WO2016125841A1 - Dispositif de maintien de pièce et procédé de traitement de découpe au laser - Google Patents

Dispositif de maintien de pièce et procédé de traitement de découpe au laser Download PDF

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Publication number
WO2016125841A1
WO2016125841A1 PCT/JP2016/053292 JP2016053292W WO2016125841A1 WO 2016125841 A1 WO2016125841 A1 WO 2016125841A1 JP 2016053292 W JP2016053292 W JP 2016053292W WO 2016125841 A1 WO2016125841 A1 WO 2016125841A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
workpiece
holding device
workpiece holding
base material
Prior art date
Application number
PCT/JP2016/053292
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English (en)
Japanese (ja)
Inventor
良昭 辰己
利文 菅原
Original Assignee
株式会社クリエイティブテクノロジー
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Application filed by 株式会社クリエイティブテクノロジー filed Critical 株式会社クリエイティブテクノロジー
Priority to JP2016573410A priority Critical patent/JP6631888B2/ja
Publication of WO2016125841A1 publication Critical patent/WO2016125841A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a workpiece holding device and a laser cutting method for holding a workpiece.
  • a device using a mechanical clamp is a device used for lathe processing or milling, and is a device for fixing a workpiece by mechanically grasping (squeezing) a workpiece using a dedicated chuck (for example, patent document) 1).
  • An apparatus using a magnet is also an apparatus mainly used in machining, and is an apparatus for adsorbing and fixing a magnetic workpiece by the magnetic force of the magnet (see, for example, Patent Document 2).
  • the apparatus using the vacuum is an apparatus that grips the workpiece by the pressure difference between the front surface (processed surface) and the back surface of the workpiece, and is currently used most in Si wafer and glass processing. (For example, refer to Patent Document 3).
  • the technique of holding by wax fixing is a technique of fixing a workpiece using the property of wax that melts when heated and hardens when cooled (see, for example, Patent Document 4).
  • the technique of holding with a tape is a technique of holding a workpiece by attaching the tape to the back surface of the workpiece and fixing the tape with a vacuum chuck. This technique is frequently used in the grinding process of a Si wafer (see, for example, Patent Document 5).
  • An electrostatic chuck is a device that grips the back surface of a workpiece by static electricity, and is often used for holding a semiconductor or a display (see, for example, Patent Document 6).
  • the adhesive chuck is a device that focuses on the adhesiveness of silicone, butadiene rubber, and urethane rubber, and fixes a workpiece by the adhesive force of the silicone or the like (see, for example, Patent Document 7).
  • the above-described conventional technique cannot solve such a problem. That is, in a device using a mechanical clamp, for example, when a thin Si wafer or glass of 0.5 mm or less is ground, it cannot be gripped by a chuck. If it is forcibly gripped, the thin workpiece will be damaged by the mechanical force of the chuck. In an apparatus using a magnet, the workpiece needs to have magnetism, and therefore cannot hold a non-magnetic Si wafer or glass. A device using a vacuum can obtain a relatively large holding force. However, when a Si wafer or glass is processed thinly, it becomes easy to bend.
  • the technique of holding with a tape is the most used technique for processing a thin Si wafer.
  • this technique has a problem in terms of cost because an expensive tape such as a BG (background) tape or an expanded tape is used.
  • BG background
  • it is a consumable item while being an expensive tape. That is, once these tapes are used, they cannot be used again.
  • An electrostatic chuck develops its force even in a vacuum, and is used in many processes.
  • the holding force on a workpiece is weaker than other types of techniques.
  • Adhesive chucks use very soft rubber such as silicone, butadiene rubber, urethane rubber, etc., so if you try to fix the work piece with these rubbers, the work piece will move and high-precision processing Is difficult.
  • the present invention has been made to solve the above-described problems, and can hold and release various thin workpieces reliably and gently without being damaged or deformed even under various environments. Furthermore, it is an object of the present invention to provide a workpiece holding device and a laser cut processing method that enable reduction of processing costs and high-precision processing.
  • the invention of claim 1 is characterized in that an adhesive part capable of adhering a workpiece to the surface thereof and capable of bending in a thickness direction, and holding the adhesive part detachably on the surface.
  • a workpiece holding device provided with a holding portion to be fixed, wherein the adhesive portion is capable of fixing the workpiece by sticking on the surface thereof, and has an adhesive layer having flexibility at least in the thickness direction;
  • the holding portion is a portion formed by a base material layer that can be bent in the thickness direction and has a desired tensile strength, and is fixed to the back surface of the adhesive layer to suppress deformation of the adhesive layer due to external force.
  • the base material layer of the part was detachably adsorbed, and the adhesive part was held and fixed on the surface.
  • the workpiece can be held and fixed by installing the workpiece holding device of the present invention during the surface grinding process and the machining process in the semiconductor industry. That is, when the work piece is placed on the surface of the adhesive portion in a state where the separate adhesive portion is detachably held and fixed on the holding portion, the work piece is adhered by the adhesive portion and the work piece is held. It is held and fixed by the device. In this state, the surface of the workpiece can be processed using a grindstone or the like.
  • the workpiece holding device of the present invention since the workpiece can be held and fixed simply by placing the workpiece on the adhesive portion, mechanical stress is not given to the workpiece during holding and fixing. Absent. Therefore, by using this workpiece holding device, even in a thin workpiece processing process, it can be reliably held and fixed without being damaged or deformed. And after completion
  • maintained is removed from a holding part, a to-be-processed object is turned down, and an adhesion part is turned up. At this time, since the adhesive portion can be bent in the thickness direction, the adhesive portion is easily peeled off from the workpiece, the holding operation for the workpiece is released, and the workpiece is detached from the adhesive portion.
  • the adhesive portion is formed by the adhesive layer that can adhere and fix the workpiece on its surface and the base material layer fixed to the back surface of the adhesive layer.
  • an expensive tape such as a BG tape or an expanded tape.
  • the adhesive layer can be used not only once but many times.
  • the adhesive layer of the adhesive part is thickened, the workpiece moves, and there is a possibility that the fixing ability for holding and fixing the workpiece is lost. For this reason, it is preferable that the adhesive layer is as thin as possible.
  • the pressure-sensitive adhesive layer is made thin, the pressure-sensitive adhesive layer may be stretched or dented by an external force such as a grindstone transmitted through the workpiece during processing.
  • the adhesive portion has a desired tensile strength, and the base material layer that adheres to the back surface of the adhesive layer and suppresses deformation of the adhesive layer due to external force is fixed to the adhesive layer.
  • the adhesive layer is prevented from being deformed by an external force such as a grindstone transmitted through the workpiece, and there is no possibility that the adhesive layer will stretch or dent.
  • the workpiece is securely fixed, and high-precision machining is possible.
  • the work piece can be held and fixed at room temperature, heating and cooling processes and special parts are not required unlike the wax fixing technique. That is, according to the workpiece holding device of the present invention, a special processing process and processed parts are not required, and the processing cost can be reduced.
