WO2016157461A1 - 接合装置、接合方法及び加圧ユニット - Google Patents
接合装置、接合方法及び加圧ユニット Download PDFInfo
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- WO2016157461A1 WO2016157461A1 PCT/JP2015/060290 JP2015060290W WO2016157461A1 WO 2016157461 A1 WO2016157461 A1 WO 2016157461A1 JP 2015060290 W JP2015060290 W JP 2015060290W WO 2016157461 A1 WO2016157461 A1 WO 2016157461A1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Definitions
- the present invention relates to a bonding apparatus, a bonding method, and a pressure unit.
- the metal particle paste is a low-temperature sintering type conductive paste that contains nano-sized or sub-micron-sized metal particles in a solvent and utilizes the low-temperature sintering phenomenon and high surface activity of the metal particles.
- a conventional bonding apparatus 900 pressurizes an assembly 10 in which an electronic component 14 (semiconductor element) is placed on a substrate 12 on which a conductor pattern is formed via a metal particle paste 16 while heating. Is a joining device for joining the substrate 12 and the electronic component 14 together.
- a conventional bonding apparatus 900 includes a heating mechanism unit 920 having a first heating unit 922 and a second heating unit 924 arranged at positions facing each other, and a second heating unit 924 from the first heating unit 922 to the second heating unit. And a pressurizing mechanism (not shown) that pressurizes the assembly 10 by moving along the direction toward 924.
- the first heating unit 922 is located below the second heating unit 924.
- the first heating unit 922 and the second heating unit 924 are used by moving the second heating unit 924 downward.
- the assembly 10 is pressurized while being heated.
- the pressurizing mechanism unit that pressurizes the assembly 10 by moving the second heating unit 924 since the pressurizing mechanism unit that pressurizes the assembly 10 by moving the second heating unit 924 is provided, the assembly 10 using the first heating unit 922 and the second heating unit 924 is provided.
- the substrate 12 and the electronic component 14 can be bonded to each other through the metal particle paste 16.
- the assembly 10 since the assembly 10 is disposed on the first heating unit 922 and then the assembly 10 is pressurized while being heated using the first heating unit 922 and the second heating unit 924, Before the assembly 10 is pressurized, heat is transferred from the first heating unit 922 to the metal particle paste 16, so that the metal particle paste 16 partially undergoes a sintering reaction (solidification reaction). There is a problem that the electronic component 14 cannot be bonded with a high bonding force.
- Such a problem is not a problem that occurs only when a semiconductor device having a structure in which a substrate on which a conductor pattern is formed and a semiconductor element are bonded using a metal particle paste. This is also a problem that may occur in general joined bodies having a structure in which a “formed substrate or other substrate” and a “semiconductor element or other electronic component” are joined using a metal particle paste.
- the present invention has been made to solve the above-described problems, and can bond a substrate and an electronic component with a higher bonding force than before, and can evenly bond the substrate and the electronic component. It is an object of the present invention to provide a joining device capable of performing the above. It is another object of the present invention to provide a bonding method using such a bonding apparatus. Furthermore, it aims at providing the pressurization unit used for such a joining apparatus.
- a bonding apparatus includes a pressure unit having a first transmission member and a second transmission member that sandwich a substrate on which an electronic component is placed via a metal particle paste and transmits pressure and heat.
- a joining device that joins the substrate and the electronic component by heating while applying pressure, a heating mechanism having a first heating part and a second heating part disposed at positions facing each other, and the first A positioning mechanism for positioning the pressurizing unit at a position not in contact with either the first heating unit or the second heating unit in a space between the heating unit and the second heating unit; and the first heating Pressurizing unit that pressurizes the pressurizing unit by moving at least one of the first heating unit and the second heating unit along a direction from one of the first heating unit and the second heating unit toward the other. Characterized in that it comprises a part.
- the first transmission member includes a plateau portion protruding outward at a central portion of the surface opposite to the surface facing the second transmission member, and the plateau portion.
- the positioning mechanism portion has an opening into which the base plate portion is inserted when storing the pressurizing unit, and the positioning mechanism portion includes the shoulder portion provided around the shoulder portion.
- the first heating unit and the second heating unit are formed by positioning a tray having a bottom surface in which a support unit for supporting a shoulder is formed around the opening, and the tray in which the pressure unit is stored. It is preferable to have a positioning unit that can position the pressurizing unit at a position that does not contact any of the above.
- the first heating unit is positioned below the second heating unit, and the pressurizing mechanism unit moves the first heating unit upward. It is preferable to pressurize the pressurizing unit.
- the pressurizing mechanism unit can move the pressurizing unit and the tray in the vertical direction by moving the first heating unit in the vertical direction.
- the first heating unit is disposed on the first transmission member side of the pressurizing unit
- the second heating unit is disposed on the second transmission member side of the pressurizing unit
- the support unit is The shoulder is supported when the first transmission member is not in contact with the first heating part, and the shoulder is supported when the first transmission member is in contact with the first heating part. It is preferable that it will be in the state away from the part.
- the pressurizing mechanism section heats the pressurizing unit while pressurizing, and then moves the first heating section downward to move the pressurizing unit to the pressurizing unit. It is preferable that no contact is made with either the first heating unit or the second heating unit in the space between the first heating unit and the second heating unit.
- the pressurizing mechanism section moves the first heating section upward and moves the second heating section downward, whereby the pressurizing unit. Is preferably pressurized.
- the bonding apparatus preferably further includes a chamber provided at a position surrounding the first heating unit and the second heating unit, and a vacuum pump for evacuating the chamber.
- the bonding apparatus of the present invention preferably further includes an inert gas supply mechanism capable of supplying an inert gas into the chamber.
