WO2022009451A1 - Procédé de libération de film polymère, procédé de fabrication de dispositif électronique et support de libération - Google Patents

Procédé de libération de film polymère, procédé de fabrication de dispositif électronique et support de libération Download PDF

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Publication number
WO2022009451A1
WO2022009451A1 PCT/JP2021/000071 JP2021000071W WO2022009451A1 WO 2022009451 A1 WO2022009451 A1 WO 2022009451A1 JP 2021000071 W JP2021000071 W JP 2021000071W WO 2022009451 A1 WO2022009451 A1 WO 2022009451A1
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Prior art keywords
polymer film
peeling
inorganic substrate
substrate
functional element
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PCT/JP2021/000071
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English (en)
Japanese (ja)
Inventor
哲雄 奥山
吉拡 鶴野
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東洋紡株式会社
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Priority to KR1020227038710A priority Critical patent/KR20220163475A/ko
Priority to CN202180040217.3A priority patent/CN115697871A/zh
Priority to JP2022534894A priority patent/JP7400976B2/ja
Publication of WO2022009451A1 publication Critical patent/WO2022009451A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers

Definitions

  • FIG. It is a top view of the laminated body shown in FIG. It is a schematic cross-sectional view of the peeling apparatus which concerns on 10th Embodiment. It is a schematic cross-sectional view of the modification of the peeling apparatus which concerns on 10th Embodiment. It is a schematic cross-sectional view of another modification of the peeling apparatus which concerns on 10th Embodiment. It is a schematic cross-sectional view of another modification of the peeling apparatus which concerns on 10th Embodiment. It is a schematic cross-sectional view of another modification of the peeling apparatus which concerns on 10th Embodiment. It is a schematic cross-sectional view of the peeling apparatus which concerns on 11th Embodiment.
  • a two-layer structure consisting of a known easily peelable polymer layer (easy peeling layer) and a main polymer layer (polymer film), or a main It may have a two-layer structure consisting of a layer (polymer film) and an inorganic thin film layer.
  • an existing configuration for controlling the peeling force may be applied.
  • the adhesive force between the easily peeling polymer layer (easily peeling layer) and the inorganic substrate Is stronger than the adhesive strength between the easily peelable polymer layer (easy peeling layer) and the main polymer layer (polymer film), and is easily peeled off from the main polymer layer (polymer film).
  • the adhesive strength between the easy peeling polymer layer (easy peeling layer) and the main polymer layer (polymer film) is a polymer that is easy to peel off.
  • a laminate of the polymer film and the inorganic substrate can be obtained.
  • a laminate can be obtained by directly melt-extruding the polymer onto an inorganic substrate.
  • the inorganic substrate and the polymer film can be layered and heated to the melting point or softening temperature of the polymer under pressure to press them together to form a laminate. can.
  • the polymer film 14 is not particularly limited, but is a polyimide resin such as polyimide, polyamideimide, polyetherimide, or fluorinated polyimide (for example, aromatic polyimide resin, alicyclic polyimide resin); polyethylene, polypropylene, polyethylene terephthalate, and the like.
  • a polyimide resin such as polyimide, polyamideimide, polyetherimide, or fluorinated polyimide (for example, aromatic polyimide resin, alicyclic polyimide resin); polyethylene, polypropylene, polyethylene terephthalate, and the like.
  • the silane coupling agent includes n-propyltrimethoxysilane, butyltrichlorosilane, 2-cyanoethyltriethoxysilane, cyclohexyltrichlorosilane, decyltrichlorosilane, diacetoxydimethylsilane, diethoxydimethylsilane, and dimethoxy.
  • the coupling agent includes 1-mercapto-2-propanol, 3-mercaptopropionate methyl, 3-mercapto-2-butanol, 3-mercaptopropionate butyl, 3- (dimethoxymethylsilyl)-.
  • silane coupling agent layer As a method for applying the silane coupling agent (method for forming the silane coupling agent layer), a method of applying a silane coupling agent solution to the inorganic substrate 12, a vapor deposition method, or the like can be used.
  • the silane coupling agent layer may be formed on the surface of the polymer film 14.
  • the thickness of the silane coupling agent layer is extremely thin compared to the inorganic substrate 12, the polymer film 14, etc., and is negligible from the viewpoint of mechanical design. In principle, it is the minimum. , A thickness on the order of a single molecular layer is sufficient.
  • the adhesive strength of the laminated body can be developed by a step of bringing the inorganic substrate 12 into close contact with the polymer film 14 and a step of heating.
  • the method of bringing them into close contact is not particularly limited, but there are laminating, pressing and the like. Adhesion and heating may be performed at the same time or sequentially.
  • the heating method is not particularly limited, but may be placed in an oven, a heat laminate, a heat press, or the like.
  • a two-layer structure consisting of a known easily peelable varnish layer (easy peeling layer) and a main varnish layer (polymer film), or a main layer ( It may have a two-layer structure consisting of a polymer film) and an inorganic thin film layer.
  • a method of cutting the polymer film 14 by relatively scanning the water jet and the laminate 10 a method of cutting the polymer film 14 while cutting a little to the glass layer by a dicing device of a semiconductor chip, and the like.
  • the method is not particularly limited.