  • the adhesive layer of the adhesive portion includes silicone rubber (silicone resin), styrene butadiene rubber, chlorosulfonated polyethylene rubber, acrylonitrile butadiene rubber, ethylene propylene.
  • silicone rubber silicone resin
  • styrene butadiene rubber chlorosulfonated polyethylene rubber
  • acrylonitrile butadiene rubber ethylene propylene.
  • the rubber, chloroprene rubber, butadiene rubber, fluorine rubber, isobutylene isoprene rubber, and urethane rubber were used.
  • the base material layer of the adhesive portion is formed of a synthetic resin, and the holding portion is for vacuum adsorbing the base material layer of the adhesive portion. It was set as the structure which has a vacuum suction mechanism. With this configuration, the adhesive part can be strongly fixed on the holding part by placing the adhesive part on the holding part and causing the vacuum suction mechanism to function. At this time, since the base material layer of the adhesive portion is vacuum-sucked by the vacuum suction mechanism of the holding portion, the base material layer may be pulled into the suction hole and deformed.
  • the base material layer of the adhesive portion is formed of a synthetic resin having a desired tensile strength, so that the base material layer is pulled into the adsorption hole and deforms. It is not.
  • the base material layer of the adhesive portion is formed of either polyethylene terephthalate (PET) or polyimide.
  • the base material layer of the adhesive portion is formed of a magnetic member, and the holding portion magnetically attracts the base material layer of the adhesive portion. For this reason, either a permanent magnet or an electromagnet is provided.
  • a permanent magnet or an electromagnet is provided.
  • the workpiece holding device of the present invention can be used even in a vacuum. Furthermore, even if this workpiece holding device is used in a machining process that uses grinding fluid, cooling water, etc., unlike the vacuum suction mechanism, there are no suction holes. There is no such thing as inhaling.
  • the invention of claim 6 is the workpiece holding device according to any one of claims 1 to 5, wherein the thickness of the adhesive layer of the adhesive part is within 0.025 mm to 1.5 mm, and its hardness Is 20 ° to 70 °, and its adhesive strength is 2N (Newton) / 20 mm or less in terms of peel strength with respect to the work piece, and the size of the base material layer of the adhesive portion is equal to or larger than the size of the adhesive layer
  • the thickness is within 0.025 mm to 0.5 mm, and the tensile strength is 10 MPa (megapascal) or more.
  • a seventh aspect of the present invention is the workpiece holding device according to any one of the first to sixth aspects, wherein the pressure-sensitive adhesive layer and the base material layer of the pressure-sensitive adhesive portion have chemical resistance against a liquid used during processing. And it was set as the structure whose heat resistance is 100 degreeC or more. With this configuration, since the adhesive layer and the base material layer of the adhesive part have chemical resistance against the liquid used during processing, liquids such as grinding liquid and cooling water adhere to the workpiece and the adhesive part. Even so, the attractive force does not decrease. For this reason, the workpiece holding device of the present invention can reliably hold the workpiece without being affected even in a wet or dry processing environment. Furthermore, since the heat resistance of the adhesive layer and the base material layer of the adhesive part is 100 ° C. or higher, no special member for heat insulation is required even during heating and cooling, and the cost of parts is reduced. be able to.
  • the base material layer of the adhesive portion is formed of a conductive polyimide
  • the holding portion electrostatically charges the base material layer of the adhesive portion.
  • the configuration is an electrostatic chuck that is attracted by force. With this configuration, the work piece is adhered onto the adhesive layer of the adhesive portion, and the base material layer is placed on the electrostatic chuck that is the holding portion, so that the base material layer formed of conductive polyimide is electrostatically charged. The workpiece is attracted to the electrostatic chuck by force, and the workpiece is held and fixed on the electrostatic chuck.
  • the base material layer of the adhesive portion is a normal polyimide, it is not possible to obtain a sufficient adsorption force by the electrostatic chuck.
  • the base material layer of the adhesive portion is formed of conductive polyimide.
  • the invention of claim 9 is the workpiece holding device according to any one of claims 1 to 8, wherein the base material layer of the adhesive portion is a plurality of piece-like bases separated by a plurality of slits having a predetermined width. It consists of material layers.
  • the adhesive portion does not shrink. As a result, the workpiece is held on the adhesive portion without warping. Further, when a workpiece having warpage is attached to the adhesive portion, the adhesive layer is pressed against the entire surface of the workpiece being warped in a state where the adhesive portion is pulled or bent. Then, the workpiece is pressed until the workpiece is warped. Thereafter, the pressing force is released, and the adhesive portion is released from the pulling force or the like. Then, the workpiece tends to return to the original warped state by releasing the pressing force.
  • the contraction force of the entire adhesive portion resists the return force of the workpiece and maintains the workpiece without warping.
  • the workpiece is held on the adhesive portion without warping.
  • an adhesion part is pulled or bent.
  • the adhesive portion extends as a whole, and the workpiece is released from the adhesive force of the adhesive layer and is released from the adhesive portion.
  • each slit of the base material layer is a linear slit extending from one end to the other end of the base material layer,
  • the slits were arranged in parallel at predetermined intervals. With this configuration, even if the adhesive part is pulled in the length direction of the slit, the entire adhesive part does not spread. However, when the adhesive portion is pulled in the width direction of the slit, that is, in the direction in which the slits are arranged, the adhesive layer in the slit portion is extended and the entire adhesive portion is spread.
  • a roller or the like is placed on the base material layer of the adhesive part. Rolls in the vertical direction and presses the adhesive layer against the workpiece. Then, the adhesive portion is released from the pressing force of the roller or the like. Then, since the adhesive part does not shrink, the workpiece is held without warping.
  • the adhesive portion is arranged so that the alignment direction of the slits of the adhesive portion is the same as the warping direction of the workpiece. The adhesive layer is brought into contact with the warped surface of the workpiece.
  • the roller or the like is rolled in the direction in which the slits are arranged on the base material layer of the adhesive portion. Then, the entire adhesive portion extends in the slit arrangement direction, that is, the warping direction of the workpiece, and the adhesive layer is in pressure contact with the entire surface of the workpiece. Then, after the workpiece is pressed with a roller or the like until the workpiece is no longer warped, the pressing force of the roller or the like is released. Then, the workpiece tries to return to the warped state like the original bow.
  • the entire adhesive part tends to shrink in the slit alignment direction, so that the contraction force resists the return force of the work piece and the work piece is not warped. To maintain. As a result, the workpiece is held by the adhesive portion without warping. And when removing the to-be-processed workpiece hold
  • each slit of the base material layer is a linear slit.
  • each slit of the base material layer is a zigzag line-shaped or wavy line-shaped slit.
