TWI774894B - Substrate protector and method for producing film-attached substrate - Google Patents

Abstract

The substrate protector (11) is provided with: a base material sheet (12) having a size that can cover at least the peripheral portion of the substrate (S); an adhesive layer (13) capable of being adhered to the peripheral portion of the substrate (S); and The flexible spacer (14) is arranged between the base material sheet (12) and the adhesive layer (13). The substrate sheet (12) has a through hole (12a) at a position surrounded by the adhesive layer (13) and the spacer (14). The method for producing a film-attached substrate includes a preparation step of sucking the substrate (S) through the through hole (12a) of the base sheet (12) of the substrate protector (11), and preparing the substrate protector (11) and the substrate ( S) the adhered film-forming substrate; and a film-forming step of forming a functional film on the second main surface ( S2 ) of the substrate (S) of the film-forming substrate.

Description

Substrate protector and method for producing film-attached substrate

The present invention relates to a substrate protection tool and a method for producing a film-attached substrate.

In the two main surfaces of substrates such as glass substrates, the functional film may be formed on only one main surface of the substrate. In this case, by protecting the other main surface of the substrate with the substrate protector, it is possible to suppress the formation of a functional film on the other main surface of the substrate. For example, in Patent Document 1, by using a jig having an attachment surface attached to the peripheral edge portion of the main surface on the non-film formation target side of the substrate, the film formation material is prevented from winding around the main surface.

Patent Document 1: Japanese Patent Laid-Open No. 2016-197623

As in the above-mentioned prior art, when a functional film is formed on only one main surface of a substrate, the adhesion of the film-forming material to the peripheral edge portion of the other main surface of the substrate due to the winding of the film-forming material is suppressed. , there is still room for improvement.

An object of the present invention is to provide a substrate protector and a method for producing a film-attached substrate that can appropriately form a functional film only on one main surface of a substrate.

A substrate protector for solving the above-mentioned problems, which protects the first main surface of a substrate having a first main surface and a second main surface located on the opposite side of the first main surface, comprising: a base material sheet, It is configured to at least cover the size of the peripheral portion of the substrate; the adhesive layer can be adhered to the peripheral portion of the substrate; and the flexible spacer is disposed between the substrate sheet and the adhesive layer, the substrate sheet A through hole is provided at the position surrounded by the adhesive layer and the spacer.

According to this configuration, before the film formation of the functional film, the substrate can be sucked through the through holes of the base sheet, and the peripheral portion of the substrate and the peripheral portion of the base sheet can be adhered by the adhesive layer to form the functional film. In this case, the film-forming material can be prevented from winding around and adhering to the peripheral portion of the first main surface of the substrate.

When the substrate is thin, for example, 0.05 to 1.5 mm, even if the substrate is deflected during suction, the flexible spacer is also deflected, so that the adhesive layer does not peel off from the peripheral edge of the substrate. Moreover, when attaching the board|substrate protector to a board|substrate, since it is not necessary to press the 2nd main surface of a board|substrate to a jig etc., it becomes easy to maintain the cleanliness of the 2nd main surface of a board|substrate.

A method for producing a film-attached substrate that solves the above-mentioned problems is to produce a film-attached substrate using the above-mentioned substrate protector, comprising a preparation step of sucking a substrate through a through hole of a base sheet of the substrate protector to prepare the substrate protector A film-forming substrate adhered to the substrate; and a film-forming step of forming a functional film on the second main surface of the substrate of the film-forming substrate.

According to the present invention, the functional film can be appropriately formed only on one main surface of the substrate.

Hereinafter, the embodiment of the manufacturing method of the protective tool for substrates and the film-attached board|substrate of this invention is demonstrated with reference to drawings. In addition, in the drawings, for convenience of explanation, a part (for example, thickness) of the structure is shown exaggeratedly. In addition, the dimensional ratio of each part may be different from the actual one.

As shown in FIG. 1, the board|substrate S protected by the board|substrate protector 11 has the 1st main surface S1 and the 2nd main surface S2 on the opposite side of the 1st main surface S1. The board|substrate protector 11 protects the 1st main surface S1 of the board|substrate S. The second main surface S2 of the substrate S whose first main surface S1 is protected by the substrate protector 11 is the main surface on which the functional film is formed, and the functional film is formed on the second main surface S2. Film-attached substrates are available. In the present embodiment, although a glass substrate is used as the substrate S, for example, a resin substrate or a ceramic substrate may be used.

