WO2016150276A1 - 柔性衬底基板和显示基板及其制作方法、显示装置 - Google Patents

柔性衬底基板和显示基板及其制作方法、显示装置 Download PDF

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Publication number
WO2016150276A1
WO2016150276A1 PCT/CN2016/075103 CN2016075103W WO2016150276A1 WO 2016150276 A1 WO2016150276 A1 WO 2016150276A1 CN 2016075103 W CN2016075103 W CN 2016075103W WO 2016150276 A1 WO2016150276 A1 WO 2016150276A1
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Prior art keywords
substrate
film
groove
organic material
display
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PCT/CN2016/075103
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English (en)
French (fr)
Inventor
谢明哲
谢春燕
刘陆
王和金
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京东方科技集团股份有限公司
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Priority to US15/511,656 priority Critical patent/US10121834B2/en
Publication of WO2016150276A1 publication Critical patent/WO2016150276A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a flexible substrate substrate and a display substrate, a method of fabricating the same, and a display device.
  • the traditional display is a flat panel display and cannot be bent at will.
  • the future trend of display is to achieve a large amount of information display on the flexible body, that is, flexible display.
  • the flexible display and the flexible display module can achieve mechanical bending in any step of substrate packaging, production, storage, use, operation, process connection, handling, transportation, and the like.
  • the key technologies for flexible display can be divided into several areas: display technology, substrate technology, array technology and packaging technology.
  • the substrates that can realize flexible display mainly include three methods of an ultra-thin glass substrate, a metal foil substrate, and a plastic substrate.
  • plastic substrates generally selected PEN, PET, PI, PC, etc.
  • plastic is an organic material, and water vapor and oxygen easily penetrate the plastic to affect the quality of the flexible display panel, especially the performance of the OLED and the TFT. Even if the barrier layer is attached from the back side, moisture/oxygen will enter from the side and affect the quality of the product.
  • the present disclosure provides a flexible substrate substrate and a display substrate and a manufacturing method thereof for solving the problem that the flexible substrate of the organic material cannot block moisture, oxygen, and affect the quality of the product.
  • the present disclosure also provides a display device including the above display substrate capable of ensuring the quality of the product.
  • the flexible substrate substrate includes a substrate organic material film, the surface of the substrate organic material film has a groove, and the substrate organic material film The grooved surface is provided with a water oxygen barrier film having a thickness smaller than the groove depth of the groove.
  • the recess is filled with a film of a filling organic material such that a surface of the flexible substrate is flat, and the filling organic material film is disposed on the water-oxygen barrier film on.
  • the substrate organic material film and the material filling the organic material film are plastic or resin.
  • the embodiment of the present disclosure further provides a method for fabricating a flexible substrate as described above, which includes:
  • a water oxygen barrier film is formed on a surface of the substrate organic material film having a groove, and the thickness of the water oxygen barrier film is smaller than a groove depth of the groove.
  • the manufacturing method as described above, optionally, the manufacturing method further includes:
  • a film of a filled organic material is formed on the water-oxygen barrier film, and the film of the filled organic material is filled in the groove such that a surface of the flexible substrate is flat.
  • the flexible substrate is formed by the following steps:
  • the inorganic substrate is peeled off.
  • the display substrate further includes a flexible substrate and a display film layer disposed on the flexible substrate, the flexible substrate comprising a substrate organic material film, a substrate organic material film
  • the flexible substrate comprising a substrate organic material film, a substrate organic material film
  • the surface of the substrate organic material film having a groove is provided with a water oxygen barrier film, and the thickness of the water oxygen barrier film is smaller than the groove depth of the groove;
  • the display film layer is disposed on the water oxygen barrier film, and at least a portion of the display film layer is located in a region where the groove is located.
  • the recess is filled with a film of filled organic material such that the surface of the flexible substrate is flat, and the film of filled organic material is disposed on the water-oxygen barrier film;
  • the display film layer is specifically disposed on the film of the filled organic material.
  • the entire display film layer is located in a region where the groove is located.
  • the display film layer comprises an organic light emitting layer of an organic light emitting diode, or an active layer of a thin film transistor, the active layer being a silicon semiconductor material.