  • a thirteenth aspect of the present invention is the workpiece holding device according to the ninth aspect, wherein the plurality of slits are formed by a plurality of circular or polygonal slits having different diameters, and the small-diameter slit has a large diameter. It was set as the structure arrange
  • the adhesive part is also restored to the original state, and the adhesive layer adheres to the entire surface of the workpiece without warping.
  • the workpiece without warping is held by the adhesive portion, and the pasting of the workpiece is completed.
  • the pressures, such as air, are raised further.
  • transforms into the state protruded in the hook shape toward the workpiece.
  • the workpiece is pressed in a direction away from the adhesive portion and peeled off from the adhesive portion.
  • a fourteenth aspect of the present invention is a laser cutting method for laser cutting a workpiece using the workpiece holding device according to any one of the first to thirteenth aspects, wherein the workpiece holding device includes: A first step of forming an adhesive portion with an ultrathin adhesive layer and an ultrathin base material layer to reduce the thermal conductivity of the adhesive portion, and a second step of adhering the workpiece onto the adhesive portion And a third step of detachably adsorbing the base material layer of the adhesive portion by the holding portion, and holding and fixing the adhesive portion to the surface of the holding portion, and irradiating the surface of the workpiece with a laser, And a fourth step of half-cutting the workpiece.
  • the adhesive portion is formed of an extremely thin adhesive layer and an extremely thin base material layer. Then, by executing the second step, the workpiece is adhered on the adhesive portion, and by executing the third step, the adhesive portion is held and fixed on the surface of the holding portion.
  • the fourth step in this state the surface of the workpiece is irradiated with the laser, and the workpiece is half cut. That is, the workpiece can be laser-diced by executing the laser cut processing method. By the way, in laser cutting, the workpiece is heated by the energy of the laser, and the workpiece may be in an overheated state.
  • the adhesive portion of the workpiece holding device is formed by the ultrathin adhesive layer and the ultrathin base material layer to reduce the thermal conductivity of the adhesive portion. Therefore, the heat applied to the workpiece is not retained in the adhesive portion and is radiated to the outside, so that there is almost no possibility that the workpiece is overheated.
  • the present invention there is an excellent effect that even a thin workpiece can be reliably held and fixed without being damaged or deformed. Moreover, not only can the workpiece be securely fixed to enable high-precision machining, but also the workpiece can be held / released without applying a load. Furthermore, not only one processing but also a number of processings can be performed, and a special processing process and processed parts are not required, so that processing costs can be reduced.
  • a magnetic workpiece but also a non-magnetic workpiece can be securely held despite the configuration using a magnet, There is an effect that it can be used even in a vacuum.
  • the workpiece can be reliably held not only in a dry processing environment but also in a wet processing environment.
  • the work piece can be held in a state free from warpage by the pressure-sensitive adhesive portion regardless of whether the work piece is warped or not. There is an effect that the workpiece can be easily detached from the adhesive portion simply by pulling or bending the.
  • a workpiece that is warped only in one direction, such as a bow can be held without warping and can be easily removed.
  • FIG. 1 is a perspective view illustrating a workpiece holding device according to a first embodiment of the present invention, which is separated into an adhesive portion and a holding portion. It is a front view of the workpiece holding apparatus which shows a holding
  • FIG. 22A is a cross-sectional view showing a method for removing a Si wafer.
  • FIG. 22A shows a state before the start of roller movement
  • FIG. 22B shows a state where the roller starts moving
  • FIG. FIG. 22D shows the state of movement of the roller
  • FIG. 22D shows the state of movement of the roller and the state where the Si wafer is peeled off.
  • seat shows the example of the adhesion plate which has the slit of radial direction other than five slits. It is a top view which shows the adhesion plate which is the principal part of the workpiece holding apparatus which concerns on 10th Example of this invention. It is a top view which shows the modification of 10th Example, (a) of FIG. 36 shows the example of the adhesive plate in which the five slits of a base material sheet are eccentric, (b) of FIG.
  • seat shows the example of the adhesion plate which has the slit of radial direction other than five slits.
  • FIG. 1 is a perspective view showing a workpiece holding device according to a first embodiment of the present invention separately in an adhesive portion and a holding portion
  • FIG. 2 is a workpiece holding device showing the holding portion in cross section.
  • a workpiece holding device 1-1 of this embodiment is a device for holding and fixing a Si (silicon) wafer W as a workpiece, and includes an adhesive plate 2 as an adhesive portion. And a vacuum chuck 3-1 as a holding portion.
  • the adhesive plate 2 is a disc body that adheres the Si wafer W to its surface.
  • the adhesive plate 2 has flexibility that can be bent in the thickness direction (vertical direction in FIGS. 1 and 2).
  • the adhesive plate 2 has a structure in which an adhesive sheet 21-1 as an adhesive layer and a base material sheet 22-1 as a base material layer are laminated and fixed.
  • the pressure-sensitive adhesive sheet 21-1 is a sheet for sticking the Si wafer W onto the surface 21a.
  • the pressure-sensitive adhesive sheet 21-1 is formed of silicone rubber having flexibility in the thickness direction. .
  • the shape and size of the adhesive sheet 21-1 are set to be approximately the same shape and the same size as the circular Si wafer W, and as shown in FIG. 2, the thickness t1 is set to 1.0 mm.
  • the silicone rubber pressure-sensitive adhesive sheet 21-1 has a hardness of 60 °, and the pressure-sensitive adhesive strength with respect to the Si wafer W is 2 N / 20 mm or less. Further, the pressure-sensitive adhesive sheet 21-1 has chemical resistance against the grinding fluid S used during processing, and its heat resistance is 100 ° C. or higher.
  • the base sheet 22-1 is a sheet for suppressing the deformation of the adhesive sheet 21-1, and in this embodiment, the base sheet 22-1 is a synthetic resin that can be bent in the thickness direction.
  • PET polyethylene terephthalate
  • the shape and size of the base sheet 22-1 are set to be the same shape and almost the same size as the pressure-sensitive adhesive sheet 21-1, and the thickness t2 is set to 0.1 mm.
  • the tensile strength of the PET base material sheet 22-1 is about 50 MPa.
  • the base sheet 22-1 also has chemical resistance against the grinding fluid S used during processing, and its heat resistance is 100 ° C. or higher.
  • the base sheet 22-1 is fixed to the back surface 21b of the pressure-sensitive adhesive sheet 21-1, thereby preventing the pressure-sensitive adhesive sheet 21-1 from being deformed by an external force during processing.
  • the vacuum chuck 3-1 is a device for detachably holding and fixing the adhesive plate 2 to the surface 3a, and has a chuck body 30 and a vacuum suction mechanism 31.
  • the chuck body 30 has a circular surface 3 a for placing the adhesive plate 2, and the vacuum suction mechanism 31 is assembled to the chuck body 30.
  • the vacuum suction mechanism 31 is a mechanism for vacuum-sucking the adhesive plate 2 on the surface 3a, and is composed of a plurality of suction holes 32 opened to the surface 3a, an intake passage 33, a hose 34, and a vacuum pump 35. Yes. Specifically, as shown in FIG.
