WO2016200126A1 - 카메라 모듈 - Google Patents

카메라 모듈 Download PDF

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Publication number
WO2016200126A1
WO2016200126A1 PCT/KR2016/006030 KR2016006030W WO2016200126A1 WO 2016200126 A1 WO2016200126 A1 WO 2016200126A1 KR 2016006030 W KR2016006030 W KR 2016006030W WO 2016200126 A1 WO2016200126 A1 WO 2016200126A1
Authority
WO
WIPO (PCT)
Prior art keywords
holder
circuit board
printed circuit
camera module
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/006030
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
안명진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150080414A external-priority patent/KR102344460B1/ko
Priority claimed from KR1020160017308A external-priority patent/KR101943449B1/ko
Priority to US15/735,076 priority Critical patent/US10498937B2/en
Priority to EP22200666.0A priority patent/EP4141539B1/en
Priority to CN202110523175.0A priority patent/CN113296333B/zh
Priority to CN201680033459.9A priority patent/CN107735726B/zh
Priority to EP24213351.0A priority patent/EP4488751A3/en
Priority to EP16807766.7A priority patent/EP3306907B1/en
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Priority to JP2017563582A priority patent/JP7020921B2/ja
Priority to CN202110523211.3A priority patent/CN113296334B/zh
Priority to EP20186849.4A priority patent/EP3745196B1/en
Publication of WO2016200126A1 publication Critical patent/WO2016200126A1/ko
Anticipated expiration legal-status Critical
Priority to US16/665,420 priority patent/US10911655B2/en
Priority to US17/135,149 priority patent/US11470231B2/en
Priority to US17/929,913 priority patent/US11882350B2/en
Priority to US18/543,811 priority patent/US20240121494A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B1/00—Film strip handling
    • G03B1/02—Moving film strip by pull on end thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/40—Circuit details for pick-up tubes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Definitions

  • Embodiments relate to a camera module having a structure that prevents a focal length between a lens and an image sensor from being assembled or deformed or damaged in a part of an assembly during assembly.
  • Cars can be equipped with camera modules for various purposes. For example, when parking a car, a camera module for securing a rear view may be mounted at the rear of the car.
  • the camera module may be used in the case of a car black box which is very useful for tracking the accident history and the cause of an accident.
  • the camera module is used as a recognition device for clearly and easily grasp the situation of the blind spot that is difficult for the driver or passengers of the vehicle to see with the naked eye.
  • the production and technology development of the automotive camera module is also increasing accordingly.
  • an image sensor may be disposed at a position opposite to the lens in the optical axis direction.
  • the lens and the image sensor are arranged so that the focal length is within the design range.
  • the embodiment can prevent the focal length between the lens and the image sensor from being out of the design range or deform or break a part of the component in the assembling process, and allow the lens and the image sensor to be aligned in parallel. It relates to a camera module having a.
  • Embodiments of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above may be clearly understood by those skilled in the art to which the embodiments belong.
  • the lens barrel is provided with at least one lens; A holder to which the lens barrel is coupled; A printed circuit board coupled to the lower part of the holder so as to face the lens; An adhesive unit coupling the holder and the printed circuit board; An opening that opens a portion of the first space formed by coupling the printed circuit board and the holder; And a housing coupled to the holder, and a combination of the holder and the housing forms a second space that is separated from the first space, and the opening communicates the first space and the second space.
  • the printed circuit board may be coupled to an image sensor, and the image sensor may be disposed in the first space.
  • One side of the adhesive portion may be disposed to be exposed to the second space.
  • the coupling portion of the holder and the housing may be disposed closer to the lens in the first direction than the adhesive portion.
  • the adhesive part may overlap with the housing in a direction perpendicular to the first direction.
  • the opening may be provided as a first through hole formed at one side of the adhesive portion.
  • the opening may be provided as a second through hole formed in the printed circuit board in a first direction.
  • the second through hole may be formed inside the curve formed by the adhesive portion.
  • the opening may be provided as a third through hole formed to penetrate the holder laterally under the holder.
  • the opening may be closed after the coupling between the holder and the printed circuit board is completed.
  • An embodiment of the camera module may further include a packing member mounted to a coupling portion of the lens barrel and the holder.