- the first heating unit is positioned above the second heating unit, and the pressurizing mechanism unit moves the first heating unit downward. It is preferable to pressurize the pressurizing unit.
- the bonding apparatus according to any one of [1] to [9] is used to sandwich an assembly in which an electronic component is placed on a substrate with a metal particle paste interposed therebetween. And a joining method for joining the substrate and the electronic component by heating while applying pressure to a pressure unit having a first transmission member and a second transmission member for transmitting heat.
- a pressurizing unit positioning step for positioning the pressurizing unit at a position not in contact with either the first heating unit or the second heating unit in a space between the heating unit and the second heating unit, and a pressurizing mechanism unit The pressure unit is moved by moving at least one of the first heating unit and the second heating unit in a direction from one of the first heating unit and the second heating unit toward the other.
- the first heating unit and the second heating unit are moved by a pressing unit moving step that moves the first heating unit and the second heating unit along a direction from one of the first heating unit and the second heating unit to the other.
- Pressurizing unit pressurization that heats the pressurizing unit while applying pressure by moving at least one of the sections along a direction from one of the first heating unit and the second heating unit toward the other. And a heating step in this order.
- a pressurizing unit of the present invention is a pressurizing unit used in the joining apparatus according to any one of [1] to [9], and is disposed at a position facing each other and transmits pressure and heat.
- the first transmission member and the second transmission member for the plate, the first transmission member projecting outward in a central portion of the surface opposite to the surface facing the second transmission member And a shoulder provided around the plateau.
- the first heating unit and the bonding method include the positioning mechanism unit for positioning the pressure unit at a position that does not contact either the first heating unit or the second heating unit. After the pressure unit is positioned at a position that does not contact any of the second heating units, the pressure unit can be heated while being pressurized using the first heating unit and the second heating unit. Therefore, it is possible to prevent heat from being transferred from the first heating unit to the metal particle paste before pressurizing the pressurizing unit, and to prevent the metal particle paste from partially causing a sintering reaction (solidification reaction). be able to. As a result, the substrate and the electronic component can be bonded with a higher bonding force than before.
- the joining apparatus, joining method, and pressurizing unit of the present invention since the pressurizing unit having the first transmission member and the second transmission member that sandwich the assembly and transmit the pressure and heat is used, the conventional joining is performed. Compared with the apparatus 900, the time during which heat is transferred to the metal particle paste can be delayed. For this reason, even when the pressure unit is pressurized while the first heating unit and the second heating unit are heated, heat is transmitted from the first heating unit to the metal particle paste before the pressure unit is pressurized. It is possible to prevent the metal particle paste from partially causing a sintering reaction. As a result, also from this viewpoint, the substrate and the electronic component can be bonded with a higher bonding force than before.
- the second transmission is performed.
- the member By moving the member while maintaining parallelism with respect to the first transmission member, it is possible to prevent a difference in pressure relating to each part of the electronic component. As a result, it is possible to uniformly bond the substrate and the electronic component.
- the pressurizing unit having the first transmitting member and the second transmitting member that sandwich the assembly and transmits pressure and heat is used.
- the pressurizing unit having the first transmitting member and the second transmitting member that sandwich the assembly and transmits pressure and heat is used.
- heat is transferred from the first heating unit to the metal particle paste before the pressure unit is pressurized. Can be prevented. Therefore, it is not necessary to change the temperatures of the first heating unit and the second heating unit when the pressure unit is pressurized, and the substrate and the electronic component can be joined with a relatively short tact time.
- the first transmission member is provided around the plateau portion and the plateau portion that protrude toward the outside in the central portion of the surface opposite to the surface facing the second transmission member. Therefore, when the pressurizing unit is stored in the tray and attached to the joining device, the tray can be supported by the tray support portion so that the tray can support the pressurizing unit.
- the tray When pressurizing the pressure unit, the tray can be brought into a state where it does not support the pressure unit by pushing the platen portion from the outside to the inside. Therefore, the pressurizing unit can be pressurized without being affected by the tray, and as a result, the substrate and the electronic component can be bonded more uniformly.
- the first transmission member is formed on the platen portion that protrudes outward at the center portion of the surface opposite to the surface facing the second transmission member, and around the plateau portion. Since the shoulder portion is provided, when the pressurizing unit is housed in the tray, the pressurizing unit is less likely to be displaced by inserting the base portion into the opening of the tray.
- FIG. 1A is a side sectional view of the bonding apparatus 100
- FIG. 1B is a side sectional view of the pressure unit 200 according to the first embodiment.
- FIG. 3 is a view for explaining a tray 131 in the first embodiment.
- FIG. 3 is a view for explaining the joining method according to the first embodiment.
- 4A to 4C are process diagrams.
- the chamber 110 is not shown (the same applies to FIGS. 5 to 7 below).
- FIG. 3 is a view for explaining the joining method according to the first embodiment.
- FIGS. 5A to 5C are process diagrams.
- FIG. 3 is a view for explaining the joining method according to the first embodiment.
- FIG. 6A to FIG. 6C are process diagrams.
- FIG. 3 is a view for explaining the joining method according to the first embodiment.
- 7A and 7B are process diagrams. It is a figure shown in order to demonstrate the conventional joining apparatus 900.
- FIG. 8 reference numeral 910 indicates a chamber, and reference numeral 928 indicates a heater.
- the assembly 10 will be described. As shown in FIG. 1, the assembly 10 has an electronic component 14 disposed on a substrate 12 on which a conductor pattern is formed via a metal particle paste 16.
- the “substrate” in the present specification refers to a component on which an electronic component is mounted.
- the substrate 1 in the first embodiment is a circuit board in which a conductor pattern is formed on a main body made of a non-conductive substance, for example.
