JP5773372B2 - Device having workpiece transfer mechanism - Google Patents

Description

The present invention relates to a device having a word over click delivery mechanism using a fixing jig in close contact fixing a thin plate-like workpiece such as a semiconductor wafer.

  In a semiconductor manufacturing process, in order to reduce the size of a semiconductor chip (hereinafter referred to as “chip”), a back grinding process for grinding and thinning the back surface of a semiconductor wafer (hereinafter referred to as “wafer”), a wafer on which a circuit is formed. There are various processes such as a dicing process for cutting the semiconductor chip into individual semiconductor chips, and a die bonding process for bonding the chip to the electrode portion of the mounting substrate having the wiring pattern.

  Here, the wafer thinned by the back grinding process is damaged even by a slight impact. Therefore, the plate-shaped jig body and the workpiece on one side of the jig body are attached and detached so that the ultrathin wafer is not distorted and damaged by its own weight, acceleration, or machining stress during transportation or processing. A fixing jig configured to support and fix a wafer has been proposed (see, for example, Patent Document 1). This jig body has a plurality of support protrusions for supporting the adhesion layer on one side, and has a side wall having the same height as the support protrusion on the outer peripheral portion of one side, and the adhesion layer is bonded to the end face of the side wall, A partition space surrounded by a side wall is defined between the adhesion layer and the jig body, and a vent hole communicating with the partition space is formed in the jig body.

  While the wafer is closely fixed to the fixing jig, the wafer is held without any positional deviation or breakage of the wafer. On the other hand, when the air in the partition space is sucked through the air holes by evacuating the air holes, the adhesion layer is deformed so as to be recessed between the support protrusions, and the contact area of the wafer with the adhesion layer is reduced. For this reason, the wafer can be detached from the fixing jig without applying an excessive force to the wafer.

  Due to the advantages of the fixing jig as described above, a wafer protective structure is formed by combining the wafer and the fixing jig by tightly fixing the wafer to the fixing jig, and a back grinding process or the like is performed in the state of the protective structure. It is proposed to carry out or transport for the next process.

JP 2006-216775 A

  By the way, in the semiconductor manufacturing process, after performing predetermined processing on one surface of the wafer (that is, the surface opposite to the surface in close contact with the fixing jig), in the next step, the other surface of the wafer (that is, Predetermined processing may be performed on the surface that is in close contact with the fixing jig. In such a case, removing the wafer from the state of the protective structure and turning the wafer upside down so that the fixing jig and the wafer are fixed in close contact with each other is not only inferior workability, but also the wafer is turned upside down. Sometimes an extremely thin wafer may be damaged.

  On the other hand, a method of attaching a wafer to a treated surface through an adhesive tape and fixing it to a ring frame, removing a fixing jig and delivering the wafer to the ring frame has been conventionally known. Then, the support of the wafer at the adhesive tape portion is lacking, and it can be applied only to a processing table that matches the size of the ring frame. Furthermore, there is a problem that the pressure-sensitive adhesive tape becomes disposable and causes high costs.

Therefore, in view of the above points, an object of the present invention is to reduce the amount of processing that can be performed or conveyed on a workpiece while the workpiece is securely held when both surfaces of a thin plate workpiece are sequentially processed. It is to provide a device having a cost of word over click delivery mechanism.

In order to solve the above-mentioned problems, an apparatus having a workpiece transfer mechanism according to the present invention includes a first protective structure in which a first fixing jig is closely fixed to one surface of a thin plate-shaped workpiece. After the predetermined processing is performed , the second fixing jig stored in the jig standby part is closely fixed to the other surface by the attaching / detaching part , and the first fixing jig is detached from the workpiece. Then, the workpiece is delivered to the second fixing jig, and a predetermined process can be performed on one surface of the workpiece of the second protective structure in which the second fixing jig is closely fixed to the other surface of the workpiece. An apparatus having a workpiece delivery mechanism, wherein the first and second fixing jigs are a plate-like jig body and a close contact that is provided on one side of the jig body and detachably holds the workpiece. The jig body has a plurality of supports that support the adhesion layer on one side. And having a side wall having the same height as the supporting projection on the outer peripheral portion of one side, and the adhesion layer is bonded to an end surface of the side wall, and the side wall is disposed between the adhesion layer and the jig body. A partition space surrounded by the partition space is defined, a vent hole communicating with the partition space is formed in the jig body, and the adhesion layer is formed by sucking air in the partition space through the vent hole. is intended to be deformed, the workpiece transfer mechanism, communicates with the ventilation hole of the first fixing jig, and the detachable unit having a through hole for connecting to the suction means, it can be supported in the workpiece or fixture is and a conveying means having a finger portion which is vertically reversible form, the temporarily stores the jig standby portion fixing jig after passing receiving the workpiece, the first or the second protective structure A protective structure storage part is provided. To.