  • the lower ends of the plurality of suction holes 32 communicate with the intake passage 33, and one end of the hose 34 communicates with the intake passage 33, whereby the vacuum pump 35 is used.
  • the vacuum pump 35 By exhausting the air from the suction holes 32, the intake passage 33 and the hose 34, the back surface 22b of the base sheet 22-1 is sucked onto the surface 3a of the chuck body 30, and the adhesive plate 2 is attached to the chuck body 30. It is held and fixed on the top.
  • the pressure-sensitive adhesive plate 2 can be removed from the chuck body 30 by setting the suction holes 32, the intake passage 33, and the hose 34 to normal pressure.
  • FIG. 3 is a sectional view showing an example in which the workpiece holding device 1-1 is used for surface grinding.
  • the Si wafer W is set on the workpiece holding device 1-1 in the surface grinding process, first, the Si wafer W is placed on the adhesive plate 2, The wafer W is adhered to the surface 21a of the adhesive sheet 21-1.
  • a 0.7 mm thick Si wafer W was used as the workpiece.
  • the adhesive plate 2 is placed on the chuck body 30 of the vacuum chuck 3-1, and the vacuum pump 35 of the vacuum suction mechanism 31 is driven.
  • the air in the adsorption hole 32 and the intake passage 33 is exhausted to the outside through the hose 34, and the inside of the adsorption hole 32 becomes negative pressure.
  • the back surface 22b of the base sheet 22-1 is sucked onto the front surface 3a of the chuck body 30 by the suction holes 32, and the adhesive plate 2 is held and fixed on the chuck body 30.
  • the grindstone 100 is moved over the entire surface of the Si wafer W while being rotated while being pressed against the surface of the Si wafer W. At this time, the grinding liquid S is ejected from the nozzle 110 onto the Si wafer W to achieve grinding efficiency and cooling.
  • an SDC (metal coated diamond) # 325 is used as the grindstone 100, and the feed speed of the grindstone 100 is moved at 150 mm / min. It was possible to grind to a thickness of 08 mm.
  • the thickness of the Si wafer W used in this embodiment is 0.7 mm as described above, which is a very thin wafer. Therefore, if this Si wafer W is gripped from both the left and right sides and stress is applied, there is a risk of breakage.
  • the Si wafer W can be held and fixed simply by placing the Si wafer W on the adhesive plate 2. There is no stress. Therefore, by using the workpiece holding device 1-1, the thin Si wafer W is not damaged or deformed in the surface grinding process.
  • an expensive tape such as a BG tape or an expanded tape is not used. Since the Si wafer W is adhered and fixed using the adhesive plate 2 composed of the inexpensive adhesive sheet 21-1 and the base material sheet 22-1, processing can be performed at low cost. Furthermore, unlike these expensive tapes, the adhesive plate 2 can be used multiple times, not just once.
  • FIG. 4 is a front view for explaining a problem when the Si wafer W is adhered using only the thin adhesive sheet 21-1.
  • the thickness t1 of the adhesive sheet 21-1 is set to 1.0 mm, which is very thin. The reason why the thickness is reduced is that if the pressure-sensitive adhesive sheet 21-1 is made thicker, the Si wafer W moves and the fixing ability for holding and fixing the Si wafer W may be lost.
  • the pressure-sensitive adhesive plate 2 is formed of only the thin pressure-sensitive adhesive sheet 21-1, the pressure-sensitive adhesive sheet 21-1 expands or dents due to the pressure of the grindstone 100 rotating and moving during surface grinding. 21c occurs. Therefore, as shown in FIGS.
  • a PET base sheet 22-1 having a tensile strength of about 50 MPa is fixed to the back surface 21b of the adhesive sheet 21-1, An adhesive plate 2 was formed.
  • the base material sheet 22-1 having a tensile strength of about 50 MPa becomes the pressure-sensitive adhesive sheet 21-. Suppresses the occurrence of elongation and dent of 1.
  • the base sheet 22-1 of the adhesive plate 2 is formed of PET having a tensile strength of about 50 MPa, the base sheet 22-1 is drawn into the suction hole 32 of the vacuum suction mechanism 31, There is no risk of deformation.
  • the Si wafer W can be held and fixed at room temperature by the adhesive plate 2 and the vacuum chuck 3-1. This eliminates the need for heating and cooling processes and components as in the wax fixing technique. That is, according to the workpiece holding device 1-1, it is possible to reduce the processing cost without requiring a special processing process and processed parts.
  • FIG. 5 is a front view showing a method of removing the Si wafer W.
  • FIG. 5A shows a state where the adhesive plate 2 to which the Si wafer W is adhered is placed on the pedestal 120
  • FIG. (B) shows a state where the adhesive plate 2 is peeled off from the Si wafer W.
  • the vacuum pump 35 is reversely driven to bring the inside of the suction hole 32 to normal pressure.
  • the adhesive plate 2 to which the Si wafer W is adhered can be removed from the vacuum chuck 3-1.
  • the Si wafer W is placed on the lower side and the adhesive plate 2 is placed on the predetermined pedestal 120 with the adhesive plate 2 facing upward. In this state, as shown in FIG.
  • the finger 210 of the hand 200 is hooked on the periphery of the Si wafer W and pulled in the thickness direction.
  • the adhesive plate 2 as a whole has the flexibility to bend in the thickness direction (vertical direction in FIG. 5), so that the adhesive plate 2 is easily peeled off from the Si wafer W, and the Si wafer W The sticking operation of the sticking plate 2 is released. That is, the Si wafer W can be easily detached from the adhesive plate 2 with a small force by using the adhesive plate 2 applied to this embodiment.
  • FIG. 6 is a sectional view showing a workpiece holding device according to a second embodiment of the present invention.
  • the workpiece holding device 1-2 of this embodiment differs from the first embodiment in that the base sheet 22-2 of the adhesive plate 2 is formed of polyimide.
  • the base material sheet 22-2 of the adhesive plate 2 was formed of polyimide, which is a synthetic resin that can be bent in the thickness direction.
  • the thickness t2 of the base sheet 22-2 is set to 0.05 mm.
  • the tensile strength of the base material sheet 22-2 made of polyimide is 250 MPa, which is larger than the tensile strength of the base material sheet 22-1 made of PET. Therefore, the thickness t1 of the silicone rubber pressure-sensitive adhesive sheet 21-2 can be set to an extremely thin thickness of 0.1 mm. Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.
  • FIG. 7 is a sectional view showing a workpiece holding device according to a third embodiment of the present invention.
  • the workpiece holding device 1-3 of this embodiment includes an adhesive plate 2 and a magnet chuck 3-2.
  • the base material sheet 22-3 of the adhesive plate 2 was formed of a magnetic member that can be bent in the thickness direction.
