TWI511224B - 撓性載體座、裝置及用於拆卸載體基板之方法 - Google Patents

撓性載體座、裝置及用於拆卸載體基板之方法 Download PDF

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TWI511224B
TWI511224B TW101102305A TW101102305A TWI511224B TW I511224 B TWI511224 B TW I511224B TW 101102305 A TW101102305 A TW 101102305A TW 101102305 A TW101102305 A TW 101102305A TW I511224 B TWI511224 B TW I511224B
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carrier
substrate
carrier substrate
detaching
product
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TW201241954A (en
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Daniel Burgstaller
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Ev Group E Thallner Gmbh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L21/67092—Apparatus for mechanical treatment
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

撓性載體座、裝置及用於拆卸載體基板之方法
本發明係關於如請求項1之一種撓性載體座、如請求項2之一種在一拆卸方向L上自一產品基板拆卸一載體基板之裝置、如請求項9之一種對應方法及如請求項10之一種用於在自一產品基板剝離一載體基板後安裝一載體基板之一撓性載體座之使用。
在半導體產業中，結構晶圓或產品晶圓通常暫時結合至載體晶圓或載體基板以能夠處置載體晶圓或載體基板。在處理該等產品基板後，應儘可能容易地、立即、經濟地且乾淨地自該載體基板移除該等產品基板。用於使產品晶圓結合於一載體晶圓上之最常用方法係施加一黏著層於該兩個基板之一者(或該兩個基板)並在壓力下使該兩個基板接觸。在剝離期間，在(例如)藉由晶圓彼此抵靠平行移位該等晶圓而減小膠結劑之黏著力(溫度、紫外線輻射等等)後，自該產品晶圓剝離該載體晶圓。藉由負壓力使所謂的卡盤固持該等晶圓。
在剝離期間，必須考慮複數個臨界因數，且絕對優先考慮曝露極為昂貴的脆性產品晶圓(歸因於預處理為應力儘可能小)且不損壞該產品晶圓。另一方面，應在能量消耗儘可能小之情況下經濟地並立即剝離該載體基板。在複數個已知剝離製程中，尤其對於破壞該等晶圓之間之黏著層之黏著性質而言，必須加熱載體晶圓與結構晶圓/產品晶 圓之堆疊至該膠結劑具有專一之一溫度。
本發明之目的因此係為開發用於剝離載體基板之一般性裝置及方法，使得能夠小心剝離同時更快速。同時將減小能量消耗。
技術方案1、2、9及10之特徵達成此目的。附屬技術方案中給定本發明之有利進展。說明書、申請專利範圍及/或圖式中給定特徵之至少兩個之全部組合亦屬於本發明之框架內。在所給定值範圍下，所指示之限制內之值亦將被揭示為邊界值且將以任何組合予以陳述。