  According to the present invention, since the workpiece is transferred between the two fixing jigs using two fixing jigs, the workpiece can be processed only by changing one of the two fixing jigs that tightly fixes the workpiece. The surface that should be opened can be opened. For this reason, the workability when the surface to be processed of the workpiece is reversed and conveyed for the next process can be significantly improved as compared with the case where the workpiece itself is reversed without the support. And the protective structure of the workpiece in which the workpiece is securely held by the fixing jig not only during the predetermined processing on the workpiece and during the transfer of the workpiece but also between the two fixing jigs. Therefore, even if the workpiece is extremely thin, it can be prevented from being damaged.

  As described above, according to the present invention, the workpiece can be sequentially conveyed using a reusable fixing jig without performing a workpiece surface protection sheet or the like, and a predetermined process can be performed on both surfaces thereof. Various problems such as high cost and increase in waste associated with the use of the protective sheet can be effectively solved.

1 is a schematic plan view of a wafer transfer device according to an embodiment of the present invention. (A) is typical sectional drawing of the fixing jig used for the wafer conveyance apparatus of this invention. (B) is a top view of the jig body of the fixing jig. The typical perspective view of a conveyance arm. (A) thru | or (d) is typical sectional drawing explaining the delivery of the wafer between fixing jigs. The top view which shows the modification which integrated the wafer conveyance apparatus of this invention in the grinding apparatus.

  Referring to FIG. 1, reference numeral 1 denotes a wafer transfer apparatus for transferring a wafer W which is a thin plate-like workpiece of the present invention. The wafer transfer apparatus 1 has a rectangular base 2 in plan view, and a predetermined apparatus (hereinafter referred to as “upstream apparatus”) 10a that performs an upstream process and a predetermined apparatus (hereinafter referred to as “downstream apparatus”) that performs a downstream process. ")" And 10b. Then, after a predetermined process is performed on one surface of the wafer W by the upstream apparatus 10a, the other surface to be processed is opened and transferred to the downstream apparatus 10b in order to perform a predetermined process on the other surface of the wafer W.

  The upstream device 10a and the downstream device 10b are provided with protective structure housing portions S1 and S2 that are arranged with the opening surfaces thereof facing the wafer transfer device 1. In the protection structure housing part S1 of the upstream device 10a, a wafer W is supported and fixed to a fixing jig 3a (to be described later) (hereinafter referred to as “protection structure 30a”) with a predetermined interval in the vertical direction. Several are stored. Note that the wafer W and the fixing jig 3 may be housed in a cassette having a known structure and installed at a predetermined position of the upstream device 10a by a handling device. In addition, the protection structure storage unit S2 stores a plurality of wafers W with a predetermined interval in the vertical direction in a state where the wafer W is supported and fixed to a fixing jig 3b described later (hereinafter referred to as “protection structure 30b”). It can be done.

  Here, the fixing jig 3 for supporting and fixing the wafer W includes a plate-like jig main body 31 and an adhesion layer 32 provided on one surface of the jig main body 31 (FIG. 2A and FIG. (Refer FIG.2 (b)). The jig body 31 is formed in a disk shape having a slightly larger diameter than the wafer W. The material of the jig body 31 is not particularly limited as long as it has excellent mechanical strength. For example, a metal material such as an aluminum alloy, a magnesium alloy, and stainless steel, a resin such as polyamide, polycarbonate, polypropylene, acrylic, and polyvinyl chloride. Examples thereof include molding materials, inorganic materials such as glass, and organic-inorganic composite materials such as glass fiber reinforced epoxy resins.