- the constituent material of the substrate 1 is a material that can withstand the sintering temperature of the metal particle paste 4 (depending on the type, for example, 300 ° C.) (for example, if it is a main body, it is a heat-resistant resin, ceramic, or conductor pattern). (Metal) can be used.
- the substrate to which the present invention is applied may be a DCB (Direct Copper Bond) substrate or a lead frame.
- substrate which is an application object of this invention should just mount an electronic component, for example, may be a silicon chip. That is, the present invention can be applied to connect the silicon chip and the conductive connector.
- the electronic component 14 is a component used in, for example, an electric product, and particularly a component that needs to be electrically connected to the substrate 12.
- the electronic component 14 include a semiconductor element (for example, a semiconductor chip on which an integrated circuit is mounted), an electric motor, a resistor, a capacitor, a piezoelectric element, a connector, a switch, an antenna, and a conductive connector.
- the manufacturing method of the joined body of this invention can be used especially suitably when manufacturing the joined body which bonded at least 1 semiconductor element with the board
- the number of electronic components 14 is one, but the number of electronic components may be two or more. When the number of electronic components is two or more, the electronic components may be a single type or a plurality of types.
- the metal particle paste 16 is a low-temperature sintering type conductive paste that contains nano-sized or sub-micron-sized metal particles in a solvent and utilizes the low-temperature sintering phenomenon and high surface activity of the metal particles.
- the metal particle paste 16 contains, for example, metal particles, an organic dispersion material, an organic dispersion material capturing material, and a volatile organic solvent.
- the metal particles include metal nanoparticles (for example, metal particles having an average diameter of approximately 100 nm or less), metal submicron particles (for example, metal particles having an average diameter of approximately 0.1 ⁇ m to 1 ⁇ m), or metal Both nanoparticles and metal submicron particles can be used.
- As a material of the metal particles for example, silver, gold, or copper can be used.
- the organic dispersion material covers the surface of the metal particles at room temperature and functions to keep the metal particles in an independent dispersion state.
- the organic dispersion material trapping material functions to react with the organic dispersion material covering the metal particles at a high temperature to remove it from the surface of the metal particles.
- the volatile organic solvent functions to capture a reaction material between the organic dispersion material and the organic dispersion material capturing material and to release it as a gas.
- the joining device 100 is a joining device that joins the substrate 12 and the electronic component 14 by heating the pressurizing unit 200 while applying pressure.
- the pressurizing unit 200 includes a first transmission member 210, a second transmission member 220, a guide member 230, and an interval adjustment mechanism 240 as shown in FIG.
- the pressurizing unit 200 sandwiches the assembly 10 on which the electronic component 14 is placed via the metal particle paste 16 on the substrate 12 and transmits pressure and heat.
- the first transmission member 210 and the second transmission member 220 are connected via a guide member 230.
- the first transmission member 210 is a plate-like member on which the assembly 10 is placed.
- the first transmission member 210 has a plateau 212 protruding outward at a central portion of the surface opposite to the surface facing the second transmission member 220 and a shoulder 214 provided around the plateau 212.
- the first transmission member 210 includes a rectangular shape when viewed in a plan view (not only a strictly rectangular shape but also a rectangular shape as a whole, such as a rectangular shape with chamfered corners, the same applies hereinafter).
- a guide member 230 is erected at each corner portion of the first transmission member 210.
- H> D is established, where H is the height of the plateau 212 with respect to the shoulder 214, and D is the thickness of the tray 131 described later.
- the second transmission member 220 is a plate-like member that comes into contact with the electronic component 14 when the pressure unit 200 is being pressurized (see FIG. 5C).
- the second transmission member 220 has a quadrangular shape when viewed from above, and a guide member receiving hole 222 is formed at a position corresponding to the guide member 230 (each corner portion of the second transmission member 220).
- the guide member 230 is a rod-shaped member that connects the first transmission member 210 and the second transmission member 220 as shown in FIG.
- the guide member 230 guides the second transmission member 220 while maintaining parallelism with the first transmission member 210.
- One end of the guide member 230 is connected to the first transmission member 210 at each corner of the first transmission member 210, and the other end of the guide member 230 is inserted into the guide member receiving hole 222.
- the other end of the guide member 230 is configured not to protrude from the guide member receiving hole 222 even when the pressure unit 200 is pressurized.
- the interval adjustment mechanism 240 is an elastic member such as a coil spring that adjusts the interval between the first transmission member 210 and the second transmission member 220.
- the interval adjusting mechanism 240 separates the second transmission member 220 and the electronic component 14 when the pressure unit 200 is not pressurized, and the second transmission member 220 and the electronic component 14 when the pressure unit 200 is pressurized. Contact.
- the bonding apparatus 100 includes a chamber 110, a heating mechanism unit 120, a positioning mechanism unit 130, a pressurizing mechanism unit 140, a vacuum pump 150, and an inactive state.
- a gas supply mechanism 160 As shown in FIGS. 1 and 2, the bonding apparatus 100 according to the first embodiment includes a chamber 110, a heating mechanism unit 120, a positioning mechanism unit 130, a pressurizing mechanism unit 140, a vacuum pump 150, and an inactive state.
- a gas supply mechanism 160 is shown in FIGS. 1 and 2
- the chamber 110 (for example, a vacuum chamber) is provided at a position surrounding the first heating unit 122 and the second heating unit 124.
- the heating mechanism unit 120 includes a first heating unit 122, a second heating unit 124, and a temperature control unit 126 that controls the temperatures of the first heating unit 122 and the second heating unit 124.
- 1st heating part 122 and 2nd heating part 124 are arranged in the position which mutually opposes along the up-and-down direction in chamber 110, as shown in Drawing 1 (a).
