WO2019117186A1 - Équipement de protection pour substrat, et procédé de production d'un substrat ayant un film - Google Patents

Équipement de protection pour substrat, et procédé de production d'un substrat ayant un film Download PDF

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Publication number
WO2019117186A1
WO2019117186A1 PCT/JP2018/045622 JP2018045622W WO2019117186A1 WO 2019117186 A1 WO2019117186 A1 WO 2019117186A1 JP 2018045622 W JP2018045622 W JP 2018045622W WO 2019117186 A1 WO2019117186 A1 WO 2019117186A1
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WO
WIPO (PCT)
Prior art keywords
substrate
film
adhesive layer
main surface
protector
Prior art date
Application number
PCT/JP2018/045622
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English (en)
Japanese (ja)
Inventor
悦二 福井
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2019559685A priority Critical patent/JP7222357B2/ja
Priority to CN201880078244.8A priority patent/CN111433388B/zh
Publication of WO2019117186A1 publication Critical patent/WO2019117186A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a protective device for a substrate and a method of manufacturing a film-coated substrate.
  • a functional film may be formed on only one of the main surfaces of the substrate.
  • the substrate protector by protecting the other main surface of the substrate with the substrate protector, it is possible to suppress the film formation of the functional film on the other main surface of the substrate.
  • wraparound of the film forming material to the main surface is prevented by using a jig having an attached surface that adheres to the peripheral portion of the main surface on the side other than the film formation target of the substrate.
  • An object of the present invention is to provide a protective device for a substrate capable of suitably forming a functional film only on one main surface of a substrate, and a method of manufacturing a film-coated substrate.
  • a substrate protector that solves the above problems is a substrate protector that protects the first main surface of a substrate having a first main surface and a second main surface opposite to the first main surface, A substrate sheet of a size capable of covering at least the peripheral edge of the substrate, an adhesive layer capable of adhering to the peripheral edge of the substrate, and a gap between the substrate sheet and the adhesive layer And a flexible spacer, and the base sheet has a through hole at a position surrounded by the adhesive layer and the spacer.
  • the substrate can be sucked through the through holes of the substrate sheet before the functional film is formed, and the peripheral portion of the substrate and the peripheral portion of the substrate sheet can be adhered by the adhesive layer. It can be suppressed that the film forming material wraps around at the time of film formation of the film and adheres to the peripheral portion of the first main surface of the substrate.
  • the substrate When the substrate is as thin as 0.05 to 1.5 mm, for example, even if the substrate is bent at the time of suction, the flexible spacer is also bent, so the adhesive layer may be peeled from the peripheral portion of the substrate. Absent.
  • the second main surface of the substrate does not have to be pressed with a jig or the like, so the cleanliness of the second main surface of the substrate can be easily maintained.
  • the method for producing a film-coated substrate that solves the above-mentioned problems is a method for producing a film-coated substrate using the above-mentioned protective device for a substrate, and the method for producing a film-coated substrate Preparing a film-forming substrate by suctioning the substrate and preparing a film-forming substrate in which the substrate protector adheres to the substrate; forming a functional film on the second main surface of the substrate in the film-forming substrate And a film forming process.
  • a functional film can be suitably formed only on one main surface of a substrate.
  • the substrate S protected using the substrate protector 11 has a first major surface S1 and a second major surface S2 opposite to the first major surface S1.
  • the substrate protector 11 protects the first main surface S1 of the substrate S.
  • the second main surface S2 of the substrate S in which the first main surface S1 is protected by the substrate protector 11 is the main surface on which a functional film is formed, and a functional film is formed on the second main surface S2.
  • a film-coated substrate is obtained.
  • a glass substrate is used as the substrate S, but for example, a resin substrate or a ceramic substrate can also be used.
  • the substrate protector 11 comprises a base material sheet 12 configured to be at least a size capable of covering the periphery of the substrate S, an adhesive layer 13 capable of adhering to the periphery of the substrate S, the base material sheet 12 and an adhesive And a flexible spacer 14 disposed between the layer 13.
  • Examples of the material of the base sheet 12 include polymeric materials such as resin materials or rubber materials, and metal materials.
  • resin materials include polyolefin resins, polyester resins, polyamide resins, and polyimide resins.
