模组成品的污点和坏点是导致所述摄像模组质量不良的一个非常重要的因素,其中污点很大一部分由于可移动或者不可移动颗粒附着在所述滤光片上造成,而坏点也有很大一部分是由于可移动或者不可移动颗粒附着在所述感光芯片上所造成。
这些可移动或不可移动的颗粒是在摄像模组的组装过程中,外部环境中的尘埃颗粒、设备碎屑、胶水碎屑、模组材料碎屑、人体碎屑等进入摄像模组内部形成的。对于常规的可调焦模组,即使是成品,在使用过程中也有可能会有尘埃或粉尘颗粒通过所述马达落入所述摄像模组的内部,而长时间的使用过程中,所述摄像模组内部结构摩擦产生的材料碎屑也可能导致污点或者坏点的产生。
随着高端像素模组的发展,人们对摄像模组成像质量的要求越来越高,即使只有很小的粉尘等颗粒物落在所述摄像模组的表面,也会导致所述摄像模组变成不良品。因此,本领域技术人员发明了一份申请号为201210211626.8,名称为“一种防尘摄像模组的制备方法”的发明申请。其发明包括了以下几个步骤:
(1)制备一镜头、一感光芯片、一平面印刷电路基板;
(2)制备一具备厚度的中空密封层;
(3)制备一具备厚度的透明材料的透光保护层,并将其设置在所述密封层的顶表面上,且将该密封层完全覆盖,在所述感光芯片感光区域的正上方到透光保护层的顶表面之间,形成一垂直高度不小于0.65mm的成像保护区域。
该发明是通过在所述感光芯片上设置密封层和保护层,增大成像距离,使掉落在保护层上的粉尘等颗粒物的尺寸大于30um时,才能成像,从而解决所述摄像模组的成像问题。
虽然上述发明在一定程度上解决了所述摄像模组的成像问题,提高了所述摄像模组的良品率,但该方法属于治标不治本,通过增加成像距离,从而使较小尺寸的粉尘等颗粒物不被成像,但粉尘等颗粒物依然是存在的,并且粉尘等颗粒物的成像效果是跟粉尘等颗粒物的具体位置以及成像角度有关,而上述发明并
不能保证较小尺寸的粉尘等颗粒物不会被放大成像。换句话说,尽管上述发明通过增加成像距离从而使较小尺寸的粉尘等颗粒物不被成像,但它并不能确保这些较小尺寸的粉尘等颗粒物不会因为所处位置或者成像角度的变化而被放大成像出来。此外,上述发明提供的防尘摄像模组结构和制备方法都比较复杂。
而现有技术中还有一种摄像模组的防尘结构,这种防尘结构通常设置于马达的内部。这种防尘结构对于摄像模组在运行过程中产生的可移动颗粒具有一定的预防作用,但是无法彻底预防。同时,这种防尘结构对于已经在摄像模组组装过程中入的可移动颗粒或不可移动的颗粒没有任何效果,这些可移动或不可移动的颗粒会落在摄像模组中的滤光片或者感光芯片的表面,从而导致摄像模组产生污点或者坏点不良。换句话说,这种设置于马达内部的防尘结构可以在摄像模组的运行过程中防止一部分可移动颗粒进入感光芯片的表面,但是对于已经进入感光芯片表面的可移动颗粒是没有任何作用的。
发明内容
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以吸附所述摄像模组中的滤光片周围的粉尘、碎屑等可移动颗粒物,从而避免因粉尘、碎屑等可移动颗粒物的随意移动而落在所述滤光片的表面,从而导致所述摄像模组产生污点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以吸附进入所述摄像模组内部的粉尘、碎屑等颗粒物,从而避免粉尘、碎屑等颗粒物落在所述滤光片的表面而产生污点不良或者落入所述摄像模组中的感光芯片的表面而产生坏点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以防止粉尘、碎屑等可移动颗粒物通过所述摄像模组中的所述滤光片和所述感光芯片之间的间隙而进入所述摄像模组的内部,从而避免因所述粉尘等可移动颗粒物的随意移动而导致所述摄像模组产生污点不良或坏点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以捕捉所述摄像模组内部的感光芯片周围的粉尘、碎屑等颗粒物,从而避免所述粉尘、碎屑等可移动颗粒落入所述感光芯片的表面而产生坏点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组不仅能够提高所述摄像模组中镜座与滤光片的稳定性,而且能够避免粉尘、碎屑等可移动颗粒物落入所述滤光片的表面而产生污点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以防止粉尘、碎屑等可移动颗粒物穿过所述摄像模组中的马达外壳而落入所述滤光片或所述感光芯片的表面,从而造成所述摄像模组的污点不良或坏点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组具有耐水洗和耐烘烤性,多次水洗和烘烤后使用仍然能够粘附所述滤光片表面或所述感光芯片表面的粉尘、碎屑等可移动颗粒物。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组可以捕捉进入所述摄像模组内部的粉尘、碎屑等可移动颗粒物,从而避免粉尘、碎屑等可移动颗粒物在所述滤光片的表面形成污点不良或在所述感光芯片的表面而形成坏点不良。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组不仅可以粘附所述滤光片周围的粉尘、碎屑等可移动颗粒物,而且可以进一步地具有不透光的性能,可以遮挡或吸收
杂光,也可以具有不反光的特点。
本发明的一个目的在于提供一种具有捕尘结构的摄像模组,所述具有捕尘结构的摄像模组不仅可以粘附所述感光芯片周围的粉尘、碎屑等可移动颗粒物,而且具有不透光的性能,可以遮挡或吸收杂光,也可以具有不反光的特点。
为达上述目的,本发明提供一具有捕尘结构的摄像模组,其包括:一镜头,一感光芯片,一镜座,一滤光片以及具有粘性的至少一捕尘结构,其中所述滤光片安装于所述镜座,所述镜头位于所述感光芯片的感光路径,所述捕尘结构被设置于所述摄像模组内,以用于捕捉所述摄像模组内的可移动颗粒物。
可以理解的是,在另外的变形实施例中,所述滤光片也可以安装于所述镜头或安装于一马达,或与所述感光芯片相贴合,所述镜座一体封装于所述感光芯片和所述滤光片。
优选地,所述捕尘结构的位置选自如下结构中的一种或多种以上的组合:
其中所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;
其中所述捕尘结构固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;
其中所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖所述滤光片的底表面的外边缘,且与所述滤光片底表面固定,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;
其中所述捕尘结构设置于所述滤光片的底表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;
其中所述捕尘结构填充于所述滤光片与所述镜座之间的间隙;
其中所述捕尘结构的纵切面为L型,具有一竖直部和一水平部,所述竖直部固定于所述滤光片的外周面与所述镜座的内表面之间,所述水平部固定于所述滤光片的底表面的外边缘与所述镜座之间的间隙,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。
其中所述捕尘结构呈筒形,固定于所述滤光片的外周面与所述镜座的内表面之间,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。
其中所述捕尘结构固定于所述镜座的内表面的一个或多个局部区域,或全部区域。
其中所述捕尘结构位于所述滤光片和所述感光芯片之间的镜座内侧表面,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。
其中所述摄像模组进一步包括一马达,其包括一马达外壳和一动子,所述马达外壳向上延伸地设于所述镜座,所述捕尘结构用于捕捉所述马达外壳和所述动子之间的间隙中的可移动颗粒,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述马达外壳一体延伸于或组装于所述镜座,所述捕尘结构固定于所述第一凸台和所述第二凸台与所述马达外壳的内侧相交处;
其中所述的具有捕尘结构的摄像模组还包括一电路板,所述感光芯片电性连接于所述电路板,其中所述捕尘结构设置于所述电路板对应所述感光芯片之外的区域,其中所述电路板集成有多个集成电路元器件,其中在位于所述感光芯片外围的所述集成电路元器件可选择性地被所述捕尘结构包覆;
其中所述感光芯片包括一感光区域和一逻辑区域,其中所述电路板集成有多个集成电路元器件,其中在位于所述感光芯片的所述感光区域的外围的所述集成电路元器件可选择性地被所述捕尘结构包覆;
其中所述电路板上集成有一金线,所述金线的一端连接于所述电路板,所述金线的另一端连接于所述感光芯片的所述逻辑区域,其中所述捕尘结构位于所述感光芯片的所述感光区域的外围并包覆所述金线;以及
其中所述捕尘结构设置于所述感光芯片的顶表面的非感光区域。
优选地,所述捕尘结构为一具有粘性的胶状层。
进一步地,所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
根据本发明的优选实施例,所述胶状层优选UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
根据本发明的一些实施例,所述胶状层是透光型材料。
根据本发明的一些实施例,所述胶状层是不透光型材料,从而进一步地提供阻挡杂光的性能。优选地,所述胶状层是不透光型材料,其通过不反射光线、或呈深色可吸附照射到其表面的光线、或表面粗糙不会对照射到其表面的光线形成镜面反射从而分别提供不反射光线、吸收杂光或遮挡杂光的性能。
根据本发明的一些实施例,所述捕尘结构通过点胶、涂胶、喷胶、印刷或贴附工艺形成于所述摄像模组内部。
根据本发明的一个优选地实施例,所述胶状层进一步地实施为黑色胶层。
根据本发明的另外一方面,本发明提供一应用于摄像模组的具有捕尘结构的滤光片,其包括一滤光片和具有粘性的一捕尘结构,所述滤光片适合于应用于具有一感光芯片的一摄像模组,其中所述捕尘结构设置于所述滤光片并且不影响照射至所述感光芯片的光路,所述捕尘结构用于吸附掉落于所述滤光片表面的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
优选地,所述捕尘结构设置于所述滤光片的顶表面或/和底表面的外边缘。或优选地,所述捕尘结构设于所述滤光片的外周面。
根据本发明的另外一方面,本发明还提供一应用于摄像模组的具有捕尘结构的镜座,其包括一镜座和具有粘性的一捕尘结构,所述镜座适合于应用于安装一摄像模组的一滤光片,其中所述捕尘结构用于吸附所述镜座内部的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
优选地,所述捕尘结构设置于所述镜座内表面的一个或多个局部区域,或设置于所述镜座的全部内表面。
优选地,所述镜座包括一顶侧镜座部,一中间镜座部和一底侧镜座部,其中所述顶侧镜座部形成一顶侧凹槽,所述中间镜座部形成一通孔,所述底侧镜座部形成一底侧凹槽,其中所述中间镜座部相对于所述顶侧镜座部和所述底侧镜座部向内侧凸起地延伸形成一凸台,以使所述通孔的内径小于所述顶侧凹槽和所述底侧凹槽的内径,其中所述滤光片适合于安装于所述顶侧凹槽或所述底侧凹槽内。
优选地,所述捕尘结构设置于所述顶侧镜座部的内表面的局部或全部区域、所述中间镜座部的所述凸台的顶表面的局部或全部区域、所述中间镜座部的所述凸台的内表面的局部或全部区域、所述中间镜座部的所述凸台的底表面的局部或全部区域、或所述底侧镜座部的内表面的局部或全部区域、或上述两者以上的组合。
优选地,在组装所述摄像模组后,所述捕尘结构填充所述滤光片的所述镜座之间的间隙。
优选地,其还包括一马达外壳,其中所述马达外壳延伸于所述镜座,并且在所述马达外壳内侧和所述镜座的顶侧设置有所述捕尘结构。
根据本发明的另外一方面,本发明还提供一应用于摄像模组的具有捕尘结构的电路板,其包括一电路板以及具有粘性的一捕尘结构,所述电路板适合于电性连接一摄像模组的一感光芯片,所述捕尘结构设置于所述电路板的对应于安装所述感光芯片以外的区域,以吸附所述摄像模组内部的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
优选地,所述电路板集成有多个集成电路元器件,其中所述集成电路元器件也可以选择性地被所述捕尘结构包覆。
根据本发明的另外一方面,本发明还提供一应用于摄像模组的具有捕尘结构的感光芯片,其包括一感光芯片以及具有粘性的一捕尘结构,其中所述捕尘结构设置于所述感光芯片的顶表面的非感光区域,以吸附掉落至所述感光芯片顶表面的可移动颗粒。
进一步地,所述捕尘结构可以进一步地延伸于所述感光芯片的外周面。
根据本发明的另外一方面,本发明还提供一应用于摄像模组的具有捕尘结构的马达,其包括一马达以及具有粘性的一捕尘结构,所述捕尘结构设置于所述马达内部以用于粘附通过马达内部间隙进入摄像模组的可移动颗粒,所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶,其经固化、水洗、烘烤后仍能保持粘性。
因此,采用本发明所述的具有捕尘结构的摄像模组不仅可以防止粉尘、碎屑等可移动颗粒物落在所述滤光片的表面而导致粉尘、碎屑等可移动颗粒物污点成像而使所述摄像模组变成污点不良,还可以防止粉尘、碎屑等可移动颗粒物进入所述摄像模组的内部落入所述感光芯片的表面而导致粉尘、碎屑等可移动颗粒物污点成像而使所述摄像模组产生坏点不良,除此以外,本发明所述的具有捕尘结构的摄像模组相对于现有技术中的摄像模组不仅可以增加稳固性,而且还能够在一定程度上遮挡射入所述感光芯片的杂光,从而进一步提高所述摄像模组的成像效果。
图1为本发明所述的具有捕尘结构的摄像模组的第一实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图2为本发明所述的具有捕尘结构的摄像模组的第二实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图3为本发明所述的具有捕尘结构的摄像模组的第三实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图4为本发明所述的具有捕尘结构的摄像模组的第四实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图5为本发明所述的具有捕尘结构的摄像模组的第四实施例的整体剖视结构示意图。
图6为本发明所述的具有捕尘结构的摄像模组的第五实施例的局部剖视图,示出了所述感光芯片、所述电路板电路板、所述集成电路元器件以及所述捕尘结构的结构和位置关系。
图7为本发明所述的具有捕尘结构的摄像模组的第六实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图8为本发明所述的具有捕尘结构的摄像模组的第七实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图9为本发明所述的具有捕尘结构的摄像模组的第八实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图10为本发明所述的具有捕尘结构的摄像模组的第九实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图11为本发明所述的具有捕尘结构的摄像模组的第十实施例的局部剖视图,示出了所述镜座、所述滤光片以及所述捕尘结构的结构和位置关系。
图12为本发明所述的具有捕尘结构的摄像模组的第十实施例的整体剖视结构示意图。
图13为本发明所述的具有捕尘结构的摄像模组的第十一实施例的局部剖视图,示出了所述镜座、所述马达外壳、所述动子以及所述捕尘结构的结构和位置关系。
图14为本发明所述的具有捕尘结构的摄像模组的第十一实施例的整体剖视结构示意图。
图15为本发明所述的具有捕尘结构的摄像模组的第十二实施例的剖视结构示意图。
图16为本发明所述的具有捕尘结构的摄像模组的第十三实施例的剖视结构示意图。
图17为上述第十三实施例的具有捕尘结构的感光芯片的结构示意图。
图18为本发明所述的具有捕尘结构的摄像模组的第十四实施例的局部剖视图,示出了所述感光芯片、所述电路板、所述金线、所述集成电路元器件以及所述捕尘结构的结构和位置关系。
图19为本发明所述的具有捕尘结构的摄像模组的第十五实施例的局部剖视图,示出了所述感光芯片、所述电路板、所述金线、所述集成电路元器件以及所述捕尘结构的结构和位置关系。
图20为本发明所述的具有捕尘结构的摄像模组的第十六实施例的局部剖视图,示出了所述感光芯片、所述电路板、所述金线、所述集成电路元器件以及所述捕尘结构的结构和位置关系。
图21为本发明所述的具有捕尘结构的摄像模组的第十七实施例的局部剖视图,示出了所述感光芯片、所述电路板、所述金线、所述集成电路元器件以及所述捕尘结构的结构和位置关系。
图22为本发明的第十八个优选实施例的一摄像模组的示意图。
图23示意本发明的上述第十八个优选实施例的摄像模组的第一个可替换实施例。
图24示意本发明的上述第十八个优选实施例的摄像模组的第二个可替换实施例。
图25是本发明的第十九个优选实施例的摄像模组的示意图。
图26为本发明的上述第十九个优选实施例的摄像模组的第一个可替换实施例。
图27为本发明的上述第十九个个优选实施例的摄像模组的第二个可替换实施例。
图28是本发明的第二十个优选实施例的摄像模组的示意图。
图29为本发明的上述第二十个优选实施例的该摄像模组的一个可替换实施例。
图30是本发明的第二十一个优选实施例的摄像模组的示意图。
图31为本发明的上述第二十一个优选实施例的摄像模组的一个可替换实施例。
图32为本发明的第二十二个优选实施例的摄像模组的示意图。
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其
他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。
本发明所述的一具有捕尘结构的摄像模组包括一镜座、一滤光片、一感光芯片、一电路板、一镜头以及一捕尘结构,其中所述电路板一体集成于基板的多个集成电路元器件,所述滤光片水平连接于所述镜座并位于所述感光芯片的上方,,所述电路板电性连接于所述感光芯片。所述摄像模组可以是定焦摄像模组,也可以是动焦摄像模组,当所述摄像模组是动焦摄像模组时,其进一步地包括一马达,以作为对焦驱动机构,所述镜座固定连接于所述马达,用于作为所述摄像模组支架,所述镜头被设置于所述马达,以使所述马达能够驱动所述镜头,进而对所述摄像模组进行对焦调整,所述捕尘结构被设置于所述摄像模组用于捕捉粉尘、碎屑等可移动颗粒物,从而防止粉尘、碎屑等颗粒物在所述摄像模组上污点成像。
