WO2017110113A1 - 電子装置及び電磁干渉抑制体の配置方法 - Google Patents
電子装置及び電磁干渉抑制体の配置方法 Download PDFInfo
- Publication number
- WO2017110113A1 WO2017110113A1 PCT/JP2016/065542 JP2016065542W WO2017110113A1 WO 2017110113 A1 WO2017110113 A1 WO 2017110113A1 JP 2016065542 W JP2016065542 W JP 2016065542W WO 2017110113 A1 WO2017110113 A1 WO 2017110113A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electromagnetic interference
- interfered
- electronic device
- interfering
- disposed
- Prior art date
Links
- 238000000034 method Methods 0.000 title description 12
- 230000002452 interceptive effect Effects 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000012212 insulator Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 230000001629 suppression Effects 0.000 description 36
- 238000011156 evaluation Methods 0.000 description 21
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000004907 flux Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- -1 polyisopropylene Polymers 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 102220223878 rs867113214 Human genes 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
Definitions
- the present invention relates to an electromagnetic interference suppressor, and more particularly, to an arrangement of an electromagnetic interference suppressor in an electronic device.
- electromagnetic interference suppressor In order to suppress electromagnetic interference generated in various electronic devices, particularly internal interference (so-called self-poisoning), noise-generating parts, circuits, conductors, etc. (hereinafter collectively referred to as interfering substances) and noise
- interfering substances noise-generating parts
- interfering substances noise-generating parts
- interfering substances noise-generating parts
- interfering substances noise-generating parts
- interfering substances noise-generating parts, circuits, conductors, etc.
- interfered objects an electromagnetic interference suppressor is disposed along both parts, circuits, conductive wires, etc.
- interfered objects electromagnetic interference with respect to the interfered object can be suppressed.
- the term “electronic device” as used herein refers to all devices including electronic components, circuits, wiring, and the like, and includes, for example, wireless communication terminals such as mobile phone terminals, various computers such as desktop computers, laptop computers, and workstations.
- an electromagnetic interference suppressor is a sheet-like component in which a magnetic powder is dispersed in a binder.
- the electromagnetic interference suppressor has high electrical resistance and frequency selective loss characteristics due to magnetic resonance.
- Patent Document 1 discloses a technique for enhancing an electromagnetic interference suppression effect by arranging an electromagnetic interference suppression body in close contact with an electronic component mounted on a substrate.
- An electromagnetic wave is shielded by coating the substrate and the electronic component installed thereon with an electromagnetic wave shielding film.
- a complicated process is required to bring the electromagnetic interference suppressor into close contact with an electronic component or the like.
- the arrangement of electronic components is changed for various reasons. However, if the electronic components arranged on the substrate are coated with a film together with the substrate, such an arrangement change cannot be dealt with.
- Patent Document 2 describes that interference between electronic components is suppressed by mounting an electromagnetic radiation noise absorbing sheet near the electronic components. It should be noted that according to this document, an electromagnetic radiation noise absorbing sheet is disposed along each of the interferent and the interfered object. FIG. 1 of the same document shows two electromagnetic radiation noise absorbing sheets. The same applies to FIG. 2 of the same document.
- the noise suppression sheet that is, the main noise suppression function of the electromagnetic interference suppression body is (1) suppression of coupling in the near field, (2) suppression of unnecessary radiation in a high-frequency line, and ( 3) Attenuation of noise components propagating through the transmission line.
- IEC62333-2 specifies the following four measurement methods.
- Rda Internal decoupling ratio
- Rde Inter-decoupling ratio
- the electromagnetic interference suppressor has a frequency band in which the noise suppression effect is reduced. This is because, since the electromagnetic interference suppressor has a relatively high dielectric constant in the in-plane direction, the coupling due to the electric field induced in the in-plane direction increases, that is, the internal decoupling rate of the electromagnetic interference suppressor has its frequency. This is thought to be because the band becomes negative. Conventionally, electromagnetic interference suppressors have been thought to have no special side effects, but it has been found that there is a side effect that the electromagnetic coupling between the interferer and the interfered object may increase depending on the frequency. It was.
- Patent Document 1 one electromagnetic interference suppressor is disposed along both the interferent and the interfered object. According to this arrangement method, electromagnetic coupling may increase due to the above-described reason.
- Patent Document 2 a total of two electromagnetic interference suppressors are arranged along each of the interferer and the interfered object. Moreover, in patent document 2, it arrange
- the present invention has been made in view of the above, and the problem to be solved by the present invention is an electromagnetic interference suppressor arranging method effective for noise in a wide frequency band including a high frequency band, And it is providing the electronic apparatus provided with the electromagnetic interference suppression body arrange
- the present invention includes, as one aspect thereof, an interferer that generates an electromagnetic wave, an interfered object that is affected by the electromagnetic wave, an interferer, and a substrate on which the interfered object is placed, and
- the electromagnetic interference suppressor disposed in parallel with the substrate along only one of the interfering object and the interfered object is provided, and an end portion of the interfering object that faces the interfered object is first.
- the end of the object to be interfered with and the end facing the interferer is the second end, the one end of the electromagnetic interference suppressor is the first end and the first end
- An electronic device disposed between two ends is provided.
- casing which surrounds both an interference object and a to-be-interfered object
- casing including an electromagnetic interference suppression body and an insulator
- the interfering object and the interfered object may be, for example, any one of an electronic component, an electronic circuit, and a wiring.