- the 1st heating part 122 is located below the 2nd heating part 124, and can be moved to the up-and-down direction by pressurization mechanism part 140 mentioned below.
- the second heating unit 124 is fixed.
- the first heating unit 122 is on the first transmission member 210 side of the pressure unit 200
- the second heating unit 124 is on the pressure unit 200. It will be in the state where it has been arranged on the 2nd transmission member 220 side, respectively.
- the shapes of the first heating unit 122 and the second heating unit 124 are each plate-shaped, and a heater 128 for heating is provided inside.
- the heating temperature of the first heating unit 122 and the second heating unit 124 is, for example, 300 ° C.
- the temperature control unit 126 controls the temperature of the first heating unit 122 and the second heating unit 124 by controlling the output to the heater 128.
- the positioning mechanism unit 130 includes a tray 131 and a positioning unit 132 as shown in FIG.
- the positioning mechanism unit 130 positions the pressurizing unit 200 at a position that does not contact any of the first heating unit 122 and the second heating unit 124 in the space between the first heating unit 122 and the second heating unit 124.
- the tray 131 is a metal plate in which both ends of the bottom surface 133 are bent upward and bent outward at a predetermined height position.
- the length of the bottom surface 133 in the horizontal direction (the length from one end bent upward at the bottom surface 133 to the other end (the length in the left-right direction in FIG. 3)) is the horizontal length of the second heating unit 124. It is longer than the length in the direction (the length in the left-right direction in FIG. 1A).
- the tray 131 houses the pressure unit 200 so that the first transmission member 210 is on the lower side and the second transmission member 220 is on the upper side.
- the tray 131 is formed with an opening 134 into which the platen portion 212 is inserted when the pressurizing unit 200 is stored, and when the pressurizing unit 200 is stored.
- a support portion 135 that supports the shoulder portion 214 has a bottom surface 133 that is formed around the opening portion 134.
- the opening 134 is formed in a state connected to the outer edge of the bottom surface 133.
- the plateau 212 can be inserted into the opening from above, or the plateau 212 can be inserted by sliding from the side.
- the support part 135 supports the pressure unit 200.
- the support unit 135 is in a state of supporting the shoulder 214, and the first transmission member 210 is in contact with the first heating unit 122. Is in a state of being separated from the shoulder 214.
- the positioning unit 132 includes a tray receiving unit 137, a tray receiving unit driving unit 138, and a tray receiving unit driving control unit 139, and positions the tray 131 in which the pressing unit 200 is stored. By doing so, the pressurizing unit 200 can be positioned at a position where neither the first heating unit 122 nor the second heating unit 124 comes into contact. When the pressure unit 200 is positioned, the portion 136 bent outward is placed on the tray receiving portion 137 after the pressure unit 200 is accommodated in the tray 131.
- the tray receiving portion 137 receives the bent portion 136 of the tray 131 as shown in FIG.
- the tray receiving portion 137 is provided with a step (not shown) for positioning the placement position of the tray 131.
- the tray receiver drive unit 138 moves the tray receiver 137 in the vertical direction in order to adjust the height position of the tray receiver 137.
- the tray receiving unit driving unit 138 is configured by an appropriate driving mechanism (for example, a servo motor or a hydraulic mechanism).
- the tray receiver drive controller 139 adjusts the height position of the tray receiver 137 by controlling the tray receiver driver 138.
- the pressurizing mechanism unit 140 includes a first heating unit driving unit 142 and a first heating unit driving control unit 144.
- the pressurizing mechanism unit 140 can move the first heating unit 122 along the vertical direction (along the direction from the first heating unit 122 toward the second heating unit 124).
- the pressurizing mechanism unit 140 moves the first heating unit 122 upward to sandwich and pressurize the pressurizing unit 200 between the first heating unit 122 and the second heating unit 124.
- the pressurizing mechanism unit 140 can move the pressurizing unit 200 and the tray 131 in the vertical direction by moving the first heating unit 122 in the vertical direction (see, for example, FIG. 5A).
- the pressure mechanism unit 140 heats the pressure unit 200 while applying pressure, and then moves the first heating unit 122 downward to move to the initial position (position where the tray 131 is placed on the tray receiving unit 137).
- the pressure unit 200 can be moved so that it does not contact any of the first heating unit 122 and the second heating unit 124 in the space between the first heating unit 122 and the second heating unit 124. .
- the first heating unit driving unit 142 moves the first heating unit 122 in the vertical direction.
- an appropriate driving mechanism for example, a servo motor or a hydraulic mechanism
- the first heating unit drive control unit 144 controls the moving speed and the height position of the first heating unit 122 by controlling the first heating unit driving unit 142.
- the vacuum pump 150 evacuates the chamber 110.
- the inert gas supply mechanism 160 supplies an inert gas (for example, N 2 gas) into the chamber 110.
- the joining method according to the first embodiment is a joining method in which the substrate and the electronic component are joined by using the pressure unit 200 according to the first embodiment while being attached to the joining apparatus 100.
- the joining method according to Embodiment 1 includes a pressurizing unit manufacturing process, a pressurizing unit positioning process, a pressurizing unit moving process, a pressurizing unit pressurizing and heating process, The pressure unit cooling process is performed in this order.
- the joining method according to the first embodiment will be described in the order of steps.
- the metal particle paste 16 is apply
- a semiconductor element is used as the electronic component 14.
- the assembly 10 is disposed on the first transmission member 210.
- the guide member 230 is erected on the corner portion of the first transmission member 210, and the interval adjusting mechanism 240 is disposed around each guide member 230.
- the assembly 10 may be disposed on the first transmission member 210 in which the guide member 230 is erected in advance at the corner portion.