  • Examples of the rubber material include silicone rubber, urethane rubber, chloroprene rubber, styrene butadiene rubber, and ethylene propylene diene rubber.
  • As a metal material aluminum and stainless steel are mentioned, for example.
  • a heat-resistant substrate sheet that can withstand heat during film formation may be used.
  • the thickness of the base sheet 12 is, for example, in the range of 10 ⁇ m to 500 ⁇ m.
  • the adhesive layer 13 is formed in a continuous ring along the peripheral portion of the first major surface S1 of the substrate S.
  • the adhesive layer 13 can be composed of a known adhesive material. Examples of the adhesive layer 13 include silicone-based adhesive layers, acrylic adhesive layers, and urethane-based adhesive layers. For example, in the case where film formation of a functional film involves heating, a heat-resistant adhesive layer that can withstand heat during film formation may be used.
  • the adhesive layer 13 can be composed of an adhesive layer constituting one surface of the double-sided adhesive tape, or an adhesive layer formed by applying the spacer 14. In the present embodiment, the adhesive layer 13 is provided on the spacer 14 by bonding the double-sided adhesive tape to the spacer 14. That is, the adhesive layer 13 adheres to the spacer 14.
  • the support of the double-sided pressure-sensitive adhesive tape and the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer which adheres the support to the spacer 14) constituting the other surface of the double-sided pressure-sensitive adhesive tape are omitted.
  • the support of the double-sided pressure-sensitive adhesive tape is made of, for example, a resin film such as a polyimide film or a PET film.
  • the adhesion of the adhesive layer 13 to the substrate S is, for example, as weak as 3.0 (N / 25 mm width) or less so that the adhesive layer 13 can be easily peeled off from the substrate S after the functional film is formed. It is preferred to be sticky.
  • the lower limit of the adhesive strength of the adhesive layer 13 to the substrate S is preferably 0.05 (N / 25 mm width) or more in order to easily ensure the adhesion to the substrate S.
  • the adhesive force of the adhesive layer 13 is measured in accordance with the 180 ° peel test defined in JIS Z0237 (2009). JIS Z0237 (2009) corresponds to the international standards ISO 29862: 2007, ISO 29863: 2007 and ISO 29864: 2007.
  • the base sheet 12 has through holes 12 a at positions surrounded by the adhesive layer 13 and the spacers 14. If it explains in full detail, the upper surface surrounded by adhesion layer 13 and spacer 14 in substrate sheet 12 is an exposure side, and has opposed to the 1st principal surface S1 of substrate S.
  • the through hole 12 a of the base sheet 12 is used as an air discharge hole for discharging the air between the substrate S and the base sheet 12 when the substrate protector 11 is attached to the substrate S.
  • the number of through holes 12a may be singular as in the present embodiment or may be changed to a plurality.
  • the shape of the through hole 12a may be rectangular as in the present embodiment, or may be changed to, for example, a circular shape.
  • the area of the through holes 12 a is preferably, for example, in the range of 5% to 50% when the area of the base sheet 12 is 100%. As the area of the through hole 12a is larger, the function as the air discharge hole is more easily exhibited. As the area of the through hole 12a is smaller, the first main surface S1 of the substrate S can be covered wider by the base sheet 12, and thus the cleanliness of the first main surface S1 can be easily maintained.
  • the through hole 12 a is preferably formed at a position closer to the center of the base sheet 12 than the adhesive layer 13 and the spacer 14 in plan view of the base sheet 12. In this case, the air between the substrate S and the base sheet 12 can be discharged in a well-balanced manner.
  • the spacer 14 is formed in a continuous ring along the peripheral edge of the first major surface S1 of the substrate S.
  • a flexible material which comprises the spacer 14 a woven fabric or a nonwoven fabric, a polymeric material, and a rubber material are mentioned, for example.
  • the woven or non-woven fabric include glass cloth.
  • the rubber material include silicone rubber, urethane rubber, chloroprene rubber, styrene butadiene rubber, and ethylene propylene diene rubber.
  • the spacer 14 may have a single layer structure or a multilayer structure made of the same or different materials. For example, in the case where deposition of a functional film involves heating, a spacer that can withstand heat during deposition may be used.
  • the spacer 14 can be fixed to the base sheet 12 with a known adhesive or pressure sensitive adhesive.
  • the spacer 14 may be fixed to the base sheet 12 using, for example, a single-sided adhesive tape (glass cloth tape or the like) having the spacer 14 as a support.
  • the thickness of the spacer 14 is, for example, in the range of 150 ⁇ m to 5 mm. It is preferable that the spacer 14 be thicker than the adhesive layer 13 in a state before the substrate protector 11 is attached to the substrate S, that is, in a state where the substrate protector 11 does not receive a load.
