WO2019085030A1 - 有机电致发光显示装置及制作方法 - Google Patents

有机电致发光显示装置及制作方法 Download PDF

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WO2019085030A1
WO2019085030A1 PCT/CN2017/111069 CN2017111069W WO2019085030A1 WO 2019085030 A1 WO2019085030 A1 WO 2019085030A1 CN 2017111069 W CN2017111069 W CN 2017111069W WO 2019085030 A1 WO2019085030 A1 WO 2019085030A1
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layer
organic electroluminescence
electroluminescence display
polarizer
encapsulation
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PCT/CN2017/111069
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English (en)
French (fr)
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唐岳军
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武汉华星光电技术有限公司
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Priority to US15/739,888 priority Critical patent/US20190131584A1/en
Publication of WO2019085030A1 publication Critical patent/WO2019085030A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light

Definitions

  • the invention relates to a display panel technology, in particular to an organic electroluminescence display device and a manufacturing method thereof.
  • OLED Organic Light-Emitting Diode
  • LCD liquid crystal display
  • OLED displays have self-illuminating properties and do not use a separate light source, so they can be fabricated thinner and lighter than display devices that use separate light sources, making it relatively easy to achieve flexible, foldable display characteristics.
  • OLED displays have high quality characteristics such as low power consumption, high brightness, high response speed, and the like.
  • the fabrication of the OLED display comprises a plurality of film layers, such as a TFT (Thin Film Transistor) layer, a planarization layer, a pixel defining layer, an organic electroluminescent device layer, an encapsulation layer, the encapsulation layer comprising a package cap and/or a thin film encapsulation layer, OLED
  • the display also includes an anti-reflective layer of a circular polarizer to reduce ambient light reflection for outdoor viewing and even cover glass for protection.
  • the present invention provides an organic electroluminescence display device and a manufacturing method thereof, thereby improving manufacturing efficiency and reducing manufacturing time.
  • the present invention provides an organic electroluminescence display device comprising an organic electroluminescence display panel, the organic electroluminescence display panel comprising a substrate, an organic electroluminescent device layer disposed on the substrate, and an organic electroluminescence device An encapsulation layer on the device layer, a polarizer attached to a light-emitting surface of the organic electroluminescence display panel.
  • the polarizer is disposed on the encapsulation layer and/or on a side of the substrate facing away from the organic electroluminescent device layer.
  • a protective glass is disposed on the encapsulation layer, and the polarizer is disposed on the protective glass.
  • the encapsulation layer comprises at least one encapsulation film and/or package cover.
  • the encapsulation layer comprises at least one encapsulation film and a package cover, and the polarizer is disposed between the package film and the package cover.
  • the present invention also provides a method for fabricating a first organic electroluminescent display device, comprising the fabrication of an organic electroluminescent display panel, the fabrication of the organic electroluminescent display panel comprising fabricating an organic electroluminescent device layer on a substrate, respectively And attaching a polarizer to the encapsulation layer, and assembling the encapsulation layer to which the polarizer is attached and the substrate having the organic electroluminescence device layer.
  • the encapsulation layer comprises at least one encapsulation film and/or package cover.
  • the invention also provides a method for fabricating a second organic electroluminescent display device, comprising the fabrication of an organic electroluminescent display panel, the fabrication of the organic electroluminescent display panel comprising respectively forming a package on the organic electroluminescent device layer
  • the layer and the polarizer are attached to the cover glass, and the cover glass to which the polarizer is attached is assembled with the substrate having the package layer.
  • the present invention also provides a third method for fabricating an organic electroluminescence display device, comprising the fabrication of an organic electroluminescence display panel, comprising: fabricating an organic electroluminescent device layer on a substrate, respectively. And attaching a polarizer on a side of the encapsulation layer and the substrate facing away from the organic electroluminescent device layer, and assembling the encapsulation layer to which the polarizer is attached and the substrate having the organic electroluminescent device layer.
  • the encapsulation layer comprises at least one encapsulation film and/or package cover.
  • the final The encapsulating layer or the protective glass to which the polarizer is attached is combined with the substrate having the organic electroluminescent device layer, thereby enabling the respective devices to be fabricated separately, thereby improving manufacturing efficiency, reducing manufacturing time, and reducing process complexity.
  • FIG. 1-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 1 of the present invention.