  • SUS Stainless Used Steel
  • 430 having a tensile strength of 420 MPa was used.
  • the tensile strength of the base sheet 22-3 made of SUS430 is much larger than the tensile strength of the base sheets 22-1 and 22-2 used in the first and second examples.
  • the thickness t2 can be set to 0.03 mm.
  • the thickness t1 of the adhesive sheet 21-3 made of silicone rubber can be set to an extremely thin thickness of 0.05 mm or less.
  • the magnet chuck 3-2 is formed of a permanent magnet for magnetically attracting the base sheet 22-3 of the adhesive plate 2.
  • the chuck body itself of the magnet chuck 3-2 is formed of a permanent magnet.
  • FIG. 8 is a cross-sectional view showing an example in which the workpiece holding device 1-3 is used for surface grinding.
  • the adhesive plate 2 to which the Si wafer W is adhered is placed on the magnet chuck 3-2.
  • the base sheet 22-3 of the adhesive plate 2 is magnetically attracted to the surface 3a of the magnet chuck 3-2 by the magnet chuck 3-2 formed of a permanent magnet, and the entire adhesive plate 2 is magnetized. It is firmly fixed on the top.
  • the Si wafer W can be surface ground by rotating the grindstone 100 while being in pressure contact with the surface of the Si wafer W while jetting the grinding liquid S from the nozzle 110 onto the Si wafer W. .
  • the Si wafer W can be reliably held and fixed regardless of whether the Si wafer W is magnetic or non-magnetic. Further, since the adhesive plate 2 can be magnetically attracted onto the magnet chuck 3-2, the workpiece holding device 1-3 can be used even in a vacuum. Further, in the workpiece holding device 1-3 of this embodiment, unlike the vacuum suction mechanism, there is no suction hole in the chuck body 30, so that the situation where the grinding fluid S is sucked into the device does not occur. Since other configurations, operations, and effects are the same as those in the first and second embodiments, description thereof is omitted.
  • FIG. 9 is a sectional view showing a workpiece holding device according to a fourth embodiment of the present invention.
  • the workpiece holding device 1-4 of this embodiment is a device that can be applied to plasma dicing.
  • the workpiece holding device 1-4 is different from the first to third embodiments in that the adhesive plate 2 is electrostatically attracted by the electrostatic chuck 3-3.
  • the pressure-sensitive adhesive sheet 21-4 of the pressure-sensitive adhesive plate 2 is formed of silicone rubber having a thickness t1 of 0.1 mm
  • the base material sheet 22-4 is formed of a conductive thickness t2 of 0.05 mm.
  • the workpiece to be adhered by the adhesive plate 2 is a Si wafer W having a thickness of 0.7 mm as in the first to third embodiments.
  • the electrostatic chuck 3-3 is a device having a structure in which a pair of suction electrodes 36 and 37 are disposed on the surface side of the chuck body 30 and a predetermined voltage is supplied from the power source 38 to the suction electrodes 36 and 37.
  • a predetermined voltage is supplied from the power source 38 to the suction electrodes 36 and 37.
  • the electrostatic chuck 3-3 not only an apparatus having such a structure but also all known electrostatic chucks can be applied.
  • FIG. 10 is a cross-sectional view showing an example in which the workpiece holding device 1-4 is used for plasma dicing.
  • the electrostatic chuck 3-3 When used for plasma dicing, the electrostatic chuck 3-3 is placed in a plasma generator (not shown). Then, as shown in FIG. 10, the Si wafer W is adhered on the adhesive sheet 21-4 of the adhesive plate 2, and the base material sheet 22-4 is placed on the surface 3a of the electrostatic chuck 3-3. Thereafter, the power supply 38 is turned on to supply a predetermined voltage to the suction electrodes 36 and 37 of the electrostatic chuck 3-3.
  • the base material sheet 22-4 of the adhesive plate 2 is a normal polyimide, a sufficient suction force by the electrostatic chuck 3-3 cannot be obtained.
  • the base sheet 22-4 is made of conductive polyimide, strong electrostatic force is provided between the conductive base sheet 22-4 and the electrostatic chuck 3-3. Adsorption force is generated.
  • the Si wafer W is firmly held and fixed to the electrostatic chuck 3-3. In this state, plasma can be generated and the Si wafer W can be diced.
  • the adhesive plate 2 can be detached from the electrostatic chuck 3-3 by turning off the power supply 38. Thereafter, as shown in FIG. 5, the Si wafer W can be removed from the adhesive plate 2.
  • Other configurations, operations, and effects are the same as those in the first to third embodiments, and therefore their descriptions are omitted.
  • FIG. 11 is a sectional view for explaining the first to third steps of the laser cutting method according to the fifth embodiment of the present invention
  • FIG. 12 is a sectional view showing the fourth step. is there.
  • the laser cut processing method of this embodiment includes the first to fourth steps.
  • the adhesive plate 2 of the Si wafer W is formed of an extremely thin adhesive sheet 21-5 and an ultrathin base material sheet 22-5. That is, the thermal conductivity of the adhesive plate 2 is reduced by setting the adhesive plate 2 to be extremely thin.
  • the thickness t1 of the adhesive sheet 21-5 was set to 0.03 mm
  • the thickness t2 of the base material sheet 22-5 was set to 0.025 mm.
  • the second step is a step of sticking the Si wafer W to the surface 21 a of the adhesive plate 2.
  • the third step is a step of detachably sucking the base material sheet 22-5 of the adhesive plate 2 by the vacuum suction mechanism 31 of the vacuum chuck 3-1. That is, in this step, the adhesive plate 2 is held and fixed to the surface 3a of the vacuum chuck 3-1.
  • the fourth step is a step of irradiating the surface Wa of the Si wafer W with the laser L and half-cutting the Si wafer W as shown in FIG. Specifically, the laser W is irradiated from the laser generator 300 to the surface Wa of the Si wafer W to cut the groove Wc. This is so-called half-cut, and the groove Wc having a predetermined depth is formed without causing the laser L to reach the back surface Wb of the Si wafer W.
  • the Si wafer W can be laser-diced by performing the first to fourth steps of this embodiment.
  • the Si wafer W may be overheated by the energy of the laser.
  • the adhesive plate 2 and the ultrathin adhesive sheet 21-5 are extremely thin. Since the thermal conductivity of the adhesive plate 2 is reduced by forming the substrate sheet 22-5, the heat applied to the Si wafer W is dissipated outside without being held by the adhesive plate 2 . For this reason, there is almost no possibility that Si wafer W will be in an overheating state.
  • Other configurations, operations, and effects are the same as those in the first to fourth embodiments, and therefore their descriptions are omitted.
  • FIG. 13 is a cross-sectional view of an adhesive plate that is a main part of a workpiece holding device according to a sixth embodiment of the present invention
  • FIG. 14 is a plan view of the adhesive plate as viewed from the base sheet side.