The substrate protector 11 includes: a substrate sheet 12 having a size that can cover at least the peripheral edge portion of the substrate S; an adhesive layer 13 capable of being adhered to the peripheral edge portion of the substrate S; and a flexible spacer 14 disposed on the base between the material sheet 12 and the adhesive layer 13 .

Examples of the material of the base sheet 12 include polymer materials such as resin materials and rubber materials, and metal materials. As a resin material, a polyolefin resin, a polyester resin, a polyimide resin, and a polyimide resin are mentioned, for example. Examples of the rubber material include silicone rubber, urethane rubber, chloropine rubber, styrene-butadiene rubber, and ethylene-propylene-diene rubber. As a metal material, aluminum and stainless steel are mentioned, for example. For example, when the film formation of the functional film is accompanied by heating, it is sufficient to use a heat-resistant substrate sheet that can withstand the heat at the time of film formation. The thickness of the base material sheet 12 is in the range of, for example, 10 μm or more and 500 μm or less.

The adhesive layer 13 is formed in a continuous ring shape along the peripheral portion of the first main surface S1 of the substrate S. The adhesive layer 13 can be made of known adhesive materials. As the adhesive layer 13 , for example, a polysiloxane-based adhesive layer, an acrylic-based adhesive layer, and a urethane-based adhesive layer can be mentioned. For example, when the film formation of the functional film is accompanied by heating, a heat-resistant adhesive layer that can withstand the heat during film formation may be used. The adhesive layer 13 may be composed of an adhesive layer constituting one side of the double-sided adhesive tape or an adhesive layer formed by coating the spacer 14 . In this embodiment, the adhesive layer 13 is provided on the spacer 14 by attaching the double-sided adhesive tape to the spacer 14 . That is, the adhesive layer 13 is adhered to the spacer 14 .

In addition, in the drawings, the support of the double-sided adhesive tape and the adhesive layer constituting the other side of the double-sided adhesive tape (the adhesive layer for adhering the support to the spacer 14 ) are omitted. The support of the double-sided adhesive tape is formed of a resin film such as a polyimide film or a PET film, for example.

The adhesive force of the adhesive layer 13 to the substrate S is preferably weaker than 3.0 (N/25mm width), for example, so that the adhesive layer 13 can be easily peeled off from the substrate S after the functional film is formed. Furthermore, in order to easily secure the adhesiveness to the substrate S, the lower limit of the adhesive force of the adhesive layer 13 to the substrate S is preferably 0.05 (N/25 mm width) or more. The adhesive force of the adhesive layer 13 was measured based on the 180∘ peel test specified in JIS Z0237 (2009). Furthermore, JIS Z0237 (2009) corresponds to ISO 29862:2007, ISO 29863:2007 and ISO 29864:2007 of international standards.

As shown in FIGS. 1 , 2 and 4 , the substrate sheet 12 has through holes 12 a at positions surrounded by the adhesive layer 13 and the spacer 14 . If described in detail, the upper surface of the substrate sheet 12 surrounded by the adhesive layer 13 and the spacer 14 is an exposed surface, which is opposite to the first main surface S1 of the substrate S. The through hole 12 a of the base sheet 12 is used as an air discharge hole for discharging the air between the base sheet S and the base sheet 12 when the board protector 11 is attached to the base sheet S. The number of the through holes 12a may be single as in the present embodiment, or may be changed to plural. The shape of the through hole 12a may be a quadrangular shape as in the present embodiment, and may be changed to a circular shape, for example. When the area of the substrate sheet 12 is set to 100%, the area of the through hole 12a is preferably in the range of 5% or more and 50% or less, for example. The larger the area of the through hole 12a, the easier it is to function as an air discharge hole. The smaller the area of the through hole 12a, the wider the first main surface S1 of the substrate S can be covered by the base sheet 12, so that the cleanliness of the first main surface S1 can be easily maintained. The through hole 12 a is preferably formed at a position closer to the center of the substrate sheet 12 than the adhesive layer 13 and the spacer 14 when the substrate sheet 12 is viewed from above. In this case, the entire air between the substrate S and the base sheet 12 can be discharged in a well-balanced manner.