  • a film or sheet having no adhesiveness or adhesiveness may be sandwiched between the peeled portions 18 in order to maintain the peeled state so that the peeled portions 18 do not reattach.
  • a film or sheet having adhesiveness or adhesiveness on one side may be sandwiched between the peeling portions 18.
  • a metal part for example, a needle
  • FIG. 2 is a schematic cross-sectional view of the peeling device according to the first embodiment.
  • the peeling device 20 according to the first embodiment includes a vacuum chamber 30, a roller 32, a vacuum chuck 34, and a substrate contactor 35.
  • the roller 32 is arranged so as to be movable in the vacuum chamber 30.
  • the vacuum chuck 34 can adsorb and hold the laminated body 10, and can be positioned above the vacuum chamber 30 in a state where the laminated body 10 is adsorbed.
  • the substrate contactor 35 is arranged on the upper surface of the vacuum chamber 30 so as to cover the upper surface opening of the vacuum chamber 30.
  • the gap between the vacuum chamber 30 and the substrate contactor 35 should be small. Although not shown, it is sufficient if there is a part that closes the gap.
  • the substrate contactor 35 is preferably an adsorption plate having a porous body (adsorption plate with a porous body).
  • the peeling device 20 sucks the polymer film 14 side of the laminated body 10 with the vacuum chuck 34 and positions it above the vacuum chamber 30. At this time, the laminated body 10 is positioned so as to be located at the opening of the peeled portion 18. At this time, the inorganic substrate 12 of the laminated body 10 is brought into contact with the substrate contactor 35.
  • the peeling device 20 arranges the roller 32 on the non-adhesive surface 12a side of the inorganic substrate 12, and presses the inorganic substrate 12 in the peeling portion 18 direction (upward in FIG. 2) by the roller 32 and the substrate contactor 35. (Step D-1).
  • FIG. 3 is a schematic cross-sectional view of the peeling device according to the first embodiment, and is a diagram showing a state in which the rollers are moved. As shown in FIG. 3, when the roller 32 and the substrate contactor 35 are moved laterally (leftward in FIG. 3) from the lower part of the peeling portion 18, the portions where the pressure by the roller 32 and the substrate contactor 35 is released are released in order. , The peeling of the peeled portion 18 progresses.
  • the surfaces of the roller 32 and the substrate contact 35 are moved in parallel with the non-adhesive surface 12a of the inorganic substrate 12, and the peeling proceeds according to the movement of the roller 32 and the substrate contact 35 (step D-3). ..
  • the inorganic substrate 12 is warped in the direction away from the polymer film 14, and the entire polymer film 14 is warped. Is peeled off from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held by the vacuum chuck 34, bending and deformation do not occur.
  • the substantially plane is not only a perfect plane, but the flatness in JISB0621 (1984) is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less.
  • the surfaces of the roller 32 and the substrate contact 35 are moved in parallel with the non-adhesive surface 12a of the inorganic substrate 12, and the peeling proceeds in accordance with the movement of the roller 32, so that the peeling speed is increased. Can be controlled. As a result, it is possible to prevent an excessive load from being applied to the inorganic substrate 12 and the polymer film 14.
  • Either the roller 32 or the substrate contactor 35 may be used for pushing up the laminate 10, preferably both the roller 35 and the substrate contactor 35.
  • the peeling angle of the inorganic substrate 12 can be controlled. For example, if the radius of the roller 32 is reduced, the inorganic substrate 12 is peeled off at a radius of curvature according to it, and if the radius of the roller 32 is increased, the inorganic substrate 12 is peeled off at a radius of curvature according to it.
  • the peeling device 20 can be miniaturized, and by increasing the radius of the roller 32, the bending load applied to the inorganic substrate 12 can be reduced.
  • the vacuum chamber 30 and the vacuum chuck 34 correspond to the static pressure difference forming means of the present invention.
  • the radius of the roller is 40 mm or more and 1000 mm or less, more preferably 60 mm or more and 100 mm or less.
  • a material having a certain degree of elasticity is preferable, and for example, silicone rubber, fluororubber, urethane rubber, ethylene propylene rubber and the like can be used.
  • the elastic modulus of the roller material (JIS K 6255: 2013) is preferably 3 to 60%.
  • the rubber hardness of the roller material is preferably 50 to 90, preferably non-adhesive and antistatic or conductive.
  • the mesh-like sheet 38 may be arranged between the inorganic substrate 12 and the roller 32. Since the mesh-like sheet 38 is arranged between the inorganic substrate 12 and the roller 32, the peeled inorganic substrate 12 can be held.
  • the mesh-shaped sheet 38 may be breathable and may have a certain level of strength, and for example, a known screen mesh or the like can be used.
  • the material of the mesh-like sheet is preferably a material that is appropriately elastically deformed, and specifically, a mesh having a mesh count of # 80 or more and # 600 or less using a polyester filament, a nylon filament, a stainless wire, or the like. It is preferably a shaped sheet. Further, it is preferably antistatic or conductive.
  • the peeling device 20 may have a configuration in which the mesh-shaped sheet is not arranged. In this case, there may be another mechanism for taking out the peeled inorganic substrate 12 each time.
  • the peeling device 23 is a device in which a support part 33 is added to the peeling device 22 described above.