  On one side of the jig body 31, cylindrical support protrusions 33 having a height of about 0.05 to 0.5 mm and a diameter of about 0.05 to 1.0 mm are arranged at a pitch of about 0.2 to 2.0 mm. A plurality are formed. Further, a cylindrical side wall 34 having the same height as the support protrusion 33 is formed on the outer peripheral portion of one side of the jig body 31. The support protrusion 33 may be formed in a shape other than a columnar shape, for example, a truncated cone shape. On the other hand, the other surface of the jig body 31 is preferably smoothed so as to have a predetermined surface roughness.

  The adhesion layer 32 is formed of a film having a thickness of 20 to 200 μm made of an elastomer such as urethane, acrylic, fluorine, or silicone that is excellent in flexibility, flexibility, heat resistance, elasticity, adhesiveness, and the like. The And the outer peripheral part of the contact | adherence layer 32 is adhere | attached on the end surface of the side wall 34 of the jig | tool main body 31 with an adhesive agent, heat sealing, etc. FIG. Thereby, a partition space 35 surrounded by the side wall 34 is defined between the adhesion layer 32 and the jig body 31. Further, the adhesion layer 32 is supported in contact with the flat end surface of each support protrusion 33. The jig body 31 is formed with at least one vent hole 36 that penetrates the jig body 31 in the thickness direction and communicates with the partition space 35.

  An articulated transfer arm (transfer means) 4 having a known structure is provided at the center of the work surface 2a of the gantry 2 (see FIGS. 1 and 3). The front end portion of the transfer arm 4 is formed as a finger portion 41 having a substantially U-shape in plan view. At least one surface of the finger portion 41 is provided with a suction hole 42, and the wafer W and / or the fixing jig 3 is formed by the finger portion 41. Can be transported in a state of being held by suction. The suction holes 42 are arranged so as not to coincide with the vent holes 36 of the fixing jig 3 so that the partition space 35 is not decompressed when the fixing jig 3 is fixed by suction.

  Further, the finger portion 41 can be turned upside down by a motor 43 as a reversing mechanism, and an attachment shaft 44 to the work surface 2a of the transfer arm 4 is connected to a driving means such as a cylinder in a direction perpendicular to the work surface 2a. It is designed to move up and down. Two transfer arms 4 may be installed on the work surface 2a of the gantry 2 for the first fixing jig 3a and the second fixing jig 3b described later.

  At one end in the longitudinal direction of the work surface 2a of the gantry 2 (on the right side in FIG. 1), an attaching / detaching portion 5 for attaching / detaching the fixing jig 3 to / from the wafer W is provided. In this case, the transfer arm (transfer means) 4 and the detachable part 5 constitute a wafer delivery mechanism. The detachable portion 5 includes a recess 6 formed on the work surface 2a of the gantry so as to substantially match the outer shape of the fixing jig 3, and a plurality of lift pins 7 incorporated in the gantry 2 (see FIGS. 1 and 4). ). The lift pin 7 is provided between the ascending position protruding upward from the work surface 2a of the gantry 2 by an air cylinder (not shown) and the descending position accommodated in the gantry 2 for delivery of the fixing jig 3 from the transfer arm 4. To reciprocate.

  The attaching / detaching portion 5 has a through hole 8 that communicates with the vent hole 36 of the fixing jig 3 when the fixing jig 3 is set in the recess 6, and a bellows tube (not shown) is provided in the through hole 8. A vacuum pump (suction means) V is connected via the terminal. In this case, an O-ring may be provided on the bottom surface of the recess 6 so as to surround the through hole 8.

  When the fixing jig 3 is set by dropping into the recess 6 by the lowering of the lift pin 7, the vent hole 36 of the fixing jig 3 communicates with the through hole 8, and the through hole 8 is evacuated by the vacuum pump V. When the air in the partition space 35 is sucked through the air holes 36, the contact layer 32 is deformed so as to be recessed between the support protrusions 33, and the contact area of the wafer W with the contact layer 32 is reduced. For this reason, the wafer W can be detached from the fixing jig 3 without applying an excessive force thereto.