- the interfering object may be a power supply line
- the interfered object may be a signal line.
- a suitable example of these electronic devices is a communication device.
- an interferer that generates an electromagnetic wave, an interfered object that is affected by the electromagnetic wave, an interferer and a substrate on which the interfered object is placed, and the interferer and An electronic device provided with an electromagnetic interference suppressor disposed in parallel with the substrate along only one of the interfered objects is connected to the first end of the interfered object that faces the interfered object. And the second end is the end of the interfered object that faces the interferer, the one end of the electromagnetic interference suppressing body is the first end and the second end Provided is a method for arranging an electromagnetic interference suppressing body, which is arranged so as to be positioned between end portions.
- an electromagnetic interference suppressor arranging method that is effective against noise in a wide frequency band including a high frequency band, and an electronic device including the electromagnetic interference suppressor arranged according to this method. it can.
- FIG. 2 is a schematic diagram showing a cross section of an electronic device 1 according to an embodiment of the present invention, in which an electromagnetic interference suppressing body 6 is disposed along an interfering object 2.
- FIG. 3 is a perspective view for explaining a positional relationship among an interfering object 2, an interfered object 3, and an electromagnetic interference suppressing body 6 inside a housing 5 of the electronic device 1. It is a perspective view for demonstrating the evaluation system 10 which modeled the electronic device. 4 is a plan view for explaining a Y coordinate in the evaluation system 10.
- FIG. The perspective view for demonstrating the positional relationship of the interferer 2, the interfered object 3, and the electromagnetic interference suppression body 6 inside the housing
- FIG. 4 is a schematic diagram showing a cross section of an electronic device 20 in which an electromagnetic interference suppressing body 21 is disposed along an interfered object 3.
- FIG. 3 is a schematic diagram showing a partial cross section of an electronic device 60 in which an interfering object 2 disposed on a substrate 4 is covered with an insulator 61 and a plate-like electromagnetic interference suppressing body 62 is disposed thereon.
- FIG. 3 is a schematic diagram showing a partial cross section of an electronic device 70 in which an interfering object 2 disposed on a substrate 4 is covered with an insulator 61 and further covered with an electromagnetic interference suppressing body 71. It is the schematic of the example of the sheet-like electromagnetic interference suppression body 71 which has a softness
- the electronic device 1 includes an interfering object 2, an interfered object 3, a substrate 4, a housing 5, and an electromagnetic interference suppressing body 6.
- the electronic device 1 is an arbitrary type of electronic device. Specifically, for example, a communication terminal device such as a mobile phone terminal, a data communication device, a personal computer, and the like are conceivable, but the present invention is not limited thereto, and includes an interfering object 2 and an interfered object 3. Any type of electronic device is applicable.
- the interferer 2 is a component, circuit, device, wiring or the like that may generate noise.
- the interfered object 3 is a component, circuit, device, wiring, or the like that may be affected by noise, and a typical example is an antenna.
- the interferer 2 and the interfered object 3 are disposed on the substrate 4.
- the interfering object 2, the interfered object 3, and the substrate 4 are accommodated in a housing 5.
- An electromagnetic interference suppressing body 6 is disposed inside the housing 5 at a position facing the interfering object 2.
- the housing 5 is made of an insulator such as plastic.
- the electronic device 1 may include parts, circuits, devices, wirings, and the like other than the interfering object 2 and the interfered object 3 on the substrate 4. Further, the electronic device 1 may be provided with components, circuits, devices, wirings, and the like other than the interfering object 2 and the interfered object 3 inside or outside the housing 5.
- the electromagnetic interference suppressor 6 is mainly used for measures against radiation noise in small digital devices and measures for internal interference (self-poisoning).
- the electromagnetic interference suppressor 6 is a sheet-like component in which magnetic powder is dispersed in a binder, more specifically, a sheet-like component obtained by dispersing soft magnetic metal powder in an insulating base material. Possible parts.
- the electromagnetic interference suppressing body 6 may be a thick film or a thin film made of a high-resistance magnetic material. Further, the electromagnetic interference suppressing body 6 may be a simple rectangular sheet, but in order to enhance the effect of suppressing electromagnetic interference, a rectangular sheet may be provided with a slit.
- the electromagnetic interference suppressing body 6 is disposed along the interfering object 2.
- the electromagnetic interference suppressing body 6 and a part of the housing 5 are arranged along the interfering object 2.
- one end of the electromagnetic interference suppressing body 6 is located between the interfering object 2 and the interfered object 3 and does not reach above the interfered object 3.
- a part of the housing 5, that is, an insulator is disposed along the interfered object 3, but the electromagnetic interference suppressing body 6 is not disposed.
- the end of the interfering object 2 that faces the interfered object 3 is defined as a first end P1.
- the end of the interfered object 3 that faces the interfered object is defined as a second end P2.
- one end portion of the electromagnetic interference suppressing body 6 is disposed between the first end portion P1 and the second end portion P2.
- the distance D is a distance between the first end P1 and the second end P2.
- the electromagnetic interference suppressing body 6 is arranged so as to cover only the interfering object 2 and not the interfered object 3 so as to cover the in-plane direction of the electromagnetic interference suppressing body 6 (horizontal direction in FIG. 1).