  • the lens barrel is provided with at least one lens; A holder to which the lens barrel is coupled; A printed circuit board coupled to the lower part of the holder so as to face the lens; A housing coupled with the holder and accommodating the printed circuit board; An opening that opens a portion of the first space generated by the coupling of the holder and the printed circuit board; And an adhesive part coupled to a lower surface of the holder and an upper surface of the printed circuit board to couple the holder and the printed circuit board, wherein the opening includes at least one of one side of the adhesive part, the printed circuit board, and the lower part of the holder. It may be formed at the site of.
  • Yet another embodiment of the camera module includes a printed circuit board; An image sensor mounted on the printed circuit board; The image sensor accommodates the image sensor and is disposed on the printed circuit board, and includes a first coupling part and a second coupling part formed on both sides of the first coupling reference hole and the second coupling reference hole, respectively, and are formed through the upper part of the image sensor.
  • a holder having a hole; And a lens barrel fastened to an upper portion of the through hole so as to face the image sensor, wherein the printed circuit board has a horizontal surface passing through a center of the first fastening reference hole and a center of the second fastening reference hole and an upper surface of the image sensor.
  • the horizontal plane tilted to be parallel and passing through the center of the first fastening reference hole and the center of the second fastening reference hole may be parallel to an upper surface of the lens mounted on the lens barrel.
  • the lens barrel may protrude in a ring shape on an outer circumferential surface thereof, and include a protruding portion joined to an upper surface of the holder.
  • It may include a first adhesive member disposed between the bottom surface of the protrusion and the top surface of the holder facing the protrusion.
  • the holder may further include a second adhesive member having a lower surface facing the printed circuit board and disposed between the bonding surface adjacent to the through hole and the printed circuit board at the lower surface.
  • the barrier rib may further include a partition wall disposed between the bonding surface and the through hole.
  • the partition wall may protrude from the lower surface of the holder toward the printed circuit board.
  • the partition wall may protrude from the upper surface of the printed circuit board toward the lower surface of the holder.
  • the bonding surface has an inclined cross-sectional shape, and the height of the space between the bonding surface and the upper surface of the printed circuit board may increase as the distance from the through hole increases.
  • the camera module of the embodiment can be suppressed from the change of the design of the focal length of the camera module, the damage to the adhesive portion or the printed circuit board, etc. can be suppressed the occurrence of malfunction.
  • the lens and the image sensor are fastened in parallel, the same image and the correct, non-distorted accurate image may be obtained from each camera module without being affected by the mounting position of the camera module.
  • 1 is a side view showing the lens barrel of the first embodiment.
  • Fig. 2 is a side sectional view showing the holder of the first embodiment.
  • 3 is a side sectional view showing the camera module of the first embodiment.
  • FIG. 4 is a view for explaining the opening of the first embodiment.
  • FIG. 5 is a side cross-sectional view of FIG. 4.
  • FIG. 6 is a view for explaining the opening of the second embodiment.
  • FIG. 7 is a view for explaining the opening of the third embodiment.
  • FIG. 8 is a plan view illustrating a camera module according to a fourth embodiment.
  • FIG. 9 is an exploded cross-sectional view illustrating a camera module according to a fourth embodiment.
  • FIG. 10A is a side view illustrating the camera module according to the fourth embodiment.
  • 10B is a cross-sectional view illustrating a camera module according to a fourth embodiment.
  • 11A to 11C are views illustrating a bonding surface of the camera module according to the fifth to seventh embodiments.
  • a rectangular coordinate system (x, y, z) can be used.
  • the x-axis and the y-axis mean planes perpendicular to the optical axis.
  • the optical axis direction (z-axis direction) may be referred to as a first direction, the x-axis direction as a second direction, and the y-axis direction as a third direction. .
  • 1 is a side view showing the lens barrel 100 of the first embodiment.
  • 2 is a side sectional view showing the holder 200 of the first embodiment.
  • 3 is a side sectional view showing the camera module of the first embodiment.
  • the camera module of the first embodiment includes a lens barrel 100, a holder 200, a printed circuit board 300, a housing 400, an adhesive part 500, an opening part, and a packing member. 700 may be included.