更具体地,如图1所示为本发明所述的具有捕尘结构的摄像模组的第一实施例的部分剖视结构示意图,示出了所述镜座101、所述滤光片102以及所述捕尘结构110的位置关系。所述镜座101为环状结构,其中间具有通孔,使穿过所述镜头108的光线得以能够到达所述感光芯片103。所述镜座101进一步地起到支撑所述滤光片102的作用。在本发明的第一实施例中,所述镜座101的纵切面具有一第一凸台1011和一第二凸台1012,可以理解的是,在立体结构中,所述第一和第二凸台1011和1012可以是一个整体环状凸台的两个部分,也可能是分段式的多个凸台部分中的两个独立部分,本发明并不受到限制。在这个优选实施例中,所述第一和第二凸台1011和1012是一个整体环状凸台的两个部分。所述第一凸台1011和所述第二凸台1012相互对称,所述滤光片102的纵切面具有一第一端1021和一第二端1022,所述滤光片102的纵切面的第一端1021固定于所述镜座101的纵切面的所述第一凸台1011的顶表面,所述滤光片102的纵切面的所述第二端1022固定于所述镜座101的纵切面的所述第二凸台1012的顶表面,所述捕尘结构110被设置于所述滤光片102顶表面外周及所述滤光片102与所述镜座101之间的间隙,用于捕捉粉尘、碎屑等可移动颗粒物,从而防止粉尘、碎屑等可移动颗粒物进入所述摄像模组10的内部。
具体而言,所述捕尘结构110为一倒置的环状L型结构,如图1所示,所述捕尘结构110的纵切面包括一竖直部1101和一水平部1102,所述竖直部1101分别插入设置于所述滤光片102的第一端1021与所述镜座101以及所述滤光片102的所述第二端1022与所述镜座101之间的间隙,所述水平部1102分别重叠于所述滤光片102的所述第一端1021和所述第二端102的顶表面,所述捕尘结构110既不会遮挡射入所述感光芯片的光路,又可以粘住掉落在所述滤光片102顶表面的可移动颗粒,从而防止所述摄像模组10内部出现可移动污点成像。也即是说,在这个优选实施例中,所述捕尘结构110包括一环状竖直部和一环状水平部,所述环状竖直部位于所述滤光片102的外周缘和所述镜座101的内表面之间,并且位于所述凸台1011和1012的上方,所述环状水平部位于所述滤光片102的顶表面的外边缘,并且不遮挡所述射入所述感光芯片的光路。所述环状L型结构的所述捕尘结构110带有粘性,能够粘住所述滤光片102表面的粉尘、碎屑等可移动颗粒物,以及想要通过所述滤光片102和所述镜座101之间的间隙进入所述摄像感光芯片表面的粉尘、碎屑等可移动颗粒物,所述竖直部1101和所述水平部1102所形成的所述L型结构既可以是一体成型,也可以为拼接成型,只要与本实施例中的捕尘结构110能够解决相同的技术问题并且达到相同的技术效果,均属于本发明的保护范围之内,本发明的具体实施方式并不以此为限。
在一个实施例中,所述倒置的环状L型的捕尘结构110为一具有粘性的胶状层而形成,因为所述胶状
层具有粘性,因此可以粘附粉尘等可移动颗粒并固定,因此可以避免所述摄像模组10内部出现可移动污点成像。
值得注意的是,在本发明的第一实施例中,作为所述倒置的环状L型的捕尘结构110的所述胶状层可以是透光材料,也可以实施为不透光材料,当被优选实施为一种不透光胶状材料时,所述不透光胶状材料既能够阻挡原本要在所述镜座101上发射到所述感光芯片的杂光,同时由于所述胶状材料的性能又能固定粉尘、碎屑等可移动颗粒,从而减少污点的产生。
作为优选实施例,所述捕尘结构110的所述不透光胶状层在固化后能保持粘性,从而粘住粉尘等可移动颗粒并将其牢牢固定。此外,所述不透光胶状材料具有耐水洗和耐烘烤的特性,换句话说,作为所述捕尘结构110的所述不透光胶状层在经过一次或多次水洗或烘烤后仍然能保持粘性,并且成分稳定,能够长期保持其粘性。此外,所述不透光胶状层可以具有不透明不反射光线,或深色可吸附照射到表面的光线,或具有粗糙的表面,因此不会对照射到其表面的光线形成镜面反射的效应。总而言之,作为所述捕尘结构110的所述不透光胶状材料具有能够遮挡杂光、吸收杂光或不反射杂光的特性。
作为本发明的第一实施例的进一步优选,所述捕尘结构110的所述胶状层被进一步实施为由液态胶体而形成,所述液态胶体形成的所述胶状涂层呈不透明状,由于胶状物质具有粘附性,而不透明的物体具有不透光性,因此,作为所述捕尘结构110的所述胶状层不仅可以粘附粉尘、碎屑等可移动颗粒,而且还可以阻挡杂光。
作为本发明的第一实施例的一种变形,作为所述捕尘结构110的所述胶状层还可以被设置为通过UV型胶水而形成,所述UV型胶水通过紫外线曝光后胶水固化,但其仍然具有粘性,因此可以粘附粉尘等可移动颗粒,同时,由于不透明的所述胶状层具有不透光性,可以阻挡杂光,因此作为所述捕尘结构110的所述胶状层不仅可以粘附粉尘等可移动颗粒,而且还可以阻挡杂光。
更进一步地,作为本发明的第一实施例的另一种变形,作为所述捕尘结构110的所述胶状层还可以被实施为通过热固型胶水而形成,所述热固型胶水经过烘烤加热后固化,但其仍然具有粘性,因此可以粘附粉尘、碎屑等可移动颗粒,同时,由于不透明的所述胶状层具有不透光性,可以阻挡杂光,因此作为所述捕尘结构110的所述胶状层不仅可以粘附粉尘、碎屑等可移动颗粒,而且可以阻挡杂光。
作为本发明的第一实施例的再一种变形,作为所述捕尘结构110的所述胶状层还可以被实施为通过不干胶而形成,所述不干胶为片状且双面具有粘性,因此可以粘附粉尘等可移动颗粒,同时由于所述胶状层为不透明状,可以阻挡杂光,因此作为所述捕尘结构110的所述胶状层不仅可以粘附粉尘等可移动颗粒,而且可以阻挡杂光。
此外,本领域技术人员可以根据实际情况确定作为所述捕尘结构110的所述胶状层的具体实施方式和类型,比如通过自然干燥或固化型胶水或其他的试剂,在涂布后经过放置自然固化而形成的所述胶状层等,只要使所述胶状层表面具有粘性,并且可以更优选地由不透明材料制成,从而不仅可以阻挡杂光,而且可以粘附粉尘、碎屑等可移动颗粒的特性即可,都属于本发明的保护范围之内,本发明的具体实施方式并不以此为限。
在本发明的第一实施例中,作为所述捕尘结构110的所述胶状层可以被具体实施为一黑色胶体,其能提供不透光性能,而且在摄像模组制作或使用过程中都能用来粘附粉尘、碎屑等可移动颗粒,本领域技术人员可以根据本发明的具体揭露结合实际情况确定所述捕尘结构110的具体类型。换句话说,只要采用了与本发明相同或近似的技术方案,解决了与本发明相同或近似的技术问题,并且达到了与本发明相同或近似的技术效果,都属于本发明的保护范围之内,本发明的具体实施手段并不以此为限。
在本发明的这个优选实施例中,所述镜座101顶侧具有台阶状形状,并且所述滤光片102位于顶侧台阶形成的凹槽中,其底表面可以粘接于所述镜座101的环状凸台从而与所述镜座101粘接固定,所述滤光片102顶表面的外边缘区域以及外周面形成有胶状的所述捕尘结构110,其在固化、水洗、烘烤工艺后仍能保持粘性,从而吸附所述滤光片102上方的可移动颗粒,防止可移动颗粒落入所述滤光片102的有效工作区域,以防止所述摄像模组内部出现可移动污点成像。
另外,所述捕尘结构110可以在所述滤光片102制作过程中,通过点胶、涂胶、喷胶、印刷、贴附等多种方式形成在所述滤光片102的顶表面和外周面,然而将具有所述捕尘结构110的所述滤光片102组装于所述镜座101。也可以在将所述滤光片102组装于所述镜座101的过程中将胶状材料施加至所述滤光片102顶表面的外边缘区域以及所述滤光片102和所述镜座101之间的间隙,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110仍然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用,并且制作所述捕尘结构110的材料可以是透光材料也可以是不透光材料,不透光材料能进一步地起到阻挡杂光的作用。
如图2所示为本发明所述的具有捕尘结构的摄像模组的第二实施例的部分剖视结构示意图,示出了所述镜座101A、所述滤光片102A以及所述捕尘结构110A的位置关系。在本发明的第二实施例中,所述镜座101A的纵切面具有一第一凸台1011A和一第二凸台1012A,所述第一凸台1011A和所述第二凸台1012A相互对称,所述滤光片102A的纵切面的具有一第一端1021A和一第二端1022A,所述滤光片102A的纵切面的第一端1021A固定于所述镜座101A的纵切面的所述第一凸台1011A的顶表面,所述滤光片102A的纵切面的所述第二端1022A固定于所述镜座101A的纵切面的所述第二凸台1012A的顶表面,所述捕尘结构110A被设置于所述滤光片102A的顶表面的外周,用于捕捉粉尘、碎屑等可移动颗粒物,从而粉尘、碎屑等可移动颗粒物防止粉尘、碎屑等可移动颗粒物进入所述摄像模组10A的内部。
具体而言,如图2所示,所述捕尘结构110A为环状结构,其纵切面为横置的直条状,捕尘结构110A被分别设置于所述滤光片102A的所述第一端1021A和第二端1022A的顶表面且分别重叠于所述滤光片102A的所述第一端1021A和所述第二端1022A,因此所述捕尘结构110A既不会遮挡射入所述感光芯片103A的光路,又可以粘住掉落在所述滤光片102A顶表面的可移动颗粒,从而防止所述摄像模组10A内部出现可移动污点成像。
环状结构的捕尘结构110A带有粘性,位于所述滤光片102A的顶表面的外边缘,并且不遮挡所述射入所述感光芯片的光路,其能够粘住所述滤光片102A表面的粉尘、碎屑等可移动颗粒物,更具体而言,类似地在本发明的第二实施例中,所述捕尘结构110A为一具有粘性的胶状层而形成,因为所述胶状层具有粘性,因此可以粘附粉尘等可移动颗粒并固定,因此可以避免所述摄像模组10A内部出现可移动污点成像。具有粘性的所述胶状层可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,与上述第一实施例相区别的是,所述捕尘结构110A可以只设置于所述滤光片102A的顶表面的外边缘,而没有进一步地设置于所述滤光片102A的环状外周面。所述滤光片102A顶表面的外边缘区域形成有胶状的所述捕尘结构110A,以吸附所述滤光片102A上方的可移动颗粒,防止可移动颗粒落入所述滤光片102的有效工作区域,以防止所述摄像模组内部出现可移动污点成像。
另外,所述捕尘结构110A可以在所述滤光片102A制作过程中,通过点胶、涂胶、喷胶、印刷、贴附等多种方式形成在所述滤光片102A的顶表面的外边缘,然而将具有所述捕尘结构110A的所述滤光片
102A组装于所述镜座101A。也可以在将所述滤光片102A组装于所述镜座101A后将胶状材料施加至所述滤光片102顶表面的外边缘区域,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110A仍然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。在所述捕尘结构110A是不透光材料,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图3所示为本发明所述的具有捕尘结构的摄像模组的第三实施例的部分剖视结构示意图,示出了所述镜座101B、所述滤光片102B以及所述捕尘结构110B的位置关系。在本发明的第三实施例中,所述镜座101B的纵切面具有一第一凸台1011B和一第二凸台1012B,所述第一凸台1011B和所述第二凸台1012B相互对称,所述滤光片102B的纵切面的具有一第一端1021B和一第二端1022B,所述滤光片102B的纵切面的第一端1021B固定于所述镜座101B的纵切面的所述第一凸台1011B的底表面,所述滤光片102B的纵切面的所述第二端1022B固定于所述镜座101B的纵切面的所述第二凸台1012B的底表面,所述捕尘结构110B被设置于所述滤光片的底表面外边缘及所述滤光片102B与所述镜座101B之间的间隙,用于捕捉粉尘、碎屑等可移动颗粒物,从而防止粉尘、碎屑等可移动颗粒物进入所述摄像模组10B的内部。
具体而言,所述捕尘结构110B为一对L型筒状结构,如图3所示,其纵切面包括一竖直部1101B和一水平部1102B,所述竖直部1101B分别插入设置于所述滤光片102B的第一端1021B与所述镜座101B以及所述滤光片102的所述第二端1022B与所述镜座101B之间的间隙,所述水平部1102B分别重叠于所述滤光片102B的所述第一端1021B和所述第二端102B的底表面,因此所述捕尘结构110B既不会遮挡射入所述感光芯片103B的光路,又可以粘住落在所述滤光片102B底表面的可移动颗粒,以及粘住可能会掉落至所述感光芯片103B的可移动颗粒,从而防止所述摄像模组10B内部出现可移动污点成像。
所述L型筒状结构带有粘性,能够粘住所述滤光片102B表面的粉尘、碎屑等可移动颗粒物,以及想要通过所述滤光片102B和所述镜座101B之间的间隙进入所述摄像感光芯片表面的粉尘、碎屑等可移动颗粒物,所述竖直部1101B和所述水平部1102B所形成的所述L型结构既可以是一体成型,也可以为拼接成型,只要与本实施例中的捕尘结构110B能够解决相同的技术问题并且达到相同的技术效果,均属于本发明的保护范围之内,本发明的具体实施方式并不以此为限。
所述L型筒状结构的捕尘结构110B为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101B底侧具有台阶状形状,并且所述滤光片102B位于底侧台阶形成的凹槽中,其顶表面可以粘接于所述镜座101B的环状凸台的底表面从而与所述镜座101B粘接固定,所述滤光片102B底表面的外边缘区域以及外周面形成有胶状的所述捕尘结构110B,以吸附所述滤光片102B上方的可移动颗粒,防止可移动颗粒进入所述滤光片102B的有效工作区域,以及防止可移动颗粒落至所述感光芯片表面,从而防止所述摄像模组内部出现可移动污点成像。
另外,所述捕尘结构110B可以在所述滤光片102B制作过程中,通过点胶、涂胶、喷胶、印刷、贴附等多种方式形成在所述滤光片102B的底表面的外边缘以及外周面,然而将具有所述捕尘结构110B的所述滤光片102B组装于所述镜座101B。也可以在将所述滤光片102B组装于所述镜座101B后将胶状材料施加至所述滤光片102B底表面的外边缘区域和外周面,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110B仍然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。在所述捕尘结构110B
是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图4和图5所示,为本发明所述的具有捕尘结构的摄像模组的第四实施例的部分剖视结构示意图和整体剖视示意图。在这个实施例中,所述的一具有捕尘结构的摄像模组包括一镜座101C、一滤光片102C、一感光芯片103C、一电路板105C、一镜头108C以及一捕尘结构110C,其中所述电路板105C一体集成于基板的多个集成电路元器件104C,所述滤光片102C水平连接于所述镜座101C并位于所述感光芯片103C的上方,所述电路板105C电性连接于所述感光芯片103C。在本发明的第四实施例中,所述镜座101C的纵切面具有一第一凸台1011C和一第二凸台1012C,所述第一凸台1011C和所述第二凸台1012C相互对称,所述滤光片102C的纵切面的具有一第一端1021C和一第二端1022C,所述滤光片102C的纵切面的第一端1021C固定于所述镜座101C的纵切面所述第一凸台1011C的底表面,所述滤光片102C的纵切面的所述第二端1022C固定于所述镜座101C的纵切面的所述第二凸台1012C的底表面,所述捕尘结构110C被设置于所述滤光片102C的底表面的外边缘,用于捕捉粉尘、碎屑等可移动颗粒物,从而防止粉尘、碎屑等可移动颗粒物进入所述摄像模组10C的内部。
具体而言,如图4和图5所示,所述捕尘结构110C为一环状结构,其纵切面为横置的直条形,所述捕尘结构110C被分别设置于所述滤光片102C的所述第一端1021C和第二端1022C的底表面且分别重叠于所述滤光片102C的所述第一端1021C和所述第二端1022C,所述捕尘结构110C既不会遮挡射入所述感光芯片103C的光路,又可以粘住落在所述滤光片102C底表面的可移动颗粒以及粘住可能掉落至所述感光芯片103C的可移动颗粒,从而防止所述摄像模组10C内部出现可移动污点成像。
所述直条形的捕尘结构110C带有粘性,能够粘住所述滤光片102C表面的粉尘、碎屑等可移动颗粒物,更具体而言在本发明的第四实施例中,所述直条形的捕尘结构110C为一具有粘性的胶状层而形成,因为所述胶状层具有粘性,因此可以粘附粉尘等可移动颗粒并固定,因此可以避免所述摄像模组10C内部出现可移动污点成像。
所述环状结构的捕尘结构110C为具有粘性的胶状层,可以是透光或不透光材料制成,具体可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
本发明这个实施例和上述第三实施例的区别在于,本发明的所述滤光片102C的外周的侧面可以没有设置具有粘性的胶状层。另外,所述捕尘结构110C可以在所述滤光片102C制作过程中,通过点胶、涂胶、喷胶、印刷、贴附等多种方式形成在所述滤光片102C的底表面的外边缘,然而将具有所述捕尘结构110B的所述滤光片102C组装于所述镜座101C。也可以在将所述滤光片102C组装于所述镜座101C后将胶状材料施加至所述滤光片102C底表面的外边缘区域,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110C仍然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。在所述捕尘结构110C是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。。
如图6所示,为本发明所述的具有捕尘结构的摄像模组的第五实施例的部分剖视结构示意图,示出了感光芯片103D、所述电路板105D、所述集成电路元器件104D以及所述捕尘结构110D的结构和位置关系。在本发明的第五实施例中,所述捕尘结构110D设置在所述电路板105D除了对应所述感光芯片103D之外的局部或全部区域。如图中所示,其可以呈凸台形包覆于所述集成电路元器件104D的外表面并且进一步
覆盖于所述电路板105D除了对应所述感光芯片103D之外的所述电路板103D基板的其他区域,使所述捕尘结构110D位于所述感光芯片103D的外围,以避免粉尘、碎屑等可移动颗粒落入所述感光芯片103D的顶表面而导致所述摄像模组10D出现坏点不良。
类似地,所述捕尘结构110D为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述电路板105D的对应所述感光芯片103D的外周区域都可以设置上述粘性胶层,以及防止可移动颗粒落至所述感光芯片表面,从而防止所述摄像模组内部出现可移动污点成像。