  • the support part 33 pushes the inorganic substrate 12 to widen the peeled portion 18 part between the inorganic substrate 12 and the polymer film 14.
  • FIG. 6 is a schematic cross-sectional view of the peeling device according to the second embodiment.
  • the peeling device 40 according to the second embodiment includes a vacuum chuck 34 and a diaphragm 42.
  • the vacuum chuck 34 can adsorb and hold the laminated body 10, and can be positioned above the diaphragm 42 in a state where the laminated body 10 is adsorbed.
  • the diaphragm 42 is an elastic thin film, and the laminated body 10 can be pressed against the surface.
  • a pressurizing device (not shown) is installed under the diaphragm 42, and the surface of the diaphragm 42 (elastic thin film) is pressed against the laminated body 10 by the pressurization by the pressurizing device.
  • the diaphragm 42 is an elastic thin film, even if the functional element 16 is provided on the polymer film 14, the laminate is substantially uniformly along the surface of the polymer film 14 and the functional element 16. 10 can be pressed.
  • the peeling device 40 sucks the polymer film 14 side of the laminated body 10 with the vacuum chuck 34 and positions it above the diaphragm 42.
  • the embedding member 64 may be a hard sheet coated with a plastically deformable resin composition, or may be a hard sheet coated with a plastically deformable resin composition. Further, it may have adhesiveness, and the embedding member itself may have a role as a protective layer for the functional element.
  • FIG. 10 is a schematic cross-sectional view of the peeling device according to the third embodiment.
  • the peeling device 50 according to the third embodiment includes a vacuum chamber 30, a vacuum chuck 34, an embedding member 64, a flexible support material 66, a porous flexible body 52, and a pressure inlet 54. ..
  • the flexible support material 66 is arranged in the vacuum chamber 30, and when the laminated body 11 with a functional element is arranged on the upper side, it is possible to hold the polymer film 14 or the inorganic substrate 12.
  • the flexible support material 66 is not particularly limited as long as it has flexibility, and examples thereof include a silicone rubber sheet.
  • the embedding member 64 is arranged in the vacuum chamber 30, and holds the polymer film 14 or the inorganic substrate 12 when the laminate 11 with a functional element is arranged on the surface opposite to the vacuum chuck 34. It is possible. Although it is in contact with the polymer film 14 in FIG. 10, it may be located outside the polymer film 14.
  • the embedding member 64 is not particularly limited as long as it is porous and has flexibility, but for example, a plastic sintered porous body, a metal porous sintered body, or a porous ceramic sintered body. Is processed into a shape that can embed a functional element.
  • the process C according to the third embodiment includes the process E-1 and the process E-2.
  • the peeling device 50 operates as follows to perform steps E-1 and E-2.
  • the peeling device 50 sucks the polymer film 14 side of the laminated body 11 with the functional element by the vacuum chuck 34 and positions it above the vacuum chamber 30.
  • the functional element 16 of the laminated body 11 is positioned so as to be located at the opening of the embedding member 64.
  • the peeling device 50 makes the inside of the vacuum chamber 30 less than the atmospheric pressure by the pump P.
  • the peeled portion 18 is at atmospheric pressure.
  • a static pressure difference is provided between the non-adhesive surface 14a of the polymer film 14 and the peeled portion 18. That is, while the non-contact surface 14a side is set to be less than the atmospheric pressure, the static pressure difference is provided by introducing air from the pressure introduction port 54 to make the pressure higher than the atmospheric pressure (step E-2).
  • the peeling spreads sequentially from the peeling portion 18, and the polymer film 14 with the functional element 16 is peeled from the inorganic substrate 12.
  • the inorganic substrate 12 is warped in the direction away from the polymer film 14, and the entire polymer film 14 is peeled off from the inorganic substrate 12 while maintaining a substantially flat surface.
  • the peeling device 20 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward in FIG. 11) by the support part 33 (step F-1). Specifically, it is preferable to bend the inorganic substrate 12.
  • the minimum radius of curvature of the curvature is preferably 350 mm or more. Since the load of the inorganic substrate 12 can be reduced, it is more preferably 400 mm or more, and further preferably 500 mm or more. Further, it is preferably 1000 mm or less, and more preferably 800 mm or less because the peeling speed increases.
  • the substantially plane is not only a perfect plane, but the flatness in JISB0621 (1984) is preferably 500 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 10 ⁇ m or less. Further, the deviation from the plane in the range of 1 mm 2 is preferably 10 ⁇ m or less, more preferably 3 ⁇ m or less, and further preferably 0.5 ⁇ m or less.
  • the mesh-like sheet 38 may be arranged under the inorganic substrate 12. Since the mesh-like sheet 38 is arranged under the inorganic substrate 12, the inorganic substrate 12 after peeling can be held.
  • the mesh-shaped sheet 38 may be breathable and may have a certain level of strength, and for example, a known screen mesh or the like can be used.
  • the peeling device 20 may have a configuration in which the mesh-shaped sheet is not arranged. In this case, there may be another mechanism for taking out the peeled inorganic substrate 12 each time.
  • FIGS. 13 and 14 are schematic cross-sectional views of a modified example of the peeling device according to the fifth embodiment.
