KR20150099714A - Substrate holder and production method for substrate having film formed over entire surface thereof using same - Google Patents

Abstract

A substrate holder for improving the productivity of the entire surface film deposition substrate, and a method for manufacturing an entire surface film deposition substrate using the substrate holder. 1. A substrate holder for holding a substrate on which a first main surface is entirely formed, the unit substrate being a plate-like member having a main surface smaller in area than the main surface of the substrate, A holder unit having an adhesive layer having a releasable surface to be attached to the main surface and a unit fixing surface having a larger area than the main surface of the unit base and having a direction in which the unit main surface and the second main surface of the unit base face each other , Wherein the plurality of holder units are fixed to the unit fixing surface, and a method for manufacturing an entire surface film formation substrate using the substrate holder.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate holder,

The present invention relates to a substrate holder and a method for manufacturing an entire-surface film forming substrate using the same.

Conventionally, when a film having various functions such as an antireflection film is formed on a substrate such as a glass substrate, for example, sputtering is used. Here, sputtering is a technique of depositing target particles, which are discharged from a target placed in a vacuum and opposed to the substrate, on a substrate.

The sputtering method is roughly divided into a so-called vertical type in which a film is formed in a state in which the target and the substrate are standing up, and a so-called horizontal type in which film formation is performed in a state in which both are horizontal. The horizontal type is roughly classified into a sputter-up system in which a target is disposed below a substrate and a sputter-down system in which a target is placed above the substrate.

Of these methods, the sputter-down method often employs a vertical sputter method or a sputter-up method because the possibility that foreign matter falls onto the substrate and adheres to the substrate is higher than other methods.

When a vertical sputtering method or a sputtering method is employed, a substrate holder for holding a substrate is used because the substrate can not be placed on a flat surface and sputtered.

4 is a front view showing an example of a conventional substrate holder. The substrate holder 51 shown in Fig. 4 has a plurality of bar-shaped frames 52 arranged in parallel. The rod-shaped frames 52 are spaced slightly wider than the width of one side of the first main surface 72a of the substrate 71. The grip portions 53 are spaced apart from the rod- As shown in Fig.

When the film formation is performed using the substrate holder 51, the substrate 71 is disposed between the rod-shaped frames 52, and the edge of the substrate 71 is gripped by the grip portion 53. This makes it possible to form the substrate 71 on the first main surface 72a while keeping the substrate 71 in a standing state or in a state in which the first main surface 72a is directed downward without dropping the substrate 71. [

Fig. 5 shows another example of a conventional substrate holder. Fig. 5 (A) is a front view and Fig. 5 (B) is a sectional view taken along the line B-B in Fig. The substrate holder 61 shown in Fig. 5 includes a plate-like frame 62 having a thickness as a main body. The plate-shaped frame 62 is provided with a recess 63 for allowing the substrate 71 to be fitted from one side thereof, And an opening 64 having a smaller area than the main surface of the substrate 71 and substantially resembling the substrate 71 is formed on the bottom surface of the recess 63. [ 5 (A), the outer circumference of the first main surface 72a hidden by the plate-shaped frame 62 is indicated by a broken line.

When the film formation is carried out using the substrate holder 61, the plate-like frame 62 in which the substrate 71 is sandwiched by the concave portion 63 is set in such a state that the opening portion 64 is downward, (See Fig. 5 (B)) so that the lower surface 64 is slightly downward. At this time, since the opening portion 64 is smaller than the substrate 71, the substrate 71 is not dropped, and the first main surface 72a is exposed from the opening portion 64. [ Then, the first main surface 72a exposed from the opening 64 can be formed.

Japanese Laid-Open Patent Publication No. 2011-046174 Japanese Laid-Open Patent Publication No. 2012-086527 International Publication No. 2012/053548

2. Description of the Related Art In recent years, there has been an increasing demand for tablet PCs (personal computers) and smart phones (hereinafter also referred to as " smart phones "). In a smart phone, , Productivity growth is urgent.

Smart phones, etc. differ in size and shape from maker to maker, so the size and shape of the glass substrate used differs from maker to maker. Even in the same maker, the size and shape of the glass substrate are different for each product, and the product life cycle thereof is also very fast.

However, in the conventional substrate holder described on the basis of Figs. 4 and 5, since each part is a fixed structure and its shape and structure are unchanged, when used for a glass substrate having a different size or shape, , It is necessary to newly prepare another substrate holder. Further, since the substrate holder is replaced, the setting of the substrate is repeated, and the film formation is repeated, a decrease in productivity in total can not be avoided.

Also, with respect to a glass substrate used in a smart phone or the like, from the viewpoint of designability and the like, there is an increasing demand for an entire surface film formation in which the entire surface of one main surface is formed. However, in the case of using a conventional substrate holder, as described below, the requirement can not be satisfied.

Fig. 6 is a front view showing a deposition substrate produced using the substrate holder of Fig. 4, and Fig. 7 is a front view showing a deposition substrate produced by using the substrate holder of Fig.

4, when the substrate holder 51 is used, a film is formed in a state in which a part of the edge of the substrate 71 is gripped by the grip portion 53. [ 6, a film-forming region 77 is formed on the first main surface 76a of the deposition substrate 75, but the region held by the gripping portion 53 is a film- Area 78 as shown in Fig.

5, in the case of using the substrate holder 61, the film is formed only on a part exposed from the opening 64 having a smaller area than the first main surface 72a. Therefore, as shown in Fig. 7, a non-film region 78 that surrounds the film formation region 77 is formed on the outer periphery of the first main face 76a of the film formation substrate 75 to be obtained.

As described above, in the conventional substrate holder, the entire surface can not be formed. Therefore, when the entire surface of the substrate is to be formed at present, for example, a double-faced tape or the like is used for a flat- And the back side is fixed.

However, according to this method, since a step of preparing and bonding a double-sided tape to each of a plurality of substrates each time a film is formed is required, the number of steps is remarkably increased and productivity is very inferior. In addition, since the chance of touching the substrate with a tool or a hand is increased, foreign substances are easily attached to the substrate. Further, there is a possibility that residual adhesive remains on the substrate even after the double-sided tape is peeled off after the film formation.

Therefore, the present inventors have paid attention to the curable silicone resin composition disclosed in, for example, Patent Documents 1 to 3 as a method of fixing the back side of the substrate to the carrier, and by curing the composition on a flat carrier, . ≪ / RTI >

However, the step of applying and curing the curable silicone resin composition on a relatively large carrier surface on which a plurality of substrates are arranged takes a very long time, and at a high cost, the productivity is not improved.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a substrate holder which improves the productivity of the entire surface film deposition board, and a manufacturing method of the entire surface film deposition substrate using the substrate.