  • the lens barrel 100 may be provided with at least one lens.
  • the lens coupled to the lens barrel 100 may be configured in one piece, or two or more lenses may be configured to form an optical system.
  • the lens barrel 100 may include a first coupling part 110.
  • the first coupling part 110 may be coupled to the second coupling part 220 formed in the holder 200, such that the lens barrel 100 and the holder 200 may be coupled to each other.
  • the coupling portion of the holder 200 and the housing 400 that is, the first coupling portion 110 and the second coupling portion 220 may be disposed closer to the lens in the first direction than the adhesive portion 500. Can be.
  • the first coupling part 110 and the second coupling part 220 may be coupled in various ways.
  • a screw thread coupled to each other is formed in the first coupling part 110 and the second coupling part 220, and the first coupling part 110 and the second coupling part 220 are screwed together.
  • the lens barrel 100 and the holder 200 may be coupled to each other.
  • an adhesive is applied between the first coupling part 110 and the second coupling part 220, so that the first coupling part 110 and the second coupling part ( 220 may be adhesively bonded.
  • the lens barrel 100 may be coupled to the holder 200. As described above, the first coupling part 110 formed on the lens barrel 100 and the second coupling part 220 formed on the holder 200 are coupled to each other by screwing, adhesive bonding, or the like, to the holder 200. ) And the lens barrel 100 may be combined with each other.
  • the holder 200 may be hollow.
  • the hollow is formed in a shape corresponding to the outer shape of the lens barrel 100, a portion of the lens barrel 100 is inserted so that the holder 200 and the lens barrel 100 can be coupled to each other.
  • the protrusion 200 may be formed in the holder 200. As shown in FIG. 3, the protrusion 210 may protrude in a lateral direction of a wall surface of the holder 200.
  • the holder 200 may be coupled to an upper portion of the housing 400, such that the holder 200 and the housing 400 may be coupled to each other.
  • the protrusion 210 and the upper portion of the housing 400 may be coupled to each other by, for example, coupling by means of fasteners, adhesive bonding, or the like.
  • a sealing means such as a packing may be interposed between the protrusion 210 and the upper portion of the housing 400.
  • the printed circuit board 300 may be coupled to the lower portion of the holder 200 so as to face the lens.
  • the printed circuit board 300 may include an image sensor 310 in which light incident through the lenses provided in the lens barrel 100 arrives to form an image of a subject.
  • the image sensor 310 may be disposed on the printed circuit board 300 to face the lens in an optical axis direction, that is, in a first direction. In addition, the image sensor 310 may be disposed in the first space S1.
  • the printed circuit board 300 may be provided with a plurality of substrates other than the substrate on which the image sensor 310 is mounted.
  • the second substrate 320 may be coupled to the printed circuit board 300.
  • the second substrate 320 may be formed of a flexible material.
  • the second substrate 320 may electrically connect the printed circuit board 300 to an external device so that electrical signals may be transmitted and received between the printed circuit board 300 and the external device.
  • the second substrate 320 may serve to electrically connect the plurality of substrates to each other.
  • the packing member 700 may be mounted at a coupling portion of the lens barrel 100 and the holder 200.
  • the packing member 700 may be disposed at a portion of the coupling portion of the lens barrel 100 and the holder 200 except for the first coupling portion 110 and the second coupling portion 220. have.
  • the packing member 700 may be provided as an o-ring surrounding the lens barrel 100, as shown in FIG. 3.
  • the packing member 700 may serve to prevent foreign substances from flowing into the gap formed between the packing member 700 and the lens barrel 100 when the lens barrel 100 and the holder 200 are coupled to each other. have.
  • the housing 400 may be coupled to the holder 200 and may accommodate the printed circuit board 300. As described above, the housing 400 and the holder 200 may be coupled to each other by coupling the upper portion of the housing 400 and the protrusion 210 of the holder 200 to each other.
  • the second space S2 of the housing 400 may be formed in a sealed structure to prevent foreign substances from flowing from the outside.
  • the second space S2 may be formed to be separated from the first space S1 by the combination of the holder 200 and the housing 400. In addition, the second space S2 may be separated from the first space S1 by the printed circuit board 300.