  Furthermore, a jig standby part S3 is provided at the other end in the longitudinal direction of the work surface 2a of the gantry 2 (left side in FIG. 1), and the fixing jig 3 is arranged in the vertical direction in the jig standby part S3. At least one is temporarily stored at a predetermined interval. In FIG. 1, the fixing jig 3 is housed in a cassette having a known structure and is set at a predetermined position on the work surface 2a by a handling device. There may be only a temporary space.

  Next, the operation of the wafer transfer apparatus 1 of the present invention will be described. First, one protective structure 30 a is taken out from the protective structure storage unit S <b> 1 by the transfer arm 4 and transferred to the detachable unit 5. At that time, the jig body 31 side of the fixing jig 3 is adsorbed by the finger portions 41, the finger portions 41 are turned upside down as appropriate, and transferred so that the wafer W of the protective structure 30a is on the upper side.

  Before the protective structure 30 a reaches the detachable portion 5 by the transfer arm 4, the lift pin 7 is raised and the protective structure 30 a is delivered to the lift pin 7. When the protective structure 30 a is supported by the lift pins 7, after the suction of the transport arm 4 is released, the transport arm 4 is moved backward. When the lift pins 7 are returned to the lowered position, the first fixing jig 3a is set in the recess 6 of the detachable portion 5, and the protective structure 30a is fixed to the wafer transfer apparatus 1 (FIG. 4A and FIG. 4 (b)).

  Next, the single fixing jig 3, that is, the second fixing jig 3 b is picked up by holding the jig main body 31 side from the jig standby section S 3 by the transfer arm 4 and is transferred to the attachment / detachment section 5. At that time, the adhesion layer 32 of the fixing jig 3b is set on the lower side. Then, the adhesion layer 32 of the second fixing jig 3b is brought into contact with the entire surface of the wafer W of the protection structure 30a, and the transfer arm 4 is moved slightly downward to apply a pressing force to the second fixing. The wafer W is tightly fixed to the jig 3b (see FIG. 4C).

  Next, when the vacuum pump V is operated and the air in the partition space 35 is sucked through the vent hole 36 by evacuating the through hole 8 and the vent hole 36, the adhesion layer 32 of the first fixing jig 3 a is supported by the support protrusion. 33, the contact area of the wafer W with respect to the adhesion layer 32 is reduced, and the wafer W can be detached from the first fixing jig 3a. When the second fixing jig 3b is moved right above by the transfer arm 4 so that the both fixing jigs 3a and 3b are separated from each other, the first fixing jig 3a is completely detached from the wafer W. The wafer is transferred to the second fixing jig 3b, and the protective structure 30b is formed (see FIG. 4D).

  Next, the second fixing jig 3b and the protection structure 30b for the wafer W are transferred by the transfer arm 4 to the protection structure storage portion S2 of the downstream apparatus 10b and stored. Further, the first fixing jig 3a remaining in the recess 6 of the attaching / detaching portion 5 is transferred to the jig standby portion S3 by the transfer arm 4 as a second fixing jig 3b for processing the next wafer W. Stored temporarily. Finally, the processing mechanism of the downstream apparatus 10b (not shown) performs processing on the open surface of the wafer W in the state of the protective structure 30b, that is, the surface covered with the first fixing jig 3a.

  As described above, in this embodiment, since the wafer W is delivered using the two fixing jigs 3a and 3b, only the fixing jig 3a and 3b to which the wafer W is firmly fixed can be changed. The surface to be processed of the wafer W can be opened. For this reason, workability when the surface to be processed of the wafer W is reversed and transferred for the next process can be remarkably improved as compared with the case where the wafer W itself is reversed. After the wafer W is once tightly fixed to the fixing jig 3, not only during a predetermined process on the wafer W and during the transfer of the wafer W, but also between the fixing jigs 3a and 3b. Even when the wafer W is delivered, the protective structures 30a and 30b in which the wafer W is securely held by the fixing jig 3 are not damaged, even if the wafer W is extremely thin.

  As described above, according to the present embodiment, the wafers W are sequentially transferred using the two reusable fixing jigs 3a and 3b without using a disposable adhesive sheet or the like, and are applied to both surfaces of the wafer W. Since the predetermined treatment can be performed, various problems such as high cost and increase in waste associated with the use of the pressure-sensitive adhesive sheet can be effectively solved.