  • the peeling devices 22 and 23 according to the fifth embodiment provide a vacuum chuck 37 for an inorganic substrate as a holding mechanism for the inorganic substrate 12 with respect to the peeling device 20 described above. Be prepared.
  • the vacuum chuck 37 for the inorganic substrate can be moved up and down and tilted.
  • the vacuum chuck 34 can suck and hold the laminated body 10, and can position the laminated body 10 upward in a sucked state.
  • FIG. 13 and 14 are schematic cross-sectional views of a modified example of the peeling device according to the fifth embodiment.
  • the peeling devices 22 and 23 according to the fifth embodiment provide a vacuum chuck 37 for an inorganic substrate as a holding mechanism for the inorganic substrate 12 with respect to the peeling device 20 described above. Be prepared.
  • the vacuum chuck 37 for the inorganic substrate can be moved up and down and tilted.
  • the peeling device 22 operates in the same manner as the peeling device 20 described above. However, since the peeling device 22 is provided with the vacuum chuck 37 for the inorganic substrate, the inorganic substrate 12 can be deformed in the direction in which the peeling portion expands while limiting the bending from the minimum radius of curvature. Since the mesh-shaped sheet 38 is provided, the inorganic substrate 12 after peeling can be supported. Therefore, it is possible to prevent the peeled portion of the inorganic substrate 12 from hanging down significantly.
  • the peeling device 22 separates the vacuum chuck 37 (contact surface with the inorganic substrate 12) of the inorganic substrate from the non-adhesive surface 12a of the inorganic substrate 12 at a position away from the peeling portion 18.
  • the inorganic substrate 12 has a radius of curvature according to this movement, the height, inclination, and the presence / absence of vacuum suction of the vacuum chuck 37 of the inorganic substrate are controlled.
  • the peeling of the peeling portion 18 proceeds in order from the portion where the pressure by the vacuum chuck 37 of the inorganic substrate is released. (Step G-3).
  • the entire polymer film 14 is peeled off from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held by the vacuum chuck 34, bending and deformation do not occur.
  • the vacuum chuck 37 of the inorganic substrate is sequentially moved from the peeling portion 18 side of the inorganic substrate 12, and the peeling proceeds according to the movement of the vacuum chuck 37 of the inorganic substrate, so that the peeling speed is controlled. can do. As a result, it is possible to prevent an excessive load from being applied to the inorganic substrate 12 and the polymer film 14.
  • the peeling device 23 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward in FIG. 14) by the vacuum chuck 37 of the inorganic substrate, and the inorganic substrate 12 is displaced in the direction of the peeling portion 18 (in FIG. 14). Press (upward) (step G-1).
  • the peeling device 24 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward in FIG. 15) by the substrate contact 35 and the support part 33, and displaces the inorganic substrate 12 in the peeling portion 18 direction (FIG. 15). In 15, it is pressed upward (upward) (step G-1).
  • the roller 32 and the substrate contact 12 are sequentially moved from the peeling portion 18 side of the inorganic substrate 12, and the peeling is advanced according to the movement of the roller 32 and the substrate contact 12, so that the peeling speed is increased. Can be controlled. As a result, it is possible to prevent an excessive load from being applied to the inorganic substrate 12 and the polymer film 14.
  • the peeled portion 18 By providing a wall so as to surround the nozzle portion, the peeled portion 18 can be sealed, and the pressure difference between the polymer film 14 of the inorganic substrate 12 and the non-contact surface side 12a that is not in close contact can be efficiently provided. can.
  • FIG. 31 is a schematic cross-sectional view of the peeling device according to the tenth embodiment.
  • the peeling device 120 according to the tenth embodiment includes a nozzle 122 (hereinafter, also referred to as an air blow nozzle 122) and a holding plate 124.
  • the following processing is performed as a preliminary step of the step B.
  • the non-woven fabric 164 (soft pressing plate 164) is present below the adhesive tape 162, the polymer film 114 is turned up to some extent, but the non-woven fabric 164 (soft pressing plate 164) causes the peeled region 118 to be separated. It can be prevented from spreading more than that.
  • the laminate that can be used in the present invention is not limited to this example, and the end faces of the inorganic substrate and the polymer film may not be flush with each other at the end portion of the object for forming the peeling region.
  • the polymer film 174 is not formed on the inorganic substrate 112 at the end portion (right end portion in FIG. 41) which is the target for forming the peeling region.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un procédé de libération d'un film polymère comprenant l'étape A, consistant à préparer un corps stratifié comprenant un substrat inorganique en contact étroit avec un film polymère sur lequel est formé un tracé de circuit et/ou un élément fonctionnel, l'étape B, consistant à former, sur une extrémité du corps stratifié, une partie de libération entre le film polymère et le substrat inorganique, et l'étape C, consistant à déformer le substrat inorganique dans la direction de séparation à partir du film polymère, afin de libérer le film polymère du substrat inorganique tout en le maintenant approximativement plat.
PCT/JP2021/000071 2020-07-06 2021-01-05 Procédé de libération de film polymère, procédé de fabrication de dispositif électronique et support de libération WO2022009451A1 (fr)