  • the adhesive part 500 is coupled to the bottom surface of the holder 200 and the top surface of the printed circuit board 300 to couple the holder 200 to the printed circuit board 300. Can play a role. In this case, one side of the adhesive part 500 may be disposed to be exposed to the second space S2.
  • the adhesive part 500 may be disposed to overlap the housing 400 in a second direction and / or a third direction perpendicular to the first direction.
  • the adhesive part 500 may be formed on the bottom surface of the holder 200 and the top surface of the printed circuit board 300.
  • the adhesive part 500 may be formed in a curved shape along an edge of a lower surface of the holder 200 and an upper surface of the printed circuit board 300.
  • the adhesive part 500 may be formed by applying an adhesive to a lower surface of the holder 200 and / or an upper surface of the printed circuit board 300.
  • the adhesive part 500 may also be formed in a rectangular curved shape.
  • the process of coupling the printed circuit board 300 to the holder 200 by the adhesive part 500 may be performed by an active align process.
  • the active alignment process moves the printed circuit board 300 in the first direction to adjust the focal length between the lens and the image sensor 310 provided to face each other, or to move the printed circuit board 300 to the first direction.
  • the adhesive part 500 may be temporarily cured while the active alignment process is in progress, and may be appropriately provided to perform a complete curing operation after the active alignment is completed.
  • the adhesive forming the adhesive part 500 may use a hybrid adhesive that is cured in response to both ultraviolet rays and heat.
  • the adhesive part 500 may be temporarily cured by irradiating ultraviolet light to the adhesive part 500 while adjusting the focal length between the lens and the image sensor 310.
  • the adhesive part 500 may be heated to completely harden the adhesive part 500.
  • the adhesion part 500 may be heated using an oven or the like.
  • the camera module is sealed by the packing member 700 on the upper side and attached to the adhesive part 500 on the lower side.
  • the first space S1 may be formed to be sealed.
  • the air filled in the first space (S1) due to the heating is expanded by heating can do.
  • the printed circuit board 300 may be swollen, deformed, or changed in position. In this case, the focal length between the lens adjusted to the design range and the image sensor 310 through the active alignment process may be out of the design range.
  • the adhesive unit 500 or the printed circuit board 300 may be damaged due to the expansion of the air filled in the first space (S1). Changes outside the design range of the focal length, breakage of the adhesive part 500 or the printed circuit board 300 may cause a malfunction of the camera module.
  • the air filled in the first space (S1) in the camera module of the embodiment from the first space (S1) An opening may be formed to allow it to exit.
  • the camera module of the embodiment can be suppressed from the change in the design range of the focal length of the camera module, the damage of the adhesive portion 500 or the printed circuit board 300, etc. can be suppressed the occurrence of malfunction.
  • the opening may serve to open a part of the first space S1 formed by the coupling of the holder 200 and the printed circuit board 300.
  • the opening may be formed at at least one portion of one side of the adhesive part 500, the printed circuit board 300, and the lower portion of the holder 200.
  • each embodiment of the opening will be described with reference to FIGS. 4 to 7.
  • FIG. 4 is a view for explaining the opening of the first embodiment.
  • 5 is a side cross-sectional view of FIG. 4.
  • One embodiment of the opening, as shown in Figure 4 may be provided with a first through hole 610 formed on one side of the adhesive portion (500).
  • the first through-hole 610 is formed in the adhesive portion 500, when the heating to cure the adhesive portion 500, the coupling of the housing 400 after the coupling of the printed circuit board 300 is in progress As this progresses, a part of the air that is filled in the first space S1 and expands due to heating may escape to the outside through the first through hole 610.
  • the width D1 of the first through hole 610 may be, for example, 0.1 mm to 0.3 mm. However, in consideration of the size of the entire camera module, the arrangement of each component may be provided with a wider or narrower width than this.
  • one first through hole 610 is formed at a side of the adhesive part 500, but is not limited thereto. That is, the first through hole 610 may be formed in the corner portion of the adhesive portion 500, it may be provided in a plurality of two or more.
  • the cross section of the first through hole 610 may be provided in various forms such as circular, oval, square and polygonal.
  • FIG. 6 is a view for explaining the opening of the second embodiment.
