WO2017004702A1 - Procédé d'impression d'une ligne utlra-étroite - Google Patents

Procédé d'impression d'une ligne utlra-étroite Download PDF

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Publication number
WO2017004702A1
WO2017004702A1 PCT/CA2016/050767 CA2016050767W WO2017004702A1 WO 2017004702 A1 WO2017004702 A1 WO 2017004702A1 CA 2016050767 W CA2016050767 W CA 2016050767W WO 2017004702 A1 WO2017004702 A1 WO 2017004702A1
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WO
WIPO (PCT)
Prior art keywords
ink
line
substrate
interlayer
printing
Prior art date
Application number
PCT/CA2016/050767
Other languages
English (en)
Inventor
Ta-Ya Chu
Zhiyi Zhang
Ye Tao
Original Assignee
National Research Council Of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council Of Canada filed Critical National Research Council Of Canada
Priority to US15/740,514 priority Critical patent/US11396610B2/en
Priority to EP16820593.8A priority patent/EP3318110B1/fr
Priority to CA2990282A priority patent/CA2990282C/fr
Priority to JP2017568333A priority patent/JP2018529218A/ja
Priority to KR1020187003055A priority patent/KR20180029051A/ko
Priority to CN201680039570.9A priority patent/CN107852820A/zh
Publication of WO2017004702A1 publication Critical patent/WO2017004702A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • the present disclosure relates generally to fabrication techniques for printable electronic devices and, in particular, to a technique for printing a narrow line in fabricating a printable electronic device.
  • a line width of around 30 ⁇ to 50 ⁇ can usually be obtained using conventional printing technology.
  • the line width is primarily dictated by the surface energy difference between the substrate surface and ink.
  • a line width of 15 ⁇ can be printed using a commercial print head with a droplet volume of around 1 pi to 10 pi.
  • 10-30 ⁇ is the limit for direct printing.
  • the popular ink- bank method requires initial patterning of the substrate using a material with desired surface energy to control the ink spread after being printed on the substrate.
  • Other techniques like electrohydrodynamic jet printing, have been demonstrated to print narrow lines less than 2 ⁇ wide using a femtoliter nozzle.
  • electrohydrodynamic jet printing is not scalable for mass production. [0004]
  • Conventional methods of optimizing surface tension difference, viscosity, drying process and other parameters can only reduce the line width down to about 15 ⁇ . While a patterning step could reduce the printed line width to a submicrometer scale, this patterning step also is costly and introduces nonfunctional features which reduce integration density.
  • the present disclosure provides a new method of printing ultranarrow lines by exploiting the interaction between an ink containing a solvent mixture and the substrate (or interlayer) upon which the ink is deposited.
  • the solvent mixture slightly dissolves the substrate (or interlayer) while its evaporation/drying causes shrinkage of the line width.
  • the resulting line has a sunken or embedded profile.
  • one inventive aspect of the present disclosure is a method of providing a substrate having an interlayer on the substrate and printing the ultranarrow line by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent mixture that partially dissolves the interlayer on the while its evaporation/drying causes the ink to shrink and sink into the interlayer on the substrate thereby reducing a width of the line.
  • the surface energy may change during evaporation/drying.
  • Figure 1 depicts the surface tension and pendant drop volume of the mixture of ethanol, ethylene glycol and glycerin as a function of time at 23 °C;
  • Figure 2A depicts freshly printed lines of red ink (based on a mixture of ethanol, ethylene glycol, and glycerol) that have been inkjet-printed on PET (e.g. Melinex ST 505);
  • Figure 2B depicts the lines after being thermally treated at 70 °C for 5 minutes;
  • Figure 3 shows the contact angle of ethylene glycol and glycol mixture on uncrosslinked SU-8 for which the ratio of ethylene glycol to glycol is the same as that in the mixture used in Figure 1 and for which the SU-8 is a photoresist epoxy spin coated on PET film and soft backed only without the exposure to UV and hard baked for crosslinking;
  • Figure 4A shows an optical microscope image of silver nano ink freshly printed on uncrosslinked SU-8
  • Figure 4B shows an optical microscope image of the silver nano ink on the uncrosslinked SU-8 after being thermally treated at 70 °C for 5 minutes;
  • Figure 5A shows a cross-sectional scanning electron microscope (SEM) image of silver nano ink printed on uncrosslinked SU-8 having a shrunk line width of 15 ⁇ in which the image was taken at a 45-degree tilt angle, so that the Y-axis should be divided by 0.7 for the height calibration;
  • SEM scanning electron microscope