  In the present embodiment, the case where the wafer transfer apparatus 1 is configured as an independent apparatus has been described. However, for example, the work transfer apparatus of the present invention is incorporated in a grinding apparatus 20 for wafer grinding having a known structure. May be.

  That is, as shown in FIG. 5, the grinding apparatus 20 has a gantry 21, and the work surface 22 of this gantry 21 is provided with a rotary table 23 having a stepping motor, and intermittently stops at every predetermined rotation angle. It is supposed to be. On the rotary table 23, four chuck tables 24 are provided at predetermined intervals in the circumferential direction. The chuck table 24 is composed of, for example, a porous table and can detachably suck and fix the wafer with a negative pressure.

  Further, a rough grinding device 25 and a finish grinding device 26 having a known structure are suspended above the work surface 22 from the upstream side in the rotational direction so as to correspond to the stop position of the chuck table 24. On the work surface 22 of the gantry 21, a transfer arm 4 a and an attachment / detachment part 5 for attaching / detaching the fixing jig 3 to / from the wafer W are arranged in the same manner as in the above embodiment.

  In the grinding apparatus 20, a wafer storage unit SA in which a plurality of wafers W are stored in a predetermined position on the work surface 22 at a predetermined interval in the vertical direction, and a plurality of fixing jigs 3 are in the vertical direction. And a protection structure storage section SC that can store a plurality of wafers W at a predetermined interval in the vertical direction in a state where the wafer W is supported and fixed to the fixing jig 3. And are arranged. In addition, in order to change the surface to be processed of the wafer W by changing the contact surface of the wafer W with the fixing jig 3, the jig standby portion SD and another transfer arm 4b having the same structure as the transfer arm 4a are provided. Is provided.

  Then, one wafer W is taken out from the wafer storage unit SA by the transfer arm 4a by sucking and holding the surface on the side where the grinding process is performed, and the chuck table 24 on the rotary table 23 is moved to the one at the loading position A. And carry. At this time, the transfer arm 4a is appropriately turned upside down according to the storage state of the wafer storage unit SA so that the surface of the wafer W to be processed (the suction surface side) is on the upper side.

  Next, the rotary table 24 is rotated, the wafer W is moved to the rough grinding position B below the rough grinding device 25, the back surface of the wafer W is rough ground, and ground to a predetermined thickness. Thereafter, the rotary table is further rotated to move the wafer to a finishing position C below the finish grinding apparatus, and the back surface of the wafer W ground to a predetermined thickness is finish ground and cleaned.

  Next, the rotary table 24 is further rotated, and the wafer W after the grinding is moved to the discharge position D. When the ground wafer W reaches the discharge position D, the transfer arm 4a takes out one sheet of the fixing jig 3, that is, the first fixing jig 3a from the jig storage portion SB, and transfers it to the discharge position D. At that time, the jig body 31 side of the fixing jig 3a is adsorbed by the finger portions 41, and the finger portions 41 are appropriately turned upside down so that the adhesion layer 32 of the fixing jig 3 is on the lower side.

  Next, the adhesion layer 32 of the first fixing jig 3a is brought into contact with the entire upper surface (the surface subjected to grinding) of the wafer W at the discharge position, and the transfer arm 4 is moved slightly downward. Apply pressing force. Thereby, the wafer W is closely fixed to the first fixing jig 3a, and the protective structure 30a is formed by combining the wafer W and the fixing jig 3a.

  Next, the protection structure 30a is transported to the detachable portion 5 by the transport arm 4a. At that time, the finger part 41 is turned upside down and transferred so that the surface to be processed of the wafer W is on the upper side, the lift pin 7 is moved to the raised position, the protective structure 30a is delivered to the lift pin 7, and the lift pin 7 is lowered. Thus, the protective structure 30a is set on the detachable portion 5.