  • the embodiment of the present disclosure further provides a method for manufacturing a display substrate as described above, including:
  • the manufacturing method specifically includes:
  • the display film layer is formed on the water oxygen barrier film, and at least a portion of the display film layer is located in a region where the groove is located.
  • the manufacturing method as described above, optionally, the manufacturing method further includes:
  • the display film layer is formed on the filled organic material film.
  • the step of forming the flexible substrate substrate includes:
  • the inorganic substrate is peeled off.
  • a display device is also provided in an embodiment of the present disclosure, optionally including a display substrate as described above.
  • a recess is provided on a surface of the flexible substrate, and a water-oxygen barrier film is disposed on the surface of the flexible substrate having the recess, and the thickness of the water-oxygen barrier film is smaller than the recess The depth of the groove. Therefore, when the display element is formed on the water-oxygen barrier film, the water-oxygen barrier film located in the groove can block water vapor and oxygen from penetrating into the back side and the side surface of the substrate substrate.
  • the film layer affects the performance of the display element, improves the stability of the product, and ensures the quality of the display device.
  • 1 to 2 are schematic views showing a manufacturing process of a flexible substrate in some embodiments of the present disclosure
  • 3 to 5 are schematic views showing a manufacturing process of a display substrate in some embodiments of the present disclosure.
  • FIG. 6 is a schematic structural view of a flexible substrate in some embodiments of the present disclosure.
  • FIG. 7-9 are schematic views showing a manufacturing process of a display substrate in some embodiments of the present disclosure.
  • the present disclosure provides a flexible substrate and a manufacturing method thereof, in particular, a flexible substrate of an organic material (such as plastic or resin), which is used to solve the problem that water vapor and oxygen can penetrate the flexible substrate of the organic material, and the influence is set in Problems with the performance of display elements thereon, particularly organic display elements such as organic light emitting diodes and thin film transistors.
  • organic material such as plastic or resin
  • the surface of the flexible substrate substrate has a groove, and the surface of the flexible substrate substrate having the groove is provided with a water oxygen barrier film, and the thickness of the water oxygen barrier film is smaller than the groove depth of the groove. Therefore, when the display element is formed on the water-oxygen barrier film, the water-oxygen barrier film located in the groove can block moisture and oxygen from penetrating into the display element from the back side and the side surface of the substrate substrate, so as not to affect the performance of the display element. The quality of the display device is guaranteed.
  • the manufacturing method of the flexible substrate substrate comprises:
  • a water oxygen barrier film is formed on a surface of the substrate organic material film having a groove, and the thickness of the water oxygen barrier film is smaller than a groove depth of the groove.
  • the water oxygen barrier film may be an inorganic material because the inorganic material has the characteristics of blocking moisture and oxygen.
  • a flexible substrate substrate 1 is provided in an embodiment of the present disclosure.
  • the flexible base substrate 1 includes a substrate organic material film 10 having a groove 2 on its surface.
  • the substrate organic material film 10 having the surface of the groove 2 is provided with a water-oxygen barrier film 3.
  • the thickness of the water-oxygen barrier film 3 is smaller than the groove depth of the groove 2. Therefore, the water-oxygen barrier film 3 can block moisture and oxygen from penetrating into the groove 2 from the groove bottom and the groove of the groove 2.
  • the organic element is formed on the water-oxygen barrier film 3, it is possible to protect the organic element located in the groove 2 from moisture and oxygen, and to ensure the quality of the element.
  • the material of the water-oxygen barrier film 3 may specifically be an inorganic material.
  • a method for fabricating a flexible substrate substrate including:
  • a water-oxygen barrier film 3 is formed on the surface of the substrate organic material film 10 having the groove 2, and the thickness of the water-oxygen barrier film 3 is smaller than the groove depth of the groove 2.
  • the technical solution of the present disclosure can block water vapor and oxygen from penetrating from the back side and the side surface of the base substrate into the organic component disposed thereon, ensuring the quality of the component, and improving the stability of the product.