  • the method for manufacturing a film-coated substrate includes the steps of preparing a film-forming substrate SA having the substrate S and the substrate protective device 11 by attaching the substrate protective device 11 to the substrate S; And a film forming step of forming a functional film on the second main surface S2 of the substrate S in the film formation substrate SA.
  • the preparation step the substrate S is sucked through the through holes 12 a of the substrate sheet 12 of the substrate protective member 11 to prepare a film forming substrate in which the substrate protective member 11 and the substrate S adhere.
  • a suction device 15 is used to suction the substrate S.
  • the suction device 15 is opened in the decompression chamber 16, the exhaust unit 17 for exhausting the air in the decompression chamber 16, the placement surface 18 on which the substrate protective member 11 is placed, and the deposition surface 18.
  • a well-known vacuum pump (not shown) is connected to the exhaust unit 17.
  • the substrate protection device 11 is placed on the mounting surface 18 of the suction device 15 so that the adhesive layer 13 of the substrate protection device 11 faces upward.
  • the substrate S is placed on the adhesive layer 13 of the substrate protector 11.
  • the air in the decompression chamber 16 of the suction device 15 is exhausted from the exhaust unit 17.
  • the suction unit 19 of the suction device 15 sucks the air between the substrate sheet 12 of the substrate protector 11 and the substrate S through the through holes 12 a of the substrate sheet 12 of the substrate protector 11.
  • the substrate protection device 11 can be attached to the substrate S by pressing the substrate S against the adhesive layer 13 of the substrate protection device 11.
  • the flat substrate S is curved so as to be convex toward the suction device 15. May.
  • a glass substrate having a thickness of 0.05 to 1.5 mm is used as the flat substrate S, such bending tends to occur easily.
  • the flexible spacer 14 is also bent, so the adhesive layer 13 is not peeled off from the peripheral portion of the substrate S.
  • the functional film is formed on the second main surface S2 of the substrate S attached to the substrate protector 11 to produce a film-coated substrate.
  • a known film forming method such as a PVD (Physical Vapor Deposition) method such as a sputtering method, a CVD (Chemical Vapor Deposition) method, a coating method such as a spray or spin coating is used. be able to.
  • a coating method such as a spray or spin coating.
  • the film forming material for forming the functional film F may be an inorganic material or an organic material.
  • the film forming process may be performed in any posture in which the second main surface S2 of the film formation substrate SA is horizontal, vertical, or inclined neither horizontal nor vertical.
  • the shape of the substrate sheet 12 of the substrate protector 11 is the substrate sheet 12 It may be changed so as to protrude outward from the substrate S, and the film formation substrate SA may be suspended using the protruding portion.
  • the film-coated substrate SF obtained in the film forming step has a functional film F provided on the second main surface S2 of the substrate S, and the adhesive layer of the substrate protective member 11 Removed from 13.
  • the substrate protector 11 after the film forming process can also be used repeatedly for the production of another film-coated substrate SF.
  • the plurality of protection devices 11 for a substrate are stored together in a compact size by overlapping in the thickness direction. be able to.
  • the substrate protector 11 comprises a substrate sheet 12 of a size capable of covering at least the periphery of the substrate S, an adhesive layer 13 capable of adhering to the periphery of the substrate S, and a substrate sheet And a flexible spacer 14 disposed between the adhesive layer 13 and the adhesive layer 13.
  • the base sheet 12 has a through hole 12 a at a position surrounded by the adhesive layer 13 and the spacer 14.
  • the substrate S is sucked through the through holes 12 a of the base sheet 12 before the functional film F is formed, and the adhesive layer 13 adheres the peripheral part of the substrate S and the peripheral part of the base sheet 12 It is possible to suppress adhesion of the film forming material to the peripheral portion of the first main surface S1 of the substrate S during film formation of the functional film F.
  • the flexible spacer 14 is also flexed even if the substrate S is flexed at the time of suction. 13 will not peel off.
  • the substrate protective tool 11 since the second main surface S2 of the substrate S does not have to be pressed by a jig or the like, the cleanliness of the second main surface S2 of the substrate S is maintained. easy.
  • the functional film F can be suitably formed only on the second main surface S2 of the substrate S.
  • the adhesive layer 13 of the substrate protector 11 is annularly formed. In this case, it can be further suppressed that the film forming material wraps around at the time of forming the functional film F and adheres to the peripheral portion of the first main surface S1 of the substrate S. Therefore, the functional film F can be more suitably formed only on the second main surface S2 of the substrate S.