  • Another embodiment of the opening, as shown in Figure 6, may be provided with a second through hole 620 formed in the first direction on the printed circuit board 300.
  • the second through hole 620 may be provided in a via hole in the printed circuit board 300.
  • the second through hole 620 may be formed through the printed circuit board 300. Therefore, when heating to cure the adhesive portion 500, a portion of the air filled in the first space (S1) and expands due to the heating may exit through the second through hole 620.
  • the second through hole 620 may be formed in a curve formed by the adhesive part 500. That is, referring to FIG. 6, the second through hole 620 may be formed between the image sensor 310 and the adhesive part 500. Due to this structure, the adhesive part 500 may form a first space S1, and the second through hole 620 may communicate the first space S1 with the outside.
  • the width D2 of the second through hole 620 may be, for example, 0.1 mm to 0.3 mm, more preferably about 2 mm. However, in consideration of the size of the entire camera module, the arrangement of each component may be provided with a wider or narrower width than this.
  • one second through hole 620 is formed at the side of the adhesive part 500 in one embodiment, but is not limited thereto. That is, the second through hole 620 may be formed at an appropriate position between the image sensor 310 and the adhesive part 500, and may be provided in two or more pieces.
  • the cross section of the first through hole 610 is illustrated in FIG. 6 as a circular shape, but is not limited thereto.
  • the cross-section of the first through hole 610 may be provided in various forms such as oval, square, and polygon.
  • FIG. 7 is a view for explaining the opening of the third embodiment.
  • Another embodiment of the opening, as shown in FIG. 7, may be provided as a third through hole 630 formed to penetrate the holder 200 laterally under the holder 200.
  • the third through hole 630 may be formed at the lower side of the holder 200, that is, at the lower side of the protrusion 210 in the lateral direction of the holder 200. have.
  • the third through hole 630 may be formed to penetrate the holder 200 laterally. Therefore, when heating to cure the adhesive portion 500, a portion of the air filled in the first space (S1) and expands due to the heating may exit through the second through hole 620.
  • the third through hole 630 is partially part of the first space S1. You can move from the outside.
  • the width D3 of the third through hole 630 may be, for example, 0.3 mm to 0.5 mm. However, in consideration of the size of the entire camera module, the arrangement of each component may be provided with a wider or narrower width than this.
  • one third through hole 630 is formed in one embodiment, but is not limited thereto. That is, two or more third through holes 630 may be provided to penetrate the lower portion of the holder 200 laterally.
  • the cross section of the third through hole 630 may be provided in various forms such as circular, elliptical, square and polygonal.
  • the opening communicates with the first space S1 and the second space S2 formed in the housing 400. It may be provided to make.
  • the opening When the opening is formed, when foreign matter is introduced into the first space S1 through the opening and is adsorbed to a component such as the image sensor 310, it may cause a malfunction of the camera module.
  • the opening is provided to communicate the first space S1 and the second space S2 with each other, and the holder 200 and the housing 400 are sealed to seal the second space S2.
  • the first space S1 and the second space S2 communicate with each other, but the entire first space S1 and the second space S2 may be sealed.
  • the opening may be closed after the coupling of the holder 200 and the printed circuit board 300 is completed. Closing of the opening may be performed before coupling the housing 400 to the holder 200.
  • the opening serves only in the process of bonding the holder 200 and the printed circuit board 300 through the active alignment process using the adhesive part 500, thereby heating the adhesive part 500. After curing is completed, it is unnecessary.
  • the opening may be closed in order to prevent foreign foreign matter from entering the first space S1 through the opening.
  • an adhesive can use, for example, a heat curable adhesive, an ultraviolet curable adhesive, the above-mentioned hybrid adhesive, or the like.
  • FIG. 8 is a plan view showing a camera module according to a fourth embodiment
  • FIG. 9 is an exploded cross-sectional view showing a camera module according to a fourth embodiment
  • FIG. 10A is a side view showing a camera module according to a fourth embodiment
  • FIG. 10b is a sectional view showing the camera module according to the fourth embodiment.
  • the camera module 1000 accommodates the printed circuit board 1200, the image sensor 1400 and the image sensor 1400 mounted on the printed circuit board 1200.
  • the holder 1600 is disposed on the printed circuit board 1200, the lens barrel 1800 is fastened to the holder 1600.