- the second transmission member 220 is disposed on the guide member 230, and the second transmission member 220 is supported by the interval adjustment mechanism 240. In this way, the pressure unit 200 is manufactured.
- the tray 131 containing the pressurizing unit 200 is placed on the tray receiving portion 137.
- the pressure unit 200 is positioned at a position in the space between the first heating unit 122 and the second heating unit 124 that does not contact any of the first heating unit 122 and the second heating unit 124 (FIG. 4 ( See a).).
- the height position of the pressure unit 200 at this time is an intermediate height position between the first heating unit 122 and the second heating unit 124.
- the pressurizing mechanism unit 140 moves the first heating unit 122 upward along the direction from the first heating unit 122 to the second heating unit 124 (along the vertical axis). Move.
- the 1st heating part 122 and the 2nd heating part 124 are heated beforehand. Both the heating temperature of the 1st heating part 122 and the 2nd heating part 124 is 300 degreeC, for example.
- the 1st heating part 122 If the 1st heating part 122 is moved to the position which contacts the 1st transmission member 210, it will be in the state where the 1st heating part 122 pushed the base part 212 of pressurization unit 200, and support part 135 of tray 131 will become a pressurization unit. It becomes a state away from the shoulder 214 of 200 (refer to the area surrounded by the broken line A in FIG. 4B).
- the pressure unit 200 and the tray 131 are also moved upward, and the tray 131 is separated from the tray receiving portion 137 (see FIG. 5A). ).
- the pressurization unit 200 will be pressurized with the 1st heating part 122 and the 2nd heating part 124, and the 1st heating part 122 and the 2nd The heating unit 124 pressurizes the assembly 10 (the metal particle paste 16 in the assembly 10) via the first transmission member 210 and the second transmission member 220. Further, heat is transmitted to the metal particle paste 16 in the assembly 10 by the first heating unit 122 and the second heating unit 124 via the first transmission member 210 and the second transmission member 220.
- the metal particle paste 16 can be heated while being pressurized. As a result, the metal particle paste 16 can be fired, and the joined body 11 in which the substrate 12 and the electronic component 14 are joined via the fired metal particle paste 16 can be formed.
- the substrate 12 and the electronic component 14 can be joined.
- the positioning mechanism unit 130 for positioning the pressure unit 200 at a position that does not contact any of the first heating unit 122 and the second heating unit 124 is provided. Then, after the pressure unit 200 is positioned at a position that does not contact either the first heating unit 122 or the second heating unit 124, the pressure unit 200 is pressurized using the first heating unit 122 and the second heating unit 124. Can be heated. Accordingly, it is possible to prevent heat from being transferred from the first heating unit 122 to the metal particle paste 16 before pressurizing the pressurizing unit 200, and the metal particle paste 16 partially undergoes a sintering reaction (solidification reaction). You can prevent it from happening. As a result, the substrate 12 and the electronic component 14 can be bonded with a higher bonding force than before.
- the pressure unit including the first transmission member 210 and the second transmission member 220 that sandwich the assembly 10 and transmit pressure and heat. Since 200 is used, the time during which heat is transferred to the metal particle paste 16 can be delayed as compared with the conventional bonding apparatus 900. For this reason, even when the pressurizing unit 200 is pressurized while the first heating unit 122 and the second heating unit 124 are heated, the first heating unit 122 applies the metal particle paste 16 before pressurizing the pressurizing unit 200. Heat can be prevented from being transferred, and the metal particle paste 16 can be prevented from partially causing a sintering reaction. As a result, also from this viewpoint, the substrate 12 and the electronic component 14 can be bonded with a higher bonding force than in the past.
- the pressure unit including the first transmission member 210 and the second transmission member 220 that sandwich the assembly 10 and transmit pressure and heat. Since 200 is used, it is possible to prevent a difference in the pressure related to each part of the electronic component 14 by moving the second transmission member 220 while maintaining parallelism with respect to the first transmission member 210. As a result, the substrate 12 and the electronic component 14 can be bonded uniformly.
- the pressure unit including the first transmission member 210 and the second transmission member 220 that sandwich the assembly 10 and transmit pressure and heat. 200 is used, even when the pressurizing unit 200 is pressurized while the first heating unit 122 and the second heating unit 124 are heated, the metal particle paste from the first heating unit 122 before pressurizing the pressurizing unit 200 is used. Heat can be prevented from being transmitted to 16. Therefore, it is not necessary to change the temperatures of the first heating unit 122 and the second heating unit 124 when the pressurizing unit 200 is pressurized, and the substrate 12 and the electronic component 14 can be bonded with a relatively short tact time. it can.
- the positioning mechanism unit 130 is formed with the opening 134 into which the base plate part 212 is inserted when the pressurizing unit 200 is stored, and the pressurizing unit 200 is stored. Since the support portion 135 that supports the shoulder portion 214 includes the tray 131 having the bottom surface 133 formed around the opening portion 134, the pressure unit 200 housed in the tray 131 is not easily displaced in the horizontal direction. Become.
- the positioning mechanism unit 130 positions the tray 131 in which the pressurizing unit 200 is stored, so that the first heating unit 122 and the second heating unit 124 are both positioned. Since the positioning unit 132 capable of positioning the pressure unit 200 at a position where the pressure unit 200 is not in contact is provided, the pressure unit 200 can be easily positioned simply by positioning the tray 131 containing the pressure unit 200.
- the first heating unit 122 is positioned below the second heating unit 124, and the pressurizing mechanism unit 140 moves the first heating unit 122 upward.
- the first heating unit 122 pushes the platen portion 212 of the pressurizing unit 200 only by moving the first heating unit 122. For this reason, it can be set as the state which the tray 131 does not support the pressurization unit 200, and the pressurization unit 200 can be pressurized without being influenced by the tray 131.