本發明之基本構想係設計在自產品基板拆卸載體基板後用於安裝該載體基板之一載體座，使得該載體座容許彎曲該載體基板。如本發明中陳述之載體座具有一彎曲勁度，該彎曲勁度足以(尤其係)藉由舉升該載體基板之邊緣而產生自產品基板剝離該載體基板之一拆卸力。
如本發明中陳述，應僅發生一稍微曲折，尤其小於45°彎曲角、較佳地小於40°、更佳地小於30°、尤其較佳地小於20°、甚至更佳地小於10°、最佳地小於5°。依此方式，保護亦具有類似於載體座之一定彎曲勁度之載體基板及上述全部產品基板以免受損。彎曲在尤其於中心方向上自該載體基板之邊緣遷移之遷移拆卸前端上引發大部分拆卸力。
本發明之要點因此係用於一種在自一產品基板拆卸一載體基板後用於安裝該載體基板之撓性載體座，提供用於運 用該載體座上之該載體基板之彎曲而剝離該產品基板之拆卸構件。
如本發明中陳述，因此亦可想到到該載體座之毯覆、非環形版本(尤其係具有一定彈性或彎曲強度之一聚合物)。為固定並固持該載體基板，載體座將具有真空通道。在此連接中，尤其除增加固持力外，亦可將載體基板靜電固定在該載體座上。
該載體座亦可至少部分由金屬、陶瓷或一複合材料組成。所使用之材料僅需要容許如本發明中陳述之功能性。
而且一獨立發明係一種用於在一拆卸方向L上自一產品基板(11)拆卸一載體基板(13)之裝置，該裝置具有下列特徵：-一載體座，其在該拆卸方向L上為撓性以用於安裝該載體基板，-一基板座，其用於安裝該產品基板，-拆卸構件，其等用於運用該載體基板之彎曲自該產品基板剝離該載體基板。
如本發明中陳述之拆卸方向L本質上(特別精確地)法向於該載體基板及/或產品基板之表面。該載體座及/或藉由該載體座固持之該載體基板之彎曲之一彎曲軸法向於該拆卸方向L。該彎曲軸尤其平行於該產品基板及/或該載體基板之表面。
在一有利版本中，如本發明中陳述之裝置可有利地包括一壓力室，該壓力室可曝露於過壓以將已用負壓力固定在 該載體座上之一載體基板更強地固定於該載體座。該室中之壓力可大於1巴、較佳地大於2巴、甚至更佳地大於5巴、又更佳地大於10巴、尤其小於100巴。
根據本發明之一有利實施例，提供該載體座可在該拆卸方向L上彈性變形。如本發明中陳述，雖然僅在該載體基板之周邊上施加一張力，但該載體座之彈性使得可將拆卸力集中於遷移拆卸前端上。
在本發明之另一有利版本中，提供可藉由拆卸構件施加作用在該基板座之周邊上之至少一張力及克服該張力而作用於該載體座之周邊上之至少一相反力，以沿一拆卸前端產生拆卸轉矩。依此方式，尤其在開始剝離時可減小總負載。依此方式，對載體基板及產品基板提供更多保護。特定提供尤其藉由在該基板座之周邊上均勻施加張力以增加該等張力至該基板座中心中之一所得張力，同時該(該等)相反力增加至該載體座之一邊緣上之一所得相反力及該遷移拆卸前端上之對應拆卸轉矩。該載體座因此相對於該基板座傾斜。
為更好地保護產品基板(尤其對於極靈敏或極昂貴的產品基板)，如本發明中陳述，提供基板座被用作於整個表面上方固持產品基板一剛性接收器。
根據本發明之另一有利實施例，提供載體座尤其被用作具有一可調整內徑Di 之一開口環。歸因於該環形狀，亦可視需要藉由環幾何形狀(尤其係環寬度B對環直徑Da 及/或對環高度H)調整載體基板之彎曲勁度。而且該環形狀導致 在該環開口之區域中，容許載體基板之更多的運動自由使得達成載體座之彎曲勁度與載體基板之彎曲勁度之一相互作用。此處該載體座之彎曲勁度尤其至少等於或大於該載體基板之彎曲勁度。
如本發明中陳述，有利地選擇載體座之彎曲勁度，使得其處於介於1/20倍至20倍於載體基板之彎曲勁度之間、尤其介於1/10倍至10倍於載體基板之彎曲勁度、較佳地介於1/5倍至5倍於載體基板之彎曲勁度、甚至更佳地介於1/2倍至2倍於載體基板之彎曲勁度之間之一範圍中。載體基板尤其係具有介於500微米與750微米之間、較佳地600微米之一厚度d之一矽晶圓。該載體基板可具有200毫米或300毫米之一直徑Dt 。