The inventors of the present invention have made intensive investigations in order to achieve the above object, and as a result, by using a substrate holder having a specific configuration, it is possible to flexibly cope with a glass substrate having a different size or shape to reduce the number of processes and labor, And the present invention has been completed.

That is, the present invention provides the following (1) to (10).

(1) A substrate holder for holding a substrate on which a first main surface is entirely formed, the unit substrate being a plate-like member having a major surface area smaller than that of the main surface of the substrate, And a second main surface of the unit main body, wherein the second main surface of the unit main body has a unit fixing surface having a larger area than the main surface of the unit main body, Wherein a plurality of said holder units are fixed to said unit fixing surface in a direction in which said plurality of holder units face each other.

(2) The substrate holder according to (1), wherein the thickness of the holder unit is 0.1 to 10 mm.

(3) The substrate holder according to (1) or (2), wherein the adhesion layer is a cured silicone resin layer formed by curing the curable silicone resin composition on the first main surface of the unit base.

(4) The substrate holder according to any one of (1) to (3), wherein the thickness of the adhesive layer is 10 to 100 m.

(5) The substrate holder according to any one of (1) to (4), wherein the substrate is a glass substrate having a thickness of 0.5 to 5 mm.

(6) The substrate holder according to any one of (1) to (5), wherein the carrier has a thickness of 0.7 to 8 mm.

(7) A method for manufacturing an entire surface film formation substrate using the substrate holder according to any one of (1) to (6), wherein a second main surface of the substrate is attached to the peelable surface, Wherein the first main surface of the substrate is adhered to an entire surface of the substrate, and the entire surface of the substrate is peeled off from the peelable surface.

(8) The substrate is a substrate having a substrate main body on which a first major surface is entirely formed, and a protective layer formed on a second main surface side of the substrate main body and having a protective layer constituting a second main surface of the substrate, (7). ≪ / RTI >

(9) The method for producing an all-on-substrate substrate according to (8), wherein the thickness of the protective layer is 5 to 500 m.

(10) The optical information recording medium according to (10), wherein the protective layer comprises: a base film constituting a second main surface of the substrate; and an adhesive layer disposed between the base film and the substrate main body and having a releasable surface attached to the base film and the substrate main body (8) or (9) above.

(11) The method according to any one of (7) to (10) above, wherein a gap is formed between at least one of the substrates and at least one of the plurality of the substrates adjacent to the substrate, A method for manufacturing an entire surface deposition substrate.

(12) A method of manufacturing an all-face deposition substrate as described in any one of (7) to (11), wherein the center of gravity of the substrate is attached to the peelable surface.

(13) A glass substrate obtained by the method for manufacturing an entire-surface film-forming substrate according to any one of (7) to (12) above.

According to the substrate holder of the present invention and the method of manufacturing an entire surface film formation substrate using the same, it is possible to flexibly cope with a glass substrate having a different size or shape, thereby reducing the number of processes and labor, .

Fig. 1 shows an example of a state in which the substrate holder of the present invention holds a substrate. Fig. 1 (A) is a front view, and Fig. 1 (B) is a sectional view taken along the line AA in Fig.
2 is a front view showing another example of a state in which the substrate holder of the present invention holds a substrate.
3 is a cross-sectional view showing an example of a state in which a substrate holder of the present invention holds a substrate on which a protective layer is formed.
4 is a front view showing an example of a conventional substrate holder.
Fig. 5 shows another example of a conventional substrate holder. Fig. 5 (A) is a front view, and Fig. 5 (B) is a sectional view taken along the line BB of Fig.
Fig. 6 is a front view showing a deposition substrate produced using the substrate holder of Fig. 4; Fig.
Fig. 7 is a front view showing a deposition substrate produced using the substrate holder of Fig. 5; Fig.
8 is a graph showing the relationship between the silicon resin film thickness and the adhesion force.

[Substrate holder]

Fig. 1 shows an example of a state in which the substrate holder of the present invention holds a substrate. Fig. 1 (A) is a front view and Fig. 1 (B) is a sectional view taken along the line A-A in Fig.

The substrate holder 11 shown in Fig. 1 schematically includes a plurality of holder units 21 and a carrier 31 to which a holder unit 21 is fixed. . The substrate holder 11 is sputtered by a vertical sputtering method or a sputtering method in a state where the held substrate 41 is vertically erected or the first main surface 42a thereof is directed downward, The first main surface 42a of the first insulating film 41 is formed.

Hereinafter, the substrate 41 will be described, and the respective structures of the substrate holder 11 (the carrier 31 and the holder unit 21) will be described.

[Board]

1, the substrate 41 has a pair of main surfaces 42 (a first main surface 42a and a second main surface 42b), and a first main surface 42a thereof is formed as a whole surface do.

Here, the substrate 41 may be, for example, a glass substrate used as a cover glass or the like in a smart phone or the like.

The production method of the glass substrate is not particularly limited, and can be produced by conventionally known methods. For example, conventionally known glass raw materials may be melted to be melted glass and then formed into a plate by a float process, a fusion process, a slot-down draw process, a reed process, a pulling process, or the like.

The composition of the glass substrate is not particularly limited, and conventionally known alkali glass (soda lime glass or the like), alkali-free glass, or the like is used. At this time, characteristics such as heat shrinkage and chemical resistance of the glass substrate are not particularly limited, and can be appropriately selected depending on the application.

The shape of the substrate 41 is not limited as long as it has the first main surface 42a and the second main surface 42b, but it is preferable that the substrate 41 is rectangular. Here, the quadrangle is substantially quadrangular, and includes a shape in which a corner of a peripheral portion is cut out (corner cut), as shown in Fig. 1 (A).

The size of the main surface 42 of the substrate 41 is not limited. For example, in the case of a quadrangle, it is preferable that 10 mm x 30 mm to 1000 mm x 1500 mm, and 30 mm x 50 mm to 800 mm x 1000 Mm is more preferable.

The thickness of the substrate 41 (the length in the vertical direction in FIG. 1B) is not particularly limited, but is preferably 0.5 to 5 mm, more preferably 0.7 to 3 mm, for example.

The main surface 42 of the substrate 41 may be a polished surface or a non-etched surface (untreated surface) which is not polished, and is appropriately selected depending on the application.

The substrate 41 may be a substrate having a protective layer formed thereon as shown in Fig.