在所述电路板105D基板制作完成并且集成了所述集成电路元器件104D后,留出中央的用于放置所述感光芯片103D的区域后,可以通过点胶、涂胶、喷胶、印刷、贴附等多种方式将具有粘性的胶水设置在所述电路板105D外周的局部或全部区域,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110D仍然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。也可以是集成所述集成电路元器件104D的所述电路板105D与所述感光芯片103D组装后,再将具有粘性的胶水设置在所述电路板105D除了对应所述感光芯片103D之外的外周的局部或全部区域。
值得一提的是,具有粘性的胶状层除了可作除尘作用外,其也可以用来粘接所述电路板105D和所述镜座。另外,在所述捕尘结构110D是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图7所示为本发明所述的具有捕尘结构的摄像模组的第六实施例的部分剖视结构示意图,示出了所述镜座101E、所述滤光片102E以及所述捕尘结构110E的位置关系。在本发明的第六实施例中,所述镜座101E的纵切面具有一第一凸台1011E和一第二凸台1012E,所述第一凸台1011E和所述第二凸台1012E相互对称,所述滤光片102E的纵切面的具有一第一端1021和一第二端1022E,所述捕尘结构110E被固定于所述镜座101E与所述滤光片102E之间的间隙,用于捕捉粉尘、碎屑等可移动颗粒物,从而粉尘、碎屑等可移动颗粒物防止粉尘、碎屑等可移动颗粒物通过所述滤光片102E与所述镜座101E之间的间隙进入所述摄像模组10E的内部。
具体而言,如图7所示,所述捕尘结构110E为一L型筒状结构,其纵切面包括一竖直部1101E和一水平部1102E,所述竖直部1101E分别插入设置于所述滤光片102的第一端1021E的侧边与所述镜座101E之间以及所述滤光片102E的所述第二端1022E的侧边与所述镜座101E之间的间隙,所述水平部1102E分别插入设置于所述滤光片102E的所述第一端1021E的底表面与所述镜座101E的第一凸台1011E的顶表面之间以及所述滤光片102E的第一端1022E的底表面与所述镜座101E的第二凸台1012E的顶表面之间的间隙,因此所述捕尘结构110E既不会遮挡射入所述感光芯片103E的光路,又可以粘住所述滤光片102E附近的粉尘等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒物通过所述滤光片102E与所述镜座101E之间的间隙进入所述摄像模组10E的内部。
所述L型筒状结构带有粘性,能够粘住所述滤光片102E周围的粉尘、碎屑等可移动颗粒物,以及想要通过所述滤光片102E和所述镜座101E之间的间隙进入所述摄像感光芯片103E表面的粉尘、碎屑等可移动颗粒物,所述竖直部1101E和所述水平部1102E所形成的所述L型结构既可以是一体成型,也可以为拼接成型,只要与本实施例中的捕尘结构110能够解决相同的技术问题并且达到相同的技术效果,均属于本发明的保护范围之内,本发明的具体实施方式并不以此为限。
在本发明的第六实施例中,所述L型筒状捕尘结构的110E被具体实施为一具有粘性的胶状层而形成,
因为所述胶状层具有粘性,因此不仅可以粘附粉尘、碎屑等可移动颗粒并固定,从而可以避免所述摄像模组10E内部出现可移动污点成像,而且可以起到固定所述滤色片102E与所述镜座101E的作用,从而增加所述滤色片102E与所述镜座101E之间的稳定性。
类似地,所述捕尘结构110E为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101E顶侧的纵切面形成台阶状,并且台阶状的内表面的设置有纵切面为台阶状的所述捕尘结构110E,从而纵切面为台阶状的所述捕尘结构110E位于所述镜座101E和所述滤光片102E之间,以防止粉尘、碎屑等可移动颗粒从所述镜座101E和所述滤光片102E之间落在所述感光芯片上。
在所述镜座101E和所述滤光片102E组装前,可以先将所述镜座101E顶侧的台阶状内表面设置所述捕尘结构110E,然后再将所述滤光片102E安装于所述捕尘结构110E形成的凹槽。另外,在这个实施例中,所述捕尘结构110E不仅起到捕捉可移动颗粒的作用,还进一步起到粘接和固定所述滤光片102E的作用。还值得一提的是,具有粘性的胶状层除了可作除尘作用外,在所述捕尘结构110D是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图8所示,为本发明所述的具有捕尘结构的摄像模组的第七实施例的部分剖视结构示意图,示出了所述镜座101F、所述滤光片102F以及所述捕尘结构110F的位置关系。所述在本发明的第七实施例中,所述镜座101F的纵切面具有一第一凸台1011F和一第二凸台1012F,所述第一凸台1011F和所述第二凸台1012相互对称,所述滤光片102F的纵切面的具有一第一端1021F和一第二端1022F,所述滤光片102F的纵切面的第一端1021F固定于所述镜座101F的纵切面的第一凸台1011F的顶表面,所述滤光片102F的纵切面的第二端1022F固定于所述镜座101F的纵切面的第二凸台1012F的顶表面,所述捕尘结构110F被固定于所述镜座101F与所述滤光片102F之间的间隙,用于捕捉粉尘、碎屑等可移动颗粒物,从而粉尘、碎屑等可移动颗粒物防止粉尘、碎屑等可移动颗粒物通过所述滤光片102F与所述镜座101F之间的间隙进入所述摄像模组10F的内部,并粘附所述滤光片102F周围的粉尘等可移动颗粒,从而防止粉尘等可移动颗粒落入所述滤光片102F上而导致污点的产生。
具体而言,如图8所示,所述捕尘结构110F为一竖直的筒状结构,其纵切面为竖直的条状,分别插入设置于所述镜座101F与所述滤光片102F的第一端1021F的侧边之间以及所述镜座101F与所述滤光片102F的第二端1022F的侧边之间,因此所述捕尘结构110F既不会遮挡射入所述感光芯片103F的光路,又可以粘住所述滤光片102F附近的粉尘等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒物在所述滤光片102F上形成污点不良。
类似地,所述捕尘结构110F为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101F顶侧的纵切面形成台阶状,并且台阶状的内表面设置有纵切面为竖直状的所述捕尘结构110E,其与上述第六实施例的区别在于,所述镜座101F的凸台顶表面可以没有设置所述捕尘结构110E,即筒状的所述捕尘结构110F位于所述滤色片102F的外周面和所述镜座101F之间,以防止粉尘、碎屑等可移动颗粒从所述镜座101F和所述滤光片102F之间落在所述感光芯片上。
在所述镜座101F和所述滤光片102F组装前,可以先将所述镜座101F顶侧的内表面设置筒状的所述捕尘结构110E,然后再将所述滤光片102E安装于所述捕尘结构110E形成的凹槽。或者,也可以是所述镜座101F和所述滤光片102F组装工艺中,将所述滤光片102F固定于所述镜座101F的台阶面后,然后在所述滤光片102F的外周面和所述镜座101F的内表面之间添加具有粘性有胶状物,从而形成筒状的所述捕尘结构110F。还值得一提的是,具有粘性的胶状层除了可作除尘作用外,在所述捕尘结构110F是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图9所示为本发明所述的具有捕尘结构的摄像模组的第八实施例的部分剖视结构示意图,示出了所述镜座101G、所述滤光片102G以及所述捕尘结构110G的位置关系。在本发明的第八实施例中,所述镜座101G的纵切面具有一第一凸台1011G和一第二凸台1012G,所述第一凸台1011G和所述第二凸台1012G相互对称,所述滤光片102G的纵切面的具有一第一端1021G和一第二端1022G,所述滤光片102G的纵切面的第一端1021G固定于所述镜座101G的纵切面第一凸台1011G的顶表面,所述滤光片102G的纵切面的第二端1022G固定于所述镜座101G的纵切面的第二凸台1012G的顶表面,所述捕尘结构110G被固定于所述镜座101G的内侧并位于所述滤光片102G与所述感光芯片103G之间,用于捕捉所述滤光片102G及所述感光芯片周围的粉尘、碎屑等可移动颗粒物,从而粉尘、碎屑等可移动颗粒物防止粉尘、碎屑等可移动颗粒物在所述滤光片102G底表面形成污点不良或者落入所述感光芯片的表面而形成坏点不良。
具体而言,如图9所示,所述捕尘结构110G为一阶梯状结构,如倒立的Z字形,其纵切面分别沿着所述镜座101G的所述第一凸台1011G和所述第二凸台1012G的底表面而固定,因此所述捕尘结构110G既不会遮挡射入所述感光芯片的光路,又可以粘住所述滤光片102G以及所述感光芯片附近的粉尘等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒物在所述滤光片102G上形成污点不良或者落入所述感光芯片103G的表面而形成坏点不良。
类似地,所述捕尘结构110G为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101G和所述滤光片102G组装前或之后,可以将位于所述滤光片102G和所述感光芯片之间的所述镜座101G内表面部分设置筒状的所述捕尘结构110G,从而用于捕捉位于所述滤光片102G和所述感光芯片之间的空间中的可移动颗粒。还值得一提的是,所述捕尘结构110G的具有粘性的胶状层除了可作除尘作用外,在所述捕尘结构110G是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图10所示为本发明所述的具有捕尘结构的摄像模组的第九实施例的部分剖视结构示意图,示出了所述镜座101H、所述滤光片102H以及所述捕尘结构110H的位置关系。在本发明的第九实施例中,所述镜座101H的纵切面具有一第一凸台1011H和一第二凸台1012H,所述第一凸台1011H和所述第二凸台1012H相互对称,所述滤光片102H的纵切面具有一第一端1021H和一第二端1022H,所述滤光片102H的纵切面的第一端1021H固定于所述镜座101H的纵切面的所述第一凸台1011H的底表面,所述滤光片102H的纵切面的所述第二端1022H固定于所述镜座101H的纵切面的所述第二凸台1012H的底表面,所述捕尘结构110H被设置于所述滤光片102H与所述镜座101H之间的间隙并位于所述凸台底侧的所述镜座101H的内表面,用于捕捉所述摄像模组10H内部的粉尘、碎屑等可移动颗粒物。
具体而言,所述捕尘结构110H的纵切面为一对倒置的L型筒状结构,如图10所示,其纵切面包括一
竖直部1101H和一水平部1102H,所述竖直部1101H分别插入设置于所述滤光片102H的第一端1021H的侧边与所述镜座101H的第一之间并可以进一步地延伸至所述底座101H的底侧以及插入所述滤光片102H的所述第二端1022H的侧边与所述镜座101H之间并可以进一步延伸至所述底座101H的底侧,所述水平部1102H分别重叠于所述滤光片102H的所述第一端1021H的顶表面与所述镜座101H的第一凸台1011H的底表面之间以及所述滤光片102H的所述第二端1022H的顶表面与所述镜座101H的第二凸台1012H的底表面之间,因此所述捕尘结构110H既不会遮挡射入所述感光芯片的光路,又可以粘住所述滤光片102H周围的可移动颗粒以及所述感光芯片周围的可移动颗粒,从而防止所述摄像模组10H内部出现污点成像或坏点不良。
值得一提的是,在这个实施例中,具有粘性的捕尘结构110H在除尘作用的同时,还能进一步地起到粘接固定所述滤光片102H的作用。类似地,所述捕尘结构110H为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101H底侧形成台阶面,并且所述镜座101H和所述滤光片102H组装前,可以将所述镜座101H底侧的台阶面设置筒状的所述捕尘结构110H,然而将所述滤光片102H固定于所述捕尘结构110H的水平部的下侧。还值得一提的是,在所述捕尘结构110H是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图11和图12所示,为本发明所述的具有捕尘结构的摄像模组的第十实施例的部分剖视结构示意图和整体剖视结构示意图,示出了所述镜座101I、所述滤光片102I以及所述捕尘结构110I的位置关系。所述在本发明的第十实施例中,所述镜座101I的纵切面具有一第一凸台1011I和一第二凸台1012I,所述第一凸台1011I和所述第二凸台1012I相互对称,所述滤光片102I的纵切面的具有一第一端1021I和一第二端1022I,所述滤光片102I的纵切面的第一端1021I固定于所述镜座101I的纵切面的第一凸台1011I的底表面,所述滤光片102I的纵切面的第二端1022I固定于所述镜座101I的纵切面的第二凸台1012I的底表面,所述捕尘结构110I被固定于所述镜座101I与所述滤光片102I之间的间隙并延伸至所述镜座101I的底侧,用于捕捉并粘附粉尘、碎屑等可移动颗粒物,以防止粉尘、碎屑等可移动颗粒物落入所述滤光片102I和所述感光芯片103I的表面,从而防止粉尘等可移动颗粒落入所述滤光片102I上而导致污点的产生或者落入所述感光芯片103I的表面而形成坏点不良。
具体而言,如图11和图12所示,所述捕尘结构110I为一竖直的环状结构,其纵切面为竖直的条状,分别插入设置于所述镜座101I与所述滤光片102I的第一端1021I的侧边之间以及所述镜座101I与所述滤光片102I的第二端1022I的侧边之间,因此所述捕尘结构110I既不会遮挡射入所述感光芯片103I的光路,又可以粘住所述滤光片102I附近的粉尘等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒物在所述滤光片102I上形成污点不良。其与上述第九实施例的区别在于,没有第九实施例中的所述水平部1102H。
类似地,所述捕尘结构110H为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在这个优选实施例中,所述镜座101H底侧形成台阶面,并且所述镜座101H和所述滤光片102H组装前或组装后,可以将所述镜座101H内形成筒状的所述捕尘结构110H,使最后组装后的结构中,所述捕尘
结构110H固定于所述滤光片102H的外周边和所述镜座101H之间。还值得一提的是,在所述捕尘结构110H是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
从另外一方面说,如图11中所示,所述镜座101I包括一顶侧镜座部1013I,一中间镜座部1014I和一底侧镜座部1015I,各个所述顶侧镜座部1013I,所述镜座部1014I和所述底侧镜座部1015I呈环状,其中所述顶侧镜座部1013I形成一顶侧凹槽1016I,所述中间镜座部1014I形成一中央通孔1017I,所述底侧镜座部1015I形成一底侧凹槽1018I。即沿着竖直方向,所述镜座101I具有一体成形的上述三个部分,其中所述中间镜座部1014I相对于所述顶侧镜座部1013I和所述镀侧镜座部1015I向内凸起地延伸形成有凸台(1011I,1012I),这样使所述通孔1017I的内径小于所述顶侧凹槽1016I和所述底侧凹槽1018I的内径,这样在所述镜座101I的顶侧和底侧都表面台阶状表面。
在这个实施例中,所述滤光片102I位于所述底侧凹槽1018I内,并且贴合于所述中间镜座部1014I的所述凸台(1011I,1012I)的底表面,所述捕尘结构110H设置于所述底侧镜座部1015I的内表面,以用于捕捉所述滤光片101I和所述感光芯片103I之间的可移动颗粒。
进一步地,参考如图1、图3以及图7至图12中所示,所述镜座相当于都包括上述的所述顶侧镜座部1013I,所述镜座部1014I和所述底侧镜座部1015I的三部分的类似结构。参考图1,相当于所述镜座101的顶侧镜座部的内表面设置有粘性的所述捕尘结构110;在图3中,相当于所述镜座101B的底侧镜座部的内表面和所述滤光片102B的外周之间设置有粘性的所述捕尘结构110B,即只位于所述镜座101B的底侧镜座部的局部内表面;在图7和图8中,相当于所述镜座101E或101F的顶侧镜座部的内表面设置有粘性的所述捕尘结构110E或110F;在图9中,相当于所述镜座101G的中间镜座部的内表面和底表面以及底侧镜座部的内表面设置有粘性的所述捕尘结构110G;在图10中,相当于所述镜座101H的中间镜座部的底表面以及底侧镜座部的内表面设置有粘性的所述捕尘结构110H;在图11和12中,只有所述镜座101I的所述底侧镜座部1015I的内表面设置有所述捕尘结构110I。
因此,可以理解的是,所述捕尘结构可以位于所述镜座内表面的任意位置,可以是不限于上述附图中所示的具体位置,如还可以是某个镜座部的一个或多个局部内表面,或者可以是上述附图中所示的位置的组合。也就是说,所述捕尘结构设置在所述镜座的内表面的位置可以不限,可以是一个或多个局部位置,可以是所述镜座的所有内表面都设置有所述捕尘结构,其都能起到捕捉可移动颗粒的作用。
如图13和图14所示,为本发明所述的具有捕尘结构的摄像模组的第十一实施例的部分剖视结构示意图和整体剖视结构示意图,示出了所述马达外壳106J、所述动子107J以及所述捕尘结构110J之间的结构和位置关系。详细地,所述在本发明的第十一实施例中,所述摄像模组10J进一步包括一马达1J,其具有一马达外壳106J和一动子107J,所述马达外壳106J向上延伸于所述镜座101J,所述摄像模组是动焦摄像模组并包括用于实现驱动镜头进行自动对焦的马达1J,所述捕尘结构110J被设置于对应所述动子107J和所述马达外壳106J之间的区域,以吸附所述马达外壳106J和所述动子107J周围的粉尘、碎屑等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒穿过所述马达外壳106J而落入位于其下方的所述滤光片102J或所述感光芯片103J的表面而导致污点不良或坏点不良的产生。所述捕尘结构可以设置于所述马达1J内部,可粘附通过马达结构间隙进入的颗粒异物。
具体而言,如图13和14所示,所述马达外壳106J向上延伸于所述镜座101J并与所述镜座101J一体设置或可以相组装,所述镜座101J的纵切面包括一第一凸台1011J和一第二凸台1012J,所述第一凸台1011J和所述第二凸台1012J相互平行对称且所述第一凸台1011J和所述第二凸台1012J均位于所述滤光片102J