  • the adhesive layer 13 of the substrate protector 11 is formed so as to be adhesive not only on the entire surface of the substrate S but only on the peripheral portion of the substrate S, the substrate protector 11 adheres excessively to the substrate S Therefore, after the formation of the functional film F, the substrate protector 11 can be easily peeled off from the substrate S. Further, since the adhesive layer 13 is formed so as to be adhesive only on the peripheral portion of the substrate S, not on the entire surface of the substrate S, the adhesive is in a range that affects the performance of the substrate S on the first main surface S1 of the substrate S It can be avoided to be transferred.
  • the substrate S is sucked through the through holes 12 a of the substrate sheet 12 of the substrate protective member 11, and the substrate protective member 11 adheres to the substrate S And a film forming process of forming the functional film F on the second major surface S2 of the substrate S in the film forming substrate SA.
  • the spacer 14 of the substrate protector 11 of the above embodiment is fixed to the substrate sheet 12 of the substrate protector 11, but is disposed so as to overlap the substrate sheet 12 without being fixed to the substrate sheet 12.
  • it may be fixed to the mounting surface 18 of the suction device 15.
  • the adhesive layer 13 of the substrate protector 11 may be formed in a shape other than an annular shape.
  • the adhesive layer 13 of the substrate protector 11 can be changed to, for example, a plurality of adhesive layers corresponding to two opposing sides of the substrate S.
  • the shape of the substrate S is not limited to a flat plate, and may be a curved plate.
  • the outer shape of the substrate protector 11 can be appropriately changed according to the outer shape of the substrate S.
  • the suction device 15 may be changed so that the plurality of substrate protectors 11 and the plurality of substrates S can be placed. That is, the number of suction units 19 of the suction device 15 can be changed in accordance with the number of the substrate protectors 11 (substrates S) mounted on the mounting surface 18 of the suction device 15.
  • the same suction device 15 can be used for a substrate smaller than the substrate S shown in FIG. That is, even if the size of the substrate S is changed, the same suction device 15 can be used.
  • the plurality of protection devices 11 for a substrate and the plurality of substrates S can be adhered. That is, since a plurality of film formation substrates SA can be obtained by one suction operation of the suction device 15, the working efficiency of the preparation process of preparing the film formation substrates SA can be enhanced.
  • the plurality of substrate protectors 11 may be configured as a connected body 20 to which the plurality of substrate protectors 11 are coupled.
  • the plurality of substrate protectors 11 are connected using the base sheet 12, but they may be connected using the spacer 14, or by separately providing a connecting material such as a tape material. It may be linked.
  • the plurality of film formation substrates SA can be handled integrally by using the connected body 20, for example, an operation of carrying in the plurality of film formation substrates SA to the film formation apparatus used in the film formation process or It is possible to enhance the efficiency of the unloading operation. Further, by using the connector 20, it becomes easy to suspend and arrange the plurality of film formation substrates SA.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Un équipement de protection (11) pour un substrat est pourvu : d'une feuille de matériau de base (12) configurée dans une taille qui permet le recouvrement d'au moins une partie de bord périphérique d'un substrat (S), d'une couche adhésive (13) apte à adhérer à la partie de bord périphérique du substrat (S), et d'un élément d'espacement souple (14) disposé entre la feuille de matériau de base (12) et la couche adhésive (13). La feuille de matériau de base (12) présente un trou traversant (12a) à une position entourée par la couche adhésive (13) et l'élément d'espacement (14). Un procédé de production d'un substrat ayant un film comprend : une étape de préparation pour aspirer un substrat (S) à travers un trou traversant (12a) dans une feuille de matériau de base (12) d'un équipement de protection (11) pour un substrat, et préparer un substrat de formation de film dans lequel le substrat (S) et l'équipement de protection (11) pour un substrat sont liés ensemble ; et une étape de formation de film pour former un film fonctionnel sur une seconde surface principale (S2) du substrat (S) dans le substrat de formation de film.
PCT/JP2018/045622 2017-12-14 2018-12-12 Équipement de protection pour substrat, et procédé de production d'un substrat ayant un film WO2019117186A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019559685A JP7222357B2 (ja) 2017-12-14 2018-12-12 膜付き基板の製造方法
CN201880078244.8A CN111433388B (zh) 2017-12-14 2018-12-12 基板用保护具以及附膜基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017239987 2017-12-14
JP2017-239987 2017-12-14