  • the adhesive plate 2 applied to this embodiment is different from the adhesive plates of the first to fifth embodiments in that it has a plurality of slits 23-1.
  • this adhesive plate 2 is also based on any one of the adhesive sheets 21-1 to 21-5 (hereinafter referred to as “adhesive sheet 21”) as an adhesive layer.
  • Any one of base material sheets 22-1 to 22-5 as a material layer hereinafter referred to as “base material sheet 22” is laminated and fixed.
  • a plurality of slits 23-1 are provided on the base sheet 22 side.
  • each slit 23-1 is a linear slit, and extends from one end (upper end in FIG. 14) to the other end (lower end in FIG. 14) of the base sheet 22.
  • five slits 23-1 are arranged in parallel on the base sheet 22 at substantially equal intervals.
  • the width a of the slit 23-1 is constant in the length direction and the depth b is the thickness of the base sheet 22, as shown in a partially enlarged view surrounded by a broken-line circle. Is set equal to
  • the base sheet 22 is completely separated into six pieces 22a-1 which are piece-like base layers by the five slits 23-1.
  • FIG. 15 is a cross-sectional view for explaining the function of the adhesive plate 2.
  • FIG. 15 (a) shows a state in which the adhesive plate 2 is pulled in the A direction
  • FIG. 15 (b) shows an adhesive plate. 2 shows a state where 2 is pulled in the B direction
  • FIG. 16 is a plan view showing a state where the adhesive plate 2 is pulled.
  • the adhesive plate 2 of this example has a structure in which the base material sheet 22 fixed to the adhesive sheet 21 is separated into six pieces 22a-1 by five slits 23-1. It has become. Therefore, as shown in FIGS. 15A and 16, the base sheet 22 of the adhesive plate 2 with the adhesive sheet 21 on the lower side is pulled in the A direction, that is, the length direction of the slit 23-1. However, the portion 21d of the adhesive sheet 21 at the slit 23-1 does not extend in the A direction. Therefore, even if the base sheet 22 of the adhesive plate 2 is pulled in the A direction, the entire adhesive plate 2 does not spread in the A direction. On the other hand, as shown in FIG. 15B and FIG.
  • FIG. 17 is a cross-sectional view showing a method of attaching the Si wafer W without warping to the adhesive plate 2
  • FIG. 18 is a plan view showing the rolling direction of the roller.
  • the roller 220 is rolled in the A direction, that is, the length direction of the slit 23-1.
  • the adhesive sheet 21 adheres to the Si wafer W without extending.
  • the roller 220 is separated from the adhesive plate 2.
  • the adhesive sheet 21 does not extend and the entire adhesive plate 2 does not spread, even if the pressing force by the roller 220 is released, the adhesive plate 2 does not shrink. As a result, the Si wafer W is held on the adhesive plate 2 without being warped without receiving tension from the adhesive plate 2.
  • FIG. 19 is a cross-sectional view showing a method for attaching a warped Si wafer W to the adhesive plate 2
  • FIG. 20 is a plan view showing a roller rolling direction
  • FIG. It is sectional drawing which shows a state.
  • the Si wafer W warped in an arc shape is attached to the adhesive plate 2
  • the adhesive sheet 21 of the adhesive plate 2 is brought into contact with the warped surface Wa of the Si wafer W.
  • the base material sheet 22 of the adhesive plate 2 is pressed by the roller 220.
  • the adhesive plate 2 is arranged so that the arrangement direction of the slits 23-1 coincides with the warping direction of the Si wafer W, and the center axis M of the roller 220 has five slits 23 as shown in FIG.
  • the direction of the roller 220 is set so as to be parallel to -1.
  • the roller 220 is rolled in the B direction, that is, the direction in which the slits 23-1 are arranged.
  • the warp of the Si wafer W is corrected by the pressing rotation of the roller 220.
  • the adhesive plate 2 is pulled in the B direction, and the adhesive sheet 21 adheres to the surface Wa of the Si wafer W while extending in the B direction.
  • the entire surface of the adhesive sheet 21 is not warped while the entire adhesive plate 2 is spread in the B direction. Adhere to the entire surface. In this state, the roller 220 is separated from the adhesive plate 2. Then, since the adhesive plate 2 is released from the pressing force of the roller 220, the pressing force to the Si wafer W is also released, and the Si wafer W tries to warp back to the original bow shape. However, as shown in FIG. 21, when the pressure-sensitive adhesive sheet 21 of the pressure-sensitive adhesive plate 2 is released from the pressing force of the roller 220, it tends to shrink. As a result, as indicated by the arrows, the shrinkage force f1 of the adhesive plate 2 and the return force f2 of the Si wafer W are balanced, and the Si wafer W is held by the adhesive plate 2 without warping.
  • FIG. 22 is a cross-sectional view showing a method for removing the Si wafer W.
  • FIG. 22A shows a state before the roller 220 starts to move
  • FIG. 22B shows a state where the roller 220 starts moving.
  • FIG. 22C shows the movement state of the roller 220
  • FIG. 22D shows the state where the movement of the roller 220 is finished and the Si wafer W is peeled off.
  • both ends of the adhesive plate 2 holding the Si wafer W in the arrangement direction of the slits 23-1).
  • the roller 220 is positioned on, for example, the left end of the adhesive plate 2 in a state where both ends are supported by the support member 240.
  • the roller 220 is rolled in the direction in which the slits 23-1 are arranged while the adhesive plate 2 is pressed by the roller 220.
  • the adhesive plate 2 is bent downward, and the portion D of the Si wafer W that is greatly affected by the pressing force of the roller 220 is released from the adhesive force of the adhesive sheet 21.
  • the portion D of the Si wafer W up to the moving position of the roller 220 is peeled off from the adhesive plate 2. Therefore, as shown in FIG. 22C, when the roller 220 is rolled toward the right end of the adhesive plate 2, the Si wafer W sequentially moves from the adhesive plate 2 according to the amount of movement of the roller 220. It will be peeled off.
  • the Si wafer W is removed using the roller 220.
  • the Si wafer W can also be removed using the finger 210 of the hand 200. Can do. That is, the Si wafer W can be easily detached from the adhesive plate 2 by hooking the finger 210 of the hand 200 to the peripheral edge of one end portion of the adhesive plate 2 in the direction of the slits 23-1 in the arrangement direction. .
  • Other configurations, operations, and effects are the same as those in the first to fifth embodiments, and therefore their descriptions are omitted.
  • FIG. 23 is a plan view showing an adhesive plate 2 which is a main part of the workpiece holding device according to the seventh embodiment of the present invention.
  • the shape of the slit is different from the slit 23-1 of the sixth embodiment.
  • the slits 23-2 having the same width and depth as the slits 23-1 of the sixth embodiment were set in a zigzag shape in plan view.
  • the five slits 23-2 were arranged in parallel with the base material sheet 22, and the base material sheet 22 was separated into six pieces of zigzag section portions 22a-2.