  • the flexible substrate 1 is formed by the following steps:
  • an inorganic substrate 20 such as a glass substrate
  • Forming the substrate organic material film 10 on the surface of the inorganic substrate 20, and the material of the substrate organic material film 10 may be selected from plastic or resin;
  • the inorganic substrate 20 is peeled off.
  • the flexible substrate 1 includes a substrate organic material film 10 disposed on the surface of the inorganic substrate 20, and the surface of the substrate organic material film 10 has a groove 2.
  • the inorganic substrate 20 may be peeled off in a suitable step as needed in a subsequent application, and finally, the flexible substrate 1 does not include the inorganic substrate 20. .
  • the recess 2 is further filled with a film 5 of filled organic material, and the film 5 filled with the organic material is disposed on the water-oxygen barrier film 3, as shown in FIG.
  • the surface of the flexible substrate can be made flat, which is advantageous for the uniformity of the subsequent process.
  • the material filling the organic material film 5 can be selected from plastic or resin.
  • the manufacturing method of the flexible substrate further comprises:
  • a film 5 filled with an organic material is formed on the water-oxygen barrier film 3, and the film 5 filled with the organic material is filled in the groove 2, so that the surface of the flexible substrate is flat.
  • the flexible substrate substrate in an embodiment of the present disclosure may specifically include:
  • a water-oxygen barrier film 3 disposed on the surface of the substrate organic material film 10 having the groove 2, the thickness of the water-oxygen barrier film 3 being smaller than the groove depth of the groove 2;
  • the filled organic material film 5 filled in the recess 2 and located on the water-oxygen barrier film 3 is such that the surface of the flexible substrate is flat.
  • the material of the filled organic material film 5 and the substrate organic material film 10 is the same.
  • the display substrate includes a flexible substrate substrate 1 and a display film layer 4 disposed on the flexible substrate substrate 1.
  • the flexible substrate substrate 1 includes a substrate organic material film 10 having a groove 2 on the surface thereof, and a water-oxygen barrier film 3 on the surface of the substrate organic material film 10 having the groove 2.
  • the thickness of the water-oxygen barrier film 3 is smaller than the groove depth of the groove 2.
  • the display film layer 4 is disposed on the water-oxygen barrier film 3, and at least a portion of the display film layer 4 is located in a region where the groove 2 is located.
  • the display film layer 4 is disposed in the recess 2.
  • the thickness of the water-oxygen barrier film 3 is smaller than the groove depth of the groove 2, water and oxygen
  • the barrier film 3 can block water vapor and oxygen from penetrating into the groove 2 from the groove bottom and the groove of the groove 2, and protect the display film layer 4 located in the groove 2 from moisture and oxygen, thereby improving the display element. Stability, to ensure the quality of the product.
  • a method for fabricating a display substrate including:
  • a display film layer 4 is formed on the water-oxygen barrier film 3, and at least a portion of the display film layer 4 is located in a region where the groove 2 is located.
  • the entire display film layer 4 is located in the region where the groove 2 is located, and the cooperation of the water-oxygen barrier film 3 and the groove 2 can protect the entire display film layer 4 from moisture and oxygen.
  • the manufacturing method further includes:
  • the inorganic substrate 20 is peeled off as shown in FIG.
  • the recess 2 is further filled with a film 5 filled with an organic material, and the film 5 filled with the organic material is disposed on the water-oxygen barrier film 3 to provide a flexible substrate having a flat surface as shown in FIG. Then, the display film layer 4 is specifically disposed on the film 5 for filling the organic material, which improves the uniformity of film formation, as shown in FIG.
  • the display film layer 4 specifically includes an organic light emitting layer of the organic light emitting diode.
  • the display film layer 4 specifically includes an active layer of a thin film transistor, particularly when the active layer is a silicone semiconductor material.
  • the flexible substrate 1 is formed by the following steps:
  • an inorganic substrate 20 such as a glass substrate
  • a substrate organic material film 10 is formed on the surface of the inorganic substrate 20, and the substrate organic material film 10 is formed.
  • the material can be selected from plastic or resin;
  • a groove 2 is formed on the surface of the substrate organic material film 10.
  • the inorganic substrate 20 is peeled off.