- the induced electric field can be divided at a position between the interfering object 2 and the interfered object 3. For this reason, electromagnetic interference can be suppressed in a wide frequency band while avoiding an increase in electromagnetic coupling between the interfering object and the interfered object, which is a side effect of the electromagnetic interference suppressing body 6.
- FIG. 2 is a perspective view showing the positional relationship between the interfering object 2, the interfered object 3 and the electromagnetic interference suppressing body 6.
- the housing 5 is omitted.
- the Y direction is a direction of a straight line obtained by extending a line segment corresponding to the distance D between the interfering object 2 and the interfered object 3
- the X direction is a direction orthogonal to the Y direction in the horizontal plane in the figure. is there.
- the Z direction is a direction orthogonal to the horizontal plane.
- the electromagnetic interference suppressor 6 covers the entire periphery of the interferent 2 as viewed from the Z direction, and covers the periphery of the interferer 2 so as not to reach the interfered object 3 in the Y direction.
- the distance between the upper surface of the interfering object 2 and the lower surface of the housing 5 is a distance H2.
- a distance between the upper surface of the interfered object 3 and the lower surface of the housing 5 is a distance H3.
- the distances D, H2, and H3 vary depending on the sizes of the electronic device 1, the interferer 2, the interfered object 3, and the like.
- the distance D may be 5 to 300 mm
- the distances H2 and H3 may be 1 to 5 mm.
- the electronic device 1 is a portable device such as a mobile phone terminal, it is conceivable to reduce the distances D, H2, and H3 of the desktop PC to 1/3 to 1/5.
- an evaluation system 10 as shown in FIG. 3 is modeled.
- internal decoupling Rda was calculated using high-frequency three-dimensional electromagnetic field analysis software ANSYS HFSS from Ansys Japan.
- the two sets of antennas 11 and 12 are loop coils, one corresponding to the interfering object 2 and the other corresponding to the interfered object 3.
- the antennas 11 and 12 were connected to ports 1 and 2 of a network analyzer (not shown), respectively, and the coupling between the antennas 11 and 12 was evaluated based on the transmission characteristics S21.
- Internal decoupling Rda which is a parameter to be evaluated, is an index representing the degree of coupling between antennas, and the larger the value, the weaker the coupling.
- the internal decoupling Rda is obtained by the following equation.
- Rda S21R-S21M
- S21R is an S parameter when the electromagnetic interference suppressing body 13 is not present.
- S21M is an S parameter when the electromagnetic interference suppression body 13 is present.
- the electromagnetic interference suppression body 13 corresponds to the electromagnetic interference suppression body 6.
- the electromagnetic interference suppressor 13 is obtained by flattening a soft magnetic metal powder of Si 9.8% -Al 6.0% -Fe composition (% by mass) and dispersing it in an elastomer having excellent powder filling properties, and having a thickness of 0.2 mm. It is an interference suppressor.
- the antennas 11 and 12 each have a thickness of 1 mm.
- the distance between the antennas 11 and 12 corresponds to the distance D described above, and its length is 10 mm.
- the position of the electromagnetic interference suppression body 13 is represented by Y.
- Y is a coordinate having a straight line extending in a direction orthogonal to the antenna 11 as an axis. Of the two surfaces of the antenna 11, the surface on the side facing the antenna 12 is set to zero. The direction approaching is positive.
- the internal decoupling Rda when the electromagnetic interference suppression body 13 is located at Y ⁇ 1 mm, 0 mm, 5 mm, 10 mm, 11 mm, 15 mm, and 30 mm was respectively simulated. . This simulation is similarly established regardless of which of the antennas 11 and 12 is an interfering object.
- Rda is positive over the entire simulated frequency band.
- the low-frequency magnetic flux generated by the interfering object is considered to go straight to the interfered object without being focused by the electromagnetic interference suppressing body.
- the high frequency electromagnetic wave generated by the interfering object is neither absorbed nor reflected by the electromagnetic interference suppressing body.
- the low-frequency magnetic flux generated by the interferent is considered to be focused by the electromagnetic interference suppressor.
- a part of the high-frequency electromagnetic wave generated by the interfering substance is absorbed by the electromagnetic interference suppressor and partly reflected.
- the reflected high-frequency electromagnetic wave is considered to be transmitted to the interfered object.
- Rda is positive up to about 2.4 GHz, and after that, Rda is negative. At 3 GHz, Rda is -5.0 dB.
- the interval in which the internal decoupling Rda is negative is small even in a frequency band of 2 GHz or higher, and a relatively large internal decoupling Rda is present even in a relatively low frequency band. It is preferable at the point obtained.
- Y 5 mm because the internal decoupling Rda becomes large.
- the electronic device 1 it is possible to suppress the electromagnetic interference generated inside it in a wide band. For this reason, it is easy to increase the speed and size of the built-in electronic circuit. Further, when the electronic device 1 is a communication device, it is easy to ensure communication quality.
- the interfering object 2 and the interfered object 3 are illustrated on the assumption that they are small components arranged on the substrate 4. However, the interfering object 2 and the interfered object 3 are wirings. Also good. At this time, the arrangement of the interfering object 2, the interfered object 3, and the electromagnetic interference suppressing body 6 is as shown in FIG. It will be apparent to those skilled in the art that the description of the electronic device 1 described above can be applied almost as it is.