  • Other configurations, operations, and effects are the same as those in the sixth embodiment, and thus description thereof is omitted.
  • FIG. 24 is a plan view showing an adhesive plate 2 which is a main part of the workpiece holding device according to the eighth embodiment of the present invention.
  • the shape of the slit is different from the slits 23-1 and 23-2 of the sixth and seventh embodiments.
  • the slits 23-3 having the same width and the same depth as the slits 23-1 and 23-2 of the sixth and seventh embodiments have a wavy shape in plan view.
  • the five slits 23-3 were arranged in parallel with the base material sheet 22, and the base material sheet 22 was separated into six pieces of wavy line section 22a-3.
  • Other configurations, operations, and effects are the same as those in the sixth and seventh embodiments, and therefore their descriptions are omitted.
  • FIG. 25 is a plan view showing the adhesive plate 2 that is a main part of the workpiece holding device according to the ninth embodiment of the present invention
  • FIG. 26 is a cross-sectional view of the adhesive plate 2.
  • This embodiment differs from the sixth to eighth embodiments in that the slit of the adhesive plate 2 is formed in a circular shape.
  • the slit 23-4 having the same width and depth as the slits 23-1 to 23-3 of the sixth to eighth embodiments is formed in a circular shape in plan view.
  • five slits 23-4 having different diameters were concentrically arranged on the base sheet 22. That is, the five slits 23-4 are arranged in an annual ring shape so that the small-diameter slit is included inside the large-diameter slit.
  • the base sheet 22 has a central circular section 22a-4a and five donut-shaped sections 22a-4b to 22a-4f concentrically located outside the central section 22a-4a.
  • the six sections 22a-4a to 22a-4f are fixed to the adhesive sheet 21.
  • FIG. 27 is a cross-sectional view for explaining the function of the adhesive plate 2.
  • FIG. 27 (a) shows a state in which an air nozzle is attached to the adhesive plate 2
  • FIG. 27 (b) shows an adhesive plate. 2 shows a state where air pressure is applied.
  • the adhesive plate 2 is attached to the air nozzle 230.
  • the adhesive plate 2 is disposed on the air chamber 231 side of the air nozzle 230, and the outermost section 22 a-4 f of the base sheet 22 is attached to the front end surface 232 of the air nozzle 230 in an airtight manner.
  • FIG. 27B when air K is supplied into the air chamber 231 of the air nozzle 230, the air pressure is increased in the thickness direction of the adhesive plate 2 (the direction perpendicular to the surface of the adhesive plate 2). ) To the base material sheet 22 of the adhesive plate 2.
  • the base sheet 22 is separated into a central circular section 22a-4a and five outer donut-shaped sections 22a-4b to 22a-4f by the five slits 23-4. Therefore, the portion 21d of the adhesive sheet 21 at the location of each slit 23-4 extends in the thickness direction, and each section portion 22a-4a (22a-4b to 22a-4f) extends in the thickness direction (lower side of FIG. 27). Direction). As a result, the entire pressure-sensitive adhesive plate 2 is bent into a bowl shape by the pressure of the air K.
  • FIG. 28 is a perspective view of the Si wafer W warped in a bowl shape
  • FIG. 29 is a cross-sectional view showing a state in which the adhesive plate 2 is in contact with the Si wafer W
  • FIG. 31 is a cross-sectional view showing a state where the plate 2 is pressed
  • FIG. 31 is a cross-sectional view showing a state where air pressure is applied to the adhesive plate 2.
  • some Si wafers have no warp and others have a bow shape.
  • FIG. 28 there is a Si wafer W that warps in multiple directions like a bowl.
  • the Si wafer W warped in a bowl shape is attached to the adhesive plate 2, first, as shown in FIG. 29, the air nozzle 230 with the atmospheric pressure inside the air chamber 231 is faced downward, and the adhesive plate 2 The adhesive sheet 21 is brought into contact with the Si wafer W. At this time, the central section 22a-4a is positioned immediately above the vertex Wp of the Si wafer W. In this state, as shown in FIG. 30, when the air nozzle 230 is pressed in the direction of the Si wafer W, the entire pressure-sensitive adhesive plate 2 is bent toward the air chamber 231 by the drag of the Si wafer W.
  • the Si wafer W is adhered to the adhesive sheet 21 of the adhesive plate 2 without warping.
  • the Si wafer W warped in a bowl shape can be attached to the adhesive plate 2 without warping.
  • FIG. 32 is a cross-sectional view showing a state where the air nozzle 230 is raised
  • FIG. 33 is a cross-sectional view showing a method of peeling the Si wafer W.
  • FIG. 32 in a state where the Si wafer W is attached to the adhesive plate 2, even if the air nozzle 230 is raised, the Si wafer W is held on the adhesive plate 2 without warping. In this way, in order to remove the held Si wafer W from the adhesive plate 2, air K is further supplied into the air chamber 231, and the air chamber 231 is set to a pressure exceeding the predetermined pressure. As a result, as shown in FIG.
  • the respective sections 22a-4a (22a-4b to 22a-4f) are displaced in the thickness direction (downward in FIG. 33), and the entire adhesive plate 2 is formed into a bowl shape. It will bend. As a result, the Si wafer W is peeled off from the adhesive sheet 21 of the adhesive plate 2 and detached from the adhesive plate 2.
  • FIG. 34 is a plan view showing a modification of the ninth embodiment, and FIG. 34 (a) shows an example of the adhesive plate 2 in which the five slits 23-4 of the base material sheet 22 are eccentric. (B) of 34 shows an example of the adhesive plate 2 in which the base material sheet 22 has radial slits in addition to the five slits 23-4.
  • the adhesive plate 2 adapted to the Si wafer W (see FIG. 28) where the vertex Wp is located at the center has been described. However, in some Si wafers, the vertex Wp is shifted from the center. .
  • the adhesive plate 2 shown in FIG. 34A has a structure suitable for attaching and removing the Si wafer W whose apex Wp is eccentric. Specifically, the five circular slits 23-4 are not concentric but are provided eccentrically, and the innermost section 22a-4a is set to be located at the eccentric vertex Wp of the Si wafer W. ing. Thus, when the innermost section 22a-4a is positioned immediately above the vertex Wp (see FIG.
  • the Si wafer W having the eccentric vertex Wp can be attached to or removed from the adhesive plate 2.
  • the displacement direction of the sections 22a-4a to 22a-4f is limited to the thickness direction of the adhesive plate 2 (the front and back direction of the paper surface in the figure).
  • the adhesive plate 2 shown in FIG. 34 (b) is an adhesive plate applicable in such a case.
  • FIG. 35 is a plan view showing an adhesive plate 2 which is a main part of the workpiece holding device according to the tenth embodiment of the present invention.
  • This embodiment differs from the ninth embodiment in that the slits of the adhesive plate 2 are formed in a polygonal shape.