  • the method for manufacturing the display substrate in the embodiment of the present disclosure specifically includes:
  • the water-oxygen barrier film 3 is formed on the surface of the substrate organic material film 10 having the groove 2, and the thickness of the water-oxygen barrier film 3 is smaller than the groove depth of the groove 2;
  • the display film layer 4 is located in the region where the groove 2 is located, including each film layer of the organic light emitting diode, or each film layer of the thin film transistor;
  • the area of the display substrate located at the periphery of the groove 2 is removed along the broken line in FIG. 7, so that the display film layer 4 can be substantially protected from moisture and oxygen under the cooperation of the groove 2 and the water-oxygen barrier film 3;
  • the inorganic substrate 20 is peeled off.
  • the display substrate in the embodiment of the present disclosure is an organic light emitting diode display substrate or a thin film transistor display substrate, which is merely an example and is not a limitation.
  • the display film layer 4 may also be each film layer of other organic components, depending on the type of display substrate.
  • a display device including the display substrate in the embodiment of the present disclosure, can improve the stability of the product and ensure the quality of the product.
  • the technical solution of the present disclosure provides a water-oxygen barrier film by providing a groove on a surface of the flexible substrate, and a surface of the flexible substrate having a groove, and the thickness of the water-oxygen barrier film is smaller than the groove The depth of the groove. Therefore, when the display element is formed on the water-oxygen barrier film, the water-oxygen barrier film located in the groove can block water vapor and oxygen from penetrating into the display film layer from the back surface and the side surface of the substrate substrate, thereby affecting the performance of the display element and improving The stability of the product guarantees the product of the display device quality.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