和所述感光芯片103J的上方,所述捕尘结构110J为截面呈L型的筒状结构,在纵切面图中,其位于所述第一凸台1011J和所述第二凸台1012J的顶表面并且分别靠近所述马达外壳106J的侧边,以吸附所述马达外壳106J和所述动子107J周围的粉尘等可移动颗粒,从而防止粉尘等可移动颗粒穿过所述马达外壳106J而落入位于其下方的所述滤光片102J或所述感光芯片103J的表面而导致污点不良或坏点不良的产生。即所述捕尘结构呈筒状,位于所述镜座101J的顶侧以及所述马达外壳106J的内侧,并且优选地,其尺寸大于所述马达外壳106J和所述动子107J的间隔,从而吸附所述马达外壳106J和所述动子107J周围的粉尘等可移动颗粒。可以理解的是,所述滤光片102J在图中示意为安装在所述镜座101J的底侧的凹槽中,其也可能在其他实施例中安装在所述镜座101J的顶侧的凹槽中。
类似地,所述捕尘结构110J为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。还值得一提的是,在所述捕尘结构110J是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
如图15所示,为本发明所述的具有捕尘结构的摄像模组的第十二实施例的剖视结构示意图。本发明的第十二实施例为上述第一实施例和上述第五实施例的结合。具体而言,这个实施例中,所述摄像模组包括多个所述捕尘结构110K,如一第一捕尘结构110K’和一第二捕尘结构110K”,而所述第一捕尘结构110K’与上述第一实施例中的捕尘结构110的结构、位置、作用、功能以及成分完全相同,所述第二捕尘结构110K”与上述第五实施例中的捕尘结构110D的结构、位置、作用、功能以及成分完全相同,因此在本实施例中便不再赘述。
如图16所示,为本发明所述的具有捕尘结构的摄像模组的第十三实施例的剖视结构示意图。本发明的第十四实施例为上述第六实施例和上述第五实施例的结合。具体而言所述摄像模组包括多个所述捕尘结构110L,如包括一第一捕尘结构110L’和一第二捕尘结构110L”,而所述第一捕尘结构110L’与上述第六实施例中的捕尘结构110E的结构、位置、作用、功能以及成分完全相同,所述第二捕尘结构110L”与上述第五实施例中的捕尘结构110D的结构、位置、作用、功能以及成分完全相同,因此在本实施例中便不再赘述。
另外,在这个实施例中,所述第二捕尘结构110L”也可以进一步地设置在所述感光芯片103L外周表面。并且,所述摄像模组还包括一第三捕尘结构110L”’,参考图17中所示,所述第三捕尘结构110L”’可以呈环状,也可以是多段式结构,其设置在所述感光芯片103L的顶表面的外边缘的非感光区域,即在不影响中央的感光区域的正常工作前提下,能够粘附所述摄像模组内部的可移动颗粒,防止可移动颗粒落入所述感光芯片103L的顶表面的感光区域。
也就是说,参考图5、图10、图12、图14至图16所示是具有捕尘结构的摄像模组的纵切面剖示图。可以理解的是,在本发明的所述摄像模组中,可以搭配如图1-4,6-9以及图11-13和图17中至少一种所述捕尘结构,并且也可以是多种或多个位置的所述捕尘结构的组合。本发明的所述捕尘结构,在不影响滤光片和感光芯片的正常功效前提下,可以位置不限,尺寸不限,形状不限。
图18为本发明所述的具有捕尘结构的摄像模组的第十四实施例的局部剖视图,示出了所述感光芯片103M、所述电路板105M、所述金线109M、所述集成电路元器件104M以及所述捕尘结构110M的结构和位置关系。在本发明的第十四实施例中,感光芯片103M与所述电路板105M之间进一步连接有一金线109M,用于导通信号。所述感光芯片103M包括一感光区域1031M和一逻辑区域1032M,所述金线109M
的一端连接于所述感光芯片103M的所述逻辑区域1032M,另一端连接于所述电路板105M上并位于所述感光芯片103M与所述集成电路元器件104M之间,所述捕尘结构110M设置在所述电路板105M除了对应所述感光芯片103M的所述感光区域1031M之外的局部或全部区域。如图18中所示,所述捕尘结构的110M呈凸台形包覆于所述集成电路元器件104M的外表面,使所述捕尘结构110M位于所述感光芯片103M的外围,以避免粉尘、碎屑等可移动颗粒落入所述感光芯片103M的所述感光区域1031M的顶表面而导致所述摄像模组10M出现坏点不良。
类似地,所述捕尘结构110M为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在所述电路板105M基板制作完成并且集成了所述集成电路元器件104M后,可以通过点胶、涂胶、喷胶、印刷、贴附等多种方式将具有粘性的胶水设置在所述集成电路元器件104M外周的全部区域,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110M然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。也可以是集成所述集成电路元器件104M的所述电路板105M与所述感光芯片103M组装后,再将具有粘性的胶水设置在所述集成电路元器件104M的外周的全部区域。
值得一提的是,所述金线109M也可以为铜线、银线、铝线等导通性能好的材料。此外,在所述捕尘结构110M是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
图19为本发明所述的具有捕尘结构的摄像模组的第十五实施例的局部剖视图,示出了所述感光芯片103N、所述电路板105N、所述金线109N、所述集成电路元器件104N以及所述捕尘结构110N的结构和位置关系。在本发明的第十四实施例中,感光芯片103N与所述电路板105N之间进一步连接有一金线109N,用于导通信号。所述感光芯片103N包括一感光区域1031N和一逻辑区域1032N,所述金线109N的一端连接于所述感光芯片103N的所述逻辑区域1032N,另一端连接于所述电路板105N上并位于所述感光芯片103N与所述集成电路元器件104N之间。如图19中所示,本发明的第十五实施例与上述第十四实施例的区别在于,在该第十五实施例中,所述捕尘结构的110N覆盖于所述金线109N的下端并且位于所述电路板105N的上表面并紧贴所述感光芯片103N,使所述捕尘结构110N紧贴所述感光芯片103N的侧边外围,以避免粉尘、碎屑等可移动颗粒落入所述感光芯片103N的所述感光区域1031N的顶表面而导致所述摄像模组10N出现坏点不良。
类似地,所述捕尘结构110N为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在所述电路板105N基板制作完成并且集成了所述金线109N后,可以通过点胶、涂胶、喷胶、印刷、贴附等多种方式将具有粘性的胶水覆盖在所述金线109N的下端,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110N然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。也可以是集成所述金线109N的所述电路板105N与所述感光芯片103N组装后,再将具有粘性的胶水设置在所述金线109N的下端。
值得一提的是,值得一提的是,所述金线109N也可以为铜线、银线、铝线等导通性能好的材料。此外,在所述捕尘结构110N是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
图20为本发明所述的具有捕尘结构的摄像模组的第十四实施例的局部剖视图,示出了所述感光芯片103O、所述电路板105O、所述金线109O、所述集成电路元器件104O以及所述捕尘结构110O的结构和位置关系。在本发明的第十四实施例中,感光芯片103O与所述电路板105O之间进一步连接有一金线109O,用于导通信号。所述感光芯片103O包括一感光区域1031O和一逻辑区域1032O,所述金线109O的一端连接于所述感光芯片103O的所述逻辑区域1032O,另一端连接于所述电路板105O上并位于所述感光芯片103O与所述集成电路元器件104O之间,所述捕尘结构110O设置在所述感光芯片103O的所述逻辑区域1032O的上表面或所述感光芯片103O的非感光区域1031O的上表面。如图20中所示,所述捕尘结构的110O设置于所述所述感光芯片103O的所述逻辑区域1032O的上表面,使所述捕尘结构110O位于所述感光芯片103O的所述感光区域1031O的外围,以避免粉尘、碎屑等可移动颗粒落入所述感光芯片103O的所述感光区域1031O的顶表面而导致所述摄像模组10O出现坏点不良。
类似地,所述捕尘结构110O为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在所述感光芯片103O制作完成后,可以通过点胶、涂胶、喷胶、印刷、贴附等多种方式将具有粘性的胶水设置在所述感光芯片103O的所述逻辑区域1032O,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110O然有粘性,从而能起到粘附粉尘、碎屑等可移动颗粒的作用。也可以是所述电路板105O与所述感光芯片103O组装后,再将具有粘性的胶水设置在所述感光芯片103O的所述逻辑区域1032O。
值得一提的是,所述金线109O也可以为铜线、银线、铝线等导通性能好的材料。此外,在所述捕尘结构110O是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
图21为本发明所述的具有捕尘结构的摄像模组的第十四实施例的局部剖视图,示出了所述感光芯片103P、所述电路板105P、所述金线109P、所述集成电路元器件104P以及所述捕尘结构110P的结构和位置关系。在本发明的第十四实施例中,感光芯片103P与所述电路板105P之间进一步连接有一金线109P,用于导通信号。所述感光芯片103P包括一感光区域1031P和一逻辑区域1032P,所述金线109P的一端连接于所述感光芯片103P的所述逻辑区域1032P,另一端连接于所述电路板105P上并位于所述感光芯片103P与所述集成电路元器件104P之间,所述捕尘结构110P覆盖于全部所述金线109P的区域。如图21中所示,所述捕尘结构的110P呈台阶状包覆于所述金线109P的外表面,即所述捕尘结构的110P既包覆了所述金线109P的下端与所述电路板105P连接的部分,也包覆了所述金线109P的上端与所述感光芯片103的所述逻辑区域1032P连接的部分,从而使所述捕尘结构110P位于所述感光芯片103P的所述感光区域1031P的外围,以避免粉尘、碎屑等可移动颗粒落入所述感光芯片103P的所述感光区域1031P的顶表面而导致所述摄像模组10P出现坏点不良。
类似地,所述捕尘结构110P为具有粘性的胶状层,可以是透光或不透光材料制成,其可以是液态胶状涂层,如可以是UV型胶、热固型胶、或自干型胶等,或可以是双面具有粘性的片状不干胶,其在固化、水洗、烘烤工艺后仍能保持粘性,其具体材料可以与上述第一实施例中的材料相同或类似,在此不再赘述。
在集成所述金线109P的所述电路板105P与所述感光芯片103P组装后,可以通过点胶、涂胶、喷胶、印刷、贴附等多种方式将具有粘性的胶水设置在所述集成电路元器件104P外周的全部区域,然后经自然固化或其他固化手段如紫外固化、热固化后,所述捕尘结构110P然有粘性,从而能起到粘附粉尘、碎屑等可
移动颗粒的作用。
值得一提的是,所述金线109P也可以为铜线、银线、铝线等导通性能好的材料。此外,在所述捕尘结构110P是不透光材料时,通过不反射光线,或者可吸附光线,或不形成镜面反射的方式还能进一步地提供不反射杂光、吸收杂光或遮挡杂光的性能。
附图之图22是根据本实用新型的第十八个优选实施例的一摄像模组的示意图。如图22所示,所述摄像模组包括一光学镜头210、一感光芯片220、一滤光片230、一支架240、一电路板250、一系列电子元件260和一组捕尘结构270。
所述光学镜头210被设置于所述感光芯片220的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210的处理之后进一步被所述感光芯片220接受以适于进行光电转化。
依据本实用新型的所述第十八个优选实施例,所述支架240被设置,以被用于对所述光学镜头210和所述滤光片230提供支撑,从而使所述光学镜头210和所述滤光片230能够被稳定保持于预设位置。更具体地,所述支架240包括一第一支撑体241和一第二支撑体242。所述光学镜头210被设置于所述第一支撑体241,以被所述第一支撑体241支撑。所述滤光片230被所述第二支撑体242支撑。
所述电子元件260与所述电路板250进行可通电导通,以使所述摄像模组具有预设功能。
所述感光芯片220与所述电路板250进行可通电导通,以使所述感光芯片220能够发挥光电转化作用。
如图22所示,所述摄像模组进一步包括至少一组引线,如引线280,其被用于可通电导通所述感光芯片220和所述电路板250。
如图22所示,所述捕尘结构270包括至少一第一粘结层271和至少一第二粘结层272。所述第一粘结层271被设置于所述滤光片230的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230的表面。也就是说,所述第一粘结层271具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230的表面,从而防止污尘对所述滤光片230产生影响,进而防止所述摄像模组内部出现污点成像。
具体地,所述第一粘结层271具有粘性,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第一粘结层271的材质选自热固胶和自干胶。
热固胶水通过烘烤加热后固化形成热固胶,其被固化后仍然具有粘性,可粘附污尘,例如可移动颗粒。值得一提的是,热固胶还具有阻挡杂光的作用,从而提高所述摄像模组的性能。
自干胶是指自然干燥(固化)型胶水固化后形成的胶。自然干燥(固化)型胶水被涂布后经时放置自然固化,固化后表面仍然具有粘性,可以粘附污尘,例如可移动颗粒。自然干燥(固化)型胶水固化后形成的自干胶不透明,其具有阻挡杂光的作用,从而提高所述摄像模组的性能。
如图22所示,所述支架240的所述第二支撑体242具有一第一内侧面24211、一第二内侧面24212、一第三内侧面24213、一内顶面24214和一内底面24215。所述第一内侧面24211、所述第二内侧面24212、所述第三内侧面24213、所述内顶面24214和所述内底面24215相互连接形成所述第二支撑体242的内表面2421。所述第二支撑体242具有一容纳空间2420。所述第一内侧面24211、所述第二内侧面24212、所述第三内侧面24213、所述内顶面24214和所述内底面24215被设置于所述容纳空间2420的周围。所述滤光片230和所述感光芯片220均被设置于所述容纳空间2420内。所述第一粘结层271被设置于所述第二支撑体242的所述内表面2421,以有利于保持所述第二支撑体242内的环境的清洁,进而保障所述滤光片230和所述感光芯片220的清洁。
更具体地,根据本实用新型的所述第十八个优选实施例,所述第一粘结层271被均匀设置于所述第二支撑体242的所述第一内侧面24211。所述滤光片230被设置于所述第一粘结层271。也就是说,所述第一粘结层271被设置于所述第二支撑体242和所述滤光片230之间。值得一提的是,由于所述第一粘结层271具有粘性,所述第一粘结层271不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述第二支撑体242和所述滤光片230的作用。更具体的,由于热固胶和自干胶都可以从液态转化为固态,固所述第一粘结层271的形状可以根据所述第二支撑体242和所述滤光片230的形状发生改变,这样所述第一粘结层271有效填充了所述第二支撑体242和所述滤光片230之间的缝隙,从而防止污物进入所述第二支撑体242和所述滤光片230之间,进而避免这些污物带来的性能不良隐患。值得一提的是,所述第一粘结层271被设置于所述滤光片230的外侧,当污尘,从所述摄像模组的外部进入所述摄像模组的内部并进而向所述滤光片230扩散的途中,受到所述第一粘结层271的作用而在其到达所述滤光片230之前被所述第一粘结层271所粘结,从而保障了所述滤光片230的清洁度。
更具体地,所述滤光片230具有一顶表面231和一底表面232。所述第一粘结层271包括一第一裸露面2711。所述第一裸露面2711在所述滤光片230的所述顶表面231的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230的所述顶表面231的清洁。值得一提的是,所述第一裸露面2711具有粘结的作用。换言之,所述第一裸露面2711具有粘性,从而能够粘结到达其的污物。
如图22所示,所述第二粘结层272被设置于所述感光芯片220以及所述滤光片230的所述底表面232的附近,从而能够防止污尘,例如可移动颗粒附着在所述感光芯片220的表面以及所述滤光片230的所述底表面232。也就是说,所述第二粘结层272具有粘结污尘的作用,当污尘从其经过时,所述第二粘结层272能够将从其经过的污尘粘结,从而防止污尘运动至所述感光芯片220的表面以及所述滤光片230的所述底表面232,从而防止污尘对所述感光芯片220以及所述滤光片230产生影响,进而防止所述摄像模组出现污点和坏点。
具体地,所述第二粘结层272具有粘性,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第二粘结层272具体实施为胶状物或者胶膜。
根据本实用新型的所述第十八个优选实施例,所述感光芯片220被设置于所述电路板250。所述电子元件260被设置于所述电路板250并处于所述感光芯片220的附近。所述第二粘结层272被覆盖于所述电子元件260从而对所述电子元件260进行保护。值得一提的是,被设置于线路板表面的电子元件通常是污尘容易聚集的地方。而污尘往往会对其可通电连接造成影响,从而影响所述摄像模组的电路,并进而影响整个摄像模组的使用寿命。所述第二粘结层272被覆盖于所述电子元件260并将所述电子元件260固定于所述电路板250。所述第二粘结层272对所述电子元件260的周围环境进行密封,从而防止污尘进入所述电子元件260与所述电路板250之间的间隙,进而防止其影响所述摄像模组的电路以及所述摄像模组的使用寿命。
另外,所述第二粘结层272被设置于所述感光芯片220以及所述滤光片230的所述底表面232的附近,从而能够粘结所述感光芯片220以及所述滤光片230的所述底表面232附近的污尘,从而有助于保持所述感光芯片220以及所述滤光片230的所述底表面232的清洁度,进而保障所述摄像模组的正常工作。更具体地,所述第二粘结层272被设置于所述感光芯片220的外围。由于所述第二粘结层272具有粘性,当污尘从所述摄像模组的外侧进入所述摄像模组内并向所述感光芯片220运动时经过所述第二粘结层272并被所述第二粘结层272所粘结,从而防止其到达所述感光芯片220,从而保障了所述感光芯片220的清洁度,从而使所述感光芯片220能够更好地工作,进而提高所述摄像模组的质量。