此處尤其有利於尤其在整個環周邊上方尤其以回彈周邊軸肩之形式延行之固持構件。因此，在可經濟地生產之一單一幾何形狀下，可施加拆卸力於載體基板，尤其施加於該載體基板之整個周邊上，且尤其開始剝離時拆卸前端之臨界啟始可集中於載體基板之周邊上之一或多個部位。
在如本發明中陳述之一進展中，提供載體座用以本質上完全側向包圍該載體基板，尤其至少包圍周邊之98%、較佳地至少99%、甚至更佳地至少99.5%。依此方式，該載體基板大致上支撐在整個周邊上方。載體座尤其被用作一環，該環周邊封閉較佳地至少達該周邊之98%、甚至更佳地至少達99%、又更佳地至少達99.5%。該環亦可由個別區段構成。
根據一有利實施例，拆卸構件具有用於導致載體座之至少一周邊區段在拆卸方向L上之一平移移動之平移驅動構件。
一獨立發明係一種用於在一拆卸方向L上自一產品基板拆卸一載體基板之方法，該方法具有下列步驟(尤其按下列序列)：-用一基板座安裝產品基板及用在該拆卸方向L上為撓性之一載體座安裝載體基板，及-運用該載體基板之彎曲自該產品基板剝離該載體基板。
而且如本發明中陳述，存在當自一產品基板剝離一載體基板時用於安裝該載體基板之一撓性載體座之使用。
在本發明之一有利實施例中，提供在小於200、較佳地小於100、甚至更佳地小於50、理想地上在室溫下，尤其在無毯覆加熱構件之情況下發生剝離。
如本發明中陳述，可想到藉由拆卸構件之動作加速尤其拆卸前端上之剝離(尤其藉由分離構件之動作局部加速該拆卸前端上之剝離)。該等分離構件可包括機械分離及/或局部加熱，較佳地包括一定向熱氣流。可明確個別或組合提供一分離楔、一分離刀片、一分離導線或較佳地定向於該拆卸前端之一熱壓縮空氣噴嘴。
一分離楔被定義為具有一較佳呈V狀剖面之一工具。一分離刀片被定義為具有一極銳邊緣之一工具。該分離導線係在中間層之平面中藉由拉緊狀態中之一對應設備朝其移動之一極薄、較佳地高強度導線。該分離導線尤其用作一 加熱導線，因此能夠被加熱。
如本發明中陳述，亦可想到其中在拆卸期間拆卸前端大致上沿產品基板之周邊朝中心以螺旋延行至內部之一實施例。此藉由在圍繞該周邊延行時增加作用於周邊之拆卸力達成。
所描述之特徵類似地應用於如本發明中陳述之裝置及如本發明中陳述之方法以及如本發明中陳述之使用。
將自較佳例示性實施例之下列描述及使用圖式明白本發明之特徵及細節。
用圖式中相同的元件符號識別具有相同功能之相同組件。
圖1展示可半自動地使用之一載體座1，且其中藉由該載體座1手動固持載體基板13。該載體座1用於自藉由一互連層12連接至該載體基板之一產品基板11剝離該載體基板13。
該載體座1由位於一周邊區段26上之一固持手柄2及開口與該固持手柄2相對之一環3組成。在該環3之開口3o上存在該環3之相對端24、24'上用於調整之端24、24'之間之間隔A之分隔構件25。可藉由調整該間隔A調整該環3之一內徑Di 及一外徑Da 。此例示性實施例中之分隔構件25由槓桿4、5組成，該槓桿4附接在端24上且該槓桿5附接在端24'上。槓桿4、5藉由此處可手動操作之定位元件14貫穿。如本發明中陳述，可想到上文描述之手動運動學之自動再定 位。
固持手柄2藉由固定元件10(尤其係螺釘)附接至環3。如本發明中陳述，應針對一給定幾何形狀(環高度H、環寬度B、外徑Da 、內徑Di )選擇環3之材料，使得可藉由分隔構件25使環3彈性彎曲以克服彎曲勁度引發之力。