提供一种柔性衬底基板（1）和显示基板及其制作方法、显示装置。所述柔性衬底基板（1）的表面设置有凹槽（2），并在所述柔性衬底基板（1）具有凹槽（2）的表面设置水氧阻挡薄膜（3），且所述水氧阻挡薄膜（3）的厚度小于所述凹槽（2）的槽深。

Description

柔性衬底基板和显示基板及其制作方法、显示装置
相关申请的交叉引用
本申请主张在2015年3月26日在中国提交的中国专利申请号No.201510134975.8的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，特别是涉及一种柔性衬底基板和显示基板及其制作方法、显示装置。
背景技术
传统的显示都是平板显示，不可以随意弯曲。显示的未来趋势是在柔性体上实现大量信息的展示，即柔性显示。柔性显示屏和柔性显示模组在基板包装、生产、存储、使用、操作、工序衔接、搬运、运输等任何一个步骤都可以实现机械弯曲。实现柔性显示的关键技术可以分为几个方面：显示技术、基板技术、阵列技术和封装技术。目前可以实现柔性显示的基板主要有超薄玻璃基板、金属箔片基板、塑料基板这三种方式。其中，塑料基板(一般选择PEN、PET、PI、PC等)柔韧性更好、质量更轻、更耐冲击，适于制作轻薄化器件，成为柔性显示技术的发展趋势。
但是，塑料为有机材料，水汽、氧气很容易穿透塑料进而影响柔性显示面板的品质，尤其是OLED、TFT的性能。就算从背面外贴阻隔层，水汽/氧气也是会从侧边进入从而影响产品的品质。
发明内容
本公开提供一种柔性衬底基板和显示基板及其制作方法，用以解决有机材料的柔性衬底基板不能阻隔水汽、氧气，影响产品的品质的问题。
本公开还提供一种显示装置，包括上述的显示基板，能够保证产品的品质。
为解决上述技术问题，本公开实施例中提供一种柔性衬底基板，所述柔性衬底基板包括衬底有机材料薄膜，衬底有机材料薄膜的表面具有凹槽，所述衬底有机材料薄膜具有凹槽的表面设置有水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。
如上所述的柔性衬底基板，可选的是，所述凹槽内填充有填充有机材料薄膜，使得柔性衬底基板的表面平坦，且所述填充有机材料薄膜设置在所述水氧阻挡薄膜上。
如上所述的柔性衬底基板，可选的是，所述衬底有机材料薄膜和填充有机材料薄膜的材料为塑料或树脂。
本公开实施例中还提供一种如上所述的柔性衬底基板的制作方法，其中，包括：
在一衬底有机材料薄膜的表面形成凹槽；
在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。
如上所述的制作方法，可选的是，所述制作方法还包括：
在所述水氧阻挡薄膜上形成填充有机材料薄膜，所述填充有机材料薄膜填充在所述凹槽内，使得柔性衬底基板的表面平坦。
如上所述的制作方法，可选的是，所述柔性衬底基板通过以下步骤形成：
提供一无机基板；
在所述无机基板的表面形成衬底有机材料薄膜；
在所述衬底有机材料薄膜的表面形成所述凹槽；
在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡膜；并且
剥离无机基板。
本公开实施例中还提供一种显示基板，包括柔性衬底基板和设置在所述柔性衬底基板上的显示膜层，所述柔性衬底基板包括衬底有机材料薄膜，衬底有机材料薄膜的表面具有凹槽，所述衬底有机材料薄膜具有凹槽的表面设置有水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深；
所述显示膜层设置在所述水氧阻挡薄膜上，且所述显示膜层的至少一部分位于所述凹槽所在的区域。
如上所述的显示基板，可选的是，所述凹槽内填充有填充有机材料薄膜，使得柔性衬底基板的表面平坦，且所述填充有机材料薄膜设置在所述水氧阻挡薄膜上；
所述显示膜层具体设置在所述填充有机材料薄膜上。
如上所述的显示基板，可选的是，整个所述显示膜层位于所述凹槽所在的区域。
如上所述的显示基板，可选的是，所述显示膜层包括有机发光二极管的有机发光层，或薄膜晶体管的有源层，所述有源层为硅半导体材料。
本公开实施例中还提供一种如上所述的显示基板的制作方法，包括：
形成柔性衬底基板；
在所述柔性衬底基板上形成显示膜层，
其中，所述制作方法具体包括：
在一衬底有机材料薄膜的表面形成凹槽；