根据本实用新型的所述第十八个优选实施例,所述顶表面231包括一边缘顶面2311。所述滤光片230被支撑于所述第二支撑体242的所述内顶面24214。如图22所示,所述边缘顶面2311处于所述第二支撑体242的所述内顶面24214的上方。
图23示意了根据本实用新型的上述第十八个优选实施例的所述摄像模组的第一个可替换实施例。根据所述第一个可替换实施例的一摄像模组包括一光学镜头210、一感光芯片220、一滤光片230、一支架240、一电路板250、一系列电子元件260和一组捕尘结构270A。所述组捕尘结构270A包括至少一第一粘结层271A和至少一第二粘结层272。所述支架240包括一第一支撑体241和一第二支撑体242所述第二支撑体242具有一第一内侧面24211、一第二内侧面24212、一第三内侧面24213、一内顶面24214和一内底面24215。与上述第十八个优选实施例不同的是,所述第一粘结层271A被均匀设置于所述第一内侧面24211和所述内顶面24214。更具体地,所述第一粘结层271A被均匀、连续地设置于所述第一内侧面24211和所述内顶面24214,从而对所述滤光片230进行更为牢固的固定。所述滤光片230具有一顶表面231和一底表面232。
如图23所示,所述第一粘结层271A具有一第一裸露面2711和一第二裸露面2712A。更具体地,被设置于所述第一内侧面24211的所述第一粘结层271A具有所述第一裸露面2711。被设置于所述内顶面24214的所述第一粘结层271A具有所述第二裸露面2712A。值得一提的是,所述第一裸露面2711和所述第二裸露面2712A均具有粘结的作用。换言之,所述第一裸露面2711和所述第二裸露面2712A均具有粘性,从而能够粘结到达其的污物。
所述第一裸露面2711在所述滤光片230的所述顶表面231的附近被裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230的所述顶表面231的清洁。
所述第二裸露面2712A在所述滤光片230的所述底表面232的附近被裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230的所述底表面232的清洁。值得一提的是,所述第二裸露面2712A也被裸露于所述感光芯片220的附近,所以所述第二裸露面2712A的设置同时有利于保持所述感光芯片220的清洁。
图24示意了根据本实用新型的上述第十八个优选实施例的所述摄像模组的第二个可替换实施例。根据所述第二个可替换实施例的一摄像模组包括一光学镜头210、一感光芯片220、一滤光片230、一支架240、一电路板250、一系列电子元件260和一组捕尘结构270B。所述组捕尘结构270B包括至少一第一粘结层271B和至少一第二粘结层272。所述支架240包括一第一支撑体241和一第二支撑体242所述第二支撑体242具有一第一内侧面24211、一第二内侧面24212、一第三内侧面24213、一内顶面24214和一内底面24215。所述滤光片230具有一顶表面231和一底表面232。
光线经所述滤光片230过滤时无需经过所述边缘顶面2311。
根据本实用新型的所述第十八个优选实施例的所述可替换实施例,所述滤光片230被支撑于所述第二支撑体242的所述内顶面24214。与上述第十八个优选实施例不同的是,所述第一粘结层271B被均匀设置于所述滤光片230的所述边缘顶面2311、第二支撑体242的所述第一内侧面24211、所述第二支撑体242的所述内顶面24214和所述第二支撑体242的所述第二内侧面24212。更具体地,所述第一粘结层271B被均匀、连续地设置于所述滤光片230的所述边缘顶面2311、第二支撑体242的所述第一内侧面24211、所述第二支撑体242的所述内顶面24214和所述第二支撑体242的所述第二内侧面24212。
如图24所示,所述第一粘结层271B具有一第一裸露面2711B和一第二裸露面2712B。更具体地,被设置于所述第一内侧面24211的所述第一粘结层271B具有所述第一裸露面2711B。被设置于所述内顶面24214的所述第一粘结层271B具有所述第二裸露面2712B。值得一提的是,所述第一裸露面2711B和所述
第二裸露面2712B均具有粘结的作用。换言之,所述第一裸露面2711B和所述第二裸露面2712B均具有粘性,从而能够粘结到达其的污物。
所述第一裸露面2711B在所述滤光片230的所述顶表面231的附近被裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230的所述顶表面231的清洁。
所述第二裸露面2712B在所述滤光片230的所述底表面232的附近被裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230的所述底表面232的清洁。值得一提的是,所述第二裸露面2712B也被裸露于所述感光芯片220的附近,所以所述第二裸露面2712B的设置同时有利于保持所述感光芯片220的清洁。
值得一提的是,所述第一裸露面2711B相对于所述第十八个优选实施例及其第一个可替换实施例的第一裸露面2711具有更大的表面积并且对所述滤光片230进行更为牢固的连接,其连接作用和粘结作用更强。所述第二裸露面2712B相对于所述第一个优选实施例的第二裸露面2712及根据其第一个可替换实施例的第二裸露面2712A具有更大的表面积,其连粘结作用更强。
附图之图25是根据本实用新型的第十九个优选实施例的一摄像模组的示意图。如图25所示,所述摄像模组包括一光学镜头210C、一感光芯片220C、一滤光片230C、一支架240C、一电路板250C、一系列电子元件260C、一组捕尘结构270C、至少一引线280C和一马达290C。所述引线280C被设置,以被用于可通电导通所述感光芯片220C和所述电路板250C。
所述光学镜头210C被设置于所述感光芯片220C的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210C的处理之后进一步被所述感光芯片220C接受以适于进行光电转化。
依据本实用新型的所述第十九个优选实施例,所述支架240C被设置,以被用于对所述滤光片230C提供支撑,从而使所述滤光片230C能够被稳定保持于预设位置。所述光学镜头210C被设置于所述马达290C,以被所述马达290C支撑并能够通过所述马达290C对所述光学镜头210C进行调节。所述电子元件260C与所述电路板250C进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220C与所述电路板250C进行可通电导通,以使所述感光芯片220C能够发挥光电转化作用。
如图25所示,所述捕尘结构270C包括至少一第一粘结层271C和至少一第二粘结层272C。所述第一粘结层271C被设置于所述滤光片230C的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230C的表面。也就是说,所述第一粘结层271C具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271C能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230C的表面,从而防止污尘对所述滤光片230C产生影响,进而防止所述摄像模组内部出现污点成像。
具体地,所述第一粘结层271C具有粘性的胶状涂层,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第一粘结层271C的材质为UV型胶。
UV型胶水通过紫外曝光后固化形成固态胶,其被固化后仍然具有粘性,可粘附污尘,例如可移动颗粒。值得一提的是,UV型胶还具有阻挡杂光的作用,从而提高所述摄像模组的性能。
如图25所示,所述支架240C的所述支架240C具有一第一内侧面24211C、一第二内侧面24212C、一第三内侧面24213C、一内顶面24214C和一内底面24215C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C相互连接形成所述支架240C的内表面2421C。所述支架240C具有一容纳空间2420C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C被设置于所述容纳空间2420C的周围。
所述滤光片230C和所述感光芯片220C均被设置于所述容纳空间2420C内。所述第一粘结层271C被设置于所述支架240C的所述内表面2421C,以有利于保持所述支架240C内的环境的清洁,进而保障所述滤光片230C和所述感光芯片220C的清洁。
更具体地,根据本实用新型的所述第十九个优选实施例,所述第一粘结层271C被均匀设置于所述支架240C的所述内底面24215C。所述滤光片230C被设置于所述第一粘结层271C。也就是说,所述第一粘结层271C被设置于所述支架240C和所述滤光片230C之间。值得一提的是,由于所述第一粘结层271C具有粘性,所述第一粘结层271C不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述支架240C和所述滤光片230C的作用。根据本实用新型的所述第十九个优选实施例,所述滤光片230C被倒装于所述支架240C。
更具体的,由于UV型胶可以从液态转化为固态,故所述第一粘结层271C的形状可以根据所述支架240C和所述滤光片230C的形状发生改变,这样所述第一粘结层271C有效填充了所述支架240C和所述滤光片230C之间的缝隙,从而防止污物进入所述支架240C和所述滤光片230C之间,进而避免这些污物带来的性能不良隐患。值得一提的是,所述第一粘结层271C被设置于所述滤光片230C的外侧。污尘从所述摄像模组的外部进入所述摄像模组的内部并进而向所述滤光片230C扩散的途中,受到所述第一粘结层271C的作用而在其到达所述滤光片230C之前被所述第一粘结层271C所粘结,从而保障了所述滤光片230C的清洁度。
更具体地,所述滤光片230C具有一顶表面231C和一底表面232C。所述第一粘结层271C包括一第一裸露面2711C。所述第一裸露面2711C在所述滤光片230C的所述顶表面231C的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230C的所述顶表面231C的清洁。值得一提的是,所述第一裸露面2711C具有粘结的作用。换言之,所述第一裸露面2711C具有粘性,从而能够粘结到达其的污物。
如图25所示,所述第二粘结层272C被设置于所述感光芯片220C以及所述滤光片230C的所述底表面232C的附近,从而能够防止污尘,例如可移动颗粒附着在所述感光芯片220C的表面以及所述滤光片230C的所述底表面232C。也就是说,所述第二粘结层272C具有粘结污尘的作用,当污尘从其经过时,所述第二粘结层272C能够将从其经过的污尘粘结,从而防止污尘运动至所述感光芯片220C的表面以及所述滤光片230C的所述底表面232C,从而防止污尘对所述感光芯片220C以及所述滤光片230C产生影响,进而防止所述摄像模组出现污点和坏点。
具体地,所述第二粘结层272C具有粘性,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第二粘结层272C具体实施为胶状物或者胶膜。
根据本实用新型的所述第十九个优选实施例,所述感光芯片220C被设置于所述电路板250C。所述电子元件260C被设置于所述电路板250C并处于所述感光芯片220C的附近。值得一提的是,所述引线280C与所述电路板250C的连接处容易聚集污尘。而污尘往往会对其可通电连接造成影响,从而影响所述感光芯片220C的可通电导通以及所述摄像模组的电路连接,并进而影响整个摄像模组的使用寿命。如图25所示,所述引线280C具有一线路板连接端281C。所述第二粘结层272C被覆盖于所述引线280C的所述线路板连接端281C并将所述引线280C固定于所述电路板250C。所述第二粘结层272C对所述引线280C的所述线路板连接端281C的周围环境进行密封,从而防止污尘进入所述引线280C的所述线路板连接端281C与所述电路板250C之间的间隙,进而防止其影响所述摄像模组的电路以及所述摄像模组的使用寿命。
另外,所述第二粘结层272C被设置于所述感光芯片220C以及所述滤光片230C的所述底表面232C
的附近,从而能够粘结所述感光芯片220C以及所述滤光片230C的所述底表面232C附近的污尘,从而有助于保持所述感光芯片220C以及所述滤光片230C的所述底表面232C的清洁度,进而保障所述摄像模组的正常工作。更具体地,所述第二粘结层272C被设置于所述感光芯片220C的外围。由于所述第二粘结层272C具有粘性,当污尘从所述摄像模组的外侧进入所述摄像模组内并向所述感光芯片220C运动时经过所述第二粘结层272C并被所述第二粘结层272C所粘结,从而防止其到达所述感光芯片220C,从而保障了所述感光芯片220C的清洁度,从而使所述感光芯片220C能够更好地工作,进而提高所述摄像模组的质量。
根据本实用新型的所述第十九个优选实施例,所述顶表面231C包括一边缘顶面2311C。所述滤光片230C被设置于所述支架240C的所述内底面24215C。如图25所示,所述边缘顶面2311C处于所述支架240C的所述内底面24215C的下方。值得一提的是,所述边缘顶面2311C所处的所述滤光片230C的边缘部分的设置使所述滤光片230C能够被稳定连接和支撑,其无需具有滤光效果。所述第一粘结层271C被设置于所述边缘顶面2311C也不会影响所述滤光片230C的滤光效果。相反,所述第一粘结层271C具有阻挡杂光的作用,从而提高所述摄像模组的性能。
附图之图26是根据本实用新型的第十九个优选实施例的所述摄像模组的第一个可替换实施例示意图。如图26所示,所述摄像模组包括一光学镜头210C、一感光芯片220C、一滤光片230C、一支架240C、一电路板250C、一系列电子元件260C、一组捕尘结构270D、至少一引线280C和一马达290C。所述引线280C被设置,以被用于可通电导通所述感光芯片220C和所述电路板250C。
所述光学镜头210C被设置于所述感光芯片220C的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210C的处理之后进一步被所述感光芯片220C接受以适于进行光电转化。
所述支架240C被设置,以被用于对所述滤光片230C提供支撑,从而使所述滤光片230C能够被稳定保持于预设位置。所述光学镜头210C被设置于所述马达290C,以被所述马达290C支撑并能够通过所述马达290C对所述光学镜头210C进行调节。所述电子元件260C与所述电路板250C进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220C与所述电路板250C进行可通电导通,以使所述感光芯片220C能够发挥光电转化作用。
如图26所示,所述捕尘结构270D包括至少一第一粘结层271D和至少一第二粘结层272C。所述第一粘结层271D被设置于所述滤光片230C的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230C的表面。也就是说,所述第一粘结层271D具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271D能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230C的表面,从而防止污尘对所述滤光片230C产生影响,进而防止所述摄像模组内部出现污点成像。
如图26所示,所述支架240C的所述支架240C具有一第一内侧面24211C、一第二内侧面24212C、一第三内侧面24213C、一内顶面24214C和一内底面24215C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C相互连接形成所述支架240C的内表面2421C。所述支架240C具有一容纳空间2420C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C被设置于所述容纳空间2420C的周围。所述滤光片230C和所述感光芯片220C均被设置于所述容纳空间2420C内。所述第一粘结层271D被设置于所述支架240C的所述内表面2421C,以有利于保持所述支架240C内的环境的清洁,进而保障所述滤光片230C和所述感光芯片220C的清洁。
与本实用新型的所述第十九个优选实施例不同的是,根据所述第十九个优选实施例的所述第一个可替
换实施方式,所述第一粘结层271D被均匀设置于所述支架240C的所述内底面24215C和所述第三内侧面24213C。所述滤光片230C被设置于所述第一粘结层271D。值得一提的是,由于所述第一粘结层271D具有粘性,所述第一粘结层271D不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述支架240C和所述滤光片230C的作用。根据本实用新型的所述第十九个优选实施例的所述第一个可替换实施方式,所述滤光片230C被倒装于所述支架240C。
更具体地,所述滤光片230C具有一顶表面231C和一底表面232C。所述第一粘结层271D包括一第一裸露面2711D和一第二裸露面2712D。所述第一裸露面2711D在所述滤光片230C的所述顶表面231C的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230C的所述顶表面231C的清洁。所述第二裸露面2712D在所述滤光片230C的所述底表面232C的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230C的所述底表面232C的清洁。值得一提的是,所述第一裸露面2711D和所述第二裸露面2712D具有粘性,从而能够粘结到达其的污物。
值得一提的是,所述第二裸露面2712D也被裸露于所述感光芯片220C和所述电子元件260C的附近,所以所述第二裸露面2712D的设置同时有利于保持所述感光芯片220C和所述电子元件260C的清洁。
附图之图27是根据本实用新型的第十九个优选实施例的所述摄像模组的第二个可替换实施例示意图。如图27所示,所述摄像模组包括一光学镜头210C、一感光芯片220C、一滤光片230C、一支架240C、一电路板250C、一系列电子元件260C、一组捕尘结构270E、至少一引线280C和一马达290C。所述引线280C被设置,以被用于可通电导通所述感光芯片220C和所述电路板250C。