- the electronic device 20 will be described with reference to FIG.
- the position of the electromagnetic interference suppressing body 21 is different from that of the electronic device 1.
- the electromagnetic interference suppressing body 6 is arranged so as to cover the interfering object 2
- the electromagnetic interference suppressing body 21 is covered so as to cover the interfered object 3. Is arranged.
- no electromagnetic interference suppressor is disposed on the interferer 2.
- the electromagnetic interference suppressor in order to avoid the high frequency electromagnetic wave reflected by the electromagnetic interference suppressor from reaching the interfered object 3, the electromagnetic interference suppressor is configured to cover only one of the interfered object 2 and the interfered object 3. Place.
- the electromagnetic interference suppressor may be disposed so as to cover the interfering object 2 as in the electronic apparatus 1, or may be disposed so as to cover only the interfered object 3 as in the electronic apparatus 20.
- the electromagnetic interference suppressor is described as being disposed so as to cover only one of the interferent and the interfered object, but the high frequency electromagnetic wave reflected by the electromagnetic interference suppressor is described. Speaking of the effect of preventing the influence of, the same effect can be obtained even if only the other is covered.
- An electronic device 30 in FIG. 19 includes an electromagnetic interference suppressing body 11 disposed along the inner surface of the housing 5, and further along the outer surface of the housing 5 so as to face the electromagnetic interference suppressing body 11.
- the conductor plate 31 is provided.
- the conductor plate 31 is disposed so as to be hidden by the electromagnetic interference suppressing body 11 when viewed from the interfered object 3. For this reason, the bottom surface of the conductor plate 31 is the same as or smaller than the bottom surface of the electromagnetic interference suppressing body 11.
- the conductor plate 31 functions as an electromagnetic shield against electromagnetic waves flying from the outside of the housing 5 to the interfered object 3.
- the conductor plate 31 is disposed on the housing 5, but an opening is provided in the housing 5 at a position corresponding to the back surface of the electromagnetic interference suppression body 11, and the conductor plate is in the opening. You may arrange
- the 20 is an electronic device 40 in which a recess 41 is provided in a position corresponding to the back surface of the electromagnetic interference suppressor 11 in the housing 5 and an antenna 42 is disposed therein.
- the electronic device 40 is a wireless communication terminal such as a mobile phone terminal, and the antenna 42 is an antenna for wireless communication.
- the interfering object 2 and the interfered object 3 do not necessarily have to be arranged on the same substrate, and the present invention can be realized by arranging them on different substrates.
- the electronic interference suppression body is described as being attached to the inner surface of the housing.
- the support that supports the electronic interference suppressor is not necessarily a casing.
- the electromagnetic interference suppressing body may be supported at a position away from the housing.
- the electromagnetic interference suppression body is disposed along the inner surface of the housing.
- the casing is an insulator in principle, but the outside of the casing of the electromagnetic interference suppressing body can be a conductor.
- at least one of the interfering object and the interfered object on the substrate is covered with an insulator.
- at least the upper surface of the interferer / interfered object insulator covered with the insulator is covered with an electromagnetic interference suppressor.
- the evaluation system 10 has been described with reference to FIGS. 3-16, but this description also applies to the second embodiment.
- the interfering object 2 arranged on the substrate 4 is covered with an insulator 61, and a plate-like electromagnetic interference suppressing body 62 is arranged thereon.
- the insulator 61 is, for example, a mold resin.
- the electromagnetic interference suppressing body 62 covers the entire top surface of the interfering object 2 covered with the insulator 61 but does not cover the side surface.
- the illustrated housing 63 is a part of the electronic device 60.
- FIG. 22 shows a part of the housing 63, and a portion not shown of the housing 63 continues to the ends of the wavy lines at the left and right end portions.
- the casing 63 is not limited to being an insulator except for the portion where the electromagnetic interference suppressing body is disposed, and may be a casing made entirely of metal. This is because the interference object 2 is covered with the insulator 61, so that noise reflection by the metal casing does not occur.
- the electronic device 70 which is a modification of the electronic device 60 is the same as the electronic device 60 in that the interfering object 2 disposed on the substrate 4 is covered with an insulator 61 as shown in FIG.
- the electromagnetic interference suppression body 62 has a plate shape and has a structure in which the electromagnetic interference suppression body 62 is placed on the interfering object 2 via the insulator 61.
- the electromagnetic interference suppressing body 71 is a flexible sheet, covers the entire upper surface and side surfaces of the insulator 61, and further covers the surface of the peripheral substrate 4 thereof. Covering.
- the electromagnetic interference suppressing body 71 is obtained by distributing magnetic flat powder 73 in a layered manner on a sheet made of, for example, a resin 72.
- the electromagnetic interference suppression body 71 can also be used as the electromagnetic interference suppression body 6, 13, 21 of the first embodiment or the electromagnetic interference suppression body 62 of the electronic device 60.
- FIG. 24 illustrates an example of an electromagnetic interference suppression body, and a configuration different from that of the electromagnetic interference suppression body 71 may be used.
- Resin 72 is, for example, an elastomer rubber such as acrylic rubber, chlorinated polyethylene, polybutadiene, polyisopropylene, EPM, EPDM, SBR, nitrile rubber, epichlorohydrin, neoprene, butyl, polysulfide, urethane rubber, polyethylene, polypropylene, polystyrene, acrylic, Thermoplastic resins such as polyvinyl chloride, polycarbonate, nylon, urethane, PBT, PET, ABS and the like, and melamine, phenol, epoxy, urethane, polyimide, diallyl phthalate, unsaturated polyester, furan and the like.