- the substrate 12 and the electronic component 14 can be uniformly bonded with high accuracy relatively easily.
- the pressurizing mechanism unit 140 can move the pressurizing unit 200 and the tray 131 in the vertical direction by moving the first heating unit 122 in the vertical direction. Therefore, it is not necessary to provide a new mechanism for moving the pressure unit 200.
- the support unit 135 is in a state of supporting the shoulder portion 214 when the first transmission member 210 is not in contact with the first heating unit 122, and the first transmission is performed.
- the member 210 is in contact with the first heating unit 122, the member 210 is separated from the shoulder 214. Therefore, when the pressure unit 200 is stored in the tray 131 and attached to the joining apparatus 100, the shoulder 214 is placed in the tray 131.
- the pressure unit 200 is pressurized, the tray 131 is pushed from the outside to the inside when the pressure unit 200 is pressurized. Can be in a state where the pressure unit 200 is not supported. Therefore, the pressurizing unit 200 can be pressurized without being affected by the tray 131, and as a result, the substrate 12 and the electronic component 14 can be bonded more uniformly.
- pressurizing unit 200 is moved to the 1st heating part 122 by moving the 1st heating part 122 below.
- the temperature of the first heating unit 122 and the second heating unit 124 is not changed.
- the pressure unit 200 can be cooled. Therefore, it is not necessary to wait for the temperature of the first heating unit 122 and the second heating unit 124 to decrease, and the substrate 12 and the electronic component 14 can be bonded more efficiently.
- the bonding apparatus 100 includes the chamber 110 provided at a position surrounding the first heating unit 122 and the second heating unit 124 and the vacuum pump 150 that evacuates the chamber 110.
- the metal particle paste 16 can be prevented from being oxidized before the pressurizing unit pressurizing and heating step is performed, and the bonding force between the substrate 12 and the electronic component 14 can be prevented from being lowered.
- the inert gas supply mechanism part 160 which can supply an inert gas in the chamber 110 is provided, before implementing a pressurization unit pressurization heating process, it is metal particles. Oxidation of the paste 16 can be further reliably suppressed, and a decrease in the bonding force between the substrate 12 and the electronic component 14 can be reliably prevented.
- the first transmission member 210 includes the plateau portion 212 and the plateau that protrude toward the outside in the central portion of the surface opposite to the surface facing the second transmission member 220. Since the shoulder portion 214 provided around the portion 212 is provided, when the pressurizing unit 200 is accommodated in the tray 131 and attached to the joining apparatus 100, the tray portion is supported by the support portion 135 of the tray 131. The pressurizing unit 200 can be supported, and when the pressurizing unit 200 is pressed, the tray 131 does not support the pressurizing unit 200 by pressing the platform 212 from the outside to the inside. Can do. Therefore, the pressurizing unit 200 can be pressurized without being affected by the tray 131, and as a result, the substrate 12 and the electronic component 14 can be bonded more uniformly.
- the first transmission member 210 is a plateau portion 212 that protrudes outward at the center portion of the surface opposite to the surface facing the second transmission member 220. And the shoulder 214 provided around the plateau 212, the pressurization unit 200 is inserted into the opening 134 of the tray 131 when the pressurization unit 200 is stored in the tray 131. It becomes difficult to shift the position.
- the bonding apparatus (not shown) according to the second embodiment has basically the same configuration as the bonding apparatus 100 according to the first embodiment, but moves not only the first heating unit but also the second heating unit. This is different from the case of the joining apparatus 100 according to the first embodiment. That is, in the joining apparatus according to the second embodiment, the pressurizing mechanism unit moves the first heating unit upward and moves the second heating unit downward.
- the pressurizing mechanism unit includes a second heating unit driving unit that moves the second heating unit and a second heating unit drive that controls the second heating unit driving unit. It further has a control part.
- the bonding apparatus according to the second embodiment is different from the bonding apparatus 100 according to the first embodiment in that not only the first heating unit but also the second heating unit is moved.
- the pressurizing unit is connected to the first heating unit and the first heating unit. After the pressure unit is positioned at a position that does not contact any of the second heating units, the pressure unit can be heated while being pressurized using the first heating unit and the second heating unit.
- a pressurization mechanism part moves a 1st heating part upwards and moves a 2nd heating part toward the downward direction, a 1st heating part and 1st 2
- the moving time of the heating unit can be shortened, and the substrate and the electronic component can be joined efficiently.
- the bonding apparatus according to the second embodiment has the same configuration as that of the bonding apparatus 100 according to the first embodiment except that not only the first heating unit but also the second heating unit is moved. It has the effect applicable among the effects which the joining apparatus 100 which concerns on has.
- the first heating unit is positioned below the second heating unit, and the pressurizing mechanism unit moves the first heating unit downward to thereby apply the pressurizing unit.
- the first heating unit may be positioned above the second heating unit, and the pressurizing mechanism unit may pressurize the pressurizing unit by moving the first heating unit downward.
- a mechanism for example, a suction mechanism that sucks the pressure unit upward
- the pressurization mechanism unit pressurizes the pressurization unit by moving the first heating unit (and the second heating unit) in the left-right direction.
- the first heating unit is disposed on the first transmission member side of the pressure unit and the second heating unit is disposed on the second transmission member side of the pressure unit.
- the invention is not limited to this.
- the first heating unit may be disposed on the second transmission member side of the pressure unit, and the second heating unit may be disposed on the first transmission member side of the pressure unit.
- the temperature of the 1st heating part and the 2nd heating part was 300 degreeC, this invention is not limited to this. Any temperature can be used as long as the metal particle paste can cause a sintering reaction.