  • 1-2 is a schematic diagram of fabricating an organic electroluminescent device layer and an encapsulation layer on a substrate according to Embodiment 1 of the present invention
  • FIG. 1-3 are schematic views showing the attachment of a polarizer to a cover glass according to Embodiment 1 of the present invention
  • 2-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 2 of the present invention.
  • FIG. 2-2 is a schematic view showing the fabrication of an organic electroluminescent device layer on a substrate according to Embodiment 2 of the present invention
  • 3-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 3 of the present invention.
  • 3-2 is a schematic view showing the fabrication of an organic electroluminescent device layer and a package film on a substrate according to Embodiment 3 of the present invention
  • 3-3 is a schematic view showing a polarizing plate attached to a package cover according to Embodiment 3 of the present invention.
  • FIG. 4 is a schematic view showing a polarizing plate attached to a substrate according to Embodiment 4 of the present invention.
  • Figure 5 is a schematic structural view of an organic electroluminescence display device according to Embodiment 5 of the present invention.
  • Fig. 6 is a schematic view showing the structure of an organic electric light-emitting display panel of the present invention.
  • the organic electroluminescence display device of the present invention comprises an organic electroluminescence display panel. As shown in FIG. 6, the organic electroluminescence display panel comprises at least a substrate 1, a thin film transistor layer 11, a pixel defining layer 119, and an organic electroluminescent device layer. 2 and the encapsulation layer 3.
  • the thin film transistor layer 11 may include a buffer layer 111, an active layer 112, a gate insulating layer 113, a gate electrode 114, an interlayer insulating layer 115, a source electrode 116, a drain electrode 117, and a flat layer 118, which are sequentially disposed, but
  • the structure of the thin film transistor of the invention is not limited thereto, and may be other types of thin film transistors such as an amorphous silicon thin film transistor, a metal oxide thin film transistor, or the like.
  • the organic electroluminescent device layer 2 includes an anode 12 and a cathode 13, and the anode 12 is in contact with the drain electrode 117 through a hole; and a pixel defining layer 119 is disposed on the flat layer 118 and the anode 12.
  • the organic electroluminescent device layer 2 further includes sequentially disposed from the anode 12 to the cathode 13: a cavity Injection layer (HIL) 21, hole transport layer (HTL) 22, organic light-emitting layer (EML) 23, electron transport layer (ETL) 24, and electron injection layer (EIL) 25; however, the organic electroluminescent device layer of the present invention 2 is not limited to the structure here.
  • HIL cavity Injection layer
  • HTL hole transport layer
  • EML organic light-emitting layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the material of the substrate 1 may be glass, metal sheet, or polyimide (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET). Formed from a polymer material such as polyethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP).
  • PI polyimide
  • PC polycarbonate
  • PES polyether sulfone
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PAR polyarylate
  • FRP glass fiber reinforced plastic
  • the improvement of the present invention is not in the thin film transistor layer and the organic electroluminescent device layer.
  • the organic electroluminescent display panel can adopt the top emission type organic electroluminescence display panel in the prior art, and the bottom emission type has An electroluminescence display panel or a double-sided illumination type organic electroluminescence display panel. Since the foregoing organic electroluminescence display panel is prior art, it will not be specifically described herein. The following is a detailed description of the improvement. description.
  • the polarizer 4 in the present invention is attached to the light-emitting surface of the organic electroluminescence display panel.
  • the polarizer 4 is a circular polarizer, and the polarizer 4 may have a thin film structure or a sheet structure, and is not particularly limited herein.
  • the polarizer 4 can be formed on the encapsulation layer 3 or the cover glass 5, and is selected according to actual conditions.
  • the polarizer 4 is a circular polarizer, but the invention is not limited thereto, for example, it may also be an anti-reflective layer of its type, an anti-reflective layer formed on the surface of the encapsulation layer or the protective cover, and an anti-reflection layer. Type selection, but the two structures are assembled separately or assembled/attached after they are completed.
  • FIG. 1-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 1 of the present invention, wherein the organic electroluminescence display panel in the organic electroluminescence display device is a top emission type organic electroluminescence display panel.
  • the organic electroluminescent display panel is provided with an encapsulation layer 3 on the organic electroluminescent device layer 2, and the encapsulation layer 3 is provided with a protective glass 5, and the polarizer 4 is attached to the cover glass 5, specifically The polarizer 4 is attached to the side surface of the cover glass 5 opposite to the encapsulation layer 3. Since the cover glass 5 is provided here, the encapsulation layer 3 can employ at least one encapsulation film 31.