3 is a cross-sectional view showing an example of a state in which a substrate holder of the present invention holds a substrate on which a protective layer is formed. 3, the substrate 41, which is a substrate on which a protective layer is formed, is composed of a substrate main body 43 having a first main surface 44a and a second main surface 44b, and a protective layer 45. The substrate main body 43 is substantially the same as the above-described substrate 41 in which the first main surface 44a is entirely formed. The protective layer 45 is formed on the second main surface 44b side of the substrate main body 43 and constitutes the second main surface 42b in the substrate 41 on which the protective layer is formed.

The substrate on which such a protective layer is formed will be described in further detail later.

[carrier]

As shown in Fig. 1, the carrier 31 has a unit fixing surface 32 (see Fig. 1) which is larger in area than the main surface 25 (the first main surface 25a and the second main surface 25b) of the unit base 24 ). At least one holder unit 21 is fixed to the unit fixing surface 32 of the carrier 31 in such a direction that the unit fixing surface 32 faces the second main surface 25b of the unit base 24.

The material of the carrier 31 is not particularly limited as long as it is capable of maintaining a vertical state or a horizontal state while holding the substrate 41. From the viewpoint of industrial availability, , Glass, and the like.

When a metal is employed as the material of the carrier 31, the kind thereof is not particularly limited and examples thereof include stainless steel and an aluminum alloy.

In the case of employing glass as the material of the carrier 31, the production method thereof is not particularly limited and can be produced by conventionally known methods. For example, conventionally known glass raw materials can be melted into a molten glass and then molded by a float method, a fusion method, a slot-down draw method, a reed furnace method, an impression method, or the like.

The composition of the glass is not particularly limited, and conventionally known alkali glass (soda lime glass or the like), non-alkali glass, or the like is used. At this time, the properties such as heat shrinkage and chemical resistance of the glass are not particularly limited either.

The shape of the carrier 31 is not limited as long as it has the unit fixing surface 32, but it is preferable that the carrier 31 is rectangular. Here, a quadrangle is a substantially quadrangle, and includes a shape in which a corner of a peripheral portion is cut out (corner cut).

The size of the unit fixing surface 32 of the carrier 31 is set so that the size of the main surface 25 of the unit base 24 to be described later (the main surface 25 is smaller than that of the main surface 42 of the substrate 41) The surface of the sputtering apparatus is not particularly limited as long as it has a larger area than that of the sputtering apparatus, and it may vary depending on the kind of the sputtering apparatus to be used. For example, in the case of a quadrangle, 400 mm x 500 mm to 1200 mm x 1500 mm is preferable, More preferably from mm x 600 mm to 1500 mm x 1800 mm.

The thickness (the length in the vertical direction in FIG. 1B) of the carrier 31 is not particularly limited, but is preferably 0.7 mm to 8 mm from the viewpoint of rigidity and weight, and more preferably 1.5 mm to 5 mm.

The unit fixing surface 32 of the carrier 31 may be a polished surface or a non-etched surface (untreated surface) that is not polished.

[Holder Unit]

As shown in Fig. 1, the holder unit 21 is composed of a unit base 24 and an adhesive layer 27. Fig. The unit base 24 is a plate-like member having a main surface 25 (a first major surface 25a and a second major surface 25b) having a smaller area than the main surface 42 of the substrate 41. [

The adhesion layer 27 is a layer having a peelable surface 28 fixed to the first main surface 25a of the unit base 24 and adhered to the second main surface 42b of the substrate 41 so as to be freely peeled off. to be.

The holder unit 21 is fixed to the unit fixing surface 32 in a direction in which the second main surface 25b of the unit base 24 and the unit fixing surface 32 of the carrier 31 face each other. The substrate 41 is held on the substrate holder 11 by attaching the second main surface 42b of the substrate 41 to the peelable surface 28 of the adhesive layer 27 of the holder unit 21. [ do.

The example of Fig. 1 (A) is an example in which a plurality of holder units 21 are arranged to hold a plurality of substrates 41. Fig. 1 (A), each of the substrates 41 is held by one holder unit 21, but the number of the holder units 21 used for holding one substrate 41 is the same as that of the substrate 41 ), And is not particularly limited. Needless to say, one substrate 41 may be held by a plurality of holder units 21 as necessary. For example, in a case where the size of the substrate 41 is large, a plurality of holder units 21 can be used for stable maintenance.

The arrangement of the plurality of holder units 21 on the carrier 31 is such that when the substrate holder 11 on which the substrate 41 is placed is viewed in a plan view, All of the substrates 41 may be contained in the substrate holder 11, that is, within the size of the carrier 31. [ In the case of only one substrate 41, it may be within the size of the carrier 31.

The first main surface 42a of the substrate 41 is not covered with the portions of the substrate holder 11 so that the entire surface of the first main surface 42a can be formed.

At this time, the adhering force of the "fixing" between the second main surface 25b of the unit base 24 of the holder unit 21 and the unit fixing surface 32 is determined by the adhesive force between the adhesive layer 27 and the substrate 41 (Peel strength) of the second main surface 42b and is equal to or greater than the adhesion force (peel strength) of the first main surface 25a of the unit base 24 and the adhesion layer 27. [

The fixing means for realizing " fixation " between the second main surface 25b of the unit base 24 and the unit fixing surface 32 is not particularly limited and, for example, a heat resistant adhesive, (Registered trademark) double-faced tape or the like can be used.

The plurality of holder units 21 can be fixed to the unit fixing surface 32 of the carrier 31 in any arbitrary arrangement by the above-mentioned fixing means, and the arrangement thereof can be easily changed.

As described above, in the case of the conventional substrate holder described with reference to Figs. 4 and 5, in order to cope with a glass substrate having a different size or shape in that each part is fixed and its shape and structure are unchanged, , It is necessary to newly manufacture another substrate holder, and the productivity is very inferior.

On the other hand, in the present invention, since the arrangement of the holder unit 21 can be arbitrarily and easily changed, as shown in Fig. 2 to be described later, when a plurality of substrates 41 having different sizes and shapes are simultaneously disposed It is possible to flexibly cope with the problem without deteriorating the productivity.

2 is a front view showing another example of a state in which the substrate holder of the present invention holds a substrate. Even in such a case, the arrangement of the holder unit 21 can be easily changed to the arrangement in which the substrates 41 do not overlap each other. Therefore, there is no need to newly manufacture another substrate holder, and the productivity is extremely excellent.

In the conventional substrate holder described with reference to Figs. 4 and 5, the entire surface can not be formed, and therefore, in order to form an entire surface, a method of fixing the substrate by using a double-faced tape or the like is employed for a flat carrier. However, in this technique, since a step of preparing and bonding a double-sided tape to each of a plurality of substrates each time a film is formed is required, the number of steps is remarkably increased, and productivity is very inferior. In addition, when the substrate 41 is peeled off, a pressure-sensitive adhesive such as a double-sided tape may remain on the substrate 41. [

On the other hand, the substrate 41 of the present invention is held only on the peelable surface 28 of the adhesive layer 27 of the holder unit 21 disposed in the carrier 31 in advance. In addition, since the substrate holder 11 including the holder unit 21 can be used repeatedly, the number of steps is reduced and the productivity is excellent.

