JPWO2019117186A1 - Protective equipment for substrates and manufacturing method for substrates with film - Google Patents

Abstract

The substrate protective equipment (11) includes a substrate sheet (12) having a size capable of covering at least the peripheral edge of the substrate (S) and an adhesive layer (adhesive) that can adhere to the peripheral edge of the substrate (S). 13) and a flexible spacer (14) arranged between the base sheet (12) and the adhesive layer (13). The base sheet (12) has a through hole (12a) at a position surrounded by the adhesive layer (13) and the spacer (14). In the method of manufacturing a substrate with a film, the substrate (S) is sucked through the through hole (12a) of the substrate sheet (12) of the substrate protective tool (11), and the substrate protective tool (11) and the substrate (S) are combined. It is provided with a preparatory step of preparing a film-forming substrate to which is adhered, and a film-forming step of forming a functional film on the second main surface (S2) of the substrate (S) of the film-forming substrate.

Description

The present invention relates to a protective device for a substrate and a method for manufacturing a substrate with a film.

Of both main surfaces of a substrate such as a glass substrate, a functional film may be formed only on one main surface of the substrate. In this case, by protecting the other main surface of the substrate with a protective tool for the substrate, it is possible to suppress the formation of a functional film on the other main surface of the substrate. For example, in Patent Document 1, by using a jig having an adhering surface that adheres to the peripheral edge portion of the main surface of the substrate that is not the object of film formation, the film-forming material is prevented from wrapping around the main surface.

Japanese Unexamined Patent Publication No. 2016-197623

A technique for suppressing adhesion of a film-forming material to the peripheral edge of the other main surface of a substrate due to wraparound of the film-forming material when a functional film is formed on only one main surface of the substrate as in the above-mentioned conventional technique. There is still room for improvement.

An object of the present invention is to provide a protective device for a substrate capable of suitably forming a functional film on only one main surface of the substrate, and a method for manufacturing a substrate with a film.

The protective device for a substrate that solves the above problems is a protective device for a substrate that protects the first main surface of a substrate having a first main surface and a second main surface opposite to the first main surface. , A base sheet having a size capable of covering at least the peripheral edge of the substrate, an adhesive layer adhesive to the peripheral edge of the substrate, and arranged between the base sheet and the adhesive layer. The base material sheet is provided with a flexible spacer, and has a through hole at a position surrounded by the adhesive layer and the spacer.

According to this configuration, the substrate can be sucked through the through hole of the base material sheet before the formation of the functional film, and the peripheral portion of the substrate and the peripheral edge portion of the base material sheet can be adhered by the adhesive layer, which is functional. It is possible to prevent the film-forming material from wrapping around and adhering to the peripheral edge of the first main surface of the substrate when the film is formed.

Further, when the substrate is as thin as 0.05 to 1.5 mm, even if the substrate bends during suction, the flexible spacer also bends, so that the adhesive layer may peel off from the peripheral edge of the substrate. Absent. Further, when the protective device for the substrate is attached to the substrate, it is not necessary to press the second main surface of the substrate with a jig or the like, so that the cleanliness of the second main surface of the substrate can be easily maintained.

The method for manufacturing a substrate with a film that solves the above problems is a method for manufacturing a substrate with a film using the protective tool for the substrate, and is through a through hole in the base material sheet of the protective tool for the substrate. A preparatory step of sucking the substrate to prepare a film-forming substrate on which the substrate protective tool and the substrate are adhered, and forming a functional film on the second main surface of the substrate in the film-forming substrate. It includes a film forming process.

According to the present invention, a functional film can be suitably formed on only one main surface of a substrate.

It is an exploded perspective view which shows the protective equipment for a substrate in an embodiment. It is a perspective view which shows the substrate for film formation. It is a perspective view explaining the preparation process of the substrate for film formation. It is an end view explaining the preparation process of the film-forming substrate. It is an end view explaining the preparation process of the film-forming substrate. It is a perspective view which shows the protective equipment for a substrate and the substrate with a film. It is a perspective view explaining the change example of the preparation process of the film-forming substrate. It is a perspective view explaining the change example of the preparation process of the film-forming substrate.