  • the image sensor 1400 may be mounted on the printed circuit board 1200.
  • the image sensor 1400 collects incident light to generate an image signal, and may be provided as a complementary metal oxide semiconductor (CMOS) sensor or a charge coupled device (CCD) sensor. Can be.
  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • the holder 1600 may be disposed on the printed circuit board 1200 to accommodate the image sensor 1400 mounted on the printed circuit board 1200.
  • both sides of the holder 1600 may be symmetrically provided with a first fastening portion 1620 and a second fastening portion 1640, the first fastening portion 1620 and the second fastening portion 1640 is the first fastening reference hole 1620a and the second fastening reference hole 1640a may be formed in a plate shape in the longitudinal direction and formed in the first fastening part 1620 and the second fastening part 1640, respectively.
  • the first fastening part 1620 and the second fastening part 1640 may be fastened to a position where the camera module is to be mounted to fix the camera module.
  • the holder 1600 may have a through hole 1660 formed on the image sensor 1400.
  • the lens barrel 1800 is fastened to an upper portion of the through hole 1660 formed in the holder 1600, and the lens barrel 1800 is disposed to face the image sensor 1400 mounted on the printed circuit board 1200. Can be.
  • the inner diameter of the through hole 1660 may be formed to correspond to the outer diameter of the lens barrel 1800, the lens barrel 1800 protrudes in the form of a ring on the outer circumferential surface, and a protrusion for bonding to the upper surface of the holder 1600 ( 1820).
  • the protrusion 1820 may be fixed to the lens barrel 1800 at a predetermined height of the through hole 1660, and may be provided between the bottom surface of the protrusion 1820 and the upper surface of the holder facing the protrusion 1820.
  • the adhesive member 1120 may be disposed to bond and fasten the holder 1600 and the lens barrel 1800.
  • the first adhesive member may be provided as an ultraviolet curing adhesive that can be solidified in a short time by the reaction of the photoreaction initiator in the adhesive by irradiating ultraviolet rays to the liquid adhesive, but is not limited thereto.
  • At least one lens may be disposed in the inner space of the lens barrel 1800, and the plurality of lenses may be stacked and arranged at a predetermined interval in the inner space.
  • the printed circuit board on which the holder and the image sensor is mounted is aligned so as to be horizontal, and then the optical axis of the lens disposed on the lens barrel is aligned.
  • the image sensor mounted on the PCB was not mounted horizontally with respect to the printed circuit board, an accurate image could not be obtained.
  • the printed circuit board 1200 is tilted so that the horizontal plane passing through the center O of the first fastening reference hole and the center of the second fastening reference hole O 'is parallel to the top surface of the image sensor 140.
  • the position of the holder and the image sensor may be measured by a laser displacement sensor, or the like, to tilt the printed circuit board to align the holder and the printed circuit board.
  • the primary aligned holder and the printed circuit board may be bonded and fixed by a second adhesive member to be described later.
  • the holder and the printed circuit board are aligned so that the horizontal plane passing through the center O of the first fastening reference hole and the center of the second fastening reference hole O 'is parallel to the top surface of the image sensor 1400.
  • the horizontal plane passing through the center O of the first fastening reference hole and the center O ′ of the second fastening reference hole may be aligned with the optical axis of the lens disposed on the lens barrel so as to be parallel to the upper surface of the lens mounted on the lens barrel.
  • the lens barrel including the optical axis aligned lens and the holder are bonded and fixed with the first adhesive member.
  • the horizontal plane passing through the center O of the first fastening reference hole and the center of the second fastening reference hole O 'and the upper surface of the image sensor 1400 and the upper surface of the lens may be parallel to each other. 1400) and the camera module can be mounted in a position where the camera module will be mounted by tilting the printed circuit board to be parallel to the horizontal plane passing through the center O of the first fastening reference hole and the center of the second fastening reference hole O '. have.
  • the holder 1600 has a lower surface facing the printed circuit board 1200, the second adhesive member between the through hole 1660 and the bonding surface 1680 adjacent to the printed circuit board 1200 in the lower surface 1140 may be disposed.