In addition, since the substrate 41 is held only on the peelable surface 28, unnecessary contact with the substrate 41 by the machine or by human hands is reduced, and foreign substances are not adhered to the substrate 41 do. In addition, since the use of the double-sided tape or the like itself is eliminated, the problem of residual adhesive of the double-sided tape or the like is also solved.

As the adhesive layer 27, a cured silicone resin layer formed by curing a predetermined curable silicone resin composition may be used. However, for example, the adhesive layer 27 may be formed on the entire surface of a large carrier such as the carrier 31 Applying and curing the composition is very time consuming, expensive, and very inferior in productivity.

However, in the present invention, the adhesion layer 27 may be formed only on the first main surface 25a of the unit base body 24, which is smaller than the carrier 31. [ That is, since the area for forming the adhesion layer 27 is small compared to the case where the adhesion layer 27 is formed on the entire surface of the large carrier, it can be uniformly produced with a desired thickness. In addition, the material required for forming the adhesion layer 27 may be a small amount, which is low cost. Further, even when the curable silicone resin composition is cured, a large apparatus is not required, and the productivity is extremely excellent.

Further, in the present invention, even if a problem occurs in a part of the substrate holder 11, only the problematic holder unit 21 can be repaired or exchanged, and the entire substrate holder 11 need not be replaced. From this viewpoint, productivity is also excellent.

As shown in Fig. 1 (B), the thickness T of the holder unit 21 is preferably 0.1 to 10 mm, more preferably 0.5 to 5 mm, and further preferably 0.7 to 3 mm.

When the substrate 41 adhered to the peelable surface 28 is peeled off, the fingertip or the instrument (not shown) is normally applied to the gap between the second main surface 42b of the substrate 41 to be peeled and the unit fixing surface 32 (All of which are not shown). At this time, if the thickness T of the holder unit 21 is too thin, it is difficult to insert a fingertip or the like into the gap, and handling of the peeling may be inferior.

On the other hand, if the thickness T of the holder unit 21 is large, the handleability of peeling is improved. However, if the holder unit 21 is too thick, the target particles emitted from the target may be scattered on the first main surface 42a (Hereinafter also referred to as " inner deposition ") on the second main surface 42b as well as on the second main surface 42b. This may cause problems in processing the substrate 41, or the yield of the substrate 41 may be reduced.

When the thickness T of the holder unit 21 is within the above range, it is preferable to keep the handling properties of the peeling well and to prevent the deposition of the target particles on the surface to such an extent that there is practically no problem.

Hereinafter, the unit base 24 and the adhesive layer 27 constituting the holder unit 21 will be described in more detail.

<Unit gas>

The unit base 24 is a plate-like member having a main surface 25 (a first major surface 25a and a second major surface 25b) having a smaller area than the main surface 42 of the substrate 41. For example, Glass substrates.

The production method of the glass substrate is not particularly limited, and can be produced by conventionally known methods. For example, conventionally known glass raw materials can be dissolved and melted to be formed into a plate by a float process, a fusion process, a slot-down draw process, a reed process, a pulling process, or the like.

The composition of the glass substrate is not particularly limited, and conventionally known alkali glass (soda lime glass or the like), alkali-free glass, or the like can be used. At this time, characteristics such as heat shrinkage and chemical resistance of the glass substrate are not particularly limited.

In the present invention, when a glass substrate (glass) is used in the unit base 24, the carrier 31 described above, etc., it is preferable that the heat resistance is high. Concretely, the temperature when the weight loss when the sample is heated at a speed of 10 캜 / minute in the air atmosphere exceeds 5% of the sample weight is defined as a 5% heating weight feeling temperature, and when the temperature is 300 Deg.] C or higher, and more preferably 350 deg. C or higher.

When the unit base 24 is a plate-like member having the first main surface 25a and the second main surface 25b, the shape of the unit base 24 is not limited, but it is preferably a square. Here, a quadrangle is a substantially quadrangle, and includes a shape in which a corner of a peripheral portion is cut out (corner cut).

The size of the main surface 25 of the unit base 24 is not particularly limited as long as it is smaller than the major surface 42 of the substrate 41. [ For example, in the case of a quadrangle, it is preferably 10 mm x 10 mm to 200 mm x 200 mm, more preferably 50 mm x 50 mm to 100 mm x 100 mm.

The thickness of the unit base 24 (the length in the vertical direction in Fig. 1 (B)) is relatively small because the thickness of the adhesive layer 27 is relatively small, for example, 10 to 100 탆, (T). Specifically, the thickness of the unit base 24 is preferably 0.1 to 10 mm, more preferably 0.5 to 5 mm, and even more preferably 0.7 to 3 mm.

The main surface 25 of the unit base 24 may be a polished surface or a non-etched surface (untreated surface) that is not polished.

<Adhesive Layer>

The adhesive layer 27 is fixed to the first main surface 25a of the unit base 24 and has a releasable surface 28 which is in close contact with the second main surface 42b of the substrate 41 to be.

The adhesive layer 27 can be formed by a method in which the curable silicone resin composition is formed on the first main surface 25a of the unit base 24 by using a silicone resin layer (hereinafter also referred to as a cured silicone resin layer) So that a sufficient adhering force can be obtained.

Hereinafter, the adhesive layer 27 as the cured silicone resin layer will be described.

The adhesive layer 27 is fixed on the first main surface 25a of the unit base 24 and the second main surface 42b of the substrate 41 in the substrate holder 11 holding the substrate 41, So that an adhesive force is generated. The peel strength between the second main surface 42b of the substrate 41 and the adhesion layer 27 is required to be lower than the peel strength between the first main surface 25a of the unit base 24 and the adhesion layer 27 . That is, when separating the substrate 41 from the unit base 24, the substrate 41 is peeled from the interface between the second main surface 42b of the substrate 41 and the adhesive layer 27, 25a and the adhesion layer 27, it is necessary that they do not peel off easily.

Therefore, the adhesion layer 27 adheres to the second main surface 42b of the substrate 41, but has a surface property that allows the substrate 41 to be easily peeled off. That is, the adhesive layer 27 is attached to the second main surface 42b of the substrate 41 with a certain degree of bonding force to prevent displacement of the substrate 41, When peeling off, the substrate 41 is attached with a bonding force so that it can be peeled easily without breaking it.