所述光学镜头210C被设置于所述感光芯片220C的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210C的处理之后进一步被所述感光芯片220C接受以适于进行光电转化。
所述支架240C被设置,以被用于对所述滤光片230C提供支撑,从而使所述滤光片230C能够被稳定保持于预设位置。所述光学镜头210C被设置于所述马达290C,以被所述马达290C支撑并能够通过所述马达290C对所述光学镜头210C进行调节。所述电子元件260C与所述电路板250C进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220C与所述电路板250C进行可通电导通,以使所述感光芯片220C能够发挥光电转化作用。
如图27所示,所述捕尘结构270E包括至少一第一粘结层271E和至少一第二粘结层272C。所述第一粘结层271E被设置于所述滤光片230C的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230C的表面。也就是说,所述第一粘结层271E具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271E能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230C的表面,从而防止污尘对所述滤光片230C产生影响,进而防止所述摄像模组内部出现污点成像。
如图27所示,所述支架240C的所述支架240C具有一第一内侧面24211C、一第二内侧面24212C、一第三内侧面24213C、一内顶面24214C和一内底面24215C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C相互连接形成所述支架240C的内表面2421C。所述支架240C具有一容纳空间2420C。所述第一内侧面24211C、所述第二内侧面24212C、所述第三内侧面24213C、所述内顶面24214C和所述内底面24215C被设置于所述容纳空间2420C的周围。所述滤光片230C和所述感光芯片220C均被设置于所述容纳空间2420C内。所述第一粘结层271E被设置于所述支架240C的所述内表面2421C,以有利于保持所述支架240C内的环境的清洁,进而保障所述滤光片230C和所述感光芯片220C的清洁。
与本实用新型的所述第十九个优选实施例不同的是,根据所述第十九个优选实施例的所述第二个可替换实施方式,所述第一粘结层271E被均匀设置于所述支架240C的所述第一内侧面24211C、所述第二内侧面24212C、所述内底面24215C和所述第三内侧面24213C。所述滤光片230C被设置于所述支架240C的所述内顶面24214C。值得一提的是,由于所述第一粘结层271E具有粘性,所述第一粘结层271E不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述支架240C和所述滤光片230C的作用。
更具体地,所述滤光片230C具有一顶表面231C和一底表面232C。所述第一粘结层271E包括一第一裸露面2711E和一第二裸露面2712E。所述第一裸露面2711E在所述滤光片230C的所述顶表面231C的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230C的所述顶表面231C的清洁。所述第二裸露面2712E在所述滤光片230C的所述底表面232C的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230C的所述底表面232C的清洁。值得一提的是,所述第一裸露面2711E和所述第二裸露面2712E具有粘性,从而能够粘结到达其的污物。
值得一提的是,所述第二裸露面2712E也被裸露于所述感光芯片220C和所述电子元件260C的附近,所以所述第二裸露面2712E的设置同时有利于保持所述感光芯片220C和所述电子元件260C的清洁。
附图之图28是根据本实用新型的第二十个优选实施例的一摄像模组的示意图。如图28所示,所述摄像模组包括一光学镜头210F、一感光芯片220F、一滤光片230F、一支架240F、一电路板250F、一系列电子元件260F、一组捕尘结构270F、至少一引线280F和一马达290F。所述引线280F被设置,以被用于可通电导通所述感光芯片220F和所述电路板250F。
所述光学镜头210F被设置于所述感光芯片220F的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210F的处理之后进一步被所述感光芯片220F接受以适于进行光电转化。
依据本实用新型的所述第二十个优选实施例,所述支架240F被设置,以被用于对所述滤光片230F提供支撑,从而使所述滤光片230F能够被稳定保持于预设位置。所述光学镜头210F被设置于所述马达290F,以被所述马达290F支撑并能够通过所述马达290F对所述光学镜头210F进行调节。所述电子元件260F与所述电路板250F进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220F与所述电路板250F进行可通电导通,以使所述感光芯片220F能够发挥光电转化作用。
如图28所示,所述捕尘结构270F包括至少一第一粘结层271F和至少一第二粘结层272F。所述第一粘结层271F被设置于所述滤光片230F的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230F的表面。也就是说,所述第一粘结层271F具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271F能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230F的表面,从而防止污尘对所述滤光片230F产生影响,进而防止所述摄像模组内部出现污点成像。
具体地,所述第一粘结层271F具有粘性的胶状涂层,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第一粘结层271F的材质选自热固胶和自干胶和UV型胶。
热固胶水通过烘烤加热后固化形成热固胶,其被固化后仍然具有粘性,可粘附污尘,例如可移动颗粒。值得一提的是,热固胶还具有阻挡杂光的作用,从而提高所述摄像模组的性能。
自干胶是指自然干燥(固化)型胶水固化后形成的胶。自然干燥(固化)型胶水被涂布后经时放置自然固化,固化后表面仍然具有粘性,可以粘附污尘,例如可移动颗粒。自然干燥(固化)型胶水固化后形成的自干胶不透明,其具有阻挡杂光的作用,从而提高所述摄像模组的性能。
UV型胶水通过紫外曝光后固化形成固态胶,其被固化后仍然具有粘性,可粘附污尘,例如可移动颗
粒。值得一提的是,UV型胶还具有阻挡杂光的作用,从而提高所述摄像模组的性能。
如图28所示,所述支架240F的所述支架240F具有一第一内侧面24211F、一第二内侧面24212F、一第三内侧面24213F、一内顶面24214F和一内底面24215F。所述第一内侧面24211F、所述第二内侧面24212F、所述第三内侧面24213F、所述内顶面24214F和所述内底面24215F相互连接形成所述支架240F的内表面2421F。所述支架240F具有一容纳空间2420F。所述第一内侧面24211F、所述第二内侧面24212F、所述第三内侧面24213F、所述内顶面24214F和所述内底面24215F被设置于所述容纳空间2420F的周围。所述滤光片230F和所述感光芯片220F均被设置于所述容纳空间2420F内。
更具体地,所述滤光片230F具有一顶表面231F和一底表面232F。根据本实用新型的所述第二十个优选实施例,所述顶表面231F包括一边缘顶面2311F。所述滤光片230F被支撑于所述支架240F的所述内顶面24214F。如图28所示,所述边缘顶面2311F处于所述支架240F的所述内顶面24214F的上方。所述第一粘结层271F被均匀、连续设置于所述滤光片230F的所述边缘顶面2311F以及所述支架240F的所述第一内侧面24211F。值得一提的是,所述第一粘结层271F被设置于所述滤光片230F的外侧,当污尘,从所述摄像模组的外部进入所述摄像模组的内部并进而向所述滤光片230F扩散的途中,受到所述第一粘结层271F的作用而在其到达所述滤光片230F之前被所述第一粘结层271F所粘结,从而保障了所述滤光片230F的清洁度。
所述第一粘结层271F包括一第一裸露面2711F。所述第一裸露面2711F在所述滤光片230F的所述顶表面231F的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230F的所述顶表面231F的清洁。值得一提的是,所述第一裸露面2711F具有粘结的作用。换言之,所述第一裸露面2711F具有粘性,从而能够粘结到达其的污物。
如图28所示,所述第二粘结层272F被设置于所述感光芯片220F以及所述滤光片230F的所述底表面232F的附近,从而能够防止污尘,例如可移动颗粒附着在所述感光芯片220F的表面以及所述滤光片230F的所述底表面232F。也就是说,所述第二粘结层272F具有粘结污尘的作用,当污尘从其经过时,所述第二粘结层272F能够将从其经过的污尘粘结,从而防止污尘运动至所述感光芯片220F的表面以及所述滤光片230F的所述底表面232F,从而防止污尘对所述感光芯片220F以及所述滤光片230F产生影响,进而防止所述摄像模组出现污点和坏点。
具体地,所述第二粘结层272F具有粘性,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第二粘结层272F具体实施为胶状物或者胶膜。
根据本实用新型的所述第二十个优选实施例,所述感光芯片220F被设置于所述电路板250F。所述电子元件260F被设置于所述电路板250F。所述第二粘结层272F被设置于所述感光芯片220F的非感光区域(芯片逻辑区域)。不仅能够保持所述感光芯片220F的清洁,而且不会对其光电转化产生不良影响。
另外,所述第二粘结层272F被设置于所述感光芯片220F以及所述滤光片230F的所述底表面232F的附近,从而能够粘结所述感光芯片220F以及所述滤光片230F的所述底表面232F附近的污尘,从而有助于保持所述感光芯片220F以及所述滤光片230F的所述底表面232F的清洁度,进而保障所述摄像模组的正常工作。更具体地,所述第二粘结层272F被设置于所述感光芯片220F的外围。由于所述第二粘结层272F具有粘性,当污尘从所述摄像模组的外侧进入所述摄像模组内并向所述感光芯片220F运动时经过所述第二粘结层272F并被所述第二粘结层272F所粘结,从而防止其到达所述感光芯片220F,从而保障了所述感光芯片220F的清洁度,从而使所述感光芯片220F能够更好地工作,进而提高所述摄像模组的质量。
附图之图29是根据本实用新型的第二十个优选实施例的所述摄像模组的一可替换实施例示意图。如
图29所示,所述摄像模组包括一光学镜头210F、一感光芯片220F、一滤光片230F、一支架240F、一电路板250F、一系列电子元件260F、一组捕尘结构270G、至少一引线280F和一马达290F。所述引线280F被设置,以被用于可通电导通所述感光芯片220F和所述电路板250F。
所述光学镜头210F被设置于所述感光芯片220F的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210F的处理之后进一步被所述感光芯片220F接受以适于进行光电转化。
所述支架240F被设置,以被用于对所述滤光片230F提供支撑,从而使所述滤光片230F能够被稳定保持于预设位置。所述光学镜头210F被设置于所述马达290F,以被所述马达290F支撑并能够通过所述马达290F对所述光学镜头210F进行调节。所述电子元件260F与所述电路板250F进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220F与所述电路板250F进行可通电导通,以使所述感光芯片220F能够发挥光电转化作用。
如图29所示,所述捕尘结构270G包括至少一第一粘结层271G和至少一第二粘结层272F。所述第一粘结层271G被设置于所述滤光片230F的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230F的表面。也就是说,所述第一粘结层271G具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271G能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230F的表面,从而防止污尘对所述滤光片230F产生影响,进而防止所述摄像模组内部出现污点成像。
如图29所示,所述支架240F的所述支架240F具有一第一内侧面24211F、一第二内侧面24212F、一第三内侧面24213F、一内顶面24214F和一内底面24215F。所述第一内侧面24211F、所述第二内侧面24212F、所述第三内侧面24213F、所述内顶面24214F和所述内底面24215F相互连接形成所述支架240F的内表面2421F。所述支架240F具有一容纳空间2420F。所述第一内侧面24211F、所述第二内侧面24212F、所述第三内侧面24213F、所述内顶面24214F和所述内底面24215F被设置于所述容纳空间2420F的周围。所述滤光片230F和所述感光芯片220F均被设置于所述容纳空间2420F内。所述滤光片230F被设置于所述支架240F的所述内顶面24214F。所述滤光片230F具有一顶表面231F和一底表面232F。所述顶表面231F包括一边缘顶面2311F。所述边缘顶面2311F处于所述支架240F的所述内顶面24214F的上方。
与本实用新型的所述第二十个优选实施例不同的是,根据所述第二十个优选实施例的所述可替换实施方式,所述第一粘结层271G被均匀设置于所述支架240F的所述滤光片230F的所述边缘顶面2311F。值得一提的是,由于所述第一粘结层271G具有粘性,所述第一粘结层271G不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述支架240F和所述滤光片230F的作用。值得一提的是,所述边缘顶面2311F所处的所述滤光片230F的边缘部分的设置使所述滤光片230F能够被稳定连接和支撑,其无需具有滤光效果。所述第一粘结层271F被设置于所述边缘顶面2311F也不会影响所述滤光片230F的滤光效果。
所述第一粘结层271G包括一第一裸露面2711G和一第二裸露面2712G。所述第一裸露面2711G在所述滤光片230F的所述顶表面231F的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230F的所述顶表面231F的清洁。所述第二裸露面2712G在所述滤光片230F的所述底表面232F的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230F的所述底表面232F的清洁。值得一提的是,所述第一裸露面2711G和所述第二裸露面2712G具有粘性,从而能够粘结到达其的污物。
值得一提的是,所述第二裸露面2712G也被裸露于所述感光芯片220F和所述电子元件260F的附近,所以所述第二裸露面2712G的设置同时有利于保持所述感光芯片220F和所述电子元件260F的清洁。
附图之图30是根据本实用新型的第二十一个优选实施例的一摄像模组的示意图。如图30所示,所述摄像模组包括一光学镜头210H、一感光芯片220H、一滤光片230H、一支架240H、一电路板250H、一系列电子元件260H、一组捕尘结构270H、至少一引线280H和一马达290H。所述引线280H被设置,以被用于可通电导通所述感光芯片220H和所述电路板250H。
所述光学镜头210H被设置于所述感光芯片220H的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210H的处理之后进一步被所述感光芯片220H接受以适于进行光电转化。
依据本实用新型的所述第二十一个优选实施例,所述支架240H被设置,以被用于对所述滤光片230H提供支撑,从而使所述滤光片230H能够被稳定保持于预设位置。所述光学镜头210H被设置于所述马达290H,以被所述马达290H支撑并能够通过所述马达290H对所述光学镜头210H进行调节。所述电子元件260H与所述电路板250H进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220H与所述电路板250H进行可通电导通,以使所述感光芯片220H能够发挥光电转化作用。
如图30所示,所述捕尘结构270H包括至少一第一粘结层271H和至少一第二粘结层272H。所述第一粘结层271H被设置于所述滤光片230H的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230H的表面。也就是说,所述第一粘结层271H具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271H能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230H的表面,从而防止污尘对所述滤光片230H产生影响,进而防止所述摄像模组内部出现污点成像。
具体地,所述第一粘结层271H具有粘性的胶状涂层,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第一粘结层271H的材质为UV型胶。
UV型胶水通过紫外曝光后固化形成固态胶,其被固化后仍然具有粘性,可粘附污尘,例如可移动颗粒。值得一提的是,UV型胶还具有阻挡杂光的作用,从而提高所述摄像模组的性能。
如图30所示,所述支架240H的所述支架240H具有一第一内侧面24211H、一第二内侧面24212H、一第三内侧面24213H、一内顶面24214H和一内底面24215H。所述第一内侧面24211H、所述第二内侧面24212H、所述第三内侧面24213H、所述内顶面24214H和所述内底面24215H相互连接形成所述支架240H的内表面2421H。所述支架240H具有一容纳空间2420H。所述第一内侧面24211H、所述第二内侧面24212H、所述第三内侧面24213H、所述内顶面24214H和所述内底面24215H被设置于所述容纳空间2420H的周围。所述滤光片230H和所述感光芯片220H均被设置于所述容纳空间2420H内。所述第一粘结层271H被设置于所述支架240H的所述内表面2421H,以有利于保持所述支架240H内的环境的清洁,进而保障所述滤光片230H和所述感光芯片220H的清洁。