  • Figure 5B shows a cross-sectional scanning electron microscope (SEM) image of silver nano ink printed on uncrosslinked SU-8 having a shrunk line width of 5 ⁇ in which the image was taken at a 45-degree tilt angle, so that the Y-axis should be divided by 0.7 for the height calibration;
  • SEM scanning electron microscope
  • Figure 6 illustrates a draining mechanism to further shrink the line width in which the red area represents the ink-covered area and the arrows indicate the ink shrinkage direction; and
  • Figure 7 depicts an optical microscope image of an ultranarrow silver line printed on SU-8/PET substrate using silver (Ag) nano ink;
  • Figure 8 schematically depicts an ultranarrow line printed by the present method.
  • a method of printing an ultranarrow line of a functional material such as an electrically conductive ink.
  • the method entails, in general, steps, acts or operations of providing a substrate having an interlayer on the substrate and printing the ultranarrow line by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent mixture that partially dissolves the interlayer on the substrate, causing the ink to shrink and sink into the interlayer on the substrate thereby reducing a width of the line.
  • the surface energy of the solvent mixture may change during evaporation/drying.
  • the functional material is an electrically conductive ink such as, for example, a silver nanoparticle ink.
  • the functional material may be a conductor, semiconductor, dielectric, electroluminescent, photovoltaic, or any other electronic function.
  • the solvent is a mixture of ethanol, ethylene glycol and glycerol.
  • the solvent is a mixture of ethanol, ethylene glycol and glycerol
  • the substrate is polyethyleneterepthalate (PET)
  • the interlayer is SU-8 being composed of a fully epoxidized bisphenol-A/formaldehyde novolac co-polymer.
  • the line width may be further narrowed by thermally treating the ink, interlayer and substrate after printing. For example, the ink, interlayer and substrate are thermally treated at 70°C for 5 minutes or thermally treated at 50°C then at 75°C.
  • Further narrowing of the line may be achieved by draining ink longitudinally along the line by depositing larger areas of ink at each end of the line, the larger areas having a free energy lower than that of the line, thereby causing the ink to drain toward each of the larger areas during the shrinking process thus further reducing the width of the line.
  • the present method can achieve a height-to-width ratio of the line of 0.1 1 or greater.
  • Printing e.g. performed using an inkjet printer, can achieve a line width below 10 ⁇ . This is very useful for printing a gate of a transistor of a printable electronic device.
  • the method further entails controlling a surface tension of the ink while drying to remain less than a surface tension of the substrate upon which the ink is drying.
  • the interaction between the selected ink and interlayer/substrate reduces the width of the printed line. In some cases, it achieves a reduction in width down to 1 .5 to 3 ⁇ .
  • the ink increases its surface energy during the drying process, leading to reduced line width.
  • the ink also contains solvents which can partially dissolve the selected interlayer/substrate, thereby causing the printed feature to sink or embed into the interlayer/substrate during the drying process, which helps to further reduce the line width.
  • the ink is selected so that the ink can wet well on the substrate and form stable line edges, and so that a de-wetting process for the deposited ink can then cause the width of the printed line to shrink on the substrate in a controlled fashion under the influence of the surface tension of the ink and the interaction between ink and interlayer/substrate, i.e. the localized, partial dissolving of the substrate/interlayer by the solvent in the ink. Therefore, in at least some embodiments, the combination of the selected ink solvent(s) and solubility of interlayer/substrate is critical in order to obtain an ultranarrow line width below 10 ⁇ .
  • the ink can change its wetting property on a substrate after it is deposited on the substrate.
  • a solvent mixture that contains a solvent with low surface tension and low boiling point.
  • the mixture has a lower surface energy to wet a substrate initially but gradually lose its wettability as the volatile solvent evaporates and the ink surface energy increases.
  • Figure 1 demonstrates the change of surface tension and pendant drop volume of a mixture of ethanol, ethylene glycol and glycerol with time. Table 1 lists the surface tension and boiling point of the some of the solvents that may be used in this method: Solvent Boiling Point (°C) Surface Tension (mN/m, @ 20°C)