Hereinafter, embodiments of the substrate protective tool of the present invention and the method for manufacturing a substrate with a film will be described with reference to the drawings. In the drawings, for convenience of explanation, a part (for example, thickness) of the configuration may be exaggerated. In addition, the dimensional ratio of each part may differ from the actual one.

As shown in FIG. 1, the substrate S protected by the substrate protective tool 11 has a first main surface S1 and a second main surface S2 on the opposite side of the first main surface S1. The substrate protective tool 11 protects the first main surface S1 of the substrate S. The second main surface S2 of the substrate S in which the first main surface S1 is protected by the protective tool 11 for the substrate is the main surface on which the functional film is formed, and the functional film is formed on the second main surface S2. By forming a film, a substrate with a film can be obtained. In the present embodiment, a glass substrate is used as the substrate S, but for example, a resin substrate or a ceramic substrate can also be used.

The substrate protective tool 11 has a substrate sheet 12 having a size capable of covering at least the peripheral edge of the substrate S, an adhesive layer 13 that can be adhered to the peripheral edge of the substrate S, and adhesive to the substrate sheet 12. It includes a flexible spacer 14 arranged between the layer 13 and the layer 13.

Examples of the material of the base sheet 12 include a polymer material such as a resin material or a rubber material, and a metal material. Examples of the resin material include polyolefin resin, polyester resin, polyamide resin, and polyimide resin. Examples of the rubber material include silicon rubber, urethane rubber, chloroprene rubber, styrene / butadiene rubber, and ethylene / propylene / diene rubber. Examples of the metal material include aluminum and stainless steel. For example, when the film formation of the functional film involves heating, a heat-resistant base sheet that can withstand the heat during the film formation may be used. The thickness of the base sheet 12 is, for example, in the range of 10 μm or more and 500 μm or less.

The adhesive layer 13 is formed in a continuous annular shape along the peripheral edge portion of the first main surface S1 of the substrate S. The adhesive layer 13 can be made of a well-known adhesive material. Examples of the adhesive layer 13 include a silicone-based adhesive layer, an acrylic-based adhesive layer, and a urethane-based adhesive layer. For example, when the film formation of the functional film is accompanied by heating, a heat-resistant adhesive layer capable of withstanding the heat during the film formation may be used. The adhesive layer 13 can be composed of an adhesive layer forming one surface of the double-sided adhesive tape or an adhesive layer formed by applying the adhesive layer 14 to the spacer 14. In the present embodiment, the adhesive layer 13 is provided on the spacer 14 by attaching the double-sided adhesive tape to the spacer 14. That is, the adhesive layer 13 is adhered to the spacer 14.

In the drawings, the support of the double-sided adhesive tape and the adhesive layer forming the other surface of the double-sided adhesive tape (the adhesive layer that adheres the support to the spacer 14) are omitted. The support of the double-sided adhesive tape is made of, for example, a resin film such as a polyimide film or a PET film.

The adhesive strength of the adhesive layer 13 to the substrate S is weak, for example, 3.0 (N / 25 mm width) or less so that the adhesive layer 13 can be easily peeled from the substrate S after the functional film is formed. It is preferably sticky. The lower limit of the adhesive force of the adhesive layer 13 to the substrate S is preferably 0.05 (N / 25 mm width) or more in order to facilitate the adhesion to the substrate S. The adhesive strength of the adhesive layer 13 is measured according to the 180 ° peeling test specified in JIS Z0237 (2009). JIS Z0237 (2009) corresponds to the international standards ISO 29862: 2007, ISO 29863: 2007, and ISO 29864: 2007.