  • the second adhesive member may be provided as an ultraviolet curing adhesive that can be solidified in a short time by the reaction of the photoreaction initiator in the adhesive by irradiating ultraviolet rays to the liquid adhesive, but is not limited thereto.
  • 11A to 11C are views illustrating a bonding surface of the camera module according to the fifth to seventh embodiments.
  • partition walls 1700a and 1700b may be disposed between the joining surface 1680 and the through hole 1660, and the partition walls 1700a and 1700b may be connected to the joining surface 1680 of the holder.
  • the second adhesive member 1140 disposed between the printed circuit boards 1200 may be prevented from spreading toward the image sensor 1400.
  • the partition wall 1700a may be disposed to protrude from the lower surface of the holder 1600 toward the printed circuit board 1200, and the ring having an inner diameter equal to or larger than the inner diameter of the through hole 1600. It may be arranged in the form.
  • the inner diameter of the partition wall 1700a is too large than the inner diameter of the through hole 1600, an area in which the second adhesive member is disposed between the bonding surface 1680 of the holder 1600 and the printed circuit board 1200 is reduced. Since the adhesive force may drop, the partition wall may be disposed at such a position that the adhesive force does not drop.
  • the partition wall 1700a may have an oval shape of a side surface of the partition wall 1700a such that the printed circuit board 1200 may be tilted.
  • the partition wall 1700b may be disposed to protrude from the upper surface of the printed circuit board 1200 toward the lower surface of the holder.
  • the inner diameter of the partition wall 1700b may be disposed in a ring shape that is equal to or larger than the inner diameter of the through hole 1660 of the holder.
  • the partition wall 1700a may have an oval shape of a side surface of the partition wall 1700a such that the printed circuit board 1200 may be tilted.
  • the heights of the barrier ribs 1700a and 1700b may vary depending on the amount of the second adhesive member 1140 disposed between the bonding surface 1680 and the printed circuit board 1200, and the height of the barrier ribs 1700a and 1700b may be 10. It may be from 200 ⁇ m to 200 ⁇ m.
  • the second adhesive member 1140 disposed between the bonding surface 1680 and the printed circuit board 1200 may be applied so thinly that the adhesive force may be lowered.
  • the second adhesive member 1140 disposed between the bonding surface 1680 and the printed circuit board 1200 is thickly applied, which may cause the holder to be pushed away from the printed circuit board. Can be.
  • the heights of the partition walls 1700a and 1700b may vary depending on the area of the bottom surface of the holder 1600 or the amount of the second adhesive member according to the material of the second adhesive member.
  • the bonding surface 1680 according to the seventh embodiment may have an inclined cross-sectional shape, and the height of the space between the bonding surface 1680 and the upper surface of the printed circuit board 1200 passes through. The distance from the hole 1660 may increase.
  • the second adhesive member 1140 may be disposed in the space between the bonding surface 1680 and the upper surface of the printed circuit board 1200.
  • the space between the bonding surface 1680 and the upper surface of the printed circuit board 1200 may be provided.
  • the height of the structure increases as the distance from the through-hole 1660 can prevent the second adhesive member from spreading toward the image sensor.
  • the inclination angles ⁇ 1 and ⁇ 2 of the bonding surface may be different from the first inclination angle ⁇ 1 of the bonding surface and the second inclination angle ⁇ 2 of the bonding surface as the printed circuit board 1200 is tilted.
  • the second inclination angle ⁇ 2 of the bonding surface becomes larger, and as the first inclination angle ⁇ 1 of the bonding surface becomes larger, The second inclination angle ⁇ 2 may be small.
  • the inclination angles ⁇ 1 and ⁇ 2 of the bonding surface may be 0.5 ° to 1.5 °, and the bonding may be performed when the first inclination angle ⁇ 1 of the bonding surface or the second inclination angle ⁇ 2 of the bonding surface is smaller than 0.5 °.
  • the thickness of the second adhesive member 1140 disposed between the surface and the printed circuit board becomes thinner, thereby lowering the adhesive strength, and the first inclination angle ⁇ 1 of the bonding surface or the second inclination angle ⁇ 2 of the bonding surface is smaller than 1.5 °.
  • the second adhesive member 114 may be disposed at an edge portion of the lower surface of the holder 160 more than necessary, and the supporting force may be weakened.