In the present invention, the property that the surface (the peelable surface 28) of the adhesion layer 27 can easily be peeled off is referred to as peelability. On the other hand, the first main surface 25a of the unit base 24 and the adhesive layer 27 are attached with a bonding force that is not relatively easily peeled off.

The adhesive layer 27 and the substrate 41 are formed not by a strong coupling such as an anchor effect as a mechanical coupling or a chemical interaction in order to have the peelability described above, It is preferable that they are joined by a Van der Waals force generated by the proximity of the contact portions 41.

On the other hand, the adhesive force of the adhesive layer 27 to the first main surface 25a of the unit base 24 is relatively higher than the adhesive force of the substrate 41 to the second major surface 42b. In the present invention, the bonding of the substrate 41 to the second major surface 42b is also referred to as &quot; attachment &quot;, and the bonding of the unit base 24 to the first major surface 25a is also referred to as &quot; fixed &quot;.

The peel strength of the adhesive layer 27 with respect to the second main surface 42b of the substrate 41 is relatively lowered and the peel strength of the adhesive layer 27 with respect to the first main surface 25a of the unit base 24 is The curable silicone resin composition is cured on the first main surface 25a of the unit base 24 to form the adhesive layer 27 made of the cured silicone resin and then the adhesive layer 27 made of the cured silicone resin It is preferable that the substrate 41 is placed on and adhered to the surface of the substrate.

In the present invention, the cured silicone resin itself is the same resin as the non-tacky cured silicone resin used for release paper and the like, and even when adhered to the substrate 41, the peel strength is low. However, when the curable silicone resin composition before curing is applied on the first main surface 25a of the unit base 24, the curable silicone resin composition is smoothened by the smile existing on the first main surface 25a of the unit base 24 It is in a state that it enters into a concavity and a hole. When the curable silicone resin composition is cured in this state, the interaction between the unit base 24 (the first main surface 25a) and the curable silicone resin composition, for example, an anchor effect occurs, and the cured silicone resin and the first The peel strength of the main surface 25a is thought to be high.

The adhesion area (ground area) of the adhesion layer 27 to be formed by applying the curable silicone resin composition onto the first main surface 25a of the unit base 24 and then curing is set to be the same as that of the substrate It is considered that the thickness of the unit main body 24 with respect to the first main surface 25a of the unit base body 24 is larger than that of the second main surface 42b of the unit base body 41. [ Therefore, even if the substrate 41 and the unit base 24 are made of the same material (for example, glass), the adhesion between the adhesion layer 27 and the substrate 41, the adhesion between the adhesion layer 27 and the unit base 24 The peel strength in each case can be made different.

The formation of the adhesion layer 27 in which the difference in peel strength against the second main surface 42b of the substrate 41 and the peel strength with respect to the first main surface 25a of the unit base 24 can be performed, . For example, a unit gas 24 having a bonding force with respect to the cured silicone resin higher than that of the substrate 41 can be used. In addition, the peeling strength with respect to the adhesive layer 27 can be improved by performing a treatment for increasing the bonding force of the first main surface 25a of the unit base 24. Specifically, the first main surface 25a of the unit base 24, which is a glass substrate, is exposed to atmospheric plasma, corona, UV (ultraviolet rays), ozone, or the like to increase the concentration of the silanol groups, The adhesion with the layer 27 can be improved.

The curable silicone resin composition used for forming such a cured silicone resin layer is not particularly limited. For example, conventionally known curable silicone resin compositions can be used. Specific examples include (a) a linear organopolysiloxane having at least two alkenyl groups per molecule, (b) at least three hydrogen atoms bonded to silicon atoms and having at least three hydrogen atoms bonded to the silicon atoms, (B) a linear organopolysiloxane having an alkenyl group, (B) a linear organopolysiloxane having an alkenyl group and (B) a hydrogen atom bonded to a silicon atom, (C) a platinum catalyst, wherein the content of the component (C) is 900 to 3000 mass ppm (in terms of platinum) relative to the total amount of the component (A) An organopolysiloxane composition which is cured by an addition reaction; a polyimide having a crosslinking site crosslinked by heating at a second temperature in excess of the first temperature in the silicon portion; Silicon, and containing the solvent to be volatilized by drying in the first low first temperature above the second temperature, the resin composition; and the like.

Specifically, for example, "curable silicone resin composition" described in paragraphs [0041] to [0061] of Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2011-046174), patent document 2 (Japanese Patent Application Laid- , "Organopolysiloxane composition" described in paragraphs [0018] to [0045] of Japanese Patent Application Laid-open No. Hei Can be used.

(Formation of cured silicone resin layer)

First, the curable silicone resin composition is applied to the first main surface 25a of the unit base 24 to form a layer of the curable silicone resin composition, and then the curable silicone resin composition is cured to form a cured silicone resin layer.

As the condition for curing the curable silicone resin composition, an optimum condition is appropriately selected depending on the kind of the organopolysiloxane and the like to be used. Typically, the heating temperature is preferably 50 to 300 占 폚, and the treating time is preferably 5 to 300 minutes.

The method of applying the curable silicone resin composition is not particularly limited, and conventionally known methods are used. Examples of the coating method include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method and a gravure coating method.

The formation of the cured silicone resin layer is not limited to the above method. For example, after the curable silicone resin composition is applied to the first main surface 25a of the unit base 24 by dripping or the like, a mold releasing treatment such that the cured silicone resin layer after curing does not adhere is performed And the layer of the curable silicone resin composition is cured between the mold release treatment substrate and the unit base 24 under the above-described conditions. If the curable silicone resin composition contains a volatile component, it is preferable that the volatile component does not contain a volatile component because the volatile component may gather as a gas and foam. As the mold releasing treatment, conventionally known treatments can be used. For example, a fluorine-based releasing agent and a silicone-based releasing agent are used. Further, after curing, the mold release treated substrate used is peeled off.

The thickness of the adhesive layer 27 as the cured silicone resin layer is preferably 10 to 100 mu m, more preferably 30 to 80 mu m.

The adhesion force of the substrate 41 is represented by the product of the adhesion force and the adhesion area of the peelable surface 28 of the adhesion layer 27 and the substrate 41.

The adhesive strength between the releasable surface 28 of the adhesive layer 27 and the substrate 41 tends to increase as the thickness of the adhesive layer 27 becomes thinner (FIG. 8).

On the other hand, if the cured silicone resin layer is thinner than 10 占 퐉, the substrate 41 may not be adhered to the releasable surface 28 only, resulting in insufficient adhesion. This is considered to be because if the cured silicone resin layer is too thin, its flexibility is insufficient and the releasable surface 28 does not sufficiently contact the substrate 41 on which the cured silicone resin layer is laid.