該環3具有突出遠離一環軸肩6之一周邊軸肩7及一階部9。該階部9以一z狀依一內角度45°<I<90°、尤其<80°、較佳地<70°朝該環中間延行，且因此形成終止於一銳內邊緣8之一尤其周邊延行壁斜面17。該內邊緣8同時係該周邊軸肩7之一接觸面7s之一組件，該周邊軸肩7之表面平行於該環軸肩6延行。該接觸面7s與該環軸肩6等距一距離M。如本發明中陳述選擇該距離M，使得該距離M至多比載體基板13之一厚度d稍微大(尤其至多大)該互連層12之厚度(參見圖7)。較佳地，如圖6所示選擇該距離M，使得其小於該載體基板13之厚度d。較佳地，該距離M至少為該載體基板13之厚度d一半大。
可藉由分隔構件25增加位於內徑Di 與外徑Da 之間以固持該載體基板13且由內邊緣8形成之一直徑Dk 直到可將該載體基板13透過由該內邊緣8形成之一開口(直徑Dk )插入遠至該環軸肩6。接著可藉由分隔構件25再次減小直徑Dk 直到該載體基板13之一周邊邊緣13u聯接該周邊軸肩7之斜面17並藉由該斜面17固定。因此藉由撓性載體座1固持該載體基板13。大致上藉由夾持及/或形狀配合發生安裝。為將該載體基板13夾持在該斜面17上，尤其在定位構件14上 可存在用於控制該夾持之測力計構件。
產品基板11僅經由該互連層12附接至載體座。該載體座1與該產品基板11之間不存在直接接觸。當該載體座1與該產品基板11之間不需要接觸時，該產品基板11受到最大程度的保護且本質上排除污染或損壞。
該產品基板11與該互連層12及該載體基板13一起形成一堆疊19(載體基板-產品基板-組合)。本發明同樣適用於載體基板與產品基板之一組合而不具備內插互連層，尤其適用於所謂的預結合，其中晶圓尤其藉由范德華力(Van der Waals force)彼此黏附。
當在圖7之實施例中將該堆疊19固定在該載體座1上時，該銳內邊緣8同時用作一分離構件或用以藉由該互連層12之周邊邊緣上之內邊緣8之尖端貫穿該互連層12而啟始剝離。
該載體座1幾乎完全包圍該載體基板13，惟該環開口3o外。
圖8展示一膜框架23上之堆疊19，該產品基板11連接至接合至該膜框架23之一膜21。該堆疊19、該膜框架23及該膜21[形成]一膜框架組合20。
該載體基板13可藉由該固持手柄2及藉由固定該產品基板11或該膜框架23拉離該產品基板11。側向施加張力於該載體基板13，因此藉由該固持手柄2之單邊配置施加於周邊區段26。藉由該內邊緣8貫穿該互連層12啟始，運用載體基板13及環3(載體基板13克服其藉由彎曲勁度產生之力) 之變形而使載體基板13緩慢地自該周邊區段26剝離行進至相對側。此處一拆卸前端藉由該互連層12自該周邊區段26遷移至該載體基板13之相對側。因此，取決於該拆卸前端與該固持手柄2之距離及施加於該固持手柄2之拆卸力，定義力矩沿該拆卸前端作用。
在一第一實施例中此以自動形式展示於圖9a至圖9d中且在一第二實施例中展示於圖10a至圖10d，其等在下文予以描述。
用於以適合於自動之一形式安裝該載體基板13之上文描述之載體座1之使用通用於該兩項實施例。
本發明之一重要態樣在於在提供開始剝離時尤為小心的處置，因此當尤其藉由實施在周邊上或在互連層邊緣上該互連層之一機械剝離而啟始剝離時，提供尤為小心的處置。
圖9及圖10各自展示一基座27及安裝在該基座27上以提供一穩定基座架構及附接如本發明中陳述之裝置之其他組件之一托架22，其等在下文予以描述。在該框架23或該基座27上，尤其在該托架22之蓋22d及由該基座27形成之一底部27b之間，存在用於該載體座1或該載體座1之周邊區段之平移運動(尤其係驅動)之驅動構件15'及用於固持該堆疊19或該膜框架組合20之一基板座18(接收器)之平移運動(尤其係驅動)之驅動構件15。驅動構件15'在平移方向上可具有尤其藉由一可動軸承形成之一自由跳脫機構。