更具体地,所述滤光片230H具有一顶表面231H和一底表面232H。根据本实用新型的所述第二十一个优选实施例,所述底表面232H包括一边缘底面2321H。所述滤光片230H被设置于所述支架240H的所述内底面24215H。如图30所示,所述边缘底面2321H处于所述支架240H的所述内底面24215H的下方。
根据本实用新型的所述第二十一个优选实施例,所述第一粘结层271H被均匀设置于所述支架240H的所述第三内侧面24213H和所述滤光片230H的所述边缘底面2321H。值得一提的是,由于所述第一粘结层271H具有粘性,所述第一粘结层271H不仅可以起到粘结污尘的作用,而且还可以起到连接所述支架240H和所述滤光片230H的作用。根据本实用新型的所述第二十一个优选实施例,所述滤光片230H被倒装于所述支架240H。
更具体的,由于UV型胶可以从液态转化为固态,故所述第一粘结层271H的形状可以根据所述支架
240H和所述滤光片230H的形状发生改变,这样所述第一粘结层271H有效填充了所述支架240H和所述滤光片230H之间的缝隙,从而防止污物进入所述支架240H和所述滤光片230H之间,进而避免这些污物带来的性能不良隐患。值得一提的是,所述第一粘结层271H被设置于所述滤光片230H的外侧,当污尘,从所述摄像模组的外部进入所述摄像模组的内部并进而向所述滤光片230H扩散的途中,受到所述第一粘结层271H的作用而在其到达所述滤光片230H之前被所述第一粘结层271H所粘结,从而保障了所述滤光片230H的清洁度。
所述第一粘结层271H包括一第二裸露面2712H。所述第二裸露面2712H在所述滤光片230H的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230H的清洁。值得一提的是,所述第二裸露面2712H具有粘结的作用。换言之,所述第二裸露面2712H具有粘性,从而能够粘结到达其的污物。
如图30所示,所述第二粘结层272H被设置于所述感光芯片220H以及所述滤光片230H的所述底表面232H的附近,从而能够防止污尘,例如可移动颗粒附着在所述感光芯片220H的表面以及所述滤光片230H的所述底表面232H。也就是说,所述第二粘结层272H具有粘结污尘的作用,当污尘从其经过时,所述第二粘结层272H能够将从其经过的污尘粘结,从而防止污尘运动至所述感光芯片220H的表面以及所述滤光片230H的所述底表面232H,从而防止污尘对所述感光芯片220H以及所述滤光片230H产生影响,进而防止所述摄像模组出现污点和坏点。
具体地,所述第二粘结层272H具有粘性,其能够粘附污尘,从而对污尘进行粘结。更具体地,所述第二粘结层272H具体实施为胶状物或者胶膜。
根据本实用新型的所述第二十一个优选实施例,所述感光芯片220H被设置于所述电路板250H。所述第二粘结层272H覆盖于所述引线280H从而对所述引线280H进行保护。值得一提的是,所述引线280H及其连接处容易聚集污尘。而污尘往往会对其可通电连接造成影响,从而影响所述感光芯片220H的可通电导通以及所述摄像模组的电路连接,并进而影响整个摄像模组的使用寿命。如图30所示,所述第二粘结层272H被设置,以覆盖所述引线280H并对所述引线280H进行固定。所述第二粘结层272H对所述引线280H的周围环境进行保护,从而防止污尘到达所述引线280H,进而防止其影响所述摄像模组的电路以及所述摄像模组的使用寿命。
另外,所述第二粘结层272H被设置于所述感光芯片220H、所述电子元件260H以及所述滤光片230H的所述底表面232H的附近,从而能够粘结所述感光芯片220H、所述电子元件260H以及所述滤光片230H的所述底表面232H附近的污尘,从而有助于保持所述感光芯片220H、所述电子元件260H以及所述滤光片230H的所述底表面232H的清洁度,进而保障所述摄像模组的正常工作。更具体地,所述第二粘结层272H被设置于所述感光芯片220H的外围。由于所述第二粘结层272H具有粘性,当污尘从所述摄像模组的外侧进入所述摄像模组内并向所述感光芯片220H及所述电子元件260H运动时经过所述第二粘结层272H并被所述第二粘结层272H所粘结,从而防止其到达所述感光芯片220H及所述电子元件260H,从而保障了所述感光芯片220H及所述电子元件260H的清洁度,从而使所述感光芯片220H能够更好地工作,进而提高所述摄像模组的质量。
附图之图31是根据本实用新型的第二十一个优选实施例的所述摄像模组的一可替换实施例示意图。如图31所示,所述摄像模组包括一光学镜头210H、一感光芯片220H、一滤光片230H、一支架240H、一电路板250H、一系列电子元件260H、一组捕尘结构270K、至少一引线280H和一马达290H。所述引线280H被设置,以被用于可通电导通所述感光芯片220H和所述电路板250H。
所述光学镜头210H被设置于所述感光芯片220H的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210H的处理之后进一步被所述感光芯片220H接受以适于进行光电转化。
所述支架240H被设置,以被用于对所述滤光片230H提供支撑,从而使所述滤光片230H能够被稳定保持于预设位置。所述光学镜头210H被设置于所述马达290H,以被所述马达290H支撑并能够通过所述马达290H对所述光学镜头210H进行调节。所述电子元件260H与所述电路板250H进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220H与所述电路板250H进行可通电导通,以使所述感光芯片220H能够发挥光电转化作用。
如图31所示,所述捕尘结构270K包括至少一第一粘结层271K和至少一第二粘结层272H。所述第一粘结层271K被设置于所述滤光片230H的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230H的表面。也就是说,所述第一粘结层271K具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271K能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230H的表面,从而防止污尘对所述滤光片230H产生影响,进而防止所述摄像模组内部出现污点成像。
如图31所示,所述支架240H的所述支架240H具有一第一内侧面24211H、一第二内侧面24212H、一第三内侧面24213H、一内顶面24214H和一内底面24215H。所述第一内侧面24211H、所述第二内侧面24212H、所述第三内侧面24213H、所述内顶面24214H和所述内底面24215H相互连接形成所述支架240H的内表面2421H。所述支架240H具有一容纳空间2420H。所述第一内侧面24211H、所述第二内侧面24212H、所述第三内侧面24213H、所述内顶面24214H和所述内底面24215H被设置于所述容纳空间2420H的周围。所述滤光片230H和所述感光芯片220H均被设置于所述容纳空间2420H内。所述第一粘结层271K被设置于所述支架240H的所述内表面2421H,以有利于保持所述支架240H内的环境的清洁,进而保障所述滤光片230H和所述感光芯片220H的清洁。
所述滤光片230H被设置于所述支架240H的所述内顶面24214H。所述滤光片230H具有一顶表面231H和一底表面232H。所述底表面232H包括一边缘底面2321H。所述滤光片230H被设置于所述支架240H的所述内底面24215H。如图30所示,所述边缘底面2321H处于所述支架240H的所述内底面24215H的下方。
与本实用新型的所述第二十一个优选实施例不同的是,根据所述第二十一个优选实施例的所述可替换实施方式,所述第一粘结层271K被均匀设置于所述支架240H的所述滤光片230H的所述边缘底面2321H。值得一提的是,由于所述第一粘结层271K具有粘性,所述第一粘结层271K不仅可以起到粘结污尘的作用,而且还可以起到固定和连接所述支架240H和所述滤光片230H的作用。值得一提的是,所述边缘底面2321H所处的所述滤光片230H的边缘部分的设置使所述滤光片230H能够被稳定连接和支撑,其无需具有滤光效果。所述第一粘结层271H被设置于所述边缘底面2321H也不会影响所述滤光片230H的滤光效果。
所述第一粘结层271K包括一第二裸露面2712K。所述第二裸露面2712K在所述滤光片230H的所述底表面232H的附近裸露于周围环境中,从而能够粘结其周围环境的污物,从而保持所述滤光片230H的所述底表面232H的清洁。值得一提的是,所述第二裸露面2712K具有粘性,从而能够粘结到达其的污物。
值得一提的是,所述第二裸露面2712K也被裸露于所述感光芯片220H和所述电子元件260H的附近,所以所述第二裸露面2712K的设置同时有利于保持所述感光芯片220H和所述电子元件260H的清洁。
如图32的所示是根据本发明的第二十二个优选实施例的摄像模组,其中所述摄像模组包括一光学镜头210L、一感光芯片220L、一滤光片230L、一支架240L、一电路板250L、一系列电子元件260L、一组捕尘结构270L、至少一引线280L和一马达290L。所述引线280L被设置,以被用于可通电导通所述感光
芯片220L和所述电路板250L。
所述光学镜头210L被设置于所述感光芯片220L的感光路径,从而在所述摄像模组被用于采集物体的影像时,被物体反射的光线能够在藉由所述光学镜头210L的处理之后进一步被所述感光芯片220L接受以适于进行光电转化。
所述支架240L被设置,以被用于对所述滤光片230L提供支撑,从而使所述滤光片230L能够被稳定保持于预设位置。所述光学镜头210L被设置于所述马达290L,以被所述马达290L支撑并能够通过所述马达290L对所述光学镜头210L进行调节。所述电子元件260L与所述电路板250L进行可通电导通,以使所述摄像模组具有预设功能。所述感光芯片220L与所述电路板250L进行可通电导通,以使所述感光芯片220L能够发挥光电转化作用。
如图32所示,所述捕尘结构270L包括至少一第一粘结层271L和至少一第二粘结层272L。所述第一粘结层271L被设置于所述滤光片230L的附近,从而能够防止污尘,例如可移动颗粒附着在所述滤光片230L的表面。也就是说,所述第一粘结层271L具有粘结污尘的作用,当污尘从其经过时,所述第一粘结层271L能够将从其经过的污尘粘结,从而防止污尘运动至所述滤光片230L的表面,从而防止污尘对所述滤光片230L产生影响,进而防止所述摄像模组内部出现污点成像。
如图32所示,所述支架240L的所述支架240L具有一第一内侧面24211L、一第二内侧面24212L、一第三内侧面24213L、一内顶面24214L和一内底面24215L。所述第一内侧面24211L、所述第二内侧面24212L、所述第三内侧面24213L、所述内顶面24214L和所述内底面24215L相互连接形成所述支架240L的内表面2421L。所述支架240L具有一容纳空间2420L。所述第一内侧面24211L、所述第二内侧面24212L、所述第三内侧面24213L、所述内顶面24214L和所述内底面24215L被设置于所述容纳空间2420L的周围。所述滤光片230L和所述感光芯片220L均被设置于所述容纳空间2420L内。可以理解的是,所述第一粘结层271L的位置可以是被设置于所述第一内侧面24211L、所述第二内侧面24212L、所述第三内侧面24213L、所述内顶面24214L和所述内底面24215L中的至少一个表面上。例如,在这所述第一粘结层271L被设置于所述支架240L的第三内侧面24213L,以有利于保持所述支架240L内的环境的清洁,进而保障所述滤光片230L和所述感光芯片220L的清洁。
所述摄像模组是动焦摄像模组并包括用于实现驱动镜头进行自动对焦的马达290L,其包括动子291L和马达外壳292L,所述捕尘结构270L的所述第二粘结层272L被设置于对应所述动子291L和所述马达外壳292L之间的区域,以吸附所述马达外壳292L和所述动子291L周围的粉尘、碎屑等可移动颗粒,从而防止粉尘、碎屑等可移动颗粒穿过所述马达外壳292L而落入位于其下方的所述滤光片230L或所述感光芯片220L的表面而导致污点不良或坏点不良的产生。所述捕尘结构270L的所述第二粘结层272L可以设置于所述马达290L内部,可粘附通过马达结构间隙进入的颗粒异物。
具体而言,如图中所示,所述马达外壳292L向上延伸于所述支架240L并与所述支架240L一体设置,在其他变形中,其也可以是贴装。所述第二粘结层272L设置于所述支架240L的顶表面并且分别靠近所述马达外壳292L的侧边,以吸附所述马达外壳292L和所述动子291L周围的粉尘等可移动颗粒,从而防止粉尘等可移动颗粒穿过所述马达外壳292L而落入位于其下方的所述滤光片230L或所述感光芯片220L的表面而导致污点不良或坏点不良的产生。即所述第二粘结层272L呈筒状,位于所述支架240L的顶侧以及所述马达外壳292L的内侧,并且优选地,其尺寸大于所述马达外壳292L和所述动子291L的间隔,从而吸附所述马达外壳292L和所述动子291L周围的粉尘等可移动颗粒。
值得一提的是,根据以上优选实施例的所述捕尘结构270、270A、270B、270C、270D、270E、270F、
270G、270H、270K、270L的设置位置仅仅是对本发明的示例而非限制。根据本实用新型的其他实施例的粘结元件也可以被设置于其摄像模组的其它位置,例如其马达的内侧,以在其马达内层提供具有粘结性能的裸露面。只要能够达到本发明的发明目的,本发明在这方面不做限制。
另外,所述摄像模组的上述结构只作为举例而并不对本发明的示例进行限制,例如所述滤光片可以设置在所述镜座或所述支架,也可以与所述镜头组装成在一起,或者可以与所述马达组装在一起。所述镜座或所述支架可以与所述电路板相贴装或一体地封装。所述感光芯片和所述电路板可以是通过COB(Chip On Board)工艺用引线相导通,也可能是其他方式如焊接或导电胶接合的导通连接方式。所述感光芯片也可以是和所述电路板相倒装(Flip Chip)的方式。并且可以理解的是,多个所述摄像模组也可以相组合,而形成阵列摄像模组,即本发明的所述捕尘结构可以应用至阵列摄像模组中,所述阵列摄像模组可以是分体式阵列模组,也可以是一体式模组如共用电路板或共用镜座(支架)。
此外,本领域技术人员可以根据实际情况或客户需对本发明上述的所有实施例进行整合、搭配或不超出本领域技术人员的知识范畴进行修改,只要采用了与本发明相同或近似的技术方案,解决了与本发明相同或近似的技术问题,并且达到了与本发明相同或近似的技术效果,均属于本发明的保护范围之内,本发明的具体实施方式并不以此为限。
综上所述,采用本发明所述的具有捕尘结构的摄像模组不仅可以防止粉尘、碎屑等可移动颗粒物落在所述滤光片的表面而导致粉尘、碎屑等可移动颗粒物污点成像而使所述摄像模组变成污点不良,还可以防止粉尘、碎屑等可移动颗粒物进入所述摄像模组的内部落入所述感光芯片或所述滤光片或所述镜头的表面而导致粉尘、碎屑等可移动颗粒物污点成像而使所述摄像模组产生坏点不良,除此以外,本发明所述的具有捕尘结构的摄像模组相对于现有技术中的摄像模组不仅可以增加稳固性,而且在实施为不透光材料时,还能够进一步地在一定程度上遮挡射入所述感光芯片的杂光,从而进一步提高所述摄像模组的成像效果。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。
Claims (89)
- 一具有捕尘结构的摄像模组,包括:一镜头,一感光芯片,所述镜头位于所述感光芯片的感光路径,所述捕尘结构被设置于所述摄像模组内,以用于捕捉所述摄像模组内的可移动颗粒物。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一镜座和一滤光片,其中所述滤光片安装于所述镜座,其中所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路。
- 根据权利要求2所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求2所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一滤光片,其中所述捕尘结构固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路。
- 根据权利要求5所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求5所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,其中所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖所述滤光片的底表面的外边缘,且与所述滤光片底表面固定。
- 根据权利要求8所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求8所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一滤光片,其中所述捕尘结构设置于所述滤光片的底表面的外边缘,并且不影响射入所述感光芯片的光路。
- 根据权利要求11所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求11所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一镜座和一滤光片,其中所述捕尘结构填充于所述滤光片与所述镜座之间的间隙。
- 根据权利要求14所述的具有捕尘结构的摄像模组,其中所述捕尘结构的纵切面为L型,具有一竖直部和一水平部,所述竖直部固定于所述滤光片的外周面与所述镜座的内表面之间,所述水平部固定于所述滤光片的底表面的外边缘与所述镜座之间的间隙。
- 根据权利要求15所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求15所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求14所述的具有捕尘结构的摄像模组,其中所述捕尘结构呈筒形,固定于所述滤光片的外周面与所述镜座的内表面之间。