- the magnetic flat powder 73 is flat soft magnetic particles made of, for example, an iron-based amorphous alloy.
- the electronic device 70 not only the upper surface of the interfering object 2 but also the side surfaces are covered with the electromagnetic interference suppressing body 71, so that noise can be effectively suppressed even when the interfering object 2 is tall, for example. it can.
- the electromagnetic interference suppressing bodies 62 and 72 are disposed on the insulators 61 and 62 that cover the interferent 2, but the interfered object 3 is replaced by an insulator instead of the interferer 2. It is good also as covering and arranging an electromagnetic interference suppression body on it.
- the electronic devices 60 and 70 have a structure in which the interfering object 2 disposed on the substrate 4 is covered with the insulator 61 from above the interfering object 2. It is good also as arrange
- the electronic device 70 has a structure in which the interferent 2 covered with the insulator 61 is covered with the electromagnetic interference suppressor 71 together with the peripheral substrate 4, but the interferent 2 covered with the insulator 61 is A structure may be adopted in which the electromagnetic interference suppressor 71 is covered in advance and then disposed on the substrate 4.
- the interfering object 2 and the interfered object 3 covered with the insulator 61 and the electromagnetic interference suppressing body 62 or 71 may be arranged on different substrates. Will be obvious to those skilled in the art.
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Networks Using Active Elements (AREA)
- Transmitters (AREA)
- Transceivers (AREA)
- Structure Of Receivers (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
2つの伝送線路間や同じプリント配線板内に実装された2つの部品間で生じる空間的な結合に対し、ノイズ抑制シートを伝送線路に対して平行に装着することにより得られる減衰の割合である。
2つの伝送線路、プリント配線板間、あるいは2つの部品間で生じる空間的な結合に対し、シートを両者の間隙に装着することにより得られる減衰の割合である。
伝送線路を伝播する伝導信号/ノイズに対し、シートを伝送線路に装着して得られる単位線路長当りの減衰量である。
回路基板から放射される輻射ノイズに対し、シートを装着することで得られる抑制量である。この測定は、通常のEMI計測と同様の10m法や3m法による遠方界測定である。
Rda=S21R-S21M
ここで、S21Rは電磁干渉抑制体13が無い場合のSパラメータである。S21Mは電磁干渉抑制体13が有る場合のSパラメータである。電磁干渉抑制体13は電磁干渉抑制体6に対応する。電磁干渉抑制体13は、Si9.8%-Al6.0%-Fe組成(質量%)の軟磁性金属粉末を扁平化し、粉末充填性に優れるエラストマー中に分散させ、厚さ0.2mmの電磁干渉抑制体である。アンテナ11、12はそれぞれ1mmの厚さを有する。アンテナ11、12の間の距離は上述の距離Dに対応し、その長さは10mmである。
2 与干渉物
3 被干渉物
4、4A、4B 基板
5、63 筐体
6、13、21、62、71 電磁干渉抑制体
10 評価系
11、12、42 アンテナ
31 導体板
41 くぼみ
61 絶縁体
72 樹脂
73 磁性偏平粉
Claims (12)
- 電磁波を発生する与干渉物、
電磁波の影響を受ける被干渉物、
前記与干渉物及び前記被干渉物を載置するための基板、
前記与干渉物及び前記被干渉物のいずれか一方のみに沿って、前記基板と平行に配置された電磁干渉抑制体を備え、
前記与干渉物の端部であって前記被干渉物に対向するものを第1の端部とし、前記被干渉物の端部であって前記与干渉物に対向する端部を第2の端部とするとき、前記電磁干渉抑制体の一方の端部は、前記第1の端部と前記第2の端部との間に配置される電子装置。 - 前記与干渉物及び被干渉物の他方に沿って前記基板と平行に配置された絶縁体を更に備える請求項1に記載の電子装置。
- 前記与干渉物及び前記被干渉物の両方を囲む筐体を備え、前記筐体は前記電磁干渉抑制体及び前記絶縁体を備える請求項2に記載の電子装置。
- 前記電磁干渉抑制体の一方の面に沿って前記与干渉物及び前記被干渉物のいずれか一方を配置したとき、前記電磁干渉抑制体の他方の面に沿って配置された導体板を備える
請求項1乃至請求項3のいずれか1項に記載の電子装置。 - 前記与干渉物及び前記被干渉物は、それぞれ、電子部品、電子回路、及び配線のいずれかである請求項1乃至請求項4のいずれか1項に記載の電子装置。
- 前記与干渉物は電源線であり、前記被干渉物は信号線である請求項5に記載の電子装置。
- 互いに異なる第1及び第2の基板を含む複数の基板を備え、
前記与干渉物は前記第1の基板に配置され、前記被干渉物は前記第2の基板に配置される
請求項1乃至請求項6のいずれか1項に記載の電子装置。 - 請求項1乃至請求項7のいずれか1項に記載の電子装置である通信装置。
- 電磁波を発生する与干渉物、
電磁波の影響を受ける被干渉物、
前記与干渉物及び前記被干渉物を載置するための基板、及び、
前記与干渉物及び前記被干渉物のいずれか一方のみに沿って、前記基板と平行に配置された電磁干渉抑制体を備える電子装置に、
前記与干渉物の端部であって前記被干渉物に対向するものを第1の端部とし、前記被干渉物の端部であって前記与干渉物に対向する端部を第2の端部とするとき、前記電磁干渉抑制体の一方の端部が、前記第1の端部と前記第2の端部との間に位置するように配置する、電磁干渉抑制体の配置方法。 - 電磁波を発生する与干渉物、
電磁波の影響を受ける被干渉物、
前記与干渉物及び前記被干渉物を載置するための基板、
前記与干渉物及び前記被干渉物のいずれか一方の一部乃至全部を覆う絶縁体、及び、
前記絶縁体による被覆物に前記絶縁体を介して配置される電磁干渉抑制体
を備える電子装置。 - 前記電磁干渉抑制体は板状であり、前記被覆物のうち、前記基板に接する面に対向する面を覆うように配置される請求項10に記載の電子装置。