As shown in FIGS. 1, 2 and 4, the base sheet 12 has a through hole 12a at a position surrounded by the adhesive layer 13 and the spacer 14. More specifically, the upper surface of the base material sheet 12 surrounded by the adhesive layer 13 and the spacer 14 is an exposed surface and faces the first main surface S1 of the substrate S. The through hole 12a of the base sheet 12 is used as an air discharge hole for discharging air between the substrate S and the base sheet 12 when the substrate protective tool 11 is attached to the substrate S. The number of through holes 12a may be singular as in the present embodiment, or may be changed to a plurality. The shape of the through hole 12a may be a quadrangular shape as in the present embodiment, or may be changed to a circular shape, for example. The area of the through hole 12a is preferably in the range of, for example, 5% or more and 50% or less when the area of the base sheet 12 is 100%. The larger the area of the through hole 12a, the easier it is for the function as an air discharge hole to be exhibited. As the area of the through hole 12a is smaller, the first main surface S1 of the substrate S can be covered more widely with the base sheet 12, so that the cleanliness of the first main surface S1 can be easily maintained. The through hole 12a is preferably formed at a position closer to the center of the base sheet 12 than the adhesive layer 13 and the spacer 14 in the plan view of the base sheet 12. In this case, the air between the substrate S and the base sheet 12 can be discharged in a well-balanced manner as a whole.

The spacer 14 is formed in a continuous annular shape along the peripheral edge portion of the first main surface S1 of the substrate S. Examples of the flexible material constituting the spacer 14 include a woven fabric or a non-woven fabric, a polymer material, and a rubber material. Examples of the woven fabric or non-woven fabric include glass cloth. Examples of the rubber material include silicon rubber, urethane rubber, chloroprene rubber, styrene / butadiene rubber, and ethylene / propylene / diene rubber. The spacer 14 may have a single-layer structure, or may have a multi-layer structure composed of the same or different materials. For example, when the film formation of the functional film involves heating, a spacer that can withstand the heat during the film formation may be used. The spacer 14 can be fixed to the base sheet 12 with a well-known adhesive or adhesive. The spacer 14 may be fixed to the base sheet 12 by using, for example, a single-sided adhesive tape (glass cloth tape or the like) configured with the spacer 14 as a support. The thickness of the spacer 14 is, for example, in the range of 150 μm to 5 mm. The spacer 14 is preferably formed thicker than the adhesive layer 13 in a state before the substrate protective tool 11 is attached to the substrate S, that is, in a state where the substrate protective tool 11 is not loaded.

Next, a method for manufacturing a substrate with a film will be described.
As shown in FIG. 2, the method for manufacturing a substrate with a film includes a preparatory step of preparing a film-forming substrate SA having the substrate S and the substrate protective tool 11 by attaching the substrate protective tool 11 to the substrate S. A film forming step of forming a functional film on the second main surface S2 of the substrate S in the film forming substrate SA is provided. In the preparation step, the substrate S is sucked through the through hole 12a of the base material sheet 12 of the substrate protective tool 11, and the film-forming substrate on which the substrate protective tool 11 and the substrate S are adhered is prepared.

As shown in FIGS. 3 and 5, in the preparation step of this embodiment, the suction device 15 is used to suck the substrate S. The suction device 15 opens into the decompression chamber 16, the exhaust unit 17 for exhausting the air in the decompression chamber 16, the mounting surface 18 on which the substrate protective tool 11 is mounted, and the mounting surface 18, and the decompression chamber. A suction unit 19 for sucking the outside air of the 16 is provided. A well-known vacuum pump (not shown) is connected to the exhaust unit 17.

In order to obtain the film-forming substrate SA in the preparatory step, first, the substrate protective tool 11 is placed on the mounting surface 18 of the suction device 15 so that the adhesive layer 13 of the substrate protective tool 11 faces upward. The substrate S is placed on the adhesive layer 13 of the substrate protective tool 11.

Next, as shown in FIG. 5, the air in the decompression chamber 16 of the suction device 15 is exhausted from the exhaust unit 17. As a result, the suction unit 19 of the suction device 15 sucks the air between the base sheet 12 of the substrate protective tool 11 and the substrate S through the through hole 12a in the base sheet 12 of the substrate protective tool 11. As a result, the substrate S is pressed against the adhesive layer 13 of the substrate protective tool 11, so that the substrate protective tool 11 can be attached to the substrate S.

