TWI774894B - 基板用保護具以及附膜基板的製造方法 - Google Patents
基板用保護具以及附膜基板的製造方法 Download PDFInfo
- Publication number
- TWI774894B TWI774894B TW107144833A TW107144833A TWI774894B TW I774894 B TWI774894 B TW I774894B TW 107144833 A TW107144833 A TW 107144833A TW 107144833 A TW107144833 A TW 107144833A TW I774894 B TWI774894 B TW I774894B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- film
- protector
- adhesive layer
- main surface
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017239987 | 2017-12-14 | ||
JP2017-239987 | 2017-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201930624A TW201930624A (zh) | 2019-08-01 |
TWI774894B true TWI774894B (zh) | 2022-08-21 |
Family
ID=66819264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107144833A TWI774894B (zh) | 2017-12-14 | 2018-12-12 | 基板用保護具以及附膜基板的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7222357B2 (fr) |
CN (1) | CN111433388B (fr) |
TW (1) | TWI774894B (fr) |
WO (1) | WO2019117186A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112930106B (zh) * | 2021-01-22 | 2022-11-22 | 杭州唯灵医疗科技有限公司 | 一种柔性电子设备及柔性电子设备的组装方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010123598A (ja) * | 2008-11-17 | 2010-06-03 | Lintec Corp | 板状部材の支持装置及び支持方法並びに支持具 |
TW201430160A (zh) * | 2012-12-21 | 2014-08-01 | Asahi Glass Co Ltd | 基板支持件及使用其之整面成膜基板之製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09246365A (ja) * | 1996-03-11 | 1997-09-19 | Dainippon Printing Co Ltd | 基板用保持治具 |
TWI423739B (zh) * | 2011-09-23 | 2014-01-11 | Au Optronics Corp | 可撓式基板結構之製造方法 |
JP6631888B2 (ja) * | 2015-02-07 | 2020-01-15 | 株式会社クリエイティブテクノロジー | 被加工物保持装置及びレーザカット加工方法 |
JP6627243B2 (ja) * | 2015-04-02 | 2020-01-08 | 日本電気硝子株式会社 | 基板の処理方法、及び基板の成膜方法 |
-
2018
- 2018-12-12 WO PCT/JP2018/045622 patent/WO2019117186A1/fr active Application Filing
- 2018-12-12 TW TW107144833A patent/TWI774894B/zh active
- 2018-12-12 JP JP2019559685A patent/JP7222357B2/ja active Active
- 2018-12-12 CN CN201880078244.8A patent/CN111433388B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010123598A (ja) * | 2008-11-17 | 2010-06-03 | Lintec Corp | 板状部材の支持装置及び支持方法並びに支持具 |
TW201430160A (zh) * | 2012-12-21 | 2014-08-01 | Asahi Glass Co Ltd | 基板支持件及使用其之整面成膜基板之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201930624A (zh) | 2019-08-01 |
CN111433388A (zh) | 2020-07-17 |
WO2019117186A1 (fr) | 2019-06-20 |
JP7222357B2 (ja) | 2023-02-15 |
JPWO2019117186A1 (ja) | 2020-12-17 |
CN111433388B (zh) | 2023-05-12 |
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