- 前記電磁干渉抑制体はシート状であり、前記被覆物のうち、前記基板に接する面以外の面を覆うように配置される請求項10に記載の電子装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/065,790 US10729044B2 (en) | 2015-12-25 | 2016-05-26 | Electronic device and method for disposing electromagnetic interference suppressor |
KR1020187021548A KR102441507B1 (ko) | 2015-12-25 | 2016-05-26 | 전자 장치 및 전자 간섭 억제체의 배치방법 |
CN201680073519.XA CN108370655B (zh) | 2015-12-25 | 2016-05-26 | 电子装置、通信装置以及电磁干扰抑制体的配置方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015254001A JP2017118015A (ja) | 2015-12-25 | 2015-12-25 | 電子装置及び電磁干渉抑制体の配置方法 |
JP2015-254001 | 2015-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017110113A1 true WO2017110113A1 (ja) | 2017-06-29 |
Family
ID=59089995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/065542 WO2017110113A1 (ja) | 2015-12-25 | 2016-05-26 | 電子装置及び電磁干渉抑制体の配置方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10729044B2 (ja) |
JP (1) | JP2017118015A (ja) |
KR (1) | KR102441507B1 (ja) |
CN (1) | CN108370655B (ja) |
TW (1) | TWI672092B (ja) |
WO (1) | WO2017110113A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109561642A (zh) * | 2018-10-26 | 2019-04-02 | Oppo广东移动通信有限公司 | 电磁干扰控制方法及相关产品 |
CN109561643A (zh) * | 2018-11-02 | 2019-04-02 | Oppo广东移动通信有限公司 | 电磁干扰控制方法及相关产品 |
WO2022065006A1 (ja) * | 2020-09-28 | 2022-03-31 | 富士フイルム株式会社 | 積層体の製造方法、アンテナインパッケージの製造方法、積層体及び組成物 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018088029A (ja) * | 2016-11-28 | 2018-06-07 | 富士通株式会社 | 電磁ノイズ対策検証プログラム、情報処理装置、および電磁ノイズ対策検証方法 |
US11121095B2 (en) * | 2016-12-21 | 2021-09-14 | Mitsubishi Electric Corporation | Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias |
US12004336B2 (en) | 2019-07-19 | 2024-06-04 | Dell Products L.P. | System and method for thermal management and electromagnetic interference management |
US11378608B2 (en) * | 2019-07-19 | 2022-07-05 | Dell Products L.P. | System and method for device state determination |
US11132038B2 (en) | 2019-07-19 | 2021-09-28 | Dell Products L.P. | System and method for thermal management of shadowed devices |
US11644425B2 (en) | 2019-07-19 | 2023-05-09 | Dell Products L.P. | System and method for optical state determination |
US11399450B2 (en) | 2019-07-19 | 2022-07-26 | Dell Products L.P. | System and method for managing electromagnetic interference |
US11122718B2 (en) | 2019-07-19 | 2021-09-14 | Dell Products L.P. | System and method for device level electromagnetic interference management |
US11143682B2 (en) * | 2019-07-19 | 2021-10-12 | Dell Products L.P. | System and method for communicating externally from an electromagnetic interference suppressed volume |
US11234347B2 (en) | 2019-07-19 | 2022-01-25 | Dell Products L.P. | System and method for physical management of devices |
US11147194B2 (en) | 2019-08-21 | 2021-10-12 | Dell Products L.P. | System and method for managing electromagnetic interference |
US11234350B2 (en) | 2019-08-21 | 2022-01-25 | Dell Products L.P. | System and method for isolated device access |
TWI715306B (zh) * | 2019-11-22 | 2021-01-01 | 英業達股份有限公司 | 測試載台 |
TWI727832B (zh) * | 2020-06-17 | 2021-05-11 | 海華科技股份有限公司 | 無線通訊裝置 |
US11925009B2 (en) * | 2021-03-09 | 2024-03-05 | Hamilton Sundstrand Corporation | Adaptive design and fabrication of radiation shielding inserts for electronic components |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054592U (ja) * | 1991-06-26 | 1993-01-22 | 鐘淵化学工業株式会社 | 高周波数帯域用電子機器内部回路の反射防止構造 |
JP2001268190A (ja) * | 2000-03-22 | 2001-09-28 | Sony Corp | 通信端末装置 |
JP2001274582A (ja) * | 2000-03-23 | 2001-10-05 | Sony Corp | 電子機器 |
JP2002134679A (ja) * | 2000-10-25 | 2002-05-10 | Sony Corp | 集積回路 |