  • the bonding surface 1600 may have roughness, which may improve adhesion between the bonding surface and the second adhesive member.
  • the size of the roughness may be 1 ⁇ m to 5 ⁇ m, but the size of the roughness may vary depending on the area or material of the bonding surface 1600 of the holder.
  • Embodiments described above may be combined with each other.
  • the barrier rib 1700a protrudes toward the printed circuit board 1200 to the lower surface of the holder 1600 while having the inclined bonding surface 1680, or is printed while having the inclined bonding surface 1680.
  • the barrier rib 1700b may protrude from the upper surface of the circuit board 1200 toward the lower surface of the holder 1600.
  • the lens and the image sensor are fastened in parallel so that the same image and the correct, non-distorted accurate image can be obtained from each camera module without being affected by the mounting position of the camera module.
  • the occurrence of malfunction can be suppressed by preventing the adhesive part of the camera module or the printed circuit board from being damaged, and the lens and the image sensor are connected in parallel to each other so as not to be affected by the mounting position of the camera module.
  • a camera module capable of obtaining an image and an accurate image without distortion can be manufactured and applied to a mobile communication terminal.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
PCT/KR2016/006030 2015-06-08 2016-06-08 카메라 모듈 Ceased WO2016200126A1 (ko)

Priority Applications (13)

Application Number Priority Date Filing Date Title
CN202110523211.3A CN113296334B (zh) 2015-06-08 2016-06-08 摄像机模块
EP22200666.0A EP4141539B1 (en) 2015-06-08 2016-06-08 Camera module
EP20186849.4A EP3745196B1 (en) 2015-06-08 2016-06-08 Camera module
CN202110523175.0A CN113296333B (zh) 2015-06-08 2016-06-08 摄像机模块
CN201680033459.9A CN107735726B (zh) 2015-06-08 2016-06-08 摄像机模块
EP24213351.0A EP4488751A3 (en) 2015-06-08 2016-06-08 Camera module
EP16807766.7A EP3306907B1 (en) 2015-06-08 2016-06-08 Camera module
US15/735,076 US10498937B2 (en) 2015-06-08 2016-06-08 Camera module
JP2017563582A JP7020921B2 (ja) 2015-06-08 2016-06-08 カメラモジュール
US16/665,420 US10911655B2 (en) 2015-06-08 2019-10-28 Camera module
US17/135,149 US11470231B2 (en) 2015-06-08 2020-12-28 Camera module
US17/929,913 US11882350B2 (en) 2015-06-08 2022-09-06 Camera module
US18/543,811 US20240121494A1 (en) 2015-06-08 2023-12-18 Camera module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2015-0080414 2015-06-08
KR1020150080414A KR102344460B1 (ko) 2015-06-08 2015-06-08 카메라 모듈
KR1020160017308A KR101943449B1 (ko) 2016-02-15 2016-02-15 카메라 모듈
KR10-2016-0017308 2016-02-15

Related Child Applications (2)

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US15/735,076 A-371-Of-International US10498937B2 (en) 2015-06-08 2016-06-08 Camera module
US16/665,420 Continuation US10911655B2 (en) 2015-06-08 2019-10-28 Camera module

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WO2016200126A1 true WO2016200126A1 (ko) 2016-12-15

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US (5) US10498937B2 (enExample)
EP (4) EP3306907B1 (enExample)
JP (1) JP7020921B2 (enExample)
CN (3) CN113296333B (enExample)
WO (1) WO2016200126A1 (enExample)

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CN107735726B (zh) 2021-06-01
EP3306907A1 (en) 2018-04-11
EP4488751A3 (en) 2025-01-15
CN113296334B (zh) 2022-09-27
JP7020921B2 (ja) 2022-02-16
CN113296333A (zh) 2021-08-24
EP4141539A1 (en) 2023-03-01
US10498937B2 (en) 2019-12-03
US20220417400A1 (en) 2022-12-29
EP3745196A1 (en) 2020-12-02
US11882350B2 (en) 2024-01-23
CN107735726A (zh) 2018-02-23
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US20210120155A1 (en) 2021-04-22
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US20190098184A1 (en) 2019-03-28
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