When the cured silicone resin layer is thick, the flexibility is increased. Therefore, the substrate 41 is brought into close contact with the substrate 41 only. However, if the thickness is larger than 100 m, the adhesion of the peelable surface 28 to the substrate 41 is small Loses. This is considered to be due to the fact that if the cured silicone resin layer is too thick, the effect of heat shrinkage upon curing becomes large, the irregularities of the releasable surface 28 become excessive, and the contact area with the substrate 41 decreases.

However, when the thickness of the cured silicone resin layer is within the above range, the substrate 41 is brought into close contact with the substrate 41, and the adhesion is also excellent.

In the present invention, the thickness of the adhesive layer 27, which is a cured silicone resin layer, was measured by a touch-sensitive surface shape measuring instrument (trade name: Dektak3030, Veeco).

The surface area of the peelable surface 28 of the adhesive layer 27 which is a cured silicone resin layer is set to be larger than the surface area of the second main surface 28 of the substrate 41 in terms of the magnitude of the adhesive force of the substrate 41 and the ease of attaching / Is preferably from 10 to 99%, more preferably from 20 to 90%, with respect to the area of the surface layer 42b.

The magnitude of the adhering force of the substrate 41 is expressed by (the adhering force per unit area of the releasable surface 28 of the adhesive layer 27 and the substrate 41) x (the adhered area).

The adhesion between the peelable surface 28 of the adhesion layer 27 and the substrate 41 increases as the adhesion layer 27 becomes thinner. On the other hand, as described above, as the adhesion layer 27 becomes thinner, it takes time to come into close contact with the substrate 41 due to lack of flexibility. That is, from the practical point of view, there is a preferable range of the thickness of the adhesion layer 27, which satisfies both of the adhesion of the substrate in a short period of time and the sufficient adherence by adhesion.

The peel strength of the adhesive layer 27 as the cured silicone resin layer with respect to the substrate 41 is preferably 0.1 to 1.5 N / 25 mm, more preferably 0.5 to 1.2 N / More preferably 25 mm.

In the present invention, the peel strength is represented by the following measurement method.

An adhesive layer 27 (thickness: about 20 to 50 mm) is formed on the entire surface of the first main surface 25a of the unit base 24 (thickness = about 1.1 to 1.3 mm) (Thickness: about 1.1 to 1.3 mm) having a size of 25 mm x 75 mm and a size of 25 mm on one side are brought into close contact with each other to form a sample. Next, the second main surface 25b of the unit base 24 of this sample was fixed to the end of the pedestal with double-sided tape, and the central portion of the portion (25 mm x 25 mm) The peel strength is measured by pushing up vertically using a digital force gauge (trade name: NP-200, manufactured by Imadasai).

The adhesion layer 27, which is a cured silicone resin layer, preferably has heat resistance from the standpoint of suppressing degassing. Specifically, the pyrolysis initiation temperature is preferably 120 占 폚 or higher, more preferably 150 占 폚 or higher, more preferably 180 占 폚 or higher, particularly 180 占 폚 or higher and 280 占 폚 Or less.

The pyrolysis initiation temperature can be measured as follows.

A cured silicone resin layer (thickness = about 20 to 40 占 퐉) was formed on a unit base 24 (thickness = about 1.1 to 1.3 mm) having a width of 50 mm and a substrate 41 Thickness = about 1.1 to 1.3 mm) is laminated again (laminate) is used as the evaluation sample. Next, this sample is placed on a hot plate heated to 100 DEG C, and the temperature at which the foaming phenomenon is confirmed in the sample by heating at a heating rate of 10 DEG C per minute is defined as the thermal decomposition start temperature.

[Manufacturing method of entire surface film forming substrate]

A method for manufacturing an entire surface film formation substrate using the substrate holder 11 of the present invention (hereinafter, also referred to as &quot; a method for manufacturing an entire surface film formation substrate of the present invention &quot;) will be described.

In the method of manufacturing the entire surface film forming substrate of the present invention, first, the second main surface 42b of the substrate 41 is brought into close contact with the peelable surface 28 of the adhesion layer 27. Thereby, the substrate 41 is held in the substrate holder 11. At this time, it is preferable that the center-of-gravity position of the substrate 41 is brought into close contact with the releasable surface 28. [ As a result, the substrate is surely brought into close contact with the substrate and the necessary adhesion force is easily obtained, and even when the substrate is vertically or downwardly oriented, the substrate holding is improved.

1 (A) and Fig. 2, when the substrate 41 is brought into close contact with the substrate 41, one substrate 41 and at least one of the plurality of substrates 41 adjacent to the substrate 41 It is preferable to form a gap between the openings. This is because not only the substrates 41 are not overlapped with each other but also fingers and mechanisms can be inserted into the gaps as an opportunity to peel off the attached substrate 41 in close contact with each other. The distance of this gap is not particularly limited as long as it is a distance allowing the use of a mechanism or a finger.

Next, the whole surface film formation is performed on the first main surface 42a of the adhered substrate 41.

The method for forming the entire surface is not particularly limited, but for the reasons described above, it is preferable to adopt a sputtering method of a vertical sputtering method or a sputtering method. At this time, since the film is not covered by the respective portions of the substrate holder 11, the film can be formed on the entire surface of the first main surface 42a.

Thereafter, the entire surface-formed substrate 41 is peeled off from the peelable surface 28 of the adhesion layer 27. At this time, a fingertip is inserted between the second main surface 42b of the substrate 41 and the unit fixing surface 32 (see Fig. 1B) from the gap between the neighboring substrates 41 The fingertip is hooked on the edge of the substrate 41, and the substrate 41 is peeled off. Thereby, the substrate 41 on which the entire surface is formed can be obtained.

Here, the order (direction) of the adhesion and peeling of the substrate 41 with respect to the substrate holder 11 may be, for example, a direction from the holder unit 21 located at the upper end in FIG. And, on the contrary, peeling off from the lower substrate 41, film defects can be reduced.

Although the substrate holder 11 can be repeatedly used, target particles by sputtering are deposited on the unit fixing surface 32 of the carrier 31 as the number of times of use increases. Since the deposited target particles may cause oscillation or the like, the number of repeated use is preferably about 20 to 100 times, more preferably 50 to 100 times.

In the method of manufacturing the entire surface film forming substrate of the present invention, a substrate having a protective layer as shown in Fig. 3 may be used as the substrate 41. [ That is, the substrate 41 may be held by bringing the second main surface 42b of the substrate 41 constituted by the protective layer 45 into close contact with the peelable surface 28 of the adhesion layer 27. Thereby, the total thickness including the substrate holder 11 and the substrate 41 (hereinafter also referred to as &quot; total thickness &quot;) is slightly larger, but it is preferable when the deposition of the target particles on the surface is not permitted.