JP2002185408A (ja) * | 2000-12-11 | 2002-06-28 | Mitsubishi Electric Corp | 光送受信器 |
JP2006304080A (ja) * | 2005-04-22 | 2006-11-02 | Hitachi Metals Ltd | 磁性体で封止したアンテナを有する電子回路 |
JP2010135701A (ja) * | 2008-12-08 | 2010-06-17 | Sony Corp | 電磁波抑制シート、デバイス、電子機器 |
JP2011049807A (ja) * | 2009-08-27 | 2011-03-10 | Kyocera Corp | 携帯電子機器 |
JP2013168439A (ja) * | 2012-02-14 | 2013-08-29 | Mitsubishi Electric Corp | 高周波回路ケース用カバー、その製造方法およびこれを用いた高周波回路モジュール |
JP2015220260A (ja) * | 2014-05-14 | 2015-12-07 | Tdk株式会社 | 磁気抑制シート及びその製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI113937B (fi) * | 1989-02-21 | 2004-06-30 | Tatsuta Electric Wire & Gable | Painettu piirilevy ja menetelmä sen valmistamiseksi |
FI103935B1 (fi) | 1994-09-07 | 1999-10-15 | Nokia Mobile Phones Ltd | Menetelmä EMC-suojakotelon kiinnittämiseksi piirilevyyn ja EMC-suojakotelo |
JPH11354691A (ja) * | 1998-06-10 | 1999-12-24 | Nec Corp | 集積回路装置及びその実装方法 |
JP2000196282A (ja) | 1998-12-24 | 2000-07-14 | Tokin Corp | 電子回路装置、およびこれを搭載した携帯電話機、簡易携帯電話機 |
DE10233318C1 (de) * | 2002-07-22 | 2003-09-25 | Siemens Ag | Entstöreinrichtung |
US7129422B2 (en) * | 2003-06-19 | 2006-10-31 | Wavezero, Inc. | EMI absorbing shielding for a printed circuit board |
JP2005235944A (ja) * | 2004-02-18 | 2005-09-02 | Tdk Corp | 電子デバイスおよびその製造方法 |
JP5216342B2 (ja) | 2008-01-29 | 2013-06-19 | 京セラ株式会社 | シールドケース及び電子機器 |
US8477499B2 (en) * | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US9072204B2 (en) | 2009-07-17 | 2015-06-30 | Panasonic Intellectual Property Management Co., Ltd. | Electronic module and production method therefor |
US8493749B2 (en) * | 2009-10-12 | 2013-07-23 | Apple Inc. | Conforming EMI shielding |
CN102056448B (zh) | 2009-11-04 | 2013-02-27 | 环旭电子股份有限公司 | 电子模组 |
US8213180B2 (en) * | 2010-01-21 | 2012-07-03 | Broadcom Corporation | Electromagnetic interference shield with integrated heat sink |
CN202014429U (zh) | 2011-04-27 | 2011-10-19 | 东莞宇龙通信科技有限公司 | 电子装置 |
EP2685797B1 (en) * | 2011-05-06 | 2017-12-13 | Huawei Device Co., Ltd. | Composite material and electron device |
CN102296274B (zh) * | 2011-08-18 | 2013-11-27 | 北京镨玛泰克真空科技有限公司 | 用于阴极弧金属离子源的屏蔽装置 |
JP6263846B2 (ja) | 2012-08-16 | 2018-01-24 | 住友ベークライト株式会社 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
KR20140057040A (ko) | 2012-11-02 | 2014-05-12 | 연세대학교 산학협력단 | 피페린계 화합물을 유효성분으로 포함하는 피부노화 개선용 조성물 |
JPWO2014098065A1 (ja) * | 2012-12-19 | 2017-01-12 | 戸田工業株式会社 | 電磁波干渉抑制体 |
KR200486521Y1 (ko) * | 2013-03-12 | 2018-05-30 | 네오그라프 솔루션즈, 엘엘씨 | 휴대용 전자 디바이스 열 관리 시스템 |
CN104347595B (zh) * | 2013-07-31 | 2017-04-12 | 环旭电子股份有限公司 | 电子封装模块及其制造方法 |
WO2015023246A1 (en) * | 2013-08-10 | 2015-02-19 | Intel Corporation | Thermal energy storage, dissipation and emi suppression for integrated circuits using porous graphite sheets and phase change material |
SG2013083258A (en) * | 2013-11-06 | 2015-06-29 | Thales Solutions Asia Pte Ltd | A guard structure for signal isolation |
US9420734B2 (en) * | 2014-04-01 | 2016-08-16 | Advanced Micro Devices, Inc. | Combined electromagnetic shield and thermal management device |
KR20150130915A (ko) | 2014-05-14 | 2015-11-24 | 티디케이가부시기가이샤 | 자기억제 시트 및 그 제조방법 |
US9820373B2 (en) * | 2014-06-26 | 2017-11-14 | Apple Inc. | Thermal solutions for system-in-package assemblies in portable electronic devices |
US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
CN204632754U (zh) | 2015-03-18 | 2015-09-09 | 新科实业有限公司 | 电子部件模块 |
US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
-
2015
- 2015-12-25 JP JP2015254001A patent/JP2017118015A/ja active Pending
-
2016
- 2016-05-26 US US16/065,790 patent/US10729044B2/en active Active