The spacer 14 is formed in a continuous ring shape along the peripheral edge portion of the first main surface S1 of the substrate S. As a flexible material which comprises the spacer 14, a woven fabric or a nonwoven fabric, a polymer material, and a rubber material are mentioned, for example. As a woven fabric or a nonwoven fabric, glass fiber cloth is mentioned, for example. Examples of the rubber material include silicone rubber, urethane rubber, chloropine rubber, styrene-butadiene rubber, and ethylene-propylene-diene rubber. The spacer 14 may be a single-layer structure or a multi-layer structure composed of the same or different materials. For example, when the film formation of the functional film is accompanied by heating, it is sufficient to use a spacer that can withstand the heat at the time of film formation. The spacer 14 can be fixed to the substrate sheet 12 by well-known adhesives or adhesives. For example, the spacer 14 can be fixed to the base material sheet 12 using a single-sided adhesive tape (glass fiber tape or the like) constituted by using the spacer 14 as a support. The thickness of the spacer 14 is, for example, in the range of 150 μm to 5 mm. The spacer 14 is preferably formed thicker than the adhesive layer 13 in a state before the substrate protector 11 is mounted on the substrate S, that is, in a state where the substrate protector 11 is not loaded.

Next, the manufacturing method of the film-attached board|substrate is demonstrated.

As shown in FIG. 2 , the method for producing a film-attached substrate includes: a preparation step of preparing a film-forming substrate SA including the substrate S and the substrate-protecting tool 11 by attaching the substrate protector 11 to the substrate S; In the step, a functional film is formed on the second main surface S2 of the substrate S of the film-forming substrate SA. In the preparation step, the substrate S is sucked through the through holes 12 a of the base sheet 12 of the substrate protector 11 , and the substrate for film formation in which the substrate protector 11 and the substrate S are adhered is prepared.

As shown in FIGS. 3 and 5 , in the preparation steps of the present embodiment, the suction device 15 is used to suck the substrate S. The suction device 15 includes a decompression chamber 16 , an exhaust portion 17 for exhausting the air in the decompression chamber 16 , a placement surface 18 on which the substrate protector 11 is placed, and an opening on the placement surface 18 to suck the decompression chamber. The suction part 19 of the outside air of 16. A well-known vacuum pump, which is not shown in the drawings, is connected to the exhaust portion 17 .

For the film-forming substrate SA obtained in the preparation step, first, the substrate protector 11 is placed on the placement surface 18 of the suction device 15 so that the adhesive layer 13 of the substrate protector 11 faces upward, and then placed on the substrate. The substrate S is placed on the adhesive layer 13 of the protector 11 .

Next, as shown in FIG. 5 , the air in the decompression chamber 16 of the suction device 15 is exhausted from the exhaust part 17 . Thereby, the suction part 19 of the suction device 15 sucks the air between the base sheet 12 of the substrate protector 11 and the substrate S through the through holes 12a of the base sheet 12 of the substrate protector 11 . Thereby, the board|substrate protector 11 can be attached to the board|substrate S by pressing the board|substrate S to the adhesive layer 13 of the board|substrate protector 11.

Here, when the suction device 15 is used to suck the air between the base sheet 12 of the substrate protector 11 and the substrate S, the plate-shaped substrate S may be bent into a convex shape on the suction device 15 side. For example, when a glass substrate having a thickness of 0.05 to 1.5 mm is used as the flat substrate S, such a warp tends to be easily caused. However, even if the substrate S is deflected by suction by the suction device 15 , since the flexible spacer 14 is also deflected, the adhesive layer 13 does not peel off from the peripheral portion of the substrate S.

A film-attached board|substrate is produced by film-forming a functional film on the 2nd main surface S2 of the board|substrate S mounted in the board|substrate protector 11. In the film forming step of the manufacturing method of the film-coated substrate SF, PVD (Physical Vapor Deposition) method such as sputtering method, CVD (Chemical Vapor Deposition, chemical vapor deposition) method, spraying, spin coating, etc. can be used. A well-known film-forming method such as a coating method is used. As the functional film F (refer to FIG. 6 ), for example, a film (dielectric film, etc.) having predetermined optical properties, a film having predetermined mechanical properties, a film having predetermined chemical properties, and a film having predetermined color may be mentioned. film. The film-forming material for forming the functional film F may be an inorganic material or an organic material.