- 根据权利要求18所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求18所述的具有捕尘结构的摄像模组,其中所述镜座的纵切 面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一镜座,其中所述捕尘结构固定于所述镜座的内表面的一个或多个局部区域,或全部区域。
- 根据权利要求21所述的具有捕尘结构的摄像模组,其中所述捕尘结构位于所述滤光片和所述感光芯片之间的镜座内侧表面。
- 根据权利要求22所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面。
- 根据权利要求22所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的底表面。
- 根据权利要求1所述的具有捕尘结构的摄像模组,其中所述摄像模组进一步包括一马达,其包括一马达外壳和一动子,所述马达外壳向上延伸地设于所述镜座,所述捕尘结构用于捕捉所述马达外壳和所述动子之间的间隙中的可移动颗粒。
- 根据权利要求25所述的具有捕尘结构的摄像模组,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述马达外壳一体延伸于或组装于所述镜座,所述捕尘结构固定于所述第一凸台和所述第二凸台与所述马达外壳的内侧相交处。
- 根据权利要求1所述的具有捕尘结构的摄像模组,还包括一电路板,所述感光芯片电性连接于所述电路板,其中所述捕尘结构设置于所述电路板对应所述感光芯片之外的区域。
- 根据权利要求27所述的具有捕尘结构的摄像模组,其中所述电路板,其中所述电路板集成有多个集成电路元器件,其中在位于所述感光芯片外围的所述集成电路元器件可选择性地被所述捕尘结构包覆。
- 根据权利要求28所述的具有捕尘结构的摄像模组,其中所述感光芯片包括一感光区域和一逻辑区域,其中所述电路板集成有多个集成电路元器件,其中在位于所述感光芯片的所述感光区域的外围的所述集成电路元器件可选择性地被所述捕尘结构包覆。
- 根据权利要求29所述的具有捕尘结构的摄像模组,其中所述电路板上集成有一引线,所述引线的一端连接于所述电路板,所述引线的另一端连接于所述感光芯片的所述逻辑区域,其中所述捕尘结构位于所述感光芯片的所述感光区域的外围并包覆所述引线。
- 根据权利要求1所述的具有捕尘结构的摄像模组,其中所述捕尘结构设置于所述感光芯片的顶表面的非感光区域。
- 根据权利要求1所述的具有捕尘结构的摄像模组,其中还包括一镜座和一滤光片,其中所述捕尘结构的位置选自如下结构中的两种以上的组合:所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;其中所述捕尘结构固定于所述滤光片的顶表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;其中所述捕尘结构延伸于所述滤光片和所述镜座之间并覆盖所述滤光片的底表面的外边缘,且与所述滤光片底表面固定,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;其中所述捕尘结构设置于所述滤光片的底表面的外边缘,并且不影响射入所述感光芯片的光路,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面;其中所述捕尘结构填充于所述滤光片与所述镜座之间的间隙;其中所述捕尘结构的纵切面为L型,具有一竖直部和一水平部,所述竖直部固定于所述滤光片的外周面与所述镜座的内表面之间,所述水平部固定于所述滤光片的底表面的外边缘与所述镜座之间的间隙,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。其中所述捕尘结构呈筒形,固定于所述滤光片的外周面与所述镜座的内表面之间,所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的 两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。其中所述捕尘结构固定于所述镜座的内表面的一个或多个局部区域,或全部区域。其中所述捕尘结构位于所述滤光片和所述感光芯片之间的镜座内侧表面,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述滤光片的纵切面的两端分别固定于所述第一凸台和所述第二凸台的顶表面或底表面。其中所述摄像模组进一步包括一马达,其包括一马达外壳和一动子,所述马达外壳向上延伸地设于所述镜座,所述捕尘结构用于捕捉所述马达外壳和所述动子之间的间隙中的可移动颗粒,其中所述镜座的纵切面包括一第一凸台和一第二凸台,所述马达外壳一体延伸于或组装于所述镜座,所述捕尘结构固定于所述第一凸台和所述第二凸台与所述马达外壳的内侧相交处;其中所述的具有捕尘结构的摄像模组还包括一电路板,所述感光芯片电性连接于所述电路板,其中所述捕尘结构设置于所述电路板对应所述感光芯片之外的区域,其中所述电路板集成有多个集成电路元器件,其中在位于所述感光芯片外围的所述集成电路元器件可选择性地被所述捕尘结构包覆;以及其中所述捕尘结构设置于所述感光芯片的顶表面的非感光区域。
- 根据权利要求1-32中任一项所述的具有捕尘结构的摄像模组,其中所述捕尘结构为一具有粘性的胶状层。
- 根据权利要求33所述的具有捕尘结构的摄像模组,其中所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
- 根据权利要求34所述的具有捕尘结构的摄像模组,其中所述胶状层为UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
- 根据权利要求33所述的具有捕尘结构的摄像模组,其中所述胶状层是透光型材料。
- 根据权利要求33所述的具有捕尘结构的摄像模组,其中所述胶状层是不透光型材料,从而进一步地提供阻挡杂光的性能。
- 根据权利要求33所述的具有捕尘结构的摄像模组,其中所述胶状层是不透光型材料,其通过不反射光线、或呈深色可吸附照射到其表面的光线、或表面粗糙不会对照射到其表面的光线形成镜面反射从而分别提供不反射光线、吸收杂光或遮挡杂光的性能。
- 根据权利要求33所述的具有捕尘结构的摄像模组,其中所述捕尘结构通过点胶、涂胶、喷胶、印刷或贴附工艺形成于所述摄像模组内部。
- 根据权利要求35所述的具有捕尘结构的摄像模组,其中所述胶状层进一步地实施为黑色胶层。
- 一应用于摄像模组的具有捕尘结构的滤光片,其特征在于,包括一滤光片和具有粘性的一捕尘结构,所述滤光片适合于应用于具有一感光芯片的一摄像模组,其中所述捕尘结构设置于所述滤光片并且不影响照射至所述感光芯片的光路,所述捕尘结构用于吸附掉落于所述滤光片表面的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
- 根据权利要求41所述的具有捕尘结构的滤光片,其中所述捕尘结构设置于所述滤光片的顶表面或/和底表面的外边缘。
- 根据权利要求42所述的具有捕尘结构的滤光片,其中所述捕尘结构进一步地延伸至所述滤光片的外周面。
- 根据权利要求41所述的具有捕尘结构的滤光片,其中所述捕尘结构设于所述滤光片的外周面。
- 根据权利要求41至44中任一所述的具有捕尘结构的滤光片,其中所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
- 根据权利要求45所述的具有捕尘结构的滤光片,其中所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
- 根据权利要求46所述的具有捕尘结构的滤光片,其中所述胶状层是透光型材料,或所述胶状层是不透光型材料,其通过不反射光线、或呈深色可吸附照射到其表面的光线、或表面粗糙不会对照射到其表面的光线形成镜面反射从而分别提供不反射光线、吸收杂光或遮挡杂光的性能。
- 一应用于摄像模组的具有捕尘结构的镜座,其特征在于,包括一镜座和具有粘性的一捕尘结构,所述镜座适合于应用于安装一摄像模组的一滤光片,其中所述捕尘结构用于吸附所述镜座内部的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
- 根据权利要求48所述的具有捕尘结构的镜座,其中所述捕尘结构设置于所述镜座内表面的一个或多个局部区域,或设置于所述镜座的全部内表面。
- 根据权利要求48所述的具有捕尘结构的镜座,其中所述镜座包括一顶侧 镜座部,一中间镜座部和一底侧镜座部,其中所述顶侧镜座部形成一顶侧凹槽,所述中间镜座部形成一通孔,所述底侧镜座部形成一底侧凹槽,其中所述中间镜座部相对于所述顶侧镜座部和所述底侧镜座部向内侧凸起地延伸形成一凸台,以使所述通孔的内径小于所述顶侧凹槽和所述底侧凹槽的内径,其中所述滤光片适合于安装于所述顶侧凹槽或所述底侧凹槽内。
- 根据权利要求50所述的具有捕尘结构的镜座,其中所述捕尘结构设置于所述顶侧镜座部的内表面的局部或全部区域、所述中间镜座部的所述凸台的顶表面的局部或全部区域、所述中间镜座部的所述凸台的内表面的局部或全部区域、所述中间镜座部的所述凸台的底表面的局部或全部区域、或所述底侧镜座部的内表面的局部或全部区域、或上述两者以上的组合。
- 根据权利要求48所述的具有捕尘结构的镜座,其中在组装所述摄像模组后,所述捕尘结构填充所述滤光片的所述镜座之间的间隙。
- 根据权利要求48所述的具有捕尘结构的镜座,还包括一马达外壳,其中所述马达外壳延伸于所述镜座,并且在所述马达外壳内侧和所述镜座的顶侧设置有所述捕尘结构。
- 根据权利要求48至53中任一所述的具有捕尘结构的镜座,其中所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
- 根据权利要求54所述的具有捕尘结构的镜座,其中所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
- 根据权利要求55所述的具有捕尘结构的镜座,其中所述胶状层是透光型材料,或所述胶状层是不透光型材料,其通过不反射光线、或呈深色可吸附照射到其表面的光线、或表面粗糙不会对照射到其表面的光线形成镜面反射从而分别提供不反射光线、吸收杂光或遮挡杂光的性能。
- 一应用于摄像模组的具有捕尘结构的电路板,其特征在于,包括一电路板以及具有粘性的一捕尘结构,所述电路板适合于电性连接一摄像模组的一感光芯片,所述捕尘结构设置于所述电路板的对应于安装所述感光芯片以外的区域,以吸附所述摄像模组内部的可移动颗粒,防止所述摄像模组内部出现可移动污点成像。
- 根据权利要求57所述的具有捕尘结构的电路板,其中所述电路板集成有多个集成电路元器件,其中所述集成电路元器件可选择性地被所述捕尘结构包 覆。
- 根据权利要求57至58中任一所述的具有捕尘结构的电路板,其中所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
- 根据权利要求59所述的具有捕尘结构的电路板,其中所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
- 一应用于摄像模组的具有捕尘结构的感光芯片,其特征在于,包括一感光芯片以及具有粘性的一捕尘结构,其中所述捕尘结构设置于所述感光芯片的顶表面的非感光区域,以吸附掉落至所述感光芯片顶表面的可移动颗粒。
- 根据权利要求61所述的具有捕尘结构的感光芯片,其中所述捕尘结构进一步地延伸于所述感光芯片的外周面。
- 根据权利要求61至62中任一所述的具有捕尘结构的感光芯片,其中所述捕尘结构经固化、水洗、烘烤后仍能保持粘性。
- 根据权利要求63所述的具有捕尘结构的感光芯片,其中所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶。
- 一应用于摄像模组的具有捕尘结构的马达,其特征在于,包括一马达以及具有粘性的一捕尘结构,所述捕尘结构设置于所述马达内部以用于粘附通过马达内部间隙进入摄像模组的可移动颗粒,所述捕尘结构是一胶状层,其是UV胶、热固胶、自然干燥型胶或双面具有粘性的不干胶,其经固化、水洗、烘烤后仍能保持粘性。
- 一具有捕尘结构的摄像模组,其特征在于,包括:一光学镜头;一感光芯片,其中所述光学镜头和所述感光芯片光学对齐地排列;和一捕尘结构,其中所述捕尘结构能够粘结所述摄像模组内的污尘。
- 根据权利要求66所述的摄像模组,其进一步包括一滤光片和一支架,其中所述滤光片被设置于所述支架,其中所述捕尘结构进一步包括至少一第一粘结层,其中所述第一粘结层能够粘结所述滤光片附近的污尘。
- 根据权利要求67所述的摄像模组,其中所述支架具有一内表面并具有一容纳空间,其中所述滤光片和所述感光芯片均被设置于所述容纳空间内。
- 根据权利要求66所述的摄像模组,其中所述捕尘结构包括至少一第二粘结层,其中所述第二粘结层被设置于所述感光芯片附近。
- 根据权利要求69所述的摄像模组,其进一步包括一电路板和一系列电子元件,其中所述电子元件被设置于所述电路板,其中所述第二粘结层被设置于所述电子元件以覆盖所述电子元件。
- 根据权利要求69所述的摄像模组,其进一步包括一电路板和至少一引线,其中所述引线被用于可通电导通所述感光芯片和所述电路板,其中所述第二粘结层被设置以覆盖所述引线。
- 根据权利要求70所述的摄像模组,其进一步包括一电路板和至少一引线,其中所述引线被用于可通电导通所述感光芯片和所述电路板,其中所述引线具有一连接于所述电路板的电路板连接端,其中所述第二粘结层被设置以覆盖所述引线的所述电路板连接端。
- 根据权利要求69所述的摄像模组,其中所述第二粘结层被设置于所述感光芯片的非感光区域。
- 根据权利要求69所述的摄像模组,其中所述支架包括一第一支撑体和一第二支撑体,其中所述第一支撑体被支撑于所述第二支撑体,其中所述光学镜头被支撑于所述第一支撑体,其中所述滤光片设置于所述第二支撑体,其中所述内表面和所述容纳空间被形成于所述第二支撑体。
- 根据权利要求67所述的摄像模组,其进一步包括一被设置于所述支架的马达,其中所述光学镜头被设置于所述马达。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述第一粘结层被设置于所述支架的内表面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面,其中所述第一粘结层被设置于所述第一内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面和一内顶面,其中所述第一内侧面和所述内顶面相互连接,其中所述第一粘结层被连续设置于所述第一内侧面和所述内顶面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面、一第二内侧面和一内顶面,其中所述第一内侧面、所述内顶面和所述第二内侧面相互连接,其中所述第一粘结层被连续设置于所述第一内侧面、所述内顶面和所述第二内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面 包括一内底面,其中所述第一粘结层被设置于所述内底面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第三内侧面和一内底面,其中所述第三内侧面和所述内底面相互连接,其中所述第一粘结层被连续设置于所述第三内侧面和所述内底面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面、一第二内侧面、一第三内侧面、一内顶面和一内底面,其中所述第一粘结层被设置于所述第一内侧面、所述第二内侧面、所述内底面和所述第三内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面、一第二内侧面和一内顶面,其中所述第一内侧面、所述内顶面和所述第二内侧面相互连接,其中所述滤光片具有一边缘顶面,其中所述第一粘结层被连续设置于所述边缘顶面、所述第一内侧面、所述内顶面和所述第二内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面,其中所述滤光片具有一边缘顶面,其中所述第一粘结层被连续设置于所述边缘顶面和所述第一内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述内表面包括一第一内侧面,其中所述滤光片具有一边缘底面,其中所述第一粘结层被连续设置于所述边缘底面和所述第一内侧面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述滤光片具有一边缘顶面,其中所述第一粘结层被设置于所述边缘顶面。
- 根据权利要求67~68和75中任意一项所述的摄像模组,其中所述滤光片具有一边缘底面,其中所述第一粘结层被设置于所述边缘底面。
- 根据权利要求69-73中任意一项所述的摄像模组,其进一步包括一滤光片和一支架,其中所述滤光片被设置于所述支架,其中所述捕尘结构进一步包括至少一第一粘结层,其中所述第一粘结层能够粘结所述滤光片附近的污尘;并且所述第一粘结层的位置位于所述支架的内表面,并且其位置选自如下结构中的至少一种:所述内表面包括一第一内侧面,其中所述第一粘结层被设置于所述第一内侧面;所述内表面包括一第一内侧面和一内顶面,其中所述第一内侧面和所述内顶面相互连接,其中所述第一粘结层被连续设置于所述第一内侧面和所述内顶面;所述内表面包括一第一内侧面、一第二内侧面和一内顶面,其中所述第一内侧面、所述内顶面和所述第二内侧面相互连接,其中所述第一粘结层被连续设置于所述第一内侧面、所述内顶面和所述第二内侧面;所述内表面包括一内底面,其中所述第一粘结层被设置于所述内底面;所述内表面包括一第三内侧面和一内底面,其中所述第三内侧面和所述内底面相互连接,其中所述第一粘结层被连续设置于所述第三内侧面和所述内底面;所述内表面包括一第一内侧面、一第二内侧面、一第三内侧面、一内顶面和一内底面,其中所述第一粘结层被设置于所述第一内侧面、所述第二内侧面、所述内底面和所述第三内侧面;所述内表面包括一第一内侧面、一第二内侧面和一内顶面,其中所述第一内侧面、所述内顶面和所述第二内侧面相互连接,其中所述滤光片具有一边缘顶面,其中所述第一粘结层被连续设置于所述边缘顶面、所述第一内侧面、所述内顶面和所述第二内侧面;所述内表面包括一第一内侧面,其中所述滤光片具有一边缘顶面,其中所述第一粘结层被连续设置于所述边缘顶面和所述第一内侧面;所述内表面包括一第一内侧面,其中所述滤光片具有一边缘底面,其中所述第一粘结层被连续设置于所述边缘底面和所述第一内侧面;所述滤光片具有一边缘顶面,其中所述第一粘结层被设置于所述边缘顶面;和所述滤光片具有一边缘底面,其中所述第一粘结层被设置于所述边缘底面。
- 根据权利要求75所述的摄像模组,其中所述第一粘结层被设置于所述马达的内侧,以在所述马达的内侧粘结污尘。
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