  • the encapsulating film 31 is a single layer or a plurality of layers of an inorganic material, or may be a combination of a plurality of layers of an inorganic material layer and an organic material layer.
  • the manufacturing method of Embodiment 1 of the present invention includes the following steps:
  • the thin film transistor layer 11, the organic electroluminescent device layer 2, and the encapsulation layer 3 are formed on the substrate 1 by using the prior art;
  • the polarizing plate 4 is attached to the protective glass 5; specifically, a marking structure (not shown) for alignment can be formed on the protective glass, and the marking structure is prior art. It is not specifically limited herein, and the polarizing plate 4 and the substrate 1 having the encapsulating layer 3 are aligned by a marking structure;
  • the cover glass 5 to which the polarizer 4 is attached is assembled with the substrate having the encapsulation layer 3, and the assembly here can be performed by adhering or attaching.
  • the steps of forming the thin film transistor layer 11, the organic electroluminescent device layer 2, and the encapsulation layer 3 on the substrate 1 in Embodiment 1 and the step of attaching the polarizing plate 4 on the protective glass 5 may be performed simultaneously or at different times. They are carried out separately and are not specifically limited here.
  • the steps of forming the thin film transistor layer 11, the organic electroluminescent device layer 2, the encapsulation layer 3, the polarizing plate 4, and the protective glass 5 on the substrate 1 are not required in steps, but are separately fabricated and used.
  • the thin film transistor layer 11 , the organic electroluminescent device layer 2 , the encapsulation layer 3 are formed on the substrate, and the polarizing plate 4 is attached/adhered on the protective glass 5, thereby performing stepwise operation to enhance the organic electrochemistry.
  • the production efficiency of the light-emitting display device is not required in steps, but are separately fabricated and used.
  • the polarizer 4 is attached to the surface of the protective glass 5 opposite to the encapsulation layer 3.
  • the attachment of the polarizer 4 can be used in the prior art, and is not specifically limited herein.
  • FIG. 2-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 2 of the present invention, wherein the organic electroluminescence display panel in the organic electroluminescence display device is a top emission type organic electroluminescence display panel.
  • the organic electroluminescent display panel is provided with an encapsulation layer 3 on the organic electroluminescent device layer 2, and the encapsulation layer 3 includes a package cover 32, and the polarizer 4 is attached to the package cover 32, specifically The polarizer 4 is attached to a side surface of the package cover 32 opposite to the organic electroluminescent device layer 2.
  • a cover glass 5 may be further disposed on a side surface of the package cover 32 facing away from the polarizer 4.
  • the manufacturing method of Embodiment 2 of the present invention includes the following steps:
  • the thin film transistor layer 11 and the organic electroluminescent device layer 2 are formed on the substrate 1 by using the prior art;
  • the polarizer 4 is attached to the encapsulation layer 3; specifically, the encapsulation layer 3 includes a package cover 32, and the polarizer 4 is attached to the package cover 32 and the organic electroluminescent device layer 2.
  • a marking structure (not shown) for alignment may be formed on the package cover 32.
  • the marking structure is prior art, and is not specifically limited herein. The sheet 4 and the substrate 1 having the organic electroluminescent device layer 2 are aligned;
  • the encapsulation layer 3 to which the polarizer 4 is attached is assembled with the substrate having the organic electroluminescent device layer 2, and the assembly here can be performed by encapsulation using an encapsulant, and is not performed here. limited.
  • the protective glass 5 may be attached to the surface of the encapsulating layer 3 facing away from the polarizing plate 4 before or after the polarizing plate 4 is attached to the encapsulating layer 3, which is not specifically limited.
  • the steps of forming the thin film transistor layer 11, the organic electroluminescent device layer 2, the encapsulating layer 3, and the polarizing plate 4 on the substrate 1 are not required in steps, but are separately fabricated and fabricated by using existing methods.
  • the thin film transistor layer 11 and the organic electroluminescent device layer 2 are formed on a substrate, and the polarizing plate 4 is formed on the encapsulating layer 3, thereby performing stepwise operation to improve the production efficiency of the organic electroluminescence display device.
  • 3-1 is a schematic structural view of an organic electroluminescence display device according to Embodiment 3 of the present invention, wherein the organic electroluminescence display panel in the organic electroluminescence display device is a top emission type organic electroluminescence display panel.