The film-forming step can be performed in any of a posture in which the second main surface S2 of the film-forming substrate SA is horizontal, a vertical posture, or an inclined posture that is neither horizontal nor vertical. For example, when the film-forming substrate SA is arranged so that the second main surface S2 of the film-forming substrate SA is vertical, the substrate protector 11 can be changed so that the base sheet 12 protrudes outward from the substrate S According to the shape of the base sheet 12, the substrate SA for film formation is suspended by the protruding portion.

As shown in FIG. 6 , the film-attached substrate SF obtained in the film forming step has the functional film F provided on the second main surface S2 of the substrate S, and is removed from the adhesive layer 13 of the substrate protector 11 .

The substrate protection tool 11 after the film forming step can be reused in the manufacture of other film-attached substrates SF. Moreover, even in the case where there are plural substrate protectors 11, since the thickness of the substrate protectors 11 is relatively thin, by overlapping the plural substrate protectors 11 in the thickness direction, it is possible to store them closely together.

Next, the action and effect of this embodiment will be described.

(1) The substrate protector 11 has: a base material sheet 12 having a size that can cover at least the peripheral portion of the substrate S; an adhesive layer 13 capable of being adhered to the peripheral portion of the substrate S; and a flexible spacer 14, It is arranged between the base material sheet 12 and the adhesive layer 13 . The base sheet 12 has a through hole 12 a at a position surrounded by the adhesive layer 13 and the spacer 14 .

According to this configuration, the substrate S can be sucked through the through holes 12 a of the suction substrate sheet 12 before the functional film F is formed, and the peripheral edge of the substrate S and the peripheral edge of the substrate sheet 12 can be adhered by the adhesive layer 13 . During the film formation of the flexible film F, the film formation material can be prevented from winding around and adhering to the peripheral portion of the first main surface S1 of the substrate S. As shown in FIG.

In addition, when the substrate S is thin, for example, 0.05 to 1.5 mm, even if the substrate S is deflected during suction, the flexible spacer 14 is also deflected, so that the adhesive layer 13 does not appear from the peripheral portion of the substrate S. peeling situation. Moreover, when the board|substrate protector 11 is attached to the board|substrate S, since it is not necessary to press the 2nd main surface S2 of the board|substrate S to a jig etc., it is easy to maintain the cleanliness of the 2nd main surface S2 of the board|substrate S.

Therefore, the functional film F can be appropriately formed only on the second main surface S2 of the substrate S.

(2) The adhesive layer 13 of the substrate protector 11 is formed in a ring shape. In this case, when the functional film F is formed into a film, the film-forming material can be further prevented from winding around and adhering to the peripheral portion of the first main surface S1 of the substrate S. Therefore, the functional film F can be more appropriately formed only on the second main surface S2 of the substrate S.

In addition, since the adhesive layer 13 of the substrate protector 11 is formed to be adhered only to the peripheral portion of the substrate S rather than the entire surface of the substrate S, the substrate protector 11 is not excessively adhered to the substrate S, and the functional film The substrate protector 11 can be easily peeled off from the substrate S after the film formation of F. In addition, since the adhesive layer 13 is formed to be adhered only to the peripheral portion of the substrate S rather than the entire surface of the substrate S, the transfer of the adhesive to the first main surface S1 of the substrate S can be prevented from affecting the function of the substrate S.

(3) The method for producing the film-attached substrate SF includes a preparation step of sucking the substrate S through the through holes 12 a of the base sheet 12 of the substrate protector 11 to prepare a film formation in which the substrate protector 11 and the substrate S are adhered Using the substrate SA; and the film-forming step, the functional film F is formed on the second main surface S2 of the substrate S of the film-forming substrate SA.

According to this method, the same effects as those described in the above-mentioned column (1) can be obtained.

(change example) This embodiment can be implemented with the following modifications.

Although the spacer 14 between the substrate protector 11 in the above-described embodiment is fixed to the base sheet 12 of the substrate protector 11, it may be arranged not to be fixed to the base sheet 12 but to overlap the base sheet 12, for example, it may be It is fixed to the mounting surface 18 of the suction device 15 .