在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深；
在所述水氧阻挡薄膜上形成所述显示膜层，且所述显示膜层的至少一部分位于所述凹槽所在的区域。
如上所述的制作方法，可选的是，所述制作方法还包括：
在所述水氧阻挡薄膜上形成填充有机材料薄膜，所述填充有机材料薄膜填充在所述凹槽内，使得柔性衬底基板的表面平坦；
在所述填充有机材料薄膜上形成所述显示膜层。
如上所述的制作方法，可选的是，形成柔性衬底基板的步骤包括：
提供一无机基板；
在所述无机基板表面形成衬底有机材料薄膜；
在所述衬底有机材料薄膜的表面形成凹槽；
在形成所述显示膜层之后，剥离所述无机基板。
本公开实施例中还提供一种显示装置，可选的是，包括如上所述的显示基板。
本公开的上述技术方案的有益效果如下：
上述技术方案中，通过在柔性衬底基板的表面设置凹槽，并在所述柔性衬底基板具有凹槽的表面设置水氧阻挡薄膜，且所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。从而在所述水氧阻挡薄膜上形成显示元件时，位于凹槽中的水氧阻挡薄膜能够阻挡水汽、氧气从衬底基板的背面和侧面穿透进入显 示膜层，影响显示元件的性能，提高了产品的稳定性，保证了显示装置的品质。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1-图2表示本公开一些实施例中柔性衬底基板的制作过程示意图；
图3-图5表示本公开一些实施例中显示基板的制作过程示意图；
图6表示本公开一些实施例中柔性衬底基板的结构示意图；
图7-图9表示本公开一些实施例中显示基板的制作过程示意图。
具体实施方式
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
本公开提供一种柔性衬底基板及其制作方法，尤其是有机材料(如塑料、树脂)的柔性衬底基板，用以解决水汽、氧气能够穿透有机材料的柔性衬底基板，影响设置在其上的显示元件的性能的问题，特别是有机发光二极管、薄膜晶体管等有机显示元件。
所述柔性衬底基板的表面具有凹槽，所述柔性衬底基板具有凹槽的表面设置有水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。因此，在所述水氧阻挡薄膜上形成显示元件时，位于凹槽中的水氧阻挡薄膜能够阻挡水汽、氧气从衬底基板的背面和侧面穿透进入显示元件，以免影响显示元件的性能，保证了显示装置的品质。
相应地，所述柔性衬底基板的制作方法包括：
在一衬底有机材料薄膜的表面形成凹槽；
在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。
其中，所述水氧阻挡薄膜可以为无机材料，因为无机材料具有阻隔水汽和氧气的特性。
下面将结合附图和实施例，对本公开的具体实施方式作进一步详细描述。以下实施例用于说明本公开，但不用来限制本公开的范围。
结合图2所示，本公开实施例中提供一种柔性衬底基板1。柔性衬底基板1包括衬底有机材料薄膜10，所述衬底有机材料薄膜10的表面具有凹槽2。所述衬底有机材料薄膜10具有凹槽2的表面设置有水氧阻挡薄膜3。水氧阻挡薄膜3的厚度小于凹槽2的槽深。因此，水氧阻挡薄膜3能够阻挡水汽和氧气从凹槽2的槽底和槽避穿透至凹槽2内。当在水氧阻挡薄膜3上形成有机元件时，能够保护位于凹槽2中的有机元件不会受到水汽和氧气的影响，保证元件的品质。
由于无机材料具有阻挡水汽和氧气的特性，水氧阻挡薄膜3的材料具体可以为无机材料。
相应地，结合图1和图2所示，本公开实施例中还提供一种柔性衬底基板的制作方法，包括：
在衬底有机材料薄膜10的表面形成凹槽2；
在所述衬底有机材料薄膜10具有凹槽2的表面形成水氧阻挡膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深。
本公开的技术方案能够阻挡水汽和氧气从衬底基板的背面和侧面穿透进入设置在其上的有机元件，保证元件的品质，提高产品的稳定性。
在实际工艺过程中，柔性衬底基板1通过以下步骤形成：
提供一无机基板20，如：玻璃基板；
在无机基板20的表面形成所述衬底有机材料薄膜10，衬底有机材料薄膜10的材料可以选择塑料或树脂；
在衬底有机材料薄膜10的表面形成凹槽2；
在所述衬底有机材料薄膜10具有凹槽2的表面形成水氧阻挡膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深；并且
剥离无机基板20。
柔性衬底基板1包括设置在无机基板20的表面的衬底有机材料薄膜10，衬底有机材料薄膜10的表面具有凹槽2。可以在后续的应用中，根据需要在合适的步骤中剥离无机基板20，最终，柔性衬底基板1并不包括无机基板20。.