Publications (1)

Publication Number Publication Date
WO2019117186A1 true WO2019117186A1 (fr) 2019-06-20

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PCT/JP2018/045622 WO2019117186A1 (fr) 2017-12-14 2018-12-12 Équipement de protection pour substrat, et procédé de production d'un substrat ayant un film

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JP (1) JP7222357B2 (fr)
CN (1) CN111433388B (fr)
TW (1) TWI774894B (fr)
WO (1) WO2019117186A1 (fr)

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
CN112930106B (zh) * 2021-01-22 2022-11-22 杭州唯灵医疗科技有限公司 一种柔性电子设备及柔性电子设备的组装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246365A (ja) * 1996-03-11 1997-09-19 Dainippon Printing Co Ltd 基板用保持治具
JP2010123598A (ja) * 2008-11-17 2010-06-03 Lintec Corp 板状部材の支持装置及び支持方法並びに支持具
WO2016125841A1 (fr) * 2015-02-07 2016-08-11 株式会社クリエイティブテクノロジー Dispositif de maintien de pièce et procédé de traitement de découpe au laser
JP2016197623A (ja) * 2015-04-02 2016-11-24 日本電気硝子株式会社 吸着保持用治具とこの治具を備えた吸着保持装置、吸着保持方法、基板の処理方法、及び基板の成膜方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423739B (zh) * 2011-09-23 2014-01-11 Au Optronics Corp 可撓式基板結構之製造方法
KR20150099714A (ko) * 2012-12-21 2015-09-01 아사히 가라스 가부시키가이샤 기판 홀더 및 이것을 사용한 전체면 성막 기판의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246365A (ja) * 1996-03-11 1997-09-19 Dainippon Printing Co Ltd 基板用保持治具
JP2010123598A (ja) * 2008-11-17 2010-06-03 Lintec Corp 板状部材の支持装置及び支持方法並びに支持具
WO2016125841A1 (fr) * 2015-02-07 2016-08-11 株式会社クリエイティブテクノロジー Dispositif de maintien de pièce et procédé de traitement de découpe au laser
JP2016197623A (ja) * 2015-04-02 2016-11-24 日本電気硝子株式会社 吸着保持用治具とこの治具を備えた吸着保持装置、吸着保持方法、基板の処理方法、及び基板の成膜方法

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CN111433388B (zh) 2023-05-12
TWI774894B (zh) 2022-08-21
JP7222357B2 (ja) 2023-02-15
JPWO2019117186A1 (ja) 2020-12-17
TW201930624A (zh) 2019-08-01
CN111433388A (zh) 2020-07-17

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