  • the organic electroluminescent display panel is provided with an encapsulation layer 3 on the organic electroluminescent device layer 2, the encapsulation layer 3 includes at least one encapsulation film 31 and a package cover 32, and the encapsulation film 31 is disposed on the organic electro-electrode
  • the package cover 32 is disposed on a side surface of the package film 31 facing away from the organic electroluminescent device layer 2, and the polarizer 4 is attached to a surface of the package cover 32 opposite to the package film 31. .
  • a cover glass 5 may be further disposed on a side surface of the package cover 32 facing away from the polarizer 4.
  • the manufacturing method of Embodiment 3 of the present invention includes the following steps:
  • the thin film transistor layer 11, the organic electroluminescent device layer 2, and the encapsulation film 31 are formed on the substrate 1 by using the prior art;
  • the polarizing plate 4 is attached to the package cover 32; specifically, a marking structure (not shown) for alignment may be formed on the package cover 32, and the marking structure is also formed.
  • a marking structure for alignment may be formed on the package cover 32, and the marking structure is also formed.
  • the polarizing plate 4 and the substrate 1 having the organic electroluminescent device layer 2 and the encapsulating film 31 are aligned by a marking structure;
  • the encapsulation layer 3 is produced separately.
  • the package cover 32 to which the polarizer 4 is attached is assembled with the substrate having the organic electroluminescent device layer 2 and the package film 31, and the assembly here may be adhesion or attachment. Or use a packaged package.
  • the cover glass 5 may be attached to the surface of the package cover 32 facing away from the polarizer 4 before or after the polarizer 4 is attached to the package cover 32, which is not specifically limited.
  • the encapsulating film 31 is a single layer or a plurality of layers of an inorganic material, or may be a combination of a plurality of layers of an inorganic material layer and an organic material layer.
  • the steps of forming the thin film transistor layer 11, the organic electroluminescent device layer 2, the encapsulating layer 3, and the polarizing plate 4 on the substrate 1 are not required in steps, but are separately fabricated and fabricated by using existing methods.
  • a thin film transistor layer 11, an organic electroluminescent device layer 2, a package film 31 are formed on a substrate, and a polarizer 4 is formed on the package cover 32, thereby performing stepwise operation to improve the production efficiency of the organic electroluminescence display device. .
  • the organic electroluminescence display panel in the organic electroluminescence display device of the fourth embodiment is a bottom emission type organic electroluminescence display panel.
  • This structure is prior art and will not be described in detail herein.
  • the polarizer 4 is attached to the light-emitting surface of the organic electroluminescence display surface. Specifically, the polarizer 4 is attached to the substrate 1 away from the carrier thin film transistor layer 11 and the organic electroluminescent device layer 2 . On one side of the surface.
  • the manufacturing method of Embodiment 4 includes the following steps:
  • a thin film transistor layer 11 is formed on the substrate 1 by using the prior art.
  • the polarizing plate 4 is attached to the surface of the substrate 1 facing away from the thin film transistor layer 11 and the organic electroluminescent device layer 2; specifically, the marking structure for alignment can be formed on the substrate 1.
  • the marking structure is prior art, and is not specifically limited herein, and is aligned with the polarizer 4 by a marking structure.
  • FIG. 5 is a schematic structural diagram of an organic electroluminescence display device according to Embodiment 5 of the present invention, wherein the organic electroluminescence display panel in the organic electroluminescence display device is a transparent organic electroluminescence display panel or double-sided illumination.
  • the organic electroluminescent display panel where the polarizer 4 is disposed at the light-emitting surface of the organic electroluminescence display surface, and specifically, the polarizer 4 can be disposed in the arrangement structure of the polarizer 4 in Embodiment 1-3.
  • the processing and the manufacturing method are performed, and the details are not described in detail herein.
  • the polarizer 4 is disposed on a surface of the substrate 1 facing away from the thin film transistor layer 11 and on the encapsulation layer 3.
  • an organic electroluminescent device layer it is not necessary to sequentially fabricate or attach/adhere an organic electroluminescent device layer, an encapsulating layer, a polarizing plate, a protective glass, etc. on a substrate, and the two structures of the present invention can be fabricated step by step, and then packaged or adhered/ Attachment combination can improve the efficiency of OLED display production and production.