The substrate 41 having the protective layer formed thereon is peeled from the substrate holder 11 and then the protective layer 45 is peeled to expose the second main surface 44b of the substrate main body 43. [ The protective layer 45 in contact with the second main surface 44b of the substrate main body 43 has a peelable surface which adheres to the second main surface 44b of the substrate main body 43 so as to be freely peeled off desirable. That is, the peel strength between the protective layer 45 and the second main surface 44b of the substrate body 43 is larger than the peel strength between the protective layer 45 and the peelable surface 28 of the adhesion layer 27 .

3, the base film 47 constituting the second main surface 42b of the substrate 41, the base film 47 constituting the second main surface 42b of the substrate 41, And an adhesive layer 48 disposed between the base film 47 and the substrate main body 43 and having a peelable surface in close contact with the base film 47 and the substrate main body 43. [ In this case, the adhesive layer 48 of the protective layer 45 is attached to the second main surface 44b of the substrate main body 43 and used.

As the base film 47, a known film having heat resistance and self-supporting property can be used. For example, films of polyester type, polyvinyl chloride type and the like can be mentioned.

As the adhesive layer 48, for example, a layer made of a known pressure-sensitive adhesive having heat resistance may be used, and it is preferable to use an adhesive such as acrylic, polyurethane or silicone.

The protective layer 45 may be formed on the second main surface 44b of the substrate main body 43 by a wet coat as another protective layer 45. [ For example, it can be formed by applying a polyvinyl ester-based resin onto the substrate main body 43 and curing it by heating. At this time, as the protective layer 45, for example, a UV curable resin such as an acrylic UV curable resin (trade name: GER-3000, manufactured by TAIYO INK) can be used.

The protective layer 45 is formed such that the peel strength between the protective layer 45 and the second main surface 44b of the substrate body 43 is greater than the peel strength of the protective layer 45 and the peelable surface 28 ), And is not limited to the above.

The thickness of the protective layer 45 is preferably 5 to 500 占 퐉, more preferably 20 to 300 占 퐉, and still more preferably 30 to 200 占 퐉. When the thickness of the protective layer 45 is 5 占 퐉 or more, the protective layer 45 having a peelable surface can be formed without difficulty. When the thickness of the protective layer 45 is 500 m or less, the protective layer 45 can be formed at a low cost.

Example

Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is not limited to these examples. Examples I, II and III are all examples.

[Experimental Examples I and II]

[Preparation of curable silicone resin composition]

First, in the same manner as described in paragraphs [0102], [0103], [0107] and [0109] of Patent Document 1 (Japanese Patent Laid-Open Publication No. 2011-046174), organohydrogensiloxane and alkenyl group- By weight of a curable silicone resin composition.

[Manufacture of holder unit]

Next, a curable silicone resin composition was applied to the first main surface 25a of the unit substrate 24 (100 mm x 100 mm) which is a glass substrate (trade name: Dragon Trail (registered trademark), manufactured by Asahi Glass Co., . The thickness of the unit base 24 is shown in Table 1 below. The dropping amount of the composition was changed in Experimental Example I and Experimental Example II.

A glass substrate (not shown) having the same size as the unit base 24 was placed on the dropped composition. The glass substrate laid thereon is a release-treated substrate of a report in which the releasing treatment with a silicone oil type releasing agent (trade name: dimethylpolysiloxane, SH200, manufactured by Toray, Dow Corning) is completed.

Thereafter, it was heated and cured in the air at 200 DEG C for 30 minutes to form an adhesive layer 27 which is a cured silicone resin layer. Three pieces of holder units 21 having the adhesive layer 27 fixed to the first main surface 25a of the unit base 24 were produced.

[Production of substrate holder]

Next, the second main surface 25b of the unit base 24 of the holder unit 21 is placed on the unit fixing surface 32 of the carrier 31 (730 mm x 920 mm, thickness: 1.3 mm) Lt; / RTI &gt; A capton double-sided tape (trade name: P-223, manufactured by Nitto Denko KK) is used for fixing. Thereby, the substrate holder 11 was produced.

[Evaluation (Initial)]

Next, on the releasable surface 28 of the adhesive layer 27 of the holder unit 21 of the produced substrate holder 11, a substrate 41 (130 mm x 240 mm, thickness: 1.3 mm ) Was placed on the second main surface 42b of the test piece, and evaluation was carried out as follows. The results are shown in Table 1.

&Lt; Time until adhesion is completed [second] &gt;

It was judged that the close contact was completed at the time when the ground surface area of the peelable surface 28 and the second main surface 42b of the substrate 41 was stopped by the naked eye and the time until this point was measured .

<Adhesion area [%]>

The second main surface 42b of the substrate 41 was placed on the peelable surface 28 and the contact area with respect to the area of the peelable surface 28 at the time when the close contact was completed was evaluated.

<Maintainability>

The substrate holder 11 is raised in a state in which the substrate 41 is in tight contact with the adhesion layer 27 and the film is formed by the vertical sputtering method as described below and if the substrate 41 does not fall down, , And when it dropped, it was evaluated as &quot; x &quot;.

In Examples I and II, the peel strength of the adhesive layer 27 with respect to the substrate 41 was 0.77 to 1.20 N / 25 mm.

[Tabernacle]

Next, the substrate holder 11 on which the substrate 41 was held was raised, and film formation was performed by the so-called vertical sputtering method. Specifically, TiO _x (1 <x <2) target was placed on a cathode as a sputtering target in a vacuum chamber, and the vacuum chamber was evacuated to 1.3 × 10 ^-3 Pa or less. Then, a mixed gas of argon gas (96 sccm) and oxygen gas (4 sccm) was introduced as a sputter gas. At this time, the pressure was 5.7 x 10 &lt; -1 &gt; Pa. In this state, reactive sputtering was performed using a DC pulse power source, and a TiO ₂ layer was formed on the first main surface 42a of the substrate 41 held in the substrate holder 11 provided in the vacuum chamber . The first major surface (42a) formed on, it has a film forming surface overall TiO ₂ layer.

[Evaluation (after 10 times)]

After the film formation, the substrate 41 was peeled off, and the substrate 41 was attached to the substrate holder 11 in the same manner to form a film. The flow of adhesion, film formation and peeling was repeated ten times, and the adhesiveness of the adhesive layer 27 thereafter was evaluated in the same manner as in the evaluation (initial). The results are shown in Table 1.