可选地，凹槽2内还填充有填充有机材料薄膜5，且填充有机材料薄膜5设置在水氧阻挡薄膜3上，如图6所示。通过在凹槽2内填充所述填充有机材料薄膜5，可以使得柔性衬底基板的表面平坦，有利于后续工艺的均匀性。
其中，填充有机材料薄膜5的材料可以选择塑料或树脂
相应地，柔性衬底基板的制作方法还包括：
在水氧阻挡薄膜3上形成填充有机材料薄膜5，填充有机材料薄膜5填充在凹槽2内，使得柔性衬底基板的表面平坦。
如图6所示，本公开一实施例中的柔性衬底基板可以具体包括：
衬底有机材料薄膜10；
设置在衬底有机材料薄膜10表面的凹槽2；
设置在衬底有机材料薄膜10具有凹槽2表面的水氧阻挡薄膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深；
填充在凹槽2内并位于水氧阻挡薄膜3上的填充有机材料薄膜5，使得柔性衬底基板的表面平坦。
可选地，填充有机材料薄膜5和衬底有机材料薄膜10的材料相同。
基于同一发明构思，本公开实施例中还提供一种显示基板，如图4所示，所述显示基板包括柔性衬底基板1和设置在柔性衬底基板1上的显示膜层4。其中，柔性衬底基板1包括衬底有机材料薄膜10，所述衬底有机材料薄膜10的表面具有凹槽2，在衬底有机材料薄膜10具有凹槽2的表面设置有水氧阻挡薄膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深。显示膜层4设置在水氧阻挡薄膜3上，且显示膜层4的至少一部分位于凹槽2所在的区域。
具体的，设置显示膜层4的至少一部分位于凹槽2中。
上述技术方案中，由于水氧阻挡薄膜3的厚度小于凹槽2的槽深，水氧 阻挡薄膜3能够阻挡水汽和氧气从凹槽2的槽底和槽避穿透至凹槽2内，保护位于凹槽2中的显示膜层4不会受到水汽和氧气的影响，提高显示元件的稳定性，保证产品的品质。
相应地，结合图1-图3所述，本公开实施例中还提供一种显示基板的制作方法，包括：
形成衬底有机材料薄膜10；
在衬底有机材料薄膜10的表面形成凹槽2；
在衬底有机材料薄膜10具有凹槽2的表面形成水氧阻挡薄膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深；
在水氧阻挡薄膜3上形成显示膜层4，且显示膜层4的至少一部分位于凹槽2所在的区域。
可选地，整个显示膜层4位于凹槽2所在的区域，水氧阻挡薄膜3和凹槽2的配合能够保护整个显示膜层4不会受到水汽和氧气的影响。
为了提高显示基板的品质，所述制作方法还包括：
沿图3中的虚线去除显示基板位于凹槽2周边的区域，使得显示膜层4基本上都能够在凹槽2和水氧阻挡薄膜3的配合保护下，不受到水汽和氧气的影响，结合图3和图4所示；
剥离无机基板20，如图5所示。
本公开实施例中，凹槽2内还填充有填充有机材料薄膜5，且填充有机材料薄膜5设置在水氧阻挡薄膜3上，以提供表面平坦的柔性衬底基板，如图6所示。则，显示膜层4具体设置在填充有机材料薄膜5上，提高了成膜的均匀性，如图7所示。
对于有机发光二极管显示基板，显示膜层4具体包括机发光二极管的有机发光层。
对于薄膜晶体管显示基板，显示膜层4具体包括薄膜晶体管的有源层，特别是所述有源层为有机硅半导体材料时。
在实际工艺过程中，柔性衬底基板1通过以下步骤形成：
提供一无机基板20，如：玻璃基板；
在无机基板20的表面形成衬底有机材料薄膜10，衬底有机材料薄膜10 的材料可以选择塑料或树脂；
在衬底有机材料薄膜10的表面形成凹槽2。
在衬底有机材料薄膜10上形成显示膜层4后，剥离无机基板20。
结合图1、图2以及图6-图9所示，本公开实施例中显示基板的制作方法具体包括：
提供一无机基板20；
在无机基板20表面形成衬底有机材料薄膜10；
在衬底有机材料薄膜10表面形成凹槽2；
在衬底有机材料薄膜10具有凹槽2表面形成水氧阻挡薄膜3，水氧阻挡薄膜3的厚度小于凹槽2的槽深；
在水氧阻挡薄膜3上形成填充有机材料薄膜5，填充有机材料薄膜5填充在凹槽2内，使得柔性衬底基板的表面平坦；
在填充有机材料薄膜5上形成显示膜层4，显示膜层4位于凹槽2所在的区域，包括有机发光二极管的各膜层，或薄膜晶体管的各膜层；
沿图7中的虚线去除显示基板位于凹槽2周边的区域，使得显示膜层4基本上都能够在凹槽2和水氧阻挡薄膜3的配合保护下，不受到水汽和氧气的影响；
剥离无机基板20。
至此完成显示基板的制作。
需要说明的是，本公开实施例中的显示基板为有机发光二极管显示基板或薄膜晶体管显示基板，在此只是举例说明，并不是一种限制。显示膜层4也可以为其他有机元件的各膜层，具体取决于显示基板的类型。
本公开实施例中还提供一种显示装置，包括本公开实施例中的显示基板，能够提高产品的稳定性，保证产品的品质。