The adhesive layer 13 of the substrate protector 11 may be formed in a shape other than a ring shape. The adhesive layer 13 of the substrate protector 11 can be changed to, for example, a plurality of adhesive layers corresponding to the opposite sides of the substrate S.

The shape of the substrate S is not limited to a flat plate shape, and may be a curved plate shape.

The external shape of the board protector 11 can be appropriately changed according to the external shape of the board S.

As shown in FIG. 7 , the suction device 15 can be changed so that a plurality of substrate protectors 11 and a plurality of substrates S can be placed thereon. That is, the number of the suction parts 19 of the suction device 15 can be changed according to the number of the substrate protectors 11 (substrate S) placed on the mounting surface 18 of the suction device 15 . In this case, for example, the same suction device 15 can be used for a substrate smaller in size than the substrate S shown in FIG. 7 . That is, even if the size of the substrate S is changed, the same suction device 15 can be used. Moreover, by one suction operation of the suction device 15, the plurality of substrate protection tools 11 and the plurality of substrates S can be adhered. That is, since a plurality of substrates SA for film formation can be obtained by one suction operation of the suction device 15, the work efficiency of the preparation step for preparing the substrate SA for film formation can be improved.

• As shown in FIG. 8 , a plurality of substrate protectors 11 can be configured as a connecting body 20 in which the plurality of substrate protectors 11 are connected. In this connection body 20, although the base material sheet 12 is used to connect the plurality of substrate protectors 11, the spacers 14 may be used to connect them, or a connection material such as an adhesive tape may be provided separately. By using the coupling body 20 as described above, the plurality of film-forming substrates SA can be handled as one body, and, for example, the operation of carrying in the plurality of film-forming substrates SA of the film forming apparatus used in the film forming step can be improved. , The efficiency of shipping out operations. Moreover, by using the coupling body 20, it is easy to suspend and arrange|position the several board|substrates SA for film formation.

11‧‧‧Protective tools for substrates 12‧‧‧Substrate sheet 12a‧‧‧Through hole 13‧‧‧Adhesive layer 14‧‧‧Spacers F‧‧‧functional film S‧‧‧Substrate S1‧‧‧First main face S2‧‧‧Second main surface SA‧‧‧Substrate for film formation SF‧‧‧Substrate with film

FIG. 1 is an exploded perspective view showing the protector for substrates according to the embodiment. FIG. 2 is a perspective view showing a substrate for film formation. FIG. 3 is a perspective view illustrating a preparation step of the substrate for film formation. 4 is an end view illustrating a preparation step of the substrate for film formation. 5 is an end view illustrating a preparation step of the substrate for film formation. FIG. 6 is a perspective view showing a substrate protector and a film-attached substrate. FIG. 7 is a perspective view illustrating a modified example of the preparation process of the substrate for film formation. FIG. 8 is a perspective view illustrating a modified example of the preparation process of the substrate for film formation.

11‧‧‧Protective tools for substrates

12‧‧‧Substrate sheet

12a‧‧‧Through hole

13‧‧‧Adhesive layer

14‧‧‧Spacers

S‧‧‧Substrate

S1‧‧‧First main face

S2‧‧‧Second main surface

Claims (3)

A substrate protector for protecting the first main surface of a substrate having a first main surface and a second main surface located on the opposite side of the first main surface, comprising: a base material sheet, It is configured to at least cover the size of the peripheral portion of the substrate; the adhesive layer can be adhered to the peripheral portion of the substrate; and the flexible spacer is disposed between the substrate sheet and the adhesive layer, the substrate sheet A through hole is provided at the position surrounded by the adhesive layer and the spacer, and the through hole can exhaust the air between the substrate and the base material sheet as a whole. According to the protector for a substrate of claim 1, the spacer is formed on the substrate thicker than the adhesive layer when the protector for a substrate is not loaded. A method for producing a film-attached substrate, wherein a film-attached substrate is produced by using the substrate protector according to claim 1 or 2 of the scope of application, characterized in that it comprises: a preparation step of passing through the substrate sheet of the substrate protector. The through hole sucks the substrate to prepare a film-forming substrate formed by adhering the substrate protector to the substrate; and the film-forming step is to form a functional film on the second main surface of the substrate of the film-forming substrate membrane.

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