  • the ink To print an electronic device, the ink must be able to form well-defined lines when printed on the selected substrate. This is to ensure that identical post- printing shrinkage can happen at the same time along each line edge. In other words, the shrunk lines should have substantially uniform width and no breakage lengthwise. When a pattern with more than two lines is printed, the condition ensures that the pattern could maintain its design after the width of the printed lines are shrunk. Note that bulged or discontinuous lines, or even aligned drops, will appear if de-wetting happens before stable lines are formed.
  • the line shrinkage in the post-printing process is controlled at a desired rate along each line edge. This is also to ensure that the lines shrunk by this method have substantially uniform width and have no breakage along their entire length.
  • the shrinkage rate is not uniform along a line edge, the section that shrinks more slowly will have a larger area and thus lower free energy than the one that shrinks faster.
  • ink in the faster shrinking section would flow to the slower one, especially when the shrinkage rate is high, resulting in bulged or discontinuous lines.
  • This uneven-rate-caused effect can be intensified when the shrinkage rate is high. This situation should be avoided.
  • the bulging and breakage can be avoided and same level of shrinkage can be achieved.
  • the reason is that ink viscosity is high and line shrinkage is slow at 50°C.
  • the solvent is mostly evaporated at 50°C, the ink viscosity is substantially increased and line shrinkage rate becomes moderate at 75°C. Indeed, solvent evaporation can be decoupled with viscosity effect in such a stepwise heating process to effectively control the line shrinkage speed.
  • the ink solvent can slightly (or partially) dissolve a thin layer of interlayer/substrate.
  • This localized dissolution of the interlayer/substrate by the ink solvent helps ink to spread on the substrate as shown in Figure 3. This may drag the line edges in opposite directions during shrinkage, and thus substantially reducing the chance for bulging and line breakage.
  • the solvents recede with the line edges. The dissolution can therefore continue in the ink-covered area, sinking the ink into the substrate to a limited degree. This process also provides a mechanism for preventing bulging and line breakage.
  • the ultranarrow lines obtained using the above method are characterized by a unique cross-sectional profile.
  • Their height/width (H/W) ratios are very high because the narrow width is achieved by the reduction in line width and increase in line height.
  • the H/W ratio can reach 0.1 1 or greater when the line width is 17 ⁇ or narrower.
  • This ratio cannot be achieved by one layer printing using any scalable printing process, such as inkjet printing, flexo printing, gravure printing, and screen printing.
  • the combination of ultranarrow line width and high H/W ratio is the unique structural feature of the lines printed/processed with the above disclosed method.
  • the H/W ratio can reach an extremely high value of 0.7 by dissolving the substrate using an ink solvent. A slight dissolution is favoured by the elevated temperature and continues in the area still covered by the ink. As such, the printed line gradually sinks into the substrate as it shrinks. This sinking or embedment process plays an additional and vital role in avoiding line bulging and breakage, even when a line substantially shrinks to become ultranarrow with an extremely high H/W ratio.
  • Figure 5 shows a scanning electron microscope (SEM) image of the shrunken line.
  • SEM scanning electron microscope
  • draining method drains some ink from a line during its shrinkage. Draining is accomplished by placing low free-energy reservoirs at the end of each line as shown by way of example in Figure 6. In the printing process, more ink can be printed at the end of each line in various shapes, such as circle, oval, square, diamond, etc.. When a printed pattern is exposed to the post- printing treatment to shrink the printed feature, all its edges recede in the direction as indicated by the arrows. Simultaneously, part of the ink in the line is also drained to the area at its two ends, which have a free energy lower than the line due to the larger volume.
  • This ink-draining process can cause the line to further shrink. In other words, this draining effect can further diminish the cross-sectional area of the line.
  • the mechanism is superficially similar or analogous to the mechanical drawing of a thick solid wire to a thin one, but is intrinsically different as no external energy is required in the draining and the lines are not elongated.
  • Silver lines 0.45 ⁇ wide and 100 ⁇ long, can be obtained repeatedly using this method.