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  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供了一种有机电致发光显示装置，包括有机电致发光显示面板，所述有机电致发光显示面板包括基板、设置于基板上的有机电致发光器件层、设于有机电致发光器件层上的封装层、偏光片，所述偏光片贴附于有机电致发光显示面板的发光面上。本发明还提供了一种制作方法，包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在基板上制作有机电致发光器件层以及在封装层或保护玻璃上贴附偏光片。与现有技术相比，实现能够分别制作相应的器件，从而提高制造效率，减小制造时间和降低工艺的复杂性。

Description

有机电致发光显示装置及制作方法 技术领域
本发明涉及一种显示面板技术，特别是一种有机电致发光显示装置及制作方法。
背景技术
目前，有机电致发光(OLED，Organic Light-Emitting Diode)显示器作为用于显示图像的显示设备已备受关注。与液晶显示器(LCD)设备不同，OLED显示器具有自发光特性，并且不采用单独的光源,因此可以被制造的比采用单独光源的显示设备薄和轻，相对容易实现柔性、可折叠显示的特性。此外，OLED显示器具有诸如低功耗、高亮度、高响应速度等的高质量特性。
然而OLED显示器的制造包含多个膜层，例如TFT(薄膜晶体管)层、平坦层、像素限定层、有机电致发光器件层、封装层，封装层包含封装盖板和/或薄膜封装层，OLED显示器还包含圆偏光片等类型的抗反射层，以减小环境光反射促进户外可视，甚至还包含保护玻璃(cover glass)起到保护功能。这些制造工艺繁多、复杂，还需改进。
发明内容
为克服现有技术的不足，本发明提供一种有机电致发光显示装置及制作方法，从而提高制造效率、减小制造时间。
本发明提供了一种有机电致发光显示装置，包括有机电致发光显示面板，所述有机电致发光显示面板包括基板、设置于基板上的有机电致发光器件层、设于有机电致发光器件层上的封装层、偏光片，所述偏光片贴附于有机电致发光显示面板的发光面上。
进一步地，所述偏光片设于封装层上和/或基板背离有机电致发光器件层的一侧上。
进一步地，所述封装层上设有保护玻璃，所述偏光片设于保护玻璃上。
进一步地，所述封装层包括至少一层封装薄膜和/或封装盖板。
进一步地，所述封装层包括至少一层封装薄膜和封装盖板，所述偏光片设于封装薄膜与封装盖板之间。
本发明还提供了第一种有机电致发光显示装置的制作方法，包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在基板上制作有机电致发光器件层以及在封装层上贴附偏光片，将贴附有偏光片的封装层与具有有机电致发光器件层的基板进行组装。
进一步地，所述封装层包括至少一层封装薄膜和/或封装盖板。
本发明还提供了第二种有机电致发光显示装置的制作方法，包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在有机电致发光器件层上制作封装层以及在保护玻璃上贴附偏光片，将贴附有偏光片的保护玻璃与具有封装层的基板进行组装。
本发明还提供了第三种有机电致发光显示装置的制作方法，包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在基板上制作有机电致发光器件层以及在封装层和基板背离有机电致发光器件层的一侧上贴附偏光片，将贴附有偏光片的封装层与具有有机电致发光器件层的基板进行组装。
进一步地，所述封装层包括至少一层封装薄膜和/或封装盖板。
本发明与现有技术相比，通过在封装层和/或保护玻璃上贴附偏光片，通过分别制作有机电致发光器件层以及在封装层和/或保护玻璃上贴附偏光片，最终将贴附有偏光片的封装层或保护玻璃与具有有机电致发光器件层的基板相互组合，从而实现能够分别制作相应的器件，从而提高制造效率，减小制造时间和降低工艺的复杂性。
附图说明
图1-1是本发明实施例1的有机电致发光显示装置的结构示意图；
图1-2是本发明实施例1在基板上制作有机电致发光器件层以及封装层的示意图；
图1-3是本发明实施例1在保护玻璃上贴附偏光片的示意图；
图2-1是本发明实施例2的有机电致发光显示装置的结构示意图；
图2-2是本发明实施例2在基板上制作有机电致发光器件层的示意图；