Here, when the air between the substrate sheet 12 and the substrate S of the substrate protective tool 11 is sucked by using the suction device 15, the flat plate-shaped substrate S is curved so as to be convex toward the suction device 15. May be done. For example, when a glass substrate having a thickness of 0.05 to 1.5 mm is used as the flat plate-shaped substrate S, such bending tends to occur. However, even if the substrate S is bent by suction by the suction device 15, the flexible spacer 14 is also bent, so that the adhesive layer 13 does not peel off from the peripheral edge of the substrate S.

A substrate with a film is produced by forming a functional film on the second main surface S2 of the substrate S attached to the protective tool 11 for the substrate. In the film forming process in the manufacturing method of the substrate SF with a film, a well-known film forming method such as PVD (Physical Vapor Deposition) method such as sputtering method, CVD (Chemical Vapor Deposition) method, coating method such as spraying and spin coating is used. be able to. Examples of the functional film F (see FIG. 6) include a film having a predetermined optical property (dielectric film, etc.), a film having a predetermined mechanical property, a film having a predetermined chemical property, and a predetermined film. Examples include colored films. The film-forming material for forming the functional film F may be an inorganic material or an organic material.

The film forming step may be performed in any of a posture in which the second main surface S2 of the film forming substrate SA is horizontal, a vertical posture, and an inclined posture that is neither horizontal nor vertical. For example, when the film-forming substrate SA is arranged in a posture in which the second main surface S2 of the film-forming substrate SA is vertical, the substrate sheet 12 has the shape of the substrate sheet 12 of the substrate protective tool 11. It may be changed so that it protrudes outward from the substrate S, and the film-forming substrate SA may be suspended by using the protruding portion.

As shown in FIG. 6, the substrate SF with a film obtained in the film forming step has a functional film F provided on the second main surface S2 of the substrate S, and has an adhesive layer of the protective tool 11 for the substrate. Removed from 13.
The substrate protective tool 11 after the film forming step can be repeatedly used in the production of another substrate SF with a film. Further, even when there are a plurality of protective tools 11 for substrates, since the protective tools 11 for substrates are relatively thin, the plurality of protective tools 11 for substrates can be stored compactly by stacking them in the thickness direction. be able to.

Next, the operation and effect of this embodiment will be described.
(1) The substrate protective tool 11 includes a substrate sheet 12 having a size capable of covering at least the peripheral edge of the substrate S, an adhesive layer 13 that can adhere to the peripheral edge of the substrate S, and a substrate sheet. It is provided with a flexible spacer 14 arranged between the 12 and the adhesive layer 13. The base sheet 12 has a through hole 12a at a position surrounded by the adhesive layer 13 and the spacer 14.

According to this configuration, the substrate S is sucked through the through hole 12a of the base sheet 12 before the functional film F is formed, and the peripheral portion of the substrate S and the peripheral edge of the base sheet 12 are adhered by the adhesive layer 13. This makes it possible to prevent the film-forming material from wrapping around and adhering to the peripheral edge of the first main surface S1 of the substrate S when the functional film F is formed.

Further, when the substrate S is as thin as 0.05 to 1.5 mm, even if the substrate S bends during suction, the flexible spacer 14 also bends, so that the adhesive layer is formed from the peripheral edge of the substrate S. 13 does not come off. Further, when the protective tool 11 for the substrate is attached to the substrate S, the second main surface S2 of the substrate S does not have to be pressed by a jig or the like, so that the cleanliness of the second main surface S2 of the substrate S is maintained. easy.

Therefore, the functional film F can be suitably formed only on the second main surface S2 of the substrate S.
(2) The adhesive layer 13 of the protective tool 11 for a substrate is formed in an annular shape. In this case, it is possible to further prevent the film-forming material from wrapping around and adhering to the peripheral edge of the first main surface S1 of the substrate S when the functional film F is formed. Therefore, the functional film F can be more preferably formed only on the second main surface S2 of the substrate S.

Further, since the adhesive layer 13 of the substrate protective tool 11 is formed so as to be adhereable only to the peripheral edge portion of the substrate S instead of the entire surface of the substrate S, the substrate protective tool 11 excessively adheres to the substrate S. The protective tool 11 for the substrate can be easily peeled off from the substrate S after the functional film F is formed. Further, since the adhesive layer 13 is formed so as to be adhesively formed only on the peripheral edge portion of the substrate S, not on the entire surface of the substrate S, the adhesive is present in the range affecting the performance of the substrate S on the first main surface S1 of the substrate S. It can be avoided to be transcribed.