本公开的技术方案通过在柔性衬底基板的表面设置凹槽，并在所述柔性衬底基板具有凹槽的表面设置水氧阻挡薄膜，且所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。从而在所述水氧阻挡薄膜上形成显示元件时，位于凹槽中的水氧阻挡薄膜能够阻挡水汽、氧气从衬底基板的背面和侧面穿透进入显示膜层，影响显示元件的性能，提高了产品的稳定性，保证了显示装置的品 质。
以上所述仅是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开技术原理的前提下，还可以做出若干改进和替换，这些改进和替换也应视为本公开的保护范围。

Claims (14)

  1. 一种柔性衬底基板，其中，所述柔性衬底基板包括衬底有机材料薄膜，所述衬底有机材料薄膜的表面具有凹槽，所述柔性衬底基板具有凹槽的表面设置有水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。
  2. 根据权利要求1所述的柔性衬底基板，其中，所述凹槽内填充有填充有机材料薄膜，使得柔性衬底基板的表面平坦，且所述填充有机材料薄膜设置在所述水氧阻挡薄膜上。
  3. 根据权利要求2所述的柔性衬底基板，其中，所述衬底有机材料薄膜和填充有机材料薄膜的材料为塑料或树脂。
  4. 一种权利要求1-3任一项所述的柔性衬底基板的制作方法，包括：
    在一衬底有机材料薄膜的表面形成凹槽；
    在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深。
  5. 根据权利要求4所述的制作方法，其中，所述制作方法还包括：
    在所述水氧阻挡薄膜上形成填充有机材料薄膜，所述填充有机材料薄膜填充在所述凹槽内，使得柔性衬底基板的表面平坦。
  6. 根据权利要求4或5所述的制作方法，具体包括：
    提供一无机基板；
    在所述无机基板的表面形成衬底有机材料薄膜；
    在所述衬底有机材料薄膜的表面形成所述凹槽；
    在衬底有机材料薄膜具有凹槽的表面形成水氧阻挡膜；以及
    剥离无机基板。
  7. 一种显示基板，包括柔性衬底基板和设置在所述柔性衬底基板上的显示膜层，其中，所述柔性衬底基板包括衬底有机材料薄膜，衬底有机材料薄膜的表面具有凹槽，所述衬底有机材料薄膜具有凹槽的表面设置有水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深；
    所述显示膜层设置在所述水氧阻挡薄膜上，且所述显示膜层的至少一部分位于所述凹槽所在的区域。
  8. 根据权利要求7所述的显示基板，其中，所述凹槽内填充有填充有机材料薄膜，使得柔性衬底基板的表面平坦，且所述填充有机材料薄膜设置在所述水氧阻挡薄膜上；
    所述显示膜层具体设置在所述填充有机材料薄膜上。
  9. 根据权利要求7或8所述的显示基板，其中，整个所述显示膜层位于所述凹槽所在的区域。
  10. 根据权利要求7或8所述的显示基板，其中，所述显示膜层包括有机发光二极管的有机发光层，或，薄膜晶体管的有源层，所述有源层为硅半导体材料。
  11. 一种权利要求7-10任一项所述的显示基板的制作方法，包括：
    形成柔性衬底基板；
    在所述柔性衬底基板上形成显示膜层，
    其中，所述制作方法还包括：
    在一衬底有机材料薄膜的表面形成凹槽；
    在所述衬底有机材料薄膜具有凹槽的表面形成水氧阻挡薄膜，所述水氧阻挡薄膜的厚度小于所述凹槽的槽深；
    在所述水氧阻挡薄膜上形成所述显示膜层，且所述显示膜层的至少一部分位于所述凹槽所在的区域。
  12. 根据权利要求10所述的制作方法，其中，所述制作方法还包括：
    在所述水氧阻挡薄膜上形成填充有机材料薄膜，所述填充有机材料薄膜填充在所述凹槽内，使得柔性衬底基板的表面平坦；
    在所述填充有机材料薄膜上形成所述显示膜层。
  13. 根据权利要求11或12所述的制作方法，其中，形成柔性衬底基板的步骤具体包括：
    提供一无机基板；
    在所述无机基板表面形成衬底有机材料薄膜；
    在所述衬底有机材料薄膜的表面形成凹槽；
    在形成所述显示膜层之后，剥离所述无机基板。
  14. 一种显示装置，包括权利要求7-10任一项所述的显示基板。
PCT/CN2016/075103 2015-03-26 2016-03-01 柔性衬底基板和显示基板及其制作方法、显示装置 WO2016150276A1 (zh)

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