- 2016-05-26 WO PCT/JP2016/065542 patent/WO2017110113A1/ja active Application Filing
- 2016-05-26 KR KR1020187021548A patent/KR102441507B1/ko active IP Right Grant
- 2016-05-26 CN CN201680073519.XA patent/CN108370655B/zh active Active
- 2016-06-17 TW TW105119049A patent/TWI672092B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054592U (ja) * | 1991-06-26 | 1993-01-22 | 鐘淵化学工業株式会社 | 高周波数帯域用電子機器内部回路の反射防止構造 |
JP2001268190A (ja) * | 2000-03-22 | 2001-09-28 | Sony Corp | 通信端末装置 |
JP2001274582A (ja) * | 2000-03-23 | 2001-10-05 | Sony Corp | 電子機器 |
JP2002134679A (ja) * | 2000-10-25 | 2002-05-10 | Sony Corp | 集積回路 |
JP2002185408A (ja) * | 2000-12-11 | 2002-06-28 | Mitsubishi Electric Corp | 光送受信器 |
JP2006304080A (ja) * | 2005-04-22 | 2006-11-02 | Hitachi Metals Ltd | 磁性体で封止したアンテナを有する電子回路 |
JP2010135701A (ja) * | 2008-12-08 | 2010-06-17 | Sony Corp | 電磁波抑制シート、デバイス、電子機器 |
JP2011049807A (ja) * | 2009-08-27 | 2011-03-10 | Kyocera Corp | 携帯電子機器 |
JP2013168439A (ja) * | 2012-02-14 | 2013-08-29 | Mitsubishi Electric Corp | 高周波回路ケース用カバー、その製造方法およびこれを用いた高周波回路モジュール |
JP2015220260A (ja) * | 2014-05-14 | 2015-12-07 | Tdk株式会社 | 磁気抑制シート及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109561642A (zh) * | 2018-10-26 | 2019-04-02 | Oppo广东移动通信有限公司 | 电磁干扰控制方法及相关产品 |
CN109561642B (zh) * | 2018-10-26 | 2020-07-31 | Oppo广东移动通信有限公司 | 电磁干扰控制方法及相关产品 |
CN109561643A (zh) * | 2018-11-02 | 2019-04-02 | Oppo广东移动通信有限公司 | 电磁干扰控制方法及相关产品 |
WO2022065006A1 (ja) * | 2020-09-28 | 2022-03-31 | 富士フイルム株式会社 | 積層体の製造方法、アンテナインパッケージの製造方法、積層体及び組成物 |
JP7477628B2 (ja) | 2020-09-28 | 2024-05-01 | 富士フイルム株式会社 | 積層体の製造方法、アンテナインパッケージの製造方法、及び積層体 |
Also Published As
Publication number | Publication date |
---|---|
US20190008079A1 (en) | 2019-01-03 |
TWI672092B (zh) | 2019-09-11 |
CN108370655B (zh) | 2020-03-17 |
CN108370655A (zh) | 2018-08-03 |
KR20180098368A (ko) | 2018-09-03 |
KR102441507B1 (ko) | 2022-09-06 |
US10729044B2 (en) | 2020-07-28 |
JP2017118015A (ja) | 2017-06-29 |
TW201724962A (zh) | 2017-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2017110113A1 (ja) | 電子装置及び電磁干渉抑制体の配置方法 | |
KR20160149133A (ko) | 회로 보호 구조 및 전자 기기 | |
US11800600B2 (en) | Information handling system coaxial cable grounding | |
EP2395828A1 (en) | Apparatus for reducing radiation quantity | |
CN101166410A (zh) | 电磁干扰屏蔽装置及其应用的电子设备 | |
US20180263107A1 (en) | Shielding mold for electric and magnetic emi mitigation | |
CN202635004U (zh) | 一种应用于电子设备的电磁屏蔽结构 | |
WO2023211526A1 (en) | Flexible printed circuit cable assembly with electromagnetic shielding | |
CN113346239B (zh) | 电子设备及通信系统 | |
US8149593B2 (en) | Radiation level reducing device | |
US20170194695A1 (en) | Antenna device and mobile terminal | |
TWI536690B (zh) | 雜訊抑制組件與具有雜訊抑制組件之電子裝置 | |
JP5894612B2 (ja) | 熱伝導性emi抑制構造 | |
US10706832B2 (en) | Noise reduction device and printed circuit assembly including the same | |
US20220264763A1 (en) | Metamaterial heat spreader | |
WO2018125424A1 (en) | Shield for connector | |
US20220294109A1 (en) | Electronic computing device having self-shielding antenna | |
JP2021184429A (ja) | 磁性体シートおよび該磁性体シートを備えた電子機器 | |
Chiu et al. | Harmonization of a bandpass shielding enclosure and its internal antenna | |
Tobana et al. | Suppression effect by conducting plate under ground plane for emission from printed circuit board | |
KR20050074835A (ko) | 플랫 케이블의 emi 차폐장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16878016 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20187021548 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020187021548 Country of ref document: KR |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16878016 Country of ref document: EP Kind code of ref document: A1 |