  • the slit 23-5 having the same width and depth as the slit 23-4 of the ninth embodiment was set in a pentagonal shape.
  • Five slits 23-5 having different diameters were concentrically arranged on the base sheet 22. That is, the five slits 23-5 are arranged in an annual ring shape so that the small-diameter slit is included inside the large-diameter slit.
  • the base sheet 22 is separated into a central pentagonal section 22a-5a and five pentagonal ring-shaped sections 22a-5b to 22a-5f concentrically located on the outer side. The two sections 22a-5a to 22a-5f are fixed to the adhesive sheet 21.
  • FIG. 36 is a plan view showing a modification of the tenth embodiment.
  • FIG. 36 (a) shows an example of the adhesive plate 2 in which the five slits 23-5 of the base material sheet 22 are eccentric.
  • 36 (b) shows an example of the adhesive plate 2 in which the base sheet 22 has radial slits in addition to the five slits 23-5.
  • the five circular slits 23-5 are not concentric but provided eccentrically, and the innermost section 22a-5a is the eccentric apex of the Si wafer. Is set to be located.
  • this invention is not limited to the said Example, A various deformation
  • Si wafer W is applied as the workpiece
  • a glass substrate may be applied as the workpiece.
  • silicone rubber is applied as the pressure-sensitive adhesive sheet 21-1.
  • styrene butadiene rubber chlorosulfonated polyethylene rubber, acrylonitrile butadiene rubber, ethylene propylene rubber, chloroprene rubber, butadiene rubber, fluorine Any of rubber, isobutylene isoprene rubber, and urethane rubber can be applied as the pressure-sensitive adhesive sheet 21-1.
  • the thickness t1 of the adhesive sheets 21-1 to 21-5 of the adhesive plate 2 is set to 1.0 mm, 0.1 mm, 0.03 mm and 0.05 mm. If the thickness t1 of the pressure-sensitive adhesive sheets 21-1 to 21-5 of the plate 2 is within 0.025 mm to 1.5 mm, similar actions and effects can be obtained. Further, the thickness t2 of the base sheet 22-1 to 22-5 was set to 0.1 mm, 0.05 mm, 0.03 mm and 0.025 mm, but the thickness of the base sheet 22-1 to 22-3 If the length t2 is within 0.025 mm to 0.5 mm, the same action and effect can be obtained.
  • a sheet-like polyethylene terephthalate (PET) is used as the base material layer of the adhesive plate.
  • PET polyethylene terephthalate
  • a sheet-like polyimide is used as the base material layer.
  • the substrate layer is not limited, and any synthetic resin having flexibility and desired tensile strength can be applied as the substrate layer.
  • the magnetic body of the third embodiment may be applied as the base material layer.
  • the magnet chuck is 3-2 and the permanent magnet is used, but it is needless to say that an electromagnet may be used.
  • the shape of the adhesive plate 2 was set to be circular and matched to the shape of the Si wafer W.
  • a polygonal glass such as a quadrangle
  • the shape of the adhesive plate 2 can be set to a square or the like to match the shape of the workpiece. is there.
  • the base material layer is separated into rectangular, zigzag, corrugated, circular, donut, pentagonal piece-like base material layers by a plurality of slits.
  • the structure of the base material layer is not limited to these.
  • the base material layer of the adhesive portion only needs to be composed of a plurality of piece-like base material layers separated by a plurality of slits having a predetermined width.
  • the base material layer having a structure separated into the material layers is also included in the scope of the present invention.
  • hose 35 ... vacuum pump, 36, 37 ... suction electrode, 38 ... power supply, 100 ... grinding wheel, 110 ... nozzle, 120 ... pedestal, 200 ... hand, 21 ... finger, 220 ... roller, 230 ... air nozzle, 231 ... air chamber, 232 ... tip surface, 240 ... support member, 300 ... laser generator, K ... air, M ... central axis, L ... laser, S ... grinding fluid , T1, t2 ... thickness, W ... Si wafer, Wa ... front surface, Wb ... back surface, Wc ... groove, Wp ... apex.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

L'invention concerne un dispositif de maintien de pièce et un procédé de traitement de découpe au laser par lesquels il est possible de tenir/libérer divers types de pièces minces de façon fiable et en douceur, sans leur causer d'endommagement ni de déformation même dans divers environnements, et qui permettent de réduire les coûts de traitement et d'effectuer un traitement de haute précision. Le dispositif de maintien de pièce (1-1) est pourvu d'une plaque adhésive (2) et d'un mandrin à dépression (3-1). La plaque adhésive (2) est une plaque qui fait adhérer une tranche de silicium (Si) W à sa surface, et comprend une feuille adhésive (21-1) et une feuille de base (22-1). La feuille adhésive (21-1) est faite de caoutchouc de silicone possédant de la souplesse dans le sens de l'épaisseur, et présente une épaisseur (t1) de 1,0 mm. La feuille de base (22-1) est une feuille de PET destinée à empêcher la déformation de la feuille adhésive (21-1), et présente une épaisseur (t2) de 0,1 mm. Le mandrin à dépression (3-1) est un dispositif destiné à maintenir et fixer la plaque adhésive (2) à une surface (3a) d'une manière amovible, et comporte un corps de mandrin (30) et un mécanisme d'adsorption à vide (31).
PCT/JP2016/053292 2015-02-07 2016-02-03 Dispositif de maintien de pièce et procédé de traitement de découpe au laser WO2016125841A1 (fr)

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JP2019034330A (ja) * 2017-08-21 2019-03-07 株式会社ディスコ チップの製造方法
JP2019034331A (ja) * 2017-08-21 2019-03-07 株式会社ディスコ チップの製造方法
JP2019038703A (ja) * 2017-08-22 2019-03-14 株式会社ディスコ チップの製造方法
WO2019117186A1 (fr) * 2017-12-14 2019-06-20 日本電気硝子株式会社 Équipement de protection pour substrat, et procédé de production d'un substrat ayant un film
WO2019240029A1 (fr) * 2018-06-15 2019-12-19 株式会社アルバック Dispositif de traitement sous vide et dispositif de substrat factice
CN113492995A (zh) * 2021-09-10 2021-10-12 成都飞机工业（集团）有限责任公司 一种增加飞机部件精整加工工艺刚性的方法
CN114056933A (zh) * 2021-12-17 2022-02-18 广东海拓创新精密设备科技有限公司 一种高分子量改性硅化聚氨酯橡胶物理粘附吸盘及其制备方法
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JP6925711B2 (ja) * 2017-04-12 2021-08-25 株式会社ディスコ フレームユニット及び被加工物のレーザー加工方法
JP6994852B2 (ja) * 2017-06-30 2022-01-14 株式会社ディスコ レーザー加工装置及びレーザー加工方法
JP6957109B2 (ja) * 2017-12-12 2021-11-02 株式会社ディスコ デバイスチップの製造方法及びピックアップ装置
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法

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