  • the line length is limited by the fact that only a limited amount of ink can be drained from each end of a line. Nevertheless, the length is enough for the lines to be used in many applications such as printing transistors. Again, there is no pre-patterning step required and only one printing and one post printing process are involved in the method, making this technique very useful for the manufacturing of printable electronics.
  • Figure 7 depicts an optical microscope image of an ultranarrow silver line printed on SU-8/PET substrate using silver (Ag) nano particle ink.
  • a dog bone pattern was printed using a nano silver ink on uncrosslinked SU-8 and then exposed to 70 °C for 5 minutes.
  • the "dog bone” pattern or “dumbbell pattern” can be any suitable pattern having larger areas of ink at each end of the line. Because the larger areas have a free energy lower than that of the line, the larger areas draw (drain) the ink from the line toward each of the larger areas thus further reducing the width of the line between the large areas.
  • the key to control line shrinkage to avoid bulging and line breakage is to use a suitable interaction between the ink and the substrate.
  • the selected ink with solvents can slightly dissolve the selected interlayer/substrate, so the constriction of the line (reduction of the printed line width) can be decreased below 10 ⁇ from the initial width of over 30 ⁇ .
  • This figure shows a substrate 10 upon which a solvent- containing ink 12 is printed. The solvent partially dissolves the substrate to cause the ink to sink or embed into the substrate.
  • Figure 8 shows the sunken portion 14 schematically.
  • the method can achieve ultranarrow line widths of 1.5 ⁇ and 3 ⁇ for Ag printed over a 10 mm length.
  • a further reduction in line width down to a sub-micrometer level has been achieved by implementing the draining mechanism (using the dumbbell or dog bone pattern).
  • a printed Ag line width of 0.45 ⁇ with a length of 100 ⁇ has been demonstrated using the combination of these two techniques.
  • the method further entails inactivating the surfactant to further reduce the width of the line. Inactivating the surfactant achieves de-wetting and thus line shrinkage. Any chemical that can cut a surfactant molecule to separate its hydrophilic section from hydrophobic section would work. Chemically, it is also possible to add a catalyst to the ink to degrade the surfactant under certain conditions, such as at elevated temperature or as the ink is exposed to light or other energy.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Ink Jet (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé d'impression d'une ligne ultra-étroite constituée d'un matériau fonctionnel. Ledit procédé consiste à prendre un substrat ayant une couche intermédiaire située sur le substrat et à imprimer la ligne ultra-étroite par dépôt d'encre sur la couche intermédiaire du substrat, l'encre comprenant ledit matériau fonctionnel et un mélange de solvants qui dissout partiellement la couche intermédiaire sur le substrat pour amener l'encre à se rétrécir et à s'enfoncer dans la couche intermédiaire située sur le substrat, ce qui permet de réduire la largeur de la ligne.
PCT/CA2016/050767 2015-07-03 2016-06-30 Procédé d'impression d'une ligne utlra-étroite WO2017004702A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US15/740,514 US11396610B2 (en) 2015-07-03 2016-06-30 Method of printing ultranarrow line
EP16820593.8A EP3318110B1 (fr) 2015-07-03 2016-06-30 Procédé d'impression d'une ligne utlra-étroite
CA2990282A CA2990282C (fr) 2015-07-03 2016-06-30 Procede d'impression d'une ligne utlra-etroite
JP2017568333A JP2018529218A (ja) 2015-07-03 2016-06-30 極細配線を印刷する方法
KR1020187003055A KR20180029051A (ko) 2015-07-03 2016-06-30 초협폭 선을 인쇄하는 방법
CN201680039570.9A CN107852820A (zh) 2015-07-03 2016-06-30 印刷超窄线条的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562188579P 2015-07-03 2015-07-03
US62/188,579 2015-07-03

Publications (1)

Publication Number Publication Date
WO2017004702A1 true WO2017004702A1 (fr) 2017-01-12

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PCT/CA2016/050767 WO2017004702A1 (fr) 2015-07-03 2016-06-30 Procédé d'impression d'une ligne utlra-étroite

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US (1) US11396610B2 (fr)
EP (1) EP3318110B1 (fr)
JP (1) JP2018529218A (fr)
KR (1) KR20180029051A (fr)
CN (1) CN107852820A (fr)
CA (1) CA2990282C (fr)
TW (1) TW201709784A (fr)
WO (1) WO2017004702A1 (fr)

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20090181172A1 (en) * 2007-10-15 2009-07-16 Nanoink, Inc. Lithography of nanoparticle based inks
US7615483B2 (en) * 2006-12-22 2009-11-10 Palo Alto Research Center Incorporated Printed metal mask for UV, e-beam, ion-beam and X-ray patterning

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US11396610B2 (en) 2022-07-26
EP3318110B1 (fr) 2021-01-13
CA2990282C (fr) 2023-08-08
US20180187035A1 (en) 2018-07-05
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CA2990282A1 (fr) 2017-01-12
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