- the temperature of a 1st heating part and a 2nd heating part is good also as the same temperature, and good also as a different temperature.
- First heating part driving part 144 ... First heating part control part, DESCRIPTION OF SYMBOLS 150 ... Vacuum pump, 160 ... Inert gas supply mechanism part, 200 ... Pressurization unit, 210 ... 1st transmission member, 212 ... Plateau part, 214 ... Shoulder part, 220 ... 2nd transmission member, 222 ... Guide Material receiving holes, 230 ... guide member, 240 ... gap adjustment mechanism
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Abstract
Description
まず、組立体10を説明する。
組立体10は、図1に示すように、導体パターンが形成された基板12に金属粒子ペースト16を介して電子部品14を配置したものである。
実施形態1における基板1は、例えば、非伝導性の物質からなる本体に導体パターンが形成された回路基板である。基板1の構成材料としては、金属粒子ペースト4の焼結温度(種類にもよるが、例えば300℃)に耐えられる材料(例えば、本体であれば耐熱性の樹脂やセラミックス、導体パターンであれば金属)からなるものを用いることができる。
なお、本発明の適用対象である基板は、DCB(Direct Copper Bond)基板やリードフレームであってもよい。また、本発明の適用対象である基板は、電子部品を搭載するものであればよく、例えば、シリコンチップであってもよい。つまり、シリコンチップと導電性の接続子とを接続するのに本発明を適用することもできる。
まず、導体パターンが形成された基板12に金属粒子ペースト16を塗布し、その上から電子部品14を配置することにより組立体10を作製する。電子部品14としては、半導体素子を用いる。
次に、第1伝達部材210の台地部212をトレイ131の開口部134に挿入して、第1伝達部材210の肩部214を支持部135が支持した状態とすることにより加圧ユニット200をトレイ131に収納する。
次に、加圧機構部140によって、第1加熱部122を第1加熱部122から第2加熱部124に向かう方向に沿って(鉛直軸に沿って)上方へ移動させる。
第1加熱部122をさらに上方へ移動させると、第1伝達部材210及び組立体10も上方へ移動し、電子部品14の上面と第2伝達部材220とが接触する(図5(c)参照。)
金属粒子ペースト16を焼成した後、第1加熱部122を下方に向かって移動させることにより、加圧ユニット200及びトレイ131を下方に向かって移動させ(図6(a)~図6(c)及び図7(a)参照。)、加圧ユニット200を収納したトレイ131及び第1加熱部122を最初の位置に戻す(図7(b)参照。)。これにより、加圧ユニット200は第1加熱部122及び第2加熱部124のどちらからも離間した状態となるため、加圧ユニット200を冷却することができる。
実施形態2に係る接合装置(図示せず。)は、基本的には実施形態1に係る接合装置100と同様の構成を有するが、第1加熱部だけでなく第2加熱部も移動させる点で実施形態1に係る接合装置100の場合とは異なる。すなわち、実施形態2に係る接合装置において、加圧機構部は、第1加熱部を上方に向かって移動させるとともに、第2加熱部を下方に向かって移動させる。
Claims (11)
- 基板に金属粒子ペーストを介して電子部品を載置した組立体を挟み込んで圧力及び熱を伝達する第1伝達部材及び第2伝達部材を有する加圧ユニットを加圧しながら加熱することによって前記基板と前記電子部品とを接合する接合装置であって、
互いに対向する位置に配置された第1加熱部及び第2加熱部を有する加熱機構部と、
前記第1加熱部及び前記第2加熱部の間の空間における前記第1加熱部及び前記第2加熱部のいずれにも接触しない位置に前記加圧ユニットを位置決めするための位置決め機構部と、
前記第1加熱部及び前記第2加熱部のうちの少なくとも一方を前記第1加熱部及び前記第2加熱部のうちの一方から他方に向かう方向に沿って移動させることにより前記加圧ユニットを加圧する加圧機構部とを備えることを特徴とする接合装置。 - 前記第1伝達部材は、前記第2伝達部材と対向する面とは反対側の面の中央部分において外側に向かって突出した台地部及び前記台地部の周囲に設けられた肩部を有し、
前記位置決め機構部は、
前記加圧ユニットを収納するときに前記台地部を挿入する開口部が形成され、かつ、前記加圧ユニットを収納するときに前記肩部を支持する支持部が前記開口部の周りに形成されている底面を有するトレイと、
前記加圧ユニットが収納された前記トレイを位置決めすることにより前記第1加熱部及び前記第2加熱部のいずれにも接触しない位置に前記加圧ユニットを位置決めすることが可能な位置決め部とを有することを特徴とする請求項1に記載の接合装置。 - 前記第1加熱部は、前記第2加熱部よりも下方に位置し、
前記加圧機構部は、前記第1加熱部を上方に向かって移動させることにより前記加圧ユニットを加圧することを特徴とする請求項2に記載の接合装置。 - 前記加圧機構部は、前記第1加熱部を上下方向に移動させることによって前記加圧ユニット及び前記トレイを上下方向に移動させることが可能であり、
前記第1加熱部は、前記加圧ユニットの前記第1伝達部材側に配置され、かつ、前記第2加熱部は、前記加圧ユニットの前記第2伝達部材側に配置され、
前記支持部は、前記第1伝達部材が前記第1加熱部と接触していない場合には前記肩部を支持した状態となり、前記第1伝達部材が前記第1加熱部と接触している場合には前記肩部から離れた状態となることを特徴とする請求項3に記載の接合装置。 - 前記加圧機構部は、前記加圧ユニットを加圧しながら加熱した後に、前記第1加熱部を下方に向かって移動させることにより前記加圧ユニットを前記第1加熱部及び前記第2加熱部の間の空間における前記第1加熱部及び前記第2加熱部のいずれにも接触しない状態とすることを特徴とする請求項3又は4に記載の接合装置。
- 前記加圧機構部は、前記第1加熱部を上方に向かって移動させるとともに前記第2加熱部を下方に向かって移動させることにより、前記加圧ユニットを加圧することを特徴とする請求項3~5のいずれかに記載の接合装置。
- 前記第1加熱部及び前記第2加熱部を囲む位置に設けられたチャンバーと、
前記チャンバー内を真空にする真空ポンプとをさらに備えることを特徴とする請求項1~6のいずれかに記載の接合装置。 - 前記チャンバー内に不活性ガスを供給可能な不活性ガス供給機構をさらに備えることを特徴とする請求項7に記載の接合装置。
- 前記第1加熱部は、前記第2加熱部よりも上方に位置し、