如圖9及圖10中所示之基板座18可在一拆卸方向L上(因 此在圖式之平面中)向上及/或向下平移移動。用於驅動該基板座18之驅動構件15因此可尤其同步移動、較佳地藉由受控於一中心控制裝置之馬達(尤其係步進馬達)驅動。
在如圖9中所示之實施例中，對於該載體座1而言，在與該周邊區段26相對之載體座1之側上僅存在一驅動構件15'，同時在該周邊區段26上存在一搖桿軸承16，使得該載體座可圍繞該搖桿軸承16樞轉，但是被固定在該拆卸方向L上。因此，該方法之序列如下：在圖9a中展示之方法步驟中，適用於該膜框架組合20(尤其該載體基板13)之載體座1附接至上部驅動構件15'及搖桿軸承16。同時，該膜框架組合20預先或隨後(特定言之)藉由施加一真空而固定於該基板座18上。可藉由驅動構件15使該基板座18在該拆卸方向L上移動。
如本發明中陳述，可替代地想到該載體座1之周邊上，一側上存在若干(尤其兩個)驅動構件15'，且另一側上存在若干(尤其兩個)搖桿軸承16。
該載體座1可藉由位於驅動構件15'及搖桿軸承16上環周邊3u上之固持構件28固定。該基板座18可藉由驅動構件15上之固持構件29固定。
接著藉由驅動構件15實施該基板座18之一同步平移運動直到該載體基板13之頂部13o聯接該環軸肩6使該基板座18移動進入圖9b中展示之位置(因此在朝該載體座1之拆卸方向L上)。可經由中心控制裝置、藉由尤其整合於該基板座18中之力變換器產生該載體基板13撞擊該環軸肩6之偵測 而發生控制。較佳地在該基板座18之周邊上，存在以一角距為360°/n分佈之n個力變換器。
因此可將該載體基板13固持在該載體座1中，直徑Dk 因此必須預先與環3之內邊緣8匹配，使得該載體座1中可接收該載體基板13及其外部輪廓(尤其係一直徑為Dt 之圓形)。當接收該載體座13時，內徑Di 小於該載體基板13之直徑Dt ，使得該載體基板13不能滑過。一旦到達如圖9b中展示之位置，可減小內徑Di 直到該載體基板13被固定在該載體座1中(參見圖6及圖7)，且因此聯接該壁斜面17。
一旦到達如圖9b中展示之位置，釋放上部撓性驅動構件15'，使得其在拆卸方向L具有一自由度，且附接至驅動構件15'之載體座1之側可在該拆卸方向L上自由移動。在此實施例中，不需要驅動驅動構件15'。但如本發明中陳述，此處可想到藉由中心裝置對運動之一控制，使得驅動構件15'非被動(如在較佳實施例中)而係主動。
接著，在經提供在該基板座18上相對之兩個驅動構件15上，指向遠離該載體座1之一驅動力F1 (張力)及尤其與該驅動力F1 相同之一驅動力F2 (張力)尤其同步施加於該基板座18以自該產品基板11剝離固定在該載體座1上之載體基板13。
經作用與該等驅動力F1 及F2 相反且尤其平行於其等之一相反力G(或若干相反力G，若存在若干搖桿軸承16)施加於搖桿軸承16。
依此方式，繼續已自內邊緣8啟始之剝離製程，在增加 該載體座1及該載體基板13之彎曲之情況下，一拆卸前端自該搖桿軸承16延行至該載體座1之相對側。與該等驅動力F1 及F2 以及該相反力G(藉由該互連層12之互連力產生)平衡，力矩隨著沿拆卸前端極小地分佈之拆卸轉矩K1 至Kn 沿拆卸前端作用。
在圖9c中展示之位置中，該載體基板13剝離一半以上，剝離藉由該載體基板變形13及該載體座1亦變形兩者而產生(克服該載體座1及該載體基板13之結合強度)。
在圖9d中展示之位置中，自該產品基板11完全剝離該載體基板13。該圖式中之互連層12黏附至該產品基板11，但是亦可部分或完全黏附至該載體基板13。