  Next, the fixing arm 3, that is, the second fixing jig 3 b is picked up by holding the jig main body 31 side from the jig standby part SD by the transfer arm 4 a, and is transferred to the attachment / detachment part 5. At that time, the adhesion layer 32 of the fixing jig 3b is set on the lower side. In this case, the second fixing jig 3b is the first fixing jig 3a used in the previous process and left in the attaching / detaching portion 5, and is temporarily transferred to the jig standby portion SD by the transfer arm 4a. That are stored in a stored state are used. Note that the first fixing jig 3a left on the attaching / detaching portion 5 on the work surface 22 may be re-stored in the original jig storage portion SB by the transfer arm 4b.

  Then, the adhesion layer 32 of the second fixing jig 3b is brought into contact with the entire surface of the wafer W of the protective structure 30a in the detachable portion 5 and the transfer arm 4 is moved slightly downward to apply a pressing force. Then, the wafer W is closely fixed to the second fixing jig 3b.

  Next, when the vacuum pump is operated and the air in the partition space 35 is sucked through the vent hole 36 by evacuating the through hole 8 and the vent hole 36, the adhesion layer 32 of the first fixing jig 3 a is supported by the support protrusion 33. As a result, the contact area of the wafer W with respect to the adhesion layer 32 decreases, and the wafer W can be detached from the first fixing jig 3a. When the second fixing jig 3b is moved right above by the transfer arm 4 so that the both fixing jigs 3a and 3b are separated from each other, the first fixing jig 3a is completely detached from the wafer W. The wafer W is transferred to the second fixing jig 3b to form a protective structure 30b. The protection structure 30b is stored in a cassette set in the protection structure storage section SC by the transfer arm 4b, and the cassette is transferred to a processing apparatus in the next process.

  Next, in order to perform a predetermined process on the circuit surface (the surface opposite to the grinding surface) of the wafer W in the next process, for example, the dicing process, the wafer W is placed in a dicing apparatus that performs the dicing process by another transfer arm (not shown). The protective structure 30b is conveyed as it is. On the other hand, the first fixing jig 3a left in the attaching / detaching portion 5 is returned to the jig standby portion SD by the transport arm 4a.

  Next, the transfer method of the present invention used in other processing steps of the wafer W will be further described.

  As a first example, a back grinding process in which the upstream apparatus 10a is a wafer grinding apparatus, and a processing process in which the downstream apparatus 10b is a DAF pasting process in which a die bonding film (also referred to as a die attach film (DAF)) pasting apparatus is used. .

  First, a surface protection sheet is attached to the circuit surface of an unpolished wafer W having a circuit pattern incorporated on the surface in the previous step, and the wafer W is mounted on a wafer grinding apparatus, which is the upstream apparatus 10b, and the wafer W is ground. Since the wafer W ground to an extremely thin thickness is extremely brittle, the fixing jig 3a is tightly fixed to the grinding surface while being placed on the stage of the wafer grinding apparatus. The obtained protection structure 30a has a structure including a fixing jig 3a, a wafer W (the grinding surface on the fixing jig side), and a surface protection sheet.

  Subsequently, the protective structure 30a is transferred from the fixing jig 3a to the fixing jig 3b by using the wafer conveyance device 1 of the present invention to form the protective structure 30b. The delivery method is as described above, and the obtained protection structure 30b has a structure including the fixing jig 3b, the surface protection sheet, and the wafer W (exposed grinding surface).

  Next, the protective structure 30b is transported to a die bonding film sticking device, which is the downstream device 10b, and the die bonding film is stuck to the ground surface side of the wafer W. The wafer W to which the die bond film is attached is subjected to predetermined processing such as a surface protection sheet peeling step, a dicing step, and a die bonding step. In addition, you may perform the peeling process of a surface protection sheet before a DAF sticking process. Also in these steps, it is preferable that the processing is performed in a state where the wafer is supported and fixed to the fixing jig 3.

  As a second example, there is a dicing process in which the upstream apparatus 10a is a dicing apparatus, and a processing process that is a chip sorting process in which the downstream apparatus 10b is a pickup apparatus.

  First, a surface protection sheet is affixed to the circuit surface of the unpolished wafer W having a circuit pattern incorporated on the surface in the previous step, and the first fixing jig 3a is tightly fixed on the surface protection sheet. Subsequently, the wafer is installed in a wafer grinding apparatus that is the upstream apparatus 10a, and grinding is performed from the back surface side of the wafer W to a predetermined thickness. The obtained protection structure 30a has a structure including the fixing jig 3a, the surface protection sheet, and the wafer W (exposed grinding surface).

