TWI774894B - 基板用保護具以及附膜基板的製造方法 - Google Patents

基板用保護具以及附膜基板的製造方法 Download PDF

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Publication number
TWI774894B
TWI774894B TW107144833A TW107144833A TWI774894B TW I774894 B TWI774894 B TW I774894B TW 107144833 A TW107144833 A TW 107144833A TW 107144833 A TW107144833 A TW 107144833A TW I774894 B TWI774894 B TW I774894B
Authority
TW
Taiwan
Prior art keywords
substrate
film
protector
adhesive layer
main surface
Prior art date
Application number
TW107144833A
Other languages
English (en)
Chinese (zh)
Other versions
TW201930624A (zh
Inventor
福井悅二
Original Assignee
日商日本電氣硝子股份有限公司
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Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201930624A publication Critical patent/TW201930624A/zh
Application granted granted Critical
Publication of TWI774894B publication Critical patent/TWI774894B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW107144833A 2017-12-14 2018-12-12 基板用保護具以及附膜基板的製造方法 TWI774894B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017239987 2017-12-14
JP2017-239987 2017-12-14

Publications (2)

Publication Number Publication Date
TW201930624A TW201930624A (zh) 2019-08-01
TWI774894B true TWI774894B (zh) 2022-08-21

Family

ID=66819264

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107144833A TWI774894B (zh) 2017-12-14 2018-12-12 基板用保護具以及附膜基板的製造方法

Country Status (4)

Country Link
JP (1) JP7222357B2 (fr)
CN (1) CN111433388B (fr)
TW (1) TWI774894B (fr)
WO (1) WO2019117186A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112930106B (zh) * 2021-01-22 2022-11-22 杭州唯灵医疗科技有限公司 一种柔性电子设备及柔性电子设备的组装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123598A (ja) * 2008-11-17 2010-06-03 Lintec Corp 板状部材の支持装置及び支持方法並びに支持具
TW201430160A (zh) * 2012-12-21 2014-08-01 Asahi Glass Co Ltd 基板支持件及使用其之整面成膜基板之製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246365A (ja) * 1996-03-11 1997-09-19 Dainippon Printing Co Ltd 基板用保持治具
TWI423739B (zh) * 2011-09-23 2014-01-11 Au Optronics Corp 可撓式基板結構之製造方法
JP6631888B2 (ja) * 2015-02-07 2020-01-15 株式会社クリエイティブテクノロジー 被加工物保持装置及びレーザカット加工方法
JP6627243B2 (ja) * 2015-04-02 2020-01-08 日本電気硝子株式会社 基板の処理方法、及び基板の成膜方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123598A (ja) * 2008-11-17 2010-06-03 Lintec Corp 板状部材の支持装置及び支持方法並びに支持具
TW201430160A (zh) * 2012-12-21 2014-08-01 Asahi Glass Co Ltd 基板支持件及使用其之整面成膜基板之製造方法

Also Published As

Publication number Publication date
TW201930624A (zh) 2019-08-01
CN111433388A (zh) 2020-07-17
WO2019117186A1 (fr) 2019-06-20
JP7222357B2 (ja) 2023-02-15
JPWO2019117186A1 (ja) 2020-12-17
CN111433388B (zh) 2023-05-12

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