在剝離期間，該載體座1及該載體基板13彎曲(尤其在自該產品基板11剝離該載體基板13達一半時量測之平均值)彎曲角度1°<W<45°、尤其W<35°、此處大致上為6°。
在如圖10a至圖10d中所示之第二實施例中，該載體座1上存在一搖桿軸承16來代替驅動構件15'，使得該周邊區段26及一相對周邊區段26'上之載體座1(因此其中該等搖桿軸承16附接至該載體座1之固持構件28)被固定在拆卸方向L上(如本發明中陳述，該載體座1之周邊上可存在若干搖桿軸承16)。在該等周邊區段26之間之區段中，該載體座1可在其撓性架構內克服彎曲勁度而移動。因此當根據圖10c之方法步驟中施加驅動力時，本質上自該互連層12之周邊(脈動)同心延行之一拆卸前端升高至該互連層12中間。此處藉由該載體座之內邊緣8之啟始在克服該互連層12之初 始互連力方面起重要作用。
該等拆卸轉矩K1 至Kn 在如圖10a至圖10d中所示之實施例中隨著拆卸前端行進而各自主要沿拆卸前端作用於一(脈動)圓形區段上。當根據圖9c量測至與搖桿軸承相對之側邊緣之彎曲角度W時，歸因於作用於全部側之周邊上之拆卸力K量測自該載體基板13之中心至邊緣量測彎曲角度W'，此情況中之彎曲角度W'歸因於距離較短而相應較小，前提係該載體座1及該載體基板2之材料以及其等尺寸相同。藉由減小環寬度B及/或環高度H，可減小環3之彎曲勁度使得彎曲角度W'增加。
1‧‧‧載體座/拆卸構件/產品基板
2‧‧‧固持手柄
3‧‧‧環
3o‧‧‧開口
3u‧‧‧環周邊
4‧‧‧槓桿
5‧‧‧槓桿
6‧‧‧環軸肩
7‧‧‧周邊軸肩
7s‧‧‧接觸面
8‧‧‧內邊緣
9‧‧‧階部/固持構件
10‧‧‧固定構件
11‧‧‧產品基板
12‧‧‧互連層
13‧‧‧載體基板
13o‧‧‧頂部
13u‧‧‧周邊邊緣
14‧‧‧定位元件
15‧‧‧驅動構件/拆卸構件
15'‧‧‧驅動構件/拆卸構件
16‧‧‧搖桿軸承/拆卸構件
17‧‧‧斜面
18‧‧‧基板座
19‧‧‧堆疊
20‧‧‧膜框架組合
21‧‧‧膜/薄片
22‧‧‧托架
22d‧‧‧蓋
23‧‧‧膜框架
24‧‧‧端
24'‧‧‧端
25‧‧‧分隔構件
26‧‧‧周邊區段
27‧‧‧基座
27b‧‧‧底部
28‧‧‧固持構件/拆卸構件
29‧‧‧固持構件
A‧‧‧間隔
B‧‧‧環寬度
d‧‧‧厚度
Da ‧‧‧外徑
Di ‧‧‧內徑
Dk ‧‧‧直徑
F1 ‧‧‧驅動力(張力)
F2 ‧‧‧驅動力(張力)
Fn ‧‧‧驅動力(張力)
G‧‧‧相反力
H‧‧‧環高度
I‧‧‧內角
K1 ‧‧‧拆卸轉矩
K2 ‧‧‧拆卸轉矩
Kn ‧‧‧拆卸轉矩
L‧‧‧拆卸方向
M‧‧‧距離
W‧‧‧彎曲角度
W'‧‧‧彎曲角度
圖1展示如本發明中陳述具有一分割線A-A之一載體座之一平面圖，圖2展示根據來自圖1之分割線A-A之載體座之一截面圖，圖3從下方展示根據圖1之載體座之一圖，圖4展示來自圖2之一詳細細節圖E，圖5a展示由載體基板、互連層及產品基板構成之一堆疊之一側視圖，圖5b展示由載體基板、互連層及產品基板構成之一堆疊之一平面圖，圖6展示類似於圖4之具有載體座之一第一實施例之一詳細圖，圖7展示類似於圖4之具有載體座之一第二實施例之一詳 細圖，圖8展示固定於一膜框架上之一堆疊，圖9a至圖9d用如本發明陳述之四個方法步驟展示如本發明中陳述之根據一第一實施例之一裝置，及圖10a至圖10d用四個方法步驟展示如本發明中陳述之裝置之一第二實施例。
11‧‧‧產品基板/載體基板
13‧‧‧載體基板
15'‧‧‧驅動構件/拆卸構件
27‧‧‧基座
F1‧‧‧驅動力(張力)
F2‧‧‧驅動力(張力)
G‧‧‧相反力
K‧‧‧拆卸轉矩
W‧‧‧彎曲角度

Claims (10)