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KR1020227038710A KR20220163475A (ko) 2020-07-06 2021-01-05 고분자 필름의 박리 방법, 전자 디바이스의 제조 방법 및 박리 장치
CN202180040217.3A CN115697871A (zh) 2020-07-06 2021-01-05 高分子膜的剥离方法、电子器件的制造方法以及剥离装置
JP2022534894A JP7400976B2 (ja) 2020-07-06 2021-01-05 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022230505A1 (fr) * 2021-04-28 2022-11-03 東洋紡株式会社 Procédé de libération de film polymère, procédé de fabrication de dispositif électronique et dispositif de libération

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117246621B (zh) * 2023-11-10 2024-01-23 四川英创力电子科技股份有限公司 一种高效剥离电路板镀金层表面保护胶带的装置及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031486A (ja) * 2002-06-24 2004-01-29 Daiichi:Kk フィルム状基板の保護スペーサ及びその製造方法
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
WO2015008658A1 (fr) * 2013-07-16 2015-01-22 東洋紡株式会社 Procédé permettant de produire un dispositif électronique flexible

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6256248A (ja) * 1985-09-04 1987-03-11 Somar Corp 薄膜剥離方法及びその実施装置
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
JP3910485B2 (ja) 2002-05-15 2007-04-25 シャープ株式会社 フィルム剥離装置およびフィルム剥離方法
JP5907711B2 (ja) 2011-12-06 2016-04-26 キヤノンマシナリー株式会社 剥離装置および剥離方法
JP2015145306A (ja) 2014-02-04 2015-08-13 旭硝子株式会社 積層体の剥離開始部作成方法及び剥離開始部作成装置並びに電子デバイスの製造方法
JP6311501B2 (ja) 2014-07-07 2018-04-18 凸版印刷株式会社 剥離きっかけ作製装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031486A (ja) * 2002-06-24 2004-01-29 Daiichi:Kk フィルム状基板の保護スペーサ及びその製造方法
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
WO2015008658A1 (fr) * 2013-07-16 2015-01-22 東洋紡株式会社 Procédé permettant de produire un dispositif électronique flexible

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022230505A1 (fr) * 2021-04-28 2022-11-03 東洋紡株式会社 Procédé de libération de film polymère, procédé de fabrication de dispositif électronique et dispositif de libération

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