(3) In the method for manufacturing the substrate SF with a film, the substrate S is sucked through the through hole 12a of the substrate sheet 12 of the substrate protective tool 11, and the substrate protective tool 11 and the substrate S adhere to each other. A preparatory step for forming the functional film F on the second main surface S2 of the substrate S in the film forming substrate SA is provided.

According to this method, the same effect as that described in the above column (1) can be obtained.
(Change example)
This embodiment can be modified and implemented as follows.

The spacer 14 of the substrate protective tool 11 of the above embodiment is fixed to the base sheet 12 of the substrate protective tool 11, but is arranged so as to be overlapped with the base sheet 12 without being fixed to the base sheet 12. It may be fixed to the mounting surface 18 of the suction device 15, for example.

The adhesive layer 13 of the protective tool 11 for a substrate may be formed in a shape other than an annular shape. The adhesive layer 13 of the substrate protective tool 11 can be changed to, for example, a plurality of adhesive layers corresponding to the two opposite sides of the substrate S.

The shape of the substrate S is not limited to a flat plate shape, but may be a curved plate shape.
The outer shape of the protective tool 11 for the board can be appropriately changed according to the outer shape of the board S.
-As shown in FIG. 7, the suction device 15 may be changed so that a plurality of substrate protective devices 11 and a plurality of substrates S can be placed. That is, the number of suction portions 19 of the suction device 15 can be changed according to the number of substrate protective devices 11 (board S) mounted on the mounting surface 18 of the suction device 15. In this case, for example, the same suction device 15 can be used for a substrate having a size smaller than that of the substrate S shown in FIG. That is, the same suction device 15 can be used even if the size of the substrate S is changed. Further, the plurality of substrate protective devices 11 and the plurality of substrates S can be adhered to each other by one suction operation of the suction device 15. That is, since a plurality of film-forming substrate SAs can be obtained by one suction operation of the suction device 15, the work efficiency of the preparation step for preparing the film-forming substrate SA can be improved.

As shown in FIG. 8, the plurality of substrate protective equipment 11 may be configured as a connecting body 20 in which the plurality of substrate protective equipment 11 are connected. In this connecting body 20, a plurality of protective tools 11 for substrates are connected by using a base sheet 12, but they may be connected by using a spacer 14, or by separately providing a connecting material such as a tape material. It may be connected. By using the connector 20 in this way, it is possible to handle a plurality of film-forming substrate SAs as a unit. Therefore, for example, a work of carrying a plurality of film-forming substrate SAs into a film-forming apparatus used in a film-forming process The efficiency of unloading work can be improved. Further, by using the connecting body 20, it becomes easy to suspend and arrange a plurality of film forming substrates SA.

11 ... Substrate protective equipment, 12 ... Base sheet, 12a ... Through hole, 13 ... Adhesive layer, 14 ... Spacer, F ... Functional film, S ... Substrate, S1 ... First main surface, S2 ... Second main surface , SA ... Substrate for film formation, SF ... Substrate with film.

Claims (2)

A protective tool for a substrate that protects the first main surface of a substrate having a first main surface and a second main surface opposite to the first main surface.
A base sheet having a size capable of covering at least the peripheral edge of the substrate, and
An adhesive layer that can be adhered to the peripheral edge of the substrate,
A flexible spacer disposed between the base sheet and the adhesive layer.
A protective device for a substrate, wherein the base material sheet has a through hole at a position surrounded by the adhesive layer and the spacer. A method for manufacturing a film-coated substrate by using the substrate protective device according to claim 1.
A preparatory step of sucking the substrate through the through hole of the substrate sheet of the protective tool for the substrate to prepare a film-forming substrate to which the protective tool for the substrate and the substrate are adhered.
A method for manufacturing a substrate with a film, which comprises a film forming step of forming a functional film on the second main surface of the substrate in the film forming substrate.

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