  Next, the wafer W is transferred to the dicing apparatus, which is the upstream apparatus in the first example, in the state of the protective structure 30a. In the dicing apparatus, the wafer W is diced so as to cut a part of the thickness of the surface protection sheet, and the wafer W is formed into chips. In this way, the protection structure 30a having the configuration of the fixing jig 3a, the surface protection sheet, and the chip (work) is obtained.

  Next, the protective structure 30a is transferred from the fixing jig 3a to the fixing jig 3b by using the wafer conveyance device 1 of the present invention to form the protective structure 30b. The delivery method is as described above, and the obtained protective structure 30b has a structure including a fixing jig 3b, a chip (the grinding surface is the fixing jig side), and a surface protection sheet in this order.

  Next, the protection structure 30b is conveyed to the sheet peeling apparatus which is the downstream apparatus 10b, and the surface protection sheet is peeled from the chip. Further, the protective structure 30b is conveyed to a pickup device and die-bonded on a predetermined substrate for each chip or transferred onto a chip tray. As the pickup device, a device having a function of depressurizing the partition space 35 through the air passage 36 of the fixing jig 3b can be used. By depressurizing the partition space 35, the adhesion layer 32 of the fixing jig 3b can be deformed, and the adhesion of all the chips fixed to the fixing jig 3b can be weakened. As a result, the pick-up process is performed without the needle being pushed up, so that the chip is not damaged.

  Moreover, in embodiment of this invention, it is not limited to the process demonstrated above, It can apply in the conveyance between other processes. Moreover, it is applicable also in the conveyance between the processes from which the order and combination of the process demonstrated above differed.

  Further, in the present embodiment, description has been made on the transfer of the wafer W by changing the surface to be processed. However, the fixing jig used in the processing of a thin workpiece other than the wafer W such as a precision substrate made of quartz glass or the like is used. Similarly, the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 ... Wafer transfer apparatus (work transfer apparatus), 3 ... Fixing jig, 31 ... Jig body, 32 ... Adhesion layer, 33 ... Supporting protrusion, 34 ... Side wall, 35 ... Partition space, 36 ... Vent hole, 4 ... Transfer Means (work delivery mechanism), 41 ... finger part, 43 ... motor (reversing mechanism), 5 ... detachable part (work delivery mechanism), W ... wafer, S1, S2 ... protection structure housing part, S3 ... jig standby part .

Claims (1)

After a predetermined treatment is performed on the other surface of the first protective structure in which the first fixing jig is closely fixed to one surface of the thin plate-like workpiece, the attachment / detachment unit attaches the other surface to the other surface. The second fixing jig stored in the jig standby part is closely fixed, the first fixing jig is detached from the work, and the work is transferred to the second fixing jig, and the second fixing jig is transferred to the other surface of the work. A workpiece delivery mechanism that allows a predetermined process to be performed on one surface of the workpiece of the second protective structure, to which the fixing jig is closely fixed, and transfers the first fixing jig to the jig standby portion. A device comprising:
The first and second fixing jigs are each composed of a plate-like jig body and an adhesion layer provided on one side of the jig body to detachably hold the workpiece. Has a plurality of support projections for supporting the adhesion layer on one side, and has a side wall having the same height as the support projection on the outer peripheral portion of one side, and the adhesion layer is bonded to the end surface of the side wall, A partition space surrounded by the side wall is defined between the adhesion layer and the jig body, and a vent hole communicating with the partition space is formed in the jig body, and the partition space is formed through the vent hole. By sucking the air inside, the adhesion layer is deformed,
The workpiece transfer mechanism, communicates with the ventilation hole of the first fixing jig, and the detachable unit having a through hole for connecting to the suction means, the support of the workpiece or fixture is formed at to be vertically invertible A conveying means having a finger part,
Work is characterized by providing a temporarily stores the jig standby portion fixture after delivered the said workpiece, and a protection structure housing portion for accommodating the first or second protective structure A device having a delivery mechanism.

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