图2-3是本发明实施例2在封装层上贴附偏光片的示意图；
图3-1是本发明实施例3的有机电致发光显示装置的结构示意图；
图3-2是本发明实施例3在基板上制作有机电致发光器件层以及封装薄膜的示意图；
图3-3是本发明实施例3在封装盖板上贴附偏光片的示意图；
图4是本发明实施例4在基板上贴附偏光片的示意图；
图5是本发明实施例5的有机电致发光显示装置的结构示意图；
图6是本发明有机电是发光显示面板的结构示意图。
具体实施方式
下面结合附图和实施例对本发明作进一步详细说明。
本发明的有机电致发光显示装置包括有机电致发光显示面板，如图6所示，有机电致发光显示面板至少包括基板1、薄膜晶体管层11、像素限定层119、有机电致发光器件层2以及封装层3。
所述薄膜晶体管层11可包括依次设置的缓冲层111、有源层112、栅极绝缘层113、栅极114、层间绝缘层115、源极116、漏极117、平坦层118，但本发明的薄膜晶体管的结构并不限于此，其还可以是非晶硅薄膜晶体管、金属氧化物薄膜晶体管等其他类型的薄膜晶体管。
所述有机电致发光器件层2包括阳极12、阴极13，所述阳极12经过孔与漏极117接触；像素限定层119设置于平坦层118、阳极12上。
所述有机电致发光器件层2还包括从阳极12到阴极13顺序设置的：空穴 注入层(HIL)21、空穴传输层(HTL)22、有机发光层(EML)23、电子传输层(ETL)24以及电子注入层(EIL)25；但本发明的有机电致发光器件层2并不限制于这里的结构。
所述基板1的材料可以为玻璃、金属片，也可以是聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料形成。
本发明的改进之处并不在于薄膜晶体管层、有机电致发光器件层，本发明中有机电致发光显示面板可采用现有技术中的顶发光型有机电致发光显示面板、底发光型有机电致发光显示面板或双面发光型有机电致发光显示面板，由于前述的有机电致发光显示面板为现有技术，在此不对其进行具体的描述，下面本发明针对改进之处进行详细的描述。
本发明中的偏光片4贴附于有机电致发光显示面板的发光面上。偏光片4为圆偏光片，偏光片4可以为薄膜结构也可以为片状结构，在此不做具体限定。
偏光片4可制作在封装层3或保护玻璃5上，具体根据实际情况进行选择。
本发明中，偏光片4为圆偏光片，但本发明不限于此，例如还可以为其类型的抗反射层，抗反射层在封装层或保护盖板表面形成方式，还可以依据抗反射层类型选择，但两结构分别完成后进行封装或粘附/贴附的组装。
如图1-1所示，为本发明实施例1的有机电致发光显示装置的结构示意图，此处有机电致发光显示装置中有机电致发光显示面板为顶发光型有机电致发光显示面板，所述有机电致发光显示面板在有机电致发光器件层2上设置有封装层3，封装层3上设置有保护玻璃5，所述偏光片4贴附于保护玻璃5上，具体地，偏光片4贴附于保护玻璃5与封装层3相对的一侧表面上，由于这里设置了保护玻璃5，因此封装层3可采用至少一层封装薄膜31。
所述封装薄膜31为单层或多层的无机材料层，也可以是多层无机材料层和有机材料层交替组合。
本发明实施例1的制作方法包括如下步骤：
如图1-2所示，采用现有技术在基板1上制作薄膜晶体管层11、有机电致发光器件层2以及制作封装层3；
以及如图1-3所示，在保护玻璃5上贴附偏光片4；具体地，可在保护玻璃上制作对位用的标记结构(图中未示出)，该标记结构为现有技术，在此不做具体限定，通过标记结构来与偏光片4以及具有封装层3的基板1进行对位；
如图1-1所示，将贴附有偏光片4的保护玻璃5与具有封装层3的基板进行组装，这里的组装可以为粘附或贴附的方式进行。
实施例1中在基板1上制作薄膜晶体管层11、有机电致发光器件层2、封装层3的步骤以及在保护玻璃5上贴附偏光片4的步骤可同时分别进行，也可以在不同时间分别进行，在此不做具体限定。
实施例1中不需要按照步骤依次在基板1上制作薄膜晶体管层11、有机电致发光器件层2、封装层3、偏光片4、保护玻璃5等步骤，而是将其分别进行制作，采用现有的制作方法在基板上制作薄膜晶体管层11、有机电致发光器件层2、封装层3，另外在保护玻璃5上贴附/粘附偏光片4，从而分步进行，提升有机电致发光显示装置的生产效率。
在实施例1中，偏光片4贴附在保护玻璃5与封装层3相对的一侧表面上，偏光片4的贴附可采用现有技术，在此不做具体限定。