The &quot; close contact area &quot; of &quot; after 10 times &quot; is calculated by taking 100% as the &quot; close contact area &quot;

From the results shown in the first table, it was found that all of the adhesion layer 27 was excellent in retention to the substrate 41.

[Experimental Example III]

Next, the same glass substrate as Experimental Examples I and II was used as the substrate main body 43 and a base film 47 (thickness: 38 占 퐉) as a polyester film was formed on the second main surface 44b of the substrate main body 43 A protective layer 45 (trade name: EC-90000 ASL, manufactured by Sumitomo) adhered with an adhesive layer 48 (thickness: 28 탆) made of an acrylic pressure-sensitive adhesive was stuck to the substrate 41.

Subsequently, on the peelable surface 28 of the adhesive layer 27 of the holder unit 21 of the substrate holder 11, the protective layer 45 of the substrate 41, which is the substrate on which the protective layer is formed, The two main surfaces 42b were placed on top of each other and evaluated as follows.

In the same manner as in Experiment I described above, five holder units 21 were manufactured and a substrate holder 11 was manufactured. At this time, as shown in Table 2 below, the thickness T of the holder unit 21 was changed by changing the thickness of the unit base 24.

[Evaluation (after 10 times)]

In the same manner as described above, the flow of adhesion, film formation, and peeling was repeated 10 times, and the subsequent side deposition and peeling handling were evaluated as follows. The results are shown in Table 2.

<Sediment deposition>

In each of the holder units 21, ten substrates 41 having the entire surface formed thereon were produced. In the case where film deposition on the second main surface 42b is not visually confirmed on any of the substrates 41, it is evaluated as &quot;? &Quot;Quot; x &quot; when the film formation was confirmed to be on the second main surface 42b of the second main surface 42b.

<Peel handling>

When peeling the substrate 41, the time required for peeling in each holder unit 21 was measured. The time required for peeling was determined by the peeling strength (large or small of the adhesion force) x ease of substrate handling. When the average time required for peeling was less than 5 seconds, , The peel-off handling was slightly inferior and evaluated as &quot; x &quot;.

From the results shown in Table 2, in Experimental Examples III-2 to 4, when the thickness of the unit base 24 was less than 3 mm, deposition on the side was suppressed and the peeling handling was excellent. On the other hand, in Experimental Example III-1, it was found that the peeling handling was slightly inferior, and in Experimental Example III-5, the suppression of the deposition on the side was slightly inferior.

In Example III-5, adhesion of the film to the second main surface 42b of the substrate 41, which is the substrate on which the protective layer was formed, was confirmed. After the completion of the film formation, the substrate 41 was peeled off from the substrate holder 11 The second main surface 44b of the substrate body 43, which was not formed, could be exposed by peeling the protective layer 45 thereafter.

By using the protective film in this way, both the ease of peeling handling and the prevention of the inner periphery of the film can be achieved.

Industrial availability

The substrate holder and the manufacturing method of the entire surface film forming substrate of the present invention can flexibly cope with a glass substrate which is different in size and shape from a glass substrate to be used and can reduce the number of processes and labor, And can be used for the production of glass substrates used as cover glasses for tablet PCs and smart phones.

The entire contents of the specification, claims, drawings and summary of Japanese Patent Application No. 2012-280079 filed on December 21, 2012 are hereby incorporated herein by reference as the disclosure of the specification of the present invention.

11: substrate holder
21: holder unit
24: Unit gas
25: Main surface of unit gas
25a: a first main surface of the unit body
25b: a second main surface of the unit body
27: Adhesive layer
28: peelable surface
31: Carrier
32: Unit fixing surface
41: substrate
42: Main surface of the substrate
42a: a first main surface of the substrate
42b: a second main surface of the substrate
43:
44a: a first main surface of the substrate main body
44b: a second main surface of the substrate main body
45: Protective layer
47: base film
48: Adhesive layer
51: substrate holder
52: rod-shaped frame
53:
61: substrate holder
62: Plate frame
63:
64: opening
71: substrate
72a: a first main surface of the substrate
75: Film forming substrate
76a: a first main surface of the deposition substrate
77:
78: Non-film region
T: thickness of holder unit

Claims (13)

1. A substrate holder for holding a substrate on which a first major surface is entirely formed,
A unit base which is a plate-like member having a main surface smaller in area than the main surface of the substrate; and an adhesive layer which is fixed to the first main surface of the unit base and has a releasable surface to be attached to the second main surface of the substrate. Unit,
A plurality of holder units each having a unit fixing surface having a larger area than the main surface of the unit base and having a plurality of holder units fixed to the unit fixing surface in a direction in which the unit main surface and the second main surface of the unit base face each other Wherein the substrate holder comprises: The method according to claim 1,
Wherein the holder unit has a thickness of 0.1 to 10 mm. 3. The method according to claim 1 or 2,
Wherein the adhesive layer is a cured silicone resin layer formed by curing a curable silicone resin composition on a first main surface of the unit base. 4. The method according to any one of claims 1 to 3,
Wherein the thickness of the adhesive layer is 10 to 100 占 퐉. 5. The method according to any one of claims 1 to 4,
Wherein the substrate is a glass substrate having a thickness of 0.5 to 5 mm. 6. The method according to any one of claims 1 to 5,
Wherein the carrier has a thickness of 0.7 to 8 mm. A method for manufacturing an entire surface film formation substrate using the substrate holder according to any one of claims 1 to 6,
Attaching a second major surface of the substrate to the peelable surface,
A first main surface of the substrate adhered to the peelable surface is entirely formed,
And peeling the entire surface-formed substrate from the peelable surface. 8. The method of claim 7,
Wherein the substrate is a substrate having a substrate main body on which a first major surface is entirely formed and a protective layer formed on a second main surface side of the substrate main body and having a protective layer constituting a second main surface of the substrate, / RTI &gt; 9. The method of claim 8,
Wherein the thickness of the protective layer is 5 to 500 占 퐉. 10. The method according to claim 8 or 9,
Wherein the protective layer has a base film constituting a second main surface of the substrate and an adhesive layer disposed between the base film and the substrate main body and having a releasable surface attached to the base film and the substrate main body, A method for manufacturing an entire surface deposition substrate. 11. The method according to any one of claims 7 to 10,
Wherein a gap is formed between one substrate and at least one of the other substrates adjacent to the substrate when the substrate is brought into close contact with the substrate. 12. The method according to any one of claims 7 to 11,
And attaching the center-of-gravity position of the substrate to the peelable surface. A glass substrate obtained by the method for manufacturing an entire-surface film-forming substrate according to any one of claims 7 to 12.

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