前記加圧機構部は、前記第1加熱部を下方に向かって移動させることにより前記加圧ユニットを加圧することを特徴とする請求項2に記載の接合装置。 - 請求項1~9のいずれかに記載の接合装置を用いて、基板に金属粒子ペーストを介して電子部品を載置した組立体を挟み込んで圧力及び熱を伝達する第1伝達部材及び第2伝達部材を有する加圧ユニットを加圧しながら加熱することによって前記基板と前記電子部品とを接合する接合方法であって、
位置決め機構部によって、第1加熱部及び第2加熱部の間の空間における前記第1加熱部及び前記第2加熱部のいずれにも接触しない位置に前記加圧ユニットを位置決めする加圧ユニット位置決め工程と、
加圧機構部によって、前記第1加熱部及び前記第2加熱部のうちの少なくとも一方を前記第1加熱部及び前記第2加熱部のうちの一方から他方に向かう方向に沿って移動させることにより、前記加圧ユニットを前記第1加熱部及び前記第2加熱部のうちの一方から他方に向かう方向に沿って移動させる加圧ユニット移動工程と、
前記加圧機構部によって、前記第1加熱部及び前記第2加熱部のうちの少なくとも一方を前記第1加熱部及び前記第2加熱部のうちの一方から他方に向かう方向に沿って移動させることにより、前記加圧ユニットを加圧しながら加熱する加圧ユニット加圧加熱工程とをこの順序で含むことを特徴とする接合方法。 - 請求項1~9のいずれかに記載の接合装置に用いる加圧ユニットであって、
互いに対向した位置に配置され、圧力及び熱を伝達するための前記第1伝達部材及び前記第2伝達部材を有し、
前記第1伝達部材は、前記第2伝達部材と対向する面とは反対側の面の中央部分において外側に向かって突出した台地部及び前記台地部の周囲に設けられた肩部を有することを特徴とする加圧ユニット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/122,927 US10037903B2 (en) | 2015-03-31 | 2015-03-31 | Bonding device, bonding method and pressure applying unit |
JP2015555328A JP6129352B2 (ja) | 2015-03-31 | 2015-03-31 | 接合装置、接合方法及び加圧ユニット |
PCT/JP2015/060290 WO2016157461A1 (ja) | 2015-03-31 | 2015-03-31 | 接合装置、接合方法及び加圧ユニット |
EP15880666.1A EP3279930A1 (en) | 2015-03-31 | 2015-03-31 | Bonding device, bonding method, and pressurization unit |
CN201580036480.XA CN106471611A (zh) | 2015-03-31 | 2015-03-31 | 接合装置、接合方法以及加压单元 |
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PCT/JP2015/060290 WO2016157461A1 (ja) | 2015-03-31 | 2015-03-31 | 接合装置、接合方法及び加圧ユニット |
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US (1) | US10037903B2 (ja) |
EP (1) | EP3279930A1 (ja) |
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Cited By (1)
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JP6342566B1 (ja) * | 2017-11-16 | 2018-06-13 | アルファーデザイン株式会社 | 部品保持装置及び部品接合システム |
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DE102014114093B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114097B4 (de) * | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
US11152328B2 (en) * | 2018-12-13 | 2021-10-19 | eLux, Inc. | System and method for uniform pressure gang bonding |
KR20210037431A (ko) * | 2019-09-27 | 2021-04-06 | 삼성전자주식회사 | 본딩 헤드, 이를 포함하는 다이 본딩 장치 및 이를 이용한 반도체 패키지의 제조 방법 |
CN113458580A (zh) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | 接合装置 |
NL2031849B1 (en) * | 2022-05-13 | 2023-11-20 | Boschman Tech Bv | Micro-controlled Environment Carrier with Pedestals |
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- 2015-03-31 US US15/122,927 patent/US10037903B2/en not_active Expired - Fee Related
- 2015-03-31 CN CN201580036480.XA patent/CN106471611A/zh active Pending
- 2015-03-31 JP JP2015555328A patent/JP6129352B2/ja active Active
- 2015-03-31 EP EP15880666.1A patent/EP3279930A1/en not_active Withdrawn
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JP2008282986A (ja) * | 2007-05-10 | 2008-11-20 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
JP2010114208A (ja) * | 2008-11-05 | 2010-05-20 | Nikon Corp | 冷却装置および接合システム |
JP2012009703A (ja) | 2010-06-25 | 2012-01-12 | Shindengen Electric Mfg Co Ltd | 半導体装置の接合方法、および、半導体装置 |
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US10037903B2 (en) | 2018-07-31 |
EP3279930A1 (en) | 2018-02-07 |
JPWO2016157461A1 (ja) | 2017-04-27 |
JP6129352B2 (ja) | 2017-05-17 |
US20170076963A1 (en) | 2017-03-16 |
CN106471611A (zh) | 2017-03-01 |
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