如图2-1所示，为本发明实施例2的有机电致发光显示装置的结构示意图，此处有机电致发光显示装置中有机电致发光显示面板为顶发光型有机电致发光显示面板，所述有机电致发光显示面板在有机电致发光器件层2上设置有封装层3，封装层3包括封装盖板32，所述偏光片4贴附于封装盖板32上，具体地，偏光片4贴附于封装盖板32与有机电致发光器件层2相对的一侧表面上。
在实施例2中，在封装盖板32背离偏光片4的一侧表面上还可设置有保护玻璃5。
本发明实施例2的制作方法包括如下步骤：
如图2-2所示，采用现有技术在基板1上制作薄膜晶体管层11、有机电致发光器件层2；
以及如图2-3所示，在封装层3上贴附偏光片4；具体地，封装层3包括封装盖板32，偏光片4贴附与封装盖板32与有机电致发光器件层2相对的一侧，当然还可在封装盖板32上制作对位用的标记结构(图中未示出)，该标记结构为现有技术，在此不做具体限定，通过标记结构来与偏光片4以及具有有机电致发光器件层2的基板1进行对位；
如图2-1所示，将贴附有偏光片4的封装层3与具有有机电致发光器件层2的基板进行组装，这里的组装可以使用封装胶进行封装的方式进行，在此不做限定。
在封装层3上贴附偏光片4之前或之后，还可在封装层3背离偏光片4的一侧表面贴附保护玻璃5，在此不做具体限定。
实施例2中不需要按照步骤依次在基板1上制作薄膜晶体管层11、有机电致发光器件层2、封装层3、偏光片4等步骤，而是将其分别进行制作，采用现有的制作方法在基板上制作薄膜晶体管层11、有机电致发光器件层2，另外在、封装层3上制作偏光片4，从而分步进行，提升有机电致发光显示装置的生产效率。
如图3-1所示，为本发明实施例3的有机电致发光显示装置的结构示意图，此处有机电致发光显示装置中有机电致发光显示面板为顶发光型有机电致发光显示面板，所述有机电致发光显示面板在有机电致发光器件层2上设置有封装层3，所述封装层3包括至少一层封装薄膜31和封装盖板32，封装薄膜31设于有机电致发光器件层2上，封装盖板32设于封装薄膜31背离有机电致发光器件层2的一侧表面，所述偏光片4贴附于封装盖板32与封装薄膜31相对的一侧表面上。
在实施例3中，在封装盖板32背离偏光片4的一侧表面上还可设置有保护玻璃5。
本发明实施例3的制作方法包括如下步骤：
如图3-2所示，采用现有技术在基板1上制作薄膜晶体管层11、有机电致发光器件层2以及封装薄膜31；
以及如图3-3所示，在封装盖板32上贴附偏光片4；具体地，还可在封装盖板32上制作对位用的标记结构(图中未示出)，该标记结构为现有技术，在此不做具体限定，通过标记结构来与偏光片4以及具有有机电致发光器件层2、封装薄膜31的基板1进行对位；
在本实施例3中，封装层3采用分别制作的方式进行制作。
如图3-1所示，将贴附有偏光片4的封装盖板32与具有有机电致发光器件层2、封装薄膜31的基板进行组装，这里的组装可以为粘附或贴附的方式或使用封装胶封装的方式进行。
在封装盖板32上贴附偏光片4之前或之后，还可在封装盖板32背离偏光片4的一侧表面贴附保护玻璃5，在此不做具体限定。
所述封装薄膜31为单层或多层的无机材料层，也可以是多层无机材料层和有机材料层交替组合。
实施例3中不需要按照步骤依次在基板1上制作薄膜晶体管层11、有机电致发光器件层2、封装层3、偏光片4等步骤，而是将其分别进行制作，采用现有的制作方法在基板上制作薄膜晶体管层11、有机电致发光器件层2、封装薄膜31，另外在、封装盖板32上制作偏光片4，从而分步进行，提升有机电致发光显示装置的生产效率。
如图4所示，实施例4中的有机电致发光显示装置中的有机电致发光显示面板为底发光型有机电致发光显示面板，此结构为现有技术，在此不做详细说明，值得注意的是，此处的偏光片4贴附于有机电致发光显示面的发光面上，具体地，偏光片4贴附与基板1背离承载薄膜晶体管层11、有机电致发光器件层2的一侧表面上。
实施例4的制作方法包括如下步骤：
如图1-2所示，采用现有技术在基板1上制作薄膜晶体管层11、有机电致 发光器件层2以及制作封装层3；
以及如图4所示，在基板1背离薄膜晶体管层11、有机电致发光器件层2的一侧表面贴附偏光片4；具体地，可在基板1上制作对位用的标记结构(图中未示出)，该标记结构为现有技术，在此不做具体限定，通过标记结构来与偏光片4进行对位。
如图5所示，为本发明实施例5的有机电致发光显示装置的结构示意图，此处有机电致发光显示装置中有机电致发光显示面板为透明有机电致发光显示面板或双面发光型有机电致发光显示面板，此处偏光片4的设置位置为有机电致发光显示面的发光面，具体地，偏光片4的设置方式可采用实施例1-3中偏光片4的设置结构进行以及制作方法进行，在此不再详细赘述，如图所示，偏光片4设于基板1背离薄膜晶体管层11的一侧表面以及位于封装层3上。