  1. 一種在自一產品基板(11)拆卸一載體基板(13)時用於安裝該載體基板(13)之撓性載體座(1)，提供用於運用該載體基板(13)之彎曲(bending)而剝離(debonding)該產品基板(11)之拆卸構件(1、28)。
  2. 如請求項1之載體座，其中該載體座(1)用作具有一可調整直徑(Dk )之一特別開口環(3)。
  3. 如請求項1或2之載體座，其具有尤其在整個環周邊(3u)上方延行之固持構件(9)，尤其具有一回彈周邊軸肩(7)。
  4. 如請求項1或2之載體座，其本質上用以完全側向封閉該載體基板(13)。
  5. 一種用於在一拆卸方向(L)上自一產品基板(11)拆卸一載體基板(13)之裝置，該裝置具有下列特徵：一載體座(1)，其在該拆卸方向(L)上為撓性以用於安裝該載體基板(13)，一基板座(18)，其用於安裝該產品基板(11)，及拆卸構件(1、15、15'、16、28)，其等用於運用該載體基板(13)之彎曲自該產品基板(11)剝離該載體基板(13)。
  6. 如請求項5之裝置，該載體座(1)可在該拆卸方向(L)上彈性變形。
  7. 如請求項5或6之裝置，其中可藉由該等拆卸構件(1、15、15'、16、28)施加尤其作用於該基板座(18)之周邊上 之至少一張力(F1 、F2 、Fn )及克服該張力(F1 、F2 、Fn )而尤其作用於該載體座之周邊上之至少一相反力(G)以沿一拆卸前端產生拆卸轉矩(L1 、L2 、Ln )。
  8. 如請求項5或6之裝置，其中該基板座(18)用作於整個表面上方容納該產品基板(11)之一剛性基板座(18)。
  9. 一種用於在一拆卸方向(L)上自一產品基板拆卸一載體基板之方法，其具有下列步驟，尤其按下列序列：用一基板座(mount)安裝該產品基板，及用在該拆卸方向(L)上為撓性之一載體座安裝該載體基板，及運用該產品基板之彎曲自該產品基板剝離該載體基板。
  10. 一種在自一產品基板剝離一載體基板時用於安裝該載體基板之一撓性載體座之使用。
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KR20170078858A (ko) 2017-07-07
JP6234363B2 (ja) 2017-11-22
US20140020847A1 (en) 2014-01-23
US20160020124A1 (en) 2016-01-21
TW201802995A (zh) 2018-01-16
JP2014513426A (ja) 2014-05-29
EP2697823A1 (de) 2014-02-19
CN103460369A (zh) 2013-12-18
SG193904A1 (en) 2013-11-29
US10272660B2 (en) 2019-04-30
KR20140001998A (ko) 2014-01-07
TWI641068B (zh) 2018-11-11
KR20150108428A (ko) 2015-09-25
EP2697823B1 (de) 2014-06-25
CN103460369B (zh) 2016-12-28
TWI610388B (zh) 2018-01-01
US9296193B2 (en) 2016-03-29
TW201241954A (en) 2012-10-16
KR101570917B1 (ko) 2015-11-20
WO2012139627A1 (de) 2012-10-18

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