本发明中不需要依次在基板上制作或贴附/粘附有机电致发光器件层、封装层、偏光片、保护玻璃等，可以分步进行本发明两结构制作，然后进行封装或粘附/贴附组合，可以提升OLED显示器制作和生产效率。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (20)

  1. 一种有机电致发光显示装置，包括有机电致发光显示面板，其中：所述有机电致发光显示面板包括基板、设置于基板上的有机电致发光器件层、设于有机电致发光器件层上的封装层、偏光片，所述偏光片贴附于有机电致发光显示面板的发光面上。
  2. 根据权利要求1所述的有机电致发光显示装置，其中：所述偏光片设于封装层上或基板背离有机电致发光器件层的一侧上。
  3. 根据权利要求1所述的有机电致发光显示装置，其中：所述偏光片设于封装层上和基板背离有机电致发光器件层的一侧上。
  4. 根据权利要求1所述的有机电致发光显示装置，其中：所述封装层上设有保护玻璃，所述偏光片设于保护玻璃上。
  5. 根据权利要求1所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板。
  6. 根据权利要求1所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜或封装盖板。
  7. 根据权利要求2所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板。
  8. 根据权利要求2所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜或封装盖板。
  9. 根据权利要求3所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜或封装盖板。
  10. 根据权利要求5所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板，所述偏光片设于封装薄膜与封装盖板之间。
  11. 根据权利要求6所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板，所述偏光片设于封装薄膜与封装盖板之间。
  12. 根据权利要求7所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板，所述偏光片设于封装薄膜与封装盖板之间。
  13. 根据权利要求8所述的有机电致发光显示装置，其中：所述封装层包括至少一层封装薄膜和封装盖板，所述偏光片设于封装薄膜与封装盖板之间。
  14. 一种有机电致发光显示装置的制作方法，其中：包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在基板上制作有机电致发光器件层以及在封装层上贴附偏光片，将贴附有偏光片的封装层与具有有机电致发光器件层的基板进行组装。
  15. 根据权利要求14所述的有机电致发光显示装置的制作方法，其中：所述封装层包括至少一层封装薄膜和封装盖板。
  16. 根据权利要求14所述的有机电致发光显示装置的制作方法，其中：所述封装层包括至少一层封装薄膜或封装盖板。
  17. 一种有机电致发光显示装置的制作方法，其中：包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在有机电致发光器件层上制作封装层以及在保护玻璃上贴附偏光片，将贴附有偏光片的保护玻璃与具有封装层的基板进行组装。
  18. 一种有机电致发光显示装置的制作方法，其中：包括有机电致发光显示面板的制作，所述有机电致发光显示面板的制作包括分别在基板上制作有机电致发光器件层以及在封装层和基板背离有机电致发光器件层的一侧上贴附偏光片，将贴附有偏光片的封装层与具有有机电致发光器件层的基板进行组装。
  19. 根据权利要求18所述的有机电致发光显示装置的制作方法，其中：所述封装层包括至少一层封装薄膜和封装盖板。
  20. 根据权利要求18所述的有机电致发光显示装置的制作方法，其中：所述封装层包括至少一层封装薄膜或封装盖板。
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